JP4752320B2 - Substrate holding apparatus and exposure apparatus, substrate holding method, exposure method, and device manufacturing method - Google Patents

Description

  The present invention relates to a substrate holding apparatus that holds a substrate, an exposure apparatus that exposes a substrate through a liquid, and a device manufacturing method.

In a photolithography process that is one of the manufacturing processes of microdevices such as semiconductor devices and liquid crystal display devices, an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. This exposure apparatus has a mask stage for holding a mask and a substrate stage for holding a substrate, and projects the mask pattern onto the substrate via a projection optical system while sequentially moving the mask stage and the substrate stage. is there. In the manufacture of microdevices, miniaturization of patterns formed on a substrate is required in order to increase the density of devices. In order to meet this requirement, it is desired to further increase the resolution of the exposure apparatus. As one of means for realizing the higher resolution, a liquid on the substrate as disclosed in the following patent document is used. An immersion exposure apparatus has been devised that forms a liquid immersion region and exposes the substrate through the liquid in the liquid immersion region.
International Publication No. 99/49504 Pamphlet JP 2004-289127 A

  If the liquid enters the back side of the substrate through a gap between the substrate and the substrate stage, various problems may occur. For example, when the back surface of the substrate is wetted by the liquid that has entered the back surface of the substrate, the substrate holder (substrate holding device) may not be able to hold the substrate satisfactorily. Alternatively, when unloading the substrate from the substrate holder using a predetermined transport system, liquid may adhere to the transport system that holds the back side of the wet substrate, or liquid may be scattered on the transport path. There is also a risk of expansion.

  The present invention has been made in view of such circumstances, and includes a substrate holding apparatus and an exposure apparatus that can prevent liquid from entering the back side of the substrate, and a device manufacturing method using the exposure apparatus. The purpose is to provide.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to a first aspect of the present invention, there is provided a substrate holding device for holding a substrate (P) irradiated with exposure light (EL), which is formed on a base material (PHB) and a base material (PHB). The support part (30) that supports the back surface (Pb) of the substrate (P) and the base material (PHB) are formed, face the back surface (Pb) of the substrate (P), and surround the support part (30). Formed on the base material (PHB), facing the back surface (Pb) of the substrate (P) and surrounding the first peripheral wall portion (31). The gas is supplied to a predetermined space (V3) surrounded by the second peripheral wall (34), the first peripheral wall (31), the second peripheral wall (34), and the back surface (Pb) of the substrate (P). There is provided a substrate holding device (PH) including an air supply port (42) and an exhaust port (52) for discharging gas in a predetermined space (V3).

  According to the first aspect of the present invention, the air supply port that supplies gas to the predetermined space surrounded by the first peripheral wall portion, the second peripheral wall portion, and the back surface of the substrate, and the exhaust port that discharges the gas in the predetermined space Therefore, it is possible to prevent liquid from entering the back side of the substrate.

  According to the second aspect of the present invention, the exposure includes the substrate holding device (PH) of the above aspect and exposes the substrate (P) held by the substrate holding device (PH) through the liquid (LQ). An apparatus (EX) is provided.

  According to the second aspect of the present invention, since the liquid can be prevented from entering the back side of the substrate, the substrate can be exposed satisfactorily.

  According to the third aspect of the present invention, a device manufacturing method using the exposure apparatus (EX) of the above aspect is provided.

  According to the third aspect of the present invention, a device can be manufactured by using an exposure apparatus that can satisfactorily expose a substrate.

  According to the present invention, liquid can be prevented from entering the back side of the substrate, and the substrate can be exposed satisfactorily.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. In FIG. 1, an exposure apparatus EX includes a mask stage MST that can move while holding a mask M, a substrate holder PH that holds a substrate P, a substrate stage PST that can move a substrate holder PH that holds a substrate P, Illumination optical system IL for illuminating mask M held on mask stage MST with exposure light EL, projection optical system PL for projecting a pattern image of mask M illuminated with exposure light EL onto substrate P, and exposure apparatus And a control device CONT for controlling the overall operation of EX.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. A liquid immersion mechanism 1 is provided for filling the optical path space K1 of the exposure light EL in the vicinity of the PL image plane with the liquid LQ. The liquid immersion mechanism 1 is provided in the vicinity of the optical path space K1, and is provided in the nozzle member 70 having the supply port 12 for supplying the liquid LQ and the recovery port 22 for recovering the liquid LQ, the supply pipe 13, and the nozzle member 70. The liquid supply device 11 for supplying the liquid LQ through the supply port 12, the recovery port 22 provided in the nozzle member 70, and the liquid recovery device 21 for recovering the liquid LQ through the recovery pipe 23 are provided. . The nozzle member 70 is formed in an annular shape so as to surround the final optical element LS1 closest to the image plane of the projection optical system PL among the plurality of optical elements constituting the projection optical system PL above the substrate P (substrate holder PH). Is formed.

  Further, the exposure apparatus EX of the present embodiment has an immersion region LR of the liquid LQ that is larger than the projection region AR and smaller than the substrate P in a part of the region on the substrate P including the projection region AR of the projection optical system PL. The local liquid immersion method is used to form the surface locally. The exposure apparatus EX uses the liquid immersion mechanism 1 while transferring at least the pattern image of the mask M to the substrate P, and uses the liquid immersion mechanism 1 to provide the final optical element LS1 and the final optical element LS1 that are closest to the image plane of the projection optical system PL. A liquid LQ immersion region LR is formed on the substrate P by filling the optical path space K1 of the exposure light EL with the substrate P arranged at the opposite position with the liquid LQ, and the projection optical system PL and the liquid immersion A pattern image of the mask M is projected onto the substrate P by irradiating the substrate P with the exposure light EL that has passed through the mask M via the liquid LQ in the region LR. The control device CONT supplies a predetermined amount of the liquid LQ using the liquid supply device 11 of the liquid immersion mechanism 1 and recovers the predetermined amount of the liquid LQ using the liquid recovery device 21, so that the optical path space K <b> 1 is replaced with the liquid LQ. The liquid LQ immersion region LR is locally formed in a partial region on the substrate P.

  In the present embodiment, the liquid immersion region LR may be described as being formed on the substrate P. However, the liquid immersion region LR is disposed at a position facing the final optical element LS1 on the image plane side of the projection optical system PL. For example, it can be formed on a part of the substrate holder PH or a part of the substrate stage PST.

  In the present embodiment, the exposure apparatus EX uses a scanning exposure apparatus (so-called scanning stepper) that exposes a pattern formed on the mask M onto the substrate P while moving the mask M and the substrate P synchronously in the scanning direction. An example will be described. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the Y-axis direction, the direction orthogonal to the Y-axis direction in the horizontal plane is the X-axis direction (non-scanning direction), the X-axis, and A direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a substrate in which a photosensitive material (resist) is coated on a base material such as a semiconductor wafer, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination optical system IL includes an exposure light source, an optical integrator that equalizes the illuminance of a light beam emitted from the exposure light source, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, and the exposure light EL. A field stop for setting an illumination area on the mask M is provided. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. The exposure light EL emitted from the illumination optical system IL is, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp. Alternatively, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used as the liquid LQ. Pure water includes not only ArF excimer laser light but also, for example, far ultraviolet light (DUV light) such as emission lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). It can be transmitted.

  Mask stage MST is movable while holding mask M. Mask stage MST holds mask M by vacuum suction (or electrostatic suction). The mask stage MST is in a plane perpendicular to the optical axis AX of the projection optical system PL in a state where the mask M is held by driving a mask stage driving device MSTD including a linear motor controlled by the control device CONT, that is, XY. It can move two-dimensionally in the plane and can rotate slightly in the θZ direction. A movable mirror 91 is provided on the mask stage MST. A laser interferometer 92 is provided at a predetermined position. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 92 using the moving mirror 91. The The measurement result of the laser interferometer 92 is output to the control device CONT. The control device CONT drives the mask stage drive device MSTD based on the measurement result of the laser interferometer 92, and controls the position of the mask M held on the mask stage MST.

  The projection optical system PL projects the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements, which are held by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. In the present embodiment, among the plurality of optical elements constituting the projection optical system PL, the final optical element LS1 closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.

  Substrate stage PST can move substrate holder PH holding substrate P on the image plane side of projection optical system PL. The substrate stage PST is movably provided on the base member BP while supporting the substrate holder PH. The substrate stage PST is driven by a substrate stage driving device PSTD. The substrate stage driving device PSTD is controlled by the control device CONT. The substrate stage driving device PSTD includes, for example, a linear motor, and includes an XY driving device that moves the substrate holder PH in the X axis direction, the Y axis direction, and the θZ direction, and a voice coil motor, for example. And a Z driving device for moving the substrate holder PH in the Z-axis direction, the θX direction, and the θY direction. By driving the substrate stage PST, the upper surface (front surface) of the substrate P held by the substrate holder PH is movable in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. .

  A movable mirror 93 is provided on the side surface of the substrate holder PH. A laser interferometer 94 is provided at a predetermined position. The two-dimensional position and rotation angle of the substrate P on the substrate holder PH are measured in real time by the laser interferometer 94 using the moving mirror 93. Although not shown, the exposure apparatus EX includes a focus / leveling detection system that detects surface position information of the upper surface (front surface) of the substrate P. The focus / leveling detection system detects surface position information (position information in the Z-axis direction and inclination information in the θX and θY directions) of the upper surface (front surface) of the substrate P. The measurement result of the laser interferometer 94 and the detection result of the focus / leveling detection system are output to the control device CONT. The control device CONT drives the substrate stage drive device PSTD based on the detection result of the focus / leveling detection system, and controls the focus position (Z position) and the tilt angles (θX, θY) of the substrate P to control the substrate P. The positional relationship between the upper surface (front surface) and the image plane via the projection optical system PL and the liquid LQ is adjusted, and the X-axis direction, Y-axis direction, and θZ of the substrate P are determined based on the measurement result of the laser interferometer 94. Position control in the direction.

  Next, the liquid immersion mechanism 1 will be described. The liquid supply device 11 of the liquid immersion mechanism 1 includes a tank that stores the liquid LQ, a pressure pump, a temperature adjustment device that adjusts the temperature of the supplied liquid LQ, a deaeration device that reduces the gas component of the supplied liquid LQ, and A filter unit or the like for removing foreign substances in the liquid LQ is provided. One end of a supply pipe 13 is connected to the liquid supply apparatus 11, and the other end of the supply pipe 13 is connected to a nozzle member 70. The liquid supply operation of the liquid supply device 11 is controlled by the control device CONT. The control device CONT can adjust the liquid supply amount per unit time from the supply port 12 by controlling the liquid supply device 11. The tank, pressure pump, temperature adjustment device, deaeration device, filter unit, etc. of the liquid supply device 11 do not have to be all provided in the exposure apparatus EX, such as a factory where the exposure apparatus EX is installed. Equipment may be substituted.

  The liquid recovery device 21 of the liquid immersion mechanism 1 includes a vacuum system such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, a tank that stores the recovered liquid LQ, and the like. One end of a recovery tube 23 is connected to the liquid recovery device 21, and the other end of the recovery tube 23 is connected to a nozzle member 70. The liquid recovery operation of the liquid recovery device 21 is controlled by the control device CONT. The control device CONT can adjust the liquid recovery amount per unit time via the recovery port 22 by controlling the liquid recovery device 21. The vacuum system, the gas-liquid separator, the tank, etc. of the liquid recovery apparatus 21 do not have to be all provided in the exposure apparatus EX, and equipment such as a factory in which the exposure apparatus EX is installed may be substituted. .

  The supply port 12 for supplying the liquid LQ and the recovery port 22 for recovering the liquid LQ are formed on the lower surface 70 </ b> A of the nozzle member 70. The lower surface 70 </ b> A of the nozzle member 70 is provided at a position facing the upper surface of the substrate P. The nozzle member 70 is an annular member provided so as to surround the side surface of the final optical element LS1, and the supply port 12 is provided on the lower surface 70A of the nozzle member 70 with the final optical element LS1 (projection optical system) of the projection optical system PL. A plurality of PLs are provided so as to surround the PL optical axis AX). The recovery port 22 is provided outside the supply port 12 with respect to the final optical element LS1 on the lower surface 70A of the nozzle member 70, and is provided so as to surround the final optical element LS1 and the supply port 12. .

  The control device CONT supplies a predetermined amount of the liquid LQ to the optical path space K1 using the liquid supply device 11, and collects a predetermined amount of the liquid LQ in the optical path space K1 using the liquid recovery device 21, thereby projecting optics. The optical path space K1 of the exposure light EL between the system PL and the substrate P is filled with the liquid LQ, and an immersion region LR of the liquid LQ is locally formed on the substrate P. When forming the liquid immersion region LR of the liquid LQ, the control device CONT drives each of the liquid supply device 11 and the liquid recovery device 21. When the liquid LQ is delivered from the liquid supply device 11 under the control of the control device CONT, the liquid LQ delivered from the liquid supply device 11 is formed in the nozzle member 70 after flowing through the supply pipe 13. Through the supply channel, the supply port 12 supplies the projection optical system PL to the image plane side. When the liquid recovery device 21 is driven under the control device CONT, the liquid LQ on the image plane side of the projection optical system PL is formed in the nozzle member 70 via the recovery port 22. The liquid is then collected by the liquid recovery device 21 after flowing through the recovery pipe 23.

  Next, the substrate holder PH will be described with reference to FIGS. 2 is a side sectional view of the substrate holder PH in a state where the substrate P is held, and FIG. 3 is a plan view of the substrate holder PH in a state where the substrate P is held as viewed from above.

  In FIG. 2, the substrate holder PH is formed on the base material PHB and the base material PHB, and is formed on the base material PHB and the first holding portion PH1 that holds the substrate P so as to be detachable (replaceable), and the first holding portion. Around the substrate P held by the portion PH1, there is provided a second holding portion PH2 that sucks and holds the plate member T that forms an upper surface Ta that is substantially flush with the upper surface (front surface) Pa of the substrate P. The plate member T is a member different from the base material PHB, and is provided so as to be detachable (exchangeable) with respect to the base material PHB of the substrate holder PH. As shown in FIG. 3, a substantially circular hole portion TH in which the substrate P can be placed is formed in the central portion of the plate member T. And the plate member T hold | maintained at 2nd holding | maintenance part PH2 is arrange | positioned so that the circumference | surroundings of the board | substrate P hold | maintained at 1st holding | maintenance part PH1 may be enclosed. The outer edge (side surface) Pc of the substrate P held by the first holding portion PH1 and the inner side (the hole TH side) of the plate member T which is disposed outside the substrate P and held by the second holding portion PH2. A gap A of about 0.1 to 1.0 mm is formed between the edge (inner side surface) Tc. Further, the outer shape of the plate member T is formed in a rectangular shape in plan view, and in the present embodiment, the outer shape of the plate member T is approximately the same as the outer shape of the base material PHB.

  FIG. 4 shows a state in which the substrate P and the plate member T are removed from the first and second holding portions PH1 and PH2, respectively.

  The plate member T has liquid repellency with respect to the liquid LQ. The plate member T is made of a material having liquid repellency such as a fluorine resin such as polytetrafluoroethylene (Teflon (registered trademark)) or an acrylic resin. The plate member T may be formed of metal or the like, and the surface thereof may be covered with a liquid repellent material such as a fluorine-based resin.

  In FIG. 2, each of the upper surface Ta and the lower surface Tb of the plate member T is a substantially flat surface (flat portion). The upper surface Ta of the plate member T held by the second holding part PH2 is substantially flush with the upper surface Pa of the substrate P held by the first holding part PH1. Thus, the optical path space K1 is filled with the liquid LQ by moving the substrate holder PH (substrate stage PST) in the XY direction with respect to the projection optical system PL while supplying and collecting the liquid LQ by the liquid immersion mechanism 1. The immersion region LR can be smoothly moved between the upper surface Pa of the substrate P and the upper surface Ta of the plate member T. If the optical path space K1 can continue to be filled with the liquid LQ, the space between the upper surface Pa of the substrate P held by the first holding part PH1 and the upper surface Ta of the plate member T held by the second holding part PH2 There may be a difference in level.

  2, 3, and 4, the first holding portion PH <b> 1 of the substrate holder PH is formed on the base material PHB, and the first support portion 30 that supports the lower surface (back surface) Pb of the substrate P, and the base material The first peripheral wall portion 31 is formed on the PHB, is opposed to the lower surface Pb of the substrate P, and is annularly provided so as to surround the first support portion 30. The 1st support part 30 is comprised by the some convex-shaped member.

  The first peripheral wall portion 31 is formed in a substantially annular shape in plan view according to the shape of the substrate P, and the upper surface 31A of the first peripheral wall portion 31 faces the peripheral region (edge region) of the lower surface Pb of the substrate P. It is formed to do. A first space V1 surrounded by the lower surface Pb of the substrate P, the first peripheral wall portion 31, and the base material PHB is formed on the lower surface Pb side of the substrate P held by the first holding portion PH1.

  A first suction port 33 is formed on the base material PHB inside the first peripheral wall portion 31. The first suction port 33 is for adsorbing and holding the substrate P, and is provided inside the first peripheral wall portion 31 at a plurality of predetermined positions other than the first support portion 30 on the upper surface of the base material PHB. Yes. Each of the first suction ports 33 is connected to a first vacuum system (not shown). The control device CONT drives the first vacuum system, sucks the gas (air) inside the first space V1 surrounded by the substrate P, the first peripheral wall portion 31, and the base material PHB, and uses this first space V1. By making the negative pressure, the lower surface Pb of the substrate P is sucked and held by the first support portion 30. Further, by canceling the suction operation by the first vacuum system, the substrate P can be removed from the first holding portion PH1. The first holding portion PH1 in the present embodiment constitutes a so-called pin chuck mechanism.

  Further, a second peripheral wall portion 34 is formed on the base material PHB so as to face the lower surface Pb of the substrate P and to surround the first peripheral wall portion 31. In the present embodiment, the width of the upper surface 34A of the second peripheral wall portion 34 is formed large (wide). The second peripheral wall portion 34 is formed in an annular shape in plan view outside the first peripheral wall portion 31.

  The second holding portion PH2 of the substrate holder PH is provided on the outer side of the substantially annular third peripheral wall portion 36 formed on the base material PHB so as to surround the second peripheral wall portion 34, and the third peripheral wall portion 36, An annular fourth peripheral wall portion 37 formed on the base material PHB so as to surround the third peripheral wall portion 36, and a plurality of base material PHB formed between the third peripheral wall portion 36 and the fourth peripheral wall portion 37. The second support portion 38 is provided. The second support portion 38 is composed of a plurality of convex members.

  The second support portion 38 supports the lower surface Tb of the plate member T. The third peripheral wall portion 36 is formed in a substantially annular shape in plan view according to the shape of the hole TH of the plate member T. The fourth peripheral wall portion 37 is formed in a substantially rectangular annular shape in plan view according to the outer shape of the plate member T. The upper surface 36A of the third peripheral wall portion 36 is formed so as to face the inner edge region (inner edge region) in the vicinity of the hole TH in the lower surface Tb of the plate member T. The upper surface 37A of the fourth peripheral wall portion 37 is formed to face the outer edge region (outer edge region) of the lower surface Tb of the plate member T. On the lower surface Tb side of the plate member T held by the second holding portion PH2, a second space V2 surrounded by the lower surface Tb of the plate member T, the third and fourth peripheral wall portions 36 and 37, and the base material PHB is formed. It is formed.

  A second suction port 39 is formed on the base material PHB between the third peripheral wall portion 36 and the fourth peripheral wall portion 37. The second suction port 39 is for adsorbing and holding the plate member T, and a plurality of the upper surfaces of the base material PHB other than the second support portion 38 between the third peripheral wall portion 36 and the fourth peripheral wall portion 37. Are provided at predetermined positions. Each of the second suction ports 39 is connected to a second vacuum system (not shown). The control device CONT drives the second vacuum system and sucks the gas (air) inside the second space V2 surrounded by the plate member T, the third and fourth peripheral wall portions 36 and 37, and the base material PHB. By making the second space V <b> 2 have a negative pressure, the lower surface Tb of the plate member T is sucked and held by the second support portion 38. Further, the plate member T can be removed from the second holding portion PH2 by releasing the suction operation by the second vacuum system. In the present embodiment, the second holding portion PH2 also constitutes a so-called pin chuck mechanism.

  In the present embodiment, the upper surface 34 </ b> A of the second peripheral wall portion 34 is formed lower than the upper surface 31 </ b> A of the first peripheral wall portion 31. Similarly, the upper surface 34A of the second peripheral wall portion 34 is formed lower than the upper surface 36A of the third peripheral wall portion 36.

  5 and 6 are views showing the vicinity of the gap A, and FIG. 7 is an enlarged plan view of the vicinity of the first, second, and third peripheral wall portions 31, 34, and 36 as viewed from above. 5 corresponds to a cross-sectional view taken along line S1-S1 in FIG. 4, and FIG. 6 corresponds to a cross-sectional view taken along line S2-S2 in FIG.

  5 and 6, the substrate holder PH includes an air supply port 42 for supplying gas to the third space V3 surrounded by the first peripheral wall portion 31, the second peripheral wall portion 34, and the lower surface Pb of the substrate P, and And an exhaust port 52 for exhausting the gas in the three spaces V3.

  As shown in FIG. 5, the air supply port 42 is provided on the base material PHB between the first peripheral wall portion 31 and the second peripheral wall portion 34. As shown in FIGS. 4 and 7, the air supply ports 42 are provided at each of a plurality of predetermined positions along the first peripheral wall portion 31. In the present embodiment, the plurality of air supply ports 42 are provided at predetermined intervals along the first peripheral wall portion 31. In the present embodiment, each of the air supply ports 42 has a substantially circular shape in plan view, but may have an arbitrary shape such as a polygonal shape.

  An air supply device 41 is connected to the air supply port 42 via a flow path 43. The air supply device 41 includes a pump capable of delivering gas, a temperature adjusting device for adjusting the temperature of the supplied gas, a filter unit for removing foreign matter in the supplied gas, and the like. The gas supply operation of the air supply device 41 is controlled by the control device CONT. The control device CONT can adjust the gas supply amount per unit time from the air supply port 42 by controlling the air supply device 41.

  As shown in FIG. 6, the exhaust port 52 is provided on the base material PHB between the first peripheral wall portion 31 and the second peripheral wall portion 34. Further, as shown in FIGS. 4 and 7, the exhaust port 52 is provided in a predetermined positional relationship with respect to the air supply port 42. In the present embodiment, the exhaust port 52 is provided between the air supply ports 42 adjacent to each other along the first peripheral wall portion 31. In the present embodiment, each of the exhaust ports 52 has a polygonal shape (substantially hexagonal shape) in plan view, but may be any shape such as a circular shape.

  A first suction device 51 is connected to the exhaust port 52 via a flow path 53. The first suction device 51 can suck the fluid in the third space V <b> 3 through the exhaust port 52. The fluid in the third space V3 includes the gas in the third space V3 and the liquid LQ that has entered the third space V3. The first suction device 51 can suck the gas and suck and collect the liquid LQ. is there. The first suction device 51 includes a vacuum system such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ. The suction operation of the first suction device 51 is controlled by the control device CONT.

  A branch channel 54 is connected to the middle of the channel 53. One end of the branch channel 54 is connected to the channel 53, and the other end is connected to an external space (external space) with respect to the third space V3. In the present embodiment, the external space is an atmospheric space, and the other end of the branch channel 54 is connected to the atmospheric space.

  A valve mechanism 55 is provided in the middle of the branch flow path 54. The operation of the valve mechanism 55 is controlled by the control device CONT. By opening the branch channel 54 by the valve mechanism 55, the exhaust port 52 and the atmospheric space (external space) are connected via the channel 53 and the branch channel 54. That is, when the branch flow path 54 is opened, the exhaust port 52 connects the third space V3 and the atmospheric space, and the third space V3 is open to the atmosphere. On the other hand, the control device CONT closes the branch flow path 54 by the valve mechanism 55 and drives the first suction device 51 to suck the fluid in the third space V3 through the exhaust port 52 by the first suction device 51. can do.

  The substrate holder PH includes a suction port 62 provided between the second peripheral wall portion 34 and the third peripheral wall portion 36, and a second suction device 61 connected to the suction port 62 via a flow path 63. I have. The second suction device 61 has the same configuration as the first suction device 51. The suction port 62 is provided on the base material PHB between the second peripheral wall portion 34 and the third peripheral wall portion 36. In the present embodiment, the plurality of suction ports 62 are provided along the second peripheral wall portion 34 at predetermined intervals. In the present embodiment, each of the suction ports 62 has a polygonal shape (substantially hexagonal shape) in plan view, but may be an arbitrary shape such as a circular shape.

  The first suction device 51 and the first vacuum system for making the first space V1 have a negative pressure are independent from each other, and the second suction device 61 and the first vacuum system for making the second space V2 have a negative pressure. The two vacuum systems are independent of each other. The control device CONT can individually control the operations of the first and second suction devices 51 and 61 and the first and second vacuum systems, and the suction operation by the first and second suction devices 51 and 61; The suction operation by the first and second vacuum systems can be performed independently.

  As shown in FIGS. 5 and 6, the lower surface Pb of the substrate P held by the first holding portion PH1 and a partial region of the upper surface 34A of the second peripheral wall portion 34 face each other, and the second holding portion. The lower surface Tb of the plate member T held by PH2 and the other region of the upper surface 34A of the second peripheral wall 34 are opposed to each other. That is, the upper surface 34 </ b> A of the second peripheral wall portion 34 is disposed immediately below the gap A formed between the substrate P and the plate member T. In addition, the second peripheral wall portion 34 forms a predetermined gap C between the upper surface 34A and the lower surface Pb of the substrate P. The second peripheral wall portion 34 forms a predetermined gap G between the upper surface 34A and the lower surface Tb of the plate member T. In the present embodiment, the gap C and the gap G are set to about 1 to 10 μm.

  The gap C is a flow that circulates through the third space V3 formed by the base material PHB, the first peripheral wall portion 31, the second peripheral wall portion 34, and the lower surface Pb of the substrate P, and the space outside the third space V3. Forming a road. The third space V3 is connected to the external space (atmospheric space) via the gap A and gap C, and is open to the atmosphere via the gap A and gap C.

  The gap G circulates through the fourth space V4 formed by the base material PHB, the second peripheral wall portion 34, the third peripheral wall portion 36, and the lower surface Tb of the plate member T, and the space outside the fourth space V4. A flow path is formed. The fourth space V4 is connected to an external space (atmospheric space) via a gap A and a gap G, and is open to the atmosphere via the gap A and gap G.

  The lower surface Pb of the substrate P held by the first holding part PH1 overhangs a predetermined amount outside the first peripheral wall part 31 with respect to the first space V1. The air supply port 42 and the exhaust port 52 are provided at positions facing the overhanging region of the lower surface Pb of the substrate P. Further, the lower surface Pb of the substrate P held by the first holding portion PH <b> 1 is in contact with the upper surface 31 </ b> A of the first peripheral wall portion 31.

  Further, the inner diameter of the annular third peripheral wall portion 36 of the second holding portion PH2 is formed larger than the inner diameter of the hole portion TH of the plate member T, and the plate member T held by the second holding portion PH2 The inner edge region of the lower surface Pb overhangs by a predetermined amount on the inner side (substrate P side) than the third peripheral wall portion 36. The suction port 62 is provided at a position facing the overhanging region of the lower surface Tb of the plate member T. Further, the lower surface Tb of the plate member T held by the second holding portion PH <b> 2 is in contact with the upper surface 36 </ b> A of the third peripheral wall portion 36.

  Next, the operation of the exposure apparatus EX and the liquid recovery action of the substrate holder PH will be described.

  In order to perform immersion exposure on the substrate P held by the first holder PH1 of the substrate holder PH, the control device CONT forms an immersion region LR of the liquid LQ on the substrate P using the immersion mechanism 1. Further, when the substrate P is subjected to immersion exposure, the control device CONT drives the air supply device 41 and starts supplying gas to the third space V3 via the air supply port 42. Further, the control device CONT controls the valve mechanism 55 to open the branch flow path 54, connect the third space V3 and the atmospheric space via the exhaust port 52, and open the third space V3 to the atmosphere. Then, the control device CONT irradiates the upper surface Pa of the substrate P with the exposure light EL through the liquid LQ in the liquid immersion region LR formed on the substrate P.

  While the exposure light EL is being applied to the substrate P (while the substrate P is held by the substrate holder PH), the control device CONT drives the air supply device 41 to form the third space from the air supply port 42. Continue supplying gas to V3. The control device CONT can make the third space V3 a positive pressure by supplying gas from the air supply port 42 to the third space V3. Further, while the exposure light EL is irradiated, the driving of the first and second suction devices 51 and 61 is stopped.

  For example, when the edge region of the upper surface Pa of the substrate P is subjected to immersion exposure, a part of the immersion region LR formed on the image plane side of the projection optical system PL is formed outside the substrate P as shown in FIG. In this state, an immersion region LR of the liquid LQ is formed on the gap A. In that case, the gap A between the substrate P held by the first holding part PH1 and the plate member T held by the second holding part PH2 is set to about 0.1 to 1.0 mm. The liquid LQ is prevented from entering the gap A by the surface tension of the liquid LQ. Further, since the plate member T has liquid repellency, the liquid LQ is prevented from entering the gap A. Therefore, even when the edge region of the substrate P is exposed, the liquid LQ can be held under the projection optical system PL by the upper surface Tc of the plate member T.

  In this way, the gap A is reduced or the plate member T is made liquid repellent to suppress the intrusion of the liquid LQ from the gap A. The liquid LQ may enter the third space V3 of the substrate holder PH through the gap A formed around the substrate P due to a pressure change of the liquid LQ forming the LR. .

  In the present embodiment, since the third space V3 is set to a positive pressure by supplying gas from the air supply port 42, the liquid LQ is prevented from entering the third space V3 via the gap A. Can do. As shown in FIG. 5, by setting the third space V3 to a positive pressure, even if the liquid LQ enters through the gap A, the liquid LQ remains on the lower surface Pb of the substrate P and the upper surface of the second peripheral wall portion 34. It can suppress moving to the 3rd space V3 side rather than the gap C between 34A. Accordingly, the liquid LQ can be prevented from entering the lower surface Pb side of the substrate P, and the lower surface Pb of the substrate P can be prevented from getting wet.

  Further, since the third space V3 is opened to the atmosphere through the exhaust port 52 while the exposure light EL is irradiated, the gas in the third space V3 is exhausted to the atmospheric space (external space). Therefore, even if gas is supplied to the third space V3 through the air supply port 42, it is possible to prevent the pressure in the third space V3 from excessively increasing. Therefore, the gas in the third space V3 is mixed into the liquid LQ in the liquid immersion region LR via the gap C and the gap A, or the peripheral portion of the substrate P is increased due to an increase in the pressure in the third space V3. It is possible to prevent the occurrence of inconvenience such as deformation (warping, etc.).

  In addition, since the upper surface 31A of the first peripheral wall portion 31 is in contact (contact) with the lower surface Pb of the substrate P, it is possible to reliably prevent the liquid LQ from entering the first space V1.

  Further, there is a possibility that the liquid LQ may enter the fourth space V4 through the gap A and the gap G. However, the upper surface 36A of the third peripheral wall portion 36 is in contact (contact) with the lower surface Tb of the plate member T. Therefore, it is possible to reliably prevent the liquid LQ from entering the second space V2.

  After the immersion exposure processing of the substrate P is completed, that is, after the irradiation of the exposure light EL is stopped, the control device CONT holds the substrate P in the first holding portion PH1 of the substrate holder PH and While stopping the drive, the drive of at least one of the first suction device 51 and the second suction device 61 is started. Here, when starting to drive the first suction device 51, the control device CONT controls the valve mechanism 55 to close the branch flow path 54.

  When the exposure of the exposure light EL is stopped, the control device CONT drives the first suction device 51, so that the first suction device 51 causes the fluid in the third space V3 to pass through the exhaust port 52. Aspirate.

  When the first suction device 51 is driven, the gas around the exhaust port 52 (that is, the gas in the third space V3) is sucked into the exhaust port 52, as shown in FIGS. That is, when the first suction device 51 sucks the gas in the third space V3 through the exhaust port 52, the gap C between the lower surface Pb of the substrate P and the upper surface 34A of the second peripheral wall portion 34 is A gas flow from the external space toward the third space V3 is generated, and the gap B between the side surface of the first peripheral wall portion 31 and the inner side surface of the second peripheral wall portion 34 has a gas flow toward the exhaust port 52. A flow is generated (see arrow y1).

  As a result, the liquid LQ enters the third space V3 via the gap A, or the liquid LQ adheres to a region of the lower surface Pb of the substrate P that overhangs outside the first peripheral wall portion 31. However, the liquid LQ can be moved to the exhaust port 52 by the gas flow described above, and the liquid LQ can be sucked and collected by the first suction device 51 through the exhaust port 52.

  Further, the control device CONT drives the second suction device 61 when the irradiation of the exposure light EL is stopped, so that the second suction device 61 causes the fourth space V4 to pass through the suction port 62. The fluid can be aspirated.

  When the second suction device 61 is driven, the gas around the suction port 62 (that is, the gas in the fourth space V4) is sucked into the suction port 62, as shown in FIGS. That is, when the second suction device 61 sucks the gas in the fourth space V4 through the suction port 62, the gap G between the lower surface Tb of the plate member T and the upper surface 34A of the second peripheral wall portion 34 is reduced. A gas flow from the external space toward the fourth space V4 is generated, and a gas flowing toward the suction port 62 is formed in the gap J between the side surface of the second peripheral wall portion 34 and the inner side surface of the third peripheral wall portion 36. Is generated (see arrow y2).

  As a result, the liquid LQ enters the fourth space V4 via the gap A, or the liquid LQ adheres to a region of the lower surface Tb of the plate member T that overhangs the third peripheral wall portion 36. However, the liquid LQ can be moved to the suction port 62 by the gas flow described above, and the liquid LQ can be sucked and collected by the second suction device 61 through the suction port 62.

  Further, by setting the gap B between the side surface of the first peripheral wall portion 31 and the inner side surface of the second peripheral wall portion 34 to, for example, about 0.5 to 1.5 mm, in the groove-shaped third space V3, The flow velocity of the gas flow toward the exhaust port 52 can be increased. Similarly, by setting the gap J between the second peripheral wall portion 34 and the third peripheral wall portion 36 to, for example, about 0.5 to 1.5 mm, the suction port 62 is formed in the groove-shaped fourth space V4. It is possible to increase the flow of gas that goes.

  The suction force of the liquid LQ to the gap G is larger than the suction force of the liquid LQ to the gap C, and the suction force via the gap C, the gap G, the suction port 62, and the exhaust port 52. A suction force may be set. By doing so, the liquid LQ that has entered from the gap A can be smoothly drawn into the lower surface Tb side of the plate member T, so that the inconvenience that the liquid LQ that has entered from the gap A enters the lower surface Pb side of the substrate P can be prevented. be able to.

  The control device CONT can perform the suction operation using the exhaust port 52 and the suction operation using the suction port 62 in parallel after the exposure of the substrate P is completed, and drives the second suction device 61. Then, after the suction operation using the suction port 62 is performed, the first suction device 51 can be driven to perform the suction operation using the exhaust port 52. Alternatively, the control device CONT can perform the suction operation using the suction port 62 after performing the suction operation using the exhaust port 52.

  In addition to recovering the liquid LQ that has entered the gap A, for example, when all the liquid LQ in the liquid immersion region LR is recovered, the liquid LQ in the liquid immersion region LR formed on the gap A is changed to the gap A. It can also be actively collected via When it is desired to collect all the liquid LQ in the liquid immersion region LR, the control device CONT performs a recovery operation using the liquid recovery device 21 of the liquid immersion mechanism 1, an exhaust port 52 and a suction port 62 provided in the substrate holder PH. It can be used in combination with a recovery operation using.

  As described above, the air supply port 42 for supplying gas to the third space V3 surrounded by the first peripheral wall portion 31, the second peripheral wall portion 34, and the back surface Pb of the substrate P, and the gas in the third space V3 are supplied. Since the exhaust port 52 for discharging is provided, liquid can be prevented from entering the back surface Pb side of the substrate P.

Second Embodiment
Next, a second embodiment will be described with reference to FIGS. 8 is a side sectional view of the substrate holder (substrate stage) according to the second embodiment, FIG. 9 is a view of the substrate holder (substrate stage) as viewed from above, and FIGS. 10 and 11 are views showing the vicinity of the gap A. 10 corresponds to a cross-sectional view taken along line S1-S1 in FIG. 9, and FIG. 11 corresponds to a cross-sectional view taken along line S2-S2 in FIG. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  The substrate holder PH of the first embodiment described above has a second holding portion PH2 that detachably holds the plate member T, but the substrate holder PH of the second embodiment includes the plate member T and the second member. 2 The holding part PH2 is not provided.

  The substrate holder PH is provided inside a recess 96 provided in the substrate stage PST. A support surface 98 that supports the lower surface of the substrate holder PH is provided inside the recess 96 of the substrate stage PST, and the substrate holder PH is provided so as to be detachable (replaceable) with respect to the support surface 98. A movable mirror 93 is provided on the side surface of the substrate stage PST.

  The upper surface 97 of the substrate stage PST other than the concave portion 96 is a flat surface (flat portion) that is substantially the same height (level) as the upper surface Pa of the substrate P held by the substrate holder PH. . If the optical path space K1 on the image plane side of the projection optical system PL can be continuously filled with the liquid LQ, a step is formed between the upper surface Pa of the substrate P held by the substrate holder PH and the upper surface 97 of the substrate stage PST. There is no problem. Thus, the substrate holder PH of the present embodiment has a configuration having only the first holding portion PH1 for holding the substrate P.

  The substrate holder PH is formed on the base material PHB, the base material PHB, the first support portion 30 that supports the lower surface Pb of the substrate P, and formed on the base material PHB, facing the lower surface Pb of the substrate P, A first peripheral wall portion 31 provided so as to surround the first support portion 30 and a second base member formed on the base material PHB, facing the lower surface Pb of the substrate P, and provided so as to surround the first peripheral wall portion 31. And a peripheral wall portion 34. The upper surface 34A of the second peripheral wall portion 34A is lower than the upper surface 31A of the first peripheral wall portion 31, the upper surface 31A of the first peripheral wall portion 31 and the lower surface Pb of the substrate P are in contact, and the upper surface 34A of the second peripheral wall portion 34. A predetermined gap C is provided between the substrate P and the back surface Pb of the substrate P.

  The air supply port 42 and the exhaust port 52 are provided on the base material PHB between the first peripheral wall portion 31 and the second peripheral wall portion 34. Further, a predetermined gap D is provided between the side surface of the substrate holder PH (side surface of the second peripheral wall portion 34) and the inner surface of the recess 96 of the substrate stage PST, and the suction port 62 is located inside the gap D. The support surface 98 is provided.

  When the substrate P is subjected to immersion exposure, as in the above-described embodiment, the control device CONT continues to supply gas from the air supply port 42 at least while the exposure light EL is irradiated. By setting the third space V3 to a positive pressure, as shown in FIG. 10, the liquid LQ that has entered through the gap A causes a gap C between the lower surface Pb of the substrate P and the upper surface 34A of the second peripheral wall portion 34. It is suppressed that it moves to the 3rd space V3 side rather than. Therefore, the liquid LQ can be prevented from entering the lower surface Pb side of the substrate P through the gap A between the substrate P held by the substrate holder PH and the upper surface 97 of the substrate stage PST.

  When the exposure light EL irradiation is stopped, the control device CONT appropriately drives the first suction device 51 and the second suction device 61 to perform the suction operation through the exhaust port 52, as in the above-described embodiment. A suction operation through the suction port 62 is performed as necessary.

  In the first and second embodiments described above, a predetermined gap C is formed between the upper surface 34A of the second peripheral wall portion 34 and the lower surface Pb of the substrate P. The upper surface 34A and the lower surface Pb of the substrate P may be in contact with each other.

  In the first and second embodiments described above, both the suction operation through the exhaust port 52 and the suction operation through the suction port 62 are performed. However, the suction operation and suction through the exhaust port 52 are performed. Both the suction operation through the mouth 62 may not necessarily be performed. For example, after the exposure of the substrate P, the suction operation through the exhaust port 52 is performed, and the suction operation through the suction port 62 may be performed as necessary. Or after completion | finish of exposure of the board | substrate P, the suction operation through the suction port 62 may be performed, and the suction operation through the exhaust port 52 may be performed as needed. Alternatively, after the exposure of the substrate P, both the suction operation through the exhaust port 52 and the suction operation through the suction port 62 may be omitted.

  In the first and second embodiments described above, the upper surface 34A of the second peripheral wall portion 34 may be subjected to a lyophobic treatment having liquid repellency with respect to the liquid LQ. Examples of the liquid repellency treatment include a treatment for coating a material having liquid repellency such as a fluorine resin or an acrylic resin. Further, at least a part of the first peripheral wall part 31 or at least a part of the third peripheral wall part 36 may be subjected to a liquid repellency treatment.

  As described above, the liquid LQ in the present embodiment is composed of pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. . When the purity of pure water supplied from a factory or the like is low, the exposure apparatus may have an ultrapure water production device.

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be about 1.44, and when ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution is obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  In the present embodiment, the optical element LS1 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberration (spherical aberration, coma aberration, etc.) can be adjusted by this optical element. . The optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

  When the pressure between the optical element at the tip of the projection optical system PL generated by the flow of the liquid LQ and the substrate P is large, the optical element is not exchangeable but the optical element is moved by the pressure. It may be fixed firmly so that there is no.

  In the present embodiment, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ. The structure which satisfy | fills LQ may be sufficient.

  In the projection optical system of the above-described embodiment, the optical path space on the image plane side of the optical element at the tip is filled with liquid, but as disclosed in International Publication No. 2004/019128, the optical at the tip is used. It is also possible to employ a projection optical system in which the optical path space on the object plane side of the element is filled with liquid.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not pass through water. The liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, at a portion in contact with the liquid LQ. In addition, as the liquid LQ, the liquid LQ is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used.

  Moreover, as the liquid LQ, a liquid having a refractive index of about 1.6 to 1.8 may be used. Furthermore, the optical element LS1 may be formed of a material having a refractive index higher than that of quartz or fluorite (for example, 1.6 or more).

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in JP-A-10-163099, JP-A-10-214783, JP-T 2000-505958, and the like. It can also be applied to.

  Further, as disclosed in JP-A-11-135400 and JP-A-2000-164504, a measurement stage equipped with a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and various photoelectric sensors. The present invention can also be applied to an exposure apparatus including the above.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6,778,257, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used.

  Further, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P. The present invention can also be applied.

  The exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 12, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view which shows the substrate holder which concerns on 1st Embodiment. FIG. 3 is a plan view of FIG. 2 viewed from above. It is the top view which looked at the substrate of the substrate holder from the upper part. It is a principal part expanded sectional view of a substrate holder. It is a principal part expanded sectional view of a substrate holder. It is a principal part enlarged plan view of a substrate holder. It is a sectional side view of the substrate holder which concerns on 2nd Embodiment. It is the top view which looked at the substrate of the substrate holder from the upper part. It is a principal part expanded sectional view of a substrate holder. It is a principal part expanded sectional view of a substrate holder. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid immersion mechanism, 30 ... 1st support part (support part), 31 ... 1st surrounding wall part, 31A ... Upper surface, 34 ... 2nd surrounding wall part, 34A ... Upper surface, 41 ... Air supply apparatus, 42 ... Air inlet 51 ... First suction device (suction device), 52 ... Exhaust port, EL ... Exposure light, EX ... Exposure device, LQ ... Liquid, P ... Substrate, Pa ... Upper surface (front surface), Pb ... Lower surface (back surface), PH ... substrate holder (substrate holding device), PHB ... base material, V1 ... first space, V2 ... second space, V3 ... third space (predetermined space), V4 ... fourth space

Claims (36)

A substrate holding device for holding a substrate irradiated with exposure light,
A substrate;
A support part formed on the base material and supporting the back surface of the substrate;
A first peripheral wall formed on the base material, facing the back surface of the substrate, and surrounding the support;
A second peripheral wall formed on the base material, facing the back surface of the substrate, and surrounding the first peripheral wall;
An air supply port that is provided between the first peripheral wall portion and the second peripheral wall portion and supplies gas to a predetermined space surrounded by the first peripheral wall portion, the second peripheral wall portion, and the back surface of the substrate; ,
An exhaust port that is provided between the first peripheral wall portion and the second peripheral wall portion and exhausts the gas in the predetermined space ;
The substrate holding device , wherein the air supply port and the exhaust port are provided apart from each other along the first peripheral wall portion .   The substrate holding apparatus according to claim 1, wherein the predetermined space is set to a positive pressure by supplying a gas from the air supply port.   3. The substrate holding apparatus according to claim 1, wherein the supply of gas from the air supply port is continued while the exposure light is irradiated.   The substrate holding device according to claim 1, wherein the air supply port is provided on the base material between the first peripheral wall portion and the second peripheral wall portion. The substrate holding apparatus according to claim 4, wherein the air supply port is provided at a position facing the back surface of the substrate.   The substrate exhaust apparatus according to claim 1, wherein the exhaust port is provided on the base material between the first peripheral wall portion and the second peripheral wall portion. The substrate holding apparatus according to claim 6, wherein the exhaust port is provided at a position facing the back surface of the substrate. The substrate holding apparatus according to claim 1, wherein the exhaust port is capable of connecting the predetermined space and an external space.   The substrate holding device according to claim 1, further comprising a suction device that sucks the fluid in the predetermined space through the exhaust port. The fluid in the predetermined space includes at least a part of the gas in the predetermined space and the liquid that has entered the predetermined space,
The substrate holding device according to claim 9, wherein the suction device is capable of sucking and collecting the liquid.   The substrate holding device according to claim 9 or 10, wherein the suction device sucks the fluid in the predetermined space when irradiation of the exposure light is stopped. A flow path connecting the exhaust port and the suction device;
A branch flow path having one end connected to the flow path and the other end connected to an external space, and
The substrate holding apparatus according to claim 9, wherein the predetermined space is opened to the external space when the branch flow path is opened. The substrate holding apparatus according to claim 12, wherein the branch flow path is opened when gas is supplied from the air supply port to the predetermined space. The substrate holding device according to claim 12 or 13, wherein the branch flow path is opened when the exposure light is irradiated on the substrate. The second peripheral wall portion of the upper surface substrate holding apparatus according to any one claim of the first circumferential wall portion of the lower claim than the upper surface 1-14. It said first wall portion, the substrate holding apparatus of any one of claims 1 to 15 in contact with the back surface of the substrate. The substrate holding device according to claim 1, wherein the second peripheral wall portion is in contact with a back surface of the substrate. It said second circumferential wall portion, the substrate holding apparatus of any one of claims 1-16 for forming a predetermined gap between the back of the substrate. The substrate holding device according to claim 18, wherein a gap formed between the upper surface of the second peripheral wall portion and the back surface of the substrate is 1 to 10 μm. 20. The substrate holding device according to claim 1, wherein a back surface of the substrate supported by the support portion is opposed to a partial region of an upper surface of the second peripheral wall portion. By the space surrounded by the substrate and the first peripheral wall portion and the base material to a negative pressure, of any one of claims 1 to 20 for attracting and holding the back surface of the substrate by the support portion Substrate holding device. A third peripheral wall formed on the substrate so as to surround the second peripheral wall;
The substrate holding device according to any one of claims 1 to 21, further comprising: a suction port provided between the second peripheral wall portion and the third peripheral wall portion. A detachable plate member that forms an upper surface substantially flush with the upper surface of the substrate supported by the support;
23. The substrate holding apparatus according to claim 22, wherein the suction port provided between the second peripheral wall portion and the third peripheral wall portion is provided at a position facing the lower surface of the plate member. 24. The substrate holding apparatus according to claim 1, wherein the exhaust port is provided at each of a plurality of predetermined positions along the first peripheral wall portion. A plurality of the air inlets are provided on the base material,
The substrate holding apparatus according to any one of claims 1 to 24, wherein the exhaust port is provided between the air supply ports adjacent to each other along the first peripheral wall portion. 26. The substrate holding apparatus according to claim 25, wherein the plurality of air supply ports are provided at predetermined intervals along the first peripheral wall portion. The substrate holding device according to any one of claims 1 to 26, wherein a gap between a side surface of the first peripheral wall portion and an inner side surface of the second peripheral wall portion is 0.5 to 1.5 mm. An exposure apparatus comprising the substrate holding device according to any one of claims 1 to 27 and exposing the substrate held by the substrate holding device through a liquid. A device manufacturing method using the exposure apparatus according to claim 28 . A substrate holding method for holding a substrate irradiated with exposure light,
Holding the back surface of the substrate with a substrate holding portion having a support portion formed on the base material and a first peripheral wall portion provided on the base material so as to surround the support portion;
An air supply port and an exhaust port provided along the first peripheral wall portion between the first peripheral wall portion and the second peripheral wall portion provided on the base so as to surround the first peripheral wall portion. Gas is supplied from the air supply port to a predetermined space surrounded by the first peripheral wall portion, the second peripheral wall portion, and the back surface of the substrate;
Discharging the gas in the predetermined space from the exhaust port. 31. The substrate holding method according to claim 30, wherein the predetermined space is brought to a positive pressure by supplying gas from the air supply port. 32. The substrate holding method according to claim 30, further comprising sucking the fluid in the predetermined space from the exhaust port. The substrate holding method according to claim 32, wherein the fluid in the predetermined space is sucked from the exhaust port when irradiation of the exposure light is stopped. 34. The substrate holding method according to claim 32 or 33, wherein a gas flow toward the exhaust port along the first peripheral wall portion is generated in the predetermined space by the suction. The substrate holding method according to any one of claims 30 to 34, wherein the liquid in the predetermined space is recovered by the suction. 36. An exposure method for exposing a substrate held by the substrate holding method according to any one of claims 30 to 35 through a liquid.

Images