JP2010040702A - Stage device, exposure system and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage device which can suppress liquid flooding from a gap. <P>SOLUTION: A side face Pc of a substrate P has a vertical region 61 substantially vertical to a front face Pa of the substrate P. At least a part of a side face Tc of a plate member T is disposed so as to oppose the vertical region 61 of the side face Pc. The side face Tc of the plate member T is formed along the side face Pc of the substrate P. The plate member T is disposed so that the side face Tc is opposed to the side face Pc of the substrate P with a gap G1 therebetween. The size of the gap G1 is a distance of a boundary part 53 between the side face Tc and the vertical region 61 of the side face Pc. Occasionally, the formed liquid immersion space is formed across the front face Pa of the substrate P and an upper face Ta of the plate member T. Thus, it is possible to prevent a liquid LQ from flooding into a space on the rear face Pb side of the substrate P through the gap G1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method.

As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.
US Patent Publication No. 2006/0139614 US Pat. No. 7,199,858

  In a liquid immersion exposure apparatus, various problems may occur when liquid enters from a gap between a substrate and members disposed around the edge of the substrate. For example, when the invading liquid is vaporized, there is a possibility that the substrate is thermally deformed by the heat of vaporization of the liquid, or a liquid adhesion mark (watermark) is formed on the substrate. When such a problem occurs, an exposure failure such as a defect in a pattern formed on the substrate occurs, and as a result, a defective device may occur. Accordingly, there is a need for further improvements to prevent liquid from entering through the gap.

  An object of an aspect of the present invention is to provide a stage apparatus that can prevent liquid from entering from a gap. Another object of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, a predetermined member having a side surface opposed to the side surface of the object through a gap and a top surface to which a liquid is supplied is provided, and the surface roughness of the side surface is larger than the surface roughness of the top surface. A stage device is provided.

  According to a second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the stage apparatus of the first aspect.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the second aspect and developing the exposed substrate.

  According to the present invention, it is possible to prevent liquid from entering from the gap. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the present invention, it is possible to suppress the occurrence of defective devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that is movable while holding the measurement member C to be moved, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, a drive system 6 that moves the measurement stage 3, and a mask Illumination system IL that illuminates M with exposure light EL, projection optical system PL that projects an image of the pattern of mask M illuminated with exposure light EL onto substrate P, and at least part of the optical path of exposure light EL is liquid LQ. The liquid immersion member 7 capable of forming the liquid immersion space LS so as to be satisfied by the above and the control device 8 for controlling the operation of the entire exposure apparatus EX.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  The measuring member C can measure the exposure light EL. As the measurement member C held by the measurement stage 3, for example, at least a part of an aerial image measurement system capable of measuring an aerial image by the projection optical system PL as disclosed in US Patent Application Publication No. 2002/0041377. For example, at least a part of an illuminance unevenness measurement system capable of measuring the illuminance unevenness of the exposure light EL as disclosed in US Pat. No. 4,465,368, for example, as disclosed in US Pat. No. 6,721,039 At least a part of a measurement system capable of measuring the amount of change in the transmittance of the exposure light EL of the projection optical system PL, for example, an irradiation amount measurement system (for example, as disclosed in US Patent Application Publication No. 2002/0061469) At least part of the illuminance measuring system) and for example in EP 1079223 At least a portion, and the like of the wavefront aberration measurement system. An example of an exposure apparatus that includes a substrate stage that can move while holding a substrate, and a measurement stage that can move by mounting a measurement member (measuring instrument) that measures exposure light without holding the substrate. For example, it is disclosed in US Pat. No. 6,897,963 and European Patent Application No. 1713113.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes the irradiation position of the exposure light EL emitted from the illumination system IL. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes, for example, a linear motor. In the present embodiment, the mask stage 1 is movable in three directions, that is, the X axis, the Y axis, and the θZ direction on the guide surface 9G by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes the irradiation position of the exposure light EL emitted from the projection optical system PL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C.

  In the present embodiment, the substrate stage 2 includes a stage body 11 and a substrate table 12 disposed on the stage body 11. The substrate P is held on the substrate table 12. The measurement stage 3 includes a stage main body 13 and a measurement table 14 arranged on the stage main body 13. The measurement member C is held on the measurement table 14.

  The drive system 5 includes a coarse movement system 5A capable of moving the stage main body 11 on the guide surface 10G and a fine movement system 5B capable of moving the substrate table 12 on the stage main body 11. The coarse movement system 5A includes, for example, a linear motor, and the fine movement system 5B includes, for example, a voice coil motor. The stage main body 11 can move in three directions on the guide surface 10G, that is, the X axis, the Y axis, and the θZ direction by the operation of the coarse motion system 5A. The substrate table 12 is movable in three directions on the stage main body 11 such as the Z-axis, θX, and θY directions by the operation of the fine movement system 5B.

  The drive system 6 includes a coarse movement system 6A capable of moving the stage main body 13 on the guide surface 10G, and a fine movement system 6B capable of moving the measurement table 14 on the stage main body 13. The coarse movement system 6A includes, for example, a linear motor, and the fine movement system 6B includes, for example, a voice coil motor. The stage main body 13 can move in three directions on the guide surface 10G in the X axis, Y axis, and θZ directions by the operation of the coarse motion system 6A. The measurement table 14 can be moved in three directions on the stage body 13 in the Z-axis, θX, and θY directions by the operation of the fine movement system 6B.

  In the present embodiment, the position information of the mask stage 1, the substrate stage 2, and the measurement stage 3 is measured by an interferometer system 11 including laser interferometer units 11A and 11B. The laser interferometer unit 11 </ b> A can measure the position information of the mask stage 1 using the measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11 </ b> B can measure the position information of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2 </ b> R disposed on the substrate table 12 and the measurement mirror 3 </ b> R disposed on the measurement table 14. When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 operates the drive systems 4, 5, 6 based on the measurement result of the interferometer system 11, and the mask stage 1. The position control of the (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C) is executed.

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is an optical path of the exposure light EL between the terminal optical element 12 and an object disposed at the irradiation position (projection region PR) of the exposure light EL emitted from the terminal optical element 12. Is filled with the liquid LQ. In the present embodiment, the object that can be arranged in the projection region PR includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. .

  In the present embodiment, the liquid immersion member 7 has a lower surface 14 that can face an object disposed in the projection region PR. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the surface (upper surface) of the object on the other side, the optical path of the exposure light EL between the last optical element 12 and the object is liquid. An immersion space LS is formed so as to be filled with LQ.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the substrate table 12 (substrate stage 2) arranged at a position facing the terminal optical element 12 and the liquid immersion member 7. As shown in FIG. 2, the liquid immersion member 7 has an opening 7 </ b> K at a position facing the emission surface 13. The exposure light EL emitted from the emission surface 13 can pass through the opening 7K and irradiate the substrate P.

Further, the liquid immersion member 7 includes a supply port 15 capable of supplying the liquid LQ and a recovery port 16 capable of recovering the liquid LQ. The supply port 15 is disposed at a predetermined position of the liquid immersion member 7 in the vicinity of the optical path of the exposure light EL so as to face the optical path. The supply port 15 is connected to the liquid supply device 18 via the flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The channel 17 includes a supply channel formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel and the liquid supply device 18. Liquid supply device 1
The liquid LQ delivered from 8 is supplied to the supply port 15 via the flow path 17.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. In the present embodiment, the collection port 16 is disposed around the opening 7K through which the exposure light EL passes. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. A plate-like porous member 19 including a plurality of holes (openings or pores) is disposed in the recovery port 16. Note that a mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape may be disposed in the recovery port 16. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes the lower surface of the porous member 19. The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery device 21 includes a vacuum system, and can recover the liquid LQ by suction. The channel 20 includes a recovery channel formed inside the liquid immersion member 7 and a channel formed by a recovery pipe connecting the recovery channel and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the liquid recovery operation using the recovery port 16 in parallel with the liquid supply operation using the supply port 15, so that the terminal optical element 12 and the liquid immersion member 7 on one side are performed. And an immersion space LS can be formed with the liquid LQ between the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  The substrate table 12 includes a first holding unit 31 that holds the substrate P in a releasable manner. The first holding unit 31 is provided on the chuck surface 22 of the substrate table 12 that can face the back surface Pb of the substrate P, and holds the back surface Pb of the substrate P. In the present embodiment, the first holding portion 31 includes a so-called pin chuck mechanism, is disposed on the chuck surface 22, and has an annular first rim portion 23 facing the peripheral region of the back surface Pb of the substrate P, and the chuck surface 22. And a plurality of pin members 24 arranged on the inner side of the first rim portion 23 and supporting the back surface Pb of the substrate P, and a first suction which is arranged on the chuck surface 22 inside the first rim portion 23 and can suck gas. And mouth 25. Using the first suction port 25, the control device 8 exhausts the gas in the space surrounded by the back surface Pb of the substrate P, the first rim portion 23, and the chuck surface 22, and makes the space have a negative pressure. Thus, the substrate P is sucked and held by the pin member 24. Further, the control device 8 can release the substrate P from the first holding unit 31 by stopping the suction operation using the first suction port 25.

  In the present embodiment, the substrate table 12 (substrate stage 2) includes a plate member T disposed around the substrate P as disclosed in US Patent Publication No. 2007/0177125 and the like. ing. The substrate table 12 includes a second holding part 32 that is disposed around the first holding part 31 and holds the plate member T in a releasable manner. The second holding unit 32 is disposed around the first holding unit 31. The plate member T has an opening TH in which the substrate P can be disposed. The plate member T held by the second holding unit 32 is disposed around the substrate P held by the first holding unit 31.

  The second holding portion 32 is provided on the chuck surface 26 of the substrate table 12 that can face the back surface (lower surface) of the plate member T, and holds the lower surface Tb of the plate member T. In the present embodiment, the second holding portion 32 includes a so-called pin chuck mechanism, is disposed around the first rim portion 23 on the chuck surface 26, and opposes the inner edge region of the lower surface Tb of the plate member T in the vicinity of the opening TH. An annular second rim portion 27, an annular third rim portion 28 disposed around the second rim portion 27 on the chuck surface 26, and opposed to an outer edge region of the lower surface Tb of the plate member T; A plurality of pin members 29 disposed between the second rim portion 27 and the third rim portion 28 and supporting the lower surface Tb of the plate member T, and the second rim portion 27 and the third rim portion 28 on the chuck surface 26 And a second suction port 30 capable of sucking gas. The control device 8 uses the second suction port 30 to exhaust the gas in the space surrounded by the lower surface Tb of the plate member T, the second rim portion 27, the third rim portion 28, and the chuck surface 26, The plate member T is sucked and held by the pin member 29 by making the space a negative pressure. In addition, the control device 8 can release the plate member T from the second holding portion 32 by stopping the suction operation using the second suction port 30.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the surface Pa of the substrate P and the XY plane are substantially parallel. The second holding unit 32 holds the plate member T so that the upper surface Ta of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface Pa of the substrate P held by the first holding unit 31 and the upper surface Ta of the plate member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is).

  The surface Pa of the substrate P held by the first holding unit 31 and the upper surface Ta of the plate member T held by the second holding unit 32 are the emission surface 13 of the last optical element 12 and the lower surface 14 of the liquid immersion member 7. It is possible to oppose. The liquid LQ from the supply port 15 is applied to at least one of the surface Pa of the substrate P held by the first holding unit 31 and the upper surface Ta of the plate member T held by the second holding unit 32 through the opening 7K. Supplied.

The substrate P is disposed in the opening TH of the plate member T held by the second holding part 32. The upper surface Ta of the plate member T held by the second holding unit 32 is disposed around the surface Pa of the substrate P held by the first holding unit 31. In the present embodiment, the first holding unit 31 is configured so that the side surface Pc of the substrate P and the side surface (inner side surface) Tc of the plate member T held by the second holding unit 32 face each other via the gap G1. The substrate P is held. The side surface Tc defines the opening TH.
The upper end of the side surface Tc of the plate member T facing the side surface Pc of the substrate P via the gap G1 is connected to the inner edge of the upper surface Ta to which the liquid LQ from the supply port 15 is supplied.

  FIG. 3 is a side sectional view showing an example of the measurement table 14 (measurement stage 3). The measurement table 14 includes a third holding unit 33 that holds the measurement member C in a releasable manner. The third holding unit 33 is provided on the chuck surface 35 of the measurement table 14 that can face the peripheral area of the lower surface Cb of the measurement member C, and holds the lower surface Cb of the measurement member C. In the present embodiment, the third holding portion 33 includes a so-called pin chuck mechanism, is disposed on the chuck surface 35, and has an annular fourth rim portion 36 facing the lower surface Cb of the measurement member C, and the chuck surface 35 An annular fifth rim portion 37 disposed around the four rim portion 36 and facing the peripheral region of the lower surface Cb of the measuring member C, and the chuck surface 35 between the fourth rim portion 36 and the fifth rim portion 37. A plurality of pin members 38 arranged and supporting the lower surface Cb of the measuring member C, and a third suction port arranged between the fourth rim portion 36 and the fifth rim portion 37 on the chuck surface 35 and capable of sucking gas. 39.

  In the present embodiment, the measurement table 14 has a recess 45 inside the fourth rim portion 36. An optical sensor 46 is disposed in the recess 45. In the present embodiment, the measurement member C includes a member that can transmit the exposure light EL, such as quartz, and at least a part of the measurement member C includes a transmission portion that can transmit the exposure light EL. The exposure light EL applied to the upper surface Ca of the measurement member C held by the third holding unit 33 is applied to the optical sensor 46 through the transmission part of the measurement member C. The optical sensor 46 is emitted from the last optical element 12 and receives the exposure light EL via the measuring member C.

  In the present embodiment, the measurement table 14 (measurement stage 3) includes a plate member S arranged around the measurement member C. The measurement table 14 is disposed around the third holding unit 33 and includes a fourth holding unit 34 that holds the plate member S so as to be releasable. The fourth holding part 34 is arranged around the third holding part 33. The plate member S has an opening SH in which the measurement member C can be disposed. The plate member S held by the fourth holding unit 34 is disposed around the measurement member C held by the third holding unit 33.

  The fourth holding unit 34 is provided on the chuck surface 40 of the measurement table 14 that can face the lower surface Sb of the plate member S, and holds the lower surface Sb of the plate member S. In the present embodiment, the fourth holding portion 34 includes a so-called pin chuck mechanism, is disposed around the fifth rim portion 37 on the chuck surface 40, and opposes the inner edge region of the lower surface Sb of the plate member S in the vicinity of the opening SH. An annular sixth rim portion 41, an annular seventh rim portion 42 disposed around the sixth rim portion 41 on the chuck surface 40, and opposed to an outer edge region of the lower surface Sb of the plate member S; A plurality of pin members 43 disposed between the sixth rim portion 41 and the seventh rim portion 42 and supporting the lower surface Sb of the plate member S, and the sixth rim portion 41 and the seventh rim portion 42 on the chuck surface 40 And a fourth suction port 44 capable of sucking gas.

  In this embodiment, the 3rd holding | maintenance part 33 hold | maintains the measurement member C so that the upper surface Ca of the measurement member C and XY plane may become substantially parallel. The fourth holding unit 34 holds the plate member S so that the upper surface Sa of the plate member S and the XY plane are substantially parallel. In the present embodiment, the upper surface Ca of the measurement member C held by the third holding unit 33 and the upper surface Sa of the plate member S held by the fourth holding unit 34 are arranged in substantially the same plane (substantially surface). One).

  The upper surface Ca of the measuring member C held by the third holding unit 33 and the upper surface Sa of the plate member S held by the fourth holding unit 34 are the emission surface 13 of the last optical element 12 and the lower surface 14 of the liquid immersion member 7. Can be opposed. The liquid LQ from the supply port 15 is at least one of the upper surface Ca of the measuring member C held by the third holding unit 33 and the upper surface Sa of the plate member S held by the fourth holding unit 34 through the opening 7K. To be supplied.

  The measuring member C is disposed in the opening SH of the plate member S held by the fourth holding part 34. The upper surface Sa of the plate member S held by the fourth holding unit 34 is disposed around the upper surface Ca of the measurement member C held by the third holding unit 33. In the present embodiment, the third holding portion 33 is configured such that the side surface Cc of the measuring member C and the side surface (inner side surface) Sc of the plate member S held by the fourth holding portion 34 face each other via the gap G2. The measurement member C is held. The side surface Sc defines the opening SH. The upper end of the side surface Sc of the plate member S facing the side surface Cc of the measuring member C via the gap G2 is connected to the inner edge of the upper surface Sa to which the liquid LQ from the supply port 15 is supplied.

  In the present embodiment, the measurement table 14 includes a rod member 47 on the side surface on the −Y side facing the substrate table 12. In the present embodiment, the size of the rod member 47 is smaller than the size of the plate member S in the X-axis direction. The rod member 47 has an upper surface 48 that can face the exit surface 13 of the last optical element 12 and the lower surface 14 of the liquid immersion member 7, and a side surface 49 that can face the side surface of the substrate table 12. In the present embodiment, the upper surface 48 is substantially parallel to the XY plane. Further, the upper surface 48 of the rod member 47 and the upper surface Sa of the plate member S held by the fourth holding part 34 are arranged in substantially the same plane (substantially flush).

  The liquid LQ from the supply port 15 can be supplied to the upper surface 48 of the rod member 47 through the opening 7K. The upper end of the side surface 49 of the rod member 47 that can face the side surface of the substrate table 12 is connected to the −Y side edge of the upper surface 48 to which the liquid LQ from the supply port 15 is supplied.

  Here, in the following description, the upper surface Ta of the plate member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate table 12 (substrate stage 2) and is held by the fourth holding unit 34. The upper surface Sa of the plate member S and the upper surface 48 of the rod member 47 are collectively referred to as the upper surface 3U of the measurement table 14 (measurement stage 3) as appropriate.

  FIG. 4 is a view showing an example of the operation of the exposure apparatus EX according to the present embodiment. In this embodiment, as disclosed in, for example, U.S. Patent Application Publication No. 2006/0023186, U.S. Patent Application Publication No. 2007/0127006, and the like, the control device 8 includes the substrate stage 2 and the measurement stage. 3, the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are brought close to or in contact with each other so that at least one of the substrate 3 continues to form a space capable of holding the liquid LQ between the terminal optical element 12 and the liquid immersion member 7. In this state, at least one of the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 is opposed to the exit surface 13 of the terminal optical element 12 and the lower surface 14 of the liquid immersion member 7, and the terminal optical element 12 and the liquid The substrate stage 2 and the measurement stage 3 can be synchronously moved in the XY directions with respect to the immersion member 7. Thereby, the control device 8 is in a state where the immersion space LS can be formed between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2, and the terminal optical element 12, the liquid immersion member 7 and the measurement stage 3 In the meantime, it is possible to change from one of the states in which the immersion space LS can be formed to the other. That is, the control device 8 can move in the immersion space LS of the liquid LQ between the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 while suppressing leakage of the liquid LQ.

  In the following description, at least one of the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 and the terminal optical element 12 in a state where the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are approached or brought into contact with each other. The operation of causing the substrate stage 2 and the measurement stage 3 to move synchronously in the XY directions with respect to the last optical element 12 and the liquid immersion member 7 while making the emission surface 13 and the lower surface 14 of the liquid immersion member 7 face each other is appropriately scrammed. This is called movement.

  In the present embodiment, when the scram movement is executed, the control device 8 causes the side surface on the + Y side of the substrate stage 2 and the side surface 49 of the rod member 47 of the measurement stage 3 to face each other with a predetermined gap G3. Then, the control device 8 simultaneously moves (synchronously moves) the substrate stage 2 and the measurement stage 3 while maintaining the gap G3. In the present embodiment, the immersion space LS moves on the upper surface 48 of the rod member 47 during scram movement. In the present embodiment, when the scram movement is performed, the control device 8 controls the substrate stage 2 so that the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are arranged in substantially the same plane. The positional relationship between the upper surface 2U and the upper surface 3U of the measurement stage 3 is adjusted.

  For example, when executing the measurement process using the measurement member C, the control device 8 makes the terminal optical element 12 and the liquid immersion member 7 and the measurement stage 3 face each other, and the optical path between the terminal optical element 12 and the measurement member C. The immersion space LS is formed so that is filled with the liquid LQ. The control device 8 irradiates the measurement member C with the exposure light EL via the projection optical system PL and the liquid LQ, and executes measurement processing using the measurement member C. The result of the measurement process is reflected in the exposure process of the substrate P.

  When executing the exposure processing of the substrate P, the control device 8 makes the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 face each other, and the optical path between the terminal optical element 12 and the substrate P is the liquid LQ. The immersion space LS is formed so as to be filled with The control device 8 irradiates the substrate P with the exposure light EL from the mask M illuminated with the exposure light EL by the illumination system IL via the projection optical system PL and the liquid LQ. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. is there. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction.

  FIG. 5 is an enlarged side sectional view (YZ sectional view) of the side surface Pc of the substrate P held by the first holding unit 31 and the vicinity of the side surface Tc of the plate member T held by the second holding unit 32. . Hereinafter, a state in which the substrate P is held by the first holding unit 31 and the plate member T is held by the second holding unit 32 will be described.

  As shown in FIG. 5, in the present embodiment, the surface roughness of the side surface Tc of the plate member T is larger than the surface roughness of the upper surface Ta. In the present embodiment, the upper surface Ta is substantially flat and substantially parallel to the XY plane.

  In the present embodiment, the side surface Tc includes a plurality of first inclined surfaces 51 extending in the first direction from the upper surface Ta side (+ Z side) downward (−Z direction) and outward with respect to the center of the substrate P. In the present embodiment, the first direction is a direction toward the outside with respect to the center of the opening TH.

  In the present embodiment, the side surface Tc includes a plurality of second inclined surfaces 52 extending from the upper surface Ta side (+ Z side) downward (−Z direction) and in a second direction opposite to the first direction. In the present embodiment, the second direction is a direction toward the center of the opening TH.

  In the following description, the first slope 51 is appropriately referred to as a downward slope 51, and the second slope 52 is appropriately referred to as an upward slope 52.

  In the present embodiment, downward slopes 51 and upward slopes 52 are alternately arranged in the Z-axis direction.

  In the present embodiment, the angle θ1 formed by the Z axis and the downward slope 51 is substantially the same as the angle θ2 formed by the Z axis and the upward slope 52. In the present embodiment, the angle θ1 and the angle θ2 are about 45 degrees.

  In the present embodiment, the size L1 of the downward slope 51 is substantially the same as the size L2 of the upward slope 52 in the Z-axis direction.

  In the present embodiment, the boundary 53 between the upper end of the downward slope 51 and the lower end of the upward slope 52 is pointed. The downward slope 51 and the upward slope 52 can be formed using, for example, a lathe process. Note that the boundary portion 53 may be rounded.

  In the present embodiment, the upper surface Ta and the lower surface Tb of the plate member T are substantially parallel. In the present embodiment, the distance between the upper surface Ta and the lower surface Tb of the plate member T (the thickness of the plate member T) is substantially the same as the distance between the front surface Pa and the back surface Pb of the substrate P (the thickness of the substrate P). In the present embodiment, the thickness of the substrate P is about 0.775 mm.

  In the present embodiment, the side surface Tc including the downward slope 51 and the upward slope 52 is liquid repellent with respect to the liquid LQ. The upper surface Ta and the lower surface Tb are also liquid repellent with respect to the liquid LQ.

  In the present embodiment, the plate member T includes a metal base material such as stainless steel and a liquid repellent material film formed on the base material. In the present embodiment, the upper surface Ta, the lower surface Tb, and the side surface Tc of the plate member T include the surface of the liquid repellent material film. Examples of the liquid repellent material include PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), and Teflon (registered trademark). Thereby, each of the upper surface Ta, the lower surface Tb, and the side surface Tc becomes liquid repellent with respect to the liquid LQ. The contact angles of the upper surface Ta, the lower surface Tb, and the side surface Tc with respect to the liquid LQ are, for example, 90 degrees or more. In this embodiment, the base material of the plate member T is stainless steel (SUS316), and the liquid repellent material forming the film is PFA. In the present embodiment, the contact angle (advance contact angle) of the upper surface Ta, the lower surface Tb, and the side surface Tc with respect to the liquid LQ is about 110 degrees. The plate member T itself may be formed of a liquid repellent material.

  The side surface Pc of the substrate P has a vertical region 61 that is substantially perpendicular to the surface Pa of the substrate P. At least a part of the side surface Tc of the plate member T is disposed so as to face the vertical region 61 of the side surface Pc.

  The side surface Tc of the plate member T is provided along the side surface Pc of the substrate P. The plate member T is disposed so that the side surface Tc and the side surface Pc of the substrate P face each other with the gap G1 interposed therebetween. In the present embodiment, the size of the gap G1 is, for example, about 0.1 mm to 0.5 mm. In the present embodiment, the size of the gap G1 is the distance between the boundary portion 53 of the side surface Tc and the vertical region 61 of the side surface Pc.

  In the present embodiment, for example, as shown in FIG. 2, the immersion space LS formed by the liquid LQ from the supply port 15 is formed across the surface Pa of the substrate P and the upper surface Ta of the plate member T. There is a case. That is, the immersion space LS may be formed on the gap G1. According to the present embodiment, the liquid LQ can be prevented from entering the space on the back surface Pb side of the substrate P via the gap G1.

  FIG. 6 is a schematic diagram showing a general behavior of the liquid LQ that has entered the gap G between the surface 101 of the first member and the surface 102 of the second member. In the following description, it is assumed that the contact angle of the surface 101 with respect to the liquid LQ is θa, the contact angle of the surface 102 with respect to the liquid LQ is θb, the surface tension of the liquid LQ is γ, and the size of the gap G is d.

  In general, the following expression holds for the internal pressure IP of the liquid LQ that has entered the gap G between the surfaces 101 and 102 and the radius of curvature R of the interface of the liquid LQ in the gap G.

  In the equation (1), the action of gravity is ignored. As shown in the equation (1), the curvature radius R of the interface of the liquid LQ changes according to the conditions of the surfaces 101 and 102. The conditions of the surfaces 101 and 102 include contact angles θa and θb and a size d. Further, the internal pressure IP changes according to the curvature radius R.

  FIG. 6 shows a case where the surface 101 and the surface 102 are parallel to the Z axis, and the contact angle θa and the contact angle θb are equal. In the example shown in FIG. 6, the contact angles θa and θb of the surfaces 101 and 102 shown in FIG. 6A are larger than the contact angles θa and θb of the surfaces 101 and 102 shown in FIG.

  As shown in FIG. 6A, when the shape of the interface of the liquid LQ in the gap G becomes convex in the −Z direction, an internal pressure IP directed in the + Z direction is generated due to the surface tension of the liquid LQ. In this case, the movement of the interface of the liquid LQ in the −Z direction is suppressed, and the penetration of the liquid LQ into the gap G is suppressed. On the other hand, as shown in FIG. 6B, when the shape of the interface of the liquid LQ in the gap G becomes convex in the + Z direction, an internal pressure IP directed in the −Z direction is generated due to a capillary phenomenon. In this case, the movement of the interface of the liquid LQ in the −Z direction is promoted, and the penetration of the liquid LQ into the gap G is promoted.

  Here, in the following description, a state in which the interface of the liquid LQ in the gap G is convex in the −Z direction is appropriately referred to as a suppressed state, and a state that is convex in the + Z direction is appropriately uninhibited. Called. Therefore, the penetration of the liquid LQ is suppressed when the interface of the liquid LQ is suppressed, and the penetration of the liquid LQ is promoted when the interface is not suppressed.

  When the interface of the liquid LQ is formed in the gap G between the surfaces 101 and 102, the shape (curvature radius) of the interface changes according to the conditions of the surfaces 101 and 102 where the interface is located. In other words, when the interface of the liquid LQ is formed between the surface 101 and the surface 102, the conditions of the surfaces 101 and 102 are the direction of the internal pressure IP of the liquid LQ, that is, the penetration of the liquid LQ is suppressed. Determine whether or not.

  FIG. 7 is a view for explaining the shape of the interface MS of the liquid LQ formed in the gap G1 between the side surface Tc of the plate member T and the side surface Pc of the substrate P according to this embodiment.

  As described above, in the present embodiment, since the side surface Tc is liquid repellent with respect to the liquid LQ, the interface MS is likely to be in a suppressed state. For example, even when the interface MS is located on the upward slope 52, there is a high possibility that the interface MS will be in a suppressed state.

  Furthermore, when the interface MS is located on the downward slope 51, as shown in FIG. 7, the interface MS located on the downward slope 51 is in a suppressed state with high probability. When the angle θL formed by the downward slope 51 and the interface of the liquid LQ is, for example, about 110 degrees, the curvature radius of the interface MS becomes sufficiently small because the interface MS is located on the downward slope 51. Therefore, the internal pressure IP increases and the infiltration of the liquid LQ into the gap G1 can be suppressed. In other words, when the interface MS is positioned on the downward slope 51, the substantial advancing contact angle of the side surface Tc with respect to the liquid LQ is increased, so that the interface MS can be prevented from moving in the −Z direction.

  Further, for example, in FIG. 7, even when the interface MS located on the first downward slope 51A moves in the −Z direction, the second downward slope 51B exists below the first downward slope 51A. Therefore, the penetration of the liquid LQ (movement of the interface MS in the −Z direction) can be prevented by the second downward slope 51B. That is, since the plurality of downward slopes 51 are arranged in the Z-axis direction, the penetration of the liquid LQ (movement of the interface MS in the −Z direction) can be stopped more easily. For example, by moving the substrate table 12 in the XY direction with respect to the last optical element 12 and the liquid immersion member 7, the pressure of the liquid LQ in the liquid immersion space LS varies, and due to the pressure variation, the liquid LQ flows in the gap G1. There is a possibility of easy intrusion. Even in such a case, since the plurality of downward slopes 51 are arranged in the Z-axis direction, the penetration of the liquid LQ can be suppressed by the downward slopes 51.

  Thus, in this embodiment, since the surface roughness of the side surface Tc is increased and the substantial advancing contact angle of the side surface Tc with respect to the liquid LQ is increased, the movement of the interface MS of the liquid LQ in the −Z direction is performed. Can be suppressed. Therefore, the penetration of the liquid LQ from the gap G1 can be suppressed, and the liquid LQ can be prevented from flowing around to the back surface Pb side of the substrate P or adhering to the back surface Pb of the substrate P. Further, the liquid LQ can be prevented from flowing around to the lower surface Tb side of the plate member T or adhering to the lower surface Tb of the plate member T.

  Although the plate member T disposed on the substrate table 12 has been mainly described here, the surface roughness of the side surface Sc of the plate member S disposed on the measurement table 14 is made larger than the surface roughness of the upper surface Sa. Can do. For example, similarly to the side surface Tc of the plate member T, a downward slope and an upward slope can be formed on the side surface Sc of the plate member S. Thereby, the penetration of the liquid LQ from the gap G2 can be suppressed, and the liquid LQ can be prevented from flowing around to the lower surface Cb side of the measuring member C or adhering to the lower surface Cb of the measuring member C. it can. Further, the liquid LQ can be prevented from flowing around to the lower surface Sb side of the plate member S or adhering to the lower surface Sb of the plate member S.

  Further, as shown in FIG. 8, the surface roughness of the side surface 49 of the rod member 47 can be made larger than the surface roughness of the upper surface 48. For example, similarly to the side surface Tc of the plate member T, a downward slope and an upward slope can be formed on the side surface 49 of the rod member 47. Thereby, even when the substrate stage 2 and the measurement stage 3 are moved simultaneously while maintaining the gap G3 in order to move the scram, the infiltration of the liquid LQ into the gap G3 can be suppressed. Accordingly, the liquid LQ can be prevented from leaking or scattering.

  As described above, according to the present embodiment, the infiltration of the liquid LQ from the gap G1 formed in at least a part of the periphery of the substrate P can be suppressed. Further, according to the present embodiment, it is possible to suppress the intrusion of the liquid LQ from the gaps G2 and G3. Therefore, the occurrence of exposure failure can be suppressed, and the occurrence of defective devices can be suppressed.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is an enlarged side sectional view (YZ sectional view) of the vicinity of the side surface Tc of the plate member T2 according to the second embodiment. The plate member T <b> 2 is held by the first holding unit 31, and the substrate P is held by the second holding unit 32.

  As shown in FIG. 9, in this embodiment, the angle θ1 formed by the Z-axis and the downward slope 51 is larger than the angle θ2 formed by the Z-axis and the upward slope 52.

  In the present embodiment, the size L1 of the downward slope 51 is smaller than the size L2 of the upward slope 52 in the Z-axis direction.

  FIG. 10 is a schematic diagram for explaining the shape of the interface MS of the liquid LQ formed in the gap G1 between the side surface Tc of the plate member T2 and the side surface Pc of the substrate P according to this embodiment.

  In the present embodiment, since the angle θ1 formed by the Z-axis and the downward slope 51 is large, the curvature radius of the interface MS becomes sufficiently small when the interface MS is located on the downward slope 51. That is, when the interface MS is located on the downward slope 51, the substantial advancing contact angle of the side surface Tc with respect to the liquid LQ becomes sufficiently large. Therefore, the movement of the interface MS in the −Z direction can be effectively suppressed, and the penetration of the liquid LQ into the gap G1 can be suppressed.

  Further, for example, even if the interface MS located on the downward slope 51C in FIG. 10 moves in the −Z direction, the liquid LQ permeates (−Z of the interface MS) by the downward slope 51D below the downward slope 51C. (Movement in the direction) can be stopped.

  Further, in the present embodiment, the penetration of the liquid LQ into the gap G1 is suppressed, and the liquid LQ is discharged from the gap G1 satisfactorily.

  FIG. 11 is a schematic diagram showing an example of the operation of the exposure apparatus EX. For example, as shown in FIG. 11A, the substrate stage 2 is moved in the + Y direction from the state in which the immersion space LS is formed between the terminal optical element 11 and the immersion member 7 and the plate member T2. In this case, as shown in FIG. 11 (B), after the immersion space LS is formed on the gap G1, as shown in FIG. 11 (C), the terminal optical element 11, the immersion member 7 and the substrate P The liquid immersion space LS is formed between the two. In the present embodiment, even when the state shown in FIG. 11A changes to the state shown in FIG. 11B, the liquid LQ can be sufficiently prevented from entering the gap G1. In this embodiment, even when a part of the liquid LQ in the immersion space LS slightly enters the gap G1, the state shown in FIG. 11B changes to the state shown in FIG. 11C. In addition, the liquid LQ can be discharged from the gap G1 satisfactorily.

  FIG. 12 is a schematic diagram illustrating an example of a state in which the liquid LQ is discharged from the gap G1 between the side surface Tc of the plate member T2 and the side surface Pc of the substrate P according to the present embodiment.

  In the present embodiment, the angle θ1 formed by the Z axis and the downward slope 51 is large, and the substantial receding contact angle of the downward slope 51 with respect to the liquid LQ is sufficiently large. In the present embodiment, the angle θ2 formed by the Z axis and the upward slope 52 is small, and the substantial receding contact angle of the upward slope 52 with respect to the liquid LQ is large. That is, the side surface Tc of the plate member T2 according to the present embodiment forms an immersion space LS on the gap G1, and even if a part of the liquid LQ in the immersion space LS slightly enters the gap G1, Along with the movement of the immersion space LS, the liquid LQ in the gap G1 is easily discharged together with the immersion space LS. Thus, for example, when the state shown in FIG. 11B is changed to the state shown in FIG. 11C, the liquid LQ is discharged from the gap G1 satisfactorily.

  Here, the plate member T2 disposed on the substrate table 12 has been mainly described, but at least one of the side surface Sc of the plate member S and the side surface 49 of the rod member 47 disposed on the measurement table 14 is illustrated in FIG. A downward slope and an upward slope as described with reference to FIGS. 10 and 12 can be formed.

  Even in the plate member T described in the first embodiment, the infiltration of the liquid LQ into the gap G1 is suppressed, and the liquid LQ is discharged from the gap G1 satisfactorily.

  In the first and second embodiments described above, the optical path on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. For example, International Publication No. 2004/019128 As disclosed in the No. pamphlet, it is possible to employ a projection optical system PL in which the optical path on the incident side (object plane side) of the last optical element 12 is also filled with the liquid LQ.

  In each embodiment described above, water is used as the liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. .

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 13, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view which shows an example of the substrate table and liquid immersion member which concern on 1st Embodiment. It is a sectional side view which shows an example of the measurement table which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the plate member which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the behavior of the liquid which permeated into the gap. It is a schematic diagram for demonstrating the effect | action of the plate member which concerns on 1st Embodiment. It is a figure which shows an example of the measurement stage which concerns on 1st Embodiment. It is a figure which shows an example of the plate member which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating the effect | action of the plate member which concerns on 2nd Embodiment. It is a figure for demonstrating an example of operation | movement of exposure apparatus. It is a schematic diagram for demonstrating the effect | action of the plate member which concerns on 2nd Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

2 ... Substrate stage, 3 ... Measurement stage, 12 ... Substrate table, 14 ... Measurement table,
DESCRIPTION OF SYMBOLS 31 ... 1st holding part, 32 ... 2nd holding part, 33 ... 3rd holding part, 34 ... 4th holding part, 51 ... 1st slope, 52 ... 2nd slope, C ... Measuring member, Ca ... Upper surface, Cb ... lower surface, Cc ... side surface, G1 ... gap, G2 ... gap, G3 ... gap, P ... substrate, Pa ... front surface, Pb ... back surface, Pc ... side surface, S ... plate member, Sa ... upper surface, Sb ... lower surface, Sc ... Side surface, SH ... opening, T ... plate member, Ta ... upper surface, Tb ... lower surface, Tc ... side surface, TH ... opening, EL ... exposure light, LQ ... liquid

Claims (16)

A predetermined member having a side surface facing the side surface of the object through a gap and an upper surface to which liquid is supplied;
The stage apparatus has a surface roughness greater than that of the upper surface.   The stage device according to claim 1, wherein the side surface includes a plurality of first slopes extending from the upper surface side downward in a first direction toward the outside with respect to the center of the object. The side surface includes a plurality of second slopes extending downward from the upper surface side and in a second direction opposite to the first direction,
The stage apparatus according to claim 2, wherein the first slope and the second slope are alternately arranged in a direction substantially perpendicular to the upper surface.   The stage apparatus according to claim 3, wherein an angle formed between an axis substantially perpendicular to the upper surface and the first inclined surface is larger than an angle formed between the axis and the second inclined surface.   The stage apparatus according to claim 4, wherein the first inclined surface is smaller than the second inclined surface in a direction substantially perpendicular to the upper surface.   The stage device according to claim 1, wherein the side surface is liquid repellent with respect to the liquid. A movable stage having the predetermined member and a first holding unit for holding the object;
The stage device according to any one of claims 1 to 6, wherein the predetermined member is disposed on at least a part of the periphery of the object held by the first holding unit.   The stage apparatus according to claim 7, wherein the movable stage includes a second holding unit that holds the predetermined member in a releasable manner.   The stage device according to claim 8, wherein the predetermined member includes a plate member having an opening in which the object is disposed.   The stage apparatus according to claim 7, wherein the object includes a substrate exposed with exposure light.   The stage apparatus according to claim 7, wherein the object includes a measurement member that measures exposure light. A first movable stage;
A second movable stage different from the first movable stage,
The object includes at least a part of the first movable stage,
The predetermined member includes at least a part of the second movable stage,
The stage device according to any one of claims 1 to 6, wherein the first movable stage and the second movable stage are movable simultaneously while maintaining the gap.   13. The stage apparatus according to claim 12, wherein the first movable stage has a holding part that holds the object so as to be releasable, and / or the second movable stage has a holding part that holds the predetermined member so as to be releasable.   The stage apparatus according to claim 12 or 13, wherein at least one of the first movable stage and the second movable stage has a holding unit for holding a substrate exposed by exposure light. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the stage apparatus according to claim 1. Exposing the substrate using the exposure apparatus according to claim 15;
Developing the exposed substrate; and a device manufacturing method.

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