JP2009182110A - Exposure system, exposure method and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure system that can improve throughput. <P>SOLUTION: The exposure system performs exposure to a substrate using exposure light through liquid. The exposure system includes: an optical member having an ejection surface that ejects exposure light; a first member that can hold liquid between the optical member and the first member and can move within a predetermined region; and a control device that controls the movement of the first member so that the movement of speed of a first condition where liquid is held between the optical member and the control device may be different from that of a second condition where liquid is not held. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate with exposure light via a liquid, an exposure method, and a device manufacturing method.

As an exposure apparatus used in a photolithography process, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in Patent Documents 1 and 2 is known. In the immersion exposure apparatus, a liquid is held between the projection optical system and the substrate held on the substrate stage.
US Patent Application Publication No. 2004/0211920 US Patent Application Publication No. 2006/0023186

  When the substrate stage is moved while the liquid is held between the projection optical system and the substrate stage (substrate), for example, the movement speed of the substrate stage is limited in order to suppress the outflow, the remaining, etc. of the liquid. there is a possibility. The exposure apparatus is required to improve the throughput. Therefore, it is desired to devise a technique capable of improving the throughput even when the moving speed of the substrate stage in a state where the liquid is held with the projection optical system is limited.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can improve throughput. Another object of the present invention is to provide a device manufacturing method capable of improving productivity.

  According to the first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, and the liquid is held between the optical member having an emission surface for emitting the exposure light and the optical member. The movement of the first member is controlled so that the movement speed is different between the first state in which the liquid can be moved between the first member and the optical member, and the first state in which the liquid is held and the second state in which the liquid is not held. And an exposure apparatus including the control device.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein the liquid is held between an optical member having an exit surface for emitting the exposure light. And an exposure method that varies the moving speed of the first member between the first state and the second state, including moving the first member within a predetermined region so as to change depending on the second state that is not held. The

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the third aspect and developing the exposed substrate.

  According to the present invention, the throughput of exposure processing can be improved. Further, according to the present invention, the productivity of the device can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX1 according to the first embodiment. The exposure apparatus EX1 of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In this embodiment, the exposure apparatus EX1 is movable while holding the substrate P as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. An exposure apparatus that includes a substrate stage 2 and a measurement stage 3 that is movable without mounting a substrate P and a measuring instrument that can perform predetermined measurement related to exposure and a measuring member S (S1 to S3). A case will be described as an example.

  In FIG. 1, an exposure apparatus EX1 includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and a predetermined measurement related to exposure without holding the substrate P. A measuring stage 3 that can be moved by mounting a measuring instrument and a measuring member S, a first drive system 4 that includes an actuator such as a linear motor that moves the mask stage 1, a substrate stage 2 and a measuring stage 3. A second moving system 5 that includes an actuator such as a moving linear motor, an illumination system IL that illuminates the mask M with the exposure light EL, and a projection that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P. The optical system PL, the liquid immersion member 6 capable of forming the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ, and the positions of the stages 1, 2, and 3. An interferometer system 7 for measuring the information, and a control unit 8 for controlling the exposure apparatus EX1 entire operation.

  The immersion space LS is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ. In the present embodiment, the immersion space LS is such that the optical path of the exposure light EL emitted from the terminal optical element 9 closest to the image plane of the projection optical system PL is the liquid LQ among the plurality of optical elements of the projection optical system PL. Formed to be filled. The last optical element 9 has an exit surface 10 that emits the exposure light EL toward the image plane of the projection optical system PL. During the exposure of the substrate P, the immersion space LS is filled with the liquid LQ in the optical path of the exposure light EL between the terminal optical element 9 and the substrate P disposed to face the exit surface 10 of the terminal optical element 9. Formed to be.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask in which a predetermined pattern is formed on a transparent plate such as a glass plate using a light shielding film such as chromium. A reflective mask can also be used as the mask M. The substrate P is a substrate for manufacturing a device. The substrate P includes a base material such as a semiconductor wafer such as a silicon wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). In addition, a protective film called a top coat film for protecting the photosensitive film from the liquid LQ may be formed on the photosensitive film.

The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 has a mask holding unit 11 that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 11 holds the mask M so that the pattern formation surface (lower surface) of the mask M and the XY plane are substantially parallel. The mask stage 1 can move in the XY plane while holding the mask M by the operation of the first drive system 4. In the present embodiment, the mask stage 1 is movable in three directions, ie, the X axis, the Y axis, and the θZ direction, with the mask M held by the mask holding unit 11.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The plurality of optical elements of the projection optical system PL are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is substantially parallel to the Z axis. Further, the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 has a substrate holding part 12 that holds the substrate P in a releasable manner. In the present embodiment, the substrate holding unit 12 holds the substrate P so that the exposure surface (front surface) of the substrate P and the XY plane are substantially parallel. The substrate stage 2 has an upper surface 13 disposed around the substrate holding unit 12. The upper surface 13 of the substrate stage 2 is substantially parallel to the XY plane. In the present embodiment, the surface of the substrate P held by the substrate holding part 12 and the upper surface 13 of the substrate stage 2 are arranged in substantially the same plane (substantially flush). The substrate stage 2 can move in the XY plane while holding the substrate P by the operation of the second drive system 5. In the present embodiment, the substrate stage 2 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions with the substrate P held by the substrate holder 12.

  The measurement stage 3 has a measurement member holding portion 14 that holds the measurement member S so as to be releasable. In the present embodiment, the measurement member holding unit 14 holds the measurement member S so that the surface of the measurement member S and the XY plane are substantially parallel. The measurement stage 3 has an upper surface 15 disposed around the measurement member holding unit 14. The upper surface 15 of the measurement stage 3 is substantially parallel to the XY plane. In the present embodiment, the surface of the measurement member S held by the measurement member holding portion 14 and the upper surface 15 of the measurement stage 3 are arranged in substantially the same plane (substantially flush). The measurement stage 3 is mounted with the measurement member S and can move in the XY plane by the operation of the second drive system 5. In the present embodiment, the measurement stage 3 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions while the measurement member S is held by the measurement member holding unit 14. .

  The interferometer system 7 measures positional information of the mask stage 1, the substrate stage 2, and the measurement stage 3 in the XY plane. The interferometer system 7 includes a laser interferometer 7A that measures position information of the mask stage 1 in the XY plane, and a laser interferometer 7B that measures position information of the substrate stage 2 and the measurement stage 3 in the XY plane. Yes. The laser interferometer 7A irradiates measurement light onto the reflection surface 1R disposed on the mask stage 1, and uses the measurement light via the reflection surface 1R to mask the mask stage 1 (X-axis, Y-axis, and θZ directions). The position information of the mask M) is measured. The laser interferometer 7B irradiates the reflection surface 2R disposed on the substrate stage 2 with measurement light, and uses the measurement light via the reflection surface 2R to use the substrate stage 2 (X-axis, Y-axis, and θZ directions). The position information of the substrate P) is measured. Further, the laser interferometer 7B irradiates the reflection surface 3R disposed on the measurement stage 3 with measurement light, and uses the measurement light via the reflection surface 3R to measure the X axis, the Y axis, and the θZ direction. 3 (Measurement member S) position information is measured.

  In the present embodiment, a focus / leveling detection system (not shown) for detecting position information on the surface of the substrate P held on the substrate stage 2 is disposed. The focus / leveling detection system detects position information on the surface of the substrate P in the Z-axis, θX, and θY directions.

  In the present embodiment, a first alignment system 51 and a second alignment system 52 are arranged. The first alignment system 51 is disposed in the vicinity of the mask stage 1. The second alignment system 52 is disposed in the vicinity of the tip of the projection optical system PL. The first alignment system 51 is a TTR (Through The Reticle) type alignment system using light of an exposure wavelength, and is provided on the measurement stage 3 so as to correspond to the alignment mark on the mask M and the alignment mark. The conjugate image of the first fiducial mark FM1 through the projection optical system PL is simultaneously observed. The first alignment system 51 of this embodiment irradiates light with a mark as disclosed in, for example, US Pat. No. 5,646,413, and performs image processing on the image data of the mark captured by an image sensor such as a CCD. A VRA (Visual Reticle Alignment) method for detecting the position of the mark is adopted. The second alignment system 52 is an off-axis alignment system, and detects an alignment mark on the substrate P, a second reference mark FM2 provided on the measurement stage 3, and the like. The second alignment system 52 of the present embodiment irradiates the mark with broadband light that does not expose the photosensitive film on the substrate P as disclosed in, for example, US Pat. No. 5,493,403, and reflects light from the mark. The image of the mark formed on the light receiving surface and the image of the index (the index mark on the index plate provided in the second alignment system 52) are imaged using an image sensor such as a CCD, and the image signals An FIA (Field Image Alignment) type alignment system that measures the position of the mark by image processing is employed.

  The liquid immersion member 6 is disposed in the vicinity of the last optical element 9. The liquid immersion member 6 can hold the liquid LQ between the object disposed at a position facing the exit surface 10 of the last optical element 9. The position facing the emission surface 10 includes the irradiation position of the exposure light EL emitted from the emission surface 10. In the present embodiment, the liquid immersion member 6 has a lower surface 16, and an object that can face the emission surface 10 can face the lower surface 16. When the surface of the object is disposed at a position facing the emission surface 10, at least a part of the lower surface 16 and the surface of the object are opposed. When the exit surface 10 and the surface of the object face each other, the last optical element 9 can hold the liquid LQ between the exit surface 10 and the surface of the object. Further, when the lower surface 16 and the surface of the object face each other, the liquid immersion member 6 can hold the liquid LQ between the lower surface 16 and the surface of the object. The liquid immersion member 6 holds the liquid LQ between the object and the optical path of the exposure light EL between the exit surface 10 of the last optical element 9 and the object disposed at a position facing the exit surface 10. The immersion space LS is formed so that is filled with the liquid LQ. That is, the liquid immersion space LS is formed by the liquid LQ held between the emission surface 10 and the lower surface 16 and the surface of the object.

  In the present embodiment, the object that can face the emission surface 10 includes an object that can move within a predetermined plane including the irradiation position of the exposure light EL. In the present embodiment, the object includes at least one of the substrate stage 2 and the measurement stage 3. The object includes a substrate P held on the substrate stage 2. The object includes a measurement member S mounted on the measurement stage 3. Therefore, the liquid immersion member 6 can hold the liquid LQ between at least one of the substrate stage 2 and the measurement stage 3. Each of the substrate stage 2 and the measurement stage 3 can hold the liquid LQ between the terminal optical element 9 and the liquid immersion member 6.

  In the present embodiment, each of the substrate stage 2 and the measurement stage 3 is movable on the guide surface 18 of the base member (surface plate) 17. In the present embodiment, the guide surface 18 is substantially parallel to the XY plane. The substrate stage 2 is movable within a predetermined region of the guide surface 18 including the irradiation position of the exposure light EL in the XY plane. The measurement stage 3 can move within a predetermined region of the guide surface 18 including the irradiation position of the exposure light EL within the XY plane. The substrate stage 2 can move independently of the measurement stage 3.

  In the present embodiment, the immersion space LS is formed such that a partial region (local region) on the surface of the substrate P disposed at a position facing the emission surface 10 and the lower surface 16 is covered with the liquid LQ. The interface (meniscus, edge) of the liquid LQ is formed between the surface of the substrate P and the lower surface 16. That is, in the present embodiment, the exposure apparatus EX1 sets the immersion space LS so that a part of the region on the substrate P including the projection region PR of the projection optical system PL is covered with the liquid LQ when the substrate P is exposed. Adopt the local immersion method to be formed.

  FIG. 2 is a side sectional view showing the vicinity of the liquid immersion member 6. In the present embodiment, the liquid immersion member 6 is an annular member. The liquid immersion member 6 is disposed around the last optical element 9. The liquid immersion member 6 has an opening 6K at a position facing the emission surface 10. The exposure light EL emitted from the emission surface 10 can pass through the opening 6K.

  The liquid immersion member 6 includes a supply port 19 that can supply the liquid LQ and a recovery port 20 that can recover the liquid LQ. The supply port 19 can supply the liquid LQ to the optical path of the exposure light EL emitted from the emission surface 10 in order to form the immersion space LS. The recovery port 20 can recover the liquid LQ on the object arranged at a position facing the lower surface 16 of the liquid immersion member 6. As described above, the object that can face the lower surface 16 includes at least one of the substrate stage 2 and the measurement stage 3, and the recovery port 20 is at least one of the substrate stage 2 and the measurement stage 3 that faces the lower surface 16. The liquid LQ can be recovered.

  The supply port 19 is disposed at a predetermined position of the liquid immersion member 6 facing the optical path in the vicinity of the optical path of the exposure light EL. The supply port 19 is connected to the liquid supply device 22 via the flow path 21. The liquid supply device 22 can deliver a clean and temperature-adjusted liquid LQ. The flow path 21 includes a supply flow path formed inside the liquid immersion member 6 and a flow path formed by a supply pipe that connects the supply flow path and the liquid supply device 22. The liquid LQ delivered from the liquid supply device 22 is supplied to the supply port 19 via the flow path 21. The supply port 19 supplies the liquid LQ from the liquid supply device 22 to the optical path of the exposure light EL.

  The collection port 20 is disposed around the opening 6K. The recovery port 20 is disposed at a predetermined position of the liquid immersion member 6 that faces the surface of the object. In the present embodiment, a plate-like porous member 23 including a plurality of holes (openings or pores) is disposed in the recovery port 20. The porous member 23 includes a mesh filter in which a large number of small holes are formed in a mesh shape. In the present embodiment, at least a part of the lower surface 16 of the liquid immersion member 6 is constituted by the lower surface of the porous member 23. The recovery port 20 is connected to the liquid recovery device 25 via the flow path 24. The liquid recovery device 25 includes a vacuum system, and can recover the liquid LQ by suction. The flow path 24 includes a recovery flow path formed inside the liquid immersion member 6 and a flow path formed by a recovery pipe that connects the recovery flow path and the liquid recovery device 25. The liquid LQ recovered from the recovery port 20 (hole of the porous member 23) is recovered to the liquid recovery device 25 via the flow path 24.

  In the present embodiment, the control device 8 executes the liquid recovery operation using the liquid recovery device 25 and the recovery port 20 in parallel with the liquid supply operation using the liquid supply device 22 and the supply port 19, thereby completing the terminal optical. An immersion space LS can be formed with the liquid LQ between the element 9 and the liquid immersion member 6 and an object facing the terminal optical element 9 and the liquid immersion member 6. During the exposure of the substrate P, the liquid immersion member 6 holds the liquid LQ with the substrate P so that the optical path of the exposure light EL emitted from the exit surface 10 of the last optical element 9 is filled with the liquid LQ.

  FIG. 3 is a plan view of the substrate stage 2, the measurement stage 3, and the second drive system 5 as viewed from above. In FIG. 3, the second drive system 5 includes a plurality of linear motors 30, 31, 32, 33, 34, and 35. The second drive system 5 includes a pair of Y-axis guide members 36 and 37 that are long in the Y-axis direction. Each of the Y-axis guide members 36 and 37 includes a coil unit having a plurality of coils. One Y-axis guide member 36 supports two slide members 38 and 39 so as to be movable in the Y-axis direction, and the other Y-axis guide member 37 can move two slide members 40 and 41 in the Y-axis direction. To support. Each of the slide members 38, 39, 40, 41 includes a magnet unit having a plurality of permanent magnets. That is, in this embodiment, the moving magnet type Y-axis linear motors 30 and 31 are formed by the slide members 38 and 39 including the magnet unit and the Y-axis guide member 36 including the coil unit. Similarly, the moving magnet type Y-axis linear motors 32 and 33 are formed by the slide members 40 and 41 having a magnet unit and the Y-axis guide member 37 having a coil unit.

  The second drive system 5 includes a pair of X-axis guide members 42 and 43 that are long in the X-axis direction. Each of the X-axis guide members 42 and 43 includes a coil unit having a plurality of coils. One X-axis guide member 42 supports the slide member 44 connected to the substrate stage 2 so as to be movable in the X-axis direction, and the other X-axis guide member 43 supports the slide member 45 connected to the measurement stage 3. It is supported so as to be movable in the X-axis direction. Each of the slide members 44 and 45 includes a magnet unit having a plurality of permanent magnets. That is, in this embodiment, the moving magnet type X that drives the substrate stage 2 in the X-axis direction by the slide member 44 having a magnet unit connected to the substrate stage 2 and the X-axis guide member 42 having a coil unit. A shaft linear motor 34 is formed. Similarly, a moving magnet type X-axis linear motor 35 for driving the measurement stage 3 in the X-axis direction by a slide member 45 having a magnet unit connected to the measurement stage 3 and an X-axis guide member 43 having a coil unit is provided. It is formed.

  The slide members 38 and 40 are fixed to one end and the other end of the X-axis guide member 42, and the slide members 39 and 41 are fixed to one end and the other end of the X-axis guide member 43, respectively. Therefore, the X-axis guide member 42 can be moved in the Y-axis direction by the Y-axis linear motors 30 and 32, and the X-axis guide member 43 can be moved in the Y-axis direction by the Y-axis linear motors 31 and 33.

  The control device 8 can control the position of the substrate stage 2 in the θZ direction by making the thrust generated by each of the pair of Y-axis linear motors 30 and 32 different. The position of the measurement stage 3 in the θZ direction can be controlled by differentiating the thrust generated by each of 33.

  Although not described in detail, the substrate stage 2 of the present embodiment includes a stage body driven by linear motors 30, 32, and 34, and a substrate table mounted on the stage body. A drive system that can move the substrate table in the Z-axis, θX, and θY directions with respect to the stage main body is disposed between the substrate table and the substrate table. The substrate table has a substrate holding part 12 and an upper surface 13. Therefore, the control device 8 can move the substrate P held on the upper surface 13 and the substrate holding part 12 in six directions including the X axis, Y axis, Z axis, θX, θY, and θZ directions.

  The measurement stage 3 of the present embodiment includes a stage main body driven by the linear motors 31, 33, and 35 and a measurement table mounted on the stage main body. Between the stage main body and the measurement table, A drive system capable of moving the measurement table in the Z-axis, θX, and θY directions with respect to the stage body is disposed. The measurement table has a measurement member holding part 14 and an upper surface 15. Therefore, the control device 8 can move the measurement member S held on the upper surface 15 and the measurement member holding portion 14 in six directions, that is, the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions.

  In the present embodiment, the measurement stage 3 has a measurement member S disposed on the upper surface 15. The measuring member S includes an optical component. In the present embodiment, the measurement member S includes three measurement members S1 to S3. In the present embodiment, the measurement member S1 is a part of an aerial image measurement system 46 that measures the imaging characteristics of the projection optical system PL as disclosed in, for example, US Patent Application Publication No. 2002/0041377. It is the measuring member which comprises. The measuring member S1 is irradiated with the exposure light EL emitted from the last optical element 9 through the liquid LQ. The exposure light EL that has passed through the measurement member S1 is received by, for example, a light receiving element disposed inside the measurement stage 3.

  The measurement member S2 is a measurement member constituting a part of the illuminance unevenness measurement system 47 as disclosed in, for example, US Pat. No. 4,465,368. The measuring member S2 is irradiated with the exposure light EL emitted from the last optical element 9 via the liquid LQ. The exposure light EL that has passed through the measurement member S2 is received by, for example, a light receiving element disposed inside the measurement stage 3.

  Note that the measurement member S2 disposed on the measurement stage 3 is a measurement for measuring the amount of variation in the transmittance of the exposure light EL of the projection optical system PL as disclosed in, for example, US Pat. No. 6,721,039. System, for example, a dose measurement system (illuminance measurement system) as disclosed in US 2002/0061469, for example wavefront aberration as disclosed in EP 1079223 It may constitute a part of a measurement system that measures information related to the exposure light EL, such as a measurement system.

  The measurement member S3 includes a first reference mark FM1 measured by the first alignment system 51 and a second reference mark FM2 measured by the second alignment system 52. In the present embodiment, the first reference mark FM1 is measured by the first alignment system 51 through the projection optical system PL and the liquid LQ in the immersion space LS, and the second reference mark FM2 is not through the liquid LQ. The second alignment system 52 measures.

  In the present embodiment, the surface of the substrate P held by the substrate holding unit 12, the upper surface 13 of the substrate stage 2, the surface of the measurement member S (S 1 to S 3) held by the measurement member holding unit 14, and the measurement stage 3. Each of the upper surfaces 15 can oppose the exit surface 10 of the last optical element 9 and the lower surface 16 of the liquid immersion member 6. In this embodiment, as disclosed in, for example, US Patent Application Publication No. 2006/0023186, etc., the control device 8 is configured such that at least one of the substrate stage 2 and the measurement stage 3 has a terminal optical element 9. And the upper surface 13 of the substrate stage 2 and the measurement stage in a state where the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are brought close to or in contact with each other so as to keep the liquid LQ between the liquid immersion member 6 and the liquid immersion member 6. 3, the substrate stage 2 and the measurement stage 3 with respect to the terminal optical element 9 and the liquid immersion member 6, with the lower surface 10 of the terminal optical element 9 and the lower surface 16 of the liquid immersion member 6 facing each other. Can be moved synchronously in the XY directions. Thereby, the immersion space LS of the liquid LQ can be moved between the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3. Thus, in the present embodiment, the liquid LQ held between the terminal optical element 9 and the liquid immersion member 6 by the relative movement of the substrate stage 2 and the measurement stage 3 with respect to the terminal optical element 9 and the liquid immersion member 6. Can be moved from one of the substrate stage 2 and the measurement stage 3 to the other.

  In the following description, the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are moved closer to each other in order to move the immersion space LS of the liquid LQ between the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3. In the state of contact, at least one of the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 and the lower surface 10 of the last optical element 9 and the lower surface 16 of the liquid immersion member 6 face each other, while the last optical element 9 and the liquid The operation of synchronously moving the substrate stage 2 and the measurement stage 3 with respect to the immersion member 6 in the XY directions is appropriately referred to as a scram sweep operation.

  In the present embodiment, when executing the scram sweep operation, the control device 8 causes the upper surface of the substrate stage 2 so that the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are arranged in substantially the same plane. The positional relationship between 13 and the upper surface 15 of the measurement stage 3 is adjusted.

  When the substrate P is exposed, the substrate P held on the substrate stage 2 is disposed so as to face the terminal optical element 9 and the liquid immersion member 6, and the optical path between the terminal optical element 9 and the liquid immersion member 6 and the substrate P is disposed. Is filled with liquid LQ. When the substrate P is exposed, the position information of the mask stage 1 is measured by the laser interferometer 7A, the position information of the substrate stage 2 is measured by the laser interferometer 7B, and the position information of the surface of the substrate P is detected by focus / leveling detection. Detected by the system. The control device 8 operates the first drive system 4 based on the measurement result of the laser interferometer 7 </ b> A, and executes the position control of the mask M held on the mask stage 1. Further, the control device 8 operates the second drive system 5 based on the measurement result of the laser interferometer 7B and the detection result of the focus / leveling detection system to control the position of the substrate P held on the substrate stage 2. Execute.

  Further, during measurement using the measurement member S, the measurement member S mounted on the measurement stage 3 is arranged to face the terminal optical element 9 and the liquid immersion member 6, and the terminal optical element 9, the liquid immersion member 6 and the measurement member are arranged. The optical path between S and S is filled with the liquid LQ. Further, during measurement using the measurement member S, the position information of the measurement stage 3 is measured by the laser interferometer 7B, and the position information of the surface of the measurement member S is detected by the focus / leveling detection system. The control device 8 operates the second drive system 5 based on the measurement result of the laser interferometer 7B and the detection result of the focus / leveling detection system, and executes position control of the measurement member S mounted on the measurement stage 3. To do.

  In the present embodiment, the substrate stage 2 changes between a first state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and a second state in which the liquid LQ is not held. Similarly, the measurement stage 3 changes between a first state in which the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and a second state in which the liquid LQ is not held.

  In the present embodiment, each of the substrate stage 2 and the measurement stage 3 holds the liquid LQ between the terminal optical element 9 and the liquid immersion member 6 when arranged at positions facing the emission surface 10 and the lower surface 16. Is possible. In the present embodiment, the first state of the substrate stage 2 includes a state in which the substrate stage 2 is disposed facing the terminal optical element 9 and the liquid immersion member 6, and the first state of the measurement stage 3 is the measurement stage 3. Includes a state where the terminal optical element 9 and the liquid immersion member 6 are opposed to each other. That is, in the present embodiment, the first state includes a state in which at least one of the substrate stage 2 and the measurement stage 3 is disposed to face the terminal optical element 9 and the liquid immersion member 6.

  Specifically, the first state of the substrate stage 2 is that the substrate stage 2 is exposed to the terminal optical element 9 and the liquid immersion member 6 in order to expose the substrate P on the substrate stage 2 with the exposure light EL via the liquid LQ. Including the state of being opposed to each other. Further, the first state of the measurement stage 3 is that the measurement stage 3 faces the terminal optical element 9 and the liquid immersion member 6 in order to irradiate the measurement light S on the measurement stage 3 with the exposure light EL via the liquid LQ. Including the state of being placed.

  In the present embodiment, the first state moves the liquid LQ in the immersion space LS held between the last optical element 9 and the immersion member 6 from one of the substrate stage 2 and the measurement stage 3 to the other. In order to do so, this includes a state in which the substrate stage 2 and the measurement stage 3 are brought close to or in contact with each other. Specifically, in the first state, during the scram sweep operation, at least one of the substrate stage 2 and the measurement stage 3 causes the liquid LQ in the liquid immersion space LS to flow between the terminal optical element 9 and the liquid immersion member 6. Includes holding state. In other words, the first state includes a state in which the liquid LQ in the immersion space LS is in contact with at least one of the substrate stage 2 and the measurement stage 3 during the scram sweep operation.

  The second state of the substrate stage 2 includes a state where the substrate stage 2 is disposed at a position not facing the emission surface 10 and the lower surface 16, and the second state of the measurement stage 3 is disposed at a position not opposed to the emission surface 10 and the lower surface 16. Including

  Specifically, in the second state of the substrate stage 2, the substrate stage 2 is disposed at a position that does not face the emission surface 10 and the lower surface 16, and the liquid is placed between the terminal optical element 9 and the liquid immersion member 6 and the measurement stage 3. Including the state in which LQ is held. The second state of the measurement stage 3 is that the measurement stage 3 is disposed at a position not facing the emission surface 10 and the lower surface 16, and the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the substrate stage 2. Including

  In the present embodiment, the control device 8 performs a scram sweep operation so that at least one of the substrate stage 2 and the measurement stage 3 continues to hold the liquid LQ between the terminal optical element 9 and the liquid immersion member 6. Thus, one of the substrate stage 2 and the measurement stage 3 can be changed from the first state to the second state, and the other can be changed from the second state to the first state.

  In the present embodiment, the control device 8 controls the movement of the substrate stage 2 so that the movement speed differs between the first state and the second state. In the present embodiment, the control device 8 controls the movement of the substrate stage 2 so that the movement speed in the second state is higher than the movement speed in the first state.

  Further, in the present embodiment, the control device 8 controls the movement of the measurement stage 3 so that the movement speed is different between the first state and the second state. In the present embodiment, the control device 8 controls the movement of the measurement stage 3 so that the movement speed in the second state is higher than the movement speed in the first state.

  Thus, in this embodiment, the movement speed in the second state is higher than the movement speed in the first state. That is, the movement speed in the first state is lower than the movement speed in the second state.

  The moving speed of the substrate stage 2 in the first state includes a maximum speed at which the liquid LQ is prevented from flowing out and remaining when the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6.

  When the substrate stage 2 is moved at high speed while the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the substrate stage 2, the last optical element 9, the liquid immersion member 6, and the substrate stage 2 In the meantime, it becomes difficult to keep the liquid LQ well, and there is a possibility that the liquid LQ may flow out or remain on the substrate stage 2 for example. Therefore, the moving speed (maximum speed) in the first state of the substrate stage 2 is set to a value that can suppress the outflow and remaining of the liquid LQ.

  In the present embodiment, the moving speed (maximum speed) of the substrate stage 2 in the first state is determined according to the state of the upper surface 13 of the substrate stage 2 in contact with the liquid LQ. The state of the upper surface 13 includes a contact angle with the liquid LQ. For example, when the contact angle between the upper surface 13 and the liquid LQ is high, the moving speed (maximum speed) of the substrate stage 2 can be increased within a range in which the outflow and remaining of the liquid LQ can be suppressed as compared with the case where the contact angle is low. . Note that the maximum speed can be obtained in advance by, for example, experiments or simulations.

  Similarly, the moving speed of the measurement stage 3 in the first state includes the maximum speed at which the liquid LQ is prevented from flowing out and remaining when the liquid LQ is held between the last optical element 9 and the liquid immersion member 6. It can be determined according to the state of the upper surface 15 of the measurement stage 3 in contact with the liquid LQ (contact angle with the liquid LQ).

  Further, as described above, in the present embodiment, the substrate stage 2 can be changed between the first state and the second state by the scram sweep operation with the measurement stage 3. The moving speed of the substrate stage 2 in the first state includes the moving speed immediately after the change from the second state to the first state. Further, the movement speed of the substrate stage 2 in the second state includes the movement speed immediately after the change from the first state to the second state.

  Similarly, the moving speed of the measurement stage 3 in the first state includes the moving speed immediately after the change from the second state to the first state. Further, the movement speed of the measurement stage 3 in the second state includes the movement speed immediately after the change from the first state to the second state.

  Next, an example of the operation of the exposure apparatus EX1 having the above-described configuration will be described with reference to the schematic diagrams of FIGS. In the present embodiment, a plurality of substrates P are sequentially loaded (carried in) into the substrate holder 12 and a predetermined process is executed. In this embodiment, the control device 8 moves the substrate stage 2 to the substrate exchange position when loading (loading) the substrate P into the substrate holding unit 12 or when unloading (unloading) the substrate P from the substrate holding unit 12. Move to. In the present embodiment, a transport system 48 capable of executing at least one of loading and unloading of the substrate P is disposed on the substrate holding unit 12 of the substrate stage 2 moved to the substrate replacement position. The control device 8 uses the transport system 48 to unload (carry out) the exposed substrate P from the substrate stage 2 (substrate holding unit 12) moved to the substrate replacement position, and to be exposed next. Substrate replacement processing including an operation of loading (carrying in) the substrate P before exposure onto the substrate stage 2 (substrate holding unit 12) can be executed.

  In the following description, the position facing the exit surface 10 of the last optical element 9, that is, the irradiation position of the exposure light EL emitted from the exit surface 10 is appropriately referred to as a first position PJ1, and the substrate replacement position is appropriately determined. This is referred to as a second position PJ2. The first position PJ1 and the second position PJ2 are different positions.

  Further, in the following description, the case where the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are brought into contact with each other during the scram sweep operation will be described as an example. For example, when the surface tension of the liquid LQ suppresses the penetration of the liquid LQ between the upper surface 13 and the upper surface 15 or the leakage of the liquid LQ between the upper surface 13 and the upper surface 15, the upper surface 13 The scram sweep operation may be executed in a state where a predetermined gap is formed between the upper surface 15 and the upper surface 15.

  As shown in FIG. 4, the control device 8 moves the substrate stage 2 to the second position PJ <b> 2 in order to load (carry in) the substrate P before exposure onto the substrate stage 2. The control device 8 uses the transport system 48 to load the substrate P before exposure onto the substrate holder 12 of the substrate stage 2. The substrate P loaded on the substrate holding unit 12 is held by the substrate holding unit 12.

  When the substrate stage 2 is disposed at the second position PJ2, the measurement stage 3 is disposed at the first position PJ1, and the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the measurement stage 3. The The control apparatus 8 performs various measurements using at least one of the measurement members S (measurement devices) mounted on the measurement stage 3 as necessary. For example, the control device 8 uses the interferometer system 7 including the laser interferometer 7B to measure the position information of the measurement stage 3, and the irradiation position (projection optical system PL) of the exposure light EL emitted from the emission surface 10. ) Is measured using the aerial image measurement system 46, and the position of the second fiducial mark FM 2 is measured using the second alignment system 52. The control device 8 has information on the positional relationship between the irradiation position of the exposure light EL and the detection reference position of the second alignment system 52 based on the measurement result of the aerial image measurement system 46 and the measurement result of the second alignment system 52. That is, baseline information is acquired. When performing measurement using the aerial image measurement system 46, the liquid LQ is held between the last optical element 9 and the measurement member S1. Further, the control device 8 can perform various adjustments (calibration) based on the measurement result after measuring the imaging characteristics of the projection optical system PL using the aerial image measurement system 46. For example, adjustment of the imaging characteristics of the projection optical system PL is executed based on the measurement result of the aerial image measurement system 46.

  As shown in FIG. 4, the state in which the measurement stage 3 is disposed at the first position PJ1 and the substrate stage 2 is disposed at the second position PJ2 is the second state of the substrate stage 2, and 1 state.

  The moving speed of the measurement stage 3 in the first state is determined to be equal to or lower than the maximum speed Vm13 at which the liquid LQ is suppressed from flowing out and remaining when the liquid LQ is held between the last optical element 9 and the liquid immersion member 6. . The moving speed (maximum speed) Vm13 in the first state of the measurement stage 3 is determined according to the state of the upper surface 15. The maximum speed Vm13 is desirably as high as possible within a range in which the outflow and residual of the liquid LQ can be suppressed.

  On the other hand, the moving speed (maximum speed) Vm22 in the second state of the substrate stage 2 is determined according to, for example, the driving capability of the second driving system 5 or the like. The maximum speed Vm22 is desirably as high as possible.

  After the measurement using the measurement stage 3 is finished and the loading of the substrate P onto the substrate stage 2 is finished, the control device 8 keeps the measurement stage 3 at the first position PJ1 and the upper surface 15 of the measurement stage 3 and the substrate. The upper surface 13 of the stage 2 is brought into contact. That is, the control device 8 contacts the upper surface 15 and the upper surface 13 from the second position PJ2 in order to bring the upper surface 13 of the substrate stage 2 in the second state into contact with the upper surface 15 of the measurement stage 3 in the first state. The substrate stage 2 in the second state is moved to the position at the first speed V1. Thereby, as shown in FIG. 5, the upper surface 15 of the measurement stage 3 in the first state and the upper surface 13 of the substrate stage 2 in the second state are in contact with each other.

  In the present embodiment, the first speed V1 includes a maximum speed Vm22. Thereby, the upper surface 15 of the measurement stage 3 and the upper surface 13 of the substrate stage 2 can be brought into quick contact.

  In the present embodiment, the control device 8 changes the movement speed of the substrate stage 2 from the first speed V1 to the second speed V2 lower than the first speed V1 immediately before the upper surface 15 and the upper surface 13 come into contact with each other. Change. That is, the control device 8 does not hold the liquid LQ between the last optical element 9 and the liquid immersion member 6 and immediately before changing from the state not in contact with the measurement stage 3 to the state in contact with the measurement stage 3. In addition, the moving speed of the substrate stage 2 is lowered.

  Next, the control device 8 performs a scram sweep operation in order to move the immersion space LS from the upper surface 15 of the measurement stage 3 to the upper surface 13 of the substrate stage 2. The control device 8 synchronously moves the substrate stage 2 and the measurement stage 3 in the + Y direction while the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are in contact with each other.

  Thus, as shown in FIG. 5, from the state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the measurement stage 3, as shown in FIG. After the liquid LQ is held between the liquid immersion member 6 and the measurement stage 3 and the substrate stage 2, as shown in FIG. 7, between the last optical element 9 and the liquid immersion member 6 and the substrate stage 2. To the state where the liquid LQ is held. That is, a state in which both the liquid LQ and the measurement stage 3 and the substrate stage 2 are in contact with each other from the state in which the liquid LQ and the substrate stage 2 are not in contact with each other and the liquid LQ and the measurement stage 3 are in contact with each other. As a result, the liquid LQ and the measurement stage 3 are not in contact with each other, and the liquid LQ and the substrate stage 2 are in contact with each other.

  Thereby, the measurement stage 3 changes from the first state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 to the second state in which the liquid LQ is not held, and the substrate stage 2 is changed to the terminal optical. The second state in which the liquid LQ is not held between the element 9 and the liquid immersion member 6 is changed to the first state in which the liquid LQ is held.

  At the time of the scram sweep operation for moving the immersion space LS from the upper surface 15 of the measurement stage 3 to the upper surface 13 of the substrate stage 2, the control device 8 operates at the third speed V3 lower than the first speed V1. The substrate stage 2 is moved synchronously. In the present embodiment, the third speed V3 is substantially the same speed as the second speed V2. Note that the third speed V3 may be lower than the second speed V2. The third speed V3 may be lower than the first speed V1 and higher than the second speed V2.

  The third speed V3 is determined according to the upper surface 15 of the measurement stage 3 and the upper surface 13 of the substrate stage 2 that are in contact with the liquid LQ. As described above, the state of the upper surfaces 13 and 15 includes a contact angle with the liquid LQ. The control device 8 sets the third speed V3 so that the moving speed is as high as possible within a range in which the outflow and the remaining of the liquid LQ can be suppressed, and the measurement stage 3 and the substrate stage 2 at the third speed V3. And move synchronously.

In the present embodiment, the third speed V3 is substantially constant during a scram sweep operation for moving the immersion space LS from the upper surface 15 of the measurement stage 3 to the upper surface 13 of the substrate stage 2. At the time of scram sweep operation, the moving speed V3 ₁ in a state where the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the measurement stage 3, the last optical element 9 and the liquid immersion member 6 the liquid LQ is held between the moving speed V3 ₂ in a state in which the liquid LQ is held between the measurement stage 3 and the substrate stage 2, and the last optical element 9 and the liquid immersion member 6 and the substrate stage 2 the moving speed V3 ₃ in it which states may be different. For example, the moving speed V3 ₁ is outflow of the liquid LQ, to the extent that the remaining can be suppressed, so that high moving speed as possible, can be determined according to the state of the top surface 15. Further, the moving speed V3 ₂ is outflow of the liquid LQ, to the extent that the remaining can be suppressed, so that high moving speed as possible, can be determined according to the state of the top surface 13 and top surface 15. Further, the moving speed V3 ₃ is the outflow of the liquid LQ, as to the extent that the remaining can be suppressed, so long as a high moving speed possible, can be determined according to the state of the top surface 13.

  The scram sweep operation changes the substrate stage 2 to the first state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6, and the measurement stage 3 is between the terminal optical element 9 and the liquid immersion member 6. Then, after changing to the second state in which the liquid LQ is not held, the control device 8 changes the moving speed of the measurement stage 3 from the third speed V3 to the fourth speed V4 higher than the third speed V3. The control device 8 increases the movement speed of the measurement stage 3 from the third speed V3 to the fourth speed V4 immediately after the measurement stage 3 changes from the first state to the second state.

  In the present embodiment, the control device 8 synchronously moves the substrate stage 2 and the measurement stage 3 at the third speed V3, changes the measurement stage 3 from the first state to the second state, and moves the substrate stage 2 to the first state. After changing from the second state to the first state, the substrate stage 2 and the measurement stage 3 are separated, the acceleration of the measurement stage 3 is started in a state where the substrate stage 2 is maintained in the first state, and the measurement stage 3 is moved. The speed is set to the fourth speed V4.

  Thereby, as shown in FIG. 8, the substrate stage 2 is disposed at the first position PJ <b> 1, and the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the substrate stage 2. Further, the measurement stage 3 is arranged at a predetermined standby position away from the substrate stage 2. In the following description, the predetermined standby position of the measurement stage 3 is appropriately referred to as a third position PJ3.

  The state where the measurement stage 3 is arranged at the third position PJ3 and the substrate stage 2 is arranged at the first position PJ1 is the first state of the substrate stage 2 and the second state of the measurement stage 3.

  The moving speed in the first state of the substrate stage 2 is set to a maximum speed Vm12 or less at which the liquid LQ is prevented from flowing out and remaining when the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6. . The moving speed (maximum speed) Vm12 in the first state of the substrate stage 2 is determined according to the state of the upper surface 13. The maximum speed Vm12 is determined according to the state of the surface of the substrate P. The state of the surface of the substrate P includes a contact angle with the liquid LQ. The maximum speed Vm12 is desirably as high as possible within a range in which the outflow and residual of the liquid LQ can be suppressed.

In the present embodiment, the moving speed of the substrate stage 2 in the first state is such that the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the upper surface 13 and the terminal optical element 9 and the liquid immersion member 6. When the liquid LQ is held between the substrate and the surface of the substrate P, the maximum speed Vm12 is set so that the outflow and the residual of the liquid LQ are suppressed. Note that the maximum speed VM 12 ₁ when the liquid LQ between the final optical element 9 and the liquid immersion member 6 and the upper surface 13 is held, with the last optical element 9 and the liquid immersion member 6 and the front surface of the substrate P the maximum speed VM 12 ₂ when the liquid LQ is held, may be at the same rate, or at different rates.

  On the other hand, the moving speed (maximum speed) Vm23 in the second state of the measurement stage 3 is determined according to, for example, the driving capability of the second driving system 5. The maximum speed Vm23 is desirably as high as possible.

  In the present embodiment, the maximum speed Vm22 of the substrate stage 2 in the second state is higher than the maximum speed Vm12 of the substrate stage 2 in the first state. Further, the maximum speed Vm23 of the measurement stage 3 in the second state is higher than the maximum speed Vm13 of the measurement stage 3 in the first state.

  After the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the substrate stage 2, the control device 8 starts liquid immersion exposure of the substrate P. The control device 8 starts an alignment process for the substrate P held by the substrate holding unit 12. The control device 8 moves the substrate stage 2 in the X and Y directions, and sequentially arranges a plurality of alignment marks provided so as to correspond to the shot regions on the substrate P in the detection region of the second alignment system 52. Then, the control device 8 measures the position information of the substrate stage 2 using the interferometer system 7 including the laser interferometer 7B, and uses the second alignment system 52 to mark a plurality of alignment marks on the substrate P. Then, the liquid LQ is sequentially detected without going through the liquid LQ. Thereby, the control device 8 can obtain the position information of the alignment mark on the substrate P in the coordinate system defined by the interferometer system 7.

  At a predetermined timing, the position information of the surface of the substrate P held by the substrate holding unit 12 is detected by the focus / leveling detection system.

  Then, the control device 8 controls the position of the substrate P on the substrate stage 2 based on the position information on the surface of the substrate P and the position information on the alignment marks on the substrate P, and the liquid for a plurality of shot regions on the substrate P Perform immersion exposure. In order to expose the shot area on the substrate P, the control device 8 emits exposure light EL from the illumination system IL. The exposure light EL emitted from the illumination system IL illuminates the mask M. The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  The exposure apparatus EX1 of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P synchronously in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 8 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are scanned in the XY plane intersecting the optical path (optical axis AX) of the exposure light EL. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction.

  In addition, the control apparatus 8 is the state in which the substrate stage 2 and the measurement stage 3 are brought close to or in contact with each other during the measurement of the alignment mark on the substrate P using the second alignment system 52 or during the exposure of the substrate P. 2 and the measurement stage 3 can be moved synchronously in the XY directions.

  After the immersion exposure of the substrate P is completed, the controller 8 brings the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 into contact with the substrate stage 2 placed at the first position PJ1. That is, the control device 8 contacts the upper surface 13 and the upper surface 15 from the third position PJ3 in order to bring the upper surface 15 of the measurement stage 3 in the second state into contact with the upper surface 13 of the substrate stage 2 in the first state. The measurement stage 3 in the second state is moved to the position at the fifth speed V5. As a result, as shown in FIG. 9, the upper surface 13 of the substrate stage 2 in the first state and the upper surface 15 of the measurement stage 3 in the second state come into contact with each other.

  In the present embodiment, the fifth speed V5 includes the maximum speed Vm23. Thereby, the upper surface 15 of the measurement stage 3 and the upper surface 13 of the substrate stage 2 can be brought into quick contact.

  In the present embodiment, the control device 8 changes the moving speed of the measurement stage 3 from the fifth speed V5 to the sixth speed V6 that is lower than the fifth speed V5 immediately before the upper surface 15 and the upper surface 13 contact each other. Change. That is, the control device 8 does not hold the liquid LQ between the last optical element 9 and the liquid immersion member 6 and immediately before changing from the state not in contact with the substrate stage 2 to the state in contact with the substrate stage 2. In addition, the moving speed of the measuring stage 3 is lowered.

  Next, the control device 8 performs a scram sweep operation to move the immersion space LS from the upper surface 13 of the substrate stage 2 to the upper surface 15 of the measurement stage 3. The control device 8 synchronously moves the substrate stage 2 and the measurement stage 3 in the −Y direction in a state where the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are in contact with each other.

  As a result, as shown in FIG. 9, from the state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the substrate stage 2 as shown in FIG. After the liquid LQ is held between the liquid immersion member 6 and the substrate stage 2 and the measurement stage 3, as shown in FIG. 11, between the last optical element 9 and the liquid immersion member 6 and the measurement stage 3. To the state in which the liquid LQ is held. That is, a state in which both the liquid LQ and the substrate stage 2 and the measurement stage 3 are in contact from the state in which the liquid LQ and the measurement stage 3 are not in contact with each other and the liquid LQ and the substrate stage 2 are in contact with each other. As a result, the liquid LQ and the substrate stage 2 are not in contact with each other, and the liquid LQ and the measurement stage 3 are in contact with each other.

  As a result, the substrate stage 2 changes from the first state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 to the second state in which the liquid LQ is not held. The second state in which the liquid LQ is not held between the element 9 and the liquid immersion member 6 is changed to the first state in which the liquid LQ is held.

  At the time of the scram sweep operation for moving the immersion space LS from the upper surface 13 of the substrate stage 2 to the upper surface 15 of the measurement stage 3, the control device 8 operates at the seventh speed V7, which is lower than the fifth speed V5, The measurement stage 3 is moved synchronously. In the present embodiment, the seventh speed V7 is substantially the same speed as the sixth speed V6. Note that the seventh speed V7 may be lower than the sixth speed V6. The seventh speed V7 may be lower than the fifth speed V5 and higher than the sixth speed V6.

  The seventh speed V7 is determined according to the upper surface 13 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 that are in contact with the liquid LQ. As described above, the state of the upper surfaces 13 and 15 includes a contact angle with the liquid LQ. The control device 8 sets the seventh speed V7 so that the moving speed is as high as possible within a range in which the outflow and the remaining of the liquid LQ can be suppressed, and the substrate stage 2 and the measurement stage 3 are set at the seventh speed V7. And move synchronously.

In the present embodiment, the seventh speed V7 is substantially constant during the scram sweep operation for moving the immersion space LS from the upper surface 13 of the substrate stage 2 to the upper surface 15 of the measurement stage 3. At the time of scram sweep operation, the moving speed V7 ₁ in a state where the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the substrate stage 2, the last optical element 9 and the liquid immersion member 6 the liquid LQ is held between the moving speed V7 ₂ in a state in which the liquid LQ is held between the substrate stage 2 and the measurement stage 3, the last optical element 9 and the liquid immersion member 6 and the measurement stage 3 and the movement speed V7 ₃ in in that state may be different.

  Further, in the present embodiment, the control device 8 causes the third speed V3, which is the moving speed when the measurement stage 3 is changed from the first state to the second state, and the substrate stage 2 from the first state to the second state. The seventh speed V7, which is the moving speed when changing to, is made different. In other words, the control device 8 moves the liquid LQ held between the terminal optical element 9 and the liquid immersion member 6 from the measurement stage 3 to the substrate stage 2 and from the substrate stage 2 to the measurement stage 3. The movement speed (synchronous movement speed) of the substrate stage 2 and the measurement stage 3 is varied depending on the movement. The third speed V3 and the seventh speed V7 can be determined according to the state of the upper surfaces 13 and 15 so that the moving speed is as high as possible within a range in which the outflow and remaining of the liquid LQ can be suppressed.

  The third speed V3 and the seventh speed V7 may be the same speed.

  The scram sweep operation changes the measurement stage 3 to the first state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6, and the substrate stage 2 is between the terminal optical element 9 and the liquid immersion member 6. Then, after changing to the second state where the liquid LQ is not held, the control device 8 changes the moving speed of the substrate stage 2 from the seventh speed V7 to the eighth speed V8 higher than the seventh speed V7. The control device 8 increases the moving speed of the substrate stage 2 from the seventh speed V7 to the eighth speed V8 immediately after the substrate stage 2 changes from the first state to the second state.

  In the present embodiment, the control device 8 synchronously moves the substrate stage 2 and the measurement stage 3 at the seventh speed V7, changes the substrate stage 2 from the first state to the second state, and moves the measurement stage 3 to the first state. After changing from the second state to the first state, the substrate stage 2 and the measurement stage 3 are separated from each other, the acceleration of the substrate stage 2 is started in a state where the measurement stage 3 is maintained in the first state, and the substrate stage 2 is moved. The speed is set to the eighth speed V8.

  As a result, the measurement stage 3 is arranged at the first position PJ 1, and the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the measurement stage 3. Further, the substrate stage 2 moves to the second position PJ2 in order to unload the exposed substrate P. The eighth speed V8, which is the moving speed of the substrate stage 2 when moving to the second position PJ2, includes the maximum speed Vm22.

  The state in which the substrate stage 2 is disposed at the second position PJ2 and the measurement stage 3 is disposed at the first position PJ1 is the first state of the measurement stage 3 and the second state of the substrate stage 2.

  The exposed substrate P held by the substrate holding unit 12 of the substrate stage 2 moved to the second position PJ2 is unloaded from the substrate holding unit 12 by the transport system 48. The substrate P unloaded from the substrate holding unit 12 is subjected to predetermined processing such as development processing.

  After the unloading of the substrate P after the exposure is completed, the control device 8 loads the substrate P before the exposure onto the substrate holding unit 12 of the substrate stage 2 using the transport system 48. The substrate P loaded on the substrate holding unit 12 is held by the substrate holding unit 12. Further, when the substrate stage 2 is disposed at the second position PJ2, the measurement stage 3 is disposed at the first position PJ1, and the liquid LQ is placed between the terminal optical element 9 and the liquid immersion member 6 and the measurement stage 3. Retained. The control apparatus 8 performs various measurements using at least one of the measurement members S (measurement devices) mounted on the measurement stage 3 as necessary. Thereafter, the same processing is repeated.

  As described above, according to the present embodiment, when the substrate stage 2 in the first state holding the liquid LQ is moved between the terminal optical element 9 and the liquid immersion member 6, for example, the liquid LQ flows out and remains. Even when the movement speed (maximum speed) Vm12 in the first state of the substrate stage 2 is limited to suppress the above, the movement speed of the substrate stage 2 in the second state that does not hold the liquid LQ is set to the maximum speed Vm12. By making it higher, throughput can be improved. Therefore, the productivity of the device can be improved.

  Similarly, when the measurement stage 3 in the first state that holds the liquid LQ is moved between the last optical element 9 and the liquid immersion member 6, the measurement stage is used in order to suppress, for example, the outflow or residual of the liquid LQ. Even when the moving speed (maximum speed) Vm13 in the first state 3 is limited, the moving speed of the measurement stage 3 in the second state that does not hold the liquid LQ is made higher than the maximum speed Vm13, thereby improving the throughput. Can be planned. Therefore, the productivity of the device can be improved.

  In the present embodiment, the case where the movement speed in the second state of the substrate stage 2 (or the measurement stage 3) is higher than the movement speed in the first state has been described as an example. At least a part of the moving speed may be lower than the moving speed in the first state.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the second embodiment, the exposure apparatus EX2 includes, for example, US Pat. No. 6,341,007, US Pat. No. 6,400,441, US Pat. No. 6,549,269, US Pat. Description will be made by taking as an example a case where the exposure apparatus is a twin stage type exposure apparatus having a plurality of substrate stages that can move while holding the substrate P, as disclosed in the specification, US Pat. No. 6,262,796 and the like. .

  FIG. 13 is a plan view schematically showing the exposure apparatus EX2. In FIG. 13, the exposure apparatus EX2 includes an exposure station ST1 that performs an exposure process for the substrate P, and a measurement station ST2 that performs a predetermined measurement process and a substrate exchange process for exposure of the substrate P.

  Although not shown in detail, the exposure station ST1 includes a mask stage 1 that is movable while holding the mask M, an illumination system IL that illuminates the mask M with the exposure light EL, and a mask M that is illuminated with the exposure light EL. A projection optical system PL for projecting an image of the pattern onto the substrate P is disposed. In the present embodiment, the first position PJ1 facing the exit surface 10 of the terminal optical element 9 of the projection optical system PL is disposed at the exposure station ST1. Similarly to the first embodiment described above, an immersion member capable of forming an immersion space LS in the vicinity of the last optical element 9 so that the optical path of the exposure light EL emitted from the emission surface 10 is filled with the liquid LQ. 6 is arranged. As the liquid immersion member 6, for example, a seal member as disclosed in US Patent Application Publication No. 2004/0165159 can be used.

  The measurement station ST2 includes an alignment system for acquiring position information of the substrate P (position information regarding the X axis, Y axis, and θZ direction) and position information of the surface of the substrate P (Z axis, θX, and θY directions). Various measurement systems capable of executing measurement processing relating to exposure of the substrate P, such as a focus / leveling detection system capable of detecting position information), are arranged. The second position (substrate replacement position) PJ2 where the substrate replacement process is performed is arranged in the measurement station ST2.

  Further, the exposure apparatus EX2 includes a first substrate stage 61 that can move while holding the substrate P, and a second substrate stage 62 that can move while holding the substrate P independently of the first substrate stage 61. ing. Each of the first substrate stage 61 and the second substrate stage 62 is movable between the exposure station ST1 and the measurement station ST2 while holding the substrate P.

  The first substrate stage 61 has a first substrate holding part 61H that holds the substrate P in a releasable manner. The first substrate holding unit 61H holds the substrate P so that the exposure surface (front surface) of the substrate P and the XY plane are substantially parallel. The first substrate stage 61 has an upper surface 63 disposed around the first substrate holding part 61H. The upper surface 63 is substantially parallel to the XY plane. In the present embodiment, the surface of the substrate P held by the first substrate holding part 61H and the upper surface 63 are arranged in substantially the same plane (substantially flush).

  The second substrate stage 62 has a second substrate holding part 62H that holds the substrate P in a releasable manner. The second substrate holding unit 62H holds the substrate P so that the exposure surface (front surface) of the substrate P and the XY plane are substantially parallel. The second substrate stage 62 has an upper surface 64 disposed around the second substrate holding part 62H. The upper surface 64 is substantially parallel to the XY plane. In the present embodiment, the surface of the substrate P held by the second substrate holding part 62H and the upper surface 64 are arranged in substantially the same plane (substantially flush).

  Further, each of the first substrate stage 61 and the second substrate stage 62 can move within a predetermined region of the XY plane (guide surface) including the first position PJ1 facing the emission surface 10 while holding the substrate P. is there. Each of the first substrate stage 61 and the second substrate stage 62 can hold the liquid LQ between the last optical element 9 and the liquid immersion member 6.

  As in the first embodiment described above, the exposure apparatus EX2 includes a first drive system 4 that can move the mask stage 1. The exposure apparatus EX2 includes a second drive system 65 that can move each of the first substrate stage 61 and the second substrate stage 62.

  As shown in FIG. 13, the second drive system 65 includes X-axis linear motors 73, 74, 76, 77 and Y-axis linear motors 75, 78. The X-axis linear motor 73 includes an X-axis guide member 66 including a coil unit, and a slide member 83 including a magnet unit that can move in the X-axis direction with respect to the X-axis guide member 66. The X-axis linear motor 74 includes an X-axis guide member 67 including a coil unit, and a slide member 84 including a magnet unit that can move in the X-axis direction with respect to the X-axis guide member 67. The X-axis linear motor 76 includes an X-axis guide member 68 including a coil unit, and a slide member 86 including a magnet unit that can move in the X-axis direction with respect to the X-axis guide member 68. The X-axis linear motor 77 includes an X-axis guide member 69 including a coil unit, and a slide member 87 including a magnet unit that can move in the X-axis direction with respect to the X-axis guide member 69. The Y-axis linear motor 75 includes a Y-axis guide member 71 including a coil unit, and a slide member 85 including a magnet unit that can move in the Y-axis direction with respect to the Y-axis guide member 71. The Y-axis linear motor 78 includes a Y-axis guide member 72 including a coil unit, and a slide member 88 including a magnet unit movable in the Y-axis direction with respect to the Y-axis guide member 72. Both ends of the Y-axis guide member 71 are connected to slide members 83 and 84. Both ends of the Y-axis guide member 72 are connected to slide members 86 and 87.

  Each of the first substrate stage 61 and the second substrate stage 62 is releasably connected to the slide members 85 and 88 via a joint as disclosed in, for example, US Patent Application Publication No. 2001/0004105. The

  The linear motors 73, 74, and 75 move at least one of the first substrate stage 61 and the second substrate stage 62 connected to the slide member 85 at the exposure station ST1. The linear motors 76, 77, 78 move at least one of the first substrate stage 61 and the second substrate stage 62 connected to the slide member 88 at the measurement station ST2. For example, the first substrate stage 61 connected to the slide member 85 via a joint is movable in the exposure station ST1 by the operation of the linear motors 73, 74, and 75. Further, the second substrate stage 62 connected to the slide member 85 via the joint is movable in the exposure station ST1 by the operation of the linear motors 73, 74, and 75. Further, the first substrate stage 61 connected to the slide member 88 through the joint can move in the measurement station ST2 by the operation of the linear motors 76, 77, and 78. Further, the second substrate stage 62 connected to the slide member 88 through the joint can be moved in the measurement station ST2 by the operation of the linear motors 76, 77, and 78.

  In the present embodiment, the first substrate stage 61 and the second substrate stage 62 are sequentially connected to the slide member 85 in a releasable manner, and the first substrate stage 61 and the second substrate stage 62 can be released to the slide member 88. Are connected sequentially. In addition, the control device 8 releases the connection between the slide member 85 and the first substrate stage 61 (or the second substrate stage 62) at a predetermined timing, and the slide member 88 and the second substrate stage 62 (or the first substrate). The connection between the slide member 88 and the second substrate stage 62 (or the first substrate stage 61), and the slide member 85 and the first substrate stage 61 (or the second substrate stage 62). And connect. That is, the control device 8 executes the exchange operation of the slide member 85 and the slide member 88 with respect to the first substrate stage 61 and the second substrate stage 62 at a predetermined timing. In the following description, the exchange operation of the slide member 85 and the slide member 88 with respect to the first substrate stage 61 and the second substrate stage 62 is appropriately referred to as a switching operation.

  Next, an example of the operation of the exposure apparatus EX2 having the above-described configuration will be described with reference to schematic diagrams of FIGS.

  As shown in FIG. 14, the first substrate stage 61 holding the substrate P is disposed at the exposure station ST <b> 1, and holds the liquid LQ between the terminal optical element 9 and the liquid immersion member 6. In FIG. 14, the substrate P held on the first substrate stage 61 disposed in the exposure station ST1 has finished a predetermined measurement process in the measurement station ST2 before being disposed in the exposure station ST1. Yes. The control device 8 performs immersion exposure of the substrate P held on the first substrate stage 61 at the exposure station ST1.

  When the first substrate stage 61 is disposed at the exposure station ST1, the second substrate stage 62 is disposed at the measurement station ST2. The control device 8 moves the second substrate stage 62 to the second position PJ2 and loads the unexposed substrate P to be exposed next onto the second substrate stage 62. Moreover, the control apparatus 8 performs the measurement process regarding the board | substrate P hold | maintained at the 2nd board | substrate stage 62 in measurement station ST2.

  As shown in FIG. 14, the state in which the first substrate stage 61 is disposed at the first position PJ1 of the exposure station ST1 and the second substrate stage 62 is disposed at the measurement station ST2 is the first state of the first substrate stage 61. This is the second state of the second substrate stage 62.

  The moving speed of the first substrate stage 61 in the first state is a maximum speed Vm161 or less at which the liquid LQ is suppressed from flowing out and remaining when the liquid LQ is held between the last optical element 9 and the liquid immersion member 6. Determined. The moving speed (maximum speed) Vm 161 in the first state of the first substrate stage 61 is determined according to the state of the upper surface 63. The state of the upper surface 63 includes the state of the surface of the substrate P held on the first substrate stage 61. It is desirable that the maximum speed Vm161 is as high as possible within a range in which the outflow and remaining of the liquid LQ can be suppressed.

  On the other hand, the moving speed (maximum speed) Vm 262 in the second state of the second substrate stage 62 is determined according to, for example, the driving capability of the second driving system 65. The maximum speed Vm262 is desirably as high as possible.

  After the measurement at the measurement station ST <b> 2 is completed and the exposure at the exposure station ST <b> 1 is completed, the control device 8 starts the liquid immersion exposure of the substrate P held on the second substrate stage 62. The operation of moving 62 from the measurement station ST2 to the exposure station ST1 is started. In the present embodiment, as shown in FIG. 15, the control device 8 holds the liquid LQ between the last optical element 9 and the liquid immersion member 6 and the first substrate stage 61, and the second drive system 65. Are used to move each of the first substrate stage 61 and the second substrate stage 62 to an intermediate region ST3 between the exposure station ST1 and the measurement station ST2. In the present embodiment, the first substrate stage 61 is disposed on the −Y side of the second substrate stage 62 in the intermediate region ST3.

  The moving speed when the first substrate stage 61 moves from the exposure station ST1 to the intermediate area ST3 is the maximum speed Vm161 or less.

  The moving speed when the second substrate stage 62 moves from the measurement station ST2 to the intermediate area ST3 is the first speed V1. The first speed V1 includes a maximum speed Vm262.

  In the intermediate region ST3, the control device 8 brings the upper surface 63 of the first substrate stage 61 in the first state into contact with the upper surface 64 of the second substrate stage 62 in the second state. In the present embodiment, the control device 8 changes the moving speed of the second substrate stage 62 from the first speed V1 to the second speed V2 lower than the first speed V1 immediately before the upper surface 63 and the upper surface 64 contact each other. Change.

  Next, the control device 8 performs a scram sweep operation in order to move the immersion space LS from the upper surface 63 of the first substrate stage 61 to the upper surface 64 of the second substrate stage 62. In the present embodiment, the scram sweep operation is performed by the upper surface 63 of the first substrate stage 61 in order to move the liquid immersion space LS between the upper surface 63 of the first substrate stage 61 and the upper surface 64 of the second substrate stage 62. And at least one of the upper surface 63 of the first substrate stage 61 and the upper surface 64 of the second substrate stage 62, the lower surface 10 of the last optical element 9, and the liquid immersion. This includes an operation of synchronously moving the first substrate stage 61 and the second substrate stage 62 in the XY directions with respect to the last optical element 9 and the liquid immersion member 6 while facing the lower surface 16 of the member 6.

  In the present embodiment, the control device 8 moves the first substrate stage 61 and the second substrate stage 62 in a state where the upper surface 63 of the first substrate stage 61 and the upper surface 64 of the second substrate stage 62 are in contact with each other. -Synchronously moves in the Y direction.

  Accordingly, as shown in FIG. 15, the terminal optical element 9 and the liquid immersion member 6 are changed from the state in which the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the first substrate stage 62. After the state in which the liquid LQ is held between the first substrate stage 61 and the second substrate stage 62, as shown in FIG. 16, the last optical element 9, the liquid immersion member 6, and the second substrate stage 62 In the meantime, the liquid LQ changes.

  As a result, the first substrate stage 61 changes from the first state in which the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 to the second state in which the liquid LQ is not held. Changes from the second state in which the liquid LQ is not held between the last optical element 9 and the liquid immersion member 6 to the first state in which the liquid LQ is held.

  During the scram sweep operation for moving the immersion space LS from the upper surface 63 of the first substrate stage 61 to the upper surface 64 of the second substrate stage 62, the control device 8 is at a third speed V3 lower than the first speed V1. The first substrate stage 61 and the second substrate stage 62 are moved synchronously.

  The third speed V3 is determined according to the upper surface 63 of the first substrate stage 61 and the upper surface 64 of the second substrate stage 62 that are in contact with the liquid LQ. The state of the upper surfaces 63 and 64 includes a contact angle with the liquid LQ. The control device 8 sets the third speed V3 so that the moving speed is as high as possible within the range in which the outflow and the residual of the liquid LQ can be suppressed, and the first substrate stage 61 and the first speed are set at the third speed V3. The two substrate stages 62 are moved synchronously.

  Next, the control device 8 performs a switching operation in a state where the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the second substrate stage 62. As shown in FIG. 17, the control device 8 executes the release of the connection between the slide member 85 and the first substrate stage 61 and the release of the connection between the slide member 88 and the second substrate stage 62. Thereafter, as shown in FIG. 18, the control device 8 moves the slide members 85 and 88 so that the first substrate stage 61 and the slide member 88 face each other, and the second substrate stage 62 and the slide member 88 face each other. Moving. Then, the control device 8 executes connection between the slide member 88 and the second substrate stage 62 and connection between the slide member 85 and the first substrate stage 61.

  The controller 8 moves the second substrate stage 62 to the exposure station ST1 while holding the liquid LQ between the last optical element 9 and the liquid immersion member 6 and the second substrate stage 62, and the first substrate stage 61 is moved to the exposure station ST1. To the measurement station ST2.

  The moving speed of the second substrate stage 62 in the first state is equal to or lower than the maximum speed Vm162 at which the liquid LQ is suppressed from flowing out and remaining when the liquid LQ is held between the last optical element 9 and the liquid immersion member 6. Determined. The moving speed (maximum speed) Vm 162 in the first state of the second substrate stage 62 is determined according to the state of the upper surface 64. The state of the upper surface 64 includes the state of the surface of the substrate P held on the second substrate stage 62. It is desirable that the maximum speed Vm162 is as high as possible within a range in which the outflow and remaining of the liquid LQ can be suppressed.

  Further, the control device 8 changes the moving speed of the first substrate stage 61 from the third speed V3 to the fourth speed V4 higher than the third speed V3, and moves the first substrate stage 61 to the measurement station ST2. To do. Immediately after the first substrate stage 61 changes from the first state to the second state, the control device 8 increases the moving speed of the first substrate stage 61 from the third speed V3 to the fourth speed V4. The control device 8 synchronously moves the first substrate stage 61 and the second substrate stage 62 at the third speed V3 to change the first substrate stage 61 from the first state to the second state. Is changed from the second state to the first state, the first substrate stage 61 and the second substrate stage 62 are separated from each other, and the second substrate stage 62 is maintained in the first state. Acceleration is started, the moving speed of the first substrate stage 61 is set to the fourth speed V4, and the first substrate stage 61 is moved to the measurement station ST2.

  The fourth speed V4 includes the maximum speed Vm261 in the second state of the first substrate stage 61. The moving speed (maximum speed) Vm 261 in the second state of the first substrate stage 61 is determined according to, for example, the driving capability of the second driving system 65. It is desirable that the maximum speed Vm261 is as high as possible.

  Accordingly, as shown in FIG. 19, the second substrate stage 62 is disposed at the first position PJ1, and the liquid LQ is held between the last optical element 9 and the liquid immersion member 6 and the second substrate stage 62. . The first substrate stage 61 is disposed in the measurement station ST2.

  The state where the second substrate stage 62 is disposed at the first position PJ1 and the first substrate stage 61 is disposed at the measurement station ST2 is the first state of the second substrate stage 62. Two states.

  In order to expose the substrate P held on the second substrate stage 62, the control device 8 moves the substrate P to the first position PJ1, and performs immersion exposure of the substrate P. In the exposure station ST1, immersion exposure of the substrate P on the second substrate stage 62 is performed, and in the measurement station ST2, the substrate replacement process for the first substrate stage 61 and the first substrate stage 61 holding the substrate P are performed. The measurement process is performed.

  In the present embodiment, the maximum speed Vm261 in the second state of the first substrate stage 61 is higher than the maximum speed Vm161 in the first state. Further, the maximum speed Vm262 in the second state of the second substrate stage 62 is higher than the maximum speed Vm162 in the first state.

  Thereafter, the same processing is repeated. That is, after the liquid immersion exposure of the substrate P on the second substrate stage 62 is completed, the control device 8 holds the liquid LQ between the last optical element 9 and the liquid immersion member 6 and the second substrate stage 62. Thus, the first substrate stage 61 holding the substrate P before exposure and the second substrate stage 62 holding the substrate P after exposure are arranged in the intermediate region ST3. Then, the control device 8 executes the scram sweep operation, and from the state where the liquid LQ is held between the terminal optical element 9 and the liquid immersion member 6 and the second substrate stage 62, the terminal optical element 9 and the liquid The liquid LQ is changed to be held between the immersion member 6 and the first substrate stage 61. Then, after executing the switching operation, the control device 8 moves the first substrate stage 61 to the exposure station ST1, and moves the second substrate stage 62 to the measurement station ST2.

  Also in the present embodiment, the control device 8 changes the moving speed when changing the first substrate stage 61 from the first state to the second state, and changes the second substrate stage 62 from the first state to the second state. The moving speed at the time of making it different can be made different. That is, the control device 8 moves the liquid LQ held between the last optical element 9 and the liquid immersion member 6 from the first substrate stage 61 to the second substrate stage 62, and from the second substrate stage 62 to the second substrate stage 62. The movement speed (synchronous movement speed) of the first substrate stage 61 and the second substrate stage 62 can be varied by moving to the first substrate stage 61. The control device 8 adjusts the first substrate stage 61 and the second substrate stage 62 according to the state of the upper surfaces 63 and 64 so that the moving speed is as high as possible within a range in which the outflow and remaining of the liquid LQ can be suppressed. The moving speed (synchronous moving speed) can be determined.

  As described above, also in this embodiment, throughput is improved by making the moving speed of the first and second substrate stages 61 and 62 in the second state higher than the moving speed (maximum speed) in the first state. Can be achieved.

  In the first and second embodiments, the liquid immersion space LS is held between the terminal optical element 9 and the liquid immersion member 6 and the object facing the emission surface 10 and the lower surface 16. However, the liquid immersion member 6 may be omitted. In this case, the first state is a state in which the liquid LQ is held between the terminal optical element 9 and the object facing the exit surface 10 of the terminal optical element 9.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  Similar to the exposure apparatus EX2 of the second embodiment described above, the exposure apparatus EX3 of the third embodiment is a twin-stage type exposure apparatus including a plurality of substrate stages that can move while holding the substrate P.

  In addition, the exposure apparatus EX3 of the present embodiment is a cover that can form a space for holding the liquid LQ with the terminal optical element 9 as disclosed in, for example, US Patent Application Publication No. 2004/0211920. A member C is provided. In the present embodiment, the liquid immersion member 6C includes a sealing member as disclosed in, for example, U.S. Patent Application Publication No. 2004/0165159, U.S. Patent Application Publication No. 2004/0211920, and the like. The cover member C can be releasably held. The liquid immersion member 6C can form a liquid immersion space LS while holding the liquid LQ between the liquid immersion member 6C and the cover member C disposed at the first position PJ1.

  FIG. 20 is a plan view schematically showing the exposure apparatus EX3. As shown in FIG. 20, the exposure apparatus EX3 includes a first substrate stage 61C that can move while holding the substrate P, and a second substrate that can move while holding the substrate P independently of the first substrate stage 61C. A stage 62C and a second drive system 65 capable of moving each of the first substrate stage 61C and the second substrate stage 62C are provided. The second drive system 65 of the present embodiment has the same configuration as the second drive system 65 of the second embodiment described above. Similar to the second embodiment described above, the second drive system 65, the first and second substrate stages 61C, 62C of the present embodiment can perform a switching operation.

  The cover member C is a member that can hold the liquid LQ with the last optical element 9. The cover member C is formed according to the size and shape of the immersion space LS formed by the seal member. In the present embodiment, the cover member C is a substantially circular plate-like member having substantially the same thickness as the substrate P in the XY plane.

  The first substrate stage 61C includes a first cover member holding portion 111 that holds the cover member C in a releasable manner. The second substrate stage 62C includes a second cover member holding portion 112 that holds the cover member C so as to be releasable.

  The liquid immersion member (seal member) 6C can form a gas bearing between an object (including the substrate P and the cover member C) facing the lower surface of the liquid immersion member 6C. A pressurized vacuum type gas bearing is formed between the lower surface of the liquid immersion member 6C and the surface of the object. The gap between the lower surface of the liquid immersion member 6C and the surface of the object (the surface of the substrate P, the surface of the cover member C) is maintained by the gas bearing.

  The liquid immersion member 6C holds the cover member C so as to be releasable. The liquid immersion member 6 </ b> C maintains a predetermined gap between the lower surface of the liquid immersion member 6 </ b> C and the upper surface of the cover member C by utilizing an adsorption action generated by forming a gas bearing with the cover member C. The cover member C can be held in the state. The liquid immersion member 6 </ b> C can hold the cover member C so as to be releasable so that the cover member C is disposed at a position facing the exit surface 10 of the last optical element 9. The liquid immersion member 6C has a cover so that the cover member C is disposed at a position facing the emission surface 10 when each of the first substrate stage 61C and the second substrate stage 62C is away from the first position PJ1. The member C is held.

  In the present embodiment, the exposure apparatus EX3 includes one cover member C. Therefore, when the cover member C is held by the first cover member holding part 111, the second cover member holding part 112 does not hold the cover member C, and there is nothing in the second cover member holding part 112. Become. Similarly, when the cover member C is held by the second cover member holding portion 112, the first cover member holding portion 111 does not hold the cover member C, and there is nothing in the first cover member holding portion 111. It becomes.

  In the present embodiment, the cover member C is held by the first cover member holding unit 111 during the exposure of the substrate P held by the first substrate stage 61C. Further, the cover member C is held by the second cover member holding unit 112 during the exposure of the substrate P held by the second substrate stage 62C.

  Next, an example of the operation of the exposure apparatus EX3 having the above-described configuration will be described with reference to schematic diagrams of FIGS.

  In the exposure station ST1, the substrate P held on the first substrate stage 61C is disposed at the first position PJ1 and subjected to immersion exposure. During exposure of the substrate P held by the first substrate stage 61C, the cover member C is held by the first cover member holding portion 111. The moving speed of the first substrate stage 61C in the first state is determined to be equal to or lower than the maximum speed Vm161 at which the liquid LQ is prevented from flowing out and remaining.

  After the immersion exposure of the substrate P on the first substrate stage 61C is completed, as shown in FIG. 21, the control device 8 uses the second drive system 65 to detect the exit surface 10 of the last optical element 9, the first The first substrate stage 61C is moved in the XY directions so that the upper surface of the cover member C held by the one cover member holding part 111 faces. Thereby, the liquid LQ is held between the exit surface 10 of the last optical element 9 and the upper surface of the cover member C held by the first cover member holding part 111.

  Next, the control device 8 releases the holding of the cover member C by the first cover member holding portion 111, releases the cover member C from the first cover member holding portion 111, and utilizes the adsorption action of the gas bearing. The cover member C is held by the liquid immersion member 6C. The cover member C held by the liquid immersion member 6 </ b> C is disposed at a position facing the emission surface 10, and the liquid LQ is held between the last optical element 9 and the cover member C.

  While the exposure process of the substrate P held on the first substrate stage 61C is being performed in the exposure station ST1, the substrate exchange process for the second substrate stage 62C and the second substrate stage 62C are held in the measurement station ST2. Measurement processing relating to the substrate P being performed is executed. In the measurement station ST2, the second substrate stage 62C is in the second state. The second substrate stage 62C can move in the measurement station ST2 at a moving speed including the maximum speed Vm262.

  The control device 8 starts an operation of moving the second substrate stage 62C from the measurement station ST2 to the exposure station ST1 in order to start immersion exposure of the substrate P held on the second substrate stage 62C. In the present embodiment, as shown in FIG. 22, the control device 8 performs the second operation with the liquid LQ held between the last optical element 9 and the cover member C held by the liquid immersion member 6C. Using the drive system 65, each of the first substrate stage 61C and the second substrate stage 62C is moved to the intermediate region ST3. In the present embodiment, the first substrate stage 61C is disposed on the −Y side of the second substrate stage 62C in the intermediate region ST3.

  After the cover member C is held by the liquid immersion member 6C, the first substrate stage 61C when moving from the exposure station ST1 to the intermediate region ST3 is in the second state. The moving speed of the first substrate stage 61C in the second state includes the maximum speed Vm261. Further, the second substrate stage 62C when moving from the measurement station ST2 to the intermediate region ST3 is in the second state. The second substrate stage 62C moves from the measurement station ST2 to the intermediate area ST3 at a moving speed including the maximum speed Vm262.

  Next, the control device 8 performs a switching operation. The control device 8 releases the connection between the slide member 85 and the first substrate stage 61C and releases the connection between the slide member 88 and the second substrate stage 62C. Then, as shown in FIG. 23, the control device 8 performs connection between the slide member 88 and the second substrate stage 62C and connection between the slide member 85 and the first substrate stage 61C.

  The control device 8 moves the second substrate stage 62C to the exposure station ST1, and moves the first substrate stage 61C to the measurement station ST2. The second substrate stage 62C moves from the intermediate area ST3 to the exposure station ST1 at a moving speed including the maximum speed Vm262. Further, the moving speed of the first substrate stage 61C in the second state is a moving speed including the maximum speed Vm261 and moves from the intermediate region ST3 to the measuring station ST2.

  As shown in FIG. 24, the control device 8 moves the second substrate stage 62C so that the cover member C held by the liquid immersion member 6C and the second cover member holding portion 112 face each other. Next, the control device 8 releases the cover member C held by the liquid immersion member 6C from the liquid immersion member 6C, and holds the cover member C by the second cover member holding portion 112.

  And after the cover member C is hold | maintained at the 2nd cover member holding | maintenance part 112, as shown in FIG. 25, the control apparatus 8 uses the 2nd drive system 65, the exit surface 10 of the last optical element 9, From the state in which the upper surface of the cover member C held by the second cover member holding portion 112 faces, the exit surface 10 of the last optical element 9 and the upper surface of the second substrate stage 62C (or the second substrate stage 62C are held). The second substrate stage 62 </ b> C is moved in the XY directions so that the surface changes to a state where the surface of the substrate P is opposite to the surface of the substrate P. Accordingly, the liquid LQ is held between the last optical element 9 and the liquid immersion member 6C and the upper surface of the second substrate stage 62C (or the surface of the substrate P held by the second substrate stage 62C). Then, the control device 8 moves the substrate P held on the second substrate stage 62C to the first position PJ1, and executes immersion exposure of the substrate P.

  After the cover member C is held by the second cover member holding portion 112, the emission surface 10 and the upper surface of the second substrate stage 62C (the surface of the substrate P) from the state where the emission surface 10 and the upper surface of the cover member C face each other. And the second substrate stage 62C changes from the second state to the first state. The moving speed of the second substrate stage 62C in the first state is determined to be equal to or lower than the maximum speed Vm162 at which the liquid LQ is prevented from flowing out and remaining.

  In the exposure station ST1, immersion exposure of the substrate P on the second substrate stage 62C is performed, and in the measurement station ST2, the substrate replacement process for the first substrate stage 61C and the first substrate stage 61C holding the substrate P are performed. The measurement process is performed. During the exposure of the substrate P held on the second substrate stage 62C, the cover member C is held by the second cover member holding portion 112. In the measurement station ST2, the first substrate stage 61C is in the second state. The first substrate stage 61C can move in the measurement station ST2 at a moving speed including the maximum speed Vm261.

  Thereafter, the same processing is repeated. That is, after the liquid immersion exposure of the substrate P on the second substrate stage 62C is completed, the control device 8 releases the cover member C from the second cover member holding portion 112 and removes the cover member C from the liquid immersion member 6C. Hold on. The cover member C held by the liquid immersion member 6 </ b> C holds the liquid LQ between the terminal optical element 9. In addition, the second substrate stage 62C holding the exposed substrate P is moved from the exposure station ST1 to the measurement station ST2, and a substrate exchange process or the like is performed.

  As described above, also in the present embodiment, throughput is improved by making the moving speed of the first and second substrate stages 61C and 62C in the second state higher than the moving speed (maximum speed) in the first state. Can be achieved.

  In each of the above-described embodiments, the projection optical system PL fills the optical path on the exit side (image plane side) of the terminal optical element with a liquid, but is disclosed in US Patent Application Publication No. 2005/0248856. As described above, it is possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element is filled with liquid.

  In addition, although the liquid LQ of the above-mentioned embodiment is water, liquids other than water may be sufficient. The liquid LQ is preferably a liquid LQ that is transparent to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the projection optical system or a photosensitive material (photoresist) film that forms the surface of the substrate. For example, as the liquid LQ, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, cedar oil, or the like can be used. A liquid LQ having a refractive index of about 1.6 to 1.8 may be used. Furthermore, an optical element (such as a terminal optical element) of the projection optical system PL that is in contact with the liquid LQ may be formed of a material having a refractive index higher than that of quartz and fluorite (for example, 1.6 or more). In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P are The present invention can also be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed in a stationary state and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously.

  The type of the exposure apparatus is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P. An exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In each of the above-described embodiments, each position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage. ) May be used. Further, the position of the stage may be controlled by switching between the interferometer system and the encoder system or using both.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610, A harmonic generator that outputs pulsed light having a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator).

  Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. In this case, an illumination system is unnecessary. Here, as a self-luminous image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission) Display), plasma display (PDP: Plasma Display Panel), and the like.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus according to the present embodiment assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 26, a microdevice such as a semiconductor device includes a step 201 for performing a function / performance design of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. FIG. 3 is a side sectional view showing the vicinity of the liquid immersion member according to the first embodiment. It is a top view which shows a part of exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a top view which shows a part of exposure apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a top view which shows a part of exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Mask stage, 2 ... Substrate stage, 3 ... Measurement stage, 5 ... 2nd drive system, 6 ... Liquid immersion member, 8 ... Control apparatus, 9 ... Terminal optical element, 10 ... Ejection surface, 13 ... Upper surface, 15 ... Upper surface, 61 ... first substrate stage, 62 ... second substrate stage, 63 ... upper surface, 64 ... upper surface, 65 ... second drive system, 111 ... first cover member holding portion, 112 ... second cover member holding portion, C ... Cover member, EL ... Exposure light, EX1, EX2, EX3 ... Exposure apparatus, LQ ... Liquid, LS ... Immersion space, P ... Substrate, PJ1 ... First position, PJ2 ... Second position, PL ... Projection optical system

Claims (40)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface for emitting the exposure light;
A first member capable of holding a liquid with the optical member and movable within a predetermined region;
An exposure apparatus comprising: a control device that controls movement of the first member so that a moving speed differs between a first state in which liquid is held with respect to the optical member and a second state in which liquid is not held.   The exposure apparatus according to claim 1, wherein the moving speed in the second state is higher than the moving speed in the first state.   The exposure apparatus according to claim 1, wherein the first member is capable of holding the substrate.   The said 1st state includes the state by which the said 1st member is arrange | positioned facing the said optical member in order to expose the board | substrate on the said 1st member with the said exposure light through the said liquid. Exposure device. A second member capable of holding a liquid with the optical member;
The exposure apparatus according to claim 1, wherein the second state includes a state in which a liquid is held between the optical member and the second member.   The second member is movable in the predetermined region, and the liquid held between the first member and the second member by the relative movement of the first member and the second member with respect to the optical member is changed to the first member. The exposure apparatus according to claim 5, wherein the exposure apparatus moves from one of the member and the second member to the other.   In the first state, the first member and the second member are moved closer to move the liquid held between the first member and the second member from one of the first member and the second member to the other. The exposure apparatus according to claim 6, further comprising a contacted state.   Movement of the first member and the second member of the liquid held between the optical member and the movement of the first member and the second member from one to the other and the other from the other is performed. The exposure apparatus according to claim 6 or 7, wherein the speed is varied. A second member capable of holding a liquid with the optical member and movable within the predetermined region;
The exposure apparatus according to claim 1, wherein the control device controls movement of the first member and the second member so that movement speeds are different between the first state and the second state. .   The exposure apparatus according to claim 9, wherein the first state includes a state in which at least one of the first member and the second member is disposed to face the optical member.   The exposure apparatus according to claim 9 or 10, wherein a moving speed in the first state is lower than a moving speed in the second state.   The control device moves one of the first member and the second member from the first state so that at least one of the first member and the second member continues to hold the liquid with the optical member. The exposure apparatus according to claim 5, wherein the exposure apparatus is changed to the second state and the other is changed from the second state to the first state.   The control device is configured such that the upper surface of the first member and the upper surface of the second member are in contact with or in contact with the upper surface of the first member and the upper surface of the second member that can face the emission surface of the optical member. The exposure apparatus according to claim 12, wherein the first member and the second member are moved synchronously with respect to the optical member while at least one of an upper surface and the emission surface of the optical member are opposed to each other.   The exposure apparatus according to claim 5, wherein the movement speed in the first state includes a movement speed immediately after the change from the second state to the first state.   The exposure apparatus according to claim 5, wherein the movement speed in the second state includes a movement speed immediately after changing from the first state to the second state.   The exposure apparatus according to claim 5, wherein the moving speed in the first state includes a maximum speed at which the outflow of the liquid is suppressed when the liquid is held with the optical member.   The exposure apparatus according to claim 5, wherein the moving speed in the first state is determined according to a state of a liquid contact surface of the first member and the second member that are in contact with the liquid.   The exposure apparatus according to claim 17, wherein the state of the liquid contact surface includes a contact angle with the liquid.   The exposure apparatus according to any one of claims 5 to 18, wherein the control device lowers a moving speed immediately before changing from the second state to the first state.   The exposure apparatus according to any one of claims 5 to 19, wherein the control device increases a moving speed immediately after the change from the first state to the second state.   The control device changes one of the first member and the second member from the first state to the second state, changes the other from the second state to the first state, and then changes the first member. 21. The exposure apparatus according to claim 20, wherein a member is separated from the second member, and thereafter acceleration of the one member in the second state is started. The control device is configured such that the upper surface of the first member and the upper surface of the second member are in contact with or in contact with the upper surface of the first member and the upper surface of the second member that can face the emission surface of the optical member. The first member and the second member are moved synchronously with respect to the optical member while facing at least one of the upper surface and the emission surface of the optical member,
The moving speed when changing the first member from the first state to the second state is different from the moving speed when changing the second member from the first state to the second state. 12. The exposure apparatus according to 12.   The exposure apparatus according to claim 22, wherein the moving speed is determined according to a state of a liquid contact surface of the first member and the second member that are in contact with the liquid.   The exposure apparatus according to claim 23, wherein the state of the liquid contact surface includes a contact angle with the liquid.   The exposure apparatus according to any one of claims 5 to 24, wherein the first member is movable independently of the second member.   26. The exposure apparatus according to claim 25, wherein the first member holds the substrate, and the second member is equipped with a measuring instrument capable of performing measurement related to exposure.   26. The exposure apparatus according to claim 25, wherein each of the first member and the second member holds the substrate.   The exposure apparatus according to claim 5, wherein the second member includes a cover member that is releasably held by the first member and that can hold a liquid between the second member and the optical member.   The exposure apparatus according to any one of claims 1 to 28, further comprising a liquid immersion member disposed around the optical member and capable of holding a liquid between at least one of the first member and the second member.   21. The exposure apparatus according to claim 20, wherein the liquid immersion member includes a supply port that supplies a liquid to an optical path of the exposure light emitted from the emission surface.   The exposure apparatus according to claim 29 or 30, wherein the liquid immersion member includes a recovery port capable of recovering at least one liquid on the first member and the second member. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 31;
Developing the exposed substrate; and a device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Moving the first member within a predetermined area so as to change between a first state in which the liquid is held and a second state in which the liquid is not held between the optical member having an emission surface for emitting the exposure light;
An exposure method in which the moving speed of the first member is different between the first state and the second state.   34. The exposure method according to claim 33, wherein the moving speed in the first state is lower than the moving speed in the second state.   The exposure method according to claim 33 or 34, wherein the first member is capable of holding the substrate.   The first state includes a state in which the first member is disposed to face the optical member in order to expose the substrate on the first member with the exposure light through the liquid. Exposure method. Moving the second member within the predetermined region,
37. The exposure method according to any one of claims 33 to 36, wherein the second state includes a state in which a liquid is held between the optical member and the second member.   One of the first member and the second member is changed from the first state to the second state so that at least one of the first member and the second member continues to hold the liquid with the optical member. 38. The exposure method according to claim 37, wherein the other is changed from the second state to the first state.   At least one of the upper surface of the first member and the upper surface of the second member in a state in which the upper surface of the first member and the upper surface of the second member that can face the emission surface of the optical member are close to or in contact with each other 39. The exposure method according to claim 38, wherein the first member and the second member are moved synchronously with respect to the optical member while facing the emission surface of the optical member. Exposing the substrate using the exposure method according to any one of claims 33 to 39;
Developing the exposed substrate; and a device manufacturing method.

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