JP5375843B2 - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device capable of preventing outflow of liquid, even when a substrate is exposed while moving, and of properly exposing the substrate. <P>SOLUTION: An exposure device EX includes a first liquid immersion system 1, that fills an optical path K of an exposure light EL with liquid LQ and forms a first liquid immersion region LR1 on a substrate P, and a second liquid immersion system 2, that forms a second liquid immersion region LR2 for preventing the outflow of liquid LQ in the first liquid immersion region LR1 on the outer side of the first liquid immersion region LR1, with respect to the optical path K. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate through a liquid and a device manufacturing method.

  In an exposure apparatus used in a photolithography process, an immersion exposure apparatus has been devised that fills an optical path of exposure light with a liquid and exposes a substrate through the liquid as disclosed in the following patent documents.

International Publication No. 99/49504 Pamphlet

  In the exposure apparatus, it is required to increase the moving speed of the substrate in order to improve device productivity. However, when the substrate is moved at a high speed in a state where the optical path of the exposure light is filled with the liquid, there is a possibility that the liquid flows out.

  The present invention has been made in view of such circumstances, and an exposure apparatus capable of preventing the outflow of liquid and exposing the substrate satisfactorily when performing exposure while moving the substrate, and the exposure thereof An object of the present invention is to provide a device manufacturing method using an apparatus.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, in an exposure apparatus that exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL), the optical path (K) of the exposure light (EL) is changed to a liquid (K). LQ) and a first immersion mechanism (1) for forming a first immersion region (LR1) on the substrate (P) and outside the first immersion region (LR1) with respect to the optical path (K) An exposure apparatus (EX) comprising: a second immersion mechanism (2) for forming a second immersion area (LR2) for preventing the liquid (LQ) from flowing out of the first immersion area (LR1). Is provided.

  According to the first aspect of the present invention, even when the exposure is performed while moving the substrate, the liquid can be prevented from flowing out and the substrate can be satisfactorily exposed.

  According to the second aspect of the present invention, in an exposure apparatus that exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL) so as to face the surface of the substrate (P), and A first member (70) having a first surface (71) provided so as to surround an optical path (K) of exposure light (EL) and an optical path (K) so as to face the surface of the substrate (P). The second member (90) having the second surface (91) provided outside the first surface (71), and the optical path between the first surface (71) and the surface of the substrate (P) ( An immersion mechanism (1) for filling a predetermined space (G1) including K) with the liquid (LQ) to form an immersion area (LR1) on the substrate (P); and a liquid (LQ) in the immersion area (LR1) ) In the state where the second member (90) and the substrate (P) are separated from each other, the adjusting mechanism (60) for adjusting the position of the second member (90). When an exposure apparatus equipped with (EX) is provided.

  According to the second aspect of the present invention, even when the exposure is performed while moving the substrate, the liquid can be prevented from flowing out and the substrate can be exposed satisfactorily.

  According to the third aspect of the present invention, a device manufacturing method using the exposure apparatus (EX) of the above aspect is provided.

  According to the third aspect of the present invention, a device can be manufactured using an exposure apparatus in which the outflow of liquid that fills the optical path of exposure light is prevented.

  According to the present invention, the outflow of liquid can be prevented and the substrate can be exposed satisfactorily.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 1st Embodiment. It is the top view which looked at the principal part of the liquid immersion system concerning a 1st embodiment from the lower side. It is a schematic diagram for demonstrating the behavior of a liquid. It is a figure for demonstrating operation | movement of the liquid immersion system which concerns on 1st Embodiment. It is a figure for demonstrating operation | movement of the liquid immersion system which concerns on 1st Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 2nd Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 3rd Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 4th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 5th Embodiment. It is a top view which shows typically the liquid immersion system which concerns on 6th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 7th Embodiment. It is a top view which shows typically the liquid immersion system which concerns on 7th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 7th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 8th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 9th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 10th Embodiment. It is a sectional side view which shows the principal part of the liquid immersion system which concerns on 11th Embodiment. It is a figure for demonstrating the liquid immersion system which concerns on 12th Embodiment. It is a figure for demonstrating the liquid immersion system which concerns on 13th Embodiment. It is a flowchart figure for demonstrating an example of the manufacturing process of a microdevice.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. In FIG. 1, an exposure apparatus EX exposes a mask stage 3 that can move while holding a mask M, a substrate stage 4 that can move while holding a substrate P, and a mask M held on the mask stage 3. The illumination optical system IL that illuminates with EL, the projection optical system PL that projects the pattern image of the mask M illuminated with the exposure light EL onto the substrate P held by the substrate stage 4, and the overall operation of the exposure apparatus EX are controlled. And a control device 7 for performing the operation. Here, the substrate includes a substrate in which a photosensitive material (photoresist) is coated on a base material such as a semiconductor wafer, and the mask includes a reticle on which a device pattern to be reduced and projected on the substrate is formed. In this embodiment, a transmissive mask is used as a mask, but a reflective mask may be used.

  In the present embodiment, the exposure apparatus EX uses a scanning exposure apparatus (so-called scanning stepper) that exposes a pattern formed on the mask M onto the substrate P while moving the mask M and the substrate P synchronously in the scanning direction. An example will be described. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the Y-axis direction, the direction orthogonal to the Y-axis direction in the horizontal plane is the X-axis direction (non-scanning direction), the X-axis, and A direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. A first immersion system 1 that fills the optical path K of the exposure light EL on the image plane side of the PL with the liquid LQ is provided. The operation of the first immersion system 1 is controlled by the control device 7. The exposure apparatus EX uses the first immersion system 1 to fill the optical path K of the exposure light EL with the liquid LQ while projecting at least the pattern image of the mask M onto the substrate P. The exposure apparatus EX irradiates the substrate P with the exposure light EL that has passed through the mask M via the projection optical system PL and the liquid LQ filled in the optical path K, whereby the pattern image of the mask M is applied onto the substrate P. Project. Further, in the exposure apparatus EX of the present embodiment, the liquid LQ filled in the optical path K is larger than the projection area AR in a part of the area on the substrate P including the projection area AR of the projection optical system PL, and the substrate P A local liquid immersion method in which a liquid immersion region LR1 of a smaller liquid LQ is locally formed is employed.

  Further, the exposure apparatus EX of the present embodiment includes a second immersion system 2 that is different from the first immersion system 1. The operation of the second immersion system 2 is controlled by the control device 7. The second immersion system 2 can form an immersion region LR2 for the liquid LQ on the substrate P. In the following description, the liquid immersion area formed by the first liquid immersion system 1 is appropriately referred to as a first liquid immersion area LR1, and the liquid immersion area formed by the second liquid immersion system 2 is appropriately referred to as a second liquid immersion area. This is referred to as an immersion region LR2. The second immersion system 2 forms a second immersion region LR2 for preventing the liquid LQ from flowing out of the first immersion region LR1 outside the first immersion region LR1 with respect to the optical path K. In the present embodiment, water (pure water) is used as the liquid LQ.

  In the present embodiment, the case where the liquid immersion regions LR1 and LR2 are mainly formed on the substrate P will be described as an example. However, on the image plane side of the projection optical system PL, a plurality of projection optical systems PL are provided. Of the optical elements, it can be formed on an object disposed at a position facing the final optical element FL closest to the image plane of the projection optical system PL, for example, on a part of the substrate stage 4 or the like.

The exposure apparatus EX includes a base BP provided on the floor and a main column 6 installed on the base BP. The illumination optical system IL is supported by a support frame 6F fixed to the upper part of the main column 6. The illumination optical system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. The exposure light EL emitted from the illumination optical system IL is, for example, far ultraviolet light (DUV light) such as emission lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp. Alternatively, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used.

  The mask stage 3 is movable in the X-axis, Y-axis, and θZ directions on the mask stage surface plate 3B while holding the mask M by driving a mask stage driving device 3D including an actuator such as a linear motor. is there. The mask stage 3 is supported in a non-contact manner on the upper surface (guide surface) of the mask stage surface plate 3B by an air bearing 3A. The mask stage surface plate 3B is supported by an upper support portion 6A protruding toward the inside of the main column 6 via a vibration isolator 3S. Position information of the mask stage 3 (and hence the mask M) is measured by the laser interferometer 3L. The laser interferometer 3L measures the position information of the mask stage 3 using a moving mirror 3K provided on the mask stage 3. The control device 7 drives the mask stage driving device 3D based on the measurement result of the laser interferometer 3L, and controls the position of the mask M held on the mask stage 3.

  The projection optical system PL projects the pattern image of the mask M onto the substrate P at a predetermined projection magnification, and has a plurality of optical elements, and these optical elements are held by the lens barrel 5. The lens barrel 5 has a flange 5F, and the projection optical system PL is supported by the lens barrel surface plate 5B via the flange 5F. The lens barrel surface plate 5B is supported by a lower support portion 6B protruding toward the inside of the main column 6 via a vibration isolator 5S. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 4 has a substrate holder 4H that holds the substrate P. The substrate stage is fixed in a state where the substrate P is held on the substrate holder 4H by driving a substrate stage driving device 4D including an actuator such as a linear motor. On the board 4B, it can move in directions of six degrees of freedom of the X axis, Y axis, Z axis, θX, θY, and θZ directions. The substrate stage 4 is supported in a non-contact manner on the upper surface (guide surface) of the substrate stage surface plate 4B by an air bearing 4A. The substrate stage surface plate 4B is supported on the base BP via a vibration isolator 4S. The position information of the substrate stage 4 (and consequently the substrate P) is measured by the laser interferometer 4L. The laser interferometer 4L uses the moving mirror 4K provided on the substrate stage 4 to measure position information regarding the X-axis, Y-axis, and θZ directions of the substrate stage 4. Further, surface position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held on the substrate stage 4 is detected by a focus / leveling detection system (not shown). The control device 7 drives the substrate stage driving device 4D based on the measurement result of the laser interferometer 4L and the detection result of the focus / leveling detection system, and controls the position of the substrate P held on the substrate stage 4. The substrate holder 4H is disposed in a recess 4R provided on the substrate stage 4, and the upper surface 4F of the substrate stage 4 other than the recess 4R is substantially the same as the surface of the substrate P held by the substrate holder 4H. It is a flat surface that is height (level). There may be a step between the surface of the substrate P held by the substrate holder 4H and the upper surface 4F of the substrate stage 4.

  Next, the first and second immersion systems 1 and 2 will be described. FIG. 2 is a side sectional view showing a main part of the first and second immersion systems 1 and 2, and FIG. 3 is a plan view seen from below.

  First, the first immersion system 1 will be described. 2 and 3, the first immersion system 1 includes a substrate P held by a substrate stage 4 (substrate holder 4H) and a final optical element of the projection optical system PL provided at a position facing the substrate P. The first immersion area LR <b> 1 is formed on the substrate P by filling the optical path K to the FL with the liquid LQ. The final optical element FL is the optical element closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL, and the liquid LQ that fills the optical path K is the plurality of optical elements of the projection optical system PL. Of these, only the final optical element FL is contacted.

  The first liquid immersion system 1 is provided in the vicinity of the optical path K. The first supply port 12 that supplies the liquid LQ for forming the first liquid immersion area LR1 to the optical path K and the first liquid LQ are collected. A first nozzle member 70 having a recovery port 22, a first supply pipe 13, a first liquid supply device 11 that supplies a liquid LQ via the first supply port 12 of the first nozzle member 70, and a first nozzle member 70 and a first liquid recovery device 21 that recovers the liquid LQ via the first recovery pipe 23. As shown in FIG. 1, the first nozzle member 70 is supported by the lower support portion 6 </ b> B of the main column 6 via the first support mechanism 61.

  The first liquid supply device 11 includes a temperature adjustment device that adjusts the temperature of the supplied liquid LQ, a deaeration device that reduces the gas component of the supplied liquid LQ, a filter unit that removes foreign matters in the liquid LQ, and the like. . One end of a first supply pipe 13 is connected to the first liquid supply device 11. In addition, an internal flow path (first supply flow path) 14 that connects the other end of the first supply pipe 13 and the first supply port 12 is formed inside the first nozzle member 70, and the first liquid is formed. The supply device 11 can supply clean and temperature-adjusted liquid LQ to the first supply port 12 via the first supply pipe 13 and the first supply flow path 14.

  The first liquid recovery device 21 includes a vacuum system such as a vacuum pump. One end of a first recovery pipe 23 is connected to the first liquid recovery device 21. In addition, an internal flow path (first recovery flow path) 24 that connects the other end of the first recovery pipe 23 and the first recovery port 22 is formed inside the first nozzle member 70, and the first liquid The recovery device 21 can recover the liquid LQ via the first recovery port 22, the first recovery flow path 24, and the first recovery pipe 23.

  The first nozzle member 70 is formed in an annular shape so as to surround the final optical element FL. A predetermined gap is provided between the first nozzle member 70 and the final optical element FL. The first nozzle member 70 has a bottom plate 78 having an upper surface 79 that faces the lower surface of the final optical element FL. A part of the bottom plate 78 is disposed between the lower surface of the final optical element FL of the projection optical system PL and the surface of the substrate P (substrate stage 4) in the Z-axis direction. Further, an opening 76 through which the exposure light EL passes is formed at the center of the bottom plate 78. The opening 76 is formed larger than the projection area AR irradiated with the exposure light EL. In the present embodiment, the opening 76 is formed in a substantially rectangular shape in plan view corresponding to the cross-sectional shape of the exposure light EL (that is, the projection area AR). The bottom plate 78 of the first nozzle member 70 has a lower surface 77 provided so as to face the surface of the substrate P held by the substrate stage 4 and surround the optical path K (opening 76) of the exposure light EL. Have. The lower surface 77 is a flat surface parallel to the XY plane, and is provided in the first nozzle member 70 at a position closest to the substrate P held by the substrate stage 4.

  A space having a predetermined gap is provided between the lower surface of the final optical element FL and the upper surface 79 of the bottom plate 78. In the following description, a space inside the first nozzle member 70 including a space between the lower surface of the final optical element FL and the upper surface 79 of the bottom plate 78 is appropriately referred to as an internal space GP.

  The first supply port 12 is provided at a position connected to the internal space GP. In the present embodiment, the first supply ports 12 are provided at predetermined positions on both sides in the Y-axis direction across the optical path K outside the optical path K of the exposure light EL. A plurality of first supply pipes 13 and first supply flow paths 14 are provided so as to correspond to a plurality (two) of first supply ports 12. Although not shown, the first nozzle member 70 includes a discharge port that discharges (exhausts) the gas in the internal space GP to the external space (atmospheric space).

  The first recovery port 22 is provided in an annular shape so as to face the surface of the substrate P held by the substrate stage 4 and to surround the optical path K of the exposure light EL and the lower surface 77. The first recovery port 22 is provided outside the first supply port 12 with respect to the optical path K in the first nozzle member 70.

  A porous member 25 having a plurality of holes is disposed in the first recovery port 22. The porous member 25 can be composed of, for example, a titanium mesh member or a ceramic porous body. The porous member 25 has a lower surface 26 facing the surface of the substrate P held by the substrate stage 4. The lower surface 26 of the porous member 25 is provided so as to face the surface of the substrate P held by the substrate stage 4 and to surround the optical path K of the exposure light EL and the lower surface 77. The lower surface 26 of the porous member 25 is substantially flat, and the porous member 25 is disposed in the recovery port 22 so that the lower surface 26 is substantially parallel to the surface (XY plane) of the substrate P held on the substrate stage 4. Yes. In the present embodiment, the lower surface 77 of the bottom plate 78 and the lower surface 26 of the porous member 25 are substantially flush.

  When titanium is used as the material of the first nozzle member 70 and the porous member (mesh) 25, it is desirable to use a material in which an anatase-type titanium oxide film is formed on the surface of titanium metal. The anatase-type titanium oxide film not only has high hydrophilic ability, but can maintain the hydrophilic ability for a long period of time, so that the nozzle member 70 (mesh) and the substrate P or the nozzle member 70 and the stage upper surface The liquid LQ can be held stably in between. As a titanium metal having an anatase-type titanium oxide film formed on the surface, for example, “Titanister (registered trademark)” manufactured by Yield Co., Ltd. is known.

  In the following description, the lower surface 77 of the bottom plate 78 and the lower surface 26 of the porous member 26 are appropriately referred to as a first lower surface 71 of the first nozzle member 70.

  Next, the operation of the first immersion system 1 will be described. The operations of the first liquid supply device 11 and the first liquid recovery device 21 are controlled by the control device 7, and the optical path K of the exposure light EL is filled with the liquid LQ to form the first liquid immersion region LR1. Therefore, the control device 7 drives each of the first liquid supply device 11 and the first liquid recovery device 21. The liquid LQ delivered from the first liquid supply device 11 flows through the first supply pipe 13 and then enters the internal space GP from the first supply port 12 via the first supply flow path 14 of the first nozzle member 70. Supplied. The liquid LQ supplied from the first supply port 12 to the internal space GP fills the internal space GP, and then passes through the opening 76 between the first lower surface 71 of the first nozzle member 70 and the surface of the substrate P. It flows into the first space G1 including K and fills the first space G1 including the optical path K. At this time, the first liquid recovery device 21 recovers a predetermined amount of the liquid LQ per unit time. The first liquid recovery device 21 including the vacuum system is supplied from the first supply port 12 by setting the first recovery flow path 24 to a negative pressure, and the first lower surface 71 of the first nozzle member 70 and the surface of the substrate P are supplied. The liquid LQ existing in the first space G <b> 1 can be recovered via the porous member 25 disposed in the first recovery port 22. The liquid LQ filled in the first space G1 including the optical path K flows into the first recovery flow path 24 via the first recovery port 22 (porous member 25) of the first nozzle member 70, and the first recovery pipe. After flowing through 23, it is recovered by the first liquid recovery device 21. As described above, the control device 7 controls the first immersion system 1 to perform the liquid supply operation by the first supply port 12 and the liquid recovery operation by the first recovery port 22 in parallel. The first immersion region LR1 is formed by filling the first space G1 including the optical path K between the first lower surface 71 of the 70 and the surface of the substrate P held by the substrate stage 4 with the liquid LQ.

  Next, the second immersion system 2 will be described. The second immersion system 2 forms a second immersion region LR2 for preventing the liquid LQ from flowing out of the first immersion region LR1 outside the first immersion region LR1 with respect to the optical path K.

  The second immersion system 2 includes a second nozzle member 80 having a second supply port 32 for supplying the liquid LQ for forming the second immersion region LR2 and a second recovery port 42 for recovering the liquid LQ, The second liquid supply device 31 that supplies the liquid LQ via the second supply pipe 33 and the second supply port 32 of the second nozzle member 80, the second recovery port 42 of the second nozzle member 80, and the second recovery pipe And a second liquid recovery device 41 that recovers the liquid LQ through 43. As shown in FIG. 1, the second nozzle member 80 is supported by the lower support portion 6 </ b> B of the main column 6 via the second support mechanism 62.

  The second liquid supply device 31 includes a temperature adjustment device that adjusts the temperature of the supplied liquid LQ, a deaeration device that reduces the gas component of the supplied liquid LQ, a filter unit that removes foreign matters in the liquid LQ, and the like. . One end of a second supply pipe 33 is connected to the second liquid supply device 31. In addition, an internal flow path (second supply flow path) 34 that connects the other end of the second supply pipe 33 and the second supply port 32 is formed inside the second nozzle member 80, and the second liquid The supply device 31 can supply the clean and temperature-adjusted liquid LQ to the second supply port 32 via the second supply pipe 33 and the second supply flow path 34.

  The second liquid recovery device 41 includes a vacuum system such as a vacuum pump. One end of a second recovery pipe 43 is connected to the second liquid recovery device 41. In addition, an internal flow path (second recovery flow path) 44 that connects the other end of the second recovery pipe 43 and the second recovery port 42 is formed inside the second nozzle member 80, and the second liquid The recovery device 41 can recover the liquid LQ via the second recovery port 42, the second recovery flow path 44, and the second recovery pipe 43.

  The second nozzle member 80 is formed in an annular shape so as to surround the first nozzle member 70. A predetermined gap is provided between the second nozzle member 80 and the first nozzle member 70. The second nozzle member 80 is provided outside the first lower surface 71 of the first nozzle member 70 so as to face the surface of the substrate P held on the substrate stage 4 and with respect to the optical path K of the exposure light EL. A second lower surface 81 is provided. The second lower surface 81 of the second nozzle member 80 is provided in an annular shape so as to surround the first lower surface 71 of the first nozzle member 70. The first lower surface 81 is a flat surface parallel to the XY plane, and is provided in the second nozzle member 80 at a position closest to the substrate P held by the substrate stage 4.

  The second recovery port 42 is provided in an annular shape so as to face the surface of the substrate P held by the substrate stage 4 and to surround the optical path K of the exposure light EL and the first lower surface 71 of the first nozzle member 70. It has been. The second recovery port 42 is provided outside the first recovery port 22 with respect to the optical path K in the second nozzle member 80.

  A porous member 45 having a plurality of holes is disposed in the second recovery port 42. The porous member 45 can be composed of, for example, a titanium mesh member or a ceramic porous body, like the porous member 25 disposed in the first recovery port 22. The porous member 45 has a lower surface 46 that faces the surface of the substrate P held by the substrate stage 4. The lower surface 46 of the porous member 45 is provided so as to face the surface of the substrate P held by the substrate stage 4 and to surround the optical path K of the exposure light EL and the first lower surface 71 (first recovery port 22). It has been.

  As in the case of the first nozzle member 70, the second nozzle member 80 and the porous member (mesh) 45, when titanium is used as the material, are formed by forming an anatase-type titanium oxide film on the surface of titanium metal. Is desirable.

  The lower surface 46 of the porous member 45 is substantially flat, and the porous member 45 is disposed in the second recovery port 42 so that the lower surface 46 is substantially parallel to the surface (XY plane) of the substrate P held on the substrate stage 4. Has been. Further, the lower surface 46 of the porous member 45 constitutes a part of the second lower surface 81 of the second nozzle member 80, and constitutes a region inside the annular second lower surface 81. That is, the second lower surface 81 of the second nozzle member 80 is configured by the lower surface 46 of the porous member 45 and the lower surface 87 that constitutes other regions. In the present embodiment, in the second lower surface 81, the lower surface 46 of the porous member 45 and the lower surface 87 constituting the region outside the lower surface 46 with respect to the optical path K are substantially flush. A second supply port 32 is formed in the lower surface 87.

  In the present embodiment, the first nozzle member 70 and the second nozzle member 80 are such that the first lower surface 71 of the first nozzle member 70 and the second lower surface 81 of the second nozzle member 80 are substantially the same height (level). The first support mechanism 61 and the second support mechanism 62 are supported by the first support mechanism 61 and the second support mechanism 62, respectively.

  The second supply port 32 is provided on the second lower surface 81 (lower surface 87) of the second nozzle member 80. The second supply port 32 is provided outside the first and second recovery ports 22 and 42 with respect to the optical path K. In the present embodiment, the second supply port 32 is provided in an annular shape so as to surround the optical path K and the first and second recovery ports 22 and 42. In the present embodiment, the second supply port 32 is formed in an annular slit shape having a predetermined slit width on the lower surface 87 of the second nozzle member 80.

  The second supply flow path 34 that supplies the liquid LQ to the second supply port 32 includes a first flow path portion 34A that is connected to the second supply port 32, and a second buffer space that is larger than the first flow path portion 34A. And a flow path part 34B. The second flow path part 34 </ b> B is provided outside the first flow path part 34 </ b> A with respect to the optical path K and is connected to the second supply pipe 33. 34 A of 1st flow path parts incline so that the space | interval (distance) with the board | substrate P may become small gradually as it goes to the inner side from the outer side of the optical path K, ie, as the optical path K is approached. And the 2nd supply port 32 is provided in the lower end of 34 A of 1st flow-path parts. In the present embodiment, the first flow path portion 34A is inclined at a predetermined angle (for example, about 30 ° to 45 °) with respect to the surface (XY plane) of the substrate P held on the substrate stage 4. The second supply port 32 provided at the lower end of the first flow path portion 34A supplies the liquid LQ toward the optical path K in the inclined direction.

  The first flow path portion 34A is a slit-shaped flow path formed in an annular shape in a cross-sectional view along the XY plane so as to correspond to the second supply port 32 formed in an annular slit shape. The buffer space of the second flow path portion 34B has a width that is sufficiently larger than the width of the first flow path portion 34A. The other end of the second supply pipe 33 is connected to the second flow path portion 34B including the buffer space.

  Next, the operation of the second immersion system 2 will be described. The operations of the second liquid supply device 31 and the second liquid recovery device 41 are controlled by the control device 7, and in order to form the second liquid immersion region LR2, the control device 7 Each of the apparatus 31 and the second liquid recovery apparatus 41 is driven. The liquid LQ delivered from the second liquid supply device 31 flows through the second supply pipe 33, and then flows into the second flow path portion 34B including the buffer space in the supply flow path 34, and the second flow path section 34B. And it is supplied to the 2nd supply port 32 via 34 A of 1st flow-path parts. The liquid LQ supplied from the supply flow path 34 including the second flow path portion 34B and the first flow path portion 34A to the second supply port 32 is connected to the first lower surface 81 of the second nozzle member 80 from the second supply port 32. It is supplied to the second space G2 between the surface of the substrate P. The first flow path portion 34A is inclined at a predetermined angle so that the distance (distance) from the substrate P gradually decreases as it approaches the optical path K, and the second supply port provided at the lower end of the first flow path portion 34A. 32 supplies the liquid LQ toward the optical path K in the inclined direction.

  In the present embodiment, a plurality of connection positions of the second flow path portion 34B of the supply flow path 34 and the second supply pipe 33 are set at substantially equal intervals in the circumferential direction (θZ direction) on the side surface of the second nozzle member 80. The other end of the second supply pipe 33 is connected to each of the plurality of connection positions. The buffer space of the second flow path part 34B disperses and equalizes the energy (pressure, flow velocity) of the liquid LQ supplied from the second liquid supply device 31 via the second supply pipe 33, and the first space from the buffer space. The amount (flow velocity) of the liquid LQ flowing into the flow path portion 34A per unit time is made uniform at each position of the first flow path portion 34A that is a slit-shaped flow path. A buffer space is provided to disperse and equalize the energy of the liquid LQ supplied from the second supply pipe 33 to supply each position of the slit-like second supply port 32 via the first flow path portion 34A. The flow rate (flow velocity) of the liquid LQ to be made can be made uniform, and the liquid LQ is supplied in a substantially uniform supply amount to the second space G2 at each position of the annular slit-shaped second supply port 32. Is done. As described above, the second immersion system 2 uses the slit-shaped second liquid LQ supplied to the second supply port 32 via the second flow path portion 34B including the buffer space and the first flow path portion 34A. The supply port 32 can supply the second space G2 almost uniformly.

  The liquid LQ supplied from the second supply port 42 to the second space G2 fills the second space G2. At this time, the second liquid recovery device 41 recovers a predetermined amount of the liquid LQ per unit time. The second liquid recovery apparatus 41 including the vacuum system is supplied from the second supply port 32 by setting the second recovery flow path 44 to a negative pressure, and the second lower surface 81 of the second nozzle member 80 and the surface of the substrate P are supplied. The liquid LQ existing in the second space G2 between the two can be recovered through the porous member 45 disposed in the second recovery port 42. The liquid LQ filled in the second space G2 flows into the second recovery flow path 44 via the second recovery port 42 (porous member 45) of the second nozzle member 80 and flows through the second recovery pipe 43. Then, it is recovered by the second liquid recovery device 41. As described above, the control device 7 controls the second immersion system 2 to perform the liquid supply operation by the second supply port 32 and the liquid recovery operation by the second recovery port 42 in parallel. The second immersion region LR2 is formed by filling the second space G2 between the second lower surface 81 of the 80 and the surface of the substrate P with the liquid LQ.

  As shown in FIG. 2, the second immersion system 2 forms the second immersion region LR2 outside the first immersion region LR1 with respect to the optical path K at a position away from the first immersion region LR1. To do. In the present embodiment, the second supply port 32 and the second recovery port 42 are formed in an annular shape so as to surround the optical path K (first lower surface 71), and the liquid supply operation by the second supply port 32 and the second supply port 32. By performing the liquid recovery operation by the recovery port 42 in parallel, the second immersion system 2 can form the annular second immersion region LR2. That is, the second immersion region LR2 is formed in an annular shape by the second immersion system 2 so as to surround the optical path K of the exposure light EL and the first immersion region LR1.

  Further, the second supply port 32 supplies the liquid LQ in an inclined direction toward the optical path K, and the second recovery port 42 is provided on the inner side of the second supply port 32 with respect to the optical path K. Therefore, the second immersion system 2 can satisfactorily form the second immersion region LR2 without causing the liquid LQ to flow out.

  Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  In order to expose the substrate P, the controller 7 uses the first immersion system 1 to form the first immersion region LR1 on the substrate P held on the substrate stage 4, and the second immersion system. 2 is used to form the second immersion region LR2 so as to surround the first immersion region LR1. Then, the control device 7 moves the mask M while relatively moving the optical path K (projection optical system PL) of the exposure light EL and the substrate P in a state where the first and second liquid immersion regions LR1 and LR2 are formed. Is projected onto the substrate P via the projection optical system PL and the liquid LQ in the first immersion region LR1. As described above, the exposure apparatus EX of the present embodiment is a scanning exposure apparatus that uses the Y-axis direction as the scanning direction, and the control apparatus 7 uses the substrate stage 4 to move the substrate P in the Y-axis direction. Then, the substrate P is exposed.

  In such a scanning exposure apparatus, for example, as the scanning speed (moving speed) of the substrate P increases, the liquid LQ cannot be sufficiently recovered through the first recovery port 22 and fills the optical path K. The liquid LQ that has been discharged may flow out of the first recovery port 22 with respect to the optical path K. For example, when the substrate P is moved from the state shown in the schematic diagram of FIG. 4A to the first immersion region LR1 by a predetermined distance at a predetermined speed in the −Y direction, the substrate P is moved. There is a possibility that the interface LG between the liquid LQ in the first immersion region LR1 and the space outside thereof moves outward with respect to the optical path K of the exposure light EL. During the movement, there is a possibility that the moving speed of the interface LG increases or the shape of the interface LG changes greatly and the liquid LQ flows out of the first recovery port 22. For example, as shown in the schematic diagram of FIG. 4B, the liquid LQ that has been in contact with the first lower surface 71 of the first nozzle member 70 is separated from a part of the first lower surface 71 of the first nozzle member 70 ( There is a possibility that a film (thin film) of the liquid LQ is formed on the substrate P. Since the formed liquid LQ film is separated from the first recovery port 22 (porous member 25), there is a possibility that the first recovery port 22 cannot recover the liquid LQ film. That is, since the formed film of the liquid LQ does not come into contact with the porous member 25 disposed in the first recovery port 22, there is a possibility that the first recovery port 22 cannot recover the liquid LQ. Then, there is a possibility that the liquid LQ flows out of the first recovery port 22 or the formed film of the liquid LQ tears on the substrate P and remains as droplets on the substrate P. There is. As the moving speed of the substrate P increases, there is a high possibility that the liquid LQ cannot be sufficiently recovered through the first recovery port 22, and the liquid LQ flows out or onto the substrate P. The possibility of remaining is increased.

  In the present embodiment, the control device 7 uses the second immersion system 2 to prevent the liquid LQ from flowing out of the first immersion region LR1 outside the first immersion region LR1 with respect to the optical path K. Therefore, even if the liquid LQ that fills the optical path K flows out of the first recovery port 22 with respect to the optical path K, the liquid LQ is discharged to the second nozzle member 80 ( Outflow to the outside of the second recovery port 42) can be prevented.

  FIG. 5 is a diagram illustrating a state in which the outflow of the liquid LQ in the first immersion region LR1 is prevented by the second immersion region LR2. The control device 7 uses the second liquid immersion system 2 to form a second liquid immersion region LR2 so as to surround the first liquid immersion region LR1. The immersion region LR2 is formed. Therefore, as the substrate P moves in the −Y direction, even if the liquid LQ in the first immersion region LR1 tries to flow out in the −Y direction, the front side of the substrate P in the movement direction, that is, the first immersion region LR1. The second liquid immersion area LR2 formed on the −Y side can prevent the liquid LQ from flowing out of the first liquid immersion area LR1 (outflow to the outside of the second nozzle member 80).

  The second liquid immersion region LR2 is formed by the liquid LQ that fills the space between the second lower surface 81 of the second nozzle member 80 and the surface of the substrate P, and prevents the liquid LQ from flowing out of the first liquid immersion region LR1. Acts as a wall. As described above, the second immersion system 2 uses the liquid LQ supplied from the second supply port 32 to place the first immersion region LR1 between the second lower surface 81 of the second nozzle member 80 and the surface of the substrate P. The wall for preventing the liquid LQ from flowing out can be formed without a gap. Therefore, as described with reference to FIG. 4, even when the liquid LQ film is formed on the substrate P, the liquid LQ can be prevented from flowing out.

  In the present embodiment, the second supply port 32 supplies the liquid LQ in an inclined direction toward the optical path K, and the second immersion system 2 supplies the second immersion area LR2 to the optical path K. Thus, the flow of the liquid LQ from the outside to the inside is generated. That is, for example, even when the substrate P moves in the −Y direction, the liquid LQ supplied from the second supply port 32 tends to flow toward the + Y side. Therefore, even if the substrate P moves in the predetermined direction (−Y direction), the liquid LQ supplied from the second supply port 32 to the second space G2 flows out of the second nozzle member 80 with respect to the optical path K. Is prevented. In addition, the liquid LQ supplied from the second supply port 32 is in a direction (+ Y direction) opposite to the direction (−Y direction) in which the liquid LQ is about to flow out of the first immersion region LR1. ) Can be given momentum. Accordingly, it is possible to effectively prevent the liquid LQ from flowing out of the first immersion region LR1.

  Then, as shown in FIG. 5, the liquid LQ that has flowed out from the first liquid immersion region LR1 is absorbed by the second liquid immersion region LR2, and is recovered from the second recovery port 42 together with the liquid LQ in the second liquid immersion region LR2. Is done. As described above, in the present embodiment, even if the liquid LQ in the first immersion region LR1 that fills the optical path K flows out of the first recovery port 22, the liquid LQ flows to the second nozzle member 80 (second recovery port). 42) is prevented from flowing outside.

  In the present embodiment, since the control device 7 forms the second immersion region LR2 at least while the substrate P is moving, the first immersion region LR1 as the substrate P moves. Even if the liquid LQ is about to flow out to the front side in the movement direction of the substrate P, the liquid LQ can be prevented from flowing out in the second liquid immersion region LR2.

  Further, the control device 7 performs stepping movement of the substrate P in the X-axis direction between shots when sequentially exposing a plurality of shot areas on the substrate P, but the liquid LQ may flow out by the stepping movement. is there. In the present embodiment, since the control device 7 forms the second immersion region LR2 at least while moving the substrate P, the control device 7 moves the substrate P in the scanning direction (scanning direction, Y-axis direction). Even when the substrate P is moved in the non-scanning direction (stepping direction, X-axis direction) as well as during exposure, the outflow of the liquid LQ in the first immersion area LR1 is performed using the second immersion area LR2. Can be prevented.

  As described above, the second liquid immersion area LR2 can prevent the liquid LQ from flowing out of the first liquid immersion area LR1. Accordingly, with the outflow of the liquid LQ, for example, peripheral equipment malfunctions, the environment (humidity, etc.) in which the exposure apparatus EX is placed fluctuates, or droplets of the liquid LQ remain on the substrate P. The occurrence of defects such as these can be suppressed. Therefore, the substrate P can be exposed satisfactorily.

  When a detection device (for example, a focus / leveling detection system) that performs predetermined detection by irradiating the surface of the substrate P with detection light, for example, is provided outside the first immersion region LR1, the liquid LQ is If the liquid LQ flows out, there is a possibility that the detection accuracy deteriorates due to the liquid LQ or an error occurs in the detection operation. However, by preventing the liquid LQ from flowing out, such a problem can be prevented. can do. Therefore, the exposure of the substrate P executed based on the detection can be performed well.

  In the present embodiment, since the second immersion region LR2 is formed in an annular shape so as to surround the first immersion region LR1, not only the movement of the substrate P in the scanning direction and the stepping direction but also the substrate The second immersion region LR2 exists on the front side in the movement direction when P moves in a predetermined direction in the XY plane. Therefore, the liquid LQ can be prevented from flowing out even when the substrate P moves in any direction in the XY plane.

  As shown in FIG. 6, for example, when the substrate P moves in the + Y direction, for example, the liquid LQ that has been in contact with the second lower surface 81 starts from a part of the second lower surface 81 of the second nozzle member 80. There is a possibility that a film (thin film) of the liquid LQ is formed on the substrate P, but the liquid LQ is taken into the liquid LQ in the first immersion region LR1, and therefore the film of the liquid LQ No droplets remain on the substrate P.

  In the first embodiment, the lower surface 77 of the bottom plate 78 and the lower surface 26 of the porous member 25 are substantially flush, but the lower surface 26 of the porous member 25 is lower than the lower surface 77 of the bottom plate 78 with respect to the surface of the substrate P. The lower surface 26 of the porous member 25 may be inclined with respect to the XY plane. Further, the lower surface 46 of the porous member 45 may be provided away from the lower surface 87 with respect to the surface of the substrate P, may be provided at a position close to the surface of the substrate P, or the porous member 45. The lower surface 46 may be inclined with respect to the XY plane.

  In the first embodiment, the first lower surface 71 of the first nozzle member 70 and the second lower surface 81 of the second nozzle member 80 are substantially flush with each other. And the second lower surface 81 of the second nozzle member 80 may be provided at different positions (heights) in the Z-axis direction.

  Further, at least one of the first nozzle member 70 and the second nozzle member 80 is driven by at least one of the first support mechanism 61 that supports the first nozzle member 70 and the second support mechanism 62 that supports the second nozzle member 80. A driving device (actuator) may be provided. And using the drive device, the position (posture) of the first nozzle member 70 and the second nozzle member 80, the positional relationship between the first lower surface 71 and the second lower surface 82, or the first lower surface 71 with respect to the substrate P, The positional relationship of the second lower surface 81 may be adjusted. For example, the position of the second nozzle member 80 for forming the second immersion region LR2 (position in the Z-axis direction) and posture (position in the θX and θY directions) are changed during the movement of the substrate P. You may adjust according to conditions. Here, the moving condition of the substrate P includes at least a part of the moving speed, acceleration, deceleration, moving direction, and moving distance when the substrate P is moved in a predetermined direction. Alternatively, when exposure is performed while moving the substrate P in the scanning direction while adjusting the position of the surface of the substrate P with respect to the image plane of the projection optical system PL, the surface of the substrate P is moved in the Z axis, θX, and θY directions. When moving in at least one direction, the first lower surface 71 of the first nozzle member 71 and the second lower surface 81 of the second nozzle member 80 according to the movement of the surface of the substrate P (for example, so as to follow). You may make it adjust the position and attitude | position of at least one of these.

  Alternatively, the liquid immersion conditions for forming the second liquid immersion region LR2 may be adjusted according to the movement conditions of the substrate P. Here, the immersion conditions are the supply conditions (supply amount, supply direction, supply position, etc.) of the liquid LQ from the second supply port 32, and the recovery conditions (recovery amount) of the liquid LQ through the second recovery port 42. , Collection direction, collection position, etc.). For example, when the moving speed of the substrate P is high, the amount of liquid supplied from the second supply port 32 per unit time is increased, or the second lower surface 81 of the second nozzle member 80 is relative to the surface of the substrate P. The position can be adjusted, and the positional relationship (distance) between the surface of the substrate P and the second supply port 32 can be adjusted. In addition, when the second supply port 32 is divided into a plurality of parts, a specific second supply port 32 is selected from among the plurality of second supply ports 32 according to the movement condition (movement direction, etc.) of the substrate P. The liquid LQ may be supplied. Further, according to the movement condition of the substrate P, for example, the amount of liquid recovered per unit time via the second recovery port 42 is adjusted, or the second nozzle member 80 is driven to adjust the surface of the substrate P and the second recovery. You may make it adjust the positional relationship (distance) with the opening | mouth 42 (porous member 45).

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 7 is a view showing a main part of the first and second immersion systems 1 and 2 according to the second embodiment. As shown in FIG. 7, in the present embodiment, the second nozzle member 80 is omitted, and the first region 71 ′ and the substrate P on the lower surface of the first nozzle member 70 (the surface facing the surface of the substrate P). The first immersion region LR1 is formed by the liquid LQ that fills the first space G1 including the optical path K between the first surface 71 ′ and the substrate P. The second region 81 ′ outside the first region 71 ′ and the substrate P The second immersion region LR2 is formed by the liquid LQ that fills the second space G2 between the surface of the first liquid immersion region LR2 and the surface of the second immersion region LR2. A first recovery port 22 is provided outside the first supply port 12 for supplying the liquid LQ for forming the first immersion region LR1 with respect to the optical path K on the lower surface of the first nozzle member 70. The second recovery port 42 is provided outside the first recovery port 22 with respect to the optical path K, and the second immersion region LR2 for forming the second liquid immersion region LR2 is formed outside the second recovery port 42 with respect to the optical path K. Two supply ports 32 are provided.

  As described above, the first region (first lower surface) 71 ′ forming the first space G1 filled with the liquid LQ for forming the first liquid immersion region LR1 with the substrate P, and the second liquid immersion region The second member (second lower surface) 82 ′ forming the second space G2 filled with the liquid LQ for forming the LR2 may be provided in the same member (first nozzle member 70).

  As in the first embodiment described above, the first lower surface for forming the first liquid immersion region LR1 and the second lower surface for forming the second liquid immersion region LR2 are provided in separate members. Accordingly, as described above, for example, the positional relationship between the first lower surface 71 and the second lower surface 81 with respect to the surface of the substrate P can be adjusted as appropriate.

<Third Embodiment>
Next, a third embodiment will be described with reference to FIG. As shown in FIG. 8, also in this embodiment, the second nozzle member 80 is omitted, and the first region 71 ′ and the substrate P on the lower surface of the first nozzle member 70 (the surface facing the surface of the substrate P). The first immersion region LR1 is formed by the liquid LQ that fills the first space G1 including the optical path K between the first surface 71 ′ and the substrate P. The second region 81 ′ outside the first region 71 ′ and the substrate P The second immersion region LR2 is formed by the liquid LQ that fills the second space G2 between the surface of the first liquid immersion region LR2 and the surface of the second immersion region LR2. A recovery port 22 is provided outside the first supply port 12 for supplying the liquid LQ for forming the first immersion region LR1 with respect to the optical path K on the lower surface of the first nozzle member 70. A second supply port 32 for forming the second liquid immersion region LR2 is provided outside the recovery port 22 with respect to K.

  Thus, the recovery operation of the liquid LQ in the first immersion region LR1 and the recovery operation of the liquid LQ in the second immersion region LR2 may be performed using the same recovery port 22. In other words, the first immersion system 1 and the second immersion system 2 may also serve as the recovery port 22.

<Fourth embodiment>
Next, a fourth embodiment will be described with reference to FIG. As shown in FIG. 9, in the present embodiment, the exposure apparatus EX includes a first nozzle member 70 and a second nozzle member 80, and the recovery port 22 is formed on the first lower surface 71 of the first nozzle member 70. Is provided. The second supply port 32 is provided on the second lower surface 81 of the second nozzle member 80. The second lower surface 81 is not provided with a recovery port. The first liquid immersion region LR1 is formed by a liquid supply operation from the first supply port 12 and a liquid recovery operation through the recovery port 22, and the second liquid immersion region LR2 is a liquid from the second supply port 32. It is formed by the supply operation and the liquid recovery operation via the recovery port 22.

  The second immersion region LR2 is formed so as to straddle the first lower surface 71 of the first nozzle member 70 and the second lower surface 81 of the second nozzle member 80. The gap between the nozzle member 80 and the nozzle member 80 is set so small that the liquid LQ does not enter.

<Fifth Embodiment>
Next, a fifth embodiment will be described with reference to FIG. As shown in FIG. 10, the exposure apparatus EX includes a first nozzle member 70 and a second nozzle member 80, and the first nozzle member 70 includes a first supply port 12. The recovery port 22 is not provided on the first lower surface 71 of the first nozzle member 70. Further, the second lower surface 81 of the second nozzle member 80 is provided with a recovery port 42 and a second supply port 32. The first liquid immersion region LR1 is formed by a liquid supply operation from the first supply port 12 and a liquid recovery operation through the recovery port 42, and the second liquid immersion region LR2 is a liquid from the second supply port 32. It is formed by the supply operation and the liquid recovery operation via the recovery port 22.

  The first immersion region LR1 is formed so as to straddle the first lower surface 71 of the first nozzle member 70 and the second lower surface 81 of the second nozzle member 80. The gap between the nozzle member 80 and the nozzle member 80 is set so small that the liquid LQ does not enter.

<Sixth Embodiment>
Next, a sixth embodiment will be described with reference to FIG. In the first to fifth embodiments described above, the second immersion region LR2 is formed in an annular shape so as to surround the first immersion region LR1, but the second immersion region LR2 is formed in the optical path K. On the other hand, it may be formed in each of a plurality of predetermined regions outside the first liquid immersion region LR1. For example, as shown in the schematic diagram of FIG. 11, a plurality of second nozzle members 80 for forming the second immersion region LR2 are provided so as to surround the first nozzle member 70, and the outside of the first immersion region LR1. A plurality of second immersion regions LR2 can be formed. In the example illustrated in FIG. 11, four second nozzle members 80 are provided, and are arranged on the + Y side, the −Y side, the + X side, and the −X side with respect to the first nozzle member 70. The second immersion region LR2 is formed on each of the + Y side, the -Y side, the + X side, and the -X side with respect to the first immersion region LR1.

  In addition, when the control device 7 moves the substrate P in the XY direction with the first immersion region LR1 formed on the substrate P, the second supply port provided in each of the plurality of second nozzle members 80. 32, the liquid LQ is supplied from the second supply port 32 of the specific second nozzle member 80, and the second liquid immersion region LR <b> 2 can be formed on the front side in the movement direction of the substrate P. For example, when the control device 7 moves the substrate P in the −Y direction with the first immersion region LR1 formed on the substrate P, at least of the plurality (four) of the second nozzle members 80, The liquid LQ is supplied from the second supply port 32 of the second nozzle member 80 arranged in the −Y direction with respect to the first nozzle member 70 (first immersion region LR1), and the front side in the movement direction of the substrate P, That is, the second immersion region LR2 is formed on the −Y side. Thus, even if the liquid LQ in the first liquid immersion area LR1 is about to flow out in the −Y direction as the substrate P moves in the −Y direction, the liquid LQ flows out of the second liquid immersion area LR2. Can be prevented.

  In the first to sixth embodiments described above, the second immersion region LR2 has been described as being formed in a single annular shape. The liquid immersion area may surround the first liquid immersion area LR1.

  In the first to sixth embodiments described above, the liquid LQ in the first immersion region LR1 and the liquid LQ in the second immersion region LR2 are the same type (water) and the same quality (water quality). However, for example, the type (physical property) of the liquid LQ that forms the first immersion region LR1 may be different from the type of the liquid LQ that forms the second immersion region LR2. Further, the quality of the liquid LQ that forms the first immersion region LR1 may be different from the quality of the liquid LQ that forms the second immersion region LR2. For example, the temperature of the liquid LQ in the second immersion region LR2 may be different from that of the liquid LQ in the first immersion region LR1. In this case, the temperature of the substrate P can be adjusted with the liquid LQ in the second immersion region LR2. For example, when a part of the liquid LQ in the first immersion region LR1 is vaporized by setting the temperature of the liquid LQ in the second immersion region LR2 higher than the temperature of the liquid LQ in the first immersion region LR1. The temperature decrease of the substrate P caused by the heat of vaporization can be compensated by the liquid LQ in the second immersion region LR2. Alternatively, the degassing level of the liquid LQ supplied from the first supply port 12 and the degassing level of the liquid LQ supplied from the second supply port 32 may be different.

<Seventh embodiment>
Next, a seventh embodiment will be described with reference to FIGS. FIG. 12 is a side sectional view showing the main part according to the seventh embodiment, and FIG. 13 is a schematic plan view. The exposure apparatus EX of the present embodiment includes a nozzle member 70 having a first lower surface 71 provided so as to face the surface of the substrate P held on the substrate stage 4 and surround the optical path K of the exposure light EL. A predetermined member 90 having a second lower surface 91 provided on the outer side of the first lower surface 71 with respect to the optical path K of the exposure light EL so as to face the surface of the substrate P held on the substrate stage 4; 1 Liquid immersion system 1 that fills a predetermined space G1 including the optical path K between the lower surface 71 and the surface of the substrate P with the liquid LQ to form the liquid immersion region LR1 on the substrate P, and the liquid LQ of the liquid immersion region LR1 In order to prevent the outflow, an adjustment mechanism 60 that adjusts the position of the predetermined member 90 in a state where the predetermined member 90 and the substrate P are separated is provided.

  Similarly to the first to sixth embodiments described above, the nozzle member 70 includes the supply port 12 that supplies the liquid LQ for filling the optical path K of the exposure light EL with the liquid LQ and forming the liquid immersion region LR1 on the substrate P. And a recovery port 22 for recovering the liquid LQ.

  The adjustment mechanism 60 includes a support mechanism 62 that supports the predetermined member 90, and the predetermined member 90 is supported by the lower support portion 6 </ b> B of the main column 6 via the support mechanism 62. The adjustment mechanism 60 includes a drive mechanism 63 that drives the predetermined member 90. The drive mechanism 63 constitutes a part of the support mechanism 62, and can drive the predetermined member 90 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. The drive mechanism 63 includes an actuator that can drive the predetermined member 90 by a Lorentz force, such as a voice coil motor, and an actuator that includes a piezoelectric element. In the present embodiment, the drive mechanism 63 includes a coarse motion actuator including, for example, a voice coil motor capable of performing position adjustment of the predetermined member 90 with a predetermined accuracy, and a piezoelectric actuator capable of performing position adjustment of the predetermined member 90 with high accuracy, for example. And an actuator for fine movement including an element.

  The nozzle member 70 and the predetermined member 90 are separated from each other. That is, the support mechanism 61 that supports the nozzle member 70 and the support mechanism 62 that supports the predetermined member 90 support the nozzle member 70 and the predetermined member 90 so that the nozzle member 70 and the predetermined member 90 are separated from each other. doing. Thereby, the movement of the predetermined member 90 when driving the predetermined member 90 with respect to the nozzle member 70 by the drive mechanism 63 is not prevented.

  As shown in the schematic diagram of FIG. 13, in the present embodiment, a plurality of the predetermined members 90 are provided so as to surround the nozzle member 70 and, consequently, the liquid immersion region LR1. In the present embodiment, the predetermined member 90 is disposed on each of the + Y side, the −Y side, the + X side, and the −X side with respect to the nozzle member 70.

  Further, the predetermined member 90 has liquid repellency with respect to the liquid LQ. In the present embodiment, the predetermined member 90 includes a material containing a fluorine-based resin such as PTFE (polytetrafluoroethylene) or PFA (tetrafluoroethylene-perfluoroalkoxyethylene copolymer), for example. Yes. These materials are materials that do not easily elute impurities (eluate) into the liquid (water) LQ, that is, materials that do not easily contaminate the liquid (water). The predetermined member 90 may be formed of a predetermined material such as metal, and the surface thereof may be covered (coated) with a film of a liquid repellent material such as a fluorine-based material.

  Next, a method for exposing the substrate P using the above-described exposure apparatus EX will be described.

  For example, as illustrated in FIG. 14, when the substrate P is moved in the −Y direction in a state where the liquid immersion region LR <b> 1 is formed on the substrate P, the liquid LQ in the liquid immersion region LR <b> 1 is directed to the nozzle member 70 with respect to the optical path K. May flow out in the -Y direction. In order to prevent the liquid LQ from flowing out using the adjusting mechanism 60 having the drive mechanism 63, the control device 7 at least in the moving direction of the substrate P, that is, the liquid immersion region LR1 among the plurality of predetermined members 90. On the other hand, the position of the predetermined member 90 arranged on the −Y side is adjusted. Specifically, the control device 7 drives the predetermined member 90 using the drive mechanism 63 of the adjustment mechanism 60, and the surface of the substrate P held on the second lower surface 91 of the predetermined member 90 and the substrate stage 4. And adjust the gap. For example, the control device 7 uses the adjustment mechanism 60 to apply the second lower surface 91 of the predetermined member 90 provided on the −Y side to the liquid immersion region LR1 to prevent the liquid LQ from flowing out. The member 70 is brought closer to the surface of the substrate P than the first lower surface 71 of the member 70.

  By doing so, the predetermined member 90 can prevent the liquid LQ from flowing out. The predetermined member 90 acts as a wall for preventing the liquid LQ from flowing out of the first liquid immersion region LR1. The adjustment mechanism 60 makes the gap between the surface of the substrate P and the second lower surface 91 of the predetermined member 90 sufficiently small so that the liquid LQ does not flow out. Thus, the liquid LQ is prevented from flowing out of the predetermined member 90. Further, since the surface of the predetermined member 90 has liquid repellency, it is possible to prevent the liquid LQ from flowing out through the gap or the liquid LQ adhering to the surface of the predetermined member 90 from remaining. ing.

  For example, when the substrate P is moved in the + Y direction, the control device 7 uses the adjustment mechanism 60 to move the second lower surface 91 of the predetermined member 90 arranged on the + Y side with respect to the liquid immersion region LR1 to the substrate P. The second lower surface 91 of another predetermined member 90 is separated from the surface of the substrate P. Similarly, when the substrate P is moved in the + X direction (or −X direction), the control device 7 uses the adjustment mechanism 60 to place the substrate P on the + X side (or −X side) with respect to the liquid immersion region LR1. The second lower surface 91 of the predetermined member 90 is moved closer to the surface of the substrate P, and the second lower surface 91 of the other predetermined member 90 is separated from the surface of the substrate P.

  In the present embodiment, the controller 7 detects the surface position information of the substrate P using the focus / leveling detection system before performing the exposure of the substrate P. When the substrate P is exposed, the detection result The substrate P is exposed while controlling the substrate stage 4 and adjusting the positional relationship of the surface of the substrate P with respect to the image plane of the projection optical system PL. Specifically, before the exposure of the substrate P, the control device 7 obtains the surface shape (approximate curved surface) of the substrate P in advance using a focus / leveling detection system, and when the substrate P is exposed, The substrate P is exposed while controlling the substrate stage 4 so that the image plane through the liquid LQ of the projection optical system PL matches the surface of the substrate P. During the exposure of the substrate P, the control device 7 determines the second lower surface 91 of the predetermined member 90 and the surface of the substrate P based on the surface position information (information on the surface shape) of the substrate P that is obtained in advance. Are adjusted using the adjusting mechanism 60 so that the gap between the second lower surface 91 of the predetermined member 90 and the surface of the substrate P is in a desired state. As described above, in the present embodiment, the control device 7 performs a predetermined process with respect to the surface of the substrate P by feedforward control based on the surface position information of the substrate P obtained in advance while moving the substrate P. The substrate P is exposed while adjusting the position of the second lower surface 91 of the member 90.

  When the substrate P is not moved, the control device 7 moves each of the plurality of predetermined members 90 in the + Z direction so that the predetermined member 90 and the substrate P do not contact each other, and retracts the predetermined member 90 from the substrate P. It is desirable to keep it.

  As described above, even when the substrate P is exposed while being moved by the predetermined member 90, the outflow of the liquid LQ can be prevented and the substrate P can be exposed satisfactorily. In addition, since the adjustment mechanism 60 forms a predetermined gap between the second lower surface 91 of the predetermined member 90 and the surface of the substrate P, it is possible to prevent inconvenience due to the contact between the predetermined member 90 and the substrate P. Can do.

  Further, in the present embodiment, among the plurality of predetermined members 90, the predetermined member 90 provided on the front side in the movement direction of the substrate P is moved, and the second lower surface 91 of the predetermined member 90 is moved to the first of the nozzle member 70. The first lower surface 71 is closer to the surface of the substrate P, and the second lower surfaces 91 of the other predetermined members 90 are sufficiently separated from the surface of the substrate P. Therefore, inconveniences such as contact between the other predetermined members 90 and the substrate P are suppressed.

  In the present embodiment, the predetermined member 90 has a configuration in which a plurality (four) of the predetermined members 90 are provided outside the nozzle member 70, and the weight of each predetermined member 90 can be reduced. Therefore, the controllability when performing the position control of each of the predetermined members 90 can be improved.

  In the present embodiment, among the plurality of predetermined members 90, only the second lower surface 91 of the predetermined member 90 arranged on the front side in the movement direction of the substrate P has been described so as to approach the surface of the substrate P. The other predetermined member 90 may be brought close to the surface of the substrate P. For example, when the substrate P is moved in the −Y direction, the control device 7 uses the adjustment mechanism 60 to set, for example, a predetermined position arranged on the −Y side, the + X side, and the −X side with respect to the liquid immersion region LR1. The second lower surface 91 of the member 90 may be brought close to the surface of the substrate P. In addition, for example, when the substrate P moves in the tilt direction with respect to the Y-axis direction, the control device 7 can prevent any predetermined member 90 among the plurality of predetermined members 90 so that the liquid LQ can be prevented from flowing out. The second lower surface 91 can be brought close to the surface of the substrate P.

  In the present embodiment, four predetermined members 90 are provided around the nozzle member 70, but the number and arrangement thereof can be arbitrarily set.

  In the present embodiment, the adjustment mechanism 60 can drive the predetermined member 90 in the direction of six degrees of freedom, but may be driven only in the vertical direction (only in the Z-axis direction), for example.

  In the present embodiment, the second lower surface 91 of the predetermined member 90 is planar, but may be, for example, a curved surface or a combination of a plurality of planes facing different directions.

<Eighth Embodiment>
Next, an eighth embodiment will be described with reference to FIG. A characteristic part of this embodiment is that a first detection device 94 for detecting the positional relationship between the surface of the substrate P and the second lower surface 91 of the predetermined member 90 is provided. In FIG. 15, the exposure apparatus EX includes a first detection device 94 that detects the positional relationship between the surface of the substrate P and the second lower surface 91 of the predetermined member 90. The first detection device 94 is provided at a predetermined position of the predetermined member 90. The first detection device 94 is provided at a position where it does not come into direct contact with the liquid LQ that has flowed out. In the present embodiment, the first detection device 94 is provided on the side of the predetermined member 90 opposite to the side facing the optical path K (first immersion region LR1). The first detection device 94 irradiates the surface of the substrate P with detection light, receives the detection light reflected by the surface of the substrate P, and based on the light reception result, the second lower surface 91 of the predetermined member 90 and the substrate The distance from the surface of P can be detected. The detection result of the first detection device 94 is output to the control device 7.

  A plurality of first detection devices 94 are provided for one predetermined member 90, and the control device 7 determines a predetermined member for the surface of the substrate P based on the detection results of the plurality of first detection devices 94. It is also possible to obtain a positional relationship with respect to the inclination direction (θX, θY direction) of the 90 second lower surface 91. Further, the control device 7 may obtain the distance between the second lower surface 91 of the predetermined member 90 and the surface of the substrate P from the average value of the detection results of the plurality of first detection devices 94. Thus, the first detection device 94 of the present embodiment optically detects the positional relationship between the second lower surface 91 of the predetermined member 90 and the surface of the substrate P, and the control device 7 Based on the detection result, the positional relationship between the second lower surface 91 of the predetermined member 90 and the surface of the substrate P can be obtained.

  Then, the control device 7 uses the adjustment mechanism 60 based on the detection result of the first detection device 94 to prevent the liquid LQ from flowing out during the exposure while moving the substrate P. The position of the member 90 is adjusted. That is, the control device 7 determines the second lower surface 92 of the predetermined member 90 and the substrate based on the positional relationship between the second lower surface 91 of the predetermined member 90 and the surface of the substrate P obtained from the detection result of the first detection device 94. The position of the predetermined member 90 is adjusted using the adjustment mechanism 60 so that the positional relationship (gap) with the surface of P is in a desired state. Thereby, it is possible to prevent the liquid LQ from flowing out while preventing the collision between the predetermined member 90 and the substrate P.

<Ninth Embodiment>
Next, a ninth embodiment will be described with reference to FIG. A characteristic part of this embodiment is that a second detection device 96A for detecting the outflow of the liquid LQ is provided. In FIG. 16, the exposure apparatus EX includes a second detection device 96 </ b> A that detects whether or not the liquid LQ in the liquid immersion region LR <b> 1 has flowed out of the nozzle member 70. The second detection device 96A includes a detection member 97 provided so as to be in contact with the liquid LQ that has flowed out. In the present embodiment, the detection member 97 is provided on the side surface of the predetermined member 90 that faces the optical path K (the liquid immersion region LR1). The detection member 97 is configured to float on the liquid LQ, and is supported so as to be movable in the Z-axis direction with respect to the predetermined member 90. When the detection member 97 is not in contact with the liquid LQ, that is, when the outflow of the liquid LQ in the liquid immersion area LR1 is not detected, the control device 7 uses the adjustment mechanism 60 including the drive mechanism 63. The second lower surface 91 of the predetermined member 90 is further away from the substrate P than the first lower surface 71 of the nozzle member 70 and is retracted to a predetermined position. At this time, at least a part of the detection member 97 is disposed below the second lower surface 91 of the predetermined member 90 in a range where it does not contact the substrate P so that the detection member 97 can come into contact with the liquid LQ that has flowed out.

  When the liquid LQ in the liquid immersion region LR1 flows out and comes into contact with the flowing out liquid LQ and the detection member 97, a force based on the flowed out liquid LQ acts on the detection member 97. For example, buoyancy acts on the detection member 97 by the liquid LQ that has flowed out. The detection member 97 is a floating member configured to be able to float in the liquid LQ, and is supported so as to be movable in the Z-axis direction with respect to the predetermined member 90. Move to (float). In addition, a sensor capable of detecting the force of the liquid LQ acting on the detection member 97 is connected to the detection member 97. The second detection device 96A can determine whether or not the liquid LQ has flowed out based on the force of the liquid LQ acting on the detection member 97.

  When the control device 7 determines that the liquid LQ has flowed out based on the detection result of the second detection device 96A, the control device 7 uses the adjustment mechanism 60 including the drive mechanism 63 to move the second lower surface 91 of the predetermined member 90 to the nozzle. The member 70 is brought closer to the surface of the substrate P than the first lower surface 71 of the member 70. That is, when the control device 7 determines that the liquid LQ has flowed out based on the detection result of the second detection device 96A, in order to prevent the liquid LQ from flowing out, the second lower surface 91 of the predetermined member 90 and the substrate P The positional relationship with the surface is adjusted so as to be a gap that can prevent the liquid LQ from flowing out. Even when the second lower surface 91 of the predetermined member 90 approaches the surface of the substrate P, the detection member 97 is supported so as to be movable in the Z-axis direction with respect to the predetermined member 90 and can float on the liquid LQ. Therefore, contact between the detection member 97 and the substrate P is prevented.

  Here, in the present embodiment, the surface position information of the substrate P is detected by a focus / leveling detection system. Therefore, the control device 7 optimizes the positional relationship of the second lower surface 91 of the predetermined member 90 with respect to the surface of the substrate P based on the detection result of the focus / leveling detection system and the information on the driving amount of the driving mechanism 63. Can do.

  On the other hand, when the control device 7 determines that the liquid LQ is not flowing out based on the detection result of the second detection device 96A, the control device 7 uses the adjustment mechanism 60 including the drive mechanism 63 to use the second lower surface of the predetermined member 90. 91 is further away from the surface of the substrate P than the first lower surface 71 of the nozzle member 70.

  In the ninth embodiment, the first detection device 94 as described in the eighth embodiment is provided, and the predetermined member 90 with respect to the surface of the substrate P is determined based on the detection result of the first detection device 94. The positional relationship of the second lower surface 91 may be optimized. Or you may adjust the predetermined member 90 based on the information regarding the surface shape of the board | substrate P previously calculated | required before exposing the board | substrate P. FIG.

  In the present embodiment, the second detection device 96A detects whether or not the liquid LQ has flowed out using the force received by the detection member 97 from the liquid LQ. For example, an eddy current sensor or the like can be used. A liquid presence / absence sensor that can detect whether or not the liquid LQ is in contact with the predetermined member 90 may be included.

<Tenth Embodiment>
Next, a tenth embodiment will be described with reference to FIG. A characteristic part of the present embodiment is that the nozzle member 70 is provided with a second detection device 96B that detects the outflow of the liquid LQ. In FIG. 17, on the first lower surface 71 of the nozzle member 70, a second detection device 96B that detects the outflow of the liquid LQ in the liquid immersion region LR1 is provided. The second detection device 96 </ b> B is provided in the outer edge region of the first lower surface 71 of the nozzle member 70. In the present embodiment, the porous member 25 is disposed in the recovery port 22, and the second detection device 96 </ b> B is provided in the outer edge region of the lower surface 26 of the porous member 25. Note that the second detection device 96 </ b> B may be provided outside the lower surface 26 of the porous member 25 in the first lower surface 71.

  The second detection device 96B can be configured by a sensor that can detect the presence or absence of the liquid LQ, such as an eddy current sensor. Alternatively, as the second detection device 96B, the nozzle member 70 includes a projection unit that can project the detection light onto the substrate P, and a light receiving unit that can receive the detection light reflected on the substrate P. The outflow of the liquid LQ may be optically detected based on the light reception result of the part. In the first lower surface 71 of the nozzle member 70, the difference in refractive index between the liquid and the gas when the liquid LQ is present between the position where the second detection device 96B is provided and the surface of the substrate P is not present. Since the light receiving state at the light receiving unit differs, the second detection device 96B determines the position where the second detection device 96B on the first lower surface 71 of the nozzle member 70 is provided and the substrate P based on the light reception result of the light receiving unit. It can be determined whether or not there is a liquid LQ between the two, that is, whether or not the liquid LQ has flowed out.

  Then, when the control device 7 determines that the liquid LQ in the liquid immersion region LR1 has flowed out based on the detection result of the second detection device 96B, the control device 7 uses the adjustment mechanism 60 to move the second lower surface 91 of the predetermined member 90. The nozzle member 70 is brought closer to the surface of the substrate P than the first lower surface 71. On the other hand, when the control device 7 determines that the liquid LQ in the liquid immersion region LR1 has not flowed out based on the detection result of the second detection device 96B, the control device 7 uses the adjustment mechanism 60 to adjust the second lower surface of the predetermined member 90. 91 is further away from the substrate P than the first lower surface 71 of the nozzle member 70.

  In the present embodiment, the surface position information of the substrate P is detected by a focus / leveling detection system, and the control device 7 is based on the detection result of the focus / leveling detection system and information on the drive amount of the drive mechanism 63. Thus, the positional relationship of the second lower surface 91 of the predetermined member 90 with respect to the surface of the substrate P can be optimized. Also in the present embodiment, the first detection device 94 as described in the eighth embodiment is provided, and the predetermined member 90 with respect to the surface of the substrate P is determined based on the detection result of the first detection device 94. The positional relationship of the second lower surface 91 may be optimized. Or you may adjust the predetermined member 90 based on the information regarding the surface shape of the board | substrate P previously calculated | required before exposing the board | substrate P. FIG.

<Eleventh embodiment>
Next, an eleventh embodiment will be described with reference to FIG. A characteristic part of this embodiment is that a second detection device 96C for detecting the outflow of the liquid LQ is provided on the lower support portion 6B of the main column 6. The second detection device 96 </ b> C in FIG. 18 includes a projection unit that projects the detection light La to a predetermined position outside the nozzle member 70 with respect to the optical path K in the surface of the substrate P, and detection reflected on the surface of the substrate P. A light receiving portion for receiving the light La. The control device 7 can detect the outflow of the liquid LQ based on the light reception result of the light receiving unit of the second detection device 96C. In the surface of the substrate P, whether or not the liquid LQ is present at the position where the detection light La is irradiated from the second detection device 96C, the light receiving state at the light receiving unit due to the difference in refractive index between the liquid and the gas Therefore, the second detection device 96C determines whether or not the liquid LQ is present outside the nozzle member 70 with respect to the optical path K on the surface of the substrate P based on the light reception result of the light receiving unit. You can ask if it has been leaked.

  Then, similarly to the above-described tenth embodiment, when the control device 7 determines that the liquid LQ in the liquid immersion region LR1 has flowed out based on the detection result of the second detection device 96C, the control device 7 uses the adjustment mechanism 60 to perform a predetermined operation. The second lower surface 91 of the member 90 is brought closer to the surface of the substrate P than the first lower surface 71 of the nozzle member 70. On the other hand, when the control device 7 determines that the liquid LQ in the liquid immersion region LR1 does not flow out based on the detection result of the second detection device 96C, the control device 7 uses the adjustment mechanism 60 to adjust the second lower surface of the predetermined member 90. 91 is further away from the substrate P than the first lower surface 71 of the nozzle member 70.

<Twelfth embodiment>
Next, a twelfth embodiment will be described with reference to FIG. FIG. 19A is a schematic plan view for explaining the twelfth embodiment, and FIG. 19B is a side view. A characteristic part of the present embodiment is that the second detection device 96D that detects the outflow of the liquid LQ irradiates the detection light La for detecting the outflow of the liquid LQ substantially parallel to the surface of the substrate P. is there. A second detection device 96D of FIG. 19 has a projection unit 96K that projects detection light La substantially parallel to the surface of the substrate P, and a light receiving unit that is provided at a position where the detection light La projected from the projection unit 96K can be received. 96L. The detection light La is irradiated near the outside of the interface (edge) LG of the liquid immersion region LR1. When the liquid LQ in the liquid immersion area LR1 flows outside the recovery port 22 of the nozzle member 70, the liquid LQ exists on the optical path of the detection light La. Since the light receiving state in the light receiving unit 96L differs depending on whether or not the liquid LQ is present on the optical path of the detection light La, the control device 7 is based on the light reception result of the light receiving unit 96L of the second detection device 96D. The outflow of the liquid LQ can be detected.

<13th Embodiment>
In the above-described seventh to twelfth embodiments, the predetermined member 90 is configured to be divided into a plurality of parts outside the nozzle member 70. However, as illustrated in the schematic diagram of FIG. 70 (liquid immersion region LR1) may be formed in an annular shape so as to surround it. By doing so, it is possible to prevent the liquid LQ from flowing out in any direction that intersects the optical path K of the exposure light EL. In the thirteenth embodiment, as described in the above-described embodiments, the position of the annular predetermined member 90 may be adjusted by feedforward control, or the detection result of the first detection device 94 is used. May be adjusted.

  As described above, in each of the above-described embodiments, an outflow prevention device that forms a wall for preventing the liquid LQ from flowing out of the liquid immersion region LR1 is provided outside the liquid immersion region LR1. The outflow prevention device can prevent the liquid LQ from flowing out. Therefore, various problems associated with the outflow of the liquid LQ can be prevented, and the substrate P can be exposed satisfactorily.

  Note that the liquid LQ in the liquid immersion area LR1 may flow out not only in the exposure of the substrate P but also in various measurements performed via the liquid LQ. For example, in the state where the immersion region LR1 is formed on the sensor provided on the upper surface 4F of the substrate stage 4, and the measurement operation is performed using the sensor, the second immersion region LR1 is disposed outside the immersion region LR1. The region LR2 can be formed, or the second member 90 can be disposed. Accordingly, various measurements performed via the liquid LQ in the liquid immersion area LR1 can be performed with high accuracy while preventing the liquid LQ from flowing out. Therefore, the exposure of the board | substrate P performed based on the measurement can also be performed favorably.

  Further, as disclosed in Japanese Patent Application Laid-Open No. 11-135400 and Japanese Patent Application Laid-Open No. 2000-164504, a measurement stage equipped with a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and various photoelectric sensors. The above-described embodiments can also be applied to an exposure apparatus including the above. Even when the liquid immersion region LR1 is formed on the measurement stage, the second liquid immersion region LR2 can be formed outside the liquid immersion region LR1, or the predetermined member 90 can be disposed.

  In the projection optical systems of the above-described embodiments, the optical path of the exposure light EL on the image plane side of the optical element at the tip is filled with liquid, but as disclosed in International Publication No. 2004/019128. It is also possible to adopt a projection optical system in which the optical path on the object plane side of the optical element at the tip is also filled with liquid.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not pass through water. The liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In addition, as the liquid LQ, the liquid LQ is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used.

  Moreover, as the liquid LQ, a liquid having a refractive index of about 1.6 to 1.8 may be used. Furthermore, the optical element FL may be formed of a material having a refractive index higher than that of quartz or fluorite (for example, 1.6 or more).

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in JP-A-10-163099, JP-A-10-214783, JP-T 2000-505958, and the like. It can also be applied to.

  In the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in JP-A-6-124873 and JP-A-10. -303114, US Pat. No. 5,825,043, etc., and can be applied to an immersion exposure apparatus that performs exposure in a state where the entire surface of the substrate to be exposed is immersed in the liquid. is there.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6,778,257, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used.

  Further, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P. The present invention can also be applied.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 21, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

  DESCRIPTION OF SYMBOLS 1 ... 1st immersion system, 2 ... 2nd immersion system, 4 ... Substrate stage, 7 ... Control apparatus, 12 ... 1st supply port, 22 ... 1st collection port, 25 ... Porous member, 26 ... Lower surface, 32 ... 2nd supply port, 42 ... 2nd collection | recovery port, 45 ... Porous member, 46 ... Lower surface, 60 ... Adjustment mechanism, 63 ... Drive mechanism, 70 ... 1st nozzle member, 71 ... 1st lower surface, 80 ... 2nd nozzle 81, second lower surface, 90, predetermined member, 91, second lower surface, 94, first detection device, 96A to 96D, second detection device, EL, exposure light, EX, exposure device, G1, first space. G2 ... second space, K ... optical path, LQ ... liquid, LR1 ... first immersion region, LR2 ... second immersion region, P ... substrate

Claims (42)

In an exposure apparatus for exposing the substrate by irradiating exposure light onto the substrate,
A projection optical system;
An object disposed so as to surround the optical path of the exposure light and disposed at a position facing the optical element closest to the image plane of the projection optical system can be opposed to the first space between the object and the liquid. A first nozzle member for forming the first immersion region of
A second nozzle member that is disposed outside the first nozzle member with respect to the optical path and forms a second liquid immersion region away from the first liquid immersion region in a second space between the object and the object. When,
A second supply port that is provided in the second nozzle member and supplies a liquid for forming the second immersion region;
A drive device capable of moving at least one of the first nozzle member and the second nozzle member;
While the object is moving, the second immersion region can be formed;
An exposure apparatus in which at least one of the first nozzle member and the second nozzle member is moved based on a moving condition of the object.   The exposure apparatus according to claim 1, wherein the position or posture of the second nozzle member is adjusted by the driving device.   The exposure apparatus according to claim 1, wherein the second nozzle member is moved in an optical axis direction of the optical element by the driving device.   The exposure apparatus according to claim 1, wherein the positional relationship between the first nozzle member and the second nozzle member is adjusted by the driving device.   The exposure apparatus according to claim 1, wherein the positional relationship of the second nozzle member with respect to the object is adjusted by the driving device.   The exposure apparatus according to claim 1, wherein the position or posture of the second nozzle member is adjusted by the driving device so as to follow the moving object. A first support mechanism for supporting the first nozzle member;
A second support mechanism for supporting the second nozzle member,
The exposure apparatus according to claim 1, wherein the driving device is disposed on at least one of the first support mechanism and the second support mechanism.   The exposure apparatus according to claim 7, further comprising a support portion that supports the first and second support mechanisms. In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate,
A projection optical system;
An object disposed so as to surround the optical path of the exposure light and disposed at a position facing the optical element closest to the image plane of the projection optical system can be opposed to the first space between the object and the liquid. A first nozzle member for forming the first immersion region of
A second nozzle member that is disposed outside the first nozzle member with respect to the optical path and forms a second liquid immersion region away from the first liquid immersion region in a second space between the object and the object. When,
A second supply port that is provided in the second nozzle member and supplies a liquid for forming the second immersion region;
A first support mechanism for supporting the first nozzle member;
A second support mechanism for supporting the second nozzle member;
A driving device disposed on at least one of the first support mechanism and the second support mechanism and moving at least one of the first nozzle member and the second nozzle member;
A support portion for supporting the first and second support mechanisms,
The first immersion region can be formed on the substrate;
Wherein the second liquid immersion area, formable der Ru exposure device on the substrate. The second nozzle member has a second recovery port for recovering the previous SL liquid,
The exposure according to any one of claims 1 to 9, wherein the second liquid immersion region is formed by performing liquid recovery by the second recovery port in parallel with liquid supply by the second supply port. apparatus.   The exposure apparatus according to claim 10, wherein a liquid immersion condition for forming the second liquid immersion area is adjusted based on a moving condition of the object. In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate,
A projection optical system;
An object disposed so as to surround the optical path of the exposure light and disposed at a position facing the optical element closest to the image plane of the projection optical system can be opposed to the first space between the object and the liquid. A first nozzle member for forming the first immersion region of
A second nozzle member that is disposed outside the first nozzle member with respect to the optical path and forms a second liquid immersion region away from the first liquid immersion region in a second space between the object and the object. When,
A second supply port that is provided in the second nozzle member and supplies a liquid for forming the second immersion region;
A second recovery port provided in the second nozzle member for recovering the liquid;
While the object is moving, liquid recovery by the second recovery port is performed in parallel with liquid supply by the second supply port, so that the second immersion region can be formed,
An exposure apparatus in which a liquid immersion condition for forming the second liquid immersion region is adjusted based on a moving condition of the object.   The liquid immersion condition includes at least one of a supply amount, a supply direction, a supply position of the liquid from the second supply port, a recovery amount, a recovery direction, and a recovery position of the liquid from the second recovery port. The exposure apparatus according to claim 11 or 12. The second nozzle member has a second supply channel for supplying the liquid to the second supply port,
The said 2nd supply flow path contains the 1st flow path part connected to the said 2nd supply port, and the 2nd flow path part containing a larger buffer space than the said 1st flow path part. The exposure apparatus according to any one of the above. In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate,
A projection optical system;
An object disposed so as to surround the optical path of the exposure light and disposed at a position facing the optical element closest to the image plane of the projection optical system can be opposed to the first space between the object and the liquid. A first nozzle member for forming the first immersion region of
A second nozzle member that is disposed outside the first nozzle member with respect to the optical path and forms a second liquid immersion region away from the first liquid immersion region in a second space between the object and the object. When,
A second supply port that is provided in the second nozzle member and supplies a liquid for forming the second immersion region;
A second recovery port provided in the second nozzle member for recovering the liquid;
A second supply channel provided in the second nozzle member for supplying the liquid to the second supply port;
The second supply channel includes an exposure device including a first channel connected to the second supply port and a second channel including a buffer space larger than the first channel.   The exposure apparatus according to claim 14, wherein the second supply port is provided in the second surface and supplies a liquid in an inclined direction toward the optical path.   The exposure apparatus according to claim 1, wherein the moving condition of the object includes at least one of a moving speed, an acceleration, a deceleration, a moving direction, and a moving distance of the object.   The exposure apparatus according to claim 1, wherein the second immersion area is formed at least on the front side in the movement direction of the object.   The exposure apparatus according to claim 18, wherein the second immersion area is formed in an annular shape so as to surround the first immersion area.   The exposure apparatus according to claim 19, wherein the annular second immersion region is formed in a double manner. A plurality of the second nozzle members are arranged,
21. The exposure apparatus according to any one of claims 18 to 20, wherein the second liquid immersion region is formed on a front side in the movement direction of the object by a specific second nozzle member among the plurality of second nozzle members. In an exposure apparatus for exposing the substrate by irradiating exposure light onto the substrate,
A projection optical system;
An object disposed so as to surround the optical path of the exposure light and disposed at a position facing the optical element closest to the image plane of the projection optical system can be opposed to the first space between the object and the liquid. A first nozzle member for forming the first immersion region of
A second nozzle member that is disposed outside the first nozzle member with respect to the optical path and forms a second liquid immersion region away from the first liquid immersion region in a second space between the object and the object. When,
A second supply port that is provided in the second nozzle member and supplies a liquid for forming the second immersion region ;
A plurality of the second nozzle members are arranged,
An exposure apparatus that forms the second liquid immersion region on the front side in the moving direction of the object by a specific second nozzle member among the plurality of second nozzle members. The exposure apparatus according to claim 21 or 22 liquid for forming the second liquid immersion area from the second supply port of a particular second nozzle member is supplied.   The exposure apparatus according to any one of claims 21 to 23, wherein the second immersion area is formed in a state where the first immersion area is formed. The exposure apparatus according to any one of claims 1 to 24, wherein the second liquid immersion area prevents liquid from flowing out of the first liquid immersion area. The first nozzle member has a first supply port for supplying a liquid for forming the first liquid immersion region, and a first recovery port for recovering the liquid,
The exposure according to any one of claims 1 to 25, wherein the first liquid immersion region is formed by performing liquid recovery by the first recovery port in parallel with liquid supply by the first supply port. apparatus.   The exposure apparatus according to any one of claims 1 to 26, wherein the first lower surface and the second lower surface have different heights.   28. The exposure apparatus according to any one of claims 1 to 27, wherein a liquid forming the first liquid immersion area is different from a liquid forming the second liquid immersion area.   29. The exposure apparatus according to claim 28, wherein the liquid forming the first liquid immersion area and the liquid forming the second liquid immersion area are of different types.   30. The exposure apparatus according to claim 28 or 29, wherein the liquid forming the first liquid immersion region and the liquid forming the second liquid immersion region have different qualities.   31. The exposure apparatus according to claim 28, wherein a temperature of the liquid forming the first liquid immersion area is different from a temperature of the liquid forming the second liquid immersion area.   28. The exposure apparatus according to any one of claims 1 to 27, wherein the liquid forming the first immersion area is the same as the liquid forming the second immersion area.   A device manufacturing method using the exposure apparatus according to any one of claims 1 to 32. In an exposure method of exposing the substrate by irradiating exposure light onto the substrate,
A first liquid immersion region is provided in a first space between the first nozzle member and the substrate, using a first nozzle member provided so as to surround the optical path of the exposure light and capable of facing the substrate. Forming,
Using the second nozzle member disposed outside the first nozzle member with respect to the optical path, the second space between the second nozzle member and the substrate is separated from the first liquid immersion region. Forming a second immersion region of liquid,
The second nozzle member is provided with a second supply port for supplying a liquid for forming the second immersion region,
The substrate is moved in a state in which the first immersion region and the second immersion region are formed;
An exposure method in which at least one of the first nozzle member and the second nozzle member is moved based on a moving condition of the substrate.   The exposure method according to claim 34, wherein a position or posture of the second nozzle member is adjusted based on a moving condition of the substrate.   36. The exposure method according to claim 34 or 35, wherein the second nozzle member is moved in an optical axis direction of the optical element based on a moving condition of the substrate.   37. The exposure method according to any one of claims 34 to 36, wherein a positional relationship between the first nozzle member and the second nozzle member is adjusted based on a movement condition of the substrate.   38. The exposure method according to any one of claims 34 to 37, wherein a positional relationship of the second nozzle member with respect to the substrate is adjusted based on a moving condition of the substrate. In an exposure method of exposing the substrate by irradiating exposure light onto the substrate,
A first liquid immersion region is provided in a first space between the first nozzle member and the substrate, using a first nozzle member provided so as to surround the optical path of the exposure light and capable of facing the substrate. Forming,
Using the second nozzle member disposed outside the first nozzle member with respect to the optical path, the second space between the second nozzle member and the substrate is separated from the first liquid immersion region. Forming a second immersion region of liquid,
The second nozzle member is provided with a second supply port for supplying a liquid for forming the second immersion region,
A plurality of the second nozzle members are arranged,
An exposure method in which the second immersion region is formed on the front side in the movement direction of the substrate by a specific second nozzle member among the plurality of second nozzle members. The exposure method according to claim 39 in which the liquid for forming the second liquid immersion area from the second supply port of said specific second nozzle member is supplied.   41. The exposure method according to any one of claims 39 to 40, wherein the second immersion area is formed in a state where the first immersion area is formed.   The device manufacturing method using the exposure method as described in any one of Claims 34-41.

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