JP2010021538A - Aligner, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aligner suppressing generation of defective exposure. <P>SOLUTION: The aligner exposes a substrate to an exposure light via a first liquid. The aligner includes an optical member emitting the exposure light, a liquid immersing member forming a liquid immersed space to fill an optical path of the exposure light between the optical member and an object with the first liquid, a measuring device optically measuring the position of the object which is movable relative to the optical member and a humidifier at least partially disposed in the vicinity of the liquid immersing member to humidify at least a part of an optical path of a light measured by the measuring device. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an exposure apparatus that exposes a substrate with exposure light as disclosed in the following patent document is used. The exposure apparatus includes a substrate stage that can move while holding the substrate, and a measurement device that measures the position of the substrate stage.

US Patent Application Publication No. 2006/0227309 US Patent Application Publication No. 2007/0288121 US Patent Application Publication No. 2006/0268249

  When the measurement accuracy of the measurement device is lowered, the movement performance of the substrate stage may be lowered. As a result, an exposure failure may occur or a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to a first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a first liquid, an optical member that emits exposure light, and exposure light between the optical member and an object. An immersion member that forms an immersion space so that the optical path is filled with the first liquid, a measuring device that can optically measure the position of an object that can move with respect to the optical member, and measurement in the vicinity of the immersion member There is provided an exposure apparatus comprising a humidifier that humidifies an optical path of measurement light of the apparatus.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate, wherein the substrate is held by a movable member on which one of an emission portion for emitting measurement light and a scale portion that can face the emission portion is arranged. Moving the movable member below the other of the emission unit and the scale unit, irradiating the scale unit with measurement light emitted from the emission unit, obtaining position information of the movable member, An exposure method is provided that includes irradiating exposure light onto a substrate held by a movable member while controlling the position of the movable member based on information, and humidifying at least a part of an optical path of measurement light. The

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the third aspect and developing the exposed substrate.

  According to the present invention, the occurrence of defective exposure can be suppressed, and the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is sectional drawing which shows the vicinity of the last optical element and liquid immersion member which concern on 1st Embodiment. FIG. 2 is a plan view showing a substrate stage, an encoder system, and a liquid immersion member according to the first embodiment. It is a figure for demonstrating an example of the humidification apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the encoder head which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the humidity gradient resulting from the liquid of immersion space. It is a figure for demonstrating an example of the humidification apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating an example of the humidification apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating an example of the humidification apparatus which concerns on 3rd Embodiment. It is a figure for demonstrating an example of the exposure apparatus which concerns on 4th Embodiment. It is a figure for demonstrating an example of the humidification apparatus which concerns on 4th Embodiment. It is a figure for demonstrating an example of the humidification apparatus which concerns on 5th Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX optically positions a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and the positions of the mask stage 1 and the substrate stage 2. Interferometer system 3 for measuring, encoder system 4 for optically measuring the position of the substrate stage 2, and detection system for optically detecting positional information of the surface of the substrate P held by the substrate stage 2 (focus leveling) Detection system) 23, an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and an optical path of the exposure light EL A liquid immersion member 5 capable of forming the liquid immersion space LS so that at least a part thereof is filled with the liquid LQ, a chamber device 6 that accommodates at least the projection optical system PL, and an exposure apparatus And a control unit 7 for controlling the EX entire operation. Further, the exposure apparatus EX of the present embodiment includes a humidifier 8 that humidifies at least a part of the optical path of the measurement light LB in order to adjust the environment of the optical path of the measurement light LB of the encoder system 4.

  The chamber device 6 includes a chamber member 6T that forms a substantially closed internal space 6S, and an environment control device 6C that controls the environment (temperature, humidity, cleanliness, etc.) of the internal space 6S. The environment control device 6C supplies gas to the internal space 6S in order to control the environment of the internal space 6S. In the present embodiment, a mask stage 1, a substrate stage 2, an illumination system IL, a projection optical system PL, and the like are arranged in the internal space 6S.

  The exposure apparatus EX includes, for example, a body 11 including a first column 9 provided on a support surface FL in a clean room and a second column 10 provided on the first column 9. The first column 9 includes a first support member 12 and a first surface plate 14 supported by the first support member 12 via a vibration isolator 13. The second column 10 includes a second support member 15 provided on the first surface plate 14 and a second surface plate 17 supported on the second support member 15 via a vibration isolator 16.

  The first column 9 forms a substantially closed internal space 9S. In the present embodiment, the exposure apparatus EX includes an environment control device 9C that controls the environment (temperature, humidity, cleanliness, etc.) of the internal space 9S. The environment control device 9C supplies gas to the internal space 9S in order to control the environment of the internal space 9S.

The illumination system IL includes a light source, an illuminance uniformizing optical system including an optical integrator, and a blind mechanism as disclosed in, for example, US Patent Application Publication No. 2003/0025890. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, bright lines (g line, h line, i line) emitted from a mercury lamp, and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 can move to the illumination region IR while holding the mask M. The mask stage 1 has a mask holding unit 1H that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 1H holds the mask M so that the pattern formation surface (lower surface) of the mask M and the XY plane are substantially parallel. The mask stage 1 can move in the XY plane including the illumination region IR along the upper surface (guide surface) of the second surface plate 17 by the operation of the first drive system 1D including an actuator such as a linear motor. . The upper surface of the second surface plate 17 is substantially parallel to the XY plane. In the present embodiment, the mask stage 1 is movable in three directions of the X axis, the Y axis, and the θZ direction while holding the mask M by the mask holding unit 1H.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by the lens barrel 18. The lens barrel 18 has a flange 18F. Projection optical system PL is supported by first surface plate 14 via flange 18F. A vibration isolator can be provided between the first surface plate 14 and the lens barrel 18.

  The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Of the plurality of optical elements of the projection optical system PL, the terminal optical element 21 closest to the image plane of the projection optical system PL has an emission surface 22 that emits the exposure light EL toward the image plane of the projection optical system PL. The projection region PR includes the irradiation position EP of the exposure light EL emitted from the emission surface 22.

  The substrate stage 2 is movable to the projection region PR (irradiation position EP) while holding the substrate P. The substrate stage 2 has a substrate holding part 2H that holds the substrate P in a releasable manner. In the present embodiment, the substrate holding part 2H includes a so-called pin chuck mechanism. In the present embodiment, the substrate holding unit 2H holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. The substrate stage 2 can move in the XY plane including the projection region PR along the upper surface (guide surface) of the third surface plate 19 by the operation of the second drive system 2D including an actuator such as a linear motor. . The third surface plate 19 is supported on the support surface FL via the vibration isolator 20. The upper surface of the third surface plate 19 is substantially parallel to the XY plane. In the present embodiment, the substrate stage 2 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions with the substrate P held by the substrate holding part 2H.

  The substrate stage 2 has an upper surface 2T that is disposed around the substrate holding portion 2H and can face the exit surface 22 of the last optical element 21. The substrate holding part 2H is arranged in a recess 2C provided on the substrate stage 2. The surface of the substrate P held by the substrate holding part 2H can be opposed to the exit surface 22 of the last optical element 21. The upper surface 2T of the substrate stage 2 is flat and substantially parallel to the XY plane. The surface of the substrate P held by the substrate holding part 2H and the upper surface 2T of the substrate stage 2 are arranged in substantially the same plane (substantially flush).

  In the present embodiment, the substrate stage 2 has a plate member T disposed around the substrate P held by the substrate holding part 2H. In the present embodiment, the substrate stage 2 includes a plate member holding portion 2J that holds the plate member T in a releasable manner. In the present embodiment, the plate member holding portion 2J includes a so-called pin chuck mechanism. The plate member holding part 2J is arranged around the substrate holding part 2H.

  The plate member T has an opening TH in which the substrate P can be disposed. The plate member T held by the plate member holding portion 2J is disposed around the substrate P held by the substrate holding portion 2H. In the present embodiment, the inner surface of the opening TH of the plate member T held by the plate member holding portion 2J and the outer surface of the substrate P held by the substrate holding portion 2H face each other with a predetermined gap. The plate member holding portion 2J holds the plate member T so that the upper surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the substrate holding part 2H and the upper surface of the plate member T held by the plate member holding part 2J are arranged in substantially the same plane (substantially flush with each other). is there). That is, in the present embodiment, the upper surface 2T of the substrate stage 2 includes the upper surface of the plate member T held by the plate member holding portion 2J.

  The interferometer system 3 includes the first interferometer unit 3A capable of optically measuring the position information of the mask stage 1 (mask M) in the XY plane and the position information of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of optical measurement. Each of the first and second interferometer units 3A and 3B includes a plurality of laser interferometers. The first interferometer unit 3A irradiates the measurement mirror 1R provided on the mask stage 1 with measurement light, and measures position information of the mask stage 1 (mask M) in the X axis, Y axis, and θZ directions. The second interferometer unit 3B irradiates the measurement mirror 2R provided on the substrate stage 2 with measurement light, and measures the position information of the substrate stage 2 (substrate P) in the X axis, Y axis, and θZ directions.

  The detection system 23 can optically detect position information on the surface of the substrate P in the Z axis, θX, and θY directions. The detection system 23 is configured to detect the height information of the surface of the substrate P at each of a plurality of detection points (for example, as disclosed in US Pat. No. 5,448,332, US Patent Application Publication No. 2007/0247640). A so-called multipoint position detection system that detects position information in the Z-axis direction) is included. The detection system 23 can detect not only the position information of the surface of the substrate P but also the position information of the upper surface 2T of the substrate stage 2, for example.

  The encoder system 4 optically measures position information of the substrate stage 2 (substrate P) in the XY plane. The encoder system 4 includes an encoder head 31 that can measure position information of the substrate stage 2 and a support member 32 that supports the encoder head 31. The support member 32 supports the encoder head 31 at a position where the substrate stage 2 can face.

  In the present embodiment, the substrate stage 2 includes a scale member. The encoder head 31 can face the scale member arranged on the substrate stage 2. The encoder system 4 measures the position of the substrate stage 2 (substrate P) in the XY plane using the encoder head 31 and a scale member disposed on the substrate stage 2. Details of the encoder system 4 and the scale member are disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  In the present embodiment, the support member 32 is supported by the first column 9. In the present embodiment, the support member 32 is suspended from the first surface plate 14 of the first column 9 via the connecting member 32F. The encoder head 31 supported by the support member 32 is disposed above the substrate stage 2.

  The liquid immersion member 5 is disposed in the vicinity of the last optical element 21. The liquid immersion member 5 forms the liquid immersion space LS so that the optical path of the exposure light EL between the terminal optical element 21 and the object disposed at the irradiation position EP is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object that can be placed at the irradiation position EP includes an object that can be moved to the irradiation position EP. In the present embodiment, the object includes at least one of the substrate stage 2 (plate member T) and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the liquid immersion member 5 forms the liquid immersion space LS so that the optical path of the exposure light EL between the last optical element 21 and the substrate P is filled with the liquid LQ.

  The liquid immersion member 5 has a lower surface 24 that can face the object, and a space between the lower surface 24 and the object can hold the liquid LQ. An immersion space LS is formed by the liquid LQ held between the lower surface 24 and the object. In the present embodiment, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. The interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 24 of the liquid immersion member 5 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  In the present embodiment, the liquid immersion member 5 is supported by the first column 9. In the present embodiment, the liquid immersion member 5 is suspended from the first surface plate 14 of the first column 9 via the connecting member 5C.

  FIG. 2 is a cross-sectional view showing the vicinity of the last optical element 21 and the liquid immersion member 5. In the present embodiment, the liquid immersion member 5 is a liquid immersion member as disclosed in, for example, US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1873815, and includes an injection surface 22. An opening 25 through which the exposure light EL emitted from can be passed, a supply port 26 for supplying the liquid LQ, and a recovery port 27 for recovering the liquid LQ. A porous member 28 is disposed in the recovery port 27. In the present embodiment, at least a part of the lower surface 24 of the liquid immersion member 5 is constituted by the lower surface of the porous member 28. The supply port 26 is connected to the liquid supply device 29 via a flow path 29R. The liquid supply device 29 can deliver a clean and temperature-adjusted liquid LQ. The recovery port 27 is connected to the liquid recovery device 30 via the flow path 30R. The liquid recovery apparatus 30 includes a vacuum system and can recover the liquid LQ by sucking it. In the present embodiment, the control device 7 executes the liquid recovery operation using the recovery port 27 in parallel with the liquid supply operation using the supply port 26, so that the terminal optical element 21 and the liquid immersion member 5 on one side are performed. The immersion space LS can be formed with the liquid LQ between the terminal optical element 21 and the object on the other side facing the immersion member 5.

FIG. 3 is a plan view showing the substrate stage 2, the encoder system 4, and the liquid immersion member 5. In the present embodiment, the plate member T includes a first plate T1 having an opening TH and a second plate T2 disposed around the first plate T1. In the present embodiment, the plate member T (first and second plates T1, T2) is formed of a material having a low coefficient of thermal expansion. The plate member T is formed of, for example, an optical glass member or a ceramic member (Shot Corporation's Zerodur (trade name), Al ₂ O _3, TiC, or the like).

  In the present embodiment, the second plate T2 functions as a scale member of the encoder system 4. In the following description, the second plate T2 is appropriately referred to as a scale member T2.

  The scale member T2 forms at least a part of the upper surface 2T of the substrate stage 2. The scale member T <b> 2 disposed on the substrate stage 2 can face the encoder head 31. The encoder head 31 is disposed above the scale member T2.

  The scale member T2 includes Y scales 34 and 35 for measuring the position information of the substrate stage 2 in the Y axis direction, and X scales 36 and 37 for measuring the position information of the substrate stage 2 in the X axis direction. . The Y scale 34 is disposed on the −X side with respect to the opening TH, and the Y scale 35 is disposed on the + X side with respect to the opening TH. The X scale 36 is disposed on the −Y side with respect to the opening TH, and the X scale 36 is disposed on the + Y side with respect to the opening TH.

  Each of the Y scales 34 and 35 includes a plurality of lattices (lattice lines) RG having the X-axis direction as a longitudinal direction and arranged at a predetermined pitch in the Y-axis direction. That is, the Y scales 34 and 35 include a one-dimensional lattice having the Y-axis direction as a periodic direction. Each of the X scales 36 and 37 includes a plurality of lattices (lattice lines) RG arranged with a predetermined pitch in the X-axis direction with the Y-axis direction as a longitudinal direction. That is, the X scales 36 and 37 include a one-dimensional lattice having the X-axis direction as a periodic direction. For convenience of illustration, in FIG. 3, the pitch of the diffraction grating RG is shown to be significantly larger than the actual pitch.

  In the present embodiment, the grating RG is a diffraction grating. That is, in the present embodiment, the Y scales 34 and 35 have a diffraction grating RG whose periodic direction is the Y-axis direction, and the X scales 36 and 37 have a diffraction grating RG whose periodic direction is the X-axis direction. In the present embodiment, the Y scales 34 and 35 are reflection scales on which a reflection type grating (reflection diffraction grating) having a periodic direction in the Y-axis direction is formed. The X scales 36 and 37 are reflection scales on which a reflection type grating (reflection diffraction grating) having the X axis direction as a periodic direction is formed.

  The encoder system 4 includes linear encoders 4A and 4C that measure position information of the substrate stage 2 in the Y-axis direction, and linear encoders 4B and 4D that measure position information of the substrate stage 2 in the X-axis direction.

  Each of the linear encoders 4A, 4B, 4C, and 4D includes a plurality of encoder heads 31 that can face the scale member T2, and a support member 32 that supports the encoder heads 31. Each of the linear encoders 4A, 4B, 4C, and 4D is a so-called multi-lens linear encoder.

  Each of the linear encoders 4A to 4D is disposed outside the optical path of the exposure light EL so as to extend in the radial direction with respect to the optical axis AX near the image plane of the projection optical system PL. Further, each of the linear encoders 4 </ b> A to 4 </ b> D is disposed in the vicinity of the liquid immersion member 9 so as to surround the liquid immersion member 9. The linear encoder 4A is disposed on the −X side of the projection optical system PL. The linear encoder 4B is disposed on the −Y side of the projection optical system PL. The linear encoder 4C is disposed on the + X side of the projection optical system PL. The linear encoder 4D is disposed on the + Y side of the projection optical system PL. The linear encoder 4A and the linear encoder 4C are disposed symmetrically with respect to the optical axis AX of the projection optical system PL. The linear encoder 4B and the linear encoder 4D are arranged symmetrically with respect to the optical axis AX of the projection optical system PL.

  The linear encoder 4A uses the Y scale 34 to measure the position of the substrate stage 2 in the Y axis direction. The linear encoder 4 </ b> C uses the Y scale 35 to measure the position of the substrate stage 2 in the Y-axis direction. The linear encoder 4B uses the X scale 36 to measure the position of the substrate stage 2 in the X axis direction. The linear encoder 4D uses the X scale 37 to measure the position of the substrate stage 2 in the X-axis direction.

  In the linear encoder 4A, the interval in the X-axis direction between adjacent encoder heads 31 (measurement light LB from the encoder head 31) is smaller than the width of the Y scales 34 and 35 in the X-axis direction (the length of the diffraction grating RG). Similarly, in the linear encoder 4C, the interval in the X-axis direction between adjacent encoder heads 31 (measurement light LB from the encoder head 31) is based on the width of the Y scales 34 and 35 in the X-axis direction (the length of the diffraction grating RG). small. Further, in the linear encoder 4B, the interval in the Y-axis direction between adjacent encoder heads 31 (measurement light LB from the encoder head 31) is smaller than the width of the X scales 36 and 37 in the Y-axis direction (the length of the diffraction grating RG). . Similarly, in the linear encoder 4D, the interval in the Y-axis direction between adjacent encoder heads 31 (measurement light LB from the encoder head 31) is based on the width of the X scales 36 and 37 in the Y-axis direction (the length of the diffraction grating RG). small.

  Measurement values of the linear encoders 4 </ b> A to 4 </ b> D are output to the control device 7. The control device 7 can execute position control of the substrate stage 2 in the XY plane based on the measurement values of the linear encoders 4A to 4D.

  FIG. 4 is an enlarged cross-sectional view showing the vicinity of the encoder system 4 and the humidifier 8. 4, the encoder system 4 includes an encoder head 31 that emits measurement light LB, a scale member T2 that is disposed at a position that can face the encoder head 31, and is irradiated with the measurement light LB emitted from the encoder head 31. Have The encoder head 31 is supported by the support member 32. The scale member T2 is disposed on the substrate stage 2.

  The optical path of the measurement light LB is disposed between the scale member T2 of the substrate stage 2 and the encoder head 31 to which the substrate stage 2 can face. The optical path of the measurement light LB is arranged around the immersion space LS.

  In the present embodiment, each of the last optical element 21, the liquid immersion member 5, the substrate stage 2, the scale member T <b> 2, and the encoder head 31 is disposed in the internal space 9 </ b> S of the first column 9. The substrate stage 2 moves in the internal space 9S. The immersion space LS is formed in the internal space 9S. The optical path of the measurement light LB between the encoder head 31 and the scale member T2 is disposed in the internal space 9S.

  The humidifier 8 includes a supply unit 40 that supplies steam to the optical path of the measurement light LB. The supply unit 40 is disposed in the vicinity of the optical path of the measurement light LB. In the present embodiment, the supply unit 40 is disposed at a position that can face the substrate stage 2.

  In this embodiment, the supply part 40 is arrange | positioned in at least one part of the circumference | surroundings of the encoder head 31 which the substrate stage 2 can oppose. In the present embodiment, the supply unit 40 is supported by the support member 32.

  In the present embodiment, the supply unit 40 includes a porous member 41 that holds the liquid LC. At least a part of the surface of the porous member 41 is exposed. That is, at least a part of the surface of the porous member 41 is in contact with the gas in the internal space 9S in the internal space 9S.

  The porous member 41 is disposed at least at a part around the encoder head 31. In the present embodiment, the porous member 41 is disposed between the plurality of encoder heads 31. In the present embodiment, each of the encoder head 31 and the porous member 41 is supported by the lower surface (support surface) 42 of the support member 32.

  In the present embodiment, the porous member 41 is, for example, a sponge. As the sponge, for example, a sponge made of polyvinyl alcohol (PVA sponge) or a sponge made of urethane (urethane sponge) can be used. As the porous member 41, for example, a sintered member (for example, sintered metal or ceramics) in which a plurality of pores are formed, a foamed member (for example, foamed metal), or the like may be used. The porous member 41 is not limited to the above-described material as long as it can hold the liquid LC so that the liquid LC does not drip and does not contaminate the internal space 9S.

  In addition, the humidifier 8 includes a liquid supply system 43 that supplies the liquid LC to the porous member 41. The liquid supply system 43 is formed inside the support member 32 so that at least a part thereof is connected to the liquid supply port 44 formed in the support surface 42 and the liquid supply port 44, and the internal flow path 45 through which the liquid LC flows. And a liquid supply device 46 for delivering the liquid LC to the internal flow path 45. A plurality of liquid supply ports 44 are arranged according to the plurality of porous members 41. The liquid supply device 46 includes a temperature adjustment device 46C that adjusts the temperature of the liquid LC, and a filter device 46F that can remove foreign matters from the liquid LC, and can send the clean and temperature-adjusted liquid LC to the internal flow path 45. is there. The control device 7 can adjust the temperature of the liquid LC flowing through the internal flow path 45 by controlling the temperature adjustment device 46C.

  In the present embodiment, the liquid LC used in the humidifier 8 is the same type of liquid as the liquid LQ for filling the optical path of the exposure light EL. That is, in the present embodiment, the liquid LC is water (pure water).

  The liquid LC delivered from the liquid supply device 46 flows through the internal flow path 45. The internal flow path 45 includes a main flow path 45A to which the liquid LC is supplied from the liquid supply device 46, and a plurality of branch flow paths 45B that connect the main flow path 45A and the liquid supply port 44, respectively. At least a part of the liquid LC flowing through the main channel 45A is supplied to each of the liquid supply ports 44 via the branch channel 45B. The porous member 41 is disposed so as to cover the liquid supply port 44. The liquid supply port 44 can supply the liquid LC to the porous member 41. The liquid LC supplied to the porous member 41 from the liquid supply port 44 penetrates into the porous member 41. The porous member 41 holds the liquid LC. At least a part of the surface of the porous member 41 is exposed. Thereby, the liquid LC is vaporized on the surface of the porous member 41, and the optical path of the measurement light LB is humidified. That is, the vapor (water vapor) of the liquid LC is supplied from the surface of the porous member 41 to the internal space 9S including the optical path of the measurement light LB.

  The main flow path 45 </ b> A is connected to the liquid recovery device 47. The liquid LC that has flowed through the main flow path 45 </ b> A (internal flow path 45) is recovered by the liquid recovery device 47.

  In the present embodiment, the temperature of the encoder head 31 is adjusted using the liquid LC. The control device 7 causes the liquid LC, the temperature of which has been adjusted by the temperature adjusting device 46C, to flow through the internal flow path 45 of the support member 32, thereby supporting the support member 32 and / or the encoder head 31 supported by the support member 32. The temperature can be adjusted. That is, by flowing the temperature-adjusted liquid LC through the internal flow path 45 of the support member 32, the support member 32 and / or the encoder head 31 supported by the support member 32 is maintained at a desired temperature, and / or It can be changed to a desired temperature.

  FIG. 5 is a configuration diagram illustrating an example of the encoder head 31 and the scale member T2. As shown in FIG. 5, the scale member T2 includes two plate-like members 38A and 38B bonded together. The diffraction grating RG is disposed between the plate member 38A and the plate member 38B.

  The encoder head 31 includes an irradiation device 50 that emits measurement light, an optical system 51 through which the measurement light passes, and a light receiving device 52 that receives the measurement light via the scale member T2. The irradiation device 50 includes a light source 50A that generates measurement light (laser light) LB and a lens system 50B that is disposed at a position where the measurement light LB emitted from the light source 50A can enter. The optical system 51 includes a polarizing beam splitter 53, a pair of reflection mirrors 54A and 54B, lenses 55A and 55B, λ / 4 plates 56A and 56B, and reflection mirrors 57A and 57B. The light receiving device 52 includes a polarizer (analyzer), a photodetector, and the like. The light receiving device 52 outputs a signal corresponding to the received light to the control device 7.

  The measurement light LB emitted from the light source 50A enters the polarization beam splitter 53 via the lens system 50B and is separated by polarization. The polarization beam splitter 53 separates the incident measurement light LB into measurement light LB1 having a P-polarized component as a main component and measurement light LB2 having an S-polarized component as a main component. The measurement light LB1 reaches the diffraction grating RG disposed on the scale member T2 via the reflection mirror 54A. The measurement light LB2 reaches the diffraction grating RG via the reflection mirror 54B. The diffraction grating RG generates diffracted light by irradiation with the measurement lights LB1 and LB2. Predetermined order diffracted light (for example, first-order diffracted light) generated by the diffractive optical element RG is incident on the λ / 4 plates 56A and 56B via the lenses 55A and 55B. The λ / 4 plates 56A and 56B convert incident light into circularly polarized light. The light converted into the circularly polarized light by the λ / 4 plates 56A and 56B is incident on the reflection mirrors 57A and 58B, reflected by the reflection mirrors 57A and 58B, and again incident on the λ / 4 plates 56A and 56B. Light incident on the λ / 4 plates 56A and 56B is applied to the diffraction grating RG disposed on the Y scale 36 via the λ / 4 plates 56A and 56B. The light that passes through the diffraction grating RG reaches the polarization beam splitter 53. In the present embodiment, the light reflected by the reflection mirrors 57 </ b> A and 57 </ b> B follows the same optical path as the forward path in the reverse direction and reaches the polarization beam splitter 53.

  The two measurement light beams that have reached the polarization beam splitter 53 have their polarization directions rotated 90 degrees with respect to the original direction. Therefore, the first-order diffracted light of the measurement light LB1 that has passed through the polarizing beam splitter 53 is reflected by the polarizing beam splitter 53 and enters the light receiving device 52. Further, the first-order diffracted light of the measurement light LB2 reflected by the polarization beam splitter 53 first passes through the polarization beam splitter 53, is synthesized coaxially with the first-order diffracted light of the measurement light LB1, and enters the light receiving device 52.

  The two first-order diffracted lights incident on the light receiving device 52 are aligned in the polarization direction by the analyzer inside the light receiving device 52 and interfere with each other to become interference light, and this interference light is detected by the photodetector. And converted into an electric signal corresponding to the intensity of the interference light.

  When the substrate stage 2 moves in the measurement direction (for example, the Y-axis direction), the phases of the two lights change, and the intensity of the interference light changes. The intensity change of the interference light is detected by the light receiving device 52. The encoder head 31 outputs position information corresponding to the intensity change as a measurement value.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described. In the present embodiment, for example, as shown in FIG. 3, the substrate stage 2 can move within a predetermined region including the irradiation position EP of the exposure light EL and the substrate replacement position CP on the guide surface of the third surface plate 19. It is. The control device 7 uses a transport system (not shown) to carry (load) the substrate P before exposure onto the substrate stage 2 (substrate holding part 2H) moved to the substrate exchange position CP, and the substrate stage. Substrate replacement processing including an operation of unloading the substrate P after exposure from the substrate 2 (substrate holding unit 2H) can be executed.

  In the present embodiment, the detection system 23 detects position information on the surface of the substrate P between the substrate replacement position CP and the irradiation position EP. The detection system 23 irradiates detection light from a direction inclined with respect to the Z-axis direction with respect to each of a plurality of detection points within the surface of the substrate P (within the XY plane), and detection via the detection points. And a light receiving device 23B capable of receiving light.

  In order to start the exposure operation of the substrate P, the control device 7 moves the substrate stage 2 to the substrate replacement position CP, and uses the transport system (not shown) to place the substrate stage 2 placed at the substrate replacement position CP. The substrate P before exposure is loaded. After the substrate P is loaded on the substrate stage 2, the control device 7 operates the second drive system 2D to start the movement of the substrate stage 2 from the substrate exchange position CP toward the irradiation position EP.

  The detection area of the detection system 23 is disposed between the substrate replacement position CP and the irradiation position EP. The control device 7 detects position information on the surface of the substrate P using the detection system 23 while the substrate stage 2 moves from the substrate exchange position CP to the irradiation position EP. In the present embodiment, the control device 7 uses the encoder system 4 to measure the position information of the substrate stage 2 in the XY plane, and uses the detection system 23 while moving the substrate stage 2 in the XY plane. Perform detection operation.

  The control device 7 starts an operation of sequentially exposing a plurality of shot regions of the substrate P through the projection optical system PL and the liquid LQ in the immersion space LS. When the exposure operation of the substrate P is started, an immersion space LS is formed with the liquid LQ between the terminal optical element 21 and the immersion member 5 and the surface of the substrate P. The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 7 controls the mask stage 1 and the substrate stage 2 to perform predetermined scanning in the XY plane that intersects the optical axis AX (optical path of the exposure light EL) with the mask M and the substrate P. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 7 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  In the present embodiment, during the exposure of the substrate P, the position information of the mask stage 1 is measured by the first interferometer unit 3A, and the position information of the substrate stage 2 is measured by the encoder system 4. The first interferometer unit 3A acquires position information of the mask stage 1 (mask M) using measurement light. The encoder system 4 acquires the position information of the substrate stage 2 (substrate P) using the measurement light LB. Based on the position information of the mask stage 1 acquired using the first interferometer unit 3A and the position information of the substrate stage 2 acquired using the encoder system 8 during the exposure of the substrate P, the control device 7 The substrate P is irradiated with exposure light EL while controlling the position of each of the substrates P.

  In the present embodiment, the measurement value of the second interferometer unit 3B is assisted when correcting (calibrating) long-term fluctuations in the measurement value of the encoder system 4 (for example, deformation over time of the scale member T2). Used.

  After the exposure of the substrate P is completed, the control device 7 operates the second drive system 2D to unload the exposed substrate P from the substrate stage 2, and moves from the irradiation position EP to the substrate replacement position CP. The movement of the substrate stage 2 is started. The control device 7 moves the substrate stage 2 to the substrate exchange position CP, and uses the transport system (not shown) to unload the substrate P after exposure from the substrate stage 2 arranged at the substrate exchange position CP. Execute. Thereafter, the control device 7 loads the substrate P before exposure onto the substrate stage 2 using the transport system. Thereafter, the same processing as described above is repeated.

  In the present embodiment, a humidity gradient may occur on the optical path of the measurement light LB due to the vaporization of the liquid LQ in the immersion space LS. For example, the humidity of the optical path of the measurement light LB near the immersion space LS may be high, and the humidity of the optical path of the measurement light LB away from the immersion space LS may be low. Alternatively, for example, as shown in the schematic diagram of FIG. 6, in the optical path of the measurement light LB between the encoder head 31 and the scale member T2, the humidity of the portion near the scale member T2 where the immersion space LS is formed is There is a possibility that the humidity in the portion close to the encoder head 31 becomes low. Thus, when a humidity gradient occurs, for example, a refractive index gradient with respect to the measurement light LB may occur between the encoder head 31 and the scale member T2. In addition, the refractive index gradient may change over time. As a result, the measurement accuracy of the encoder system 4 is lowered, the position control accuracy of the substrate stage 2 is lowered, and as a result, an exposure failure may occur.

  Moreover, when the humidity of the gas supplied from the environment control device 9C for adjusting the environment of the internal space 9S is low, the liquid LQ in the immersion space LS may be easily vaporized.

  In the present embodiment, the control device 7 acquires the position information of the substrate stage 2 (substrate P) using the measurement light LB while humidifying the optical path of the measurement light LB with the humidifying device 8, and acquires the acquired position information. Based on the position information, the substrate stage 2 (controlling the position of the substrate P while irradiating the substrate P with the exposure light EL. The humidifier 8 humidifies the optical path of the measurement light LB of the encoder system 4. It is possible to suppress the generation of a humidity gradient in the optical path of the measurement light LB due to the vaporization of the liquid LQ in the immersion space LS, and thus it is possible to suppress a decrease in measurement accuracy of the encoder system 4.

  In the present embodiment, since the liquid supply system 43 is provided, the state in which the liquid LC is held in the porous member 41 can be maintained. The control device 7 can maintain the state in which the liquid LC is held in the porous member 41 by supplying the liquid LC to the porous member 41 constantly or at a predetermined timing using the liquid supply system 43.

  In the present embodiment, the porous member 41 (supply unit 40) that supplies the vapor is disposed at a position facing the substrate stage 2 (scale member T2) where the immersion space LS is formed. As described with reference to FIG. 6, when the humidity near the scale member T2 is high and the humidity near the encoder head 31 is low due to the liquid LQ in the immersion space LS, the position facing the scale member T2. That is, by providing the supply unit 40 in the vicinity of the encode head 31 where the humidity is relatively low, it is possible to effectively suppress the generation of a humidity gradient in the optical path of the measurement light LB.

  Further, according to the present embodiment, the porous member 41 (supply unit 40) supplies a gas having a higher humidity than the gas supplied by the environment control device 9C to the optical path of the measurement light LB and the periphery of the immersion space LS. can do. Therefore, generation | occurrence | production of the above humidity gradients can be suppressed.

  As described above, according to the present embodiment, it is possible to suppress the generation of a humidity gradient in the optical path of the measurement light LB of the encoder system 4 due to the vaporization of the liquid LQ in the immersion space LS. Accordingly, it is possible to suppress a decrease in measurement accuracy of the encoder system 4 and to favorably execute the movement control of the substrate stage 2 based on the measurement result. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

  In the above-described embodiment, the amount of vapor (humidification amount) supplied from the supply unit 40 to each of the optical paths of the plurality of measurement lights LB is substantially the same, but is supplied to each optical path of the measurement light LB. The amount of steam supplied from the section 40 may be varied. For example, in the XY plane, the amount of vapor supplied from the supply unit 40 to each optical path of the measurement light LB differs depending on the distance between each optical path of the measurement light LB and the liquid immersion member 5 (or the optical axis AX). It may be allowed.

  For example, the humidity of the optical path of the measurement light LB in the vicinity of the immersion space LS is high, and the humidity of the optical path of the measurement light LB far from the immersion space LS may be lower than that optical path. In this case, the amount of vapor supplied from the supply unit 40 to the optical path of the measurement light LB near the liquid immersion member 5 is supplied from the supply unit 40 to the optical path of the measurement light LB farther from the liquid immersion member 5 than the optical path. More than the amount of steam produced. Thereby, generation | occurrence | production of a humidity gradient can be suppressed in each of the optical path of the some measurement light LB. Conversely, the amount of vapor supplied from the supply unit 40 to the optical path of the measurement light LB near the liquid immersion member 5 is changed from the supply unit 40 to the optical path of the measurement light LB farther from the liquid immersion member 5 than the optical path. It may be less than the amount of steam supplied. Thereby, the difference (humidity gradient) between the humidity in the optical path of the measurement light LB near the liquid immersion member 5 and the humidity in the optical path of the measurement light LB farther from the liquid immersion member 5 than the optical path can be suppressed. . What is necessary is just to determine the quantity of the vapor | steam supplied from each supply part 40 so that the fall of the measurement precision of the encoder system 4 may be suppressed according to arrangement | positioning of the some encoder head 31, etc. FIG.

  Further, the amount of vapor supplied from the supply unit 40 to the first optical path among the optical paths of the plurality of measurement lights LB and the second optical path (for example, liquid than the first optical path) among the optical paths of the plurality of measurement lights LB. In order to make the amount of vapor supplied from the supply unit 40 different in the optical path away from the immersion member 5, the porosity of the porous member 41 arranged in the vicinity of the first optical path and the vicinity of the second optical path are arranged. Further, the porosity of the porous member 41 may be different. Alternatively, the exposed area of the porous member 41 arranged in the vicinity of the first optical path and the exposed area of the porous member 41 arranged in the vicinity of the second optical path in the internal space 9S may be different. Alternatively, a supply flow channel communicating with the supply port 44 disposed in the vicinity of the first optical path and a supply flow channel communicating with the supply port 44 disposed in the vicinity of the second optical path are formed independently, The amount of liquid supplied to the supply channel may be different. Of course, you may combine these suitably.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 7 is a diagram illustrating an example of a humidifier 8B according to the second embodiment. In FIG. 7, the humidifier 8B includes a supply unit 40B that supplies steam to the optical path of the measurement light LB. The supply unit 40B is disposed at a position facing the substrate stage 2 (scale member T2).

  In this embodiment, supply part 40B is provided with the blower outlet 60 which blows off steam. The air outlet 60 is disposed on the support surface 42 of the support member 32. The air outlet 60 is disposed between the plurality of encoder heads 31. A generator 61 capable of generating steam is connected to each of the air outlets 60. In this embodiment, the vapor | steam supplied to the optical path of the measurement light LB from the supply part 40B containing the some blower outlet 60 is water vapor | steam. The production | generation apparatus 61 can adjust the quantity of the steam which blows off from the blower outlet 60. FIG. Each operation of the generation device 61 is controlled by the control device 7.

  In the present embodiment, the control device 7 controls the amount of vapor supplied from the supply unit 40 </ b> B to the optical path of the measurement light LB according to the movement condition of the substrate stage 2. The moving condition of the substrate stage 2 includes at least one of a moving speed, a moving direction, and a moving distance in a predetermined direction.

  Depending on the movement conditions of the substrate stage 2, the humidity (humidity gradient) of the optical path of the measurement light LB may change. For example, as illustrated in FIG. 8, when the substrate stage 2 moves in the −Y direction with the immersion space LS formed, at least one of the position and shape of the interface LG of the liquid LQ in the immersion space LS is There is a possibility that the humidity (humidity gradient) of the optical path of the measurement light LB changes. For example, in the example illustrated in FIG. 8, the humidity of a portion AR of the optical path of the measurement light LB closest to the liquid immersion member 5 among the optical paths of the measurement light LB arranged in the Y-axis direction may rapidly increase. There is. In this case, in order to suppress the generation of a humidity gradient in the optical path of the measurement light LB closest to the liquid immersion member 5, the control device 7 changes the amount of steam supplied from the blower outlet 60 close to the optical path to another amount. More than the amount of steam supplied from the outlet 60. Thereby, generation | occurrence | production of the humidity gradient in each optical path of the some measurement light LB is suppressed. Alternatively, the amount of steam supplied from the outlet 60 to the optical path of the measurement light LB near the liquid immersion member 5 and the amount of steam supplied from the outlet 60 to the optical path of the measurement light LB away from the liquid immersion member 5 It may be less. Thereby, the difference (humidity gradient) between the humidity in the optical path of the measurement light LB near the liquid immersion member 5 and the humidity in the optical path of the measurement light LB farther from the liquid immersion member 5 than the optical path can be suppressed. . The amount of steam supplied from the plurality of outlets 60 may be substantially the same. What is necessary is just to determine the quantity of the vapor | steam supplied from each blower outlet 60 so that the fall of the measurement precision of the encoder system 4 may be suppressed.

  Note that, as in the first embodiment, the amount of steam supplied from the blower outlet 60 may not be changed according to the movement condition of the substrate stage 2. That is, also when supplying steam using the blower outlet 60, you may continue supplying substantially constant amount of steam from each blower outlet 60 similarly to 1st Embodiment. Also in the second embodiment, the liquid LC whose temperature is adjusted is caused to flow through the internal flow path 45B of the support member 32B, whereby the support head 32B and / or the encoder head 31 supported by the support member 32B can be set in a desired manner. The temperature can be maintained and / or changed to the desired temperature.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the first and second embodiments described above, the encoder head 31 that emits the measurement light LB is disposed at a position facing the substrate stage 2, and the scale member T <b> 2 that is irradiated with the measurement light LB is disposed on the substrate stage 2. An example of the case has been described. In the third embodiment, a case where the encoder head 31 is disposed on the substrate stage 2 and the scale member T2 is disposed at a position facing the substrate stage 2 will be described. An encoder system in which the encoder head 31 is disposed on the substrate stage 2 and the scale member T2 is disposed at a position facing the substrate stage 2 is disclosed in, for example, US Patent Application Publication No. 2006/0227309.

  FIG. 9 is a diagram illustrating an example of the humidifying device 8C according to the third embodiment. In FIG. 9, an encoder head 31 is disposed on the substrate stage 2. The scale member T2 is disposed at a position where the substrate stage 2 (encoder head 31) can face. In the present embodiment, the scale member T2 is disposed on the support member 32C.

The humidifier 8C according to the present embodiment includes a supply unit 40C that supplies steam to the optical path of the measurement light LB. The supply unit 40C includes an air outlet 60 formed in a part of the lower surface of the support member 32C that can face the substrate stage 2. A generator 61 capable of generating steam is connected to the outlet 60. Also in this embodiment, generation | occurrence | production of the humidity gradient in the optical path of measurement light LB can be suppressed.
In the third embodiment, the scale member T2 supported by the support member 32C and / or the support member 32C is made desired by flowing the temperature-adjusted liquid LC through the internal flow path 45C of the support member 32C. The temperature can be maintained and / or changed to the desired temperature.

  In the third embodiment, a porous member may be used as the supply unit 40C as in the first embodiment.

  Also in the third embodiment, as described in the first embodiment and the second embodiment, the amounts of vapor supplied to the optical paths of the plurality of measurement lights LB may be substantially the same. , May be different.

  Also in the third embodiment, as described in the second embodiment, the amount of vapor supplied to the optical paths of the plurality of measurement lights LB may be changed according to the movement condition of the substrate stage 2. In the third embodiment, since the position of the optical path of the measurement light LB changes due to the movement of the substrate stage 2, the position where the vapor is supplied and / or the respective positions according to the position of the optical path of the measurement light LB. The amount of steam supplied can be determined. As in the first embodiment, a substantially constant amount of steam may be supplied.

  In the first to third embodiments described above, the steam is supplied to all of the optical paths of the plurality of measurement lights LB. However, the steam may be supplied to only some of the optical paths. In the first to third embodiments described above, the flow path (such as 45) for supplying the vapor to the optical path of the measurement light LB is provided inside the support member (such as 32) that supports the encoder head 31 or the scale member T2. However, the flow path (such as 45) may not be provided in the support member (such as 32). In other words, the liquid LC flowing in the flow path (such as 45) may not be used for temperature adjustment of at least one of the support member (such as 32), the encoder head, and the scale member T2.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In the fourth embodiment, a case where the humidifier 8D humidifies the optical path of the detection light LF of the detection system 23 will be described. The optical path of the detection light LF is arranged in the internal space 9S.

  FIG. 10 is a plan view showing a part of the exposure apparatus EX according to the fourth embodiment, and FIG. 11 is a side view. 10 and 11, the humidifier 8 </ b> D includes a supply unit 40 </ b> D that supplies steam to the optical path of the detection light LF of the detection system 23. The supply unit 40D is disposed in the vicinity of the optical path of the detection light LF. The supply unit 40D is disposed at a position that can face the substrate stage 2.

  In the present embodiment, the supply unit 40D includes a porous member 41D that holds the liquid LC. Further, the humidifier 8D includes a support member 32D that supports the porous member 41D, and a liquid supply system 43D that supplies the liquid LC to the porous member 41D via an internal flow path 45D formed in the support member 32D. . Also in the present embodiment, it is possible to suppress the generation of a humidity gradient in the optical path of the measurement light LF.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In the fifth embodiment, a case where the humidifier 8E humidifies the optical path of the measurement light LH of the interferometer system 3 will be described. The optical path of the detection light LH is arranged in the internal space 9S.

  FIG. 12 is a side view showing a part of the exposure apparatus EX according to the fifth embodiment. In FIG. 12, the humidifier 8 </ b> E includes a supply unit 40 </ b> E that supplies steam to the optical path of the detection light LH of the interferometer system 3. The interferometer system 3 (second interferometer unit 3B) includes a laser interferometer 3L that emits measurement light LH. The measurement mirror 2R of the substrate stage 2 is disposed at a position that can face the laser interferometer 3L. The measurement mirror 2R is irradiated with the measurement light LH emitted from the laser interferometer 3L.

  The supply unit 40E is disposed in the vicinity of the optical path of the detection light LH. The supply unit 40E is disposed at a position that can face the substrate stage 2.

  In the present embodiment, the supply unit 40E includes a porous member 41E that holds the liquid LC. The humidifier 8E includes a support member 32E that supports the porous member 41E, and a liquid supply system 43E that supplies the liquid LC to the porous member 41E via an internal flow path 45E formed in the support member 32E. . Also in this embodiment, generation | occurrence | production of the humidity gradient in the optical path of the measurement light LH can be suppressed.

  In the above-described first to fifth embodiments, the exposure apparatus EX includes the interferometer system 3 and the encoder system 4, but may include only one of them.

  In the first to fifth embodiments described above, the internal space 9S substantially closed by the first column 9 is formed, and the internal space 9S is controlled by the environmental control device 9C. The internal space 9 </ b> S closed by may not be formed. In this case, the environment control device 9C can be omitted, and the gas from the environment control device 6C is also supplied around the immersion space LS.

  In the first to fifth embodiments described above, the humidity of the optical path of the measurement light is adjusted as the environmental adjustment of the measurement light optical path. However, as the environmental adjustment of the optical path of the measurement light, parameters other than humidity (for example, , Temperature) may be adjusted.

  In the first to fifth embodiments described above, the optical path on the exit side (image plane side) of the terminal optical element 21 of the projection optical system PL is filled with the liquid LQ. For example, International Publication No. 2004/019128. As disclosed in the No. pamphlet, it is also possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 21 is also filled with the liquid LQ.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  Furthermore, as disclosed in, for example, US Pat. No. 6,897,963, a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or various photoelectric sensors are mounted, and a substrate to be exposed is mounted. The present invention can also be applied to an exposure apparatus that includes a measurement stage that is not held. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 13, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Interferometer system, 4 ... Encoder system, 5 ... Immersion member, 7 ... Control device, 8 ... Humidification device, 9C ... Environmental control device, 9S ... Internal space, 21 ... End optical element, 23 DESCRIPTION OF SYMBOLS ... Detection system, 31 ... Encoder head, 32 ... Support member, 40 ... Supply part, 41 ... Porous member, 46C ... Temperature adjusting device, 61 ... Air outlet, EL ... Exposure light, EP ... Irradiation position, EX ... Exposure apparatus, LC ... Liquid, LQ ... Liquid, LS ... Immersion space, P ... Substrate, T2 ... Scale member

Claims (26)

An exposure apparatus that exposes a substrate with exposure light through a first liquid,
An optical member for emitting the exposure light;
An immersion member that forms an immersion space so that the optical path of the exposure light between the optical member and the object is filled with the first liquid;
A measuring device capable of optically measuring the position of the object movable relative to the optical member;
An exposure apparatus comprising: a humidifying device that is at least partially disposed in the vicinity of the liquid immersion member and humidifies at least a part of an optical path of measurement light of the measurement device.   The exposure apparatus according to claim 1, wherein the humidifier includes a supply unit that is disposed in the vicinity of the liquid immersion member and supplies steam to at least a part of an optical path of the measurement light. A substantially closed space,
An environment control device for supplying gas to the space in order to control the environment of the space,
The object is moved in the space;
The optical path of the measurement light is disposed in the space,
The exposure apparatus according to claim 2, wherein the supply unit of the humidifier supplies a gas having a higher humidity than the gas supplied by the environment control device.   The exposure apparatus according to claim 2, wherein the supply unit includes an air outlet that blows out steam. The supply unit can supply steam at a first position and a second position different from the first position,
The exposure apparatus according to any one of claims 2 to 4, wherein a vapor supply amount at the first position is different from a vapor supply amount at the second position.   6. The exposure apparatus according to claim 5, wherein a distance between the liquid immersion member and the first position is different from a distance between the liquid immersion member and the second position.   The exposure apparatus according to claim 5 or 6, wherein a distance between the optical axis of the optical member and the first position is different from a distance between the optical axis of the optical member and the second position.   The exposure apparatus according to any one of claims 2 to 7, further comprising a control device that controls an amount of vapor supplied from the supply unit according to a moving condition of the object.   The exposure apparatus according to claim 2, wherein the vapor supplied from the supply unit includes a vapor of a second liquid.   The exposure apparatus according to claim 9, wherein the supply unit includes a porous member that holds the second liquid.   The exposure apparatus according to claim 9 or 10, wherein the second liquid includes the first liquid.   The exposure apparatus according to claim 9, wherein the temperature of at least a part of the measurement apparatus is adjusted using the second liquid. A support member that supports at least a part of the measurement device at a position where the object can face;
The exposure apparatus according to claim 12, wherein the temperature of at least a part of the measurement apparatus is adjusted by flowing the second liquid through a flow path formed inside the support member.   The exposure apparatus according to claim 13, further comprising a temperature adjustment device that adjusts a temperature of the second liquid flowing in the flow path. The measurement device includes an emission unit that emits the measurement light, and a measurement unit that is arranged at a position that can face the emission unit and that is irradiated with the measurement light emitted from the emission unit,
The exposure apparatus according to claim 13 or 14, wherein one of the emission unit and the measurement unit is supported by the support member, and the other is disposed on the object. The measuring device includes an encoder system having an encoder head and a scale member that can face the encoder head,
The exposure apparatus according to claim 15, wherein the emission unit includes the encoder head. The optical path of the measurement light is disposed between the first part of the object and the second part of the predetermined member that the object can face,
The exposure apparatus according to claim 2, wherein the supply unit is disposed at a position facing the object. The measurement device includes an emission unit that emits the measurement light, and a measurement unit that can be opposed to the emission unit and irradiated with the measurement light emitted from the emission unit,
The exposure apparatus according to claim 17, wherein the first portion includes the measurement unit. The measurement device includes an emission unit that emits the measurement light, and a measurement unit that can be opposed to the emission unit and irradiated with the measurement light emitted from the emission unit,
The exposure apparatus according to claim 17, wherein the first portion includes the emission unit. The measuring device includes an encoder system having an encoder head and a scale member that can face the encoder head,
The exposure apparatus according to claim 18, wherein the emission unit includes the encoder head. A movable member holding and moving the substrate;
The exposure apparatus according to claim 1, wherein the object includes the movable member.   The exposure apparatus according to any one of claims 1 to 21, wherein an optical path of the measurement light is disposed at least at a part of the periphery of the liquid immersion member.   The exposure apparatus according to any one of claims 1 to 22, wherein the humidifier suppresses generation of a humidity gradient in an optical path of the measurement light caused by the first liquid. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 23;
Developing the exposed substrate; and a device manufacturing method. An exposure method for exposing a substrate,
Holding the substrate on a movable member in which one of an emission part for emitting measurement light and a scale part that can face the emission part is disposed;
Moving the movable member below the other of the injection portion and the scale portion;
Irradiating the scale part with measurement light emitted from the emission part to obtain position information of the movable member;
Irradiating the substrate held by the movable member with exposure light while controlling the position of the movable member based on the position information;
Humidifying at least part of the optical path of the measurement light. Exposing the substrate using the exposure method according to claim 25;
Developing the exposed substrate; and a device manufacturing method.

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