JP2009070968A - Exposure device, cleaning method and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device capable of cleaning a holding portion while suppressing a decrease in availability, and suppressing the occurrence of an exposure defect. <P>SOLUTION: The exposure device exposes a substrate to exposure light through liquid. The exposure device includes: an optical member having a projection surface for projecting the exposure light; a first member which has a first holding portion where the substrate can be attached and detached and can move within a predetermined area including a first position opposed to the projection surface; a second member which can be positioned at the first position; and a first cleaning device which cleans the first holding portion of the first member in a state wherein liquid is held between the optical member and the second member arranged at the first position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate with exposure light through a liquid, a cleaning method used in the exposure apparatus, and a device manufacturing method.

As an exposure apparatus used in a photolithography process, there is known an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in Patent Document 1 below. In the immersion exposure apparatus, the immersion part is formed so that the optical path of the exposure light between the optical member capable of emitting the exposure light and the substrate is filled with the liquid. The substrate is held by the holding unit of the substrate stage, and the exposure light emitted from the optical member is irradiated onto the substrate held by the holding unit via the liquid in the liquid immersion unit. In the exposure apparatus, if a foreign substance exists between the substrate and the holding unit, for example, the flatness of the substrate is lowered, and as a result, an exposure failure may occur and a defective device may occur. For this reason, for example, a technique for cleaning the holding portion as disclosed in Patent Document 2 below has been devised.
US Patent Application Publication No. 2007/0127006 US Pat. No. 5,559,582

  In the immersion exposure apparatus, the process of collecting all the liquid in the immersion part or the process of re-forming the immersion part may take time. Therefore, there is a possibility that problems such as a reduction in the operating rate of the exposure apparatus and a decrease in throughput may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus that can perform a cleaning operation while suppressing a decrease in operation rate and can suppress occurrence of exposure failure. It is another object of the present invention to provide a cleaning method that can perform a cleaning operation while suppressing a decrease in operating rate and can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method capable of suppressing the occurrence of defective devices while suppressing a decrease in productivity.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface that emits exposure light, and a first holding unit that can attach and detach the substrate A first member that can move within a predetermined region including a first position facing the exit surface, a second member that can be disposed at the first position, and an optical member and a second member disposed at the first position. An exposure apparatus is provided that includes a first cleaning device that cleans the first holding portion of the first member in a state in which the liquid is held between the members.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided a cleaning method for use in an exposure apparatus that exposes a substrate with exposure light through a liquid, the first position facing the exit surface of an optical member that emits exposure light. Cleaning the substrate holding portion of the first member movable within a predetermined area including the liquid, and holding the liquid between the second member and the optical member disposed at the first position during the cleaning of the substrate holding portion. A cleaning method is provided.

  According to the fourth aspect of the present invention, the substrate is held on the substrate holding part cleaned using the cleaning method of the third aspect, and between the optical member and the substrate held on the substrate holding part. There is provided a device manufacturing method including exposing the substrate with exposure light through a liquid and developing the exposed substrate.

  According to the present invention, the cleaning operation is performed while suppressing the decrease in the operation rate, and the occurrence of exposure failure can be suppressed. Moreover, according to this invention, generation | occurrence | production of a defective device can be suppressed, suppressing the fall of productivity.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram showing an example of an exposure apparatus EX1 according to the first embodiment, and FIG. 2 is a plan view schematically showing the exposure apparatus EX1, in which the vicinity of the substrate stage 1 and the measurement stage 2 is located upward. It is the figure seen from. In the present embodiment, the exposure apparatus EX1 is a substrate stage 1 that is movable while holding the substrate P as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application No. 1713113. A case where the exposure apparatus includes the measurement stage 2 that is movable without mounting the substrate P and is mounted with a measuring instrument capable of performing predetermined measurement related to exposure will be described.

  In the present embodiment, the exposure apparatus EX1 is a liquid immersion apparatus that exposes the substrate P with the exposure light EL via the liquid LQ as disclosed in, for example, US Patent Application Publication No. 2007/0127006. A case where the exposure apparatus is used will be described as an example.

  1 and 2, the exposure apparatus EX1 includes a mask stage 3 that can move while holding a mask M, and a substrate holder 4 that can attach and detach the substrate P. The substrate holder 4 holds the substrate P. The first drive system that moves the mask stage 3 and the measurement stage 2 that can be moved while the substrate stage 1 that can be moved while the measurement device that can perform predetermined measurement relating to exposure without mounting the substrate P is mounted. 5, a second movement system 6 that moves the substrate stage 1 and the measurement stage 2, a base member (surface plate) 8 having a guide surface 7 that supports the substrate stage 1 and the measurement stage 2 movably, and a mask An illumination system IL that illuminates M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and the mask stage 3 are disposed. A first alignment system 9, a second alignment system 10 disposed in the vicinity of the tip of the projection optical system PL, an interferometer system 11 for measuring positional information of the stages 1, 2, and 3, and a substrate holder. 4, a focus / leveling detection system 12 capable of detecting surface position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P, a transport system 13 that transports the substrate P, and a substrate A substrate temperature adjusting device 14 for adjusting the temperature of P and a control device 15 for controlling the operation of the entire exposure apparatus EX1 are provided. The control device 15 is connected to a storage device 81 that stores various information relating to exposure.

  In addition, the board | substrate P here is a board | substrate for manufacturing a device, for example, includes what formed the photosensitive film in base materials, such as a semiconductor wafer like a silicon wafer. The photosensitive film is a film of a photosensitive material (photoresist). In the substrate P, various films such as a protective film (top coat film) may be formed on the photosensitive film. The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. For example, a predetermined pattern is formed on a transparent plate member such as a glass plate using a light shielding film such as chromium. This transmission type mask is not limited to a binary mask in which a pattern is formed by a light shielding film, and includes, for example, a phase shift mask such as a halftone type or a spatial frequency modulation type. In the present embodiment, a transmissive mask is used as the mask M, but a reflective mask may be used.

  Further, the exposure apparatus EX1 of the present embodiment includes a first cleaning device 16 for cleaning the substrate holding part 4 of the substrate stage 1. In the present embodiment, the first cleaning device 16 includes a polishing device 18 including a polishing member 17 that polishes the substrate holding unit 4.

The illumination system IL illuminates a predetermined illumination area IR on the mask M with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 3 has a mask holding unit 19 to which the mask M can be attached and detached, and can move in at least three directions of the X axis, the Y axis, and the θZ direction with the mask M held by the mask holding unit 19. is there. The first drive system 5 includes an actuator such as a linear motor, and can move the mask stage 3 in three directions, ie, an X axis, a Y axis, and a θZ direction. The position information of the mask stage 3 (mask M) is measured by the laser interferometer 11A of the interferometer system 11. The laser interferometer 11 </ b> A measures position information regarding the X axis, the Y axis, and the θZ direction of the mask stage 3 using a measurement mirror 3 </ b> R provided on the mask stage 3. The control device 15 operates the first drive system 5 based on the measurement result of the interferometer system 11 including the laser interferometer 11 </ b> A, and controls the position of the mask M held on the mask stage 3.

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. The plurality of optical elements of the projection optical system PL are held by the lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Each of the substrate stage 1 and the measurement stage 2 is movable on the guide surface 7 of the base member 8. In the present embodiment, the guide surface 7 is substantially parallel to the XY plane. Each of the substrate stage 1 and the measurement stage 2 is movable along the guide surface 7 in the XY plane orthogonal to the optical axis AX (Z axis) of the projection optical system PL.

  The substrate stage 1 is movable while holding the substrate P by the substrate holding unit 4. The substrate stage 1 includes a substrate stage main body 20 that can move on the guide surface 7, and a substrate table 21 that is mounted on the substrate stage main body 20 and has the substrate holding unit 4. The substrate table 21 has an upper surface 22 arranged around the substrate holding unit 4. The upper surface 22 of the substrate table 21 is flat and substantially parallel to the XY plane. The substrate stage main body 20 is movable along the guide surface 7 in the XY plane. The substrate table 21 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions while the substrate P is held on the substrate holder 4.

  The measurement stage 2 is movable without mounting the substrate P while mounting a measuring instrument and a measuring member (optical component) that can perform predetermined measurement related to exposure. The measurement stage 2 includes a measurement stage main body 23 that is movable along the guide surface 7 and a measurement table 24 that is mounted on the measurement stage main body 23 and includes at least a part of a measuring instrument and a measurement member. The measurement table 24 has an upper surface 25 disposed around the measurement member. The upper surface 25 of the measurement table 24 is flat and substantially parallel to the XY plane. The measurement stage main body 23 can move in the XY plane along the guide surface 7. The measurement table 24 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions in a state where at least a part of the measuring instrument and the measurement member are mounted.

  The second drive system 6 includes a first coarse movement system 26 that moves the substrate stage body 20, a first fine movement system 27 that moves the substrate table 21 relative to the substrate stage body 20, and a first movement system that moves the measurement stage body 23. 2 The coarse movement system 28 and the 2nd fine movement system 29 which moves the measurement table 24 with respect to the measurement stage main body 23 are provided.

  The first coarse movement system 26 includes an actuator such as a linear motor, and can move the substrate stage main body 20 in the X axis, Y axis, and θZ directions. As the substrate stage body 20 moves, the substrate table 21 mounted on the substrate stage body 20 also moves together with the substrate stage body 20. The first fine movement system 27 includes an actuator such as a voice coil motor disposed between the substrate stage main body 20 and the substrate table 21, and can move the substrate table 21 relative to the substrate stage main body 20. In the present embodiment, the first fine movement system 27 is capable of moving the substrate table 21 in the X axis, Y axis, Z axis, θX, θY, and θZ directions with respect to the substrate stage main body 20.

  The second coarse movement system 28 includes an actuator such as a linear motor, and can move the measurement stage main body 23 in the X axis, Y axis, and θZ directions. As the measurement stage main body 23 moves, the measurement table 24 mounted on the measurement stage main body 23 also moves together with the measurement stage main body 23. The second fine movement system 29 includes an actuator such as a voice coil motor disposed between the measurement stage main body 23 and the measurement table 24, and can move the measurement table 24 relative to the measurement stage main body 23. In the present embodiment, the second fine movement system 29 can move the measurement table 24 in the X axis, Y axis, Z axis, θX, θY, and θZ directions with respect to the measurement stage main body 23.

  In FIG. 2, the second drive system 6 includes a plurality of linear motors 30, 31, 32, 33, 34, and 35. The second drive system 6 includes a pair of Y-axis guide members 36 and 37 extending in the Y-axis direction. Each of the Y-axis guide members 36 and 37 includes a coil unit having a plurality of coils. One Y-axis guide member 36 supports two slide members 38 and 39 so as to be movable in the Y-axis direction, and the other Y-axis guide member 37 can move two slide members 40 and 41 in the Y-axis direction. To support. Each of the slide members 38, 39, 40, 41 includes a magnet unit having a plurality of permanent magnets. That is, in this embodiment, the moving magnet type Y-axis linear motors 30 and 31 are formed by the slide members 38 and 39 including the magnet unit and the Y-axis guide member 36 including the coil unit. Similarly, the moving magnet type Y-axis linear motors 32 and 33 are formed by the slide members 40 and 41 having a magnet unit and the Y-axis guide member 37 having a coil unit.

  The second drive system 6 includes a pair of X-axis guide members 42 and 43 extending in the X-axis direction. Each of the X-axis guide members 42 and 43 includes a coil unit having a plurality of coils. One X-axis guide member 42 supports a slide member 44 connected to the substrate stage main body 20 so as to be movable in the X-axis direction, and the other X-axis guide member 43 is a slide member connected to the measurement stage main body 23. 45 is supported so as to be movable in the X-axis direction. Each of the slide members 44 and 45 includes a magnet unit having a plurality of permanent magnets. That is, in this embodiment, the moving magnet type that drives the substrate stage body 20 in the X-axis direction by the slide member 44 having a magnet unit connected to the substrate stage body 20 and the X-axis guide member 42 having a coil unit. The X-axis linear motor 34 is formed. Similarly, a moving magnet type X-axis linear motor that drives the measurement stage main body 23 in the X-axis direction by a slide member 45 having a magnet unit connected to the measurement stage main body 23 and an X-axis guide member 43 having a coil unit. 35 is formed.

  The slide members 38 and 40 are fixed to one end and the other end of the X-axis guide member 42, and the slide members 39 and 41 are fixed to one end and the other end of the X-axis guide member 43, respectively. Therefore, the X-axis guide member 42 can be moved in the Y-axis direction by the Y-axis linear motors 30 and 32, and the X-axis guide member 43 can be moved in the Y-axis direction by the Y-axis linear motors 31 and 33.

  The control device 15 can control the position in the θZ direction of the substrate stage 1 (substrate stage body 20) by making the thrust generated by each of the pair of Y-axis linear motors 30 and 32 different, and the pair of Y-axis By making the thrust generated by each of the linear motors 31 and 33 different, the position of the measurement stage 2 (measurement stage main body 23) in the θZ direction can be controlled.

  In the present embodiment, the first coarse movement system 26 includes Y-axis linear motors 30 and 32 and an X-axis linear motor 34. The second coarse movement system 28 includes Y-axis linear motors 31 and 33 and an X-axis linear motor 35.

  The exposure apparatus EX1 of the present embodiment exposes the substrate P with the exposure light EL through the liquid LQ. The exposure apparatus EX1 forms the liquid immersion part LS with the liquid LQ so that at least a part of the optical path space of the exposure light EL is filled with the liquid LQ. The optical path space of the exposure light EL is a space including the optical path through which the exposure light EL passes. The liquid immersion part LS is a part (space, region) filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In the present embodiment, among the plurality of optical elements of the projection optical system PL, the optical path space of the exposure light EL emitted from the terminal optical element 46 closest to the image plane of the projection optical system PL is filled with the liquid LQ. The liquid immersion part LS is formed with the liquid LQ. The last optical element 46 has a lower surface (exit surface) 46A that emits the exposure light EL toward the image plane of the projection optical system PL. The terminal optical element 46 can hold the liquid LQ between a lower surface 46A of the terminal optical element 46 and a predetermined member disposed at a position facing the lower surface 46A of the terminal optical element 46. In the liquid immersion part LS, the optical path space of the exposure light EL between the lower surface 46A of the terminal optical element 46 and a predetermined member disposed at a position facing the lower surface 46A of the terminal optical element 46 is filled with the liquid LQ. Formed. The exposure apparatus EX1 exposes the substrate P by irradiating the substrate P with the exposure light EL through the liquid LQ of the liquid immersion part LS.

  As shown in FIG. 1, the exposure apparatus EX1 of the present embodiment uses the liquid LQ to fill the liquid immersion part LS so that the optical path space of the exposure light EL emitted from the lower surface 46A of the terminal optical element 46 is filled with the liquid LQ. A liquid immersion member 47 that can be formed is provided. The liquid immersion member 47 is disposed in the vicinity of the last optical element 46. The liquid immersion member 47 has a lower surface (liquid contact surface) 47A that can face a predetermined member disposed at a position facing the lower surface 46A of the last optical element 46. The lower surface 47A can contact the liquid LQ. The liquid immersion member 47 can form the liquid immersion part LS with the liquid LQ between a predetermined member arranged at a position facing the lower surface 47A. In the present embodiment, the liquid immersion part LS is formed by the liquid LQ held between the terminal optical element 46 and the liquid immersion member 47 and a predetermined member facing the terminal optical element 46 and the liquid immersion member 47. .

  The predetermined member that can be disposed at a position facing the terminal optical element 46 and the liquid immersion member 47 includes a member that can move on the light emission side of the terminal optical element 46 (the image plane side of the projection optical system PL). A member that can be moved to a position to which the exposure light EL emitted from the lower surface 46A of 46 is irradiated.

  In the present embodiment, the predetermined member that can be disposed at a position facing the lower surface 46 </ b> A of the last optical element 46 includes at least one of the substrate stage 1 and the measurement stage 2. Further, the predetermined member includes the substrate P held on the substrate stage 1. The predetermined member includes various measurement members (optical components) mounted on the measurement stage 2.

  For example, the terminal optical element 46 and the liquid immersion member 47 can hold the liquid LQ between the substrate stage 1 (substrate P) disposed at a position facing the lower surface 46A of the terminal optical element 46. Further, the terminal optical element 46 and the liquid immersion member 47 can hold the liquid LQ between the measurement stage 2 disposed at a position facing the lower surface 46A of the terminal optical element 46.

  In the present embodiment, a liquid immersion part LS is formed by the liquid immersion member 47 so that a partial region (local region) of the surface of the predetermined member is covered with the liquid LQ, and the surface of the predetermined member A gas-liquid interface (meniscus, edge) LG of the liquid LQ is formed between the liquid immersion member 47 and the lower surface 47A of the liquid immersion member 47. For example, when the substrate P is exposed, the liquid immersion part LS is formed with the liquid LQ so that a part of the region on the substrate P including the projection region PR of the projection optical system PL is covered with the liquid LQ. That is, the immersion exposure apparatus EX1 of the present embodiment employs a local immersion method.

  The lower surface 46 </ b> A of the last optical element 46 is disposed at a position facing the guide surface 7. The substrate stage 1 can move within a predetermined region of the guide surface 7 including a position facing the lower surface 46A of the terminal optical element 46, and can be disposed at a position facing the lower surface 46A of the terminal optical element 46. The measurement stage 2 can move independently of the substrate stage 1 within a predetermined region of the guide surface 7 including a position facing the lower surface 46A of the terminal optical element 46, and a position facing the lower surface 46A of the terminal optical element 46. Can be arranged.

  The first cleaning device 16 can clean the substrate holding part 4 of the substrate stage 1. The first cleaning device 16 of the present embodiment includes a polishing device 18 including a polishing member 17 that polishes the substrate holding portion 4 as disclosed in, for example, US Pat. No. 5,559,582. In the present embodiment, the polishing apparatus 18 includes the polishing member 17, a support member 48 that can support the polishing member 17, and a drive device 49 that can move the support member 48.

In the present embodiment, the polishing member 17 includes a grindstone capable of polishing the substrate holding unit 4. The grindstone is formed of a porous member such as alumina (Al ₂ O ₃ ), white ceramics, alkane stone, TiO ₂ , ZrO ₂ , ruby, Altech, or the like.

  The polishing member 17 has a lower surface (polishing surface) 17 </ b> A that can face the substrate holding unit 4. In the present embodiment, the lower surface 17A of the polishing member 17 is substantially parallel to the XY plane.

  The driving device 49 can move the support member 48. The driving device 49 can move the polishing member 17 by moving the support member 48. In the present embodiment, the driving device 49 can move the polishing member 17 at least in the X-axis, Y-axis, and Z-axis directions.

  With the driving device 49, the lower surface 17 </ b> A of the polishing member 17 can be disposed at a position facing the guide surface 7. Further, the substrate stage 1 including the substrate holding part 4 is movable to a position facing the lower surface 17A of the polishing member 17.

  That is, in the present embodiment, the substrate stage 1 is movable within a predetermined region of the guide surface 7 including a position facing the lower surface 46A of the last optical element 46 and a position facing the lower surface 17A of the polishing member 17. . In the following description, a position facing the lower surface 46A of the last optical element 46 is appropriately referred to as an exposure position PJ1, and a position facing the lower surface 17A of the polishing member 17 is appropriately referred to as a cleaning position PJ2. The exposure position PJ1 and the cleaning position PJ2 are separated from each other. The first cleaning device 16 can clean the substrate holding part 4 of the substrate stage 1 disposed at the cleaning position PJ2.

  At the time of exposure of the substrate P, the substrate P held on the substrate stage 1 is disposed at the exposure position PJ1 so as to face the terminal optical element 46 and the liquid immersion member 47. At least during exposure of the substrate P, a liquid is interposed between the terminal optical element 46 and the liquid immersion member 47 and the substrate P so that the optical path space of the exposure light EL emitted from the lower surface 46A of the terminal optical element 46 is filled with the liquid LQ. LQ is held and the liquid immersion part LS is formed.

  At the time of measurement using the measurement stage 2, the measurement member mounted on the measurement stage 2 is arranged at the exposure position PJ 1 so as to face the terminal optical element 46 and the liquid immersion member 47. At the time of measurement using the measurement member, a liquid is interposed between the last optical element 46 and the liquid immersion member 47 and the measurement member so that the optical path space of the exposure light EL emitted from the lower surface 46A of the last optical element 46 is filled with the liquid LQ. LQ is held and the liquid immersion part LS is formed.

  In the present embodiment, when the substrate holder 4 is cleaned using the first cleaning device 16, the measurement stage 2 is disposed at the exposure position PJ 1 so as to face the terminal optical element 46 and the liquid immersion member 47. . During the cleaning of the substrate holder 4 using the first cleaning device 16, the liquid LQ is held between the last optical element 46 and the liquid immersion member 47 and the measurement stage 2, and the liquid immersion part LS is formed.

  The transport system 13 can transport the substrate P. The transport system 13 includes a transport member 50 that can transport the substrate P. The conveyance member 50 includes a conveyance member that can carry (load) the substrate P before exposure into the substrate holding unit 4 and a conveyance member that can carry out (unload) the substrate P after exposure from the substrate holding unit 4. The transport system 13 may use one transport member to load the substrate P onto the substrate holding unit 4 and unload the substrate P from the substrate holding unit, or to transfer the substrate P to the substrate holding unit 4. Each of the conveyance member for loading and the conveyance member for unloading the substrate P from the substrate holding unit 4 may be provided.

  When loading the substrate P onto the substrate holding unit 4 or unloading the substrate P from the substrate holding unit 4, the control device 15 moves the substrate stage 1 to a substrate exchange position (loading) different from the exposure position PJ1 and the cleaning position PJ2. Position) Move to PJ3. The transport system 13 can execute at least one of loading and unloading of the substrate P on the substrate holding unit 4 of the substrate stage 1 moved to the substrate exchange position PJ3. The control device 15 uses the transport system 13 to unload (carry out) the substrate P after exposure from the substrate stage 1 (substrate holding unit 4) moved to the substrate exchange position PJ3, and then is exposed. Substrate replacement processing including an operation of loading (carrying in) the substrate P before power exposure to the substrate stage 1 (substrate holding unit 4) can be executed.

  The focus / leveling detection system 12 can detect surface position information (θX, θY, and position information regarding the Z-axis direction) of the surface of the substrate P held by the substrate holding unit 4. In the present embodiment, the focus / leveling detection system 12 is a so-called oblique incidence type multi-point focus / leveling detection system. The focus / leveling detection system 12 includes an irradiation device 51 that irradiates the detection light LU from each of a plurality of detection points Kij on the surface of the substrate P in a direction inclined with respect to the Z-axis direction (height direction), and the substrate P And a light receiving device 52 capable of receiving the detection light LU reflected by the surface of the light. The irradiation device 51 emits non-photosensitive detection light LU to the photosensitive film on the substrate P. The light reception result of the light receiving device 52 of the focus / leveling detection system 12 is output to the control device 15. Based on the output result of the focus / leveling detection system 12, the control device 15 positions information (surface position information) regarding the Z-axis direction (height direction) and the tilt directions (θX and θY directions) of the surface of the substrate P. Can be detected. An example of an oblique incidence type multi-point focus / leveling detection system is disclosed in, for example, International Publication No. 2005/096354 (corresponding US Application No. 10 / 594,509).

  In the present embodiment, the focus / leveling detection system 12 is disposed between the substrate replacement position PJ3 and the exposure position PJ1. The focus / leveling detection system 12 detects surface position information (including height information) of the substrate P held by the substrate holder 4 between the substrate replacement position PJ3 and the exposure position PJ1. In other words, the focus / leveling detection system 12 detects the surface position information of the substrate P on the substrate stage 1 disposed between the substrate replacement position PJ3 and the exposure position PJ1.

  The focus / leveling detection system 12 holds the surface position information of the substrate P (substrate P before exposure) held by the substrate holding unit 4 and moved (arranged) to the exposure position PJ1 as the substrate exchange position PJ3 and the exposure position. Detected with PJ1. That is, in the present embodiment, the focus / leveling detection system 12 obtains the surface position information of the substrate P before the substrate P is irradiated with the exposure light EL (before the exposure processing of the substrate P is started). Obtain in advance.

  Position information of the substrate table 21 (substrate P) in the X-axis, Y-axis, and θZ directions is measured by the laser interferometer 11B of the interferometer system 11. The laser interferometer 11 </ b> B measures position information using the reflection mirror 1 </ b> R provided on the substrate table 21. The control device 15 drives the second drive system 6 based on the measurement result of the interferometer system 11 including the laser interferometer 11B and the detection result of the focus / leveling detection system 12, and holds the second drive system 6 on the substrate holder 4 of the substrate table 21. The position of the substrate P is controlled.

  Position information in the X-axis, Y-axis, and θZ directions of the measurement table 24 (measurement member) is measured by the laser interferometer 11C of the interferometer system 11. The laser interferometer 11 </ b> C measures position information using the reflection mirror 2 </ b> R provided on the measurement table 24. Further, surface position information (position information regarding the Z-axis, θX, and θY directions) of the upper surface 25 of the measurement table 24 is detected by the focus / leveling detection system 12. The control device 15 drives the second drive system 6 based on the measurement result of the interferometer system 11 including the laser interferometer 11C and the detection result of the focus / leveling detection system 12, and controls the position of the measurement table 24.

  The first alignment system 9 is a TTR (Through The Reticle) type alignment system using light of an exposure wavelength, and is provided on the measurement stage 2 so as to correspond to the alignment mark on the mask M and the alignment mark. The conjugate image of the first fiducial mark FM1 through the projection optical system PL is simultaneously observed. The first alignment system 9 of the present embodiment irradiates light on a target mark (such as the alignment mark on the mask M and the first reference mark FM1) as disclosed in, for example, US Pat. No. 5,646,413. Then, a VRA (Visual Reticle Alignment) system is employed in which image data of a mark imaged by an image sensor such as a CCD is processed to detect the mark position. An alignment system that receives detection light via a projection optical system PL and a first reference mark including a light transmission portion, as disclosed in US Patent Application Publication No. 2002/0041377, etc. Instead of the one alignment system 9, it may be used.

  The second alignment system 10 is an off-axis alignment system, and detects an alignment mark on the substrate P, a second reference mark FM2 provided on the measurement stage 2, and the like. The second alignment system 10 according to the present embodiment uses, for example, broadband detection light that does not expose a photosensitive material on the substrate P as disclosed in US Pat. No. 5,493,403, as a target mark (an alignment mark on the substrate P, And the second reference mark FM2, etc.) and an image of the target mark imaged on the light receiving surface by the reflected light from the target mark and the index (the index mark on the index plate provided in the second alignment system 10) The FIA (Field Image Alignment) type alignment system that measures the position of the mark by image-processing the captured image using an image pickup device such as a CCD and processing the image pickup signals is employed.

  The substrate temperature adjusting device 14 adjusts the temperature of the substrate P before exposure. The substrate temperature adjusting device 14 is controlled by the control device 15. In the present embodiment, the substrate temperature adjusting device 14 includes a holding member 54 having a holding portion 53 to which the substrate P can be attached and detached. The holding portion 53 of the holding member 54 can face the back surface of the substrate P, and holds the back surface of the substrate P. The holding member 54 includes a temperature adjustment mechanism 55 including a heating mechanism and a cooling mechanism, and can adjust the temperature of the substrate P held by the holding unit 53.

  In the present embodiment, the holding member 54 is disposed on the conveyance path of the conveyance system 13. The transport system 13 transports the substrate P to the holding member 54 before transporting the substrate P to the substrate holder 4 of the substrate stage 1. In the present embodiment, the holding member 54 is disposed in the vicinity of the substrate replacement position PJ3. The transport member 50 can load the substrate P, the temperature of which has been adjusted by the holding member 54, onto the substrate holding unit 4 of the substrate stage 1 that has been moved to the substrate exchange position PJ3. The transport system 13 transports the substrate P to the substrate holding unit 4 of the substrate stage 1.

  In the present embodiment, the measurement stage 2 includes a plurality of measuring instruments and measuring members (optical components) for performing various measurements related to exposure. At a predetermined position on the upper surface 25 of the measurement table 24 of the measurement stage 2, a slit plate 57 on which an opening pattern 56 capable of transmitting the exposure light EL is formed is provided as a measurement member. The slit plate 57 constitutes a part of an aerial image measurement system 58 as disclosed in, for example, US Patent Application Publication No. 2002/0041377. The slit plate 57 is irradiated with the exposure light EL from the projection optical system PL in order to measure the imaging characteristics of the projection optical system PL. The aerial image measurement system 58 includes a slit plate 57 and a light receiving element that receives the exposure light EL through the opening pattern 56 of the slit plate 57. The control device 15 irradiates the slit plate 57 with the exposure light EL, receives the exposure light EL through the opening pattern 56 of the slit plate 57 by the light receiving element, and measures the imaging characteristics of the projection optical system PL. To do. The light receiving element of the aerial image measurement system 58 is disposed below the slit plate 57 and receives light through the opening pattern 56 of the slit plate 57.

  In addition, an upper plate 60 on which a transmission pattern 59 capable of transmitting the exposure light EL is formed as a measurement member is provided at a predetermined position on the upper surface 25 of the measurement table 24. The upper plate 60 constitutes a part of an illuminance unevenness measuring system 61 that can measure the illuminance unevenness of the exposure light EL as disclosed in, for example, US Pat. No. 4,465,368. The upper plate 60 is irradiated with the exposure light EL from the projection optical system PL in order to measure the illuminance unevenness of the exposure light EL irradiated to the image plane side of the projection optical system PL. The illuminance unevenness measurement system 61 includes an upper plate 60 and a light receiving element that receives the exposure light EL through the opening pattern 59 of the upper plate 60. The control device 15 irradiates the upper plate 60 with the exposure light EL, receives the exposure light EL through the opening pattern 59 of the upper plate 60, and measures the illuminance unevenness of the exposure light EL. The light receiving element of the illuminance unevenness measuring system 61 is disposed below the upper plate 60 and receives light through the opening pattern 59 of the upper plate 60.

  Note that the upper plate 60 is a measurement system for measuring the variation in the transmittance of the exposure light EL of the projection optical system PL as disclosed in, for example, US Pat. No. 6,721,039, for example, US Pat. Exposure dose of exposure light EL such as a dose measurement system (illuminance measurement system) as disclosed in the specification of 2002/0061469, for example, a wavefront aberration measurement system as disclosed in the specification of European Patent No. 1079223 It may constitute a part of a measurement system that measures information about energy. In that case, a light receiving element that constitutes a part of the measurement system is disposed below the upper plate 60.

  A reference plate 62 is provided as a measurement member at a predetermined position on the upper surface 25 of the measurement table 24 of the measurement stage 2. The reference plate 62 includes a first reference mark FM1 measured by the first alignment system 9 and a second reference mark FM2 measured by the second alignment system 10. In the present embodiment, the first alignment system 9 measures the first reference mark FM1 via the projection optical system PL and the liquid LQ of the liquid immersion unit LS. The second alignment system 10 measures the second fiducial mark FM2 without going through the liquid LQ.

  In the present embodiment, the upper surface of the slit plate 57, the upper surface of the upper plate 60, the upper surface of the reference plate 62, and the upper surface 25 of the measurement table 24 are arranged in substantially the same plane (in the XY plane) ( Is almost the same).

  FIG. 3 is a side sectional view showing the vicinity of the substrate stage 1 and the liquid immersion member 47. In FIG. 3, the substrate table 21 includes a substrate holding unit 4 that holds the substrate P in a detachable manner. The substrate holding unit 4 faces the back surface of the substrate P and holds the back surface of the substrate P in a detachable manner. The upper surface 22 of the substrate table 21 is disposed around the substrate holding unit 4. The substrate holding unit 4 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the substrate holding unit 4 and the upper surface 22 of the substrate table 21 are substantially parallel. In the present embodiment, the surface of the substrate P held by the substrate holding unit 4 and the upper surface 22 of the substrate table 21 are arranged in substantially the same plane (almost flush).

  In the present embodiment, the substrate table 21 has a detachable plate member T. The substrate table 21 has a plate member holding portion 63 that is disposed around the substrate holding portion 4 and holds the plate member T in a detachable manner. The plate member holding portion 63 faces the lower surface of the plate member T and holds the lower surface of the plate member T so as to be detachable.

  The plate member T has an opening TH in which the substrate P can be disposed. The plate member T held by the plate member holding portion 63 is disposed around the substrate P held by the substrate holding portion 4. In the present embodiment, the upper surface 22 of the substrate table 21 includes the upper surface of the plate member T held by the plate member holding portion 63.

  In the present embodiment, the inner surface of the opening TH of the plate member T held by the plate member holding portion 63 and the outer surface of the substrate P held by the substrate holding portion 4 are arranged to face each other with a predetermined gap. Is done. The plate member holding part 63 holds the plate member T so that the upper surface 22 of the plate member T and the XY plane are substantially parallel. Further, the plate member holding portion 63 holds the plate member T so that the upper surface 22 of the plate member T and the surface of the substrate P held by the substrate holding portion 4 are substantially flush with each other.

  Each of the substrate holder 4 and the plate member holder 63 includes a so-called pin chuck mechanism. As shown in FIG. 3, the substrate holding part 4 is formed on the base material 21B of the substrate table 21, and includes a plurality of pin members 64 that support the back surface of the substrate P, and a plurality of pin members 64 on the base material 21B. A plurality of first peripheral walls 65 disposed around and a first suction port 66 provided on the base material 21 </ b> B inside the first peripheral wall 65 and capable of sucking gas are provided.

  The plate member holding portion 63 includes a second peripheral wall 67 formed around the first peripheral wall 65 on the base material 21B, a third peripheral wall 68 formed around the second peripheral wall 67 on the base material 21B, A plurality of pin members 69 that are formed on the base material 21B between the second peripheral wall 67 and the third peripheral wall 68 and support the lower surface of the plate member T, and a base material between the second peripheral wall 67 and the third peripheral wall 68 A plurality of second suction ports 70 are provided on 21B and capable of sucking gas.

  The gas in the space surrounded by the back surface of the substrate P, the first peripheral wall 65, and the base material 21B is sucked by the first suction port 66, and the space becomes negative pressure, so that the back surface of the substrate P becomes the pin member 64. Adsorbed and held. In addition, the substrate P can be removed from the substrate holding unit 4 by stopping the suction operation using the first suction port 66.

  Further, the gas in the space surrounded by the lower surface of the plate member T, the second peripheral wall 67, the third peripheral wall 68, and the base material 21B is sucked by the second suction port 70, and the space becomes negative pressure. The lower surface of the member T is attracted and held by the pin member 69. Further, the plate member T can be removed from the plate member holding portion 63 by stopping the suction operation using the second suction port 70.

  The liquid immersion member 47 is an annular member and is disposed around the terminal optical element 46. The liquid immersion member 47 has an opening 71 disposed at a position facing the lower surface 46A of the last optical element 46. The liquid immersion member 47 includes a supply port 72 that can supply the liquid LQ and a recovery port 73 that can recover the liquid LQ.

  The supply port 72 can supply the liquid LQ to the optical path space of the exposure light EL in order to form the liquid immersion part LS. The supply port 72 is disposed at a predetermined position of the liquid immersion member 47 facing the optical path space in the vicinity of the optical path space of the exposure light EL. The exposure apparatus EX1 includes a liquid supply device 74. The liquid supply device 74 can deliver a clean and temperature-adjusted liquid LQ. The supply port 72 and the liquid supply device 74 are connected via a flow path 75. The flow path 75 includes a supply flow path formed inside the liquid immersion member 47 and a flow path formed by a supply pipe 76 that connects the supply flow path and the liquid supply device 74. The liquid LQ delivered from the liquid supply device 74 is supplied to the supply port 72 via the flow path 75. The supply port 72 supplies the liquid LQ from the liquid supply device 74 to the optical path space of the exposure light EL.

  The recovery port 73 can recover at least a part of the liquid LQ on a predetermined member facing the lower surface 47A of the liquid immersion member 47. In the present embodiment, the recovery port 73 is disposed around the optical path space of the exposure light EL. The recovery port 73 is disposed at a predetermined position of the liquid immersion member 47 facing the surface of the predetermined member. A plate-like porous member (mesh member) 77 including a plurality of holes (openings or pores) is disposed in the recovery port 73. In addition, the exposure apparatus EX1 includes a liquid recovery apparatus 78 that can recover the liquid LQ. The liquid recovery device 78 includes a vacuum system and can recover the liquid LQ by suction. The recovery port 73 and the liquid recovery device 78 are connected via a flow path 79. The flow path 79 includes a recovery flow path formed inside the liquid immersion member 47 and a flow path formed by a recovery pipe 80 that connects the recovery flow path and the liquid recovery device 78. The liquid LQ recovered from the recovery port 73 is recovered by the liquid recovery device 78 via the flow path 79.

  In the present embodiment, the control device 15 executes the liquid recovery operation using the recovery port 73 in parallel with the liquid supply operation using the supply port 72, so that the terminal optical element 46 and the liquid immersion member 47 are terminated. The liquid immersion part LS can be formed with the liquid LQ between the optical element 46 and the predetermined member facing the liquid immersion member 47.

  In this embodiment, as disclosed in, for example, U.S. Patent Application Publication No. 2006/0023186, U.S. Patent Application Publication No. 2007/0127006, etc., the control device 15 includes the substrate table 21 and The upper surface 22 of the substrate table 21 and the upper surface 25 of the measurement table 24 are approached so that at least one of the measurement table 24 continues to form a space capable of holding the liquid LQ between the terminal optical element 46 and the liquid immersion member 47. Alternatively, in the state of contact, at least one of the upper surface 22 of the substrate table 21 and the upper surface 25 of the measurement table 24 is opposed to the lower surface 46A of the terminal optical element 46 and the lower surface 47A of the liquid immersion member 47, and the terminal optical element 46 and The substrate table 21 and the measurement table 24 can be synchronously moved in the XY direction with respect to the liquid immersion member 47.Thereby, the liquid immersion part LS of the liquid LQ can move between the upper surface 22 of the substrate table 21 and the upper surface 25 of the measurement table 24 while suppressing leakage of the liquid LQ. When the liquid LQ immersion portion LS is moved between the upper surface 22 of the substrate table 21 and the upper surface 25 of the measurement table 24, the upper surface 22 of the substrate table 21 and the upper surface 25 of the measurement table 24 are substantially the same height. The positional relationship between the substrate table 21 and the measurement table 24 is adjusted so as to be in the same plane.

  4 and 5 are schematic views showing a state in which the focus / leveling detection system 12 detects the surface position information of the substrate P on the substrate stage 1. FIG. 4 is a plan view, and FIG. It is a side view.

  As described above, in the present embodiment, the focus / leveling detection system 12 uses the surface position information of the surface of the substrate P held by the substrate holding unit 4 between the substrate replacement position PJ3 and the exposure position PJ1. To detect.

  In the present embodiment, the focus / leveling detection system 12 irradiates each of the plurality of detection points Kij on the surface of the substrate P held by the substrate holding unit 4 with the detection light LU, and the plurality of detection points Kij. The height information Zij corresponding to the position in the height direction (Z-axis direction) of the surface of the substrate P in each can be detected. That is, the focus / leveling detection system 12 can set a plurality of detection points Kij on the surface of the substrate P, and can detect the position in the height direction of the surface of the substrate P at each of the plurality of detection points Kij.

  The irradiation device 51 of the focus / leveling detection system irradiates the detection light LU from above the substrate P to each of a plurality of positions (detection points) on the surface of the substrate P held by the substrate holding unit 4. The light receiving device 52 can receive the detection light LU emitted from the irradiation device 51 and reflected by the surface of the substrate P.

  The irradiation device 51 includes a plurality of emission units 51S that emit the detection light LU. The irradiation device 51 emits the detection light LU from each of the plurality of emission units 51 </ b> S and irradiates the surface of the substrate P with the plurality of detection lights (light beams) LU. In the present embodiment, the irradiation device 51 irradiates the detection light LU to each of a plurality of detection points set along the X-axis direction on the surface of the substrate P.

  In the present embodiment, the control device 15 moves the substrate stage 1 in the Y-axis direction while measuring the position information of the substrate stage 1 (substrate table 21) using the interferometer system 11 including the laser interferometer 11B. However, the irradiation device 51 of the focus / leveling detection system 12 irradiates the detection light LU onto the substrate P held by the substrate holding unit 4. Thereby, the detection light LU is irradiated on almost the entire surface of the substrate P. The detection light LU irradiated to each of the plurality of detection points Kij on the surface of the substrate P is reflected by the surface of the substrate P and received by the light receiving device 52. The light receiving device 52 outputs a detection signal corresponding to the height information Zij corresponding to the position in the height direction of the surface of the substrate P with respect to each of the plurality of detection points Kij to the control device 15.

  FIG. 6 is a schematic diagram showing the position of the detection point Kij on the surface of the substrate P held by the substrate holding unit 4. As shown in FIG. 6, on the surface of the substrate P, a plurality of detection points Kij are set in a matrix in the X axis direction and the Y axis direction.

  Based on the height information Zij relating to each of the plurality of detection points Kij, the control device 15 performs positional information (surfaces) relating to the Z-axis direction (height direction) and the inclination directions (θX and θY directions) of the surface of the substrate P. Position information) can be acquired.

  Using the height information Zij output from the light receiving device 52, the control device 15 uses the height information Zij at each detection point Kij with respect to a predetermined reference plane Zo (for example, the image plane of the projection optical system PL, the best imaging plane). Position information in the height direction of the surface of the substrate P is acquired.

  For example, when the surface of the substrate P at a predetermined detection point among the plurality of detection points Kij is disposed on the reference plane Zo (or when the surface of the substrate P has a predetermined positional relationship with respect to the reference plane Zo). The focus / leveling detection system 12 outputs height information Zij in a predetermined state (for example, a zero level state). In other words, when the surface of the substrate P and the reference surface Zo match (or when the surface of the substrate P and the reference surface Zo are in a predetermined positional relationship), the light receiving device 52 can increase the height of the predetermined state. The state of the focus / leveling detection system 12 is adjusted (calibrated) so that the height information Zij is output. Further, the height information Zij at each measurement point Kij output from the focus / leveling detection system 12 changes in proportion to the difference between the reference plane Zo and the position in the height direction at the measurement point Kij. The focus leveling detection system 12 can be calibrated by using the aerial image measurement system 58. An example of the calibration method is disclosed in, for example, US Patent Application Publication No. 2002/0041377. ing.

  The control device 15 can obtain the position in the height direction (Z-axis direction) with respect to the reference plane Zo at each of the detection points Kij based on the height information Zij for each of the detection points Kij. In other words, the control device 15 can obtain the position of each detection point Kij in the height direction and the positional relationship between the reference plane Zo.

  Further, the control device 15 determines the shape of the surface of the substrate P held by the substrate holding unit 4 (approximate plane, unevenness) with reference to the reference surface Zo based on the height information Zij related to each detection point Kij. Information).

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX1 having the above-described configuration and a method for cleaning the substrate holding unit 4 will be described.

  In the present embodiment, based on the detection result of the focus / leveling detection system 12, the cleaning operation for the substrate holder 4 using the first cleaning device 16 is controlled.

  In the present embodiment, at least one of the height information Zij relating to each of the plurality of detection points Kij on the surface of the substrate P held by the substrate holding unit 4 detected using the focus / leveling detection system 12 is abnormal. It is determined whether or not there is, and based on the determination result, it is determined whether or not to start the cleaning operation using the first cleaning device 16.

  Here, the abnormality of the height information Zij is a state in which the height information Zij with respect to the reference surface Zo (difference in the Z-axis direction between the reference surface Zo and the height information Zij) is equal to or greater than a predetermined allowable value. Including. When the height information Zij with respect to the reference surface Zo is less than the allowable value, the immersion exposure of the substrate P can be performed satisfactorily, and the defects of the pattern formed on the substrate P can be suppressed to an allowable level or less.

  Further, in the present embodiment, after the height information Zij of the surface of the first substrate P1 held by the substrate holding unit 4 is detected by the focus / leveling detection system 12, the first substrate P1 is immersed in the liquid. The exposure and the unloading of the exposed first substrate P1 from the substrate holding unit 4 are executed, and then the second substrate P2 is loaded on the substrate holding unit 4 and held by the substrate holding unit 4 The height information Zij on the surface of the second substrate P2 thus detected is detected by the focus / leveling detection system 12. In the present embodiment, the cleaning operation using the first cleaning device 16 is controlled based on the detection result related to the first substrate P1 and the detection result related to the second substrate P2.

  In the present embodiment, the position of the detection point Kij where the height information Zij is abnormal on the surface of the first substrate P1 with respect to the substrate holder 4 and the detection point where the height information Zij is abnormal on the surface of the second substrate P2. The cleaning operation using the first cleaning device 16 is controlled based on the relationship between the position of Kij relative to the substrate holding unit 4.

  Specifically, the position of the detection point Kij with the abnormal height information Zij on the surface of the second substrate P2 with respect to the substrate holder 4 is the detection point Kij with the abnormal height information Zij on the surface of the first substrate P1. If it is determined that the position of the second substrate P2 is substantially the same as the position of the substrate holding unit 4, the second substrate P2 held by the substrate holding unit 4 is carried out of the substrate holding unit 4 without immersion exposure of the substrate P2 ( After unloading, the cleaning operation for the substrate holder 4 using the first cleaning device 16 is started.

  As one of the causes that the height information Zij becomes abnormal, as shown in the schematic diagram of FIG. 7, foreign matter exists in the substrate holding part 4, and the foreign matter is arranged between the back surface of the substrate P and the substrate holding part 4. It can be mentioned that a situation occurs. When a foreign substance is arranged between the back surface of the substrate P and the substrate holding part 4, the shape of the surface of the substrate P changes locally (deforms) in the portion where the foreign substance exists as shown in FIG. )there's a possibility that. That is, there is a possibility that a local region on the surface of the substrate P corresponding to a portion where foreign matter exists is deformed so as to swell (convex) toward the + Z side. In the following description, a region (portion) in which the shape of the surface of the substrate P has locally changed corresponding to a portion where foreign matter exists is appropriately referred to as a deformation region CA.

  When the deformation amount (deformation amount in the height direction) of the deformation area CA on the surface of the substrate P is equal to or larger than a predetermined allowable value, the height information Zij related to the detection point Kij determined in the deformation area CA is abnormal. It becomes.

  Accordingly, the height information Zij at each of the plurality of detection points Kij on the surface of the first substrate P1 held by the substrate holding unit 4 is detected by the focus / leveling detection system 12, and then the substrate holding unit 4 receives the first information. A second substrate P2 different from the first substrate P1 is carried in, and the height information Zij at each of a plurality of detection points Kij on the surface of the second substrate P2 held by the substrate holding unit 4 is detected by focus / leveling detection. When the detection is performed by the system 12, the position of the detection point Kij where the height information Zij is abnormal on the surface of the second substrate P2 with respect to the substrate holding unit 4 is not normal, and the height information Zij is abnormal on the surface of the first substrate P1. When the position of the detection point Kij is substantially the same as the position with respect to the substrate holding unit 4, there is a high possibility that foreign matter is present (attached) to the substrate holding unit 4. In other words, when the position of the deformation area CA in the first substrate P1 with respect to the substrate holder 4 and the position of the deformation area CA in the second substrate P2 with respect to the substrate holder 4 are substantially the same, the substrate holder 4 It is considered that foreign matter is present (attached) on the surface.

  For this reason, in the present embodiment, the control device 15 determines that the position of the detection point Kij where the height information Zij is abnormal on the surface of the second substrate P2 with respect to the substrate holder 4 is the height on the surface of the first substrate P1. When it is determined that the information Zij is substantially the same as the position of the abnormal detection point Kij with respect to the substrate holding unit 4, it is determined that foreign matter is present (attached) to the substrate holding unit 4 and is held by the substrate holding unit 4. After unloading the second substrate P <b> 2 from the substrate holder 4, a cleaning operation for the substrate holder 4 using the first cleaning device 16 is started.

  Further, as one of the causes that the height information Zij becomes abnormal, as shown in FIG. 8, there is a situation in which foreign matter exists (attaches) on the surface of the substrate P held by the substrate holding unit 4. Is mentioned. When a foreign substance exists on the surface of the substrate P and the size of the foreign substance (size in the height direction) is equal to or greater than a predetermined allowable value, the height related to the detection point Kij corresponding to the portion where the foreign substance exists Information Zij becomes abnormal.

  Even if foreign matter exists (attaches) on the surface of the substrate P held by the substrate holding unit 4, there is a possibility that the foreign matter does not adhere to the surface of the substrate P newly carried into the substrate holding unit 4. high. Further, even if foreign matter adheres to the surface of the substrate P after replacement, the position of the foreign matter attached to the surface of the substrate P before replacement with respect to the substrate holder 4 and the surface of the substrate P after replacement It is considered that there is a high possibility that the position of the foreign matter on the substrate holder 4 is different.

  Therefore, the position of the detection point Kij where the height information Zij is abnormal on the surface of the second substrate P2 with respect to the substrate holder 4 and the holding of the detection point Kij where the height information Zij is abnormal on the surface of the first substrate P1. By comparing the position with respect to the part 4, whether the abnormality of the height information Zij on the surface of the second substrate P2 is caused by foreign matter existing (attached) on the substrate holding part 4 or on the surface of the substrate P2 It is possible to determine whether it is caused by the existing (attached) foreign matter.

  In the present embodiment, the control device 15 determines that the position of the detection point Kij where the height information Zij is abnormal on the surface of the second substrate P2 with respect to the substrate holding unit 4 is the height information Zij on the surface of the first substrate P1. Is determined to be different from the position of the abnormal detection point Kij with respect to the substrate holding unit 4, it is determined that foreign matter is present (attached) on the surface of the second substrate P2, and the substrate holding using the first cleaning device 16 is performed. Without performing the cleaning operation on the unit 4, the exposure of the second substrate P2 held by the substrate holding unit 4 is started.

  As described above, in the present embodiment, the position of the detection point Kij where the height information Zij is abnormal on the surface of the first substrate P1 with respect to the substrate holder 4 and the height information Zij on the surface of the second substrate P2 are The cleaning operation using the first cleaning device 16 is controlled based on the relationship between the position of the abnormal detection point Kij with respect to the substrate holder 4.

  In the present embodiment, the control device 15 measures the position information of the substrate stage 1 using the interferometer system 11 and moves the substrate stage 1 in the Y-axis direction while moving the focus / leveling detection system 12. By using this, the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the substrate P held by the substrate holding unit 4 is detected. In the present embodiment, the position information of the detection light LU emitted from each emission unit 51S of the irradiation apparatus 51 within the coordinate system defined by the interferometer system 11 is known. Therefore, the control device 15 can obtain the position information of each detection point Kij within the coordinate system defined by the interferometer system 11. Therefore, the control device 15 can obtain the position information of the detection point Kij and the position information of the deformation area CA in the coordinate system defined by the interferometer system 11 where the height information Zij is abnormal.

  Hereinafter, an example of the substrate P exposure method and the substrate holding unit 4 cleaning method according to the present embodiment will be described with reference to the flowchart of FIG. 9 and the schematic diagrams of FIGS. As described above, in the present embodiment, a plurality of substrates P are sequentially loaded on the substrate holding unit 4 and predetermined processing is executed. In the following description, for example, a case where the m-th substrate P among the N substrates P that are sequentially processed is processed will be described.

  The m-th substrate P is held by the holding member 54 of the substrate temperature adjusting device 14 by the transfer system 13 and the temperature is adjusted (step SA1). When the m-th substrate P is held by the holding member 54, the (m−1) -th substrate P is held by the substrate holding unit 4 and is held by the substrate holding unit 4. The (m−1) th substrate P is arranged at the exposure position PJ1 and is subjected to immersion exposure. The (m−1) th substrate P held by the substrate holder 4 is subjected to the surface of the substrate P at each of a plurality of detection points Kij by the focus / leveling detection system 12 before being subjected to immersion exposure. Height information Zij is detected. The height information Zij regarding the surface of the (m−1) th substrate P is stored in the storage device 81.

  After the immersion exposure of the (m−1) th substrate P is completed, the control device 15 moves the substrate stage 1 holding the (m−1) th substrate P by the substrate holder 4 to the substrate exchange position. Move to PJ3. When the substrate stage 1 is moved to the substrate exchange position PJ3, the control device 15 moves synchronously with the substrate table 21 and the measurement table 24 approaching or in contact with each other, and the liquid immersion part LS of the liquid LQ is moved to the substrate table 21. To the measurement table 24.

  Accordingly, as shown in FIG. 10, the measurement table 24 is arranged at the exposure position PJ <b> 1, and the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24. In addition, after the liquid immersion unit LS is moved to the measurement table 24, the control device 15 uses various measuring instruments (measuring members) mounted on the measurement table 24 as necessary. Perform measurement. For example, after measuring the imaging characteristics of the projection optical system PL using the aerial image measurement system 58, the control device 15 performs various adjustments (calibration) based on the measurement results. For example, the image formation characteristic of the projection optical system PL is adjusted based on the measurement result of the aerial image measurement system 58.

  The control device 15 uses the transport system 13 to unload the (m−1) th substrate P after exposure from the substrate stage 1 moved to the substrate replacement position PJ3. After the exposed substrate P is unloaded from the substrate stage 1, the control device 15 uses the transport system 13 to transfer the mth substrate P held by the holding member 54 of the substrate temperature adjusting device 14. The substrate is loaded onto the substrate holding unit 4 of the substrate stage 1 (step SA2). The substrate P loaded on the substrate holding unit 4 is held by the substrate holding unit 4.

  As shown in FIG. 11, the control device 15 starts moving the substrate stage 1 holding the m-th substrate P by the substrate holder 4 from the substrate exchange position PJ3 to the exposure position PJ1. The control device 15 uses the focus / leveling detection system 12 between the substrate replacement position PJ3 and the exposure position PJ1, and uses a plurality of detection points on the surface of the m-th substrate P held by the substrate holder 4. Height information Zij of the surface of the substrate P in each of Kij is detected. In other words, the focus / leveling detection system 12 detects the height information Zij of the substrate P before the exposure light EL is applied to the mth substrate P (step SA3).

  The control device 15 stores the height information Zij of the surface of the substrate P at each of a plurality of detection points Kij on the surface of the m-th substrate P, detected using the focus / leveling detection system 12, in the storage device 81. (Step SA4).

  The control device 15 determines whether or not at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij is abnormal (step SA5).

  When it is determined in step SA5 that the height information Zij is not abnormal, the control device 15 starts immersion exposure of the mth substrate P held by the substrate holding unit 4 (step SA6). In order to start the immersion exposure of the substrate P, the control device 15 moves synchronously with the substrate table 21 and the measurement table 24 approaching or contacting each other as shown in FIG. The part LS is moved from the measurement table 24 to the substrate table 21. As a result, the substrate P held by the substrate holding unit 4 is placed at the exposure position PJ1 (step SA7). At this time, the measurement process using the measurement table 24 has already been completed.

  Next, the control device 15 starts an alignment process for the substrate P held by the substrate holding unit 4 of the substrate table 21. The control device 15 moves the substrate table 21 in the X and Y directions, and sequentially arranges a plurality of alignment marks provided so as to correspond to the shot regions on the substrate P in the detection region of the second alignment system 10. Then, the control device 15 measures the position information of the substrate table 21 using the interferometer system 11 including the laser interferometer 11B, and uses the second alignment system 10 to mark a plurality of alignment marks on the substrate P. Then, the liquid LQ is sequentially detected without going through the liquid LQ. As a result, the control device 15 can obtain the position information of the alignment mark on the substrate P within the coordinate system defined by the interferometer system 11. If the detection area of the second alignment system 10 is away from the exposure position PJ1, the alignment process is performed before the substrate table 21 and the measurement table 24 are moved in synchronization with the substrate table 21 and the measurement table 24 approaching or contacting each other. Also good.

  Then, the control device 15 controls the position of the substrate P on the substrate table 21 based on the height information Zij on the surface of the substrate P and the position information of the alignment marks on the substrate P, and a plurality of shot areas on the substrate P. Immersion exposure is executed for (step SA8). In order to expose the shot area on the substrate P, the control device 15 emits exposure light EL from the illumination system IL. The exposure light EL emitted from the illumination system IL illuminates the mask M. The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ of the liquid immersion part LS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  The exposure apparatus EX1 of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P synchronously in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX1 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is exposed by irradiating the substrate P with the exposure light EL through the projection optical system PL and the liquid LQ while moving the mask M in the Y-axis direction.

  Note that the control device 15 can synchronously move the substrate table 21 and the measurement table 24 in the XY directions while the substrate table 21 and the measurement table 24 are approaching or in contact with each other during the exposure of the substrate P.

  After the immersion exposure of the mth substrate P is completed (step SA9), the control device 15 moves the substrate stage 1 holding the mth substrate P by the substrate holder 4 to the substrate exchange position PJ3. . When the substrate stage 1 is moved to the substrate exchange position PJ3, as described above, the control device 15 moves synchronously with the substrate table 21 and the measurement table 24 approaching or in contact with each other, and the liquid immersion part of the liquid LQ The LS is moved from the substrate table 21 to the measurement table 24. The m-th substrate P after exposure held by the substrate holder 4 of the substrate stage 1 moved to the substrate exchange position PJ3 is unloaded from the substrate holder 4 by the transport system 13 (step SA10). . The substrate P unloaded from the substrate holding unit 4 is subjected to predetermined processing such as development processing.

  If it is determined in step SA5 that at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the m-th substrate P is abnormal, the control device 15 performs the previous process. It is determined whether at least one of the height information Zij on the surface of the substrate P at each of the plurality of detection points Kij on the surface of the (m−1) th substrate P is abnormal (step SA11).

  If it is determined in step SA11 that the height information Zij of the (m−1) th substrate P is not abnormal, immersion exposure of the mth substrate P is started (step SA6).

  When it is determined in step SA11 that at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the (m−1) th substrate P is abnormal, the control device 15 The height information Zij related to the (m−1) th substrate P and the height information Zij related to the mth substrate P stored in the storage device 81 are compared (step SA12).

  The control device 15 compares the height information Zij related to the (m−1) th substrate P with the height information Zij related to the mth substrate P, and the surface of the (m−1) th substrate P is compared. The position of the detection point Kij with the abnormal height information Zij relative to the substrate holding unit 4 is the same as the position of the detection point Kij with the abnormal height information Zij on the surface of the mth substrate P. It is determined whether or not there is (step SA13).

  Further, as described above, in the present embodiment, the control device 15 can obtain the position information of each detection point Kij within the coordinate system defined by the interferometer system 11, and therefore (m-1). The position in the coordinate system defined by the interference system 11 of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P and the height information Zij is abnormal on the surface of the m-th substrate P. It can be determined whether or not the position of the detection point Kij in the coordinate system defined by the interference system 11 is the same.

  In step SA13, the position of the detection point Kij where the height information Zij is abnormal on the surface of the mth substrate P with respect to the substrate holder 4 is the height information Zij on the surface of the (m−1) th substrate P. If it is determined that the position of the abnormal detection point Kij is different from the position with respect to the substrate holding unit 4, the control device 15 does not perform the cleaning operation on the substrate holding unit 4 using the first cleaning device 16, and the mth substrate P Liquid immersion exposure is started (step SA6).

  In step SA13, the position of the detection point Kij where the height information Zij is abnormal on the surface of the mth substrate P with respect to the substrate holder 4 is detected, and the detection point where the height information Zij is abnormal on the surface of the mth substrate P. If it is determined that the position of Kij relative to the substrate holding unit 4 is substantially the same, the control device 15 starts a cleaning operation for the substrate holding unit 4 using the first cleaning device 16 (step SA14).

  The control device 15 carries out (unloads) the m-th substrate P held by the substrate holding unit 4 from the substrate holding unit 4 in order to perform cleaning on the substrate holding unit 4 (step SA15).

  In the present embodiment, the exposure apparatus EX1 includes a holding member 54 that can support the substrate P at a position different from the exposure position PJ1 and the substrate replacement position PJ3. The control device 15 moves the substrate stage 1 to the substrate exchange position PJ3 and moves it to the substrate exchange position PJ3 in order to carry out the m-th substrate P held by the substrate holder 4 from the substrate holder 4. The m-th substrate P held by the substrate holding unit 4 of the substrate stage 1 is unloaded from the substrate holding unit 4 and transferred to the holding member 54 using the transfer system 13. The holding member 54 supports the m-th substrate P carried out from the substrate holding unit 4 at a position different from the exposure position PJ1 and the substrate replacement position PJ3.

  The control device 15 unloads the m-th substrate P held by the substrate holding unit 4 from the substrate holding unit 4, and then moves the substrate stage 1 including the substrate holding unit 4 to the cleaning position PJ2 (step SA16). . Thereby, as shown in FIG. 13, the substrate holding part 4 is arranged at the cleaning position PJ2.

  The control device 15 performs a cleaning operation using the first cleaning device 16 on the substrate holding unit 4 disposed at the cleaning position PJ2 (step SA17).

  As shown in FIG. 13, in the present embodiment, when the substrate holder 4 is disposed at the cleaning position PJ2, the measurement table 24 is disposed at the exposure position PJ1. The control device 15 controls the substrate holding unit 4 using the first cleaning device 16 in a state where the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24 arranged at the exposure position PJ1. Perform cleaning.

  In the present embodiment, the substrate is held using the first cleaning device 16 in a state where the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24 arranged at the exposure position PJ1. When the cleaning operation of the unit 4 is executed, the measuring operation using the measuring instrument and the measuring member of the measuring table 24 is executed in parallel with at least a part of the cleaning operation for the substrate holding unit 4 using the first cleaning device 16. Is done. For example, during the cleaning of the substrate holder 4 using the first cleaning device 16, the aerial image measurement system 58 of the measurement table 24 disposed at the exposure position PJ1 performs an operation of measuring the exposure light EL via the liquid LQ. Execute.

  FIG. 14 is a schematic diagram for explaining an example of the cleaning operation for the substrate holding unit 4 using the first cleaning device 16.

  In the present embodiment, the first cleaning device 16 includes a polishing device 18, and cleans the substrate holding unit 4 using the polishing member 17 of the polishing device 18. By polishing the substrate holding part 4 using the polishing member 17, foreign matter adhering to the substrate holding part 4 can be removed. The polishing apparatus 18 can polish the holding surface of the substrate holding unit 4 including, for example, the upper end surface of the pin member 64 and the upper end surface of the first peripheral wall 65.

  In order to polish the substrate holding unit 4 using the polishing device 18 of the first cleaning device 16, the control device 15 moves the substrate table 21 and moves the bottom surface of the polishing member 17 of the polishing device 18 as shown in FIG. (Polishing surface) 17A and substrate holding part 4 are made to oppose, and lower surface 17A of polishing member 17 and the holding surface of substrate holding part 4 (for example, the upper end surface of pin member 64) are made to contact.

  Then, as shown in FIG. 14, the control device 15 makes the XY in which the polishing member 17 and the substrate holding portion 4 are substantially parallel to the lower surface 17A in a state where the lower surface 17A of the polishing member 17 and the substrate holding portion 4 are in contact with each other. The substrate table 21 is moved using the second drive system 6 so as to move relatively in the direction. Thereby, the polishing process for the substrate holding part 4 by the polishing member 17 is executed.

  The control device 15 moves the substrate table 21 so that substantially the entire region of the holding surface of the substrate holding unit 4 is polished by the polishing member 17. When the substrate holding unit 4 is polished by the polishing member 17, the foreign matter attached to the substrate holding unit 4 is peeled (separated) from the substrate holding unit 4 and removed. As a result, the substrate holder 4 is cleaned by the first cleaning device 16.

  During the cleaning of the substrate holder 4 using the first cleaning device 16 including the polishing device 18, the liquid LQ is held between the measurement table 24 arranged at the exposure position PJ 1, the terminal optical element 46 and the liquid immersion member 47. Yes.

  Note that when the substrate holding unit 4 is polished using the polishing member 17, the driving device of the polishing apparatus 18 is moved so that the polishing member 17 and the substrate holding unit 4 are relatively moved in the XY directions substantially parallel to the lower surface 17A. 49 may be used to move the polishing member 17 or both the polishing member 17 and the substrate table 21 may be moved. In the present embodiment, the polishing member 17 is used to polish almost the entire region of the holding surface of the substrate holding unit 4, but the height information Zij is based on the position information of the abnormal detection point Kij. Then, the positional relationship between the polishing member 17 and the substrate holding unit 4 may be adjusted, and the local region of the substrate holding unit 4 corresponding to the detection point Kij having the abnormal height information Zij may be polished. .

  After the cleaning of the substrate holding unit 4 is completed (step SA18), the control device 15 separates the polishing member 17 and the substrate holding unit 4 and moves the substrate stage 1 to the substrate exchange position PJ3. The control device 15 uses the transfer system 13 to move the mth substrate P held by the holding member 54 of the substrate temperature adjusting device 14 to the substrate holding portion 4 of the substrate stage 1 moved to the substrate exchange position PJ3. Transport. As a result, the m-th substrate P whose temperature has been adjusted is loaded onto the substrate holding unit 4 (step SA19). After the substrate P is loaded on the substrate holder 4, the immersion exposure of the substrate P is started (step SA6).

  As described above, according to the present embodiment, since the substrate holding unit 4 is cleaned using the first cleaning device 16, the substrate P can be satisfactorily held by the cleaned substrate holding unit 4. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

  According to the present embodiment, when the substrate holder 4 (substrate stage 1) is arranged at the cleaning position PJ2 in order to clean the substrate holder 4, the measurement stage 2 (measurement table 24) is arranged at the exposure position PJ1. Therefore, the substrate holder 4 can be cleaned using the first cleaning device 16 while the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24. Therefore, the substrate holding part 4 can be cleaned without performing the process of collecting all the liquid LQ in the liquid immersion part LS or forming the liquid immersion part LQ again. Therefore, it is possible to clean the substrate holding unit 4 satisfactorily while suppressing a decrease in the operating rate of the exposure apparatus EX1, a decrease in throughput, and the like. Therefore, the substrate P can be exposed satisfactorily while suppressing a decrease in productivity, and the occurrence of defective devices can be suppressed.

  Further, in the present embodiment, the cleaning operation for the substrate holding unit 4 using the first cleaning device 16 is controlled based on the detection result of the focus / leveling detection system 12, so that, for example, N substrates P are sequentially processed. During the process, for example, in the lot, the substrate holder 4 can be efficiently cleaned. Further, according to the present embodiment, since the cleaning operation for the substrate holding unit 4 using the first cleaning device 16 is controlled based on the detection result of the focus / leveling detection system 12, for example, foreign substances are present in the substrate holding unit 4. Even though it does not exist, it is possible to prevent unnecessary processing from being executed, such as cleaning processing being executed or excessive cleaning processing being executed.

  In the present embodiment, the detection result of the height information Zij related to the (m−1) th substrate P held by the substrate holding unit 4 and the mth substrate P held by the substrate holding unit 4 are used. It is possible to determine whether or not foreign matter is attached to the substrate holding unit 4 based on the detection result of the height information Zij relating to the cleaning information, and based on the determined result, a cleaning operation is performed on the substrate holding unit 4 It can be determined whether or not to do so.

  In this embodiment, for example, in step SA15, after unloading the m-th substrate P before exposure from the substrate holding unit 4, the substrate P is supported by the holding member 54 of the substrate temperature adjusting device 14. Therefore, the temperature of the substrate P can be prevented from changing during the cleaning of the substrate holding unit 4. Therefore, after the cleaning of the substrate holder 4 is completed, the substrate P whose temperature has been adjusted by the holding member 54 can be loaded onto the substrate holder 4 and the substrate P can be exposed satisfactorily.

  In the present embodiment, the measurement operation using the measuring instrument and the measurement member of the measurement table 24 is performed in parallel with at least a part of the cleaning operation for the substrate holding unit 4 using the first cleaning device 16. Using the measurement result, for example, adjustment (calibration) of the exposure apparatus EX1 can be executed.

  In the present embodiment, in step SA15, the substrate P unloaded from the substrate holding unit 4 for cleaning the substrate holding unit 4 is supported by the holding member 54 of the substrate temperature adjusting device 14 as an example. As described above, for example, the transport member 50 of the transport system 13 may support the substrate P unloaded from the substrate holder 4 in order to clean the substrate holder 4. The conveyance member 50 that supports the substrate P unloaded from the substrate holding unit 4 in order to clean the substrate holding unit 4 may be a conveyance member that can load the substrate P onto the substrate holding unit 4. May be a conveying member that can be unloaded from the substrate holding unit 4. The substrate P unloaded from the substrate holder 4 is supported by the transport member 50 of the transport system 13 during the cleaning of the substrate holder 4 using the first cleaning device 16. Further, by providing the transport member 50 with a temperature adjustment mechanism capable of adjusting the temperature of the substrate P, it is possible to prevent the temperature of the substrate P from changing during the cleaning of the substrate holding unit 4. After the cleaning of the substrate holding unit 4 is finished, the substrate P supported by the transport member 50 is loaded on the substrate holding unit 4 and subjected to immersion exposure.

  In the present embodiment, the first cleaning is performed based on the height information of the (m−1) th substrate P and the height information of the mth substrate P stored in the storage device 81. Although the cleaning operation using the apparatus 16 is controlled, when there is no past height information of the substrate P in the storage device 81, for example, when the first substrate P of the lot is exposed, the first substrate of the lot. The determination of the abnormality of the height information on the surface of P may be omitted, and exposure of the substrate P may be started.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  The second embodiment is a modification of the above-described first embodiment. A characteristic part of the second embodiment different from the first embodiment described above is that the exposure apparatus EX1 includes a second cleaning device 82 that cleans the surface of the substrate P held by the substrate holding portion 4. is there.

  FIG. 15 is a schematic diagram illustrating an example of the second cleaning device 82 that cleans the surface of the substrate P held by the substrate holding unit 4. In FIG. 15, the second cleaning device 82 includes a supply member 84 having a gas supply port 83 capable of supplying gas, and a gas supply device 86 connected to the gas supply port 83 via a flow path 85. . The surface of the substrate P held by the substrate holding unit 4 can be arranged at a position facing the gas supply port 83. The gas supply device 86 can supply clean and temperature-adjusted gas, and the gas sent from the gas supply device 86 is supplied to the gas supply port 83 via the flow path 85. The second cleaning device 82 supplies gas from the gas supply port 83 to the surface of the substrate P with the surface of the substrate P facing the gas supply port 83. Thereby, the foreign matter existing on the surface of the substrate P is blown off by the gas supplied from the gas supply port 83 and removed from the surface of the substrate P. As described above, the second cleaning device 82 of the present embodiment can remove the foreign matter on the surface of the substrate P by the gas supply operation using the gas supply port 83, and can clean the surface of the substrate P.

  The gas supply port 83 can be arranged at a position facing a predetermined region of the guide surface 7. In addition, the substrate stage 1 including the substrate holding unit 4 can be moved to a position facing the gas supply port 83.

  Next, an example of the operation of the exposure apparatus EX1 according to the second embodiment will be described with reference to the flowchart of FIG. In the present embodiment, steps SA1 to SA19 described with reference to FIG. 9 are executed as in the first embodiment. A description of steps SA1 to SA19 is omitted.

  In step SA13, the position of the detection point Kij where the height information Zij is abnormal on the surface of the mth substrate P with respect to the substrate holder 4 is the height information Zij on the surface of the (m−1) th substrate P. If it is determined that the position of the abnormal detection point Kij is different from the position with respect to the substrate holding unit 4, the control device 15 does not perform the cleaning operation on the substrate holding unit 4 using the first cleaning device 16 and moves the second cleaning device 82. A cleaning operation for the surface of the mth substrate P to be used is started (step SA20). The control device 15 causes the surface of the mth substrate P held by the substrate holding unit 4 and the gas supply port 83 of the second cleaning device 82 to face each other from the gas supply port 83 to the surface of the substrate P. Gas is supplied to clean the surface of the substrate P. After the cleaning of the surface of the substrate P using the second cleaning device 82 is completed, the immersion exposure of the substrate P is started (step SA6).

  According to the present embodiment, when it is determined that foreign matter is present on the surface of the substrate P based on the detection result of the focus / leveling detection system 12, the surface of the substrate P is used for the second cleaning device 82. After cleaning, immersion exposure of the substrate P can be started.

  FIG. 17 is a schematic diagram showing another example of the second cleaning device 82B. In FIG. 17, the second cleaning device 82 </ b> B includes a suction member 88 having a gas suction port 87 capable of sucking a gas, and a suction device 90 connected to the gas suction port 87 via a flow path 89. The surface of the substrate P held by the substrate holding unit 4 can be arranged at a position facing the gas suction port 87. The suction device 90 includes a vacuum system and can suck a gas. The suction device 90 can suck the gas in the vicinity of the gas suction port 87 from the gas suction port 87 through the flow path 88. The second cleaning device 82B sucks gas from the gas suction port 87 in a state where the surface of the substrate P and the gas suction port 87 face each other. Thereby, the gas in the vicinity of the surface of the substrate P is sucked from the gas suction port 87, and the foreign matter existing on the surface of the substrate P is sucked from the gas suction port 87 together with the surrounding gas, and from the surface of the substrate P. Removed. As described above, the second cleaning device 82B including the gas suction port 87 can remove the foreign matter on the surface of the substrate P and clean the surface of the substrate P by the gas suction operation using the gas suction port 87. it can.

  In addition, the surface of the plate member T currently hold | maintained at the plate member holding | maintenance part 63 can be cleaned using the 2nd cleaning apparatus 82 (82B).

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 18 is a flowchart illustrating an example of an exposure method and a cleaning method for the substrate P according to the third embodiment. The exposure apparatus EX1 according to the third embodiment includes the second cleaning device 82 (82B) as described in the second embodiment. In the following description, the case where the exposure apparatus EX1 includes the second cleaning device 82 having the gas supply port 83 capable of supplying gas will be described as an example. However, the gas suction port 87 capable of sucking gas is described. The second cleaning device 82B may be provided.

  A characteristic part of the third embodiment is that a first detection operation for detecting height information Zij at each of a plurality of detection points Kij on the surface of the substrate P held by the substrate holder 4 at a first timing is executed. When it is determined that at least one of the height information Zij detected in the first detection operation is abnormal, a cleaning operation is performed on the surface of the substrate P held by the substrate holding unit 4 (step SB3). (Step SB11) After the cleaning operation for the surface of the substrate P is executed, the second detection operation for detecting the height information Zij at each of the plurality of detection points Kij on the surface of the substrate P at the second timing is executed. In step SB12, the cleaning operation using the substrate holder 4 is controlled based on the detection result of the first detection operation and the detection result of the second detection operation. There to that point.

  In the present embodiment, the position of the detection point Kij at which the height information Zij is determined to be abnormal in the first detection operation with respect to the substrate holding unit 4 and the detection point at which the height information Zij is determined to be abnormal in the second detection operation. The cleaning operation using the first cleaning device 16 is controlled based on the relationship between the position of Kij relative to the substrate holding unit 4.

  In FIG. 18, the predetermined substrate P before exposure is held by the holding member 54 of the substrate temperature adjusting device 14 by the transport system 13 and the temperature is adjusted (step SB1). When the substrate P before exposure is held by the holding member 54, another substrate P is held by the substrate holding unit 4 and is subjected to immersion exposure. After the immersion exposure of the substrate P held by the substrate holding unit 4 is completed, the control device 15 moves the substrate stage 1 holding the exposed substrate P by the substrate holding unit 4 to the substrate exchange position PJ3. . When the substrate stage 1 is moved to the substrate exchange position PJ3, the control device 15 moves synchronously with the substrate table 21 and the measurement table 24 approaching or in contact with each other, and the liquid immersion part LS of the liquid LQ is moved to the substrate table 21. To the measurement table 24. Thereby, the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24.

  The control device 15 uses the transport system 13 to unload the exposed substrate P from the substrate stage 1 moved to the substrate exchange position PJ3. After the exposed substrate P is unloaded from the substrate stage 1, the control device 15 uses the transport system 13 to transfer the substrate P held by the holding member 54 of the substrate temperature adjusting device 14 to the substrate stage 1. The substrate is loaded onto the substrate holder 4 (step SB2). The substrate P loaded on the substrate holding unit 4 is held by the substrate holding unit 4.

  The control device 15 starts the movement of the substrate stage 1 holding the substrate P before exposure by the substrate holder 4 from the substrate exchange position PJ3 to the exposure position PJ1. The control device 15 uses the focus / leveling detection system 12 between the substrate replacement position PJ3 and the exposure position PJ1 at each of a plurality of detection points Kij on the surface of the substrate P held by the substrate holding unit 4. Height information Zij on the surface of the substrate P is detected (step SB3).

  The control device 15 stores the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the substrate P, detected using the focus / leveling detection system 12 in step SB3, in the storage device 81 ( Step SB4).

  The control device 15 determines whether or not at least one of the height information Zij on the surface of the substrate P at each of the plurality of detection points Kij detected in Step SB3 is abnormal (Step SB5).

  If it is determined in step SB5 that the height information Zij is not abnormal, the control device 15 starts immersion exposure of the substrate P held by the substrate holder 4 (step SB6). In order to start immersion exposure of the substrate P, the control device 15 moves in synchronization with the substrate table 21 and the measurement table 24 approaching or contacting each other, and moves the liquid immersion part LS of the liquid LQ from the measurement table 24. Move to the substrate table 21. As a result, the substrate P held by the substrate holder 4 is placed at the exposure position PJ1 (step SB7).

  Next, the control device 15 performs an alignment process on the substrate P held by the substrate holding unit 4 of the substrate table 21, and based on the position information of the alignment mark of the substrate P, the control device 15 While controlling the position, immersion exposure is performed on a plurality of shot areas on the substrate P (step SB8).

  After immersion exposure of the substrate P is completed (step SB9), the control device 15 moves the substrate stage 1 holding the substrate P by the substrate holding unit 4 to the substrate exchange position PJ3. The exposed substrate P is unloaded from the substrate holder 4 by the transport system 13 (step SB10).

  If it is determined in step SB5 that at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the substrate P is abnormal, the control device 15 causes the second cleaning device 82 to be used. The cleaning operation is performed on the surface of the substrate P held by the substrate holding unit 4 (step BS11).

  After performing the cleaning operation on the surface of the substrate P using the second cleaning device 82, the control device 15 uses the focus / leveling detection system 12 to perform the cleaning on the surface of the substrate P after being cleaned held by the substrate holding unit 4. The height information Zij of the surface of the substrate P at each of the plurality of detection points Kij is detected (step SB12).

  The control device 15 determines whether or not at least one of the height information Zij on the surface of the substrate P at each of the plurality of detection points Kij detected in Step SB12 is abnormal (Step SB13).

  In step SB13, when it is determined that none of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij detected in step SB12 is abnormal, the control device 15 uses the first cleaning device 16. The liquid immersion exposure of the substrate P is started without executing the cleaning operation for the holding unit 4 (step SB6).

  If it is determined in step SB13 that at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij detected in step SB12 is abnormal, the control device 15 is stored in the storage device 81. The height information Zij related to the substrate P detected in step SB3 is compared with the height information Zij related to the substrate P detected in step SB12 (step SB14).

  The control device 15 compares the height information Zij related to the substrate P detected in step SB3 with the height information Zij related to the substrate P detected in step SB12, and the height of the height information Zij detected in step SB3 is high on the surface of the substrate P detected in step SB3. The position of the detection point Kij where the height information Zij is abnormal is the same as the position of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P detected in step SB12. It is determined whether or not there is (step SB15).

  In step SB15, the position of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P detected in step SB12 with respect to the substrate holding unit 4 is the height information Zij on the surface of the substrate P detected in step SB3. If it is determined that the position of the abnormal detection point Kij is different from the position of the substrate holding unit 4, the control device 15 performs the immersion exposure of the substrate P without performing the cleaning operation on the substrate holding unit 4 using the first cleaning device 16. Is started (step SB6).

  In step SB15, the position of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P detected in step SB12 with respect to the substrate holding unit 4 is the height information Zij on the surface of the substrate P detected in step SB3. When determining that the position of the abnormal detection point Kij is substantially the same as the position of the substrate holding unit 4, the control device 15 starts a cleaning operation for the substrate holding unit 4 using the first cleaning device 16 (step SB16).

  The control device 15 unloads the substrate P held by the substrate holding unit 4 from the substrate holding unit 4 in order to start cleaning the substrate holding unit 4 (step SB17).

  The control device 15 moves the substrate stage 1 to the substrate exchange position PJ3 and carries the substrate stage moved to the substrate exchange position PJ3 in order to carry out the substrate P held by the substrate holder 4 from the substrate holder 4. The substrate P held by one substrate holding unit 4 is unloaded from the substrate holding unit 4 using the transfer system 13 and transferred to the holding member 54. The holding member 54 supports the substrate P unloaded from the substrate holding unit 4 at a position different from the exposure position PJ1 and the substrate replacement position PJ3.

  The control device 15 moves the substrate stage 1 including the substrate holding unit 4 to the cleaning position PJ2 after unloading the substrate P held by the substrate holding unit 4 from the substrate holding unit 4 (step SB18).

  The control device 15 performs a cleaning operation using the first cleaning device 16 on the substrate holding unit 4 arranged at the cleaning position PJ2 (step SB19).

  The control device 15 controls the substrate holding unit 4 using the first cleaning device 16 in a state where the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24 arranged at the exposure position PJ1. Perform cleaning. During the cleaning of the substrate holder 4 using the first cleaning device 16, the liquid LQ is held between the measurement table 24 arranged at the exposure position PJ1, the last optical element 46, and the liquid immersion member 47.

  After the cleaning of the substrate holder 4 using the first cleaning device 16 is completed (step SB20), the control device 15 moves the substrate stage 1 to the substrate replacement position PJ3. The control device 15 uses the transfer system 13 to transfer the substrate P held by the holding member 54 of the substrate temperature adjusting device 14 to the substrate holding unit 4 of the substrate stage 1 moved to the substrate exchange position PJ3. As a result, the temperature-adjusted substrate P is loaded onto the substrate holding unit 4 (step SB21). After the substrate P is loaded on the substrate holding unit 4, the liquid immersion exposure of the substrate P is started (step SB6).

  As described above, also in the present embodiment, when the substrate holder 4 (substrate stage 1) is disposed at the cleaning position PJ2 in order to clean the substrate holder 4, the measurement stage 2 (measurement) at the exposure position PJ1. Since the table 24) is disposed, the substrate holder 4 is cleaned using the first cleaning device 16 in a state where the liquid LQ is held between the terminal optical element 46 and the liquid immersion member 47 and the measurement table 24. Can do. Therefore, the substrate holding part 4 can be cleaned without performing the process of collecting all the liquid LQ in the liquid immersion part LS or forming the liquid immersion part LQ again. Therefore, it is possible to clean the substrate holding unit 4 satisfactorily while suppressing a decrease in the operating rate of the exposure apparatus EX1, a decrease in throughput, and the like. Therefore, the substrate P can be exposed satisfactorily while suppressing a decrease in productivity, and the occurrence of defective devices can be suppressed.

  Further, since the cleaning operation for the substrate holder 4 using the first cleaning device 16 is controlled based on the detection result of the focus / leveling detection system 12, the cleaning of the substrate holder 4 can be performed efficiently. Further, according to the present embodiment, since the cleaning operation for the substrate holding unit 4 using the first cleaning device 16 is controlled based on the detection result of the focus / leveling detection system 12, for example, foreign substances are present in the substrate holding unit 4. Even though it does not exist, it is possible to prevent unnecessary processing from being executed, such as cleaning processing being executed or excessive cleaning processing being executed.

  Further, in the present embodiment, based on the detection result detected at the first timing and the detection result detected at the second timing, the height information Zij related to the substrate P held by the substrate holding unit 4 is used. It can be determined whether or not a foreign substance is attached to the holding unit 4, and it can be determined whether or not a cleaning operation should be performed. In particular, since the cleaning operation of the surface of the substrate P is executed between the first timing and the second timing, it is possible to easily determine whether or not foreign matter is attached to the substrate holding unit 4. it can.

  In the present embodiment, the substrate P unloaded from the substrate holding unit 4 may be supported by the transport member 50 of the transport system 13 in order to clean the substrate holding unit 4.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  The fourth embodiment is a modification of the above-described third embodiment. FIG. 19 is a flowchart showing an example of the operation of the exposure apparatus EX1 according to the fourth embodiment. In the fourth embodiment, steps SB1 to SB21 described with reference to FIG. 18 are executed as in the third embodiment. A description of steps SB1 to SB21 is omitted.

  In step SB15, the position of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P detected in step SB12 with respect to the substrate holding unit 4 is the height information Zij on the surface of the substrate P detected in step SB3. If it is determined that the position of the abnormal detection point Kij is different from the position with respect to the substrate holding unit 4, the control device 15 does not perform the cleaning operation on the substrate holding unit 4 using the first cleaning device 16 and moves the second cleaning device 82. A cleaning operation for the surface of the substrate P to be used is started (step SB22). After the cleaning of the surface of the substrate P using the second cleaning device 82 is completed, immersion exposure of the substrate P is started (step SB6).

  In step SB15, the position of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P detected in step SB12 with respect to the substrate holding unit 4 is the height information Zij on the surface of the substrate P detected in step SB3. When determining that the position of the abnormal detection point Kij is substantially the same as the position of the substrate holding unit 4, the control device 15 starts a cleaning operation for the substrate holding unit 4 using the first cleaning device 16 (step SB16).

  In the present embodiment, the position of the detection point Kij where the height information Zij is abnormal on the surface of the substrate P detected in step SB3 with respect to the substrate holder 4 and the height information on the surface of the substrate P detected in step SB12. It is determined which of the cleaning operation for the substrate holding portion 4 and the cleaning operation for the surface of the substrate P is performed based on the relationship between the detection point Kij where Zij is abnormal and the position of the substrate holding portion 4.

  As described above, according to the present embodiment, when it is determined that foreign matter is present on the surface of the substrate P based on the detection result of the focus / leveling detection system 12, the surface of the substrate P is changed to the first level. 2 After cleaning using the cleaning device 82, immersion exposure of the substrate P can be started.

  In the first to fourth embodiments described above, the case where the first cleaning device 16 cleans the substrate holding unit 4 has been described as an example. However, the plate member holding unit 63 can also be cleaned. The plate member holding part 63 is detachably attachable to the plate member T. Further, the plate member T can be loaded (loaded) into the plate member holding portion 63 and unloaded from the plate member holding portion 63 at a position other than the exposure position PJ1 by a predetermined conveying member. When performing the cleaning operation on the plate member holding portion 63 using the first cleaning device 16, the control device 15 carries out the exposure with the last optical element 46 and the liquid immersion member 47 after carrying out the plate member T from the plate member holding portion 63. The substrate stage 1 is moved to the cleaning position PJ2 while the liquid LQ is held between the measurement table 24 disposed at the position PJ1. Then, the control device 15 performs a cleaning operation on the plate member holding portion 63 using the first cleaning device 16. By cleaning the plate member holding portion 63, the plate member T can be favorably held by the plate member holding portion 63. The polishing device 18 of the first cleaning device 16 can polish the holding surface of the plate member holding portion 63 including the upper end surface of the pin member 69, the upper end surface of the second peripheral wall 67, and the upper end surface of the third peripheral wall 68. .

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the fifth embodiment, the exposure apparatus EX2 includes, for example, US Pat. No. 6,341,007, US Pat. No. 6,400,441, US Pat. No. 6,549,269, US Pat. No. 6,590,634, and US Pat. No. 6,208,407. Description will be made by taking as an example a case where the exposure apparatus is a twin stage type exposure apparatus having a plurality of substrate stages movable while holding the substrate P as disclosed in the specification, US Pat. No. 6,262,796, and the like. . That is, in the fifth embodiment, the exposure apparatus EX2 includes a first substrate stage 91 that can move while holding the substrate P, and a first substrate stage 91 that can move while holding the substrate P independently of the first substrate stage 91. 2 substrate stage 92.

  FIG. 20 is a schematic block diagram showing an example of an exposure apparatus EX2 according to the fifth embodiment, and FIG. 21 is a plan view schematically showing the exposure apparatus EX2, in which a first substrate stage 91 and a second substrate stage 92 are shown. It is the figure which looked at the vicinity of from above. The exposure apparatus EX2 is provided with a control device 93 that controls the overall operation of the exposure apparatus EX2. The control device 93 is connected to a storage device 94 that stores various types of information related to exposure.

  In FIG. 20, the exposure apparatus EX2 includes an exposure station ST1 that performs an exposure process for the substrate P, and a measurement station ST2 that performs a predetermined measurement process related to the exposure of the substrate P and a replacement process for the substrate P. A base member 96 having a guide surface 95 that movably supports each of the first substrate stage 91 and the second substrate stage 92 is disposed so as to extend between the exposure station ST1 and the measurement station ST2.

  The first substrate stage 91 has a first substrate holding part 97 to which the substrate P can be attached and detached, and the second substrate stage 92 has a second substrate holding part 98 to which the substrate P can be attached and detached. The first substrate holding unit 97 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second substrate holding unit 98 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. Each of the first substrate stage 91 and the second substrate stage 92 is movable between the exposure station ST1 and the measurement station ST2 along the guide surface 95 while holding the substrate P. In the present embodiment, the guide surface 95 of the base member 96 is substantially parallel to the XY plane.

  In the exposure station ST1, a mask stage 99 that is movable while holding the mask M, an illumination system IL that illuminates the mask M with the exposure light EL, and an image of the pattern of the mask M that is illuminated with the exposure light EL are projected onto the substrate P. A projection optical system PL or the like is disposed. In the present embodiment, the exposure position PJ1 facing the lower surface (exit surface) 100A of the last optical element 100 of the projection optical system PL is disposed at the exposure station ST1. Each of the first substrate stage 91 and the second substrate stage 92 can move within a predetermined region on the guide surface 95 including the exposure position PJ1 facing the lower surface 100A of the last optical element 100 while holding the substrate P. .

  In the measurement station ST2, the alignment system 101 for acquiring the position information of the substrate P (position information regarding the X axis, the Y axis, and the θZ direction), and the surface position information of the surface of the substrate P (Z axis, θX, and Various measurement systems capable of executing measurement processing relating to exposure of the substrate P, such as a focus / leveling detection system 102 capable of detecting position information relating to the θY direction), are arranged.

  In the present embodiment, the first cleaning device 103 for cleaning at least one of the first substrate holding unit 97 and the second substrate holding unit 98 is disposed in the measurement station ST2. The first cleaning device 103 includes a polishing device 105 including a polishing member 104. In the present embodiment, the cleaning position PJ2 is disposed at the measurement station ST2.

  In the present embodiment, the substrate replacement position PJ3 is disposed at the measurement station ST2. The transport system 106 capable of transporting the substrate P unloads (unloads) the exposed substrate P from the first substrate stage 91 (or the second substrate stage 92) moved to the substrate replacement position PJ3 of the measurement station ST2. Substrate replacement processing including the operation and the operation of loading (carrying in) the unexposed substrate P to be exposed next onto the first substrate stage 91 (or the second substrate stage 92) can be performed.

  In the present embodiment, the holding member 108 of the substrate temperature adjusting device 107 that adjusts the temperature of the substrate P is disposed in the vicinity of the substrate replacement position PJ3.

  The exposure apparatus EX2 of the present embodiment is an immersion exposure apparatus that employs a local immersion method. When the substrate P is exposed, the optical path space of the exposure light EL emitted from the lower surface 100A of the last optical element 100 is the liquid LQ. Filled with. The exposure apparatus EX2 of the present embodiment is configured such that the optical path space of the exposure light EL is liquid as disclosed in, for example, US Patent Application Publication No. 2004/0165159, US Patent Application Publication No. 2007/0132979, and the like. A seal member (liquid immersion member) 109 capable of forming the liquid immersion part LS with the liquid LQ so as to be filled with LQ is provided. The seal member 109 is disposed in the vicinity of the last optical element 100.

  The seal member 109 can form the liquid immersion part LS with the liquid LQ between the seal member 109 and a predetermined member arranged at the exposure position PJ1. In the present embodiment, the predetermined member that can be arranged at the exposure position PJ1 includes at least one of the first substrate stage 91 and the second substrate stage 92. The predetermined member includes a substrate P held on at least one of the first substrate stage 91 and the second substrate stage 92.

  The alignment system 101 includes an optical element 110 that can face a predetermined member including the first substrate stage 91 and the second substrate stage 92. The alignment system 101 measures an alignment mark on the substrate P, a reference mark on the first and second substrate stages 91 and 92, and the like via the optical element 110. The predetermined member is movable within a predetermined region of the guide surface 95 including a position facing the optical element 110 of the alignment system 101. In the following description, a position facing the optical element 110 of the alignment system 101 is appropriately referred to as a measurement position PJ4.

  The focus / leveling detection system 102 detects the height information Zij of the surface of the substrate P at each of a plurality of detection points Kij on the surface of the substrate P held by the first substrate holding unit 97 arranged at the measurement position PJ4. Is possible. Similarly, the focus / leveling detection system 102 has information on the height of the surface of the substrate P at each of a plurality of detection points Kij on the surface of the substrate P held by the second substrate holding unit 98 disposed at the measurement position PJ4. Zij can be detected. The focus / leveling detection system 102 includes an irradiation device 102 </ b> A that irradiates the detection light LU with respect to each of a plurality of detection points Kij on the surface of the substrate P from a direction inclined with respect to the Z-axis direction (height direction). A light receiving device 102B capable of receiving the detection light LU reflected on the surface of the light receiving device.

  Further, the exposure apparatus EX2 of the present embodiment has a space for holding the liquid LQ between the terminal optical element 100 and the seal member 109 as disclosed in, for example, US Patent Application Publication No. 2004/0211920. A cap member C that can be formed is provided. The seal member 109 can form the liquid immersion part LS with the liquid LQ between the seal member 109 and the cap member C disposed at the exposure position PJ1.

  The first substrate stage 91 has a first cap holding part 111 to which the cap member C can be attached and detached, and the second substrate stage 92 has a second cap holding part 112 to which the cap member C can be attached and detached. The cap member C is held by the first cap holding part 111 during the exposure of the substrate P held on the first substrate stage 91 and is exposed during the exposure of the substrate P held by the second substrate stage 92. 2 held by the cap holder 112.

  Further, the seal member 109 can hold the cap member C. The seal member 109 is arranged such that the cap member C is disposed at a position facing the lower surface 100A of the last optical element 100 when both the first substrate stage 91 and the second substrate stage 92 are separated from the exposure position PJ1. The cap member C is held.

  Similar to the first to fourth embodiments described above, the exposure apparatus EX2 includes a first drive system 113 capable of moving the mask stage 99. The exposure apparatus EX2 includes a second drive system 114 that can move the first substrate stage 91 and the second substrate stage 92, respectively.

  The first substrate stage 91 includes a first substrate stage main body 115 and a first substrate table 116 mounted on the first substrate stage main body 115 and having a first substrate holding part 97. The second substrate stage 92 includes a second substrate stage main body 117 and a second substrate table 118 mounted on the second substrate stage main body 117 and having a second substrate holding part 98.

  The second drive system 114 includes a first coarse movement system 119 that moves the first substrate stage body 115, a first fine movement system 120 that moves the first substrate table 116 relative to the first substrate stage body 115, and a second A second coarse movement system 121 that moves the substrate stage main body 117 and a second fine movement system 122 that moves the second substrate table 118 relative to the second substrate stage main body 117 are provided.

  The first fine movement system 120 includes an actuator such as a voice coil motor disposed between the first substrate stage main body 115 and the first substrate table 116. The second fine movement system 122 includes an actuator such as a voice coil motor disposed between the second substrate stage main body 117 and the second substrate table 118.

  As shown in FIG. 21, the first coarse movement system 119 includes Y-axis linear motors 123 and 124 and an X-axis linear motor 125. The second coarse movement system 121 includes Y axis linear motors 126 and 127 and an X axis linear motor 128.

  The Y-axis linear motors 123 and 126 include a Y-axis guide member 129 including a coil unit and slide members 130 and 131 including a magnet unit movable in the Y-axis direction with respect to the Y guide member 129. The Y-axis linear motors 124 and 127 include a Y-axis guide member 132 including a coil unit and slide members 133 and 134 including a magnet unit movable in the Y-axis direction with respect to the Y guide member 132.

  The X-axis linear motor 125 includes an X-axis guide member 135 including a coil unit, and a slide member 136 including a magnet unit that can move in the X-axis direction with respect to the X-axis guide member 135. The X-axis linear motor 128 includes an X-axis guide member 137 including a coil unit, and a slide member 138 including a magnet unit that can move in the X-axis direction with respect to the X-axis guide member 137. Both ends of the X-axis guide member 135 are connected to slide members 130 and 133. Both ends of the X-axis guide member 137 are connected to slide members 131 and 134.

  Each of the first substrate stage 91 (first substrate stage main body 115) and the second substrate stage 92 (second substrate stage main body 117) is disclosed in, for example, US Patent Application Publication No. 2001/0004105. It is releasably connected to the slide members 136 and 138 via the joint members.

  As shown in FIGS. 20 and 21, the first substrate stage main body 115 includes a first joint member 139 provided on the −Y side surface and a second joint member 140 provided on the + Y side surface. ing. Similarly, the second substrate stage main body 117 includes a third joint member 141 provided on the −Y side surface and a fourth joint member 142 provided on the + Y side surface.

  The second drive system 114 includes a joint member 143 provided on the slide member 136 and a joint member 144 provided on the slide member 138. The joint member 143 is provided on the side surface on the + Y side of the slide member 136 so as to face the measurement station ST2 side (+ Y side). The joint member 144 is provided on the side surface on the −Y side of the slide member 138 so as to face the exposure station ST1 side (−Y side).

  The slide member 136 and the joint member 143 are fixed, and the slide member 136 and the joint member 143 can move together. Further, the slide member 138 and the joint member 144 are fixed, and the slide member 138 and the joint member 144 are movable together.

  A first joint member 139 of the first substrate stage main body 115 and a third joint member 141 of the second substrate stage main body 117 are sequentially connected to the joint member 143 fixed to the slide member 136 so as to be releasable. A second joint member 140 of the first substrate stage main body 115 and a fourth joint member 142 of the second substrate stage main body 117 are sequentially connected to the joint member 144 fixed to the slide member 138 so as to be releasable.

  In the following description, the joint member 143 and the slide member 136 to which the first substrate stage main body 115 and the second substrate stage main body 117 are sequentially connected are collectively referred to as a first connection member 145 as appropriate. The joint member 144 and the slide member 138 to which the first substrate stage main body 115 and the second substrate stage main body 117 are sequentially connected are collectively referred to as a second connection member 146 as appropriate.

  The control device 93 releases the connection between the first connection member 145 and the first substrate stage main body 115 (or the second substrate stage main body 117) and the second connection member 146 on the base member 96 at a predetermined timing. Release of connection with the second substrate stage body 117 (or the first substrate stage body 115), connection between the first connection member 145 and the second substrate stage body 117 (or the first substrate stage body 115), and second The connection member 146 is connected to the first substrate stage main body 115 (or the second substrate stage main body 117). That is, the control device 93 performs the exchange operation of the first connection member 145 and the second connection member 146 with respect to the first substrate stage 91 and the second substrate stage 92 at a predetermined timing.

  FIG. 22 is a side sectional view showing the vicinity of the first substrate stage 91 and the seal member 109. The first substrate holding portion 97 includes a so-called pin chuck mechanism, and is disposed inside a first recess 148 formed at a predetermined position on the upper surface 147 of the first substrate table 116. The substrate P can be attached to and detached from the first substrate holder 97. The first cap holding part 111 includes a so-called vacuum chuck mechanism, and is disposed inside a second recess 149 formed at a predetermined position on the upper surface 147 of the first substrate table 116. The cap member C can be attached to and detached from the first cap holding part 111. The second substrate stage 92 has a configuration equivalent to that of the first substrate stage 91, and includes a second substrate holding portion 98 to which the substrate P can be attached and detached, and a second cap holding portion 112 to which the cap member C can be attached and detached. .

  Further, in the present embodiment, the exposure apparatus EX2 includes positional information in the Z-axis direction of the first and second substrate tables 116 and 118 as disclosed in, for example, US Patent Application Publication No. 2004/0130691. An interferometer system including a laser interferometer (Z interferometer) capable of measuring The interferometer system uses the measurement light applied to the measurement mirrors 150 and 151 and the reflection mirror 152 of the first substrate table 116, based on the X axis, Y axis, Z axis, θX, θY, and It is possible to measure position information regarding six directions of the θZ direction. Similarly, the interference system can measure position information regarding the six directions of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions of the second substrate table 118.

  The seal member 109 includes a flow path 153 that supplies and recovers the liquid LQ. Further, the seal member 109 provides a gas seal for confining the liquid LQ between the lower surface of the seal member 109 and the surface of the predetermined member (the surface of the substrate P in FIG. 22) facing the lower surface of the seal member 109. A gas inlet 154 and a gas outlet 155 to be formed are provided. An annular first groove connected to the gas inlet 154 and an annular second groove connected to the gas outlet 155 are formed on the lower surface of the seal member 109. Each of the first groove and the second groove is disposed around the optical path space of the exposure light EL. The first groove is disposed outside the second groove with respect to the optical path space of the exposure light EL.

  The seal member 109 can form a gas bearing 156 between the lower surface of the seal member 109 and the surface of a predetermined member (the surface of the substrate P in FIG. 22). The control device 93 performs a gas introduction (supply) operation using the gas introduction port 154 and a gas extraction (suction) operation using the gas extraction port 155 so as to face the lower surface of the seal member 109 and the lower surface of the seal member 109. A gas bearing 156 can be formed between the surface of the member (the surface of the substrate P). A pressurized vacuum type gas bearing 156 is formed between the lower surface of the seal member 109 and the surface of the predetermined member (the surface of the substrate P). The gas bearing 156 maintains a gap (for example, 0.1 to 1.0 mm) between the lower surface of the seal member 109 and the surface of the predetermined member (the surface of the substrate P).

  The cap member C is a member that can hold the liquid LQ with the last optical element 100. The cap member C is formed according to the size and shape of the liquid immersion part LS formed by the seal member 109. In the present embodiment, the cap member C is a substantially circular plate-shaped member having substantially the same thickness as the substrate P in the XY plane.

  In the present embodiment, the exposure apparatus EX2 includes one cap member C. Therefore, when the cap member C is held by the first cap holding part 111 of the first substrate table 116, the cap member C is not held by the second cap holding part 112 of the second substrate table 118, and there is nothing. It becomes a state. Similarly, when the cap member C is held by the second cap holding portion 112, the cap member C is not held by the first cap holding portion 111, and there is nothing.

  In the present embodiment, the first cap holding unit 111 holds the cap member C and the second cap holding during the exposure of the substrate P held by the first substrate stage 91 (first substrate holding unit 97). The unit 112 holds the cap member C during the exposure of the substrate P held by the second substrate stage 92 (second substrate holding unit 98).

  As described above, the gas bearing 156 can be formed between the seal member 109 of the present embodiment and the surface of the predetermined member arranged at a position facing the lower surface of the seal member 109. The seal member 109 is in a state in which a predetermined gap is maintained between the lower surface of the seal member 109 and the upper surface of the cap member C by utilizing an adsorption action generated by forming the gas bearing 156 with the cap member C. Thus, the cap member C can be held. The seal member 109 can hold the cap member C in a releasable manner so that the cap member C is disposed at a position facing the lower surface 100A of the last optical element 100. The seal member 109 is configured such that the cap member C is disposed at a position facing the lower surface 100A of the terminal optical element 100 when each of the first substrate stage 91 and the second substrate stage 92 is separated from the terminal optical element 100. The cap member C is held.

  23 and 24 are diagrams illustrating an example of the operation using the cap member C. FIG. For example, when the cap member C held by the first cap holding part 111 is held by the seal member 109, the control device 93 includes the lower surface 100A of the last optical element 100 and the lower surface of the seal member 109 as shown in FIG. The upper surface of the cap member C held by the first cap holding part 111 is made to face. Thereby, the liquid LQ is held between the terminal optical element 100 and the seal member 109 and the upper surface of the cap member C, and the liquid immersion part LS is formed. A gas bearing 156 is formed between the lower surface of the seal member 109 and the upper surface of the cap member C.

  Next, the control device 93 releases the holding of the cap member C by the first cap holding part 111. Thereby, the first cap holding part 111 can release the cap member C. A gas bearing 156 is formed between the lower surface of the seal member 109 and the upper surface of the cap member C, and the seal member 109 uses an adsorption action generated by forming the gas bearing 156 with the cap member C. Then, the cap member C is held in a state where a predetermined gap is maintained between the lower surface of the seal member 109 and the upper surface of the cap member C.

  Then, as shown in FIG. 24, the control device 93 controls the first fine movement system 120 in a state where the gas bearing 156 is formed between the lower surface of the seal member 109 and the upper surface of the cap member C, and the seal member The positional relationship in the Z-axis direction between the cap member C held by 109 and the first cap holding part 111 is adjusted, and the cap member C is removed from the first cap holding part 111. For example, when the first substrate table 116 moves downward (−Z direction), the cap member C held by the seal member 109 is removed from the first cap holding portion 111 and held by the seal member 109. . Thus, the cap member C held by the first cap holding part 111 is released from the first cap holding part 111 and is held by the seal member 109. The cap member C released from the first cap holding part 111 and held by the seal member 109 holds the liquid LQ between the terminal optical element 100 and the seal member 109.

  Further, when the cap member C held by the seal member 109 is held by the first cap holding part 111, the control device 93 includes the cap member C held by the seal member 109 and the lower surface 100A of the last optical element 100. The lower surface of the cap member C and the first cap holding part 111 of the first substrate table 116 are opposed to each other while holding the liquid LQ.

  Then, the control device 93 adjusts the positional relationship between the cap member C held by the seal member 109 and the first cap holding portion 111 of the first substrate table 116 in the Z-axis direction, and is held by the seal member 109. The cap member C is released from the seal member 109 and transferred to the first cap holding portion 111. Specifically, the control device 93 causes the lower surface of the cap member C held by the seal member 109 and the upper surface of the first cap holding portion 111 to contact each other, and then the cap member C is moved by the first cap holding portion 111. Hold to adsorb. As a result, the cap member C held by the seal member 109 is released from the seal member 109 and is held by the first cap holding portion 111.

  Then, the control device 93 holds the liquid LQ between the terminal optical element 100 and the seal member 109 and the cap member C held by the first cap holding part 111, and the terminal optical element 100 and the seal member 109. In contrast, the first substrate stage 91 is moved in the X and Y directions so that the lower surface 100A of the last optical element 100 and the lower surface of the seal member 109 are opposed to the upper surface 147 (including the substrate P) of the first substrate table 116. Thereby, the liquid LQ is held between the last optical element 100 and the seal member 109 and the first substrate stage 91 (including the substrate P), and the liquid immersion part LS is formed.

  As described above, the operation of releasing the cap member C held by the first cap holding portion 111 from the first cap holding portion 111 and holding it by the seal member 109, and the cap member C held by the seal member 109. The operation of releasing from the seal member 109 and holding it in the first cap holding part 111 has been described. The operation of releasing the cap member C held by the second cap holding part 112 from the second cap holding part 112 and holding it by the seal member 109, and the cap member C held by the seal member 109, In the operation of releasing from the seal member 109 and holding it by the second cap holding part 112, the cap member C held by the first cap holding part 111 is released from the first cap holding part 111 and sealed. The operation of holding the member 109 and the operation of releasing the cap member C held by the seal member 109 from the seal member 109 and holding the cap member C by the first cap holding portion 111 are omitted. To do.

  Next, an example of an exposure method and a cleaning method for the substrate P according to the present embodiment will be described with reference to the flowchart of FIG. 25 and the schematic diagrams of FIGS.

  As shown in FIG. 26, in the exposure station ST1, the substrate P held by the first substrate holding part 97 of the first substrate stage 91 is disposed at the exposure position PJ1 and subjected to immersion exposure. The first substrate holding unit 97 holds, for example, the (m−1) th substrate P among N substrates P that are sequentially processed. Before the immersion exposure, the (m−1) th substrate P held by the first substrate holding unit 97 is detected at a plurality of detection points by the focus / leveling detection system 102 at the measurement station ST2. Height information Zij of the surface of the substrate P in each of the Kij is detected. The height information Zij relating to the (m−1) th substrate P is stored in the storage device 94.

  As shown in FIG. 26, during the exposure of the substrate P held by the first substrate holding portion 97 of the first substrate stage 91, the cap member C is held by the first cap holding portion 111 of the first substrate stage 91. ing.

  As shown in FIG. 27, after the immersion exposure of the substrate P on the first substrate stage 91 is completed, the control device 93 uses the second drive system 114 and the lower surface 100A of the last optical element 100 and the first The first substrate stage 91 is moved in the XY directions so that the upper surface of the cap member C held by the first cap holding part 97 of the substrate stage 91 faces the upper surface. Accordingly, the liquid LQ is held between the lower surface 100A of the terminal optical element 100 and the upper surface of the cap member C held by the first cap holding part 111.

  Next, the control device 93 releases the holding of the cap member C by the first cap holding part 111, releases the cap member C from the first cap holding part 111, and utilizes the adsorption action of the gas bearing 156, The cap member C is held by the seal member 109. The cap member C held by the seal member 109 is disposed at a position facing the lower surface 100A of the terminal optical element 100, and the liquid LQ is held between the terminal optical element 100 and the cap member C.

  While the exposure process of the substrate P held by the first substrate holding unit 97 is being performed in the exposure station ST1, the substrate exchange process for the second substrate holding unit 98 and the second substrate holding unit are performed in the measurement station ST2. Measurement processing relating to the substrate P held by 98 is executed.

  For example, of the N substrates P that are sequentially processed, the m-th substrate P is held by the holding member 108 of the substrate temperature adjusting device 107 by the transfer system 106 and the temperature is adjusted (step SC1).

  A second substrate stage 92 is disposed at the substrate exchange position PJ3. The second substrate holding unit 98 of the second substrate stage 92 holds the (m−2) th substrate P that has already been exposed in the exposure station ST1. The (m−2) th post-exposure substrate P held by the second substrate stage 92 disposed at the substrate exchange position PJ3 is unloaded from the second substrate holding unit 98 by the transport system 106. . In addition, the (m−2) th substrate P held by the second substrate holding unit 98 is subjected to a plurality of detection points by the focus / leveling detection system 102 at the measurement station ST2 before being subjected to immersion exposure. Height information Zij of the surface of the substrate P in each of Kij is detected. The height information Zij regarding the (m-2) th substrate P is stored in the storage device 94.

  The (m-2) th substrate P after exposure held by the second substrate holding unit 98 is unloaded from the second substrate holding unit 98, and then the mth sheet whose temperature is adjusted by the holding member 108. The substrate P is loaded by the transport system 106 onto the second substrate holding unit 98 of the second substrate stage 92 disposed at the substrate exchange position PJ3 of the measurement station ST2 (Step SC2).

  As shown in FIG. 26, the control device 93 moves the second substrate stage 92 holding the m-th substrate P by the second substrate holding unit 98 to the measurement position PJ2. The control device 93 uses the focus / leveling detection system 102 to height the surface of the substrate P at each of a plurality of detection points Kij on the surface of the m-th substrate P held by the second substrate holding unit 98. Information Zij is detected. (Step SC3).

  The control device 93 stores the height information Zij of the surface of the substrate P at each of a plurality of detection points Kij on the surface of the m-th substrate P, detected using the focus / leveling detection system 102, in the storage device 94. (Step SC4).

  Further, the control device 93 executes various measurement processes relating to the substrate P held by the second substrate holding unit 98 arranged in the measurement station ST2, such as a measurement process using the alignment system 101.

  The controller 93 determines whether or not at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij held by the second substrate holding unit 98 is abnormal (step SC5). ).

  If it is determined in step SC5 that the height information Zij is not abnormal, the control device 93 starts immersion exposure of the mth substrate P held by the second substrate holding unit 98 (step SC6). .

  The control device 93 starts an operation of moving the second substrate stage 92 from the measurement station ST2 to the exposure station ST1 in order to start immersion exposure of the substrate P held by the second substrate holding unit 98. In the present embodiment, as shown in FIG. 28, the control device 93 performs the second drive in a state where the liquid LQ is held between the terminal optical element 100 and the cap member C held by the seal member 109. Using the system 114, each of the first substrate stage 91 and the second substrate stage 92 is moved to an area between the exposure station ST1 and the measurement station ST2. In the present embodiment, the first substrate stage 91 is disposed on the −X side of the second substrate stage 92 in the region between the exposure station ST1 and the measurement station ST2.

  Next, as shown in FIG. 29, the control device 93 releases the connection between the first connection member 145 and the first joint member 139 of the first substrate stage 91, and the second connection member 146 and the second substrate stage 92. The connection between the first joint member 145 and the third joint member 141 of the second substrate stage 92 and the connection between the second joint member 146 and the first substrate stage 91 are performed. Connection with the second joint member 140 is executed. As described above, the control device 93 performs the exchange operation of the first connection member 145 and the second connection member 146 with respect to the first substrate stage 91 and the second substrate stage 92.

  Next, the controller 93 uses the second drive system 114 to move the second substrate stage 92 to the exposure station ST1 and move the first substrate stage 91 to the measurement station ST2.

  As shown in FIG. 30, the control device 93 moves the second substrate stage 92 so that the cap member C held by the seal member 109 and the second cap holding portion 112 of the second substrate stage 92 face each other. Moving. Next, the control device 93 releases the cap member C held by the seal member 109 from the seal member 109 and holds the cap member C by the second cap holding portion 112.

  As shown in FIG. 31, after the cap member C is held by the second cap holding part 112, the control device 93 uses the second drive system 114 to connect the lower surface 100 </ b> A of the terminal optical element 100 and the second optical system 100. From the state where the upper surface of the cap member C held by the cap holding portion 112 faces, the lower surface 100A of the last optical element 100 and the upper surface (or the second substrate holding portion 98) of the second substrate stage 92 are held. The second substrate stage 92 is moved in the XY directions so as to change to a state in which the surface of the substrate P faces the substrate P). As a result, between the lower surface 100A of the last optical element 100 and the seal member 109 and the upper surface of the second substrate stage 92 (or the surface of the substrate P held by the second substrate holding portion 98 of the second substrate stage 92). Liquid LQ is retained.

  As shown in FIG. 32, the controller 93 moves the substrate P to the exposure position PJ1 in order to expose the substrate P held by the second substrate holding unit 98 (step SC7). Immersion exposure is executed (step SC8).

  In the exposure station ST1, immersion exposure of the substrate P on the second substrate stage 92 is performed, and in the measurement station ST2, the substrate replacement process for the first substrate stage 91 and the first substrate stage 91 holding the substrate P are performed. The measurement process is performed. During the exposure of the substrate P held by the second substrate holding unit 98 of the second substrate stage 92, the cap member C is held by the second cap holding unit 112 of the second substrate stage 92.

  Thereafter, the same processing is repeated. That is, after the immersion exposure of the m-th substrate P on the second substrate stage 92 is completed (step SC9), the control device 93 releases the cap member C from the second cap holding portion 112 and the cap. The member C is held by the seal member 109. The cap member C held by the seal member 109 holds the liquid LQ between the terminal optical element 100 and the cap member C. The second substrate stage 92 holding the exposed substrate P is moved from the exposure position PJ1 of the exposure station ST1 to the substrate exchange position PJ3 of the measurement station ST2. The m-th substrate P after exposure held by the second substrate holding unit 98 of the second substrate stage 92 moved to the substrate exchange position PJ3 is unloaded from the second substrate holding unit 98 by the transport system 106. (Step SC10). The substrate P unloaded from the second substrate holding unit 98 is subjected to predetermined processing such as development processing.

  If it is determined in step SC5 that at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the mth substrate P is abnormal, the control device 93 performs the previous process. It is determined whether at least one of the height information Zij on the surface of the substrate P at each of the plurality of detection points Kij on the surface of the (m-2) th substrate P is abnormal (step SC11).

  If it is determined in step SC11 that the height information Zij of the (m-2) th substrate P is not abnormal, immersion exposure of the mth substrate P is started (step SC6).

  When it is determined in step SC11 that at least one of the height information Zij of the surface of the substrate P at each of the plurality of detection points Kij on the surface of the (m-2) th substrate P is abnormal, The height information Zij related to the (m-2) th substrate P and the height information Zij related to the mth substrate P stored in the storage device 94 are compared (step SC12).

  The control device 93 compares the height information Zij related to the (m-2) th substrate P with the height information Zij related to the mth substrate P, and the surface of the (m-2) th substrate P is compared. The position of the detection point Kij with the abnormal height information Zij relative to the second substrate holding part 98 and the position of the detection point Kij with the abnormal height information Zij on the surface of the mth substrate P relative to the second substrate holding part 98 Are the same (step SC13).

  In step SC13, the position of the detection point Kij where the height information Zij is abnormal on the surface of the mth substrate P with respect to the second substrate holder 98 is the height information on the surface of the (m-2) th substrate P. When it is determined that Zij is different from the position of the abnormal detection point Kij with respect to the second substrate holding unit 98, the control device 93 does not perform the cleaning operation on the second substrate holding unit 98 using the first cleaning device 103. Immersion exposure of the mth substrate P is started (step SC6).

  In step SC13, the position of the detection point Kij where the height information Zij is abnormal on the surface of the m-th substrate P with respect to the second substrate holding unit 98 is abnormal, and the height information Zij is abnormal on the surface of the m-th substrate P. If it is determined that the position of the detection point Kij is substantially the same as the position with respect to the second substrate holding unit 98, the control device 93 starts the cleaning operation for the second substrate holding unit 98 using the first cleaning device 103 (step SC14). .

  The control device 93 carries out (unloads) the m-th substrate P held by the second substrate holding unit 98 from the second substrate holding unit 98 in order to start cleaning the second substrate holding unit 98. (Step SC15).

  The control device 93 moves the second substrate stage 92 to the substrate exchange position PJ3 in order to carry out the m-th substrate P held by the second substrate holding unit 98 from the second substrate holding unit 98, The m-th substrate P held by the second substrate holding unit 98 of the second substrate stage 92 moved to the substrate exchange position PJ3 is unloaded from the second substrate holding unit 98 using the transfer system 106, It is conveyed to the holding member 108. The holding member 108 supports the m-th substrate P carried out from the second substrate holding unit 98 at a position different from the exposure position PJ1 and the substrate replacement position PJ3.

  The controller 93 unloads the m-th substrate P held by the second substrate holding unit 98 from the second substrate holding unit 98 and then moves the second substrate stage 92 including the second substrate holding unit 98 to the cleaning position. Move to PJ2 (step SC16). Accordingly, as shown in FIG. 33, the second substrate holding portion 98 is disposed at the cleaning position PJ2.

  The control device 93 starts a cleaning operation using the first cleaning device 103 for the second substrate holder 98 disposed at the cleaning position PJ2 (step SC17).

  As shown in FIG. 33, in this embodiment, when the second substrate holding unit 98 using the first cleaning device 103 is cleaned, the exposure of the substrate P on the first substrate stage 91 is performed at the exposure station ST1. After the completion, the cap member C is held by the first cap holding part 111 of the first substrate stage 91. Then, the upper surface 147 of the first substrate stage 91 is disposed at the exposure position PJ1 facing the lower surface 100A of the last optical element 100. Accordingly, the liquid LQ is held between the lower surface 100A of the last optical element 100 and the lower surface of the seal member 109 and the upper surface 147 of the first substrate stage 91.

  Thus, when the second substrate holding part 98 is disposed at the cleaning position PJ2, the first substrate stage 91 is disposed at the exposure position PJ1. The control device 93 uses the first cleaning device 103 to hold the second substrate while the liquid LQ is held between the last optical element 100 and the seal member 109 and the first substrate stage 91 disposed at the exposure position PJ1. Cleaning of the unit 98 is executed. During the cleaning of the second substrate holding unit 98 using the first cleaning device 103, the liquid LQ is held between the first substrate stage 91 disposed at the exposure position PJ1, the last optical element 100, and the seal member 109.

  The first cleaning device 103 includes a polishing device 105 and cleans the second substrate holding unit 98 using the polishing member 104 of the polishing device 105. By polishing the second substrate holding part 98 using the polishing member 104, foreign substances adhering to the second substrate holding part 98 can be removed.

  During the cleaning of the second substrate holding unit 98 using the first cleaning device 103, the control device 93 performs a measurement process using the first substrate stage 91 disposed at the exposure position PJ1 in the exposure station ST1. It may be. For example, when an optical sensor capable of measuring the exposure light EL is arranged on the first substrate table 116 of the first substrate stage 91, the first substrate holding unit 98 using the first cleaning device 103 is cleaned during the first cleaning. The optical sensor of the substrate table 116 is disposed at the exposure position PJ1, and the exposure light EL is measured using the optical sensor in a state where the liquid LQ is held between the terminal optical element 100 and the optical sensor of the first substrate table 116. can do. For example, the control device 93 can irradiate the photosensor of the first substrate table 116 with the exposure light EL emitted from the last optical element 100 via the liquid LQ.

  During the cleaning of the second substrate holding unit 98 using the first cleaning device 103, the substrate P on the first substrate stage 91 disposed at the exposure position PJ1 may be exposed at the exposure station ST1. That is, the controller 93 holds the liquid LQ between the last optical element 100 and the substrate P disposed at the exposure position PJ1 in the exposure station ST1, and irradiates the substrate P with the exposure light EL through the liquid LQ. However, the cleaning operation of the second substrate holding unit 98 using the first cleaning device 103 can be executed in the measurement station ST2.

  During the cleaning of the second substrate holding unit 98 using the first cleaning device 103, the cap member C is held by the seal member 109 so that the liquid LQ is held between the last optical element 100 and the cap member C. May be. That is, the control device 93 holds the liquid LQ between the last optical element 100 and the cap member C disposed at the exposure position PJ1 by being held by the seal member 109, and thus the first cleaning device 103. Cleaning of the second substrate holding part 98 using can be performed.

  When the cap member C is provided with an optical sensor, the control device 93 moves between the terminal optical element 100 and the cap member C disposed at the exposure position PJ1 by being held by the seal member 109. The exposure light EL is emitted from the last optical element 100 in a state where the liquid LQ is held on the cap member C, and the exposure light EL emitted from the last optical element 100 is provided on the cap member C via the liquid LQ. It can be detected by an optical sensor.

  After the cleaning of the second substrate holding unit 98 is completed (step SC18), the control device 93 moves the second substrate stage 92 to the substrate exchange position PJ3 by separating the polishing member 104 from the second substrate holding unit 98. The control device 93 uses the transfer system 106 to m sheets held by the holding member 108 of the substrate temperature adjusting device 107 on the second substrate holding portion 98 of the second substrate stage 92 moved to the substrate replacement position PJ3. The eye substrate P is transported. As a result, the m-th substrate P whose temperature has been adjusted is loaded onto the second substrate holding unit 98 (step SC19). After the substrate P is loaded on the second substrate holding unit 98, immersion exposure of the substrate P is started (step SC6).

  As described above, according to the present embodiment, the liquid LQ is held between the last optical element 100 and at least one of the first substrate stage 91, the substrate P, and the cap member C disposed at the exposure position PJ1. In this state, the second substrate holding part 98 can be cleaned.

  In this embodiment, in step SC13, the position of the detection point Kij where the height information Zij is abnormal on the surface of the m-th substrate P with respect to the second substrate holding part 98 is the (m-2) th. When it is determined that the height information Zij on the surface of the substrate P is different from the position of the abnormal detection point Kij relative to the second substrate holding unit 98, the cleaning operation for the second substrate holding unit 98 using the first cleaning device 103 is executed. Although the case where the immersion exposure of the m-th substrate P is started is described as an example, the second cleaning device 82 (82B) as described in the second embodiment is used to perform the second exposure. After performing the cleaning process on the surface of the substrate P held by the substrate holding unit 98, the exposure of the substrate P held by the second substrate holding unit 98 may be started.

  In this embodiment, the case where the substrate P unloaded from the second substrate holding unit 98 in step SC15 is supported by the holding member 108 of the substrate temperature adjusting device 107 is described as an example. 106 may be supported by the conveying member 106.

  In the twin stage type exposure apparatus EX2 described in the present embodiment, the second cleaning apparatus 82 (82B) capable of cleaning the surface of the substrate P as described in the second embodiment is provided in the measurement station ST2. In the case of being arranged, for example, height information Zij at each of a plurality of detection points Kij on the surface of the substrate P held by the second substrate holding unit 98 is detected at the first timing using the focus / leveling detection system 102. If it is determined that at least one of the height information Zij detected at the first timing is abnormal, a cleaning operation is performed on the surface of the substrate P using the second cleaning device 82 (82B), and After the cleaning operation for the surface is performed, each of the plurality of detection points Kij on the surface of the substrate P The height information Zij is detected at the second timing using the focus / leveling detection system 102, and the second information is detected based on the detection result of the first timing detection operation and the detection result of the second timing detection operation. The cleaning operation for the substrate holding unit 098 may be controlled.

  In this case, for example, the position of the detection point Kij that is determined to be abnormal in the height information Zij in the second timing detection operation with respect to the second substrate holding unit 98 is the height information Zij in the first timing detection operation. When it is determined that the position of the determined detection point Kij is substantially the same as the position with respect to the second substrate holding unit 98, after the substrate P held by the second substrate holding unit 98 is unloaded from the second substrate holding unit 98. The cleaning operation using the first cleaning device 103 for the second substrate holding part 98 can be started.

  Further, the position of the detection point Kij at which the height information Zij is determined to be abnormal in the detection operation at the second timing relative to the second substrate holding unit 98 is determined to be abnormal in the height information Zij at the detection operation at the first timing. When it is determined that the position of the detection point Kij is different from the position with respect to the second substrate holding unit 98, the exposure of the substrate P can be started without executing the cleaning operation with respect to the second substrate holding unit 98. After performing the cleaning operation using the second cleaning device 82 (82B) on the surface, the exposure of the substrate P can also be started.

  If it is determined that none of the height information Zij is abnormal in the detection operation at the second timing, the second substrate stage 92 is moved to the exposure station ST2 without performing the cleaning operation on the second substrate holding unit 98. Thus, exposure of the substrate P can be started.

  In the present embodiment, the case where the second substrate holding unit 98 is cleaned has been described as an example, but the same applies to the case where the first substrate holding unit 97 is cleaned.

  In the first to fifth embodiments described above, after detecting the height information of the surface of the substrate P held by the substrate holding unit 4 (98), for cleaning the substrate holding unit 4 (98), An example in which the substrate P is unloaded from the substrate holding unit 4 (98), the substrate holding unit 4 (98) is cleaned, and then the unloaded substrate P is loaded onto the substrate holding unit 4 (98) again. As described above, the substrate P unloaded for cleaning the substrate holder 4 (98) may not be loaded again on the substrate holder 4 (98).

  In the first to fifth embodiments described above, by providing a camera capable of acquiring an image of the surface of the substrate P, the camera is used to observe whether foreign matter is attached to the surface of the substrate P. can do. For example, when it is determined that at least one of the height information Zij at each of the plurality of detection points Kij on the surface of the substrate P held by the substrate holding unit is abnormal based on the detection result of the focus / leveling detection system The camera is used to confirm whether the abnormal cause is a foreign matter between the substrate P and the substrate holder as shown in FIG. 7 or a foreign matter on the surface of the substrate P as shown in FIG. can do. In addition, after cleaning the surface of the substrate P using the above-described second cleaning device, it can be confirmed using a camera whether foreign matter on the surface of the substrate P is removed.

  In each of the above-described embodiments, the case where the first cleaning device 16 (103) includes the polishing device 18 (105) has been described as an example. However, for example, a mechanism for cleaning using a nonwoven fabric may be provided. Good.

  In each of the above-described embodiments, the surface of the substrate P held by the substrate holding unit and the XY plane are substantially parallel, and the height information Zij of the surface of the substrate P held by the substrate holding unit is the substrate. Although the case where position information in the Z-axis direction substantially perpendicular to the surface of P is included has been described as an example, for example, the surface of the substrate P held by the substrate holding unit may be inclined with respect to the XY plane. . Even in this case, the height information of the surface of the substrate P held by the substrate holding unit includes position information in a direction substantially perpendicular to the surface of the substrate P.

  In each of the above-described embodiments, the projection optical system PL fills the optical path space on the exit side (image plane side) of the last optical element with a liquid, but this is disclosed in US Patent Application Publication No. 2005/0248856. As described above, it is also possible to employ a projection optical system in which the optical path space on the incident side (object plane side) of the last optical element is filled with liquid.

  In addition, although the liquid LQ of the above-mentioned embodiment is water, liquids other than water may be sufficient. The liquid LQ is preferably a liquid LQ that is transparent to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the projection optical system or a photosensitive material (photoresist) film that forms the surface of the substrate. For example, as the liquid LQ, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, cedar oil, or the like can be used. A liquid LQ having a refractive index of about 1.6 to 1.8 may be used. Furthermore, an optical element (such as a terminal optical element) of the projection optical system PL that is in contact with the liquid LQ may be formed of a material having a refractive index higher than that of quartz and fluorite (for example, 1.6 or more). In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

Further, for example, when the exposure light EL is F ₂ laser light, the F ₂ laser light does not transmit water, so that the liquid LQ can transmit F ₂ laser light, such as perfluorinated polyether (PFPE). ), Fluorine-based fluids such as fluorine-based oils can be used. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, at a portion in contact with the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P are The present invention can also be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed in a stationary state and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The type of the exposure apparatus is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P. An exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In each of the above-described embodiments, each position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage. ) May be used. In this case, it is preferable that a hybrid system including both the interferometer system and the encoder system is used, and the measurement result of the encoder system is calibrated using the measurement result of the interferometer system. Further, the position of the stage may be controlled by switching between the interferometer system and the encoder system or using both.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610, A harmonic generator that outputs pulsed light having a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). The variable shaping mask is not limited to DMD, and a non-light emitting image display element described below may be used instead of DMD. Here, the non-light-emitting image display element is an element that spatially modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction, and a transmissive liquid crystal modulator is a transmissive liquid crystal modulator. An electrochromic display (ECD) etc. are mentioned as an example other than a display element (LCD: Liquid Crystal Display). In addition to the DMD described above, the reflective spatial light modulator includes a reflective mirror array, a reflective liquid crystal display element, an electrophoretic display (EPD), electronic paper (or electronic ink), and a light diffraction type. An example is a light valve (Grating Light Valve).

  Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. In this case, an illumination system is unnecessary. Here, as a self-luminous image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission) Display), plasma display (PDP: Plasma Display Panel), and the like. Further, as a self-luminous image display element provided in the pattern forming apparatus, a solid light source chip having a plurality of light emitting points, a solid light source chip array in which a plurality of chips are arranged in an array, or a plurality of light emitting points on a single substrate A built-in type or the like may be used to form a pattern by electrically controlling the solid-state light source chip. The solid light source element may be inorganic or organic.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and a liquid immersion portion is provided in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus according to the present embodiment assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 34, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like. The cleaning operation of the above-described embodiment is included in the substrate processing step 204.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a top view which shows a part of exposure apparatus which concerns on 1st Embodiment. FIG. 3 is a side sectional view showing the vicinity of a substrate stage and a liquid immersion member according to the first embodiment. It is a top view which shows typically the state in which the focus leveling detection system is detecting the surface position information of a board | substrate. It is a side view which shows typically the state in which the focus leveling detection system is detecting the surface position information of a board | substrate. It is a schematic diagram which shows the positional relationship of the surface of a board | substrate, and a detection point. It is a schematic diagram which shows the state in which the foreign material exists between a board | substrate and a board | substrate holding part. It is a schematic diagram which shows the state in which the foreign material exists on the surface of a board | substrate. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of a 1st cleaning apparatus. It is a figure which shows an example of the 2nd cleaning apparatus which concerns on 2nd Embodiment. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the 2nd cleaning apparatus which concerns on 2nd Embodiment. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on 4th Embodiment. It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 5th Embodiment. It is a top view which shows a part of exposure apparatus which concerns on 5th Embodiment. It is a sectional side view showing the neighborhood of the 1st substrate stage and seal member concerning a 5th embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 5th Embodiment. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate stage, 2 ... Measurement stage, 4 ... Substrate holding part, 12 ... Focus leveling detection system, 13 ... Conveyance system, 14 ... Substrate temperature adjusting device, 16 ... First cleaning device, 17 ... Polishing member, 18 ... Polishing device, 46 ... last optical element, 46A ... lower surface, 47 ... liquid immersion member, 50 ... conveying member, 54 ... holding member, 63 ... plate member holding portion, 82, 82B ... second cleaning device, 83 ... gas supply port 87 ... Gas suction port, 91 ... First substrate stage, 92 ... Second substrate stage, 97 ... First substrate holder, 98 ... Second substrate holder, 100 ... Terminal optical element, 100A ... Lower surface, 102 ... Focus Leveling detection system 109: Seal member 111: First cap holding portion 112: Second cap holding portion C: Cap member EL: Exposure light, EX1 EX2 ... exposure apparatus, LQ ... liquid, LS ... immersion portion, P ... substrate, PJ1 ... exposure position, PJ2 ... cleaning position, PJ3 ... substrate exchange position, PL ... projection optical system, T ... plate member

Claims (50)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface for emitting the exposure light;
A first member having a first holding part to which the substrate can be attached and detached, and movable within a predetermined region including a first position facing the emission surface;
A second member that can be disposed at the first position;
A first cleaning device for cleaning the first holding portion of the first member in a state where liquid is held between the optical member and the second member disposed at the first position. Exposure device. A detection device capable of detecting height information of the surface of the substrate at each of a plurality of detection points on the surface of the substrate held by the first holding unit;
The exposure apparatus according to claim 1, wherein a cleaning operation using the first cleaning device is controlled based on a detection result of the detection device.   3. The exposure according to claim 2, wherein whether or not at least one of the height information is abnormal is determined, and whether or not a cleaning operation using the first cleaning device is started is determined based on the determination result. apparatus. After the height information at each of a plurality of detection points on the surface of the first substrate held by the first holding unit is detected by the detection device, the second substrate held by the first holding unit Height information at each of a plurality of detection points on the surface is detected by the detection device,
The exposure apparatus according to claim 2 or 3, wherein a cleaning operation using the first cleaning device is controlled based on a detection result related to the first substrate and a detection result related to the second substrate.   The position of the detection point where the height information is abnormal on the surface of the first substrate with respect to the first holding part, and the first holding part of the detection point where the height information is abnormal on the surface of the second substrate The exposure apparatus according to claim 4, wherein a cleaning operation using the first cleaning apparatus is controlled based on a relationship with a position relative to the position.   The position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the first holding unit is the position of the detection point where the height information is abnormal on the surface of the first substrate. When it is determined that the position is substantially the same as the position of the first holding unit, after the second substrate held by the first holding unit is unloaded from the first holding unit, a cleaning operation for the first holding unit is started. The exposure apparatus according to claim 4 or 5.   The exposure apparatus according to claim 6, further comprising a support member that supports the second substrate unloaded from the first holding unit at a second position different from the first position.   The position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the first holding unit is the position of the detection point where the height information is abnormal on the surface of the first substrate. The exposure apparatus according to claim 4 or 5, wherein when it is determined that the position of the second substrate is different from the position of the first substrate, exposure of the second substrate is started without executing a cleaning operation on the first holding unit. A second cleaning device for cleaning the surface of the substrate held by the first holding unit;
The position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the first holding unit is the position of the detection point where the height information is abnormal on the surface of the first substrate. The cleaning operation for the surface of the second substrate using the second cleaning device is started without executing the cleaning operation for the first holding unit when it is determined that the position differs from the position for the first holding unit. The exposure apparatus described. A second cleaning device for cleaning the surface of the substrate held by the first holding unit;
The detection device performs a first detection operation for detecting the height information at each of a plurality of detection points on the surface of the substrate held by the first holding unit,
When it is determined that at least one of the height information detected in the first detection operation is abnormal, a cleaning operation is performed on the surface of the substrate using the second cleaning device,
The detection device performs a second detection operation for detecting the height information at each of a plurality of detection points on the surface of the substrate after a cleaning operation on the surface of the substrate is performed,
The exposure apparatus according to claim 2 or 3, wherein a cleaning operation using the first cleaning device is controlled based on a detection result of the first detection operation and a detection result of the second detection operation.   The position of the detection point at which the height information is determined to be abnormal in the first detection operation with respect to the first holding unit, and the first of the detection point at which the height information is determined to be abnormal in the second detection operation. The exposure apparatus according to claim 10, wherein a cleaning operation using the first cleaning apparatus is controlled based on a relationship with a position with respect to the holding unit.   The position of the detection point at which the height information is determined to be abnormal in the second detection operation with respect to the first holding unit is the first detection point at which the height information is determined to be abnormal in the first detection operation. When it is determined that the position is substantially the same as the position with respect to the holding unit, the first holding unit that uses the first cleaning device after unloading the substrate held by the first holding unit from the first holding unit. The exposure apparatus according to claim 10 or 11, wherein a cleaning operation is started.   The exposure apparatus according to claim 12, further comprising a support member that supports the substrate unloaded from the first holding unit at a second position different from the first position.   The position of the detection point at which the height information is determined to be abnormal in the second detection operation with respect to the first holding unit is the first detection point at which the height information is determined to be abnormal in the first detection operation. 12. The exposure apparatus according to claim 10, wherein when it is determined that the position is different from the position with respect to the holding unit, the exposure of the substrate is started without performing a cleaning operation on the first holding unit.   The exposure according to claim 10, wherein when it is determined that none of the height information is abnormal in the second detection operation, exposure of the substrate is started without executing a cleaning operation using the first cleaning device. apparatus.   The position of the detection point at which the height information is determined to be abnormal in the second detection operation with respect to the first holding unit is the first detection point at which the height information is determined to be abnormal in the first detection operation. 13. The cleaning operation for the surface of the substrate using the second cleaning device is started without executing the cleaning operation for the first holding unit when it is determined that the position is different from the position with respect to the holding unit. Exposure equipment. The second cleaning device includes a gas supply port capable of supplying gas,
The exposure apparatus according to claim 9, wherein a gas is supplied to the surface of the substrate from the gas supply port. The second cleaning device includes a gas suction port capable of sucking a gas,
The exposure apparatus according to any one of claims 9 to 17, wherein a gas is sucked from the gas suction port in a state where the surface of the substrate and the gas suction port are opposed to each other.   The exposure apparatus according to any one of claims 2 to 18, wherein the detection apparatus detects the height information before the exposure light is irradiated onto the substrate.   The exposure apparatus according to claim 1, wherein the second member is movable within a predetermined region including the first position while mounting a measuring instrument without holding the substrate.   21. The exposure apparatus according to claim 20, wherein a measurement operation using the measuring device is executed in parallel with at least a part of a cleaning operation using the first cleaning device.   The exposure apparatus according to any one of claims 1 to 21, wherein the second member is movable in a predetermined region including the first position while holding the substrate. The first member has a second holding part to which the plate member can be attached and detached,
The exposure apparatus according to claim 1, wherein the second member includes the plate member.   24. The exposure apparatus according to claim 1, wherein the first cleaning device includes a polishing member that polishes the first holding unit. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 24;
Developing the exposed substrate; and a device manufacturing method. A cleaning method used in an exposure apparatus that exposes a substrate with exposure light through a liquid,
Cleaning the substrate holding portion of the first member movable within a predetermined region including a first position facing the emission surface of the optical member emitting the exposure light;
A cleaning method comprising: holding a liquid between the second member disposed at the first position and the optical member during cleaning of the substrate holding portion. Further detecting height information of the surface of the substrate at each of a plurality of detection points on the surface of the substrate held by the substrate holding unit,
27. The cleaning method according to claim 26, wherein a cleaning operation for the substrate holder is controlled based on the detection result.   28. The cleaning method according to claim 27, wherein it is determined whether or not at least one of the height information is abnormal, and based on the determination result, it is determined whether or not to start a cleaning operation for the substrate holder. Detecting height information at each of a plurality of detection points on the surface of the first substrate held by the substrate holding unit;
After detecting the height information of the first substrate, detecting height information at each of a plurality of detection points on the surface of the second substrate held by the substrate holding unit,
29. The cleaning method according to claim 27 or 28, wherein a cleaning operation for the substrate holder is controlled based on a detection result related to the first substrate and a detection result related to the second substrate.   The position of the detection point where the height information is abnormal on the surface of the first substrate with respect to the substrate holding unit, and the position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the substrate holding unit 30. The cleaning method according to claim 29, wherein a cleaning operation for the substrate holding unit is controlled based on the relationship between   The position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the substrate holding unit is the position of the detection point where the height information is abnormal on the surface of the first substrate with respect to the substrate holding unit. 30. The cleaning operation for the substrate holding unit is started after the second substrate held by the substrate holding unit is unloaded from the substrate holding unit when it is determined that 30. The cleaning method according to 30.   32. The cleaning method according to claim 31, wherein the second substrate carried out from the substrate holding part is supported at a second position different from the first position.   The position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the substrate holding unit is the position of the detection point where the height information is abnormal on the surface of the first substrate with respect to the substrate holding unit. The cleaning method according to claim 29 or 30, wherein when it is determined that the second substrate is different from the first substrate, exposure of the second substrate is started without performing a cleaning operation on the substrate holding unit.   The position of the detection point where the height information is abnormal on the surface of the second substrate with respect to the substrate holding unit is the position of the detection point where the height information is abnormal on the surface of the first substrate with respect to the substrate holding unit. 31. The cleaning method according to claim 29, wherein when it is determined that the cleaning operation is not performed, the cleaning operation for the surface of the substrate held by the substrate holding unit is started without performing the cleaning operation for the substrate holding unit. Detecting the height information at each of a plurality of detection points on the surface of the substrate held by the substrate holding unit at a first timing;
Performing a cleaning operation on the surface of the substrate when it is determined that at least one of the height information detected at the first timing is abnormal;
After the cleaning operation on the surface of the substrate is performed, detecting the height information at each of a plurality of detection points on the surface of the substrate at a second timing,
29. The cleaning method according to claim 27 or 28, wherein a cleaning operation for the substrate holding portion is controlled based on a detection result of the first timing detection operation and a detection result of the second timing detection operation.   The position of the detection point at which the height information is determined to be abnormal in the detection operation at the first timing with respect to the substrate holding portion, and the detection point at which the height information is determined to be abnormal in the detection operation at the second timing. 36. The cleaning method according to claim 35, wherein a cleaning operation for the substrate holding unit is controlled based on a relationship with a position with respect to the substrate holding unit.   The position of the detection point where the height information is determined to be abnormal in the detection operation at the second timing is the position of the detection point where the height information is determined to be abnormal in the detection operation at the first timing. When it is determined that the position is substantially the same as the position with respect to the substrate holder, a cleaning operation for the substrate holder is started after the substrate held by the substrate holder is unloaded from the substrate holder. Item 37. The cleaning method according to Item 35 or 36.   38. The cleaning method according to claim 37, wherein the substrate carried out from the substrate holding part is supported at a second position different from the first position.   The position of the detection point where the height information is determined to be abnormal in the detection operation at the second timing is the position of the detection point where the height information is determined to be abnormal in the detection operation at the first timing. 37. The cleaning method according to claim 35 or 36, wherein when it is determined that the position is different from the position with respect to the substrate holding unit, exposure of the substrate is started without executing a cleaning operation with respect to the substrate holding unit.   36. The cleaning according to claim 35, wherein when it is determined that none of the height information is abnormal in the detection operation at the second timing, exposure of the substrate is started without executing a cleaning operation on the substrate holder. Method.   The position of the detection point where the height information is determined to be abnormal in the detection operation at the second timing is the position of the detection point where the height information is determined to be abnormal in the detection operation at the first timing. 38. The cleaning method according to claim 36 or 37, wherein when it is determined that the position is different from the position with respect to the substrate holding unit, the cleaning operation for the surface of the substrate is started without executing the cleaning operation for the substrate holding unit.   42. The cleaning method according to claim 34, wherein the cleaning operation on the surface of the substrate includes supplying a gas to the surface of the substrate.   43. The cleaning method according to any one of claims 34 to 42, wherein the cleaning operation on the surface of the substrate includes sucking a gas in the vicinity of the surface of the substrate.   44. The cleaning method according to any one of claims 27 to 43, wherein the height information is detected before the exposure light is irradiated onto the substrate.   45. The cleaning method according to any one of claims 26 to 44, wherein the second member is movable within a predetermined region including the first position while mounting a measuring instrument without holding the substrate.   46. The cleaning method according to claim 45, wherein a measurement operation using the measuring instrument is performed in parallel with at least a part of the cleaning operation for the substrate holding unit.   47. The cleaning method according to any one of claims 26 to 46, wherein the second member is movable in a predetermined region including the first position while holding the substrate.   The cleaning method according to any one of claims 26 to 47, wherein the second member includes a plate member to which the first member can be attached and detached.   49. The cleaning method according to any one of claims 26 to 48, wherein the cleaning operation for the substrate holding unit includes polishing the substrate holding unit. Holding the substrate on the substrate holder cleaned using the cleaning method according to any one of claims 26 to 49;
Exposing the substrate with exposure light through a liquid between the optical member and the substrate held by the substrate holding unit;
Developing the exposed substrate; and a device manufacturing method.

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