JP2014093456A - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of suppressing occurrence of an exposure defect.SOLUTION: A substrate P is exposed to exposure light through a liquid. An exposure apparatus includes: an optical member which has an exposure surface from which the exposure light is emitted; a substrate holding part 31 which holds a lower surface of the substrate P in a releasable state; a first member which has a first upper surface arranged to cover a part of a periphery of an upper surface of the substrate P held by the substrate holding part 31 and a first inner surface including a first inclined part inclined outward and downward to the center of the substrate holding part 31; a second member which has a second upper surface arranged to cover a part of the periphery of the upper surface of the substrate P held by the substrate holding part 31 and a second inner surface including a second inclined part inclined outward and downward to the center of the substrate holding part 31; and an adjustment apparatus DV which can adjust gaps between the substrate and the first member and second member by moving the first member and the second member in a direction crossing the optical axis of an optical member.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method for exposing a substrate by irradiating a substrate with exposure light via a liquid.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used. The exposure apparatus includes a substrate stage that is movable while holding a substrate, and exposes the substrate held on the substrate stage.

US Patent Application Publication No. 2008/0043211 US Patent Application Publication No. 2008/0100812

  In the immersion exposure apparatus, for example, if the liquid remains on at least one of the upper surface of the substrate and the upper surface of the substrate stage, an exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and a lower surface of the substrate are releasably held. And a first upper surface disposed so as to cover a part of the periphery of the upper surface of the substrate held by the substrate holding unit, and a first inclined downward toward the outside with respect to the center of the substrate holding unit. A first member having a first inner surface including one inclined portion, a second upper surface arranged to cover a part of the periphery of the upper surface of the substrate held by the substrate holding portion, and the center of the substrate holding portion A second member having a second inner surface including a second inclined portion that is inclined downward toward the outer side, and a first member and a second member are moved in a direction intersecting the optical axis of the optical member, thereby causing the first to the substrate. And an adjusting device capable of adjusting a gap between the member and the second member. There is provided.

  According to the second aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and a lower surface of the substrate are releasably held. A substrate holding unit, a flexible first member having a first upper surface disposed on at least part of the periphery of the upper surface of the substrate in a state where the substrate is held by the substrate holding unit, and the substrate and the first member An exposure apparatus is provided that includes a driving device that bends at least a part of the first member so that the size of the first gap changes.

  According to the third aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and a lower surface of the substrate are releasably held. A first member having a substrate holding portion, a first upper surface defining an opening smaller than the diameter of the substrate, a first inner surface inclined downward toward the outside with respect to the center of the opening, and the periphery of the substrate holding portion The first member is releasably held so that the peripheral region of the upper surface of the substrate and the first inner surface of the first member face each other when the substrate is held by the substrate holding portion. The first member is released from the first holding unit in at least one of carrying the substrate into and out of the substrate from the substrate holding unit, and the first member and the first holding unit. The substrate is transported between Exposure apparatus is provided.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and a lower surface of the substrate being releasably held. And a stage device movable below the optical member, and movable on the substrate in a direction intersecting the optical axis of the optical member, and the first shot region of the substrate is the exit surface of the optical member An exposure apparatus is provided that includes a cover member that covers the second shot region of the substrate in a state where the exposure is performed through the liquid in the immersion space formed on the side.

  According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure apparatus according to any one of the first to fourth aspects; and developing the exposed substrate. Is provided.

  According to a sixth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein a liquid immersion space is formed on an exit surface side of an optical member from which the exposure light is emitted. And holding the lower surface of the substrate in a releasable manner with a substrate holding portion movable under the optical member, exposing the substrate through the liquid in the immersion space, and holding the substrate on the substrate holding portion. A first member having a first upper surface disposed at a part of the periphery of the upper surface of the substrate and a first inner surface including a first inclined portion inclined downward toward the outside with respect to the center of the substrate holding portion. Adjusting the dimension of the first gap between the substrate and the first member, a second upper surface disposed at a part of the periphery of the upper surface of the substrate, and A second inclined portion that is inclined downward toward the outside with respect to the center of the substrate holding portion is included. A second member having two inner surface to move in a direction intersecting the optical axis, and adjusting the size of the second gap between the substrate and the second member, the exposure method comprising is provided.

  According to a seventh aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein a liquid immersion space is formed on an emission surface side of an optical member from which the exposure light is emitted. And holding the lower surface of the substrate in a releasable manner with a substrate holding portion movable under the optical member, exposing the substrate through the liquid in the immersion space, and holding the substrate on the substrate holding portion. The dimension of the first gap between the substrate and the first member changes so that at least a part of the flexible first member having the first upper surface disposed at least at a part of the periphery of the upper surface of the substrate in the state of being And an exposure method is provided.

  According to an eighth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein a liquid immersion space is formed on an emission surface side of an optical member from which the exposure light is emitted. And holding the lower surface of the substrate in a releasable manner with a substrate holder movable under the optical member, exposing the substrate through the liquid in the immersion space, and defining an opening smaller than the diameter of the substrate A first member having a first upper surface and a first inner surface that is inclined downward toward the outside with respect to the center of the opening; At least one of holding the substrate so as to be releasable so as to face the first inner surface of one member and carrying the substrate into and out of the substrate holding portion from the first holding portion. The first member is released and the first The exposure method comprising, the method comprising transporting a substrate between the wood and the first holding portion is provided.

  According to a ninth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein a liquid immersion space is formed on an exit surface side of an optical member from which the exposure light is emitted. Holding the lower surface of the substrate in a releasable manner by a substrate holding part movable under the optical member, and the liquid in the immersion space in which the first shot region of the substrate is formed on the emission surface side of the optical member The second shot region of the substrate is covered with a cover member that is movable on the substrate in a direction intersecting the optical axis of the optical member.

  According to a tenth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure method according to any one of the sixth to ninth aspects; and developing the exposed substrate. A method is provided.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

1 is a schematic block diagram showing an example of an exposure apparatus according to a first embodiment. The figure which shows an example of the liquid immersion member and substrate stage which concern on 1st Embodiment. The top view of the board | substrate P and the cover member T which were set on the board | substrate stage 2. FIG. AA sectional view taken on the line in FIG. AA line sectional view in Drawing 3 at the time of non-exposure operation. The top view of a substrate stage. The figure which shows the principal part structure which concerns on 2nd Embodiment. The top view of the substrate stage 2 which concerns on 3rd Embodiment. BB sectional view taken on the line in FIG. The figure which shows operation | movement of the cover member which concerns on 3rd Embodiment. The figure which shows operation | movement of the cover member which concerns on another form. The figure which shows operation | movement of the cover member which concerns on another form. The figure which shows operation | movement of the cover member which concerns on another form. The top view of the substrate stage which concerns on 4th Embodiment. The figure which shows the principal part structure which concerns on 4th Embodiment. The figure which shows an example of a substrate stage. The flowchart which shows an example of the manufacturing process of a device.

  Hereinafter, embodiments of the exposure apparatus, the exposure method, and the device manufacturing method of the present invention will be described with reference to FIGS. 1 to 17, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, an exposure apparatus EX performs exposure without holding a substrate M, a mask stage 1 that can move while holding a mask M, a substrate stage (stage apparatus) 2 that can move while holding a substrate P, and the substrate P. A movable measurement stage 3 mounted with a measurement member C and a measuring instrument for measuring the light EL, a drive system 4 for moving the mask stage 1, a drive system 5 for moving the substrate stage 2, and a measurement stage 3 are moved. A driving system 6 that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and an optical path of the exposure light EL A liquid immersion member 7 capable of forming the liquid immersion space LS so that at least a part thereof is filled with the liquid LQ, a control device 8 that controls the operation of the entire exposure apparatus EX, and a controller 8 that is connected to the exposure apparatus EX. And a storage device 8R for storing seed information. The storage device 8R includes, for example, a memory such as a RAM, a recording medium such as a hard disk and a CD-ROM. In the storage device 8R, an operating system (OS) for controlling the computer system is installed, and a program for controlling the exposure apparatus EX is stored.

  Further, the exposure apparatus EX includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. The detection system 300 includes an alignment system 302 that detects an alignment mark on the substrate P, and a surface position detection system 303 that detects the position of the upper surface (surface) Pa of the substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film, or may include a protective film (topcoat film) or a liquid repellent film that protects the photosensitive film.

  Further, the exposure apparatus EX includes a chamber apparatus 103 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space 102 in which the exposure light EL travels. The chamber apparatus 103 includes a chamber member 104 that forms the space 102, and an air conditioning system 105 that adjusts the environment of the space 102.

  The space 102 includes a space 102A and a space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 includes an air supply unit 105S that supplies gas to the spaces 102A and 102B, and supplies the gas from the air supply unit 105S to the spaces 102A and 102B to adjust the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are arranged in the space 102A.

  The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 can be moved to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C. The substrate stage 2 and the measurement stage 3 can move independently on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion (substrate holding portion) 31 that holds the lower surface Pb of the substrate P so as to be releasable, and an opening Th in which the substrate P can be disposed. And an upper surface disposed around the upper surface Pa of the substrate P in a state of being held by the holding unit 31.

  In the present embodiment, the substrate stage 2 is arranged around the first holding unit 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. And a second holding portion 32 that holds the lower surface Tb of the cover member T in a releasable manner. The cover member T has, for example, a surface having water repellency (liquid repellency) and is disposed around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding portion 31 is disposed. In the present embodiment, the cover member T has an upper surface 2U.

In the present embodiment, the first holding unit 31 holds the substrate P so that the upper surface Pa of the substrate P and the XY plane are substantially parallel. The second holding part 32 holds the cover member T so that the upper surface 2U of the cover member T and the XY plane are substantially parallel. In the present embodiment, the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U of the cover member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is).
In the present embodiment, the second holding portion 32 and the cover member T are divided into two parts, and each of them can move in the Y-axis direction. Details thereof will be described later.

  In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the cover member Q so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck device. The cover member Q is disposed around the measurement member C held by the third holding unit 33. Note that the holding device used at least one of the third holding portion 33 and the fourth holding portion 34 is not limited to the pin chuck device. Further, at least one of the measurement member C and the cover member Q may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding portion 34 holds the cover member Q so that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the cover member Q held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measuring member C held by the third holding unit 33. In addition, the upper surface of the cover member Q held by the fourth holding portion 34 is appropriately referred to as the upper surface 3U of the measurement stage 3.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11 </ b> A can measure the position of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R arranged on the substrate stage 2 and the measurement mirror 3R arranged on the measurement stage 3.

  The alignment system 302 detects the alignment mark of the substrate P and detects the position of the shot region S of the substrate P. The alignment system 302 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the alignment system 302 facing the −Z direction.

  The surface position detection system 303 is also called, for example, an autofocus / leveling system, and detects the position of the upper surface Pa of the substrate P by irradiating the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 with detection light. To do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing the −Z direction.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 drives the drive systems 4, 5, 5 based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to perform position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is formed on the emission surface 13 side. The immersion space LS is formed so that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The exit surface 13 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. The emission surface 13 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 7 has a lower surface 14 at least partially facing the −Z direction. In the present embodiment, the emission surface 13 and the lower surface 14 can hold the liquid LQ with an object arranged at a position (projection region PR) where the exposure light EL emitted from the emission surface 13 can be irradiated. . The immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and the object arranged in the projection region PR. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 13 and the object arranged in the projection region PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ with the object so that the optical path K of the exposure light EL between the terminal optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, the objects that can be arranged in the projection region PR include objects that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12). The object is movable with respect to the last optical element 12 and the liquid immersion member 7. The object has an upper surface (surface) that can face at least one of the emission surface 13 and the lower surface 14. An immersion space LS can be formed between the upper surface of the object and the emission surface 13. The object is movable in a plane (XY plane) perpendicular to the optical axis (Z axis) of the last optical element 12. In the present embodiment, an immersion space LS can be formed between the upper surface of the object and at least a part of the emission surface 13 and the lower surface 14. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the upper surface (front surface) of the object on the other side, the optical path K of the exposure light EL between the last optical element 12 and the object is changed. An immersion space LS is formed so as to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held on the substrate stage 2 are the exit surface 13 of the last optical element 12 facing the −Z direction and the liquid immersion facing the −Z direction. The lower surface 14 of the member 7 can be opposed. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. Further, these objects can face at least a part of the detection system 300.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ with the substrate P so that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. In FIG. 2, the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7), but as described above, the substrate stage 2 (cover member T), and The measurement stage 3 (cover member Q, measurement member C) can also be arranged.

  As shown in FIG. 2, the liquid immersion member 7 includes at least a part 71 facing the exit surface 13 of the last optical element 12 and a main body 72 at least partly disposed around the last optical element 12. Including. The facing portion 71 has a hole (opening) 7 </ b> K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least partially facing the emission surface 13 via a gap, and a lower surface 7H on which the substrate P (object) can face. The hole 7K is formed so as to connect the upper surface 7U and the lower surface 7H. The upper surface 7U is disposed around the upper end of the hole 7K, and the lower surface 7H is disposed around the lower end of the hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and irradiate the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is disposed around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

  Further, the liquid immersion member 7 includes a supply port 15 that can supply the liquid LQ and a recovery port 16 that can recover the liquid LQ. The supply port 15 supplies the liquid LQ when the substrate P is exposed, for example. The recovery port 16 recovers the liquid LQ, for example, when the substrate P is exposed. The supply port 15 can supply the liquid LQ during one or both of the exposure and non-exposure of the substrate P. Note that the recovery port 16 can recover the liquid LQ during one or both of exposure and non-exposure of the substrate P.

  The supply port 15 is disposed so as to face the optical path K in the vicinity of the optical path K of the exposure light EL emitted from the emission surface 13. The supply port 15 only needs to face one or both of the space between the exit surface 13 and the opening 7K and the side surface of the last optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to the space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and then is supplied onto the substrate P (object) through the opening 7K.

  The supply port 15 is connected to the liquid supply device 18 via the flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The channel 17 includes a supply channel 17 </ b> R formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel 17 </ b> R and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The collection port 16 is disposed at least at a part around the opening 7K through which the exposure light EL passes. In the present embodiment, the collection port 16 is disposed at least at a part around the holding surface 7H. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 72 has an opening 7P that faces the substrate P (object). The opening 7P is disposed at least at a part around the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 disposed in the opening 7P. In the present embodiment, the porous member 19 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H on which the substrate P (object) can face, an upper surface 19U facing in the opposite direction of the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is disposed on at least a part of the periphery of the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes a holding surface 7H and a lower surface 19H.

  In the present embodiment, the recovery port 16 includes a hole of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 16) of the porous member 19. Note that the porous member 19 may not be disposed.

  The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to a vacuum system, and can suck the liquid LQ through the recovery port 16. The channel 20 includes a recovery channel 20R formed inside the liquid immersion member 7 and a channel formed by a recovery pipe that connects the recovery channel 20R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  In the present embodiment, the first holding unit 31 includes, for example, a pin chuck device. The first holding portion 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall portion 35 that can be opposed to the lower surface Pb of the substrate P, and the support surface 31S on the inner side of the peripheral wall portion 35, and includes a plurality of pin members. The support portion 36 includes a suction port 37 that is disposed on the support surface 31S and sucks fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space in at least a part between the lower surface Pb of the substrate P. In the support surface 31 </ b> S, the peripheral wall portion 35 is substantially circular, and the center of the first holding portion 31 is the center of the peripheral wall portion 35 in the above description and the following description. In the present embodiment, the peripheral wall portion 35 is substantially circular (annular) in the XY plane. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall portion 35 are in contact with each other, whereby the peripheral wall portion 35, the lower surface Pb of the substrate P, the support surface 31S, and the like. The space 31H formed by can be set to a negative pressure. As a result, the substrate P is held by the first holding unit 31. In addition, the substrate P is released from the first holding unit 31 by releasing the suction operation of the suction port 37.

  In this embodiment, the lower surface of the board | substrate P is hold | maintained at the upper end of the support part 36 (a some pin member) by making the space 31H into a negative pressure. That is, at least a part of the holding surface 36S that holds the substrate P is defined by the upper end of the support portion 36 (a plurality of pin members).

  In the present embodiment, the second holding unit 32 includes, for example, a pin chuck device. The second holding part 32 is arranged so as to surround the peripheral wall part 35 on the support surface 32S of the substrate stage 2, and surrounds the peripheral wall part 38 on the support surface 32S so that the lower surface Tb of the cover member T can be opposed. And a support surface 40 that includes a plurality of pin members, and a support surface that is disposed on the support surface 32S between the peripheral wall portion 39 and the peripheral wall portion 39. And a suction port 41 for sucking fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space in at least a portion between the lower surface Tb of the cover member T. The control device 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other, whereby the peripheral wall portion 38, the peripheral wall portion 39, and the cover member T The space 32H formed by the lower surface Tb and the support surface 32S can be set to a negative pressure. Thereby, the cover member T is held by the second holding portion 32. Further, the cover member T is released from the second holding portion 32 by releasing the suction operation of the suction port 41.

FIG. 3 is a plan view of the substrate P and the cover member T set on the substrate stage 2.
In the present embodiment, the second holding portion 32 and the cover member T are formed in a shape that is divided into two in the Y direction around a dividing plane D that passes through the optical axis AX of the exposure light EL and is parallel to the X axis. FIG. 4 is a cross-sectional view taken along line AA in FIG. As shown in FIGS. 3 and 4, each second holding unit 32 is independent of the substrate stage 2 in the Y-axis direction and is not illustrated by driving the driving device DV under the control of the control device 8. Guided by a guide member such as a linear guide, the substrate stage 2 is provided so as to be movable without contact.

  As each second holding part 32 holds each cover member T and moves in the Y direction, each cover member T can move in the Y direction. Each cover member T has a joint surface TF at both ends in the X direction of the opening Th. When the joint members TF are joined to each other, the opening Th is formed. The opening Th of the cover member T is an inclined surface Ts that gradually increases in diameter from the upper surface Ta toward the lower surface Tb. The inner diameter (the diameter on the upper surface Ta) of the inclined surface Ts around the optical axis AX is smaller than the diameter of the outer peripheral surface Pc of the substrate P. The upper surface Ta of the cover member T is disposed so as to cover a part of the periphery of the upper surface Pa of the substrate P. The inclined surface Ts is set to an inclination angle at which the gap Ga between the outer peripheral surface Pc and the curved surface formed between the upper surface Pa of the substrate P is, for example, about several tens to hundreds of μm.

  A measuring unit (measuring device) 43 that measures the distance between the outer peripheral surface 31c and the second holding unit 32 is provided at a position of each second holding unit 32 that faces the outer peripheral surface 31c of the first holding unit 31. Yes. The measurement unit 43 detects the distance to the second holding unit 32 by projecting the detection light 43a toward the outer peripheral surface 31c and receiving the reflected light, for example. A porous member 80 (details will be described later) at a position facing the measurement unit 43 is provided with a hole 80K that extends in the Y direction and forms an optical path of the detection light 43a.

  The distance between the outer peripheral surface 31 c and the second holding unit 32 measured by the measuring unit 43 is output to the control device 8. The control device 8 obtains the distance between the substrate P and the cover member T according to the distance between the outer peripheral surface 31c and the second holding portion 32, and calculates the amount of the gap Ga from the distance. The control device 8 controls the drive of the drive device DV according to the calculated amount of gap Ga. The driving device DV and the control device 8 constitute an adjusting device capable of adjusting the amount of the gap Ga between the substrate P and the cover member T.

  In addition, the substrate stage 2 has a space 23 that communicates with the gap Ga between the substrate P and the cover member T. The space 23 is located below the gap Ga. The gap Ga is between the opposite side surface (outer peripheral surface) Pc of the substrate P held by the first holding unit 31 and the inner surface (inclined surface) Ts of the cover member T held by the second holding unit 32. Formed.

  A porous member 80 is disposed in the space 23. In the present embodiment, the porous member 80 has an upper surface 80A that can face at least one of the injection surface 13 and the lower surface 14. The upper surface 80A is disposed below the substrate P and the cover member T (−Z side). In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed by, for example, a sintering method. In the present embodiment, at least a part of the liquid LQ that flows in through the gap Ga is recovered through the porous member 80.

  In the present embodiment, the substrate stage 2 has a suction port 24 disposed in the space 23. In the present embodiment, the suction port 24 is formed on at least a part of the inner surface of the substrate stage 2 that forms the space 23. The suction port 24 sucks at least a part of the fluid in the space portion 23 so that the space portion 23 has a negative pressure. The suction port 24 can suck one or both of the liquid and gas in the space 23.

  The suction port 24 is connected to the fluid suction device 26 via the flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suck one or both of liquid and gas through the suction port 24. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of liquid and gas) sucked from the suction port 24 is sucked into the fluid suction device 26 via the flow path 25.

  Next, an example of the operation of the exposure apparatus EX will be described with reference to FIGS. 5 is a cross-sectional view taken along line AA in FIG. 3 during a non-exposure operation.

  After the irradiation of the exposure light EL with respect to the plurality of shot areas (after the exposure of the substrate P), the control device 8 moves the substrate stage 2 to the substrate replacement position in order to execute the substrate replacement process. After the substrate stage 2 is disposed at the substrate replacement position, the control device 8 drives the driving device DV to move the second holding portion 32 and the cover member T away from the substrate P as shown in FIG. Move. Thereby, the dimension of the gap Ga becomes larger than the dimension when the exposure process is performed on the substrate P, and the upper surface Pa of the substrate P including the periphery is opened. Thereafter, the substrate P after exposure in the previous exposure process is unloaded from the first holding unit 31 using a substrate transport device (not shown). At this time, as described above, since the cover member T does not exist above the substrate P and is opened, the substrate P can be carried out to the + Z side without any trouble.

  After the exposed substrate P is unloaded from the first holding unit 31, the control device 8 loads the unexposed substrate P into the first holding unit 31 using a substrate transfer device (not shown). (Load). Even when the substrate P is carried into the first holding portion 31, since the cover members T are in positions away from each other, the substrate P is carried in without any delay.

  When the substrate P is carried into the first holding unit 31, the control device 8 drives the driving device DV to bring the second holding unit 32 and the cover member T closer to the substrate P as shown in FIG. The cover member T is joined at the joining surface TF. The position of the cover member T at this time is measured based on the distance from the outer peripheral surface 31c of the first holding unit 31 measured by the measuring unit 43, and the control device 8 controls the driving device DV according to the measured position. By doing so, the cover member T can be accurately positioned at a predetermined position. Thereby, the upper surface Pa of the substrate P is in a state in which a part of the periphery is covered with the cover member T.

  And in order to expose the board | substrate P currently hold | maintained at the 1st holding | maintenance part 31, the board | substrate stage 2 is moved to an exposure position, the last optical element 12, the liquid immersion member 7, and the board | substrate stage 2 (board | substrate P) After the immersion space LS is formed with the liquid LQ in the meantime, the control device 8 starts the exposure processing of the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. As a result, the substrate P is exposed with the exposure light EL through the liquid LQ, and the pattern image of the mask M is projected onto the substrate P through the projection optical system PL and the liquid LQ.

  As shown in FIG. 6, in this embodiment, a plurality of shot areas S, which are exposure target areas, are arranged in a matrix on the substrate P. The control device 8 sequentially exposes a plurality of shot areas S determined on the substrate P.

  When exposing the shot region S of the substrate P, the terminal optical element 12 and the liquid immersion member 7 and the substrate P are opposed to each other, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. When sequentially exposing the plurality of shot regions S of the substrate P, the immersion space LS is filled with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Is formed, the substrate stage 2 is moved in the XY plane by the drive system 5. In the state where the immersion space LS is formed with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2, the control device 8 While moving the stage 2, the substrate P is exposed.

  For example, in order to expose the first shot area S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to the exposure start position. The control device 8 moves the first shot region S (substrate P) in the Y-axis direction with respect to the projection region PR of the projection optical system PL while the immersion space LS is formed. The exposure light EL is irradiated to the shot area S.

  After the exposure of the first shot area S is completed, in order to expose the next second shot area S, the control device 8 moves the substrate P in the X-axis direction (with the immersion space LS formed) Alternatively, the second shot region S is moved to the exposure start position by moving in the direction inclining with respect to the X-axis direction in the XY plane. The control device 8 exposes the second shot area S in the same manner as the first shot area S.

  The control device 8 finishes the operation (scan exposure operation) of irradiating the shot region S with the exposure light EL while moving the shot region S in the Y-axis direction with respect to the projection region PR, and the exposure of the shot region S. Thereafter, while repeating the operation (stepping operation) for moving the next shot region S to the exposure start position, the plurality of shot regions S on the substrate P are transferred to the projection optical system PL and the liquid LQ in the immersion space LS. Are sequentially exposed. The exposure light EL is sequentially irradiated onto the plurality of shot regions S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P move relatively along the movement trajectory indicated by the arrow R1 in FIG. While exposing the projection area PR to the exposure light EL, the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL through the liquid LQ. In at least part of the movement of the substrate stage 2 in the exposure of the substrate P, the immersion space LS is formed on the gap Ga.

  Here, the gap Ga is formed between the substrate P and the cover member T. The outer peripheral surface is such that the inclined surface Ts of the cover member T partially covers the periphery of the upper surface Pa of the substrate P on the upper surface Ta. Since the diameter is smaller than the diameter of Pc, even when a chamfered inclined surface or an arcuate curved surface exists at the intersection of the upper surface Pa and the outer peripheral surface Pc in the substrate P, these inclined surfaces or The gap amount between the curved surfaces can be reduced. Therefore, even when the immersion space LS passes over the gap Ga, the possibility that the liquid LQ remains in the gap Ga can be reduced. In particular, when the surface of the cover member T and the surface of the substrate P have water repellency, the possibility that the liquid LQ remains can be further reduced.

  When the liquid LQ remains in the gap Ga, the control device 8 collects at least a part of the liquid LQ flowing into the gap Ga through the porous member 80. When recovering the liquid LQ that has flowed into the gap Ga, the control device 8 controls the fluid suction device 26 to connect the suction port 24 to the vacuum system. By performing the suction operation from the suction port 24, the hole of the porous member 80 becomes negative pressure. Thereby, the fluid around the porous member 80 is sucked from the hole of the porous member 80. Therefore, when the space 23 becomes negative pressure, the liquid LQ remaining in the gap Ga is introduced into the space 23, and is collected from the upper surface 80 </ b> A of the porous member 80 or the hole on the side surface through the suction port 24 and the flow path 25. -Removed.

  As described above, in the present embodiment, the inclined surface Ts of the cover member T is formed with a smaller diameter than the diameter of the outer peripheral surface Pc so as to partially cover the periphery of the upper surface Pa of the substrate P on the upper surface Ta. Therefore, even when an inclined surface or a curved surface exists on the peripheral edge of the substrate P, the gap amount of the gap Ga can be minimized. In the present embodiment, as described above, even when the inclined surface Ts of the cover member T covers the periphery of the upper surface Pa of the substrate P, the gap amount of the gap Ga can be adjusted by moving the cover member T. Therefore, it is possible to prevent troubles in loading / unloading the substrate P to / from the first holding unit 31 accompanying movement in the Z direction.

  Moreover, in this embodiment, in order to control the movement of each cover member T according to the distance of each cover member T and the board | substrate P which the measurement part 43 measured, each cover member T is predetermined position with respect to the board | substrate P. It is possible to position with high accuracy.

Second Embodiment
Next, a second embodiment of the exposure apparatus EX will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and the description thereof is omitted.

As shown in FIG. 7, the cover member T in the exposure apparatus EX of the present embodiment has an inclined surface Ts that gradually increases in diameter from the upper surface Ta toward the lower surface Tb on the inner surface facing the outer peripheral surface Pc of the substrate P. An inclined surface (third inclined portion) Tt that gradually increases in diameter is provided from the lower surface Tb toward the upper surface Ta. The inner diameter (the diameter on the lower surface Tb) of the inclined surface Tt around the optical axis AX is smaller than the diameter of the outer peripheral surface Pc of the substrate P. The lower surface Tb of the cover member T is disposed so as to cover a part of the periphery of the lower surface Pb of the substrate P.
Other configurations are the same as those of the first embodiment.

  In the exposure apparatus EX configured as described above, in addition to obtaining the same operations and effects as in the first embodiment, it is possible to minimize the gap amount of the gap Ga on the lower surface Pb side of the substrate P. Become.

<Third Embodiment>
Next, a third embodiment of the exposure apparatus EX will be described with reference to FIGS.
In the first and second embodiments, the movement of the cover member T in the Y direction prevents the board P from being brought into and out of the first holding unit 31. In the embodiment, a case where the cover member T is moved in the Z direction will be described.

FIG. 8 is a plan view of the substrate stage 2 according to the present embodiment, and FIG. 9 is a sectional view taken along line BB in FIG.
The cover member T in the present embodiment is a flexible member formed of a flexible material. The cover base CB has a rectangular shape in plan view, and a plurality of covers provided around the optical axis AX on the inner diameter side of the cover base CB. (Eight in FIG. 8) movable parts TM. Each movable portion TM is arranged between the adjacent movable portions TM around the optical axis AX via a gap extending in the radial direction with the optical axis AX at the center.

  As shown in FIG. 9, each movable part TM includes a thin part TMa thinner than the cover base CB in a shape in which the lower surface Tb side is omitted on the inner diameter side of the position supported by the second holding part 32. The inclined surface Ts described above is provided on the surface of the thin portion TMa facing the outer peripheral surface Pc of the substrate P. A plurality (three in FIG. 9) of groove portions TMb are provided at intervals on the outer diameter side of the thin portion TMa in the movable portion TM along the radial direction. Each groove part TMb is formed so as to penetrate in a direction orthogonal to the radial direction. Each groove part TMb includes a circular groove 29a disposed close to the upper surface Ta, and a rectangular groove 29b extending from the circular groove to the −Z side and opening to the lower surface Tb.

  A moving member 30 that moves in the Z direction under the control of the control device 8 is provided below the thin portion TMa.

  In the exposure apparatus EX configured as described above, during the exposure process, as shown in FIG. 9, the moving member 30 is separated from the thin portion TMa, so that the inclined surface Ts of the cover member T is on the upper surface Ta, and the substrate P Since it is formed with a smaller diameter than the circumference of the outer peripheral surface Pc so as to partially cover the periphery of the upper surface Pa, a chamfered inclined surface or an arc-shaped curved surface is formed at the intersection of the upper surface Pa and the outer peripheral surface Pc on the substrate P. Even when there is a gap, the amount of gap between the inclined surface and the curved surface can be reduced.

  On the other hand, when exchanging the substrate P, etc., the control device 8 moves the moving member 30 to the + Z side as the driving device, and as shown in FIG. 10, the thin portion TMa is bent and moved to the + Z side. The thin portion TMa is elastically deformed so as to rotate counterclockwise around a predetermined position of the upper surface Ta facing the groove portion TMb as a rotation center. As a result, the part having the smallest diameter from the optical axis AX on the inclined surface Ts is located outside the movement path in the Z direction of the substrate P, and the dimension of the gap Ga is increased, and the movement in the Z direction is performed. It is possible to prevent the board P from being loaded into and unloaded from the first holding part 31 accompanied by the trouble.

  Therefore, in this embodiment, in addition to obtaining the same operation and effect as in the first embodiment, it is not necessary to move the cover member T in the direction along the XY plane, and the apparatus can be downsized. it can.

In the third embodiment, the moving member 30 is moved in the Z direction. However, the present invention is not limited to this. As shown in FIGS. 11 and 12, the thin portion TMa and the groove portion TMb A protrusion Td that protrudes toward the −Z side with respect to the lower surface Tb may be provided therebetween, and the moving member 30 may move in the horizontal direction toward the optical axis AX to rotate the protrusion Td.
Even in this configuration, the same operations and effects as those of the third embodiment can be obtained.

In the third embodiment, the movable member TM is moved (rotated) with respect to the cover member CB so that the cover member T hinders the loading / unloading of the substrate P to / from the first holding unit 31. In addition to this, as shown in FIG. 13A, the cover member T and the second holding part 32 can be integrally moved with respect to the substrate stage 2 in the Z direction. 13B, the cover member T and the second holding part 32 are moved above the substrate P by using the above-described moving member 30 that is movable in the Z direction, for example. It is good.
In this configuration, the transfer device H can carry the substrate P into and out of the first holding unit 31 through the gap between the second holding unit 32 and the substrate stage 2.

<Fourth embodiment>
Next, a fourth embodiment of the exposure apparatus EX will be described with reference to FIGS.
In the present embodiment, a configuration in which the cover member T moves on the substrate P will be described.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and the description thereof is omitted.

FIG. 14 is a plan view of the substrate stage 2.
As shown in FIG. 14, guide members (supporting mechanisms) GB extending in the X direction are provided in the vicinity of both ends in the Y direction on the substrate stage 2. Two cover members T are supported on the guide member GB so as to be independently movable by a driving device (not shown) under the control of the control device 8.
Each cover member T extends in the Y direction with a length larger than the outer diameter of the substrate P. The width of each cover member T is formed to a value larger than the width of the shot region S in the X direction.

15 is a cross-sectional view taken along line CC in FIG.
As shown in FIG. 15, each cover member T is provided so as to be movable with a very small gap between the cover member T and the substrate P. Each cover member T includes a porous portion 180 provided on the side facing the substrate P, and a liquid repellent portion (water repellent portion) 181 provided on the surface of the porous portion. A fluid suction device 126 is connected to the porous portion 180.

  In the exposure apparatus EX configured as described above, as shown in FIG. 14, two other shot areas (second shot areas) adjacent in the X direction across two shot areas (first shot areas) S to be exposed are arranged. Cover with cover member T. In this case, since the gap between the cover member T and the substrate P is very small, and the surface of the cover member T is the water repellent portion 181, as shown in FIG. The liquid LQ in the immersion space LS located outside the X direction rides on the cover member T. Further, when the liquid LQ enters the gap between the cover member T and the substrate P, the liquid LQ is sucked and removed by the fluid suction device 126 through the porous portion 180.

  When the exposure process for the shot area S is completed and the substrate P and the immersion space LS move relative to each other for the exposure process for another shot area S adjacent in the X direction, Synchronously, the cover member T also moves to maintain the relative positional relationship with the liquid immersion space LS.

  Then, when the substrate P is loaded into or unloaded from the first holding unit 31, each cover member T is retracted to a position that does not hinder the movement of the substrate P in the Z direction, as indicated by a two-dot chain line in FIG. After that, the substrate P may be moved.

  As described above, in the present embodiment, by covering the shot area adjacent to the shot area S to be exposed with the cover member T, it is possible to prevent the liquid LQ from remaining in the adjacent shot area. Further, in the present embodiment, the liquid LQ that has entered the gap between the cover member T and the substrate P can be sucked and removed by the porous portion 180, so that residual water on the substrate P can be more reliably suppressed. It becomes possible.

In the fourth embodiment, the cover member T is arranged on both sides in the X direction across the shot area S to be exposed. However, the present invention is not limited to this. The cover member T may be disposed only on a certain side, and the side having the unexposed shot area may not be disposed.
In this configuration, even if the liquid LQ remains on the substrate P on the side where the unexposed shot area is present, the remaining water is in the immersion space LS when the immersion space LS is moved in a subsequent exposure process. It can be absorbed by LS and disappear.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the first and second embodiments, the cover member T is moved to increase the size of the gap Ga when the substrate P is carried out / in, but the present invention is not limited to this. The dimension of the gap Ga may be changed between a first state in which the immersion space LS is formed on the gap Ga and a second state in which the immersion space LS is not formed on the gap Ga.
For example, in the second state, the cover member T is moved to the outside (position away from the optical axis AX; for example, see FIG. 5) so that the size of the gap Ga is large. In the first state, the size of the gap Ga is 4 and 7, the inclined surface Ts of the cover member T may be moved so as to approach the substrate P so as to decrease.

  For example, when exposing a shot region adjacent to the gap Ga on the + Y side with respect to the center (optical axis AX) of the substrate P, the gap Ga between the cover member T located on the + Y side and the substrate P Each cover member T is moved to reduce the size and increase the size of the gap Ga between the cover member T and the substrate P located on the −Y side, and conversely with respect to the center (optical axis AX) of the substrate P. When exposing a shot region adjacent to the gap Ga on the −Y side, the dimension of the gap Ga between the cover member T located on the −Y side and the substrate P is reduced, and the cover member T located on the + Y side Each cover member T may be configured to move so as to increase the size of the gap Ga with the substrate P. Alternatively, when the location where the liquid LQ is supplied from the liquid immersion member 7 is located above the gap Ga formed by one of the cover members T, the dimension of the gap Ga between the one of the cover members T and the substrate P Each cover member T may be moved so that the dimension of the gap Ga between the other side of the cover member T and the substrate P is increased so that the liquid LQ is not supplied from the liquid immersion member 7.

Although not mentioned in the above embodiment, in the encoder system for measuring the position of the substrate stage 2, for example, when the encoder scale is provided on the cover member T as a measuring instrument, the movement of the cover member T is performed. Since the position of the substrate stage 2 measured by the encoder system varies according to the amount, it is preferable that the control device 8 corrects the measurement result of the encoder system according to the movement amount of the cover member T.
Such an encoder system is disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  In each of the above-described embodiments, the optical path K on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the 2004/019128 pamphlet, the optical path on the incident side (object plane side) of the last optical element 12 may also be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the exposure liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices. For example, as shown in FIG. 16, the exposure apparatus EX may include two substrate stages 2001 and 2002 (in FIG. 16, the dividing surface of the cover member and the like are not shown). In that case, the object that can be arranged so as to face the emission surface 13 is one of the substrate stages, the substrate held on the one substrate stage, the other substrate stage, and the substrate held on the other substrate stage. Including at least one.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 17, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage (stage apparatus), 3 ... Measuring member, 7 ... Liquid immersion member, 8 ... Control apparatus (adjustment apparatus), 12 ... Terminal optical element (optical member), 13 ... Ejection surface, 24 ... Suction port (collection) Mouth), 27A ... air supply port, 31 ... first holding part (substrate holding part), 32 ... second holding part, 43 ... measuring part (measuring device), 64, 65 ... air supply port, 80 ... porous member ( (Collecting member), 103 ... chamber device, AX ... optical axis, C ... measuring member (measuring instrument), DV ... driving device (adjusting device), EL ... exposure light, EX ... exposure device, Ga ... gap, GB ... guide member (Support mechanism), LQ ... liquid, LS ... immersion space, P ... substrate (first object), T ... cover member (first member, second member second object), Ta ... upper surface (first upper surface, first object) 2 upper surface), Ts ... inclined surface (first inclined portion, second inclined portion, first inner surface) , Second inner surface), Tt ... inclined surface (third inclined portion)

Claims (30)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A substrate holding portion for releasably holding the lower surface of the substrate;
A first upper surface disposed so as to cover a part of the periphery of the upper surface of the substrate held by the substrate holding portion, and a first inclined portion inclined downward toward the outside with respect to the center of the substrate holding portion; A first member having a first inner surface including:
A second upper surface disposed so as to cover a part of the periphery of the upper surface of the substrate held by the substrate holding portion, and a second inclined portion inclined downward toward the outside with respect to the center of the substrate holding portion A second member having a second inner surface including:
An adjusting device capable of adjusting a gap between the first member and the second member relative to the substrate by moving the first member and the second member in a direction intersecting an optical axis of the optical member;
An exposure apparatus comprising:   The exposure apparatus according to claim 1, wherein each of the adjusting devices is capable of moving the first and second members in a direction parallel to the optical axis.   The exposure apparatus according to claim 1, wherein the first member is moved so that a peripheral area on the upper surface of the substrate and the first inclined portion face each other. The substrate includes a base material and a film that is disposed on the base material and is liquid repellent with respect to the liquid,
The exposure apparatus according to claim 3, wherein the film and the first inclined portion face each other.   The exposure apparatus according to claim 4, wherein the first inclined portion is liquid repellent with respect to the liquid. The first member is disposed on one side with respect to the center of the substrate with respect to a direction intersecting the optical axis of the optical member,
The second member is disposed on the other side with respect to the center of the substrate,
6. The first and second members are moved so that a distance between an inner edge of the first upper surface and an inner edge of the second upper surface is smaller than a diameter of the substrate. The exposure apparatus described in 1.   The said 1st inner surface is arrange | positioned under the said 1st inclination part, and contains the 3rd inclination part which inclines upward toward the outer side with respect to the center of the said board | substrate holding part. The exposure apparatus described in 1.   The exposure apparatus according to claim 7, wherein the first member is moved so that a peripheral area on a lower surface of the substrate and the third inclined portion face each other. A second holding part that is disposed in a part of the periphery of the substrate holding part and holds the first member in a releasable manner;
The exposure apparatus according to claim 1, wherein the adjustment device moves the second holding unit. A measuring device for measuring the position of the second holding unit relative to the substrate holding unit;
The exposure apparatus according to claim 9, wherein the adjustment device moves the second holding unit based on a measurement result of the measurement device. A stage device that moves in a direction intersecting the optical axis of the optical member in a state of supporting the substrate holding part and the second holding part;
The first member includes a measuring instrument for measuring the position of the stage device,
The exposure apparatus according to claim 9 or 10, wherein a measurement result of the measuring device is corrected based on a driving amount of the adjusting device.  The dimension of the first gap between the first member and the substrate in at least one of carrying the substrate into and out of the substrate from the substrate holding unit is held by the substrate holding unit. The exposure apparatus according to any one of claims 1 to 11, wherein the first member is moved so as to be larger than a dimension of the first gap in exposure of the substrate. The liquid immersion space formed on the exit surface side of the optical member is formed in the gap by moving the substrate holding portion holding the substrate in a direction intersecting the optical axis. Changing from one of the state and the second state not formed on the gap to the other;
The exposure apparatus according to claim 1, wherein the first member is moved so that a dimension of the gap in the first state is smaller than a dimension of the gap in the second state. .   The size of the gap in a state where the first shot region of the substrate adjacent to the gap is exposed through the liquid in the immersion space formed on the emission surface side of the optical member is set to the center of the substrate. The first member is moved so as to be smaller than the size of the gap in a state in which the second shot area opposite to the first shot area is exposed. The exposure apparatus described in 1. The second shot region is adjacent to a second gap between the second member and the substrate;
The dimension of the second gap when the second shot area is exposed through the liquid in the immersion space is smaller than the dimension of the second gap when the first shot area is exposed. The exposure apparatus according to claim 14, wherein the second member is moved.   The dimension of the first gap when the liquid is supplied from above the first gap between the first member and the substrate is smaller than the dimension of the first gap when the liquid is not supplied. The exposure apparatus according to claim 1, wherein the first member is moved. The first member is a flexible member;
At least one of the first member and the first member so that a dimension of the first gap between the first member and the substrate is increased in at least one of carrying the substrate into and out of the substrate from the substrate holding unit. The exposure apparatus according to any one of claims 1 to 16, further comprising a drive device that bends a part thereof. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A substrate holding portion for releasably holding the lower surface of the substrate;
A flexible first member having a first upper surface disposed on at least a part of the periphery of the upper surface of the substrate in a state where the substrate is held by the substrate holding unit;
An exposure apparatus comprising: a driving device that bends at least a part of the first member so that a dimension of a first gap between the substrate and the first member changes.   In the driving device, the size of the first gap in at least one of the loading of the substrate into the substrate holding unit and the unloading of the substrate from the substrate holding unit is exposure of the substrate held by the substrate holding unit. The exposure apparatus according to claim 18, wherein the first member is bent so as to be larger than a dimension of the first gap. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A substrate holding portion for releasably holding the lower surface of the substrate;
A first member having a first upper surface that defines an opening smaller than the diameter of the substrate, and a first inner surface that is inclined downward toward the outside with respect to the center of the opening;
The peripheral region of the upper surface of the substrate and the first inner surface of the first member are opposed to each other in a state where the substrate is held by the substrate holding unit and is disposed at least partially around the substrate holding unit. And a second holding part for holding the first member in a releasable manner,
In at least one of carrying the substrate into and out of the substrate from the substrate holding part, the first member is released from the second holding part, and the first member and the second holding part are An exposure apparatus in which the substrate is transported between. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A stage holding device that releasably holds the lower surface of the substrate, and a stage device that is movable below the optical member;
It is movable on the substrate with respect to a direction intersecting the optical axis of the optical member, and the first shot area of the substrate is exposed through the liquid in the immersion space formed on the emission surface side of the optical member. And a cover member that covers the second shot region of the substrate. A support device that is disposed around the substrate holding portion in the stage device and supports the cover member in a movable manner;
The exposure apparatus according to claim 21, further comprising: a driving device that moves the cover member supported by the support device.   23. The exposure apparatus according to claim 21, wherein the lower surface of the cover member faces the upper surface of the substrate with a gap.   The exposure apparatus according to any one of claims 21 to 23, wherein the immersion space can be formed on an upper surface of the cover member. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 24;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Forming a liquid immersion space on the exit surface side of the optical member from which the exposure light is emitted;
Holding the lower surface of the substrate in a releasable manner with a substrate holding part movable under the optical member;
Exposing the substrate through the liquid in the immersion space;
In a state where the substrate is held by the substrate holding portion, a first upper surface disposed at a part of the periphery of the upper surface of the substrate, and a first inclination inclined downward toward the outside with respect to the center of the substrate holding portion. Moving a first member having a first inner surface including one inclined portion in a direction intersecting the optical axis of the optical member to adjust the dimension of the first gap between the substrate and the first member;
A second member having a second upper surface disposed at a part of the periphery of the upper surface of the substrate and a second inner surface including a second inclined portion inclined downward toward the outside with respect to the center of the substrate holding portion; An exposure method comprising: moving in a direction intersecting the optical axis to adjust a dimension of a second gap between the substrate and the second member. An exposure method for exposing a substrate with exposure light through a liquid,
Forming a liquid immersion space on the exit surface side of the optical member from which the exposure light is emitted;
Holding the lower surface of the substrate in a releasable manner with a substrate holding part movable under the optical member;
Exposing the substrate through the liquid in the immersion space;
At least a part of a flexible first member having a first upper surface disposed on at least a part of the periphery of the upper surface of the substrate in a state where the substrate is held by the substrate holding part, the substrate and the Bending the first gap between the first member and the first member to change. An exposure method for exposing a substrate with exposure light through a liquid,
Forming a liquid immersion space on the exit surface side of the optical member from which the exposure light is emitted;
Holding the lower surface of the substrate in a releasable manner with a substrate holding part movable under the optical member;
Exposing the substrate through the liquid in the immersion space;
The substrate holds the first member having a first upper surface defining an opening smaller than the diameter of the substrate and a first inner surface inclined downward toward the outside with respect to the center of the opening. Holding in a releasable manner by the second holding portion so that the peripheral area of the upper surface of the substrate and the first inner surface of the first member face each other in a state where
The first member and the second holding unit are released by releasing the first member from the second holding unit in at least one of carrying the substrate into and out of the substrate from the substrate holding unit. Conveying the substrate between the first and second exposure methods. An exposure method for exposing a substrate with exposure light through a liquid,
Forming a liquid immersion space on the exit surface side of the optical member from which the exposure light is emitted;
Holding the lower surface of the substrate in a releasable manner with a substrate holding part movable under the optical member;
In a state where the first shot region of the substrate is exposed through the liquid in the immersion space formed on the emission surface side of the optical member, the first shot region on the substrate with respect to the direction intersecting the optical axis of the optical member Covering the second shot area of the substrate with a movable cover member. Exposing the substrate using the exposure method according to any one of claims 26 to 29;
Developing the exposed substrate. A device manufacturing method.

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