JP2013102029A - Exposure device, exposure method, manufacturing method of device, program, and recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of minimizing occurrence of exposure failure.SOLUTION: The exposure device exposes a substrate with exposure light through a liquid. The exposure device includes an optical member having an emission surface for emitting the exposure light, a first movable member movable in a predetermined plane including an irradiation position where the substrate can be irradiated with the exposure light from the emission surface 12, a second movable member movable in a predetermined plane, a third movable member 10 movable between the optical member and at least one of the first and second movable members, a supply port for supplying a liquid to the emission surface side, and a drive system 50 which places at least one of the first movable member, the second movable member and the third movable member at a position facing the emission surface, so that a liquid immersion space LS is formed continuously on the emission surface side.

Description

  The present invention relates to an exposure apparatus, an exposure method, a device manufacturing method, a program, and a recording medium.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2009/0046261

  In the immersion exposure apparatus, for example, if a liquid flows out from a predetermined space, an exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method, a program, and a recording medium that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and exposure light from the exit surface is irradiated Between a first movable member movable within a predetermined plane including a possible irradiation position, a second movable member movable within the predetermined plane, and between the optical member and at least one of the first movable member and the second movable member A first movable member at a position facing the ejection surface so that a liquid immersion space continues to be formed on the ejection surface side, An exposure apparatus is provided that includes a second movable member and a drive system that arranges at least one of the third movable member.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein the liquid is supplied from a supply port to an emission surface side of an optical member from which the exposure light is emitted. The first movable member movable within a predetermined plane including the irradiation position where the exposure light from the emission surface can be irradiated, and the substrate is held within the predetermined plane so that a liquid immersion space is continuously formed on the emission surface side. The movable second movable member and at least one third movable member movable between the optical member and at least one of the first movable member and the second movable member are placed at a position facing the emission surface. An exposure method is provided that includes disposing and exposing the substrate through the liquid in the immersion space.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the third aspect and developing the exposed substrate.

  According to a fifth aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via a liquid, on the emission surface side of the optical member from which the exposure light is emitted. A first movable that is movable within a predetermined plane including an irradiation position where exposure light can be irradiated from the emission surface, so that liquid is supplied from the supply port and a liquid immersion space is continuously formed on the emission surface side. At least one of a member, a second movable member movable while holding the substrate within a predetermined plane, and a third movable member movable between the optical member and at least one of the first movable member and the second movable member. Is provided at a position opposite to the emission surface, and a substrate is exposed through the liquid in the immersion space.

  According to the sixth aspect of the present invention, a computer-readable recording medium on which the program of the fifth aspect is recorded is provided.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a figure which shows an example of the exposure apparatus which concerns on this embodiment. It is a figure which shows a part of exposure apparatus which concerns on this embodiment. It is a schematic diagram which shows a part of exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a top view which shows an example of the substrate stage and measurement stage which concern on this embodiment. It is a top view which shows typically a part of exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to the XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. FIG. 2 is a side sectional view showing the vicinity of the liquid immersion member 3 according to the present embodiment.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment includes a substrate stage 2P and a measurement stage 2C as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is an exposure apparatus.

  1 and 2, the exposure apparatus EX includes a mask stage 1 that can move while holding the mask M, a substrate stage 2P that can move while holding the substrate P, and exposure light without holding the substrate P. An image of a pattern of the mask M illuminated with the exposure light EL, a measurement stage 2C that can be moved by mounting a measurement member (measuring instrument) C1 that measures the EL, an illumination system IL that illuminates the mask M with the exposure light EL, and A liquid immersion space LS is formed by holding the liquid LQ between the projection optical system PL for projecting the light onto the substrate P and the substrate P so that the optical path of the exposure light EL irradiated onto the substrate P is filled with the liquid LQ. A liquid immersion member 3, a control device 4 that controls the operation of the entire exposure apparatus EX, and a storage device 5 that is connected to the control device 4 and stores various information relating to exposure are provided. The storage device 5 includes a memory such as a RAM, and a recording medium such as a hard disk and a CD-ROM. The storage device 5 is installed with an operating system (OS) for controlling the computer system, and stores a program for controlling the exposure apparatus EX.

  In the present embodiment, the exposure apparatus EX includes a shutter member 10 that is movable between the terminal optical element 13 of the projection optical system PL and at least one of the substrate stage 2P and the measurement stage 2C. The last optical element 13 has an emission surface 12 from which the exposure light EL is emitted. In the present embodiment, the exposure apparatus EX includes a drive system 50 that can move at least one of the substrate stage 2P, the measurement stage 2C, and the shutter member 10 so as to face the exit surface 12 of the last optical element 13. I have. The drive system 50 is controlled by the control device 4. The drive system 50 arranges at least one of the substrate stage 2P, the measurement stage 2C, and the shutter member 10 at a position facing the emission surface 12 so that the immersion space LS of the liquid LQ is continuously formed on the emission surface 12 side. To do.

  Further, the exposure apparatus EX of the present embodiment measures the position of the substrate stage 2P using a scale member T included in the substrate stage 2P as disclosed in, for example, US Patent Application Publication No. 2007/0288121. An encoder system 6 is provided.

  Further, the exposure apparatus EX of the present embodiment includes a first detection system 7 that detects the position of the surface of the substrate P, a second detection system 8 that detects the position of the substrate P, a mask stage 1, a substrate stage 2P, and And an interferometer system 9 for measuring the position of the measurement stage 2C.

  In the present embodiment, the exposure apparatus EX includes a transport system 11 that transports the substrate P. The transport system 11 can execute a substrate exchange process including a process for loading the substrate P into the substrate stage 2P and a process for unloading the substrate P from the substrate stage 2P.

  Further, the exposure apparatus EX includes a chamber apparatus CH that forms an internal space CS in which at least the projection optical system PL, the liquid immersion member 3, the substrate stage 2P, and the measurement stage 2C are arranged. The chamber device CH has an environment control device that controls the environment (temperature, humidity, pressure, and cleanliness) of the internal space CS.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 12G of the base member 12 including the illumination region IR while holding the mask M. In the present embodiment, the guide surface 12G and the XY plane are substantially parallel. The mask stage 1 is moved by the operation of a driving device 49 including a planar motor as disclosed in US Pat. No. 6,452,292, for example. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 12. In the present embodiment, the mask stage 1 is movable in six directions on the guide surface 12G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the driving device 49. The driving device 49 may not be a planar motor. For example, the drive device 49 may include a linear motor.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The projection optical system PL has an emission surface 12 from which the exposure light EL is emitted toward the image plane of the projection optical system PL. Of the plurality of optical elements of the projection optical system PL, the terminal optical element 13 closest to the image plane of the projection optical system PL has the exit surface 12. The projection region PR includes a position where the exposure light EL emitted from the emission surface 12 can be irradiated. In the present embodiment, the emission surface 12 faces the −Z direction and is parallel to the XY plane. Note that the exit surface 12 facing the −Z direction may be a convex surface or a concave surface. The optical axis of the last optical element 13 is parallel to the Z axis. In the present embodiment, the exposure light EL emitted from the emission surface 12 travels in the −Z direction.

  The substrate stage 2P is movable in the XY plane including the irradiation position EP where the exposure light EL from the emission surface 12 can be irradiated while holding the substrate P. The irradiation position EP where the exposure light EL from the emission surface 12 can be irradiated includes the projection region PR of the projection optical system PL. In the present embodiment, the substrate stage 2P is movable on the guide surface 14G of the base member 14. In the present embodiment, the guide surface 14G and the XY plane are substantially parallel.

  The measurement stage 2C is movable in the XY plane including the irradiation position EP (projection region PR) where the exposure light EL from the emission surface 12 can be irradiated with the measurement member C1 (measuring instrument) mounted. In the present embodiment, the measurement stage 2 </ b> C is movable on the guide surface 14 </ b> G of the base member 14.

  In this embodiment, the measurement member C1 is an aerial image measurement system capable of measuring an aerial image (imaging characteristic) of the projection optical system PL as disclosed in, for example, US Patent Application Publication No. 2002/0041377. Part of The measurement member C1 may constitute a part of an illuminance unevenness measurement system capable of measuring the illuminance unevenness of the exposure light EL as disclosed in, for example, US Pat. No. 4,465,368. Further, the measurement member C1 may constitute a reference mark that is measured by an alignment system that can measure the alignment mark of the substrate P as disclosed in, for example, US Pat. No. 5,493,403. The measurement member C1 is disclosed in, for example, an irradiation amount measurement system (illuminance measurement system) disclosed in, for example, US Patent Application Publication No. 2002/0061469, and the like, for example, European Patent No. 1079223. A part of a measurement system that measures the exposure light EL of the exposure light EL, such as a wavefront aberration measurement system, may be configured.

  The drive system 50 includes drive devices 51 and 52 that can move the substrate stage 2P and the measurement stage 2C. The driving devices 51 and 52 include flat motors as disclosed in US Pat. No. 6,452,292, for example. The planar motor has a mover disposed on each of the substrate stage 2P and the measurement stage 2C, and a stator disposed on the base member 14. The drive device 51 includes a mover disposed on the substrate stage 2P. The drive device 52 includes a mover arranged on the measurement stage 2C.

  In the present embodiment, each of the substrate stage 2P and the measurement stage 2C is operated on the guide surface 14G by the operation of the drive system 50 (drive devices 51 and 52), the X axis, the Y axis, the Z axis, θX, θY, And 6 directions of θZ direction. The driving devices 51 and 52 that move the substrate stage 2P and the measurement stage 2C may not be planar motors. For example, at least one of the driving device 51 and the driving device 52 may include a linear motor.

  The substrate stage 2P includes a first holding unit 15 that holds the substrate P in a releasable manner. Further, in the present embodiment, the substrate stage 2P includes a scale member T that is disposed on at least a part of the periphery of the first holding unit 15 and can be opposed to the emission surface 12. In the present embodiment, the scale member T is a plate-like member. As the substrate stage 2 moves, the scale member T also moves. For example, when the substrate stage 2 moves in the XY plane along the guide surface 14G, the scale member T also moves.

  In the present embodiment, the substrate stage 2P has a second holding part 16 that is disposed at least at a part of the periphery of the first holding part 15 and holds the scale member T in a releasable manner. The scale member T held by the second holding unit 16 is disposed on at least a part of the periphery of the substrate P held by the first holding unit 15. In the present embodiment, the scale member T has an opening. The substrate P is disposed inside the opening of the scale member T. In the present embodiment, the scale member T is disposed around the substrate P.

  In the present embodiment, the surface (upper surface) of the substrate P is substantially flat. The surface (upper surface) of the scale member T is substantially flat. In the present embodiment, the first holding unit 15 holds the back surface (lower surface) of the substrate P so that the front surface (upper surface) of the substrate P and the XY plane are substantially parallel to each other. The second holding unit 16 holds the back surface (lower surface) of the scale member T so that the surface (upper surface) of the scale member T and the XY plane are substantially parallel to each other.

  In the present embodiment, the surface (upper surface) of the substrate P held by the first holding unit 15 and the surface (upper surface) of the scale member T held by the second holding unit 16 are substantially in the same plane. Placed (coplanar).

  The surface (upper surface) of the substrate P held by the first holding unit 15 and the surface (upper surface) of the scale member T held by the second holding unit 16 may not be arranged in the same plane. One or both of at least part of the surface of the substrate P and at least part of the surface of the scale member T may be non-parallel to the XY plane.

  For example, at least a part of the surface (upper surface) of the scale member T may not be flat. For example, at least a part of the surface (upper surface) of the scale member T may include a curved surface.

  In the following description, the surface (upper surface) of the scale member T held by the substrate stage 2P (second holding unit 16) will be referred to as the upper surface 17 as appropriate. The upper surface 17 is disposed around the surface of the substrate P held by the first holding unit 15. The upper surface 17 of the scale member T can be opposed to the emission surface 12.

  In the present embodiment, the scale member T can be released from the substrate stage 2P, but may not be released. In this case, the second holding unit 16 can be omitted.

  Next, the liquid immersion member 3 will be described with reference to FIG. The liquid immersion member 3 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. In the present embodiment, the liquid immersion member 3 is disposed on at least a part of the periphery of the terminal optical element 13 of the projection optical system PL. In the present embodiment, the liquid immersion member 3 is an annular member. A part of the liquid immersion member 3 is arranged around the terminal optical element 13, and a part of the liquid immersion member 3 is arranged around the optical path of the exposure light EL emitted from the emission surface 12.

  The immersion space LS is formed on the emission surface 12 side. The immersion space LS is formed so that the optical path of the exposure light EL emitted from the emission surface 12 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 12 travels in the −Z direction. The exit surface 12 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 12 is a plane substantially parallel to the XY plane. The exit surface 12 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 3 has a lower surface 30 at least partially facing the −Z direction. In the present embodiment, the emission surface 12 and the lower surface 30 can hold the liquid LQ between the object disposed at the position EP (projection region PR) where the exposure light EL emitted from the emission surface 12 can be irradiated. it can. The immersion space LS is formed by the liquid LQ that is held between at least a part of the emission surface 12 and the lower surface 30 and the object disposed in the projection region PR. The immersion space LS is formed so that the optical path of the exposure light EL between the emission surface 12 and the object disposed at the irradiation position EP is filled with the liquid LQ. The liquid immersion member 3 can hold the liquid LQ with the object so that the optical path of the exposure light EL between the terminal optical element 13 and the object is filled with the liquid LQ.

  In the present embodiment, the object that can be placed at the irradiation position EP includes an object that can move relative to the irradiation position EP on the image plane side of the projection optical system PL (on the exit surface 12 side of the terminal optical element 13). The object is movable with respect to the last optical element 13 and the liquid immersion member 3. The object has an upper surface (surface) that can face at least one of the emission surface 12 and the lower surface 30. An immersion space LS can be formed between the upper surface of the object and the emission surface 12. In the present embodiment, an immersion space LS can be formed between the upper surface of the object and at least part of the emission surface 12 and the lower surface 30. By holding the liquid LQ between the emission surface 12 and the lower surface 30 on one side and the upper surface (front surface) of the object on the other side, the optical path of the exposure light EL between the last optical element 13 and the object is liquid. An immersion space LS is formed so as to be filled with LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2P (scale member T), the substrate P held by the substrate stage 2P, the measurement stage 2C, and the shutter member 10. For example, the upper surface 17 of the substrate stage 2P (scale member T) and the surface (upper surface) of the substrate P held by the substrate stage 2P are the exit surface 12 of the last optical element 13 facing the −Z direction and the −Z direction. Can be opposed to the lower surface 30 of the liquid immersion member 3. Of course, the object that can be placed at the irradiation position EP is not limited to at least one of the substrate stage 2P (scale member T), the substrate P held on the substrate stage 2P, the measurement stage 2C, and the shutter member 10.

  In the present embodiment, when performing the exposure processing of the substrate P, the control device 4 makes the terminal optical element 13 and the liquid immersion member 3 face the substrate P, and exposes the terminal optical element 13 and the substrate P to each other. The immersion space LS is formed so that the optical path of the light EL is filled with the liquid LQ. The liquid immersion member 3 can hold the liquid LQ with the substrate P so that the optical path of the exposure light EL between the terminal optical element 13 and the substrate P is filled with the liquid LQ. In the present embodiment, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 30 of the liquid immersion member 3 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method. In order to expose the substrate P, the control device 4 emits the exposure light EL from the illumination system IL, and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is irradiated onto the substrate P through the projection optical system PL and the liquid LQ. Thus, the substrate P is exposed with the exposure light EL from the exit surface 13 through the liquid LQ in the immersion space LS, and the pattern image of the mask M is projected onto the substrate P.

  FIG. 2 shows a state in which the substrate P and the scale member T are arranged at the irradiation position EP (position facing the exit surface 12 of the last optical element 13). In FIG. 2, the immersion space LS is formed between the terminal optical element 13 and the immersion member 3, the substrate P, and the scale member T.

  As shown in FIG. 2, the liquid immersion member 3 includes at least a part of the plate portion 31 disposed between the terminal optical element 13 and the substrate P (object) and at least a part of the liquid immersion member 3 around the terminal optical element 13. And a main body 32 to be arranged. The plate portion 31 has a hole (opening) 3K at a position facing the emission surface 12. The exposure light EL emitted from the emission surface 12 can pass through the opening 3K and irradiate the substrate P.

  Further, the liquid immersion member 3 includes a supply port 33 that can supply the liquid LQ and a recovery port 34 that can recover the liquid LQ. The supply port 33 supplies the liquid LQ when the substrate P is exposed, for example. The recovery port 34 recovers the liquid LQ, for example, when the substrate P is exposed.

  The supply port 33 is disposed in the vicinity of the optical path of the exposure light EL emitted from the emission surface 12 so as to face the optical path. The supply port 33 supplies the liquid LQ to the emission surface 12 side. In the present embodiment, the supply port 33 supplies the liquid LQ to the space between the upper surface of the plate portion 31 and the emission surface 12. The liquid LQ supplied from the supply port 33 flows through the space between the upper surface of the plate portion 31 and the emission surface 12, and then is supplied onto the substrate P (object) through the opening 3K.

  The supply port 33 is connected to the liquid supply device via the flow path 33R. The liquid supply device can deliver clean and temperature-adjusted liquid LQ. The flow path 33R includes a supply flow path formed inside the liquid immersion member 3 and a flow path formed by a supply pipe that connects the supply flow path and the liquid supply device. The liquid LQ delivered from the liquid supply device is supplied to the supply port 33 via the flow path 33R. At least in the exposure of the substrate P, the supply port 33 supplies the liquid LQ.

  The recovery port 34 can recover at least a part of the liquid LQ on the object facing the lower surface 30 of the liquid immersion member 3. The collection port 34 is disposed at least at a part around the lower end of the hole 3K through which the exposure light EL passes. In the present embodiment, the recovery port 34 is disposed at least at a part around the lower surface of the plate portion 31. The recovery port 34 is disposed at a predetermined position of the liquid immersion member 3 that faces the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 34. In the exposure of the substrate P, the recovery port 34 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 32 has an opening 3P that faces the substrate P (object). The opening 3P is disposed in at least a part of the periphery of the lower surface of the plate portion 31. In the present embodiment, the liquid immersion member 3 has a porous member 36 disposed in the opening 3P. In the present embodiment, the porous member 36 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 3P.

  In the present embodiment, the porous member 36 has a lower surface to which the substrate P (object) can face, an upper surface facing the opposite direction of the lower surface, and a plurality of holes connecting the upper surface and the lower surface. The lower surface of the porous member 36 is disposed on at least a part of the periphery of the lower surface of the plate portion 31. In the present embodiment, at least a part of the lower surface 30 of the liquid immersion member 3 includes the lower surface of the plate portion 31 and the lower surface of the porous member 36.

  In the present embodiment, the recovery port 34 includes a hole of the porous member 36. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 34) of the porous member 36. Note that the porous member 36 may not be disposed.

  The recovery port 34 is connected to the liquid recovery device via the flow path 34R. The liquid recovery apparatus can connect the recovery port 34 to the vacuum system, and can suck the liquid LQ through the recovery port 34. The flow path 34R includes a recovery flow path formed inside the liquid immersion member 3, and a flow path formed by a recovery pipe that connects the recovery flow path and the liquid recovery device. The liquid LQ recovered from the recovery port 34 is recovered by the liquid recovery device via the flow path 34R.

  In the present embodiment, the control device 4 executes the recovery operation of the liquid LQ from the recovery port 34 in parallel with the supply operation of the liquid LQ from the supply port 33, so that the terminal optical element 13 on one side and the liquid An immersion space LS can be formed with the liquid LQ between the immersion member 3 and the object on the other side.

  In addition, as the liquid immersion member 3, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  Next, the shutter member 10 will be described with reference to FIGS. 2 and 3. FIG. 3 is a schematic view of the liquid immersion member 3 and the shutter member 10 as viewed from above (+ Z side).

  The shutter member 10 is movable to a position facing the emission surface 12. The shutter member 10 is movable to a position facing the lower surface 30. The shutter member 10 can hold the liquid LQ between the last optical element 13 and at least a part of the liquid immersion member 3. The shutter member 10 can form an immersion space LS between the terminal optical element 13 and at least a part of the liquid immersion member 3 in a state where the shutter member 10 is disposed at a position facing at least a part of the emission surface 12 and the lower surface 30. It is.

  The drive system 50 includes a drive device 53 that can move the shutter member 10. The driving device 53 can move the shutter member 10 to a position facing the emission surface 12 and the lower surface 30. In addition, the driving device 53 can move the shutter member 10 to a position that does not face the emission surface 12 and the lower surface 30.

  In the present embodiment, the shutter member 10 includes a first shutter member 101 and a second shutter member 102 that are relatively movable. The driving device 53 includes a first driving device 531 that moves the first shutter member 101 and a second driving device 532 that moves the second shutter member 102.

  The first drive device 531 includes a connection member 54A connected to at least a part of the first shutter member 101, and an actuator 55A that moves the first shutter member 101 via the support member 54A. The actuator 55A includes, for example, at least one of a linear motor and a voice coil motor, and is capable of moving the first shutter member 101 in six directions including the X axis, Y axis, Z axis, θX, θY, and θZ directions. In the present embodiment, the first drive device 531 is supported by the support member BD. The position of the support member BD is substantially fixed. The support member BD may be coupled to a support mechanism that supports the projection optical system PL, for example. Further, the support member BD may be coupled to a support mechanism that supports at least a part of the encoder system 6.

  The second driving device 532 includes a connection member 54B connected to at least a part of the second shutter member 102, and an actuator 55B that moves the second shutter member 102 via the support member 54B. The actuator 55B includes, for example, at least one of a linear motor and a voice coil motor, and can move the second shutter member 102 in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. In the present embodiment, the second drive device 532 is supported by the support member BD.

  As shown in FIGS. 2 and 3, in the present embodiment, the first and second shutter members 101 and 102 are plate-shaped. The first shutter member 101 has an upper surface 101A that can face the emission surface 12 and a lower surface 101B that faces in the opposite direction of the upper surface 101A. The second shutter member 102 has an upper surface 102A that can be opposed to the emission surface 12, and a lower surface 102B that faces in a direction opposite to the upper surface 102A. In the present embodiment, the first and second shutter members 101 and 102 move so as not to overlap. The first shutter member 101 and at least a part of the second shutter member 102 may overlap.

  In the present embodiment, the outer shapes of the first and second shutter members 101 and 102 in the XY plane are long in the X-axis direction. In the present embodiment, the dimensions of the first and second shutter members 101 and 102 are larger than the dimension of the liquid immersion member 3 in the X-axis direction. On the other hand, the dimensions of the first and second shutter members 101 and 102 in the Y-axis direction are smaller than the dimension of the liquid immersion member 3.

  The support member 54 </ b> A is connected to the −X side end region of the upper surface 101 </ b> A of the first shutter member 101. The support member 54B is connected to the + X side end region of the upper surface 102A of the second shutter member 102. The support members 54A and 54B are connected to the first and second shutter members 101 and 102 outside the liquid immersion member 3.

  2 and 3, as an example, the first and second shutter members 101 and 102 have a space (outside) outside the space SP between the emission surface 12 and the lower surface 30 and the upper surface of the substrate P (scale member T). Space) Indicates the state of being arranged in the GP. 2 and 3, the first shutter member 101 is disposed in the + Y side outer space GP with respect to the space SP (liquid immersion member 3), and the second shutter member 102 is disposed in the space SP (liquid immersion member). 3) shows a state of being arranged in the outer space GP on the -Y side. FIG. 2 shows an example in which the first and second shutter members 101 and 102 are arranged below the lower surface 30 (on the −Z side), but the driving device 53 includes the first and second shutter members 101. , 102 can be arranged above the lower surface 30 (+ Z side).

  In the present embodiment, the first driving device 531 can move the first shutter member 101 between the outer space GP on the + Y side and the space SP. The second driving device 532 can move the second shutter member 102 between the outer space GP on the −Y side and the space SP.

  In the present embodiment, the driving device 53 approaches or contacts the −Y side edge E1 of the first shutter member 101 and the + Y side edge E2 of the second shutter member 102 facing the edge E1 in the space SP. Can be made. In the present embodiment, each of the edges E1 and E2 has an acute angle.

  4 is a diagram illustrating a state in which the shutter member 10 is not disposed in the space SP, and FIGS. 5 and 6 are diagrams illustrating a state in which at least a part of the shutter member 10 is disposed in the space SP.

  For example, when the substrate P is irradiated with the exposure light EL via the liquid LQ in the immersion space LS, as shown in FIG. 4, the control device 4 causes the substrate P (substrate stage 2P) to have the emission surface 12 and the lower surface 30. The drive system 50 (drive device 51) is controlled so as to face each other. Thereby, the liquid LQ is held between the last optical element 13 and the liquid immersion member 3 and the substrate P (substrate stage 2P), and the liquid immersion space LS is formed. Of course, the liquid LQ may be held between the last optical element 13 and the liquid immersion member 3 and the measurement stage 2C, and the liquid immersion space LS may be formed. Further, for example, when irradiating the exposure light EL to the substrate P via the liquid LQ in the immersion space LS, the control device 4 prevents the shutter member 10 from coming into contact with the liquid LQ in the immersion space LS. Adjust the position of 10. For example, the control device 4 controls the drive system 50 (drive device 53) and arranges the shutter member 10 in the outer space.

  As shown in FIG. 5, the control device 4 can control the drive system 50 (drive device 53) to place the shutter member 10 at a position facing the emission surface 12 and the lower surface 30. The control apparatus 4 can arrange | position the 1st, 2nd shutter members 101 and 102 in the position facing the injection | emission surface 12 and the lower surface 30 so that the edge E1 and the edge E2 may approach or contact in space SP. As a result, the liquid LQ is held between the optical element 13 and the liquid immersion member 3 and the shutter member 10, and the liquid immersion space LS is formed. In the example shown in FIG. 5, a state is shown in which an object such as the substrate stage 2P is disposed at a position facing the lower surfaces 101B and 102B of the first and second shutter members 101 and 102. Note that the object disposed at a position facing the lower surfaces 101B and 102B may be the substrate P or the measurement stage 2C. The shutter member 10 moves in the space SP so as not to contact the terminal optical element 13, the liquid immersion member 3, and the object. In the example shown in FIG. 5, the size of the gap G3 between the upper surface of the object and the lower surfaces 101B and 102B is smaller than the size of the gap G2 between the lower surface 30 and the upper surfaces 101A and 102A. The dimension of the gap G3 between the upper surface of the object and the lower surfaces 101B and 102B is smaller than the dimension of the gap G1 between the emission surface 12 and the upper surfaces 101A and 102A.

  Further, as shown in FIG. 5, the exit surface 12 and the lower surface 30 and the shutter member 10 face each other, and the shutter member 10 and the object (at least one of the substrate stage 2P, the substrate P, and the measurement stage 2C) face each other. In the state, when the immersion space LS is formed in at least a part of the first space AP1 between the emission surface 12 and the lower surface 30 and the shutter member 10, the second space AP2 between the shutter member 10 and the object is formed. Does not have liquid LQ.

  In the present embodiment, at least a part of the surface of the shutter member 10 is liquid repellent with respect to the liquid LQ. Note that the surface of the shutter member 10 includes at least part of the upper surfaces 101A and 101B and the lower surfaces 102A and 102B. In the present embodiment, the contact angle of the surface of the shutter member 10 with respect to the liquid LQ is larger than 90 degrees, for example. The contact angle of the surface of the shutter member 10 with respect to the liquid LQ may be, for example, 100 degrees or more, or 110 degrees or more.

  In the present embodiment, the upper surfaces 101A and 101B and the lower surfaces 101B and 102B include the surface of a film containing a liquid repellent material containing fluorine. The liquid repellent material may be, for example, PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), or Teflon (registered trademark). The shutter member 10 may be formed of a liquid repellent material containing fluorine.

  In the present embodiment, the control device 4 inserts the first and second shutter members 101 and 102 disposed in the outer space GP into the space SP, for example, to change the state shown in FIG. 4 to the state shown in FIG. Can be changed. The control device 4 moves the shutter member 10 from the outer space GP to the space SP so as not to contact the terminal optical element 13, the liquid immersion member 3, and the object. The control device 4 moves the shutter member 10 from the outer space GP to the space SP while executing the recovery operation of the liquid LQ from the recovery port 34 in parallel with the supply operation of the liquid LQ from the supply port 33. Further, in the state shown in FIG. 5, the control device 4 executes the recovery operation of the liquid LQ from the recovery port 34 in parallel with the supply operation of the liquid LQ from the supply port 33, and the final optical element 12 and An immersion space LS can be formed with the liquid LQ between the immersion member 3 and the shutter member 10.

  In the present embodiment, since at least a part of the surface of the shutter member 10 is liquid repellent with respect to the liquid LQ, it can be changed from the state shown in FIG. 4 to the state shown in FIG. That is, from the state in which the immersion space LS is formed between the terminal optical element 12 and the liquid immersion member 3 and the object (at least one of the substrate stage 2P, the substrate P, and the measurement stage 2C), the terminal optical element 12 is formed. In addition, the liquid immersion space LS is formed between the liquid immersion member 3 and the shutter member 10, and the liquid LQ can be changed to a state where there is no liquid LQ between the shutter member 10 and the object. Further, in the present embodiment, since the edges E1 and E2 are acute angles, the shutter member 10 is moved from the outer space GP to the space SP in a state where the immersion space LS is formed. It can be changed to the state shown. In the present embodiment, since the shutter member 10 is disposed in the space SP so that the size of the gap G3 is smaller than the size of the gaps G1 and G2, the state can be changed from the state shown in FIG. 4 to FIG. .

  Note that at least one of the edges E1 and E2 may not be an acute angle, for example, an obtuse angle. Note that at least a part of the surface of the shutter member 10 may be lyophilic with respect to the liquid LQ. For example, the contact angle of the surface of the shutter member 10 with respect to the liquid LQ may be smaller than 90 degrees. The dimension of the gap G3 may be the same as or larger than the dimensions of the gaps G1 and G2.

  FIG. 6 shows an example of a state in which a gap CG is formed between the edge E1 of the first shutter member 101 and the edge E2 of the second shutter member 102 arranged in the space SP. In the present embodiment, the control device 4 controls the drive system 50 (drive device 53) so that the emission surface 12 and the lower surface 30 and the shutter member 10 face each other, and the shutter member 10 and the object (substrate stage 2P, substrate P). , And at least one of the measurement stages 2C), the first space AP1 between the exit surface 12 and the lower surface 30 and the shutter member 10, and the second space AP2 between the shutter member 10 and the object. A gap CG is formed between the first shutter member 101 and the second shutter member 102.

  Accordingly, the liquid LQ in the first space AP1 is supplied onto the object via the gap CG, and the optical path of the exposure light EL on the exit surface 12 side is filled with the liquid LQ. That is, the optical path of the exposure light EL between the exit surface 12 and the object is filled with the liquid LQ.

  In the state shown in FIG. 6, the control device 4 executes the recovery operation of the liquid LQ from the recovery port 34 in parallel with the supply operation of the liquid LQ from the supply port 33, and An immersion space LS can be formed with the liquid LQ between the last optical element 12 and the liquid immersion member 3 and the shutter member 10 while filling the optical path of the exposure light EL with the liquid LQ.

  The control device 4 controls the drive system 50 (drive device 53) to change the state shown in FIG. 5 (the state where the edge E1 and the edge E2 are in contact) to the state shown in FIG. 6 (the edge E1 and the edge). In a state in which a gap CG is formed with E2. Further, the control device 4 controls the drive system 50 (drive device 53) to change from the state shown in FIG. 4 (the state where the first and second shutter members 101 and 102 are disposed in the outer space GP) to FIG. (A state in which a gap CG is formed between the edge E1 and the edge E2).

  In the present embodiment, the control device 4 can contact the edge E1 and the edge E2 when the exposure light EL is not emitted from the emission surface 12. That is, for example, when the exposure light EL is not emitted from the emission surface 12, the gap CG may not be formed.

  In the present embodiment, the control device 4 determines whether or not to form the gap CG between the edge E1 and the edge E2 based on the movement conditions of the substrate stage 2P and the measurement stage 2C. For example, the control device 4 sets the second space AP2 below the shutter member 10 facing the emission surface 12 and the lower surface 30 (the second space AP2 facing the lower surfaces 101B and 102B) to one of the substrate stage 2 and the measurement stage 2C or When both move, whether or not to form the gap CG may be determined based on the moving condition.

  For example, when the substrate stage 2P and the measurement stage 2C move at a predetermined speed or higher, the control device 4 does not form the gap CG as shown in FIG. Further, when the substrate stage 2P and the measurement stage 2C move at a speed lower than a predetermined speed, the control device 4 may form a gap CG, for example, as shown in FIG. 4 or FIG.

  Further, when the substrate stage 2P and the measurement stage 2C move at a predetermined acceleration or higher, the control device 4 does not form the gap CG as shown in FIG. Further, when the substrate stage 2P and the measurement stage 2C move below a predetermined acceleration, the control device 4 may form a gap CG, for example, as shown in FIG. 4 or FIG.

  Further, when the substrate stage 2P and the measurement stage 2C move a predetermined distance or more with respect to a predetermined direction in the XY plane, the control device 4 does not form the gap CG as shown in FIG. Further, when the substrate stage 2P and the measurement stage 2C move less than a predetermined distance, the control device 4 may form a gap CG, for example, as shown in FIG. 4 or FIG.

  In other words, the control device 4 allows the objects such as the substrate stage 2P (substrate P) and the measurement stage 2C to maintain the liquid immersion space LS of the liquid LQ between the terminal optical element 13 and the liquid immersion member 3 and the object. There is a possibility of moving under moving conditions that do not satisfy the allowable conditions. That is, for example, when the immersion space LS is formed between the terminal optical element 13 and the liquid immersion member 3 and the object (at least one of the substrate stage 2P, the substrate P, and the measurement stage 2C), the object When moving at a predetermined speed or more, moving at a predetermined acceleration or more, or moving a predetermined distance or more in a predetermined direction in the XY plane, the shape of the immersion space LS (the shape of the interface LG) is not maintained, For example, the liquid LQ may flow out of the space SP between the terminal optical element 13 and the liquid immersion member 3 and the object.

  Therefore, when the object moves under a moving condition that does not satisfy the permissible condition for maintaining the immersion space LS, the edge so that the immersion space LS is not formed between the last optical element 13 and the immersion member 3 and the object. By preventing E1 and the edge E2 from approaching or contacting each other so as not to form the gap CG, outflow of the liquid LQ can be suppressed. Further, the immersion space LS can continue to be formed between the last optical element 13 and the immersion member 3 and the shutter member 10. Therefore, for example, the liquid LQ can be held between the terminal optical element 13 and the liquid immersion member 3 and the object without stopping the supply of the liquid LQ from the supply port 33.

  Further, the control device 4 may adjust the dimension of the gap CG between the edge E1 and the edge E2 based on the movement conditions of the substrate stage 2P and the measurement stage 2C. For example, when one or both of the substrate stage 2 and the measurement stage 2C move in the space below the shutter member 10 facing the exit surface 12 and the lower surface 30 (the space where the lower surfaces 101B and 102B face), the control device 4 moves. The dimension of the gap CG may be adjusted based on the movement condition.

  For example, when the substrate stage 2P and the measurement stage 2C move at the first speed, the control device 4 adjusts the gap CG to the first dimension, and the substrate stage 2P and the measurement stage 2C have a second speed higher than the first speed. When moving at, the gap CG may be adjusted to a second dimension smaller than the first dimension.

  Further, when the substrate stage 2P and the measurement stage 2C move at the first acceleration, the control device 4 adjusts the gap CG to the first dimension, and the substrate stage 2P and the measurement stage 2C have the second acceleration higher than the first acceleration. When moving at, the gap CG may be adjusted to a second dimension smaller than the first dimension.

  Further, when the substrate stage 2P and the measurement stage 2C move the first distance with respect to a predetermined direction in the XY plane, the control device 4 adjusts the gap CG to the first dimension, and the substrate stage 2P and the measurement stage 2C are the first. When moving a second distance longer than the distance, the gap CG may be adjusted to a second dimension smaller than the first dimension.

  The object such as the substrate stage 2P (substrate P) and the measurement stage 2C does not satisfy a predetermined permissible condition capable of maintaining the immersion space LS of the liquid LQ between the terminal optical element 13 and the immersion member 3 and the object. When moving under conditions, the outflow of the liquid LQ from the space SP is also suppressed by reducing the size of the gap CG.

  By reducing the size of the gap CG, the size (mass) of the immersion space LS formed so as to fill the optical path K between the exit surface 12 and the object via the gap CG can be reduced. . In other words, the contact area between the liquid LQ and the upper surface of the object can be reduced. Therefore, in a state where the immersion space LS having a large gap CG and a large mass is formed, the object moves under a movement condition that does not satisfy the predetermined permissible condition for maintaining the immersion space LS of the liquid LQ in the space SP. Even in this case, the outflow of the liquid LQ from the space SP can be suppressed by reducing the size of the immersion space LS.

  In the following description, the state shown in FIG. 4, that is, the state in which the shutter member 10 is retracted from the space SP is appropriately referred to as an open state. In the following description, the state shown in FIG. 5, that is, the state in which the gap CG is formed between the first shutter member 101 and the second shutter member 102 disposed in the space SP, is appropriately formed as a gap forming state. . In the following description, the state shown in FIG. 5, that is, the state in which no gap CG is formed between the first shutter member 101 and the second shutter member 102 disposed in the space SP (the gap CG is closed). State) is appropriately referred to as a closed state.

  Next, the substrate stage 2P and the measurement stage 2C will be described. FIG. 7 is a plan view showing an example of the substrate stage 2P and the measurement stage 2C.

  The substrate stage 2P has a scale member T. In the present embodiment, the scale member T includes Y scales 26 and 27 for measuring the position of the substrate stage 2P in the Y-axis direction, and X scales 28 and 29 for measuring the position of the substrate stage 2P in the X-axis direction. Including. The Y scale 26 is disposed on the −X side with respect to the opening TH (the center of the first holding unit 15). The Y scale 27 is disposed on the + X side with respect to the opening TH. The X scale 28 is disposed on the −Y side with respect to the opening TH. The X scale 29 is disposed on the + Y side with respect to the opening TH.

  Each of the Y scales 26 and 27 includes a plurality of lattices (lattice lines) that are long in the X-axis direction and arranged at a predetermined pitch in the Y-axis direction. That is, the Y scales 26 and 27 include a one-dimensional lattice having the Y-axis direction as a periodic direction. Each of the X scales 28 and 29 includes a plurality of lattices (lattice lines) that are long in the Y-axis direction and arranged at a predetermined pitch in the X-axis direction. That is, the X scales 28 and 29 include a one-dimensional lattice having the X-axis direction as a periodic direction.

  In the present embodiment, the grating is a diffraction grating. That is, in the present embodiment, the Y scales 26 and 27 have diffraction gratings whose periodic direction is the Y-axis direction. The X scales 28 and 29 have diffraction gratings whose periodic direction is the X-axis direction. In the present embodiment, the Y scales 26 and 27 are reflection scales on which reflection gratings (reflection diffraction gratings) having the Y-axis direction as a periodic direction are formed. The X scales 28 and 29 are reflection type scales on which a reflection type grating (reflection diffraction grating) having a periodic direction in the X-axis direction is formed.

  In the present embodiment, the substrate stage 2P has a measurement member C2. The measurement member C2 constitutes a part of an aerial image measurement system capable of measuring the aerial image (imaging characteristics) of the projection optical system PL as disclosed in, for example, US Patent Application Publication No. 2002/0041377. To do.

  In the present embodiment, the transport system 11 includes a first transport member 11A that loads (loads) the substrate P onto the substrate stage 2P, and a second transport member 11B that unloads the substrate P from the substrate stage 2P. . 11 A of 1st conveyance members carry in the board | substrate P before exposure to the 1st holding | maintenance part 15 of the substrate stage 2P, for example. For example, the second transport member 11B unloads the exposed substrate P from the first holding unit 15 of the substrate stage 2P.

  In the present embodiment, the substrate stage 2P is movable between a position EP at least partially facing the emission surface 12, a position CP1 not facing the emission surface 12, and a position CP2 not facing the emission surface 12. .

  In the present embodiment, the exposure light EL emitted from the emission surface 12 can be irradiated to the object arranged at the position EP. In the present embodiment, processing for carrying the substrate P before exposure into the first holding unit 15 is performed at the position CP1. At the position CP2, a process of carrying out the exposed substrate P from the first holding unit 15 is executed.

  In the following description, the position EP is appropriately referred to as an irradiation position EP. In the following description, the position CP1 is appropriately referred to as a first substrate replacement position CP1, and the position CP2 is appropriately referred to as a second substrate replacement position CP2.

  In the present embodiment, the first and second substrate replacement positions CP1 and CP2 are positions on the + Y side with respect to the irradiation position EP. In the present embodiment, the first substrate replacement position CP1 is a position on the −X side with respect to the second substrate replacement position CP2.

  When the substrate P is carried into the first holding unit 15, the control device 4 moves the substrate stage 2P to the first substrate replacement position CP1. The control device 4 carries the substrate P into the first holding unit 15 of the substrate stage 2P disposed at the first substrate replacement position CP1 using the first transport member 11A.

  When the substrate P is unloaded from the first holding unit 15, the control device 4 moves the substrate stage 2P to the second substrate replacement position CP2. The control device 4 unloads the substrate P from the first holding unit 15 of the substrate stage 2P disposed at the second substrate replacement position CP2 using the second transport member 11B.

  FIG. 8 is a plan view showing an example of the encoder system 6, the first detection system 7, and the second detection system 8.

  The first detection system 7 includes a so-called oblique incidence type multi-point focus leveling detection system as disclosed in, for example, US Pat. No. 5,448,332. The first detection system 7 includes an irradiation device 7A that emits detection light and a light receiving device 7B that can receive the detection light. The first detection system 7 irradiates the detection area AF with detection light emitted from the irradiation device 7A, and detects the position of the surface (test surface) of the object arranged in the detection area AF. The detection light from the irradiation device 7A irradiated on the surface of the object is reflected on the surface of the object. At least a part of the detection light reflected by the surface of the object is received by the light receiving device 7B. The first detection system 7 detects the position of the surface of the object with respect to the Z axis, θX, and θY directions, for example, based on the light reception result of the light receiving device 7B.

  In the present embodiment, the detection area AF of the first detection system 7 is disposed between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP. The first detection system 7 detects the position of the surface of the object between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP. In other words, the first detection system 7 detects the position of the surface of the object arranged between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP.

  In the present embodiment, the first detection system 7 can detect, for example, the position of the surface of the substrate P held by the first holding unit 15 and the position of the upper surface 17 of the scale member T. The first detection system 7 may detect the position of the surface (upper surface) of the measurement stage 2C.

  The second detection system 8 irradiates the target mark with broadband detection light that does not expose the photosensitive film of the substrate P as disclosed in, for example, US Pat. No. 5,493,403, and uses the detection light reflected by the target mark. FIA (Field Image Alignment) which measures the position of the target mark by imaging the image of the target mark and the index image formed on the light receiving surface using an image pickup device such as a CCD and processing the image pickup signals. ) Type alignment device. In the present embodiment, the second detection system 8 includes a plurality of alignment devices 8A to 8E. In the present embodiment, the plurality of alignment devices 8A to 8E are arranged in the X-axis direction.

  The alignment apparatus 8A irradiates the detection light ALA with the detection light, and detects the position of the target mark arranged in the detection area ALA. The detection light applied to the target mark is reflected by the target mark. An image of the target mark based on the detection light reflected by the target mark is captured by the image sensor. The alignment device 8A detects the position of the target mark, for example, with respect to the Z axis, θX, and θY directions, for example, based on the imaging result of the imaging device. Similarly, each of alignment devices 8B to 8E irradiates detection light to detection areas ALB to ALE, and detects the positions of target marks arranged in detection areas ALB to ALB.

  In the present embodiment, the detection areas ALA to ALE of the second detection system 8 are arranged in the X-axis direction. Further, the detection areas ALA to ALE are arranged between the first and second substrate replacement positions CP1 and CP2 and the irradiation position EP. The second detection system 8 detects the position of the target mark between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP. In other words, the second detection system 8 detects the position of the target mark arranged between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP.

  In the present embodiment, the second detection system 8 is disposed on the + Y side with respect to the first detection system 7. In the present embodiment, the detection areas ALA to ALE are arranged on the + Y side with respect to the detection area AF. In other words, the detection areas ALA to ALE are arranged between the first and second substrate replacement positions CP1 and CP2 and the detection area AF.

  In the present embodiment, the second detection system 8 can detect the position of the alignment mark of the substrate P held by the first holding unit 15, for example. Note that the second detection system 8 may detect the position of a mark placed on the measurement stage 2C, for example.

  The encoder system 6 includes, for example, an irradiation device that emits measurement light and a light receiving device that receives measurement light, as disclosed in US Patent Application Publication No. 2007/0288121, and the scale member T has a grating. An encoder head 60 that irradiates measurement light from the irradiation device (scale, lattice line), receives the measurement light via the lattice with a light receiving device, and measures the position of the lattice.

  In the present embodiment, the encoder system 6 has a plurality of encoder heads 60. The encoder system 6 includes a plurality of encoder heads 60 arranged in the X-axis direction, and is arranged in the Y-axis direction with a linear encoder 6A arranged on the −X side of the last optical element 13 (liquid immersion member 3). A plurality of encoder heads 60, including a linear encoder 6B arranged on the −Y side of the last optical element 13 (immersion member 3), and a plurality of encoder heads 60 arranged in the X-axis direction, and the last optical element 13 It includes a linear encoder 6C disposed on the + X side of (immersion member 3) and a plurality of encoder heads 60 disposed in the Y-axis direction, and is disposed on the + Y side of terminal optical element 13 (immersion member 3). And a linear encoder 6D.

  In the present embodiment, the linear encoders 6A and 6C use the Y scales 26 and 27 to measure the position of the substrate stage 2P in the Y-axis direction. The linear encoders 6B and 6D use the X scales 28 and 29 to measure the position of the substrate stage 2P in the X-axis direction.

  The linear encoders 6A to 6D (encoder head 60) are arranged at positions where the upper surface 17 of the scale member T can be opposed. The scale member T is movable to a position facing the encoder head 60 of the linear encoders 6A to 6D. The encoder head 60 irradiates the measurement region with the measurement light emitted from the irradiation device, and detects the lattice of the scale member T arranged in the measurement region. At least a part of the measurement light from the irradiation device irradiated on the scale member T is reflected by the scale member T. At least a part of the measurement light reflected by the scale member T is received by the light receiving device. The encoder system 6 determines the position of the scale member T (substrate stage 2P) with respect to, for example, the X axis, the Y axis, and the θZ direction based on the light reception results of the light receiving devices of the plurality of encoder heads 60 included in each of the linear encoders 6A to 6D. Measure.

  In the present embodiment, at least a part of the linear encoder 6D is disposed between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP. The linear encoder 6D measures the position of the substrate stage 2P between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP. In other words, the linear encoder 6D measures the position of the scale member (substrate stage 2P) disposed between the first and second substrate replacement positions CP1, CP2 and the irradiation position EP.

  In the present embodiment, the linear encoders 6A to 6C are arranged on the −Y side with respect to the detection area AF. That is, in the present embodiment, the linear encoders 6A to 6C are further away from the first and second substrate replacement positions CP1 and CP2 than the detection area AF and the detection areas ALA to ALE.

  In the present embodiment, the interferometer system 9 measures the positions of the mask stage 1, the substrate stage 2P, and the measurement stage 2C. Based on the detection result of the encoder system 6, the detection result of the first detection system 7, the detection result of the second detection system 8, and the measurement result of the interferometer system 9, the control device 4 performs the mask stage 1, the substrate stage 2 </ b> P, And the position of the measurement stage 2C is adjusted.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described with reference to FIGS. 9A to 16A are plan views schematically showing the positions of the substrate stage 2P and the measurement stage 2C, and FIGS. 9B to 16A illustrate the operation of the shutter member 10. FIG. It is a schematic diagram for doing.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction.

  In the present embodiment, a plurality of shot areas, which are exposure target areas, are arranged in a matrix on the substrate P. For example, in order to expose the first shot region (first shot region) of the substrate P, the control device 4 moves the substrate P (first shot region) in the Y-axis direction with respect to the projection region PR of the projection optical system PL. At the same time, in synchronization with the movement of the substrate P in the Y-axis direction, the mask M is moved in the Y-axis direction with respect to the illumination region IR of the illumination system IL, while the immersion on the projection optical system PL and the substrate P The first shot area is irradiated with the exposure light EL through the liquid LQ in the space LS. Thereby, an image of the pattern of the mask M is projected onto the first shot area of the substrate P, and the first shot area is exposed with the exposure light EL emitted from the emission surface 12.

  After the exposure of the first shot area is completed, the control device 4 sets the substrate P in the XY plane in a state where the immersion space LS is formed in order to start the exposure of the next second shot area. The second shot area is moved to the exposure start position by moving in the direction (for example, the X axis direction or a direction inclined with respect to the X axis direction in the XY plane). Thereafter, the control device 4 starts exposure of the second shot area.

  The control device 4 exposes the shot area while moving the shot area in the Y-axis direction with respect to the projection area PR, and moves the next shot area to the exposure start position after the exposure of the shot area is completed. The plurality of shot regions of the substrate P are sequentially exposed while repeating the operation for performing the operation.

  Thus, in the present embodiment, the control device 4 sequentially exposes a plurality of shot regions of the substrate P via the liquid LQ in the immersion space LS while moving the substrate stage 2P in the XY plane. In the exposure of the substrate P, the control device 4 retracts the shutter member 10 from the space SP so that the shutter member 10 does not come into contact with the liquid LQ in the immersion space LS.

  FIG. 9 shows a state at the time when the exposure of the last shot area among the plurality of shot areas of the substrate P is completed. In the state shown in FIG. 9, at least a part of the substrate stage 2P is arranged at the irradiation position EP. Further, in this state, the control device 4 opens the shutter member 10.

  After the exposure of the last shot area is completed, the control device 4 moves the substrate stage 2P from the irradiation position EP to the second substrate replacement position CP2. That is, the control device 4 starts the operation of moving the substrate stage 2P in the XY plane and placing it at the second substrate replacement position CP2 in order to carry out the exposed substrate P from the first holding unit 15.

  As shown in FIG. 10, in this embodiment, when the substrate stage 2P moves away from the irradiation position EP, the measurement stage 2C is disposed at the irradiation position EP, and the terminal optical element 13, the liquid immersion member 3, and the measurement stage 2C are arranged. An immersion space LS is formed therebetween. When the substrate stage 2P moves away from the irradiation position EP, as disclosed in, for example, US Patent Application Publication No. 2006/0023186, US Patent Application Publication No. 2007/0127006, etc., the control device 4 can In a state where the upper surface of the stage 2P and the upper surface of the measurement stage 2C are close to or in contact with each other, the final optical element 13 and the liquid immersion member 3 are opposed to at least one of the substrate stage 2P and the measurement stage 2C. The substrate stage 2P and the measurement stage 2C are moved in the XY plane with respect to the liquid immersion member 3. As a result, the liquid immersion space LS is formed between the terminal optical element 13 and the liquid immersion member 3 and the substrate stage 2P while the leakage of the liquid LQ is suppressed. It changes to the state formed between the measurement stages 2C. Further, the control device 4 starts from the state where the immersion space LS is formed between the terminal optical element 13 and the liquid immersion member 3 and the measurement stage 2C, and the terminal optical element 13, the liquid immersion member 3 and the substrate stage 2P. It is also possible to change to a state formed during

  In the following description, in a state where the upper surface of the substrate stage 2P and the upper surface of the measurement stage 2C are close to or in contact with each other, at least a part of the substrate stage 2P is disposed at the irradiation position EP, and at the irradiation position EP, the measurement stage. An operation of synchronously moving the substrate stage 2P and the measurement stage 2C in the XY plane with respect to the last optical element 13 and the liquid immersion member 3 so that at least a part of 2C is changed from one to the other. This is referred to as a scrum movement operation as appropriate.

  In the present embodiment, in the scram moving operation, for example, as shown in FIG. 10, the −Y side edge of the upper surface of the substrate stage 2P and the + Y side edge of the upper surface of the measurement stage 2C approach or come into contact with each other.

  In the present embodiment, in the scram moving operation for changing from the state in which at least a part of the substrate stage 2P is arranged at the irradiation position EP to the state in which at least a part of the measurement stage 2C is arranged, the control device 4 The member 10 is opened.

  The control device 4 unloads the exposed substrate P from the substrate stage 2P disposed at the second substrate replacement position CP2. Further, the control device 4 moves the substrate stage 2P to the first substrate replacement position CP1, and loads (loads) the substrate P before exposure onto the substrate stage 2P arranged at the first substrate replacement position CP1.

  While the substrate exchange process including the process of unloading the substrate P from the substrate stage 2P and the process of loading the substrate P into the substrate stage 2P is being performed, the measurement stage 2C is disposed at the irradiation position. The control device 4 may execute a measurement process using the measurement member C1 (measurement device) arranged on the measurement stage 2C in a state where the immersion space LS is formed on the measurement stage 2C. For example, the control device 4 emits the exposure light EL from the exit surface 12 in a state where the immersion space LS is formed with the liquid LQ between the terminal optical element 13 and the liquid immersion member 3 and the measurement stage 2C. Also good. Thereby, in the state where the measurement stage 2C is arranged at the irradiation position EP, the emission surface in a state where the optical path of the exposure light EL between the emission surface 12 and the measurement member C1 of the measurement stage 2C is filled with the liquid LQ. The exposure light EL from 12 is irradiated onto the measurement member C1 of the measurement stage 2C, and the measurement member C1 (measurement device) arranged on the measurement stage 2C can receive the exposure light EL via the liquid LQ. In the present embodiment, the control device 4 opens the cover member 10 and executes a measurement process using the measurement member C1 of the measurement stage 2C.

  After the measurement process is completed, as shown in FIG. 11, the control device 4 inserts at least a part of the first and second shutter members 101 and 102 into the space SP. That is, the control device 4 starts inserting the first and second shutter members 101 and 102 into the space SP in a state where the liquid LQ immersion space LS is formed on the measurement stage 2C.

  After the replacement process of the substrate P is completed, as shown in FIG. 12, the control device 4 has the −Y side of the upper surface of the measurement stage 2C arranged at the irradiation position EP on the −Y side of the upper surface 17 of the substrate stage 2P. Approach or contact the Y side. Moreover, the control apparatus 4 makes the shutter member 10 a closed state.

  In the present embodiment, in the scram moving operation for changing from a state in which at least a part of the measurement stage 2C is disposed at the irradiation position EP to a state in which at least a part of the substrate stage 2P is disposed, the control device 4 The member 10 is closed.

  As shown in FIGS. 12 and 13, the substrate stage 2 </ b> P and the measurement stage 2 </ b> C move below the shutter member 10 in the scram moving operation.

  In the state shown in FIGS. 12 and 13, for example, a detection process using the first detection system 7 and the second detection system 8 may be executed. For example, the alignment mark provided on the substrate P so as to correspond to the shot area may be detected by the second detection system 8. Moreover, the operation | movement which detects the positional relationship of irradiation position EP and the reference | standard of the 2nd detection system 8 may be performed.

  As shown in FIG. 14, in a state where the substrate stage 2P is disposed at the irradiation position EP, the control device 4 puts the shutter member 10 into a gap forming state. Thereby, at least a part of the liquid LQ in the first space AP1 is supplied onto the substrate stage 2P via the gap CG, and the optical path of the exposure light EL between the emission surface 12 and the substrate stage 2P is the liquid LQ. It is filled. In the present embodiment, in the gap formation state, the position of the substrate stage 2P is controlled so that the optical path of the exposure light EL between the emission surface 12 and the measurement member C2 of the substrate stage 2P is filled with the liquid LQ.

  That is, in the present embodiment, the control device 4 places the shutter member 10 in the closed state when moving the substrate stage 2P so as to change from the state in which the measurement member C2 is not disposed at the irradiation position EP to the state in which the measurement member C2 is disposed. . Further, the control device 4 places the shutter member 10 in a gap forming state when the measuring member C2 is disposed at the irradiation position EP.

  The control device 4 emits the exposure light EL from the emission surface 12 in the state shown in FIG. Thereby, in a state where at least a part of the substrate stage 2P is disposed at the irradiation position EP, the exposure light EL between the emission surface 12 and the measurement member C2 of the substrate stage 2P is filled with the liquid LQ. Exposure light EL from the surface 12 is irradiated to the measuring member C2. Thereby, the measurement member C2 can measure the exposure light EL through the liquid LQ.

  In the state shown in FIG. 14, since the contact area between the liquid LQ and the substrate stage 2P is small, for example, even when the substrate stage 2P moves at a high speed, moves at a high acceleration, or moves a long distance, The outflow of the liquid LQ is suppressed.

  After the irradiation of the exposure light EL on the measurement member C2 is finished, the control device 4 puts the shutter member 10 in a closed state.

  In order to start exposure of the substrate P, the control device 4 moves the substrate stage 2P so as to change from the state in which the measurement member C2 is disposed at the irradiation position EP to the state in which the substrate P is disposed. In the present embodiment, as shown in FIG. 15, when the substrate stage 2P is moved so as to change from the state in which the measurement member C2 is disposed at the irradiation position EP to the state in which the substrate P is disposed, the control device 4 Then, the shutter member 10 is closed. Note that the detection process using the first detection system 7 may be executed by disposing the upper surface of the substrate P with respect to the detection area AF of the first detection system 7 with the shutter member 10 in the closed state.

  FIG. 16 is a diagram illustrating an example of a state in which the first shot region (first shot region) of the substrate P is disposed at the irradiation position EP. When the first shot region of the substrate P is arranged at the irradiation position EP, the control device 4 changes the shutter member 10 from the closed state to the open state. Thereby, the optical path of the exposure light EL between the emission surface 12 and the substrate P is filled with the liquid LQ. The control device 4 starts exposure of the substrate P. The control device 4 sequentially exposes a plurality of shot areas on the substrate P.

  Thereafter, the above processing is repeated, and a plurality of substrates P are sequentially exposed.

  In the present embodiment, in the scram moving operation for changing from the state in which at least a part of the substrate stage 2P is disposed at the irradiation position EP to the state in which at least a part of the measurement stage 2C is disposed, the control device 4 The shutter member 10 is in the open state, but may be in the closed state. Further, after the measurement stage 2C is arranged at the irradiation position EP, the control device 4 may set the shutter member 10 to at least one of the gap forming state and the open state.

  In this embodiment, when the exposure light EL is irradiated to the measurement member C1 of the measurement stage 2C via the liquid LQ, the control device 4 opens the shutter member 10, but the gap formation state It may be. In that case, the dimension of the gap CG formed when the exposure light EL is irradiated onto the measurement member C1 of the measurement stage 2C is the same as that of the gap CG formed when the exposure light EL is irradiated onto the measurement member C2 of the substrate stage 2P. It may be larger or smaller than the dimension.

  In the present embodiment, when the exposure light EL is irradiated onto the substrate P, the control device 4 opens the shutter member 10, but it may be in a gap forming state. In that case, for example, the dimension of the gap CG formed when the exposure light EL is irradiated onto the substrate P is larger than the dimension of the gap CG formed when the measurement light C2 of the substrate stage 2P is irradiated with the exposure light EL. It may be small or small.

  As described above, according to this embodiment, at least one of the shutter member 10, the substrate stage 2P, and the measurement member 2C is ejected so that the liquid LQ immersion space LS is continuously formed on the ejection surface 12 side. Since it is arranged at a position facing the surface 12 and the lower surface 30, the immersion space LS can be maintained. Accordingly, the outflow of the liquid LQ can be suppressed, and the occurrence of defective exposure and the generation of defective devices can be suppressed.

  Further, in the present embodiment, when the substrate stage 2P and the measurement stage 2C move under a moving condition that does not satisfy the permissible conditions for maintaining the immersion space LS of the liquid LQ, the upper surface of the substrate stage 2P and the measurement stage 2C A gap CG formed by the shutter member 10 is formed so that the contact area between the upper surface and the liquid LQ in the immersion space LS is reduced (so that the upper surface of the substrate stage 2 and the upper surface of the measurement stage 2C do not contact the liquid LQ). Since the adjustment is performed, the outflow of the liquid LQ can be suppressed.

  As described above, the control device 4 includes a computer system including a CPU and the like. The control device 4 includes an interface capable of executing communication between the computer system and an external device. The storage device 5 includes a memory such as a RAM, and a recording medium such as a hard disk and a CD-ROM. The storage device 5 is installed with an operating system (OS) for controlling the computer system, and stores a program for controlling the exposure apparatus EX.

  Note that an input device capable of inputting an input signal may be connected to the control device 4. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. Further, a display device such as a liquid crystal display may be provided.

  Various kinds of information including programs recorded in the storage device 5 can be read by the control device (computer system) 4. The storage device 5 stores a program that causes the control device 4 to control the exposure apparatus EX that exposes the substrate P with the exposure light EL via the liquid LQ.

  According to the above-described embodiment, the program recorded in the storage device 5 supplies the control device 4 with liquid from the supply port to the emission surface side of the optical member from which the exposure light is emitted, and the liquid on the emission surface side. A first movable member movable within a predetermined plane including an irradiation position where exposure light from the emission surface can be irradiated, and a first movable member movable while holding the substrate within the predetermined plane. Disposing at least one of the two movable members and the third movable member movable between the optical member and at least one of the first movable member and the second movable member at a position facing the emission surface; Exposing the substrate through the liquid in the immersion space.

  By reading the program stored in the storage device 5 into the control device 4, various devices of the exposure apparatus EX such as the substrate stage 2P, the measurement stage 2C, the liquid immersion member 3, and the shutter member 10 cooperate with each other. Various processes such as immersion exposure of the substrate P are performed in the state where the immersion space LS is formed.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 13 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in International Publication No. 2004/019128. As described above, the projection optical system PL in which the optical path on the incident side (object plane side) of the last optical element 13 is also filled with the liquid LQ can be employed.

  In each of the above-described embodiments, water is used as the liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  In each of the embodiments described above, the exposure apparatus EX includes a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. A twin stage type exposure apparatus provided with In that case, the object capable of forming the immersion space LS with the last optical element 12 includes at least one of a plurality of substrate stages. The removal system 10 can remove foreign substances on the upper surface of at least one of the plurality of substrate stages.

  In each of the above-described embodiments, the exposure apparatus EX may be an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, for example, the position of each stage is measured using an encoder system that detects a scale (diffraction grating) provided on each stage. However, the encoder system may not be provided.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 17, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like. The foreign substance removal process (cleaning process) is executed in the substrate processing step 204, for example.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  2 ... substrate stage, 2C ... measurement stage, 3 ... liquid immersion member, 4 ... control device, 6 ... encoder system, 7 ... first detection system, 8 ... second detection system, 10 ... shutter member, 12 ... exit surface, DESCRIPTION OF SYMBOLS 13 ... End optical element, 50 ... Drive system, 51 ... Drive apparatus, 52 ... Drive apparatus, 53 ... Drive apparatus, 101 ... 1st shutter member, 102 ... 2nd shutter member, 531 ... 1st drive apparatus, 532 ... 1st 2 drive device, EL ... exposure light, EX ... exposure device, LQ ... liquid, LS ... immersion space, P ... substrate, T ... scale member

Claims (30)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first movable member movable within a predetermined plane including an irradiation position where the exposure light from the emission surface can be irradiated;
A second movable member movable within the predetermined plane;
A third movable member movable between the optical member and at least one of the first movable member and the second movable member;
A supply port for supplying the liquid to the emission surface;
At least one of the first movable member, the second movable member, and the third movable member is disposed at a position facing the ejection surface so that the liquid immersion space is continuously formed on the ejection surface side. An exposure apparatus.   The exposure apparatus according to claim 1, wherein the third movable member moves so as not to contact the optical member, the first movable member, and the second movable member.   The ejection surface and the third movable member are in a state where the ejection surface and the third movable member are opposed to each other, and the third movable member is opposed to at least one of the first movable member and the second movable member. When the liquid immersion space is formed in at least a part of the first space between the second movable member and the second space between the third movable member and at least one of the first movable member and the second movable member. The exposure apparatus according to claim 1, wherein the liquid is not present. The third movable member includes a first member and a second member that are relatively movable,
The ejection surface and the third movable member are in a state where the ejection surface and the third movable member are opposed to each other, and the third movable member is opposed to at least one of the first movable member and the second movable member. A first space between the first member and the second movable member, and a second space between the third movable member and at least one of the first movable member and the second movable member. The exposure apparatus according to claim 1, wherein a gap is formed between the two members.   The exposure apparatus according to claim 4, wherein the first and second members are plate members.   The exposure apparatus according to claim 4, wherein the first and second members move so as not to overlap each other.   The exposure apparatus according to claim 4, wherein the first edge of the first member and the second edge of the second member facing the first edge are acute angles.   The liquid in the first space is supplied to at least a part of the first movable member and the second movable member through the gap, and the optical path of the exposure light on the emission surface side is filled with the liquid. Item 8. The exposure apparatus according to any one of Items 4 to 7.   The exposure apparatus according to any one of claims 4 to 8, wherein the gap is not formed when the exposure light is not emitted from the emission surface.   The exposure apparatus according to any one of claims 4 to 9, wherein the drive system determines whether or not to form the gap based on a moving condition of the first and second movable members.   The exposure apparatus according to claim 10, wherein the driving system does not form the gap when the first and second movable members move at a predetermined speed or more.   12. The exposure apparatus according to claim 10, wherein the driving system does not form the gap when the first and second movable members move at a predetermined acceleration or more.   The exposure apparatus according to claim 10, wherein the driving system does not form the gap when the first and second movable members move a predetermined distance or more in a predetermined direction within the predetermined plane. .   The exposure apparatus according to claim 10, wherein the drive system adjusts the size of the gap based on a moving condition of the first and second movable members.   The drive system adjusts the gap to a first dimension when the first and second movable members move at a first speed, and the first and second movable members are second higher than the first speed. The exposure apparatus according to claim 14, wherein when moving at a speed, the gap is adjusted to a second dimension smaller than the first dimension.   The drive system adjusts the gap to a first dimension when the first and second movable members move at a first acceleration, and the first and second movable members are second higher than the first acceleration. The exposure apparatus according to claim 14 or 15, wherein when moving at an acceleration, the gap is adjusted to a second dimension smaller than the first dimension.   The drive system adjusts the gap to a first dimension when the first and second movable members move a first distance with respect to a predetermined direction in the predetermined plane, and the first and second movable members are The exposure apparatus according to any one of claims 14 to 16, wherein when moving a second distance longer than the first distance, the gap is adjusted to a second dimension smaller than the first dimension. The drive system may be configured from one of a first state in which at least a part of the first movable member is disposed at the irradiation position and a second state in which at least a part of the second movable member is disposed at the irradiation position. The first and second movable members are movable so as to change to the other;
When the gap is formed so that the optical path of the exposure light between the exit surface and the first movable member is filled with the liquid in the first state, and the state changes from the first state to the second state. The gap is closed, and the gap is formed so that an optical path of the exposure light between the emission surface and the second movable member is filled with the liquid in the second state. The exposure apparatus according to one item.   The exposure apparatus according to claim 18, wherein the first and second movable members move below the third movable member when the first state changes to the second state. The first movable member includes a first measurement member,
The first measurement member is irradiated with the exposure light from the emission surface in a state where the optical path between the emission surface and the first measurement member is filled with the liquid in the first state. The exposure apparatus according to any one of 14 to 19. The second movable member includes the second measurement member,
The second measurement member is irradiated with the exposure light from the emission surface in a state where the optical path between the emission surface and the second measurement member is filled with the liquid in the second state. 21. The exposure apparatus according to 20.   The drive system closes the gap when the second movable member moves so as to change from a state where the second measurement member is not disposed at the irradiation position to a state where the second measurement member is disposed. The exposure apparatus according to claim 21, wherein when the measurement member is disposed, the gap is formed, and after the exposure of the exposure light to the second measurement member is completed, the gap is closed. The second movable member holds the substrate,
The drive system closes the gap when the second movable member moves so as to change from a state in which the second measurement member is disposed at the irradiation position to a state in which the substrate is disposed. The exposure apparatus according to claim 21 or 22, wherein the gap is formed when the substrate is disposed on the substrate.   24. The size of the gap between the upper surface of the first and second movable members and the lower surface of the third movable member is smaller than the size of the gap between the emission surface and the upper surface of the third movable member. The exposure apparatus according to any one of the above.   The exposure apparatus according to claim 1, wherein at least a part of the surface of the third movable member is liquid repellent with respect to the liquid. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 25;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Supplying the liquid from a supply port to an emission surface side of the optical member from which the exposure light is emitted;
A first movable member movable within a predetermined plane including an irradiation position at which the exposure light from the emission surface can be irradiated so that an immersion space for the liquid is continuously formed on the emission surface side; A second movable member movable while holding the substrate, and at least one third movable member movable between the optical member and at least one of the first movable member and the second movable member. , Disposing at a position facing the emission surface;
Exposing the substrate through the liquid in the immersion space. Exposing the substrate using the exposure method of claim 27;
Developing the exposed substrate. A device manufacturing method. A program that causes a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via a liquid,
Supplying the liquid from a supply port to an emission surface side of the optical member from which the exposure light is emitted;
A first movable member movable within a predetermined plane including an irradiation position at which the exposure light from the emission surface can be irradiated so that an immersion space for the liquid is continuously formed on the emission surface side; A second movable member movable while holding the substrate, and at least one third movable member movable between the optical member and at least one of the first movable member and the second movable member. , Disposing at a position facing the emission surface;
Exposing the substrate through the liquid in the immersion space.   A computer-readable recording medium on which the program according to claim 29 is recorded.

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