JP5304959B2 - Exposure apparatus and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device capable of suppressing occurrence of an exposure failure. <P>SOLUTION: An exposure device comprises: an optical member for emitting exposure light; a movable member capable of moving in a predetermined plane comprising an irradiation position of the exposure light emitted from the optical member; a scale member disposed on at least a part of a periphery of an optical path of the exposure light; a measurement system comprising an encoder head disposed at the movable member to be capable of facing the scale member, and measuring position information of the movable member; and a detection system for detecting a positional relation between the optical member and the scale member. <P>COPYRIGHT: (C)2013,JPO&amp;INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate, an exposure method, and a device manufacturing method.

  In the manufacturing process of micro devices such as semiconductor devices and electronic devices, an exposure apparatus that exposes a substrate with exposure light is used. The exposure apparatus includes a movable member such as a substrate stage that moves while holding the substrate, and exposes the substrate while measuring position information of the movable member with a position measurement system. The following patent document discloses an example of a technique for measuring position information of a movable member using an encoder system having an encoder head that can face the scale member.

US Patent Application Publication No. 2006/0227309

  In the encoder system, for example, if the position of the scale member varies, there is a possibility that the position information of the movable member cannot be accurately measured. As a result, for example, a defect may occur in a pattern formed on the substrate, which may cause an exposure failure and a defective device.

    An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to a first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light, and includes an optical member that emits exposure light and a predetermined plane including an irradiation position of exposure light emitted from the optical member. A movable member that is movable, a scale member that is disposed at least around the optical path of the exposure light, and an encoder head that is disposed on the movable member and can face the scale member, and measures position information of the movable member. An exposure apparatus including a measurement system and a detection system that detects a positional relationship between an optical member and a scale member is provided.

    According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light, and includes an optical member that emits exposure light and a predetermined plane including an irradiation position of exposure light emitted from the optical member. A movable member that includes a movable member that is movable while holding the substrate, a scale member that is disposed at least part of the periphery of the optical path of the exposure light, and an encoder head that is disposed on the movable member and can face the scale member. A measurement system that measures the position information of the light source, a detection system that detects the first positional relationship between the optical member and the scale member, and the exposure position of the exposure light and the position of the substrate based on the detection result of the detection system when the substrate is exposed. An exposure apparatus is provided that includes a correction device that corrects the second positional relationship with the shot area.

    According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first and second aspects and developing the exposed substrate. .

    According to a fourth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light, wherein a scale member is disposed at least at a part around the optical path of the exposure light, and exposure emitted from the optical member An encoder head of a measurement system for measuring position information of a movable member movable within a predetermined plane including a light irradiation position is disposed on the movable member, and a positional relationship between the optical member and the scale member is detected. And exposing the substrate by adjusting the positional relationship between the exposure light irradiation position and the shot region of the substrate based on the detection result.

    According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising exposing a substrate using the exposure method of the fourth aspect and developing the exposed substrate.

    According to the present invention, the occurrence of defective exposure can be suppressed, and the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is the figure which expanded a part of exposure apparatus concerning this embodiment. It is a top view which shows the 1st board | substrate stage which concerns on this embodiment. It is a top view which shows typically the relationship between the scale board which concerns on this embodiment, and a 1st optical element. It is a mimetic diagram for explaining a positioning device concerning this embodiment. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram showing an exposure apparatus EX according to this embodiment, and FIG. 2 is an enlarged view of a part of FIG. In this embodiment, the exposure apparatus EX includes, for example, US Pat. No. 6,341,007, US Pat. No. 6,400,491, US Pat. No. 6,549,269, US Pat. No. 6,590,634, and US Pat. No. 6,208,407. , U.S. Pat.No. 6,262,796, U.S. Pat.No. 6,674,510, U.S. Pat.No. 6,208,407, U.S. Pat.No. 6,710,849, U.S. Pat. A case where the exposure apparatus is a twin stage type exposure apparatus including a plurality (two) of substrate stages 1 and 2 that can move while holding the substrate P will be described as an example.

  1 and 2, the exposure apparatus EX is independent of the mask stage 3 that can move while holding the mask M, the first substrate stage 1 that can move while holding the substrate P, and the first substrate stage 1. A second substrate stage 2 that is movable while holding the substrate P, a first drive system 41 that moves the mask stage 3, and a second drive system 42 that moves the first and second substrate stages 1 and 2. , An interferometer system 4 including a laser interferometer that measures position information of the mask stage 3, an encoder system 5 that measures position information of the first substrate stage 1 and the second substrate stage 2, and an alignment mark on the substrate P are detected. An alignment system 6 that performs positioning, a focus / leveling detection system 7 that detects position information on the surface of the substrate P, an illumination system IL that illuminates the mask M with exposure light EL, and exposure light The image of the pattern of the mask M illuminated by the L and includes a projection optical system PL for projecting the substrate P, and a control unit 8 for controlling the operation of the entire exposure apparatus EX.

  Further, the exposure apparatus EX is, for example, a pedestal 9 disposed on the floor surface FL in the clean room, and disposed on the pedestal 9 via the vibration isolator 10 to move the first substrate stage 1 and the second substrate stage 2. The first base member 11 having a guide surface 11G that can be supported, the base frame 12 disposed on the pedestal 9, and the vibration isolation device 13 disposed on the base frame 12 so that the mask stage 3 can be moved. And a second base member 14 having a supporting guide surface 14G.

  Further, the exposure apparatus EX includes an exposure station ST1 in which an exposure process for the substrate P is executed, and a measurement station ST2 in which a predetermined measurement process for exposure and an exchange process for the substrate P are executed. The illumination system IL, the mask stage 3, and the projection optical system PL are arranged in the exposure station ST1. Of the plurality of optical elements of the projection optical system PL, the first optical element 15 closest to the image plane of the projection optical system PL has an exit surface 16 that emits the exposure light EL. The irradiation position SP1 of the exposure light EL emitted from the first optical element 15 is disposed at the exposure station ST1. The alignment system 6 and the focus / leveling detection system 7 are arranged in the measurement station ST2.

  The alignment system 6 detects the alignment mark of the substrate P and measures the position information of the substrate P in the XY plane. The alignment system 6 detects the alignment mark of the substrate P in order to detect the position information of the shot area of the substrate P. The alignment system 6 includes a plurality of optical elements including the second optical element 17 that can face the substrate P, and detects alignment marks on the substrate P using these optical elements. The first and second substrate stages 1 and 2 can move to a measurement position SP <b> 2 that holds the substrate P and faces the second optical element 17. The alignment system 6 acquires the position information of the shot area of the substrate P via the second optical element 17 and the alignment mark of the substrate P placed at the measurement position SP2 or the first and second substrate stages 1. 2 is detected.

  The focus / leveling detection system 7 detects position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held by the first and second substrate stages 1 and 2. The focus / leveling detection system 7 includes a projection device 7A, which is disposed at the measurement position SP2 and can irradiate detection light from an oblique direction onto the surface of the substrate P held by the first and second substrate stages 1 and 2, and the substrate. And a light receiving device 7B capable of receiving the detection light irradiated on the surface of P and reflected on the surface of the substrate P. The focus / leveling detection system 7 can detect not only the position information of the surface of the substrate P but also the position information of the upper surfaces of the first and second substrate stages 1 and 2. The measurement position SP2 where the measurement of the position information of the substrate P by the alignment system 6 and the focus / leveling detection system 7 is executed is arranged in the measurement station ST2.

  Each of the first and second substrate stages 1 and 2 can move while holding the substrate P in a predetermined region of the guide surface 11G including the irradiation position SP1 and the measurement position SP2. In the present embodiment, the guide surface 11G is substantially parallel to the XY plane. Each of the first and second substrate stages 1 and 2 is movable in the guide surface 11G between the exposure station ST1 and the measurement station ST2.

  In the present embodiment, the first and second substrate stages 1 and 2 are operated on the first base member 11 by the operation of the second drive system 42 including a planar motor, for example, the X axis, the Y axis, the Z axis, and θX. , ΘY, and θZ directions. A planar motor for moving the first and second substrate stages 1 and 2 is, for example, a magnet disposed on the first and second substrate stages 1 and 2 as disclosed in US Pat. No. 6,452,292. An array and a coil array disposed on the first base member 11.

  The encoder system 5 measures position information of the first and second substrate stages 1 and 2 (substrate P) in the XY plane. The encoder system 5 includes an encoder head 51 disposed on the first substrate stage 1, an encoder head 52 disposed on the second substrate stage 2, and a scale plate disposed on at least a part of the periphery of the optical path of the exposure light EL. 53. The scale plate 53 is disposed at a position that can face the encoder heads 51 and 52. The scale plate 53 is disposed in each of the exposure station ST1 and the measurement station ST2. The encoder heads 51 and 52 of the first and second substrate stages 1 and 2 arranged in the exposure station ST1 can face the lower surface of the scale plate 53 arranged in the exposure station ST1. Similarly, the encoder heads 51 and 52 of the first and second substrate stages 1 and 2 disposed in the measurement station ST2 can face the lower surface of the scale plate 53 disposed in the measurement station ST2. An example of an encoder system including an encoder head and a scale plate (grid plate) arranged on a substrate stage is disclosed in US Patent Application Publication No. 2006/0227309.

  In addition, the encoder heads 51 and 52 of the present embodiment can detect position information related to the Z-axis direction with respect to the scale plate 53 by irradiating the scale plate 53 with detection light. The control device 8 can detect position information regarding the Z-axis direction of the first and second substrate stages 1 and 2 with respect to the scale plate 53 based on the outputs of the encoder heads 51 and 52.

  A plurality of encoder heads 51 are arranged around the substrate P held by the first substrate stage 1. Similarly, a plurality of encoder heads 52 are arranged around the substrate P held by the second substrate stage 2. In the present embodiment, a plurality of encoder heads 51 are arranged on the side surface of the first substrate stage 1. Similarly, a plurality of encoder heads 52 are arranged on the side surface of the second substrate stage 2.

  The encoder system 5 can measure the position information of the first substrate stage 1 in the XY plane by the encoder head 51 and a scale plate (grid plate) 53 including a two-dimensional lattice. The encoder system 5 performs the measurement operation with the plurality of encoder heads 51 and the scale plate 53 facing each other, and based on the measurement results of the plurality of encoder heads 51, the X-axis and Y-axis of the first substrate stage 1. It is possible to measure position information regarding the three directions of the axis and the θZ direction. Similarly, the encoder system 5 can measure the position information of the second substrate stage 2 in the XY plane with the encoder head 52 and a scale plate (grid plate) 53 including a two-dimensional lattice. The encoder system 5 performs the measurement operation with the plurality of encoder heads 52 and the scale plate 53 facing each other, and based on the measurement results of the plurality of encoder heads 52, the X-axis, Y-axis of the second substrate stage 2. It is possible to measure position information regarding the three directions of the axis and the θZ direction.

  The scale plate 53 is formed of the same material such as ceramics or low expansion glass. The scale plate 53 includes a reflective diffraction grating. The diffraction grating includes a two-dimensional grating that is periodic in the X-axis direction and the Y-axis direction. The diffraction grating is disposed on the lower surface of the scale plate 53 that can face the encoder heads 51 and 52. In the present embodiment, the lower surface of the scale plate 53 is substantially parallel to the XY plane.

  In the present embodiment, the exposure apparatus EX includes a first support device 18 that supports the scale plate 53 separately from the projection optical system PL. The first support device 18 includes a flexible structure 20 that supports the scale plate 53 in a suspended manner and a base frame 12 that supports the flexible structure 20 as disclosed in, for example, WO 2007/040254. The flexible structure 20 includes a measurement frame 21 that supports the scale plate 53, a plurality of suspension members 22 that suspend and support the measurement frame 21, and a prevention frame that is disposed between each of the base frame 12 and the suspension member 22. And a vibration device 23.

  The measurement frame 21 is a plate-like member. The measurement frame 21 has an opening 21K. The projection optical system PL is disposed inside the opening 21K. The measurement frame 21 and the projection optical system PL are separated from each other. That is, the inner surface of the opening 21K of the measurement frame 21 and the projection optical system PL are not in contact with each other.

  The scale plate 53 is supported by the measurement frame 21 via the support member 54. The support member 54 is connected to the lower surface of the measurement frame 21. The measurement frame 21 supports at least a part of the scale plate 53 via the support member 54. The measurement frame 21 supports the scale plate 53 so that the lower surface of the scale plate 53 and the XY plane are substantially parallel.

  The hanging member 22 is, for example, a chain. The hanging member 22 may be a wire or a rod having a flexure structure at the upper and lower ends. The upper end of the suspension member 22 is connected to the base frame 12 via the vibration isolator 23. The lower end of the suspension member 22 is connected to the measurement frame 21. Thus, in the present embodiment, the measurement frame 21 that supports the scale plate 53 is supported by being suspended from the base frame 12 via the suspension member 22 in a non-contact state with the projection optical system PL.

  In the present embodiment, at least a part of the alignment system 6 and at least a part of the focus / leveling detection system 7 are also supported by the measurement frame 21.

  In addition, the exposure apparatus EX includes a second support device 19 that supports the projection optical system PL. The second support device 19 includes a flexible structure 24 that suspends and supports the projection optical system PL as disclosed in, for example, WO 2007/040254 pamphlet. The flexible structure 24 is supported by the base frame 12. The flexible structure 24 includes a lens barrel 25 that holds the optical elements of the projection optical system PL, a plurality of suspending members 27 that suspend and support a flange 26 of the lens barrel 25, and each of the base frame 12 and the suspending member 27. And an anti-vibration device 28 disposed between them.

  In the present embodiment, the scale plate 53 is disposed on at least a part of the periphery of the first optical element 15. In the present embodiment, the exposure apparatus EX includes a detection system 30 that detects the positional relationship between the first optical element 15 and the scale plate 53. The detection system 30 detects the positional relationship between the first optical element 15 and the scale plate 53 in the XY plane. In the present embodiment, the detection system 30 includes a sensor 31 that is disposed on the scale plate 53 and can detect the relative position between the first optical element 15 and the scale plate 53. In the present embodiment, the detection system 30 optically detects the positional relationship between the first optical element 15 and the scale plate 53, and the sensor 31 includes an emission unit that emits detection light. In the present embodiment, a reflecting member 32 having a reflecting surface capable of reflecting the detection light emitted from the sensor 31 is disposed on the side surface of the first optical element 15. The detection system 30 includes a laser interferometer, optically detects the position information of the reflecting member 32, and detects the position information of the first optical element 15 in the XY plane. Note that the sensor 31 may be disposed on the first optical element 15 and the reflecting member 32 may be disposed on the scale plate 53. Further, the detection system 30 may be an optical fiber interferometer system, and the sensor 31 may be a tip portion (ejecting portion) of the optical fiber cable. Further, the detection system 30 may include an electromagnetic sensor (pickup sensor). In that case, a pickup sensor is disposed on one of the first optical element 15 and the scale plate 53, and a magnetic body is disposed on the other.

  Further, the exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes the substrate P with the exposure light EL through the liquid LQ. The exposure apparatus EX includes a liquid immersion member 29 capable of forming a liquid immersion space so that the optical path of the exposure light EL emitted from the first optical element 15 is filled with the liquid LQ. The immersion space is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ. In the present embodiment, the liquid immersion member 29 includes a seal member as disclosed in, for example, US Patent Application Publication No. 2004/0165159. In the present embodiment, the liquid immersion member 29 is supported on the measurement frame 21 of the first support device 18 via the support member 33.

  The liquid immersion member 29 holds the liquid LQ between the surface of the object arranged at the irradiation position SP1 and thereby exposes the exposure light EL between the first optical element 15 and the object arranged at the irradiation position SP1. The liquid immersion space is formed so that the optical path of the liquid is filled with the liquid LQ. The object arranged at the irradiation position SP1 includes the first and second substrate stages 1 and 2 and the substrate P held by the first and second substrate stages 1 and 2. At least during exposure of the substrate P, the liquid immersion member 29 sets the liquid immersion space so that a partial region (local region) on the surface of the substrate P including the projection region PR of the projection optical system PL is covered with the liquid LQ. Form. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the substrate P in the Y axis direction with respect to the projection area PR of the projection optical system PL, and in the illumination area IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is exposed with the exposure light EL through the projection optical system PL and the liquid LQ while moving the mask M in the Y-axis direction. As a result, an image of the pattern of the mask M is projected onto the substrate P.

The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 3 is movable in the guide surface 14G of the second base member 14 including the illumination region IR while holding the mask M. The guide surface 14G is substantially parallel to the XY plane. In the present embodiment, the mask stage 3 is movable in three directions of the X axis, the Y axis, and the θZ direction by the operation of the first drive system 41 including a planar motor. The planar motor for moving the mask stage 3 includes a magnet array disposed on the mask stage 3 and a coil array disposed on the second base member 14.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes the irradiation position SP1. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by the lens barrel 25. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Further, the exposure apparatus EX includes an imaging characteristic adjustment system 43 that adjusts the imaging characteristics of the projection optical system PL. Examples of the imaging characteristic adjustment system 43 are disclosed in, for example, US Pat. No. 4,666,273, US Pat. No. 6,235,438, and US Patent Publication No. 2005/0206850. The imaging characteristic adjustment system 43 of the present embodiment includes a drive device that can move some of the plurality of optical elements of the projection optical system PL. The driving device can move a specific optical element among the plurality of optical elements of the projection optical system PL in the optical axis direction (Z-axis direction). The drive device can tilt a specific optical element with respect to the optical axis. The imaging characteristic adjustment system 43 includes various aberrations (projection magnification, distortion, spherical aberration, etc.) and image plane position (focus position) of the projection optical system PL by moving specific optical elements of the projection optical system PL. Adjust the imaging characteristics. The imaging characteristic adjustment system 43 can adjust the irradiation position SP1 (position of the projection region PR) of the exposure light EL by moving a specific optical element of the projection optical system PL. The imaging characteristic adjustment system may include a pressure adjustment device that adjusts the pressure of the gas in the space between some of the optical elements held inside the lens barrel 25. The imaging characteristic adjustment system 43 is controlled by the control device 8.

  Position information of the mask stage 3 (mask M) is measured by an interferometer system 4 including a laser interferometer. The interferometer system 4 measures position information using a reflection mirror provided on the mask stage 3. The control device 8 operates the first drive system 41 based on the measurement result of the interferometer system 4 and executes position control of the mask stage 3 (mask M). In addition, the position information of the first and second substrate stages 1 and 2 (substrate P) in the X axis, Y axis, and θZ directions is measured by the encoder system 5, and the position information of the substrate P in the Z axis, θX, and θY directions is measured. The surface position information is detected by a focus / leveling detection system 7. The control device 8 operates the second drive system 42 based on the measurement result of the encoder system 5 and the detection result of the focus / leveling detection system 7, and positions of the first and second substrate stages 1 and 2 (substrate P). Execute control.

  FIG. 3 is a plan view showing the first substrate stage 1 holding the substrate P. FIG. As shown in FIG. 3, a plurality of encoder heads 51 are arranged on the side surface of the first substrate stage 1. Further, the first substrate stage 1 includes a measuring unit 61 that can measure the exposure light EL emitted from the first optical element 15. At least a part of the measurement unit 61 is disposed on the upper surface of the first substrate stage 1 that can face the emission surface of the first optical element 15. The measurement unit 61 includes an aerial image measurement sensor and can measure an aerial image of the projection optical system PL. The measurement unit 61 includes, for example, a transmission unit 81 that is disposed on at least a part of the upper surface of the first substrate stage 1 and that can pass the exposure light EL, and an optical sensor that can receive the exposure light EL through the transmission unit 81. including. The measuring unit 61 can measure a spatial image of the projection optical system PL and obtain position information of the irradiation position SP1 of the exposure light EL emitted from the first optical element 15 (projection position of the projection optical system PL). . The measurement unit 61 includes a reference mark 82 detected by the alignment system 6 and a reference surface 83 detected by the focus / leveling detection system 7. The second substrate stage 2 has the same configuration as the first substrate stage 1. That is, a plurality of encoder heads 52 are arranged on the side surface of the second substrate stage 2. Further, the second substrate stage 2 has a measurement unit 62 having the same configuration as the measurement unit 61 of the first substrate stage 1. The measurement unit 62 includes a transmission part 91, a reference mark 92, and a reference surface 93. As shown in FIG. 3, a plurality of shot regions S are arranged in a matrix on the substrate P.

  FIG. 4 is a plan view schematically showing the relationship between the scale plate 53 and the first optical element 15. As shown in FIG. 4, in the present embodiment, the scale plate 53 is composed of a plurality of plate members. In the present embodiment, four scale plates 53 are arranged around the first optical element 15. A plurality of sensors 31 are arranged with respect to one scale plate 53. In the present embodiment, at least a first sensor 31 having a measurement axis as an X axis and a second sensor 31 having a measurement axis as a Y axis are arranged with respect to one scale plate 53. Although not shown in detail, a plurality of sensors 31 having the X axis (or Y axis) as a measurement axis are arranged for one scale plate 53. Thereby, the detection system 30 can detect the positional relationship between the first optical element 15 and the scale plate 53 with respect to the X-axis, Y-axis, and θZ directions.

  Further, the exposure apparatus EX of the present embodiment includes a positioning device 70 that positions the projection optical system PL in a non-contact manner. The positioning device 70 positions the projection optical system PL in order to suppress a change in the relative position between the projection optical system PL and the base frame 12. In the present embodiment, the positioning device 70 positions the projection optical system PL with respect to the base frame 12.

  FIG. 5 is a view for explaining the positioning device 70 and is a plan view schematically showing a part of the measurement frame 21 and the projection optical system PL. The positioning device 70 includes a detection device 71 that measures position information of the projection optical system PL with respect to the base frame 12, and a drive device that can move the projection optical system PL relative to the base frame 12 based on the measurement result of the detection device 71. 72.

  The drive device 72 includes first, second, and third drive units 72A, 72B, and 72C that are disposed around the flange 26. Each of the first to third drive units 72A to 72C is disposed on each of the arm portions 76A to 76C supported by the base frame 12 via the columns 75A to 75C. That is, each of the first to third drive units 72A to 72C is supported by the base frame 12 via the arm portions 76A to 76C and the columns 75A to 75C. The positional relationship between the base frame 12 and the arm portions 76A to 76C is fixed.

  The first drive unit 72A includes an actuator 73A that can move the flange 26 in the Z-axis direction with respect to the arm portion 76A, and an actuator 74A that can move the flange 26 in the circumferential direction (θZ direction). Similarly, the second drive unit 72B has actuators 73B and 74B that can move the flange 26 in the Z-axis direction and the θZ direction with respect to the arm portion 76B, and the third drive unit 72C is in relation to the arm portion 76C. Actuators 73C and 74C that can move the flange 26 in the Z-axis direction and the θZ direction are provided. In the present embodiment, the actuators 73A to 73C and 74A to 74C are non-contact electromagnetic actuators such as a voice coil motor or an EI core system. The driving device 72 including the first to third driving units 72A to 72C is configured to connect the projection optical system PL to the arms 76A to 76C (base frame 12) with the X axis, Y axis, Z axis, θX, θY, And 6 directions of θZ direction.

  The detection device 71 includes first, second, and third acceleration sensors 71A, 71B, and 71C disposed on the flange 26. Each of the first to third acceleration sensors 71A to 71C is a biaxial acceleration sensor. The detection device 71 including the first to third acceleration sensors 71A to 71C can detect acceleration information of the projection optical system PL regarding six directions of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. .

  Detection results of the detection device 71 including the first to third acceleration sensors 71 </ b> A to 71 </ b> C are output to the control device 8. The control device 8 can obtain position information (displacement information) of the projection optical system PL with respect to the base frame 12 based on the detection result (acceleration information) of the detection device 71. Based on the detection result of the detection device 71, the control device 8 controls the drive device 72 so that the position of the projection optical system PL with respect to the base frame 12 does not change. That is, the control device 8 controls the drive device 72 based on the detection result of the detection device 71 so that the positional relationship between the base frame 12 and the projection optical system PL is fixed.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described with reference to the flowchart of FIG.

  In the present embodiment, for example, when the first substrate stage 1 is disposed at the exposure station ST1, the second substrate stage 2 is disposed at the measurement station ST2. For example, when the exposure processing of the substrate P held on the first substrate stage 1 existing in the exposure station ST1 is being executed, the substrate P before exposure held on the second substrate stage 2 existing in the measurement station ST2 is executed. Position information measurement processing is executed. The position information of the substrate P includes alignment information of the substrate P with respect to a detection reference (reference position) of the alignment system 6 (position information of each shot area S of the substrate P in the X axis, Y axis, and θZ directions), and a predetermined reference. It includes at least one of position information of the surface of the substrate P with respect to the surface (position information in the Z-axis, θX, and θY directions).

  The control device 8 starts replacement of the substrate P and predetermined measurement processing at the measurement station ST2. For example, the control device 8 arranges the second substrate stage 2 at the substrate exchange position of the measurement station ST2, and loads the substrate P before exposure onto the second substrate stage 2 using a transfer system (not shown). And the control apparatus 8 starts the measurement process of the positional information on the board | substrate P in measurement station ST2. On the other hand, the first substrate stage 1 is arranged at the exposure station ST1, and the exposure processing of the substrate P after the measurement processing at the measurement station ST2 is started.

  In the present embodiment, the measurement processing of the position information of the substrate P in the measurement station ST <b> 2 includes a detection operation using the alignment system 6 and the focus / leveling detection system 7. The control device 8 moves the second substrate stage 2 in the XY directions at the measurement station ST <b> 2 and arranges the measurement unit 62 of the second substrate stage 2 in the detection region of the alignment system 6. The control device 8 measures the position information of the second substrate stage 2 in the XY plane using the encoder system 5 (encoder head 52), and uses the alignment system 6 to measure the reference mark 92 of the measuring unit 62. Is detected (step SA1). The control device 8 derives position information of the reference mark 92 in the XY plane of the coordinate system defined by the encoder system 5 based on the measurement result of the encoder system 5 and the detection result of the alignment system 6.

  In addition, the control device 8 uses the focus / leveling detection system 7 to measure the position information of the second substrate stage 2 in the Z-axis direction using the encoder head 52 at the measurement station ST <b> 2. The reference plane 93 is detected (step SA2). Based on the measurement result of the encoder head 52 and the detection result of the focus / leveling detection system 7, the control device 8 is in the Z axis, θX, and θY directions of the coordinate system defined by the encoder system 5 (encoder head 52). The position information of the reference plane 93 is derived.

  Further, the control device 8 uses the encoder system 5 to measure the position information of the second substrate stage 2 in the XY plane at the measurement station ST2, and holds it on the second substrate stage 2 using the alignment system 6. The alignment mark of the substrate P that has been processed is detected (step SA3). The control device 8 derives the position information of the alignment mark in the XY plane of the coordinate system defined by the encoder system 5 based on the measurement result of the encoder system 5 and the detection result of the alignment system 6.

  In addition, the control device 8 uses the focus / leveling detection system 7 to measure the position information of the second substrate stage 2 in the Z-axis direction using the encoder head 52 at the measurement station ST2, and uses the second substrate stage 2 to measure the position information. 2 detects position information of the surface of the substrate P held by 2 (step SA4). Based on the measurement result of the encoder head 52 and the detection result of the focus / leveling detection system 7, the control device 8 is in the Z axis, θX, and θY directions of the coordinate system defined by the encoder system 5 (encoder head 52). Position information on the surface of the substrate P is derived.

  The control device 8 determines each shot of the substrate P with respect to the detection reference (reference position) of the alignment system 6 defined based on the detection result of step SA1 based on the position information of the alignment mark of the substrate P detected in step SA3. Area position information (array information) is derived by arithmetic processing (step SA5).

  In the present embodiment, the control device 8 selects a part of the shot areas (for example, about 8 to 16) from the plurality of shot areas of the substrate P as the alignment shot area, and sets the selected shot area as the selected shot area. Corresponding alignment marks are detected using the alignment system 6. Then, the control device 8 derives the arrangement information of each shot region of the substrate P by statistically calculating the position information of the detected alignment mark as disclosed in, for example, US Pat. No. 4,780,617. , EGA (Enhanced Global Alignment) processing is executed. Thereby, the control device 8 can derive the arrangement information of each shot region of the substrate P in the XY plane.

  Further, the control device 8 derives an approximate plane (approximate surface) of each shot region on the surface of the substrate P with respect to the reference plane 93 based on the position information of the surface of the substrate P detected in step SA4 (step SA6).

  When the processing at the exposure station ST1 and the processing at the measurement station ST2 are completed, the control device 8 moves the first substrate stage 1 to the measurement station ST2 and moves the second substrate stage 2 to the exposure station ST1. The control device 8 moves the first substrate stage 1 holding the exposed substrate P to the measurement station ST2, and then unloads the substrate P on the first substrate stage 1 using the transport system. Then, the substrate P before exposure is loaded onto the first substrate stage 1 of the measurement station ST2, and measurement processing including the above-described steps SA1 to SA6 is performed.

  The control device 8 moves the second substrate stage 2 holding the substrate P subjected to measurement processing in the measurement station ST2 to the exposure station ST1, and then moves the second substrate stage 2 in the exposure station ST1 to perform projection. The measurement unit 62 of the second substrate stage 2 is arranged in the projection region PR of the optical system PL.

  The position and orientation of the second substrate stage 2 are controlled so that the image plane of the projection optical system PL formed via the liquid LQ and the reference plane 93 substantially coincide. Thereby, the relationship between the detection value of the encoder head 52, the image plane of the projection optical system PL formed via the liquid LQ, and the reference plane 93 is defined. The control device 8 derives the relationship between the approximate plane of the substrate P derived in step SA6, the detection value of the encoder head 52, and the image plane of the projection optical system PL formed via the liquid LQ (step SA7). ).

  Then, the control device 8 uses the encoder system 5 to measure the position information of the second substrate stage 2 in the XY plane, and uses the transmission unit 91 and the optical sensor of the measurement unit 62 to align the alignment mark of the mask M. Are detected via the liquid LQ (step SA8). That is, the control device 8 makes the projection optical system PL and the measurement unit 62 face each other, and fills the optical path between the first optical element 15 of the projection optical system PL and the measurement unit 62 with the liquid LQ, and then mask M The alignment mark is illuminated with the exposure light EL. Thereby, the aerial image of the alignment mark of the mask M is projected onto the measurement unit 62 via the projection optical system PL and the liquid LQ. The optical sensor of the measuring unit 62 measures the aerial image of the alignment mark on the mask M via the liquid LQ. The control device 8 derives position information of the aerial image in the XY plane of the coordinate system defined by the encoder system 5 based on the measurement result of the encoder system 5 and the measurement result of the measurement unit 62 (optical sensor). The position of the aerial image is the position of the projection region PR, and is the irradiation position SP1 of the exposure light EL.

  The pattern of the mask M and the alignment mark are formed in a predetermined positional relationship. Further, the positional relationship between the reference mark 92 of the measurement unit 62 and the transmission unit 91 (light sensor) is known. The control device 8 derives the positional relationship between the reference position in the XY plane of the coordinate system defined by the encoder system 5 and the irradiation position SP1 based on the measurement result of step SA8 (step SA9).

  The control device 8 obtains the positional relationship between the reference position in the XY plane of the coordinate system defined by the encoder system 5 and each shot area S of the substrate P obtained in step SA5 (array information of the shot area S with respect to the reference position). Based on the positional relationship between the reference position in the XY plane of the coordinate system defined by the encoder system 5 and the irradiation position SP1 obtained in step SA9, the coordinate system in the XY plane defined by the encoder system 5 The relationship between each shot area of the substrate P and the irradiation position SP1 is derived (step SA10).

  Further, the control device 8 is based on the detected value of the encoder head 52 associated with the approximate plane of the substrate P and the image plane of the projection optical system PL formed through the liquid LQ obtained in step SA7. While adjusting the position of the surface (exposure surface) of the substrate P, the position of the substrate P in the XY plane is determined based on the positional relationship between each shot region of the substrate P in the XY plane and the irradiation position SP1 obtained in step SA10. The position is controlled, and each shot area S of the substrate P is sequentially exposed (step SA11).

  After the exposure process of the substrate P on the second substrate stage 2 is completed, the control device 8 moves the second substrate stage 2 of the exposure station ST1 to the measurement station ST2, and the substrate P that has completed the measurement process at the measurement station ST2. Is moved to the exposure station ST1. The control device 8 unloads the exposed substrate P held on the second substrate stage 2 moved to the measurement station ST2 by using the transport system.

  By repeating the above procedure, the first substrate stage 1 and the second substrate stage 2 are alternately put into the exposure station ST1, and a plurality of substrates P are sequentially exposed.

  In the present embodiment, the scale plate 53 is supported by the first support device 18, and the first optical element 15 is separated from the scale plate 53 and supported by the second support device 19. In this case, the relative position between the first optical element 15 and the scale plate 53 may change, and the relative position between the irradiation position SP1 and the scale plate 53 may change. In the present embodiment, the positioning device 70 may change the position of the first optical element 15 (projection optical system PL) with respect to the base frame 12. Even in this case, the relative position between the first optical element 15 and the scale plate 53 may change. When the relative position between the first optical element 15 and the scale plate 53 changes, the measurement accuracy of the encoder system 5 decreases, and as a result, exposure failure may occur.

  Therefore, in the present embodiment, the control device 8 uses the detection system 30 to detect the positional relationship between the first optical element 15 and the scale plate 53, and based on the detection result, the measurement result of the encoder system 5 is detected. Correct. Then, the control device 8 controls the movement of the first and second substrate stages 1 and 2 based on the corrected measurement result of the encoder system 5.

  In the present embodiment, when the processing for the first and second substrate stages 1 and 2 in the exposure station ST1 and the measurement station ST2 is being performed, the detection system 30 positions the first optical element 15 and the scale plate 53. Detect (monitor) the relationship. Specifically, the detection system 30 determines the positional relationship between the first optical element 15 and the scale plate 53 at least when the alignment mark of the substrate P is detected at the measurement station ST2 and when the substrate P is exposed at the exposure station ST1. To detect.

  For example, when the exposure process of the substrate P held on the second substrate stage 2 is being performed at the exposure station ST1, the control device 8 is connected to the first optical element 15 based on the detection result of the detection system 30. When it is determined that the positional relationship with the scale plate 53 has changed, the measurement result output from the encoder system 5 is corrected based on the detection result. For example, the control device 8 determines that the scale plate 53 is displaced by a predetermined amount in a predetermined direction (for example, the Y-axis direction) in the XY plane with respect to the first optical element 15 based on the detection result of the detection system 30. At this time, the measurement result output from the encoder system 5 is corrected according to a predetermined amount. Then, the control device 8 performs the exposure of the substrate P held on the second substrate stage 2 while controlling the movement of the second substrate stage 2 based on the measurement result of the corrected encoder system 5. To do. Thereby, at the time of exposure of the substrate P, the positional relationship between the irradiation position SP1 and the shot area S of the substrate P is corrected, and the control device 8 arranges the shot area S of the substrate P at a desired position with respect to the irradiation position SP1. In this state, the shot area S can be exposed.

  Further, instead of correcting the measurement result of the encoder system 5, the control device 8 can correct the driving amount by the second driving system 42 for moving the second substrate stage 2. In the present embodiment, the control device 8 moves the second substrate stage 2 by generating a predetermined drive amount from the second drive system 42 based on the measurement result of the encoder system 5. Therefore, the control device 8 corrects the drive amount of the second drive system 42 for moving the second substrate stage 2 based on the detection result of the detection system 30, so that the irradiation position SP <b> 1 is exposed when the substrate P is exposed. And the positional relationship between the shot region S of the substrate P can be corrected.

  Note that the control device 8 may correct both the measurement result of the encoder system 5 and the drive amount by the second drive system 42 based on the detection result of the detection system 30.

  Further, the control device 8 applies the second substrate stage 2 to the detection result of the detection system 30 when the alignment system 6 detects the alignment mark of the substrate P held on the second substrate stage 2. When the detection result of the detection system 30 when performing exposure of the held substrate P changes, the detection result of the alignment system 6 can be corrected based on the detection result of the detection system 30. That is, when the alignment mark of the substrate P on the second substrate stage 2 is detected using the alignment system 6 at the measurement station ST2, and when the substrate P on the second substrate stage 2 is exposed at the exposure station ST1. Thus, when the positional relationship between the first optical element 15 and the scale plate 53 varies, the control device 8 corrects the detection result of the alignment system 6 based on the detection result of the detection system 30. The correction of the detection result of the alignment system 6 includes the correction of the arrangement information of each shot area S derived by the arithmetic processing in step SA5.

  Based on the detection result of the detection system 30, the control device 8 determines that the position of the scale plate 53 in the XY plane when the substrate P is exposed is relative to the position of the scale plate 53 in the XY plane when detecting the alignment mark. When it is determined that the predetermined amount is displaced in the predetermined direction, the detection result of the alignment system 6 (arrangement information of the shot area S derived by the EGA process) is corrected according to the predetermined amount. Then, the control device 8 is held by the second substrate stage 2 while controlling the movement of the second substrate stage 2 based on the detection result of the corrected alignment system 6 (array information of the shot area S). The exposure of the substrate P is executed.

  For example, when the alignment mark on the substrate P is detected using the alignment system 6, it is determined that the positional relationship between the first optical element 15 and the scale plate 53 has changed based on the detection result of the detection system 30. Then, the control device 8 can correct the detection result (alignment mark position information) of the alignment system 6 based on the detection result. The control device 8 can correct the positional relationship between the irradiation position SP1 of the exposure light EL and the shot area S when the substrate P is exposed based on the corrected position information of the alignment mark.

  In step SA9, when the positional relationship (baseline information) between the detection reference (reference position) of the alignment system 6 and the irradiation position SP1 is derived, the first optical element 15 is based on the detection result of the detection system 30. When it is determined that the positional relationship between the scale plate 53 and the scale plate 53 has changed, the control device 8 corrects the positional relationship (baseline information) between the detection reference (reference position) and the irradiation position SP1 based on the detection result. be able to. Then, the control device 8 can correct the positional relationship between the irradiation position SP1 of the exposure light EL and the shot area S when the substrate P is exposed based on the corrected baseline information.

  Further, the control device 8 can correct the irradiation position SP1 of the exposure light EL using the imaging characteristic adjustment system 43 based on the detection result of the detection system 30. For example, when it is determined that the scale plate 53 is displaced by a predetermined amount in a predetermined direction in the XY plane with respect to the first optical element 15, the control device 8 uses the imaging characteristic adjustment system 43 to set the irradiation position SP 1. Then, correction (shift) is performed according to a predetermined amount. And the control apparatus 8 performs exposure of the board | substrate P with the exposure light EL irradiated to irradiation position SP1 after the correction | amendment. Thereby, the positional relationship between the irradiation position SP1 and the shot area S of the substrate P is corrected when the substrate P is exposed.

  Further, the control device 8 can also correct the drive amount by the first drive system 41 for moving the mask stage 3 based on the detection result of the detection system 30. Also by doing so, the control device 8 can project the pattern image of the mask M onto the shot region S of the substrate P in a desired positional relationship.

  As described above, according to this embodiment, for example, even when the position of the scale plate 53 changes, the encoder system 5 is used to measure the position information of the first and second substrate stages 1 and 2, An image of the pattern of the mask M can be projected onto the shot region S of the substrate P with a desired positional relationship, and the occurrence of exposure failure can be suppressed.

  Further, according to the present embodiment, since the measurement frame 21 and the projection optical system PL are separated, for example, the vibration of the measurement frame 21 is suppressed from being transmitted to the projection optical system PL. In the present embodiment, the measurement frame 21 is a focus for detecting positional information (positional relationship) of the upper surfaces (surfaces of the substrate P) of the first and second substrate stages 1 and 2 with respect to the image plane of the projection optical system PL. -The leveling detection system 7 is supported. Even when the focus / leveling detection system 7 includes, for example, a vibrator or the like, the vibration of the measurement frame 21 is suppressed from being transmitted to the projection optical system PL. Further, even when the focus / leveling detection system 7 includes, for example, a light source, a light receiving element, and the like, the heat of the measurement frame 21 is suppressed from being transmitted to the projection optical system PL. The measurement frame 21 supports the alignment system 6 for detecting the positional information (positional relationship) of the first and second substrate stages 1 and 2 (substrate P) with respect to the projection region PR of the projection optical system PL. Yes. Even when the alignment system 6 includes a light source, a light receiving element, and the like, for example, the heat of the measurement frame 12 is suppressed from being transmitted to the projection optical system PL.

  In addition, according to the present embodiment, the measurement frame 21 is suspended and supported by the base frame 12, and vibrations when the mask stage 3 and the first and second substrate stages 1 and 2 move, or the floor surface FL. The vibration from the (base frame 12) is suppressed from being transmitted to the measurement frame 21.

  Further, according to the present embodiment, the projection optical system PL is suspended and supported by the base frame 12, and vibration when the mask stage 3 and the first and second substrate stages 1 and 2 move, or the floor surface Transmission of vibration from the FL (base frame 12) to the projection optical system PL is suppressed.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area of the substrate is formed by one scanning exposure. The present invention can be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also includes a substrate stage that holds and moves the substrate P as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113, and the like. In addition, the present invention can also be applied to an exposure apparatus equipped with a movable measuring stage equipped with a measuring instrument (measuring member) capable of executing predetermined measurement related to exposure.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. Examples of self-luminous image display elements include CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display). And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 7, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 1 ... 1st substrate stage, 2 ... 2nd substrate stage, 5 ... Encoder system, 6 ... Alignment system, 7 ... Focus leveling detection system, 8 ... Control apparatus, 12 ... Base frame, 15 ... 1st optical element, 18 DESCRIPTION OF SYMBOLS 1st support apparatus, 19 ... 2nd support apparatus, 20 ... Flexible structure, 21 ... Measurement frame, 29 ... Liquid immersion member, 30 ... Detection system, 31 ... Sensor, 41 ... 1st drive system, 42 ... 2nd drive System: 43 ... Imaging characteristic adjustment system, 51 ... Encoder head, 52 ... Encoder head, 53 ... Scale plate, 70 ... Positioning device, 71 ... Detection device, 72 ... Drive device, EL ... Exposure light, EX ... Exposure device, P: Substrate, SP1: Irradiation position, SP2: Measurement position, ST1: Exposure station, ST2: Measurement station

Claims (25)

An exposure apparatus that exposes a substrate with exposure light via a projection optical system,
A base frame that supports the projection optical system;
A base member having an upper surface disposed substantially parallel to a predetermined surface orthogonal to the optical axis of the projection optical system;
A stage disposed on the base member and holding the substrate;
A drive system for driving the stage;
A plurality of scale members disposed in an exposure station where the substrate is exposed via the projection optical system, each having a reflective two-dimensional grating;
A measurement frame supported by the base frame and fixed to the lower surface side so that each of the plurality of scale members is substantially parallel to the predetermined surface;
A measurement system that is arranged on the stage and includes a plurality of encoder heads that can respectively face the plurality of scale members, and measures position information of the stage;
An exposure apparatus comprising: a control system that controls driving of the stage by the drive system based on the measured position information.  2. The exposure apparatus according to claim 1, wherein the plurality of scale members are fixed to the measurement frame so as to be disposed at least at a part of the periphery of the optical path of the exposure light.  The exposure apparatus according to claim 1, wherein the measurement frame is formed with an opening in which the projection optical system is disposed at a part thereof.  The exposure apparatus according to claim 1, wherein the measurement frame is supported by the base frame via a flexure.  The exposure apparatus according to claim 1, wherein the measurement frame is supported by the base frame via a vibration isolator.  The exposure apparatus according to any one of claims 1 to 5, wherein the measurement frame is supported by being suspended from the base frame via a plurality of support members connected to the base frame.  The exposure apparatus according to claim 6, wherein each of the plurality of support members has a flexure.  The exposure apparatus according to claim 1, wherein the plurality of encoder heads are arranged around a substrate held on the stage.  The exposure apparatus according to claim 1, wherein the plurality of encoder heads are arranged on a side surface of the stage.  The exposure apparatus according to any one of claims 1 to 9, wherein the plurality of encoder heads are provided on the stage so as to be positioned outside an upper surface of the stage. A detector that is disposed in a measurement station different from the exposure station and that is at least partially supported by the base frame and measures the substrate;
A scale member disposed in the measurement station and having a reflective two-dimensional grating, and
The exposure apparatus according to claim 1, wherein position information of the stage is measured by the measurement system during the measurement operation of the substrate by the detection device. The detection device includes a first detection system for detecting a mark on the substrate,
The exposure apparatus according to claim 11, wherein position information of the stage in the predetermined plane is measured by the measurement system during the measurement operation of the substrate by the first detection system. The detection device includes a second detection system that detects positional information of the substrate with respect to a direction orthogonal to the predetermined plane,
The exposure apparatus according to claim 11 or 12, wherein position information of the stage in a direction orthogonal to the predetermined plane is measured by the measurement system during the measurement operation of the substrate by the second detection system. The stage on which the substrate is measured by the detection device is moved to the exposure station,
The control system is based on a measurement result of the detection device and position information measured by the measurement system in order to control the position of the substrate in the predetermined plane while adjusting the surface position of the substrate. The exposure apparatus according to any one of claims 11 to 13, which controls driving of the stage by the driving system. Comprising at least two stages provided with the plurality of encoder heads;
The position information is measured by the measurement system for each of the stage disposed at the exposure station and the substrate is exposed and the stage disposed at the measurement station and the substrate is measured. The exposure apparatus according to any one of the above. An immersion member capable of forming an immersion space so that the optical path of the exposure light emitted from the projection optical system is filled with liquid;
The exposure apparatus according to claim 1, wherein the plurality of scale members are arranged around an optical element of the projection optical system in contact with the liquid. The liquid immersion member forms the liquid immersion space so that a part of the substrate is covered with the liquid including a projection area of the projection optical system irradiated with the exposure light,
The exposure apparatus according to claim 16, wherein the substrate is exposed with the exposure light through the projection optical system and the liquid. A measurement unit having a light transmission unit disposed on the upper surface of the stage;
The exposure apparatus according to claim 16 or 17, wherein the measurement unit detects the exposure light through the projection optical system, the liquid, and the light transmission unit.   The exposure apparatus according to claim 1, wherein the projection optical system and the measurement frame are separated from each other.   The exposure apparatus according to claim 1, wherein the projection optical system is supported by the base frame via a vibration isolator.   The exposure apparatus according to any one of claims 1 to 20, further comprising a positioning device that is capable of moving the projection optical system with respect to the base frame and positions the projection optical system. The positioning device has a drive device capable of moving the projection optical system with respect to the base frame,
The exposure apparatus according to claim 21, wherein the driving device is supported by the base frame. A detection device for detecting position information of the projection optical system with respect to the base frame;
The exposure apparatus according to claim 21 or 22, wherein the positioning device moves the projection optical system based on a detection result of the detection device.   The exposure apparatus according to any one of claims 1 to 23, further comprising a detection system that detects a positional relationship between the projection optical system and the scale member in the predetermined plane. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 24;
Developing the exposed substrate; and a device manufacturing method.

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