WO2006137440A1 - Measuring apparatus, exposure apparatus, and device manufacturing method - Google Patents

Measuring apparatus, exposure apparatus, and device manufacturing method Download PDF

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Publication number
WO2006137440A1
WO2006137440A1 PCT/JP2006/312414 JP2006312414W WO2006137440A1 WO 2006137440 A1 WO2006137440 A1 WO 2006137440A1 JP 2006312414 W JP2006312414 W JP 2006312414W WO 2006137440 A1 WO2006137440 A1 WO 2006137440A1
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WO
WIPO (PCT)
Prior art keywords
substrate
liquid
exposure
surface
light
Prior art date
Application number
PCT/JP2006/312414
Other languages
French (fr)
Japanese (ja)
Inventor
Ikuo Hikima
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2005181712 priority Critical
Priority to JP2005-181712 priority
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO2006137440A1 publication Critical patent/WO2006137440A1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4257Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Abstract

A substrate stage (4) holds a substrate whereupon an exposure beam is applied through a liquid (LQ). A measuring apparatus (30) measures information relating to the exposure beam and has a light receiving system which can be removed from the substrate stage (4). The light receiving system receives the exposure beam through the liquid (LQ) by being held by the substrate stage (4).

Description

 Measurement apparatus, exposure apparatus, and device manufacturing method

 Technical field

 The present invention relates to a measurement device that measures information related to exposure light, an exposure device that exposes a substrate through a liquid, and a device manufacturing method.

 Priority is claimed on Japanese Patent Application No. 2005-18171, filed Jun. 22, 2005, the content of which is incorporated herein by reference.

 Background art

 In photolithography, which is one of the manufacturing steps of micro devices (such as electronic devices) such as semiconductor devices, an exposure apparatus that exposes a pattern image onto a photosensitive substrate is used. In the case of using a plurality of exposure apparatuses in combination in a microdevice manufacturing line, it is necessary to match the exposure light amount (dose amount) between the exposure apparatuses in order to reduce the variation and the like of products manufactured by each exposure apparatus. . The following patent documents disclose an example of a technique for matching exposure amounts among exposure devices using an illuminance meter capable of measuring relative illuminance among a plurality of exposure devices.

 Patent Document 1: Japanese Patent Application Laid-Open No. 10-92722

 Patent Document 2: Japanese Patent Application Laid-Open No. 11-260706

 Patent Document 3: Japanese Patent Application Laid-Open No. 2001-338868

 Disclosure of the invention

 Problem that invention tries to solve

 By the way, although an immersion exposure apparatus for exposing a substrate through a liquid has been proposed for the purpose of further increasing the resolution of an exposure apparatus, etc., a plurality of immersion exposures in a microdevice manufacturing line are being developed. Even in the case of using the apparatus in combination, it is necessary to match the exposure amount between the respective immersion exposure apparatuses. Therefore, it is desirable to devise a technology that can measure information on exposure light of each of a plurality of immersion exposure apparatuses in a smooth manner.

The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a measuring apparatus capable of smoothly measuring information on exposure light of each of a plurality of immersion exposure apparatuses. Do. Another object of the present invention is to provide an exposure apparatus in which information on exposure light is measured by the measurement apparatus, and a device manufacturing method using the exposure apparatus.

 Means to solve the problem

 In order to solve the above-mentioned problems, the present invention adopts the following configuration corresponding to each drawing shown in the embodiment. However, parenthesized symbols attached to each element are merely examples of the element, and do not limit each element.

 According to a first aspect of the present invention, there is provided a measurement device for measuring information related to exposure light (EL), wherein a substrate (P) to which exposure light (EL) is irradiated via liquid (LQ) And a light receiving system (32) for receiving the exposure light (EL) through the liquid (LQ) while being detachable from the substrate stage (4) holding the light and being held by the substrate stage (4). A measuring device provided is provided

According to the first aspect of the present invention, for example, information on exposure light of each of a plurality of immersion exposure apparatuses can be measured smoothly through a liquid.

According to the second aspect of the present invention, in the exposure apparatus which exposes the substrate (P) with the exposure light (EL) through the liquid (LQ), the measurement apparatus (30) of the above aspect can be detachably attached. Movable body to hold (

An exposure apparatus (EX) comprising the fourth aspect is provided.

According to the second aspect of the present invention, exposure processing can be performed with high accuracy using the measurement results of the measurement apparatus of the above aspect.

According to a third aspect of the present invention, there is provided a device manufacturing method using the exposure apparatus (EX) of the above aspect.

 According to the third aspect of the present invention, it is possible to manufacture a device by using an exposure apparatus capable of performing exposure processing with high accuracy.

 Brief description of the drawings

FIG. 1 is a schematic configuration view showing an exposure apparatus according to a first embodiment.

 FIG. 2 is a side cross sectional view showing the measuring apparatus according to the first embodiment.

 [FIG. 3] A plan view showing a measuring device according to the first embodiment.

 FIG. 4 is a flowchart for explaining an example of a measurement procedure using a measurement device.

FIG. 5 is a schematic view showing an example of measurement operation using a measurement device. FIG. 6 is a schematic view showing an example of the measurement operation using the measurement device.

 FIG. 7 is a side sectional view showing a measuring device according to a second embodiment.

 FIG. 8 is a side sectional view showing a measuring device according to a third embodiment.

 FIG. 9 is a flowchart for explaining an example of a manufacturing process of a micro device. Explanation of sign

 [0013] 1 ... immersion mechanism, 4 ... substrate stage, 4F ... top surface (third surface), 4H ... substrate holder, 4S ... inside surface, 8 ... transport device, 30 · · illuminance sensor (measuring device), 31 ... base material, 32 ... light receiving system, 33 · · · transparent member, 34 · · · light receiving element (light receiver), 35 · · circuit element (holding device), 35 '... circuit element (transmitting device), 36 ... Internal space, 37: upper surface, 37A: first surface, 37B: second surface, 40: side surface, 41 · · · film, 58: step, EL: exposure light, EX: exposure device, G, G, ... gap, LQ: liquid, LR: immersion area, P: substrate

 BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XY Z orthogonal coordinate system. Then, the predetermined direction in the horizontal plane is in the horizontal direction, in the horizontal plane! Thus, the direction orthogonal to the X-axis direction is taken as the Y-axis direction, and the direction (ie vertical direction) orthogonal to each of the X-axis direction and the Y-axis direction is taken as the Z-axis direction. Also, let the rotation (tilt) directions about the X axis, Y axis, and Z axis be Θ X, θ Y, and 0 Z directions, respectively.

 First Embodiment

The first embodiment will be described. FIG. 1 is a schematic configuration view showing an exposure apparatus EX according to the first embodiment. In FIG. 1, the exposure apparatus EX exposes the mask stage 3 movable by holding the mask M, the substrate stage 4 movable by holding the substrate P, and the mask M held by the mask stage 3 The illumination optical system IL illuminated by the light EL, the projection optical system PL projecting the pattern image of the mask M illuminated by the exposure light EL onto the substrate P, and the control device 7 controlling the overall operation of the exposure apparatus EX Have. In addition, the exposure apparatus EX, for example, as disclosed in Japanese Patent Laid-Open No. 7-240366 (corresponding to US Pat. No. 6,707,528), transport apparatus 8 for transporting the substrate P to the substrate stage 4. Prepare. Here, the base substrate includes one obtained by applying a photosensitive material (resist) on a base material such as a semiconductor wafer, and the mask includes a reticle on which a device pattern to be reduced and projected onto the substrate is formed. . Further, in the present embodiment, a force reflection type mask using a transmission type mask may be used as the mask.

 The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which the immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and to substantially widen the depth of focus. The liquid immersion mechanism 1 is provided to fill the optical path space K of the exposure light EL on the image plane side of the projection optical system PL with the liquid LQ to form the liquid immersion area LR of the liquid LQ on the substrate P. The exposure apparatus EX fills the optical path space K of the exposure light EL with the liquid LQ using the immersion mechanism 1 while projecting at least the pattern image of the mask M onto the substrate P. The exposure apparatus EX irradiates the substrate P with the exposure light EL that has passed through the mask M through the projection optical system PL and the liquid LQ filled in the optical path space K, so that the pattern image of the mask M is applied to the substrate P. Project Further, in the exposure apparatus EX of this embodiment, the liquid LQ filled in the optical path space K is larger than the projection area AR in a partial area on the substrate P including the projection area AR of the projection optical system PL and the substrate Liquid smaller than P Liquid immersion area of LQ Adopting a local immersion system that forms locally LR! In the present embodiment, pure water is used as the liquid LQ.

 The illumination optical system IL illuminates a predetermined illumination area on the mask M with the exposure light EL having a uniform illuminance distribution. Illumination optical system Exposure light from which also IL power is emitted, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) etc. , ArF excimer laser light (wavelength 193 nm) and F laser light (

 2) Vacuum ultraviolet light (VUV light) such as a wavelength of 157 nm is used. In the present embodiment, ArF excimer laser light is used.

The mask stage 3 is movable in the X-axis, Y-axis, and θZ directions while holding the mask M by driving of a mask stage drive device 3D including an actuator such as a linear motor. Position information of the mask stage 3 ((! /, Mask M) is measured by the laser interferometer 3L. The laser interferometer 3 L measures the positional information of the mask stage 3 using the movable mirror 3 K provided on the mask stage 3. The control unit 7 drives the mask stage drive unit 3D based on the measurement result of the laser interferometer 3L and is held by the mask stage 3. Perform position control of the mask M.

 The movable mirror 3 K may include corner cubes (retroreflectors) as well as the flat mirror, and instead of fixing the movable mirror 3 K to the mask stage 3, for example, the end face of the mask stage 3 A reflective surface formed by mirror-finishing) may be used. Further, the mask stage 3 may be configured to be capable of coarse and fine movement disclosed in, for example, Japanese Patent Application Laid-Open No. 8-130179 (Corresponding US Patent No. 6, 721, 034).

 The projection optical system PL projects a pattern image of the mask M onto the substrate P with a predetermined projection magnification, and has a plurality of optical elements, which are held by the barrel PK. ing. The projection optical system PL of this embodiment is a reduction system whose projection magnification is, for example, 1Z4, 1/5, 1/8, etc., and forms a reduced image of the mask pattern in the projection area AR conjugate to the above-mentioned illumination area. . The projection optical system PL may be any of a reduction system, an equal magnification system and a magnification system. In addition, the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. The projection optical system PL may form either an inverted image or an erected image. In the present embodiment, among the plurality of optical elements of the projection optical system PL, only the last optical element FL closest to the image plane of the projection optical system PL contacts the liquid LQ in the optical path space K.

The substrate stage 4 has a substrate holder 4 H for holding the substrate P, and is movable on the base member 5 by holding the substrate P on the substrate holder 4 H. The substrate holder 4H is disposed in the recess 4R provided on the substrate stage 4, and the upper surface 4F of the substrate stage 4 other than the recess 4R is substantially the same as the surface of the substrate P held by the substrate holder 4H. It is a flat surface that is at the same height. This is because, for example, during the exposure operation of the substrate P, a part of the liquid immersion area LR protrudes from the surface of the substrate P and is formed on the upper surface 4F. Note that only a part of the upper surface 4F of the substrate stage 4, for example, a predetermined area surrounding the substrate P (including the range where the liquid immersion area LR protrudes) may be substantially the same height as the surface of the substrate P. The upper surface 4F of the substrate stage 4 has liquid repellency to the liquid LQ. In the present embodiment, the upper surface 4F is made of a liquid repellent material such as a fluorine-based material such as polytetrafluorinated ethylene (Teflon (registered trademark)) or an acrylic material. A step may be present between the surface of the substrate P held by the substrate holder 4H and the upper surface 4F of the substrate stage 4. The Furthermore, although the substrate holder 4H may be integrally formed with a part of the substrate stage 4, in the present embodiment, the substrate holder 4H and the substrate stage 4 are separately configured, and for example, the substrate is formed by vacuum suction or the like. The holder 4H is fixed to the recess 4R.

The substrate stage 4 has an inner surface 4S that faces the side surface of the substrate P held by the substrate holder 4H. The inner side surface 4S is an inner surface of the recess 4R. Then, a gap G of, for example, about 0.1 to 1 mm is formed between the side surface of the substrate P held by the substrate holder 4 H and the inner side surface 4 S of the substrate stage 4. By setting the gap G to a predetermined value or less, the force between the front surface of the substrate P and the upper surface 4F of the substrate stage 4 and the liquid LQ are suppressed from invading the inside of the substrate stage 4 or the back side of the substrate P. There is. In addition, since the upper surface 4 F of the substrate stage 4 is liquid repellent, this also prevents the gap G liquid LQ from invading the inside of the substrate stage 4 or the back surface side of the substrate P. The inner side surface 4S may have liquid repellency.

 Substrate stage 4 holds substrate P by driving substrate stage drive device 4 D including actuators such as a linear motor, and X axis, Y axis, Z axis, 0 axis, Υ, θ θ It can move in the direction of six degrees of freedom. Position information of the substrate stage 4 (and consequently the substrate Ρ) is measured by the laser interferometer 4L. The laser interferometer 4 L uses the movable mirror 4 provided on the substrate stage 4 to measure positional information on the substrate stage 4 in the X axis, the wedge axis, and the θ wedge direction. Further, surface position information (position information regarding the direction of the Ζ axis, Θ X, and θ Υ) of the surface of the substrate held by the substrate stage 4 is detected by a focus' leveling detection system (not shown). The control device 7 drives the substrate stage drive device 4D based on the measurement result of the laser interferometer 4L and the detection result of the force level detection system, and the position of the substrate に held by the substrate stage 4 Take control.

 [0025] The laser interferometer 4L can measure the position of the substrate stage 4 in the direction of the 、 axis and also the rotation information in the 0 X, 0 Υ directions, and the details thereof are described in, for example, JP-A 2001-510577. Corresponding WO 1999Z28790)). Furthermore, instead of fixing the movable mirror 4 to the substrate stage 4, for example, a reflective surface formed by mirror-finishing a part of the substrate stage 4 (such as a side surface) may be used.

In addition, the focus and leveling detection system measures the direction of the axis of the substrate at each of the plurality of measurement points. By measuring the position information in the direction, the tilt information (rotation angle) in the Θ X and Θ Y directions of the substrate P is detected, but at least a part of the plurality of measurement points is the liquid immersion area LR ( Alternatively, they may be set within the projection area AR), or all of them may be set outside the immersion area LR. Furthermore, for example, when the laser interferometer 4L can measure the position information of the substrate P in the Z axis, θ X and θ Y directions, it is possible to measure the position information in the Z axis direction during the exposure operation of the substrate P. As described above, the position control of the substrate P in the Z-axis, θ X, and 0 Y directions is performed using the measurement results of the laser interferometer 4 L during the exposure operation even if the focus' repelling detection system is not provided. Let me see.

The liquid immersion mechanism 1 is provided between the substrate P held by the substrate stage 4 and the final optical element FL of the projection optical system PL which is provided at a position facing the substrate P and through which the exposure light EL passes. Fill the optical path space K with liquid LQ. The immersion mechanism 1 is provided in the vicinity of the optical path space K, and has a nozzle member 6 having a supply port 12 for supplying the liquid LQ to the optical path space K and a recovery port 22 for recovering the liquid LQ; And a liquid supply device 11 for supplying the liquid LQ through the supply port 12 of the nozzle member 6, and a liquid recovery device 21 for recovering the liquid LQ through the recovery port 22 of the nozzle member 6 and the recovery pipe 23. ing. The nozzle member 6 is an annular member provided to surround at least one optical element (in this example, the final optical element FL of the projection optical system PL) disposed on the image plane side of the projection optical system PL. In the present embodiment, the supply port 12 for supplying the liquid LQ and the recovery port 22 for recovering the liquid LQ are formed in the lower surface 6A of the nozzle member 6. Further, inside the nozzle member 6, a flow path connecting the supply port 12 and the supply pipe 13, and a flow path connecting the recovery port 22 and the recovery pipe 23 are formed. The supply port 12 is provided at each of a plurality of predetermined positions on the lower surface 6A of the nozzle member 6 so as to surround the final optical element FL (optical path space K) of the projection optical system PL. Further, the recovery port 22 is provided on the lower surface 6A of the nozzle member 6 outside the supply port 12 with respect to the final optical element FL, and is annularly provided to surround the final optical element FL and the supply port 12 It is done. In the present embodiment, a mesh member made of, for example, titanium or stainless steel (for example, SUS316) or a porous member made of ceramic is disposed in the recovery port 22!

The operation of the liquid supply device 11 and the liquid recovery device 21 is controlled by the control device 7. Liquid supply The supply device 11 can deliver the clean and temperature-controlled liquid LQ, and the liquid recovery device 21 including a vacuum system and the like can recover the liquid LQ. The controller 7 controls the liquid immersion mechanism 1 to perform the liquid supply operation by the liquid supply device 11 and the liquid recovery operation by the liquid recovery device 21 in parallel, thereby filling the optical path space K with the liquid LQ, The immersion area LR of the liquid LQ is locally formed in a partial area on the substrate P.

The configuration of the liquid immersion mechanism 1 (the structure of the nozzle member 6 and the like) is not limited to the above-described one, as long as a desired liquid immersion area LR is formed. For example, the liquid immersion mechanism disclosed in Japanese Patent Application Laid-Open No. 2004-289126 (corresponding US Pat. No. 6,952, 253) can also be used.

 FIG. 2 is a cross-sectional view showing an example of a measurement apparatus for measuring information on exposure light EL, and FIG. 3 is a plan view. In the present embodiment, an illuminance sensor that measures the illuminance of the exposure light EL will be described as an example of a measurement device that measures information related to the exposure light EL.

 In FIG. 2 and FIG. 3, the illuminance sensor 30 is for measuring information related to the illuminance of the exposure light EL via the liquid LQ, and is attached to and detached from the substrate stage 4 capable of holding the substrate P. It is possible. The illuminance sensor 30 of the present embodiment is a substrate type sensor (wafer type sensor) having substantially the same outer shape as the substrate P, and is attachable to and detachable from the substrate holder 4 H provided on the substrate stage 4. The illuminance sensor 30 includes a base 31 and a light receiving system 32 which is held by the base 31 and receives the exposure light EL through the liquid LQ. The light receiving system 32 has a transmitting member 33 capable of transmitting (passing) the exposure light EL, and a light receiving element 34 for receiving the exposure light EL transmitted through the transmitting member 33. The base 31 is made of a predetermined material such as stainless steel, for example.

The base material 31 holds the transmitting member 33 and has an internal space 36 in which the light receiving element 34 can be disposed. A recess 38 is formed in a part of the upper surface 37 of the substrate 31, and the transmitting member 33 is disposed in the recess 38. An inner space 36 is formed by disposing the transmitting member 33 in the recess 38 of the substrate 31. The transmitting member 33 is made of, for example, quartz, and can transmit (passable) the exposure light EL. The upper surface 37A of the transmitting member 33 held by the base 31 and the upper surface 37B of the base 31 holding the transmitting member 33 are substantially flush with each other. In the following description, of the upper surface of the illumination sensor 30, the transmitting member 3 The upper surface 37A formed by 3 is appropriately referred to as a first surface 37A, and the upper surface 37B formed by the base 31 is appropriately referred to as a second surface 37B. In addition, the entire top surface of the light sensor 30 including the first surface 37A and the second surface 37B is appropriately referred to as the top surface 37. The second surface 37B is disposed around the first surface 37A and provided so as to surround the first surface 37A.

 The internal space 36 is formed between the base 31 and the transmitting member 33 held by the base 31. The light receiving element 34 is disposed in the internal space 36. The light (exposure light EL) that has passed through the transmitting member 31 reaches the light receiving element 34, and the light receiving element 34 can receive the light (exposure light EL) that has passed through the transmitting member 33. An optical system (lens system) may be disposed between the transmitting member 33 and the light receiving element 34.

 When the numerical aperture of the projection optical system PL is large (for example, when the numerical aperture NA is 1.0 or more), if a gas is present between the transmitting member 33 and the light receiving element 34, one of the exposure light EL The light of the portion, that is, the incident angle to the transmitting member 33 is large, and there is a possibility that the light is totally reflected by the lower surface (light emitting surface) of the transmitting member 33. Therefore, the transmitting member 33 and the light receiving element 34 may be in close contact with each other so that no gas intervenes between the transmitting member 33 and the light receiving element 34, or the exposure may be performed between the transmitting member 33 and the light receiving element 34. A liquid or the like having a refractive index higher than that of gas (air) with respect to the light EL may be interposed, or a light receiving element may be formed directly (patterning) on the lower surface of the transmitting member 33.

 The light receiving element 34 includes, for example, a light conversion element, and outputs an electric signal according to the incident energy of the irradiated exposure light EL. As the light receiving element 34, a light conversion element utilizing a photovoltaic effect, a Schottky effect, a photoelectromagnetic effect, a photoconductive effect, a photoelectron emitting effect, a pyroelectric effect or the like can be used.

 Further, the illuminance sensor 30 has a circuit element 35 connected to the light receiving element 34. The circuit element 35 is connected to the light receiving element 34, and includes a holding device for holding the light reception result received by the light receiving element 34. The circuit element 35 includes an amplifier circuit (amplifier) to which the signal (illuminance signal) from the light receiving element 34 is output through the wiring, an amplification factor storage device storing the amplification factor of the amplifier circuit, and the illuminance amplified by the amplifier circuit. It has a peak hold circuit for holding the peak value of the signal, a storage element for storing the signal output from the light receiving element 34, and the like.

The peripheral region of the illumination sensor 30 is liquid repellent to the liquid LQ (the contact angle with the liquid LQ is 90 degrees Or higher). In the present embodiment, the second surface 37B of the illuminance sensor 30 has liquid repellency. A film 41 having liquid repellency is formed on the second surface 37B, and the film 41 imparts liquid repellency to the second surface 37B. The film 41 includes, for example, a fluorine-based material such as polytetrafluorinated ethylene (Teflon (registered trademark)) or an acrylic material. On the other hand, the film 41 is not formed on the first surface 37A. A liquid repellent film may be formed on the side surface 40 of the illuminance sensor 30 (substrate 31) so that each of the second surface 37B and the side surface 40 has liquid repellency to the liquid LQ.

 Next, a procedure of measuring the illuminance of the exposure light EL using the illuminance sensor 30 having the above-described configuration will be described with reference to the flow chart of FIG.

 As described above, the illuminance sensor 30 has substantially the same outer shape as the substrate P, and the transport device 8 can transport the illuminance sensor 30 to the substrate stage 4. In order to measure the illuminance of the exposure light EL using the illuminance sensor 30, the control device 7 loads (loads) the illuminance sensor 30 onto the substrate holder 4H of the substrate stage 4 using the transport device 8 (step SA1) . The control device 7 holds the illuminance sensor 30 carried by the transfer device 8 by the substrate holder 4H. The substrate holder 4H holds the lower surface 43 of the illuminance sensor 30 (step SA2).

FIG. 5 is a view showing the illuminance sensor 30 in a state of being held by the substrate holder 4H. The substrate holder 4H of the present embodiment is provided on the base material 50 and the upper surface of the base material 50, and a plurality of pin-like members that support the lower surface 43 of the illuminance sensor 30; It has an upper surface opposite to the lower surface 43 and is provided with a peripheral wall portion (rim portion) 52 provided so as to surround the support portion 51. In addition, an intake port 53 connected to a vacuum system (not shown) is provided on the upper surface of the base material 50. The controller 7 drives the vacuum system to suck the gas in the space 54 formed by the base 50, the peripheral wall 52 and the lower surface 43 of the illuminance sensor 30 supported by the support 51 through the air inlet 53. By making the space 54 negative pressure by pulling, the lower surface 43 of the illuminance sensor 30 is adsorbed and held by the support portion 51. That is, the substrate holder 4H of the present embodiment is provided with a so-called pinch chucking mechanism, and can adsorb and hold the illuminance sensor 30 and the substrate P, respectively. Further, the control device 7 can release the illuminance sensor 30 (substrate P) from the substrate holder 4 H by releasing the suction operation via the air inlet 53. Thus, the substrate holder 4H provided on the substrate stage 4 detachably holds each of the illuminance sensor 30 and the substrate P. To have.

 The upper surface 4F of the substrate stage 4 is disposed around the upper surface 37 (second surface 37B) of the illuminance sensor 30 held by the substrate holder 4H. The upper surface 37 (second surface 37B) of the illuminance sensor 30 and the upper surface 4F of the substrate stage 4 are substantially flush with each other. Further, the inner side surface 4S of the recess 4R of the substrate stage 4 is disposed at a position facing the side surface 40 of the light sensor 30 held by the substrate holder 4H. A predetermined gap G ′ is formed between the side surface 40 of the illuminance sensor 30 and the inner side surface 4S of the substrate stage 4. Since the illuminance sensor 30 has substantially the same outer shape as the substrate P, a gap G 'formed between the side surface 40 of the illuminance sensor 30 held by the substrate holder 4H and the inner surface 4S of the substrate stage 4 The gap G formed between the side surface of the substrate P held by the substrate holder 4H and the inner side surface 4S of the substrate stage 4 is substantially the same (about 0.1 to 1 mm). Therefore, the force between the upper surface 37 of the illumination sensor 30 and the upper surface 4 F of the substrate stage 4 is also suppressed from the liquid LQ entering the inside of the substrate stage 4 or the lower surface 43 side of the illumination sensor 30. Further, since the second surface 37 B, which is the peripheral region of the upper surface 4 F of the substrate stage 4 and the upper surface 37 of the illuminance sensor 30, is liquid repellent, the liquid LQ is on the inside of the substrate stage 4 or the lower surface 43 of the Infiltration is suppressed. If the inner side surface 4S and Z or the side surface 40 has liquid repellency, the liquid LQ can be more reliably prevented from infiltrating.

After holding the illuminance sensor 30 in the substrate holder 4 H, the control device 7 controls the substrate stage 4 to move the illuminance sensor 30 held in the substrate holder 4 H of the substrate stage 4 to the measurement position ( Step SA3). That is, the control device 7 sets the substrate stage 4 so that the final optical element FL of the projection optical system PL and the first surface 37 A, which is the upper surface of the transmitting member 33 of the illuminance sensor 30 held by the substrate holder 4H, face each other. Move. Then, the control device 7 uses the liquid immersion mechanism 1 in a state where the final optical element FL of the projection optical system PL and the first surface 37A of the illuminance sensor 30 held by the substrate holder 4H are opposed to each other. The operation to form the immersion area LR of the liquid LQ on the first surface 37A of 30 is started. That is, the liquid immersion mechanism 1 starts the supply operation of the liquid LQ from the supply port 12 for forming the liquid immersion area LR on the upper surface 37 (first surface 37A) of the illuminance sensor 30 (step SA4). In the following description, since the liquid LQ is present, the optical path space K in the initial state (empty state) is filled with the liquid LQ. The operation of supplying the liquid LQ to the optical path space K is referred to as an initial filling operation as appropriate. That is, the initial filling operation is an operation of forming the liquid immersion area LR on the upper surface 37 by supplying the liquid LQ to the upper surface 37 in the absence of the liquid LQ.

At the start of the initial filling operation, the control device 7 almost stops the substrate stage 4. That is, when the controller 7 starts the initial filling operation to form the immersion area LR using the immersion mechanism 1, it is held by the final optical element FL of the projection optical system PL and the substrate holder 4H. Maintain the relative position with the illumination sensor 30. Then, the control device 7 performs the supply operation and the recovery operation of the liquid LQ by the immersion mechanism 1 in parallel with the substrate stage 4 substantially stationary, as shown in FIG. Form the immersion area LR of the liquid LQ on the first surface 37A.

 Then, in a state where the immersion area LR is formed on the first surface 37A of the illuminance sensor 30 held by the substrate holder 4H of the substrate stage 4, the control device 7 exposes the exposure light EL from the illumination optical system IL. Launch. The exposure light EL is irradiated to the illuminance sensor 30 held by the substrate holder 4H via the projection optical system PL and the liquid LQ. The illuminance sensor 30 receives the exposure light EL through the liquid LQ by the light receiving system 32 while being held by the substrate holder 4 H of the substrate stage 4. The illuminance sensor 30 measures information on the illuminance of the exposure light EL by receiving the exposure light EL via the liquid LQ (step SA5). The light receiving result received by the light receiving element 34 of the light receiving system 32 is held (stored) in the circuit element 35 (step SA6).

Note that, when the illuminance of the exposure light EL is measured using the illuminance sensor 30, the control device 7 receives the light receiving surface (first surface 37A) of the illuminance sensor 30, the projection optical system PL, and the liquid LQ. The positional relationship between them is adjusted so as to substantially coincide with the formed image plane. Further, when the control device 7 measures the illuminance of the exposure light EL using the illuminance sensor 30, the control unit 7 performs the supply operation and the recovery operation of the liquid LQ by the liquid immersion mechanism 1 in parallel. Thereby, it is possible to form the immersion area LR of the liquid LQ which is always clean and temperature controlled, and the illuminance sensor 30 receives the exposure light EL by the light receiving element 34 through the liquid LQ whose clean and temperature is adjusted. can do. In addition, when the illuminance sensor 30 measures the illuminance of the exposure light EL, the control device 7 holds the substrate stage 4 substantially stationary, and is held by the final optical element FL of the projection optical system PL and the substrate holder 4H. Relative position with the illuminance sensor 30, and hence relative position between the immersion area LR and the transmitting member 33. Maintain the position.

 The size of the first surface 37A of the transmitting member 33 is sufficiently larger than the size of the liquid immersion area LR, and the liquid immersion area LR can be smoothly formed inside the first surface 37A of the transmitting member 33. By previously determining the size of the liquid immersion area LR to be formed by experiment or simulation, it is possible to provide the illumination sensor 30 with the transmitting member 33 having the first surface 37A larger than the liquid immersion area LR. In addition, by appropriately adjusting the liquid supply operation and Z or recovery operation by the liquid immersion mechanism 1 or the form of the nozzle member 6, the liquid immersion area LR is formed smaller than the first surface 37A of the transmissive member 33. I see.

 In the present embodiment, the transmitting member 33 (upper surface 37A) has a substantially circular outer shape as shown in FIG. 3, but the transmitting member 33 (upper surface 37A) is adjusted to the shape and Z or size of the liquid immersion area LR. Other shapes are also possible.

 In the present embodiment, since the liquid repellent film 41 is formed on the second surface 37 B of the base material 31 disposed around the first surface 37 A of the transmission member 33, It is suppressed that the liquid LQ of the immersion area LR formed on the first surface 37A flows out of the first surface 37A.

 Further, since the liquid repellent film 41 is not formed on the first surface 37A of the transmission member 33 on which the liquid immersion area LR of the liquid LQ is formed, deterioration in measurement accuracy can be suppressed. That is, since the liquid repellent film 41 may be deteriorated by the irradiation of the exposure light EL, the liquid repellent film 41 is formed on the first surface 37A of the transmitting member 33 to which the exposure light EL is irradiated. If this is done, irradiation of the exposure light EL may change the state of the film 41. When the state of the film 41 changes, there is a possibility that the light receiving state of the light receiving element 34 changes, such as the illuminance (light amount) of the exposure light EL reaching the light receiving element 34 changes. In addition, when the surface of the film 41 is roughened by the irradiation of the exposure light EL, the exposure light EL irradiated to the film 41 may be scattered. If such a situation occurs, the measurement accuracy of the illuminance sensor 30 may be degraded. In the present embodiment, the liquid immersion area LR is formed, and the film 41 is not formed on the first surface 37A of the transmitting member 33 to which the exposure light EL is irradiated, so that the occurrence of the above-mentioned inconvenience can be suppressed.

In addition, although the film 41 is not formed on the first surface 37A of the transmitting member 33, the liquid immersion area LR is When the immersion area LR of the liquid LQ is formed on the first surface 37A of the transmission member 33 smaller than the first surface 37A of the transmission member 33 of the illumination sensor 30, the immersion region LR and the transmission member 33 Since the relative position with the first surface 37A of the light source is maintained (as the substrate stage 4 is almost stationary), the outflow of the liquid LQ in the immersion area LR from the first surface 37A of the illuminance sensor 30 is suppressed. It is controlled.

 After the measurement using the illuminance sensor 30 is completed, the control device 7 removes the liquid immersion area LR from the upper surface 37 of the illuminance sensor 30. When removing the immersion area LR from the upper surface 37 of the illuminance sensor 30, the controller 7 stops the liquid supply operation through the supply port 12 and continues the liquid recovery operation through the recovery port 22 for a predetermined time. Do. As a result, all the liquid LQ in the immersion area LR can be recovered (removed) (step SA7). In the following description, an operation for recovering all the liquid LQ filling the optical path space K (liquid LQ in the liquid immersion area LR) will be appropriately referred to as “total recovery operation”.

 It should be noted that since the first surface 37A does not have liquid repellency, the force may be that a thin film or a minute droplet of the liquid LQ may remain on the first surface 37A after performing the full recovery operation. The apparatus 7 determines that the entire recovery operation of the liquid immersion mechanism 1 is completed when the recovery amount of the liquid LQ from the recovery port 22 of the nozzle member 6 becomes less than a predetermined amount (approximately zero).

 After the liquid LQ in the liquid immersion area LR has been completely recovered, the control device 7 uses the transfer device 8 to unload (unload) the light intensity sensor 30 from the substrate stage 4 (step SA8).

 Substrate Stage 4 Force The unloaded illuminance sensor 30 is extracted (read out) by the analysis device in which the stored information held in the holding device (storage device) 35 is placed at a predetermined position (step SA 9).

In the micro device (semiconductor device) manufacturing system of the present embodiment, as shown in the schematic view of FIG. 6, a plurality of immersion exposure apparatuses EX1 to EX4 are used in combination. The plurality of exposure devices EX1 to EX4 are connected to the same host computer EM, and the operation status and the like of each are monitored to control production. The illuminance of each of these exposure devices EX1 to EX4 is measured by the illuminance sensor 30 as a reference illuminance meter, and is used to match the exposure amount between the exposure devices. Therefore, the stored information stored and held in the circuit element 35 of the illuminance sensor 30 is extracted by the analyzer connected to the host computer EM. Be

 In the schematic view of FIG. 6, after the measurement in each of the exposure apparatuses EX1 to EX4 is completed, the measurement result in each of the exposure apparatuses is extracted by the analyzer connected to the host computer EM. The sensor 30 may hold information indicating which exposure apparatus is the measurement data together with the measurement data! / ヽ.

 Further, in the schematic view of FIG. 6, after the measurement in each of the exposure apparatuses EX1 to EX4 is completed, the measurement result in each of the exposure apparatuses is extracted by the analyzer connected to the host computer EM. The measurement data held by the illuminance sensor 30 may be extracted by an analyzer disposed at a predetermined position every time measurement by one exposure apparatus is completed, and may be sent to the host computer EM. In this case, when the analyzer also sends measurement data to the host computer, it may send information indicating whether it is measurement data of the exposure apparatus with deviation V or not together!

 Further, the illuminance sensor 30 wirelessly transmits the measurement data to the control device 7, and the control device 7 transmits the measurement data to the host computer EM in association with the identification information of the exposure device (for example, the machine number etc.). May be The manufacturing system of FIG. 6 is provided with four immersion exposure apparatuses E X1 to EX4. The number and type of force exposure apparatuses are not limited thereto. For example, not a liquid immersion type, but a normal exposure apparatus It is also possible to include.

 Further, the conveyance of the illuminance sensor 30 between the two exposure apparatuses may be performed by using a conveyance system which conveys the substrate P, or may be performed by an operator.

 In addition, on the substrate stage 4 of each of the exposure apparatuses EX1 to EX4, a constant illuminance sensor (not shown) is provided. By correcting the measurement result of the permanent illumination sensor using the measurement result of the detachable illumination sensor 30, the illuminance with which the correspondence with the other exposure apparatus is taken is derived from the measurement result of the permanent illumination sensor. be able to.

As described above, the illuminance sensor 30 which can be attached to and detached from the substrate stage 4 can smoothly measure the information on the illuminance between the exposure devices via the liquid LQ. The illuminance sensor 30 can be smoothly transported to the substrate stage 4 using the transport device 8. Since the projection optical system PL and various precision devices (members) are disposed in the vicinity of the substrate stage 4, for example, when the operator manually detaches the illuminance sensor 30 from the substrate stage 4, smooth operation is performed. Makes it difficult or hurts precision equipment etc. Problems such as changing the environment (cleanness, temperature, humidity, etc.) in which the exposure apparatus is placed. In this embodiment, the illuminance sensor 30 is attached to and detached from the substrate holder 4H by using the transport device 8 which has the illuminance sensor 30 substantially the same outer shape as the substrate P and loads and unloads the substrate P on the substrate holder 4H. Thus, the illuminance sensor 30 can be smoothly attached to and detached from the substrate stage 4. Further, since the interruption time of the exposure processing accompanying the measurement of the illuminance can be shortened, the operation rate of the exposure apparatus EX can be improved.

Further, illuminance sensor 30 has substantially the same outer shape as substrate P, and can be attached to and detached from substrate holder 4 H. Therefore, almost the same conditions as when forming liquid immersion area LR on substrate P In (operation), the liquid immersion area LR can be formed on the upper surface 37 of the illuminance sensor 30 to calculate information on the illuminance.

 In addition, the film 41 is not formed on the first surface 37A of the transmission member 33 where the liquid immersion area LR is formed, and the film 41 is formed on the second surface 37B disposed around the first surface 37A. Therefore, it is possible to suppress the outflow of the liquid LQ and maintain the measurement accuracy of the illuminance sensor 30.

 Further, in the present embodiment, even when the initial filling operation is started on the upper surface 37 (the first surface 37 A) of the illuminance sensor 30 and the illuminance sensor 30 measures the exposure light EL, immersion is performed. The region LR is formed on the first surface 37A. That is, during the measurement operation using the illumination sensor 30, the liquid immersion area LR is always formed on the first surface 37A. Therefore, even if there is a gap between the transmitting member 33 and the base 31, it is possible to suppress the liquid LQ from entering the internal space 36 from the gap.

 Further, since the immersion area LR is not formed in the gap G ′ between the upper surface 37 of the illuminance sensor 30 and the upper surface 4F of the substrate stage 4, the liquid LQ intrudes into the substrate stage 4 through the gap G ′. Can be prevented. Further, the second surface 37B of the illumination sensor 30 and the upper surface 4F of the substrate stage 4 are substantially flush, and the upper surface 4F of the substrate stage 4 disposed around the second surface 37B and the second surface 37B is repellent Since it is liquid, even if the liquid immersion area LR is formed across the gap G ′, the occurrence of problems such as the outflow of the liquid LQ can be suppressed.

Note that the initial filling operation is not started on the upper surface 37 of the illumination sensor 30, and the other objects are not After the initial filling operation is started on the upper surface of the substrate stage 4 such as the upper surface 4F of the substrate stage 4 and the immersion area LR is formed on the upper surface 4F, the supply operation and recovery operation of the liquid LQ by the immersion mechanism 1 are continued. Alternatively, the substrate stage 4 may be moved in the XY plane to move the immersion area LR formed on the upper surface 4F of the substrate stage 4 to the upper surface 37 of the illuminance sensor 30. The gap G ′ is minute, and the top surface 4F of the substrate stage 4 and the top surface 37 (second surface 37B) of the illuminance sensor 30 are liquid repellent, so that it is possible to prevent the outflow or penetration of the liquid LQ. In addition, even when the immersion area LR is moved between the second surface 37B of the illuminance sensor 30 and the upper surface 4F of the substrate stage 4, the movement of the immersion area LR while suppressing the outflow of the liquid LQ. Can be done smoothly. The other object may be a measurement stage or the like that is movable independently of the substrate stage 4.

 Further, in the present embodiment, after the measurement operation of the illuminance sensor 30 is completed, the entire recovery operation of the liquid LQ in the liquid immersion area LR formed on the upper surface 37 of the illuminance sensor 30 is performed. While the liquid LQ is supplied and recovered by the immersion mechanism 1 without completely recovering the liquid LQ, the substrate sensor 4 is moved in the XY plane to move the immersion area LR to the illuminance sensor 30. It is also possible to move, for example, from the upper surface 37 of the substrate stage 4 to the upper surface 4F of the substrate stage 4 or an object other than the substrate stage 4 (including the measurement stage etc.).

 In the present embodiment, although the light receiving element 34 and the circuit element 35 are integrally provided on the base material 31, the light receiving element 34 is provided on the base material 31, and the circuit element 35 is the base material 31. It may be provided outside the The light receiving element 34 and the circuit element 35 may be connected by a flexible connection cable, for example. Alternatively, wireless transmission may be performed between the light receiving element 34 and the circuit element 35.

 Second Embodiment

 Next, a second embodiment will be described with reference to FIG. The same or equivalent components as or to those of the embodiment described above are designated by the same reference numerals, and the description thereof will be simplified or omitted.

In FIG. 7, the illuminance sensor 30 includes a substrate 31, a transmitting member 33 held by the substrate 31, a light receiving element 34 disposed in the internal space 36, and a circuit element connected to the light receiving element 34. It has 35 'and. The circuit element 35 'of the present embodiment is connected to the light receiving element 34, and the light receiving element 3 A transmitter for wirelessly transmitting the light reception result received in 4 is provided. The exposure apparatus EX further includes a receiving device 56 for receiving a wireless signal including the measurement result transmitted from the circuit element (transmitting device) 35 'of the illumination sensor 30. The illuminance sensor 30 of the present embodiment also has substantially the same outer shape as the substrate P, and is attachable to and detachable from the substrate holder 4H. Further, in the present embodiment, the measurement result received by the receiving device 56 is displayed on the display device 57.

 Further, in the present embodiment, the film 41 ′ is formed on the entire upper surface 37 including the first surface 37A and the second surface 37B of the illuminance sensor 30. The film 41 'is made of a material having liquid repellency, high transparency to the exposure light EL, and resistance to the exposure light EL (ultraviolet light). In the present embodiment, the membrane 41 'is formed of "Cytop" manufactured by Asahi Glass Co., Ltd.

 As described above, the light reception result received by the light receiving element 34 can be wirelessly transmitted. By this, for example, cables for transmitting the light reception result can be omitted. Further, as in the present embodiment, the top surface 37 of the illuminance sensor 30 can be made liquid repellent by providing the film 41 ′ that also has the cytop equal force, and the outflow or the remaining of the liquid LQ can be prevented. Can.

 Third Embodiment

 Next, a third embodiment will be described with reference to FIG. In the following description, the component parts identical or equivalent to those of the above-described embodiment are denoted by the same reference numerals, and the description thereof will be simplified or omitted. In FIG. 8, a step 58 is provided between the first surface 37A of the transmitting member 33 and the second surface 37B of the base 31. The size (diameter) of the transmission member 33 is larger than the size (diameter) of the recess 38 of the base material 31, and the peripheral region of the lower surface of the transmission member 33 is a part of the upper surface 37 B of the base material 31. It is held. Further, in the present embodiment, the base material 31 is formed of a liquid repellent material (such as fluorine resin), and the liquid repellent property of the surface of the second surface 37 B without the liquid repellent film. Can be maintained. Further, the second surface 37B, which is a peripheral region of the upper surface 37 of the illuminance sensor 30 held by the substrate holder 4H, and the upper surface 4F of the substrate stage 4 disposed therearound are substantially flush.

Thus, even if the step 58 is formed between the first surface 37A and the second surface 37B, the initial filling operation of the liquid LQ on the first surface 37A and the operation as in the above-described embodiment Perform all recovery operations If this is done, the liquid LQ is prevented from remaining in the step 58. Further, as shown in FIG. 8, by providing the transmissive member 33 on a part of the upper surface 37B of the base material 31, the internal space 36 can be enlarged, and the design freedom of the illuminance sensor 30 is improved. can do. In addition, since the second surface 37B of the illuminance sensor 30 held by the substrate holder 4H and the upper surface 4F of the substrate stage 4 are substantially flush, the liquid LQ may be inside the substrate stage 4 or the illuminance sensor via the gap G '. It can be prevented from infiltrating to the lower surface 43 side of 30. Also, the step 58 is small (for example, 2 mm or less), and the immersion area LR is moved to the second surface 37B of the illumination sensor 30 to move the immersion area LR formed on another object onto the first surface 37A. Even when moving between the substrate stage 4 and the upper surface 4F, the movement of the liquid immersion area LR can be smoothly performed while suppressing the outflow of the liquid LQ.

In each of the embodiments described above, the entire first surface 37A of the transmitting member 33 need not be able to transmit the exposure light EL, so the first surface 37A of the transmitting member 33 transmits the exposure light EL. It may be coated with a material that does not have to be used, and an aperture (opening) through which the exposure light EL passes may be formed in part of it. In this case, the first surface 37A of the transmissive member 33 may be covered with a liquid repellent material capable of transmitting the exposure light EL, or the first surface 37A of the transmissive member 33 does not transmit the exposure light EL. A liquid repellent film is formed only on the surface of the region coated with the material, and a liquid repellent film is not formed on the surface of the region where the aperture (opening) through which the exposure light EL passes is formed.

 Although the second surface 37B of the illuminance sensor 30 and the upper surface 4F of the substrate stage 4 are flush (the same height) in the above embodiment, the present invention is not limited to this. The heights of the second surface 37 B and the upper surface 4 F of the substrate stage 4 may be made different. For example, when the illuminance sensor 30 and the substrate P have different thicknesses, when the illuminance sensor 30 is held by the substrate holder 4H, the heights of the upper surface 37 of the illuminance sensor 30 and the upper surface 4F of the substrate stage 4 are different. become . If the gap between the upper surface 37 of the illumination sensor 30 and the upper surface 4F of the substrate stage 4 becomes extremely large, for example, the substrate holder 4H can be finely moved in the Z-axis direction to make its gap smaller. Or as zero.

In each of the above-described embodiments, the support 51 and the peripheral wall 52 of the substrate holder 4 H have substantially the same height. However, the present invention is not limited to this. For example, the height of the peripheral wall 52 may be a support Closer than 51 May be low on force. In this case, a pin whose tip is disposed on the same plane as the support portion 51 (a plurality of pin-like members) may be provided on the upper end surface of the peripheral wall portion 52. Furthermore, the substrate holder 4H has a plurality of pin-like members surrounded by one peripheral wall 52. Not limited to this, for example, the mounting surface of the substrate holder 4H is divided into a plurality of blocks, and a plurality of blocks are provided for each block. The pin-shaped member may be surrounded by a peripheral wall portion. In addition, although the substrate holder 4H is of the pin chuck type, the present invention is not limited to this. For example, a holder having a plurality of concentric convex portions may be used. Although not shown in the above-described embodiments, for example, a pin member movable in the Z-axis direction is provided on the substrate stage 4 via the through hole of the substrate holder 4H, and the transfer device Delivery of the substrate P and the illuminance sensor 30 is performed between 8 and the substrate stage 4! /.

 In each of the embodiments described above, the illuminance sensor 30 is detachably provided to the substrate holder 4 H of the substrate stage 4, for example, the upper surface 4 F of the substrate stage 4. A dedicated mounting area may be provided in the vicinity of the substrate holder 4H or the like, and may be detachably provided to the mounting area. In this case, for example, the size and the outer shape of the illuminance sensor 30 may not be the same as that of the substrate P as long as they can be transported by the transport device 8, for example.

 In each of the above-described embodiments, the outer shape of the illuminance sensor 30 is substantially the same circular plate as the substrate P (Ueno), but, for example, in an exposure apparatus for manufacturing a liquid crystal display device, It may be formed in substantially the same shape as the glass substrate as the exposure target, that is, in the form of a rectangular plate.

 In each of the above-described embodiments, the illuminance sensor 30 has substantially the same outer shape as the substrate (wafer), but is detachable from the substrate stage 4 (substrate holder 4H). Light Light It may be shaped differently from the substrate (wafer) as long as it can measure information on EL. Similarly, the illumination sensor 30 may differ in size from the substrate (wafer).

 The illuminance sensor 30 may form a light receiving element (light receiving system) on a semiconductor wafer using, for example, a photolithography method. In addition, the light receiving system may be provided detachably to the semiconductor wafer.

In each of the above-described embodiments, an illuminance sensor for measuring the illuminance of the exposure light EL has been described as an example of a measurement device for measuring information related to the exposure light EL. As a measuring device which measures information, arbitrary constitutions, such as a nonuniformity sensor which measures illumination nonuniformity of exposure light EL, a space image measurement sensor which measures a space image (projected image), can be adopted.

In each of the above-described embodiments, the interferometer system (3 L, 4 L) is used to measure the positional information of the mask stage 3 and the substrate stage 4 without being limited thereto. You may use an encoder system to detect the provided scale (diffraction grating). In this case, it is preferable to use a hybrid system including both an interferometer system and an encoder system, and perform calibration (calibration) of the measurement results of the encoder system using the measurement results of the interferometer system. In addition, position control of the stage may be performed using switching between the interferometer system and the encoder system, or both of them.

 As described above, the liquid LQ in each of the above embodiments is composed of pure water. Pure water can be easily obtained in large quantities in semiconductor manufacturing plants etc., and has the advantage that it does not adversely affect the photoresist on the substrate P, optical elements (lenses) and the like. In addition, since pure water has no adverse effect on the environment and the content of impurities is extremely low, the function of cleaning the surface of the substrate P and the surface of the optical element provided on the tip surface of the projection optical system PL is also expected. it can.

 The refractive index n of pure water (water) for exposure light EL having a wavelength of about 193 nm is approximately 1.44, and ArF excimer laser light (wavelength 193 nm) is used as a light source for exposure light EL. In the case, on the substrate P, the wavelength is shortened to 1 Zn, that is, about 134 nm to obtain high resolution. Furthermore, since the depth of focus is expanded by about n times, that is, by about 1.44 times in air, the projection optical system should be able to ensure the same depth of focus as in air. The numerical aperture of PL can be further increased, which also improves the resolution.

Further, in each of the above embodiments, the optical element FL is attached to the tip of the projection optical system PL, and the optical characteristic of the projection optical system PL, for example, an aberration (spherical aberration, comatic aberration, etc.) by this optical element. Adjustments can be made. The optical element attached to the tip of the projection optical system PL may be an optical plate used to adjust the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate (cover glass etc.) capable of transmitting exposure light EL. When the pressure between the optical element at the tip of the projection optical system PL and the substrate P generated by the flow of the liquid LQ is large, the optical element is not replaceable but the pressure is not optical. The element does not move, it may be fixed as firmly.

In each of the above-described embodiments, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ. For example, a cover formed of a plane parallel plate on the surface of the substrate P The liquid LQ may be filled with the glass attached.

In addition, although the projection optical system of the above-described embodiment fills the light path space on the image plane side of the optical element at the tip with the liquid, as disclosed in WO 2004Z01918 pamphlet, It is possible to adopt a projection optical system in which the optical path space on the object plane side of the optical element is also filled with the liquid.

 Although the liquid LQ in each of the above embodiments is water (pure water), it may be a liquid other than water. For example, when the light source of the exposure light EL is an F laser, this F laser may be used. Light penetrates the water

 twenty two

 As the liquid LQ, for example, perfluorinated

 2

 It may be a fluorinated fluid such as PFPE) or a fluorinated oil. In this case, the portion in contact with the liquid LQ is subjected to lyophilic treatment, for example, by forming a thin film of a substance of molecular structure with a small polarity containing fluorine. In addition, as the liquid LQ, there is also a liquid LQ that is stable against the photoresist applied on the surface of the projection optical system PL and the substrate P that is as high as possible in the refractive index because it is transparent to the exposure light EL (for example, It is also possible to use oil).

 In addition, as the liquid LQ, one having a refractive index of about 1.6 to 1.8 may be used. Furthermore, the optical element FL may be formed of a material having a refractive index (eg, 1.6 or more) higher than that of quartz or fluorite. It is also possible to use various liquids, for example supercritical fluids, as the liquid LQ.

The substrate P in each of the above embodiments is used not only for semiconductor wafers for manufacturing semiconductor devices, but also for glass substrates for display devices, ceramic thin films for thin film magnetic heads, or exposure devices. A mask or reticle original plate (synthetic quartz, silicon wafer) or the like is applied. [0093] As the exposure apparatus EX, a step-and- 'scan type scanning exposure apparatus (scanning step) in which the mask M and the substrate P are synchronously moved to scan the pattern of the mask M in addition to the mask The present invention can also be applied to a step-and-repeat projection exposure apparatus (step) in which the pattern of the mask M is collectively exposed while M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.

 In addition, as the exposure apparatus EX, with the first pattern and the substrate P substantially stationary, a reduction image of the first pattern is projected onto a projection optical system (for example, a reflective element is not included at a 1Z8 reduction ratio, The present invention can also be applied to an exposure apparatus of a method of collectively exposing a substrate P using a projection optical system). In this case, further, after the second pattern and the substrate P are substantially stationary, a reduced image of the second pattern is partially overlapped with the first pattern using the projection optical system, and is collectively exposed on the substrate P. The invention can also be applied to a batch exposure apparatus of the stitch method. In addition, as the exposure method of the stitch method, it is also applicable to a step-and-stitch method exposure device in which at least two patterns are partially overlapped and transferred on the substrate P and the substrate P is sequentially moved.

 In each of the above embodiments, the exposure apparatus including the projection optical system PL has been described as an example, but the present invention is applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Can. Even when the projection optical system is not used, the exposure light is irradiated to the substrate through an optical member such as a mask or a lens, and a liquid immersion area is formed in a predetermined space between such an optical member and the substrate. Ru.

 Further, the present invention is disclosed, for example, in JP-A-10-163099 and JP-A-10-214783 (Corresponding US Patent No. 6,590, 634) and JP-A 2000-505958 (Corresponding US Patent No. The present invention can also be applied to a twin-stage type exposure apparatus provided with a plurality of substrate stages as disclosed in US Pat. No. 5, 969, 441), US Pat. No. 6, 208, 407 and the like.

 Furthermore, for example, as disclosed in JP-A-11-135400 (Corresponding International Publication 1999/23692) or JP-A 2000-164504 (Corresponding US Patent No. 6, 897, 963), V, The present invention can also be applied to an exposure apparatus provided with a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and a measurement stage on which Z or various photoelectric sensors are mounted.

Further, in the above embodiment, the liquid locally between the projection optical system PL and the substrate P In the present invention, the exposure apparatus disclosed in, for example, Japanese Patent Laid-Open Nos. 6-124873, 10-303114, and US Pat. No. 5, 825, 043 is used. The present invention is also applicable to an immersion / exposure apparatus that performs exposure while the entire surface of the target substrate is immersed in liquid and swirls.

The type of exposure apparatus EX is not limited to the exposure apparatus for producing a semiconductor element that exposes a semiconductor element pattern on a substrate P, and an exposure apparatus for producing a liquid crystal display element or a display, a thin film magnetic head, imaging It can be widely applied to an exposure apparatus for manufacturing a device (CCD), a micromachine, a MEMS, a DNA chip, or a reticle or a mask.

 In the above-described embodiment, the force using a light transmission type mask in which a predetermined light shielding pattern (or phase pattern 'light reduction pattern) is formed on a light transmitting substrate is replaced with this mask. For example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable shaped mask) that forms a transmission pattern or a reflection pattern or a light emission pattern based on the electronic data of a pattern to be exposed It is also possible to use, for example, DMD (Digital Micro-mirror Device), which is a type of non-light emitting type image display device (spatial light modulator), and the like.

 Also, as disclosed in, for example, WO 2001Z035168, an exposure apparatus that exposes a line 'and' space pattern on a substrate P by forming interference fringes on the substrate P (lithography The present invention can also be applied to

 Furthermore, as disclosed in, for example, JP-A-2004-519850 (Corresponding US Pat. No. 6,611, 316), two mask patterns are combined on a substrate via a projection optical system. The present invention can also be applied to an exposure apparatus that double-exposures one shot area on a substrate substantially simultaneously by one scan exposure.

 As long as the laws of the country designated or selected in this international application permit, the disclosures of all the published publications and US patents relating to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated. And be part of the text.

As described above, the exposure apparatus EX according to the embodiment of the present invention has various mechanical systems including the respective constituent elements recited in the claims of the present application, with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to keep the degree. In order to ensure these various accuracies, before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, various electrical systems Adjustments will be made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, wiring connection of electric circuits, piping connection of pressure circuits, etc. among the various subsystems. It goes without saying that there is an assembly process for each subsystem before the process for assembling the various subsystems into the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, general adjustment is performed to ensure various accuracies as the entire exposure apparatus. It is desirable that the manufacturing of the exposure apparatus be performed in a clean room in which the temperature, the clean degree, etc. are controlled.

 [0105] As shown in FIG. 9, a micro device such as a semiconductor device has a step 201 of performing function / performance design of the micro device, a step 202 of manufacturing a mask (reticle) based on this design step, and 202 Step 203 of manufacturing a substrate which is a base material, step of exposing the mask pattern onto the substrate by the exposure apparatus EX of the embodiment described above, step of developing the exposed substrate, heating (curing) and etching step of the developed substrate And the like, a device assembly step (including a processing step such as a dicing step, a bonding step, and a packaging step) 205, an inspection step 206, and the like.

 Industrial applicability

According to the present invention, information on exposure light in a liquid immersion exposure apparatus can be measured smoothly, and exposure processing can be performed with high accuracy. Therefore, the present invention, therefore, the present invention produces a wide range of products, such as semiconductor devices, liquid crystal display devices or displays, thin film magnetic heads, CCDs, micromachines, MEMS, DNA chips, reticles (masks). It is extremely useful for an exposure method and apparatus for

Claims

 The scope of the claims
 [I] A measuring device for measuring information related to exposure light,
 A measuring apparatus comprising: a light receiving system which is attachable to and detachable from a substrate stage holding a substrate to which the exposure light is irradiated via a liquid, and which receives the exposure light via the liquid while being held by the substrate stage .
 [2] The measurement apparatus according to claim 1, wherein the light receiving system is attachable to and detachable from a substrate holder for holding the substrate provided on the substrate stage.
[3] The measuring device according to claim 1 or 2, wherein the light receiving system has substantially the same outer shape as the substrate.
[4] The measuring device according to any one of claims 1 to 3, wherein the light receiving system has a region having liquid repellency to the liquid.
[5] The measurement apparatus according to any one of claims 1 to 4, wherein the light receiving system includes a transmitting member through which the exposure light is transmitted, and a light receiver which receives the exposure light transmitted through the transmitting member.
[6] The measurement device according to claim 5, wherein a liquid immersion area is formed on the upper surface of the transmission member.
[7] The measuring device according to claim 5 or 6, wherein the light receiving system holds the transmission member and has a base having an internal space in which the light receiver is disposed.
[8] The light receiving system according to any one of claims 1 to 7, having a first surface on which the liquid is disposed, and a second surface disposed outside the first surface and having liquid repellency. Measuring device as described.
[9] The measurement device according to claim 8, wherein the first surface and the second surface are substantially flush.
[10] The measuring device according to claim 8, wherein a step is provided between the first surface and the second surface.
 [II] The measurement apparatus according to any one of claims 1 to 10, further comprising a holding device for holding the light reception result of the light reception system.
 [12] The transmitter according to any one of claims 1 to 11, further comprising: a transmission device for wirelessly transmitting the light reception result of the light reception system
V, measurement device according to one or more items.
[13] The measuring device according to any one of claims 1 to 12, wherein the illuminance of the exposure light is measured.
[14] An exposure apparatus that exposes a substrate with exposure light through a liquid!
An exposure apparatus comprising: a movable body that detachably holds the measurement apparatus according to any one of claims 1 to 13.
[15] An exposure apparatus that exposes a substrate through a liquid,
 A substrate stage for holding the substrate;
 And a measuring device for measuring information on exposure light,
 An exposure apparatus comprising: a light receiving system that is detachable from the substrate stage and that receives the exposure light via the liquid in a state of being held by the substrate stage.
 [16] The exposure apparatus according to claim 15, further comprising a transfer device for transferring the light receiving system to the substrate stage.
 [17] The exposure apparatus according to [15] or [16], further comprising a liquid immersion mechanism that forms a liquid immersion area on one surface of the light receiving system.
 18. The exposure apparatus according to claim 17, wherein the liquid immersion mechanism starts a liquid supply operation for forming the liquid immersion area on the one surface of the light receiver.
19. The exposure apparatus according to claim 17, wherein supply and recovery of the liquid in the liquid immersion mechanism are performed in parallel with the measurement of the exposure light in the measurement apparatus.
[20] The substrate stage is disposed outside the light receiving system, and has a third surface that is substantially flush with the surface of the light receiver on which the liquid is disposed or the outer surface thereof.
19. The exposure apparatus according to any one of 19.
21. The substrate stage according to any one of claims 15 to 20, wherein the substrate stage has an inner side surface facing the side surface of the light receiving system and having a predetermined gap formed with the side surface of the light receiving system. Exposure device.
 [22] A device manufacturing method using the exposure apparatus according to any one of claims 14 to 21.
PCT/JP2006/312414 2005-06-22 2006-06-21 Measuring apparatus, exposure apparatus, and device manufacturing method WO2006137440A1 (en)

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