JP2009188119A - Cover member, stepper, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stepper capable of suppressing the adhesion of liquid on the backside of a substrate and suppressing the occurrence of exposure failure. <P>SOLUTION: The stepper exposes the substrate to exposure light via a liquid. The stepper has a cover member. The cover member has a first surface that opposes at least one portion of a peripheral region on the surface of the substrate with a first gap. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cover member, an exposure apparatus, an exposure method, and a device manufacturing method.

As an exposure apparatus used in a photolithography process, there is known an immersion exposure apparatus that exposes a substrate with exposure light through a liquid, as disclosed in Patent Document 1. The exposure apparatus includes a substrate holding unit that holds the back surface of the substrate, and exposes the substrate held by the substrate holding unit.
US Patent Application Publication No. 2006/0139614 US Patent Application Publication No. 2004/0160582

  In the immersion exposure apparatus, there is a possibility that the liquid enters the space on the back surface side of the substrate or the liquid adheres to the back surface of the substrate. For example, when the liquid adhering to the back surface of the substrate is vaporized, the substrate may be thermally deformed by the heat of vaporization of the liquid, or a liquid adhesion mark (watermark) may be formed on the back surface of the substrate. When such a problem occurs, there is a possibility that an exposure defect such as a defect occurs in a pattern formed on the substrate. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide a cover member that can prevent liquid from entering the space on the back surface side of the substrate. Another object of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided a cover member provided with a first surface facing at least a part of a peripheral region of a surface of a substrate exposed with exposure light through a liquid via a first gap. Is done.

  According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the cover member of the first aspect.

  According to the third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the substrate stage having a first holding unit that holds the substrate, the substrate stage, A second holding part for holding a cover member having a surface, wherein the second holding part covers at least a part of the peripheral area of the surface of the substrate and the first surface through the first gap. An exposure apparatus that holds a member is provided.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the third aspect and developing the exposed substrate.

  According to a fifth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein at least a part of a peripheral region of the surface of the substrate and the first surface of the cover member are connected to the first gap. And exposing the substrate in a state where the peripheral region and the first surface are opposed to each other.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method according to the fifth aspect and developing the exposed substrate.

  According to this invention, it can suppress that a liquid adheres to the back surface of a board | substrate. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the present invention, it is possible to suppress the occurrence of defective devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram showing an exposure apparatus EX according to the first embodiment, and FIG. 2 is an enlarged side sectional view of a part of the exposure apparatus EX. 1 and 2, an exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and a first drive system that moves the mask stage 1. 3, a second drive system 4 that moves the substrate stage 2, an interferometer system 7 that measures positional information of the stages 1 and 2, an illumination system IL that illuminates the mask M with the exposure light EL, and an exposure light EL A projection optical system PL that projects an image of the pattern of the mask M illuminated by 1 onto the substrate P, a transport device 40 that can transport the substrate P, and a control device 8 that controls the operation of the entire exposure apparatus EX. .

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask in which a predetermined pattern is formed on a transparent plate such as a glass plate using a light shielding film such as chromium. A reflective mask can also be used as the mask M. The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a substrate having a photosensitive film Rg formed on a base material W such as a semiconductor wafer such as a silicon wafer. The photosensitive film Rg is a film of a photosensitive material (photoresist).

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. The exposure apparatus EX includes a liquid immersion member 9 capable of forming the liquid immersion space LS so that at least a part of the optical path K of the exposure light EL is filled with the liquid LQ. The immersion space LS is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In the present embodiment, the immersion space LS is such that the optical path K of the exposure light EL emitted from the terminal optical element 10 closest to the image plane of the projection optical system PL is the liquid LQ among the plurality of optical elements of the projection optical system PL. It is formed to be filled with. The last optical element 10 has an exit surface 11 that emits the exposure light EL toward the image plane of the projection optical system PL. The immersion space LS is formed so that the optical path K between the terminal optical element 10 and an object disposed at a position facing the exit surface 11 of the terminal optical element 10 is filled with the liquid LQ. The position facing the emission surface 11 includes the irradiation position of the exposure light EL emitted from the emission surface 11. In the following description, a position facing the exit surface 11 of the last optical element 10 is appropriately referred to as an exposure position EP.

  The liquid immersion member 9 is disposed in the vicinity of the last optical element 10. The liquid immersion member 9 has a lower surface 12. In the present embodiment, an object that can face the emission surface 11 can face the lower surface 12. When the surface of the object is disposed at the exposure position EP, at least a part of the lower surface 12 faces the surface of the object. When the exit surface 11 and the surface of the object face each other, the terminal optical element 10 can hold the liquid LQ between the exit surface 11 and the surface of the object. Further, when the lower surface 12 and the surface of the object face each other, the liquid immersion member 9 can hold the liquid LQ between the lower surface 12 and the surface of the object. A liquid immersion space LS is formed by the liquid LQ held between the ejection surface 11 and the lower surface 12 on one side and the surface of the object on the other side.

  In the present embodiment, the object that can face the emission surface 11 and the lower surface 12 includes an object that can move within a predetermined plane including the exposure position EP. In the present embodiment, the object includes at least one of the substrate stage 2 and the substrate P held on the substrate stage 2. In the present embodiment, the substrate stage 2 is movable on the guide surface 5 of the base member 6. In the present embodiment, the guide surface 5 is substantially parallel to the XY plane. The substrate stage 2 holds the substrate P and can move in the XY plane including the exposure position EP along the guide surface 5.

  In the present embodiment, the immersion space LS is formed so that a partial region (local region) on the surface of the substrate P disposed at a position facing the emission surface 11 and the lower surface 12 is covered with the liquid LQ. The interface (meniscus, edge) of the liquid LQ is formed between the surface of the substrate P and the lower surface 12. That is, in the present embodiment, the exposure apparatus EX sets the immersion space LS so that a part of the area on the substrate P including the projection area PR of the projection optical system PL is covered with the liquid LQ when the substrate P is exposed. Adopt the local immersion method to be formed.

  In the present embodiment, a cover member 13 that covers at least a part of the peripheral region on the surface of the substrate P is disposed in the vicinity of the substrate P held by the substrate stage 2 (substrate holder). The cover member 13 includes a first surface 14 that opposes at least a part of the peripheral region on the surface of the substrate P with the first gap G1 interposed therebetween. In the present embodiment, the cover member 13 is held by the substrate stage 2.

The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 has a mask holding part 15 that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 15 holds the mask M so that the pattern formation surface (lower surface) of the mask M and the XY plane are substantially parallel. The first drive system 3 includes an actuator such as a linear motor. The mask stage 1 can move in the XY plane while holding the mask M by the operation of the first drive system 3. In the present embodiment, the mask stage 1 is movable in three directions, ie, the X axis, the Y axis, and the θZ direction, with the mask M held by the mask holding unit 15.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The plurality of optical elements of the projection optical system PL are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is substantially parallel to the Z axis. Further, the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 includes a stage body 16 and a substrate table 17 that is disposed on the stage body 16 and can hold the substrate P. The stage body 16 is supported by the gas bearing in a non-contact manner on the guide surface 5 and is movable on the guide surface 5 in the XY directions. The substrate stage 2 holds the substrate P and has a predetermined guide surface 5 including a position facing the exit surface 11 and the lower surface 12 on the light exit side of the last optical element 10 (image surface side of the projection optical system PL). It can move in the area.

  The second drive system 4 includes an actuator such as a linear motor, and a coarse motion system 4A capable of moving the stage body 16 on the guide surface 5 in the X axis, Y axis, and θZ directions, and a voice coil motor, for example. A fine movement system 4B including an actuator and capable of moving the substrate table 17 in the Z-axis, θX, and θY directions with respect to the stage body 16 is provided. The substrate table 17 is moved in the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P by the operation of the second drive system 4 including the coarse movement system 4A and the fine movement system 4B. It can move in one direction.

  The interferometer system 7 measures positional information of the mask stage 1 and the substrate stage 2 in the XY plane. The interferometer system 7 includes a laser interferometer 7A that measures position information of the mask stage 1 in the XY plane, and a laser interferometer 7B that measures position information of the substrate stage 2 in the XY plane. The laser interferometer 7A irradiates measurement light onto the reflection surface 1R disposed on the mask stage 1, and uses the measurement light via the reflection surface 1R to mask the mask stage 1 (X-axis, Y-axis, and θZ directions). The position information of the mask M) is measured. The laser interferometer 7B irradiates measurement light onto the reflection surface 2R disposed on the substrate stage 2 (substrate table 17), and uses the measurement light via the reflection surface 2R to perform the X-axis, Y-axis, and θZ directions. The position information of the substrate stage 2 (substrate P) is measured.

  In the present embodiment, a focus / leveling detection system (not shown) for detecting position information on the surface of the substrate P held on the substrate stage 2 is disposed. The focus / leveling detection system detects position information on the surface of the substrate P in the Z-axis, θX, and θY directions.

  When the substrate P is exposed, the position information of the mask stage 1 is measured by the laser interferometer 7A, and the position information of the substrate stage 2 is measured by the laser interferometer 7B. The control device 8 operates the first drive system 3 based on the measurement result of the laser interferometer 7 </ b> A, and executes position control of the mask M held on the mask stage 1. Further, the control device 8 operates the second drive system 4 based on the measurement result of the laser interferometer 7B and the detection result of the focus / leveling detection system to control the position of the substrate P held on the substrate stage 2. Execute.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 8 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are scanned in the XY plane intersecting the optical path (optical axis AX) of the exposure light EL. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  The liquid immersion member 9 is an annular member. The liquid immersion member 9 is disposed around the last optical element 10. As shown in FIG. 2, the liquid immersion member 9 has an opening 9 </ b> K at a position facing the emission surface 11. The liquid immersion member 9 includes a supply port 21 that can supply the liquid LQ and a recovery port 22 that can recover the liquid LQ.

  The supply port 21 can supply the liquid LQ in order to form the immersion space LS. The supply port 21 is disposed at a predetermined position of the liquid immersion member 9 so as to face the optical path K in the vicinity of the optical path K. The supply port 21 is connected to the liquid supply device 24 via the flow path 23. The liquid supply device 24 can deliver a clean and temperature-adjusted liquid LQ. The flow path 23 includes a supply flow path formed inside the liquid immersion member 9 and a flow path formed by a supply pipe that connects the supply flow path and the liquid supply device 24. The liquid LQ delivered from the liquid supply device 24 is supplied to the supply port 21 via the flow path 23.

  The recovery port 22 can recover at least a part of the liquid LQ on the object facing the lower surface 12 of the liquid immersion member 9. In the present embodiment, the recovery port 22 is disposed around the opening 9K through which the exposure light EL passes. The recovery port 22 is disposed at a predetermined position of the liquid immersion member 9 that faces the surface of the object. A plate-shaped porous member 25 including a plurality of holes (openings or pores) is disposed in the recovery port 22. Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the recovery port 22. In the present embodiment, at least a part of the lower surface 12 of the liquid immersion member 9 includes the lower surface of the porous member 25. The recovery port 22 is connected to a liquid recovery device 27 via a flow path 26. The liquid recovery device 27 includes a vacuum system and can recover the liquid LQ by sucking it. The flow path 26 includes a recovery flow path formed inside the liquid immersion member 9 and a flow path formed by a recovery pipe that connects the recovery flow path and the liquid recovery device 27. The liquid LQ recovered from the recovery port 22 is recovered by the liquid recovery device 27 via the flow path 26.

  In the present embodiment, the control device 8 executes the liquid recovery operation using the recovery port 22 in parallel with the liquid supply operation using the supply port 21, so that the terminal optical element 10 and the liquid immersion member 9 on one side are performed. And an immersion space LS can be formed with the liquid LQ between the object on the other side.

  FIG. 3 is a cross-sectional view showing the vicinity of the cover member 13, and FIG. 4 is a perspective view of the substrate stage 2. As shown in FIGS. 2 and 3, the substrate table 17 includes a first holding unit 18 that holds the substrate P and a second holding unit 19 that holds the cover member 13. In the present embodiment, the first holding unit 18 includes a so-called vacuum chuck mechanism, and holds the substrate P in a releasable manner. The second holding unit 19 also includes, for example, a vacuum chuck mechanism, and holds the cover member 13 in a releasable manner. The second holding unit 19 is disposed around the first holding unit 18.

  In the present embodiment, the plate member T is disposed around the cover member 13. The substrate table 17 includes a third holding unit 20 that holds the plate member T. In the present embodiment, the third holding unit 20 includes a vacuum chuck mechanism and holds the plate member T so as to be releasable. The third holding unit 20 is disposed around the second holding unit 19. The chuck mechanism used for the first holding unit 18, the second holding unit 19, and the third holding unit 20 is not limited to the vacuum chuck mechanism, and at least one of the first holding unit 18, the second holding unit 19, and the third holding unit 20. One other chuck mechanism (for example, an electrostatic chuck mechanism) may be used.

  The first holding unit 18 faces the back surface of the substrate P and holds the back surface of the substrate P. The first holding unit 18 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. In FIGS. 2 and 3 and the like, the back surface of the substrate P and the front surface of the first holding unit 18 are drawn in contact with each other for simplicity of explanation. The substrate P is held by the convex portion formed on the surface of the first holding unit 18, and a space is formed between the back surface of the substrate P and the surface of the first holding unit 18, and the gas in the space is exhausted. The substrate P is held by the first holding unit 18.

  The cover member 13 includes a plate portion 13A having a first surface 14 that can face at least a part of the peripheral region of the surface of the substrate P, a support portion 13B that is held by the second holding portion 19, and a lower surface of the support portion 13B. And a rod portion 13C connected to the (rear surface). In the present embodiment, the cover member 13 is disposed around the substrate P. As shown in FIG. 4, the cover member 13 is an annular member corresponding to the outer shape of the substrate P. The first surface 14 has an annular shape corresponding to the outer shape of the surface of the substrate P.

  As shown in FIGS. 2 and 3, the second holding unit 19 holds the cover member 13 so that the peripheral area of the surface of the substrate P and the first surface 14 face each other with the first gap G <b> 1. The substrate P held by the first holding unit 18 is separated from the cover member 13 held by the second holding unit 19. Further, in the present embodiment, the second holding unit 19 includes the cover member 13 such that the surface of the substrate P held by the first holding unit 18 and the first surface 14 of the cover member 13 are substantially parallel. Hold. That is, in the present embodiment, the first surface 14 is substantially parallel to the XY plane.

  In the present embodiment, the first surface 14 is liquid repellent with respect to the liquid LQ. In the present embodiment, the cover member 13 includes a metal base material such as stainless steel, and a film of a liquid repellent material formed on the base material. The first surface 14 is formed of a liquid repellent material film. Examples of the liquid repellent material include PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), and Teflon (registered trademark). In addition, you may make the 1st surface 14 liquid-repellent by forming cover member 13 itself with liquid-repellent material. In the present embodiment, the contact angle of the first surface 14 with respect to the liquid LQ is, for example, 90 degrees or more.

  As shown in FIG. 3, the substrate P includes a base material W and a photosensitive film Rg formed on the base material W. In the present embodiment, the surface of the substrate P includes the surface of the photosensitive film Rg. In the present embodiment, the photosensitive film Rg is liquid repellent with respect to the liquid LQ. The contact angle of the surface of the photosensitive film Rg with respect to the liquid LQ is, for example, 90 degrees or more.

  The peripheral region on the surface of the substrate P includes a region where the photosensitive film Rg is removed. In this embodiment, the substrate P is formed on the base material W by, for example, a process for forming the photosensitive film Rg based on a spin coating method, and an edge rinse process for removing a part of the formed photosensitive film Rg. It is formed through. In the present embodiment, the region from which the photosensitive film Rg has been removed includes a region subjected to edge rinse processing.

  In the present embodiment, the first surface 14 faces a part of the photosensitive film Rg. That is, the first surface 14 faces both the region where the photosensitive film Rg is formed and the region where the photosensitive film Rg is removed. In other words, the first surface 14 faces the boundary between the photosensitive film Rg and the substrate W.

  In the present embodiment, the distance H1 between the edge of the photosensitive film Rg and the edge of the substrate P (base material W) in the radial direction with respect to the center of the surface of the substrate P, that is, the size of the region from which the photosensitive film Rg has been removed is About 0.5 to 3 mm. Further, the distance H2 between the inner edge of the first surface 14 and the edge of the substrate P (base material W) in the radial direction with respect to the center of the surface of the substrate P, that is, the portion where the first surface 14 and the substrate P overlap. The size is about 1 to 10 mm.

  In the present embodiment, the size of the first gap G1 is determined so that the liquid LQ does not enter the first gap G1 due to the surface tension of the liquid LQ. The size of the first gap G1 is, for example, 1 mm or less. In the present embodiment, the size of the first gap G1 is 0.2 mm or less. Each of the first surface 14 on one side forming the first gap G1 and the surface of the photosensitive film Rg on the other side is liquid repellent with respect to the liquid LQ, and the size of the first gap G1 is optimized. Thus, the infiltration of the liquid LQ into the first gap G1 can be sufficiently suppressed.

  Further, the cover member 13 has a second surface 28 that can face the exit surface 11 of the last optical element 10. The second surface 28 includes a flat region 28A that is substantially parallel to the first surface 14 and an inclined region 28B that is inclined with respect to the flat region 28A. In the XY plane, the flat area 28A is an annular (annular) area. The inclined region 28B is disposed around the flat region 28A.

  In the present embodiment, the second surface 28 is liquid repellent with respect to the liquid LQ. Similar to the first surface 14, the second surface 28 is formed of a film of a liquid repellent material. In the present embodiment, the contact angle of the second surface 28 with respect to the liquid LQ is, for example, 90 degrees or more. As described above, the second surface 28 may be liquid repellent by forming the cover member 13 itself from a liquid repellent material.

The third holding unit 20 faces the back surface of the plate member T and holds the back surface of the plate member T. The third holding unit 20 holds the plate member T so that the surface of the plate member T and the XY plane are substantially parallel. In FIGS. 2 and 3 and the like, for simplicity of explanation, the back surface of the plate member T and the surface of the third holding portion 20 are depicted as being in contact with each other. The plate member T is held by the convex portion formed on the surface of the third holding part 20, and a space is formed between the back surface of the plate member T and the surface of the third holding part 20, and the gas in the space is exhausted. By doing so, the plate member T is held by the third holding portion 20.
In the present embodiment, the surface of the substrate P held by the first holding unit 18 and the surface of the plate member T held by the third holding unit 20 are arranged in substantially the same plane (substantially flush with each other). Is).

  In the present embodiment, the second surface 28 of the cover member 13 is higher than the surface of the substrate P and the surface of the plate member T. That is, the second surface 28 is disposed on the + Z side from the surface of the substrate P and the surface of the plate member T. In the present embodiment, the distance H3 between the surface of the substrate P (the surface of the plate member T) and the second surface 28 (flat region 28A) in the Z-axis direction is 0.5 mm or less.

  In the present embodiment, the surface of the plate member T is liquid repellent with respect to the liquid LQ. In this embodiment, the plate member T includes a metal base material such as stainless steel and a film of a liquid repellent material formed on the base material. The surface of the plate member T is formed of a liquid repellent material film. Examples of the liquid repellent material include PFA, PTFE, PEEK, Teflon (registered trademark), and the like. The plate member T itself may be formed of a liquid repellent material. In the present embodiment, the contact angle of the surface of the plate member T with respect to the liquid LQ is, for example, 90 degrees or more.

  The plate member T has an opening TH in which the cover member 13 can be disposed. The plate member T held by the third holding unit 20 is disposed around the cover member 13 held by the second holding unit 19. The inclined region 28B is inclined so as to connect the outer edge of the flat region 28A and the inner edge of the surface of the plate member T.

  As shown in FIG. 3, in the present embodiment, the second surface 28 (inclined region 28 </ b> B) of the cover member 13 held by the second holding portion 19 and the surface of the plate member T held by the third holding portion 20. A second gap G2 is formed between the two.

  In the present embodiment, the size of the second gap G2 is determined so that the liquid LQ does not enter the second gap G2 due to the surface tension of the liquid LQ. The size of the second gap G2 is, for example, 1 mm or less. Each of the second surface 28 on one side forming the second gap G2 and the surface of the plate member T on the other side is liquid repellent with respect to the liquid LQ, and the size of the second gap G2 is optimized. Thus, it is possible to sufficiently prevent the liquid LQ from entering the second gap G2.

  As shown in FIG. 3, in the present embodiment, the substrate table 17 has a hole 29 in which the rod portion 13 </ b> C of the cover member 13 can be placed. The rod portion 13C is long in the Z-axis direction. The rod portion 13 </ b> C is movable in the Z-axis direction while being guided by the hole 29.

  In addition, the substrate table 17 includes a moving device 30 that moves the cover member 13 with respect to the second holding unit 19. In the present embodiment, the moving device 30 includes a moving member 31 that can be moved in the Z-axis direction and an actuator 32 that moves the moving member 31, which is disposed below the rod portion 13 </ b> C. The moving device 30 operates the actuator 32 in a state where the moving member 31 and the rod portion 13C are in contact with each other, and moves the moving member 31 in the Z-axis direction, thereby moving the cover member 13 to the second holding portion 19. On the other hand, it can move (elevate) in the Z-axis direction.

  Further, the substrate table 17 includes a moving device (not shown) that moves (lifts) the substrate P in the Z direction with respect to the first holding unit 18.

  FIG. 5 is a diagram illustrating a state in which the cover member 13 is raised with respect to the first holding unit 18 and the second holding unit 19 by the moving device 30. As shown in FIG. 5, in the present embodiment, three rod portions 13C are arranged. The moving device 30 is provided so as to correspond to each of the three rod portions 13C. The control device 8 lifts the cover member 13 using the moving device 30 in a state where the suction of the second holding portion 19 to the cover member 13 is released and the cover member 13 can be released from the second holding portion 19. . As the cover member 13 is raised by the moving device 30, a gap G <b> 3 is formed between the cover member 13 (support portion 13 </ b> B) and the second holding portion 19. The transfer device 40 can carry (load) the substrate P into the first holding unit 18 and can carry out (unload) the substrate P from the first holding unit 18 through the gap G3. The transport device 40 supports the back surface of the substrate P and transports the substrate P.

  In the present embodiment, the transport device 40 can transport the cover member 13. In the present embodiment, the transport device 40 can transport the substrate P and the cover member 13 together. As shown in FIG. 6, the transfer device 40 can transfer the substrate P and the cover member 13 together in a state where the peripheral area of the surface of the substrate P and the first surface 14 of the cover member 13 are opposed to each other. . The control device 8 releases the holding of the second holding portion 19 with respect to the cover member 13 so that the cover member 13 can be released, and then the peripheral region of the surface of the substrate P and the first surface 14 of the cover member 13 The substrate P is transported by using the transport device 40 in a state in which the substrate P is in contact. As a result, the cover member 13 is transported to the transport device 40. Further, the transport device 40 can carry in (load) the cover member 13 with respect to the second holding unit 19, and can carry out (unload) the cover member 13 from the second holding unit 19. That is, the cover member 13 is replaceable.

  In addition, the conveying apparatus 40 can also convey only the cover member 13. For example, the transport device 40 can transport the cover member 13 in a state where the support portion 13B of the cover member 13 is supported. In addition, a transport device for transporting the cover member 13 and a transport device for transporting the substrate P can be provided.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described. The control device 8 uses the transport device 40 to load the substrate P before exposure onto the first holding unit 18. As described with reference to FIG. 5, when loading the substrate P onto the first holding unit 18, the cover member 13 is raised by the moving device 30. The substrate P is transferred from the transfer device 40 to a moving device (not shown) via the gap G3. Further, the substrate P is placed on the first holding unit 18 by a moving device (not shown), and the substrate P is held on the first holding unit 18. After the substrate P is held by the first holding unit 18, the control device 8 uses the moving device 30 to lower the cover member 13 and hold it by the second holding unit 19.

  In order to perform immersion exposure on the substrate P held by the substrate stage 2, the control device 8 has an immersion space between the last optical element 10 and the immersion member 9 and the substrate stage 2 disposed at the exposure position EP. LS is formed. In order to expose the substrate P, the control device 8 emits exposure light EL from the illumination system IL. The exposure light EL emitted from the illumination system IL illuminates the mask M. The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  In the present embodiment, the peripheral surface region of the surface of the substrate P exposed through the liquid LQ and the first surface 14 of the cover member 13 are disposed through the first gap G1, and the liquid LQ into the first gap G1 is disposed. Infiltration is suppressed. Therefore, even when the substrate P is subjected to immersion exposure, the liquid LQ is prevented from flowing out to the outside of the substrate P, the liquid LQ wrapping around the back surface of the substrate P, or adhering to the back surface of the substrate P. can do.

  In the present embodiment, since the second surface 28 is liquid repellent with respect to the liquid LQ, the state of the immersion space LS is good even when the immersion space LS is formed on the second surface 28. Can be maintained. Further, the liquid LQ is suppressed from remaining on the second surface 28. In the present embodiment, since the surface of the plate member T is liquid repellent with respect to the liquid LQ, even when the immersion space LS is formed on the plate member T, the state of the immersion space LS is good. Can be maintained. Further, the liquid LQ is suppressed from remaining on the surface of the plate member T. The state of the immersion space LS includes the size of the immersion space LS, the shape of the interface of the liquid LQ, and the like.

  In the present embodiment, since the size of the second gap G2 is determined so that the liquid LQ does not enter the second gap G2, the liquid LQ wraps around the back side of the cover member 13, or the cover member It can suppress adhering to the back surface of 13. Further, the liquid LQ can be prevented from flowing around the back surface side of the plate member T or adhering to the back surface of the plate member T.

  After the exposure of the substrate P is completed, as described with reference to FIG. 5, the control device 8 raises the cover member 13 relative to the second holding portion 19 by the moving device 30 and moves (not shown). The board | substrate P is raised with respect to the 1st holding | maintenance part 18 using an apparatus. The substrate P is transferred to the transport device 40 above the first holding unit 18 and transported through the gap G3.

  When maintenance or replacement of the cover member 13 is performed, the control device 8 unloads the cover member 13 from the second holding unit 19 using the transport device 40. As described with reference to FIG. 6, the transfer device 40 can unload the cover member 13 together with the substrate P. That is, the transfer device 40 can execute an operation of unloading the cover member 13 from the second holding unit 19 in parallel with the operation of unloading the substrate P from the first holding unit 18.

  Further, also when the cover member 13 after maintenance or a new cover member 13 is loaded on the second holding unit 19, as described with reference to FIG. The cover member 13 can be loaded. That is, the transport device 40 can execute an operation of loading the cover member 13 to the second holding unit 19 in parallel with the operation of loading the substrate P to the first holding unit 18.

  Note that the cover member 13 is not transported together with the substrate P, but only the cover member 13 is transported, and the load of the cover member 13 to the second holding unit 19 and the cover member 13 from the second holding unit 19 are transported. An unload may be performed.

  In the present embodiment, not only the cover member 13 but also the plate member T can be exchanged.

  As described above, according to this embodiment, the cover member 13 prevents the liquid LQ from entering the space on the back surface side of the substrate P or the liquid LQ from adhering to the back surface of the substrate P. Can do. Therefore, it is possible to suppress the occurrence of defective exposure and the occurrence of defective devices. In the present embodiment, the peripheral region on the surface of the substrate P and the liquid repellent first surface 14 face each other with the first gap G1 therebetween, and the substrate P and the cover member 13 do not contact each other. Therefore, the influence on the substrate P can be suppressed. Moreover, generation | occurrence | production of a foreign material can be suppressed and contamination of the cover member 13 can be suppressed.

  Further, according to this embodiment, even when the peripheral region on the surface of the substrate P includes the region from which the liquid-repellent photosensitive film Rg is removed, the liquid LQ enters the space on the back surface side of the substrate P, The liquid LQ can be prevented from adhering to the back surface of the substrate P. When the region where the liquid-repellent photosensitive film Rg is removed, in this embodiment, the region where the substrate W is exposed is lyophilic with respect to the liquid LQ, the region where the photosensitive film Rg is removed When the liquid LQ comes into contact with the liquid LQ, there is a high possibility that the liquid LQ enters the space on the back surface side of the substrate P or the liquid LQ adheres to the back surface of the substrate P. According to this embodiment, even when the peripheral region on the surface of the substrate P includes the region from which the liquid-repellent photosensitive film Rg is removed, the infiltration of the liquid LQ into the first gap G1 can be suppressed. It is possible to suppress contact between the liquid LQ and the region from which the photosensitive film Rg has been removed.

  Further, by forming an area from which the photosensitive film Rg has been removed by edge rinsing, for example, each member or device in the exposure apparatus EX such as the transport apparatus 40, or an external apparatus (such as a coater / developer apparatus or an etching apparatus) It is possible to suppress contamination of the peripheral device. Since the photosensitive film Rg formed in the peripheral region of the substrate P may be peeled off from the substrate P, if the edge rinse treatment is not performed, the peeled photosensitive film Rg may contaminate each member, device, and the like. According to the present embodiment, even when the edge rinse-treated substrate P is subjected to immersion exposure, the liquid LQ can be prevented from entering the space on the back surface side of the substrate P or adhering to the back surface of the substrate P. And the substrate P can be satisfactorily exposed by immersion.

  In this embodiment, the case where the surface of the substrate P is formed of the photosensitive film Rg has been described as an example, but the liquid LQ having a function of protecting the photosensitive film Rg, which is called a top coat film, is used. The surface of the substrate P may be formed of a liquid repellent film. For example, even if a region where the topcoat film is removed is formed in the peripheral region on the surface of the substrate P after the topcoat film is formed based on the spin coating method, the first rinse of the cover member 13 is performed. By performing immersion exposure with the surface 14 and the peripheral region of the surface of the substrate P facing each other, the liquid LQ enters the space on the back surface side of the substrate P, or the liquid LQ adheres to the back surface of the substrate P. Can be suppressed.

  In the present embodiment, the surface of the substrate P held by the first holding part 18 and the surface of the plate member T held by the third holding part 20 are arranged in substantially the same plane, and the cover member 13 Although the case where the second surface 28 is higher than the surface of the plate member T has been described, for example, as illustrated in FIG. 7, the second surface 28 and the surface of the plate member T may be disposed in substantially the same plane. . Also in this case, by disposing the first surface 14 of the cover member 13 via the peripheral region on the surface of the substrate P and the first gap G1, the liquid LQ enters the space on the back surface side of the substrate P, or the liquid LQ Can be prevented from adhering to the back surface of the substrate P.

  In the above-described embodiment, the second holding portion 19 that holds the cover member 13 can be movably provided. By doing so, for example, the size of the first gap G1 can be adjusted.

  In each of the above-described embodiments, the projection optical system PL fills the optical path K on the exit side (image plane side) of the last optical element 10 with a liquid, but is disclosed in International Publication No. 2004/019128. As shown, a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 10 is also filled with the liquid LQ can be employed.

  In addition, although the liquid LQ of the above-mentioned embodiment is water, liquids other than water may be sufficient. The liquid LQ is preferably a liquid LQ that is transparent to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the projection optical system or a photosensitive material (photoresist) film that forms the surface of the substrate. For example, as the liquid LQ, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, cedar oil, or the like can be used. A liquid LQ having a refractive index of about 1.6 to 1.8 may be used. Furthermore, an optical element (such as a terminal optical element) of the projection optical system PL that is in contact with the liquid LQ may be formed of a material having a refractive index higher than that of quartz and fluorite (for example, 1.6 or more). In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

Further, for example, when the exposure light EL is F ₂ laser light, the F ₂ laser light does not transmit water, so that the liquid LQ can transmit F ₂ laser light, such as perfluorinated polyether (PFPE). ), Fluorine-based fluids such as fluorine-based oils can be used. In this case, a lyophilic treatment is performed by forming a thin film with a substance having a small molecular structure including fluorine, for example, in a portion in contact with the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  Further, as disclosed in, for example, US Pat. No. 6,897,963, a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or various photoelectric sensors are mounted, and a substrate to be exposed. The present invention can also be applied to an exposure apparatus that includes a measurement stage that does not hold the lens. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, the positional information of the mask stage 1 and the substrate stage 2 is measured using the interferometer system 7 including the laser interferometers 7A and 7B. You may use the encoder system which detects the scale (diffraction grating) provided in each stage 1 and 2. FIG. In this case, it is good also as a hybrid system provided with both an interferometer system and an encoder system.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX according to the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 8, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a sectional side view which shows a terminal optical element, a liquid immersion member, and a substrate stage. It is a sectional side view which shows the vicinity of a cover member. It is a perspective view which shows a substrate stage. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of the exposure apparatus which concerns on this embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 10 ... Terminal optical element, 11 ... Ejection surface, 13 ... Cover member, 14 ... 1st surface, 18 ... 1st holding part, 19 ... 2nd holding part, 20 ... 3rd holding part, 28 ... Second surface, 30 ... moving device, 40 ... transport device, EL ... exposure light, EX ... exposure device, G1 ... first gap, G2 ... second gap, LQ ... liquid, LS ... immersion space, P ... substrate, Rg: photosensitive film, T: plate member, W: base material

Claims (36)

  A cover member comprising a first surface facing at least a part of a peripheral region of a surface of a substrate exposed with exposure light through a liquid via a first gap.   The cover member according to claim 1, wherein the first surface is liquid repellent with respect to the liquid.   The cover member according to claim 1, wherein the first surface has an annular shape corresponding to an outer shape of a surface of the substrate. The surface of the substrate includes a surface of a film that is liquid repellent with respect to the liquid,
The cover member according to claim 1, wherein the peripheral region includes a region where the film is removed.   The cover member according to claim 4, wherein the first surface faces a part of the film.   The cover member as described in any one of Claims 1-5 hold | maintained at the board | substrate stage holding the said board | substrate.   The cover member according to claim 6, wherein the cover member is releasably held on the substrate stage.   The cover member as described in any one of Claims 1-7 provided with the 2nd surface which can oppose the emission surface of the optical member which inject | emits the said exposure light.   The cover member according to claim 8, wherein the second surface is liquid repellent with respect to the liquid. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the cover member according to claim 1. An exposure apparatus that exposes a substrate with exposure light through a liquid,
A substrate stage having a first holding unit for holding the substrate;
A second holding part that is arranged on the substrate stage and holds a cover member having a first surface,
The second holding unit is an exposure apparatus that holds the cover member so that at least a part of a peripheral region of the surface of the substrate faces the first surface with a first gap interposed therebetween.   The exposure apparatus according to claim 11, wherein the first surface is liquid repellent with respect to the liquid.   The exposure apparatus according to claim 11, further comprising a moving device that is disposed on the substrate stage and moves the cover member relative to the first holding unit.   The exposure apparatus according to claim 11, wherein the second holding unit holds the cover member in a releasable manner.   The exposure apparatus according to claim 14, further comprising a transport device that transports the cover member.   The exposure apparatus according to claim 15, wherein the transport apparatus is capable of transporting the substrate.   The exposure apparatus according to claim 16, wherein the transport apparatus is capable of transporting the substrate and the cover member together in a state where a peripheral area of the substrate and the first surface of the cover member are opposed to each other.   The exposure apparatus according to claim 11, wherein the second holding unit is disposed around the first holding unit.   The exposure apparatus according to claim 11, wherein the first surface has an annular shape corresponding to an outer shape of a surface of the substrate.   The said 2nd holding | maintenance part hold | maintains the said cover member so that the surface of the said board | substrate hold | maintained at the said 1st holding | maintenance part and the said 1st surface of the said cover member may become substantially parallel. The exposure apparatus according to any one of the above.   21. The exposure apparatus according to claim 11, wherein a size of the first gap is determined so that the liquid does not enter the first gap due to a surface tension of the liquid.   The exposure apparatus according to any one of claims 11 to 21, wherein a size of the first gap is 1 mm or less.   The exposure apparatus according to any one of claims 11 to 22, further comprising a third holding unit that is disposed on the substrate stage and holds a plate member around the cover member held by the second holding unit. An optical member that emits the exposure light;
The cover member has a second surface that can face the emission surface of the optical member;
24. The exposure apparatus according to claim 23, wherein a second gap is formed between the second surface of the cover member held by the second holding portion and the surface of the plate member held by the third holding portion. .   The exposure apparatus according to claim 24, wherein a size of the second gap is determined so that the liquid does not enter the second gap due to a surface tension of the liquid. The surface of the substrate held by the first holding part and the surface of the plate member held by the third holding part are arranged in substantially the same plane,
26. The exposure apparatus according to claim 24, wherein at least a part of the second surface is higher than a surface of the plate member.   26. The exposure apparatus according to claim 24 or 25, wherein at least a part of the second surface is disposed substantially in the same plane as the surface of the plate member.   The exposure apparatus according to any one of claims 24 to 27, wherein the second surface is liquid repellent with respect to the liquid. An optical member that emits the exposure light;
The cover member has a second surface that can face the emission surface of the optical member;
The exposure apparatus according to claim 11, wherein the second surface is liquid repellent with respect to the liquid. Exposing the substrate using the exposure apparatus according to any one of claims 11 to 29;
Developing the exposed substrate; and a device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Causing at least a part of a peripheral region of the surface of the substrate to face the first surface of the cover member via a first gap;
Exposing the substrate in a state where the peripheral region and the first surface are opposed to each other.   32. The exposure method according to claim 31, wherein the first surface is liquid repellent with respect to the liquid. The surface of the substrate includes a surface of a film that is liquid repellent with respect to the liquid,
33. The exposure method according to claim 31 or 32, wherein a part of the peripheral region facing the first surface of the cover member includes a region where the film is removed.   34. The exposure method according to claim 33, wherein a part of the peripheral area facing the first surface of the cover member includes a part of the film.   The exposure method according to claim 33 or 34, wherein the film includes a photosensitive film. Exposing the substrate using the exposure method according to any one of claims 31 to 35;
Developing the exposed substrate; and a device manufacturing method.

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