JP2010109270A - Confirmation method, maintenance method, and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a confirmation method capable of confirming a contamination state of a member. <P>SOLUTION: The confirmation method includes: holding a first member by a first holding section releasably holding a substrate exposed with exposure light through liquid; bringing liquid in a liquid immersion space into contact with a surface of a second member, wherein the liquid immersion space is formed between the second member movable to a position capable of being irradiated with the exposure light and a liquid immersion member; moving the first member and the second member relative to the liquid immersion member in a state where the liquid immersion space is formed on one side of the liquid immersion member and bringing liquid in a liquid immersion space into contact with a surface of the first member, wherein the liquid immersion space is formed between the liquid immersion member and the first member; and confirming a contamination state on the surface of the second member on the basis of a surface state of the first member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a confirmation method, a maintenance method, and a device manufacturing method.

In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used.
US Patent Publication No. 2006/0139614 US Pat. No. 7,199,858

  When a member of an exposure apparatus or a component (component) is contaminated, for example, a defect is generated in a pattern formed on a substrate, and a defective exposure may occur. As a result, a defective device may be generated. Therefore, it is desired to devise a technique that can confirm the contamination state of a member of an exposure apparatus or a component (component) and can efficiently maintain the member.

  The aspect of this invention aims at providing the confirmation method which can confirm the contamination state of a member or components (component). Another object of the present invention is to provide a maintenance method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, the first member is held by the first holding unit that releasably holds the substrate exposed with the exposure light through the liquid, and the exposure light can be irradiated to the position. The liquid in the immersion space formed between the movable second member and the liquid immersion member is brought into contact with the surface of the second member, and the liquid immersion space is formed on one side of the liquid immersion member. In the state, the first member and the second member are moved with respect to the liquid immersion member, and the liquid in the immersion space formed between the liquid immersion member and the first member contacts the surface of the first member And a confirmation method including confirming the contamination state of the surface of the second member based on the state of the surface of the first member.

  According to the second aspect of the present invention, using the confirmation method of the first aspect, the contamination state of the second member of the immersion exposure apparatus that exposes the substrate through the liquid is confirmed, and the result of the confirmation In response, a maintenance method is provided that includes cleaning the second member.

  According to a third aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using an immersion exposure apparatus maintained by the maintenance method of the second aspect; and developing the exposed substrate. A method is provided.

  According to the aspect of the present invention, the contamination state of a member or a component (component) can be confirmed. Moreover, according to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that is movable while holding the measurement member C to be moved, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, a drive system 6 that moves the measurement stage 3, and a mask Illumination system IL that illuminates M with exposure light EL, projection optical system PL that projects an image of the pattern of mask M illuminated with exposure light EL onto substrate P, and at least part of the optical path of exposure light EL is liquid LQ. The liquid immersion member 7 capable of forming the liquid immersion space LS so as to be satisfied by the above and the control device 8 for controlling the operation of the entire exposure apparatus EX.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the position information of the mask stage 1, the substrate stage 2, and the measurement stage 3 is measured by an interferometer system 11 including laser interferometer units 11A and 11B. The laser interferometer unit 11 </ b> A can measure the position information of the mask stage 1 using the measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11 </ b> B can measure the position information of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2 </ b> R disposed on the substrate stage 2 and the measurement mirror 3 </ b> R disposed on the measurement stage 3. When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 operates the drive systems 4, 5, 6 based on the measurement result of the interferometer system 11, and the mask stage 1. The position control of the (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C) is executed.

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is an exposure light EL between the terminal optical element 12 and an object arranged at a position (projection region PR) where the exposure light EL emitted from the terminal optical element 12 can be irradiated. Are formed so as to be filled with the liquid LQ. In the present embodiment, the object that can be placed in the projection region PR is an object that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12), and the substrate stage. 2 and at least one of the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3.

  In the present embodiment, the liquid immersion member 7 has a lower surface 14 that can face an object disposed in the projection region PR. The liquid immersion member 7 can hold the liquid LQ with the object arranged in the projection region PR. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the surface (upper surface) of the object on the other side, the optical path of the exposure light EL between the last optical element 12 and the object is liquid. An immersion space LS is formed so as to be filled with LQ.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the interface (meniscus, edge) of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the substrate stage 2 according to the present embodiment. In this embodiment, the substrate stage 2 holds the substrate P in a releasable manner as disclosed in US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. It has the 1st holding | maintenance part 31 and the 2nd holding | maintenance part 32 which is arrange | positioned around the 1st holding | maintenance part 31 and hold | maintains the plate member T so that release is possible. The first and second holding portions 31 and 32 have a pin chuck mechanism. The plate member T is disposed around the substrate P held by the first holding unit 31. When the substrate stage 2 moves, the substrate P held by the first holding unit 31 and the plate member T held by the second holding unit 32 can move to the projection region PR. The holding mechanism used at least one of the first holding unit 31 and the second holding unit 32 is not limited to the pin chuck mechanism. Further, the plate member T may be formed integrally with the substrate stage 2.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second holding unit 32 holds the plate member T so that the upper surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the first holding unit 31 and the upper surface of the plate member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). ). Further, the side surface of the substrate P held by the first holding unit 31 and the inner side surface of the plate member T held by the second holding unit 32 face each other via a predetermined gap G1.

  FIG. 3 is a side sectional view showing an example of the measurement stage 3 according to the present embodiment. In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the plate member S so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck mechanism. The plate member S is disposed around the measurement member C held by the third holding unit 33. As the measurement stage 3 moves, the measurement member C held by the third holding unit 33 and the plate member S held by the fourth holding unit 34 can move to the projection region PR. The holding mechanism used at least one of the third holding unit 33 and the fourth holding unit 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the plate member S may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding unit 34 holds the plate member S so that the upper surface of the plate member S and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the plate member S held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there). Further, the side surface of the measurement member C held by the third holding unit 33 and the inner side surface of the plate member S held by the fourth holding unit 34 face each other with a predetermined gap G2.

  In the present embodiment, the measurement stage 3 includes an optical sensor 35. In the present embodiment, the measurement member C includes a member that can transmit the exposure light EL, such as quartz, and at least a part of the measurement member C includes a transmission portion that can transmit the exposure light EL. The exposure light EL applied to the upper surface of the measurement member C held by the third holding unit 33 is applied to the optical sensor 35 via the transmission part of the measurement member C. The optical sensor 35 receives the exposure light EL that is emitted from the last optical element 12 and passes through the measuring member C.

  In the present embodiment, the measurement stage 3 has two third holding portions 33, and one third holding portion 33 (33A) holds the first measurement member C (C1) and the other third holding portion. The part 33 (33B) holds the second measurement member C (C2). The first measurement member C (C1) is at least part of an aerial image measurement system capable of measuring an aerial image by the projection optical system PL as disclosed in, for example, US Patent Application Publication No. 2002/0041377. Configure. The second measurement member C (C2) constitutes at least a part of an illuminance unevenness measurement system capable of measuring the illuminance unevenness of the exposure light EL as disclosed in, for example, US Pat. No. 4,465,368. In addition, instead of the first measurement member C1 and / or the second measurement member C2, or in addition to the measurement members C1 and C2, measurement members of other measurement systems may be arranged on the measurement stage 3. Another measurement system is, for example, a measurement system capable of measuring the variation in the transmittance of the exposure light EL of the projection optical system PL, such as disclosed in US Pat. No. 6,721,039, for example, US Patent Application Publication No. 2002. At least one of a dose measurement system (illuminance measurement system) and a wavefront aberration measurement system disclosed in, for example, European Patent No. 1079223. Including. Only one measurement member C (third holding portion 33) may be provided on the measurement stage 3. An example of an exposure apparatus that includes a substrate stage that can move while holding a substrate, and a measurement stage that can move by mounting a measurement member (measuring instrument) that measures exposure light without holding the substrate. For example, it is disclosed in US Pat. No. 6,897,963 and European Patent Application No. 1713113.

  Here, in the following description, the upper surface of the plate member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measuring member C held by the third holding unit 33 and The upper surface of the plate member S held by the fourth holding unit 34 is referred to as the upper surface 3U of the measurement stage 3 as appropriate.

  FIG. 4 is a side sectional view showing an example of the liquid immersion member 7 according to the present embodiment. In the description with reference to FIG. 4, the case where the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7) will be described as an example. The stage 2 (plate member T) and the measurement stage 3 (plate member S, measurement member C) can also be arranged.

  As shown in FIG. 4, the liquid immersion member 7 has an opening 7 </ b> K at a position facing the emission surface 13. The exposure light EL emitted from the emission surface 13 can pass through the opening 7K and irradiate the substrate P.

  Further, the liquid immersion member 7 includes a supply port 15 capable of supplying the liquid LQ and a recovery port 16 capable of recovering the liquid LQ. The supply port 15 is disposed in the vicinity of the optical path of the exposure light EL so as to face the optical path. The supply port 15 is connected to the liquid supply device 18 via the flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The channel 17 includes a supply channel formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. In the present embodiment, the collection port 16 is disposed around the opening 7K through which the exposure light EL passes. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. A plate-like porous member 19 including a plurality of holes (openings or pores) is disposed in the recovery port 16. Note that a mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape may be disposed in the recovery port 16. Further, the porous member 19 may not be disposed in the recovery port 16. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes the lower surface of the porous member 19. The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to a vacuum system, and can suck the liquid LQ through the recovery port 16. The channel 20 includes a recovery channel formed inside the liquid immersion member 7 and a channel formed by a recovery pipe connecting the recovery channel and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The control device 8 moves the substrate stage 2 away from the liquid immersion member 7 to the substrate exchange position CP as shown in FIG. 5 in order to carry (load) the substrate P before exposure into the first holding unit 31. . The substrate replacement position CP is a position where the substrate P replacement process can be performed. The replacement process of the substrate P uses the transfer device 36 to carry out (unload) the exposed substrate P held by the first holding unit 31 from the first holding unit 31, and to the first holding unit 31. It includes at least one of processing for loading (loading) the substrate P before exposure. The control device 8 moves the substrate stage 2 to the substrate replacement position CP away from the liquid immersion member 7 and executes the substrate P replacement process.

  In at least a part of the period in which the substrate stage 2 is separated from the liquid immersion member 7, the control device 8 arranges the measurement stage 3 at a predetermined position with respect to the liquid immersion member 7, and the terminal optical element 12 and the liquid immersion member 7 and a predetermined region 3P on the upper surface 3U of the measurement stage 3, the liquid LQ is held and an immersion space LS is formed.

  FIG. 6 is a plan view schematically showing a state in which the liquid LQ is held between the liquid immersion member 7 and the predetermined region 3P. As shown in FIG. 6, in the present embodiment, the predetermined region 3P is a partial region of the upper surface 3U of the plate member S.

  Here, in the following description, the position of the measurement stage 3 when the liquid LQ is held and the liquid immersion space LS is formed between the liquid immersion member 7 and the predetermined region 3P of the measurement stage 3 is appropriately set as a standby position. It is called SP.

  In addition, a measurement process using the measurement member C is performed as necessary in at least a part of the period in which the substrate stage 2 is separated from the liquid immersion member 7. When the measurement process using the measurement member C is executed, the control device 8 makes the terminal optical element 12 and the liquid immersion member 7 and the measurement stage 3 face each other, and the optical path between the terminal optical element 12 and the measurement member C is liquid. The immersion space LS is formed so as to be filled with LQ. The control device 8 irradiates the measurement member C with the exposure light EL via the projection optical system PL and the liquid LQ, and executes measurement processing using the measurement member C. The result of the measurement process is reflected in the exposure process of the substrate P.

  After the substrate P before exposure is loaded on the first holding unit 31 and the measurement process using the measurement member C is completed, the control device 8 moves the substrate stage 2 to the projection region PR, and the last optical element 12 and the liquid An immersion space LS is formed between the immersion member 7 and the substrate stage 2 (substrate P). In this embodiment, as disclosed in, for example, U.S. Patent Application Publication No. 2006/0023186, U.S. Patent Application Publication No. 2007/0127006, and the like, the control device 8 includes the substrate stage 2 and the measurement stage. 3, the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are brought close to or in contact with each other so that a space capable of holding the liquid LQ is continuously formed between at least one of the optical elements 3 and the last optical element 12 and the liquid immersion member 7 In this state, at least one of the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 is opposed to the exit surface 13 of the terminal optical element 12 and the lower surface 14 of the liquid immersion member 7, and the terminal optical element 12 and the liquid The substrate stage 2 and the measurement stage 3 can be synchronously moved in the XY directions with respect to the immersion member 7. Thereby, the control device 8 is in a state where the immersion space LS can be formed between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2, and the terminal optical element 12, the liquid immersion member 7 and the measurement stage 3 In the meantime, it is possible to change from one of the states in which the immersion space LS can be formed to the other. That is, the control device 8 suppresses leakage of the liquid LQ, while the immersion space LS formed on the lower surface 14 side of the immersion member 7 is between the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3. The substrate stage 2 and the measurement stage 3 can be moved relative to the liquid immersion member 7 so as to move between them.

  In the following description, with the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 approaching or contacting each other, the substrate stage 2 and the measurement stage 3 are moved with respect to the last optical element 12 and the liquid immersion member 7. The operation of synchronously moving in the XY directions is appropriately referred to as scram movement.

  In this embodiment, when the scrum movement is executed, as shown in FIG. 7, the control device 8 causes the side surface 2F on the + Y side of the substrate stage 2 and −Y of the measurement stage 3 that can face the substrate stage 2. The side surface 3F is opposed to the side surface 3F via a predetermined gap G3. Then, the control device 8 simultaneously moves (synchronously moves) the substrate stage 2 and the measurement stage 3 while maintaining the gap G3. In the present embodiment, when the scrum movement is executed, the control device 8 causes the substrate stage 2 so that substantially one continuous surface is formed by the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3. The positional relationship between the upper surface 2U of the first and the upper surface 3U of the measurement stage 3 is adjusted.

  After the scram movement is executed and the immersion space LS is formed between the last optical element 12 and the immersion member 7 and the substrate stage 2 (substrate P), the control device 8 starts the exposure processing of the substrate P. To do. When executing the exposure processing of the substrate P, the control device 8 makes the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 face each other, and the optical path between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. The control device 8 irradiates the substrate P with the exposure light EL from the mask M illuminated with the exposure light EL by the illumination system IL via the projection optical system PL and the liquid LQ. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction.

  After the exposure processing of the substrate P is completed, the control device 8 performs scram movement, and after the immersion space LS is formed between the terminal optical element 12 and the immersion member 7 and the measurement stage 3, the substrate stage 2 is moved to the substrate exchange position CP. The measurement stage 3 is arranged at the standby position SP, for example. The control device 8 carries out the substrate P after exposure from the substrate stage 2 moved to the substrate exchange position CP, and carries the substrate P before exposure into the substrate stage 2.

  Thereafter, the control device 8 repeats the above process to sequentially expose the plurality of substrates P.

  By the way, during exposure of the substrate P, a substance (e.g., an organic substance such as a photosensitive material) generated (eluted) from the substrate P may be mixed into the liquid LQ in the immersion space LS as a foreign substance (contaminant, particle). . Further, not only substances generated from the substrate P but also foreign substances floating in the air may be mixed into the liquid LQ in the immersion space LS. As described above, in at least a part of the exposure sequence including the replacement process of the substrate P, the measurement process using the measurement member C, and the exposure process of the substrate P, the liquid LQ in the immersion space LS is transferred to the plate member S. At least a partial region of the upper surface, at least a partial region of the upper surface of the measurement member C, and at least a partial region of the upper surface of the plate member T are contacted. Therefore, when foreign matter enters the liquid LQ in the immersion space LS, the upper surface 2U of the substrate stage 2 (plate member T) disposed around the substrate P held by the first holding unit 31 and the measurement stage 3 ( There is a possibility that foreign matter may adhere to the upper surface 3U of the measuring member C and the plate member S). If foreign matter is left on the upper surface of the exposure apparatus EX (the liquid contact surface in contact with the liquid LQ), the foreign matter may adhere to the substrate P during exposure or from the supply port 15. There is a possibility that the supplied liquid LQ may be contaminated. Moreover, if the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 are contaminated, for example, the immersion space LS may not be formed satisfactorily. As a result, exposure failure may occur.

  Therefore, in the present embodiment, the control device 8 executes processing for confirming the contamination state of the surface (upper surface) of the member of the exposure apparatus EX that contacts the liquid LQ in the immersion space LS at a predetermined timing. In accordance with the result of the confirmation, a cleaning process for cleaning the member is executed.

  Hereinafter, an example of a maintenance sequence including the confirmation process and the cleaning process according to the present embodiment will be described. As shown in the flowchart of FIG. 8, in the present embodiment, the maintenance sequence includes an operation (step SP1) of holding the dummy substrate DP by the first holding unit 31 and a member (hereinafter, an evaluation target member) whose contamination state is to be confirmed. An immersion space LS is formed between the liquid immersion member 7 and the liquid immersion member 7 (step SP2), and the liquid immersion space LS is formed. In this state, the dummy substrate DP and the evaluation target member are moved with respect to the liquid immersion member 7 to form the liquid immersion space LS between the liquid immersion member 7 and the dummy substrate DP, and the liquid in the liquid immersion space LS is formed. This includes an operation of bringing the LQ into contact with the surface of the dummy substrate DP (step SP3) and an operation of confirming the surface state of the evaluation target member based on the state of the surface of the dummy substrate DP (step SP4). In the present embodiment, the confirmation process includes the operations of steps SP1 to SP4 described above. Further, in the present embodiment, when it is determined that the evaluation target member is contaminated as a result of the confirmation, an operation of cleaning the evaluation target member is executed.

  In the present embodiment, the confirmation process described above is performed on the state of the substrate P exposed through the liquid LQ (the adhesion state of foreign matter on the surface of the substrate P and / or the number (quantity) of pattern defects formed on the substrate P. )) Is started based on. That is, in the present embodiment, the timing for starting the confirmation process is determined based on the result of observing the state of the substrate P after exposure.

  For example, information regarding the state of the substrate P exposed through the liquid LQ is acquired by a predetermined observation apparatus. For example, an image of the surface of the substrate after exposure is acquired with a scanning electron microscope (SEM) or the like. The acquired information is output to the control device 8. Based on the information, the control device 8 is in a state where the substrate P after the exposure is unacceptable (foreign matter is adhering to the surface of the substrate P unacceptably and / or the pattern formed on the substrate P is acceptable. If it is determined that there are defects that cannot be performed), the confirmation process is started.

  For example, when the state of the substrate P after exposure is unacceptable, the foreign matter adhering to at least a part of the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 enters the liquid LQ in the immersion space LS, and exposure is performed. It can be determined that there is a high possibility that it has adhered to the substrate P. Therefore, the control device 8 determines whether to start the confirmation process based on the state of the substrate P after the exposure.

  The dummy substrate DP may not have the same outer shape as the substrate P.

  Hereinafter, the case where the evaluation target member is the measurement member C1 provided on the measurement stage 3 will be described as an example.

  In order to execute the confirmation process, the dummy substrate DP is held by the first holding unit 31 (step SP1). The dummy substrate DP is a member that is different from the substrate P for exposure and does not easily emit foreign matter and has a high cleanliness (clean). The dummy substrate DP has substantially the same outer shape as the substrate P, and the first holding unit 31 can hold the dummy substrate DP. A predetermined gap G1b is formed between the side surface of the dummy substrate DP held by the first holding unit 31 and the inner side surface of the plate member T held by the second holding unit 32.

  In the present embodiment, the contact angle of the surface (upper surface) of the dummy substrate DP with respect to the liquid LQ is substantially the same as the contact angle of the surface (upper surface) of the substrate P with respect to the liquid LQ. In the present embodiment, the surface of the substrate P is formed by the surface of the top coat film, and the surface of the dummy substrate DP is also formed by the top coat film. In the present embodiment, the dummy substrate DP does not include a photosensitive film, and has a base material such as a semiconductor wafer and a topcoat film formed on the base material. In the dummy substrate DP, an HMDS film may be disposed between the base material and the topcoat film. Further, a photosensitive film may be formed on the dummy substrate DP.

  The control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15 in order to execute the confirmation process of the contamination state of the upper surface of the measuring member C1. 9A, an immersion space LS is formed between the lower surface 14 of the liquid immersion member 7 and the measurement member C1, and at least the liquid LQ in the immersion space LS and at least the upper surface of the measurement member C1 are formed. A part of the area AC1 is brought into contact (step SP2). In the present embodiment, the control device 8 adjusts the position of the measurement stage 3 so that the liquid LQ is in contact with a part of the region AC1 substantially at the center of the upper surface of the measurement member C1.

  In the present embodiment, the control device 8 measures the measurement stage so that the area AC1 on the upper surface of the measurement member C1 and the liquid LQ in the immersion space LS are kept in contact with each other for a time Ts in the state of FIG. Stop the movement of 3 (fix the position). The time Ts can be arbitrarily specified. Note that, at time Ts as well, the operation of supplying the liquid LQ from the supply port 15 and the operation of recovering the liquid LQ from the recovery port 16 are continued. Further, at time Ts, the measurement stage 3 may be moved with respect to the liquid immersion member 7 so that the measurement member C1 keeps in contact with the liquid LQ in the liquid immersion space LS.

  Next, the control device 8 performs scram movement in a state where the liquid immersion space LS is formed on the lower surface 14 side of the liquid immersion member 7, and as shown in FIG. An immersion space LS is formed between the substrate DP and the liquid LQ in the immersion space LS is brought into contact with at least a part of the area ADP on the surface of the dummy substrate DP (step SP3). In the present embodiment, the control device 8 adjusts the position of the substrate stage 2 so that the liquid LQ is in contact with a part of the region ADP substantially at the center of the surface of the dummy substrate DP.

  In the present embodiment, the control device 8 keeps at least part of the region ADP on the surface of the dummy substrate DP and the liquid LQ in the immersion space LS in contact with each other for the time Td in the state of FIG. 9B. Then, the movement of the substrate stage 2 is stopped. The time Td can be arbitrarily specified. Note that the supply operation of the liquid LQ from the supply port 15 and the recovery operation of the liquid LQ from the recovery port 16 are continued at time Td. Further, at time Td, the substrate stage 2 may be moved with respect to the dummy substrate DP so that the measurement member C1 keeps in contact with the liquid LQ in the immersion space LS.

  In the present embodiment, the control device 8 causes the liquid immersion space LS formed on the lower surface 14 side of the liquid immersion member 7 to reciprocate a predetermined number of times between the surface of the dummy substrate DP and the upper surface of the measurement member C1. In this manner, the scram movement is repeated to move the substrate stage 2 (dummy substrate DP) and the measurement stage 3 (measurement member C1) relative to the liquid immersion member 7. That is, the control device 8 executes the scram movement so that the state shown in FIG. 9A and the state shown in FIG. 9B are alternately repeated. The number of times of reciprocating the immersion space LS can be arbitrarily specified. The control device 8 reciprocates the liquid immersion space LS a specified number of times. Note that step SP2 may be executed once, and step SP4 may be executed after step SP3 is executed once without reciprocating the immersion space LS. Further, during at least a part of the above-described time Ts and / or time Td, a substantially continuous surface is formed between the upper surface 2U of the substrate stage 2 and the upper surface 3U of the measurement stage 3 in the same manner as the scrum movement period. Although the formed state is maintained, the substrate stage 2 and the measurement stage 3 may be separated so as not to form the immersion space LS.

  After the immersion space LS reciprocates between the surface of the dummy substrate DP and the upper surface of the measurement member C1, the surface of the dummy substrate DP is observed. For example, the control device 8 unloads the dummy substrate DP from the first holding unit 31 using the transport device 36. The unloaded dummy substrate DP is sent to a predetermined observation device. In the present embodiment, the observation device is a camera or a scanning electron microscope that can acquire an image of the surface of the dummy substrate DP. The observation device observes the surface of the dummy substrate DP and acquires an image of the surface of the dummy substrate DP. Thereby, the contamination state of the surface of the dummy substrate DP is confirmed. Note that the observation apparatus may be provided in the exposure apparatus EX or may be disposed outside the exposure apparatus EX. When using an observation apparatus arranged outside the exposure apparatus EX, the operator may carry the dummy substrate DP from the exposure apparatus EX to the observation apparatus, or the conveyance arranged between the exposure apparatus EX and the observation apparatus. The dummy substrate DP may be transported from the exposure apparatus EX to the observation apparatus using the apparatus.

  In the present embodiment, the contamination state of the upper surface of the measurement member C1 is confirmed based on the state of the dummy substrate DP (step SP4). For example, when a foreign substance is attached to the upper surface of the measurement member C1, as described in step SP2, the liquid LQ in the immersion space LS and the upper surface of the measurement member C1 are brought into contact with each other to thereby adjust the measurement member C1. There is a high possibility that foreign matter adhering to the upper surface is mixed into the liquid LQ in the immersion space LS. As described in step SP3, the liquid LQ that is highly likely to contain foreign matter may come into contact with the surface of the dummy substrate DP, so that the foreign matter in the liquid LQ may adhere to the surface of the dummy substrate DP. high. Therefore, the contamination state of the upper surface of the measurement member C1 can be confirmed by observing the state of the dummy substrate DP with an observation device. For example, by measuring the number of foreign substances adhering to the surface of the dummy substrate DP, the degree of contamination (contamination level) on the upper surface of the measuring member C1 can be confirmed.

  In the present embodiment, the image data acquired by the observation device is output to the control device 8. The control device 8 processes the image data and confirms the contamination state of the surface of the dummy substrate DP.

  FIG. 10 is a schematic diagram illustrating an example of the acquired image data of the surface of the dummy substrate DP. For example, when the upper surface of the measurement member C1 is not contaminated or when the degree of contamination is acceptable, as shown in FIG. 10A, the surface of the dummy substrate DP after the above-described confirmation processing is clean. On the other hand, when many foreign substances adhere to the upper surface of the measurement member C, as shown in the schematic diagram of FIG. 10B, many foreign substances adhere to the surface of the dummy substrate DP after the confirmation processing. As described above, in the present embodiment, the contamination state of the upper surface of the measurement member C1 is confirmed using the fact that the contamination state of the surface of the dummy substrate DP changes according to the contamination state of the upper surface of the measurement member C1. . The control device 8 confirms the contamination state of the upper surface of the measurement member C1 by confirming the contamination state of the surface of the dummy substrate DP based on the image data of the observation device.

  In the present embodiment, the case where the evaluation target area AC1 is a part of the area substantially at the center of the upper surface of the measurement member C1 has been described as an example, but of course, the evaluation target area AC1 on the upper surface of the measurement member C1. However, the peripheral area | region of the upper surface of the measurement member C1 may be sufficient.

  Heretofore, the case where the evaluation target member is the measurement member C1 has been described as an example. Even when the evaluation target member is the measurement member C2, the contamination state of the upper surface of the measurement member C2 can be confirmed by executing the same process as the confirmation process described above.

  Further, the evaluation target member may be the plate member S of the measurement stage 3. When the member to be evaluated is the plate member S, the control device 8 forms an immersion space LS between the upper surface of the plate member S and the liquid immersion member 7 as shown in FIG. After bringing the liquid LQ in the space LS into contact with at least a part of the area AS on the upper surface of the plate member S, the scram is moved in a state where the liquid immersion space LS is formed on the lower surface 14 side of the liquid immersion member 7. 11B, an immersion space LS is formed between the surface of the dummy substrate DP and the liquid immersion member 7, and the liquid LQ in the immersion space LS and a part of the surface of the dummy substrate DP are formed. By contacting the region ADP, the contamination state of the region AS on the upper surface of the plate member S can be confirmed.

  In the example shown in FIG. 11, the evaluation target area AS on the upper surface of the plate member S is a predetermined area 3P. As described above, in the exposure sequence, when the substrate stage 2 is separated from the liquid immersion member 7, the predetermined region 3P may continue to contact the liquid LQ in the liquid immersion space LS. Therefore, it is effective to confirm the contamination state of the predetermined area 3P.

  Of course, the area AS to be evaluated on the upper surface of the plate member S may be an area other than the predetermined area 3P. The control device 8 can confirm the contamination state with respect to each of the plurality of regions on the upper surface of the plate member S by executing the same confirmation processing as described above.

  Further, the evaluation target member may be a plate member T as well as a member provided on the measurement stage 3. For example, in order to confirm the contamination state of at least a part of the area AT on the upper surface of the plate member T, the control device 8 may cause the upper surface of the plate member T and the liquid immersion member 7 as shown in FIG. An immersion space LS is formed therebetween, and after the liquid LQ in the immersion space LS and a partial area AT on the upper surface of the plate member T are brought into contact with each other, the immersion space LS is formed on the lower surface 14 side of the immersion member 7. In the formed state, the substrate stage 2 is moved to form an immersion space LS between the surface of the dummy substrate DP and the immersion member 7 as shown in FIG. By bringing the liquid LQ into contact with the partial area ADP on the surface of the dummy substrate DP, the contamination state of the area AS on the upper surface AT of the plate member T can be confirmed.

  Moreover, the control apparatus 8 can set several area | region AT as an evaluation object of the upper surface of the plate member T, and can perform the confirmation process similar to the above regarding each of these some area | region AT.

  In the present embodiment, in the confirmation process described above, the control device 8 determines the time Td during which the region ADP on the surface of the dummy substrate DP and the liquid LQ in the immersion space LS are in contact with the evaluation target members (C1, C2). , S, T) and the time Ts during which the liquid LQ in the immersion space LS is in contact with each other are made different. For example, the control device 8 makes the time Ts longer than the time Td. Thereby, the foreign material adhering to the upper surface of the evaluation target member can be removed from the upper surface, and can be satisfactorily mixed into the liquid LQ in the immersion space LS. Moreover, the control apparatus 8 may make time Td longer than time Ts. Thereby, the foreign material mixed in the liquid LQ of the immersion space LS can be favorably adhered to the surface of the dummy substrate DP.

  In the confirmation process, when the immersion space LS reciprocates a predetermined number of times between the surface of the dummy substrate DP and the upper surface of the evaluation target member, the region ADP and the liquid LQ on the surface of the dummy substrate DP The positions of the substrate stage 2 and the measurement stage 3 are adjusted so that the total time (integrated time) of contact with the substrate is different from the total time (integrated time) of contact with the evaluation target region on the upper surface of the evaluation target member. May be.

  In the above confirmation process, when contamination of at least a part of the upper surface of the measurement member C1, the measurement member C2, the plate member S, and the plate member T is confirmed, the control device 8 performs a cleaning process on the contaminated member. Execute.

  In the present embodiment, the cleaning is performed using a cleaning liquid. In the present embodiment, the liquid LQ used for exposure of the substrate P is used as the cleaning liquid.

  For example, when it is determined in the above-described confirmation process that the upper surface of the measurement member C1 is unacceptably contaminated, as shown in FIG. 13, the control device 8 is arranged between the liquid immersion member 7 and the measurement member C1. The liquid immersion space LS is formed with the liquid LQ, and the measuring member C1 is moved in the XY direction with respect to the liquid immersion member 7. In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, and the liquid immersion member 7 and the measurement member C1. A liquid immersion space LS is formed between the liquid LQ and the liquid LQ in the liquid immersion space LS is in contact with the upper surface of the measurement member C1 to control the drive system 6 to hold the measurement member C1. The measured stage 3 is reciprocated between the first position and the second position in the XY plane. Thereby, the upper surface of the measurement member C1 is cleaned with the liquid LQ.

  Further, when it is determined that the contamination of the predetermined area 3P on the upper surface 3U of the measurement stage 3 is not acceptable, the control device 8 can cleanly clean the predetermined area 3P. When cleaning the predetermined area 3P, the control device 8 moves the measurement stage 3 between the first position and the second position in the XY plane in a state where the liquid LQ in the immersion space LS is in contact with the predetermined area 3P. Make a round trip. Thereby, the predetermined region 3P is intensively cleaned with the liquid LQ.

  Further, when it is determined that a part of the upper surface of the measurement stage 3 (for example, the upper surface of the measurement member C1) is unacceptably contaminated, the control device 8 cleans almost the entire upper surface of the measurement stage 3. Also good. For example, as shown in FIG. 14, the measurement stage 3 can move with respect to the liquid immersion member 7 so that the immersion space LS moves along the arrow R <b> 1 on the upper surface 3 </ b> U of the measurement stage 3.

  Further, when cleaning the plate member T, the control device 8 forms an immersion space LS with the liquid LQ between the liquid immersion member 7 and the plate member T, and the liquid LQ and the plate member in the liquid immersion space LS. In a state where the upper surface of T is in contact, the drive system 5 is controlled to move the substrate stage 2 (plate member T) in the XY directions. Thereby, the upper surface of the plate member T is cleaned with the liquid LQ.

  As described above, according to the present embodiment, the contamination state of the members (parts, components) of the exposure apparatus EX can be confirmed. Therefore, the member can be cleaned efficiently. According to the present embodiment, the contaminated member or the region of the upper surface of the contaminated member can be specified by the confirmation process. Therefore, the specified member (region) can be cleaned intensively. Further, since a contaminated member (region) is specified, it is possible to omit a useless process such as cleaning a non-contaminated member (region that does not need to be cleaned).

  Further, in the present embodiment, the immersion space LS formed on the lower surface 14 side of the immersion member 7 reciprocates a predetermined number of times between the surface of the dummy substrate DP and the upper surface of the evaluation target member. The dummy substrate DP and the evaluation target member move. Thereby, the foreign material adhering to the upper surface of the evaluation target member can be smoothly separated from the upper surface of the evaluation target member, and the separated foreign material can be mixed in the liquid LQ. Further, the foreign matter mixed in the liquid LQ can be satisfactorily adhered to the dummy substrate DP.

  In the present embodiment, the contact angle of the surface of the dummy substrate DP with respect to the liquid LQ and the contact angle of the surface of the substrate P with respect to the liquid LQ are substantially the same, so the terminal optical element 12 and the liquid immersion member 7 and the dummy substrate DP. The immersion space LS can be satisfactorily formed between the surface and the surface. Further, the contact angle of the surface of the dummy substrate DP with respect to the liquid LQ is made higher than the contact angle of the surface of the substrate P with respect to the liquid LQ, so that the end optical element 12 and the liquid immersion member 7 and the surface of the dummy substrate are interposed. The immersion space LS can be formed satisfactorily.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 15 is a view showing an example of an exposure apparatus EX according to the second embodiment. A characteristic part of the second embodiment different from the first embodiment described above is that a bridge member 47 is provided on the measurement stage 3. That is, in the present embodiment, the side surface 3FA of the measurement stage 3 that can face the substrate stage 2 includes the side surface 49S of the bridge member 47 and the side surface 3F where the bridge member 47 is not disposed.

  The bridge member 47 has an upper surface 49U that can face the emission surface 13 and the lower surface 14, and a side surface 49S that can face the side surface 2F of the substrate stage 2. In the present embodiment, the upper surface 49U of the bridge member 47 is substantially parallel to the XY plane. Further, the upper surface 49U of the bridge member 47 and the upper surface of the plate member S held by the fourth holding portion 34 are arranged in substantially the same plane (substantially flush).

  In the present embodiment, the side surface 49S of the bridge member 47 is closer to the side surface 2F of the substrate stage 2 than the side surface 3F.

  FIGS. 16 and 17 are views showing a state in which the exposure apparatus EX according to the second embodiment is executing the scrum movement. In the present embodiment, when executing the scram movement, the control device 8 causes the side surface 2F on the + Y side of the substrate stage 2 and the side surface 49S of the bridge member 47 of the measurement stage 3 to face each other via a predetermined gap G3b, While maintaining the gap G3b, the substrate stage 2 and the measurement stage 3 are simultaneously moved (synchronized movement). In the present embodiment, when the scrum is moved, the immersion space LS is formed in a state in which a substantially continuous surface is formed by the upper surface 2U of the substrate stage 2, the upper surface 3U of the measurement stage 3, and the upper surface 49U of the bridge member 47. The upper surface 49U of the bridge member 47 is moved. That is, in the exposure sequence, at least a part of the upper surface 49U of the bridge member 47 is in contact with the liquid LQ in the immersion space LS.

  FIG. 18 is a diagram illustrating an example of a confirmation process for confirming the contamination state of the upper surface 49 </ b> U of the bridge member 47. In order to confirm the contamination state of at least a part of the region A47 on the upper surface 49U of the bridge member 47, the control device 8 performs the operation of the upper surface 49U of the bridge member 47 and the liquid immersion member 7 as shown in FIG. A liquid immersion space LS is formed between the liquid LQ in the liquid immersion space LS and a partial region A47 of the upper surface 49U of the bridge member 47, and then the liquid immersion space LS is formed on the lower surface 14 side of the liquid immersion member 7. As shown in FIG. 18B, an immersion space LS is formed between the surface of the dummy substrate DP and the liquid immersion member 7 to form the liquid immersion space LS. By bringing the liquid LQ into contact with the partial area ADP on the surface of the dummy substrate DP, the contamination state of the area A47 on the upper surface 49U of the bridge member 47 can be confirmed.

  In the present embodiment, the case where the bridge member 47 is disposed on the measurement stage 3 has been described as an example. However, the bridge member 47 may be disposed on the substrate stage 2 or may be disposed on both the measurement stage 3 and the substrate stage 2. May be.

  In the first and second embodiments described above, the dummy substrate DP is held in the first holding unit 31 and the confirmation process is performed. However, the exposure substrate P is held in the first holding unit 31. Then, the confirmation process may be executed. Even when the substrate P is used, if the evaluation target member is contaminated, the foreign matter generated from the evaluation target member adheres to the surface of the substrate P. Therefore, by observing the surface state of the substrate P, the evaluation target member The contamination state of the surface of the can be confirmed.

  In each of the above-described embodiments, the case where cleaning is performed using the liquid LQ used for exposure of the substrate P has been described as an example. However, cleaning may be performed using a liquid different from the exposure liquid LQ. For example, the member to be evaluated can be cleaned using an alkaline cleaning liquid. In that case, an alkaline cleaning liquid can be supplied from the supply port 15 to form an immersion space with the alkaline cleaning liquid between the liquid immersion member 7 and the evaluation target member, and the evaluation target member can be cleaned.

  Further, when a cleaning liquid immersion member different from the liquid immersion member 7 is provided and the evaluation target member is cleaned, a liquid immersion space is formed between the cleaning liquid immersion member and the evaluation target member, and the evaluation target The member may be cleaned. When the immersion space is formed with the cleaning immersion member, the immersion space may be formed with the liquid LQ used for exposure of the substrate P, or the immersion space may be formed with a liquid different from the liquid LQ, such as an alkaline cleaning liquid. May be formed.

  In addition, ultrasonic vibration may be applied to the liquid in the immersion space formed between the liquid immersion member and the member to be cleaned for cleaning using the ultrasonic generator.

  Further, the cleaning target member may be optically cleaned by irradiating the cleaning target member with ultraviolet rays (for example, exposure light EL). The light cleaning is described in, for example, US Patent Application Publication No. 2007/0258072.

  In each of the above-described embodiments, the confirmation process for confirming the contamination state of the surface of the member of the exposure apparatus EX is started based on the state of the substrate P exposed through the liquid LQ. For example, it may be executed at a predetermined timing such as every predetermined time interval, every time a predetermined number of substrates P are exposed, or just before the exposure processing of the first substrate P in each lot is started. Further, in each of the above-described embodiments, the control device 8 confirms the contamination state of the evaluation target member based on the image data acquired by the observation device. However, the control device 8 is provided in the exposure device EX or the observation device. The operator may determine the contamination state of the evaluation target member by displaying the contamination state of the dummy substrate DP on the display device.

  In each of the above-described embodiments, when it is determined that the contamination of the member and / or part (component) is unacceptable, the member and / or part is cleaned, but the cleaning is performed. Instead, it may be replaced.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As described above, it is possible to employ a projection optical system PL in which the optical path on the incident side (object plane side) of the last optical element 12 is also filled with the liquid LQ.

  In each embodiment described above, water is used as the liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 19, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like. The substrate processing step includes a maintenance process including a member cleaning process performed according to the result of the confirmation process of the member of the exposure apparatus EX according to the above-described embodiment, and the maintenance process including the member cleaning process. The substrate is exposed with exposure light using the exposure apparatus EX.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view showing an example of a substrate stage concerning a 1st embodiment. It is a sectional side view which shows an example of the measurement stage which concerns on 1st Embodiment. It is a sectional side view which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a flowchart for demonstrating an example of the confirmation method which concerns on 1st Embodiment. It is a figure for demonstrating an example of the confirmation method of the contamination state which concerns on 1st Embodiment. It is a figure for demonstrating an example of the confirmation method of the contamination state which concerns on 1st Embodiment. It is a figure for demonstrating an example of the confirmation method of the contamination state which concerns on 1st Embodiment. It is a figure for demonstrating an example of the confirmation method of the contamination state which concerns on 1st Embodiment. It is a figure for demonstrating an example of the maintenance method which concerns on 1st Embodiment. It is a figure for demonstrating an example of the maintenance method which concerns on 1st Embodiment. It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating an example of the confirmation method of the contamination state which concerns on 2nd Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Measurement stage, 7 ... Immersion member, 8 ... Control apparatus, 31 ... 1st holding part, 32 ... 2nd holding part, 33 ... 3rd holding part, 34 ... 4th holding part, 47 ... Bridge member, C (C1, C2) ... Measuring member, DP ... Dummy substrate, G1 ... Gap, G2 ... Gap, G3 ... Gap, P ... Substrate, S ... Plate member, T ... Plate member, EL ... Exposure light, EX ... exposure device, LQ ... liquid, LS ... immersion space

Claims (20)

Holding the first member with a first holding part that releasably holds a substrate exposed with exposure light through a liquid;
Bringing the liquid in the immersion space formed between the second member movable to a position where the exposure light can be irradiated and the liquid immersion member into contact with the surface of the second member;
With the liquid immersion space formed on one side of the liquid immersion member, the first member and the second member are moved with respect to the liquid immersion member, and the liquid immersion member and the first member Contacting the liquid in the immersion space formed therebetween with the surface of the first member;
Checking the contamination state of the surface of the second member based on the state of the surface of the first member.   The first member and the second member so that a liquid immersion space formed on one side of the liquid immersion member reciprocates a predetermined number of times between the surface of the first member and the surface of the second member. The confirmation method according to claim 1, wherein the member is moved with respect to the liquid immersion member.   The confirmation method according to claim 1 or 2, wherein a first time in which the surface of the first member is in contact with the liquid and a second time in which the surface of the second member is in contact with the liquid are different. .   The confirmation method according to any one of claims 1 to 3, wherein the liquid immersion space is formed by executing a liquid recovery operation from the recovery port in parallel with a liquid supply operation from the supply port.   The confirmation method according to claim 1, wherein the second member is in contact with a liquid during a partial period of exposure of the substrate.   The confirmation method according to any one of claims 1 to 5, wherein the second member is disposed at least at a part of the periphery of the substrate held by the first holding unit.   The said 2nd member is a confirmation method as described in any one of Claims 1-6 containing the plate member hold | maintained releasably by the 2nd holding | maintenance part arrange | positioned around the said 1st holding | maintenance part.   The confirmation method according to claim 1, wherein the second member includes a measurement member.   The confirmation method according to claim 1, wherein the second member is provided on a second stage different from the first stage on which the first holding unit is provided. One of the side surface of the first stage that can face the second stage and the side surface of the second stage that can face the first stage includes the side surface of the second member,
The confirmation method according to claim 9, wherein the side surface of the second member is closer to the side surface of the other stage than the other part of the side surface of the one stage.   The surface of the second member includes at least a part of a surface of the second stage that holds the liquid with the liquid immersion member when the first stage is separated from the liquid immersion member. The confirmation method according to 9 or 10.   The confirmation method according to claim 1, wherein the first member includes a substrate.   The said 1st member contains the dummy substrate which has the surface where the contact angle with respect to the said liquid is substantially the same as the surface of the said substrate, or the contact angle with respect to the said liquid is higher than the surface of the said substrate. Confirmation method of description.   The confirmation method according to claim 1, wherein the confirmation of the contamination state of the surface of the second member includes observation of the surface of the first member. Using the confirmation method according to any one of claims 1 to 14, confirming a contamination state of the second member of the immersion exposure apparatus that exposes the substrate through the liquid;
A maintenance method comprising: cleaning the second member in accordance with the result of the confirmation.   The maintenance method according to claim 15, wherein the confirmation is performed based on a surface state of the substrate exposed through the liquid and / or a defect in a pattern of the substrate exposed through the liquid.   The maintenance method according to claim 15 or 16, wherein the cleaning is performed using a cleaning liquid.   18. The cleaning includes forming an immersion space with the cleaning liquid between the liquid immersion member and the second member, and moving the second member relative to the liquid immersion member. Maintenance method.   The maintenance method according to claim 17, wherein the cleaning liquid includes a liquid used for exposure of the substrate. Exposing the substrate using the immersion exposure apparatus maintained by the maintenance method according to any one of claims 15 to 19,
Developing the exposed substrate; and a device manufacturing method.

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