JP2000323550A - Storing unit and board processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure safety even when operations such as instructing operations are performed within a storing unit, by providing an opening of the storing unit with a first opening corresponding to the configuration of a board and second openings corresponding to a transfer unit, the first and second openings being formed continuously. SOLUTION: An opening 8 of a storing unit has a first opening 8a for boards and second openings 8b for arms, both openings being formed continuously. The opening 8a is formed in a manner extending in a horizontal direction, and the openings 8b juxtaposed at a predetermined interval therebetween in a manner extending downward in a vertical direction. The length L1 of the opening 8a is slightly larger than the length of a glass board P, and its width W1 is slightly larger than the sum of the thickness and amount of flection of the board P. Further, the width W2 of each opening 8b is slightly larger than the thickens of a load arm 10 while corresponding to the configuration of the arm 10, and its length L2 is slightly larger than an elevating stroke required for receiving and delivering the board P.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage device for storing a transfer device for transferring a substrate through an opening, and a transfer device for transferring the substrate. The present invention relates to a substrate processing apparatus that performs processing.

[0002]

2. Description of the Related Art In recent years, in a lithography process for manufacturing a liquid crystal display panel, a plasma display panel, or the like, an exposure apparatus and another substrate processing apparatus, for example, A lithography system in which a coating device (coater) for applying a photosensitive agent such as a resist to a substrate or a developing device (developer) for developing a substrate on which the photosensitive agent is applied is connected in-line has been widely used. .

In a lithography system of this type, for example, a coater / developer provided with an exposure device main body, a substrate transfer device, and a delivery port in a chamber (storage device) of the exposure device and having both a photosensitive agent application function and a development function is provided. A coater / developer main body and a substrate transfer device are provided in a chamber (storage device). And the coater
The substrate (for example, a glass substrate) on which a predetermined process has been performed by the developer is carried into a transfer port in the exposure apparatus by the substrate transfer device on the coater / developer side through openings provided in both chambers.

The substrate set in the transfer port is transported to the exposure apparatus main body by a substrate transport device on the exposure apparatus side and subjected to exposure processing. The substrate transported again to the coater / developer after the exposure processing is transported in the reverse order. Other substrates are carried out of the exposure apparatus and sent to an inspection process or the like.

Incidentally, the above-described chambers of the exposure apparatus and the coater / developer are provided with doors for entering and exiting the apparatus at the time of teaching work and maintenance work for each substrate transfer apparatus. The teaching operation is an operation of storing coordinates such as a transfer position and a height of the substrate in the substrate transfer device. The lithography system has a so-called interlock function for stopping the operation of the substrate transfer device for safety when the door is opened.

This interlock function is to stop the board transfer device without software by interposing a circuit between the door opening / closing detecting means such as a sensor and the board transfer device with relay contacts or the like. In addition, even if it has an interlock function, the board transfer device is operable during the teaching operation.

[0007]

However, the conventional storage apparatus and substrate processing apparatus as described above have the following problems. As shown in FIG. 11, the opening K provided in the chamber has a width W through which the substrate P can pass.
And a height H that allows a transfer arm F that supports the substrate P to pass from below with a certain interval, and allows for a stroke descending to transfer the substrate P to the transfer port. I have. In recent years, as the size of the liquid crystal display panel increases, the width W of the opening K also increases. On the other hand, since the substrate P is thinned in order to avoid weight increase, the height H of the opening K is also increased in consideration of the bending generated during transport. In other words, the opening area of the opening K is being increased by increasing the width W and the height H.

For this reason, when an operator performs an operation such as a teaching operation in the chamber of one of the devices, there is a high possibility that a part of the body projects from the transfer opening K during the operation.
In this case, it is extremely dangerous if the substrate transfer device operates in the other chamber, and effective safety measures have been desired. As an example of a safety measure, a measure of attaching a sensor or the like for detecting a human body to the opening K can be considered, but this complicates the control and increases the cost.

Therefore, with respect to the safety of the teaching operation, safety measures such as stopping the operation of the transfer device by turning off the power supply of the substrate transfer device on the other device side are taken.
However, when the transport device is stopped, there is a problem that the production efficiency of the other device is reduced. This problem is not limited to in-line connected devices but also in one device, for example, between the exposure apparatus main body and the substrate transport device, or between the coater / developer main body and the substrate transport device, and is provided on the partition wall. The same occurs when the substrate P is transported through the opening. Therefore, there has been a demand for the development of a device that achieves both improvement in safety and productivity. Further, there has been a demand for development relating to transport of large substrates when large substrates are processed by a coater / developer.

The present invention has been made in consideration of the above points, and secures safety even when performing work in the apparatus such as teaching work and contributes to improvement of productivity. It is an object to provide an apparatus and a substrate processing apparatus.

[0011]

In order to achieve the above-mentioned object, the present invention employs the following structure corresponding to FIGS. 1 to 10 showing an embodiment. The storage device of the present invention has an opening (8), and in the storage device (5) for storing the transfer device (10) for transferring the substrate (P), the opening (8) has the shape of the substrate (P). The first opening (8
a) and a second opening (8b) formed continuously with the first opening (8a) and corresponding to the transport device (10).

Therefore, in the storage device of the present invention, when the substrate (P) is transferred to the outside or inside of the storage device (5) through the opening (8), the substrate (P) is transferred to the first opening ( 8
a) and the transport device (10) is passed through the second opening (8).
b). A first opening (8a),
The second opening (8b) is provided between the substrate (P) and the transfer device (1).
0), the openings (8)
Can be suppressed to the minimum necessary opening area.
Therefore, even when working outside the vicinity of the opening (8) of the storage device (5), a part of the human body of the worker projects into the storage device (5) through the opening (8). Can be prevented, so that the safety of the worker can be ensured. As a result, it is not necessary to stop the transfer device (10) even during the operation, and the productivity is improved.

Further, the substrate processing apparatus of the present invention comprises at least one of a coating device (9) for applying a photosensitive agent to the substrate (P) and a developing device for developing the substrate (P) to which the photosensitive agent has been applied. And a transfer device (10) for transferring the substrate (P), the transfer device (10)
And a support portion (41a) integrally provided inside the outer peripheral portion (44) and the outer peripheral portion (44) and supporting the substrate (P).
And a plurality of through holes (4) formed in the support portion (41a).
And (2) a substrate support device (39).

Therefore, in the substrate processing apparatus of the present invention, since the plurality of through-holes (42) are formed in the support portion (41a), the substrate support device (39) is in line contact with the support portion (41a). It is structured to receive the substrate (P) in surface contact. Therefore, when the transfer device (10) transfers the substrate supporting device (39) and the substrate (P) integrally from at least one of the coating device (2) and the developing device, the size of the substrate (P) increases. However, it is possible to prevent the substrate (P) from bending. Therefore, it is not necessary to consider the deflection of the substrate (P) when setting the size of the opening (8), and the opening (8) can be suppressed to the minimum necessary opening area.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a storage apparatus and a substrate processing apparatus according to the present invention will be described with reference to FIGS. Here, the substrate processing apparatus is a coater for applying a photosensitive agent to the substrate, and an exposure apparatus for performing exposure processing on the substrate on which the photosensitive agent has been applied, and the substrate is a square glass substrate used for manufacturing a liquid crystal display panel (for example, ,
1000 mm x 1000 mm, t = 1.1 mm)
Description will be made using an example in which the coater and the exposure apparatus are connected in-line. In these figures, the same components as those in FIG. 11 shown as a conventional example are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 2 is a plan view of the lithography system (substrate processing system) 1. Lithography system 1
Has a configuration in which a coater 2 having a chamber (storage device) 5 and an exposure apparatus (second substrate processing apparatus) 3 having a chamber 4 are arranged adjacent to each other. Side wall 4a of chamber 4
Has an opening K having substantially the same shape as that shown in FIG. Side wall 5 of chamber 5 facing side wall 4a
An opening 8 communicating with the opening K is formed in a. The coater 2 and the exposure device 3 are connected in-line via openings 8 and K.

The coater 2 includes a coater main body (processing device) 9 as a coating device housed in the chamber 5, a load arm (transport device) 10, a shutter (shielding member) 31, and a shutter opening / closing device 32. The coater body 9 performs a process of applying a photosensitive agent such as a resist to a glass substrate (substrate) P. The load arm 10 moves along the XY plane while holding the glass substrate P by suction and moves up and down along the Z direction, thereby transferring the glass substrate P to and from the coater body 9 and opening the opening 8. , K through which the glass substrate P is transferred to and from the exposure apparatus 3.

As shown in FIG. 1, the opening 8 is continuous with a substrate opening (first opening) 8a formed to extend in the horizontal direction (X direction) and the substrate opening 8a. Arm openings (second openings) which are formed in parallel with each other and are arranged vertically downward at regular intervals from the substrate openings 8a.
8b, 8b. The substrate opening 8a
According to the shape of the glass substrate P, the length L is
Is set to a dimension obtained by adding a slight margin to the length of the glass substrate P, and the width W1 is set to a dimension obtained by adding a slight margin to the thickness and the amount of deflection of the glass substrate P. Arm opening 8
b indicates that the width W2 is set to a dimension obtained by adding a slight margin to the width of the fork of the load arm 10 in accordance with the shape of the load arm 10, and a slight margin is given to the stroke that moves up and down when the glass substrate P is transferred. Is set to the length L2.

The shutter 31 mainly shields the opening 8 (and the opening K).
It is arranged so as to be movable in the vertical direction (Z direction). The shutter 31 closes the opening 8 (and the opening K) when ascending, and closes the opening 8 when descending.
(And the opening K).

The shutter opening / closing device 32 opens and closes the opening 8 by moving the shutter 31, and is arranged below the shutter 31 as shown in FIG. Further, a shutter opening / closing switch 33 is connected to the shutter opening / closing device 32. Shutter open / close switch 3
3 is for operating the shutter opening / closing device 32,
It is attached to the outer surface of the chamber 5.

On the other hand, on the side wall 5a, a shutter open / close sensor 34 which is located near the upper portion of the opening 8 and detects the open / close state of the shutter 31 is attached. As the shutter open / close sensor 34, a proximity sensor or the like is used.

The exposure apparatus 3 forms a mask (reticle) M by relatively scanning a mask M on which a pattern such as a liquid crystal display element shown in FIG. Glass substrate P
The substrate transfer apparatus 11 and the exposure apparatus main body 1 accommodated in the chamber 5 perform batch transfer onto the substrate.
2 and a transfer port 14.

The glass substrate P is transported between the coater 2 and the exposure device 3 by the shutter 31, the shutter opening / closing device 32, the substrate transport device 11, the load arm 10, and the openings 8, K. A substrate transfer system has been constructed. The direction of the optical axis of the projection optical system 22 is Z
The scanning direction in which the mask M and the glass substrate P are relatively scanned with respect to the projection optical system 22 in a plane orthogonal to the Z axis is the Y axis direction, and the non-scanning direction orthogonal to the Y axis direction is X
Description will be given as an axial direction.

The transfer port 14 is provided between the glass substrate P coated with the photosensitive agent by the coater main body 9 and the exposure apparatus main body 12.
The glass substrate P that has been subjected to the exposure processing is delivered and has four rectangularly arranged support shafts 13 that suck and support the glass substrate P from below. The support shaft 13 is arranged at a position that does not interfere with the load arm 10 and the substrate transfer device 11 even when the load arm 10 and the substrate transfer device 11 move toward the transfer port 14. The glass substrate P supported by the support shaft 13 at the transfer port 14 is adjusted to a predetermined temperature.

The substrate transport device 11 transports the glass substrate P to and from the delivery port 14 by moving along the XY plane while holding the glass substrate P by suction and moving up and down along the Z direction. , Exposure apparatus body 12
And the glass substrate P is transported between them.

The exposure apparatus main body 12 mainly includes an illumination optical system 20, a mask stage 21, a projection optical system 22, and a substrate stage 23. The illumination optical system 20
The light source unit includes a light source unit, a shutter, a secondary light source forming optical system, a beam splitter, a condenser lens system, a field stop, and an imaging lens system (all not shown). Alternatively, an illumination area having an arc shape is illuminated with uniform illuminance.

The mask stage 21 is driven in a Y-axis direction (a direction perpendicular to the plane of FIG. 3) by a mask driving mechanism 24 composed of a linear motor or the like. Further, the mask stage 21 is configured to be finely driven in the XY plane by a driving device such as a motor (not shown). A mask M is fixed to the mask stage 21 by vacuum suction or the like. The position of the mask stage 21 in the XY plane is measured at a predetermined resolution, for example, about 0.5 to 1 nm by a mask laser interferometer system 25 which is a position detecting device.

As the projection optical system 22, a plurality (five in FIG. 3) of projection optical system units PL1 to PL5 for projecting an erect erect image at the same magnification are arranged in a staggered manner. The details of the projection optical system using such a plurality of sets of the same-size erect projection optical system unit are known, and therefore detailed description is omitted here. Therefore, when the illumination area on the mask M is illuminated by the exposure illumination light from the illumination optical system 20, a 1: 1 image of the circuit pattern in the illumination area portion of the mask M is conjugated to the illumination area on the glass substrate P. Projected on an appropriate exposure area.

The substrate stage 23 is disposed below the projection optical system 22, and is moved on the stage base 26 in the Y-axis direction (or X-axis direction) by a substrate drive mechanism 27 including a linear motor or the like.
(Y two-dimensional direction). On the upper surface of the substrate stage 23, a glass substrate P is suction-held via a substrate holder 28. The position of the substrate stage 23 in the XY plane is measured by a substrate laser interferometer system 30 as a position detecting device via a movable mirror 29 at a predetermined resolution, for example, a resolution of about 0.5 to 1 nm. Has become.

In the vicinity of the transfer port 14 of the chamber 4, an opening 36 for entering and exiting the chamber 4 is formed so as to open to the outside. The opening 36 is provided with a door 37 that opens and closes the opening 36. The door 37 is provided with a door open / close sensor 38 such as a proximity sensor for detecting the open / close state of the door 37.

The operation of the storage apparatus and the substrate processing apparatus having the above configurations will be described below. First, a series of processing operations on the glass substrate P by the lithography system 1 will be described.

The glass substrate P, the surface of which has been coated with a photosensitive agent by the coater body 9 of the coater 2, is sucked and held on the lower surface side by the load arm 10 and is conveyed to a position facing the opening 8 as shown in FIG. Is done. In synchronization with this operation, the shutter 31 is lowered by driving the shutter opening / closing device 32 to open the openings 8 and K. Here, when the shutter open / close sensor 34 detects that the shutter 31 is opened, the load arm 10 enters the chamber 4 through the openings 8 and K while holding the glass substrate P. At this time, the glass substrate P passes through the substrate opening 8a at the opening 8, and the load arm 10 passes through the arm openings 8b, 8b.

When the glass substrate P reaches above the transfer port 14, the load arm 10 descends to bring the glass substrate P into contact with the support shaft 13, and
It drops again after releasing the adsorption to. Support shaft 1 at the same time
The glass substrate P is delivered by the suction of the glass substrate P by 3. After the load arm 10 descends by a predetermined amount,
It moves in the Y direction, retreats from inside the chamber 4, and returns into the chamber 5 through the openings K and 8.

When the glass substrate P is delivered, the load arm 10 remains in the opening 8, but the arm opening 8
Since b and 8b are formed in the vertical direction corresponding to the elevation of the load arm 10, the elevation of the load arm 10 can be performed without any trouble.

When the glass substrate P is set in the transfer port 14, the substrate transfer device 11 descends to a position where it does not contact the glass substrate P, and then moves toward the transfer port 14. Then, when reaching the position where the glass substrate P is to be held, the substrate transport device 11 rises and sucks the glass substrate P from the lower surface side. At the same time, the glass substrate P is transferred to the substrate transfer device 11 by the support shaft 13 releasing the suction to the glass substrate P.

When the glass substrate P and the support shaft 13 move up by a predetermined distance, the substrate transfer device 11 moves in the + X direction while holding the glass substrate P by suction. And
After rotating around the Z-axis to make the glass substrate P face the exposure apparatus main body 12, it moves in the + Y direction. When the glass substrate P reaches almost directly above the substrate stage 23, the substrate transfer device 11 descends and places the glass substrate P on the substrate holder 28. At this time, the adsorption to the glass substrate P is released. Thereafter, the substrate transfer device 11 moves in the −Y direction and retracts from the substrate stage 23.

When the glass substrate P is set on the substrate stage 23, the mask stage 21 and the substrate stage 23 are connected via the mask driving mechanism 24 and the substrate driving mechanism 27 while monitoring the measured values of the interferometer systems 25 and 30. Are moved synchronously to perform relative scanning with respect to the projection optical system 22 in the same direction at the same speed along the Y-axis direction. As a result, the circuit pattern of the entire pattern area on the mask M is transferred onto the glass substrate P having the surface coated with the photosensitive agent. Note that the glass substrate P after the exposure processing is carried out in a procedure reverse to the above.

Subsequently, maintenance and the board transfer device 11
A procedure for performing an operation in the chamber 4 based on the teaching or the like will be described. The maintenance is, for example, a correction operation when the glass substrate P is bent or the glass substrate P is displaced in the substrate transfer device 11, and the teaching operation is performed in advance of performing the exposure processing. This is an operation for storing coordinates such as a transfer position and a height of the glass substrate P in the substrate transfer device 11.

First, by operating the shutter opening / closing switch 33, the shutter 31 is opened via the shutter opening / closing device 32.
And the opening 8 is closed. When the shutter 31 closes the opening 8, the operator opens the door 37 and opens the opening 36.
From the chamber 4. Then, maintenance work or the like is performed on the substrate transfer device 11 by manual operation.
Here, the opening 8 is formed by a substrate opening 8a and an arm opening 8a.
Since the b has only the minimum required opening area, a part of the human body does not protrude into the chamber 5 through the opening 8, and the safety of the worker is ensured. Also,
Even if clothes and the like protrude from the chamber 5, the safety is ensured also in this case because the shutter 31 is provided.

Here, when the door 37 is opened, the door opening / closing sensor 38 detects the open state of the door 37.
Since the shutter 1 is closed and the door 37 is open, the exposure processing in the exposure apparatus main body 12 is stopped, but the photosensitive agent application processing in the coater main body 9 can be continued. In this case, since the glass substrate P is not transported from the coater 2 to the exposure device 3, the glass substrate P on which the photosensitive agent coating process has been completed is loaded by the load arm 10 into a buffer (not shown) provided in the coater 2. Is temporarily conveyed to and set aside.

During the maintenance work, the shutter 31 is opened due to an unexpected situation, and when the shutter opening / closing sensor 34 detects this, the photosensitive material application processing in the coater 2 and the driving of the load arm 10 are stopped. As a result, the interlock functions to ensure the safety of the worker.

When the maintenance work is completed and the worker exits the chamber 4 and closes the door 37, the door opening / closing sensor 38
Detects the closed state of the door 37. When the operator operates the shutter opening / closing switch 33, the shutter 31 is lowered via the shutter opening / closing device 32, and the opening 8 is opened. As a result, the normal transfer by the load arm 10 can be restarted while the exposure processing is started.

In the storage device and the substrate processing apparatus of the present embodiment, the opening 8 is formed by the glass substrate P and the load arm 1.
The openings 8a and 8b corresponding to the openings 0 and 8 have only a minimum necessary area. Therefore, even if an operator performs work near the opening 8 in the chamber 4, a part of the body is opened. 8 can be prevented from being protruded, and safety can be improved. In addition, when the work in the chamber 4 is performed with the shutter 31 closing the opening 8, the load arm 10 enters the chamber 4, and a part of the clothes of the worker projects into the chamber 5. Is also restricted, and the safety of workers can be more reliably ensured.

Therefore, in the storage apparatus and the substrate processing apparatus according to the present embodiment, even when the work is performed in the exposure apparatus 3, it is not necessary to turn off the power of the coater 2, so that the photosensitive agent application processing in the coater 2 can be performed. It is possible to continue, and the productivity can be improved. This is the same when the maintenance work or the like is performed by the coater 2. That is, in the present embodiment, even when the coater 2 and the exposure apparatus 3 are connected in-line, one of the apparatuses can safely perform a work such as a teaching operation.
Further, during this time, the substrate processing step in the other device can be continued, and the production efficiency can be greatly improved.

The opening K is set to the same size as the conventional one, and only the opening 8 has the substrate opening 8 a and the arm opening 8.
Since b is provided, the exposure apparatus 3 can be used regardless of the shape of the load arm 10, and the versatility is expanded.

In the above embodiment, the substrate opening 8 a and the arm opening 8 b are provided only in the opening 8 of the coater 2. However, the present invention is not limited to this, and only the opening K of the exposure apparatus 3 is provided. A configuration may be provided, or a configuration may be provided in both the openings 8 and K. Further, the opening 8 is formed directly on the side wall 5a. However, the present invention is not limited to this. For example, an opening similar to the opening K may be formed on the side wall 5a, and the substrate opening 8a and the arm may be formed. The panel having the opening 8b may be configured to be detachably attached to the side wall 5a such that the opening communicates with the openings 8a and 8b. In this case, by changing the panel, it is possible to easily cope with a change in the size of the load arm 10 and the glass substrate P, and it is possible to enhance versatility. Further, the opening 8 is set to be substantially the same size as the opening K, and the shutter 31 is made up of a plurality of shutter members, each of which can move two-dimensionally along the side wall 5a. Alternatively, the size of the opening may be changed by moving each component to form the substrate opening 8a and the arm opening 8b, or the opening may be closed to enhance safety.

Further, in the above embodiment, the substrate opening 8a is formed to extend in the horizontal direction. However, when the glass substrate P is large and thin, a very large deflection occurs, as shown in FIG. Thus, it is desirable to form the substrate opening 8a so as to correspond to the bent shape of the glass substrate P. Also in this case, the board opening 8a can be suppressed to the minimum necessary opening area, and the safety of the worker can be secured.

FIGS. 5 to 10 are views showing a storage apparatus and a substrate processing apparatus according to a second embodiment of the present invention.
In these drawings, the same elements as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted. The second embodiment is different from the first embodiment in that the configuration of the opening 8, the supporting method for transporting the glass substrate P, the coater main body 9 and the exposure apparatus main body associated therewith Twelve configurations.

As shown in FIGS. 5 and 6, the chamber 4
A side wall 4a is provided with a protrusion 4b protruding inward. A projection 5b projecting inward is provided on the side wall 5a of the chamber 5 at a position substantially opposed to the projection 4b. An opening K is formed in the protrusion 4b so as to penetrate the protrusion 4b. Similarly, the protrusion 5b has
An opening 8 penetrating through the protrusion 5b and communicating with the opening K is formed. As shown in FIG. 7, each opening K, 8
Is formed in a rectangular shape having the same size as the conventional one.

As shown in FIG. 8, the glass substrate P
May be transported while being supported by a substrate support tray (substrate support device) 39 provided in the load arm 10. The substrate support tray 39 includes a rectangular outer frame 40 that is slightly larger than the glass substrate P, and a plurality of linear members 41 stretched in a lattice at predetermined intervals inside the outer frame 40. . On both sides of the outer frame 40, two flange portions 45 held by the load arm 10 are extended outward in total, four on one side. A rectangular through-hole 42 is provided in each lattice formed by the plurality of linear members 41.
Are formed. These plural linear members 41
Are welded to each other or combined in a lattice, and are fixed to the outer frame 40 by welding.

FIG. 9 shows a part of the substrate supporting tray 39 in an enlarged manner. As shown in this figure, near each end of each linear member 41 on the side of the outer frame 40, a step 43 is formed to engage with the outer peripheral portion of the glass substrate P, which is slightly smaller than the outer frame 40. Step 4 formed on member 41
The positioning part 3 positions the glass substrate P at a predetermined position. In the present embodiment, the outer frame 4
0 and a portion 41b outside (i.e., one step higher than) the step portion 43 of each linear member 41 forms an outer peripheral portion 44, and a portion 41 inside the step portion 43 of each linear member 41.
a constitutes a supporting portion. In the following description, 41a is used as a reference for this support portion for convenience.

Each linear member 4 constituting the supporting portion 41a
The shape, dimensions, etc. of the section 1 are not particularly limited. For example, the section may have any shape such as a circle, a rectangle, and an elongated rectangle. In addition, the support portion 41a may be formed by arranging the plurality of linear members 41 in a lattice shape as described above and connecting them by welding or bonding to form a lattice surface, but is not limited thereto. It may be formed in a lattice shape by molding. The spacing between the lattices is determined according to the size and thickness of the glass substrate P so that the glass substrate P does not bend and break. As described above, since the substrate support tray 39 is formed by a combination (including integral molding) of the outer frame 40 and the linear member 41, by using a metal such as iron having high rigidity as a material thereof, it is possible to reduce the weight and height. Rigidity can be achieved, and quick conveyance becomes possible.

The structure of the substrate support tray 39 is not limited to the above structure. For example, the support portion may be formed of only a plurality of linear members arranged at a predetermined interval in the same direction. The outer peripheral portion may be formed by a single rectangular frame-shaped member in which the center of a rectangular plate-shaped member penetrates in a rectangular shape, or a single plate in which the inside is penetrated to form a through hole in some places. You may comprise. In short, it suffices that an outer peripheral portion and a support portion provided integrally inside the outer peripheral portion are provided, and a plurality of through holes are formed in the support portion. Also,
A stopper protruding upward at a position corresponding to three to four appropriately selected positions (a position facing at least three of the four sides of the glass substrate P) of the step portion 43 in FIG. 9, for example, The positioning portion may be constituted by the positioning pin.

The transfer of the glass substrate P to the substrate support tray 39 is performed by a substrate transfer device (not shown). For example, the substrate transfer device includes a vertically movable support bar, and once supports the glass substrate P above the substrate support tray 39, and moves down to transfer the glass substrate P to the substrate support tray 39. Is fine. The operation by this apparatus may be performed safely so that the glass substrate P is not bent by a large number of support rods in a place having a large space.

Returning to FIG. 8, the base 46 is
A substrate holder (holding unit) 47 for holding the glass substrate P via the substrate support tray 39 is provided thereon. On the upper surface of the substrate holder 47, a lattice-like groove 47a having a depth such that the support part 41a is embedded is formed corresponding to the lattice-like support part 41a. The upper surface of the substrate holder 47 is finished with good flatness so as to remove the deflection of the glass substrate P when the glass substrate P is placed. In addition, on the upper surface of the substrate holder 47, suction holes for bringing the glass substrate P into close contact with the glass substrate P are provided in correspondence with the plurality of openings 42. Further, a suction hole for adsorbing and fixing the lower surface of the outer frame 40 of the substrate support tray 39 is provided in a peripheral portion of the substrate holder 14. Each intake hole is connected to a vacuum pump via a pipe (both not shown).

On the other hand, although not shown, the substrate holder 28 provided on the substrate stage 23 of the exposure apparatus main body 12 also has a lattice-like groove similarly to the substrate holder 47 of the coater main body 9.

The operation of transporting the glass substrate P by the load arm 10 having the above configuration will be described. First, the operation of transporting the glass substrate P to the substrate holder 47 of the coater main body 9 will be described.

By driving the load arm 10, the glass substrate P is moved above the substrate holder 47 integrally with the substrate support tray 39. At this time, each linear member 41 constituting the lattice of the support portion 41a and the groove 47a on the substrate holder 47
And adjust the position of the load arm 10 so that the load arm 10 and the load arm 10 face each other.

Next, the load arm 10 is lowered by a predetermined amount. As a result, each linear member 41 forming the lattice of the support portion 41a fits into the groove 47a of the substrate holder 47, and
1a is lowered below the upper surface of the substrate holder 47, and only the glass substrate P comes into contact with the upper surface of the substrate holder 47. At this point, the vacuum suction by the vacuum pump is started, and the lower surface of the glass substrate P is placed on the substrate holder 47 through the respective suction holes formed in the substrate holder 14 corresponding to the plurality of through holes 42.
Is adsorbed and fixed. At this time, the substrate support tray 3
A part of the outer frame 40 is also attracted and fixed to the substrate holder 47.

When the transfer of the glass substrate P to the substrate holder 47 is completed, the load arm 10 is moved in the + Y direction and retracted from the substrate holder 47 as shown in FIG. Thus, the transfer of the glass substrate P to the substrate holder 47 is completed.

Subsequently, the glass substrate P is transferred from the substrate holder 47 of the coater main body 9 onto the substrate holder 28 of the exposure apparatus main body 12.
Will be described. When the resist coating process on the glass substrate P is completed, the load arm 10 is
From the position indicated by 0, the load arm 10 is inserted from the + Y direction side to both sides in the X direction of the substrate holder 47 below the substrate support tray 39 placed on the substrate holder 47. At the same time, the vacuum suction by the vacuum pump is released, and the suction of the glass substrate P by the substrate holder 47 is released.

Next, the load arm 10 is moved upward by a predetermined amount (+
(In the Z direction), the load arm 10 comes into contact with the flange 45 of the substrate support tray 39, and when further moved upward, the substrate support tray 39 supporting the glass substrate P via the flange 45 is moved to the position of the substrate holder 47. Lifted up,
The fitting (or engagement) between the support portion 41a and the groove 47a is released.

When the substrate support tray 39 is lifted to a position where the release of the engagement between the support portion 41a and the groove portion 47a is completed, the load arm 10 is moved in the + Y direction, and the substrate support tray 39 holding the glass substrate P is moved. To the substrate holder 4
7 Evacuate from above. Then, the load arm 10 is rotated around the Z axis, and is moved up and down in the Z direction so that the substrate support tray 39 faces the opening 8. In synchronization with this operation, the shutter 31 is driven by the drive of the shutter opening / closing device 32.
Descends to open the openings 8, K. Here, when the shutter opening / closing sensor 34 detects that the shutter 31 has been opened, the load arm 10 holds the glass substrate P via the substrate support tray 39 and the opening portions 8, K as shown in FIG. And enters the chamber 4 via.

The load arm 10 has a substrate support tray 39.
Descends when it reaches above the transfer port 14, and places the glass substrate P on the support shaft 13 together with the substrate support tray 39. At this time, the support shaft 13 is
Is disposed so as to support the outer frame 40 from below. At the time of this transfer, the glass substrate P is delivered by the support shaft 13 adsorbing the glass substrate P. Road arm 10
Moves in the −Y direction after descending by a predetermined amount, retreats from the inside of the chamber 4, and returns to the inside of the chamber 5 through the openings K and 8.

When the glass substrate P is set in the transfer port 14, the substrate transfer device 11 descends to a position where the glass substrate P does not contact the glass substrate P, and then moves toward the transfer port 14. Then, when reaching the position where the glass substrate P is to be held, the substrate transfer device 11 rises and sucks the flange 45 of the substrate support tray 39 from the lower surface side. at the same time,
The substrate support tray 39 is delivered to the substrate transfer device 11 when the support shaft 13 releases the suction on the glass substrate P.

Thereafter, the substrate transfer apparatus 11 places the glass substrate P on the substrate holder 28 of the exposure apparatus main body 12 via the substrate support tray 39, as in the first embodiment. Again, the substrate holder 47 in the coater body 9
Similarly, by fitting each linear member 41 constituting the support portion 41a of the substrate support tray 39 into a groove (not shown) of the substrate holder 28, the lower surface of the glass substrate P is suction-fixed to the substrate holder 28. Thus, the glass substrate P is
From the substrate holder 47 to the substrate holder 2 of the exposure apparatus body 12.
8.

In the storage device of the present embodiment, the opening 8,
Since K is formed so as to penetrate the protrusions 4b and 5b provided in the chambers 4 and 5, the lengths of the openings 8 and K are increased, and the opening areas of the openings 8 and K are the same as in the conventional case. Even if it is relatively large, it is possible to prevent a part of the body from protruding from the opening 8 even if the worker works near the opening 8 in the chamber 4, thereby improving the safety of the worker. Can be. Further, by performing the operation in the chamber 4 with the shutter 31 closing the opening 8,
The load arm 10 is prevented from entering the chamber 4 and a part of the clothes of the worker is also prevented from protruding into the chamber 5, so that the safety of the worker can be ensured more reliably.

Further, in the substrate processing apparatus of the present embodiment,
Since the load arm 10 is provided with the substrate support tray 39, the surface of the glass substrate P is received not by dots but by lines, so that almost the entire surface of the glass substrate P can be held evenly. Even if the size of the substrate P is increased, it is possible to effectively prevent the glass substrate P from bending during transportation. Therefore, the opening area of the openings 8 and K can be reduced to the minimum necessary, and the safety of the worker can be more reliably secured. In addition, since the glass substrate P does not bend when the glass substrate P is replaced, it is possible to effectively prevent partial abrasion of the upper surfaces of the substrate holders 47 and 28, thereby making the upper surfaces of the substrate holders 47 and 28 flat. It is possible to maintain it frequently. Furthermore, since a large number of suction holes can be provided substantially uniformly on the upper surface of the substrate holder 47 at positions corresponding to the through-holes 42 of the substrate support tray 39, the glass substrate P is suctioned uniformly over substantially the entire surface. It is also possible to improve the flatness of the glass substrate P. Further, since a method of integrally transporting the glass substrate P and the substrate support tray 39 is adopted, it is possible to transport a plurality of glass substrates P at the same time.

In the above-described embodiment, the opening areas of the openings 8 and K are made to have the same size as the conventional one. However, the projections 4b and 5b are formed on the glass substrate similarly to the first embodiment. An opening 8 having a substrate opening 8a corresponding to P, and an arm opening 8b corresponding to the load arm 10,
A configuration for forming K may be used.

In the above embodiment, the opening for the substrate,
The opening having the arm opening or the opening penetrating through the projection is used as the opening when the glass substrate P is transferred between the coater 2 and the exposure apparatus 3. The present invention is also applicable to a case in which an opening is provided in a partition provided between them, and a case in which an opening is provided in a partition provided between the coater main body 9 and the load arm 10. In this case, in the exposure apparatus 3, a position sensor for detecting a loading (transport) position of the glass substrate P is provided on the substrate stage 23 of the exposure apparatus main body 12, and a shutter for opening and closing an opening in the partition and an open state of the shutter are provided. An opening sensor for detecting the position is provided, and the shutter is opened in synchronization with the detection result of the position sensor.
On the side, when accessing the substrate stage 23, an AND operation is performed on the detection results of the position sensor and the open sensor. This makes it possible to ensure the safety of the worker when performing work using the exposure apparatus main body 12. Similarly, also in the coater 2, a position sensor for detecting the loading position of the glass substrate P is provided on the substrate holder 47 of the coater body 9, a shutter for opening and closing the opening in the partition, and an open sensor for detecting the open state of the shutter. So that the shutter is opened in synchronization with the detection result of the position sensor, and the load arm 10 side performs an AND operation on the detection results of the position sensor and the open sensor when accessing the substrate holder 47. . Thereby, the safety of the worker when working with the coater body 9 can be ensured.

In the above embodiment, the shutter 31
Is provided in the chamber 5, but a configuration provided in the chamber 4, a configuration provided in both chambers, or a configuration provided in a gap between the chambers 4 and 5 may be employed.

In the above embodiment, the linear members 41 of the substrate support tray 39 are formed in a lattice shape. However, the present invention is not limited to this. For example, a honeycomb having a hexagonal through hole is formed. Shape. In this case, the grooves formed on the upper surfaces of the substrate holder 47 and the substrate holder 28 may have a honeycomb shape.

The storage device is not limited to the one that stores the exposure device main body 12 and the coater main body 9, but also includes an inspection device that inspects the glass substrate P for the presence or absence of foreign matter and an exposed pattern, and a device transferred to the glass substrate P. A peripheral exposure device for exposing the peripheral portion of the pattern to remove the resist in the developing process, or a device for storing a titler for forming a title of the processing process or the like on the glass substrate P by the exposure process may be used. Similarly, the substrate processing apparatus is not limited to the exposure apparatus 3 or the coater 2, but is also a peripheral exposure apparatus or a titler, and a developer (developing apparatus) that performs development processing on a glass substrate P on which a resist is applied and subjected to exposure processing. Or a coater / developer in which a coater and a developer are integrally formed.

As the substrate, in addition to the glass substrate P for the liquid crystal display panel, a semiconductor wafer for a semiconductor device, a ceramic wafer for a thin-film magnetic head, or a mask or reticle used in an exposure apparatus (synthetic quartz) , Silicon wafer) and the like.

The exposure apparatus 3 includes a step-and-scan type scanning exposure apparatus (scanning stepper; US Pat. No. 5,473,410) for exposing the pattern of the mask M by synchronously moving the mask M and the glass substrate P. In addition, the present invention can also be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is exposed while the mask M and the glass substrate P are stationary and the glass substrate P is sequentially moved stepwise. .

The type of the exposure apparatus 3 is a glass substrate P
The present invention can be widely applied not only to a liquid crystal exposure apparatus for exposing a liquid crystal display element pattern, but also to an exposure apparatus for manufacturing a semiconductor, a thin film magnetic head, an imaging device (CCD), a reticle, and the like. .

As a light source of the illumination optical system 20, a bright line (g-line (436 nm) generated from an ultra-high pressure mercury lamp,
h-line (404.nm), i-line (365nm)), KrF
Not only an excimer laser (248 nm), an ArF excimer laser (193 nm), and an F ₂ laser (157 nm) but also a charged particle beam such as an X-ray or an electron beam can be used. For example, when an electron beam is used, a thermionic emission type lanthanum hexaborite (LaB ₆ ) or tantalum (Ta) can be used as an electron gun. Alternatively, a high frequency such as a YAG laser or a semiconductor laser may be used.

The magnification of the projection optical system 22 may be not only the same magnification but also a reduction system and an enlargement system. Further, as the projection optical system 22, when a far ultraviolet ray such as an excimer laser is used, a material that transmits the far ultraviolet ray such as quartz or fluorite is used as a glass material, and when an F ₂ laser or X-ray is used, a catadioptric system or An optical system of a refraction system (a reflective type mask is used for the mask M). When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It is needless to say that the optical path through which the electron beam passes is in a vacuum state. Further, the projection optical system 22
However, the present invention can also be applied to a primi-similarity exposure apparatus that exposes the pattern of the mask M by bringing the mask M and the glass substrate P into close contact with each other.

A linear motor (see US Pat. No. 5,623,853 or US Pat. No. 5,528,118) is mounted on the substrate stage 23 and the mask stage 21.
Is used, any of an air levitation type using an air bearing and a magnetic levitation type using Lorentz force or reactance force may be used. In addition, each stage 21,
23 may be a type that moves along a guide or a guideless type that does not have a guide.

Driving mechanisms 24 and 27 for the stages 21 and 23
Alternatively, a planar motor that drives a stage by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil opposed to each other may be used. In this case, one of the magnet unit and the armature unit may be connected to the stage, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stage.

The reaction force generated by the movement of the substrate stage 23 is disclosed in JP-A-8-166475 (US Pat. No. 5,528,118).
As described in the above, a frame member may be used to mechanically escape to the floor (ground). The reaction force generated by the movement of the mask stage 21 is, as described in JP-A-8-330224 (US S / N 08 / 416,558),
The frame member may be mechanically released to the floor (ground).

The illumination optical system 20 and the projection optical system 22 each composed of a plurality of optical elements
And a mask stage 21 and a substrate stage 23 composed of a number of mechanical parts are attached to the exposure apparatus main body 12 to connect wirings and pipes, and to perform overall adjustment (electrical adjustment, operation confirmation, etc.). By doing so, exposure apparatus 3 of the present embodiment can be manufactured.
It is desirable that the manufacture of the exposure apparatus 3 be performed in a clean room in which temperature, cleanliness, and the like are controlled.

For a device such as a liquid crystal display element or a semiconductor device, a step of designing the function and performance of each device, a step of manufacturing a mask M based on the design step, a step of manufacturing a glass substrate P, a wafer, etc. The device is manufactured through the steps of exposing the pattern of the mask M to the glass substrate P and the wafer, assembling each device, and inspecting the same by the exposure apparatus 3 of the embodiment.

[0084]

As described above, in the storage device according to the first aspect, the opening portion is formed continuously with the first opening portion corresponding to the shape of the substrate and the first opening portion, and corresponds to the transfer device. And a second opening. This allows
In this storage device, since the opening has only the minimum necessary area, a part of the body of the worker is prevented from protruding into the inside from the opening, and the safety of the worker is ensured. Can be. Therefore, even when the work is performed outside the vicinity of the opening, the transfer of the substrate can be continued by the transfer device, and the effect of improving productivity can be obtained.

The storage device according to the second aspect is configured such that the first opening is formed corresponding to the bent shape of the substrate. Thereby, in this storage device, even when a very large deflection occurs due to the large and thin substrate, the opening can be suppressed to the minimum necessary opening area, and the safety of the worker can be further secured. Becomes possible.

The storage device according to claim 3 is configured such that the storage device stores a processing device for performing a predetermined process on a substrate. Thus, in this storage device, even when performing work outside the vicinity of the opening, the transfer of the substrate by the transfer device and the processing of the substrate by the processing device can be continued, and the productivity can be improved. The effect is obtained.

The storage device according to claim 4 has a configuration in which the opening is formed to penetrate the projection. This allows
With this storage device, even when the length of the opening is large and the opening area of the opening is relatively large, it is possible to prevent a part of the worker's body from protruding from the opening, and to ensure the safety of the worker. Can be improved.

According to the storage device of the fifth aspect, the shielding member shields at least a part of the opening. Thereby, in this storage device, the transport device is also prevented from protruding from the opening, and a part of the clothes of the worker is also prevented from protruding into the storage device, so that the effect that the safety of the worker can be more reliably ensured. can get.

The substrate processing apparatus according to claim 6 is configured such that the transfer device includes an outer frame, a support portion for supporting the substrate, and a substrate support device having a plurality of through holes formed in the support portion. Thus, in this substrate processing apparatus, it is possible to effectively prevent the substrate from being bent during transport even if the substrate is enlarged. In addition, since a large number of suction holes can be provided substantially uniformly in the substrate holder, the substrate can be suctioned uniformly over substantially the entire surface, and the effect of improving the flatness of the substrate can be obtained. .

In the substrate processing apparatus according to the present invention, at least one of the coating apparatus and the developing apparatus has a holding portion for holding the substrate supporting apparatus. Thereby, in this substrate processing apparatus, a coating process of the photosensitive agent on the substrate,
When performing at least one of the development processing of the exposed substrate, since the substrate supporting device that supports the substrate flat is held by the holding unit, it is possible to effectively prevent partial wear on the upper surface of the holding unit. In addition, it is possible to maintain the upper surface of the holding portion with good flatness and long.

The substrate processing apparatus according to claim 8 has an opening corresponding to the shape of the substrate support apparatus, and is provided with a storage device for storing the substrate processing apparatus. Accordingly, in this substrate processing apparatus, since the opening has only the minimum required area, a part of the body of the worker is prevented from protruding from the opening to the inside of the storage device, and the worker's body can be prevented. Safety can be reliably ensured. In addition, the substrate processing can be continued even when the work is performed outside the vicinity of the opening, and the effect that the productivity can be improved can be obtained.

The substrate processing apparatus according to the ninth aspect is configured such that the transport apparatus transports the substrate to a second substrate processing apparatus connected in-line through the opening. This allows
In this substrate processing apparatus, even when the worker performs work in the second substrate processing apparatus, a part of the body of the worker is prevented from protruding from the opening to the inside of the storage device, and the safety of the worker is improved. The effect of being able to reliably ensure is obtained.

[Brief description of the drawings]

FIG. 1 is a view showing a first embodiment of the present invention, and is a front view of an opening having a substrate opening and an arm opening.

FIG. 2 is a diagram showing the first embodiment of the present invention, and is a cross-sectional plan view of a lithography system in which a coater and an exposure apparatus are connected in-line via an opening.

FIG. 3 is a sectional front view in FIG. 2;

FIG. 4 is a front view showing another form of the opening constituting the storage device of the present invention.

FIG. 5 is a view showing a second embodiment of the present invention, and is a cross-sectional plan view of a lithography system in which a coater and an exposure apparatus are connected in-line via an opening.

FIG. 6 is a sectional front view in FIG.

FIG. 7 is a front view in which an opening constituting the storage device of the present invention is formed in a protrusion.

FIG. 8 is a view showing a second embodiment of the present invention, and is an external perspective view in which a glass substrate is held on a load arm via a substrate support tray.

FIG. 9 is a detailed view of a main part of the substrate support tray.

FIG. 10 is an external perspective view of the glass substrate placed on a substrate holder together with a substrate support tray.

FIG. 11 is a front view showing an example of an opening according to the related art.

[Explanation of symbols]

 P Glass substrate (substrate) 2 Coater (coating device) 3 Exposure device (second substrate processing device) 4b, 5b Projection 5 Chamber (storage device) 8 Opening 8a Opening for substrate (first opening) 8b For arm Opening (second opening) 9 Coater body (processing device) 10 Load arm (transfer device) 31 Shutter (shielding member) 39 Substrate support tray (substrate support device) 42 Through hole 41a Support portion 44 Outer peripheral portion 47 Substrate holder (holding) Part)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroyuki Akiyama 3-2-3 Marunouchi, Chiyoda-ku, Tokyo F-term in Nikon Corporation (reference) 5F031 CA05 FA02 FA11 FA12 FA15 GA43 GA47 GA49 KA06 LA07 MA26 MA27 NA02 NA08 NA09 PA18 5F046 AA21 BA03 CB20 CB25 CC01 CC02 CC16 CC18 CD01 CD05 CD06 JA22

Claims (9)

[Claims] 1. A storage device having an opening and housing a transfer device for transferring a substrate, wherein the opening is a first opening corresponding to a shape of the substrate, and continuous with the first opening. And a second opening corresponding to the transfer device. 2. The storage device according to claim 1, wherein the first opening is formed corresponding to a bent shape of the substrate. 3. The storage device according to claim 1, wherein the storage device stores a processing device that performs a predetermined process on the substrate. 4. The storage device according to claim 1, wherein the storage device has a projection, and the opening is formed through the projection. A storage device, characterized in that: 5. The storage device according to claim 1, further comprising a shielding member that shields at least a part of the opening. 6. A substrate processing apparatus comprising: a coating device for coating a substrate with a photosensitive agent; a developing device for developing the substrate coated with the photosensitive agent; and a transfer device for transferring the substrate. The transport device includes a substrate support device having an outer peripheral portion, a support portion integrally provided inside the outer peripheral portion and supporting the substrate, and a plurality of through holes formed in the support portion. A substrate processing apparatus. 7. The substrate processing apparatus according to claim 6, wherein at least one of the coating device and the developing device has a holding unit that holds the substrate support device. . 8. The substrate processing apparatus according to claim 6, further comprising a storage device that has an opening corresponding to the shape of the substrate support device and stores the substrate processing device. Processing equipment. 9. The substrate processing apparatus according to claim 8, wherein the transfer apparatus transfers the substrate to a second substrate processing apparatus connected in-line through the opening. .