JPH0927541A - Substrate holder - Google Patents
Substrate holderInfo
- Publication number
- JPH0927541A JPH0927541A JP17307495A JP17307495A JPH0927541A JP H0927541 A JPH0927541 A JP H0927541A JP 17307495 A JP17307495 A JP 17307495A JP 17307495 A JP17307495 A JP 17307495A JP H0927541 A JPH0927541 A JP H0927541A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mounting surface
- motor
- solenoid valve
- photosensitive substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板を載置して吸着保
持する基板ホルダに関し、特に半導体素子や液晶表示基
板等を製造するための露光装置のステージ装置に適用し
て好適なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holder on which a substrate is placed and sucked and held, and is particularly suitable for application to a stage device of an exposure apparatus for manufacturing semiconductor elements, liquid crystal display substrates and the like. is there.
【０００２】[0002]
【従来の技術】従来のこの種の装置は、比較的薄い（厚
さが１mm前後）ガラス板等の感光基板を載置するホルダ
の載置面に連通した配管を電磁弁に接続し、この電磁弁
をバキューム系とフロー系とを切り換えて感光基板の真
空吸着と吸着解除とを行っていた。2. Description of the Related Art A conventional device of this type connects a solenoid valve to a pipe communicating with a mounting surface of a holder for mounting a photosensitive substrate such as a relatively thin glass plate (about 1 mm thick). The solenoid valve is switched between a vacuum system and a flow system to perform vacuum adsorption and desorption of the photosensitive substrate.
【０００３】また、このホルダには、外部の搬送装置か
ら感光基板を載置面に載置するため、或いは吸着解除さ
れた感光基板を外部の搬送装置へ移載するため、載置面
に対して上下動可能な支持装置（例えば、３点支持用の
支持ピンを上下動可能に構成した装置）が設けられてい
る。そして、感光基板が搬送装置からこの支持装置上に
載置されて載置面上に降下した後、電磁弁をバキューム
系に切り換えて感光基板を真空吸着する。また、感光基
板に対する処理が終了した後は、支持装置を上昇するの
に合わせて電磁弁をフロー系に切り換えて吸着を解除
し、感光基板を載置面から上昇する。Further, in order to place the photosensitive substrate on the mounting surface from an external transfer device or to transfer the released photosensitive substrate to the external transfer device, the holder is placed on the mounting surface. And a supporting device (for example, a device in which a supporting pin for supporting three points can be moved vertically) is provided. Then, after the photosensitive substrate is placed on the supporting device from the transport device and dropped onto the mounting surface, the electromagnetic valve is switched to the vacuum system to vacuum-adsorb the photosensitive substrate. Further, after the processing on the photosensitive substrate is completed, the electromagnetic valve is switched to the flow system in accordance with the raising of the supporting device to release the adsorption, and the photosensitive substrate is raised from the mounting surface.
【０００４】尚、これら電磁弁の切り換えと支持装置の
動作のタイミングは、制御装置からの指令によって実行
される。The timing of switching these solenoid valves and the operation of the supporting device is executed by a command from the control device.
【０００５】[0005]
【発明が解決しようとする課題】上記の如き従来の技術
においては、制御装置から支持装置の制御部、電磁弁の
制御部に対して指令が送られた後は、各装置が独立して
動作していた。例えば、感光基板が支持装置によって上
昇する前に電磁弁がフロー系に切り換わるように動作タ
イミングを指令すると、電磁弁からの空圧によって感光
基板が位置ずれを起こしてしまい、支持装置上に載置す
ることができなくなることがある。In the prior art as described above, each device operates independently after a command is sent from the control device to the control part of the supporting device and the control part of the solenoid valve. Was. For example, if the operation timing is instructed so that the solenoid valve switches to the flow system before the photosensitive substrate is raised by the supporting device, the photosensitive substrate is displaced due to the air pressure from the solenoid valve, and the photosensitive substrate is mounted on the supporting device. It may not be possible to place it.
【０００６】一方、支持装置が感光基板を上昇し始めて
から電磁弁がフロー系に切り換わるよう、電磁弁の切り
換え動作の指令タイミングを支持装置の上昇動作の指令
タイミングより送らせるように設定すると、感光基板が
上昇し始める際には依然、感光基板と載置面との間が真
空状態となったままであり、支持装置によって感光基板
を強制的に載置面から剥離することとなる。このため、
感光基板を破損したり、感光基板を帯電させることとな
る。On the other hand, if the command timing of the switching operation of the solenoid valve is set to be sent from the command timing of the raising operation of the support device so that the solenoid valve switches to the flow system after the support device starts to raise the photosensitive substrate, When the photosensitive substrate starts to rise, the vacuum state is still maintained between the photosensitive substrate and the mounting surface, and the supporting device forcibly separates the photosensitive substrate from the mounting surface. For this reason,
This will damage the photosensitive substrate and charge the photosensitive substrate.
【０００７】本発明は上記問題点に鑑み、基板の位置ず
れ、破損、帯電を生じることなく、ホルダ上に載置され
た基板を良好に剥離、上昇することが可能な基板ホルダ
を提供することを目的とする。In view of the above problems, the present invention provides a substrate holder capable of satisfactorily peeling and raising a substrate placed on the holder without causing displacement, damage, or charging of the substrate. With the goal.
【０００８】[0008]
【課題を解決するための手段】上記問題点を解決するた
め本発明では、基板（１）が載置される載置面を有し、
この載置面に連通した配管部材（３）を介して吸引手段
（１２）で真空吸引することにより、基板を載置面上に
吸着固定する基板ホルダにおいて、配管部材（３）に気
体を供給することにより、吸着を解除する気体供給手段
（１２）と、載置面の上方及び下方に移動可能な支持部
（４ａ）を有し、この支持部が載置面の上方に移動した
際に、基板を支持部上に支持して載置面から剥離する基
板支持手段（４）と、基板支持手段を駆動する駆動手段
（５，６，７）と、駆動手段の駆動力に対する抗力を検
出する抗力検出手段（１３）と、抗力検出手段によって
検出される抗力が所定の値となった際に、気体供給手段
による気体の供給を行う制御手段（９，１１）とを備え
ることとした。In order to solve the above problems, the present invention has a mounting surface on which a substrate (1) is mounted,
In the substrate holder that sucks and fixes the substrate on the mounting surface by vacuum suction by the suction means (12) through the piping member (3) communicating with the mounting surface, gas is supplied to the piping member (3). By doing so, it has a gas supply means (12) for releasing adsorption, and a support part (4a) movable above and below the mounting surface, and when this support part moves above the mounting surface. , Substrate supporting means (4) for supporting the substrate on the supporting portion and separating it from the mounting surface, driving means (5, 6, 7) for driving the substrate supporting means, and detecting the reaction force against the driving force of the driving means And a control means (9, 11) for supplying gas by the gas supply means when the drag force detected by the drag force detection means reaches a predetermined value.
【０００９】また、駆動手段は、支持部に接続したラッ
クギア（６）と、該ラックギアに係合するピニオンギア
（５）と、該ピニオンギアを回転するモータ（７）とを
含み、抗力検出手段（１３）は、モータに流れる電流の
変化を検出する電流計を備えることとした。本発明にお
いては、基板支持手段を駆動する駆動手段にかかる抗力
（例えば、駆動手段に流れる電流）を検出し、この抗力
が所定の値となったときに載置面に対して気体を供給す
るように制御手段によって制御するため、基板に対して
必要以上の負荷がかかることを避けることができる。そ
のため、載置面に吸着された基板を強制的に剥離して基
板を破損したり、帯電させたりすることなく、基板を載
置面から上昇することができる。The driving means includes a rack gear (6) connected to the support portion, a pinion gear (5) engaging with the rack gear, and a motor (7) for rotating the pinion gear, and the drag detecting means. In (13), an ammeter for detecting a change in current flowing through the motor is provided. In the present invention, the reaction force (for example, the current flowing through the driving device) applied to the driving device that drives the substrate supporting device is detected, and the gas is supplied to the mounting surface when the reaction force reaches a predetermined value. Since control is performed by the control means as described above, it is possible to avoid applying an unnecessary load to the substrate. Therefore, the substrate can be lifted from the mounting surface without forcibly peeling off the substrate adsorbed on the mounting surface to damage the substrate or charge the substrate.
【００１０】また、吸着が解除された際には基板は支持
部上に載置されているため、吸着を解除された基板が位
置ずれを起こすこともない。Further, since the substrate is placed on the supporting portion when the suction is released, the substrate which has been released from the suction is not displaced.
【００１１】[0011]
【発明の実施の形態】図１は本発明の実施例による基板
ホルダの概略的な構成を示す図である。また、図２はモ
ータと電磁弁の制御系を示す図である。ガラス基板等の
感光基板１を載置するためのホルダ２には空圧系の配管
３（ホルダ２内はホルダに設けられた穴を配管とする）
が設けられ、この配管３を介して電磁弁１２とホルダ２
の載置面とが連通している。この電磁弁１２は、バキュ
ーム系とフロー系とを切り換えて用いる構成である。1 is a diagram showing a schematic structure of a substrate holder according to an embodiment of the present invention. FIG. 2 is a diagram showing a control system for the motor and the solenoid valve. A pneumatic system piping 3 is provided in a holder 2 for mounting a photosensitive substrate 1 such as a glass substrate (in the holder 2, holes provided in the holder are used as piping).
Is provided, and the solenoid valve 12 and the holder 2 are connected through this pipe 3.
Is in communication with the mounting surface of. The solenoid valve 12 is configured to switch between a vacuum system and a flow system for use.
【００１２】また、ホルダ２には載置面２ａに開口を有
する穿孔が設けられ、この穿孔内を移動可能に、また載
置面２ａに対して上下動可能な支持部４ａを有する３点
支持用の支持ピン４が設けられている。この支持ピン４
にはラックギア６が設けられ、このラックギア６にはピ
ニオンギア５が係合している。ピニオンギア５はモータ
７によって回転し、ラックギア６を介して支持ピン４を
直線移動する。この支持ピン４を上下動することによ
り、支持部４ａに支持された感光基板１を載置面２ａに
対して載置し、また載置面２ａから上昇する。Further, the holder 2 is provided with a perforation having an opening on the mounting surface 2a, and a three-point support having a support portion 4a movable in the perforation and vertically movable with respect to the mounting surface 2a. Is provided with a support pin 4. This support pin 4
A rack gear 6 is provided in the rack gear 6, and the pinion gear 5 is engaged with the rack gear 6. The pinion gear 5 is rotated by the motor 7 and linearly moves the support pin 4 via the rack gear 6. By moving the support pin 4 up and down, the photosensitive substrate 1 supported by the support portion 4a is mounted on the mounting surface 2a, and is raised from the mounting surface 2a.
【００１３】モータ制御部９は、主制御装置１０からの
制御信号に基づいてモータ７に電圧を印加し、回転させ
る。モータ７にはエンコーダ等の回転量検出器８が内蔵
されており、モータ７の回転量から支持ピン４の上下動
量を計数する。この計数値に関する情報はモータ制御部
９（或いは主制御装置１０）に信号として送られてお
り、計数値が所定値となったときにモータ７への電圧の
印加を遮断する。さらにモータ７には、モータに流れる
電流を検出するための電流計１３が備えられ、この電流
値を検出することによってモータに掛かる負荷を検出す
る。The motor controller 9 applies a voltage to the motor 7 based on a control signal from the main controller 10 to rotate the motor 7. A rotation amount detector 8 such as an encoder is built in the motor 7, and the vertical movement amount of the support pin 4 is counted from the rotation amount of the motor 7. The information regarding the count value is sent as a signal to the motor control unit 9 (or main controller 10), and the application of the voltage to the motor 7 is cut off when the count value reaches a predetermined value. Further, the motor 7 is equipped with an ammeter 13 for detecting a current flowing through the motor, and the load applied to the motor is detected by detecting the current value.
【００１４】またモータ制御部９は、回転量検出器８の
計数値が支持ピン４が支持した感光基板が載置面２ａに
載置された場合の計数値となったときに、電磁弁制御部
１１によって電磁弁１２をバキューム系に切り換える。
そして、電流計１３によって検出された電流値が基準値
を越えた場合に、電磁弁制御部１１によって電磁弁１２
をフロー系に切り換える。Further, the motor controller 9 controls the solenoid valve when the count value of the rotation amount detector 8 becomes the count value when the photosensitive substrate supported by the support pins 4 is mounted on the mounting surface 2a. The solenoid valve 12 is switched to the vacuum system by the section 11.
When the current value detected by the ammeter 13 exceeds the reference value, the solenoid valve control unit 11 causes the solenoid valve 12
To the flow system.
【００１５】電流計１３によって検出される電流値の変
化の特性について、図３を参照して説明する。モータに
電圧を印加して起動した場合の電流値の変化は、モータ
が回転した直後は一時的に電流値が大きくなるが、モー
タが定速回転すると電流値も一定となる。一方、モータ
に負荷が掛かり回転しなくなると、電流値は極端に大き
くなる。The characteristics of the change in the current value detected by the ammeter 13 will be described with reference to FIG. The current value changes when the motor is started by applying a voltage, the current value temporarily increases immediately after the motor rotates, but the current value also becomes constant when the motor rotates at a constant speed. On the other hand, when the motor is loaded and does not rotate, the current value becomes extremely large.
【００１６】本発明では、この特性を利用して、モータ
起動時の電流値より大きな値を電流の基準値とし、電流
計１３による検出値がこの基準値を越えた場合に電磁弁
１２をフロー系に切り換えるように、モータ制御部９を
介して電磁弁制御部１１によって制御する。ところで、
基板ホルダの外部には、感光基板をホルダ２上に搬送す
るため、またホルダ２から感光基板を搬出するための不
図示の搬送装置が設けられ、ホルダ２の載置面２ａから
上昇した支持ピン４（支持部４ａ）との間で感光基板１
の受け渡しを行う。In the present invention, by utilizing this characteristic, a value larger than the current value at the time of starting the motor is used as the reference value of the current, and when the value detected by the ammeter 13 exceeds this reference value, the solenoid valve 12 is caused to flow. The electromagnetic valve control unit 11 controls the motor control unit 9 so as to switch to the system. by the way,
A transport device (not shown) for transporting the photosensitive substrate onto the holder 2 and for unloading the photosensitive substrate from the holder 2 is provided outside the substrate holder, and the support pin is raised from the mounting surface 2a of the holder 2. 4 (supporting portion 4a) and the photosensitive substrate 1
Is passed.
【００１７】上記の構成の装置において感光基板１をホ
ルダ２上に載置する際には、先ず不図示の搬送装置によ
って感光基板１をホルダ２の上方に搬送する。そして、
モータ制御部９によってモータ７を回転し、支持ピン４
を上昇する。これによって、支持ピン４の支持部４ａが
載置面２ａから突出して感光基板１の裏面に当接し、搬
送装置から感光基板１を受け取る。When the photosensitive substrate 1 is placed on the holder 2 in the apparatus having the above structure, the photosensitive substrate 1 is first conveyed above the holder 2 by a conveying device (not shown). And
The motor 7 is rotated by the motor control unit 9 and the support pin 4
To rise. As a result, the support portion 4a of the support pin 4 projects from the mounting surface 2a and contacts the back surface of the photosensitive substrate 1, and receives the photosensitive substrate 1 from the transport device.
【００１８】その後、モータ制御部９によってモータ７
を回転することにより、感光基板１を載置した支持ピン
４が降下してホルダ２の載置面２ａ上に感光基板１を載
置する。感光基板１が載置面２ａ上に載置される（支持
部４ａが載置面２ａの面と同じ位置又は載置面の下方に
位置する）のと同時に電磁弁制御部１１によって電磁弁
１２をバキューム系に切り換える。After that, the motor 7 is controlled by the motor control unit 9.
By rotating the, the support pins 4 on which the photosensitive substrate 1 is mounted are lowered to mount the photosensitive substrate 1 on the mounting surface 2 a of the holder 2. At the same time that the photosensitive substrate 1 is mounted on the mounting surface 2a (the supporting portion 4a is located at the same position as the surface of the mounting surface 2a or below the mounting surface), the solenoid valve controller 11 controls the solenoid valve 12 to operate. Switch to vacuum system.
【００１９】一方、露光等の処理が終了して感光基板１
を交換する際には、主制御装置１０よりモータ制御部９
に指令が送られ、その後モータ７に電圧を印加し、モー
タ７が回転して支持ピン４が上昇する。また、支持ピン
４が上昇すると、感光基板１が載置面２ａに対して真空
吸着されているため、モータ７の駆動力に対して負荷が
かかる。本発明では、このモータに流れる電流値の変化
を検出し、検出された電流値が所定の値以上となると同
時に、モータ制御部９から電磁弁制御部１１に指令が送
られ、電磁弁１２がフロー系に切り換えられる。それに
よって、ホルダ２内の配管３を介して感光基板１と載置
面２ａの間に圧空が入り込み、感光基板１と載置面２ａ
との間を真空状態から大気開放にする。これにより、感
光基板１が載置面２ａから持ち上がる。On the other hand, after the processing such as exposure is completed, the photosensitive substrate 1
When replacing the motor, the main controller 10 causes the motor controller 9
To the motor 7, and then the voltage is applied to the motor 7, the motor 7 rotates and the support pin 4 rises. Further, when the support pin 4 is lifted, the photosensitive substrate 1 is vacuum-sucked to the mounting surface 2a, so that a load is applied to the driving force of the motor 7. In the present invention, the change in the current value flowing through the motor is detected, and at the same time when the detected current value becomes equal to or higher than a predetermined value, a command is sent from the motor control section 9 to the solenoid valve control section 11 to cause the solenoid valve 12 to operate. Switched to flow system. As a result, compressed air enters between the photosensitive substrate 1 and the mounting surface 2a via the pipe 3 in the holder 2, and the photosensitive substrate 1 and the mounting surface 2a
The space between and is released from the vacuum state to the atmosphere. As a result, the photosensitive substrate 1 is lifted from the mounting surface 2a.
【００２０】上記実施例では、モータ制御部９、電磁弁
制御部１１、主制御装置１０をそれぞれ独立して設ける
構成としたが、一つの制御装置で各制御を行う構成とし
てもよい。また、In the above embodiment, the motor control unit 9, the solenoid valve control unit 11, and the main control unit 10 are independently provided, but a single control unit may perform each control. Also,
【図１】本発明の実施例による基板ホルダの概略的な構
成を示す図。FIG. 1 is a diagram showing a schematic configuration of a substrate holder according to an embodiment of the present invention.
【図２】モータと電磁弁の制御系を示す図。FIG. 2 is a diagram showing a control system of a motor and a solenoid valve.
【図３】電流計によって検出される電流値の変化の特性
を示す図。FIG. 3 is a diagram showing characteristics of changes in current value detected by an ammeter.
３ 配管 ４ 支持ピン ５ ピニオンギア ６ ラックギア ７ モータ ８ 回転量検出器 ９ モータ制御部 １０ 主制御装置 １１ 電磁弁制御部 １２ 電磁弁 １３ 電流計 3 Piping 4 Support Pin 5 Pinion Gear 6 Rack Gear 7 Motor 8 Rotation Amount Detector 9 Motor Controller 10 Main Controller 11 Solenoid Valve Controller 12 Solenoid Valve 13 Ammeter
Claims (2)
面に連通した配管部材を介して吸引手段で真空吸引する
ことにより、前記基板を前記載置面上に吸着固定する基
板ホルダにおいて、 前記配管部材に気体を供給することにより、前記吸着を
解除する気体供給手段と、 前記載置面の上方及び下方に移動可能な支持部を有し、
該支持部が前記載置面の上方に移動した際に、前記基板
を前記支持部上に支持して前記載置面から剥離する基板
支持手段と、 前記基板支持手段を駆動する駆動手段と、 前記駆動手段の駆動力に対する抗力を検出する抗力検出
手段と、 前記抗力検出手段によって検出される前記抗力が所定の
値となった際に、前記気体供給手段による前記気体の供
給を行う制御手段とを備えたことを特徴とする基板ホル
ダ。1. A substrate has a mounting surface on which the substrate is mounted, and the substrate is sucked and fixed on the mounting surface by vacuum suction by a suction means via a piping member communicating with the mounting surface. In the substrate holder, the gas supply means for releasing the adsorption by supplying a gas to the piping member, and a supporting portion movable above and below the placement surface,
A substrate supporting unit that supports the substrate on the supporting unit and separates it from the mounting surface when the supporting unit moves above the mounting surface; and a driving unit that drives the substrate supporting unit. A drag detecting means for detecting a drag force against the driving force of the driving means; and a controlling means for supplying the gas by the gas supplying means when the drag force detected by the drag detecting means reaches a predetermined value. A substrate holder comprising:
ラックギアと、該ラックギアに係合するピニオンギア
と、該ピニオンギアを回転するモータとを含み、 前記抗力検出手段は、前記モータに流れる電流の変化を
検出する電流計を備えることを特徴とする請求項１に記
載の基板ホルダ。2. The driving means includes a rack gear connected to the support portion, a pinion gear engaging with the rack gear, and a motor for rotating the pinion gear, and the drag detecting means flows to the motor. The substrate holder according to claim 1, further comprising an ammeter that detects a change in current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17307495A JPH0927541A (en) | 1995-07-10 | 1995-07-10 | Substrate holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17307495A JPH0927541A (en) | 1995-07-10 | 1995-07-10 | Substrate holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0927541A true JPH0927541A (en) | 1997-01-28 |
Family
ID=15953730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17307495A Pending JPH0927541A (en) | 1995-07-10 | 1995-07-10 | Substrate holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0927541A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11145271A (en) * | 1997-11-05 | 1999-05-28 | Tokyo Electron Ltd | Wafer holder |
| JP2000200825A (en) * | 1999-01-07 | 2000-07-18 | Matsushita Electric Ind Co Ltd | Substrate removal control method of vacuum treatment apparatus and vacuum treatment apparatus |
| JP2000349139A (en) * | 1999-06-03 | 2000-12-15 | Matsushita Electric Ind Co Ltd | Substrate detaching control method of vacuum treater and vacuum treater |
| JP2004343110A (en) * | 2003-05-09 | 2004-12-02 | Asml Netherlands Bv | Lithography apparatus, manufacturing method of device, and device manufactured by it |
| JP2006310588A (en) * | 2005-04-28 | 2006-11-09 | Nikon Corp | Substrate-holding device and exposure device, and device manufacturing method |
| JP2006319093A (en) * | 2005-05-12 | 2006-11-24 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP2007502538A (en) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| JP2007142267A (en) * | 2005-11-21 | 2007-06-07 | Tokyo Electron Ltd | Method for extracting object to be processed, program storage medium, and placing mechanism |
| JP2008053391A (en) * | 2006-08-24 | 2008-03-06 | Tokyo Ohka Kogyo Co Ltd | Board retainer |
| JP2010113295A (en) * | 2008-11-10 | 2010-05-20 | Hitachi High-Technologies Corp | Proximity exposure apparatus, method of loading and unloading substrate in proximity exposure apparatus, and method of manufacturing display panel substrate |
| JP2011119499A (en) * | 2009-12-04 | 2011-06-16 | Tokyo Electron Ltd | Substrate processing apparatus, and method for measuring distance between electrodes thereof, as well as storage medium storing program |
| KR101273677B1 (en) * | 2011-11-28 | 2013-06-12 | 삼성전기주식회사 | Substrate processing table |
-
1995
- 1995-07-10 JP JP17307495A patent/JPH0927541A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11145271A (en) * | 1997-11-05 | 1999-05-28 | Tokyo Electron Ltd | Wafer holder |
| JP2000200825A (en) * | 1999-01-07 | 2000-07-18 | Matsushita Electric Ind Co Ltd | Substrate removal control method of vacuum treatment apparatus and vacuum treatment apparatus |
| JP2000349139A (en) * | 1999-06-03 | 2000-12-15 | Matsushita Electric Ind Co Ltd | Substrate detaching control method of vacuum treater and vacuum treater |
| JP2008010886A (en) * | 2003-05-09 | 2008-01-17 | Asml Netherlands Bv | Lithographic equipment, and device manufacturing method |
| JP2004343110A (en) * | 2003-05-09 | 2004-12-02 | Asml Netherlands Bv | Lithography apparatus, manufacturing method of device, and device manufactured by it |
| JP4667433B2 (en) * | 2003-05-09 | 2011-04-13 | エーエスエムエル ネザーランズ ビー．ブイ． | Lithographic apparatus and device manufacturing method |
| US7327438B2 (en) | 2003-05-09 | 2008-02-05 | Asml Netherlands B.V. | Lithographic apparatus and method of a manufacturing device |
| JP2007502538A (en) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| JP2006310588A (en) * | 2005-04-28 | 2006-11-09 | Nikon Corp | Substrate-holding device and exposure device, and device manufacturing method |
| JP4666473B2 (en) * | 2005-05-12 | 2011-04-06 | 大日本スクリーン製造株式会社 | Substrate heat treatment equipment |
| JP2006319093A (en) * | 2005-05-12 | 2006-11-24 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP2007142267A (en) * | 2005-11-21 | 2007-06-07 | Tokyo Electron Ltd | Method for extracting object to be processed, program storage medium, and placing mechanism |
| JP4580327B2 (en) * | 2005-11-21 | 2010-11-10 | 東京エレクトロン株式会社 | Method of taking out object to be processed, program storage medium, and mounting mechanism |
| JP2008053391A (en) * | 2006-08-24 | 2008-03-06 | Tokyo Ohka Kogyo Co Ltd | Board retainer |
| JP2010113295A (en) * | 2008-11-10 | 2010-05-20 | Hitachi High-Technologies Corp | Proximity exposure apparatus, method of loading and unloading substrate in proximity exposure apparatus, and method of manufacturing display panel substrate |
| JP2011119499A (en) * | 2009-12-04 | 2011-06-16 | Tokyo Electron Ltd | Substrate processing apparatus, and method for measuring distance between electrodes thereof, as well as storage medium storing program |
| KR101273677B1 (en) * | 2011-11-28 | 2013-06-12 | 삼성전기주식회사 | Substrate processing table |
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