JP2009135145A - Support device, and exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To support a support subject to smoothly drive while maintaining a predetermined negative pressure state. <P>SOLUTION: A piston device PT having a cylinder 61 and a piston 71 supports the support subject PL arranged in a first space 5 set at a first pressure lower than an atmosphere. The support device comprises a rod 72 which is connected to the piston 71 and the support subject, and is provided to move axially with respect to the cylinder through an air gap 64 opened on the first space provided in the cylinder, a second space 15 which is set at a second pressure higher than the first pressure and lower than the atmosphere, and houses the cylinder, a gas bearing 75 formed between the air gap and rod, and having a gas blowing part 82, and a suction device 83 for sucking gas from the air gap in a position closer to the first space from a position where the gas blowing part is arranged, and an air intake passage 86 of which one end is opened to the air gap in a position closer to the first space than a position for sucking the gas from the air gap, and of which other end is opened to the second space. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a support apparatus and an exposure apparatus.

  Projection exposure apparatus for transferring an image of a reticle pattern as a mask to each shot region on a wafer (or glass plate or the like) coated with a resist as a substrate via a projection optical system when manufacturing a semiconductor element or the like Is used. Conventionally, as a projection exposure apparatus, a step-and-repeat type (batch exposure type) projection exposure apparatus (stepper) has been widely used. Recently, a reticle and a wafer are scanned synchronously with respect to a projection optical system. A scanning exposure type projection exposure apparatus (scanning type exposure apparatus) such as a step-and-scan system in which exposure is performed is also attracting attention.

  In a conventional exposure apparatus, a reticle stage that supports and conveys a reticle that is a pattern original and a wafer to which the pattern is transferred, and a drive unit of the wafer stage are fixed to a structure that supports a projection optical system, In addition, the vicinity of the center of gravity of the projection optical system is fixed to the structure. Further, in order to position the wafer stage with high accuracy, the position of the wafer stage is measured by a laser interferometer, and a moving mirror for the laser interferometer is attached to the wafer stage.

  As described above, in the conventional exposure apparatus, since the driving unit such as the wafer stage and the projection optical system are fixed to the same structure, the vibration generated by the driving reaction force of the stage is transmitted to the structure, and further the projection optical system. The vibration was also transmitted. Since all mechanical structures mechanically resonate with vibrations of a predetermined frequency, transmission of such vibrations to the structure causes deformation of the structure and resonance phenomenon, resulting in misalignment of the transferred pattern image. And there is a disadvantage that the contrast is lowered.

Therefore, Patent Document 1 discloses a technique for suppressing vibration transmitted to the projection optical system with a relatively simple mechanism by suspending and supporting the projection optical system on a frame via a vibration isolation device.
International Publication No. 06/038952 Pamphlet

However, the following problems exist in the conventional technology as described above.
For example, when a piston device having a cylinder and a piston is used as the vibration isolator and the projection optical system is supported by the piston, the cylinder is placed between the piston and the piston in order to smoothly drive the piston without contact with the cylinder. It is conceivable to use an air bearing configured by supplying pressurized air to the gap to be formed and sucking the supplied air.

However, when the piston device is used in a vacuum chamber, there is a possibility that the air supplied for the air bearing cannot be sucked and leaks into the vacuum chamber, and the degree of vacuum in the vacuum chamber cannot be maintained sufficiently.
This problem is not limited to the case of supporting the projection optical system, and may occur similarly when supporting other components.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a support apparatus and an exposure apparatus that can support a support object in a smoothly drivable manner while maintaining a predetermined negative pressure state. To do.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 showing the embodiment.
The support device of the present invention is supported by a piston device (PT) having a cylinder (61) and a piston (71) and arranged in a first space (5) set at a first pressure lower than the atmosphere. A support device (60) for supporting an object (PL), which is connected to a piston and an object to be supported and is axially connected to the cylinder via a gap (64) opened in a first space provided in the cylinder. A movable rod (72), a second pressure higher than the first pressure and lower than the atmosphere, the second space (15) for accommodating the cylinder, the gap and the rod A gas bearing (75) formed between and having a gas blowing part (82), and a suction device (83) for sucking gas from the gap at a position closer to the first space than the position where the gas blowing part is provided; Position where one end sucks gas from gap Rimodai open to the air gap at a position near the first space, the other end is characterized in that it has a, an intake passage which is open (86) to the second space.

Therefore, in the support device of the present invention, the gas blown out from the gas blowing portion (82) forms the gas bearing (75) between the gap (64) of the cylinder (61) and the rod (72). The piston and the supporting object can be smoothly moved in the axial direction via the rod.
In addition, the gas blown out from the gas blowing section (82) is sucked and exhausted from the gap (64) by the suction device (83). However, the gas that could not be sucked out passes through the gap into the first space ( 5), the air is sucked from the intake passage (86) that opens to the air gap at a position closer to the first space than the position for sucking the gas, and opens to the second space set to a pressure lower than the atmospheric pressure. .
Therefore, in the present invention, the piston and the rod can be moved in the axial direction while suppressing the gas from leaking from the gap into the first space.

The exposure apparatus of the present invention is characterized by including the support device described above.
Therefore, in the exposure apparatus of the present invention, it is possible to support the exposure apparatus constituent members by allowing the piston and the rod to move in the axial direction while suppressing gas from leaking into the first space.

  In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

  In this invention, a support target object can be supported so that it can drive smoothly, maintaining the pressure of 1st space.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows the exposure apparatus EX. In the present embodiment, a case where the exposure apparatus EX is an EUV exposure apparatus that exposes the substrate P with extreme ultra-violet (EUV) light will be described as an example. Extreme ultraviolet light is an electromagnetic wave in a soft X-ray region having a wavelength of about 5 to 50 nm, for example. In the following description, extreme ultraviolet light is appropriately referred to as EUV light. As an example, in the present embodiment, EUV light having a wavelength of 13.5 nm is used as the exposure light EL.

First, an outline of the exposure apparatus EX according to the present embodiment will be described.
In FIG. 1, an exposure apparatus EX includes a mask stage 1 that is movable while holding a mask M on which a pattern is formed, a substrate stage 2 that is movable while holding a substrate P, and a light source device that generates exposure light EL. 3, an illumination optical system IL that illuminates the mask M with the exposure light EL from the light source device 3, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and an exposure apparatus And a control device 4 for controlling the operation of the entire EX. The substrate P includes a substrate in which a film such as a photosensitive material (resist) is formed on the surface of a base material such as a semiconductor wafer. The mask M includes a reticle on which a device pattern projected onto the substrate P is formed.

  In the present embodiment, the mask M is a reflective mask having a multilayer film capable of reflecting EUV light. The exposure apparatus EX illuminates the surface (reflection surface) of the mask M, on which the pattern is formed of the multilayer film, with the exposure light EL (EUV light), and the substrate P having photosensitivity with the exposure light EL reflected by the mask M. Exposure.

The exposure apparatus EX of the present embodiment includes a chamber apparatus 6 that can set the first space 5 in which the exposure light EL travels to an environment in a predetermined state. The chamber device 6 includes a first member 7 that forms a first space 5 in which the exposure light EL travels, and a first adjustment device 8 that adjusts the environment of the first space 5.
In the present embodiment, the first adjustment device 8 includes a vacuum system and adjusts the first space 5 to a vacuum state. The control device 4 uses the first adjustment device 8 to adjust the first space 5 in which the exposure light EL travels to a substantially vacuum state. As an example, in the present embodiment, the pressure in the first space 5 is adjusted to a reduced pressure atmosphere of about 1 × 10 ⁻⁴ [Pa].

  The exposure light EL emitted from the light source device 3 travels through the first space 5. In the present embodiment, at least a part of the illumination optical system IL and the projection optical system PL are arranged in the first space 5. The exposure light EL emitted from the light source device 3 passes through the illumination optical system IL and the projection optical system PL arranged in the first space 5. In the present embodiment, the substrate stage 2 is disposed in the first space 5.

  In the present embodiment, the first member 7 has a first opening 9 and a first surface 11 provided around the first opening 9. The first opening 9 is formed at a position where the exposure light EL that has traveled through the first space 5 can enter. In the present embodiment, the first opening 9 is formed at a position where the exposure light EL emitted from the illumination optical system IL can enter.

  The mask stage 1 is disposed so as to cover the first opening 9. The mask stage 1 has a second surface 12 that faces the first surface 11, and is capable of relative movement with the first opening 9 while being guided by the first surface 11. In the present embodiment, the gas seal mechanism 10 is formed between the first surface 11 of the first member 7 and the second surface 12 of the mask stage 1. In the present embodiment, a predetermined gap G <b> 1 is formed between the first surface 11 and the second surface 12. The gap G1 is adjusted to a predetermined amount (for example, about 0.1 to 1 μm), and the gas is suppressed from flowing into the first space 5 through the gap G1. In the present embodiment, the first opening 9 is covered with the mask stage 1, and the gas seal mechanism 10 is formed between the first surface 11 of the first member 7 and the second surface 12 of the mask stage 1. The first space 5 is almost sealed. Thereby, the chamber apparatus 6 can control the 1st space 5 to a predetermined state (vacuum state).

  The mask stage 1 holds the mask M so that the pattern surface (the surface on the −Z side) of the mask M is disposed in the first space 5 through the first opening 9. In the present embodiment, the mask stage 1 is disposed on the + Z side of the first space 5 and holds the mask M so that the reflective surface of the mask M faces the −Z side (first space 5 side). In the present embodiment, the mask stage 1 holds the mask M so that the reflective surface of the mask M and the XY plane are substantially parallel. The exposure light EL emitted from the illumination optical system IL is applied to the reflective surface of the mask M held on the mask stage 1.

  In the present embodiment, the mask stage 1 is larger than the first opening 9 and has a first surface 13 on which the second surface 12 is formed. The mask stage 1 is smaller than the first opening 9 and holds the mask M with respect to the first stage 13. And a movable second stage 14. The first stage 13 is disposed so as to cover the first opening 9, and the gas seal mechanism 10 is formed between the second surface 12 of the first stage 13 and the first surface 11 of the first member 7. The first stage 13 is movable with respect to the first opening 9 while being guided by the first surface 11. The second stage 14 is disposed on the −Z side (first space 5 side) of the first stage 13. The mask M held on the second stage 14 is disposed in the first space 5 through the first opening 9. The second stage 14 is movable with respect to the first stage 13 while holding the mask M.

Further, in the present embodiment, the chamber device 6 has the second member 16 that forms the second space 15 that accommodates the mask stage 1 between the outer surface of the first member 7 and the environment of the second space 15. And a second adjusting device 17 for adjusting. In the present embodiment, the outside of the first space 5 and the second space 15 is an atmospheric space, and the pressure in the space outside the first space 5 and the second space 15 is atmospheric pressure. The second adjustment device 17 adjusts the second space 15 to a pressure higher than the pressure of the first space 5 and lower than the atmospheric pressure. As an example, in the present embodiment, the pressure in the second space 15 is adjusted to about 1 × 10 ⁻¹ [Pa].

  That is, in the present embodiment, at least a part of the mask stage 1 is disposed in the second space 15, and the mask M held on the mask stage 1 is disposed in the first space 5.

  FIG. 2 is a schematic diagram for explaining an example of the operation of the mask stage 1. The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In this embodiment, the scanning direction (synchronous movement direction) of the mask M is the Y-axis direction, and the scanning direction (synchronous movement direction) of the substrate P is also the Y-axis direction. The exposure apparatus EX moves the shot area of the substrate P in the Y-axis direction with respect to the projection area of the projection optical system PL, and synchronizes with the movement of the shot area of the substrate P in the Y-axis direction. While moving the pattern formation region of the mask M with respect to the illumination region of the IL in the Y-axis direction, the mask M is illuminated with the exposure light EL, and the substrate P is irradiated with the exposure light EL from the mask M. Expose P.

  As shown in FIG. 2, the mask stage 1 is movable through the first opening 9 while holding the mask M so that the mask M is disposed in the first space 5. In the present embodiment, the first stage 13 is movable at least in the Y-axis direction while being guided by the first surface 11.

  The first stage 13 moves in the Y-axis direction (scanning direction) so that the entire pattern formation region of the mask M passes through the illumination region of the illumination optical system IL during scanning exposure of one shot region on the substrate P. It has a relatively large stroke. As the first stage 13 moves in the Y-axis direction, the second stage 14 supported by the first stage 13 also moves in the Y-axis direction together with the first stage 13. Accordingly, when the first stage 13 moves in the Y-axis direction, the mask M held by the second stage 14 also moves in the Y-axis direction together with the first stage 13. The second stage 14 is slightly movable with respect to the first stage 13.

  When exposing the substrate P, the control device 4 controls the mask stage 1 to move the mask M held on the mask stage 1 to an exposure start position (scanning start position). FIG. 2A shows a state in which the mask M is disposed at the exposure start position. Then, the control device 4 moves the mask stage 1 in the Y-axis direction (here, the −Y direction) while emitting the exposure light EL from the illumination optical system IL, and from the state shown in FIG. Transition to the state shown in 2 (B). FIG. 2B shows a state in which the mask M is disposed at the exposure end position (scan end position).

  In the present embodiment, the gas seal mechanism 10 is formed between the first surface 11 of the first member 7 and the second surface 12 of the first stage 13, and the first stage 13 with respect to the first member 7. Even when the gas is moved, the gas is prevented from flowing into the first space 5. Further, as will be described later, in the present embodiment, a gap adjusting mechanism for adjusting the gap G 1 between the first surface 11 and the second surface 12 is provided, and the first stage 13 is attached to the first member 7. Even in the moving state, the gap G1 between the first surface 11 and the second surface 12 is maintained at a predetermined amount. Thereby, even when the first stage 13 is moved with respect to the first member 7, the gas is suppressed from flowing into the first space 5.

Next, each of the above-described elements will be described with reference to FIG.
In the present embodiment, the first member 7 includes a guide member 18 on which the first surface 11 is formed, and a chamber member 19 that faces at least a part of the guide member 18. The guide member 18 guides the movement of the mask stage 1. The mask stage 1 moves relative to the first opening 9 while being guided by the first surface 11 of the guide member 18.

  Further, the chamber device 6 includes a bellows member 20 that connects the guide member 18 and the chamber member 19. The bellows member 20 is flexible and elastically deformable. In the present embodiment, the bellows member 20 is made of metal. As an example, the bellows member 20 of this embodiment is made of stainless steel. Stainless steel has less outgassing. Therefore, the influence which the bellows member 20 has on the first space 5 can be suppressed.

  In the present embodiment, the first member 7 includes a guide member 18, a chamber member 19, and a bellows member 20. A substantially sealed first space 5 is formed by the guide member 18, the chamber member 19, the bellows member 20, and the mask stage 1.

  In the present embodiment, the exposure apparatus EX includes a base member 21 and a first support member 23 supported on the base member 21 via a first vibration isolation system 22. The chamber member 19 is supported by the first support member 23. A first frame member 24 is disposed on the base member 21. The first frame member 24 includes a support portion 25 and a support portion 26 connected to the upper end of the support portion 25. A second support member 27 that supports the lower surface of the guide member 18 is connected to the support portion 26. The chamber member 19 and the second support member 27 are separated from each other. The chamber member 19 and the first frame member 24 are separated from each other, and a flexible (elastic) sealing mechanism such as a bellows member is disposed between the chamber member 19 and the first frame member 24. The chamber member 19 has an upper surface 19A facing the lower surface 18B of the guide member 18 supported by the second support member 27. The bellows member 20 is disposed so as to connect the lower surface 18B of the guide member 18 and the upper surface 19A of the chamber member 19.

  The light source device 3 generates exposure light EL. The light source device 3 of the present embodiment is a so-called LPP (Laser Produced Prasma), which is a laser-generated plasma light source device that irradiates a target material such as xenon (Xe) with laser light, converts the target material into plasma, and generates EUV light. ) Type light source device. The light source device 3 is a so-called DPP (Discharge Produced Prasma) type light source device that generates a discharge in a predetermined gas, converts the predetermined gas into plasma, and generates EUV light. Also good. The EUV light (exposure light EL) generated by the light source device 3 enters the illumination optical system IL.

  The illumination optical system IL illuminates the mask M with the exposure light EL from the light source device 3. The illumination optical system IL includes a plurality of optical elements, and illuminates a predetermined illumination area on the mask M with the exposure light EL having a uniform illuminance distribution. The optical element of the illumination optical system IL includes a multilayer film reflecting mirror including a multilayer film capable of reflecting EUV light. The multilayer film of the optical element includes, for example, a Mo / Si multilayer film.

  The first stage 13 of the mask stage 1 is movable in three directions including the X axis, the Y axis, and the θZ direction while holding the mask M. The second stage 14 of the mask stage 1 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions while the mask M is held. In the present embodiment, a laser interferometer (not shown) that can measure the position information of the mask stage 1 (mask M) and a focus / leveling detection system (not shown) that can detect the surface position information of the reflecting surface of the mask M. The control device 4 controls the position of the mask M held on the mask stage 1 based on the measurement result of the laser interferometer and the detection result of the focus / leveling detection system.

  The first stage 13 and the second stage 14 of the mask stage 1 are made of metal. As an example, the first stage 13 and the second stage 14 of the present embodiment are made of stainless steel with less outgassing (outgassing).

  Projection optical system PL includes a plurality of optical elements, and projects an image of the pattern of mask M onto substrate P at a predetermined projection magnification. The optical element of the projection optical system PL includes a multilayer reflector having a multilayer film capable of reflecting EUV light. The multilayer film of the optical element includes, for example, a Mo / Si multilayer film.

  A plurality of optical elements of the projection optical system PL are held by the lens barrel 28. The lens barrel 28 has a flange 29. The projection optical system PL is suspended and supported on the flange 29 by the support device 60 as a support object at, for example, three locations around the optical axis. Details of the support device 60 will be described later.

  The substrate stage 2 holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. In the present embodiment, the substrate stage 2 holds the substrate P so that the surface of the substrate P faces the + Z direction. The exposure light EL emitted from the projection optical system PL is applied to the substrate P held on the substrate stage 2.

  The substrate stage 2 is movable in six directions including the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P. In this embodiment, a laser interferometer (not shown) that can measure the position information of the substrate stage 2 (substrate P), and a focus / leveling detection system (not shown) that can detect the surface position information of the surface of the substrate P. The control device 4 controls the position of the substrate P held on the substrate stage 2 based on the measurement result of the laser interferometer and the detection result of the focus / leveling detection system.

  3 is a cross-sectional view parallel to the XZ plane showing the vicinity of the mask stage 1, FIG. 4 is an enlarged view of a part of FIG. 3, and FIG. 5 is a perspective view showing the vicinity of the mask stage 1.

  3, 4, and 5, the exposure apparatus EX includes a first stage driving device 32 for moving the first stage 13 in the Y-axis direction. The first stage driving device 32 includes an actuator such as a linear motor, for example. In the present embodiment, the first stage drive device 32 includes a mover 32A provided on both sides of the first stage 13 in the X-axis direction, and a stator 32B provided corresponding to the mover 32A. The control device 4 can move the first stage 13 in the Y-axis direction using the first stage driving device 32.

  In the present embodiment, the stator 32 </ b> B is disposed on the guide member 18. A gas bearing is disposed between the stator 32B and the guide member 18, and the stator 32B is supported in a non-contact manner with respect to the guide member 18. For this reason, according to the law of conservation of momentum, the stator 32B moves in the −Y direction (+ Y direction) in accordance with the movement of the first stage 13 in the + Y direction (−Y direction). By the movement of the stator 32B, the reaction force accompanying the movement of the first stage 13 can be canceled and the change in the center of gravity position can be suppressed. That is, in the present embodiment, the stator 32B functions as a so-called counter mass.

  Further, the exposure apparatus EX includes a second stage driving device 33 for moving the second stage 14 with respect to the first stage 13. The second stage driving device 33 includes an actuator such as a voice coil motor. In the present embodiment, the second stage drive device 33 includes a mover 33A provided on the second stage 14 and a stator 33B provided corresponding to the mover 33A. The stator 33 </ b> B is connected to the lower surface of the first stage 13. The control device 4 can move the second stage 14 in the X axis, Y axis, Z axis, θX, θY, and θZ directions with respect to the first stage 13 by using the second stage driving device 33.

  In the present embodiment, a self-weight canceling mechanism 34 that cancels the self-weight acting in the Z-axis direction of the second stage 14 is disposed between the first stage 13 and the second stage 14. The self-weight canceling mechanism 34 includes, for example, a bellows member.

  Further, the exposure apparatus EX includes a gap adjustment mechanism 35 that adjusts the gap G1 between the first surface 11 of the guide member 18 and the second surface 12 of the first stage 13. In the present embodiment, the gap adjustment mechanism 35 adjusts the gap G <b> 1 between the first surface 11 and the second surface 12 with electromagnetic force.

  In the present embodiment, a fixing member 36 is disposed on the guide member 18. The fixing member 36 has a lower surface 38 that faces the upper surface 37 of the first stage 13 opposite to the second surface 12 (lower surface). The gap adjusting mechanism 35 includes an electromagnet unit 39 disposed on the lower surface 38 of the fixing member 36. The gap adjusting mechanism 35 can adjust the force (attraction force) generated between the lower surface 38 of the fixing member 36 and the upper surface 37 of the first stage 13 by adjusting the electric power (current) supplied to the electromagnet unit 39. It is. The gap adjusting mechanism 35 adjusts the gap G1 between the first surface 11 and the second surface 12 by adjusting the force generated between the lower surface 38 of the fixing member 36 and the upper surface 37 of the first stage 13. Can do.

  In the present embodiment, a differential exhaust gas bearing can be disposed between the first surface 11 and the second surface 12. Thereby, the force which the gap adjustment mechanism 35 requires can be weakened.

  An adjustment mechanism that adjusts the gap between the inner surface 40 of the first stage 13 that is substantially orthogonal to the X axis and the outer surface 41 of the guide member 18 that faces the inner surface 40 can be provided. For example, by arranging an electromagnet unit on the outer surface 41 and adjusting the electric power supplied to the electromagnet unit, a force generated between the inner surface 40 of the first stage 13 and the outer surface 41 of the guide member 18 is generated. By adjusting, the gap between the inner surface 40 and the outer surface 41 can be adjusted. As a result, the position of the first stage 13 in the X-axis direction can be adjusted. In order to adjust the gap between the inner surface 40 and the outer surface 41, a differential exhaust type air bearing may be disposed between the inner surface 40 and the outer surface 41.

  Further, the driving amount by the mover 32A and the stator 32B arranged on the + X side of the first stage 13, and the driving amount by the mover 32A and the stator 32B arranged on the −X side of the first stage 13 By making these different, the position of the first stage 13 in the θZ direction can be adjusted. Further, an actuator such as a voice coil motor is disposed between the lower surface of the first stage 13 and the upper surface of the second stage 14, and the second stage 14 is moved with respect to the first stage 13 with the Z axis, θX, and θY. It can move in the direction.

  As shown in FIGS. 3 and 5, the second member 16 is connected to the upper surface of the chamber member 19 and is detachable from the main body member 43 having the second opening 42 and the main body member 43. Cover member 44 covering 42. By connecting the main body member 43 and the lid member 44, a substantially sealed second space 15 is formed. Further, the second space 15 is opened by removing the lid member 44 from the main body member 43.

  In the present embodiment, the first stage 13, the first stage driving device 32, the gap adjusting mechanism 35, and the like are disposed in the second space 15. Further, as shown in FIG. 5, a cable 45 for supplying power (electric power, etc.) to the first stage driving device 32, the second stage driving device 33, the gap adjusting mechanism 35, etc. is also arranged in the second space 15. Has been. In the present embodiment, the cable 45 is supported by a so-called cable bear. Thereby, for example, the operator can easily access each device, member, and the like disposed in the second space 15 by removing the lid member 44 from the main body member 43.

  In the present embodiment, the main body member 43 has a first flange 43F, and the lid member 44 has a second flange 44F that can face the first flange 43F. By connecting the first flange 43F and the second flange 44F with, for example, a bolt or the like, the main body member 43 and the lid member 44 are connected, and the sealed second space 15 is formed. In the present embodiment, since the first flange 43F of the main body member 43 is inclined with respect to the XY plane, the operator can easily access each device, member, and the like disposed in the second space 15. Is possible. In addition, by tilting the first flange 43F with respect to the XY plane, each device, member, or the like disposed in the second space 15 is taken out, or each device, member, or the like is attached to the second space 15. Can be carried out smoothly.

  As shown in FIG. 5, a plurality of notches are formed on the upper surface of the first stage 13, and ribs 46 are formed. Thereby, the weight reduction of the 1st stage 13 is implement | achieved, maintaining intensity | strength.

Next, the support device 60 will be described.
FIG. 6 is a cross-sectional view illustrating a schematic configuration of the support device 60.
The support device 60 includes a piston device PT that supports the projection optical system PL in a suspended manner via a suspension member (support member) 30. The suspension member 30 restrains the projection optical system PL in the Z direction, which is the support direction, and supports the projection optical system PL in an unconstrained direction (X direction, Y direction, θZ direction) different from the Z direction. Wire or the like is used.

  The piston device PT includes a cylinder 61 and a piston 71 that moves in the Z direction with respect to the cylinder 61. The piston 71 is integrally connected with a rod 72 extending in the Z direction and having a smaller diameter than the piston 71 and provided with a suspension member 30 at the lower end. The lower end of the rod 72 is provided facing the first space.

  The cylinder 61 is provided through the bellows member 62 (see FIGS. 3 and 6) provided in the chamber member 19 and partitioning the first space 5 and the second space 15 in the Z direction. The space is accommodated in the first space 5, and the top portion is accommodated in the second space 15. The cylinder 61 has a hole 63 that opens in the second space 15 and extends in the Z direction in which the piston 71 moves, and a gap 64 that extends in the Z direction and opens and communicates with the first space 5 and the hole 63. Is provided. A rod 72 is provided in the gap 64 so as to be movable in the axial direction. An air chamber 73 is formed between the piston 71 and the bottom surface 63 </ b> A of the hole 63.

  The cylinder 61 is formed with a through hole 67 whose one end opens in the air chamber 73. The other end of the through hole 67 is connected to a compressed air chamber 68 serving as an auxiliary volume. Therefore, the air chamber 73 is adjusted to be equal to the air pressure of the compressed air chamber 68, and the piston 71 suspends the projection optical system PL via the rod 72 and the suspension member 30 with a force corresponding to the air pressure of the air chamber 73. To support. In other words, the position of the piston 71, that is, the position of the projection optical system PL can be adjusted by adjusting the pressure of the compressed air chamber 68, and the pressure of the compressed air chamber 68 is adjusted so as to cancel the disturbance that is input. Thus, vibration transmitted to the projection optical system PL can be suppressed.

  An air bearing 74 is provided between the hole 63 and the piston 71 for supporting the movement of the piston 71 with respect to the hole 63 in a non-contact manner. Similarly, an air bearing 75 is provided between the gap 64 and the rod 72 to support the movement of the rod 72 with respect to the gap 64 in a non-contact manner.

  The air bearing 74 has an air blowing portion (gas blowing portion) 77 that blows out high-pressure air supplied by the air supply device 76. A suction device 78 that sucks air between the hole 63 and the piston 71 is provided closer to the second space 15 than the air blowing portion 77 in the cylinder 61. The suction device 78 includes a suction port 79 provided in the hole 63 at a position closer to the second space 15 than the air blowing unit 77, and a negative pressure suction source 80 that sucks air through the suction port 79. And.

  An air bearing that has a small influence on the degree of vacuum (pressure) of the second space 15 by blowing high-pressure air from the air blowing portion 77 toward the piston 71 and sucking the air through the suction port 79. 74 is formed, and the piston 71 is supported so as to be movable in the axial direction with respect to the cylinder 61 through a clearance of, for example, several microns.

Similarly, the air bearing 75 has an air blowing portion (gas blowing portion) 82 that blows out high-pressure air supplied from the air supply device 81. A suction device 83 that sucks air between the gap 64 and the rod 72 is provided on the first space 5 side of the cylinder 61 from the air blowing portion 82. The suction device 83 includes a suction port 84 that is provided in the gap 64 at a position closer to the first space 5 than the air blowing portion 82, and a negative pressure suction source 85 that sucks air through the suction port 84. It has.
The air supply devices 76 and 81 may be shared, and the negative pressure suction sources 80 and 85 may be shared.

  An air bearing that has a small influence on the degree of vacuum (pressure) of the second space 15 by blowing high-pressure air from the air blowing portion 82 toward the rod 72 and sucking the air through the suction port 84. 75 is formed, and the rod 72 is supported so as to be movable in the axial direction with respect to the cylinder 61 through a clearance of, for example, several microns.

  Further, an intake passage 86 is provided at a position closer to the first space 5 than the suction port 84 in the cylinder 61. The intake path 86 is provided such that one end opens in the gap 64 at a position closer to the first space 5 than the position at which air is sucked from the gap 64 by the suction port 84, and the other end opens in the second space 15. .

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described.

  The first space 5 is adjusted to a vacuum state by the first adjusting device 8. The second space 15 is adjusted to a pressure higher than the pressure of the first space 5 and lower than the atmospheric pressure by the second adjustment device 17. The gap G1 between the first surface 11 and the second surface 12 is adjusted to a predetermined amount by the gap adjusting mechanism 35, and by the gas seal mechanism 10 formed between the first surface 11 and the second surface 12, Inflow of gas into the first space 5 is suppressed. Thereby, the vacuum state and environment of the first space 5 are maintained.

  After the mask M is held on the mask stage 1 and the substrate P is held on the substrate stage 2, the control device 4 starts an exposure process for the substrate P. In order to illuminate the mask M with the exposure light EL, the control device 4 starts the light emission operation of the light source device 3.

  The exposure light EL emitted from the light source device 3 by the light emission operation of the light source device 3 enters the illumination optical system IL. The exposure light EL that has entered the illumination optical system IL travels through the illumination optical system IL and is then supplied to the first opening 9. The exposure light EL supplied to the first opening 9 is incident on the mask M held on the mask stage 1 through the first opening 9. The mask M held on the mask stage 1 is emitted from the light source device 3 and illuminated with exposure light EL (EUV light) through the illumination optical system IL. The exposure light EL that is irradiated onto the reflective surface of the mask M and reflected by the reflective surface enters the projection optical system PL disposed in the first space 5. The exposure light EL that has entered the projection optical system PL travels through the projection optical system PL, and is then irradiated onto the substrate P held on the substrate stage 2.

  The control device 4 illuminates the mask M with the exposure light EL while moving the substrate P in the Y-axis direction in synchronization with the movement of the mask M in the Y-axis direction. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  In the above exposure process, the pressure of the compressed air chamber 68 can be adjusted by adjusting the pressure of the compressed air chamber 68, that is, the position of the projection optical system PL. However, at this time, the piston 71 is supported by an air bearing 74 formed of air blown from the air blowing portion 77. The cylinder 61 can move smoothly without contact.

  Similarly, the rod 72 is supported by an air bearing 75 formed of air blown from the air blowing portion 82, so that the rod 72 can move smoothly without contact with the cylinder 61 (gap 64). Here, since the air blown from the air blowing portion 82 into the gap 64 is sucked from the suction port 84 by driving the negative pressure suction source 85, the first space 5 is formed from the lower end (−Z side end portion) of the gap 64. It is possible to avoid adversely affecting the vacuum state (negative pressure state) of the first space 5 due to leakage. Further, air that has been blown into the gap 64 but could not be sucked from the suction port 84 is sucked from the intake passage 86 and exhausted into the second space 15.

  Here, the destination where the air that could not be sucked from the suction port 84 flows is the conductance (flow resistance) from the gap 64 between the suction port 84 and the intake path 86 to the intake path 86 and the gap 64 and the intake path. 86 (that is, the second space 15), the conductance from the air gap 64 located on the −Z side to the first space 5 with respect to the first space 5, and the air gap 64 and the first space 5. Depends on the pressure difference between them (atmospheric pressure difference). Since the air pressure in the first space 5 and the second space 15 is basically kept substantially constant, the air that cannot be sucked from the suction port 84 flows in the direction of smaller flow resistance.

  Therefore, in the present embodiment, the intake passage 86 is formed so that the flow resistance of the air reaching the intake passage 86 is sufficiently smaller than the flow resistance reaching the first space 5. Specifically, the area where the intake passage 86 faces the gap 64 (the total area when a plurality of intake passages 86 are provided) is 100 of the area where the gap 64 faces the first space 5 (ring-shaped area). It is set to more than double. When this area ratio is small, a part of the air is in the first space due to the pressure fluctuation of the first space 5 and the second space 15 or the pressure fluctuation of the air blown out from the air blowing section 82. However, by increasing the area ratio, the air can be smoothly and reliably flowed into the intake passage 86. In the present embodiment, the area ratio is set to 100 or more so as not to affect the apparatus. However, when the amount of air flowing into the first space 5 may be larger, the area ratio is appropriately set. be able to.

  As described above, in the present embodiment, since the intake path 86 is provided at a position closer to the first space 5 than the position at which the air in the gap 64 is sucked by the suction port 84, the air enters the first space 5. It can suppress that it flows in and adversely affects the vacuum state. In particular, in the present embodiment, since the intake passage 86 is open to the second space 15, it is not necessary to separately provide a negative pressure suction mechanism, and the air in the gap 64 can be easily drawn in, and the device Can contribute to the downsizing and lowering of the price.

  In addition, in the present embodiment, the area of the air intake path 86 that faces the air gap 64 is 100 times or more the area of the air gap 64 that faces the first space 5, so that air can be more reliably introduced into the air intake path 86. It becomes possible, and the vacuum state of the first space 5 can be stably maintained.

  Further, in the present embodiment, since the projection optical system PL is suspended and supported by the suspension member 30 that restrains only in the Z direction that is the support direction, a force other than the Z direction is applied to the projection optical system PL to be distorted. An adverse effect on the projection characteristics can be suppressed, and a high-quality exposure apparatus EX excellent in projection characteristics can be obtained.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above embodiment, the air bearing using air is exemplified as the gas bearing. However, the present invention is not limited to this, and another gas (for example, nitrogen or argon) may be used.
Moreover, although the said embodiment demonstrated as what uses a wire etc. as the suspending member 30, it is not restricted to this, For example, it is good also as a structure using the chain | strand-shaped thing with which the ring-shaped member was continued.

In the above embodiment, the configuration for supporting the projection optical system PL in the exposure apparatus EX as the support object has been described. However, for example, a Fizeau interferometer that performs lens measurement by irradiating measurement light, for example. It may be used when hanging and supporting the like.
In this case, since the interferometer can be installed in a vacuum environment, it is possible to eliminate measurement error factors such as air fluctuations, and more accurate measurement can be performed.

  The substrate (object) in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or a mask or reticle used in an exposure apparatus. The original plate (synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one scanning exposure is performed on one substrate. The present invention can also be applied to an exposure apparatus that performs double exposure of shot areas almost simultaneously.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  The present invention can also be applied to a twin stage type exposure apparatus provided with a plurality of substrate stages (wafer stages). The structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407. Furthermore, the present invention may be applied to the wafer stage disclosed in Japanese Patent Application No. 2004-168482 filed earlier by the present applicant.

  An exposure apparatus to which the present invention is applied assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

Next, an embodiment of a manufacturing method of a micro device using the exposure apparatus and the exposure method according to the embodiment of the present invention in the lithography process will be described. FIG. 7 is a flowchart showing a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micro machine, etc.).
First, in step S10 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.
Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

FIG. 8 is a diagram illustrating an example of a detailed process of step S13 in the case of a semiconductor device.
In step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pre-processing process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.
At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., from mother reticles to glass substrates and The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a silicon wafer or the like. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity-type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

FIG. 2 is a view showing an embodiment of the present invention, and is a schematic block diagram showing an exposure apparatus EX. It is a figure for demonstrating an example of operation | movement of a mask stage. It is sectional drawing which shows the vicinity of a mask stage. It is the figure which expanded a part of FIG. It is a perspective view which shows the vicinity of a mask stage. 3 is a cross-sectional view showing a schematic configuration of a support device 60. FIG. It is a flowchart which shows an example of the manufacturing process of the microdevice of this invention. It is a figure which shows an example of the detailed process of step S13 in FIG.

Explanation of symbols

  EX ... Exposure device, P ... Substrate, PL ... Projection optical system (supported object), PT ... Piston device, 1 ... Mask stage, 5 ... First space, 15 ... Second space, 30 ... Hanging member (support member) , 60 ... support device, 61 ... cylinder, 64 ... gap, 71 ... piston, 72 ... rod, 75 ... air bearing (gas bearing), 77, 82 ... air blowing part (gas blowing part), 83 ... suction device, 84 ... Suction port, 86 ... Intake passage

Claims (8)

A support device for supporting a support object arranged in a first space set at a first pressure lower than the atmosphere by a piston device having a cylinder and a piston,
A rod connected to the piston and the object to be supported, and provided to be movable in the axial direction with respect to the cylinder through a gap opened in the first space provided in the cylinder;
A second space that is set to a second pressure that is higher than the first pressure and lower than the atmosphere, and that accommodates the cylinder;
A gas bearing formed between the gap and the rod and having a gas outlet;
A suction device for sucking the gas from the gap at a position closer to the first space than the position where the gas blowing section is provided;
An intake passage having one end opened to the gap at a position closer to the first space than the position at which the gas is sucked from the gap, and the other end opened to the second space;
A support device having   2. The support device according to claim 1, wherein an area of the intake passage facing the gap is 100 times or more of an area of the gap facing the first space.   The support device according to claim 1 or 2, wherein the support object is supported via a support member that restrains the support direction in a support direction and unconstrains a direction different from the support direction.   The support apparatus as described in any one of Claim 1 to 3 which suspends and supports the said support target object.   The support apparatus according to any one of claims 1 to 4, wherein the support object is an interferometer that irradiates measurement light and measures information related to a position.   The support apparatus according to claim 1, wherein the support object is a projection optical system that projects an image of an incident pattern.   An exposure apparatus comprising the support device according to claim 1.   A mask stage for holding a mask on which a pattern surface is formed, the mask stage holding the mask so that the pattern surface is accommodated in the first space, and a portion facing the first space; The exposure apparatus according to claim 7, further comprising a portion facing the second space.

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