JP2011018744A - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of suppressing exposure defects.SOLUTION: The exposure apparatus includes: an optical system that includes an emission surface from which exposure light is emitted; a first surface that is disposed in at least a part of a surrounding of an optical path of the exposure light emitted from the emission surface; a second surface that is disposed in at least a part of a surrounding of the first surface and disposed on a side in a first direction in which the exposure light travels from the first surface with respect to a prescribed direction substantially parallel to an optical axis of the optical system, a third surface that is disposed in at least a part of a surrounding of the second surface and disposed on a side in the opposite direction from the first direction from the second surface with respect to the prescribed direction, and a first recovery portion that recovers at least a part of the liquid present in a space defined by the third surface. Here, the surface of the substrate faces the emission surface and the first, the second and the third surfaces in at least a part of the exposure of the substrate, and the substrate is exposed with the exposure light from the emission surface via the liquid between the emission surface and the surface of the substrate.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light emitted from a projection optical system via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2005/259234

  In an immersion exposure apparatus, when an object is moved at a high speed while the liquid is held between the projection optical system and the object (substrate), the liquid flows out or the liquid (film, droplet, etc.) on the object May remain. As a result, an exposure failure may occur or a defective device may occur. On the other hand, when the object is moved at a low speed in order to hold the liquid satisfactorily, the throughput may be reduced.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of defective exposure by suppressing the remaining liquid on an object. Another object of the present invention is to provide a device manufacturing method capable of suppressing the occurrence of defective devices while suppressing a decrease in throughput.

  According to the first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate, an optical system having an exit surface that emits exposure light, and at least a portion around the optical path of the exposure light that exits from the exit surface The first surface disposed on the first surface and at least part of the periphery of the first surface, and on the first direction side where the exposure light travels from the first surface with respect to a predetermined direction substantially parallel to the optical axis of the optical system A second surface, a third surface disposed on at least a part of the periphery of the second surface, and on a second direction side opposite to the first direction from the second surface with respect to the predetermined direction, and a third surface A first recovery port for recovering at least part of the liquid existing in the space defined by the surface, and at least part of the exposure of the substrate, the exit surface, the first surface, the second surface, and the third surface The surface of the substrate faces the substrate, and exposure light from the emission surface passes through the liquid between the emission surface and the substrate surface. Exposure apparatus is provided for exposing the.

  According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate, an optical system having an exit surface that emits exposure light, and at least a portion around the optical path of the exposure light that exits from the exit surface A first member having a first surface disposed at a substantially fixed position relative to the optical system, and a predetermined direction substantially parallel to the optical axis of the optical system at least at a part of the periphery of the first surface. The second surface is disposed on the first direction side where the exposure light travels from the first surface, and is disposed on at least a part of the periphery of the second surface and the second member movable with respect to the first member. A third member having a third surface and movable with respect to the first member; a first recovery port disposed on at least a part of the second surface and capable of recovering at least one of gas and liquid; and a third surface An air supply port for supplying gas, and at least one of exposure of the substrate , The surface of the substrate faces the emission surface, the first surface, the second surface, and the third surface, and the substrate is exposed with exposure light from the emission surface through a liquid between the emission surface and the surface of the substrate. An exposure apparatus is provided.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first and second aspects, and developing the exposed substrate. .

  According to the fourth aspect of the present invention, the first surface disposed in at least a part of the periphery of the optical path of the exposure light emitted from the exit surface of the optical system is opposed to the substrate via the first gap. Holding the liquid between the first surface and the substrate, exposing the substrate with exposure light from the emission surface via the liquid between the emission surface and the substrate, and the first surface and the substrate Recovering at least a portion of the liquid that has flowed out of the substrate, wherein at least a portion of the exposure of the substrate, the substrate has a second surface and a first gap disposed on at least a portion of the periphery of the first surface. Opposing through a smaller second gap and opposing a third surface disposed at least partially around the second surface through a third gap larger than the second gap, the recovery of the liquid Provided is an exposure method performed using a first recovery port arranged on a surface. That.

  According to the fifth aspect of the present invention, the first surface of the first member is disposed at least at a part around the optical path of the exposure light emitted from the exit surface of the optical system, and the position relative to the optical system is substantially fixed. And the substrate are opposed to each other through the first gap, the liquid is held between the first surface and the substrate, and the substrate is exposed to light from the emission surface through the liquid between the emission surface and the substrate. In at least a part of the exposure of the substrate, the step of recovering at least a portion of the liquid that has flowed out between the first surface and the substrate, and supplying a gas to the surface of the substrate. The substrate is disposed on at least a part of the periphery of the first surface, and faces the second surface of the second member movable with respect to the first member via a second gap smaller than the first gap, and the second surface. Arranged at least partially around the surface and movable relative to the first member The third member faces the third surface through a third gap that is smaller than the first gap, and the liquid is recovered using the first recovery port disposed on the second surface, and the gas is supplied to the third surface. An exposure method is provided that is performed using an air inlet disposed on the surface.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure method of the fourth and fifth aspects; and developing the exposed substrate. .

  According to the aspect of the present invention, it is possible to suppress the occurrence of defective exposure by suppressing the liquid remaining on the object. Moreover, according to the aspect of the present invention, it is possible to suppress the occurrence of defective devices while suppressing a decrease in throughput.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is the figure which looked at an example of the liquid immersion member concerning a 1st embodiment from the lower part. FIG. 3 is a side sectional view showing a part of the liquid immersion member according to the first embodiment. FIG. 3 is a side sectional view showing a part of the liquid immersion member according to the first embodiment. FIG. 3 is a side sectional view showing a part of the liquid immersion member according to the first embodiment. It is the figure which looked at an example of the liquid immersion member concerning a 1st embodiment from the lower part. It is the figure which looked at an example of the liquid immersion member concerning a 1st embodiment from the lower part. It is the figure which looked at an example of the liquid immersion member concerning a 1st embodiment from the lower part. It is a figure which shows a part of liquid immersion member which concerns on 1st Embodiment. FIG. 6 is a side sectional view showing a part of a liquid immersion member according to a second embodiment. It is a sectional side view which shows an example of the liquid immersion member which concerns on 3rd Embodiment. It is the figure which looked at an example of the liquid immersion member which concerns on 3rd Embodiment from the downward direction. FIG. 10 is a side sectional view showing a part of a liquid immersion member according to a third embodiment. FIG. 10 is a side sectional view showing a part of a liquid immersion member according to a fourth embodiment. FIG. 10 is a side sectional view showing a part of a liquid immersion member according to a fifth embodiment. FIG. 10 is a side sectional view showing a part of a liquid immersion member according to a sixth embodiment. It is a sectional side view which shows a part of liquid immersion member concerning 7th Embodiment. It is a sectional side view which shows a part of liquid immersion member which concerns on 8th Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX optically positions a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and the positions of the mask stage 1 and the substrate stage 2. Interferometer system 3 for measuring, illumination system IL for illuminating mask M with exposure light EL, projection optical system PL for projecting a pattern image of mask M illuminated with exposure light EL onto substrate P, and exposure light EL A liquid immersion member 4 capable of forming an immersion space LS so that at least a part of the optical path of the liquid crystal is filled with the liquid LQ, a chamber device 5 that houses at least the projection optical system PL, and a body that supports at least the projection optical system PL. 6 and a control device 7 for controlling the overall operation of the exposure apparatus EX.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmissive mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chrome or aluminum. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a multilayer film formed on the base material. The multilayer film is a film in which a plurality of films including at least a photosensitive film are stacked. The photosensitive film is a film formed of a photosensitive material. Further, the multilayer film may include, for example, an antireflection film and a protective film (topcoat film) that protects the photosensitive film.

  The chamber device 5 includes a chamber member 5A that forms a substantially closed internal space 8, and an environment control device 5B that controls the environment (temperature, humidity, cleanliness, pressure, etc.) of the internal space 8. The body 6 is disposed in the internal space 8. The body 6 includes a first column 9 provided on the support surface FL and a second column 10 provided on the first column 9. The first column 9 includes a first support member 11 and a first surface plate 13 supported by the first support member 11 via a vibration isolator 12. The second column 10 includes a second support member 14 provided on the first surface plate 13 and a second surface plate 16 supported by the second support member 14 via a vibration isolator 15. In the present embodiment, the third surface plate 18 is disposed on the support surface FL via the vibration isolator 17.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 has a mask holding part 19 that holds the mask M so as to be releasable, and is movable on the guide surface 16G of the second surface plate 16 while holding the mask M. The mask stage 1 can move while holding the mask M with respect to the illumination region IR by the operation of the drive system 20. The drive system 20 includes a planar motor having a mover 20 </ b> A disposed on the mask stage 1 and a stator 20 </ b> B disposed on the second surface plate 16. A flat motor capable of moving the mask stage 1 is disclosed in, for example, US Pat. No. 6,452,292. The mask stage 1 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 20.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by a holding member (lens barrel) 21. The holding member 21 has a flange 21F. The projection optical system PL is supported by the first surface plate 13 via the flange 21F. A vibration isolator can be provided between the first surface plate 13 and the holding member 21.

  In the present embodiment, the optical axis AX of the projection optical system PL is substantially parallel to the Z axis. In the projection optical system PL, the exposure light EL travels in the −Z direction from the object plane side to the image plane side of the projection optical system PL.

  Here, in the following description, with respect to the Z-axis direction substantially parallel to the optical axis AX of the projection optical system PL, the direction in which the exposure light EL travels in the projection optical system PL is appropriately referred to as the first direction, and the Z-axis direction. In this regard, a direction opposite to the first direction is appropriately referred to as a second direction. In the present embodiment, the first direction is the −Z direction, and the second direction is the + Z direction.

  The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The projection optical system PL has an exit surface 23 that emits the exposure light EL toward the image plane of the projection optical system PL. The exit surface 23 is disposed on the terminal optical element 22 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. The projection region PR includes a position where the exposure light EL emitted from the emission surface 23 can be irradiated. In the present embodiment, the emission surface 23 faces the first direction (−Z direction) and is parallel to the XY plane. The exit surface 23 facing the −Z direction may be a convex surface or a concave surface.

  In the present embodiment, the optical axis AX in the vicinity of the image plane of the projection optical system PL, that is, the optical axis AX of the terminal optical element 22 is substantially parallel to the Z axis. Note that the optical axis defined by the optical element adjacent to the terminal optical element 22 may be regarded as the optical axis of the terminal optical element 22. In the present embodiment, the image plane of the projection optical system PL is substantially parallel to the XY plane including the X axis and the Y axis. In the present embodiment, the image plane is substantially horizontal. However, the image plane may not be parallel to the XY plane or may be a curved surface.

  The substrate stage 2 has a substrate holding portion 24 that holds the substrate P so as to be releasable, and is movable on the guide surface 18G of the third surface plate 18. The substrate stage 2 can move while holding the substrate P with respect to the projection region PR by the operation of the drive system 25. The drive system 25 includes a planar motor having a mover 25 </ b> A disposed on the substrate stage 2 and a stator 25 </ b> B disposed on the third surface plate 18. A flat motor capable of moving the substrate stage 2 is disclosed in, for example, US Pat. No. 6,452,292. The substrate stage 2 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 25.

  The substrate stage 2 has an upper surface 26 that is disposed around the substrate holding unit 24 and can face the emission surface 23. In the present embodiment, the substrate stage 2 is disposed at least at a part of the periphery of the substrate holding portion 24 as disclosed in US Patent Application Publication No. 2007/0177125 and the like, and the lower surface of the plate member T is disposed on the lower surface of the plate member T. It has the plate member holding | maintenance part 27 hold | maintained so that release is possible. In the present embodiment, the upper surface 26 of the substrate stage 2 includes the upper surface of the plate member T. The upper surface 26 is flat.

  Note that the plate member T may not be releasable. That is, it may be provided integrally with the substrate stage 2. In this case, the plate member holding part 27 can be omitted.

  In the present embodiment, the substrate holding unit 24 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The plate member holding portion 27 holds the plate member T so that the upper surface 26 of the plate member T and the XY plane are substantially parallel.

  The interferometer system 3 optically measures the position of the first interferometer unit 3A capable of optically measuring the position of the mask stage 1 (mask M) in the XY plane and the position of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of measuring. When executing the exposure process of the substrate P or when executing the predetermined measurement process, the control device 7 operates the drive systems 20 and 25 based on the measurement result of the interferometer system 3 to thereby perform the mask stage 1 (mask M) and position control of the substrate stage 2 (substrate P) are executed.

  The liquid immersion member 4 is disposed on at least a part of the periphery of the optical path K of the exposure light EL so that the optical path K of the exposure light EL emitted from the emission surface 23 is filled with the liquid LQ. The liquid immersion member 4 forms the liquid immersion space LS so that the optical path K of the exposure light EL between the emission surface 23 and an object disposed at a position facing the emission surface 23 is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object includes at least one of the substrate stage 2 (plate member T) and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the immersion member 4 forms an immersion space LS so that the optical path K of the exposure light EL between the last optical element 22 and the substrate P is filled with the liquid LQ.

  In the present embodiment, the liquid immersion member 4 is disposed in the vicinity of the last optical element 22. The liquid immersion member 4 is supported by the support mechanism 28. In the present embodiment, the support mechanism 28 is supported by the first surface plate 13. In the present embodiment, the liquid immersion member 4 is suspended from the first surface plate 13 via the support mechanism 28.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. When the substrate P is exposed, the control device 7 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are in a predetermined plane in the XY plane that intersects the optical axis AX (the optical path K of the exposure light EL). Move in the scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 7 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  2 is a side sectional view showing the vicinity of the liquid immersion member 4, FIG. 3 is a view of the liquid immersion member 4 seen from below, and FIG. 4 is an enlarged view of a part of FIG.

  As shown in FIGS. 2, 3, and 4, in the present embodiment, the liquid immersion member 4 is an annular member. At least a part of the liquid immersion member 4 is disposed around a part of the optical path of the exposure light EL and the terminal optical element 22. As shown in FIG. 3, in the present embodiment, the outer shape of the liquid immersion member 4 in the XY plane is a circle.

  The liquid immersion member 4 includes a first surface 41 disposed at least around the optical path K of the exposure light EL emitted from the emission surface 23, at least a portion around the first surface 41, and the first surface 41. The second surface 42 disposed on the first direction side (−Z direction side) from the first surface 41, at least part of the periphery of the second surface 42, and the second direction side (+ Z direction) from the second surface 42. And a recovery port 61 for recovering at least a part of the liquid LQ present in the space 53 defined by the third surface 43.

  In the present embodiment, the recovery port 61 is disposed on at least a part of the third surface 43.

  Further, the liquid immersion member 4 has a fourth surface 44 that faces the optical path K and is disposed so as to connect the outer edge of the first surface 41 and the inner edge of the second surface 42.

  Further, the liquid immersion member 4 has a fifth surface 45 disposed on at least a part of the periphery of the third surface 43 and on the first direction side (−Z direction side) from the third surface 43 with respect to the Z-axis direction. Have.

  The first surface 41, the second surface 42, the third surface 43, and the fifth surface 45 can face the surface (upper surface) of the object disposed below the liquid immersion member 4.

  As shown in FIG. 3, in the present embodiment, the outer shapes of the first surface 41, the second surface 42, the third surface 43, and the fifth surface 45 in the XY plane are circular. Further, the inner edges of the second surface 42, the third surface 43, and the fifth surface 45 in the XY plane are also circular.

  At least part of the exposure of the substrate P, the surface of the substrate P faces the emission surface 23, the first surface 41, the second surface 42, the third surface 43, and the fifth surface 45. In the present embodiment, a part of the immersion space LS is formed by the liquid LQ held between the first surface 41 and the object arranged in the projection region PR. In at least a part of the exposure of the substrate P, the first surface 41 is irradiated with the exposure light EL emitted from the emission surface 23 so that the optical path K of the exposure light EL emitted from the emission surface 23 is filled with the liquid LQ. The liquid LQ is held between the substrate P arranged at a possible position (projection region PR). Thereby, the liquid LQ is filled in the space between the emission surface 23 and the surface of the substrate P in at least a part of the exposure of the substrate P. The substrate P is exposed with the exposure light EL from the emission surface 23 via the liquid LQ between the emission surface 23 and the surface of the substrate P.

  Hereinafter, for simplicity, the substrate P is disposed at a position facing the emission surface 23, the first surface 41, the second surface 42, the third surface 43, and the fifth surface 45, and the liquid immersion member 4 and the substrate P The case where the liquid LQ is held therebetween to form the immersion space LS will be described as an example. As described above, the liquid immersion space LS can be formed between the emission surface 23 and the liquid immersion member 4 and at least one other member (such as the plate member T of the substrate stage 2).

  In the present embodiment, the first surface 41 is substantially parallel to the XY plane. As shown in FIG. 4 etc., the 1st surface 41 opposes the surface of the board | substrate P through the 1st gap G1. Note that the first surface 41 may not be parallel to the XY plane, and may include a curved surface.

  In the present embodiment, the second surface 42 is substantially parallel to the first surface 41. That is, the second surface 42 is substantially parallel to the XY plane. The second surface 42 faces the surface of the substrate P via the second gap G2. Note that the second surface 42 may not be parallel to the XY plane, and may include a curved surface.

  In the present embodiment, the third surface 43 is disposed on at least a part of the periphery of the second surface 42 and is inclined in the second direction (+ Z direction) toward the outside with respect to the radial direction with respect to the optical axis AX. And a second inclined surface 432 that is disposed at least partly around the first inclined surface 431 and is inclined outward in the first direction (−Z direction) with respect to the radial direction with respect to the optical axis AX. In the present embodiment, the third surface 43 includes a flat surface 433 that is disposed between the first inclined surface 431 and the second inclined surface 432 and substantially parallel to the first surface 41 (XY plane). In the present embodiment, the recovery port 61 is disposed on the second slope 432. The third surface 43 faces the surface of the substrate P via the third gap G3.

  In the third surface 43, the flat surface 433 may be inclined with respect to the XY plane. For example, the third surface 43 may be inclined in the second direction toward the outside with respect to the radial direction with respect to the optical axis AX at a different angle from the first inclined surface 431, or at a different angle from the second inclined surface 432. , And may be inclined in the first direction toward the outside with respect to the radial direction with respect to the optical axis AX. Further, the flat surface 433 may include a curved surface.

  The third surface 43 may not have the flat surface 433. That is, the third surface 43 includes a first inclined surface 431 disposed at least partly around the second surface 42 and a second inclined surface 432 disposed at least partly around the first inclined surface 431. May be.

  In the third surface 43, the first inclined surface 431 may include a curved surface, and the second inclined surface 432 may include a curved surface.

  In the present embodiment, the fifth surface 45 is substantially parallel to the second surface 42. That is, the fifth surface 45 is substantially parallel to the XY plane. The fifth surface 45 faces the surface of the substrate P via the fifth gap G5.

  In the present embodiment, the positions of the second surface 42 and the fifth surface 45 are substantially equal in the Z-axis direction. That is, in the present embodiment, the second surface 42 and the fifth surface 45 are disposed in the same plane.

  The fifth surface 45 may not be parallel to the XY plane. For example, the fifth surface 45 may be inclined outward in the second direction with respect to the radial direction with respect to the optical axis AX, or may include a curved surface.

  In the present embodiment, the second gap G2 is smaller than the first gap G1. The third gap G3 is larger than the second gap G2. The second gap G2 and the fifth gap G5 are substantially equal.

  The first surface 41 is disposed around the optical path K, and a flat surface 411 that cannot collect the liquid LQ, and a liquid recovery surface 412 that is disposed on at least a part of the periphery of the flat surface 411 and can collect the liquid LQ. including.

  The liquid immersion member 4 is disposed on at least a part of the first surface 41 and has a recovery port 62 that can recover the liquid LQ. A porous member 63 is disposed in the recovery port 62. The porous member 63 is a plate-like member including a plurality of holes (openings or pores). The porous member 63 may be a mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape. The recovery port 62 can recover the liquid LQ on the substrate P through the hole of the porous member 63. Note that the porous member 63 may not be disposed in the recovery port 62.

  In the present embodiment, the liquid recovery surface 412 of the first surface 41 includes the surface of the porous member 63. That is, in the present embodiment, the first surface 41 includes the flat surface 411 and the surface (lower surface) of the porous member 63 that is disposed around the flat surface 411 and can collect the liquid LQ.

  In the present embodiment, the second surface 42 is a flat surface that cannot recover the liquid LQ. In the present embodiment, the second surface 42 is more liquid repellent than the first surface 41 with respect to the liquid LQ. In the present embodiment, the contact angle of the second surface 42 with respect to the liquid LQ is, for example, 90 degrees or more, and may be 100 degrees or more. In the present embodiment, the second surface 42 is formed of a film that is liquid repellent with respect to the liquid LQ. The film is formed of a liquid repellent material containing, for example, fluorine. Examples of the liquid repellent material include PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), and Teflon (registered trademark).

  In the present embodiment, a part of the immersion space LS is formed by the liquid LQ held between the first surface 41, the fourth surface 44, and the substrate P (object) disposed in the projection region PR. The In at least a part of the exposure of the substrate P, the liquid LQ is held in the space 51 defined by the first surface 41, the fourth surface 44, and the substrate P, and a part of the immersion space LS is formed. .

  The second surface 42 prevents the liquid LQ (liquid LQ in the space 51) between the first surface 41 and the substrate P from flowing out. In the present embodiment, the second surface 42 is liquid repellent with respect to the liquid LQ. The second gap G2 is 100 μm or less and is very small. In the present embodiment, the second gap G2 is, for example, about 5 to 20 μm. Thereby, the outflow of the liquid LQ from the space 51 is suppressed. In the present embodiment, the surface of the object including the surface of the substrate P and the upper surface of the plate member T is also liquid repellent with respect to the liquid LQ. Thereby, the outflow of the liquid LQ in the space 51 is suppressed more effectively.

  The fifth surface 45 is a flat surface that cannot recover the liquid LQ. In the present embodiment, the fifth surface 45 is more liquid repellent than the first surface 41 with respect to the liquid LQ. In the present embodiment, the contact angle of the fifth surface 45 with respect to the liquid LQ is, for example, 90 degrees or more, and may be 100 degrees or more. In the present embodiment, like the second surface 42, the fifth surface 45 is formed of a film that is liquid repellent with respect to the liquid LQ.

  The fourth surface 44 is liquid repellent with respect to the liquid LQ. In the present embodiment, the fourth surface 44 is more liquid repellent than the first surface 41 with respect to the liquid LQ. In the present embodiment, like the second surface 42, the fourth surface 44 is formed of a film that is liquid repellent with respect to the liquid LQ.

  In the present embodiment, the liquid immersion member 4 is disposed around the sixth surface 46, the sixth surface 46 facing the at least part of the emission surface 23, facing the first surface 41 and opposite to the first surface 41. 22 has a seventh surface 47 facing the side surface 35, and an eighth surface 48 disposed around the seventh surface 47 and facing the outer surface 36 of the holding member 21. The liquid immersion member 4 includes a plate portion 37 disposed so that at least a part thereof faces the emission surface 23, and a main body portion 38 disposed at least around the terminal optical element 22. At least a part of the first surface 41 and the sixth surface 46 are disposed on the plate portion 37. At least a part of the first surface 41, the second surface 42, the third surface 43, the fourth surface 44, the fifth surface 45, the seventh surface 47, and the eighth surface 48 are disposed on the main body 38. Further, the plate portion 37 has an opening 39 through which the exposure light EL emitted from the emission surface 23 can pass. During the exposure of the substrate P, the exposure light EL emitted from the emission surface 23 is irradiated on the surface of the substrate P through the opening 39. As shown in FIG. 3, in the present embodiment, the opening 39 is long in the X-axis direction intersecting the scanning direction (Y-axis direction) of the substrate P.

  The sixth surface 46 faces the emission surface 23 via the sixth gap G6. The seventh surface 47 faces the side surface 35 via the seventh gap G7. The eighth surface 48 faces the outer surface 36 via the eighth gap G8.

  The side surface 35 of the last optical element 22 is a surface different from the exit surface 23 and is a surface through which the exposure light EL does not pass. The side surface 35 is disposed around the emission surface 23. The side surface 35 is disposed so as to extend upward (+ Z direction) from the periphery of the emission surface 23. The side surface 35 is provided so as to extend from the periphery of the emission surface 23 in a radiation direction with respect to the optical axis AX (a direction perpendicular to the optical axis AX). That is, the side surface 35 is inclined so as to extend in the radial direction with respect to the optical axis AX and in the second direction (+ Z direction).

  In the present embodiment, the sixth surface 46 and the exit surface 23 are substantially parallel. Further, the seventh surface 47 and the side surface 35 are substantially parallel. Further, the eighth surface 48 and the outer surface 36 are substantially parallel.

  The sixth surface 46 and the emission surface 23 do not have to be parallel. Further, the seventh surface 47 and the side surface 35 may not be parallel. Further, the eighth surface 48 and the outer surface 36 may not be parallel.

  In the present embodiment, the seventh surface 47 faces the side surface 35 of the last optical element 22, but at least a part of the seventh surface 47 may face the outer surface of the holding member 21. In the present embodiment, the eighth surface 48 faces the outer surface 36 of the holding member 21, but when the lower surface of the terminal optical element 22 is exposed around the side surface 35 of the terminal optical element 22. In this case, at least a part of the eighth surface 48 may face the lower surface of the last optical element 22.

  In the present embodiment, the liquid immersion member 4 includes a supply port 64 that supplies the liquid LQ to the optical path K of the exposure light EL. In the present embodiment, the supply port 64 is disposed on at least a part of the seventh surface 47. The supply port 64 is disposed so as to face the space 56 between the sixth surface 46 and the emission surface 23.

  In the present embodiment, one supply port 64 is disposed on each of the + Y side and the −Y side with respect to the optical axis AX. One supply port 64 may be arranged on each of the + X side and the −X side with respect to the optical axis AX. Further, the number of supply ports 64 may be three or more.

  As shown in FIG. 2, the supply port 64 is connected to the liquid supply device 66 via the supply flow path 65. In the present embodiment, the supply flow path 65 includes an internal flow path 65 </ b> A of the liquid immersion member 4 and a supply pipe flow path 65 </ b> B that connects the internal flow path 65 </ b> A and the liquid supply device 66. The liquid supply device 66 can supply clean and temperature-adjusted liquid LQ to the supply port 64.

  The recovery port 62 is connected to a liquid recovery device 68 via a recovery channel 67. In the present embodiment, the recovery flow path 67 includes an internal flow path 67A of the liquid immersion member 4 and a recovery pipe flow path 67B connecting the internal flow path 67A and the liquid recovery device 68. The liquid recovery device 68 includes a vacuum system (such as a valve that controls the connection state between the vacuum source and the recovery port 62), and can recover the liquid LQ by suctioning from the recovery port 62.

  The recovery port 61 is connected to the liquid recovery device 70 via a recovery flow channel 69. In the present embodiment, the recovery flow path 69 includes an internal flow path 69A of the liquid immersion member 4 and a flow path 69B of a recovery pipe that connects the internal flow path 69A and the liquid recovery device 70. The liquid recovery apparatus 70 includes a vacuum system (such as a valve that controls the connection state between the vacuum source and the recovery port 61), and can recover the liquid LQ by suction from the recovery port 61.

  In the present embodiment, the supply port 64 supplies the liquid LQ to the space 56. The liquid LQ supplied to the space 56 is supplied to the optical path K of the exposure light EL that is emitted from the emission surface 23. Further, at least a part of the liquid LQ supplied from the supply port 64 to the space 56 is supplied to the space 51 between the first surface 41 and the surface of the substrate P through the opening 39. The liquid LQ supplied to the space 51 is held between the first surface 41 and the surface of the substrate P to form a part of the immersion space LS.

  In addition, at least part of the liquid LQ supplied from the supply port 64 is supplied to the space 57 between the side surface 35 and the seventh surface 47. The liquid LQ supplied to the space 57 is held between the side surface 35 and the seventh surface 47 and forms a part of the immersion space LS.

  In the present embodiment, the gas-liquid interface (meniscus, edge) of the liquid LQ in the immersion space LS includes the first interface LG1 disposed between the liquid immersion member 4 and the surface of the object (substrate P), and projection optics. 2nd interface LG2 arrange | positioned between the system PL and the liquid immersion member 4 is included.

  In at least a part of the exposure of the substrate P, the first interface LG1 is disposed between the first surface 41 and the surface of the substrate P, or between the inner edge of the second surface 42 and the surface of the substrate P. . The second interface LG2 is disposed between the side surface 35 and the seventh surface 47. In the present embodiment, in at least a part of the exposure of the substrate P, the immersion space LS is formed so that a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ. The exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  A recovery port for recovering the liquid LQ may be provided on at least one of the seventh surface 47 and the eighth surface 48.

  In the present embodiment, the control device 7 uses the recovery port 62 in parallel with the operation of supplying the liquid LQ from the supply port 64 in order to form the immersion space LS in at least part of the exposure of the substrate P. The liquid LQ recovery operation is executed. Thereby, the immersion space LS is formed so that the space 51 and the space 56 including the optical path K are filled with the liquid LQ.

  In this embodiment, the control device 7 controls the liquid recovery device 68 so that only the liquid LQ passes from the lower surface side space (space 51) of the porous member 63 to the upper surface side space (recovery flow path 67). Thus, the pressure difference between the lower surface side space and the upper surface side space of the porous member 63 can be controlled. In the present embodiment, the pressure in the space 51 on the lower surface side is substantially equal to the pressure in the internal space 8 in which the liquid immersion member 4 is disposed, and is controlled by the chamber device 5. The control device 7 controls the liquid recovery device 68 so that only the liquid LQ passes from the lower surface side to the upper surface side of the porous member 63, and adjusts the pressure on the upper surface side according to the pressure on the lower surface side. That is, the control device 7 collects only the liquid LQ from the space 51 through the hole of the porous member 63 and adjusts the gas so as not to pass through the hole of the porous member 63. A technique for adjusting only the pressure difference between one side and the other side of the porous member and allowing only the liquid LQ to pass from one side to the other side of the porous member is disclosed in, for example, US Pat. No. 7,292,313. Note that gas may flow in with the liquid LQ in the space 51 through the hole of the porous member 63.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The control device 7 makes the first surface 41, the second surface 42, the third surface 43, and the fifth surface 45 face the surface of the substrate P (or the upper surface 26 of the substrate stage 2). The first surface 41 and the surface of the substrate P are opposed via the first gap G1, and the second surface 42 and the surface of the substrate P are opposed via the second gap G2, and the third surface 43 and the substrate are opposed to each other. The surface of P faces through the third gap G3, and the fifth surface 45 and the surface of the substrate P face each other through the fifth gap G5.

  The control device 7 sends out the liquid LQ from the liquid supply device 66 with the first surface 41, the second surface 42, the third surface 43, and the fifth surface 45 facing the surface of the substrate P. Further, the control device 7 operates the liquid recovery device 68. Further, the control device 7 operates the liquid recovery device 70.

  The liquid LQ delivered from the liquid supply device 66 is supplied to the space 56 from the supply port 64. The liquid LQ supplied to the space 56 is supplied to the optical path K of the exposure light EL that is emitted from the emission surface 23. In addition, at least a part of the liquid LQ supplied from the supply port 64 to the space 56 is supplied to the space 51 through the opening 39 and is held between the first surface 41 and the surface of the substrate P. In addition, at least a part of the liquid LQ on the substrate P is recovered from the recovery port 62 disposed on the first surface 41 so as to face the surface of the substrate P. Thereby, the immersion space LS is formed by the liquid LQ supplied from the supply port 64 so that the optical path K of the exposure light EL is filled with the liquid LQ.

  In the present embodiment, the immersion space LS is formed so that the space 51 surrounded by the surface of the substrate P, the first surface 41, and the fourth surface 44 is substantially filled with the liquid LQ. The first interface LG1 of the liquid LQ in the immersion space LS is formed between the inner edge of the second surface 42 (the lower end of the fourth surface 44) and the surface of the substrate P.

  In parallel with the supply operation of the liquid LQ from the supply port 64, the control device 7 executes the recovery operation of the liquid LQ from the recovery port 62, so that the liquid path is filled with the optical path K of the exposure light EL. The immersion space LS is formed.

  The control device 7 emits the exposure light EL from the illumination system IL, and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is emitted from the emission surface 23 of the projection optical system PL. Thereby, the substrate P is exposed with the exposure light EL from the emission surface 23 through the liquid LQ between the emission surface 23 and the substrate P, and an image of the pattern of the mask M is projected onto the substrate P.

  In the present embodiment, the outflow of the liquid LQ in the space 51 is suppressed by the second surface 42. That is, the liquid LQ in the space 51 is suppressed from flowing into the space 53 formed between the third surface 43 and the substrate P via the second gap G2.

  In the present embodiment, the interface LG1 of the liquid LQ in the immersion space LS in the XY plane is suppressed from moving outside the fourth surface 44, and the expansion of the immersion space LS is suppressed. .

  In the present embodiment, the first surface 41 is opposed to the surface of the substrate P via the first gap G1, and the second surface 42 disposed around the first surface 41 is the surface of the substrate P and the second gap. Opposite via G2. The second gap G2 is sufficiently smaller than the first gap G1. Therefore, the interface LG1 is restrained from moving outside the second gap G2 in the radial direction with respect to the optical axis AX. That is, since the second gap G2 is very small, as shown in FIG. 4 and the like, due to the surface tension of the liquid LQ, the position of the interface LG1 is the inner edge of the second surface 42 (the lower end of the fourth surface 44) and the substrate P. Maintained between the surface of the. As a result, the liquid LQ in the immersion space LS is suppressed from flowing into the space 53 via the second gap G2.

  In the present embodiment, since the second surface 42 is liquid repellent with respect to the liquid LQ, the outflow of the liquid LQ in the space 51 is more effectively suppressed. In the present embodiment, since the fourth surface 44 is disposed so as to extend upward from the inner edge of the second surface 42 and face the optical path K, the expansion of the immersion space LS is suppressed. Is done. This also suppresses expansion of the immersion space LS.

  Further, since the fourth surface 44 is liquid repellent with respect to the liquid LQ, the outflow of the liquid LQ can be further suppressed. In the present embodiment, since the fourth surface 44 is more liquid repellent than the first surface 41 with respect to the liquid LQ, the outflow of the liquid LQ can be effectively suppressed.

  The fourth surface 44 may not be liquid repellent with respect to the liquid LQ. For example, the liquid repellency of the first surface 41 with respect to the liquid LQ may be substantially equal to the liquid repellency of the fourth surface 44 with respect to the liquid LQ.

  In the present embodiment, the outer shape of the first surface 41 and the inner edge of the second surface 42 are circular, and the outer shape of the immersion space LS in the XY plane is also approximately circular. As a result, the restraining force from all directions of the interface LG1 of the immersion space LS toward the center acts almost evenly. Thereby, the expansion of the immersion space LS is more effectively suppressed.

  In the present embodiment, even when the liquid LQ in the space 51 flows out and flows into the space 53 through the second gap G2, the liquid LQ existing in the space 53 defined by the third surface 43 can be recovered. Since the recovery port 61 is provided, the liquid LQ is prevented from flowing out of the space 53 or remaining on the substrate P.

  FIG. 5 is a schematic diagram showing a state in which a part of the liquid LQ in the space 51 has flowed out through the second gap G2.

  As shown in FIG. 5, for example, when the substrate P moves at a high speed in the −Y direction, the second surface 42 and the second surface 42 are moved from the space 51 between the first surface 41 and the substrate P as the substrate P moves. The liquid LQ may flow out through the second gap G2 with the substrate P. The liquid LQ flowing out of the space 51 may be thinned on the surface of the substrate P when passing through the second gap G2.

  In the present embodiment, a third surface 43 is provided around the second surface 42 that forms the second gap G2, and is disposed on the second direction side (+ Z direction side) from the second surface 42 with respect to the Z-axis direction. ing. The third surface 43 forms a third gap G3 larger than the second gap G2 outside the second gap G2 with respect to the optical axis AX. As a result, as shown in FIG. 5, the liquid LQ that has become a thin film in the second gap G2 becomes droplets on the substrate P by moving to the third gap G3 (space 53).

  In other words, when the liquid LQ flows from the space 51 to the third gap G3 (space 53) via the second gap G2, the Z-axis direction (the method of the surface of the substrate P) in the third gap G3 (space 53) The size Z3 of the liquid LQ (drop-like liquid LQ) with respect to the linear direction is larger than the size Z2 of the liquid LQ (thin film-like liquid LQ) when passing through the second gap G2.

  Thereby, the recovery port 61 smoothly smoothes at least a part of the liquid LQ that has flowed out from the space 51 between the first surface 41 and the substrate P through the second gap G2 between the second surface 42 and the substrate P. Can be recovered.

  That is, in the present embodiment, even when the liquid LQ flows out of the space 51 using the fact that the liquid LQ that has become a thin film in the second gap G2 changes into a drop shape due to, for example, surface tension in the space 53, The liquid LQ that has flowed out is satisfactorily recovered from the recovery port 61 in the space 53. As a result, the substrate P is prevented from flowing out between the liquid immersion member 4 and the substrate P, and the liquid LQ is prevented from remaining on the substrate P.

  As described above, according to the present embodiment, since the second surface 42 is provided, the liquid in the space 51 is formed by the minute second gap G2 between the second surface 42 and the surface of the substrate P. LQ outflow is suppressed. In addition, since the third surface 43 that forms the third gap G3 larger than the second gap G2 with the surface of the substrate P is disposed around the second surface 42, the thinned liquid LQ is Drops can be formed in the third gap G3 (space 53). Then, since the liquid LQ in the space 53 is recovered by the recovery port 61, the liquid LQ in the liquid immersion space LS flows out of the space between the liquid immersion member 4 and the substrate P or on the substrate P. It is suppressed that it remains. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

  In the present embodiment, since the fifth surface 45 that is disposed around the third surface 43 and forms the minute fifth gap G5 with the surface of the substrate P is disposed, the liquid in the space 53 LQ outflow is suppressed. Further, since the fifth surface 45 is liquid repellent with respect to the liquid LQ, the outflow of the liquid LQ in the space 53 is more effectively suppressed.

  Note that the fifth surface 45 may not be liquid repellent with respect to the liquid LQ. For example, the liquid repellency of the first surface 41 with respect to the liquid LQ may be substantially equal to the liquid repellency of the fifth surface 45 with respect to the liquid LQ.

  In the present embodiment, the fifth surface 45 may be omitted.

  In the present embodiment, since the recovery port 61 is disposed on the second slope 432, the liquid LQ (droplet liquid LQ) in the space 53 can be recovered smoothly.

  As shown in FIG. 6, the recovery port 61 may be disposed on the first slope 431. By arranging the recovery port 61 on the first slope 431, the recovery port 61 can smoothly recover the liquid LQ in the space 53.

  Note that the recovery ports 61 may be disposed on both the first slope 431 and the second slope 432.

  In the present embodiment, the second surface 42 is more liquid repellent than the first surface 41 with respect to the liquid LQ, but may not be liquid repellent with respect to the liquid LQ. For example, the liquid repellency of the first surface 41 with respect to the liquid LQ may be substantially equal to the liquid repellency of the second surface 42 with respect to the liquid LQ.

  In the present embodiment, the outer shapes of the first surface 41, the second surface 42, the third surface 43, and the fifth surface 45 in the XY plane are circular, and the second surface 42 and the third surface in the XY plane are circular. The inner edges of the surface 43 and the fifth surface 45 are also circular, but may be any polygon. For example, a quadrangle may be used like the liquid immersion member 4B shown in FIG. 7 and the liquid immersion member 4C shown in FIG. 8, and an octagon may be used like the liquid immersion member 4D shown in FIG. Further, it may be oval.

  In the present embodiment, the second surface 42 is substantially parallel to the XY plane (first surface 41), and the second surface 42 and the fourth surface 44 intersect substantially perpendicularly. As shown in FIG. 10A, the second surface 42 and the fourth surface 44 may be connected by a curved surface, or may be connected by a plane as shown in FIG. Moreover, as shown in FIG. 10C and FIG. 10C, the second surface 42 and the fourth surface 44 may be connected by a plurality of planes. Further, as shown in FIG. 10E, the second surface 42 may be non-parallel to the XY plane, or as shown in FIG. 10F, the second surface 42 and the fourth surface substantially parallel to the XY plane. The angle formed by 44 may be an acute angle. The angle formed between the second surface 42 and the fourth surface 44 may be an obtuse angle. Further, as shown in FIG. 10G, the second surface 42 may be non-parallel to the XY plane, and the second surface 42 and the fourth surface 44 may be connected by a curved surface, or FIG. As shown in FIG. 4, the angle formed between the second surface 42 and the fourth surface 44 substantially parallel to the XY plane may be an acute angle, and the second surface 42 and the fourth surface 44 may be connected by a curved surface. The angle formed between the second surface 42 and the fourth surface 44 that is substantially parallel to the XY plane may be an obtuse angle, and the second surface 42 and the fourth surface 44 may be connected by a curved surface.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 11 is a diagram illustrating an example of the liquid immersion member 4E according to the second embodiment. A characteristic part of the second embodiment different from the first embodiment described above is that an air supply port 71 for supplying gas is provided on the fifth surface 45.

  In FIG. 11, the liquid immersion member 4 </ b> E is disposed on the fifth surface 45 and includes an air supply port 71 that supplies gas. The air supply port 71 supplies gas to the space 55 between the fifth surface 45 and the substrate P. The air supply port 71 supplies gas toward the surface of the substrate P. The air supply port 71 is connected to a gas supply device (not shown) through a supply channel. The gas supply device can supply clean and temperature-adjusted gas to the air supply port 71.

  By supplying the gas from the air supply port 71 to the space 55, the pressure of the space 55 becomes higher than the pressure of the space 53 and the pressure of the space 8 around the liquid immersion member 4 </ b> E controlled by the chamber device 5. As shown in FIG. 11, when a gas is supplied from the air supply port 71, a gas flow from the space 55 toward the space 53 is generated. In the present embodiment, a gas seal is formed between the fifth surface 45 and the surface of the substrate P by the gas supplied from the air supply port 71. Thereby, the outflow of the liquid LQ in the space 53 is more effectively suppressed. Note that a gas bearing may be formed by the gas supplied from the air supply port 71 to prevent contact between the liquid immersion member 4E and the substrate P.

  Moreover, the various modifications (for example, the modification of FIGS. 6-10) demonstrated by the above-mentioned embodiment are applicable also to this embodiment.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  12 is a side sectional view showing the vicinity of the liquid immersion member 4F according to the second embodiment, FIG. 13 is a view of the liquid immersion member 4F viewed from below, and FIG. 14 is an enlarged view of a part of FIG. It is. A characteristic part of the third embodiment different from the first embodiment described above is that a supply port 72 for supplying the liquid LQ is provided on at least a part of the first surface 41F. Furthermore, a characteristic part of the third embodiment is that a recovery port 73 capable of recovering the liquid LQ is provided in at least a part of the second surface 42F.

  The liquid immersion member 4F is disposed on at least a part of the first surface 41F, and includes a supply port 72 that supplies the liquid LQ and a supply port 64 that supplies the liquid LQ to the optical path K. The supply port 72 supplies the liquid LQ to the first direction side (−Z direction side). The supply port 72 supplies clean and temperature-adjusted liquid LQ.

  The supply port 72 is disposed in the vicinity of the second surface 42F (fourth surface 44F). In other words, the supply port 72 is disposed in the vicinity of the second gap G2. As shown in FIG. 13, a plurality of supply ports 72 are arranged around the optical path K at a predetermined interval.

  The liquid immersion member 4F includes a recovery port 73 that is disposed on at least a part of the second surface 42F and can recover the liquid LQ. A porous member 74 is disposed in the recovery port 73. The recovery port 73 can recover the liquid LQ through the hole of the porous member 74. In the present embodiment, the second surface 42F includes the surface (lower surface) of the porous member 73.

  In the present embodiment, the first surface 41F does not include a liquid recovery surface (recovery port). The first surface 41F may have a liquid recovery surface (recovery port).

  In addition, the liquid immersion member 4F includes a recovery port 75 that recovers the liquid LQ in the space between the projection optical system PL and the liquid immersion member 4F. The recovery port 75 recovers the liquid LQ in the space 57 between the side surface 35 and the seventh surface 47. The collection port 75 is disposed on the seventh surface 47. The collection port 75 is disposed above the supply port 64. At least a part of the liquid LQ supplied from the supply port 64 is supplied to the space 57 between the side surface 35 and the seventh surface 47. The recovery port 75 recovers at least a part of the liquid LQ supplied from the supply port 64 to the space 57.

  The recovery port 75 may not be provided. For example, the recovery port 75 may be eliminated, and the recovery port may be disposed on the first surface 41F.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The control device 7 makes the first surface 41F, the second surface 42F, the third surface 43F, and the fifth surface 45F face the surface of the substrate P (or the upper surface 26 of the substrate stage 2).

  The control device 7 supplies the liquid LQ from the supply port 64 and the supply port 72 with the first surface 41F, the second surface 42F, the third surface 43F, and the fifth surface 45F facing the surface of the substrate P. At the same time, the recovery operation of the liquid LQ from the recovery port 75 is executed in parallel with the supply operation of the liquid LQ from the supply port 64 and the supply port 72. Thereby, the immersion space LS is formed so that the space 51 and the space 56 including the optical path K are filled with the liquid LQ.

  The control device 7 emits the exposure light EL from the illumination system IL, and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is emitted from the emission surface 23 of the projection optical system PL. Thereby, the substrate P is exposed with the exposure light EL from the emission surface 23 through the liquid LQ between the emission surface 23 and the substrate P, and an image of the pattern of the mask M is projected onto the substrate P.

  Also in this embodiment, the outflow of the liquid LQ in the space 51 defined by the first surface 41F, the fourth surface 44F, and the surface of the substrate P is suppressed by the second surface 42F.

  Even if the liquid LQ in the space 51 flows out, the flowing out liquid LQ is recovered from the recovery port 73 provided in the second surface 42F when passing through the second gap G2.

  Even when the liquid LQ in the space 51 flows out through the second gap G <b> 2, the liquid LQ is recovered from the recovery port 61 in the space 53.

  In the present embodiment, since the supply port 72 is disposed on the first surface 41, the cleanliness of the liquid LQ in the space 51 can be maintained. For example, contact with the surface of the substrate P may reduce the cleanliness of the liquid LQ. For example, when the substrate P and the liquid LQ come into contact with each other, a substance (e.g., an organic substance such as a photosensitive material) generated (eluted) from the substrate P is mixed into the liquid LQ in the space 51 as a foreign substance (contaminant, particle). there is a possibility.

  In the present embodiment, since the supply port 72 for supplying the liquid LQ to the space 51 is disposed on the first surface 41, the degree of cleanliness of the liquid LQ in the space 51 is determined by the liquid LQ supplied from the supply port 72. Reduction is suppressed. That is, even if at least a part of the liquid LQ in the space 51 comes into contact with the surface of the substrate P and foreign matter generated from the substrate P enters the liquid LQ in the space 51, the clean supplied to the space 51 from the supply port 72. The ratio of foreign matter (contaminant concentration) in the liquid LQ in the space 51 can be reduced by the liquid LQ.

  Thereby, it is suppressed that the cleanness of the liquid LQ in the immersion space LS decreases. Even if the liquid LQ in the space 51 has flowed out, the liquid LQ that has flowed out is clean, so that the spread of damage is suppressed, for example, the contamination of the second surface 42F, the third surface 43F, etc. is suppressed. be able to.

  In the present embodiment, the supply port 72 may not be provided. Similarly to the first embodiment described above, a recovery port may be provided on the first surface 41F without providing the recovery port 73 on the second surface 42F.

  Moreover, the various modifications (for example, the modification of FIGS. 6-10) demonstrated by the above-mentioned embodiment are applicable also to this embodiment.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 15 is a diagram illustrating an example of the liquid immersion member 4G according to the fourth embodiment. The fourth embodiment is a modification of the third embodiment. A characteristic part of the fourth embodiment different from the third embodiment described above is that an air supply port 76 for supplying gas to the space 57 and a recovery port 77 for recovering the gas are provided.

  In FIG. 15, the liquid immersion member 4 </ b> G includes an air supply port 76 that supplies a gas GW to the space 57 (seventh gap G <b> 7). The air supply port 76 is disposed so as to face the seventh gap G7. In the present embodiment, the air supply port 76 is disposed on the seventh surface 47 of the liquid immersion member 4 </ b> G facing the side surface 35.

  In the present embodiment, the air supply port 76 supplies a gas GW having a humidity higher than the humidity of the internal space 8 adjusted by the chamber device 5 to the seventh gap G7. The air supply port 76 supplies the gas GW so that the gas GW contacts the interface LG2 of the liquid LQ that has flowed into the seventh gap G7.

  The air supply port 76 is connected to a gas supply device (not shown) through a supply channel. The gas supply device supplies a gas having higher humidity than the gas supplied from the chamber device 5 to the internal space 8 to the air supply port 76. In the present embodiment, the gas supply device supplies the same kind of gas as the gas in the internal space 8 to the air supply port 76. Further, the gas supply device humidifies the gas supplied to the air supply port 76 with the same kind of liquid vapor as the liquid LQ. In the present embodiment, the chamber device 5 fills the internal space 8 with clean air, and the air supply port 76 supplies air humidified with water vapor to the seventh gap G7.

  In the present embodiment, the liquid immersion member 4G is disposed so as to face the seventh gap G7, and includes a recovery port 77 that recovers at least a part of the gas GW supplied from the air supply port 76. . In the present embodiment, the recovery port 77 is disposed on the seventh surface 47 of the liquid immersion member 4G. The recovery port 77 can recover the liquid LQ in the seventh gap G7.

  In the present embodiment, the recovery port 77 is disposed above the air supply port 76. The recovery port 77 is disposed above the air supply port 76 and adjacent to the air supply port 76.

  Since the gas GW is supplied from the air supply port 76 so as to be in contact with the interface LG2 of the liquid LQ, the liquid LQ is suppressed from being vaporized. Accordingly, it is possible to suppress the occurrence of at least one temperature change of the liquid LQ, the liquid immersion member 4G, and the object (substrate P) facing the liquid immersion member 4G due to the heat of vaporization of the liquid LQ.

  In addition, at least a part of the gas GW supplied from the air supply port 76 is recovered from the recovery port 77. Accordingly, the gas GW from the air supply port 76 is suppressed from flowing out from between the liquid immersion member 4G and the projection optical system PL to the outside (atmosphere).

  It should be noted that the air supply port 76 that supplies the humidified gas GW and the recovery port 77 that recovers at least a part of the gas GW include the liquid immersion member (such as 4) described in the first to third embodiments. You may arrange in.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a diagram illustrating an example of the liquid immersion member 4H according to the fifth embodiment. In FIG. 16, the liquid immersion member 4H has a first surface 41H, a first member 81 fixed to the projection optical system PL, a second surface 42H, and a third surface 43H, and the first member And a second member 82 movable relative to 81. The second member 82 has a fourth surface 44H that faces the optical path K and is arranged to connect the outer edge of the first surface 41H and the inner edge of the second surface 42H.

  The first member 81 has a recovery port 62H disposed on the first surface 41H and a supply port 64H that supplies the liquid LQ to the optical path K. A porous member 63H is disposed in the recovery port 62H.

  The second member 82 has a recovery port 61H arranged on the third surface 43H, at least part of the periphery of the third surface 43H, and the first direction side (−Z direction) from the third surface 43H with respect to the Z-axis direction. 5th surface 45H arrange | positioned at the side), and the air supply port 71H which is arrange | positioned at the 5th surface 45H and supplies gas.

  In the present embodiment, the first member 81 is supported on the first surface plate 13 (first column 9) via a support mechanism (not shown in FIG. 16). The second member 82 is supported by the first member 81 via the support mechanism 83. The support mechanism 83 supports the second member 82 movably with respect to the first member 81.

  In the present embodiment, the support mechanism 83 includes, for example, an elastic member such as a bellows member or a spring member, and supports the second member 82 in a swingable manner with respect to the first member 81.

  The second member 82 may be supported by the projection optical system PL (holding member 21) so as to be movable, or may be moved by the first surface plate 13 (first column 9) that supports the projection optical system PL. It may be supported.

  Further, the first member 81 may be supported so as to be movable with respect to the first surface plate 13.

  In the present embodiment, by supplying gas from the air supply port 71H to the space 55, a gas seal is formed between the fifth surface 45H and the surface of the substrate P, and a gas bearing is formed. Thereby, the outflow of the liquid LQ can be effectively suppressed while maintaining the fifth gap G5 between the fifth surface 45H and the surface of the substrate P.

  Note that the various modifications described in the above-described embodiment (for example, the modifications in FIGS. 6 to 10) can be applied to this embodiment.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 17 is a diagram illustrating an example of the liquid immersion member 4J according to the sixth embodiment. The sixth embodiment is a modification of the above-described fifth embodiment.

  In the fifth embodiment described above, the position of the second member 82 is adjusted by forming a gas bearing between the substrate P and the second member 82 supported to be swingable. A characteristic part of the sixth embodiment is that a driving device 84 capable of moving the second member 82J in at least the Z-axis direction is provided.

  As shown in FIG. 17, the liquid immersion member 4J includes a first member 81J whose position is fixed with respect to the projection optical system PL, and a second member 82J movable with respect to the first member 81J.

  The second member 82J is supported by a support mechanism 85 including a drive device 84. The drive device 84 can move the second member 82J at least in the Z-axis direction. In this embodiment, the support mechanism 85 is arrange | positioned so that the 1st surface plate 13 (1st column 9) and the 2nd member 82J may be connected. That is, the second member 82J is supported by the first surface plate 13 via the support mechanism 85.

  Note that the second member 82J may be supported by the projection optical system PL (holding member 21) or a first member 81J via a support mechanism including a driving device.

  The first member 81J is supported by the first surface plate 13 via the support mechanism 86. The position of the first member 81J with respect to the projection optical system PL is fixed.

  The control device 7 can control the drive device 84 to adjust the position of the second member 82J. The control device 7 controls the second member 82J at least in the Z-axis direction so that the fifth gap G5 between the fifth surface 45J and the surface of the substrate P is maintained or the fifth gap G5 is changed. The position can be adjusted.

  In the present embodiment, the fifth surface 45J is not provided with an air supply port for supplying gas, but may be provided.

  The first member 81J may be supported so as to be movable with respect to the projection optical system PL.

  Also in this embodiment, the outflow or the like of the liquid LQ can be suppressed.

  Note that the various modifications described in the above-described embodiment (for example, the modifications in FIGS. 6 to 10) can be applied to this embodiment.

<Seventh embodiment>
Next, a seventh embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 18 is a diagram illustrating an example of the liquid immersion member 4K according to the seventh embodiment. In FIG. 18, the liquid immersion member 4K has a first surface 41K disposed at least partly around the optical path K of the exposure light EL emitted from the emission surface 23 of the projection optical system PL, and includes the projection optical system PL. The first member 81K having a substantially fixed position relative to the first surface 41K, and the second surface 42K disposed on at least a part of the periphery of the first surface 41K and on the first direction side (−Z direction side) from the first surface 41K. A third surface 43K disposed at least at a part of the periphery of the second surface 42K, and a fifth surface 45K disposed at least at a part of the periphery of the third surface 43K, with respect to the first member 81K. A movable second member 82K and a recovery port 73K that is disposed on at least a part of the second surface 42K and capable of recovering at least one of gas and liquid, and is disposed on at least a part of the fifth surface 45K to supply gas. Air supply port 71KA porous member 74K is disposed in the recovery port 73K. The second surface 74K includes the surface (lower surface) of the porous member 74K.

  The second member 82K is provided on the third surface 43K and includes a recovery port 61K that recovers at least one of the liquid LQ and the gas present in the space 53. The second member 82K has a fourth surface 44K that faces the optical path K and is disposed so as to connect the outer edge of the first surface 41K and the inner edge of the second surface 42K.

  In the present embodiment, the first member 81K is supported on the first surface plate 13 (first column 9) via a support mechanism (not shown in FIG. 18). The second member 82K is supported by the first member 81K via the support mechanism 83K. The support mechanism 83K supports the second member 82K to be movable with respect to the first member 81K.

  In the present embodiment, the support mechanism 83K includes, for example, an elastic member such as a bellows member or a spring member, and supports the second member 82K to be swingable with respect to the first member 81K.

  The second member 82K may be movably supported by the projection optical system PL (holding member 21), or may be movable to the first surface plate 13 (first column 9) that supports the projection optical system PL. It may be supported.

  The first surface 41K holds the liquid LQ with the substrate P (object) arranged in the projection region PR so that the optical path K is filled with the liquid LQ.

  In the present embodiment, the second surface 42K and the fifth surface 45K are more liquid repellent with respect to the liquid LQ than the first surface 41K. The fourth surface 44K is also more repellent with respect to the liquid LQ than the first surface 41K. Note that at least one of the second surface 42K and the fifth surface 45K may not be more liquid repellent than the first surface 41K with respect to the liquid LQ. Further, the fourth surface 44K may not be more liquid repellent than the first surface 41K with respect to the liquid LQ.

  In the present embodiment, the second surface 42K and the fifth surface 45K are disposed in substantially the same plane. Note that the position of the second surface 42K and the position of the fifth surface 45K in the Z-axis direction may be different.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX according to the present embodiment will be described.

  The control device 7 supplies the liquid LQ from the supply port 64K with the first surface 41K of the first member 81K and the substrate P opposed to each other through the first gap G1. At least a part of the liquid LQ supplied from the supply port 64K is held between the first surface 41K and the substrate P. Thereby, the immersion space LS is formed so that the optical path K is filled with the liquid LQ. The substrate P is exposed with the exposure light EL from the emission surface 23 via the liquid LQ between the emission surface 23 and the substrate P.

  In at least a part of the exposure of the substrate P, the substrate P opposes the second surface 42K of the second member 82K via the second gap G2 smaller than the first gap G1, and the fifth surface 45K and the first gap G1. Opposing via a smaller fifth gap G5.

  The second surface 42K suppresses the liquid LQ in the space 51 between the first surface 41K and the substrate P (object) from flowing out. Even if the liquid LQ flows out of the space 51, the recovered liquid LQ is recovered using the recovery port 73K disposed on the second surface 42K. Further, the liquid LQ flowing out from the space 51 between the first surface 41K and the substrate P (object) flows into the space 53 via the second gap G2 between the second surface 42K and the substrate P. The liquid LQ existing in the space 53 is recovered using the recovery port 61K.

  In the present embodiment, gas is supplied to the surface of the substrate P using the air supply port 71K disposed on the fifth surface 45K. A gas seal is formed between the fifth surface 45K and the surface of the substrate P by supplying gas from the air supply port 71K to the space 55 between the fifth surface 45K and the substrate P (object). A gas bearing is formed. Thereby, the outflow of the liquid LQ can be effectively suppressed while maintaining the fifth gap G5 between the fifth surface 45K and the surface of the substrate P.

  A drive device that can move the second member 82K in at least the Z-axis direction may be provided, and the position of the second member 82K in at least the Z-axis direction may be adjusted by the driving force of the drive device.

  In the present embodiment, the second surface 42K, the third surface 43K, and the fifth surface 45K are disposed on the second member 82K. For example, the second surface 42K is a member disposed on the second surface 42K. The members on which the third surface 43K and the fifth surface 45K are arranged may be different. Further, the member on which the second surface 42K and the third surface 43K are arranged may be different from the member on which the fifth surface 45K is arranged.

  The first member 81K may be supported so as to be movable with respect to the projection optical system PL.

  Note that the various modifications described in the above-described embodiment (for example, the modifications in FIGS. 6 to 10) can be applied to this embodiment.

  In the first to seventh embodiments described above, the recovery port (61 etc.) for recovering at least a part of the liquid LQ existing in the space 53 is arranged on the third surface (43 etc.). However, as long as the liquid LQ in the space 53 can be collected, the collection port (61 etc.) may be arranged at a site other than the third surface (43 etc.). For example, a member different from the liquid immersion member 4 may be disposed in the space 53, and a recovery port capable of recovering the liquid LQ in the space 53 may be provided in the member.

<Eighth Embodiment>
Next, an eighth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 19 is a diagram illustrating an example of the liquid immersion member 4L according to the eighth embodiment. In FIG. 19, the liquid immersion member 4L has a first surface 41L disposed at least partly around the optical path K of the exposure light EL emitted from the emission surface 23 of the projection optical system PL, and includes the projection optical system PL. The first member 81L, the position of which is substantially fixed, and the second surface 42L disposed on at least a part of the periphery of the first surface 41L and on the first direction side (−Z direction side) from the first surface 41L. A second member 82L that is movable with respect to the first member 81L, a recovery port 61L that is disposed on at least a part of the second surface 42L and can recover at least one of gas and liquid, and the second surface 42L. And an air supply port 71L for supplying gas.

  The recovery port 61L is disposed in the first region 421L of the second surface 42L disposed around the first surface 41L. The air supply port 71L is disposed in the second region 422L of the second surface 42L disposed around the first region 421L. The first region 421L and the second region 422L are disposed in substantially the same plane. Note that the position of the first region 421L and the position of the second region 422L in the Z-axis direction may be different.

  The first member 81L is disposed on at least a part of the first surface 41L and has a recovery port 62L that can recover the liquid LQ. A porous member 63L is disposed in the recovery 62L. The first surface 41L includes the surface (lower surface) of the porous member 63L.

  The second member 82L has a fourth surface 44L that faces the optical path K and is disposed so as to connect the outer edge of the first surface 41L and the inner edge of the second surface 42L.

  In the present embodiment, the first member 81L is supported on the first surface plate 13 (first column 9) via a support mechanism (not shown in FIG. 19). The second member 82L is supported by the first member 81L via the support mechanism 83L. The support mechanism 83L supports the second member 82L so as to be movable with respect to the first member 81L.

  In the present embodiment, the support mechanism 83L includes, for example, an elastic member such as a bellows member or a spring member, and supports the second member 82L so as to be swingable with respect to the first member 81L.

  The second member 82L may be movably supported by the projection optical system PL (holding member 21), or may be movable to the first surface plate 13 (first column 9) that supports the projection optical system PL. It may be supported.

  The first surface 41L holds the liquid LQ with the substrate P (object) disposed in the projection region PR so that the optical path K is filled with the liquid LQ.

  In the present embodiment, the second surface 42L is more liquid repellent with respect to the liquid LQ than the first surface 41L. The fourth surface 44L is also more liquid repellent than the first surface 41L with respect to the liquid LQ. Note that the second surface 42L may not be more liquid repellent than the first surface 41L with respect to the liquid LQ. Further, the fourth surface 44L may not be more liquid repellent than the first surface 41L with respect to the liquid LQ.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX according to the present embodiment will be described.

  The control device 7 supplies the liquid LQ from the supply port 64L with the first surface 41L of the first member 81L and the substrate P opposed to each other through the first gap G1. At least a part of the liquid LQ supplied from the supply port 64L is held between the first surface 41L and the substrate P. Further, at least part of the liquid LQ supplied from the supply port 64L and in the space 51 between the first surface 41L and the surface of the substrate P is recovered from the recovery port 62L. In parallel with the supply operation of the liquid LQ from the supply port 64L, the recovery operation of the liquid LQ from the recovery port 62L is executed, so that the immersion space LS is formed so that the optical path K is filled with the liquid LQ. . The substrate P is exposed with the exposure light EL from the emission surface 23 via the liquid LQ between the emission surface 23 and the substrate P.

  In at least a part of the exposure of the substrate P, the substrate P faces the second surface 42L of the second member 82L via the second gap G2 smaller than the first gap G1.

  The second surface 42L suppresses the liquid LQ in the space 51 between the first surface 41L and the substrate P (object) from flowing out. Even if the liquid LQ flows out of the space 51, the recovered liquid LQ is recovered using the recovery port 61L arranged on the second surface 42L (first region 421L).

  In the present embodiment, gas is supplied to the surface of the substrate P using the air supply port 71L disposed on the second surface 42L (second region 422L). A gas seal is formed between the second surface 42L and the surface of the substrate P by supplying gas from the air supply port 71L to the space between the second surface 42L and the substrate P (object), and A gas bearing is formed. Thereby, the outflow of the liquid LQ can be effectively suppressed while maintaining the second gap G2 between the second surface 42L and the surface of the substrate P.

  A drive device that can move the second member 82L in at least the Z-axis direction may be provided, and the position of the second member 82L in at least the Z-axis direction may be adjusted by the drive force of the drive device.

  In the present embodiment, the first region 421L and the second region 422L of the second surface 42L are disposed on the second member 82L. For example, the first region 421L is a member disposed on the second surface 42L. The member in which the second region 422L is disposed may be different.

  The first member 81L may be supported so as to be movable with respect to the projection optical system PL.

  Note that the various modifications described in the above-described embodiment (for example, the modifications in FIGS. 6 to 10) can be applied to this embodiment.

  In the first to eighth embodiments described above, the exit surface 23 of the last optical element 22 and a part of the liquid immersion member (4, etc.) may not face each other. For example, the exit surface 23 of the last optical element 22 and the first surface (41, etc.) of the liquid immersion member (4, etc.) may be arranged in the same plane.

  In the first to eighth embodiments described above, the optical path on the exit side (image plane side) of the terminal optical element 22 of the projection optical system PL is filled with the liquid LQ. For example, International Publication No. 2004/019128. As disclosed in the No. pamphlet, it is also possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 22 is also filled with the liquid LQ.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, the exposure apparatus EX, for example, as disclosed in the corresponding US Pat. No. 6,611,316, synthesizes the pattern of two masks on the substrate via the projection optical system, and performs the substrate by one scanning exposure. An exposure apparatus that double-exposes one upper shot area almost simultaneously may be used. The exposure apparatus EX may be a proximity type exposure apparatus or a mirror projection aligner.

  The exposure apparatus EX is a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It may be a device.

  Further, the exposure apparatus EX is formed with a substrate stage for holding a substrate and a reference mark as disclosed in, for example, US Pat. No. 6,897,963 and US Patent Application Publication No. 2007/0127006. An exposure apparatus that includes a reference member and / or various photoelectric sensors and includes a measurement stage that does not hold the substrate to be exposed may be used, or an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus and the exposure method provided with the projection optical system PL have been described as examples. However, the projection optical system PL may not be used. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  The exposure apparatus EX exposes a line-and-space pattern on the substrate P by forming interference fringes on the substrate P as disclosed in, for example, WO 2001/035168. It may be an apparatus (lithography system).

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 20, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 4 ... Liquid immersion member, 7 ... Control apparatus, 22 ... End optical element, 23 ... Ejection surface, 41 ... 1st surface, 42 ... 2nd surface, 43 ... 3rd surface, 44 ... 4th surface 45 ... 5th surface, 51 ... space, 53 ... space, 61 ... collection port, 62 ... collection port, 63 ... porous member, 71 ... air supply port, 72 ... supply port, 73 ... collection port, 74 ... porous member , 81: First member, 82: Second member, 83: Support mechanism, 84: Drive device, 431: First slope, 432: Second slope, 433: Flat surface, AX: Optical axis, EL: Exposure light, EX ... exposure apparatus, K ... optical path, LQ ... liquid, LS ... immersion space, P ... substrate, PL ... projection optical system

Claims (42)

An exposure apparatus for exposing a substrate,
An optical system having an exit surface for emitting exposure light;
A first surface disposed on at least a part of the periphery of the optical path of the exposure light emitted from the emission surface;
A second surface disposed on at least a part of the periphery of the first surface and on a first direction side where the exposure light travels from the first surface with respect to a predetermined direction substantially parallel to the optical axis of the optical system. When,
A third surface disposed on at least a part of the periphery of the second surface and on the second direction side opposite to the first direction from the second surface with respect to the predetermined direction;
A first recovery port for recovering at least a part of the liquid present in the space defined by the third surface;
In at least a part of the exposure of the substrate, the surface of the substrate faces the emission surface, the first surface, the second surface, and the third surface;
An exposure apparatus that exposes the substrate with the exposure light from the emission surface via a liquid between the emission surface and the surface of the substrate.   The exposure apparatus according to claim 1, wherein the first recovery port is disposed on at least a part of the third surface.   The third surface is disposed at least at a part of the periphery of the second surface, and has a first inclined surface inclined in the second direction toward the outside with respect to a radial direction with respect to the optical axis, and a periphery of the first inclined surface The exposure apparatus according to claim 1, further comprising: a second inclined surface disposed at least in part and inclined in the first direction toward the outside with respect to the radiation direction. The third surface is disposed at least at a part of the periphery of the second surface, and includes a second inclined surface inclined outward in the radial direction with respect to the optical axis and inclined in the first direction,
The exposure apparatus according to claim 1, wherein the first recovery port is disposed on the second slope. The third surface is disposed at least at a part of the periphery of the second surface, and includes a first slope inclined outward in the radial direction with respect to the optical axis and inclined in the second direction,
The exposure apparatus according to claim 1, wherein the first recovery port is disposed on the first slope.   The exposure apparatus according to claim 3, wherein the third surface is disposed between the first inclined surface and the second inclined surface, and includes a surface substantially parallel to the first surface.   The said 1st surface hold | maintains the said liquid between the objects arrange | positioned in the position which can irradiate the said exposure light so that the said optical path may be satisfy | filled with the said liquid. Exposure equipment.   The exposure apparatus according to claim 7, wherein the second surface suppresses the liquid between the first surface and the object from flowing out.   The said 1st collection port collect | recovers at least one part of the liquid which flowed out through the gap between the said 2nd surface and the said object from between the said 1st surface and the said object. Exposure equipment.   The exposure apparatus according to claim 1, wherein the second surface is more liquid repellent than the first surface with respect to the liquid.   The exposure apparatus according to claim 1, wherein the second surface is substantially parallel to the first surface.   The exposure apparatus according to claim 1, further comprising a fourth surface that faces the optical path and is arranged to connect an outer edge of the first surface and an inner edge of the second surface.   The exposure apparatus according to claim 1, further comprising a second recovery port that is disposed on at least a part of the first surface and capable of recovering the liquid. A porous member disposed in the second recovery port;
The exposure apparatus according to claim 13, wherein the first surface includes a surface of the porous member.   The exposure apparatus according to claim 1, further comprising a third recovery port that is disposed on at least a part of the second surface and can recover the liquid. A porous member disposed in the third recovery port;
The exposure apparatus according to claim 15, wherein the second surface includes a surface of the porous member.   The exposure apparatus according to claim 1, further comprising a first supply port that is disposed on at least a part of the first surface and supplies the liquid.   The exposure apparatus according to claim 1, further comprising a second supply port that supplies the liquid to the optical path.   19. The exposure according to claim 1, further comprising a fifth surface disposed on at least a part of the periphery of the third surface and closer to the first direction than the third surface with respect to the predetermined direction. apparatus.   The exposure apparatus according to claim 19, further comprising an air supply port arranged on the fifth surface and configured to supply gas.   21. The exposure apparatus according to claim 19, wherein the second surface and the fifth surface are equal in position with respect to the predetermined direction. A first member having the first surface and fixed to the optical system;
The exposure apparatus according to claim 1, further comprising: a second member having the second surface and the third surface and movable with respect to the first member.   The exposure apparatus according to claim 22, further comprising a driving device capable of moving the second member in at least the predetermined direction. In the second member, a fifth surface disposed on at least a part of the periphery of the third surface and closer to the first direction than the third surface with respect to the predetermined direction;
The exposure apparatus according to claim 22, further comprising an air supply port that is arranged on the fifth surface and supplies gas.   The exposure apparatus according to claim 24, further comprising: a support mechanism that movably supports the second member relative to at least one of the optical system, the support member that supports the optical system, and the first member. An exposure apparatus for exposing a substrate,
An optical system having an exit surface for emitting exposure light;
A first member disposed on at least a part of the periphery of the optical path of the exposure light emitted from the emission surface, the first member having a substantially fixed position with respect to the optical system;
A second surface disposed on at least a part of the periphery of the first surface and on a first direction side where the exposure light travels from the first surface with respect to a predetermined direction substantially parallel to the optical axis of the optical system; A second member movable relative to the first member;
A third member disposed on at least a part of the periphery of the second member, and movable with respect to the first member;
A first recovery port disposed on at least a portion of the second surface and capable of recovering at least one of gas and liquid;
An air supply port that is disposed on at least a part of the third surface and supplies gas;
In at least a part of the exposure of the substrate, the surface of the substrate faces the emission surface, the first surface, the second surface, and the third surface;
An exposure apparatus that exposes the substrate with the exposure light from the emission surface via a liquid between the emission surface and the surface of the substrate.   27. The exposure according to claim 26, further comprising: a support mechanism that movably supports the second member and the third member with respect to at least one of the optical system, a support member that supports the optical system, and the first member. apparatus.   28. The exposure apparatus according to claim 26, wherein the second member and the third member are integral.   The exposure apparatus according to any one of claims 26 to 28, wherein the second surface and the third surface are more liquid repellent than the first surface with respect to the liquid.   30. The exposure apparatus according to any one of claims 26 to 29, wherein the second surface and the third surface are disposed in substantially the same plane.   The said 1st surface hold | maintains the said liquid between the objects arrange | positioned in the position which can irradiate the said exposure light so that the said optical path may be satisfy | filled with the said liquid. Exposure equipment.   32. The exposure apparatus according to claim 31, wherein the second surface suppresses the liquid between the first surface and the object from flowing out.   The exposure apparatus according to claim 31 or 32, wherein the first recovery port recovers at least a part of the liquid that has flowed out between the first surface and the object.   34. The exposure apparatus according to any one of claims 26 to 33, further comprising a driving device capable of moving the second member and the third member at least in the predetermined direction.   35. The exposure apparatus according to claim 26, further comprising a fourth surface that faces the optical path and is arranged to connect an outer edge of the first surface and an inner edge of the second surface.   36. The exposure apparatus according to claim 35, wherein the fourth surface is more liquid repellent than the first surface with respect to the liquid.   37. The exposure apparatus according to any one of claims 26 to 36, further comprising a second recovery port disposed on at least a part of the first surface and capable of recovering the liquid. A porous member disposed in the second recovery port;
38. The exposure apparatus according to claim 37, wherein the first surface includes a surface of the porous member. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 38;
Developing the exposed substrate; and a device manufacturing method. Between the first surface and the substrate, the first surface disposed on at least a part of the periphery of the optical path of the exposure light emitted from the exit surface of the optical system is opposed to the substrate through the first gap. Holding the liquid with,
Exposing the substrate with the exposure light from the exit surface via a liquid between the exit surface and the substrate;
Collecting at least a portion of the liquid that has flowed out between the first surface and the substrate,
In at least a part of the exposure of the substrate, the substrate opposes a second surface disposed at least at a part of the periphery of the first surface through a second gap smaller than the first gap, and Facing a third surface arranged at least in part around the two surfaces through a third gap larger than the second gap,
The liquid is collected by an exposure method performed using a first collection port disposed on the third surface. The first surface of the first member, which is disposed at least part of the periphery of the optical path of the exposure light emitted from the exit surface of the optical system and is substantially fixed in position with respect to the optical system, and the substrate via the first gap. Holding the liquid between the first surface and the substrate oppositely,
Exposing the substrate with the exposure light from the exit surface via a liquid between the exit surface and the substrate;
Recovering at least a portion of the liquid flowing out from between the first surface and the substrate;
Supplying a gas to the surface of the substrate,
In at least a part of the exposure of the substrate, the substrate is disposed at least at a part of the periphery of the first surface, and the second surface of the second member movable relative to the first member and the first gap The third surface of the third member that is opposed to the second second gap and is disposed at least partially around the second surface and movable with respect to the first member is smaller than the third gap. Across the gap,
The recovery of the liquid is performed using a first recovery port disposed on the second surface,
An exposure method in which the gas is supplied using an air supply port arranged on the third surface. Exposing the substrate using the exposure method of claim 40 or 41;
Developing the exposed substrate; and a device manufacturing method.

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