JP2014060217A - Exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of suppressing occurrence of poor exposure.SOLUTION: An upper surface of a substrate is irradiated with an exposure light through liquid. The exposure device has a substrate holding device which includes an optical member having an emission surface to which an exposure light is emitted, a first holding section for holding a substrate releasably, and a first member having an edge section being a part of an upper surface and an outer edge of the upper surface which is opposed to the edge of the substrate to be held along the circumferential direction. The edge section of the first member has a plurality of projection sections projecting towards the held substrate formed along the circumferential direction. The edge section has a first area in which the projection section having a first form is arranged, and a second area in which the projection section having a second form different from the first form is arranged.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used. The exposure apparatus includes a substrate stage that is movable while holding a substrate, and exposes the substrate held on the substrate stage.

US Patent Application Publication No. 2008/0043211 US Patent Application Publication No. 2008/0100812

  In the immersion exposure apparatus, for example, if the liquid remains on at least one of the upper surface of the substrate and the upper surface of the substrate stage, an exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method, a program, and a recording medium that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided an exposure apparatus that irradiates an upper surface of a substrate with exposure light through a liquid, the optical member having an emission surface from which the exposure light is emitted, and a substrate that can be released. And a first member having an upper surface and a first member having an edge portion which is a part of an outer edge of the upper surface and is opposed to an end portion of the held substrate in the circumferential direction. The edge portion of the first member is formed with a plurality of protrusion portions that protrude toward the held substrate along the circumferential direction, and the edge portion is provided with a protrusion portion having a first shape. An exposure apparatus is provided that includes the first region formed and a second region in which protrusions having a second shape different from the first shape are disposed.

  According to the second aspect of the present invention, there is provided an exposure apparatus that irradiates an upper surface of a substrate with exposure light through a liquid, and an optical member having an emission surface from which the exposure light is emitted, and the substrate is releasably held. And a substrate holding device including a first member having an upper surface and an edge portion defining a part of an outer edge of the upper surface, and adjacent to the first member with a gap below the optical member. A second member having a second upper surface that is movable in a state and capable of forming an immersion space, and an edge portion of the first member follows an end portion of the substrate held by the first holding portion. A first edge portion extending in a predetermined direction and a second edge portion extending in a direction in which a gap between the second member and the second member extends. The second member defines a part of the outer edge of the second upper surface, and the second edge. A third edge portion facing the portion, a second edge portion of the first member, and a third edge of the second member. At least one is a di-section, the exposure apparatus is provided which protrusion protruding toward the other side is formed along the extending direction.

  According to the third aspect of the present invention, there is provided an exposure apparatus that irradiates an upper surface of a substrate with exposure light through a liquid, and an optical member having an emission surface from which the exposure light is emitted, and the substrate is releasably held. And a first member having an upper surface and an edge portion which is a part of an outer edge of the upper surface and is opposed to an end portion of the substrate held in the circumferential direction. The first member is formed with an opening in which the measurement member is arranged, and the opening is formed with a plurality of protrusions protruding toward the arranged measurement member along the opening. An exposure apparatus having two regions is provided.

  According to a fourth aspect of the present invention, there is provided a device comprising: exposing a substrate using the exposure apparatus according to any one of the first to third aspects of the present invention; and developing the exposed substrate. A manufacturing method is provided.

  According to a fifth aspect of the present invention, there is provided an exposure method for irradiating an upper surface of a substrate with exposure light through a liquid, the optical member having an emission surface from which the exposure light is emitted, and the substrate being held releasably. A first member having an upper surface of the substrate held by the first holding portion and an edge portion which is a part of an outer edge of the upper surface and is opposed to an end portion of the held substrate in the circumferential direction. Exposing the substrate in a state where an immersion space is formed with a liquid between at least one of the upper surfaces of the first member and the edge portion of the first member protrudes toward the held substrate A plurality of protruding portions are formed side by side along the circumferential direction, and the edge portion is provided with a first region where the protruding portion having the first shape is arranged, and a protruding portion having a second shape different from the first shape. An exposure method having a second region is provided.

  According to a sixth aspect of the present invention, there is provided an exposure method for irradiating an upper surface of a substrate with exposure light through a liquid, the optical member having an emission surface from which the exposure light is emitted, and the substrate being held releasably. The first member having the upper surface of the substrate held by the first holding portion and the edge portion defining the upper surface and a part of the outer edge of the upper surface is in contact with at least a part of the first upper surface. Moving the second member below the optical member, and moving the second member below the optical member in a state adjacent to the first member via the gap below the optical member. The portion includes a first edge portion extending in a predetermined direction so that an end portion of the substrate held by the first holding portion is along, and a second edge portion extending in the extending direction of the gap between the second member and the second edge portion. The member defines a part of the outer edge of the second upper surface and faces the second edge portion. An exposure that includes an edge portion, and at least one of the second edge portion of the first member and the third edge portion of the second member has a protruding portion that protrudes toward the other side along the extending direction. A method is provided.

  According to a seventh aspect of the present invention, there is provided an exposure method for irradiating an upper surface of a substrate with exposure light through a liquid, the optical member having an emission surface from which the exposure light is emitted, and the substrate being held releasably. A first member having an upper surface of the substrate held by the first holding portion and an edge portion which is a part of an outer edge of the upper surface and is opposed to an end portion of the held substrate in the circumferential direction. Exposing the substrate in a state where an immersion space is formed with a liquid between at least one of the upper surfaces of the first member, and an opening in which the measurement member is disposed is formed in the first member. Is provided with an exposure method having a second region in which a plurality of protrusions protruding toward the arranged measurement member are formed side by side along the opening.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

1 is a schematic block diagram that shows an example of an exposure apparatus EX according to a first embodiment. The figure which shows an example of the liquid immersion member and substrate stage which concern on 1st Embodiment. The figure which expanded a part of FIG. FIG. 3 is a plan view in which a substrate P and a cover member T are held on the substrate stage 2. FIG. 3 is an enlarged plan view around a notch PN in a substrate P. Detailed drawing of convex part GZ. FIG. 10 is a schematic block diagram that shows one example of an exposure apparatus EX according to a second embodiment. The top view of the substrate stage in the same exposure apparatus EX. The figure which shows the other form of a convex part. The figure which shows the other form of a 1st convex part. The figure which shows an example of a substrate stage. The flowchart which shows an example of the manufacturing process of a device.

  Hereinafter, embodiments of the exposure apparatus, the exposure method, and the device manufacturing method of the present invention will be described with reference to FIGS. 1 to 11, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that can be moved by mounting a measurement member C and a measuring instrument, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, and a drive system 6 that moves the measurement stage 3 And an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of the optical path of the exposure light EL The immersion member 7 capable of forming the immersion space LS so as to be filled with the liquid LQ, the control device 8 for controlling the overall operation of the exposure apparatus EX, and the control device 8 for storing various information relating to exposure. And a storage device 8R that. The storage device 8R includes, for example, a memory such as a RAM, a recording medium such as a hard disk and a CD-ROM. In the storage device 8R, an operating system (OS) for controlling the computer system is installed, and a program for controlling the exposure apparatus EX is stored.

  Further, the exposure apparatus EX includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. The detection system 300 includes an alignment system 302 that detects an alignment mark on the substrate P, and a surface position detection system 303 that detects the position of the upper surface (surface) Pa of the substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  Further, the exposure apparatus EX includes a chamber apparatus 103 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space 102 in which the exposure light EL travels. The chamber apparatus 103 includes a chamber member 104 that forms the space 102, and an air conditioning system 105 that adjusts the environment of the space 102.

  The space 102 includes a space 102A and a space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 includes an air supply unit 105S that supplies gas to the spaces 102A and 102B, and supplies the gas from the air supply unit 105S to the spaces 102A and 102B to adjust the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are arranged in the space 102A.

  The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 can be moved to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C. The substrate stage 2 and the measurement stage 3 can move independently on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion (substrate holding portion) 31 that holds the lower surface Pb of the substrate P so as to be releasable, and an opening Th in which the substrate P can be disposed. And an upper surface disposed around the upper surface Pa of the substrate P in a state of being held by the holding unit 31.

  In the present embodiment, the substrate stage 2 is arranged around the first holding unit 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. And a second holding portion 32 that holds the lower surface Tb of the cover member T in a releasable manner. The cover member T is disposed around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding portion 31 is disposed. In the present embodiment, the cover member T has an upper surface 2U.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the upper surface Pa of the substrate P and the XY plane are substantially parallel. The second holding part 32 holds the cover member T so that the upper surface 2U of the cover member T and the XY plane are substantially parallel. In the present embodiment, the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U of the cover member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is).

  The cover member T may be formed integrally with the substrate stage 2. For example, at least a part of the substrate stage 2 may have the upper surface 2U. In the present embodiment, the opening Th in the cover member T is provided with a convex portion (also referred to as “protruding portion”; hereinafter the same) that projects toward the side surface Pc of the substrate P. It will be described later.

  In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the cover member Q so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck mechanism. The cover member Q is disposed around the measurement member C held by the third holding unit 33. The holding mechanism used at least one of the third holding part 33 and the fourth holding part 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the cover member Q may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding portion 34 holds the cover member Q so that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the cover member Q held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measuring member C held by the third holding unit 33. In addition, the upper surface of the cover member Q held by the fourth holding portion 34 is appropriately referred to as the upper surface 3U of the measurement stage 3.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11 </ b> A can measure the position of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R arranged on the substrate stage 2 and the measurement mirror 3R arranged on the measurement stage 3.

  The alignment system 302 detects the alignment mark of the substrate P and detects the position of the shot region (exposure region) S of the substrate P. The alignment system 302 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the alignment system 302 facing the −Z direction.

  The surface position detection system 303 is also called, for example, an autofocus / leveling system, and detects the position of the upper surface Pa of the substrate P by irradiating the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 with detection light. To do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing the −Z direction.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 drives the drive systems 4, 5, 5 based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to perform position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is formed on the emission surface 13 side. The immersion space LS is formed so that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The exit surface 13 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. The emission surface 13 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 7 has a lower surface 14 at least partially facing the −Z direction. In the present embodiment, the emission surface 13 and the lower surface 14 can hold the liquid LQ with an object arranged at a position (projection region PR) where the exposure light EL emitted from the emission surface 13 can be irradiated. . The immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and the object arranged in the projection region PR. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 13 and the object arranged in the projection region PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ with the object so that the optical path K of the exposure light EL between the terminal optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, the objects that can be arranged in the projection region PR include objects that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12). The object is movable with respect to the last optical element 12 and the liquid immersion member 7. The object has an upper surface (surface) that can face at least one of the emission surface 13 and the lower surface 14. An immersion space LS can be formed between the upper surface of the object and the emission surface 13. The object is movable in a plane (XY plane) perpendicular to the optical axis (Z axis) of the last optical element 12. In the present embodiment, an immersion space LS can be formed between the upper surface of the object and at least a part of the emission surface 13 and the lower surface 14. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the upper surface (front surface) of the object on the other side, the optical path K of the exposure light EL between the last optical element 12 and the object is changed. An immersion space LS is formed so as to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held on the substrate stage 2 are the exit surface 13 of the last optical element 12 facing the −Z direction and the liquid immersion facing the −Z direction. The lower surface 14 of the member 7 can be opposed. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. Further, these objects can face at least a part of the detection system 300.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ with the substrate P so that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. FIG. 3 is an enlarged view of a part of FIG. In FIG. 2, the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7), but as described above, the substrate stage 2 (cover member T), and The measurement stage 3 (cover member Q, measurement member C) can also be arranged.

  As shown in FIG. 2, the liquid immersion member 7 includes at least a part 71 facing the exit surface 13 of the last optical element 12 and a main body 72 at least partly disposed around the last optical element 12. Including. The facing portion 71 has a hole (opening) 7 </ b> K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least partially facing the emission surface 13 via a gap, and a lower surface 7H on which the substrate P (object) can face. The hole 7K is formed so as to connect the upper surface 7U and the lower surface 7H. The upper surface 7U is disposed around the upper end of the hole 7K, and the lower surface 7H is disposed around the lower end of the hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and irradiate the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is disposed around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

  Further, the liquid immersion member 7 includes a supply port 15 that can supply the liquid LQ and a recovery port 16 that can recover the liquid LQ. The supply port 15 supplies the liquid LQ when the substrate P is exposed, for example. The recovery port 16 recovers the liquid LQ, for example, when the substrate P is exposed. The supply port 15 can supply the liquid LQ during one or both of the exposure and non-exposure of the substrate P. Note that the recovery port 16 can recover the liquid LQ during one or both of exposure and non-exposure of the substrate P.

  The supply port 15 is disposed so as to face the optical path K in the vicinity of the optical path K of the exposure light EL emitted from the emission surface 13. The supply port 15 only needs to face one or both of the space between the exit surface 13 and the opening 7K and the side surface of the last optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to the space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and then is supplied onto the substrate P (object) through the opening 7K.

  The supply port 15 is connected to a liquid supply device (first liquid supply device) 18 via a flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The channel 17 includes a supply channel 17 </ b> R formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel 17 </ b> R and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The collection port 16 is disposed at least at a part around the opening 7K through which the exposure light EL passes. In the present embodiment, the collection port 16 is disposed at least at a part around the holding surface 7H. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 72 has an opening 7P that faces the substrate P (object). The opening 7P is disposed at least at a part around the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 disposed in the opening 7P. In the present embodiment, the porous member 19 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H on which the substrate P (object) can face, an upper surface 19U facing in the opposite direction of the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is disposed on at least a part of the periphery of the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes a holding surface 7H and a lower surface 19H.

  In the present embodiment, the recovery port 16 includes a hole of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 16) of the porous member 19. Note that the porous member 19 may not be disposed.

  The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to a vacuum system, and can suck the liquid LQ through the recovery port 16. The channel 20 includes a recovery channel 20R formed inside the liquid immersion member 7 and a channel formed by a recovery pipe that connects the recovery channel 20R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  As shown in FIGS. 2 and 3, in the present embodiment, the substrate stage 2 has a space portion 23 that communicates with a gap (gap) Ga between the substrate (object) P and the cover member T (substrate stage 2). . The space 23 is located below the gap Ga. The gap Ga is formed between the side surface Pc of the substrate P held by the first holding unit 31 and the inner surface Tc of the cover member T held by the second holding unit 32 that face each other. The inner surface Tc is arranged in parallel with the side surface Pc of the substrate P and the upper end is connected to the upper surface Ta, and the first inner surface Td is disposed below the first inner surface Td in parallel with the first inner surface Td. And an inclined surface Ts that is inclined downward toward the outside toward the center.

  A porous member 80 is disposed in the space 23. In the present embodiment, the porous member 80 has an upper surface 80A that can face at least one of the injection surface 13 and the lower surface 14. The upper surface 80A is disposed below the substrate P and the cover member T (−Z side). In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed by, for example, a sintering method. In the present embodiment, at least a part of the liquid LQ flowing into the gap Ga is recovered through the porous member 80.

  In the present embodiment, the porous member 80 is supported by the case 81. The case 81 is disposed in the space part 23. In the present embodiment, the case 81 is made of, for example, ceramic. The case 81 may be made of metal. The case 81 is not necessarily essential and may be omitted. In that case, the porous member 80 is accommodated in the space 23 without the case 81 therebetween.

  In the present embodiment, a support member 82 is disposed between the porous member 80 and the case 81 and the cover member T. The support member 82 is supported by at least a part of the porous member 80 and the case 81. The support member 82 can face at least a part of the lower surface Tb of the cover member T. The support member 82 supports at least a part of the lower surface Tb of the cover member T.

  In the present embodiment, the substrate stage 2 has a suction port 24 disposed in the space 23. In the present embodiment, the suction port 24 is formed on at least a part of the inner surface of the substrate stage 2 that forms the space 23. The suction port 24 sucks at least a part of the fluid in the space portion 23 so that the space portion 23 has a negative pressure. The suction port 24 can suck one or both of the liquid and gas in the space 23.

  The suction port 24 is connected to the fluid suction device 26 via the flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suck one or both of liquid and gas through the suction port 24. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of liquid and gas) sucked from the suction port 24 is sucked into the fluid suction device 26 via the flow path 25.

  In the present embodiment, the case 81 has a hole (opening) 81 </ b> H that connects the outer surface and the inner surface of the case 81. The opening 83 at the upper end of the hole 81 </ b> H faces the lower surface of the porous member 80. The opening at the lower end of the hole 81H is connected to the suction port 24. The suction port 24 can suck the fluid in the space inside the case 81 through the hole 81H so that the space inside the case 81 has a negative pressure.

  In the present embodiment, the first holding unit 31 has, for example, a pin chuck mechanism. The first holding portion 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall portion 35 that can be opposed to the lower surface Pb of the substrate P, and the support surface 31S on the inner side of the peripheral wall portion 35, and includes a plurality of pin members. The support portion 36 includes a suction port 37 that is disposed on the support surface 31S and sucks fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space in at least a part between the lower surface Pb of the substrate P. Note that, in the support surface 31, the peripheral wall portion 35 is substantially circular, and the center of the first holding portion 31 is the center of the peripheral wall portion 35 in the above description and the following description. In the present embodiment, the peripheral wall portion 35 is substantially circular (annular) in the XY plane. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall portion 35 are in contact with each other, whereby the peripheral wall portion 35, the lower surface Pb of the substrate P, the support surface 31S, and the like. The space 31H formed by can be set to a negative pressure. As a result, the substrate P is held by the first holding unit 31. In addition, the substrate P is released from the first holding unit 31 by releasing the suction operation of the suction port 37.

  In this embodiment, the lower surface of the board | substrate P is hold | maintained at the upper end of the support part 36 (a some pin member) by making the space 31H into a negative pressure. That is, at least a part of the holding surface 36S that holds the substrate P is defined by the upper end of the support portion 36 (a plurality of pin members).

  In the present embodiment, the second holding unit 32 has, for example, a pin chuck mechanism. The second holding part 32 is arranged so as to surround the peripheral wall part 35 on the support surface 32S of the substrate stage 2, and surrounds the peripheral wall part 38 on the support surface 32S so that the lower surface Tb of the cover member T can be opposed. And a support surface 40 that includes a plurality of pin members, and a support surface that is disposed on the support surface 32S between the peripheral wall portion 39 and the peripheral wall portion 39. And a suction port 41 for sucking fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space in at least a portion between the lower surface Tb of the cover member T. The control device 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other, whereby the peripheral wall portion 38, the peripheral wall portion 39, and the cover member T The space 32H formed by the lower surface Tb and the support surface 32S can be set to a negative pressure. Thereby, the cover member T is held by the second holding portion 32. Further, the cover member T is released from the second holding portion 32 by releasing the suction operation of the suction port 41.

  The space portion 23 includes a space around the peripheral wall portion 35. In the present embodiment, the space portion 23 includes a space between the peripheral wall portion 35 and the peripheral wall portion 38.

FIG. 4 is a plan view in which the substrate P and the cover member T are held on the substrate stage 2.
As shown in FIG. 4, the edge portion EG that defines the opening Th around the Z axis in the cover member T protrudes toward the side surface Pc (see FIG. 3) of the substrate P held by the first holding portion 31. Protruding portions (projecting portions) GZ are provided. In other words, as shown in FIG. 4, the opening Th in the cover member T has a shape (so-called “saw saw”) in which a plurality of convex portions GZ are arranged at a predetermined pitch along the circumferential direction when viewed from the Z direction. ")". In other words, the opening Th in the cover member T has a shape in which a plurality of recesses are arranged at a predetermined pitch along the circumferential direction when viewed from the tip (described later).

FIG. 5 is an enlarged plan view of the periphery of the notch PN in the substrate P.
The convex portion GZ is formed at the −X side edge of the substrate P, and is disposed in the region A1 facing the notch portion PN serving as an index related to the position of the substrate P, and the other region A2. 2nd convex part GZ2 distribute | arranged to. As shown in FIG. 5, in the region A1 (also referred to as the first region), the concave portion and the convex portion are not repeated, whereas in the region A2 (also referred to as the second region), a plurality of convex portions are formed. The portions are arranged in the circumferential direction at a predetermined pitch PZ (described later). In other words, the width W (described later) of the tip portion Tf of the first convex portion GZ1 in the region A1 is larger than the width W of the tip portion of the second convex portion GZ2 in the region A2. Note that the first convex portion GZ1 in the region A1 is not necessarily limited to this form, and for example, even if a plurality of convex portions are arranged at a pitch ZP (described later) that is finer than the second convex portion GZ2. Alternatively, the protrusion amount ZL (described later) may be smaller than the second convex portion GZ2. As described above, in this embodiment, the edge portion EG that defines the opening Th in the cover member T has the region A1 and the region A2 along the circumferential direction, and the convex portions having different shapes in the respective regions are provided. Is formed.

FIG. 6 is a detailed view of the convex portion GZ.
The convex portion GZ has a size of the arc portion R formed on the base Te (a portion farthest from the placed substrate P in the convex portion GZ), a length h from the center of the arc portion R to the tip portion, It is indicated by the specifications (shape) including the protrusion amount ZL indicated by the sum of the size and length h of the arc portion R, the width W of the tip portion, and the arrangement pitch ZP. As for the first convex portion GZ1, the width W1 of the front end portion (see FIG. 5) is formed in a range including the opening width of the notch portion PN of the substrate P. In this case, as shown in FIG. In the convex portion GZ, ZP ≦ W is set, and the convex portion GZ may be set with the specifications shown by the following expression (1).
W1 = n * W- (n-1) * (W-ZP) (1)
n: Number of convex portions GZ (positive integer)

In addition, when the gap Ga between the substrate P and the cover member T is, for example, 200 μm, as the suitable specifications of the second convex portion GZ2, the length h is 0.3 to 0.8 mm, and the arc portion R is 0.05 to 0.15 mm, pitch ZP is 0.3 to 1.0 mm, width W is 0.1 to 0.5 mm, and protrusion amount ZL is 0.35 to 0.95 mm. In this case, a suitable ratio between the length h and the pitch ZP is about 0.3 to 1.5. Thus, the 1st convex part GZ1 and the 2nd convex part GZ2 have the item from which the pitch ZP differs at least. Further, the inner surfaces Tc of the first and second convex portions GZ1 and GZ2 have the first inner surface Td and the inclined surface Ts described above with reference to FIG.
As shown in FIG. 6, when the liquid repellent film HM is formed on the surface of the cover member T with a film thickness of 20 μm, for example, the protrusions GZ1 and GZ2 are offset (added) with the film thickness. ).

Next, an example of the operation of the exposure apparatus EX will be described.
The control device 8 moves the substrate stage 2 to the exposure position, and after the immersion space LS is formed with the liquid LQ between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 (substrate P), The exposure process for the substrate P is started.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. As a result, the substrate P is exposed with the exposure light EL through the liquid LQ, and the pattern image of the mask M is projected onto the substrate P through the projection optical system PL and the liquid LQ.

  As shown in FIG. 4, in the present embodiment, a plurality of shot regions S that are exposure target regions are arranged on the substrate P in a matrix. The control device 8 sequentially exposes a plurality of shot areas S determined on the substrate P.

  When exposing the shot region S of the substrate P, the terminal optical element 12 and the liquid immersion member 7 and the substrate P are opposed to each other, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. When sequentially exposing the plurality of shot regions S of the substrate P, the immersion space LS is filled with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Is formed, the substrate stage 2 is moved in the XY plane by the drive system 5. In the state where the immersion space LS is formed with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2, the control device 8 While moving the stage 2, the substrate P is exposed.

  For example, in order to expose the first shot area S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to the exposure start position. The control device 8 moves the first shot region S (substrate P) in the Y-axis direction with respect to the projection region PR of the projection optical system PL while the immersion space LS is formed. The exposure light EL is irradiated to the shot area S.

  After the exposure of the first shot area S is completed, in order to expose the next second shot area S, the control device 8 moves the substrate P in the X-axis direction (with the immersion space LS formed) Alternatively, the second shot region S is moved to the exposure start position by moving in the direction inclining with respect to the X-axis direction in the XY plane. The control device 8 exposes the second shot area S in the same manner as the first shot area S.

  The control device 8 finishes the operation (scan exposure operation) of irradiating the shot region S with the exposure light EL while moving the shot region S in the Y-axis direction with respect to the projection region PR, and the exposure of the shot region S. Thereafter, while repeating the operation (stepping operation) for moving the next shot region S to the exposure start position, the plurality of shot regions S on the substrate P are transferred to the projection optical system PL and the liquid LQ in the immersion space LS. Are sequentially exposed. The exposure light EL is sequentially irradiated onto the plurality of shot regions S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P relatively move along the movement locus indicated by the arrow R1 in FIG. While exposing the projection area PR to the exposure light EL, the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL through the liquid LQ. In at least part of the movement of the substrate stage 2 in the exposure of the substrate P, the immersion space LS is formed on the gap Ga.

  Here, for example, when the immersion space LS moves from the cover member T to the substrate P, a part of the liquid LQ in the immersion space LS may be broken and remain on the substrate P as droplets. There is. For example, when the immersion space LS moves in the order on the cover member T, the gap Ga, and the substrate P, the geometric shape (immersion) between the cover member T and the substrate P due to the presence of the gap Ga. The shape of the contact surface of the space LS with the cover member T, the substrate P, etc.) will change. The change in the geometric shape may cause the liquid LQ in the immersion space LS to flow so that at least a part of the liquid LQ remains on the substrate P.

  In the region A2, when the immersion space LS moves from the cover member T to the substrate P, the contact area between the liquid LQ and the cover member T gradually decreases in the second convex portion GZ2, and thus the above-described case. Sudden geometric changes are mitigated. Therefore, the liquid LQ is smoothly separated from the cover member T, and the liquid LQ is suppressed from remaining on the upper surface of the substrate P. In addition, you may select suitably the item of the 2nd convex part GZ2 formed in area | region A2 according to the characteristic of the board | substrate P mounted in opening Th. Specifically, in the case of the substrate P in which the liquid LQ easily enters between the substrate P and the cover member T, for example, the value of the pitch PZ may be set large. Further, in the case of the substrate P in which the liquid LQ hardly enters between the substrate P and the cover member T, for example, the value of the pitch PZ may be set small. Alternatively, in the case of the substrate P in which the liquid LQ easily enters between the substrate P and the cover member T, for example, the value of the protrusion amount ZL may be set large. In the case of the substrate P in which the liquid LQ hardly enters between the substrate P and the cover member T, for example, the value of the protrusion amount ZL may be set small.

  On the other hand, in the region A1, when the immersion space LS moves from the cover member T to the substrate P, the presence of the notch portion PN in which the width of the opening gradually decreases, the above-described abrupt geometric shape. Although the change is alleviated, there is a concern that the amount of gap increases and the amount of leakage of liquid LQ through the gap increases. Therefore, in the present embodiment, the first protrusion GZ1 is set to be different from the specifications of the second protrusion GZ2 and the first protrusion GZ1 is set so as to reduce the gap amount. Partial liquid leakage specificity in the part PN can be reduced.

  As described above, in the present embodiment, by arranging the first convex portion GZ1 and the second convex portion GZ2 having different specifications in accordance with the position of the notch portion PN in the substrate P, the liquid LQ While suppressing the residual, partial liquid leakage specificity can be reduced, and as a result, occurrence of exposure failure can be suppressed.

  In the above-described embodiment, the first convex portion GZ1 is provided at one location (6 o'clock position) on the −X side. However, the present invention is not limited to this, and the circumferential position of the opening Th is different. For example, it is good also as a structure provided in both -Y side (3 o'clock) position which shifted | deviated 90 degrees. By adopting this configuration, it is possible to cope with any direction in which the substrate P is held by the first holding unit 31.

Second Embodiment
Next, a second embodiment of the exposure apparatus EX will be described with reference to FIGS.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 7 and FIG. 8, illustration of the notch portion and the first convex portion in the substrate P is omitted for convenience.

  The exposure apparatus EX in the present embodiment is provided with a scale member (measurement member) GT as a member with a gap Gm around the cover member T in the substrate stage 2. And the 3rd convex part GZ3 which has the specification similar to the 2nd convex part GZ2 mentioned above in the position (outer edge part, 2nd edge part) facing the scale member GT which faces the gap | interval Gm in the cover member T is provided. It is formed along the extending direction of the gap Gm. Similar to the cover member T described in the first embodiment, the upper surface of the inner surface of the second edge portion of the cover member T facing the gap Gm and the inner surface of the third edge portion of the scale member GT are connected to the upper surface. An inclined surface is formed below the inner surface and the first inner surface, and is inclined downward as the distance from the gap Gm increases (see Ts in FIG. 3 as appropriate).

  In the exposure apparatus EX configured as described above, when an encoder system that uses the scale member GT to measure the position of the substrate stage 2 is used, the liquid LQ moves between the cover member T and the scale member GT via the gap Gm. In doing so, it is possible to suppress the residual liquid LQ by using the convex portion GZ. Such an encoder system is disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The third convex portion GZ3 does not necessarily have the same specifications as the second convex portion GZ2, and may have different specifications. That is, a porous member 80 (see FIG. 3) is provided below the gap Ga between the substrate P and the cover member T, and the liquid LQ leaked through the gap Ga can be sucked and collected. Since the outer dimension accuracy of the substrate P is lower than the outer dimension accuracy of the scale member GT and the cover member T, the specifications of the second protrusion GZ2 in the cover member T are the specifications of the third protrusion GZ3. In other words, the gap amount in the gap Ga can be made, for example, about 1 mm larger than the gap amount in the gap Gm. More specifically, the protrusion amount ZL at the third protrusion GZ3 may be smaller than the protrusion amount ZL at the second protrusion GZ2. Or it is good also as a value smaller than the pitch ZLP in the 3rd convex part GZ3, and the pitch ZP in the 2nd convex part GZ2. This suppresses the liquid LQ from remaining on the upper surface of the substrate P and suppresses the liquid LG from remaining on the scale member GT. As a result, the occurrence of exposure failure can be suppressed.

  Further, in the exposure operation of the present embodiment, the substrate stage 2 and the measurement stage 3 are moved together in contact with each other (hereinafter referred to as “scram sweep operation” as appropriate), so that the lower part of the terminal optical element 12 is moved. Thus, there is a case where the liquid immersion space LS is moved between the substrate stage 2 and the measurement stage 3 while the liquid immersion space LS is maintained. Details of the scram sweep operation are disclosed in, for example, US Patent Application Publication No. 2010/0296068. In this embodiment, the substrate stage 2 is provided with a buffer member BF serving as a buffer material when the substrate stage 2 and the measurement stage 3 perform a scram sweep operation. And the 4th convex part GZ4 which has the specification similar to the said 2nd convex part GZ2 is provided in the position facing the measurement stage 3 and the scale member GT in the buffer member BF. By adopting this configuration, it is possible to prevent the liquid LQ from remaining on the substrate stage 2 when the liquid LQ moves from the measurement stage 3 to the substrate stage 2. The buffer member BF may be provided not on the substrate stage 2 side but on the measurement stage 3 side. Alternatively, the buffer member BF may be provided on both sides of the substrate stage 2 and the measurement stage 3. Moreover, the 4th convex part GZ4 provided in the buffer member BF does not necessarily need to have the same specification as the 2nd convex part GZ2, and is good also as a different specification from the 2nd convex part GZ2. Specifically, for example, the protrusion amount ZL at the fourth protrusion GZ4 may be smaller than the protrusion amount ZL at the second protrusion GZ2. Or you may make pitch PZ in the 4th convex part GZ4 smaller than the pitch PZ in the 2nd convex part GZ2. Moreover, the 4th convex part GZ4 does not necessarily need to be provided in the Y direction both sides of the buffer member BF, and may be provided in at least one side.

  In the present embodiment, the configuration in which the third protrusion GZ3 is provided on the cover member T among the cover member T and the scale member GT that form the gap Gm is exemplified, but the present invention is not limited thereto, and the scale member GT is not limited thereto. The structure provided and the structure provided in both the cover member T and the scale member GT may be sufficient. When providing convex portions on both the cover member T and the scale member GT, for example, the same convex portion protrudes into the concave portion between the other convex portions so that the gap between the convex portions is constant. The phase may be shifted by half the pitch.

Further, as shown in FIG. 7, in the measurement stage 3, a convex portion similar to the above may be provided on the cover member Q around the measurement member (measuring instrument) C for measuring the exposure light EL. Thereby, when the liquid LQ moves through the gap Gn formed between the measurement member C and the cover member Q, the liquid LQ can be suppressed from remaining on the measurement member C or the like. Examples of the measuring member C include an illuminance unevenness sensor disclosed in US Pat. No. 4,465,368, an aerial image measuring device disclosed in US 2002/0041377, and a US patent. Examples include an illuminance monitor disclosed in Japanese Patent Application Publication No. 2002/0061469 and a wavefront aberration measuring instrument disclosed in European Patent No. 1,079,223. The measurement member C includes an alignment reference mark, an imaging device I provided on the measurement stage 3 for imaging the liquid immersion member 7 and the like from below. You may employ | adopt the structure which provides the convex part mentioned above in the cover member Q in the circumference | surroundings of these measurement members C. FIG.
Further, the above-described convex portions may be provided on the cover member T around the measurement member C mounted on the substrate stage 2. Examples of the measurement member C mounted on the substrate stage 2 include a sensor (AIS sensor) S that measures a spatial image of a measurement mark via the projection optical system PL. By providing the above-described convex portion on the cover member T around the sensor S, the same actions and effects can be achieved.
The convex portions formed on the cover member T around the sensor S may have the same specifications as the third convex portions GZ3, for example, or different specifications from the second convex portions GZ2 and the third convex portions GZ3. It is good also as a convex part. For example, the protrusion amount ZL of the protrusion formed on the cover member T around the sensor S may be smaller than the protrusion amount ZL of the second protrusion GZ2. Or you may make pitch PZ of the convex part formed in the cover member T around the sensor S smaller than the pitch PZ in the 2nd convex part GZ2.
As described above, in the present embodiment, the shape (the pitch PZ, the protrusion amount ZL, and the like) of the convex portions (the first convex portions GZ1 and the second convex portions GZ2) in the portion facing the substrate P in the cover member T is as follows. This is different from the shape of other protrusions (such as the protrusions formed on the third protrusion GZ3 and the part facing the sensor S).
In addition, each convex part (1st convex part GZ1-3rd convex part GZ3, the convex part around the sensor S) formed in the cover member T mentioned above, the convex part formed in the cover member Q, and a buffer It is not always necessary to form all the convex portions formed on the member BF, and at least one of them may be formed.
Moreover, the convex part GZ demonstrated in this embodiment is applicable also to the other member in exposure apparatus. Specifically, it is preferable that the liquid LQ remains in contact with the liquid LQ, such as the lower surface 14 of the liquid immersion member 7 (for example, the periphery of the lower surface 14) or the read head of the encoder system described above. It can also be applied to parts that do not exist.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, the shape of the convex portion shown in the above embodiment is an example. In addition to this, as shown in FIG. 9A, the base portion Te is not provided with an arc portion, but an edge portion parallel to the tip portion Tf is provided. As shown in FIG. 9B, the side surfaces of the convex portions intersect with each other at the base Te, and the side surfaces of the convex portions also at the tip portion Tf as shown in FIG. 9C. A configuration that intersects and becomes a sharp end, or a configuration in which arc portions are provided on both the base Te and the tip Tf, as shown in FIG.

  Moreover, in the said 1st Embodiment, as shown in FIG. 5, in area | region A1, although the 1st convex part GZ1 which is not the shape where the unevenness | corrugation mentioned above was repeated was illustrated, it is not limited to this. For example, depending on the external dimensions of the substrate P, the gap Ga to the cover member T may be increased. In such a case, in order to suck the liquid LQ by the porous member 80, as shown in FIG. 10, the above-described unevenness may be repeated in the same manner as the second protrusion GZ2. The specifications of the first protrusion GZ1 in this configuration are a fine pitch ZP and a small protrusion amount ZL compared to the specifications of the second protrusion GZ2 (see FIG. 6). Further, in the first embodiment, the configuration in which the dimensions of the protrusions are changed according to the position of the notch portion PN on the substrate P has been described. It is good also as a structure which changes the item of a convex part in the position according to a direction. In this case, it is preferable that the residual state of the liquid LQ is confirmed in advance in the scanning movement direction and the non-scanning direction, and the specifications of the convex portion are set for each direction in accordance with the confirmed residual state.

  In each of the above-described embodiments, the optical path K on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the 2004/019128 pamphlet, the optical path on the incident side (object plane side) of the last optical element 12 may also be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the exposure liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices. For example, as illustrated in FIG. 11, the exposure apparatus EX may include two substrate stages 2001 and 2002. In that case, the object that can be arranged so as to face the emission surface 13 is one of the substrate stages, the substrate held on the one substrate stage, the other substrate stage, and the substrate held on the other substrate stage. Including at least one. In addition, although the measurement member (sensor S etc.) mentioned above is abbreviate | omitted in FIG. 11, it cannot be overemphasized that the convex part mentioned above may be provided also in the site | part facing this measurement member among cover members.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 12, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage (stage), 8 ... Control apparatus, 12 ... End optical element (optical member), 13 ... Ejection surface, 31 ... 1st holding part, 32 ... 2nd holding part, 80 ... Porous member, A1 ... 1st 1 area, A2 ... 2nd area, EL ... exposure light, EX ... exposure apparatus, Ga, Gm, Gn ... gap (gap), GT ... scale member (member, measurement member), GZ ... convex part, GZ1 ... 1st Convex part (protruding part), GZ2 ... second convex part (protruding part), LQ ... liquid, LS ... immersion space, P ... substrate (object), S ... shot area (exposure area), T ... cover member (First member, defining member)

Claims (22)

An exposure apparatus that irradiates an upper surface of a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding portion that holds the substrate in a releasable manner, and a first member that has an upper surface and an edge portion that is a part of an outer edge of the upper surface and faces an end portion of the held substrate in the circumferential direction. A substrate holding device including
The edge portion of the first member is formed with a plurality of protrusions that protrude toward the held substrate along the circumferential direction.
The edge portion includes an exposure apparatus having a first region in which a protrusion having a first shape is disposed and a second region in which a protrusion having a second shape different from the first shape is disposed.   The exposure apparatus according to claim 1, wherein the first area is arranged at a position corresponding to a position information portion provided at a predetermined position of the held substrate.   The exposure apparatus according to claim 2, wherein a plurality of the first areas are arranged at different positions in the predetermined direction.   The exposure apparatus according to any one of claims 1 to 3, wherein the first area and the second area are arranged at positions corresponding to a scanning movement direction during exposure.   The gap amount between the first member and the substrate in the first region is smaller than the gap amount between the first member and the substrate in the second region. The exposure apparatus according to one item.   6. The exposure apparatus according to claim 5, wherein the pitch of the protrusions in the first region is smaller than the width of the tip of the protrusions in the first region.   The protrusion in the first region and the protrusion in the second region each have a lower surface that is inclined downward in accordance with a direction away from the front end portion with respect to the first holding portion. An exposure apparatus according to claim 1.   The exposure apparatus according to any one of claims 1 to 7, wherein the edge portion of the first member is disposed around the first holding portion. The first member has an opening in which the substrate can be arranged,
The exposure apparatus according to claim 8, wherein the opening is defined by the edge portion. A second member having a second upper surface that is movable below the first optical member and is adjacent to the first member via a gap, and that can form a liquid immersion space;
The edge portion of the first member extends in a direction in which the gap between the first member and the second member extends in a predetermined direction so that the end portion of the substrate held by the first holding portion follows. A second edge portion extending,
The second member defines a part of an outer edge of the second upper surface, and includes a third edge portion facing the second edge portion,
At least one of the second edge portion of the first member and the third edge portion of the second member is formed with a protruding portion that protrudes toward the other side along the extending direction. Item 10. The exposure apparatus according to any one of Items 1 to 9. An exposure apparatus that irradiates an upper surface of a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A substrate holding device comprising: a first holding portion for holding the substrate in a releasable manner; and a first member having an upper surface and an edge portion defining a part of an outer edge of the upper surface;
A second member having a second upper surface, which is movable below the first optical member and is adjacent to the first member via a gap, and capable of forming a liquid immersion space;
The edge portion of the first member extends in a direction in which the gap between the first member and the second member extends in a predetermined direction so that the end portion of the substrate held by the first holding portion follows. A second edge portion extending,
The second member defines a part of an outer edge of the second upper surface, and includes a third edge portion facing the second edge portion,
An exposure in which at least one of the second edge portion of the first member and the third edge portion of the second member has a protruding portion that protrudes toward the other side is formed along the extending direction. apparatus.   The amount of space between the first member and the second member in the projecting portion formed on at least one of the second edge portion or the third edge portion is between the first member and the substrate. The exposure apparatus according to claim 10 or 11, wherein the exposure apparatus is smaller than the gap amount.   13. The exposure apparatus according to claim 11, wherein the protruding portion has a lower surface inclined downward from a tip portion thereof in a direction away from the first holding portion. The protrusion is formed on the second edge;
The exposure apparatus according to any one of claims 10 to 13, wherein the protruding portion of the second edge portion has a lower surface that is inclined downward from the tip portion toward the first holding portion. The measuring member for measuring the characteristics of the exposure light further comprises a holding device arranged in an opening formed on the upper surface thereof,
The exposure apparatus according to claim 1, wherein a plurality of projecting portions that project toward the arranged measurement member are arranged in the opening along the opening. The first member is formed with an opening in which the measurement member is disposed,
The exposure apparatus according to claim 1, wherein a plurality of projecting portions that project toward the arranged measurement member are arranged in the opening along the opening. An exposure apparatus that irradiates an upper surface of a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding part that holds the substrate in a releasable manner; and a first member having an upper surface and an edge part that is a part of an outer edge of the upper surface and faces an end of the held substrate in the circumferential direction. A substrate holding device including
The first member is formed with an opening in which the measurement member is disposed,
An exposure apparatus having a second region in the opening in which a plurality of protrusions protruding toward the arranged measurement member are formed side by side along the opening.   The exposure apparatus according to claim 16 or 17, wherein the measurement member measures an aerial image of the exposure light. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 18,
Developing the exposed substrate. A device manufacturing method. An exposure method for irradiating an upper surface of a substrate with exposure light through a liquid,
An optical member having an emission surface from which the exposure light is emitted; an upper surface of the substrate held by a first holding unit that releasably holds the substrate; and an upper surface and a part of an outer edge of the upper surface, In a state where an immersion space is formed with the liquid between at least one of the upper surfaces of the first member having an edge portion of the substrate to be held and an edge portion facing in the circumferential direction, the substrate is Exposing, and
The edge portion of the first member is formed with a plurality of protrusions that protrude toward the held substrate along the circumferential direction.
The edge portion includes an exposure method including a first region in which a protrusion having a first shape is disposed and a second region in which a protrusion having a second shape different from the first shape is disposed. An exposure method for irradiating an upper surface of a substrate with exposure light through a liquid,
An optical member having an emission surface from which the exposure light is emitted, an upper surface of the substrate held by a first holding unit that holds the substrate in a releasable manner, and an edge that defines a part of the upper surface and an outer edge of the upper surface. Moving a first member having a portion below the optical member such that at least a part of the first upper surface is in contact with the immersion space;
Moving a second member below the optical member in a state adjacent to the first member via a gap below the optical member,
The edge portion of the first member extends in a direction in which the gap between the first member and the second member extends in a predetermined direction so that the end portion of the substrate held by the first holding portion follows. A second edge portion extending,
The second member defines a part of an outer edge of the second upper surface, and includes a third edge portion facing the second edge portion,
An exposure in which at least one of the second edge portion of the first member and the third edge portion of the second member has a protruding portion that protrudes toward the other side is formed along the extending direction. Method. An exposure method for irradiating an upper surface of a substrate with exposure light through a liquid,
An optical member having an emission surface from which the exposure light is emitted; an upper surface of the substrate held by a first holding unit that releasably holds the substrate; and an upper surface and a part of an outer edge of the upper surface, In a state where an immersion space is formed with the liquid between at least one of the upper surfaces of the first member having an edge portion of the substrate to be held and an edge portion facing in the circumferential direction, the substrate is Exposing, and
The first member is formed with an opening in which the measurement member is disposed,
The exposure method which has the 2nd area | region where the protrusion part which protrudes toward the said measurement member arranged in the said opening is formed in multiple numbers along the said opening.

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