JP5233483B2 - Stage apparatus, exposure apparatus, and device manufacturing method - Google Patents

Description

  The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method.

In an exposure apparatus used in a photolithography process, by performing negative pressure suction in parallel with, for example, jetting air to the surface of a surface plate, as a guide when driving a stage such as a substrate stage, A so-called vacuum preload type air bearing (gas bearing) is used in which a minute amount of gap is formed between the surface of the surface plate and the stage is brought into non-contact.
In recent years, an EUV exposure apparatus that uses extreme ultra-violet (EUV) light as exposure light has been devised, for example, as disclosed in Patent Document 1 below, in order to make the pattern finer. Yes.
JP 2005-32510 A

However, the following problems exist in the conventional technology as described above.
Since an EUV exposure apparatus performs exposure processing in a vacuum environment, if an air bearing is used as a stage drive guide, air may adversely affect various devices.
Therefore, it may be possible to use it as a drive guide while sucking the air around the air bearing, but in consideration of the current situation where high-precision exposure processing is required as the line width of the pattern is reduced, it cannot be sucked completely. The negative effects of air cannot be ignored.
Although it is conceivable to use another driving source (for example, electromagnetic force) without using air, it is difficult to ensure guide accuracy during driving for a stage having a large weight.

  The present invention has been made in consideration of the above points, and a stage apparatus and an exposure apparatus capable of ensuring guide accuracy during driving without adversely affecting various devices even for a moving body having a large weight, and the exposure apparatus. It is an object to provide a device manufacturing method using an exposure apparatus.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 showing the embodiment.
The stage apparatus of the present invention includes a mover (75A) that moves in the first direction (Y) while supporting the movable body (2), and a stator (74A) that drives the mover along the first direction. A stage device (ST) having a force that acts on the mover in a second direction (Z) that intersects the first direction by a magnetic force to bring the mover and the stator into a non-contact state. According to the relative position between the first driving device (78) and the mover and the stator, an electromagnetic force acting on the mover in the second direction is generated, and the mover moves in the first direction. And a second driving device (79) used for calibration related to driving of the first driving device.
Therefore, in the stage device of the present invention, the moving body can be moved while eliminating the adverse effects of air by applying a force in the second direction to the mover by the magnetic force in the first driving device. Further, in the present invention, when the mover moves in the first direction, the error in applying the force in the second direction to the mover by the first drive device is calibrated by the electromagnetic force by the second drive device, The guide accuracy in the second direction can be ensured when the moving body is driven.

Further, the exposure apparatus of the present invention includes the stage apparatus (ST) described above.
Therefore, in the exposure apparatus of the present invention, for example, when moving a moving body such as a mask stage or a substrate stage in the first direction, it is possible to ensure the guide accuracy when moving in the second direction while eliminating the adverse effects of air. .

Moreover, the device manufacturing method of the present invention uses the exposure apparatus (EX) described above.
Therefore, in the device manufacturing method of the present invention, it is possible to manufacture a high-quality device because it is possible to eliminate the adverse effects of air while ensuring the guide accuracy when the moving body moves.
In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

  In the present invention, it is possible to secure guide accuracy during driving without adversely affecting various devices even for a moving body having a large weight.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system.
Here, description will be made using an example in which the stage apparatus is applied to a substrate stage that holds and moves a substrate such as a wafer in an exposure apparatus.

  The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows the exposure apparatus EX. In the present embodiment, a case where the exposure apparatus EX is an EUV exposure apparatus that exposes the substrate P with extreme ultra-violet (EUV) light will be described as an example. Extreme ultraviolet light is an electromagnetic wave in a soft X-ray region having a wavelength of about 5 to 50 nm, for example. In the following description, extreme ultraviolet light is appropriately referred to as EUV light. As an example, in the present embodiment, EUV light having a wavelength of 13.5 nm is used as the exposure light EL.

First, an outline of the exposure apparatus EX according to the present embodiment will be described.
In FIG. 1, an exposure apparatus EX includes a mask stage 1 that is movable while holding a mask M on which a pattern is formed, a stage apparatus ST that includes a substrate stage 2 that is movable while holding a substrate P, and exposure light EL. , An illumination optical system IL that illuminates the mask M with the exposure light EL from the light source device 3, and a projection optical system that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P PL and the control apparatus 4 which controls operation | movement of the whole exposure apparatus EX are provided. The substrate P includes a substrate in which a film such as a photosensitive material (resist) is formed on the surface of a base material such as a semiconductor wafer. The mask M includes a reticle on which a device pattern projected onto the substrate P is formed.

  In the present embodiment, the mask M is a reflective mask having a multilayer film capable of reflecting EUV light. The exposure apparatus EX illuminates the surface (reflection surface) of the mask M, on which the pattern is formed of the multilayer film, with the illumination light EL (EUV light), and the substrate P having photosensitivity with the exposure light EL reflected by the mask M. Exposure.

The exposure apparatus EX of the present embodiment includes a chamber apparatus (container) 6 that covers the first space 5 in which the exposure light EL travels and can be set in a predetermined state environment. The chamber device 6 includes a first space forming member 7 that forms the first space 5 in which the exposure light EL travels, and a first adjusting device 8 that adjusts the environment of the first space 5.
In the present embodiment, the first adjustment device 8 includes a vacuum system and adjusts the first space 5 to a vacuum state. The control device 4 uses the first adjustment device 8 to adjust the first space 5 in which the exposure light EL travels to a substantially vacuum state. As an example, in the present embodiment, the pressure in the first space 5 is adjusted to a reduced pressure atmosphere of about 1 × 10 ⁻⁷ [Pa].

The illumination light emitted from the light source device 3 travels through the first space 5. In the present embodiment, at least a part of the illumination optical system IL and the projection optical system PL are arranged in the first space 5. The illumination light emitted from the light source device 3 illuminates the mask M through the illumination optical system IL disposed in the first space 5. Then, the exposure light EL including information on the pattern image of the mask M passes through the projection optical system PL. In the present embodiment, the substrate stage 2 is disposed in the first space 5.
In the description of the present embodiment, the EUV light from the light source device 3 until it illuminates the mask M is described as illumination light, and the EUV light that is reflected by the mask M and projected onto the substrate P is described as exposure light EL. However, for convenience of explanation, the names are properly used, and both may be handled as the exposure light EL.

  The first space forming member 7 has a first opening 9 and a first surface 11 provided around the first opening 9. The first opening 9 is formed at a position where illumination light that has traveled through the first space 5 can enter. In the present embodiment, the first opening 9 is formed at a position where illumination light emitted from the illumination optical system IL can enter.

  The mask stage 1 is configured to move the mask 1 while holding the mask M, and is arranged to cover the first opening 9. The mask stage 1 has a second surface 12 that faces the first surface 11 provided on the first space forming member 7 (guide member 18), and the second surface 12 is guided by the first surface 11 while being guided by the first surface 11. Relative movement is possible with respect to one opening 9. In the present embodiment, the gas seal mechanism 10 is formed between the first surface 11 of the first space forming member 7 and the second surface 12 of the mask stage 1. At this time, a predetermined gap G <b> 1 is formed between the first surface 11 and the second surface 12. The gap G1 is adjusted to a predetermined amount (for example, about 0.1 to 1 μm), and the gas is suppressed from flowing into the first space 5 through the gap G1. In the present embodiment, the first opening 9 is covered with the mask stage 1, and the gas sealing mechanism 10 is formed between the first surface 11 and the second surface 12 as described above, so that the first space is formed. 5 will be in a substantially sealed state. Thereby, the chamber apparatus 6 can control the 1st space 5 to a predetermined state (vacuum state).

  The mask stage 1 holds the mask M so that the mask M is arranged in the first space 5 through the first opening 9. In the present embodiment, the mask stage 1 is disposed on the + Z side of the first space 5 and holds the mask M so that the reflective surface of the mask M faces the −Z side (first space 5 side). In the present embodiment, the mask stage 1 holds the mask M so that the reflective surface of the mask M and the XY plane are substantially parallel. The illumination light emitted from the illumination optical system IL is applied to the reflective surface of the mask M held on the mask stage 1.

  The mask stage 1 will be described in more detail. The mask stage 1 is larger than the first opening 9, has a second surface 12, and is configured to be movable with respect to the first surface 11 and the first opening. 13 and a second stage 14 that is smaller than the first opening 9 and configured to be movable with respect to the first stage 13 while holding the mask M. The first stage 13 is disposed so as to cover the first opening 9, and the gas seal mechanism 10 is formed between the second surface 12 of the first stage 13 and the first surface 11 of the first space forming member 7. The The first stage 13 is movable with respect to the first surface 11 and the first opening 9 while being guided by the first surface 11. The second stage 14 is disposed on the −Z side (first space 5 side) of the first stage 13. The mask M held on the second stage 14 is disposed in the first space 5 through the first opening 9. The second stage 14 is movable with respect to the first stage 13 while holding the mask M. With such a configuration, the first stage 13 can function as a coarse movement stage for moving the mask M, and the second stage can function as a fine movement stage for moving the mask M. Note that the first stage 13 and the second stage 14 have drive devices that move each stage, although not shown.

The chamber device 6 includes a second member 16 that forms the second space 15 between the outer surface of the first space forming member 7 and a second adjusting device 17 that adjusts the environment of the second space 15. ing. The second space 15 accommodates at least a part of the mask stage 1 (for example, the first stage 13 or the like). In the present embodiment, the outside of the first space 5 and the second space 15 is an atmospheric space, and the pressure is atmospheric pressure. The second adjustment device 17 adjusts the second space 15 to a pressure higher than the pressure of the first space 5 and lower than the atmospheric pressure. As an example, in the present embodiment, the pressure in the second space 15 is adjusted to a reduced pressure atmosphere of about 1 × 10 ⁻¹ [Pa].

  With the above configuration, at least a part of the mask stage 1 is disposed in the second space 15, and the mask M held on the mask stage 1 is disposed in the first space 5.

  The exposure apparatus EX is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P in a predetermined scanning direction in synchronization. In the present embodiment, the scanning direction (synchronous movement direction) of the mask M is the Y-axis direction, and the scanning direction (synchronous movement direction) of the substrate P is also the Y-axis direction. The exposure apparatus EX moves the shot area of the substrate P in the Y-axis direction with respect to the projection area of the projection optical system PL, and synchronizes with the movement of the shot area of the substrate P in the Y-axis direction. While moving the pattern formation region of the mask M with respect to the illumination region of the IL in the Y-axis direction, the mask M is illuminated with the exposure light EL, and the substrate P is irradiated with the exposure light EL from the mask M. Expose P.

  The first stage 13 of the mask stage 1 scans in the Y-axis direction (scanning) so that the entire pattern formation region of the mask M passes through the illumination region of the illumination optical system IL during scanning exposure of one shot region on the substrate P. Direction) with a relatively large stroke. As the first stage 13 moves in the Y-axis direction, the second stage 14 supported by the first stage 13 also moves in the Y-axis direction together with the first stage 13. Accordingly, when the first stage 13 moves in the Y-axis direction, the mask M held by the second stage 14 also moves in the Y-axis direction together with the first stage 13. The second stage 14 is slightly movable with respect to the first stage 13, and moves with a stroke smaller than the stroke of the first stage 13. Further, the second stage 14 may be movable with respect to the first stage 13 in the X direction with a small stroke.

Further, the gas seal mechanism 10 is formed between the first surface 11 of the first space forming member 7 and the second surface 12 of the first stage 13, and the first stage 13 with respect to the first space forming member 7. Even when the gas is moved, the gas is prevented from flowing into the first space 5. In the present embodiment, a gap adjusting mechanism for adjusting the gap G 1 between the first surface 11 and the second surface 12 is provided, and the first stage 13 is moved relative to the first space forming member 7. Even in this state, the gap G1 between the first surface 11 and the second surface 12 is maintained at a predetermined amount.
Thereby, even when the first stage 13 is moved with respect to the first space forming member 7, the gas is suppressed from flowing into the first space 5.

  The first space forming member 7 includes a guide member 18 on which the first surface 11 is formed, and a chamber member 19 facing at least a part of the guide member 18. The guide member 18 guides the movement of the mask stage 1. The mask stage 1 (first stage 13) moves relative to the first opening 9 while being guided by the first surface 11 of the guide member 18 as described above.

  In addition to the first space forming member 7 and the first adjustment device 8, the chamber device 6 includes a bellows member 20 that connects the guide member 18 and the chamber member 19. The bellows member 20 has flexibility and is elastically deformable. In the present embodiment, the bellows member 20 is made of stainless steel. Stainless steel has less outgassing. Therefore, the influence which the bellows member 20 has on the first space 5 can be suppressed. Note that the bellows member 20 is used as an example, and a material other than stainless steel can be used as long as the influence of degassing is small.

  The first space forming member 7 has a first opening 9 and a first surface 11, and is configured to include a guide member 18 and a chamber member 19. And by the guide member 18, the chamber member 19, the bellows member 20, the mask stage 1 (mainly the first stage 13), and the chamber member SC (part of the container, details will be described later) provided in the stage device ST. A substantially sealed first space 5 is formed. The chamber member 19 has an upper surface 19A facing the lower surface 18B of the guide member 18, and the bellows member 20 is disposed so as to connect the lower surface 18B of the guide member 18 and the upper surface 19A of the chamber member 19.

  In the present embodiment, the exposure apparatus EX includes a base member 21 and a first support member 23 supported on the base member 21 via a first vibration isolation system 22. The chamber member 19 is supported by the first support member 23. A first frame member 24 is disposed on the base member 21. The first frame member 24 includes a support portion 25 and a support portion 26 connected to the upper end of the support portion 25. A second support member 27 that supports the lower surface of the guide member 18 is connected to the support portion 26. The chamber member 19 and the second support member 27 are separated from each other. The chamber member 19 and the first frame member 24 are separated from each other, and a flexible (elastic) sealing mechanism such as a bellows member is disposed between the chamber member 19 and the first frame member 24. The chamber member 19 has an upper surface 19A facing the lower surface 18B of the guide member 18 supported by the second support member 27. The bellows member 20 is disposed so as to connect the lower surface 18B of the guide member 18 and the upper surface 19A of the chamber member 19.

  The light source device 3 is a so-called LPP (Laser Produced Plasma) light source that irradiates a target material such as xenon (Xe) with laser light, converts the target material into plasma, and generates EUV light. Device. The light source device 3 is a so-called DPP (Discharge Produced Plasma) type light source device that generates discharge in a predetermined gas, plasmifies the predetermined gas, and generates EUV light. Also good. EUV light (illumination light) generated by the light source device 3 enters the illumination optical system IL through a wavelength selection filter (not shown). Here, the wavelength selection filter has a characteristic of selectively transmitting only EUV light having a predetermined wavelength (for example, 13.4 nm) from light supplied from the light source device 3 and blocking transmission of light of other wavelengths. The EUV light that has passed through the wavelength selection filter illuminates a reflective mask (reticle) M on which a pattern to be transferred is formed via the illumination optical system IL.

  The illumination optical system IL illuminates the mask M with the exposure light EL from the light source device 3. The illumination optical system IL includes a plurality of optical elements, and illuminates a predetermined illumination area on the mask M with the exposure light EL having a uniform illuminance distribution. The optical element of the illumination optical system IL includes a multilayer film reflecting mirror including a multilayer film capable of reflecting EUV light. The multilayer film of the optical element includes, for example, a Mo / Si multilayer film.

  The first stage 13 of the mask stage 1 is movable in three directions including the X axis, the Y axis, and the θZ direction while holding the mask M. The second stage 14 of the mask stage 1 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions while the mask M is held. In the present embodiment, a laser interferometer (not shown) that can measure the position information of the mask stage 1 (mask M) and a focus / leveling detection system (not shown) that can detect the surface position information of the reflecting surface of the mask M. The control device 4 controls the position of the mask M held on the mask stage 1 based on the measurement result of the laser interferometer and the detection result of the focus / leveling detection system.

  The first stage 13 and the second stage 14 of the mask stage 1 are made of metal. As an example, the first stage 13 and the second stage 14 of the present embodiment are made of stainless steel with less outgassing (outgassing).

Returning to FIG. 1, the projection optical system PL includes a plurality of optical elements, and projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. The optical element of the projection optical system PL includes a multilayer reflector having a multilayer film capable of reflecting EUV light. The multilayer film of the optical element includes, for example, a Mo / Si multilayer film.
A plurality of optical elements of the projection optical system PL are held by the lens barrel 28. The lens barrel 28 has a flange 29. The lower end of the second frame member 30 is connected to the flange 29. The upper end of the second frame member 30 is connected to the support portion 26 of the first frame member 24 via a vibration isolation system 31. The lens barrel 28 (flange 29) is suspended from the second frame member 30.

FIG. 2 is an external perspective view of the stage apparatus ST.
As shown in FIG. 2, the stage device ST holds a surface plate JB and a substrate such as a wafer and continuously moves in the Y-axis direction, moves stepwise in the X-axis direction, and further moves slightly in the θZ direction. The stage (moving body) 2 is mainly configured.

  The driving device for driving the substrate stage 2 drives the substrate stage 2 with a long stroke in the X direction, and finely drives the substrate stage 2 in the Y direction, Z direction, θx, θy, θz, Second drive systems 73A and 73B that drive the first drive system 90 with a long stroke in the Y direction (first direction) are provided. The driving of the first drive system 90 and the second drive systems 73A and 73B is controlled by the control device 4.

The second drive system 73A includes a stator 74A that extends in the Y direction and a mover 75A that is a Y coarse movement stage that is driven with respect to the stator 74A. Similarly, the second drive system 73B includes a stator 74B that extends in the Y direction and a mover 75B that is a Y coarse movement stage that is driven with respect to the stator 74B.
The stator 74A has a plurality of coil bodies (not shown) inside, and controls the energization to the coil bodies, thereby moving the mover 75A in two directions, Y direction and X direction (third direction) ( Drive (with 2 degrees of freedom).

3 is a cross-sectional view of the second drive system 73A along the XZ plane, and FIG. 4 is a cross-sectional view along the YZ plane.
As shown in these drawings, the second drive system 73A generates a force that causes the mover 75A to act in the Z direction (second direction) by a magnetic force, so that the mover 75A and the stator 74A are not in contact with each other. An EI core type first driving device 78 is provided by combining the E type core and the I type core.

  The first drive device 78 extends in the Y direction on the both sides in the Z direction of the stator 74A in the second drive system 73A with a length over the moving range of the mover 75A (that is, a length equivalent to the stator 74A). A plurality of (here, two) I-type cores 78A and a movable element 75A are arranged in the Y-direction with a space between each other and facing each other in the Z-direction. And an E-type core 78B. In the first drive device 78, by controlling the energization of the coil portion 78C wound around the E-type core 78B, a Z-direction force for bringing the I-type core 78A closer is applied.

  The second drive system 73A is provided with a second drive device 79 that relatively moves the stator 74A and the mover 75A in the Z direction. The second drive device 79 extends to the −Z side of the stator 74A, and is provided to extend in the Y direction by a length over the moving range of the mover 75A (ie, a length equivalent to the stator 74A). The stator 79A and the mover 79B are arranged inside the mover 75A with an interval in the Y direction and provided opposite to both sides in the X direction across the stator 79A. The mover 79B is disposed at substantially the same position as the E-type core 78B in the Y direction.

As the second drive device 79 in the present embodiment, for example, a voice coil motor that applies an electromagnetic force acting in the Z direction to the mover 79B is used. As will be described later, the second driving device 79 is used for calibration related to driving of the first driving device 78.
The driving of the first driving device 78 and the second driving device 79 is controlled by the control device 4.

The second drive system 73B includes a stator 74B extending in the Y direction and a mover 75B that is a Y coarse movement stage driven with respect to the stator 74B.
The stator 74B has a plurality of coil bodies (not shown) inside, and controls the energization to the coil bodies to move the mover 75B in two directions, the Y direction and the Z direction (here, the third direction). Can be driven. That is, the second drive system 73A and the second drive system 73B are provided on both sides of the substrate stage 2, but the directions for driving the movers 75A and 75B are the same in the Y direction of the long stroke. The driving direction with a short stroke is different between the X direction and the Z direction.

FIG. 5 is a cross-sectional view of the second drive system 73B along the XZ plane.
Similarly to the second drive system 73A, the second drive system 73B generates a force that causes the mover 75B to act in the Z direction by a magnetic force, thereby bringing the mover 75B and the stator 74B into a non-contact state. An EI core type first driving device 88 is provided by coupling the core and the I type core.

  The first driving device 88 extends in the Y direction at the + X side end portion of the stator 74B in the second driving system 73B with a length over the moving range of the mover 75B (that is, a length equivalent to the stator 74B). A plurality of (here, two) I-type cores 88A and the mover 75B are arranged at intervals in the Y direction, and are respectively provided opposite to the I-type core 88A in the Z direction. And an E-type core 88B. In the first driving device 88, a Z-direction force for bringing the I-type core 88A closer is applied by controlling the energization of a coil portion (not shown) wound around the E-type core 88B.

  As shown in FIG. 2, the substrate stage 2 includes a stator 90A extending in the X direction between the movers 75A and 75B, and a substrate stage 2 provided on the substrate stage 2 as shown in FIG. The first drive system 90 such as a linear motor having a mover 90B that moves relative to the X direction moves in the X direction along the stator 90A.

  Similarly to the second drive system 73A, the first drive system 90 generates a force that causes the mover 90B (substrate stage 2) to act in the Z direction by a magnetic force, so that the mover 90B and the stator 90A are moved. An EI core type first driving device 98 is provided by coupling the E type core and the I type core in a non-contact state.

  The first driving device 98 extends on both sides in the Z direction of the stator 90A in the X direction with a length over the moving range of the mover 90B (substrate stage 2) (that is, a length equivalent to the stator 90A). A plurality of (here, two) I-type cores 98A and a plurality of (two in this case) are arranged in the X direction inside the substrate stage 2, and are respectively provided to face the I-type cores 78A in the Z direction. It is comprised from the core 98B. In the first drive device 98, a Z-direction force for bringing the I-type core 98A closer is applied by controlling the energization of a coil portion (not shown) wound around the E-type core 98B.

  Further, the first drive system 90 is provided with a second drive device 99 that relatively moves the stator 98A and the mover 90B (substrate stage 2) in the Z direction. The second driving device 99 extends to the −Z side of the stator 98A, and extends in the X direction with a length over the moving range of the mover 90B (that is, a length equivalent to the stator 98A). A plurality of stators 99A and a plurality of (here, two) stator elements 99B are disposed in the X direction in the substrate stage 2 so as to be opposed to both sides in the Y direction across the stator 99A. Consists of The mover 99B is disposed at substantially the same position as the E-type core 98B in the X direction.

As the second drive device 99 in the present embodiment, for example, a voice coil motor is used that applies an electromagnetic force acting in the Z direction to the mover 99B. As will be described later, the second driving device 99 is used for calibration related to driving of the first driving device 98.
The driving of the first driving devices 88 and 98 and the second driving device 99 is controlled by the control device 4.

Next, an example of the operation of the stage apparatus ST in the exposure apparatus EX having the above-described configuration will be described.
The substrate stage 2 moves in the X direction along the stator 90A by driving the first drive system 90, and moves the stator 90A along with the movement of the movers 75A and 75B by driving the second drive systems 73A and 73B. To move in the Y direction.

  When the substrate stage 2 is moved in the X direction, the substrate stage 2 is fixed by levitating (magnetically levitating) with a magnetic force acting in the Z direction (by controlling the amount of current supplied to the E-type core 98B) by driving the first driving device 98. A non-contact state is maintained with respect to the child 90A. Similarly, when the substrate stage 2 is moved in the Y direction via the movers 75A and 75B, it acts in the Z direction by driving the first driving devices 78 and 88 (by controlling the amount of current supplied to the E-type cores 78B and 88B). The movable elements 75A and 75B are kept in a non-contact state with respect to the stators 74A and 74B.

  Here, in the first driving device 98, since the mover 98B has a spring property with respect to the stator 98A, the position of the mover 98B in the Z direction when the substrate stage 2 moves in the X direction is There is a possibility of fluctuation depending on the position of the stage 2 in the X direction. That is, when the substrate stage 2 moves in the X direction, the position of the substrate stage 2 in the Z direction may vary depending on the position of the substrate stage 2 in the X direction.

  For the same reason, in the first driving devices 78 and 88, since the movers 78B and 88B have spring properties with respect to the stators 78A and 88A, respectively, when the movers 75A and 75B move in the Y direction. There is a possibility that the positions of the movers 78B and 88B in the Z direction vary depending on the positions of the movers 75A and 75B in the Y direction. That is, when the substrate stage 2 moves in the Y direction, the position of the substrate stage 2 in the Z direction may vary depending on the position of the substrate stage 2 in the Y direction.

  For this reason, in the present embodiment, the second driving device 79 is used to calibrate the driving of the first driving devices 78 and 88 accompanying the movement of the movers 75A and 75B in the Y direction. Similarly, the second drive device 99 is used to calibrate the drive of the first drive device 98 accompanying the movement of the substrate stage 2 in the X direction.

Specifically, for example, when the substrate stage 2 is driven in the X direction, the first driving device 98 drives the movable element 90B (substrate stage 2) with a predetermined amount of clearance from the stator 90A. The substrate stage 2 is moved while measuring the force with which the mover 99B in the second driving device 99 moves relative to the stator 99A.
As the substrate stage 2 moves, if the position of the mover 98B in the Z direction relative to the stator 98A varies due to the spring property, the position of the mover 99B in the Z direction relative to the stator 99A also varies in the second driving device 99. As a measuring device, the control device 4 can measure the position variation in the Z direction of the mover 98B according to the position in the X direction of the substrate stage 2 based on the variation in thrust in the second drive device 99. Then, a correction value for canceling the measured position change of the movable element 98B in the Z direction is obtained and stored according to the position of the substrate stage 2 in the X direction.

Similarly, when the substrate stage 2 is driven in the Y direction, for example, the first driving devices 78 and 88 drive the movable element 75A with respect to the stator 74A with a predetermined gap, and the stator 74B. The movable element 75B is lifted with a predetermined amount of clearance, and the movable elements 75A and 75B are moved while measuring the force with which the movable element 79B in the second driving device 79 moves relative to the stator 79A. Let
When the position of the mover 78B in the Z direction with respect to the stator 78A varies due to the movement of the mover 75A, 75B, the position of the mover 79B in the Z direction with respect to the stator 79A also varies in the second driving device 79. Therefore, the control device 4 can measure the position variation in the Z direction of the mover 78B corresponding to the position in the Y direction of the substrate stage 2 based on the variation in thrust in the second drive device 79 as a measuring device. Then, a correction value for canceling the measured position change of the movable element 78B in the Z direction is obtained and stored according to the position of the substrate stage 2 in the Y direction.

As described above, when the correction amounts of the first driving devices 98, 78, and 88 accompanying the movement of the substrate stage 2 in the X direction and the Y direction are obtained before the exposure processing, During the movement, the control device 4 adjusts the driving of the first driving devices 98, 78, and 88 using the position in the X direction and the position in the Y direction of the substrate stage 2 and the correction amount corresponding to the position.
Thereby, the substrate stage 2 moves along a predetermined locus without changing the position in the Z direction. During the exposure process, the operation of the second drive devices 79 and 99 may be stopped.

Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described.
The first space 5 is adjusted to a vacuum state (first pressure value) by the first adjusting device 8. Further, the second space 15 is approximately equal to the pressure of the first space 5 or higher than the pressure of the first space 5 and lower than the atmospheric pressure (second pressure value) by the second adjusting device 17. Adjusted to Alternatively, the second space 15 may be set to a pressure lower than that of the first space 5. The gap G1 between the first surface 11 and the second surface 12 is adjusted to a predetermined amount by the gap adjusting mechanism 35, and by the gas seal mechanism 10 formed between the first surface 11 and the second surface 12, Inflow of gas into the first space 5 is suppressed. Thereby, the vacuum state and environment of the first space 5 are maintained.

  After the mask M is held on the mask stage 1 and the substrate P is held on the substrate stage 2, the control device 4 starts an exposure process for the substrate P. In order to illuminate the mask M with illumination light, the control device 4 starts the light emission operation of the light source device 3.

  The EUV light emitted from the light source device 3 by the light emission operation of the light source device 3 enters the illumination optical system IL. The EUV light incident on the illumination optical system IL travels through the illumination optical system IL and is then supplied to the first opening 9. The EUV light supplied to the first opening 9 enters the mask M held on the mask stage 1 through the first opening 9 as illumination light. That is, the mask M held on the mask stage 1 is emitted from the light source device 3 and illuminated with illumination light (EUV light) via the illumination optical system IL. Illumination light that is irradiated onto the reflective surface of the mask M and reflected by the reflective surface enters the projection optical system PL that is disposed in the first space 5 as exposure light EL that includes information on the pattern image of the mask M. The exposure light EL that has entered the projection optical system PL travels through the projection optical system PL, and is then irradiated onto the substrate P held on the substrate stage 2.

  In synchronization with the movement of the mask M in the Y-axis direction, the control device 4 illuminates the mask M with the exposure light EL while scanning and moving the substrate P in the Y-axis direction by driving the second drive systems 73A and 73B. . Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P. Then, the control device 4 performs step movement of the substrate P in the X-axis direction by driving the first drive system 90 and scanning movement of the substrate P in the Y-axis direction by driving the second drive systems 73A and 73B. By repeating, the pattern of the mask M is exposed to the substrate P.

  As described above, in this embodiment, since the substrate stage 2 is levitated by the magnetic force using the first driving devices 78, 88, 98, even the heavy substrate stage 2 is air-conditioned in a vacuum environment. It is possible to move while avoiding adverse effects on various devices caused by gas, such as when a gas bearing such as a bearing is used. Further, in the present embodiment, the second drive is also performed in advance against a positional variation due to the spring property that may occur when the EI core type first drive devices 78 and 98 having the E type core and the I type core are driven. Since the calibration is performed using the devices 79 and 99, the guide accuracy when driving the substrate stage 2 can be ensured easily and reliably.

  In the present embodiment, since the drive directions for the mover are different in the second drive systems 73A and 73B, for example, the amount of protrusion of the mover 75B in the + Z direction is greater than the amount of protrusion of the mover 75A in the + Z direction. Can also be reduced. Therefore, in the present embodiment, when the position of the substrate stage 2 is measured using detection light such as a laser interferometer, the detection light is projected to an optimal position on the substrate stage 2 without being shielded by the mover 75B. It becomes possible to emit light, and the position detection accuracy of the substrate P can be effectively increased.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the position variation of the movers 75A and 90B (substrate stage 2) is measured based on the thrust variation of the second drive devices 79 and 99. In addition to this, for example, the mover It is possible to further improve the position measurement accuracy by providing a position measurement device such as a capacitance sensor on the substrate stage 2 facing the stators 74A and 90A and using the position measurement result together. .

  Further, in the above-described embodiment, the correction amount of the position variation of the mover 75A is used for the calibration of the position variation of the mover 75B. However, the present invention is not limited to this. Similarly to the two-drive system 73A, a second drive device including a voice coil motor or the like may be provided for calibration related to the drive of the first drive device 88.

  In the above embodiment, the first drive devices 78, 88, 98 are arranged on both sides in the Z direction of the stators 74A, 74B, 90A, but the present invention is not limited to this, and the first drive devices 78, 88, When 98 can express a sufficient thrust capable of supporting the weight of the substrate stage 2 or the like, the configuration may be such that only the −Z side is arranged.

In the above embodiment, the case where the present invention is applied to the stage apparatus ST has been described. However, the present invention can also be applied to the mask stage 1 and further to both the mask stage 1 and the stage apparatus ST. It is.
Further, the present invention can be used in devices other than the exposure apparatus. For example, the present invention can be applied to various measuring instruments and manufacturing apparatuses used in a vacuum environment. It will be apparent to those skilled in the art that various modifications can be made to the present invention without departing from the spirit or scope of the invention.

The stage apparatus ST also supports and relays various power members for supplying power, air, and other power to the substrate stage 2, and is connected to the movable elements 75A and 75B in the Y direction, for example. The present invention can be applied to a configuration in which a tube carrier (wiring stage) that moves integrally and moves in synchronization with the substrate stage 2 is provided in the X direction.
In this case, a sensor (such as an illumination unevenness sensor) conventionally mounted on the substrate stage 2 may be provided on the tube carrier.
As a result, the substrate stage 2 can be reduced in weight, and heat generation associated with the driving of the substrate stage 2 can be suppressed.

  The substrate (object) in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or a mask or reticle used in an exposure apparatus. The original plate (synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate through a projection optical system, and one scanning exposure is performed on one substrate. The present invention can also be applied to an exposure apparatus that performs double exposure of shot areas almost simultaneously.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In this embodiment, the case where the exposure light EL is EUV light has been described as an example. However, as the exposure light EL, for example, bright lines (g-line, h-line, i-line) emitted from a mercury lamp and KrF. It is also possible to use far ultraviolet light (DUV light) such as excimer laser light (wavelength 248 nm), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F2 laser light (wavelength 157 nm), or the like. In this case, the first space 5 is not necessarily adjusted to a vacuum state, and for example, the first space 5 can be filled with the first gas. When the first space 5 is filled with the first gas, the gas seal mechanism 10 of this embodiment can be used to maintain the environment of the first space 5 filled with the first gas. Further, the second space 15 formed by the second member 16 can be filled with the second gas.

  The present invention can also be applied to a twin stage type exposure apparatus provided with a plurality of substrate stages (wafer stages). The structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407. Furthermore, the present invention may be applied to the wafer stage disclosed in Japanese Patent Application No. 2004-168482 filed earlier by the present applicant.

  An exposure apparatus to which the present invention is applied assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

Next, an embodiment of a manufacturing method of a micro device using the exposure apparatus and the exposure method according to the embodiment of the present invention in the lithography process will be described. FIG. 7 is a flowchart showing a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micro machine, etc.).
First, in step S10 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.
Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

FIG. 8 is a diagram illustrating an example of a detailed process of step S13 in the case of a semiconductor device.
In step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pre-processing process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.
At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., from mother reticles to glass substrates and The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a silicon wafer or the like. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity-type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

FIG. 2 is a view showing an embodiment of the present invention, and is a schematic block diagram showing an exposure apparatus EX. It is an external appearance perspective view of the stage apparatus ST. It is the figure which cut the 2nd drive system 73A in the XZ plane. It is the figure which cut the 2nd drive system 73A in the YZ plane. It is the figure which cut the 2nd drive system 73B in the XZ plane. It is the figure which cut the 1st drive system 90 in the YZ plane. It is a flowchart which shows an example of the manufacturing process of the microdevice of this invention. It is a figure which shows an example of the detailed process of step S13 in FIG.

Explanation of symbols

  EX ... Exposure device ST ... Stage device 2 ... Substrate stage (moving body) 4 ... Control device (measuring device) 6 ... Chamber device (container) 74A ... Stator, 75A ... Motor, 78, 98 ... 1st drive unit, 78A, 88A ... I type core, 78B, 88B ... E type core, 79, 99 ... 2nd drive unit

Claims (9)

A stage device having a mover that supports a moving body and moves in a first direction, and a stator that drives the mover along the first direction,
A first driving device that generates a force acting in a second direction intersecting the first direction with respect to the mover by a magnetic force to bring the mover and the stator into a non-contact state;
An electromagnetic force acting in the second direction is generated on the mover according to a relative position between the mover and the stator, and the first accompanying the movement of the mover in the first direction is generated. A stage device having a second driving device used for calibration related to driving of the driving device. A measuring device that measures in advance the relative position between the mover and the stator driven by the first drive device based on the thrust of the second drive device when the mover moves in the first direction;
The stage device according to claim 1, further comprising: a control device that controls driving of the first drive device when the mover moves in the first direction based on a measurement result of the measurement device.   The stage apparatus according to claim 1, wherein the stator generates a force acting on the movable element in a third direction that intersects the first direction and the second direction, respectively.   The stage device according to claim 3, wherein the stator and the mover are provided in pairs on both sides of the movable body and different in the third direction.   5. The first drive device according to claim 1, further comprising: an E-type core provided on the mover; and an I-type core provided on the stator over a moving range of the mover. The stage apparatus according to item.   The stage device according to any one of claims 1 to 5, wherein the second driving device includes a linear motor.   An exposure apparatus comprising the stage apparatus according to any one of claims 1 to 6.   The exposure apparatus according to claim 7, further comprising a container that maintains a space for housing the stage device in a negative pressure state.   A device manufacturing method using the exposure apparatus according to claim 7 or 8.

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