JPH10116760A - Aligner and substrate holding device - Google Patents
Aligner and substrate holding deviceInfo
- Publication number
- JPH10116760A JPH10116760A JP26702396A JP26702396A JPH10116760A JP H10116760 A JPH10116760 A JP H10116760A JP 26702396 A JP26702396 A JP 26702396A JP 26702396 A JP26702396 A JP 26702396A JP H10116760 A JPH10116760 A JP H10116760A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding
- photosensitive
- adapter
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体装置や液晶
表示装置の製造工程においてマスクに形成されたパター
ンを感光基板に露光するのに用いられる露光装置及び基
板保持装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and a substrate holding apparatus used for exposing a pattern formed on a mask to a photosensitive substrate in a process of manufacturing a semiconductor device or a liquid crystal display device.
【０００２】[0002]
【従来の技術】半導体素子や液晶表示素子等の製造工程
においては、ステッパー等の露光装置を用いてフォトマ
スク又はレチクル（以下、マスクという）に形成された
パターンを半導体ウエハ又はガラスプレート等の感光基
板上に投影露光することが行われる。2. Description of the Related Art In a manufacturing process of a semiconductor device or a liquid crystal display device, a pattern formed on a photomask or a reticle (hereinafter, referred to as a mask) using an exposure apparatus such as a stepper is exposed to light on a semiconductor wafer or a glass plate. Projection exposure is performed on a substrate.
【０００３】感光基板は、投影光学系の光軸に垂直な平
面内を２次元的に移動する基板ステージ上に真空吸着保
持される。基板ステージの概略平面図である図１４
（ａ）及びその断面図である図１４（ｂ）を用いて、従
来の基板ステージの構造及び基板ステージ上への感光基
板の受け渡しの方法を説明する。リニアガイド１０１に
沿って矢印Ｅ方向に直線移動するスライダー１０２に
は、２本のフォーク部１０３ａ，１０３ｂが設けられ、
水平面内で一次元的に感光基板Ｗを搬送する。フォーク
部１０３ａ，１０３ｂの上面には感光基板を載置して固
定する吸着孔１０４ａ，１０４ｂが形成されている。２
次元的に移動する基板ステージＳＴは予め図１４（ａ）
に示したローディング位置に位置決めされる。フォーク
部１０３ａ，１０３ｂ上の感光基板Ｗは、基板ステージ
ＳＴの上に設けられた基板ホルダーＷＨの真上の位置ま
で運ばれる。The photosensitive substrate is held by vacuum suction on a substrate stage that moves two-dimensionally in a plane perpendicular to the optical axis of the projection optical system. FIG. 14 is a schematic plan view of a substrate stage.
The structure of a conventional substrate stage and a method of transferring a photosensitive substrate onto the substrate stage will be described with reference to FIG. 14A and FIG. The slider 102 that moves linearly in the direction of arrow E along the linear guide 101 is provided with two forks 103a and 103b.
The photosensitive substrate W is transported one-dimensionally in a horizontal plane. Suction holes 104a, 104b for mounting and fixing the photosensitive substrate are formed on the upper surfaces of the forks 103a, 103b. 2
The substrate stage ST which moves three-dimensionally is shown in FIG.
Is positioned at the loading position shown in FIG. The photosensitive substrate W on the forks 103a, 103b is carried to a position directly above a substrate holder WH provided on the substrate stage ST.
【０００４】基板ホルダーＷＨの載置面１０５には細い
溝１０６が環状に複数本形成され、この細い溝１０６は
感光基板Ｗの裏面を吸着するために真空源によって減圧
される。さらに、基板ホルダーＷＨの載置面１０５の中
央部には、センターアップ部１０７が上下動可能に設け
られている。フォーク部１０３ａ，１０３ｂが所定の位
置に来ると、図１４（ｂ）に示すようにセンターアップ
部１０７が載置面１０５、及びフォーク部１０３ａ，１
０３ｂよりも上方に移動し、感光基板Ｗを受け取る。A plurality of thin grooves 106 are formed in a ring shape on the mounting surface 105 of the substrate holder WH. These thin grooves 106 are depressurized by a vacuum source in order to attract the back surface of the photosensitive substrate W. Further, a center-up portion 107 is provided at the center of the mounting surface 105 of the substrate holder WH so as to be vertically movable. When the fork portions 103a and 103b come to predetermined positions, the center-up portion 107 moves the mounting surface 105 and the fork portions 103a and 103a as shown in FIG.
It moves above 03b and receives the photosensitive substrate W.
【０００５】この状態でセンターアップ部１０７は感光
基板Ｗの裏面を真空吸着し、フォーク部１０３ａ，１０
３ｂは再び図１４（ａ）の位置まで戻る。そして、最後
にセンターアップ部１０７を載置面１０５よりも下方に
移動させ、感光基板Ｗを基板ホルダーＷＨの載置面１０
５に受け渡し、溝１０６を減圧して感光基板Ｗを真空吸
着保持する。これによって、感光基板Ｗは載置面１０５
の平面度にならって平坦化矯正される。また、載置面１
０５上の感光基板Ｗを取り出すときは、全く逆のシーケ
ンスが行われる。In this state, the center-up portion 107 vacuum-adsorbs the back surface of the photosensitive substrate W, and the fork portions 103a, 103a.
3b returns to the position of FIG. Then, finally, the center-up portion 107 is moved below the mounting surface 105 to move the photosensitive substrate W to the mounting surface 10 of the substrate holder WH.
5, the pressure of the groove 106 is reduced, and the photosensitive substrate W is held by vacuum suction. As a result, the photosensitive substrate W is placed on the mounting surface 105.
The flatness is corrected according to the flatness of. The mounting surface 1
When taking out the photosensitive substrate W on 05, a completely reverse sequence is performed.
【０００６】基板ステージＳＴは剛性の高いボディ構造
のなかに設置され、ボディ構造には露光前に感光基板Ｗ
を位置決めするためのアライメントセンサーや、感光基
板の表面を投影光学系の結像面に合わせるための焦点検
出センサーが基板ステージ上部に面して取り付けられて
いる。また、露光装置の内部には、マスク収納ボックス
や基板収納ボックスが配置され、マスク搬送系、基板搬
送系等も配置されている。装置全体はチャンバーの中に
設置されて、温度を厳密に制御されている。The substrate stage ST is installed in a highly rigid body structure, and the body structure has a photosensitive substrate W before exposure.
An alignment sensor for positioning the lens and a focus detection sensor for aligning the surface of the photosensitive substrate with the image forming surface of the projection optical system are mounted facing the upper part of the substrate stage. Further, inside the exposure apparatus, a mask storage box and a substrate storage box are disposed, and a mask transport system, a substrate transport system, and the like are also disposed. The entire device is installed in a chamber and the temperature is strictly controlled.
【０００７】[0007]
【発明が解決しようとする課題】近年、半導体素子等の
高集積化に伴って感光基板上の露光領域（ショット領
域）に露光されるパターンの微細化が進み、露光装置は
解像度を上げるために開口数の大きな投影光学系を使用
するようになっている。開口数の大きな投影光学系では
焦点深度が浅くなるため、露光領域を正確に投影光学系
の焦点位置（焦点深度内）に位置づけることが望まれて
いる。また、一方では露光装置による露光領域の大面積
が進んでおり、それによって大型の素子の製造を可能に
したり、１回の露光で複数の素子のパターン露光を行っ
て装置のスループットの向上を図ることが行われてい
る。そのため、大型化する露光領域全体をより正確に投
影光学系の焦点位置に位置づけることが望まれている。In recent years, along with the high integration of semiconductor elements and the like, the pattern exposed on an exposure area (shot area) on a photosensitive substrate has been miniaturized. A projection optical system having a large numerical aperture is used. Since the depth of focus is small in a projection optical system having a large numerical aperture, it is desired to accurately position the exposure region at the focal position (within the depth of focus) of the projection optical system. On the other hand, a large area of an exposure region is being advanced by an exposure apparatus, thereby enabling the manufacture of a large-sized element or improving the throughput of the apparatus by performing pattern exposure of a plurality of elements in one exposure. That is being done. For this reason, it is desired to more accurately position the entire exposure area to be enlarged at the focal position of the projection optical system.
【０００８】このように、感光基板の露光領域を投影露
光装置の焦点位置に確実に位置づけるためには感光基板
表面の平坦性を確保することが必要である。感光基板の
表面が曲面を描いていれば、露光領域の全体を投影光学
系の焦点面内に位置づけることが困難だからである。As described above, in order to reliably position the exposure area of the photosensitive substrate at the focal position of the projection exposure apparatus, it is necessary to ensure the flatness of the surface of the photosensitive substrate. This is because if the surface of the photosensitive substrate has a curved surface, it is difficult to position the entire exposure region within the focal plane of the projection optical system.
【０００９】ところで、露光装置の運転を続ける間に、
基板ホルダーの基板保持面にゴミ等の異物が付着するこ
とがある。基板ホルダーの基板保持面に異物が付着する
と、その上に感光基板を載置して真空吸着したとき、異
物のために感光基板が変形してフォーカスずれを生じて
しまう。異物の侵入を完全に防ぐことは現状では困難で
あるため、基板ホルダーの基板保持面を定期的に清掃す
る必要がある。現在、この清掃は人手によって行われて
いる。しかし、基板ホルダーは露光装置の中央部に位置
し、前述のように基板ステージの周囲には種々のユニッ
トが配置されていてスペースがないため手が届きにく
く、完全に清掃することが困難であった。また、完全に
清掃するために基板ホルダーを取り外そうとすると、周
囲のユニットを取り外したりする等の大がかりな作業が
必要となり、その間、装置の運転を停止しなければなら
ないため露光装置のスループットが低下してしまうとい
う問題があった。本発明はこのような従来技術の問題点
に鑑みてなされたもので、基板ホルダーの基板保持面の
清掃を容易に行うことのできる露光装置を提供すること
を目的とする。By the way, while the operation of the exposure apparatus is continued,
Foreign matter such as dust may adhere to the substrate holding surface of the substrate holder. When foreign matter adheres to the substrate holding surface of the substrate holder, the photosensitive substrate is deformed due to the foreign matter when the photosensitive substrate is placed on the substrate holding surface and vacuum-adsorbed, thereby causing a focus shift. At present, it is difficult to completely prevent foreign matter from entering, so it is necessary to periodically clean the substrate holding surface of the substrate holder. Currently, this cleaning is performed manually. However, the substrate holder is located at the center of the exposure apparatus, and as described above, various units are arranged around the substrate stage and there is no space, so that it is difficult to reach and it is difficult to completely clean the substrate stage. Was. In addition, removing the substrate holder to completely clean it requires extensive work such as removing surrounding units, and during that time, the operation of the apparatus must be stopped. There was a problem that it would decrease. The present invention has been made in view of such problems of the related art, and has as its object to provide an exposure apparatus capable of easily cleaning a substrate holding surface of a substrate holder.
【００１０】[0010]
【課題を解決するための手段】上記問題を解決するため
に本発明では、感光基板と同程度の厚みと形状を有し、
表面に基板保持面を形成した基板保持用アダプターを別
部材として用意する。そして、基板ステージ上に基板保
持用アダプターを保持して真空吸着し、基板保持用アダ
プターの上に感光基板を載置して真空吸着保持するよう
にする。基板保持用アダプターは感光基板と同様の形状
を有し感光基板と同様に取り扱うことができるので、露
光装置に備わっている基板搬送系によって基板ステージ
から取り外して露光装置内を自動搬送することができ
る。基板搬送系は、基板保持用アダプターを露光装置内
に設けられた洗浄部もしくは基板収納ボックス内に搬送
収納する。洗浄部で洗浄されて異物が除去された基板保
持用アダプター、又は基板収納ボックスごと装置外部に
取り出されて洗浄された基板保持用アダプターは、再び
基板搬送系によって自動的に基板ステージ上に戻され
る。In order to solve the above problems, the present invention has a thickness and a shape similar to those of a photosensitive substrate,
A substrate holding adapter having a substrate holding surface formed on its surface is prepared as a separate member. Then, the substrate holding adapter is held on the substrate stage and vacuum-sucked, and the photosensitive substrate is placed on the substrate holding adapter and held by vacuum suction. Since the substrate holding adapter has the same shape as the photosensitive substrate and can be handled in the same manner as the photosensitive substrate, the adapter can be removed from the substrate stage by the substrate transport system provided in the exposure apparatus and automatically transported in the exposure apparatus. . The substrate transport system transports and stores the substrate holding adapter in a cleaning unit or a substrate storage box provided in the exposure apparatus. The substrate holding adapter that has been cleaned by the cleaning unit to remove foreign substances, or the substrate holding adapter that has been taken out of the apparatus together with the substrate storage box and cleaned, is automatically returned to the substrate stage again by the substrate transport system. .
【００１１】すなわち、本発明は、マスクに形成された
パターンを感光基板上に投影する投影光学系と、感光基
板を載置する基板ステージとを含む露光装置において、
基板ステージは、感光基板を保持する着脱自在な基板保
持用アダプターと、基板保持用アダプターを固定する保
持部とを備えていることを特徴とする。基板ステージの
保持部は、多数の微小突起と排気手段に連通する開口と
を備え、多数の微小突起上に感光基板を載置した状態で
開口から保持部と感光基板の間の空間を排気することに
より感光基板を真空吸着して保持するタイプのもの、あ
るいは多孔質部材と、その多孔質部材と排気手段とを連
通する流路とを有し、多孔質部材上に感光基板を載置し
た状態で多孔質部材内を排気することにより感光基板を
真空吸着して保持するタイプのものとすることができ
る。That is, the present invention provides an exposure apparatus including a projection optical system for projecting a pattern formed on a mask onto a photosensitive substrate, and a substrate stage on which the photosensitive substrate is placed.
The substrate stage includes a detachable substrate holding adapter for holding the photosensitive substrate, and a holding section for fixing the substrate holding adapter. The holding section of the substrate stage has a large number of microprojections and an opening communicating with the exhaust means, and exhausts a space between the holding section and the photosensitive substrate from the opening with the photosensitive substrate placed on the number of minute projections. The photosensitive substrate is vacuum-adsorbed and held by this, or has a porous member, and a flow path communicating the porous member and the exhaust means, and the photosensitive substrate is placed on the porous member. By evacuating the inside of the porous member in this state, the photosensitive substrate can be vacuum-adsorbed and held.
【００１２】感光基板には、例えば円形のウエハや矩形
のガラスプレート等、種類によって外形が異なるものが
あり、また寸法も種々のものがある。露光装置の基板ス
テージは、これら形状の異なる感光基板を保持する必要
があるため、基板保持用アダプターも感光基板の形状に
応じたものを複数種類用意しておき、露光する感光基板
の形状に合わせたものを使用するのがよい。また、基板
ステージの保持部を複数の領域に分割しておき、排気す
る領域を基板保持用アダプターの形状に応じて選択可能
とするのが好ましい。The photosensitive substrate has, for example, a circular wafer, a rectangular glass plate, or the like, whose outer shape differs depending on the type, and various dimensions. Since the substrate stage of the exposure device needs to hold these photosensitive substrates with different shapes, prepare multiple types of substrate holding adapters according to the shape of the photosensitive substrate, and match them to the shape of the photosensitive substrate to be exposed. It is better to use Further, it is preferable that the holding portion of the substrate stage is divided into a plurality of regions, and the region to be exhausted can be selected according to the shape of the substrate holding adapter.
【００１３】感光基板と基板保持用アダプターとは、上
下動機構により基板ステージ上で別々に上下動させるこ
とができる。感光基板は、この上下動機構を用いること
により、基板ステージ上の保持部に固定された基板保持
用アダプター上にロードしたり、アンロードしたりする
ことができる。同様に、基板保持用アダプターは、この
上下動機構により、基板ステージの保持部にロードした
り、アンロードしたりすることができる。また、本発明
による基板保持装置は、基板を保持する着脱自在な基板
保持用アダプターと、基板保持用アダプターを固定する
保持部とを備えることを特徴とする。この基板保持装置
は、前記露光装置に装着して用いられる。The photosensitive substrate and the substrate holding adapter can be individually moved up and down on the substrate stage by a vertical movement mechanism. The photosensitive substrate can be loaded or unloaded on the substrate holding adapter fixed to the holding section on the substrate stage by using the vertical movement mechanism. Similarly, the substrate holding adapter can be loaded and unloaded on the holding portion of the substrate stage by the vertical movement mechanism. Further, a substrate holding apparatus according to the present invention includes a detachable substrate holding adapter for holding a substrate, and a holding portion for fixing the substrate holding adapter. This substrate holding device is used by being mounted on the exposure device.
【００１４】本発明によると、基板保持用アダプターが
感光基板と同じような形状をしているので、清掃時に基
板保持用アダプターの真空吸着保持を解除し、感光基板
を搬送する基板搬送系をそのまま利用して基板保持用ア
ダプターを基板収納ボックスに回収できる。そのまま基
板洗浄装置にかけ、清掃後、元の位置に戻せば、基板搬
送系が自動的に基板保持用アダプターを基板ステージ上
に搬送してくれる。あるいは、基板ステージから取り外
した基板保持用アダプターを露光装置内に設けられた洗
浄部に搬送し、洗浄した後、再び基板搬送系によって基
板ステージ上に戻すこともできる。基板保持部アダプタ
ーを再度基板ステージ上に真空吸着保持すれば、その上
に感光基板を堅固に保持することが可能になる。According to the present invention, since the substrate holding adapter has the same shape as the photosensitive substrate, the vacuum holding of the substrate holding adapter is released during cleaning, and the substrate transport system for transporting the photosensitive substrate is left as it is. The adapter for holding the substrate can be collected in the substrate storage box by utilizing. If it is put into a substrate cleaning device as it is and after cleaning it is returned to its original position, the substrate transport system will automatically transport the substrate holding adapter onto the substrate stage. Alternatively, the substrate holding adapter removed from the substrate stage can be transported to a cleaning section provided in the exposure apparatus, cleaned, and then returned to the substrate stage again by the substrate transport system. If the substrate holding unit adapter is again vacuum-adsorbed and held on the substrate stage, the photosensitive substrate can be firmly held thereon.
【００１５】このようにして、基板ステージの周囲のユ
ニットを取り外したり、人手を介したりすることなく、
基板ステージの基板保持面を清掃することができる。ま
た、基板保持用アダプターを基板洗浄装置で清掃するこ
とができるので、異物の除去効果も大きく、デバイス製
造の歩留まりも向上する。In this way, without removing the unit around the substrate stage and without manual operation,
The substrate holding surface of the substrate stage can be cleaned. Further, since the substrate holding adapter can be cleaned by the substrate cleaning device, the effect of removing foreign substances is large, and the yield of device manufacturing is improved.
【００１６】[0016]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態を説明する。図１は、本発明による露光装置の
一例を模式的に示した略図である。露光装置は、露光光
でマスク１２を照射する照明系１１、所定位置にマスク
１１を保持するマスクステージ１３、感光基板１５を保
持する基板ステージ１６、マスク１２に形成されたパタ
ーンを感光基板１５上に投影するための投影光学系１４
等を含む。感光基板１５は、ベースステージ１７と基板
保持用アダプター１８を備える基板ステージ１６上に真
空吸着保持されている。基板ステージ１６に設けられた
ベースステージ１７と基板保持用アダプター１８の詳細
については後述する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view schematically showing an example of an exposure apparatus according to the present invention. The exposure apparatus includes an illumination system 11 for irradiating a mask 12 with exposure light, a mask stage 13 for holding the mask 11 at a predetermined position, a substrate stage 16 for holding a photosensitive substrate 15, and a pattern formed on the mask 12 on the photosensitive substrate 15. Optical system 14 for projecting light onto
And so on. The photosensitive substrate 15 is held on a substrate stage 16 having a base stage 17 and a substrate holding adapter 18 by vacuum suction. Details of the base stage 17 and the substrate holding adapter 18 provided on the substrate stage 16 will be described later.
【００１７】基板ステージ１６はモータ等の駆動手段２
１によって投影光学系１４の光軸と直交する方向に２次
的に移動可能になっている。また、基板ステージ１６に
は移動鏡２２が固定されていて、この移動鏡２２との間
の距離をレーザ干渉計２３で計測することにより、基板
ステージ１６の２次元座標位置が検出される。基板ステ
ージ１６は剛性の高いボディ構造２５のなかに設置さ
れ、ボディ構造２５には露光前に感光基板１５を位置決
めするためのアライメントセンサー２６や、感光基板１
５の表面を投影光学系１４の結像面に合わせるための焦
点検出センサー２７が基板ステージ上部に面して取り付
けられている。The substrate stage 16 is a driving means 2 such as a motor.
1 allows it to be moved secondarily in a direction orthogonal to the optical axis of the projection optical system 14. A movable mirror 22 is fixed to the substrate stage 16, and the distance between the movable mirror 22 and the movable mirror 22 is measured by a laser interferometer 23, whereby the two-dimensional coordinate position of the substrate stage 16 is detected. The substrate stage 16 is installed in a highly rigid body structure 25, and the body structure 25 includes an alignment sensor 26 for positioning the photosensitive substrate 15 before exposure, and a photosensitive substrate 1.
A focus detection sensor 27 for aligning the surface of No. 5 with the image forming plane of the projection optical system 14 is mounted facing the upper part of the substrate stage.
【００１８】また、ボディ構造２５の周囲には、複数種
類のマスクを保管するマスク収納ボックス３１、マスク
収納ボックス３１から次に使用するマスクを取り出して
マスクステージ１３上に搬送したり、マスクステージ１
３上のマスク１２をマスク収納ボックス３１に戻すため
のマスク搬送系３２、複数枚の感光基板を収納した基板
収納ボックス３４、基板収納ボックス３４から未露光の
感光基板を取り出して基板ステージ１６上に載置し、ま
た露光済みの感光基板を基板収納ボックス３４の所定位
置に戻すための基板搬送系３５、超音波洗浄装置などを
備えた洗浄部３６等が配置されている。洗浄部３６への
基板等の搬送は基板搬送系３５によって行われる。装置
全体はチャンバー１０の中に設置されて、厳密な温度制
御がなされている。Further, around the body structure 25, a mask storage box 31 for storing a plurality of types of masks, a mask to be used next is taken out of the mask storage box 31 and transported onto the mask stage 13,
3, a mask transport system 32 for returning the mask 12 to the mask storage box 31, a substrate storage box 34 that stores a plurality of photosensitive substrates, and unexposed photosensitive substrates are taken out of the substrate storage box 34 and placed on the substrate stage 16. A substrate transport system 35 for returning the mounted and exposed photosensitive substrate to a predetermined position of the substrate storage box 34, a cleaning unit 36 including an ultrasonic cleaning device, and the like are arranged. The transfer of the substrate and the like to the cleaning unit 36 is performed by the substrate transfer system 35. The entire apparatus is installed in a chamber 10 and strict temperature control is performed.
【００１９】図２は、基板ステージの周辺の斜視図であ
り、図は感光基板１５が基板ステージ１６の上方で基板
搬送系の搬送アーム４５によって保持されている状態を
示す。基板ステージ１６はＸＹ平面内を２次元方向に移
動可能であり、上部にベースステージ１７と基板保持用
アダプター１８を備える。感光基板１５は、基板保持用
アダプター１８の上に載置され、真空吸引保持される。
基板ステージ１６はＸ駆動手段２１ＸによってＸ方向に
駆動されるとともに、Ｙ駆動手段２１ＹによってＹ方向
に駆動される。駆動手段２１Ｘ，２１Ｙは、基板ステー
ジ駆動制御装置４１によって制御される。FIG. 2 is a perspective view of the periphery of the substrate stage, and shows a state in which the photosensitive substrate 15 is held above the substrate stage 16 by the transfer arm 45 of the substrate transfer system. The substrate stage 16 is movable in a two-dimensional direction in the XY plane, and includes a base stage 17 and a substrate holding adapter 18 at the upper part. The photosensitive substrate 15 is placed on the substrate holding adapter 18 and held by vacuum suction.
The substrate stage 16 is driven in the X direction by X driving means 21X, and is driven in the Y direction by Y driving means 21Y. The driving units 21X and 21Y are controlled by the substrate stage drive control device 41.
【００２０】基板ステージ１６上には、Ｘ方向に垂直な
反射面を有する移動鏡２２Ｘと、Ｙ方向に垂直な反射面
を有する移動鏡２２Ｙとがそれぞれ固設されている。レ
ーザ干渉計２３Ｘは移動鏡２２Ｘにレーザ光を投射し、
その反射鏡を受光して基板ステージ１６のＸ方向の位置
を検出し、レーザ干渉計２３Ｙは移動鏡２２Ｙにレーザ
光を投射し、その反射光を受光して基板ステージのＹ方
向の位置を検出するように構成されている。レーザ干渉
計２３Ｘ，２３Ｙによって検出された基板ステージ１６
の２次元位置検出信号は主制御系４２に供給される。主
制御系４２はステージ駆動制御装置４１を介してＸ駆動
装置２１Ｘ及びＹ駆動装置２１Ｙを駆動し、基板ステー
ジ１６の位置を制御する。On the substrate stage 16, a movable mirror 22X having a reflective surface perpendicular to the X direction and a movable mirror 22Y having a reflective surface perpendicular to the Y direction are fixedly provided. The laser interferometer 23X projects a laser beam on the movable mirror 22X,
The laser interferometer 23Y projects a laser beam onto the movable mirror 22Y by detecting the position of the substrate stage 16 in the X direction by receiving the reflection mirror, and detects the position of the substrate stage 16 in the Y direction by receiving the reflected light. It is configured to be. Substrate stage 16 detected by laser interferometers 23X and 23Y
Are supplied to the main control system 42. The main control system 42 drives the X drive device 21X and the Y drive device 21Y via the stage drive control device 41 to control the position of the substrate stage 16.
【００２１】基板ステージ１６には３本の基板上下ピン
５１ａ，５１ｂ，５１ｃが設けられている。基板上下ピ
ン５１ａ，５１ｂ，５１ｃは基板保持用アダプター１８
に設けられた円形開口６２ａ，６２ｂ，６２ｃに遊嵌
し、図示しない伸縮機構により基板保持用アダプター１
８に接触することなく上下動することができる。３本の
基板上下ピン５１ａ，５１ｂ，５１ｃの先端にはそれぞ
れ真空吸着用の吸着孔が設けられ、それらの先端は感光
基板１５の受け渡し時には搬送アーム４５との間で受け
渡しのできる高さまで上昇し、感光基板１５を基板保持
用アダプター１８の基板保持面に載置する際には、基板
保持面より低い位置まで下降する。このとき基板上下ピ
ン５１ａ，５１ｂ，５１ｃの先端を真空吸引することに
より、基板上下ピンの上に保持した感光基板１５がずれ
ないようにされる。The substrate stage 16 is provided with three substrate upper and lower pins 51a, 51b, 51c. The board upper and lower pins 51a, 51b, 51c are connected to the board holding adapter 18.
The adapter 1 for holding a substrate is loosely fitted into circular openings 62a, 62b, 62c provided in the
8 can be moved up and down without touching it. Vacuum suction holes are provided at the tips of the three substrate upper and lower pins 51a, 51b, 51c, respectively, and the tips rise to a height at which the photosensitive substrate 15 can be transferred to and from the transfer arm 45 when the photosensitive substrate 15 is transferred. When the photosensitive substrate 15 is placed on the substrate holding surface of the substrate holding adapter 18, the photosensitive substrate 15 descends to a position lower than the substrate holding surface. At this time, the tips of the substrate upper and lower pins 51a, 51b, and 51c are suctioned by vacuum to prevent the photosensitive substrate 15 held on the substrate upper and lower pins from shifting.
【００２２】搬送アーム４５から感光基板１５を基板保
持用アダプター１８の基板保持面上に受け取るとき、主
制御系４２は図示しない伸縮機構を介して基板上下ピン
５１ａ，５１ｂ，５１ｃを上方に移動させる。そして、
基板上下ピン５１ａ，５１ｂ，５１ｃが搬送アーム４５
から感光基板１５を受け取ると、搬送アーム４５を基板
ステージ１６の上方から退避させる。基板上下ピン５１
ａ，５１ｂ，５１ｃは感光基板１５を受け取ると下方へ
下がり、感光基板１５を基板保持用アダプター１８の基
板保持面上に載置する。基板ステージ１６が基板保持用
アダプター１８の基板保持面に感光基板１５を受け取る
と、真空吸着によって基板保持面に感光基板１５を吸着
して保持する。感光基板１５が基板ステージ１６上に載
置されると、主制御系４２は基板ステージ１６を投影光
学系１４の下方に移動して、アライメント動作やフォー
カス動作、及び露光動作を行う。When the photosensitive substrate 15 is received on the substrate holding surface of the substrate holding adapter 18 from the transfer arm 45, the main control system 42 moves the substrate upper and lower pins 51a, 51b, 51c upward through an expansion mechanism (not shown). . And
The substrate upper and lower pins 51a, 51b, 51c are
When receiving the photosensitive substrate 15 from the substrate arm, the transfer arm 45 is retracted from above the substrate stage 16. Board upper and lower pins 51
When the photosensitive substrate 15 is received, the substrates a, 51b, and 51c are lowered, and the photosensitive substrate 15 is placed on the substrate holding surface of the substrate holding adapter 18. When the substrate stage 16 receives the photosensitive substrate 15 on the substrate holding surface of the substrate holding adapter 18, the photosensitive substrate 15 is sucked and held on the substrate holding surface by vacuum suction. When the photosensitive substrate 15 is placed on the substrate stage 16, the main control system 42 moves the substrate stage 16 below the projection optical system 14, and performs an alignment operation, a focus operation, and an exposure operation.
【００２３】図３は基板保持用アダプターの説明図であ
り、図３（ａ）は全体の斜視図、図３（ｂ）は図３
（ａ）のＡ−Ａ断面図、図３（ｃ）は図３（ａ）のＢ−
Ｂ断面図である。基板保持用アダプター１８は感光基板
１５と同程度の厚みと形状を有する、例えばセラミック
製の部材からなり、その表面の基板保持面に感光基板を
真空吸着保持するものである。基板保持面には複数の真
空吸着用の溝６０が設けられ、さらに３本の基板上下ピ
ン５１ａ，５１ｂ，５１ｃを遊嵌する３個の円形開口６
２ａ，６２ｂ，６２ｃが設けられている。真空吸着用の
溝６０には各々１箇所又は数箇所の真空吸引孔６１が裏
面まで貫通して設けられている。FIG. 3 is an explanatory view of the adapter for holding a substrate. FIG. 3 (a) is a perspective view of the whole, and FIG. 3 (b) is FIG.
3A is a cross-sectional view taken along the line AA, and FIG.
It is B sectional drawing. The substrate holding adapter 18 has the same thickness and shape as the photosensitive substrate 15 and is made of, for example, a ceramic member, and vacuum-holds the photosensitive substrate on the substrate holding surface on its surface. A plurality of grooves 60 for vacuum suction are provided on the substrate holding surface, and three circular openings 6 for loosely fitting three substrate upper and lower pins 51a, 51b, 51c.
2a, 62b and 62c are provided. The vacuum suction groove 60 is provided with one or several vacuum suction holes 61 penetrating to the back surface.
【００２４】図４は、ベースステージの一例を示す斜視
図である。ベースステージ１７の上面、すなわち基板保
持用アダプター１８を載置して真空吸着により固定する
保持部は、一面に多数の突起７０が設けられ、この多数
の突起７０によって基板保持用アダプター１８の下面を
多点支持することで、基板保持用アダプター１８を平面
性を保った状態で保持する。また、ベースステージ１７
には３本の基板上下ピンを通す３箇所の貫通孔７２ａ，
７２ｂ，７２ｃと、基板保持用アダプター１８の真空吸
引孔６１に接続される複数の小孔７１が設けられてい
る。基板上下ピンを通す貫通孔７２ａ，７２ｂ，７２ｃ
の各々は、ベースステージ１７の中心に対して例えば３
０°の角度を張るように円周方向に延びた細長い形状を
している。保持部の外周部分７４、３箇所の貫通孔７２
ａ，７２ｂ，７２ｃの周壁部分７３ａ，７３ｂ，７３
ｃ、及び複数の小孔７１の周囲部分７５は、多数の突起
７０が設けられたベースステージ１７の保持部に基板保
持用アダプター１８を真空吸引したとき、それらの箇所
から空気漏れが生じないように気密な壁部で囲まれてい
る。FIG. 4 is a perspective view showing an example of the base stage. The upper surface of the base stage 17, that is, the holding portion on which the substrate holding adapter 18 is placed and fixed by vacuum suction is provided with a large number of projections 70 on one surface. By supporting at multiple points, the substrate holding adapter 18 is held in a state where the flatness is maintained. Also, base stage 17
Have three through holes 72a through which the three upper and lower pins of the substrate are passed.
72b, 72c and a plurality of small holes 71 connected to the vacuum suction holes 61 of the substrate holding adapter 18 are provided. Through holes 72a, 72b, 72c through which upper and lower pins of the substrate are passed
Are, for example, 3 with respect to the center of the base stage 17.
It has an elongated shape extending in the circumferential direction so as to form an angle of 0 °. Outer peripheral portion 74 of holding portion, three through holes 72
a, 72b, 73c, 73b, 73b
c, and the peripheral portion 75 of the plurality of small holes 71 are such that when the substrate holding adapter 18 is vacuum-sucked to the holding portion of the base stage 17 provided with a large number of projections 70, air leakage does not occur from those portions. It is surrounded by airtight walls.
【００２５】基板保持用アダプター１８は、ベースステ
ージ１７上に位置決めされて載置される。すなわち、図
５に示すように、基板保持用アダプター１８の３つの開
口６２ａ，６２ｂ，６２ｃの位置をベースステージ１７
の保持部に設けられた３箇所の貫通孔７２ａ，７２ｂ，
７２ｃの位置にそれぞれ一致させ、また、基板保持用ア
ダプター１８の基板保持面に設けられた真空吸着用の溝
６０に連通する複数の真空吸引孔６１を各々ベースステ
ージ１７の保持面に設けられた複数の小孔７１にそれぞ
れ位置合わせした状態で載置される。The substrate holding adapter 18 is positioned and mounted on the base stage 17. That is, as shown in FIG. 5, the positions of the three openings 62a, 62b, 62c of the
, Three through holes 72a, 72b,
A plurality of vacuum suction holes 61 are respectively provided on the holding surface of the base stage 17 so as to coincide with the positions of 72c and communicate with the vacuum suction grooves 60 provided on the substrate holding surface of the substrate holding adapter 18. The plurality of small holes 71 are placed so as to be aligned with each other.
【００２６】図６は、基板ステージ１６に設けられたベ
ースステージ１７上面の保持部に基板保持用アダプター
１８を真空吸着保持し、さらに基板保持用アダプター１
８の基板保持面に感光基板１５を真空吸着保持している
状態を模式的に示した断面図である。３本（図には２本
のみ図示）の基板上下ピン５１ａ，５１ｂは下方位置に
ある。ベースステージ１７上面の保持部には、一面に設
けられた多数の突起７０の上に基板保持用アダプター１
８が平面性を保って多点支持されている。このとき、ベ
ースステージ１７の保持部と基板保持用アダプター１８
の下面との間に形成される空間は閉じた空間となり、外
部の真空排気ポンプに連通する排気通路７６からこの空
間を真空排気することで、基板保持用アダプター１８は
ベースステージ１７の保持部に真空吸着保持される。ま
た、外部の真空排気ポンプに連通する他の排気通路７７
から、ベースプレート１７の小孔７１及び基板保持用ア
ダプター１８の真空吸引孔６１を介して基板保持用アダ
プター１８の基板保持面の溝６０を真空排気すること
で、基板保持用アダプター１８の基板保持面に感光基板
１５が真空吸着保持される。FIG. 6 shows a state in which a substrate holding adapter 18 is vacuum-adsorbed and held on a holding portion on the upper surface of a base stage 17 provided on the substrate stage 16.
8 is a cross-sectional view schematically showing a state in which a photosensitive substrate 15 is held by vacuum suction on a substrate holding surface 8. Three (only two are shown in the figure) substrate upper and lower pins 51a and 51b are at the lower position. The holding portion on the upper surface of the base stage 17 has a plurality of projections 70 provided on one surface thereof, and the adapter 1 for holding the substrate.
8 are supported at multiple points while maintaining flatness. At this time, the holding portion of the base stage 17 and the substrate holding adapter 18
A space formed between the substrate holding adapter 18 and the lower surface of the base stage 17 is a closed space. By evacuating this space from an exhaust passage 76 communicating with an external vacuum exhaust pump, the substrate holding adapter 18 It is held by vacuum suction. Further, another exhaust passage 77 communicating with an external vacuum exhaust pump is provided.
Then, the groove 60 on the substrate holding surface of the substrate holding adapter 18 is evacuated through the small hole 71 of the base plate 17 and the vacuum suction hole 61 of the substrate holding adapter 18, whereby the substrate holding surface of the substrate holding adapter 18 is evacuated. The photosensitive substrate 15 is held by vacuum suction.
【００２７】この例のように多数の突起７０の上に基板
保持用アダプター１８を支持すると、仮に基板保持用ア
ダプター１８の下面や突起７０の上に異物が付着してい
たとしても、異物が基板保持用アダプター１８の下面と
突起７０の頂部の間に挟まって基板保持用アダプター１
８を変形させる可能性が小さくなる。３本の基板上下ピ
ン５１ａ，５１ｂ，５１ｃは一体として、ベースプレー
ト１８の中心の回りに約３０度回動可能になっている。
そして、基板上下ピンの回転方向位置を選択することに
より、基板上下ピン５１ａ，５１ｂ，５１ｃと基板搬送
系の搬送アーム４５との間に感光基板１５の受け渡しを
行ったり、基板保持用アダプター１８の受け渡しを行っ
たりすることができる。When the substrate holding adapter 18 is supported on a large number of projections 70 as in this example, even if foreign matter adheres to the lower surface of the substrate holding adapter 18 or the projections 70, the foreign matter is The substrate holding adapter 1 sandwiched between the lower surface of the holding adapter 18 and the top of the projection 70
8 is less likely to deform. The three board upper and lower pins 51a, 51b, and 51c are integrally rotatable about the center of the base plate 18 by about 30 degrees.
Then, by selecting the rotation direction position of the substrate upper and lower pins, the photosensitive substrate 15 is transferred between the substrate upper and lower pins 51a, 51b, and 51c and the transfer arm 45 of the substrate transfer system, and the substrate holding adapter 18 Can be handed over.
【００２８】基板ステージ１６を上方から見た図７及び
図８を用いて、基板保持用アダプター１８の着脱方法に
ついて説明する。図７は感光基板１５の受け渡しを行う
ように基板上下ピンの位置が設定された基板ステージの
上面図であり、図８は基板保持用アダプターの受け渡し
を行うように基板上下ピンの位置が設定された基板ステ
ージの上面図である。感光基板１５の受け渡しを行うと
きは、図７に示したように、３本の基板上下ピン５１
ａ，５１ｂ，５１ｃの回転方向位置が円周方向に細長い
貫通孔７２ａ，７２ｂ，７２ｃの例えば右端部分に設定
されており、基板上下ピン５１ａ，５１ｂ，５１ｃの位
置が基板保持用アダプター１８の開口６２ａ，６２ｂ，
６２ｃの位置と一致している。この状態では、基板上下
ピン５１ａ，５１ｂ，５１ｃは基板ステージ１６のベー
スステージ１７及び基板保持用アダプター１８を貫通し
て上下動することができ、図２に示したように、基板搬
送系の搬送アーム４５との間で感光基板１５の受け渡し
を行うことができる。A method of attaching and detaching the substrate holding adapter 18 will be described with reference to FIGS. 7 and 8 in which the substrate stage 16 is viewed from above. FIG. 7 is a top view of the substrate stage in which the positions of the substrate upper and lower pins are set so as to transfer the photosensitive substrate 15, and FIG. 8 is a diagram in which the positions of the substrate upper and lower pins are set so as to transfer the substrate holding adapter. FIG. 4 is a top view of a substrate stage that has been set. When the photosensitive substrate 15 is to be transferred, as shown in FIG.
The positions of the a, 51b, and 51c in the rotation direction are set at, for example, the right end portions of the through holes 72a, 72b, and 72c which are elongated in the circumferential direction, and the positions of the board upper and lower pins 51a, 51b, and 51c are the openings of the board holding adapter 18. 62a, 62b,
62c. In this state, the substrate upper and lower pins 51a, 51b, and 51c can move up and down through the base stage 17 of the substrate stage 16 and the substrate holding adapter 18, and as shown in FIG. The photosensitive substrate 15 can be transferred to and from the arm 45.
【００２９】一方、図８では、図７の状態から基板上下
ピン５１ａ，５１ｂ，５１ｃが反時計回りに回転して、
基板上下ピンの位置が円周方向に細長い貫通孔７２ａ，
７２ｂ，７２ｃの例えば左端部分に設定されている。こ
の状態では、基板上下ピン５１ａ，５１ｂ，５１ｃの位
置は基板保持用アダプター１８に設けられた開口６２
ａ，６２ｂ，６２ｃの位置と一致せず、基板上下ピンを
上昇させたとき先端が基板保持用アダプターの下面と衝
突する。したがって、ベースプレート１７と基板保持用
アダプター１８との間の真空吸着を解除したうえで基板
上下ピン５１ａ，５１ｂ，５１ｃを上昇させると、図９
に示すように、基板上下ピン５１ａ，５１ｂ，５１ｃ
（図９には５１ａ及び５１ｂのみを図示）によって基板
保持用アダプター１８を持ち上げ、基板搬送系の搬送ア
ーム４５に受け渡すことができる。On the other hand, in FIG. 8, the substrate upper and lower pins 51a, 51b, 51c rotate counterclockwise from the state of FIG.
The positions of the upper and lower pins of the substrate are circumferentially elongated through holes 72a,
For example, it is set at the left end of 72b, 72c. In this state, the positions of the substrate upper and lower pins 51a, 51b, and 51c are determined by the openings 62 provided in the substrate holding adapter 18.
The positions do not coincide with the positions of a, 62b, and 62c, and when the substrate upper and lower pins are raised, the leading end collides with the lower surface of the substrate holding adapter. Accordingly, when the vacuum suction between the base plate 17 and the substrate holding adapter 18 is released, and the substrate upper and lower pins 51a, 51b, 51c are raised, FIG.
As shown in the figure, the substrate upper and lower pins 51a, 51b, 51c
The substrate holding adapter 18 can be lifted up by means of (FIG. 9 shows only 51a and 51b) and transferred to the transfer arm 45 of the substrate transfer system.
【００３０】図１０は、基板保持用アダプター１８が基
板ステージ１６の上方で基板搬送系の搬送アーム４５に
よって保持されている状態を示す斜視図である。基板保
持用アダプター１８は感光基板と同様の厚さ及び形状を
有するため、露光装置内で感光基板と同様に取り扱うこ
とができ、図１０に示すように、基板搬送系のアーム４
５によって搬送することが可能である。基板ステージ１
６のベースステージ１７上面の保持部から除去された基
板保持用アダプター１８は、基板搬送系３５のアーム４
５に載置されて露光装置内の洗浄部３６（図１参照）に
搬送され、そこで例えば超音波洗浄などによって付着し
た異物の洗浄除去が行われる。異物除去が終了した基板
保持用アダプター１８は、再び基板搬送系３５の搬送ア
ーム４５によって基板ステージ上に搬送され、図２に示
した感光基板の受け渡しと同様の手順によって基板ステ
ージ１６のベースステージ１７上に載置され、前述のよ
うに保持部に真空吸着保持される。このように、感光基
板と同様の形状の基板保持アダプター１８を用いること
により、人手を介することなく基板保持面を清掃するこ
とができる。FIG. 10 is a perspective view showing a state in which the substrate holding adapter 18 is held above the substrate stage 16 by the transfer arm 45 of the substrate transfer system. Since the substrate holding adapter 18 has the same thickness and shape as the photosensitive substrate, it can be handled in the exposure apparatus in the same manner as the photosensitive substrate, and as shown in FIG.
5 can be transported. Substrate stage 1
The substrate holding adapter 18 removed from the holding section on the upper surface of the base stage 17 of the
5 and transferred to a cleaning section 36 (see FIG. 1) in the exposure apparatus, where the foreign substances adhered thereto are cleaned and removed by, for example, ultrasonic cleaning. The substrate holding adapter 18 from which the foreign matter has been removed is transported again onto the substrate stage by the transport arm 45 of the substrate transport system 35, and the base stage 17 of the substrate stage 16 is subjected to the same procedure as the transfer of the photosensitive substrate shown in FIG. It is placed on the upper part and held by the holding part by vacuum suction as described above. As described above, by using the substrate holding adapter 18 having the same shape as the photosensitive substrate, the substrate holding surface can be cleaned without manual operation.
【００３１】また、基板ステージ１６から取り外した基
板保持用アダプター１８は、露光装置内の洗浄部３６に
搬送せず、図１に示した基板収納ボックス３４内に回収
することも可能である。その後、露光装置から基板収納
ボックス３４を取り出し、その中に納められた基板保持
用アダプターを装置外部に設置された基板洗浄機にかけ
る。基板洗浄機で洗浄して異物が除去された基板保持用
アダプター１８を再び基板収納ボックス３４に収納し、
その基板収納ボックス３４を露光装置の元の位置に設置
すれば、その後は感光基板を基板ステージに搬送するの
と同様の手順で、基板搬送系３５により基板保持用アダ
プター１８を基板ステージ１６のベースステージ１７上
面の保持部に搬送することができる。The substrate holding adapter 18 removed from the substrate stage 16 can be collected in the substrate storage box 34 shown in FIG. 1 without being transported to the cleaning unit 36 in the exposure apparatus. Thereafter, the substrate storage box 34 is taken out of the exposure apparatus, and the adapter for holding the substrate contained therein is placed on a substrate cleaning machine installed outside the apparatus. The substrate holding adapter 18 from which the foreign matter has been removed by cleaning with the substrate cleaning machine is stored again in the substrate storage box 34,
After the substrate storage box 34 is set at the original position of the exposure apparatus, the substrate holding adapter 18 is moved to the base of the substrate stage 16 by the substrate transfer system 35 in the same procedure as for transferring the photosensitive substrate to the substrate stage. It can be transported to the holding section on the upper surface of the stage 17.
【００３２】図１１は、ベースステージの他の例を説明
する斜視図である。この例においては、基板保持用アダ
プターを載置して真空吸着により固定するベースステー
ジ１７Ａの保持部は、一定の厚さの多孔質セラミックス
８０で構成されている。ベースステージ１７Ａには３本
の基板上下ピン５１ａ，５１ｂ，５１ｃを通す３箇所の
貫通孔８２ａ，８２ｂ，８２ｃと、基板保持用アダプタ
ー１８の真空吸引孔６１に接続される複数の小孔８１が
設けられている。基板上下ピンを通す貫通孔８２ａ，８
２ｂ，８２ｃは、ベースステージ１７Ａの中心に対して
例えば３０°の角度をなすように各々円周方向に延びた
細長い形状をしている。ベースステージ１７Ａの保持部
の外周部分８４、３箇所の貫通孔８２ａ，８２ｂ，８２
ｃの周壁８３ａ，８３ｂ，８３ｃ、及び複数の小孔８１
の周囲部分８５は、保持部に基板保持用アダプター１８
を真空吸引したときそれらの箇所から空気漏れが生じな
いように、例えば多孔質セラミックスに樹脂を充填して
空気の透過を防止する処理を施したり、あるいは空気を
透過しないように多孔質ではない材料によって構成され
ている。FIG. 11 is a perspective view for explaining another example of the base stage. In this example, the holding portion of the base stage 17A on which the substrate holding adapter is placed and fixed by vacuum suction is made of a porous ceramic 80 having a constant thickness. The base stage 17A has three through holes 82a, 82b, 82c through which the three substrate upper and lower pins 51a, 51b, 51c pass, and a plurality of small holes 81 connected to the vacuum suction holes 61 of the substrate holding adapter 18. Is provided. Through holes 82a, 8 through which upper and lower pins of the substrate are passed
Each of 2b and 82c has an elongated shape extending in the circumferential direction so as to form an angle of, for example, 30 ° with respect to the center of the base stage 17A. Outer peripheral portion 84 of the holding portion of base stage 17A, three through holes 82a, 82b, 82
c, peripheral walls 83a, 83b, 83c and a plurality of small holes 81
Of the substrate holding adapter 18
In order to prevent air from leaking from those places when vacuum suction is applied, for example, a process is performed to prevent air from permeating by filling resin into porous ceramics, or a non-porous material is used to prevent air from permeating It is constituted by.
【００３３】基板保持用アダプター１８は、３つの開口
６２ａ，６２ｂ，６２ｃの位置をベースステージ１７Ａ
の保持部に設けられた３箇所の貫通孔８２ａ，８２ｂ，
８２ｃの位置にそれぞれ一致させ、また、基板保持用ア
ダプター１８の基板保持面に設けられた真空吸着用の溝
６０に連通する複数の真空吸引孔６１を保持部に設けら
れた複数の小孔８１にそれぞれ位置合わせした状態でベ
ースステージ１７Ａの保持部に載置される。The substrate holding adapter 18 adjusts the positions of the three openings 62a, 62b and 62c to the base stage 17A.
, Three through holes 82a, 82b,
82c, and a plurality of small holes 81 provided in the holding portion, and a plurality of vacuum suction holes 61 communicating with the vacuum suction grooves 60 provided on the substrate holding surface of the substrate holding adapter 18 are provided. Are placed on the holding portion of the base stage 17A in a state where they are aligned with each other.
【００３４】図１２は、図１１に示したベースステージ
１７Ａの保持部に基板保持用アダプター１８を真空吸着
保持し、さらにその上に感光基板１５を真空吸着保持し
ている状態を模式的に示した断面図である。基板上下ピ
ン５１ａ，５１ｂは下方位置にある。ベースステージ１
７Ａ上面の多孔質セラミックス８０かならる保持部に
は、基板保持用アダプター１８が平面性を保って支持さ
れている。このとき、上部の開放面を基板保持用アダプ
ター１８によって塞がれたベースステージ１７Ａの多孔
質セラミックス８０を外部の真空排気ポンプに連通する
排気通路８６から真空排気することで、基板保持用アダ
プター１８はベースステージ１７Ａの保持面に真空吸着
保持される。また、外部の真空排気ポンプに連通する他
の排気通路８７から、ベースプレート１７Ａの小孔８１
及び基板保持用アダプター１８の真空吸引孔６１を介し
て基板保持用アダプター１８の基板保持面の溝６０を真
空排気することで、基板保持用アダプター１８の基板保
持面に感光基板１５が真空吸着保持される。FIG. 12 schematically shows a state in which the substrate holding adapter 18 is held by vacuum suction on the holding portion of the base stage 17A shown in FIG. 11, and the photosensitive substrate 15 is held thereon by vacuum suction. FIG. The board upper and lower pins 51a and 51b are at the lower position. Base stage 1
A substrate holding adapter 18 is supported on the holding portion formed of the porous ceramics 80 on the upper surface of 7A while maintaining the flatness. At this time, the porous ceramics 80 of the base stage 17A whose upper open surface is closed by the substrate holding adapter 18 is evacuated from the evacuation passage 86 communicating with the external evacuation pump. Is held by vacuum suction on the holding surface of the base stage 17A. Further, a small hole 81 of the base plate 17A is provided from another exhaust passage 87 communicating with an external vacuum exhaust pump.
By evacuating the groove 60 of the substrate holding surface of the substrate holding adapter 18 through the vacuum suction hole 61 of the substrate holding adapter 18, the photosensitive substrate 15 is held on the substrate holding surface of the substrate holding adapter 18 by vacuum suction. Is done.
【００３５】この場合にも、基板保持用アダプター１８
の下面やベースステージ１７Ａの保持面に付着した異物
が保持面と基板保持用アダプター１８の下面との間に挟
まって、基板保持用アダプター１８を変形させる可能性
が小さくなる。基板保持用アダプター１８を清掃する時
の一連の動作は先の例と同じである。ところで露光装置
で扱う感光基板には、円形をしたウエハーや矩形のガラ
スプレート等、種類によって外形が異なるものがある。
その寸法も３インチ、６インチ、８インチ、１２インチ
などと種々のものがある。露光装置の基板ステージ１６
は、これら形状の異なる感光基板を保持する必要がある
ため、基板保持用アダプター１８も感光基板の形状に応
じたものを複数種類用意しておき、露光する感光基板の
形状に合わせたものを使用するのがよい。Also in this case, the substrate holding adapter 18
Foreign matter adhering to the lower surface of the base stage 17A and the holding surface of the base stage 17A is caught between the holding surface and the lower surface of the substrate holding adapter 18, and the possibility of deforming the substrate holding adapter 18 is reduced. A series of operations when cleaning the substrate holding adapter 18 is the same as the previous example. Incidentally, some photosensitive substrates handled by the exposure apparatus have different outer shapes depending on the type, such as a circular wafer and a rectangular glass plate.
There are various sizes such as 3 inches, 6 inches, 8 inches, and 12 inches. Substrate stage 16 of exposure apparatus
Since it is necessary to hold these photosensitive substrates having different shapes, a plurality of types of substrate holding adapters 18 according to the shape of the photosensitive substrate are prepared, and the adapter 18 adapted to the shape of the photosensitive substrate to be exposed is used. Good to do.
【００３６】図１３は、複数の基板保持用アダプターを
交換して使用する場合に好適なベースステージを説明す
る上面図である。図は、基板保持用アダプターとして直
径の異なる２種類の円形のものを使用する場合のベース
ステージを示す。ベースステージ９０保持部は気密な境
界壁９６によって複数の領域、図の場合は内側領域９７
と外側領域９８の２つの領域に分割され、この２つの領
域９７，９８は各々独立して真空排気手段に接続される
ようになっている。基板上下ピンを貫通させる貫通孔９
２ａ，９２ｂ，９２ｃは保持部の内側領域９７に設けら
れている。小径の基板保持用アダプター１８ａを用いる
場合は、保持部の内側領域９７のみを使用する。すなわ
ち、基板保持用アダプター１８ａをその周辺部が境界壁
９６の上に乗るようにしてベースステージ９０の保持部
に載置し、保持部の内側領域９７のみを排気して基板保
持用アダプター１８ａを真空吸着保持する。FIG. 13 is a top view for explaining a base stage suitable when a plurality of substrate holding adapters are exchanged and used. The figure shows a base stage when two types of circular adapters having different diameters are used as substrate holding adapters. The holding portion of the base stage 90 is divided into a plurality of regions by an airtight boundary wall 96, and in the illustrated case, an inner region 97.
And an outer region 98. The two regions 97 and 98 are each independently connected to a vacuum exhaust unit. Through-hole 9 for penetrating upper and lower pins of substrate
2a, 92b and 92c are provided in the inner area 97 of the holding section. When using the small-diameter substrate holding adapter 18a, only the inner region 97 of the holding portion is used. That is, the substrate holding adapter 18a is placed on the holding portion of the base stage 90 such that the peripheral portion thereof rests on the boundary wall 96, and only the inner region 97 of the holding portion is evacuated to remove the substrate holding adapter 18a. Hold by vacuum suction.
【００３７】一方、大径の基板保持用アダプター１８ｂ
を使用するときは、保持部の内側領域９７及び外側領域
１８ｂの２つの領域を同時に排気してベースステージ９
０の保持部の全面に基板保持用アダプター１８ｂを真空
吸着保持する。このようにベースステージ上面の保持部
を複数の領域に分割しておき、排気する領域を基板保持
用アダプターの形状に応じて選択可能とすることで、大
きさの異なる基板保持用アダプターを交換して使用する
ことができる。On the other hand, a large-diameter substrate holding adapter 18b
When using the base stage 9, the two regions, the inner region 97 and the outer region 18 b of the holding portion, are simultaneously evacuated and
The substrate holding adapter 18b is vacuum-sucked and held on the entire surface of the zero holding unit. In this way, the holding section on the upper surface of the base stage is divided into a plurality of areas, and the area to be evacuated can be selected according to the shape of the adapter for holding the substrate. Can be used.
【００３８】ここでは、感光基板が円形であり、従って
基板保持用アダプターもベースステージも円形である場
合について説明した。しかし、本発明は円形の感光基板
に対してだけでなく、矩形等他の形状の感光基板に対し
ても適用することができる。その場合、基板保持用アダ
プターやベースステージの形状は感光基板の形状と相似
形にするのが好都合である。Here, a case has been described in which the photosensitive substrate is circular, and thus both the substrate holding adapter and the base stage are circular. However, the present invention can be applied not only to a photosensitive substrate having a circular shape but also to a photosensitive substrate having another shape such as a rectangular shape. In that case, it is convenient that the shape of the substrate holding adapter and the base stage be similar to the shape of the photosensitive substrate.
【００３９】[0039]
【発明の効果】本発明によれば、基板ステージ周囲のユ
ニットを取り外したり、人手を介したりすることなく基
板ステージの基板保持面を清掃することができる。ま
た、基板保持用アダプターを基板洗浄装置で清掃するこ
とができるので、異物の除去効果も大きく、半導体製造
の歩留まりを向上させることができる。According to the present invention, the substrate holding surface of the substrate stage can be cleaned without removing the unit around the substrate stage and without manual operation. Further, since the substrate holding adapter can be cleaned by the substrate cleaning device, the effect of removing foreign substances is great, and the yield of semiconductor manufacturing can be improved.
【図１】本発明による露光装置の一例を模式的に示した
略図。FIG. 1 is a schematic view schematically showing an example of an exposure apparatus according to the present invention.
【図２】感光基板が基板ステージの上方で搬送アームに
よって保持されている状態を示す基板ステージの周辺の
斜視図。FIG. 2 is a perspective view of the periphery of the substrate stage showing a state where the photosensitive substrate is held by a transfer arm above the substrate stage.
【図３】基板保持用アダプターの説明図であり、（ａ）
は全体の斜視図、（ｂ）はＡ−Ａ断面図、（ｃ）はＢ−
Ｂ断面図。FIGS. 3A and 3B are explanatory views of a board holding adapter, and FIG.
Is a perspective view of the whole, (b) is a cross-sectional view taken along the line AA, (c) is a B-
B sectional drawing.
【図４】ベースステージの一例を示す斜視図。FIG. 4 is a perspective view showing an example of a base stage.
【図５】ベースステージと基板保持用アダプターの位置
合わせを説明する図。FIG. 5 is a view for explaining positioning of a base stage and a substrate holding adapter.
【図６】ベースステージの保持部に基板保持用アダプタ
ーを真空吸着保持し、その上に感光基板を真空吸着保持
している状態を模式的に示した断面図。FIG. 6 is a cross-sectional view schematically showing a state in which a substrate holding adapter is held by vacuum suction on a holding portion of a base stage, and a photosensitive substrate is held thereon by vacuum suction.
【図７】感光基板の受け渡しを行うように基板法下ピン
の位置が設定された基板ステージの上面図。FIG. 7 is a top view of a substrate stage in which the position of a substrate method lower pin is set so as to transfer a photosensitive substrate.
【図８】基板保持用アダプターの受け渡しを行うように
基板法下ピンの位置が設定された基板ステージの上面
図。FIG. 8 is a top view of a substrate stage in which the position of a substrate method lower pin is set so as to transfer a substrate holding adapter.
【図９】基板上下ピンによって基板保持用アダプターを
持ち上げた状態を示す略断面図。FIG. 9 is a schematic cross-sectional view showing a state where the board holding adapter is lifted by the board upper and lower pins.
【図１０】基板保持用アダプターが基板ステージの上方
で搬送アームによって保持されている状態を示す斜視
図。FIG. 10 is a perspective view showing a state where a substrate holding adapter is held by a transfer arm above a substrate stage.
【図１１】ベースステージの他の例を説明する斜視図。FIG. 11 is a perspective view illustrating another example of the base stage.
【図１２】ベースステージの保持部に基板保持用アダプ
ターを真空吸着保持し、その上に感光基板を真空吸着保
持している状態を模式的に示した断面図。FIG. 12 is a cross-sectional view schematically showing a state in which a substrate holding adapter is vacuum-sucked and held on a holding portion of a base stage, and a photosensitive substrate is vacuum-sucked and held thereon.
【図１３】複数の基板保持用アダプターを交換して使用
する場合に好適なベースステージを説明する上面図。FIG. 13 is a top view illustrating a base stage suitable for using a plurality of substrate holding adapters by replacing them.
【図１４】（ａ）は従来の基板ステージの概略平面図、
（ｂ）はその断面図。FIG. 14A is a schematic plan view of a conventional substrate stage,
(B) is a sectional view thereof.
１１…照明系、１２…マスク、１３…マスクステージ、
１４…投影光学系、１５…感光基板、１６…基板ステー
ジ、１７…ベースステージ、１８…基板保持用アダプタ
ー、２１…駆動手段、２２…移動鏡、２３…レーザ干渉
計、２５…ボディ構造、２６…アライメントセンサー、
２７…焦点検出センサー、３１…マスク収納ボックス、
３２…マスク搬送系、３４…基板収納ボックス、３５…
基板搬送系、３６…基板洗浄部、４１…ステージ駆動制
御装置、４２…主制御系、４５…搬送アーム、５１ａ，
５１ｂ，５１ｃ…基板上下ピン、６０…溝、６１…真空
吸引孔、６２ａ，６２ｂ，６２ｃ…円形開口、７０…突
起、７１…小孔、７２ａ，７２ｂ，７２ｃ…貫通孔、７
６，７７…排気通路、８０…多孔質セラミックス、８１
…小孔、８２ａ，８２ｂ，８２ｃ…貫通孔、８６，８７
…排気通路、９０…ベースステージ、９２ａ，９２ｂ，
９２ｃ…貫通孔、９６…境界壁、９７…内側領域、９８
…外側領域、１０１…リニアガイド、１０２…スライダ
ー、１０３ａ，１０３ｂ…フォーク部、１０５…載置
面、１０６…溝、１０７…センターアップ部、ＳＴ…基
板ステージ、Ｗ…感光基板、ＷＨ…基板ホルダー11 illumination system, 12 mask, 13 mask stage,
14 Projection optical system, 15 Photosensitive substrate, 16 Substrate stage, 17 Base stage, 18 Substrate holding adapter, 21 Driving means, 22 Moving mirror, 23 Laser interferometer, 25 Body structure, 26 … Alignment sensor,
27: Focus detection sensor, 31: Mask storage box,
32: mask transport system, 34: substrate storage box, 35 ...
Substrate transport system, 36: substrate cleaning unit, 41: stage drive control device, 42: main control system, 45: transport arm, 51a,
51b, 51c: substrate upper and lower pins, 60: groove, 61: vacuum suction hole, 62a, 62b, 62c: circular opening, 70: projection, 71: small hole, 72a, 72b, 72c: through hole, 7
6, 77: exhaust passage, 80: porous ceramic, 81
... Small holes, 82a, 82b, 82c ... Through holes, 86, 87
... exhaust passage, 90 ... base stage, 92a, 92b,
92c: through hole, 96: boundary wall, 97: inner area, 98
.. Outside area, 101 linear guide, 102 slider, 103a, 103b fork, 105 mounting surface, 106 groove, 107 center-up part, ST substrate stage, W photosensitive substrate, WH substrate holder
Claims (7)
上に投影する投影光学系と、前記感光基板を載置する基
板ステージとを含む露光装置において、 前記基板ステージは、前記感光基板を保持する着脱自在
な基板保持用アダプターと、前記基板保持用アダプター
を固定する保持部とを備えたことを特徴とする露光装
置。1. An exposure apparatus comprising: a projection optical system for projecting a pattern formed on a mask onto a photosensitive substrate; and a substrate stage for mounting the photosensitive substrate, wherein the substrate stage holds the photosensitive substrate An exposure apparatus comprising: a detachable substrate holding adapter; and a holding portion for fixing the substrate holding adapter.
段に連通する開口とを備え、前記多数の微小突起上に前
記感光基板を載置した状態で前記開口から前記保持部と
前記感光基板の間の空間を排気することにより前記感光
基板を真空吸着して保持することを特徴とする請求項１
記載の露光装置。2. The image forming apparatus according to claim 1, wherein the holding unit includes a plurality of minute protrusions and an opening communicating with an exhaust unit, and the holding unit and the photosensitive member are opened from the opening in a state where the photosensitive substrate is placed on the plurality of minute protrusions. 2. The method according to claim 1, wherein the photosensitive substrate is vacuum-adsorbed and held by evacuating a space between the substrates.
Exposure apparatus according to the above.
部材と排気手段とを連通する流路とを有し、前記多孔質
部材上に前記感光基板を載置した状態で前記多孔質部材
内を排気することにより前記感光基板を真空吸着して保
持することを特徴とする請求項１記載の露光装置。3. The holding section has a porous member, and a flow path communicating the porous member with an exhaust unit, and the holding member has the porous substrate in a state where the photosensitive substrate is placed on the porous member. 2. The exposure apparatus according to claim 1, wherein the photosensitive substrate is vacuum-adsorbed and held by evacuating the inside of the quality member.
基板の形状に応じたものが複数種類用意されていること
を特徴とする請求項１、２又は３記載の露光装置。4. The exposure apparatus according to claim 1, wherein a plurality of types of the substrate holding adapter are prepared according to the shape of the photosensitive substrate.
り、排気する領域を前記基板保持用アダプターの形状に
応じて選択可能であることを特徴とする請求項２、３又
は４記載の露光装置。5. The holding unit according to claim 2, wherein the holding unit is divided into a plurality of regions, and a region to be evacuated can be selected according to a shape of the substrate holding adapter. Exposure equipment.
ーとを別々に上下動する上下動機構を備えることを特徴
とする請求項１〜５のいずれか１項記載の露光装置。6. The exposure apparatus according to claim 1, further comprising a vertical movement mechanism for vertically moving the photosensitive substrate and the substrate holding adapter separately.
ダプターと、前記基板保持用アダプターを固定する保持
部とを備えることを特徴とする基板保持装置。7. A substrate holding device, comprising: a detachable substrate holding adapter for holding a substrate; and a holding portion for fixing the substrate holding adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26702396A JPH10116760A (en) | 1996-10-08 | 1996-10-08 | Aligner and substrate holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26702396A JPH10116760A (en) | 1996-10-08 | 1996-10-08 | Aligner and substrate holding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10116760A true JPH10116760A (en) | 1998-05-06 |
Family
ID=17438989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26702396A Pending JPH10116760A (en) | 1996-10-08 | 1996-10-08 | Aligner and substrate holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10116760A (en) |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001068541A (en) * | 1999-08-26 | 2001-03-16 | Tatsumo Kk | Processed substrate tray |
| JP2001326270A (en) * | 2000-03-10 | 2001-11-22 | Canon Inc | Substrate holder, semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
| JP2004207734A (en) * | 2002-12-23 | 2004-07-22 | Asml Netherlands Bv | Lithography equipment |
| JP2004343069A (en) * | 2003-03-11 | 2004-12-02 | Asml Netherlands Bv | Method and device for maintaining machine part |
| JP2007019067A (en) * | 2005-07-05 | 2007-01-25 | Sekisui Chem Co Ltd | Stage structure for surface treatment |
| JP2007103609A (en) * | 2005-10-03 | 2007-04-19 | Mejiro Precision:Kk | Projection aligner |
| KR100840236B1 (en) * | 2001-12-14 | 2008-06-20 | 삼성전자주식회사 | Exposure apparatus for preventing halation |
| US7394521B2 (en) | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2009033178A (en) * | 2007-07-30 | 2009-02-12 | Applied Materials Inc | Vacuum chucking heater of axisymmetrical and uniform thermal profile |
| US7589820B2 (en) | 2002-12-10 | 2009-09-15 | Nikon Corporation | Exposure apparatus and method for producing device |
| US7878755B2 (en) | 2003-03-11 | 2011-02-01 | Asml Netherlands B.V. | Load lock and method for transferring objects |
| US20130271945A1 (en) | 2004-02-06 | 2013-10-17 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
| JP2016021465A (en) * | 2014-07-14 | 2016-02-04 | 国立研究開発法人産業技術総合研究所 | Carrier for semiconductor process |
| US9341954B2 (en) | 2007-10-24 | 2016-05-17 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9423698B2 (en) | 2003-10-28 | 2016-08-23 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
| US9645505B2 (en) | 2004-06-09 | 2017-05-09 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with measuring device to measure specific resistance of liquid |
| US9678332B2 (en) | 2007-11-06 | 2017-06-13 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
| US9678437B2 (en) | 2003-04-09 | 2017-06-13 | Nikon Corporation | Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction |
| US9684250B2 (en) | 2003-12-23 | 2017-06-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2017195274A (en) * | 2016-04-20 | 2017-10-26 | 日本特殊陶業株式会社 | Vacuum suction device and manufacturing method thereof |
| US9829799B2 (en) | 2004-04-14 | 2017-11-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9885872B2 (en) | 2003-11-20 | 2018-02-06 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light |
| US9891539B2 (en) | 2005-05-12 | 2018-02-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| US9939739B2 (en) | 2003-05-23 | 2018-04-10 | Nikon Corporation | Exposure apparatus and method for producing device |
| US9958786B2 (en) | 2003-04-11 | 2018-05-01 | Nikon Corporation | Cleanup method for optics in immersion lithography using object on wafer holder in place of wafer |
| JP2018520386A (en) * | 2015-07-15 | 2018-07-26 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Exposure apparatus and method |
| US10101666B2 (en) | 2007-10-12 | 2018-10-16 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
| JP2019096907A (en) * | 2019-03-04 | 2019-06-20 | 三菱電機株式会社 | Vacuum chuck stage and manufacturing method of semiconductor device |
| KR20210035991A (en) * | 2019-09-25 | 2021-04-02 | (주)탑나노시스 | Method for repairing working stage |
-
1996
- 1996-10-08 JP JP26702396A patent/JPH10116760A/en active Pending
Cited By (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001068541A (en) * | 1999-08-26 | 2001-03-16 | Tatsumo Kk | Processed substrate tray |
| JP2001326270A (en) * | 2000-03-10 | 2001-11-22 | Canon Inc | Substrate holder, semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
| JP4700819B2 (en) * | 2000-03-10 | 2011-06-15 | キヤノン株式会社 | Substrate holding apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing method |
| KR100840236B1 (en) * | 2001-12-14 | 2008-06-20 | 삼성전자주식회사 | Exposure apparatus for preventing halation |
| US7589820B2 (en) | 2002-12-10 | 2009-09-15 | Nikon Corporation | Exposure apparatus and method for producing device |
| US8089611B2 (en) | 2002-12-10 | 2012-01-03 | Nikon Corporation | Exposure apparatus and method for producing device |
| JP2004207734A (en) * | 2002-12-23 | 2004-07-22 | Asml Netherlands Bv | Lithography equipment |
| JP2004343069A (en) * | 2003-03-11 | 2004-12-02 | Asml Netherlands Bv | Method and device for maintaining machine part |
| US7878755B2 (en) | 2003-03-11 | 2011-02-01 | Asml Netherlands B.V. | Load lock and method for transferring objects |
| US7576831B2 (en) | 2003-03-11 | 2009-08-18 | Asml Netherlands B.V. | Method and apparatus for maintaining a machine part |
| US9678437B2 (en) | 2003-04-09 | 2017-06-13 | Nikon Corporation | Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction |
| US9885959B2 (en) | 2003-04-09 | 2018-02-06 | Nikon Corporation | Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator |
| US9958786B2 (en) | 2003-04-11 | 2018-05-01 | Nikon Corporation | Cleanup method for optics in immersion lithography using object on wafer holder in place of wafer |
| US9939739B2 (en) | 2003-05-23 | 2018-04-10 | Nikon Corporation | Exposure apparatus and method for producing device |
| US9423698B2 (en) | 2003-10-28 | 2016-08-23 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
| US9760014B2 (en) | 2003-10-28 | 2017-09-12 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
| US9885872B2 (en) | 2003-11-20 | 2018-02-06 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light |
| US10281632B2 (en) | 2003-11-20 | 2019-05-07 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction |
| US9684250B2 (en) | 2003-12-23 | 2017-06-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10613447B2 (en) | 2003-12-23 | 2020-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7394521B2 (en) | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10768538B2 (en) | 2003-12-23 | 2020-09-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9817321B2 (en) | 2003-12-23 | 2017-11-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10234770B2 (en) | 2004-02-06 | 2019-03-19 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
| US10007194B2 (en) | 2004-02-06 | 2018-06-26 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
| US10241417B2 (en) | 2004-02-06 | 2019-03-26 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
| US20130271945A1 (en) | 2004-02-06 | 2013-10-17 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
| US10234768B2 (en) | 2004-04-14 | 2019-03-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9989861B2 (en) | 2004-04-14 | 2018-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9829799B2 (en) | 2004-04-14 | 2017-11-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10705432B2 (en) | 2004-04-14 | 2020-07-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9645505B2 (en) | 2004-06-09 | 2017-05-09 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with measuring device to measure specific resistance of liquid |
| US9891539B2 (en) | 2005-05-12 | 2018-02-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| JP2007019067A (en) * | 2005-07-05 | 2007-01-25 | Sekisui Chem Co Ltd | Stage structure for surface treatment |
| JP2007103609A (en) * | 2005-10-03 | 2007-04-19 | Mejiro Precision:Kk | Projection aligner |
| JP4629548B2 (en) * | 2005-10-03 | 2011-02-09 | 株式会社目白プレシジョン | Projection exposure equipment |
| JP2009033178A (en) * | 2007-07-30 | 2009-02-12 | Applied Materials Inc | Vacuum chucking heater of axisymmetrical and uniform thermal profile |
| JP2014053645A (en) * | 2007-07-30 | 2014-03-20 | Applied Materials Inc | Vacuum chucking heater of axisymmetrical and uniform thermal profile |
| US10101666B2 (en) | 2007-10-12 | 2018-10-16 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9341954B2 (en) | 2007-10-24 | 2016-05-17 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9857599B2 (en) | 2007-10-24 | 2018-01-02 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9678332B2 (en) | 2007-11-06 | 2017-06-13 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
| JP2016021465A (en) * | 2014-07-14 | 2016-02-04 | 国立研究開発法人産業技術総合研究所 | Carrier for semiconductor process |
| JP2018520386A (en) * | 2015-07-15 | 2018-07-26 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Exposure apparatus and method |
| JP2017195274A (en) * | 2016-04-20 | 2017-10-26 | 日本特殊陶業株式会社 | Vacuum suction device and manufacturing method thereof |
| JP2019096907A (en) * | 2019-03-04 | 2019-06-20 | 三菱電機株式会社 | Vacuum chuck stage and manufacturing method of semiconductor device |
| KR20210035991A (en) * | 2019-09-25 | 2021-04-02 | (주)탑나노시스 | Method for repairing working stage |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10116760A (en) | Aligner and substrate holding device | |
| US6862080B2 (en) | Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method | |
| US6593045B2 (en) | Substrate processing apparatus and method | |
| TWI538014B (en) | A substrate holding device, an exposure apparatus, an exposure method, and an element manufacturing method | |
| TWI587430B (en) | A conveyance device, a conveying method, an exposure apparatus, and an element manufacturing method | |
| JP2753930B2 (en) | Immersion type projection exposure equipment | |
| JP2004319891A (en) | Exposure apparatus | |
| JPH10172897A (en) | Substrate adaptor, substrate holder and method for holding substrate | |
| KR101061637B1 (en) | Method for removing particles from substrate, apparatus and coating thereof, developing device | |
| JP2010114466A (en) | Device and method for joining substrates | |
| KR101384440B1 (en) | Article loading/unloading method and article loading/unloading device, exposure method and exposure apparatus, and method of manufacturing device | |
| JP2014003259A (en) | Load method, substrate holding apparatus, and exposure apparatus | |
| JPH11233400A (en) | Aligner, method and abrasive wheel for cleaning wafer chuck, and device manufacture | |
| JPH08288355A (en) | Substrate transfer system | |
| JPWO2008129982A1 (en) | Substrate processing method and system, and device manufacturing method | |
| JP2004221296A (en) | Substrate holding device and aligner, and device manufacturing method | |
| JPH07321179A (en) | Substrate carrying device | |
| JP2004221323A (en) | Substrate holding device, aligner and method for manufacturing device | |
| JP2005044882A (en) | Transporting device and aligner | |
| JP2004063934A (en) | Storage device, aligner, cleaning processing method and exposure method | |
| JP3551423B2 (en) | Exposure equipment | |
| JPH09266166A (en) | Aligner | |
| JPH08181057A (en) | Exposure apparatus and method therefor | |
| JP6186678B2 (en) | Object exchange method, object exchange system, exposure apparatus, flat panel display manufacturing method, and device manufacturing method | |
| KR20110021653A (en) | Exposure apparatus, and device manufacturing method using same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050425 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050510 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050711 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070327 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070528 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080715 |