JPWO2008075742A1 - Maintenance method, exposure method, exposure apparatus, and device manufacturing method - Google Patents

Abstract

The exposure apparatus has a member having a liquid repellent surface with respect to the first liquid, and exposes the substrate with exposure light through the first liquid. The exposure apparatus maintenance method recovers the deteriorated liquid repellency by removing a part of the surface of the member. The surface energy of the member can be reduced by removing the surface layer with increased surface energy and exposing the layer without increasing surface energy below it, thereby restoring the liquid repellency.

Description

The present invention relates to an exposure apparatus maintenance method, an exposure method, an exposure apparatus, and a device manufacturing method.
This application claims priority based on Japanese Patent Application No. 2006-343023 for which it applied on December 20, 2006, and uses the content here.

As an exposure apparatus used in a photolithography process, an immersion exposure apparatus that exposes a substrate through a liquid, for example, as disclosed in the following patent document is known.
International Publication No. 99/49504 Pamphlet

  In the immersion exposure apparatus, a liquid immersion space (immersion area) is formed not only on a substrate such as a wafer to be exposed but also on various members. For example, even after moving in the immersion space from the surface of the predetermined member, if liquid (for example, a liquid drop, a film, etc.) remains on the surface of the predetermined member, there are various causes due to the remaining liquid. May cause serious problems. For example, the environment (temperature, humidity, cleanliness, etc.) in which the exposure apparatus is placed may change due to vaporization of the remaining liquid. Due to the heat of vaporization of the remaining liquid, the predetermined member may be thermally deformed. In addition, after the remaining liquid is vaporized, a liquid adhesion mark (so-called watermark) may be formed on the predetermined member. If such a problem occurs, the performance of the exposure apparatus may deteriorate, and an exposure failure (such as a pattern defect) may occur. As a result, a defective device may be manufactured.

  An object of the present invention is to provide an exposure apparatus maintenance method capable of suppressing liquid from remaining on the surface of a member. It is another object of the present invention to provide an exposure method and an exposure apparatus that can prevent liquid from remaining on the surface of a member and suppress the occurrence of exposure failure. Moreover, it aims at providing the device manufacturing method which can suppress generation | occurrence | production of a defective device.

  According to a first aspect of the present invention, there is provided a maintenance method for an exposure apparatus that exposes a substrate with exposure light through a first liquid, the exposure apparatus having a liquid repellent surface with respect to the first liquid. A maintenance method is provided that includes a member and removes part of the surface of the member.

  According to the 1st aspect of this invention, it can suppress that a liquid remains on the surface of a member.

  According to the second aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a first liquid, which is disposed at a position where exposure light can be irradiated and is liquid repellent with respect to the first liquid. There is provided an exposure method including irradiating a surface of a member having exposure light with exposure light and removing a part of the surface of the member.

  According to the second aspect of the present invention, the occurrence of exposure failure can be suppressed.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the above aspect and developing the exposed substrate.

  According to the third aspect of the present invention, it is possible to suppress the occurrence of defective devices.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a first liquid, which is movable to a position where the exposure light can be irradiated and repels the first liquid. An exposure apparatus is provided that includes a member having a liquid surface and a supply port that supplies a second liquid for removing a surface layer of the member to the surface of the member.

  According to the fourth aspect of the present invention, the occurrence of exposure failure can be suppressed.

  According to a fifth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a first liquid, the exposure apparatus being movable to a position where exposure light can be irradiated, and repelling the first liquid. An exposure apparatus including a member having a liquid surface and a removing device for removing a part of the surface of the member is provided.

  According to the fifth aspect of the present invention, the occurrence of exposure failure can be suppressed.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus of the above aspect and developing the exposed substrate.

  According to the sixth aspect of the present invention, it is possible to suppress the occurrence of defective devices.

  According to the present invention, it is possible to suppress the liquid remaining on the surface of the member. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure due to the liquid remaining on the surface of the member. Moreover, according to this invention, generation | occurrence | production of the defective device resulting from the residue of the liquid in the surface of a member can be suppressed.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. It is the sectional side view which expanded a part of FIG. It is a perspective view which shows a substrate stage and a measurement stage. It is the top view which looked at the substrate stage and the measurement stage from the upper part. It is a sectional side view showing the neighborhood of a reference plate. It is a sectional side view which shows the vicinity of a slit board. It is a schematic diagram of the member which surface energy increased. It is a figure which shows the exposure apparatus of the state which is performing the maintenance operation | movement. It is a schematic diagram of the film | membrane processed with the maintenance method which concerns on 1st Embodiment. It is a schematic diagram of the film | membrane processed with the maintenance method which concerns on 1st Embodiment. It is a schematic diagram of the film | membrane processed with the maintenance method which concerns on 1st Embodiment. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic block diagram which shows the exposure apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the 2nd nozzle member which concerns on 2nd Embodiment. It is a schematic block diagram which shows the exposure apparatus which concerns on 2nd Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate stage, 2 ... Measurement stage, 5 ... Drive system, 6 ... Measurement system, 8 ... 1st optical element, 30 ... Nozzle member, 31 ... Supply port, 32 ... Collection port, 36 ... 1st supply apparatus, 40 ... second supply device, 50 ... reference plate, 50f ... film, 60 ... slit plate, 60f ... film, 70 ... upper plate, 70f ... film, 80 ... second nozzle member, EL ... exposure light, EX ... exposure device, IL ... illumination system, LC ... second liquid, LQ ... first liquid, P ... substrate, S ... member, Sf ... film, T ... plate member, Tf ... film

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. In this embodiment, the exposure apparatus EX is, for example, Japanese Patent Laid-Open No. 11-135400 (corresponding to International Publication No. 1999/23692) and Japanese Patent Laid-Open No. 2000-164504 (corresponding to US Pat. No. 6,897,963). And a substrate stage 1 that is movable while holding the substrate P, and a measurement stage 2 that is movable by mounting a measuring instrument, a measuring member, and the like that can perform measurement related to exposure. A case where the exposure apparatus is used will be described as an example.

  In FIG. 1, the exposure apparatus EX performs a measurement relating to exposure without holding the substrate P, the mask stage 3 that can move while holding the mask M, the substrate stage 1 that can move while holding the substrate P, and the like. A measuring stage 2 mounted with possible measuring instruments and measuring members and movable independently of the substrate stage 1, a driving system 4 for moving the mask stage 3, and a driving system for moving the substrate stage 1 and the measuring stage 2 5, a measurement system 6 including a laser interferometer that measures position information of each stage 1, 2, and 3, an illumination system IL that illuminates the mask M with the exposure light EL, and a mask M that is illuminated with the exposure light EL. A projection optical system PL that projects a pattern image onto a substrate P and a control device 7 that controls the operation of the entire exposure apparatus EX are provided.

  In addition, the substrate P here is a substrate for manufacturing a device, and a substrate in which a film Rg such as a photosensitive material (photoresist) is formed on a base material W such as a semiconductor wafer such as a silicon wafer, Or what applied various films, such as a protective film (topcoat film), in addition to a photosensitive material is included. The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. In the present embodiment, a transmissive mask is used as the mask M, but a reflective mask can also be used. The transmission type mask is not limited to a binary mask in which a pattern is formed by a light shielding film, and includes, for example, a phase shift mask such as a halftone type or a spatial frequency modulation type.

  The exposure apparatus EX includes a base member (surface plate) BP having a guide surface GF that supports the substrate stage 1 and the measurement stage 2 so as to be movable. Each of the substrate stage 1 and the measurement stage 2 is movable on the guide surface GF. In the present embodiment, the guide surface GF is substantially parallel to the XY plane, and each of the substrate stage 1 and the measurement stage 2 can move in the XY direction (two-dimensional direction) along the guide surface GF.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. The nozzle member 30 capable of forming an immersion space for the exposure liquid LQ is provided so as to fill the optical path space with the exposure liquid LQ. The optical path space of the exposure light EL is a space including an optical path through which the exposure light EL passes. The immersion space is a space filled with the exposure liquid LQ (or maintenance liquid LC described later). The exposure apparatus EX exposes the substrate P by irradiating the substrate P with the exposure light EL via the projection optical system PL and the exposure liquid LQ. In the present embodiment, water (pure water) is used as the exposure liquid LQ.

  In the present embodiment, the nozzle member 30 is disposed in the vicinity of the first optical element 8 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the nozzle member 30 is an annular member formed so as to surround the optical path space of the first optical element 8 and the exposure light EL. The nozzle member 30 has a lower surface, and can hold liquid between the member disposed at a position facing the lower surface of the nozzle member 30. The first optical element 8 has a light emission surface (lower surface) for emitting the exposure light EL, and holds the liquid between the first optical element 8 and a member disposed at a position facing the emission surface of the first optical element 8. Can do. Therefore, when a predetermined member is disposed at a position facing the nozzle member 30 and the first optical element 8, between the predetermined member and the nozzle member 30 and between the predetermined member and the first optical element 8. By holding the liquid, the optical path space of the exposure light EL on the light emission side of the first optical element 8, specifically, the optical path space of the exposure light EL between the first optical element 8 and the predetermined member is liquid. An immersion space can be formed to fill.

  The predetermined member that can be disposed at a position facing the first optical element 8 and the nozzle member 30 is movable on the light emission side of the first optical element 8. In the present embodiment, the predetermined member includes at least one of the substrate stage 1 and the measurement stage 2. In the present embodiment, the substrate stage 1 includes a plate member T described later, and the measurement stage 2 includes measurement members (a reference plate 50, a slit plate 60, an upper plate 70, and the like). The substrate stage 1 is movable within a predetermined region on the guide surface GF including a position facing the first optical element 8 and the nozzle member 30, and the measurement stage 2 faces the first optical element 8 and the nozzle member 30. It can move independently of the substrate stage 1 within a predetermined region on the guide surface GF including the position to be moved. The substrate P held on the substrate stage 1 can also be arranged at a position facing the first optical element 8 and the nozzle member 30. Moreover, the member arrange | positioned in the position facing the 1st optical element 8 and the nozzle member 30 may not be one member. For example, the upper surface of the substrate stage 1 and the upper surface of the measurement stage 2 may form an immersion space facing the first optical element 8 and the nozzle member 30, or may be held on the upper surface of the substrate stage 1 and the substrate stage 1. The surface of the substrate P thus formed may form an immersion space so as to face the first optical element 8 and the nozzle member 30.

  Further, the exposure apparatus EX of the present embodiment can maintain the member by supplying the maintenance liquid LC to the predetermined member to be maintained. The exposure apparatus EX supplies the maintenance liquid LC to the maintenance target member at an appropriate timing.

  In the present embodiment, the maintenance target member includes a member that can move (can be arranged) to a position facing the first optical element 8 and the nozzle member 30. The exposure apparatus EX of the present embodiment forms an immersion space for the maintenance liquid LC between the first optical element 8 and the nozzle member 30 and the maintenance target member, and performs maintenance of the member.

The illumination system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 3 is movable in the X-axis, Y-axis, and θZ directions while the mask M is held by a drive system 4 including an actuator such as a linear motor. Position information of the mask stage 3 (mask M) is measured by the laser interferometer 6M of the measurement system 6. The laser interferometer 6M uses the measurement mirror 3R provided on the mask stage 3 to measure position information regarding the X axis, the Y axis, and the θZ direction of the mask stage 3. The control device 7 drives the drive system 4 based on the measurement result of the measurement system 6 including the laser interferometer 6M, and controls the position of the mask M held on the mask stage 3.

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. The projection optical system PL has a plurality of optical elements, and these optical elements are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like. The projection optical system PL may be any one of a reduction system, a unity magnification system, and an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z-axis direction. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 1 includes a stage main body 11 and a substrate table 12 mounted on the stage main body 11 and capable of holding the substrate P. The stage main body 11 is supported by the gas bearing in a non-contact manner on the guide surface GF, and can move on the guide surface GF in the XY directions. The substrate stage 1 is movable on the light emission side of the first optical element 8 (the image plane side of the projection optical system PL) while holding the substrate P.

  The measurement stage 2 includes a stage main body 21 and a measurement table 22 mounted on the stage main body 21 and capable of mounting a measuring instrument and a measurement member. The stage body 21 is supported by the gas bearing in a non-contact manner on the guide surface GF, and can move in the XY directions on the guide surface GF. The measurement stage 2 is movable on the light exit side of the first optical element 8 (the image plane side of the projection optical system PL) with the measuring instrument mounted.

  The drive system 5 includes an actuator such as a linear motor, for example, and moves the stage main body 11 and the stage main body 21 in the X axis, Y axis, and θZ directions on the guide surface GF, thereby causing the substrate on the stage main body 11 to move. The table 12 and the measurement table 22 on the stage main body 21 include a coarse motion system 5A capable of moving in the X-axis, Y-axis, and θZ directions, and an actuator such as a voice coil motor. A fine movement system 5B that can move the table 12 in the Z-axis, θX, and θY directions, and a fine movement system 5C that can move the measurement table 22 in the Z-axis, θX, and θY directions relative to the stage main body 21 are provided. . The drive system 5 including the coarse motion system 5A and the fine motion systems 5B and 5C is configured to move each of the substrate table 12 and the measurement table 22 in six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. Can be moved to. The control device 7 controls the drive system 5 to provide six degrees of freedom in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions of the substrate table 12 (substrate P) and the measurement table 22 (measuring instrument). It is possible to control the position in the direction of.

  Position information (position information regarding the X axis, Y axis, and θZ directions) of the substrate table 12 and the measurement table 22 is measured by the laser interferometer 6P of the measurement system 6. The laser interferometer 6P uses the measurement mirrors 12R and 22R provided on the substrate table 12 and the measurement table 22, respectively, to obtain positional information regarding the X-axis, Y-axis, and θZ directions of the substrate table 12 and the measurement table 22, respectively. measure.

  Further, the exposure apparatus EX includes an oblique incidence type focus / leveling detection system FL. Surface position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held on the substrate table 12 and surface position information of the upper surface of the measurement table 22 are detected by the focus / leveling detection system FL. Is done. The measurement result of the laser interferometer 6P of the measurement system 6 and the detection result of the focus / leveling detection system FL are output to the control device 7. The control device 7 drives the drive system 5 based on the measurement result of the laser interferometer 6P and the detection result of the focus / leveling detection system FL, and controls the position of the substrate P and the like held on the substrate table 12.

  Further, the exposure apparatus EX of the present embodiment includes a TTR (Through The Reticle) type alignment system RA using light having an exposure wavelength. The alignment system RA detects the alignment mark on the mask M, the first reference mark FM1 on the reference plate 50 provided on the measurement stage 2, and the like. At least a part of the alignment system RA is disposed above the mask stage 3. The alignment system RA generates an alignment mark on the mask M and a conjugate image of the first reference mark FM1 on the reference plate 50 provided on the measurement stage 2 through the projection optical system PL so as to correspond to the alignment mark. Observe. The alignment system RA of the present embodiment includes an object mark (an alignment mark on the mask M and a reference plate) as disclosed in, for example, Japanese Patent Application Laid-Open No. 7-176468 (corresponding US Pat. No. 5,646,413). A VRA (Visual Reticle Alignment) method is employed in which light is applied to the first reference mark FM1 on 50, etc., and the mark position is detected by performing image processing on the image data of the mark imaged by a CCD camera or the like.

  Further, the exposure apparatus EX of the present embodiment includes an off-axis alignment system ALG. An alignment mark on the substrate P and a second reference mark FM2 on the reference plate 50 provided on the measurement stage 2 are detected. At least a part of alignment system ALG is disposed in the vicinity of the tip of projection optical system PL. The alignment system ALG of this embodiment is a broadband detection light that does not expose the photosensitive material on the substrate P as disclosed in, for example, Japanese Patent Laid-Open No. 4-65603 (corresponding US Pat. No. 5,493,403). Is applied to the target mark (the alignment mark on the substrate P, the second reference mark FM2 on the reference plate 50, etc.) and the image of the target mark imaged on the light receiving surface by the reflected light from the target mark and the index ( An image of an index mark on an index plate provided in the alignment system ALG is imaged using an image sensor such as a CCD, and the image position is measured by image processing of these image signals. Alignment) type alignment system is adopted.

  FIG. 2 is an enlarged side sectional view of a part of the exposure apparatus EX according to the present embodiment. In FIG. 2, an exposure apparatus EX includes an exposure liquid supply apparatus 36 that generates an exposure liquid LQ, and a maintenance liquid supply apparatus 40 that generates a maintenance liquid LC in order to maintain predetermined members of the exposure apparatus EX. And. In the following description, the exposure liquid supply device 36 is referred to as a first supply device 36, the maintenance liquid supply device 40 is referred to as a second supply device 40, the exposure liquid LQ is referred to as a first liquid LQ, and the maintenance liquid LC is referred to as a maintenance liquid LC. This is referred to as the second liquid LC.

  As described above, in the present embodiment, the first liquid LQ is pure water. The first supply device 36 can deliver clean pure water that has been temperature-adjusted and sufficiently deaerated as the first liquid LQ.

  The second liquid LC includes a liquid that can dissolve the surface layer of the maintenance target member. The 2nd supply apparatus 40 can send out the liquid which can melt | dissolve the surface layer of the member of a maintenance object as 2nd liquid LC.

  In FIG. 2, the nozzle member 30 has a supply port 31 that can supply a liquid (at least one of the first liquid LQ and the second liquid LC), and the liquid immersion space is formed by the liquid from the supply port 31. The The nozzle member 30 also has a recovery port 32 that can recover the liquid supplied from the supply port 31.

  Further, the exposure apparatus EX supplies a supply pipe that forms a flow path for supplying at least one of the first liquid LQ from the first supply apparatus 36 and the second liquid LC from the second supply apparatus 40 to the supply port 31. 35. One end (lower end) of the supply pipe 35 is connected to the supply port 31 via a supply channel formed inside the nozzle member 30. The first supply device 36 can supply the first liquid LQ to the other end (upper end) of the supply pipe 35 via the first pipe 41. The second supply device 40 can supply the second liquid LC to the other end (upper end) of the supply pipe 35 via the second pipe 42.

  A flow path switching mechanism (valve mechanism) 43 is provided at the other end (upper end) of the supply pipe 35, one end of the first pipe 41 is connected to the valve mechanism 43, and the other end of the first pipe 41 is The first supply device 36 is connected. One end of the second pipe 42 is connected to the valve mechanism 43, and the other end of the second pipe 42 is connected to the second supply device 40.

  The operation of the valve mechanism 43 is controlled by the control device 7. The control device 7 controls the valve mechanism 43 to close the flow path connecting the second pipe 42 and the supply pipe 35 and to open the flow path connecting the first pipe 41 and the supply pipe 35, thereby 2 With the supply of the second liquid LC from the supply device 40 to the supply pipe 35 (supply port 31) stopped, the first liquid LQ sent from the first supply device 36 is supplied to the first pipe 41, the supply pipe 35, And it can be supplied to the supply port 31 via the supply flow path of the nozzle member 30. Further, the control device 7 controls the valve mechanism 43 to close the flow path connecting the first pipe 41 and the supply pipe 35 and open the flow path connecting the second pipe 42 and the supply pipe 35. The second liquid LC sent from the second supply device 40 in a state where the supply of the first liquid LQ from the first supply device 36 to the supply tube 35 (supply port 31) is stopped is supplied to the second tube 42 and the supply tube. 35 and the supply channel of the nozzle member 30 can be supplied to the supply port 31.

  In the following description, the state in which the first liquid LQ is supplied from the first supply device 36 to the supply port 31 is appropriately referred to as a first supply mode, and the second liquid LC is supplied from the second supply device 40 to the supply port 31. The state in which is supplied is appropriately referred to as a second supply mode.

  The recovery port 32 is disposed on the lower surface of the nozzle member 30 and can recover liquid from at least one surface of the substrate stage 1, the measurement stage 2, and the substrate P facing the recovery port 32. A porous member (mesh) 33 is disposed in the recovery port 32. In the present embodiment, the supply port 31 is disposed at a position closer to the optical path space than the recovery port 32.

  The recovery port 32 is connected to a liquid recovery apparatus 38 that can recover the liquid (at least one of the first liquid LQ and the second liquid LC) via a recovery flow path formed inside the nozzle member 30 and a recovery pipe 37. It is connected. The liquid recovery device 38 includes a vacuum system or the like and can recover the liquid. The liquid recovered from the recovery port 32 by operating the liquid recovery device 38 flows through the recovery flow path of the nozzle member 30 and is then recovered by the liquid recovery device 38 via the recovery pipe 37.

  The nozzle member 30 has an opening 30K for allowing the exposure light EL to pass therethrough. Further, the lower surface of the nozzle member 30 includes a flat surface 34 disposed so as to surround the opening 30 </ b> K and a lower surface of the porous member 33 of the recovery port 32 disposed around the flat surface 34.

  At least during exposure of the substrate P, the substrate P, the first optical element 8 and the nozzles arranged at positions facing the first optical element 8 and the nozzle member 30 so as to fill the optical path space of the exposure light EL with the first liquid LQ. An immersion space for the first liquid LQ defined by the member 30 is formed. Further, during maintenance of the maintenance target member, the second liquid LC defined by the maintenance target member, the first optical element 8 and the nozzle member 30 disposed at positions facing the first optical element 8 and the nozzle member 30. An immersion space is formed. Further, in the present embodiment, the nozzle member 30 performs the liquid supply operation from the supply port 31 and the liquid recovery operation by the recovery port 32 in parallel to form an immersion space.

  In the present embodiment, the immersion space is formed so that a partial region (local region) on the surface of the member disposed at a position facing the nozzle member 30 and the first optical element 8 is covered with the liquid. As a result, a liquid interface (meniscus) is formed between the surface of the member and the lower surface of the nozzle member 30. That is, in this embodiment, the exposure apparatus EX sets the immersion space so that a part of the area on the substrate P including the projection area of the projection optical system PL is covered with the first liquid LQ when the substrate P is exposed. Adopt the local immersion method to be formed. The nozzle member 30 functions as a liquid holding member (liquid confinement member) that holds the first liquid LQ on the image plane side of the projection optical system PL. In addition, the structure of the nozzle member 30 is not restricted to the above-mentioned thing, For example, the member currently disclosed by corresponding US Patent Publication 7,199,858 can also be used.

  Next, the substrate table 12 will be described. The substrate table 12 is provided on the base 13, the first holder PH <b> 1 provided on the base 13 so as to be releasable, and the second holder provided on the base 13 so as to hold the plate member T releasably. PH2. The plate member T is a member different from the substrate table 12, and is releasably held by the second holder PH2 of the substrate table 12.

  A substantially circular opening TH in which the substrate P can be placed is formed in the center of the plate member T. The plate member T held by the second holder PH2 is disposed so as to surround the periphery of the substrate P held by the first holder PH1. The outer edge (side surface) of the substrate P held by the first holder PH1 and the inner edge (opening TH side) of the plate member T disposed outside the substrate P and held by the second holder PH2 (inner side) A predetermined gap is formed with the side surface. In the present embodiment, the surface of the plate member T held by the second holder PH2 is a flat surface that is substantially the same height (level) as the surface of the substrate P held by the first holder PH1. ing. Thus, the plate member T forms a flat portion around the substrate P held by the first holder PH1 of the substrate stage 1.

  The plate member T has a liquid repellent surface with respect to the first liquid LQ. In the present embodiment, the surface of the plate member T is formed of a film Tf of a material containing fluorine. That is, the surface of the plate member T includes the surface of the film Tf. Specifically, the plate member T has a base material Tb formed of a metal such as stainless steel, and a film Tf of a material containing fluorine formed on the surface of the base material Tb. In the present embodiment, the material forming the film Tf includes PFA (tetrafluoroethylene-perfluoroalkoxyethylene copolymer).

  The first holder PH <b> 1 includes a so-called pin chuck mechanism, is formed on the base material 13, and includes a plurality of pin-like members 14 that support the back surface of the substrate P and the base material 13 so as to surround the plurality of pin-like members 14. The 1st surrounding wall 15 formed in this is provided. The first peripheral wall 15 is formed in an annular shape that is substantially the same shape as the outer shape of the substrate P, and the upper surface of the first peripheral wall 15 faces a peripheral region (edge region) on the back surface of the substrate P. A plurality of first suction ports 16 capable of sucking gas are provided on the base material 13 inside the first peripheral wall 15. Each of the first suction ports 16 is connected to a suction device including a vacuum system or the like. The control device 7 uses the suction device to suck the gas in the first space surrounded by the back surface of the substrate P, the first peripheral wall 15, and the base material 13 through the first suction port 16, and thereby the first space. The negative surface of the substrate P is attracted and held by the pin-like member 14. Further, by stopping the suction operation by the suction device connected to the first suction port 16, the substrate P can be removed from the first holder PH1.

  The second holder PH <b> 2 includes a so-called pin chuck mechanism, and is formed on the base material 13 so as to surround the second peripheral wall 17 and the second peripheral wall 17 formed on the base material 13 so as to surround the first peripheral wall 15. The third peripheral wall 18 and a plurality of pin-shaped members 19 that are formed on the base material 13 between the second peripheral wall 17 and the third peripheral wall 18 and support the back surface of the plate member T are provided. The upper surface of the second peripheral wall 17 faces the inner edge region (inner edge region) on the back surface of the plate member T in the vicinity of the opening TH. The upper surface of the third peripheral wall 18 faces the outer edge region (outer edge region) of the back surface of the plate member T.

  Further, a plurality of second suction ports 20 capable of sucking gas are provided on the base material 13 between the second peripheral wall 17 and the third peripheral wall 18. Each of the second suction ports 20 is connected to a suction device including a vacuum system and the like. The control device 7 sucks the gas in the second space surrounded by the back surface of the plate member T, the second peripheral wall 17, the third peripheral wall 18, and the base material 13 through the second suction port 20 using the suction device. Then, the back surface of the plate member T is sucked and held by the pin-shaped member 19 by setting the second space to a negative pressure. Moreover, by stopping the suction operation by the suction device connected to the second suction port 20, the plate member T can be removed from the second holder PH2.

  As shown in FIG. 2, for example, when the exposure light EL is irradiated to the peripheral area (edge shot) of the surface of the substrate P, a part of the plate member T comes into contact with the first liquid LQ in the immersion space. It may be. In this case, the immersion space of the first liquid LQ is defined by the first optical element 8, the nozzle member 30, the plate member T, and the substrate P.

  Next, the measurement stage 2 will be described. FIG. 3 is a schematic perspective view showing the substrate stage 1 and the measurement stage 2, and FIG. 4 is a plan view showing the substrate stage 1 and the measurement stage 2. The measurement stage 2 includes a plurality of measuring instruments and measuring members for performing various measurements related to exposure. At a predetermined position on the upper surface of the measurement table 22 of the measurement stage 2, a reference plate 50 on which a plurality of reference marks FM1 and FM2 are formed is provided as a measurement member. In the present embodiment, the reference plate 50 is releasably held by a third holder PH3 provided on the measurement table 22. In addition, a slit plate 60 in which a slit portion 61 is formed is provided as a measurement member at a predetermined position on the upper surface of the measurement table 22. In the present embodiment, the slit plate 60 is releasably held in a fourth holder PH4 provided on the measurement table 22. Further, an upper plate 70 on which an opening pattern 71 is formed is provided as a measurement member at a predetermined position on the upper surface of the measurement table 22. In the present embodiment, the upper plate 70 is releasably held by a fifth holder PH5 provided on the measurement table 22.

  The reference plate 50 is formed on the substrate 51 made of a low thermal expansion material, the first reference mark FM1 formed on the substrate 51 and measured by the alignment system RA, and formed on the substrate 51 and measured by the alignment system ALG. The second reference mark FM2 is provided. The first and second fiducial marks FM1, FM2 are made of a metal such as Cr (chrome).

  The reference plate 50 has a liquid repellent surface with respect to the first liquid LQ. In the present embodiment, the surface of the reference plate 50 is formed of a film 50f of a material containing fluorine. That is, the surface of the storage 50 includes the surface of the film 50f. In the present embodiment, the film 50f forming the surface of the reference plate 50 is formed of a transparent material containing fluorine that can transmit light (exposure light EL). As a transparent material containing fluorine for forming the film 50f, for example, “Cytop” manufactured by Asahi Glass Co., Ltd. can be used.

  The slit plate 60 includes a light shielding film 62 made of Cr (chromium) or the like provided at the center of the upper surface of the glass plate member 64, and a portion other than the light shielding film 62 around the light shielding film 62, that is, the upper surface of the glass plate member 64. And a slit film 61 that is an opening pattern formed in a part of the light-shielding film 62. In the slit part 61, the glass plate member 64 which is a transparent member is exposed, and light can pass through the slit part 61. As a material for forming the glass plate member 64, synthetic quartz or meteorite having good permeability to the exposure light EL is used. The slit portion 61 can be formed by etching the light shielding film 62, for example. The slit plate 60 is an aerial image measurement system 60S disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-14005 (corresponding US Patent Application Publication No. 2002/0041377), Japanese Patent Application Laid-Open No. 2002-198303, and the like. Part of it. Below the slit plate 60, a light receiving element constituting a part of the aerial image measurement system 60S is arranged.

  The slit plate 60 has a liquid repellent surface with respect to the first liquid LQ. In the present embodiment, the surface of the slit plate 60 is formed of a film 60f of a material containing fluorine. That is, the surface of the slit plate 60 includes the surface of the film 60f. As the film 60f forming the surface of the slit plate 60, for example, CYTOP can be used.

  The upper plate 70 includes a light shielding film 72 made of Cr (chromium) or the like provided on the upper surface of the glass plate member 74, and an opening pattern 71 formed in a part of the light shielding film 72. In the opening pattern 71, the glass plate member 74 that is a transparent member is exposed, and light can pass through the opening pattern 71. As a material for forming the glass plate member 74, synthetic quartz or meteorite having good transparency to the exposure light EL is used. The opening pattern 71 can be formed by etching the light shielding film 72, for example. The upper plate 70 measures information on the exposure energy of the exposure light EL (light quantity, illuminance, illuminance unevenness, etc.), for example, as disclosed in Japanese Patent Application Laid-Open No. 57-117238 (corresponding US Pat. No. 4,465,368). A measuring instrument that can measure illuminance unevenness as disclosed, for example, unevenness measurement for measuring the variation in the transmittance of the exposure light EL of the projection optical system PL as disclosed in Japanese Patent Application Laid-Open No. 2001-267239. A part of a dose measuring device (illuminance measuring device) as disclosed in, for example, Japanese Patent Application Laid-Open No. 11-16816 (corresponding US Patent Application Publication No. 2002/0061469). Alternatively, the upper plate 70 constitutes a part of a wavefront aberration measuring instrument as disclosed in, for example, International Publication No. 99/60361 pamphlet (corresponding to European Patent No. 1,079,223). It may be. A light receiving element constituting a part of these measuring instruments is disposed below the upper plate 70.

  The upper plate 70 has a liquid repellent surface with respect to the first liquid LQ. In the present embodiment, the surface of the upper plate 70 is formed of a film 70f of a material containing fluorine. That is, the surface of the upper plate 70 includes the surface of the film 70f. In the present embodiment, the surface of the upper plate 70 is formed of, for example, a Cytop film 70f, like the reference plate 50 and the slit plate 60.

  In the present embodiment, the upper surface of the measurement table 22 other than the upper surfaces of the measurement members 50, 60, and 70 is formed of a film of a material containing fluorine, such as PFA, and repels the first liquid LQ. It has liquidity.

  FIG. 5 is a cross-sectional view showing the reference plate 50 held by the third holder PH3. The third holder PH3 is disposed in a recess provided in a part of the upper surface of the measurement table 22. The third holder PH3 includes a so-called pin chuck mechanism, and includes a plurality of pin-shaped members 52 that support the back surface of the reference plate 50, a peripheral wall 53 formed so as to surround the plurality of pin-shaped members 52, and an inner side of the peripheral wall 53 And a suction port 54 capable of sucking gas. The upper surface of the reference plate 50 held by the third holder PH3 and the upper surface of the measurement table 22 are set to have substantially the same height (level).

  As shown in FIG. 5, when executing the measurement process using the reference plate 50, the control device 7 arranges the reference plate 50 at a position facing the light emission surface of the first optical element 8, and the first optical element. In a state in which the immersion space of the first liquid LQ is formed between 8 and the reference plate 50, the reference plate 50 is irradiated with the exposure light EL or light having the same wavelength as the exposure light EL (ultraviolet light).

  FIG. 6 is a cross-sectional view showing the slit plate 60 held by the fourth holder PH4. As shown in FIG. 6, an opening is formed in a part of the upper surface of the measurement table 22, and an internal space connected to the opening is formed in the measurement table 22. The slit plate 60 is releasably held by a fourth holder PH4 disposed in the vicinity of the opening of the measurement table 22. The fourth holder PH4 includes a so-called pin chuck mechanism, and has a base 67 formed in an annular shape so as not to block the exposure light EL transmitted through the slit portion 61, and on the base 67 so as to be along the inner edge of the base 67. The inner peripheral wall 67A formed on the outer peripheral wall 67B is formed between the inner peripheral wall 67A and the outer peripheral wall 67B to support the back surface of the slit plate 60. A plurality of pin-like members 68, and a suction port 69 that is disposed between the inner peripheral wall 67A and the outer peripheral wall 67B and capable of sucking gas. The upper surface of the slit plate 60 held by the fourth holder PH4 and the upper surface of the measurement table 22 are set to have substantially the same height (level).

  At least a part of the aerial image measurement system 60 </ b> S is disposed in the internal space of the measurement table 22. The aerial image measurement system 60 </ b> S includes a slit plate 60, an optical system 65 disposed below the slit portion 61 in the internal space of the measurement table 22, and light reception capable of receiving light (exposure light EL) via the optical system 65. An element 66 is provided.

  As shown in FIG. 6, when performing the measurement process using the slit plate 60, the control device 7 arranges the slit plate 60 at a position facing the light exit surface of the first optical element 8, and the first optical element. The slit plate 60 is irradiated with the exposure light EL in a state where an immersion space for the first liquid LQ is formed between the slit plate 60 and the slit plate 60. The light receiving element 66 receives the exposure light EL transmitted through the slit plate 60 (slit portion 61) through the optical system 65, and executes a spatial image measurement.

  Although not shown, the measurement table 22 is provided with a fifth holder PH5 that detachably holds the upper plate 70, and the upper plate 70 is detachable from the fifth holder PH5 of the measurement table 22. Retained. The upper surface of the upper plate 70 held by the fifth holder PH5 and the upper surface of the measurement table 22 are set to have substantially the same height (level).

  When executing the measurement process using the upper plate 70, the control device 7 arranges the upper plate 70 at a position facing the light emission surface of the first optical element 8, and the first optical element 8 and the upper plate 70 are arranged. The upper plate 70 is irradiated with the exposure light EL in a state where an immersion space for the first liquid LQ is formed therebetween. The light receiving element disposed below the upper plate 70 receives the exposure light EL that has passed through the upper plate 70 and performs a predetermined measurement.

  As described above, when the measurement process is performed using the measurement table 22, the measurement table 22, the first optical element 8, and the nozzle member 30 arranged at positions facing the first optical element 8 and the nozzle member 30. And the immersion space of the first liquid LQ is defined.

  In this embodiment, as disclosed in, for example, International Publication No. 2005/0774014 (corresponding to European Patent Application Publication No. 1,713,113) and US Patent Publication No. 2006/0023186. The control device 7 faces the first optical element 8 and the nozzle member 30 so that the substrate table 12 and the measurement table 22 continue to form a space capable of holding the first liquid LQ with the first optical element 8. The first optical element using the drive system 5 with the upper surface of the substrate table 12 (plate member T) and the upper surface of the measurement table 22 approaching or contacting each other within a predetermined region of the guide surface GF including the position to be moved. The substrate table 12 and the measurement table 22 are synchronously moved in the XY direction with respect to the nozzle member 30 and the nozzle member 30. Thereby, the control device 7 can move the immersion space of the first liquid LQ between the upper surface of the substrate table 12 and the upper surface of the measurement table 22 while suppressing leakage of the first liquid LQ. When the immersion space of the first liquid LQ is moved between the upper surface of the substrate table 12 and the upper surface of the measurement table 22, the upper surface of the substrate table 12 and the upper surface of the measurement table 22 are substantially the same height (surface 1) is adjusted.

  As described above, when one of the substrate table 12 and the measurement table 22 is separated from the projection optical system PL, the other table is disposed at a position facing the first optical element 8 and the nozzle member 30. The optical path space of the exposure light EL on the light emission side of one optical element 8 can be continuously filled with the first liquid LQ.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  First, the control device 7 fills the optical path space of the exposure light EL with the first liquid LQ in a state where the first optical element 8 and the nozzle member 30 are opposed to the measurement stage 2. Of course, the immersion space for the first liquid LQ may be formed in a state where the first optical element 8 and the nozzle member 30 are opposed to the substrate stage 1.

  Next, before exposing the substrate P, the control device 7 performs various measurements using at least one of a measuring instrument and a measuring member mounted on the measuring stage 2. For example, using the aerial image measurement system 60S, the imaging characteristics of the projection optical system PL are measured as shown in FIG.

  And the control apparatus 7 performs various adjustments (calibration) based on the measurement result. For example, the image formation characteristic of the projection optical system PL is adjusted based on the measurement result of the aerial image measurement system 60S.

  After the measurement using the measurement stage 2 is completed, the control device 7 moves the substrate stage 1 and the measurement stage 2 synchronously as described above, and moves the immersion space of the first liquid LQ from the measurement stage 2 to the substrate stage. Move to 1. Next, the control device 7 starts an alignment process for the substrate P on the substrate stage 1. The control device 7 moves the substrate stage 1 in the X and Y directions, and sequentially arranges a plurality of alignment marks provided so as to correspond to the respective shot regions on the substrate P in the detection region of the alignment system ALG. Then, the control device 7 measures the position information of the substrate stage 1 using the measurement system 6 including the laser interferometer 6P, and uses the alignment system ALG to mark the plurality of alignment marks on the substrate P as the first. Detection is sequentially performed without using the liquid LQ. Thereby, the control apparatus 7 can obtain | require the positional information on the alignment mark on the board | substrate P within the coordinate system prescribed | regulated by the measurement system 6 containing the laser interferometer 6P.

  Then, the control device 7 controls the position of the substrate P on the substrate stage 1 based on the position information of the alignment marks on the substrate P, and sequentially exposes a plurality of shot areas on the substrate P.

  At least while the pattern image of the mask M is projected onto the substrate P, an immersion space is formed so as to fill the optical path space of the exposure light EL with the first liquid LQ, and the projection optical system PL and the first liquid LQ are formed. Then, the exposure light EL that has passed through the mask M is irradiated onto the substrate P held on the substrate stage. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the substrate P in the Y-axis direction with respect to the projection area of the projection optical system PL, and synchronizes with the movement of the substrate P in the Y-axis direction with respect to the illumination area of the illumination system IL. While moving the mask M in the Y-axis direction, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the first liquid LQ to expose the substrate P.

  By the way, as described above, for example, after the measurement process using the slit plate 60 is completed, the control device 7 measures the measurement stage with respect to the first optical element 8 and the nozzle member 30 (the immersion space of the first liquid LQ). 2 is moved under predetermined moving conditions (including speed, acceleration, and moving direction), and the slit plate 60 is moved to a position not facing the first optical element 8 and the nozzle member 30.

  If the liquid repellency of the surface of the slit plate 60 is deteriorated (decreased) even if the slit plate 60 is moved to a position not facing the first optical element 8 and the nozzle member 30, the surface of the slit plate 60 is One liquid LQ (for example, a drop or film of the first liquid LQ) may remain. In addition, when the slit plate 60 (measurement stage 2) is moved in the XY direction under predetermined movement conditions with respect to the first optical element 8 and the nozzle member 30 (the liquid immersion space of the first liquid LQ), If the liquid repellency of the surface is deteriorated, it is difficult to maintain the immersion space of the first liquid LQ (such as the shape of the immersion space of the first liquid LQ) in a desired state, and the first liquid LQ leaks out. there's a possibility that. In particular, when the moving speed of the slit plate 60 (measurement stage 2) is increased for the purpose of improving throughput or the like, the possibility that the first liquid LQ remains or the first liquid LQ leaks increases.

  Similarly, even after the measurement process using the reference plate 50 is executed, even if the reference plate 50 is moved to a position not facing the first optical element 8 and the nozzle member 30, the liquid repellency of the surface of the reference plate 50 is deteriorated. If so, the first liquid LQ may remain on the surface of the reference plate 50. In addition, when the reference plate 50 (measurement stage 2) is moved in the XY direction under predetermined movement conditions with respect to the first optical element 8 and the nozzle member 30 (immersion space of the first liquid LQ), the reference plate 50 If the liquid repellency of the surface is deteriorated, it is difficult to maintain the immersion space of the first liquid LQ in a desired state, and the first liquid LQ may leak.

  Similarly, if the liquid repellency of the surface of the upper plate 70 is deteriorated, the first liquid LQ remains on the surface of the upper plate 70, or the immersion space of the first liquid LQ cannot be maintained in a desired state. There is a possibility that the first liquid LQ leaks.

  Further, as described above, when the exposure light EL is irradiated to the peripheral area (edge shot) on the surface of the substrate P, at least a part of the plate member T comes into contact with the first liquid LQ in the immersion space.

  If the liquid repellency of the surface of the plate member T is deteriorated, when the plate member T is moved to a position not facing the first optical element 8 and the nozzle member 30, the first liquid LQ is placed on the surface of the plate member T. (For example, a drop or film of the first liquid LQ) may remain. Further, when the plate member T (substrate stage 1) is moved in the XY direction under predetermined movement conditions with respect to the first optical element 8 and the nozzle member 30 (immersion space of the first liquid LQ), the plate member T If the liquid repellency of the surface is deteriorated, it becomes difficult to maintain the immersion space of the first liquid LQ (the shape of the immersion space of the first liquid LQ) in a desired state, and the first liquid LQ leaks. there is a possibility.

  The deterioration of the liquid repellency performance of the surface of each member such as the surface of the slit plate 60, the surface of the reference plate 50, the surface of the upper plate 70, the upper surface of the measurement table 22, the upper surface of the substrate table 12 (the upper surface of the plate member T) This is because the liquid-repellent film that forms the surface of each member deteriorates due to exposure to exposure light EL (ultraviolet light), and the surface energy of the liquid-repellent film increases. Therefore, by reducing the surface energy of the liquid-repellent film forming the surface of each member and increasing the liquid repellency of the surface of each member, the above-described problems (residual of the first liquid LQ, the first liquid LQ Occurrence of leakage etc. can be suppressed.

  Here, in the following description, the reference plate 50, the slit plate 60, the upper plate 70, the plate member T, the substrate table 12, the measurement table 22, and the like are moved to positions facing the first optical element 8 and the nozzle member 30. The possible (arrangeable) members are collectively referred to as member S as appropriate. Further, a film of a material containing fluorine that forms the surface of the member S is appropriately referred to as a film Sf. The film Sf includes at least one of the above-described films 50f, 60f, 70f, and Tf.

  In this embodiment, in the initial state before the exposure light EL is irradiated, before the exposure light EL is irradiated, or before the exposure light EL is irradiated in a state of contact with the first liquid LQ. The surface energy of the member S formed by the film Sf is small, and the surface of the member S has high liquid repellency. That is, in the initial state, the contact angle of the first liquid LQ1 on the surface of the film Sf is large (for example, 90 ° or more). That is, in the initial state, the surface of the member S formed by the film Sf has a desired surface energy that can suppress the remaining of the first liquid LQ and maintain the immersion space of the first liquid LQ in a desired state. (Liquid repellency).

  The inventor has found that the surface energy of the member S can be reduced by removing the surface layer of the member S, that is, the surface layer of the film Sf. That is, the present inventor removes the surface layer (layer with increased surface energy) of the member S (film Sf), and exposes the layer under which the surface energy does not increase, thereby exposing the member S (film Sf). It was found that the surface energy of can be reduced. That is, it was found that the liquid repellency of the surface of the member S (film Sf) can be recovered by removing a part of the surface of the member (film Sf) with a certain thickness and exposing the lower part thereof. In the present embodiment, by supplying the second liquid LC to the surface of the member S, the surface layer of the member S (film Sf) is dissolved, and the liquid repellency of the surface of the member S is recovered (the surface energy is reduced). ).

  FIG. 7 is a schematic diagram showing the state of the member S after being irradiated with the exposure light EL (ultraviolet light) while being in contact with the first liquid LQ. FIG. 7 shows a part of the slit plate 60 as an example of the member S.

  As described above, the surface of the member S is formed of the film Sf (film 60f) made of a material containing fluorine. That is, the surface of the member S includes the surface of the film Sf. By irradiating the surface of the film Sf with the exposure light EL, the physical properties (properties, material characteristics) of the surface layer of the film Sf may change as shown in the schematic diagram of FIG. That is, when the surface of the film Sf is irradiated with the exposure light EL, the physical properties of some regions in the thickness direction near the surface including the surface of the film Sf may change. In the following description, the surface layer (partial region in the thickness direction of the film Sf) of the film Sf whose physical properties have been changed by irradiation with the exposure light EL is appropriately referred to as a modified region Sc.

  The film Sf is a film made of a material containing fluorine (organic material). For example, there is a possibility that a phenomenon such as disconnection of molecules of the film Sf is caused by irradiation with the exposure light EL. Thereby, the physical properties of the surface layer of the film Sf irradiated with the exposure light EL may change. As the physical properties of the surface layer of the film Sf change (deteriorate), the liquid repellency of the surface of the film Sf may decrease (surface energy increases).

  Therefore, the second liquid LC capable of dissolving the surface layer of the member S (film Sf) is supplied to the member S, and the surface layer of the member S (film Sf), that is, the altered region Sc is dissolved and removed from the member S. Thus, the surface of the fresh film Sf existing under the altered region Sc, the physical properties of which are not changed, that is, the desired physical properties can be exposed. Thereby, the surface energy of the member S can be reduced and the liquid repellency can be recovered.

  Thus, even when the surface energy of the member S increases due to irradiation of the exposure light EL, maintenance work including an operation of supplying the second liquid LC to the member S is performed in order to dissolve the surface layer of the member S. As a result, the surface energy of the member S can be reduced. Therefore, in the present embodiment, in order to suppress the occurrence of the above-described problems accompanying the increase in the surface energy of the member S, a maintenance operation including an operation of supplying the second liquid LC to the member S is performed at a predetermined timing. To do.

  Hereinafter, an example of the maintenance method according to the present embodiment will be described.

  FIG. 8 is a schematic diagram illustrating a state in which the slit plate 60 is maintained as an example of the member S. As shown in FIG. 8, in the present embodiment, the control device 7 is supplied from the supply port 31 by arranging the slit plate 60 at a position facing the first optical element 8 and the nozzle member 30 during maintenance. An immersion space is formed with the second liquid LC. At this time, the control device 7 sets the valve mechanism 43 to the second supply mode. As a result, as shown in FIG. 8, the second liquid LC delivered from the second supply device 40 is supplied to the supply port 31 via the second pipe 42, the supply pipe 35, and the supply flow path of the nozzle member 30. Is possible.

  The control device 7 supplies the second liquid LC to the slit plate 60 from the supply port 31 in order to dissolve the surface layer of the slit plate 60. The second liquid LC is obtained by dissolving a substance capable of dissolving the surface layer of the slit plate 60 in a predetermined liquid.

  As described above, the surface of the slit plate 60 of the present embodiment is formed of the film 60f made of a material containing fluorine. The second liquid LC includes a solvent containing fluorine and can dissolve the surface layer of the film 60f. That is, in the present embodiment, a solvent containing fluorine is used as a substance that can dissolve the surface layer of the slit plate 60. In the following description, a solvent containing fluorine is appropriately referred to as a fluorine-based solvent.

  Examples of the fluorine-based solvent include hydrofluorocarbon ether (HFE) and hydrofluorocarbon (HFC). Examples of the hydrofluorocarbon include “Bertrel XF” manufactured by Mitsui DuPont Fluorochemical Co., Ltd. Examples of the fluorine-based solvent also include “Fluorinert FC-77” manufactured by Sumitomo 3M Limited.

  Further, the second liquid LC of the present embodiment is obtained by dissolving the above-described fluorine-based solvent in alcohol. That is, the second liquid LC of the present embodiment is a solution in which the solute is a fluorinated solvent and the solvent is an alcohol. Examples of the alcohol for dissolving the fluorinated solvent include ethanol, isopropyl alcohol (IPA), and pentanol.

  As a solvent for the second liquid LC, it is desirable to use a solvent that is also soluble in the first liquid LQ. As described above, in the present embodiment, the solvent of the second liquid LC is alcohol, the first liquid LQ is pure water, and the solute of the second liquid LC is a fluorinated solvent. That is, pure water and a fluorinated solvent are each soluble in alcohol.

  In addition, the second supply device 40 of the present embodiment can deliver a second liquid LC containing a predetermined concentration of a fluorinated solvent by dissolving a fluorinated solvent in alcohol, and can deliver only alcohol (solvent). You can also

  When performing maintenance of the slit plate 60, the control device 7 performs the liquid supply operation from the supply port 31 and the liquid recovery operation by the recovery port 32 in parallel, and is supplied from the supply port 31 to the slit plate 60. The second liquid LC is recovered from the recovery port 32.

  Further, the control device 7 moves the slit plate 60 (measurement stage 2) in the XY directions with respect to the first optical element 8 and the nozzle member 30 in a state where the immersion space is formed by the second liquid LC.

  9A, 9B, and 9C are schematic views showing how the surface state of the slit plate 60 is changed by the maintenance method according to the present embodiment. FIG. 9A shows a state in which the slit plate 60 is irradiated with the exposure light EL while the first liquid LQ is in contact with the slit plate 60. As shown in FIG. 9A, the physical properties of the surface layer of the slit plate 60 (film Sf) change by irradiating the exposure light EL, and the altered region Sc is formed. Thereby, the liquid repellency of the surface of the member S falls (deteriorates).

  FIG. 9B shows a state in which the second liquid LC is brought into contact with the slit plate 60. As shown in FIG. 9B, the altered region Sc of the film Sf is gradually removed from the slit plate 60 by the contact between the slit plate 60 (film Sf) and the second liquid LC.

  In the present embodiment, when performing maintenance of the slit plate 60, the control device 7 performs the liquid supply operation from the supply port 31 and the liquid recovery operation by the recovery port 32 in parallel, and the slit plate is supplied from the supply port 31. The second liquid LC supplied onto 60 is recovered from the recovery port 32. Accordingly, a part of the film Sf including the altered region Sc removed from the slit plate 60 by the second liquid LC is recovered from the recovery port 32 together with the second liquid LC. Therefore, it is possible to suppress a part of the film Sf removed from the slit plate 60 or the second liquid LC including the dissolved film Sf from adhering (reattaching) to the member S.

  Further, since the control device 7 relatively moves the nozzle member 30 and the member S in a state where the immersion space is formed by the second liquid LC between the nozzle member 30 and the slit plate 60, the slit plate 60 The second liquid LC can be uniformly brought into contact with a wide area on the surface of the film, and the surface layer of the film Sf can be uniformly dissolved and removed. The removal of the surface layer of the film Sf may be performed over the entire surface of the film Sf, or may be performed only in a partial region of the surface of the film Sf.

  Then, by bringing the slit plate 60 and the second liquid LC into contact with each other for a predetermined time, as shown in FIG. 9C, the surface layer of the film Sf whose physical properties have changed, that is, the altered region Sc is all removed, and the desired physical properties ( The surface of the fresh film Sf having liquid repellency and surface energy is exposed. Thereby, the surface energy of the slit plate 60 is reduced, and the liquid repellency is restored. For example, the surface state of the slit plate 60 can be made substantially equal to the initial state before the exposure light EL is irradiated.

  Further, the control device 7 determines the time during which the slit plate 60 (film Sf) and the second liquid LC are in contact with each other, the concentration of the fluorinated solvent in the second liquid LC, and the flow rate (supply) of the second liquid LC to the slit plate 60 The slit plate 60 (film Sf) is controlled by controlling the amount of the second liquid LC supplied from the port 31 per unit time and the amount of the second liquid LC recovered from the recovery port 32 per unit time. Only the surface layer (only the altered region Sc) can be dissolved and removed. The contact time between the slit plate 60 (film Sf) and the second liquid LC, the concentration of the fluorinated solvent in the second liquid LC, and the flow rate of the second liquid LC with respect to the slit plate 60 (the second supplied from the supply port 31). Parameters such as the amount per unit time of the liquid LC and the amount per unit time of the second liquid LC recovered from the recovery port 32 can be determined in advance through experiments, simulations, and the like. In addition, since the thickness of the altered region Sc may change depending on the irradiation time and / or dose amount of the exposure light EL, the above parameters may be determined for the irradiation time and / or dose amount of the exposure light EL. Good.

  Then, after the maintenance of the slit plate 60 is completed, the control device 7 changes from the second supply mode to the first supply mode, and executes a normal sequence.

  The maintenance work reduces the surface energy of the slit plate 60 and increases the liquid repellency of the surface of the slit plate 60 with respect to the first liquid LQ, thereby suppressing the first liquid LQ from remaining on the surface of the slit plate 60. At the same time, when the slit plate 60 is moved in the XY directions with respect to the first optical element 8 and the nozzle member 30 (immersion space of the first liquid LQ) under predetermined movement conditions (including speed, acceleration, and movement direction). , The immersion space of the first liquid LQ (the shape of the immersion space of the first liquid LQ) is maintained in a desired state, and leakage of the first liquid LQ can be prevented.

  Next, an example of the operation when the exposure apparatus EX changes from the first supply mode to the second supply mode will be described with reference to FIGS. 10A, 10B, 10C, and 10D.

  FIG. 10A shows a state where the exposure apparatus EX is set to the first supply mode. As shown in FIG. 10A, for example, when the measurement using the slit plate 60 or the like or the exposure of the substrate P is executed, the control device 7 sets the valve mechanism 43 to the first supply mode. Thereby, the first liquid LQ (pure water) is supplied from the supply port 31, and the nozzle member 30 forms an immersion space between the slit plate 60 and the first liquid LQ supplied from the supply port 31. To do.

  When changing from the first supply mode to the second supply mode to maintain the slit plate 60, the control device 7 controls the valve mechanism 43 (or the first supply device 36) as shown in FIG. 10B. The supply of the first liquid LQ from the supply port 31 is stopped. Further, the control device 7 uses the recovery port 32 to recover all of the first liquid LQ in the immersion space.

  Next, as illustrated in FIG. 10C, the control device 7 controls the second supply device 40 to send only alcohol from the second supply device 40. Thereby, alcohol flows into the flow path of the supply pipe 35 and the supply flow path of the nozzle member 30, and the flow path of the supply pipe 35 and the supply flow path of the nozzle member 30 are filled with alcohol. Alcohol is supplied from the supply port 31, and an immersion space is formed by the alcohol. Further, the control device 7 performs an alcohol recovery operation from the recovery port 32 in parallel with the alcohol supply operation from the supply port 31. Thereby, the recovery flow path of the nozzle member 30, the flow path of the recovery pipe 37, and the like are filled with alcohol. As described above, when the control device 7 changes from the first supply mode to the second supply mode, the flow path (the flow path of the supply pipe 35) filled with the first liquid LQ (pure water) in the first supply mode. The supply channel of the nozzle member 30, the recovery channel, the channel of the recovery pipe 37, etc.) are replaced with alcohol that is the solvent of the second liquid LC before changing to the second supply mode.

  After the first liquid LQ is removed from the flow path and the flow path is replaced with alcohol, the control device 7 controls the second supply device 40 so as to be second from the second supply device 40 as shown in FIG. 10D. Liquid LC (maintenance liquid LC containing a predetermined concentration of fluorinated solvent) is delivered. Thereby, the flow path of the supply pipe 35, the supply flow path of the nozzle member 30, and the like are filled with the second liquid LC. The second liquid LC is supplied from the supply port 31, and an immersion space is formed by the second liquid LC supplied from the supply port 31. Further, the control device 7 performs a recovery operation of the second liquid LC from the recovery port 32 in parallel with the supply operation of the second liquid LC from the supply port 31. Thereby, the recovery flow path of the nozzle member 30, the flow path of the recovery pipe 37, and the like are filled with the second liquid LC.

  Alcohol is soluble in each of the first liquid LQ and the fluorinated solvent, and when changing from the first supply mode to the second supply mode, the first liquid LQ is excluded from the flow path, and the flow path is replaced with alcohol. Then, by changing to the second supply mode, for example, generation of precipitates (foreign matter) can be suppressed, and the first supply mode can be smoothly changed to the second supply mode. Moreover, the slit plate 60 can be maintained satisfactorily.

  Further, when changing from the second supply mode to the first supply mode, the control device 7 first controls the second supply device 40 to send only alcohol from the second supply device 40, and the flow path ( The flow path of the supply pipe 35, the supply flow path of the nozzle member 30, the recovery flow path, the flow path of the recovery pipe 37, etc.) are replaced with alcohol.

  After removing the second liquid LC (fluorine-based solvent) from the flow path and replacing the flow path with alcohol, the control device 7 controls the valve mechanism 43 (or the second supply device 40) from the supply port 31. The alcohol supply is stopped, and all of the alcohol in the immersion space is recovered using the recovery port 32.

  Then, the control device 7 sets the valve mechanism 43 to the first supply mode, and sends the first liquid LQ from the first supply device 36. Thereby, the flow path of the supply pipe 35, the supply flow path of the nozzle member 30, and the like are filled with the first liquid LQ. Further, the control device 7 performs a recovery operation of the first liquid LQ from the recovery port 32 in parallel with the supply operation of the first liquid LQ from the supply port 31. Thereby, the recovery flow path of the nozzle member 30, the flow path of the recovery pipe 37, and the like are filled with the first liquid LQ.

  Even when changing from the second supply mode to the first supply mode, by removing the second liquid LC from the flow path, replacing the flow path with alcohol, and changing to the first supply mode, for example, precipitates ( Generation of foreign matter) can be suppressed and the second supply mode can be smoothly changed to the first supply mode. Further, the substrate P can be exposed satisfactorily.

  In the present embodiment, the maintenance work for the slit plate 60 using the second liquid LC is periodically performed. Maintenance work for the slit plate 60 using the second liquid LC can be executed, for example, every time a predetermined number of substrates P are exposed, every lot, every predetermined time interval, and the like.

  In the above description, the case where the slit plate 60 is mainly maintained has been described as an example. However, the control device 7 is not limited to the slit plate 60 but the reference plate 50, the upper plate 70, the plate member T, and the substrate. The table 12 and the measurement table 22 can be moved (positioned) to positions facing the light exit surface of the first optical element 8, that is, positions where the exposure light EL from the first optical element 8 can be irradiated. A member capable of forming an immersion space for the first liquid LQ together with the first optical element 8 and the nozzle member 30 can be maintained using the second liquid LC.

  As described above, according to the present embodiment, the member S having a liquid repellent surface, such as the slit plate 60, has the member S even if the liquid repellency is reduced by exposure light EL or the like. By supplying the two liquid LC, the surface layer of the member S can be dissolved, the surface energy of the member S (film Sf) can be reduced, and the liquid repellency of the surface of the member S (film Sf) can be recovered. . Therefore, when performing the immersion exposure process or the measurement process for the immersion exposure process, the first liquid LQ remains on the member S by using the member S after the maintenance process with the second liquid LC. This can be suppressed, and the immersion space of the first liquid LQ can be maintained in a desired state. Therefore, the performance of the exposure apparatus EX can be maintained, and the device having the desired performance can be manufactured by satisfactorily exposing the substrate P while suppressing the occurrence of exposure failure.

  In the present embodiment, maintenance of the member S can be executed in the exposure apparatus EX. Therefore, unlike the conventional case, the surface of the member S with reduced liquid repellency can be obtained without replacing the member S with reduced liquid repellency and without stopping the operation of the exposure apparatus EX for a long time. The liquid repellency can be recovered. In addition, by performing the maintenance work several times, even if it is necessary to replace the member S having lowered liquid repellency, the frequency of the replacement can be suppressed. Therefore, it is possible to expose the substrate P satisfactorily while suppressing a decrease in the operating rate of the exposure apparatus EX and suppressing the occurrence of exposure failure.

  In the present embodiment, since the supply and recovery of the second liquid LC is performed using the nozzle member 30 used for recovery of the supply of the first liquid LQ, the number of parts is suppressed, and the structure of the apparatus is complicated. Can be suppressed.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 11 is a view showing an exposure apparatus EX according to the second embodiment. In FIG. 11, the exposure apparatus EX includes a second nozzle member 80 that is disposed at a position away from the nozzle member 30 and that can form an immersion space with the second liquid LC.

  In the present embodiment, the second nozzle member 80 is disposed on the + Y side of the first nozzle member 30, and while the substrate P held on the substrate stage 1 is exposed, the measurement stage 2 is the substrate stage. Move on the + Y side of 1.

  Each of the substrate stage 1 and the measurement stage 2 is on a guide surface GF including a position facing the light emission surface of the first optical element 8 and the lower surface of the nozzle member 30, and a position facing the lower surface of the second nozzle member 80. It can move within a predetermined area. The measurement stage 2 can move independently of the substrate stage 1 within a predetermined area on the guide surface GF.

  In the present embodiment, the nozzle member 30 is exclusively used for supplying and collecting the first liquid LQ, and is a member (substrate stage) disposed at a position facing the light emission surface of the first optical element 8 and the lower surface of the nozzle member 30. 1, at least one of the measurement stage 2 and the substrate P), the first optical element 8 and the nozzle member 30 define an immersion space for the first liquid LQ.

  The second nozzle member 80 is exclusively used for supply and recovery of the second liquid LC, and the member S (the substrate stage 1, the measurement stage 2, and the substrate P disposed at a position facing the lower surface of the second nozzle member 80). At least one) and the second nozzle member 80 define an immersion space for the second liquid LC. During the maintenance of the maintenance target member S, the second liquid LC is held between the member S and the second nozzle member 80 disposed at a position facing the lower surface of the second nozzle member 80.

  FIG. 12 is a diagram illustrating an example of the second nozzle member 80. In FIG. 12, the second nozzle member 80 has a supply port 81 that can supply the second liquid LC and a recovery port 82 that can recover the second liquid LC supplied to the member S from the supply port 81. The supply port 81 is formed substantially at the center of the lower surface of the second nozzle member 80. The recovery port 82 is formed on the lower surface of the second nozzle member 80 so as to surround the supply port 81.

  The second liquid LC is supplied to the supply port 81 from the second supply device 40 </ b> A via the supply flow path formed inside the second nozzle member 80 and the supply pipe 85. The recovery port 82 is connected to a liquid recovery device 38E capable of recovering at least the second liquid LC via a recovery flow path formed inside the second nozzle member 80 and a recovery pipe 88.

  As shown in FIG. 11, in this embodiment, the control device 7 arranges the substrate stage 1 at a position facing the light emission surface of the first optical element 8 and the lower surface of the nozzle member 30, and An operation of forming an immersion space with the first liquid LQ between the first optical element 8, the nozzle member 30, and the substrate stage 1 (substrate P) on the other side, and the measurement stage 2 as a lower surface of the second nozzle member 80. At least a part of the operation of forming the immersion space with the second liquid LC between the lower surface of the second nozzle member 80 and the measurement stage 2 can be executed in parallel. That is, in this embodiment, the control device 7 can perform the immersion exposure operation of the substrate P held on the substrate stage 1 and the maintenance operation for reducing the surface energy of the measurement stage 2 in parallel. it can.

  Therefore, the arrangement of the second nozzle member 80 in the present embodiment is effective when it is desired to frequently perform maintenance of the measurement stage 2.

  In the present embodiment, a member (nozzle member 30, supply pipe 35, recovery pipe 37, etc.) that forms a flow path through which the first liquid LQ (pure water) flows and a flow path through which the second liquid LC flows are formed. Members (second nozzle member 80, supply pipe 85, recovery pipe 88, etc.) can be separated. Since the first liquid LQ and the second liquid LC have different physical properties (material characteristics and types), a member that forms a flow path through which the first liquid LQ flows and a member that forms a flow path through which the second liquid LC flows are provided. By separating, a member that forms a flow path through which the first liquid LQ flows can be formed with a material suitable for the physical property of the first liquid LQ, and the second liquid LC flows with a material suitable for the physical property of the second liquid LC. A member for forming the flow path can be formed.

  For example, when the supply pipe 35 (or the recovery pipe 37) through which the first liquid LQ (pure water) flows is formed of PFA, the supply pipe 35 (or the recovery pipe 37) formed of the PFA includes a fluorine-based material. When the second liquid LC containing a solvent is flowed, for example, the supply pipe 35 (or the recovery pipe 37) may be damaged, or the eluate from the supply pipe 35 (or the recovery pipe 37) may be mixed with the second liquid LC. There is sex. In the present embodiment, since the supply pipe 35 (or the recovery pipe 37) through which the first liquid LQ flows and the supply pipe 85 (or the recovery pipe 88) through which the second liquid LC flows are separate members, the second liquid LC is The flowing supply pipe 85 (or the recovery pipe 88) is formed of a material suitable for the physical properties of the second liquid LC (a material that is not damaged by the second liquid LC and a material that does not affect the second liquid LC). Can do. For example, the supply pipe 85 (or the collection pipe 88) is formed by forming the supply pipe 85 (or the collection pipe 88) through which the second liquid LC flows with a metal such as stainless steel or titanium, or a synthetic resin such as polyethylene. It is possible to suppress damage from the liquid LC and the supply pipe 85 (or the recovery pipe 88) from affecting the second liquid LC. Similarly, each of the nozzle member 30 and the second nozzle member 80 can be formed of a material according to the physical properties of the first liquid LQ and the second liquid LC.

  In the present embodiment, the substrate stage 1 may be disposed at a position facing the second nozzle member 80, and the upper surface of the substrate stage 1 (plate member T) may be maintained using the second liquid LC. At this time, the measurement stage 2 may move to a position facing the first optical element 8 and the nozzle member 30.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 13 is a view showing an exposure apparatus EX according to the third embodiment. Similar to the second embodiment described above, the exposure apparatus EX includes a second nozzle member 80 and a nozzle member 30.

  In the present embodiment, the second nozzle member 80 is disposed on the −Y side of the first nozzle member 30, and the measurement stage 2 is disposed at a position facing the first optical element 8 and the nozzle member 30. The substrate stage 1 moves on the −Y side of the measurement stage 2 when it is in contact.

  As shown in FIG. 13, in the present embodiment, the control device 7 arranges the measurement stage 2 at a position facing the light emission surface of the first optical element 8 and the lower surface of the nozzle member 30, and the first optical element. The operation of forming the immersion space with the first liquid LQ between the nozzle 8, the nozzle member 30 and the measurement stage 2, and the substrate stage 1 is disposed at a position facing the lower surface of the second nozzle member 80, and the second nozzle At least a part of the operation of forming the immersion space with the second liquid LC between the lower surface of the member 80 and the substrate stage 1 (plate member T or the like) can be executed in parallel. That is, in the present embodiment, the measurement operation using the measurement stage 2 and the first liquid LQ and the maintenance operation for reducing the surface energy of the substrate stage 1 (plate member T, etc.) can be performed in parallel. it can.

  Therefore, the arrangement of the second nozzle member 80 in the present embodiment is effective when it is desired to frequently perform maintenance on the substrate stage 1.

  In addition, when the maintenance of the substrate stage 1 is performed using the second nozzle member 80, the first optical element 8 is not performed without performing the measurement operation using at least one of the measurement device of the measurement stage 2 and the measurement member. The first liquid LQ may be simply held between the measurement stage 2 and the measurement stage 2.

  Further, maintenance of the upper surface of the measurement stage 2 may be performed using the second nozzle member 80. At this time, the substrate stage 1 may be disposed at a position facing the first optical element 8 and the nozzle member 30.

  Of course, it is possible to combine the second embodiment and the third embodiment described above. That is, the second nozzle member 80 can be arranged on each of the + Y side and the −Y side of the projection optical system PL. Thereby, the maintenance operation for each of the substrate stage 1 and the measurement stage 2 can be smoothly executed at a predetermined timing.

  In each of the above-described embodiments, the maintenance operation for reducing the surface energy of the member S such as the slit plate 60 has been described so as to be executed periodically. However, is the surface energy of the member S reduced? Whether or not (the liquid repellency of the surface of the member S is deteriorated) may be detected, and the timing for performing the maintenance operation may be determined based on the result. For example, an image (optical image) of the surface of the member S is acquired by the alignment system ALG, and whether or not a maintenance operation for reducing the surface energy of the member S is executed based on the acquired image information (of the member S). Whether or not the liquid repellency of the surface has deteriorated may be determined. As described above, the alignment system ALG of the present embodiment has an image sensor such as a CCD and can acquire an image of the member S. When the surface energy of the member S is increased (when the liquid repellency of the surface of the member S is deteriorated), the member is removed even though the operation of removing the first liquid LQ from the surface of the member S is executed. There is a high possibility that the first liquid LQ (droplet) remains on the surface of S. Therefore, when the control device 7 determines that the first liquid LQ (droplet) remains on the surface of the member S based on the image information of the surface of the member S acquired using the alignment system ALG, the member It is determined (estimated) that the liquid repellency of the surface of S has deteriorated, and a maintenance operation for reducing the surface energy of the member S is executed. Further, a measuring device that measures the contact angle of the first liquid LQ droplet on the surface of the member S may be mounted on the exposure apparatus EX, and it may be determined whether or not to perform a maintenance operation based on the measurement result.

  In addition, whether or not to perform a maintenance operation for reducing the surface energy of the member S based on the detection result of the temperature sensor is provided in the member S, and a temperature sensor capable of detecting the temperature of the surface of the member S is provided. May be determined. When the surface energy of the member S is increased (when the liquid repellency of the surface of the member S is deteriorated), there is a high possibility that the first liquid LQ (droplet) remains on the surface of the member S. The temperature of the surface of the member S may change (decrease) greatly due to the vaporization of the remaining first liquid LQ. Therefore, when the control device 7 detects that the temperature of the surface of the member S has greatly changed based on the detection result of the temperature sensor, the liquid repellency of the surface of the member S deteriorates, and the member S It is determined (estimated) that the first liquid LQ (droplet) is likely to remain on the surface of the surface, and a surface treatment operation for reducing the surface energy of the member S is executed.

  In each of the above-described embodiments, a maintenance operation using the second liquid LC is performed in order to reduce the surface energy of the member S that has been increased mainly by irradiation with the exposure light EL. The target member S may be a member that is not irradiated with the exposure light EL. Even in a member that is not irradiated with the exposure light EL, the liquid repellency of the surface of the member may deteriorate over time, for example. Even in such a case, the surface having the desired liquid repellency is exposed by dissolving the surface layer of the member using the second liquid LC, and the liquid repellency of the surface of the member S can be recovered.

  In each of the above embodiments, the first liquid LQ remaining on the surface of the member S is a problem when the member S is moved with respect to the immersion space of the first liquid LQ. If the liquid repellency of the nozzle member 30 is deteriorated, the first liquid LQ remains on the surface of the member S even if the first liquid LQ is all collected using the collection port of the nozzle member 30. Maintenance of the member S is required in the same manner as each of the embodiments.

  In each of the above-described embodiments, the surface of the member S is formed of a material containing fluorine. However, the surface of the member S is formed of a material other than fluorine, such as silicon or acrylic. Also good. By forming the surface of the member S with a material containing silicon, acrylic or the like, the surface of the member S has liquid repellency. In this case, the second liquid LC to be used is appropriately selected according to the material forming the surface of the member S. That is, a substance capable of dissolving the surface layer of the member S is appropriately selected according to the material forming the surface of the member S. When the second liquid LC is obtained by dissolving a substance (solute) capable of dissolving the surface layer of the member S in a predetermined liquid (solvent), the concentration of the substance (solute) in the second liquid LC is adjusted. Thus, the surface layer of the member S can be dissolved well.

  In each of the above-described embodiments, removal of a part of the surface of the member S using the second liquid LC is not limited to dissolving a part of the surface of the member S with the second liquid LC.

  In each of the above embodiments, a part of the surface of the member S may be removed without using the second liquid LC. For example, a part of the surface of the member S may be removed using a grindstone or the like.

  In each of the above embodiments, the case where the first liquid LQ for filling the optical path space of the exposure light EL is water (pure water) has been described as an example. However, a liquid other than water may be used. . For example, the first liquid LQ having a refractive index of about 1.6 to 1.8 may be used. The first liquid LQ is stable with respect to the projection optical system PL or the photosensitive material film Rg forming the surface of the substrate P (for example, hydrofluoroether (HFE), perfluorinated polyether (PFPE)). ), Fomblin oil) can also be used. The surface (film Sf) of the member S is determined according to the first liquid LQ (physical properties of the first liquid LQ, etc.).

  In each of the above-described embodiments, the surface of the member S (50, 60, 70, T) is formed of the liquid repellent film Sf (50f, 60f, 70f, Tf). It may be formed of a material having liquid repellency. For example, the entire plate member T of the substrate table 12 may be formed of a material having liquid repellency, for example, a material including PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer). And the liquid repellency can be recovered by maintaining the surface of the plate member T by the maintenance method according to each of the embodiments described above.

  In each of the embodiments described above, the second liquid LC is supplied to the maintenance target member S in the exposure apparatus EX. However, the member S such as the slit plate 60 is transported out of the exposure apparatus EX, and exposure is performed. A maintenance operation for restoring liquid repellency may be performed using the second liquid LC outside the apparatus EX.

  In the projection optical systems of the above-described embodiments, the optical path space on the image surface (exit surface) side of the first optical element 8 at the front end is filled with liquid, but this is disclosed in International Publication No. 2004/019128. As described above, it is also possible to employ a projection optical system in which the optical path space on the object plane (incident plane) side of the first optical element 8 at the tip is filled with liquid.

  For example, quartz (silica), calcium fluoride (fluorite), barium fluoride, strontium fluoride, lithium fluoride, and fluoride are used as the optical elements (such as the optical element 8) of the projection optical system PL that come into contact with the liquid. You may form with the single crystal material of fluoride compounds, such as sodium. Furthermore, the optical element may be formed of a material having a higher refractive index than quartz and fluorite (for example, 1.6 or more). Examples of the material having a refractive index of 1.6 or more include sapphire, germanium dioxide, etc. disclosed in International Publication No. 2005/059617 pamphlet, or potassium chloride (refractive index disclosed in International Publication No. 2005/059618 pamphlet). The rate can be about 1.75) or the like. Furthermore, a thin film having a lyophilic property and / or a dissolution preventing function may be formed on a part (including at least a contact surface with a liquid) or the entire surface of the optical element. Quartz has a high affinity with a liquid and does not require a dissolution preventing film, but fluorite can form at least a dissolution preventing film.

  In each of the above-described embodiments, the position information of the mask stage, the substrate stage, and the measurement stage is measured using a measurement system (interferometer system) including a laser interferometer. However, the present invention is not limited to this. For example, an encoder system that detects a scale (diffraction grating) provided in each stage may be used. In this case, it is preferable that a hybrid system including both the interferometer system and the encoder system is used, and the measurement result of the encoder system is calibrated using the measurement result of the interferometer system. Further, the position of the stage may be controlled by switching between the interferometer system and the encoder system or using both.

  In the above-described embodiment, the configuration of the liquid immersion system such as the nozzle member is not limited to the above-described one. For example, International Publication No. 2004/0886468 (corresponding to US Patent Application Publication No. 2005/0280791), International Publication No. 2005. The immersion system disclosed in the pamphlet of / 024517 can also be used.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or a film member is applied. Further, the shape of the substrate is not limited to a circle, and may be another shape such as a rectangle.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention also includes a plurality of (two) substrate stages as disclosed in US Pat. No. 6,590,634, US Pat. No. 6,262,796, US Pat. No. 6,208,407, and the like. The present invention can also be applied to multi-stage (twin stage) exposure apparatuses.

  The present invention can also be applied to an exposure apparatus that does not include a measurement stage, as disclosed in WO99 / 49504. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  In the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in JP-A-6-124873 and JP-A-10. -303114, US Pat. No. 5,825,043, etc., and can be applied to an immersion exposure apparatus that performs exposure in a state where the entire surface of the substrate to be exposed is immersed in the liquid. is there.

  Further, in each of the above-described embodiments, the case where the exposure apparatus EX is an immersion exposure apparatus that performs exposure processing and measurement processing via the first liquid LQ has been described as an example. However, the first liquid LQ is used. An ordinary dry exposure apparatus may be used. Even in the case of a dry exposure apparatus, when the surface energy of a member having a liquid repellent surface is desired to be reduced, the maintenance using the second liquid LC described in the above embodiments can be performed.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, an electronic mask (also referred to as a variable shaping mask, for example, a non-uniform mask) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. A light emitting image display element (including DMD (Digital Micro-mirror Device) which is a kind of Spatial Light Modulator (SLM)) may be used. An exposure apparatus using DMD is disclosed in, for example, US Pat. No. 6,778,257.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  Further, as disclosed in, for example, Japanese translations of PCT publication No. 2004-51850 (corresponding US Pat. No. 6,611,316), two mask patterns are synthesized on a substrate via a projection optical system. The present invention can also be applied to an exposure apparatus that double-exposes one shot area on a substrate almost simultaneously by multiple scanning exposures.

As long as it is permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated herein by reference.
Moreover, you may combine the structure of each above-mentioned embodiment suitably.

  As described above, the exposure apparatus EX of the above embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 14, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 including substrate processing (exposure processing) for exposing the mask pattern to the substrate and developing the exposed substrate according to the above-described embodiment, device assembly step (dicing process, bonding process, (Including a processing process such as a packaging process) 205, an inspection step 206, and the like.

Claims (41)

An exposure apparatus maintenance method for exposing a substrate with exposure light through a first liquid,
The exposure apparatus includes a member having a liquid repellent surface with respect to the first liquid,
A maintenance method for removing a part of the surface of the member.   The maintenance method according to claim 1, wherein a part of the surface of the member is removed by supplying a second liquid to the surface of the member.   The maintenance method according to claim 1 or 2, wherein removing a part of the surface of the member includes dissolving a part of the surface of the member with the second liquid.   The maintenance method according to claim 3, wherein the second liquid is obtained by dissolving a substance capable of dissolving a part of the surface of the member in a predetermined liquid.   The maintenance method according to claim 2, wherein the second liquid contains a fluorine-containing solvent.   The maintenance method according to claim 5, wherein the second liquid is obtained by dissolving the solvent in alcohol.   The maintenance method according to claim 2, wherein the second liquid supplied to the member is recovered.   The maintenance method according to claim 1, wherein a part of the surface of the member is removed after the surface energy of the member is increased by irradiation with the exposure light.   The maintenance method according to claim 1, wherein the surface energy of the member is reduced by removing a part of the surface of the member.   The maintenance method according to claim 1, wherein the liquid repellency of the surface of the member is recovered by removing a part of the surface of the member.   The maintenance method according to any one of claims 1 to 10, wherein the surface of the member includes a surface of a film of a material containing fluorine.   The maintenance method according to any one of claims 1 to 11, wherein a part of the surface of the member includes a surface layer of the member.   The maintenance method according to any one of claims 1 to 12, wherein a part of the surface of the member is removed over the entire surface of the member. An exposure method for exposing a substrate with exposure light through a first liquid,
Irradiating the surface of a member disposed at a position where the exposure light can be irradiated and having liquid repellency with respect to the first liquid;
Removing a part of the surface of the member. The exposure light transmitted through the member or reflected by the member is received, and a predetermined measurement is performed.
The exposure method according to claim 14, wherein the substrate is exposed based on the measurement result.   The exposure according to claim 14 or 15, wherein removing a part of the surface of the member includes dissolving a surface layer of the surface of the member by supplying a second liquid to the surface of the member. Method. Exposing the substrate using the exposure method according to any one of claims 14 to 16,
Developing the exposed substrate. A device manufacturing method comprising: An exposure apparatus that exposes a substrate with exposure light through a first liquid,
A member that is movable to a position where the exposure light can be irradiated and has a liquid repellent surface with respect to the first liquid;
An exposure apparatus comprising: a supply port that supplies a second liquid for removing a surface layer of the member to the surface of the member.   The exposure apparatus according to claim 13, wherein the surface energy of the member is reduced by supplying the second liquid.   The exposure apparatus according to claim 18 or 19, wherein the second liquid is obtained by dissolving a solvent containing fluorine in alcohol.   21. The exposure apparatus according to claim 18, further comprising a first liquid immersion member capable of forming an immersion space between the second liquid supplied from the supply port and the member.   The first liquid immersion member forms an immersion space with the first liquid between the first liquid and the substrate so that an optical path space of the exposure light is filled with the first liquid when the substrate is exposed. The exposure apparatus described.   The liquid immersion space is disposed between the substrate and the first liquid immersion member so as to fill an optical path space of the exposure light with the first liquid during exposure of the substrate. The exposure apparatus according to claim 21, further comprising a second immersion member that forms Forming an immersion space with the second liquid by the first immersion member;
24. The exposure apparatus according to claim 23, wherein the immersion space is formed in parallel with the first liquid by the second immersion member.   25. The device according to claim 21, wherein the first liquid immersion member and the member are relatively moved in a state where the liquid immersion space is formed with the second liquid between the first liquid immersion member and the member. The exposure apparatus according to any one of the above.   26. The exposure apparatus according to claim 18, further comprising a recovery port that recovers the second liquid supplied from the supply port to the member. An exposure apparatus that exposes a substrate with exposure light through a first liquid,
A member that is movable to a position where the exposure light can be irradiated and has a liquid repellent surface with respect to the first liquid;
An exposure apparatus comprising: a removing device that removes a part of the surface of the member.   28. The exposure apparatus according to claim 27, wherein the removing device has a supply port capable of supplying a second liquid for removing a part of the surface of the member to the surface of the member.   29. The exposure apparatus according to claim 28, wherein the removing device dissolves a part of the surface of the member with the second liquid.   30. The exposure apparatus according to any one of claims 27 to 29, wherein the removing device reduces surface energy of the member by removing a part of the surface of the member.   31. The exposure apparatus according to claim 27, wherein the removing device recovers the liquid repellency of the surface of the member by removing a part of the surface of the member. A detection device for detecting deterioration of the liquid repellency of the surface of the member;
32. The exposure apparatus according to claim 31, wherein it is determined whether or not a part of the surface of the member is to be removed using the removal device based on a detection result of the detection device.   The exposure apparatus according to any one of claims 18 to 32, wherein the surface of the member includes a surface of a film of a material containing fluorine. An optical member having a light exit surface for emitting the exposure light;
34. The exposure apparatus according to any one of claims 18 to 33, wherein the member is movable within a predetermined area including a position facing a light exit surface of the optical member.   35. The exposure apparatus according to claim 34, wherein the member includes at least a part of a measurement stage that is movable with a measuring instrument capable of performing measurement relating to exposure.   36. The exposure apparatus according to claim 35, wherein the member is releasably held on the measurement stage.   37. The exposure apparatus according to claim 34, wherein the member includes at least a part of a substrate stage that is movable while holding the substrate.   38. The exposure apparatus according to claim 37, wherein the member is releasably held on the substrate stage.   39. The exposure apparatus according to claim 37 or 38, wherein the member forms a flat portion around the substrate held by the substrate stage.   40. The exposure apparatus according to any one of claims 34 to 39, wherein the member includes a measurement member that is irradiated with the exposure light. Exposing the substrate using the exposure apparatus according to any one of claims 18 to 39;
Developing the exposed substrate. A device manufacturing method comprising:

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