JP2009281946A - Equipment and method for measuring position, system and method for forming pattern, system and method for exposure and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for measuring a position which can suppress lowering of the accuracy in measurement of positional information on a moving object. <P>SOLUTION: The position measuring equipment measures the positional information on the moving body which moves within a plane of movement. The equipment has a scale plate including a diffraction grating of which the position is fixed, an encoder head which includes at least a part of a photoconducting optical system conducting supplied light to the scale plate and which is disposed on the moving body, and a light source which emits light at a position apart from the moving body and supplies the light to the photoconducting optical system. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a position measuring apparatus and a position measuring method for measuring position information of a moving body, a pattern forming apparatus and a pattern forming method for forming a pattern on a substrate, an exposure apparatus and an exposure method for exposing a substrate, and a device manufacturing method.

In the manufacturing process of a micro device such as a semiconductor device or an electronic device, a pattern forming apparatus that forms a device pattern on a substrate, such as an exposure apparatus or an inkjet apparatus, is used. The pattern forming apparatus includes a moving body such as a substrate stage that moves while holding the substrate, and forms a device pattern on the substrate while measuring position information of the moving body with the position measuring device. The following patent document discloses an example of a technique for measuring position information of a moving body using an encoder system.
US Patent Application Publication No. 2006/0227309

  The encoder system irradiates the scale plate with light emitted from the light source, and the light passing through the scale plate is detected by a detector. For example, if the temperature fluctuation (refractive index fluctuation) of the atmosphere on the optical path occurs due to the heat of the light source or the like, there is a possibility that the position information of the moving body cannot be accurately measured. Further, when the moving body is thermally deformed by heat, there is a possibility that the position information of the moving body cannot be accurately measured, or the moving performance of the moving body may be deteriorated. As a result, pattern formation defects such as pattern defects may occur, and defective devices may occur.

  An object of an aspect of the present invention is to provide a position measurement device and a position measurement method that can suppress a decrease in measurement accuracy of position information of a moving object. Another object of the present invention is to provide a pattern forming apparatus and a pattern forming method capable of suppressing pattern formation defects. Another object of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided a position measuring device for measuring position information of a moving body that moves in a moving surface, wherein a scale plate including a diffraction grating having a fixed position, and supplied light An encoder head disposed on the movable body including at least a part of the light guide optical system that leads to the scale plate; and a light source that emits light at a position away from the movable body and supplies the light to the light guide optical system. A position measuring device is provided.

  According to a second aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern on a substrate, wherein the position information of a movable body that is movable while holding the substrate is measured. A pattern forming apparatus including a position measuring device is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, wherein the position information of the movable body that is movable while holding the substrate is measured. An exposure apparatus including a position measurement device is provided.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the third aspect described above and developing the exposed substrate.

  According to a fifth aspect of the present invention, there is provided a position measurement method for measuring position information of a moving body that moves in a moving plane, wherein a scale plate including a diffraction grating is fixed at a position that can face the moving body. And arranging an encoder head including at least a part of a light guide optical system for guiding the supplied light to the scale plate, and emitting light from a light source arranged at a position away from the movable body, A position measuring method including supplying to a light guide optical system.

  According to a sixth aspect of the present invention, there is provided a pattern forming method for forming a pattern on a substrate, the position information of a movable body that is movable while holding the substrate, and the position measuring method according to the fifth aspect described above. There is provided a pattern forming method including measuring using and forming a pattern on a substrate held by a moving body.

  According to the seventh aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light, the position information of a movable body that is movable while holding the substrate, and the position measurement method according to the fifth aspect described above. An exposure method is provided that includes measuring using and exposing a substrate held on a moving body.

  According to an eighth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the seventh aspect described above and developing the exposed substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the fall of the measurement accuracy of the positional information on a moving body can be suppressed, and the pattern formation defect of the board | substrate hold | maintained at the moving body and the exposure defect can be suppressed. Therefore, generation | occurrence | production of a defective device can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the present embodiment. In the present embodiment, the exposure apparatus EX includes, for example, US Pat. No. 6,341,007, US Pat. No. 6,400,491, US Pat. No. 6,549,269, US Pat. US Pat. No. 6,262,796, US Pat. No. 6,674,510, US Pat. No. 6,208,407, US Pat. No. 6,710,849, US Pat. A case where the exposure apparatus is a twin stage type exposure apparatus including a plurality (two) of substrate stages 1 and 2 that can move while holding the substrate P will be described as an example. That is, in the present embodiment, the exposure apparatus EX includes a first substrate stage 1 that can move while holding the substrate P, and a second substrate that can move while holding the substrate P independently of the first substrate stage 1. And a substrate stage 2.

  In FIG. 1, an exposure apparatus EX includes a mask stage 3 that can move while holding a mask M, a first substrate stage 1 that can move while holding a substrate P, and a substrate that is independent of the first substrate stage 1. A second substrate stage 2 that is movable while holding P, a mask stage drive system 4 that moves the mask stage 3, a substrate stage drive system 5 that moves the first substrate stage 1 and the second substrate stage 2, An interferometer system 6 including a plate member 12 having a guide surface 11 that movably supports the first substrate stage 1 and the second substrate stage 2, a laser interferometer that measures position information of the mask stage 3, and a first substrate stage A position measuring device 60 including an encoder system 50 that measures position information of the first and second substrate stages 2, and an illumination system IL that illuminates the mask M with the exposure light EL. And it includes a projection optical system PL which projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and a control device 7 for controlling the operation of the entire exposure apparatus EX.

  Further, the exposure apparatus EX includes an exposure station ST1 having a first area SP1 including a first position irradiated with the exposure light EL, and a second position for measuring position information of the substrate P, and includes the first area SP1. And a measurement station ST2 having a second area SP2 different from the first area SP2. The exposure station ST1 exposes the substrate P. The measurement station ST2 performs predetermined measurement related to exposure and replacement of the substrate P.

  In the exposure station ST1, an illumination system IL, a mask stage 3, a projection optical system PL, and the like are arranged. Of the plurality of optical elements of the projection optical system PL, the first optical element 8 closest to the image plane of the projection optical system PL has an emission surface (lower surface) for emitting the exposure light EL. The first position where the exposure light EL is irradiated includes a position facing the first optical element 8 that emits the exposure light EL.

  Various measurement systems capable of performing measurement related to exposure of the substrate P, such as an alignment system 9 for acquiring position information of the substrate P and a focus / leveling detection system 10, are arranged in the measurement station ST2. The alignment system 9 has a plurality of optical elements including the second optical element 15, and acquires position information of the substrate P using these optical elements. The focus / leveling detection system 10 also includes a plurality of optical elements, and acquires position information of the substrate P using these optical elements. The second position for measuring the position information of the substrate P includes a position facing the second optical element 15.

  Each of the first and second substrate stages 1 and 2 can move while holding the substrate P within a predetermined region of the guide surface 11 including the first region SP1 and the second region SP2. In the present embodiment, the guide surface 11 is substantially parallel to the XY plane. Each of the first and second substrate stages 1 and 2 is movable along the guide surface 11 between the exposure station ST1 and the measurement station ST2.

  The position measuring device 60 includes an encoder system 50 that measures position information of the first and second substrate stages 1 and 2. The encoder system 50 includes a first encoder unit 50A that measures position information of the first substrate stage 1 and a second encoder unit 50B that measures position information of the second substrate stage 2.

  The first encoder unit 50 </ b> A includes a light source 56 that emits measurement light for measuring position information of the first substrate stage 1, and an encoder head 51 disposed on the first substrate stage 1. The second encoder unit 50 </ b> B includes a light source 58 that emits measurement light for measuring position information of the second substrate stage 2, and an encoder head 52 disposed on the second substrate stage 2. The light sources 56 and 58 emit, for example, coherent light, for example, laser light having a wavelength λ (= 850 nm). Each of the light sources 56 and 58 emits measurement light at a position away from the first and second substrate stages 1 and 2.

  The encoder system 50 includes scale plates 53 and 54 that can face the encoder heads 51 and 52 of the first and second substrate stages 1 and 2, respectively.

  The scale plate 53 is arranged at a position that can face the encoder head 51 of the first substrate stage 1 or the encoder head 52 of the second substrate stage 2 arranged at the exposure station ST1. The scale plate 53 is disposed on at least a part of the periphery of the projection optical system PL including the first optical element 8. The scale plate 53 has a lower surface 55. The scale plate 53 is disposed above the encoder heads 51 and 52 of the first and second substrate stages 1 and 2 disposed at the exposure station ST1. The encoder heads 51 and 52 can face the lower surface 55 of the scale plate 53.

  The scale plate 54 is disposed at a position that can face the encoder head 51 of the first substrate stage 1 or the encoder head 52 of the second substrate stage 2 disposed in the measurement station ST2. The scale plate 54 is disposed on at least a part of the periphery of the alignment system 9 including the second optical element 15 and the focus / leveling detection system 10. The scale plate 54 has a lower surface 57. The scale plate 54 is disposed above the encoder heads 51 and 52 of the first and second substrate stages 1 and 2 disposed in the measurement station ST2. The encoder heads 51 and 52 can face the lower surface 57 of the scale plate 54.

  In the present embodiment, the light source 56 irradiates at least one of the scale plate 53 and the scale plate 54 with measurement light via the encoder head 51 of the first substrate stage 1. The light source 58 irradiates at least one of the scale plate 53 and the scale plate 54 with measurement light via the encoder head 52 of the second substrate stage 2.

  Further, the exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes the substrate P with the exposure light EL through the liquid LQ. The exposure apparatus EX includes a nozzle member (seal member) 14 that can form an immersion space LS with the liquid LQ so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ. In this embodiment, the nozzle member 14 includes a sealing member as disclosed in, for example, US Patent Publication No. 2004/136494. The nozzle member 14 is disposed in the vicinity of the first optical element 8, and has a lower surface that can be opposed to the surface of an object disposed at a first position facing the first optical element 8. The nozzle member 14 forms an immersion space LS so that the optical path of the exposure light EL between the nozzle member 14 and the object disposed at the first position facing the first optical element 8 is filled with the liquid LQ. The object disposed at the first position includes the first and second substrate stages 1 and 2 and the substrate P held by the first and second substrate stages 1 and 2. At least during exposure of the substrate P, the nozzle member 14 forms an immersion space LS so that a partial region (local region) on the surface of the substrate P including the projection region of the projection optical system PL is covered with the liquid LQ. To do. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the substrate P in the Y-axis direction with respect to the projection area of the projection optical system PL, and synchronizes with the movement of the substrate P in the Y-axis direction with respect to the illumination area of the illumination system IL. The substrate P is exposed with the exposure light EL through the projection optical system PL and the liquid LQ while moving the mask M in the Y-axis direction. As a result, an image of the pattern of the mask M is projected onto the substrate P.

  The exposure apparatus EX includes, for example, a body 19 including a column 16 disposed on a floor surface in a clean room and a support frame 18 disposed on the column 16 via a vibration isolator 17. The column 16 has a support surface 20 that supports the plate member 12 via the vibration isolator 21. The support frame 18 supports the projection optical system PL, the alignment system 9, the focus / leveling detection system 10, and the like. In the present embodiment, the support frame 18 supports the scale plates 53 and 54 of the encoder system 50.

The illumination system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage 3 is movable in three directions of the X axis, the Y axis, and the θZ direction while holding the mask M by a mask stage driving system 4 including an actuator such as a linear motor. Position information of the mask stage 3 (mask M) is measured by a laser interferometer of the interferometer system 6. The laser interferometer uses the measurement mirror 3 </ b> R provided on the mask stage 3 to measure position information regarding the three directions of the mask stage 3 including the X axis, the Y axis, and the θZ direction. The control device 7 operates the mask stage drive system 4 based on the measurement result of the interferometer system 6 to control the position of the mask stage 3 (mask M).

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. A plurality of optical elements of the projection optical system PL are held by a lens barrel. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z-axis direction. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Next, the first and second substrate stages 1 and 2 and the substrate stage driving system 5 will be described with reference to FIGS. 1 and 2. FIG. 2 is a plan view of the first and second substrate stages 1 and 2 and the substrate stage driving system 5 as viewed from above.

  The first substrate stage 1 includes a stage main body 22 and a first substrate table 23 supported by the stage main body 22 and having a substrate holder 23H to which the substrate P can be attached and detached. A support device 25 capable of forming a gas bearing is provided on the lower surface of the stage main body 22 as disclosed in, for example, WO 2006/009254. The first substrate stage 1 is supported on the guide surface 11 in a non-contact manner by a gas bearing formed by the support device 25. The first substrate stage 1 can be moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P by the substrate stage drive system 5.

  The second substrate stage 2 includes a stage main body 28 and a second substrate table 29 supported by the stage main body 28 and having a substrate holder 29H to which the substrate P can be attached and detached. A support device 31 capable of forming a gas bearing is provided on the lower surface of the stage body 28 as disclosed in, for example, WO 2006/009254. The second substrate stage 2 is supported on the guide surface 11 in a non-contact manner by a gas bearing formed by the support device 31. The second substrate stage 2 can be moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P by the substrate stage drive system 5.

  The substrate stage drive system 5 includes an actuator such as a linear motor, and can move each of the first substrate stage 1 and the second substrate stage 2. The substrate stage drive system 5 includes a plurality of linear motors 34, 35, 36, and 37. The substrate stage drive system 5 includes a pair of Y-axis guide members 38 and 39 that are long in the Y-axis direction. Each of the Y-axis guide members 38 and 39 includes a coil unit including a plurality of coils. One Y-axis guide member 38 supports the slide member 40 so as to be movable in the Y-axis direction, and the other Y-axis guide member 39 supports the slide member 41 so as to be movable in the Y-axis direction. Each of the slide members 40 and 41 includes a magnet unit including a permanent magnet. That is, in this embodiment, the moving magnet type Y-axis linear motor 34 is formed by the slide member 40 having a magnet unit and the Y-axis guide member 38 having a coil unit. Similarly, a moving magnet type Y-axis linear motor 35 is formed by a slide member 41 having a magnet unit and a Y-axis guide member 39 having a coil unit.

  The substrate stage drive system 5 includes a pair of X-axis guide members 42 and 43 that are long in the X-axis direction. Each of the X-axis guide members 42 and 43 includes a coil unit including a coil. One X-axis guide member 42 supports the stage main body 22 of the first substrate stage 1 so as to be movable in the X-axis direction, and the other X-axis guide member 43 supports the stage main body 28 of the second substrate stage 2 on the X-axis. Support to move in the direction. The stage main body 22 of the first substrate stage 1 has an opening in which the X-axis guide member 42 can be disposed, and a magnet unit having a plurality of permanent magnets is provided inside the opening. Similarly, the stage main body 28 of the second substrate stage 2 has an opening in which the X guide member 43 can be disposed, and includes a magnet unit having a plurality of permanent magnets inside the opening. That is, in the present embodiment, the moving magnet type X-axis linear motor 36 is formed by the X-axis guide member 42 having the magnet unit and the coil unit of the stage body 22. Similarly, a moving magnet type X-axis linear motor 37 is formed by an X-axis guide member 43 having a magnet unit and a coil unit of the stage body 28.

  One end of one X-axis guide member 42 is fixed to the slide member 40 of the Y-axis linear motor 34, and one end of the other X-guide member 43 is fixed to the slide member 41 of the Y-axis linear motor 35. Therefore, the X-axis guide member 42 can be moved in the Y-axis direction by the Y-axis linear motor 34, and the X-axis guide member 43 can be moved in the Y-axis direction by the Y-axis linear motor 35.

  The substrate stage drive system 5 moves the first substrate stage 1 (stage body 22) in the X-axis direction by the X-axis linear motor 36, and moves the X-axis guide member 42 in the Y-axis direction by the Y-axis linear motor 34. As a result, the first substrate stage 1 (stage main body 22) is moved in the Y-axis direction together with the X-axis guide member. That is, the first substrate stage 1 and the slide member 40 of the Y-axis linear motor 34 are synchronously moved in the Y-axis direction with the positional relationship in the Y-axis direction being substantially fixed.

  The substrate stage drive system 5 also moves the second substrate stage 2 (stage body 28) in the X-axis direction by the X-axis linear motor 37, and moves the X-axis guide member 43 in the Y-axis direction by the Y-axis linear motor 35. The second substrate stage 2 (stage main body 28) is moved in the Y-axis direction together with the X-axis guide member 43. That is, the second substrate stage 2 and the slide member 41 of the Y-axis linear motor 35 move synchronously in the Y-axis direction with the positional relationship in the Y-axis direction being substantially fixed.

  The first substrate stage 1 can be moved between the exposure station ST1 and the measurement station ST2 by linear motors 34 and 36, and the second substrate stage 2 can be moved between the exposure station ST1 and the measurement station ST2 by linear motors 35 and 37. Is movable.

  The first and second substrate tables 23 and 29 are movably supported by the stage main bodies 22 and 28. Although not shown, a plurality of actuators such as a voice coil motor are arranged between the first substrate table 23 and the stage main body 22. The substrate stage drive system 5 moves the first substrate table 23 relative to the stage main body 22 by using a plurality of actuators arranged between the first substrate table 23 and the stage main body 22. It can be moved (slightly movable) in six directions including the axis, θX, θY, and θZ directions. Similarly, a plurality of actuators such as a voice coil motor are arranged between the second substrate table 29 and the stage main body 23. The substrate stage drive system 5 moves the second substrate table 29 from the stage main body 28 to the X-axis, Y-axis, Z-axis with respect to the stage main body 28 by a plurality of actuators arranged between the second substrate table 29 and the stage main body 28. It can be moved (slightly movable) in six directions including the axis, θX, θY, and θZ directions.

  As described above, in the present embodiment, the substrate stage driving system 5 includes the first substrate table 23 and the second substrate table 29 in six directions in the X axis, Y axis, Z axis, θX, θY, and θZ directions, respectively. It can move in the direction.

  The alignment system 9 measures the position information of the substrate P. The first and second substrate stages 1 and 2 can move to a second position that holds the substrate P and faces the second optical element 15. The alignment system 9 is arranged on the alignment mark of the substrate P or the upper surfaces 27 and 33 of the first and second substrate tables 23 and 29 via the second optical element 15 in order to acquire the position information of the substrate P. Detect the fiducial mark.

  The focus / leveling detection system 10 is arranged at the measurement station ST2, and the surface position information (surface position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held by the first and second substrate tables 23 and 29 is provided. ) Is detected. As shown in FIG. 1, the focus / leveling detection system 10 can irradiate the surface of the substrate P held by the first and second substrate tables 23 and 29 disposed in the measurement station ST2 from an oblique direction. A projection device 10A, and a light receiving device 10B capable of receiving detection light that is irradiated on the surface of the substrate P and reflected by the surface of the substrate P.

  Next, the position measuring device 60 including the encoder system 50 will be described. The position measuring device 60 is disposed on the scale plates 53 and 54, the first and second substrate stages 1 and 2, and the encoder heads 51 and 52 that can face the lower surfaces 55 and 57 of the scale plates 53 and 54, And light sources 56 and 58 which are arranged at positions away from the second substrate stages 1 and 2 and emit measurement light for irradiating the scale plates 53 and 54.

  A plurality of encoder heads 51 are arranged around the substrate P (substrate holder 23H) held on the first substrate table 23. Similarly, a plurality of encoder heads 52 are arranged around the substrate P (substrate holder 29H) held on the second substrate table 29. In the present embodiment, a plurality of encoder heads 51 are arranged on the side surface of the first substrate table 23. Similarly, a plurality of encoder heads 52 are arranged on the side surface of the second substrate table 29.

  As shown in FIG. 2, in the present embodiment, the encoder head 51 is disposed at a plurality of predetermined positions on the side surface of the first substrate table 23 close to the slide member 40. The slide member 40 is disposed on the + X side with respect to the first substrate table 23. In this embodiment, the encoder head 51 includes an encoder head 51A disposed at the + X side end of the −Y side surface of the first substrate table 23, and an encoder head disposed at the −Y side end of the + X side surface. 51B, an encoder head 51C disposed at the + Y side end of the + X side surface, and an encoder head 51D disposed at the + X end of the + Y side surface. These four encoder heads 51 </ b> A to 51 </ b> D can face the slide member 40.

  The encoder head 52 is disposed at a plurality of predetermined positions on the side surface of the second substrate table 29 close to the slide member 41. The slide member 41 is disposed on the −X side with respect to the second substrate table 29. In the present embodiment, the encoder head 52 includes an encoder head 52A disposed at the −X side end of the + Y side surface of the second substrate table 29, and an encoder head disposed at the + Y side end of the −X side surface. 52B, an encoder head 52C disposed at the −Y side end of the −X side surface, and an encoder head 52D disposed at the −X side end of the −Y side surface. These four encoder heads 52 </ b> A to 52 </ b> D can face the slide member 41.

  In the present embodiment, the light source 56 includes a plurality (four) of light sources 56A, 56B, 56C, and 56D corresponding to the plurality (four) of encoder heads 51A to 51D. The light sources 56A and 56B are disposed on the −Y side with respect to the slide member 40, and the light sources 56C and 56D are disposed on the + Y side with respect to the slide member 40. The light sources 56 </ b> A to 56 </ b> D are disposed outside the movable range of the slide member 40. The light sources 56A to 56D are sufficiently separated from the first and second substrate stages 1 and 2. Each of the light sources 56A to 56D is supported by a predetermined support mechanism and fixed in position.

  The light source 58 includes a plurality (four) of light sources 58A, 58B, 58C, 58D corresponding to each of the plurality (four) of encoder heads 52A to 52D. The light sources 58A and 58B are disposed on the + Y side with respect to the slide member 41, and the light sources 58C and 58D are disposed on the −Y side with respect to the slide member 41. The light sources 58 </ b> A to 58 </ b> D are disposed outside the movable range of the slide member 41. The light sources 58A to 58D are sufficiently separated from the first and second substrate stages 1 and 2. Each of the light sources 58A to 58D is supported by a predetermined support mechanism and fixed in position.

  In the present embodiment, the position measurement device 60 includes a light guide optical system 71 that guides measurement light emitted from each of the light sources 56A to 56D to at least one of the scale plate 53 and the scale plate 54, and each of the light sources 58A to 58D. A light guide optical system 72 that guides the emitted measurement light to at least one of the scale plate 53 and the scale plate 54 is provided. The light sources 56 (56 </ b> A to 56 </ b> D) supply measurement light to the light guide optical system 71. The light guide optical system 71 guides the measurement light supplied from the light source 56 to the scale plates 53 and 54. The light sources 58 (58A to 58D) supply measurement light to the light guide optical system 72. The light guide optical system 72 guides the measurement light supplied from the light source 58 to the scale plates 53 and 54.

  The light guide optical system 71 includes a first optical member 73 disposed on the encoder head 51 and a second optical member 74 disposed on the slide member 40. The first optical member 73 includes a plurality (four) of first optical members 73A, 73B, 73D, and 73D arranged in each of the plurality of encoder heads 51A to 51D. The second optical member 74 includes a plurality (four) of second optical members 74A, 74B, 74C, and 74D corresponding to the plurality of first optical members 73A to 73D. The measurement lights emitted from the light sources 56A to 56D are supplied to the first optical members 73A to 73D via the second optical members 74A to 74D, respectively. Each of the first optical members 73 </ b> A to 73 </ b> D guides measurement light from the second optical members 74 </ b> A to 74 </ b> D to at least one of the scale plate 53 and the scale plate 54.

  The light source 56A and the second optical member 74A are disposed along the Y-axis direction and face each other. The optical path between the light source 56A and the second optical member 74A is substantially parallel to the Y-axis direction. Similarly, each of the light sources 56B to 56D and each of the second optical members 74B to 74D are disposed along the Y-axis direction and face each other. Each of the optical paths between the light sources 56B to 56D and the second optical members 74B to 74D is substantially parallel to the Y-axis direction. The light sources 56A and 56B emit measurement light from the -Y direction to the + Y direction along the Y axis, and the light sources 56C and 56D measure light from the + Y direction to the -Y direction along the Y axis. Inject.

  The second optical member 74A and the first optical member 73A are disposed along the X-axis direction and face each other. The optical path between the second optical member 74A and the first optical member 73A is substantially parallel to the X-axis direction. Similarly, each of the second optical members 74B to 74D and each of the first optical members 73B to 73D are disposed along the X-axis direction and face each other. Each of the optical paths between the second optical members 74A to 74D and the first optical members 73A to 73D is substantially parallel to the X-axis direction. The second optical members 74A to 74D supply measurement light from the + X direction to the −X direction along the X axis.

  Each of the first optical members 73A to 73D is disposed below the scale plates 53 and 54, and the first optical members 73A to 73D and the lower surfaces 55 and 57 of the scale plates 53 and 54 face each other. The optical path between the first optical members 73A to 73D and the scale plates 53 and 54 is substantially parallel to the Z-axis direction. The first optical members 73A to 73D supply measurement light from the −Z direction to the + Z direction along the Z axis.

  The light guide optical system 72 includes a first optical member 75 disposed on the encoder head 52 and a second optical member 76 disposed on the slide member 41. The first optical member 75 includes a plurality (four) of first optical members 75A, 75B, 75D, and 75D that are disposed on each of the plurality of encoder heads 52A to 52D. The second optical member 76 includes a plurality (four) of second optical members 76A, 76B, 76C, and 76D corresponding to the plurality of first optical members 75A to 75D. The measurement lights emitted from the light sources 58A to 58D are supplied to the first optical members 75A to 75D via the second optical members 76A to 76D, respectively. Each of the first optical members 75A to 75D guides the measurement light from the second optical members 76A to 76D to at least one of the scale plate 53 and the scale plate 54.

  The light source 58A and the second optical member 76A are disposed along the Y-axis direction and face each other. The optical path between the light source 58A and the second optical member 76A is substantially parallel to the Y-axis direction. Similarly, each of the light sources 58B to 58D and each of the second optical members 76B to 76D are disposed along the Y-axis direction and face each other. Each of the optical paths between the light sources 58B to 58D and the second optical members 76B to 76D is substantially parallel to the Y-axis direction. The light sources 58A and 58B emit measurement light from the + Y direction to the −Y direction along the Y axis, and the light sources 58C and 58D measure the measurement light from the −Y direction to the + Y direction along the Y axis. Inject.

  The second optical member 76A and the first optical member 75A are disposed along the X-axis direction and face each other. The optical path between the second optical member 76A and the first optical member 75A is substantially parallel to the X-axis direction. Similarly, each of the second optical members 76B to 76D and each of the first optical members 75B to 75D are disposed along the X-axis direction and face each other. Each of the optical paths between the second optical members 76A to 76D and the first optical members 75A to 75D is substantially parallel to the X-axis direction. The second optical members 76A to 76D supply measurement light from the −X direction to the + X direction along the X axis.

  Each of the first optical members 75A to 75D is disposed below the scale plates 53 and 54, and the first optical members 75A to 75D and the lower surfaces 55 and 57 of the scale plates 53 and 54 face each other. The optical path between the first optical members 75A to 75D and the scale plates 53 and 54 is substantially parallel to the Z-axis direction. The first optical members 75A to 75D supply measurement light from the −Z direction to the + Z direction along the Z axis.

  The scale plates 53 and 54 are made of the same material such as ceramics or low expansion glass. The scale plates 53 and 54 include reflective diffraction gratings 53K and 54K. The diffraction gratings 53K and 54K include two-dimensional gratings that are periodic in the X-axis direction and the Y-axis direction. The diffraction gratings 53K and 54K are disposed on the lower surfaces 55 and 57 of the scale plates 53 and 54, respectively. In the present embodiment, each of the lower surfaces 55 and 57 is substantially parallel to the XY plane. Further, the lower surface 55 of the scale plate 53 and the lower surface 57 of the scale plate 54 are disposed at substantially the same position in the Z-axis direction. That is, the lower surface 55 of the scale plate 53 and the lower surface 57 of the scale plate 54 are disposed in substantially the same plane (they are flush).

  As shown in FIG. 1, the scale plates 53 and 54 are supported by the support frame 18 via support members 53S and 54S. The support members 53S and 54S are connected to the lower surface 18S of the support frame 18. The support frame 18 supports at least a part of the scale plates 53 and 54 with support members 53S and 54S. The support frame 18 supports the scale plates 53 and 54 so that the lower surfaces 55 and 57 of the scale plates 53 and 54 and the XY plane are substantially parallel to each other. The scale plates 53 and 54 are supported by the support frame 18 so that their positions are fixed. Since the positions of the light sources 56 and 58 are fixed as described above, the positional relationship between the light sources 56 and 58 and the scale plates 53 and 54 is fixed.

  The scale plate 53 is disposed at a position that can face the encoder heads 51 and 52 of the first and second substrate stages 1 and 2 existing in the exposure station ST1. In the present embodiment, the scale plate 53 has an opening 53K in which the projection optical system PL including the first optical element 8 can be disposed. The scale plate 53 (the lower surface 55 of the scale plate 53) is disposed around the projection optical system PL including the first optical element 8. The scale plate 54 is disposed at a position that can face the encoder heads 51 and 52 of the first and second substrate stages 1 and 2 existing in the measurement station ST2. In the present embodiment, the scale plate 54 has an opening 54K in which the alignment system 9 including the second optical element 15 and the focus / leveling detection system 10 can be disposed. The scale plate 54 (the lower surface 57 of the scale plate 54) is disposed around the alignment system 9 including the second optical element 15 and the focus / leveling detection system 10.

  Next, the encoder head 52A of the second encoder unit 50B, the light source 58A corresponding to the encoder head 52A, and the second optical member 76A will be described with reference to FIG. Since the encoder head 52A and the other encoder heads 52B to 52D and 51A to 51D have the same configuration, the encoder head 52A will be mainly described below, and the other encoder heads 52B to 52D and 51A to 51D. Description of the light source and the second optical member corresponding to each of the encoder heads is omitted. Further, in the following description, the case where the second encoder head 52A is disposed below the scale plate 54 will be described, but the same applies to the case where the second encoder head 52A is disposed below the scale plate 53.

  In FIG. 3, the second encoder unit 50B includes a light source 58A that emits measurement light, a second optical member 76A that reflects measurement light from the light source 58A, and an encoder that is supplied with measurement light from the second optical member 76A. And a head 52A. The encoder head 52 </ b> A includes a first optical member 75 </ b> A of the light guide optical system 72. The first optical member 75A guides and irradiates the measurement light from the second optical member 76A to the scale plate 54.

  The encoder head 52 </ b> A includes an interference optical system 61 that causes a plurality of diffracted lights generated on the scale plate 54 to interfere with each other, and a detection device 62 that detects the interference light that interferes with the interference optical system 61.

  The light source 58A emits measurement light (laser light) from the + Y direction toward the -Y direction. The second optical member 76A is a reflecting mirror having a reflecting surface, and is disposed on the −Y side with respect to the light source 58A at a position facing the exit surface of the light source 58A. The measurement light emitted from the light source 58A is incident on the reflection surface of the second optical member 76A. The second optical member 76A reflects the incident measurement light and supplies it to the first optical member 75A arranged in the encoder head 52A. The measurement light reflected by the reflecting surface of the second optical member 76A travels from the −X direction toward the + X direction.

  The first optical member 75A is a reflecting mirror having a reflecting surface, and is disposed at a position facing the reflecting surface of the second optical member 76A on the + X side with respect to the second optical member 76A. The measurement light reflected by the second optical member 76A is incident on the reflecting surface of the first optical member 75A. The first optical member 75 </ b> A reflects the incident measurement light and supplies it to the lower surface 57 of the scale plate 54. The measurement light reflected by the reflecting surface of the first optical member 75A travels from the −Z direction to the + Z direction.

  The scale plate 54 includes a reflective diffraction grating 54K including a two-dimensional grating that is periodic in the X-axis direction and the Y-axis direction. Based on the measurement light supplied to the lower surface 57, the scale plate 54 receives a plurality of interference lights having different orders. generate. Here, in order to simplify the explanation, it is assumed that the diffraction grating 54K generates + 1st order diffracted light and −1st order diffracted light.

  The interference optical system 61 is disposed at a position where the diffracted light that passes through the fixed scales 63A, 63B, 63C, and 63D through which the diffracted light generated by the scale plate 54 passes and the fixed scales 63A to 63D is incident, and interferes with the diffracted light. An index scale 64 is provided.

  The fixed scales 63 </ b> A to 63 </ b> D have a fixed positional relationship with the first optical member 75 </ b> A, and condense diffracted light generated by the scale plate 54. The index scale 64 causes the diffracted light collected by the fixed scales 63A to 63D to interfere with each other.

  The fixed scales 63A and 63B are transmissive phase gratings composed of plates on which diffraction gratings having a periodic direction in the Y-axis direction are formed, and are arranged on the −Z side from the first optical member 75A. The fixed scales 63C and 63D are transmissive phase gratings composed of plates on which diffraction gratings having a periodic direction in the X-axis direction are formed, and are arranged on the −Z side with respect to the first optical member 75A.

  The index scale 64 is a transmission type two-dimensional grating in which a diffraction grating having a periodic direction in the X-axis direction and a diffraction grating having a periodic direction in the Y-axis direction are formed. The index scale 64 is arranged on the −Z side from the fixed scales 63A to 63D.

  The fixed scale 63A diffracts the −1st order diffracted light generated by the diffraction grating whose periodic direction is the Y-axis direction of the scale plate 54 to generate + 1st order diffracted light, and this + 1st order diffracted light travels to the index scale 64. The fixed scale 63B diffracts the + 1st order diffracted light generated by the diffraction grating whose periodic direction is the Y-axis direction of the scale plate 54 to generate -1st order diffracted light, and this −1st order diffracted light travels to the index scale 64. .

  The ± first-order diffracted lights generated by the fixed scales 63A and 63B overlap each other at the same position on the index scale 64. That is, ± 1st order diffracted light interferes on the index scale 64.

  The fixed scale 63 </ b> C diffracts −1st order diffracted light generated by a diffraction grating whose periodic direction is the X-axis direction of the scale plate 54 to generate + 1st order diffracted light, and this + 1st order diffracted light travels toward the index scale 64. The fixed scale 63 </ b> D diffracts the + 1st order diffracted light generated by the diffraction grating whose periodic direction is the X-axis direction of the scale plate 54 to generate −1st order diffracted light, and this −1st order diffracted light travels to the index scale 64. .

  The ± first-order diffracted lights generated by the fixed scales 63C and 63D overlap each other at the same position on the index scale 64. That is, ± 1st order diffracted light interferes on the index scale 64.

  The detection device 62 includes a detector 65 that receives interference light that has interfered on the index scale 64, and a wireless transmitter 66 that wirelessly transmits a detection signal of the detector 65. The detector 65 includes, for example, a quadrant detector or a CCD. The interference light that has interfered on the index scale 64 enters the detector 65. The detector 65 receives the interference light.

  Depending on the wavelength of the measurement light emitted from the light source 58A and the pitch of the diffraction grating 54K of the scale plate 54, the diffraction angle of each diffraction light generated in each grating of the diffraction grating 54K is determined. Further, according to the wavelength of the measurement light emitted from the light source 58A and the pitch of the fixed scales 63A to 63D, the diffraction angle of ± first-order diffracted light generated by the fixed scales 63A to 63D (that is, ± generated by the diffraction grating 54K). The apparent bending angle of the first-order diffracted light is determined. By adjusting the wavelength of the measurement light emitted from the light source 58A, the pitch of the diffraction grating 54K of the scale plate 54, and the pitch of the diffraction gratings of the fixed scales 63A to 63D, the light intensity distribution of the two-dimensional interference light is supplied to the detector 65. Can be generated. The light quantity distribution of the two-dimensional interference light changes according to the position of the second substrate table 29 in the X-axis direction and the position of the Y-axis direction. Therefore, the detector 65 can measure position information regarding the X-axis direction and the Y-axis direction of the second substrate table 29 by detecting the light quantity distribution of the interference light.

  The detection signal of the detector 65 is output to the control device 7 via the wireless transmitter 66. A wireless receiver 67 that can receive a wireless signal from the wireless transmitter 66 is connected to the control device 7. Therefore, the control device 7 can acquire the detection signal of the detector 65 via the wireless transmitter 66 and the wireless receiver 67.

  As described above, the encoder head 52A for measuring the position information of the second substrate table 29 (second substrate stage 2) in the X-axis direction and the Y-axis direction, the second optical member 76A corresponding to the encoder head 52A, and the light source 58A. Mainly explained. The other encoder heads 52B to 52D arranged on the second substrate table 29 can also measure the position information of the second substrate table 29 in the X-axis direction and the Y-axis direction, and each of the encoder heads 52A to 52D They are arranged at different positions in the XY plane. The control device 7 can acquire the detection signals of the detectors 65 of the encoder heads 52A to 52D. The control device 7 measures position information regarding the three directions of the X-axis, Y-axis, and θZ directions of the second substrate stage 2 based on detection signals output from the detectors 65 of the encoder heads 52A to 52D. be able to. The control device 7 can also average the detection signals output from the encoder heads 52A to 52D.

  Similarly, each of the plurality of encoder heads 51A to 51D arranged on the first substrate table 23 can measure the position information of the first substrate table 23 in the X-axis direction and the Y-axis direction. Based on the detection signals output from the detectors 65 of the encoder heads 51A to 51D, it is possible to measure position information regarding the three directions of the first substrate stage 1 including the X axis, the Y axis, and the θZ direction.

  In the present embodiment, the light source 56 (56A to 56D) can continue to supply the measurement light to the light guide optical system 71 regardless of the position of the first substrate stage 1 on the guide surface 11. it can. In other words, supply of measurement light to the light guide optical system 71 emitted from the light source 56 is not hindered regardless of the position of the first substrate stage 1 on the guide surface 11. Therefore, the position measuring device 60 measures both the position information of the first substrate stage 1 when it exists in the exposure station ST1 and the position information of the first substrate stage 1 when it exists in the measurement station ST2. can do. In other words, the position measuring device 60 can continue to measure the position information of the first substrate stage 1 regardless of the position of the first substrate stage 1 on the guide surface 11. Similarly, since the light source 58 (58A to 58D) can continue to supply the measurement light to the light guide optical system 72, the position measurement device 60 is located at any position on the guide surface 11 where the second substrate stage 2 exists. Even in this case, the position information of the second substrate stage 2 can be continuously measured.

  As described above, the first encoder unit 50 </ b> A having the encoder head 51 including at least a part of the light source 56 (56 </ b> A to 56 </ b> D) and the light guide optical system 71 uses at least one of the scale plate 53 and the scale plate 54. The position information regarding the three directions of the X-axis, Y-axis, and θZ directions of one substrate stage 1 can be continuously measured. Further, the second encoder unit 50B having the encoder head 52 including at least a part of the light source 58 (58A to 58D) and the light guide optical system 72 uses the scale plate 53 and the scale plate 54, and uses the second substrate. The position information regarding the three directions of the X axis, the Y axis, and the θZ direction of the stage 2 can be continuously measured.

  Based on the measurement result of the first encoder unit 50A, the control device 7 can operate the substrate stage drive system 5 to control the position of the first substrate stage 1 (substrate P). Further, the control device 7 can operate the substrate stage driving system 5 based on the measurement result of the second encoder unit 50B to control the position of the second substrate stage 2 (substrate P).

  Next, an example of the operation of the exposure apparatus having the above configuration will be described.

  Scale plates 53 and 54 are fixed at predetermined positions of the support frame 18 that can face the first and second substrate stages 1 and 2, and encoder heads 51 and 52 are arranged on the first and second substrate stages 1 and 2. Is done. The light sources 56 and 58 are fixed at positions away from the first and second substrate stages 1 and 2. The control device 7 uses the encoder system 50 to start measuring position information of the first and second substrate stages 1 and 2. Each of the light sources 56 and 58 emits measurement light at a position away from the first and second substrate stages 1 and 2 and supplies the measurement light to the light guide optical systems 71 and 72.

  For example, the substrate P before exposure is loaded on the second substrate stage 2 present in the measurement station ST2. The second substrate stage 2 holds the loaded substrate P on the substrate holder 29H. The control device 7 starts measurement processing of the substrate P held on the second substrate stage 2 at the measurement station ST2.

  On the other hand, in the exposure station ST1, the first substrate stage 1 holding the substrate P that has already been subjected to the measurement process in the measurement station ST2 is disposed. The control device 7 starts exposure of the substrate P held on the first substrate stage 1 at the exposure station ST1. The control device 7 performs in parallel the operation of exposing the substrate P held on the first substrate stage 1 and at least part of the operation of measuring the substrate P held on the second substrate stage 2.

  The control device 7 performs immersion exposure of the substrate P held on the first substrate stage 1 at the exposure station ST1. The control device 7 uses the substrate stage driving system 5 to move the first substrate stage 1 at the exposure station ST1 and to change the substrate P held on the first substrate stage 1 to the projection optical system PL and the liquid LQ. And exposure through.

  While the exposure process of the substrate P held on the first substrate stage 1 is being executed at the exposure station ST1, the measurement process of the substrate P held on the second substrate stage 2 is executed at the measurement station ST2. The control device 7 measures the position information of the substrate P held on the second substrate stage 2 arranged in the measurement station ST2.

  A plurality of shot areas are arranged on the substrate P. The position information of the substrate P includes position information of the plurality of shot areas in the X axis, Y axis, and θZ directions. The control device 7 starts measurement processing of position information in the X axis, Y axis, and θZ directions of a plurality of shot areas on the substrate P held on the second substrate stage 2.

  For example, as shown in FIG. 2, the control device 7 measures position information in the XY plane of the second substrate stage 2 holding the substrate P using the encoder head 52 of the second substrate stage 2 at the measurement station ST2. However, the alignment system 9 is used to detect a reference mark arranged on a part of the second substrate stage 2 and an alignment mark provided on the substrate P so as to correspond to each shot region of the substrate P. And the control apparatus 7 calculates | requires each positional information on the some shot area on the board | substrate P with respect to a predetermined | prescribed reference position by arithmetic processing. The control device 7 obtains position information of each shot area with respect to a predetermined reference position in a coordinate system defined by the encoder system 50. Further, the control device 7 uses the focus / leveling detection system 10 to obtain surface position information (position information in the Z-axis, θX, and θY directions) of the substrate P with respect to a predetermined reference surface.

  After the exposure process of the substrate P held on the first substrate stage 1 is completed at the exposure station ST1, and the measurement process of the substrate P held on the second substrate stage 2 is completed at the measurement station ST2, the control is performed. The apparatus 7 starts moving the second substrate stage 2 from the second area SP2 of the measurement station ST2 to the first area SP1 of the exposure station ST1.

  The control device 7 arranges the first substrate stage 1 at the first position facing the first optical element 8 even when the second substrate stage 2 is moved from the second region SP2 to the first region SP1. As a result, even when the second substrate stage 2 is performing the operation of moving from the second region SP2 to the first region SP1, the liquid LQ in the immersion space LS flows between the first optical element 8 and the first substrate stage 1 (substrate P). With the above operation, as shown in FIG. 4, both the first substrate stage 1 and the second substrate stage 2 are arranged in the first region SP1 of the exposure station ST1.

  Next, the control device 7 uses the substrate stage drive system 5 to expose the substrate P of the second substrate stage 2 in a state where the first substrate stage 1 and the first optical element 8 face each other ( From the state in which the liquid LQ is held between the first substrate stage 1 and the first optical element 8, the second substrate stage 2 and the first optical element 8 face each other (the second substrate stage 2 and the first optical element 8). In a state where the liquid LQ is held between the optical element 8 and the optical element 8. In the present embodiment, as disclosed in, for example, International Publication No. 2005/0774014, the substrate stage driving system 5 includes at least one of the first substrate stage 1 and the second substrate stage 2 in which the first optical element is the first optical element. The first substrate stage 1 and the second substrate stage 2 are moved close to or in contact with each other so that a space capable of holding the liquid LQ is formed between the first substrate stage 1 and the second substrate stage 2. As a result, the first substrate stage 1 and the first optical element 8 face each other as shown in FIG. 4, and the liquid LQ is held between the first substrate stage 1 and the first optical element 8. As shown in FIG. 5, the second substrate stage 2 and the first optical element 8 face each other, and the liquid LQ is held between the second substrate stage 2 and the first optical element 8.

  Thereafter, the control device 7 controls the substrate stage drive system 5 while keeping the second substrate stage 2 and the first optical element 8 facing each other, and moves the first substrate stage 1 to the measurement station ST2. To do.

  The control device 7 performs immersion exposure of the substrate P held on the second substrate stage 2 at the exposure station ST1. The control device 7 measures the position information of the second substrate stage 2 using the encoder system 50, adjusts the position of the second substrate stage 2 using the substrate stage drive system 5 based on the measurement result, Each of a plurality of shot areas on the substrate P held on the second substrate stage 2 is sequentially exposed through the projection optical system PL and the liquid LQ. Further, when exposing the substrate P on the second substrate stage 2, the control device 7 uses the measurement results in the measurement station ST2 including the detection results of the alignment system 9 and the focus / leveling detection system 10 in the exposure station ST1. The substrate P is exposed while adjusting the position of the second substrate stage 2.

  On the other hand, the substrate P held on the first substrate stage 1 moved to the measurement station ST2 is unloaded at the substrate exchange position, and a new substrate P before exposure is loaded onto the first substrate stage 1. The control device 7 starts measurement processing and the like of the substrate P loaded on the first substrate stage 1 at the measurement station ST2. Thereafter, processing similar to the processing described above is repeated.

  As described above, according to the present embodiment, the position information of the first and second substrate stages 1 and 2 can be measured using the encoder system 50. According to the present embodiment, since the light sources 56 and 58 are separated from the first and second substrate stages 1 and 2, for example, due to the heat of the light sources 56 and 58, temperature fluctuations (refraction in the atmosphere of the interference light on the optical path) (Rate fluctuation) can be suppressed, and the positional information of the first and second substrate stages 1 and 2 can be measured with high accuracy. In addition, the occurrence of thermal deformation of the first and second substrate stages 1 and 2 due to the heat of the light sources 56 and 58 can be suppressed. Therefore, the substrate P can be exposed satisfactorily.

  Further, in the present embodiment, interference occurs between light passing through very close optical paths such as ± first-order diffracted light, so that the influence due to temperature fluctuation (refractive index fluctuation) of the surrounding atmosphere can be reduced.

  In the present embodiment, the detector 65 is provided on the encoder heads 51 and 52 arranged on the first and second substrate stages 1 and 2, and the index scale 64 and the detector 65 that generate interference light. Can be sufficiently shortened. Thereby, the influence of the temperature fluctuation (refractive index fluctuation) on the detection signal of the detector 65 (interference light incident on the detector 65) can be reduced.

  In the present embodiment, the first optical member 75 has only one reflecting surface that is inclined with respect to the XY plane and reflects the incident measurement light only once. However, the present invention is not limited to this. It is also possible to adopt a configuration as shown in FIG. That is, as shown in FIG. 6, by arranging the second optical member 75M including two sets of reflecting surfaces 125A and 125B on the encoder heads 51 and 52, the same function as the reflecting surface of the first optical member 75 is provided. You can have it. Further, as shown in FIG. 7, the encoder heads 51 and 52 may be provided with a prism 75N having transmission surfaces 126A and 126B. Moreover, you may use the optical members 75M and 75N shown in FIG. 6, FIG. 7 as a 2nd optical member arrange | positioned at the slide members 40 and 41. FIG.

  In the above-described embodiment, a slide member that moves in the Y-axis direction is connected to one end of an X-axis guide member that supports the first substrate stage 1 (or the second substrate stage 2) so as to be movable in the X-axis direction. The second optical member is arranged on the slide member. For example, as shown in FIG. 8, the second optical member is moved by the substrate stage drive system 5B in which the slide members 40B and 40C are connected to both ends of the X-axis guide member 42B. The encoder system described in the above embodiment can be applied to the substrate stage 1B. In the example shown in FIG. 8, the slide members 40B and 40C move in the Y-axis direction along the Y-axis guide members 38B and 38C by the operation of the linear motor. A plurality of second optical members 74 are arranged on each of the slide members 40B and 40C, and a plurality of encoder heads 51 corresponding to the plurality of second optical members 74 are arranged on the substrate stage 1B. Even with the configuration shown in FIG. 8, the positional information of the substrate stage 1B in the X-axis, Y-axis, and θZ directions can be accurately measured.

  In the above-described embodiment, measurement is performed using ± first-order diffracted light. However, the measurement is not limited to this, and measurement may be performed using ± second-order, third-order, n-th order diffracted light.

  In the above-described embodiment, the case where the encoder system 50 is used to measure the position information of the first and second substrate stages 1 and 2 has been described. However, the present invention is not limited to this, and the position information of the mask stage 3 is measured. It can also be used.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like. The present invention can also be applied to an EUV light source exposure apparatus that exposes the substrate P with extreme ultraviolet light.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). The variable shaping mask is not limited to DMD, and a non-light emitting image display element described below may be used instead of DMD. Here, the non-light-emitting image display element is an element that spatially modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction, and a transmissive liquid crystal modulator is a transmissive liquid crystal modulator. An electrochromic display (ECD) etc. are mentioned as an example other than a display element (LCD: Liquid Crystal Display). In addition to the DMD described above, the reflective spatial light modulator includes a reflective mirror array, a reflective liquid crystal display element, an electrophoretic display (EPD), electronic paper (or electronic ink), and a light diffraction type. An example is a light valve (Grating Light Valve).

  Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. In this case, an illumination system is unnecessary. Here, as a self-luminous image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission) Display), plasma display (PDP: Plasma Display Panel), and the like. Further, as a self-luminous image display element provided in the pattern forming apparatus, a solid light source chip having a plurality of light emitting points, a solid light source chip array in which a plurality of chips are arranged in an array, or a plurality of light emitting points on a single substrate A built-in type or the like may be used to form a pattern by electrically controlling the solid-state light source chip. The solid light source element may be inorganic or organic.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens.

  As described above, the exposure apparatus according to the present embodiment assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  In the above-described embodiment, the case where the substrate stage is applied to an exposure apparatus that generates a pattern by irradiating the substrate P with the exposure light EL has been described as an example. The encoder system that measures the position information of the stage can be applied to various pattern forming apparatuses that form a pattern on a substrate. As such a pattern forming apparatus, for example, an ink jet apparatus that forms a pattern on a substrate by ejecting ink droplets onto the substrate, an original plate on which a concavo-convex pattern is formed, and a substrate on which an organic material is applied are formed on the substrate glass. Examples include a nanoimprint apparatus that presses while heating to a temperature higher than the transition temperature, and then separates the original from the substrate and cools the substrate to transfer the pattern of the original to the substrate. When these apparatuses are provided with a substrate stage for holding a substrate, the pattern can be formed satisfactorily by applying the encoder system of the present invention.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a top view for demonstrating the 1st, 2nd board | substrate stage and position measuring apparatus which concern on this embodiment. It is a perspective view for demonstrating the position measuring device which concerns on this embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a schematic diagram which shows an example of the 1st optical member arrange | positioned at an encoder head. It is a schematic diagram which shows an example of the 1st optical member arrange | positioned at an encoder head. It is a figure which shows an example of the substrate stage drive system which moves a substrate stage. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 1st substrate stage, 2 ... 2nd substrate stage, 5 ... Substrate stage drive system, 7 ... Control apparatus, 8 ... 1st optical element, 11 ... Guide surface, 15 ... 2nd optical element, 18 ... Support frame, DESCRIPTION OF SYMBOLS 40 ... Slide member, 41 ... Slide member, 50 ... Encoder system, 51 ... Encoder head, 52 ... Encoder head, 53 ... Scale plate, 53K ... Diffraction grating, 54 ... Scale plate, 54K ... Diffraction grating, 55 ... Lower surface, 56 ... light source, 57 ... lower surface, 58 ... light source,
DESCRIPTION OF SYMBOLS 60 ... Position measuring device, 61 ... Interference optical system, 62 ... Detection apparatus, 63A-63D ... Fixed scale, 64 ... Index scale, 65 ... Detector, 66 ... Wireless transmitter. 71 ... light guide optical system, 72 ... light guide optical system, 73 ... first optical member, 74 ... second optical member, 75 ... first optical member, 76 ... second optical member, EL ... exposure light, EX ... exposure Equipment, P ... Substrate, ST1 ... Exposure station, ST2 ... Measurement station

Claims (18)

A position measuring device that measures position information of a moving body that moves in a moving plane,
A scale plate including a diffraction grating with a fixed position;
An encoder head disposed on the movable body, including at least a part of a light guide optical system that guides the supplied light to the scale plate;
A position measurement device comprising: a light source that emits light at a position away from the moving body and supplies the light to the light guide optical system. The light guide optical system includes a first optical member disposed on the encoder head, and a second optical member disposed on a movable member that moves in synchronization with the moving body,
The position measuring device according to claim 1, wherein light emitted from the light source is supplied to the first optical member via the second optical member. The movable body and the movable member are synchronously moved in the first direction in a state where the positional relationship in the first direction in the moving surface is substantially fixed,
The position measuring apparatus according to claim 2, wherein an optical path between the first optical member and the second optical member is substantially parallel to a second direction orthogonal to the first direction.   The position measuring device according to claim 2, wherein the movable member includes a drive member that moves the movable body.   The position measuring device according to claim 1, wherein the encoder head includes an interference optical system that causes a plurality of diffracted lights generated on the scale plate to interfere with each other. The interference optical system is
A third optical member through which the diffracted light passes;
The position measuring apparatus according to claim 5, further comprising: a fixed grating that is disposed at a position where the diffracted light that has passed through the third optical member is incident and that interferes with the diffracted light. A detection device for detecting the interfered light;
The position measuring device according to claim 5, wherein the detection device is arranged in the encoder head.   The position measurement device according to claim 7, wherein the detection device includes a detector that receives the interfered light and a wireless transmitter that wirelessly transmits a detection signal of the detector.   The position measurement apparatus according to claim 1, wherein a positional relationship between the light source and the scale plate is fixed.   The position measuring device according to claim 1, wherein the diffraction grating is a two-dimensional grating that is periodic in a first direction in the moving plane and in a second direction orthogonal to the first direction. A pattern forming apparatus for forming a pattern on a substrate,
A pattern forming apparatus comprising the position measuring device according to claim 1, in order to measure position information of a movable body that is movable while holding the substrate. An exposure apparatus that exposes a substrate with exposure light,
An exposure apparatus comprising the position measuring device according to claim 1, in order to measure position information of a movable body that is movable while holding the substrate.   The exposure apparatus according to claim 12, comprising at least two moving bodies. Exposing the substrate using the exposure apparatus according to claim 12 or 13,
Developing the exposed substrate; and a device manufacturing method. A position measurement method for measuring position information of a moving object moving in a moving plane,
Fixing a scale plate including a diffraction grating at a position that can face the moving body;
Disposing an encoder head including at least a part of a light guide optical system for guiding supplied light to the scale plate on the moving body;
A position measurement method comprising: emitting light from a light source disposed at a position away from the moving body and supplying the light to the light guide optical system. A pattern forming method for forming a pattern on a substrate,
Measuring position information of a movable body that is movable while holding the substrate, using the position measurement method according to claim 15;
Forming a pattern on the substrate held by the movable body. An exposure method for exposing a substrate with exposure light,
Measuring position information of a movable body that is movable while holding the substrate, using the position measurement method according to claim 15;
Exposing the substrate held by the movable body. Exposing the substrate using the exposure method according to claim 17;
Developing the exposed substrate; and a device manufacturing method.

Images