JP2010199198A - Environmental adjustment device, stage device and exposing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an environmental adjustment device, capable of easily maintaining the environment of a space in which a mobile body moves. <P>SOLUTION: The environment of the space in which the mobile body 2 moves is adjusted. The device has a gas supply part 8C which moves according to the movement of the mobile body and supplies environmental adjustment gas KA to the surface side of the mobile body. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an environment adjustment apparatus, a stage apparatus, and an exposure apparatus.

  In a stage apparatus having a moving stage, a reflecting surface is provided on the moving stage (or a moving mirror installed on the moving stage), and by receiving reflected light of a beam such as a laser beam irradiated on the reflecting surface, An interferometer that detects a position in a direction along the moving surface (for example, the X-axis direction and the Y-axis direction) is used. Further, in Patent Document 1, a beam irradiated in a direction along the moving surface is bent in a direction (Z direction) orthogonal to the moving surface on the moving stage, and reflected by a reflecting plate provided above the moving stage, A configuration of an interferometer that detects the position (height position) of the moving stage in the Z direction is disclosed.

In the above position measurement, in order to perform position detection with high accuracy, it is necessary to adjust the environment such as temperature and humidity with respect to the optical path of the detection light in order to eliminate error factors such as air fluctuation.
Therefore, conventionally, environmental adjustment in the optical path is performed by supplying temperature-adjusted dry air or the like to the optical path of the detection light.

JP-T-2001-510577

However, the following problems exist in the conventional technology as described above.
Since the position detection of the moving stage is performed over the entire moving range of the moving stage, it is difficult to adjust the environment over the entire moving range, which may lead to an increase in the size of the apparatus. In addition, when the distance between the dry air supply port and the moving stage is large, there is a possibility that the predetermined environment is not maintained and the position measurement accuracy is lowered.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide an environment adjustment apparatus, a stage apparatus, and an exposure apparatus that can easily maintain an environment of a space in which a moving body moves.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 11 showing the embodiment.
The environment adjusting device of the present invention is an environment adjusting device (8) that adjusts the environment of the space in which the moving body (2) moves, and moves with the movement of the moving body, and adjusts the environment on the surface side of the moving body. It has a gas supply part (8C) which supplies gas for operation.
Therefore, in the environmental adjustment device of the present invention, the gas supply unit (8C) that supplies the environmental adjustment gas to the surface side of the moving body moves with the movement of the moving body, so the environmental adjustment gas is locally supplied. The space environment can be easily adjusted without increasing the size of the apparatus.

Moreover, the stage apparatus of the present invention includes the environment adjusting apparatus described above.
Therefore, since the stage apparatus of the present invention includes the above-described environment adjusting device, the environment of the moving space of the moving stay can be easily adjusted, and high-accuracy position measurement can be performed without adverse effects such as air fluctuations. It becomes possible to do.

The exposure apparatus of the present invention includes the stage device described above.
Therefore, in the exposure apparatus of the present invention, high-precision exposure processing can be performed based on the position of the moving body measured with high precision.
In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

  In the present invention, the environment of the space in which the moving body moves can be easily maintained.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is sectional drawing which shows the vicinity of a terminal optical element and a liquid immersion member. It is a schematic block diagram of an encoder system and an environment adjustment apparatus. It is a top view which shows arrangement | positioning of a gas supply part. It is sectional drawing which shows the other form of a gas supply part. It is a top view of the environment adjusting device which concerns on 2nd Embodiment. It is a fragmentary sectional view of the environment adjusting device concerning a 2nd embodiment. It is a perspective view of the substrate stage which concerns on 3rd Embodiment. It is a top view of the environment adjusting device which concerns on 3rd Embodiment. It is a fragmentary sectional view of the environment adjusting device concerning a 3rd embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an environment adjustment apparatus, a stage apparatus, and an exposure apparatus according to the present invention will be described below with reference to FIGS.
In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

(First embodiment)
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

In FIG. 1, an exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage (moving body) 2 that can move while holding a substrate P, and positions of the mask stage 1 and the substrate stage 2. An interferometer system 3 that optically measures the position of the substrate P2, an encoder system 4 that optically measures the position of the substrate stage 2, and a detection system that optically detects positional information of the surface of the substrate P held by the substrate stage 2 (Focus / leveling detection system) 23, an illumination system IL for illuminating the mask M with the exposure light EL, a projection optical system PL for projecting an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and exposure A liquid immersion member 5 capable of forming the liquid immersion space LS so that at least a part of the optical path of the light EL is filled with the liquid LQ, and a chamber device 6 that houses at least the projection optical system PL. , And a controller 7 for controlling the operation of the entire exposure apparatus EX.
In addition, the exposure apparatus EX of the present embodiment has an environment adjustment device 8 (not shown in FIG. 1, see FIG. 3, etc.) that adjusts the optical path of the measurement light LB (see FIG. 3 described later) of the encoder system 4 and the surrounding environment. ).

  The chamber device 6 includes a chamber member 6T that forms a substantially closed internal space 6S, and an environment control device 6C that controls the environment (temperature, humidity, cleanliness, etc.) of the internal space 6S. The environment control device 6C supplies gas to the internal space 6S in order to control the environment of the internal space 6S. In the present embodiment, a mask stage 1, a substrate stage 2, an illumination system IL, a projection optical system PL, and the like are arranged in the internal space 6S.

  The exposure apparatus EX includes, for example, a body 11 including a first column 9 provided on a support surface FL in a clean room and a second column 10 provided on the first column 9. The first column 9 includes a first support member 12 and a first surface plate 14 supported by the first support member 12 via a vibration isolator 13. The second column 10 includes a second support member 15 provided on the first surface plate 14 and a second surface plate 17 supported on the second support member 15 via a vibration isolator 16.

  The first column 9 forms a substantially closed internal space 9S. In the present embodiment, the exposure apparatus EX includes an environment control device 9C that controls the environment (temperature, humidity, cleanliness, etc.) of the internal space 9S. The environment control device 9C supplies gas to the internal space 9S in order to control the environment of the internal space 9S.

  The illumination system IL includes a light source, an illuminance uniformizing optical system including an optical integrator, and a blind mechanism as disclosed in, for example, US Patent Application Publication No. 2003/0025890. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, bright lines (g-line, h-line, i-line) emitted from a mercury lamp, and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 can move to the illumination region IR while holding the mask M. The mask stage 1 has a mask holding unit 1H that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 1H holds the mask M so that the pattern formation surface (lower surface) of the mask M and the XY plane are substantially parallel. The mask stage 1 can move in the XY plane including the illumination region IR along the upper surface (guide surface) of the second surface plate 17 by the operation of the first drive system 1D including an actuator such as a linear motor. . The upper surface of the second surface plate 17 is substantially parallel to the XY plane. In the present embodiment, the mask stage 1 is movable in three directions of the X axis, the Y axis, and the θZ direction while holding the mask M by the mask holding unit 1H.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by the lens barrel 18. The lens barrel 18 has a flange 18F. Projection optical system PL is supported by first surface plate 14 via flange 18F. A vibration isolator can be provided between the first surface plate 14 and the lens barrel 18.

  The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Of the plurality of optical elements of the projection optical system PL, the terminal optical element 21 closest to the image plane of the projection optical system PL has an emission surface 22 that emits the exposure light EL toward the image plane of the projection optical system PL. The projection region PR includes the irradiation position EP of the exposure light EL emitted from the emission surface 22.

  The substrate stage 2 is movable to the projection region PR (irradiation position EP) while holding the substrate P. The substrate stage 2 has a substrate holding part 2H that holds the substrate P in a releasable manner. In the present embodiment, the substrate holding part 2H includes a so-called pin chuck mechanism. In the present embodiment, the substrate holding unit 2H holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. The substrate stage 2 can move in the XY plane including the projection region PR along the upper surface (guide surface) of the third surface plate 19 by the operation of the second drive system 2D including an actuator such as a linear motor. . The third surface plate 19 is supported on the support surface FL via the vibration isolator 20. The upper surface of the third surface plate 19 is substantially parallel to the XY plane. In the present embodiment, the substrate stage 2 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions with the substrate P held by the substrate holding part 2H.

  The substrate stage 2 has an upper surface 2T that is disposed around the substrate holding portion 2H and can face the exit surface 22 of the last optical element 21. The substrate holding part 2H is arranged in a recess 2C provided on the substrate stage 2. The surface of the substrate P held by the substrate holding part 2H can be opposed to the exit surface 22 of the last optical element 21. The upper surface (surface) 2T of the substrate stage 2 is flat and substantially parallel to the XY plane. The surface of the substrate P held by the substrate holding part 2H and the upper surface 2T of the substrate stage 2 are arranged in substantially the same plane (substantially flush).

  In the present embodiment, the substrate stage 2 has a plate member T disposed around the substrate P held by the substrate holding part 2H. In the present embodiment, the substrate stage 2 includes a plate member holding portion 2J that holds the plate member T in a releasable manner. In the present embodiment, the plate member holding portion 2J includes a so-called pin chuck mechanism. The plate member holding part 2J is arranged around the substrate holding part 2H.

  The plate member T has an opening TH in which the substrate P can be disposed. The plate member T held by the plate member holding portion 2J is disposed around the substrate P held by the substrate holding portion 2H. In the present embodiment, the inner surface of the opening TH of the plate member T held by the plate member holding portion 2J and the outer surface of the substrate P held by the substrate holding portion 2H face each other with a predetermined gap. The plate member holding portion 2J holds the plate member T so that the upper surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the substrate holding part 2H and the upper surface of the plate member T held by the plate member holding part 2J are arranged in substantially the same plane (substantially flush with each other). is there). That is, in the present embodiment, the upper surface 2T of the substrate stage 2 includes the upper surface of the plate member T held by the plate member holding portion 2J.

  The interferometer system 3 includes the first interferometer unit 3A capable of optically measuring the position information of the mask stage 1 (mask M) in the XY plane and the position information of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of optical measurement. Each of the first and second interferometer units 3A and 3B includes a plurality of laser interferometers. The first interferometer unit 3A irradiates the measurement mirror 1R provided on the mask stage 1 with measurement light, and measures position information of the mask stage 1 (mask M) in the X axis, Y axis, and θZ directions. The second interferometer unit 3B irradiates the measurement mirror 2R provided on the substrate stage 2 with measurement light, and measures the position information of the substrate stage 2 (substrate P) in the X axis, Y axis, and θZ directions.

  The detection system 23 can optically detect position information on the surface of the substrate P in the Z axis, θX, and θY directions. The detection system 23 is configured to detect the height information of the surface of the substrate P at each of a plurality of detection points (for example, as disclosed in US Pat. No. 5,448,332, US Patent Application Publication No. 2007/0247640). A so-called multipoint position detection system that detects position information in the Z-axis direction) is included. The detection system 23 can detect not only the position information of the surface of the substrate P but also the position information of the upper surface 2T of the substrate stage 2, for example.

  The encoder system 4 optically measures position information of the substrate stage 2 (substrate P) in the XY plane. As shown in FIG. 3, the encoder system 4 includes an encoder head 31 provided on the substrate stage 2, and an encoder scale 33 disposed so as to face the encoder head 31. The encoder scale 33 is supported by a support member (support portion) 32 suspended from the first surface plate 14 of the first column 9 via a connecting member 32F.

  The encoder system (measurement device) 4 measures the position of the substrate stage 2 (substrate P) in the XY plane when the encoder head (injection unit) 31 reads the encoder scale (measurement unit) 33. Note that details of the encoder system 4 are disclosed in, for example, US Patent Application Publication No. 2007/0288121 and US Patent Application Publication No. 2006/0227309, and thus the description thereof is omitted here.

  The environment adjustment device 8 adjusts the optical path of the measurement light LB of the encoder system 4 and the surrounding environment, and includes a gas supply path 8A provided in the substrate stage 2 and temperature adjustment and humidity in the gas supply path 8A. A gas supply device 8B for supplying an adjusted gas for environmental adjustment (for example, dry air, hereinafter simply referred to as gas). The tip of the gas supply path 8A is an opening 8C that opens to the surface side of the substrate stage 2 (+ Z side, surface side of the substrate P) in the vicinity of the encoder head 31 and ejects gas.

FIG. 4 is a schematic plan view of the substrate stage 2.
As shown in this figure, the encoder head 31 is disposed on both sides in the X direction and the Y direction with the substrate P interposed therebetween, and the opening 8C is provided for each encoder head 31 with the encoder head 31 interposed therebetween. The encoder head 31 is disposed so as to surround the encoder head 31 at three positions on both sides of the encoder head 31 in the tangential direction on the opposite side of the substrate P and on the outer periphery of the substrate P.

  The liquid immersion member 5 is disposed in the vicinity of the last optical element 21. The liquid immersion member 5 forms the liquid immersion space LS so that the optical path of the exposure light EL between the terminal optical element 21 and the object disposed at the irradiation position EP is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object that can be placed at the irradiation position EP includes an object that can be moved to the irradiation position EP. In the present embodiment, the object includes at least one of the substrate stage 2 (plate member T) and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the liquid immersion member 5 forms the liquid immersion space LS so that the optical path of the exposure light EL between the last optical element 21 and the substrate P is filled with the liquid LQ.

  The liquid immersion member 5 has a lower surface 24 that can face the object, and a space between the lower surface 24 and the object can hold the liquid LQ. An immersion space LS is formed by the liquid LQ held between the lower surface 24 and the object. In the present embodiment, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. The interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 24 of the liquid immersion member 5 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  In the present embodiment, the liquid immersion member 5 is supported by the first column 9. In the present embodiment, the liquid immersion member 5 is suspended from the first surface plate 14 of the first column 9 via the connecting member 5C.

  FIG. 2 is a cross-sectional view showing the vicinity of the last optical element 21 and the liquid immersion member 5. In the present embodiment, the liquid immersion member 5 is a liquid immersion member as disclosed in, for example, US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1873815, and includes an injection surface 22. An opening 25 through which the exposure light EL emitted from can be passed, a supply port 26 for supplying the liquid LQ, and a recovery port 27 for recovering the liquid LQ. A porous member 28 is disposed in the recovery port 27. In the present embodiment, at least a part of the lower surface 24 of the liquid immersion member 5 is constituted by the lower surface of the porous member 28. The supply port 26 is connected to the liquid supply device 29 via a flow path 29R. The liquid supply device 29 can deliver a clean and temperature-adjusted liquid LQ. The recovery port 27 is connected to the liquid recovery device 30 via the flow path 30R. The liquid recovery apparatus 30 includes a vacuum system and can recover the liquid LQ by sucking it. In the present embodiment, the control device 7 executes the liquid recovery operation using the recovery port 27 in parallel with the liquid supply operation using the supply port 26, so that the terminal optical element 21 and the liquid immersion member 5 on one side are performed. The immersion space LS can be formed with the liquid LQ between the terminal optical element 21 and the object on the other side facing the immersion member 5.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described. In the present embodiment, the substrate stage 2 is movable on a predetermined surface including the irradiation position EP of the exposure light EL and the substrate replacement position (not shown) on the guide surface of the third surface plate 19. The control device 7 uses a transport system (not shown) to load (load) the substrate P before exposure onto the substrate stage 2 (substrate holding unit 2H) moved to the substrate replacement position, and the substrate stage 2 Substrate replacement processing including an operation of unloading the exposed substrate P from the (substrate holding unit 2H) can be executed.

  In the present embodiment, the detection system 23 detects position information on the surface of the substrate P between the substrate replacement position and the irradiation position EP. The detection system 23 irradiates detection light from a direction inclined with respect to the Z-axis direction with respect to each of a plurality of detection points within the surface of the substrate P (within the XY plane), and detection via the detection points. And a light receiving device 23B capable of receiving light.

  In order to start the exposure operation of the substrate P, the control device 7 moves the substrate stage 2 to the substrate replacement position, and uses the transfer system (not shown) to place the substrate stage 2 on the substrate replacement position. The substrate P before exposure is loaded. After the substrate P is loaded on the substrate stage 2, the control device 7 operates the second drive system 2D to start the movement of the substrate stage 2 from the substrate exchange position toward the irradiation position EP.

  The detection area of the detection system 23 is disposed between the substrate replacement position and the irradiation position EP. The control device 7 detects position information on the surface of the substrate P using the detection system 23 while the substrate stage 2 is moving from the substrate replacement position to the irradiation position EP. In the present embodiment, the control device 7 uses the encoder system 4 to measure the position information of the substrate stage 2 in the XY plane, and uses the detection system 23 while moving the substrate stage 2 in the XY plane. Perform detection operation.

  The control device 7 starts an operation of sequentially exposing a plurality of shot regions of the substrate P through the projection optical system PL and the liquid LQ in the immersion space LS. When the exposure operation of the substrate P is started, an immersion space LS is formed with the liquid LQ between the terminal optical element 21 and the immersion member 5 and the surface of the substrate P. The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 7 controls the mask stage 1 and the substrate stage 2 to perform predetermined scanning in the XY plane that intersects the optical axis AX (optical path of the exposure light EL) with the mask M and the substrate P. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 7 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  In the present embodiment, during the exposure of the substrate P, the position information of the mask stage 1 is measured by the first interferometer unit 3A, and the position information of the substrate stage 2 is measured by the encoder system 4. The first interferometer unit 3A acquires position information of the mask stage 1 (mask M) using measurement light. The encoder system 4 acquires the position information of the substrate stage 2 (substrate P) using the measurement light LB. Based on the position information of the mask stage 1 acquired using the first interferometer unit 3A and the position information of the substrate stage 2 acquired using the encoder system 4 during the exposure of the substrate P, the control device 7 The substrate P is irradiated with exposure light EL while controlling the position of each of the substrates P.

  In the encoder system 4, the position information of the substrate stage 2 (substrate P) is acquired by reading the encoder scale 33 with the encoder head 31. At this time, from the opening 8 </ b> C of the environmental adjustment device 8, FIG. As shown, the environmental adjustment gas KA is ejected and supplied. In the present embodiment, a humidity gradient and a temperature gradient may occur on the optical path of the measurement light LB due to the vaporization of the liquid LQ in the immersion space LS. For example, the humidity of the optical path of the measurement light LB near the immersion space LS may be high, and the humidity of the optical path of the measurement light LB away from the immersion space LS may be low. Further, a temperature gradient may occur due to a difference in latent heat of vaporization caused by the humidity gradient. When the humidity gradient occurs, for example, a refractive index gradient with respect to the measurement light LB is generated between the encoder head 31 and the scale member 33. there is a possibility. In addition, the refractive index gradient may change over time. As a result, the measurement accuracy of the encoder system 4 is lowered, and the position control accuracy of the substrate stage 2 is lowered. As a result, an exposure failure may occur. In this embodiment, the optical path of the measurement light LB and its Since the periphery is filled with the environmental adjustment gas KA, the position information of the substrate stage 2 (substrate P) is obtained with high accuracy by reading the encoder scale 33 without being adversely affected by the temperature fluctuation and humidity fluctuation of the atmosphere. be able to.

  In the present embodiment, the measurement value of the second interferometer unit 3B assists when correcting (calibrating) long-term fluctuations in the measurement value of the encoder system 4 (for example, deformation over time of the scale member 33). Used.

  After the exposure of the substrate P is completed, the control device 7 operates the second drive system 2D to unload the exposed substrate P from the substrate stage 2, and moves from the irradiation position EP to the substrate replacement position. The movement of the substrate stage 2 is started. The control device 7 moves the substrate stage 2 to the substrate exchange position, and uses the transfer system (not shown) to unload the substrate P after exposure from the substrate stage 2 arranged at the substrate exchange position. . Thereafter, the control device 7 loads the substrate P before exposure onto the substrate stage 2 using the transport system. Thereafter, the same processing as described above is repeated.

As described above, in this embodiment, since the environmental adjustment gas KA is supplied from the opening 8C, it is possible to easily suppress the generation of the temperature gradient and the humidity gradient in the optical path of the measurement light LB of the encoder system 4. it can. Accordingly, it is possible to suppress a decrease in measurement accuracy of the encoder system 4 and to favorably execute the movement control of the substrate stage 2 based on the measurement result. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.
In the present embodiment, since the opening 8C for supplying the environmental adjustment gas KA to the substrate stage 2 is provided, the environmental adjustment gas is supplied over the entire movement range of the substrate stage 2 as before. Therefore, it is possible to contribute to downsizing and cost reduction of the apparatus. Further, even when there is a member such as the encoder scale 33 on the ceiling and the supply of the environmental adjustment gas from above is hindered, the environmental adjustment gas KA can be easily supplied.

  In the first embodiment, the opening 8C is configured to eject the environmental adjustment gas KA in the normal direction of the upper surface 2T of the substrate stage 2. However, as shown in FIG. The scale 33 may be configured to eject toward the position where the measurement light LB is irradiated. With this configuration, the atmosphere of the optical path of the measurement light LB can be adjusted effectively.

(Second Embodiment)
Next, a second embodiment of the environment adjustment device 8 will be described with reference to FIGS.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.
In the first embodiment, the opening 8C is formed on the upper surface 2T of the substrate stage 2, but the second embodiment is different from the first embodiment in that it is provided on a separate member.

As shown in FIG. 6, a gas ejection member 120 is integrally attached to each side surface of the substrate stage 2 so as to be located on the opposite side of the substrate P with the encoder head 31 interposed therebetween. As shown in FIG. 7, a gas supply path 8 </ b> A is formed in the gas ejection member 120, and the environment is adjusted toward the position where the measurement light LB is irradiated on the encoder scale 33 at the tip of the gas supply path 8 </ b> A. An opening 8C for ejecting the working gas KA is formed.
The upper surface of the gas ejection member 120 is formed at a position that does not protrude from the upper surface 2T of the substrate table 2.

  In the environment adjusting device 8 having the above-described configuration, in addition to obtaining the same operations and effects as those in the first embodiment, the gas supply path 8A and the opening 8C are not formed in the substrate table 2. It can be easily manufactured. Further, in the present embodiment, even when the ejection direction of the environmental adjustment gas KA is changed, it can be easily handled by changing the mounting position of the gas ejection member 120 or the like.

(Third embodiment)
Next, a third embodiment of the environment adjustment device 8 will be described with reference to FIGS.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.
In the first embodiment, the opening 8C is provided directly (first embodiment) or indirectly (second embodiment) on the substrate stage 2. However, in the third embodiment, the opening 8C is synchronously moved with the substrate stage 2. A case where the second moving body is provided will be described.

  A substrate stage (stage device) WST shown in FIG. 8 is continuously moved in the Y axis direction by a substrate table WT holding a substrate P and a substrate table WT supported by a surface plate WB and integrally with the substrate table WT by a driving device such as a linear motor. In addition, an XY stage (moving body) 71 that is step-moved in the X-axis direction and further movable in the θZ direction is provided. A plurality of actuators such as a voice coil motor are provided between the substrate table WT and the XY stage 71. By driving these actuators, the substrate table WT is in the Z-axis direction and the θX direction with respect to the XY stage 71. , And θY direction in three directions are possible, and as a whole, it has 6 degrees of freedom.

  The driving device for driving the XY stage 71 drives the XY stage 71 with a long stroke in the X direction, and drives the XY stage 71 in the Y direction, Z direction, θx, θy, θz, and the XY stage 71, Second drive systems 73A and 73B for driving the first drive system 72 with a long stroke in the Y direction are provided. The second drive system 73A includes a stator 74A extending in the Y direction and a mover 75A. The second drive system 73B includes a stator 74B extending in the Y direction and a mover 75B. The first drive system 72 is provided between the movers 75A and 75B.

  The second drive systems 73A and 73B move integrally with the substrate stage WST in the Y-axis direction, and follow (synchronize with) the substrate stage WST by driving the X linear motor 70 in the X direction. And a tube carrier 76 as a moving substage. The tube carrier 76 relays a power supply member (not shown) connected to the substrate stage (moving body) WST, such as electric wiring and an air supply pipe. In FIG. 8, only one tube carrier 76 is shown, but actually, it is provided on both sides in the Y direction with the XY stage 71 interposed therebetween.

  As shown in FIGS. 9 and 10, the gas ejection member 120 </ b> Y is mounted on the tube carrier 76 on both sides in the Y direction across the substrate table WT without contacting the substrate table WT. In addition, the gas ejection members 120X are disposed in non-contact with the substrate table WT, located on both sides in the Y direction across the substrate table WT. The gas ejection member 120X is integrally connected to the gas ejection member 120Y by the connecting portion 121. Although not shown, the connecting portion 121 is provided with a gas introduction path, and a part of the environmental adjustment gas supplied to the gas ejection member 120Y passes through the gas introduction path. 120X.

A gas supply path 8A is formed in each of the ejection members 120X and 120Y, and the environmental adjustment gas KA is directed toward the position where the measurement light LB is irradiated on the encoder scale 33 at the tip of the gas supply path 8A. An opening 8C to be ejected is formed.
The upper surfaces of the gas ejection members 120X and 120Y are also formed at positions that do not protrude from the upper surface of the substrate table WT.

In the above configuration, when the substrate stage 71 and the substrate table WT move in the X direction, the tube carrier 76 moves synchronously (follows up), so that vibrations and the like are transmitted to the substrate table WT via the power supply member. Can be prevented. In addition, since the environmental adjustment gas is supplied from the opening 8C of the ejection members 120X and 120Y toward the optical path of the measurement light LB, the position information of the substrate table WT (substrate P) can be obtained with high accuracy as described above. It can be measured.
As described above, in the present embodiment, in addition to obtaining the same operation and effect as in the first embodiment, the environmental adjustment gas KA does not flow in the substrate stage 71 and the substrate table WT, and is vibrated. Since it is provided independently of the environment adjustment device 8, it is possible to prevent the vibration associated with the supply of the environment adjustment gas KA from being transmitted to the substrate table WT (substrate P) and adversely affecting the pattern imaging characteristics.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above embodiment, the environment adjustment apparatus 8 adjusts the atmosphere using the encoder system 4. However, the encoder system 4 is not essential, and the environment adjustment apparatus 8 adjusts the environment to the surface side of the substrate stage 2 and the WT. By supplying the working gas, it is possible to scatter water generated by immersion exposure and suppress adverse effects such as temperature fluctuations and condensation due to heat of vaporization.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  Furthermore, as disclosed in, for example, US Pat. No. 6,897,963, a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or various photoelectric sensors are mounted, and a substrate to be exposed is mounted. The present invention can also be applied to an exposure apparatus that includes a measurement stage that is not held. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 11, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage (moving body), 2T ... Upper surface (surface), 4 ... Encoder system (measuring device), 8 ... Environmental adjustment device, 8C ... Opening part (gas supply part), 31 ... Encoder head (injection part), 32 ... Support member (support part), 33 ... Encoder scale (measurement part), 71 ... XY stage (moving body), EX ... Exposure apparatus, WST ... Substrate stage (stage apparatus)

Claims (8)

An environment adjusting device for adjusting an environment of a space in which a moving body moves,
An environment adjustment apparatus having a gas supply unit that moves along with the movement of the moving body and supplies an environmental adjustment gas to the surface side of the moving body.   The environment adjusting device according to claim 1, wherein the gas supply unit has an opening that opens to the surface of the moving body and ejects the environment adjusting gas. A second moving body provided in non-contact with the moving body and moving synchronously with the moving body;
The environment adjusting device according to claim 1, wherein the gas supply unit is provided in the second moving body.   The environment adjusting device according to claim 3, wherein the second moving body supports a power supply member that supplies power to the mobile body. A measuring device having an emission unit that emits measurement light, and a measurement unit that is disposed at a position that can face the emission unit and that is irradiated with the measurement light emitted from the emission unit;
The moving body is provided with either the injection unit or the measurement unit,
The environment adjustment according to any one of claims 1 to 4, wherein the other of the injection unit and the measurement unit is supported by a support unit disposed at a position facing the moving region of the moving body. apparatus. The measuring device includes an encoder system having an encoder head and a scale member that can face the encoder head,
The environment adjusting device according to claim 5, wherein the injection unit includes the encoder head.   A stage device comprising the environment adjusting device according to any one of claims 1 to 6.   An exposure apparatus comprising the stage apparatus according to claim 7.

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