JP2011003835A - Exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of confirming contaminated state of a predetermined member.SOLUTION: The exposure device applies exposure light to a substrate through liquid. The exposure device includes a detector which receives light emitted from a luminescent material adhering to a predetermined member by means of excited light applied to the predetermined member, and specifies at least one of the quantity, the type and the adhering place of the luminescent material.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used.

US Patent Application Publication No. 2006/0139614 US Pat. No. 7,199,858

  If a member (component) in the exposure apparatus is contaminated, an exposure failure such as a defect in a pattern formed on the substrate may occur, and as a result, a defective device may occur. Therefore, it is desired to devise a technique that can confirm the contamination state of members in the exposure apparatus.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can confirm the contamination state of members. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, and is generated from a luminescent material adhering to the predetermined member by excitation light irradiated on the predetermined member. An exposure apparatus including a detection device that receives light and identifies at least one of an amount of a luminescent material, a type of the luminescent material, and an attachment location of the luminescent material is provided.

  According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the light emission adhering to the holding unit by the excitation light irradiated to the holding unit holding the substrate. An exposure apparatus including a detection device that receives light generated from a substance is provided.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first and second aspects, and developing the exposed substrate. .

  According to a fourth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, the liquid being held between an emission surface of an optical member that emits exposure light and the substrate, The exposure light is irradiated onto the substrate through the liquid, and the light generated from the luminescent material adhering to the predetermined member is received by the excitation light irradiated to the predetermined member, and the amount, type, and light emission of the luminescent material are received. Detecting at least one of the deposition sites of the substance.

  According to a fifth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, the liquid being held between an emission surface of an optical member that emits exposure light and the substrate, There is provided an exposure method including: irradiating a substrate with exposure light through a liquid; and detecting a luminescent substance adhering to the holding unit by excitation light irradiated to the holding unit holding the substrate. The

  According to a sixth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure method of the fourth and fifth aspects; and developing the exposed substrate. .

  According to the aspect of the present invention, the contamination state of the predetermined member can be confirmed. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of the substrate stage which concerns on this embodiment. It is a figure which shows an example of the measurement stage which concerns on this embodiment. It is a figure which shows an example of the vicinity of the liquid immersion member which concerns on this embodiment. It is a figure which shows an example of the detection apparatus which concerns on this embodiment. It is a figure which shows a part of detection apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that can be moved by mounting a measurement member C and a measuring instrument, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, and a drive system 6 that moves the measurement stage 3 And an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of the optical path of the exposure light EL Is provided with a liquid immersion member 7 capable of forming the liquid immersion space LS so as to be filled with the liquid LQ, and a control device 8 for controlling the operation of the entire exposure apparatus EX.

  An example of an exposure apparatus including a substrate stage that can move while holding a substrate, and a measurement stage that can move by mounting a measurement member and a measurement device that measure exposure light without holding the substrate, For example, it is disclosed in US Pat. No. 6,897,963, European Patent Application Publication No. 1713113, etc., the contents of which are incorporated herein by reference.

  In addition, the exposure apparatus EX irradiates a member in the exposure apparatus EX that is in contact with the liquid LQ with excitation light that generates light emission from the luminescent substance, and detects a luminescent substance attached to the member. 50 (50A, 50B, 50C). The detection device 50 receives light generated from the luminescent material attached to the member by the excitation light applied to the member, and detects the luminescent material. The detection device 50 receives the light generated from the luminescent material attached to the member by the excitation light applied to the member, and at least one of the amount of the luminescent material, the type of the luminescent material, and the place where the luminescent material is attached. Identify one. Excitation light is light that can generate light emission from a luminescent material. In the present embodiment, the excitation light is different from the exposure light EL.

  In the present embodiment, the detection apparatus 50 includes at least a part of the first detection apparatus 50 </ b> A disposed at a position that can face at least one of the upper surface 2 </ b> U of the substrate stage 2 and the upper surface 3 </ b> U of the measurement stage 3. And a third detection device 50C at least partially disposed on the measurement stage 3.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR in a state where the measurement member C and the measuring instrument are mounted.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the position information of the mask stage 1, the substrate stage 2, and the measurement stage 3 is measured by an interferometer system 11 including laser interferometer units 11A and 11B. The laser interferometer unit 11 </ b> A can measure the position information of the mask stage 1 using the measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11 </ b> B can measure the position information of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2 </ b> R disposed on the substrate stage 2 and the measurement mirror 3 </ b> R disposed on the measurement stage 3. When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 operates the drive systems 4, 5, 6 based on the measurement result of the interferometer system 11, and the mask stage 1. The position control of the (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C) is executed.

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is an exposure light EL between the terminal optical element 12 and an object arranged at a position (projection region PR) where the exposure light EL emitted from the terminal optical element 12 can be irradiated. Are formed so as to be filled with the liquid LQ. In the present embodiment, the object that can be arranged in the projection region PR is an object that can move to the projection region PR on the image plane side (the exit surface 13 side of the terminal optical element 12) of the projection optical system PL, and the substrate stage 2, It includes at least one of the substrate P held on the substrate stage 2 and the measurement stage 3. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, and the measurement stage 3.

  In the present embodiment, the liquid immersion member 7 has a lower surface 14 that can face an object disposed in the projection region PR. The liquid immersion member 7 can hold the liquid LQ with the object arranged in the projection region PR. The liquid immersion member 7 can hold the liquid LQ with the object arranged in the projection region PR so that the optical path of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The object movable to the projection region PR can hold the liquid LQ between the last optical element 12 and the liquid immersion member 7 so that the optical path of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. is there. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the surface (upper surface) of the object on the other side, the optical path of the exposure light EL between the last optical element 12 and the object is liquid. An immersion space LS is formed so as to be filled with LQ.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the interface (meniscus, edge) of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the substrate stage 2 according to the present embodiment. In this embodiment, the substrate stage 2 holds the substrate P in a releasable manner as disclosed in US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. It has the 1st holding | maintenance part 31 and the 2nd holding | maintenance part 32 which is arrange | positioned around the 1st holding | maintenance part 31 and hold | maintains the plate member T so that release is possible. The first and second holding portions 31 and 32 have a pin chuck mechanism. The plate member T is disposed around the substrate P held by the first holding unit 31. When the substrate stage 2 moves, the substrate P held by the first holding unit 31 and the plate member T held by the second holding unit 32 can move to the projection region PR. The holding mechanism used at least one of the first holding unit 31 and the second holding unit 32 is not limited to the pin chuck mechanism.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second holding unit 32 holds the plate member T so that the upper surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the first holding unit 31 and the upper surface of the plate member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). ). Further, the side surface of the substrate P held by the first holding unit 31 and the inner side surface of the plate member T held by the second holding unit 32 face each other with a predetermined gap therebetween.

  FIG. 3 is a side sectional view showing an example of the measurement stage 3 according to the present embodiment. In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the plate member S so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck mechanism. The plate member S is disposed around the measurement member C held by the third holding unit 33. As the measurement stage 3 moves, the measurement member C held by the third holding unit 33 and the plate member S held by the fourth holding unit 34 can move to the projection region PR. The holding mechanism used at least one of the third holding part 33 and the fourth holding part 34 is not limited to the pin chuck mechanism.

  Note that at least one of the plate member T, the measurement member C, and the plate member S may not be releasable.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding unit 34 holds the plate member S so that the upper surface of the plate member S and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the plate member S held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there). Further, the side surface of the measuring member C held by the third holding portion 33 and the inner side surface of the plate member S held by the fourth holding portion 34 face each other with a predetermined gap.

  Moreover, in this embodiment, the measurement stage 3 has the optical sensor 35 as a measuring device. In the present embodiment, the measurement member C includes a member that can transmit the exposure light EL, such as quartz, and at least a part of the measurement member C includes a transmission portion that can transmit the exposure light EL. The exposure light EL applied to the upper surface of the measurement member C held by the third holding unit 33 is applied to the optical sensor 35 via the transmission part of the measurement member C. The optical sensor 35 receives the exposure light EL that is emitted from the last optical element 12 and passes through the measuring member C.

  In the present embodiment, the upper surface 2 </ b> U of the substrate stage 2 includes the upper surface of the plate member T held by the second holding unit 32. The upper surface 3U of the measurement stage 3 includes the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the plate member S held by the fourth holding unit 34.

  FIG. 4 is a side sectional view showing an example of the liquid immersion member 7 according to the present embodiment. In the description with reference to FIG. 4, the case where the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7) will be described as an example. The stage 2 (plate member T) and the measurement stage 3 (plate member S, measurement member C) can also be arranged.

  As shown in FIG. 4, the liquid immersion member 7 has an opening 7 </ b> K at a position facing the emission surface 13. The exposure light EL emitted from the emission surface 13 can pass through the opening 7K and irradiate the substrate P.

  Further, the liquid immersion member 7 includes a supply port 15 capable of supplying the liquid LQ and a recovery port 16 capable of recovering the liquid LQ. The supply port 15 is disposed in the vicinity of the optical path of the exposure light EL so as to face the optical path. The supply port 15 is connected to the liquid supply device 18 via the flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The channel 17 includes a supply channel formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. In the present embodiment, the collection port 16 is disposed around the opening 7K through which the exposure light EL passes. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. A plate-like porous member 19 including a plurality of holes (openings or pores) is disposed in the recovery port 16. Note that a mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape may be disposed in the recovery port 16. Further, the porous member 19 may not be disposed in the recovery port 16. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes the lower surface of the porous member 19. The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to a vacuum system, and can suck the liquid LQ through the recovery port 16. The channel 20 includes a recovery channel formed inside the liquid immersion member 7 and a channel formed by a recovery pipe connecting the recovery channel and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  Next, the detection device 50 will be described. FIG. 5 is a schematic diagram illustrating an example of the first detection device 50A according to the present embodiment. The first detection device 50A attaches to the predetermined member by irradiating the predetermined member in contact with the liquid LQ with excitation light that is light different from the exposure light EL and generates light from the luminescent material. It is possible to detect a luminescent substance. In the following description using FIG. 5, the case where the predetermined member in contact with the liquid LQ is the substrate stage 2 will be described as an example. The predetermined member may be the measurement stage 3, for example.

  In the following description, a case where the light emitting material is a fluorescent material will be described as an example. When the fluorescent material is irradiated with excitation light, the fluorescent material generates fluorescence.

  50 A of 1st detection apparatuses can irradiate the upper surface 2U of the substrate stage 2 with excitation light, and can detect the fluorescent substance adhering to the upper surface 2U. The first detection device 50A includes a light projecting device 110 that emits excitation light, and a light receiving device 120 that receives light emitted from the substrate stage 2 (light emitted from a fluorescent material attached to the substrate stage 2).

  The first detection device 50A includes a light source device 131, an optical system 125 including a plurality of optical elements (lenses) and a filter block 137, and an observation camera including an imaging element 128 capable of acquiring image information of the substrate stage 2 (object). 129. The image sensor 128 includes, for example, a CCD (charge coupled device). In the present embodiment, the light projecting device 110 is configured by a part of the optical system 125 including the light source device 131 and the filter block 137. The light receiving device 120 includes a part of the optical system 125 including the filter block 137 and the observation camera 129.

  The optical system 125 forms an illumination optical system 136 that illuminates the substrate stage 2 using light emitted from the light source device 131 and an image of the substrate stage 2 illuminated by the illumination optical system 136 on the image sensor 128. An image optical system 133. The image sensor 128 is disposed on the image plane side of the imaging optical system 133.

  The illumination optical system 136 includes an objective lens 135 and can face the upper surface 2U of the substrate stage 2.

  The light source device 131 emits, for example, excitation light having a wavelength from the far ultraviolet region to the far infrared region for generating fluorescence from the light emitting material attached to the upper surface 2U of the substrate stage 2. The light source device 131 includes a halogen lamp, for example. The light source 131 is not limited to a lamp, and may be a laser light source. The laser light source may be capable of emitting a plurality of wavelengths.

  The illumination optical system 136 uses the light emitted from the light source device 131 to illuminate the substrate stage 2 with excitation light in a predetermined wavelength region. The illumination optical system 136 includes a filter block 137 that can separate excitation light and fluorescence. The filter block 137 can extract light of a predetermined wavelength necessary for excitation of the fluorescent material from the light generated by the light source device 131.

  FIG. 6 is a schematic diagram illustrating an example of the filter block 137. As illustrated in FIG. 6, the filter block 137 includes a first filter 138 on which light from the light source device 131 is incident, a dichroic mirror 139 on which light is incident through the first filter 138, and light from the dichroic mirror 139. And an incident second filter 140.

  The first filter 138 functions as a wavelength selection element that cuts out light in a part of the wavelength region of light from the light source device 131 and extracts light in a predetermined wavelength region necessary for excitation of the fluorescent material as excitation light. To do. That is, the first filter 138 includes a band-pass filter that transmits only light (excitation light) in a predetermined wavelength region and does not transmit light in other wavelength regions. Light (excitation light) in a predetermined wavelength region emitted from the light source device 131 and transmitted through the first filter 138 enters the dichroic mirror 139.

  The dichroic mirror 139 functions as a separation optical element that separates excitation light and fluorescence. In the present embodiment, the dichroic mirror 139 reflects light (excitation light) in a predetermined wavelength region that has passed through the first filter 138 and transmits light outside the predetermined wavelength region. The light (excitation light) in the predetermined wavelength region that has passed through the first filter 138 is reflected by the dichroic mirror 139 and guided to the substrate stage 2. Excitation light is applied to the substrate stage 2.

  In the present embodiment, an objective lens 135 is disposed between the filter block 137 and the substrate stage 2, and excitation light from the dichroic mirror 139 passes through the objective lens 135 from above the substrate stage 2. The stage 2 is irradiated.

  When the fluorescent material on the substrate stage 2 is irradiated with excitation light, fluorescence is generated from the fluorescent material. The fluorescence generated from the fluorescent material enters the dichroic mirror 139 via the objective lens 135. In general, the wavelength of fluorescence is longer than the wavelength of excitation light, and the wavelength of fluorescence is different from the wavelength of excitation light. Therefore, the fluorescence generated from the fluorescent material and incident on the dichroic mirror 139 passes through the dichroic mirror 139. The fluorescence transmitted through the dichroic mirror 139 enters the second filter 140.

  The second filter 140 functions as a wavelength selection element that separates the fluorescence from the substrate stage 2 and unnecessary light (scattered light or the like) having a wavelength other than the fluorescence, and extracts only the fluorescence. That is, the second filter 140 includes a band-pass filter that transmits only fluorescence and does not transmit light in other wavelength regions. The fluorescence transmitted through the second filter 140 is incident on the image sensor 128 of the observation camera 129. The image sensor 128 receives fluorescence. Accordingly, the first detection device 50A can detect the fluorescent material adhering to the substrate stage 2 based on the image information of the substrate stage 2 acquired by the imaging element 128 (the light reception result of the imaging element 128). .

  The detection result of the first detection device 50 </ b> A (the light reception result of the image sensor 128) is output to the control device 8. The control device 8 can acquire information on the fluorescent substance attached to the substrate stage 2 based on the detection result of the first detection device 50A.

  For example, the amount of fluorescent light incident on the image sensor 128 changes according to the amount of fluorescent material adhering to the substrate stage 2. For example, when the amount of fluorescent material adhering to the substrate stage 2 is large, the amount of fluorescent light incident on the image sensor 128 is high, and when the amount of fluorescent material is small, the amount of fluorescent light incident on the image sensor 128 is low. Become. Therefore, the control device 8 can specify the amount of the fluorescent material adhering to the substrate stage 2 based on the amount of fluorescent light received by the image sensor 128.

  In addition, the wavelength of the fluorescence incident on the image sensor 128 changes according to the type of fluorescent material adhering to the substrate stage 2. Therefore, the control device 8 can specify the type of fluorescent material adhering to the substrate stage 2 based on the wavelength of the fluorescence received by the image sensor 128.

  Further, the control device 8 detects the first detection device 50A by detecting the fluorescent substance on the substrate stage 2 using the first detection device 50A while measuring the position of the substrate stage 2 with the interferometer system 11. Based on the result and the measurement result of the interferometer system 11, the place where the fluorescent material is attached on the upper surface 2 </ b> U of the substrate stage 2 can be specified.

  In addition, the fluorescence characteristics generated by the fluorescent material change according to the wavelength of the excitation light applied to the substrate stage 2. For example, the wavelength of excitation light that can be excited differs depending on the type of fluorescent substance. Therefore, when a plurality of fluorescent substances are attached to the substrate stage 2, the amount of fluorescent light incident on the image sensor 128 changes according to the wavelength of the excitation light applied to the substrate stage 2. Accordingly, the type of fluorescent material can be specified by irradiating the substrate stage 2 with excitation light having a different wavelength and receiving the fluorescence generated by the fluorescent material irradiated with the excitation light. In addition, it is possible to specify the location of the fluorescent material depending on the type of the fluorescent material and the amount of the fluorescent material corresponding to the type of the fluorescent material. The wavelength of the excitation light can be changed by adjusting or replacing the filter block 137.

  That is, the substrate stage 2 is irradiated with light having the first wavelength extracted by the filter block, the first light generated from the fluorescent material adhering to the substrate stage 2 is received, and then extracted by the filter block. The substrate stage 2 is irradiated with light of the second wavelength, the second light generated from the luminescent material adhering to the substrate stage 2 is received, the result of receiving the first light and the result of receiving the second light Based on this, it is possible to specify at least one of the amount of the luminescent material, the type of the luminescent material, and the place where the luminescent material is attached.

  In the present embodiment, the light source device 131 may be a laser device capable of exciting a fluorescent material and emitting laser light (excitation light) in a predetermined wavelength region. In this case, for example, the first filter 138 can be omitted.

  The case where the first detection device 50 </ b> A detects the fluorescent material attached to the substrate stage 2 has been described above. The control device 8 can also detect the fluorescent material adhering to the measurement stage 3 using the first detection device 50A with the first detection device 50A and the measurement stage 3 facing each other.

  Further, the first detection device 50A and the second and third detection devices 50B and 50C have the same configuration. The control device 8 causes the second detection device 50B provided on the substrate stage 2 and the liquid immersion member 7 to face each other, and the fluorescent material adhering to the liquid immersion member 7 is detected using the second detection device 50B. Can be detected. Further, the control device 8 causes the third detection device 50C provided on the measurement stage 3 and the liquid immersion member 7 to face each other, and the fluorescence attached to the liquid immersion member 7 using the third detection device 50C. Substances can be detected.

  In addition, although the fluorescent substance adhering to the liquid immersion member 7 is detected using at least one of the second detection device 50B and the third detection device 50C, the liquid immersion is disposed above each stage. It is also possible to detect a fluorescent material adhering to a member different from the member 7 (for example, the terminal optical element 12).

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The controller 8 moves the substrate stage 2 to the substrate exchange position CP as shown in FIG. 7 in order to carry (load) the substrate P before exposure into the first holding unit 31. The substrate replacement position CP is a position where the substrate P replacement process can be performed. The replacement process of the substrate P uses the transfer device 36 to carry out (unload) the exposed substrate P held by the first holding unit 31 from the first holding unit 31, and to the first holding unit 31. It includes at least one of processing for loading (loading) the substrate P before exposure. The control device 8 moves the substrate stage 2 to the substrate replacement position CP away from the liquid immersion member 7 and executes the substrate P replacement process.

  In at least a part of the period in which the substrate stage 2 is separated from the liquid immersion member 7, the control device 8 arranges the measurement stage 3 at a predetermined position with respect to the liquid immersion member 7, and the terminal optical element 12 and the liquid immersion member The liquid LQ is held between 7 and the upper surface 3U of the measurement stage 3, and the immersion space LS is formed.

  Further, in at least a part of the period in which the substrate stage 2 is separated from the liquid immersion member 7, measurement processing using the measurement member C and the measuring instrument is executed as necessary. When executing the measurement process using the measuring member C and the measuring instrument, the control device 8 makes the terminal optical element 12 and the liquid immersion member 7 and the measuring stage 3 face each other, and between the terminal optical element 12 and the measuring member C. The immersion space LS is formed so that the optical path is filled with the liquid LQ. The control device 8 irradiates the measurement member C with the exposure light EL via the projection optical system PL and the liquid LQ, and executes measurement processing using the measurement member C. The result of the measurement process is reflected in the exposure process of the substrate P.

  After the substrate P before exposure is loaded on the first holding unit 31 and the measurement process using the measurement member C and the measuring instrument is completed, the control device 8 moves the substrate stage 2 to the projection region PR, and then terminates the optical element. 12, an immersion space LS is formed between the immersion member 7 and the substrate stage 2 (substrate P). In this embodiment, as disclosed in, for example, U.S. Patent Application Publication No. 2006/0023186, U.S. Patent Application Publication No. 2007/0127006, and the like, the control device 8 includes the substrate stage 2 and the measurement stage. 3, the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are brought close to or in contact with each other so that a space capable of holding the liquid LQ is continuously formed between at least one of the optical elements 3 and the last optical element 12 and the liquid immersion member 7. In this state, at least one of the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 is opposed to the exit surface 13 of the terminal optical element 12 and the lower surface 14 of the liquid immersion member 7, and the terminal optical element 12 and the liquid The substrate stage 2 and the measurement stage 3 can be synchronously moved in the XY directions with respect to the immersion member 7. Thereby, the control device 8 is in a state where the immersion space LS can be formed between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2, and the terminal optical element 12, the liquid immersion member 7 and the measurement stage 3 In the meantime, it is possible to change from one of the states in which the immersion space LS can be formed to the other. That is, the control device 8 suppresses leakage of the liquid LQ, while the immersion space LS formed on the lower surface 14 side of the immersion member 7 is between the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3. The substrate stage 2 and the measurement stage 3 can be moved relative to the liquid immersion member 7 so as to move between them.

  In the following description, with the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 approaching or contacting each other, the substrate stage 2 and the measurement stage 3 are moved with respect to the last optical element 12 and the liquid immersion member 7. The operation of synchronously moving in the XY directions is appropriately referred to as scram movement.

  In this embodiment, when the scrum movement is executed, as shown in FIG. 8, the control device 8 causes the side surface 2F on the + Y side of the substrate stage 2 and −Y of the measurement stage 3 that can face the substrate stage 2. The side surface 3F on the side is made to face through a predetermined gap. The control device 8 simultaneously moves (synchronously moves) the substrate stage 2 and the measurement stage 3 while maintaining the gap. In the present embodiment, when the scrum movement is executed, the control device 8 causes the substrate stage 2 so that substantially one continuous surface is formed by the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3. The positional relationship between the upper surface 2U of the measurement surface 3 and the upper surface 3U of the measurement stage 3 is adjusted.

  The scram movement is executed, so that an immersion space LS is formed between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 (substrate P), and the exit surface 13 of the terminal optical element 12 and the surface of the substrate P After the liquid LQ is held during this time, the control device 8 starts the exposure process for the substrate P. When executing the exposure processing of the substrate P, the control device 8 makes the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 face each other, and the optical path between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. The control device 8 emits the exposure light EL from the illumination system IL and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is irradiated onto the substrate P through the projection optical system PL and the liquid LQ. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction.

  After the exposure processing of the substrate P is completed, the control device 8 performs scrum movement. After the immersion space LS is formed between the last optical element 12 and the liquid immersion member 7 and the measurement stage 3, the control device 8 moves the substrate stage 2 to the substrate exchange position CP. The control device 8 carries out the substrate P after exposure from the substrate stage 2 moved to the substrate exchange position CP, and carries the substrate P before exposure into the substrate stage 2.

  Thereafter, the control device 8 repeats the above process to sequentially expose the plurality of substrates P.

  By the way, during exposure of the substrate P, a substance generated (eluted) from the substrate P may be mixed into the liquid LQ in the immersion space LS as a contaminant (foreign matter, particle). Further, for example, a substance floating in the air may be mixed in the liquid LQ in the immersion space LS as a contaminant. An example of a substance generated from the substrate P is an organic material that forms an organic film of the substrate P. The organic film of the substrate P is at least one of a photosensitive film, an antireflection film, and a protective film, for example. The organic material can generate fluorescence when irradiated with excitation light. In the present embodiment, the organic film of the substrate P is made of an organic material. Therefore, the organic film of the substrate P is a fluorescent material. Moreover, the substance which floats in the air may be comprised with the organic material. In this case, the substance floating in the air is a fluorescent substance.

  As described above, the liquid LQ in the immersion space LS is immersed in the liquid immersion member 7 during at least a part of the exposure sequence including the replacement process of the substrate P, the measurement process using the measurement member C, and the exposure process of the substrate P. , At least a part of the substrate stage 2, and at least a part of the measurement stage 3. Therefore, when contaminants are mixed in the liquid LQ in the immersion space LS, the lower surface 14 of the immersion member 7, the upper surface 2U of the substrate stage 2 (plate member T), and the measurement stage 3 (measurement member C, plate member S). There is a possibility that contaminants may adhere to the upper surface 3U. If the state where the contaminants are attached to the surfaces of the members of the exposure apparatus EX (the liquid contact surface in contact with the liquid LQ) is left, the contaminants may adhere to the substrate P during exposure, The liquid LQ supplied from 15 may be contaminated. Moreover, if the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are contaminated, for example, the immersion space LS may not be formed satisfactorily. As a result, exposure failure may occur.

  Therefore, in the present embodiment, the control device 8 uses the detection device 50 at a predetermined timing to contaminate the surface (lower surface, upper surface) of the member of the exposure apparatus EX that contacts the liquid LQ in the immersion space LS. A process for confirming whether or not the toner adheres is executed.

  When the contaminant is a fluorescent substance, the control device 8 uses the detection device 50 to adhere to the members (the liquid immersion member 7, the substrate stage 2, the measurement stage 3, etc.) of the exposure apparatus EX that contacts the liquid LQ. Contaminants can be detected.

  Note that the timing of performing detection using the detection device 50 may be, for example, every predetermined time interval, every time a predetermined number of substrates P are exposed, or, for example, the liquid immersion member 7, the substrate stage 2, and the measurement stage 3. It may be when the immersion space LS cannot be satisfactorily formed with at least one of them. If the lower surface 14 of the liquid immersion member 7 is contaminated or at least one of the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 is contaminated, the liquid immersion member 7 and at least one of the substrate stage 2 and the measurement stage 3 There is a possibility that the immersion space LS cannot be formed in a desired shape in between. Therefore, the timing for executing detection using the detection device 50 may be determined according to the state (shape) of the immersion space LS. Moreover, you may perform the detection using the detection apparatus 50 during performing an exposure process.

  FIG. 9 shows a state in which the third detection device 50 </ b> C arranged on the measurement stage 3 irradiates the liquid immersion member 7 with excitation light and detects the fluorescent material adhering to the liquid immersion member 7. FIG.

  As shown in FIG. 9, at least a part of the third detection device 50 </ b> C is disposed on the measurement stage 3. In the present embodiment, at least a part of the plate member S is provided with a transmission part SM that can transmit excitation light emitted from the third detection device 50C and fluorescence generated from the fluorescent material attached to the liquid immersion member 7. Is provided. The third detection device 50C irradiates the lower surface 14 of the liquid immersion member 7 with excitation light via the transmission part SM.

  In the present embodiment, detection using the third detection device 50C is performed in a state where the immersion space LS is formed with the liquid LQ between the immersion member 7 and the plate member S. That is, the third detection device 50C irradiates the liquid immersion member 7 with excitation light via the liquid LQ. Note that the detection using the third detection device 50C may be executed without forming the immersion space LS (without the liquid LQ).

  The third detection device 50C has the same configuration as the first detection device 50A described with reference to FIG. 5, and the control device 8 is based on the amount of fluorescence received by the image sensor 128 of the third detection device 50C. The amount of fluorescent material (contaminant) adhering to the liquid immersion member 7 can be specified. Further, the control device 8 can specify the type of the fluorescent material (contaminant) attached to the liquid immersion member 7 based on the wavelength of the fluorescence received by the image sensor 128 of the third detection device 50C. The control device 8 may obtain the spectrum of the fluorescence received by the image sensor 128 of the third detection device 50C and specify the type of fluorescent material (contaminant) adhering to the liquid immersion member 7. In addition, the control device 8 determines the lower surface of the liquid immersion member 7 on the basis of the positional information of the measurement stage 3 on which the third detection device 50C mounted by the interferometer system 11 is mounted and the detection result of the third detection device 50C. 14 can identify the place where the fluorescent substance (contaminant) adheres. Further, the control device 8 can also obtain the area (attachment range) or distribution of the fluorescent material on the lower surface 14 of the liquid immersion member 7 based on the detection result of the third detection device 50C.

  For example, when there are a plurality of types of substances that may be generated from the substrate P, the control device 8 can specify the types of substances generated from the substrate P based on the detection results of the third detection device 50C. For example, based on the detection result of the third detection device 50C, it is determined whether the photosensitive film is contaminated, the protective film is contaminated, or both are contaminated. can do.

  Further, based on the detection result of the third detection apparatus 50C, the type of a substance that is likely to be generated from the substrate P (a substance that is easily eluted) can be specified. Therefore, based on the detection result of the third detection device 50C, the material to be used can be optimized, such as selecting a material that is difficult to elute as the material of the organic film of the substrate P.

  In the present embodiment, the control device 8 performs maintenance on the liquid immersion member 7 based on the detection result of the third detection device 50C.

  The control device 8 selects a predetermined maintenance method from a plurality of maintenance methods based on the detection result of the third detection device 50C, and performs maintenance on the liquid immersion member 7 based on the selected maintenance method.

  Although not shown, in this embodiment, the exposure apparatus EX irradiates a predetermined member with ultraviolet light having a light cleaning effect as disclosed in, for example, US Patent Application Publication No. 2007/0258072. An optical cleaning device for optically cleaning the predetermined member, for example, as disclosed in US Patent Application Publication No. 2008/0018867, etc. A plurality of cleaning devices such as an ultrasonic cleaning device for applying a sonic vibration to clean a predetermined member are provided. Based on the detection result of the third detection device 50C, the control device 8 selects a predetermined cleaning device from the plurality of cleaning devices, and cleans the liquid immersion member 7 with the selected cleaning device.

  For example, the control device 8 specifies the type of the fluorescent substance (contaminant) adhering to the liquid immersion member 7 based on the detection result of the third detection device 50C, and the specified fluorescent substance (contaminant). Depending on the type, at least one of cleaning using an optical cleaning device and cleaning using an ultrasonic cleaning device is selected.

  Further, the control device 8 can also determine a cleaning method using the cleaning device based on the detection result of the third detection device 50C. For example, the control device 8 specifies the attachment range (attachment location) of the fluorescent substance (contaminant) based on the detection result of the third detection device 50C, and determines the cleaning method according to the specified attachment range. To do. For example, when almost the entire lower surface 14 of the liquid immersion member 7 is contaminated, the control device 8 irradiates almost all the lower surface 14 of the liquid immersion member 7 with ultraviolet light from the light cleaning device. On the other hand, when a part of the lower surface 14 of the liquid immersion member 7 is contaminated, the control device 8 irradiates a part of the lower surface 14 of the liquid immersion member 7 with ultraviolet light from the light cleaning device.

  These cleaning apparatuses may be provided in the exposure apparatus EX, or may be an apparatus different from the exposure apparatus EX. When the cleaning apparatus is different from the exposure apparatus EX, the cleaning apparatus is carried into the exposure apparatus EX when maintenance (cleaning) is performed.

  Further, as the maintenance, replacement of the liquid immersion member 7 may be performed. For example, when it is difficult to remove the liquid immersion member 7 with a cleaning device, such as when an inorganic substance adheres to the liquid immersion member 7, the liquid immersion member 7 may be replaced with a new one.

  Although the case where the liquid immersion member 7 is maintained based on the detection result of the third detection device 50C has been described as an example here, the fluorescent material (contaminant) of the liquid immersion member 7 is detected by the second detection device 50B. The liquid immersion member 7 may be maintained based on the detection result of the second detection device 50B.

  Here, the case where the liquid immersion member 7 is maintained has been described as an example, but of course, at least one of the substrate stage 2 and the measurement stage 3 can be maintained. For example, at least one of the substrate stage 2 and the measurement stage 3 may be optically cleaned or ultrasonically cleaned based on the detection result of the first detection device 50A. Moreover, the plate member T may be replaced | exchanged and the plate member S may be replaced | exchanged.

  In the present embodiment, maintenance of the detection target member (such as the liquid immersion member 7) is performed based on the detection result of the detection device 50. However, based on the detection result of the detection device 50, the detection target It may be determined whether or not the maintenance of the member is performed. For example, when it is determined that the contamination of the detection target member is acceptable based on the detection result of the detection device 50, the detection target member need not be maintained.

  As described above, according to the present embodiment, it is possible to efficiently detect the contamination state of the predetermined member in the exposure apparatus EX that is in contact with the liquid LQ using the detection device 50. For example, the contamination state of the predetermined member can be detected using the detection device 50 while suppressing a decrease in the operating rate of the exposure apparatus EX. Further, by performing maintenance based on the detection result of the detection device 50, exposure processing or the like can be performed using a predetermined member from which contaminants have been removed. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

  In the above-described embodiment, one or two of the three detection devices 50A, 50B, and 50C may be omitted. For example, the detection device 50B may be simply provided on the substrate stage 2. In addition to the substrate stage 2 and the measurement stage 3, a movable stage may be provided and the detection device 50 may be provided.

  In the above-described embodiment, the light projecting device 110 of the detection device 50 may be one or plural. Since the detection device 50 includes a plurality of light projecting devices 110 and a plurality of light receiving devices 120 corresponding to the light projecting devices 110, the time required for detection can be shortened.

  One part and another part constituting one detection device 50 may be supported by different members. For example, the light projecting device 110 of the detection device 50A may be disposed above each stage, and the light receiving device 120 may be disposed on at least one of the substrate stage 2 and the measurement stage 3. The light projecting device and a part of the light receiving device of the detection device 50C may be provided on the measurement stage 3, and the other part of the light receiving device may be disposed on a member different from the measurement stage 3. Different members may be movable stages. For example, the light projecting device 110 and the light receiving device 120 constituting one detection device 50 may be provided on different movable stages.

  In the above-described embodiment, the excitation light and the exposure light EL are different from each other, but the exposure light EL may be used as the excitation light. For example, by irradiating the predetermined member (at least one of the substrate stage 2, the measurement stage 3, and the liquid immersion member 7) with the exposure light EL, fluorescence is generated from the contaminants attached to the predetermined member. And can identify at least one of the amount of contaminants, the type of contaminants, and the location where the contaminants are deposited. Note that the amount of contaminants includes the thickness of the contaminants at the deposition site.

  In the above-described embodiment, the contamination state of the predetermined member in the exposure apparatus EX that is in contact with the liquid LQ is detected, but the detection location is not limited to this. For example, even when a contaminant adheres to a member or place that does not come into contact with the liquid LQ, the contamination state at that place can be detected using the detection device 50. The place that does not come into contact with the liquid LQ is, for example, the first holding unit 31. If there is a contaminant in the first holding part 31, it becomes difficult to hold the substrate P in a desired shape. It is possible to detect the contamination state of the first holding unit 31 and determine whether maintenance (cleaning) of the first holding unit 31 is necessary. By performing maintenance (cleaning) of the first holding unit 31 based on the detection result, the substrate P can be held by the first holding unit 31 from which the contaminant has been removed. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed. The detection device 50 may be provided at a place where the substrate before exposure and the substrate after exposure processing are exchanged, and the contamination state of the first holding unit 31 may be detected.

  In the above-described embodiment, fluorescence is generated from the contaminants adhering to the predetermined member, and at least one of the amount of contaminants, the type of contaminants, and the location where the contaminants are attached is specified. The method is not limited to this. For example, the above-mentioned specification may be performed by irradiating a predetermined member with a laser using a laser microscope and receiving diffracted light from a contaminant adhering to the predetermined member by laser irradiation with a light receiving element. . In this case, it is desirable to provide a filter that removes scattered light other than diffracted light so that the light receiving element receives only diffracted light. A plurality of types of methods may be used as a method for specifying at least one of the amount of contaminant, the type of contaminant, and the location where the contaminant is attached.

  In the above-described embodiment, the contaminant is a fluorescent substance, and the fluorescence generated by the fluorescent substance is detected. However, when the contaminant includes a phosphorescent substance, the phosphorescence emitted by the phosphorescent substance is detected. May be.

  In the above-described embodiment, in the exposure processing of the substrate P, the optical path on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the / 019128 pamphlet, a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 12 is also filled with a liquid can be adopted. The liquid filled in the optical path on the incident side of the last optical element 12 may be the same type of liquid as the liquid LQ, or may be a different type of liquid.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  Further, the exposure apparatus EX may include a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. Further, the exposure apparatus EX may not include a measurement stage.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 10, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Measurement stage, 7 ... Liquid immersion member, 12 ... End optical element, 13 ... Ejection surface, 50 (50A, 50B, 50C) ... Detection apparatus, 110 ... Light projection apparatus, 120 ... Light reception apparatus, 131 ... light source device, 137 ... filter block, EL ... exposure light, EX ... exposure device, LQ ... liquid, S ... plate member, T ... plate member

Claims (20)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
The excitation light applied to the predetermined member receives light generated from the luminescent material adhering to the predetermined member, and at least one of the amount of the luminescent material, the type of the luminescent material, and the attachment location of the luminescent material. An exposure apparatus comprising a detection device for identifying one. An optical member having an exit surface for emitting the exposure light;
An immersion member capable of holding the liquid with an object arranged at a position where the exposure light can be irradiated so that an optical path of the exposure light emitted from the emission surface is filled with the liquid. ,
The exposure apparatus according to claim 1, wherein the predetermined member includes the liquid immersion member.   The exposure apparatus according to claim 2, wherein at least a part of the detection apparatus is disposed on the object. An optical member having an exit surface for emitting the exposure light;
The exposure light emitted from the emission surface can be moved to a position where the exposure light can be irradiated, and the optical path of the exposure light emitted from the emission surface is filled with the liquid. A movable member capable of holding a liquid,
The exposure apparatus according to claim 1, wherein the predetermined member includes the movable member.   The exposure apparatus according to claim 4, wherein the movable member includes a holding unit that holds the substrate and / or a measuring instrument that measures the exposure light.   The exposure apparatus according to claim 1, wherein the predetermined member is in contact with the liquid.   The exposure apparatus according to claim 1, wherein the predetermined member is a holding unit that holds the substrate. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising a detection device that receives light generated from a luminescent material attached to the holding unit by excitation light applied to the holding unit that holds the substrate.   The exposure apparatus according to claim 1, wherein the excitation light includes the exposure light.   The exposure apparatus according to claim 1, wherein the detection device includes a light projecting device that emits the excitation light, and a light receiving device that receives the light from the luminescent material.   The light projecting device includes: a light source device; and a wavelength selection element that extracts, as the excitation light, light having a predetermined wavelength necessary for light emission of the luminescent material from light generated by the light source device. 11. The exposure apparatus according to claim 10, wherein at least one of the amount of the luminescent material, the type of the luminescent material, and the place where the luminescent material is attached is specified by extracting the excitation light by the method.   Irradiating the predetermined member with the light of the first wavelength extracted by the wavelength selection element, receiving the first light generated from the luminescent material adhering to the predetermined member, and then, using the wavelength selection element The extracted light of the second wavelength is irradiated onto the predetermined member, the second light generated from the luminescent material adhering to the predetermined member is received, the result of receiving the first light, and the second light 12. The exposure apparatus according to claim 11, wherein at least one of the amount of the luminescent material, the type of the luminescent material, and the place where the luminescent material is attached is specified based on a result of receiving light. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 12,
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Holding the liquid between an emission surface of an optical member that emits the exposure light and the substrate, and irradiating the substrate with the exposure light through the liquid;
The excitation light applied to the predetermined member receives light generated from the luminescent material attached to the predetermined member, and detects at least one of the amount and type of the luminescent material and the place where the luminescent material is attached. And an exposure method comprising:   The exposure method according to claim 14, wherein the predetermined member is in contact with the liquid. An exposure method for exposing a substrate with exposure light through a liquid,
Holding the liquid between an emission surface of an optical member that emits the exposure light and the substrate, and irradiating the substrate with the exposure light through the liquid;
Detecting a luminescent substance adhering to the holding unit by excitation light irradiated to the holding unit holding the substrate.   The exposure method according to any one of claims 14 to 16, comprising performing maintenance on the predetermined member based on the detection result.   18. The exposure method according to claim 17, further comprising: selecting at least one from a plurality of maintenance methods based on the detection result, and performing maintenance on the predetermined member using the selected at least one maintenance method.   19. The exposure method according to claim 17, wherein the maintenance includes exchanging the predetermined member. Exposing the substrate using the exposure method according to any one of claims 14 to 19,
Developing the exposed substrate. A device manufacturing method.

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