TW201132570A - Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device - Google Patents

Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device Download PDF

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Publication number
TW201132570A
TW201132570A TW099136627A TW99136627A TW201132570A TW 201132570 A TW201132570 A TW 201132570A TW 099136627 A TW099136627 A TW 099136627A TW 99136627 A TW99136627 A TW 99136627A TW 201132570 A TW201132570 A TW 201132570A
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Taiwan
Prior art keywords
substrate
tray
vibration
unit
support
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TW099136627A
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Chinese (zh)
Inventor
Kunihiro Kawae
Takuya Yanagawa
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Disclosed is a substrate conveying apparatus (7) which conveys a substrate (P) together with a substrate supporting member (T), said substrate being mounted on the substrate supporting member. The substrate conveying apparatus (7) comprises: a vibration member (V) for vibrating the substrate supporting member on which the substrate is mounted; and a conveyance member (4) for holding and conveying the substrate supporting member.

Description

201132570 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板搬送裝置、曝光裝置、基板支 持裝置、及元件製造方法。 【先前技術】 在平板顯示器等之電子元件之製程中，係使用曝光裝 置或檢查裝置等大型基板之處理裝置。在使用此等處理裝 置之曝光步驟、檢查步驟，係使用將大型基板（例如玻璃 基板）搬送至處理裝置之下述專利文獻所竭示之搬送裝置。 專利文獻1 :日本特開2001 - ι〇0169號公報 【發明内容】 然而’在上述之大型基板之搬送裝置，在將搬出入部 所保持之基板交接至基板支持裝置時，基板與基板支持裝 置係分別受到支持。因此，依基板之支持方法會有使基板 因本身重量而向下方彎曲之情形。若將因本身重量而呈彎 曲狀態之基板交接至基板支持裝置，則基板之向下方彎曲 之部分會與基板支持裝置接觸，由於接觸部分之摩擦，在 基板支持裝置上基板會維持彎曲狀態。 例如在曝光裝置，若將呈如上述變形狀態之基板交接 至曝光用之基板保持具，則會產生無法在基板上之適當位 置進行既定曝光等之曝光不良之問題。又，在載置於基板 支持裝置之基板產生彎曲之情形為了解決上述情形而重 201132570 新進行交接，因此會產生基板之處理延遲之問題。 本發明之形態之目的在於提供一種可解決在基板交接 時產生之基板之彎曲之基板搬送裝置、曝光裝置、基板支 持裝置、及元件製造方法。 依本發明第1形態，提供一種基板搬送裝置，係將載 置於基板支持構件之基板與該基板支持構件一起搬送其 特徵在於具備：使載置有前述基板之前述基板支持構件振 動之加振部；保持前述加振部使振動之前述基板支持構件 並移動之搬送部。 依本發明第2形態，提供一種曝光裝置，對基板保持 〃保持之基板照射曝光用光而使前述基板曝光，其特徵在 於.具備對前述基板保持具搬送前述基板之上述之基板搬 送裝置。 依本發明第3形態，提供一種基板支持裝置，支持基 板，其特徵在於具有：載置前述基板之載置部；設於前述 載置邛且使前述載置部振動之振動產生部。 依本發明第4形態，提供一種元件製造方法，包含： 使用上述之曝光裝置使該基板曝光之動作；以及基於曝光 果處理曝光後之前述基板之動作。 根據本發明之形態，可解決在基板交接時產生之基板 之彎曲》 【實施方式】 參照圖式說明本發明之第丨實施形態。又，本發明並 4 201132570 不限於此。以下，針對具備本發明之基板搬送裝置、對塗 布有感光劑之基板進行使液晶顯示元件用圖案曝光之曝光 處理之曝光裝置進行說明，且針對本發明之基板支持裝 置、及元件製造方法之一實施形態亦進行說明。 圖1係顯示本實施形態之曝光裝置之概略構成的剖面 俯視圖。曝光裝置1具備使液晶顯示元件用圖案曝光於基 板之曝光裝置本體3、搬送機器手（搬送部）4、搬出入部 (出入口部）5、及具有不圖示之加振部之基板搬送裝置7, 該等係收納於被高度潔淨化、且調整至既定溫度之腔室2 内。關於基板搬送裝置7之加振部，往後使用圖面詳細說 明。本實施形態中，基板係大型玻璃板，其一邊之尺寸為 例如500mm以上。 圖2係曝光裝置本體3、及將基板p搬送至此曝光裝置 本體3之搬送機器手4的外觀立體圖。曝光裝置本體3具 備以曝光用光IL照明光罩Μ之未圖示之照明系統、保持形 成有液晶顯示元件用圖案之光罩Μ之未圖示之光罩載台、 配置於此光罩載台下方之投影光學系統pL、設成可在配置 於投影光學系統PL下方之基座8上二維移動之基板保持具 9、及保持基板保持具9且使該基板保持具9移動之移動機 構33。亦即，曝光裝置本體3，設有具備基板保持具9與 移動機構33之載台裝置。 此外，以下說明中，設基板保持具9相對基座8之二 維移動係在水平面内進行，在此水平面内彼此正交之方向 設定X軸及Y軸。基板保持具9對基板p之保持面，在基 201132570 準狀態（例如，進行基板p之交接時之狀態）下設與水平 面平行。X，在與x軸及γ軸正交之方向設定z軸投影 一、先PL之光軸设與Z軸平行。此外，將繞X軸、γ軸 及2轴之各方向分別稱為ΘΧ方向、ΘΥ方向及方向。 移動機構33具有移動機構本體35,及配置於移動機構 ΓΛΓ1、保持基板保持具9之板台34。移動機構本體 μ由氣體軸承以非接觸方式支持於導引面8a (基座8 =面）’可在導引面8&上移動於χγ方向。曝光裝置本 ’在保持基板Ρ之狀態下，於光射出側（投影光學系統 之像面側），可在導引面8a之既定區域内移動。 移動機構本體35係藉由包含例如線 粗動系統（移動機構）之作動，可在導引面8a上移動於灯 ::内。板台34係藉由包含例如音圈馬達等致動器之微動 系統之作動，可相對移動機構本體35在Z軸、口… =移動。板台34係藉由包含粗㈣統及微動系統之基板 載σ驅動系統之作動，在粗姓 在保持基板Ρ之狀態下，可在X軸、 轴、Ζ軸、"…、及以方向之六個方向移動。 搬送機器手4係用以對曝光裝置本體3及搬出入部5 搬送基板Ρ者。搬送機器手4保持支持載置之基板ρ之後 =盤（基板支持構件、基板支持裝置）Τ，使基板ρ與 托盤T 一起移動以搬送基板 部5交接基板P。 對曝Μ置本心及搬出入 曝光裝置！，在長方形基板？載置於上述基 上之狀態Τ，進行步進掃描方式之曝光，形W之圖 201132570 案依序轉印至基板P上之複數個、例如4個曝光區域（圖 案轉印區域）。亦即，在此曝光裝置卜進行下述掃描曝光， 亦即藉由來自照明系統之曝光用光IL照明光罩之狹縫 狀之明區域之狀態下’藉由未圖示之控制器透過未圖示 之驅動系統，使保持光罩M之光罩載台與保持基板p之基 板保持具9时移動於既定掃描方向（此處設$ γ轴方 向）’藉此將光罩Μ之圖案轉印至基板p上之⑽曝光區 域’亦即，進行掃晦曝光。此外，本實施形態之曝光裝置i 構成投影光學系統PL具有複數個投影光學模組、上述照明 系統包含與複數個投影光學模組對應之複數個照明模組之 所謂多透鏡型掃描曝光裝置。 在此1 _冑光區域之掃描曝光結束後，進行使基板保 持具9以既定量在χ方向移動至下一個曝光區域之掃描開 始位置之步進動作。接著，在曝光裝置本體3，藉由反覆進 行此種掃描曝光與步進動作，將光罩M之圖案依序轉印至 4個曝光區域。 如圖2所示，搬送機器手4係具有例如水平關節型構 造者，Μ由透過垂直關節轴連結之複數個部分構成之臂 部10、連結於此臂部1〇前端之搬送手12、及驅動裝置。 臂部可藉由驅動裝置13例如在上下方向（ζ轴方向）移 動驅動裝置1 3係藉由未圖示之控制裝置控制其驅動。 送手12别知部係設成開放之大致υ型之形狀，將 托盤Τ之長邊方向（基板Ρ之長邊方向）之兩側部18、18 支持於與托盤Τ之長邊平行之支持方向，藉此可透過托盤丁 7 201132570 保持基板p。此外，搬送手12具備對設於托Μ之不圖示 之振動致動器（振動產生部）供給電力之不圖示之供電邛。 關於振動㈣器及供電部’往後❹圖面詳細說明。° 圖3係用以說明搬送機器手4之動作的立體圖。如圖2 及圖3所示，搬送機器手4能以使搬送手12之長邊方向(基 板Ρ之長邊方向）朝向曝光裝置本體3之基板保持具9二 之方式改④搬送手12之方向。藉此，搬送機器手4將基板 Ρ交接至基板保持具9 » 此外’此搬送機器手4,在圖2及圖3為了方便起見並 未圖示，但係具備設於搬送手12下方、具有與此搬送手Μ 相同之機構且可獨立驅動之搬送手之雙料造。X，搬送 機器手4並不限於水平關節型構造之機器手，可適當採用 公知之機器手（一般而言為搬送機構）或組合來實現。 圖4係顯示搬出入部5之概略構成的側視圖。搬出入 部5被交接在與曝光裝4 i相鄰配置之塗布顯影機（未圖 示）塗布感光劑並搬送而來之基板Ρβ搬出入部5具備支持 基板Ρ之基板支持部51、及支持托盤τ之托盤支持部52。 基板支持部51具備平板狀之第丨支持部5U、及豎設於此 第1支持部51a上並分別支持基板ρ下面之不同部位之複 數個基板支持銷（支持銷）51b。本實施形態中，基板支持 銷5 1 b係設置例如3 0個。 各基板支持銷5 1 b係設成下端部固定於第1支持部 51a、上端部（上端面）可支持基板ρ。在基板支持銷5ib 之上端面設有連接於未圖示之真空泵之吸附孔，可吸附保 8 201132570 持基板p。又，在基板支持銷5丨b之上端部設有檢測基板p 是否載置於基板支持銷51b之未圖示之基板檢測部。 基板支持部51係透過連結構件53連接於驅動部54。 驅動部5 4例如藉由包含粗動系統及微動系統之驅動系統之 作動，在基座部55上可移動於χγ平面及ΘΖ方向❶藉此， 搬出入部5可進行支持於基板支持銷5ib之基板ρ之χ方 向及Y方向之位置修正、或使基板p在02方向旋轉9〇度。 托盤支持部52具備框狀之第2支持部52a、及豐設於 此第2支持部52a上並分別支持托盤τ下面之不同部位之 複數個托盤支持銷（第2支持銷）…。此外，托盤支持部 52八備對托盤τ具備之不圖示之振動致動器（振動產生部） ::電力之不圖不之供電部。關於振動致動器及供電部， 在後使用圖面詳細說明。 持冑52b係設成下端部固定於第2支持部 a、上端部可支持托盤T〇 if·般±4* μ 板支持部51 H支持，卩5 k b魏置在較基 之上端邱^女 支持°卩5U外側。又，在托盤支持銷52b 有檢測托盤τ是否載置於托 圖不之托盤檢測部。 心禾 托盤支持部52係 著導引部％移動於Ζ軸方I /…動部之作動可沿 部”之驅動部54及1=向。導引部56係設在基板支持 之第i支持部51、、 Ρ55之外側。又’基板支持部5! 之第2支持邱 連、’。構件53及驅動部54係配置於框狀 心乐2又持部52a之 L队 支持部5丨之第 ，托盤支持部52能與基板 持°卩5 1 a、連結構件53及驅動部54不 201132570 產生干涉地在z軸方向移動。 又，托盤支持部52，藉由往Z軸正方向上昇，能使支 持於托盤支持銷52b之托盤T往Z軸正方向上昇，使支持 於基板支持部51之基板支持銷5^上之基板p載置於托盤 τ。又，托盤支持部52,將藉由托盤支持銷52b支持之載置 有基板P之托盤T交接至搬送機器手4之搬送手12。 接著，詳細說明托盤τ之構造。圖5係顯示托盤τ之 平面構造的俯視圖。如圖5所示，托盤τ具備藉由在縱橫 以既定間隔交織之複數條線狀構件丨9形成格子狀之載置部 20。亦即，載置部20之未配置線狀構件19之部分成為矩 形之開口部21。托盤T在載置部20之兩側部18、18之間 之既定位置載置基板P，從下方支持基板又，托盤τ之 形狀並不限於圖5所示之形狀，為例如僅形成一個開口部 21之僅支持基板Ρ之周緣部之框狀之單一框架亦可。 基板Ρ係配置成長邊與載置部20之兩側部！ 8、丨8平 行。托盤T在於載置部20載置基板p之狀態下，兩側部i 8、 18被搬送機器手4之搬送手12從下方支持（參照圖2及圖 3)。亦即，本實施形態之搬送機器手4藉由保持托盤τ並 使移動，透過托盤T支持基板P且將基板p搬送至既定位 置。 托盤T，載置部20之下面係藉由圖4所示之搬出入部 5之托盤支持部52之複數個托盤支持銷52b支持。又，托 盤T ’如圖4所示，在藉由托盤支持銷52b支持載置部2〇 之下面之狀態下，使基板支持部5丨之複數個基板支持銷5 lb 10 201132570 插通於圖5所示之複數個開口部2!。 此外，作為托盤T之形成材料’較佳為使用在托盤τ 支持基板Ρ時可抑制基板Ρ之本身重量導致之彎曲之材 料，例如可使用各種合成樹脂或金屬。具體而言，可舉出 尼龍、聚丙烯、AS (丙烯腈-苯乙烯共聚物）樹脂、ABS (丙 烯腈-丁二烯_苯乙烯共聚物）樹脂、聚碳酸酯、纖維強化塑 膠、不鏽鋼等《作為纖維強化塑膠，可舉出GFRp( GUss Fiber Reinforced Plastic :玻璃纖維強化熱硬化性塑膠）或cFRp (Carbon Fiber Reinforced piastic :碳纖維強化熱硬化性塑 膠）。又，交織成格子狀之線狀構件19，係使用引線等柔 軟性優異之構件形成亦可。 此處’如圖2所示’在基板保持具9之上面形成有保 持托盤T之槽部3〇。槽部3〇係與托盤τ之框架構造對應設 成格子狀。又，藉由在基板保持具9之上面形成槽部3〇, 島狀設置複數個基板P之保持部（保持具部）31 ^保持部 31具有與托盤T之開口部21對應之尺寸。 ° 保持部31之上面係加工成基板保持具9對基板p之實 質保持面具有良好平面度。再者，在保持部31之上面設置 複數個用以使基板P仿效此面密合之吸引孔κ(參照圖j)。 各吸引孔K係連接於未圖示之真空泵。 、 圖6係顯示托盤T收容於基板保持具9之槽部之狀 態的部分侧剖面圖。如圖6所示，托盤丁之厚度小於槽部 3〇之深度。藉此’托盤T插入陷入槽部3〇内，成為心部 31從開口部21突出之狀態，僅載置於托盤τ上之基板p 201132570 交接至保持部3 1。 在托盤T之載置部20之下面側之四角形成圓錐狀之凹 部41，在槽部3〇内與各凹部41對應之位置設有卡合於凹 部41之球狀凸部42 ^托盤Τ’在載置部20插入至槽部3〇 時，藉由基板保持具9之凸部42卡合於載置部2〇之凹部 41内，可防止收容於槽部30之托盤Τ之位置偏移。 以下，針對本實施形態之基板搬送裝置7之加振部、 振動產生部及供電部，使用圖7及圖8詳細說明。 圖7係顯示本實施形態之搬送手12及拖盤τ之概略構 成之圖，（a )係對應於沿圖2之Α-Α’線之剖面之示意剖面 圖’ （b )係（a )之α部之擴大圖。圖8係說明本實施形雜 之托盤支持部52及拖盤Τ之概略構成之圖，係對應 於沿圖4之B-B ’線之剖面之示意剖面圖，（b )係（a )之 冷部之擴大圖。 如圖7(a)及7(b)所示’本實施形態之基板搬送裝 置7具備使拖盤T振動之加振部V。加振部v具有設於拖 盤T之振動致動器（振動產生部）va、設於拖盤τ之拖盤 側供電部（供電部）ET、設於搬送手12之手側供電部（供 電部）EH。此外，加振部v係如圖8 ( a )及8 ( b )所示， 具有設於搬出入部5之拖盤支持部52之支持部側供電部 (供電部）EP。 振動致動器VA係埋入構成載置部2〇之線狀構件〖9而 配置於載置部20之内部，對載置部2〇固定。做為振動致 動器VA，可使用例如藉由使偏心分銅旋轉來使振動產生之 12 201132570 振動馬達或具備對應於施加之電壓變形之壓電元件之超音 波馬達等。在本實施形態雖係針對具備複數振動致動器VA 之構成說明，但隨條件不同，振動致動器VA為丨個亦可。 另外，振動致動器VA只要是可固定於載置部2〇，使 載置部20以所欲之振動頻率振動者，並不限定於上述之振 動馬達或超音波馬達。此外，振動致動器VA並不一定要埋 入載置部20之内部，亦可固定於線狀構件19之下面或側 面。此外，振動致動器VA配置於載置部2〇之欲給予振動 之位置之附近更有效。 振動致動器VA係藉由對端子部VAT施加既定之電壓 來驅動，使拖盤T之載置部20以既定之振動頻率振動。在 此，振動致動器VA之振動之頻率係對應於載置部2〇之振 動之頻率設定。載置部20之振動之頻率係設定為載置於載 置部20之基板P之下面與載置部2〇之上面（基板支持面） 2〇a因振動之作用而產生滑動之高頻。 手側供電部EH係由設於搬送機器手4之電源部（圖示 略）、手側配線14、手側端子部15構成。手側配線14係 藉由一端側連接於手側端子部15而另一端側連接於搬送機 器手4之不圖示之電源部來將手側端子部〗5與電源部電氣 連接。 手側端子部15係對應於配置於拖盤τ之下面之拖盤側 端子部22露出形成於搬送手12之上面。手側端子部。係 於搬送手12對拖盤Τ定位而保持拖盤τ時與露出形成於拖 盤Τ之下面之拖盤側端子部22接觸來與拖盤側端子部 13 201132570 電氣連接。 此外’手側端子部〗5係設為可彈性變形，於搬送手j 2 保持拖盤T時’藉由與設於拖盤τ之拖盤側端子部22接觸 並往搬送手1 2側彈性變形而對拖盤側端子部22彈壓。藉 此，手側端子部1 5在按壓狀態下對拖盤側端子部22接觸， 確保與拖盤側端子部22之電氣連接。 拖盤側供電部ET係由設於拖盤τ之拖盤側配線23、 拖盤側端子部22構成。 拖盤側配線23係藉由一端側連接於振動致動器VA之 端子部VAT而$ -端側連接於拖盤側端子部22來將露出於 拖盤τ之下面之拖盤側端子部22與配置於載置部2〇内部 之振動致動器VA之端子部VAT電氣連接。 拖盤側端子部22係對應於配置於搬送手12之上面之 手側端子部露出形成於載置部2()之下面。拖盤側端子 部22係於搬送手12對拖盤τ定位而保持拖盤丁時與露出 形成於搬送手12之上面之手側端子部15接觸來與手側端 子部15電氣連接。 此外’拖盤側端子部22係設為可彈性變形，於搬送手 12保持拖盤τ時’藉由與設於搬送手12之手側端子部η 接觸並往拖盤τ側彈性變形而對手側端子部15彈壓。藉 此，拖盤側端子部22在按壓狀態下對手側端子部15接觸， 確保與手側端子部1 5之電氣連接。 藉由以上之構成’手側供電部Μ及拖盤側供電部ET 於手側端子部15與拖㈣料部22電氣連接時，可將連 201132570 接於手側配線14之另一端之不圖示之電源部所供給之電力 透過手側配線14及拖盤側配線23對做為振動產生部之振 動致動器VA供給。 此外，於搬送手12之上面設有支持拖盤τ之載置部20 之下面之複數抵接部16。抵接部16係配置於不與設於拖盤 T之振動致動器VA在俯視重疊之位置。換言之，振動致動 器VA係在拖盤τ對搬送手12定位保持之狀態下，於沿拖 盤T之方向配置於2個抵接部16與抵接部16之間。在此， 振動致動器VA係配置於於由抵接部1 6支持之拖盤τ之載 置部20振動時線狀構件丨9之振動之腹點之位置較理想。 如圖8 ( a)及8 ( b )所示，支持部側供電部Ep係由 設於搬出入部5之電源部（圖示略）、支持部側配線57、 支持部側端子部58構成。支持部側配線57係藉由一端側 連接於支持部側端子部58而另一端側連接於搬出入部5之 不圖示之電源部來將支持部側端子部58與電源部電氣連 支持部側端子部58係對應於配置於拖盤τ之下面之拖 盤側端子部22露出形成於托盤支持銷52b之上端部。支持 部側端子部58係於拖盤T對托盤支持銷52b定位保持時與 出形成於拖盤τ之下面之拖盤側端子部22接觸來與拖盤 側端子部22電氣連接。 此外，支持部側端子部58係設為可彈性變形，於托盤 支，銷52b支持拖盤τ時，藉由與設於拖盤τ之拖盤側端 子部22接觸並往拖盤支持部52侧彈性變形而對拖盤側端 15 201132570 子部22彈壓。藉此，支持部側端子部58在按壓狀態下對 拖盤側端子部22接觸，確保與拖盤側端子部22之電氣連 接。 ' 藉由以上之構成，支持部側供電部Ep於支持部侧端子 部58與拖盤側端子部22電氣連接時’可將連接於支持部 侧配線57之另一#之不圖示之電源部所供給之電力透過支 持部側配線57及拖盤側配線23對做為振動產生部之振動 致動器VA供給。 此外，於托盤支持銷52b之上面設有支持拖盤τ之載 置部20之下面之複數抵接部52c。㈣支持銷奶係配置 =與設於拖Μ T之振動致動胃VA在俯視重疊。亦即，振BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device, an exposure device, a substrate support device, and a device manufacturing method. [Prior Art] In the process of electronic components such as flat panel displays, a processing device for a large substrate such as an exposure device or an inspection device is used. In the exposure step and the inspection step using these processing apparatuses, a transfer apparatus exaggerated from the following patent documents for transporting a large substrate (for example, a glass substrate) to a processing apparatus is used. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001- PCT Publication No. 2001-A. [Invention] In the above-described large-sized substrate transfer apparatus, when the substrate held by the loading/unloading unit is transferred to the substrate supporting device, the substrate and the substrate supporting device are attached. Supported separately. Therefore, depending on the supporting method of the substrate, the substrate may be bent downward due to its own weight. When the substrate which is bent by its own weight is transferred to the substrate supporting device, the portion bent downward of the substrate comes into contact with the substrate supporting device, and the substrate is maintained in a curved state on the substrate supporting device due to the friction of the contact portion. For example, in the exposure apparatus, when the substrate in the deformed state is transferred to the substrate holder for exposure, there is a problem in that exposure failure such as predetermined exposure cannot be performed at an appropriate position on the substrate. Further, in the case where the substrate placed on the substrate supporting device is bent, in order to solve the above problem, the new 201132570 is handed over, which causes a problem of delay in processing of the substrate. It is an object of the present invention to provide a substrate transfer apparatus, an exposure apparatus, a substrate support apparatus, and a device manufacturing method which are capable of solving the bending of a substrate which is generated when a substrate is transferred. According to a first aspect of the present invention, a substrate transfer apparatus is provided, wherein a substrate placed on a substrate supporting member is transported together with the substrate supporting member, and the substrate supporting member is vibrated by vibration of the substrate supporting member on which the substrate is placed. a portion that holds the substrate supporting member that vibrates and moves the vibrating portion. According to a second aspect of the present invention, there is provided an exposure apparatus comprising: exposing the substrate to a substrate held by the substrate and exposing the substrate, wherein the substrate is provided with the substrate transfer device that transports the substrate to the substrate holder. According to a third aspect of the present invention, there is provided a substrate supporting device, comprising: a mounting portion on which the substrate is placed; and a vibration generating portion that is placed on the cymbal and vibrates the mounting portion. According to a fourth aspect of the present invention, there is provided a method of manufacturing a device comprising: an operation of exposing the substrate by using the exposure device; and an operation of the substrate after the exposure is processed based on the exposure. According to the aspect of the present invention, the bending of the substrate generated at the time of substrate transfer can be solved. [Embodiment] A third embodiment of the present invention will be described with reference to the drawings. Further, the present invention 4 201132570 is not limited thereto. In the following, an exposure apparatus including the substrate transfer apparatus of the present invention and an exposure process for exposing a liquid crystal display element pattern to a substrate on which a photosensitive agent is applied will be described, and the substrate support device and the element manufacturing method of the present invention are described. The embodiment will also be described. Fig. 1 is a cross-sectional plan view showing a schematic configuration of an exposure apparatus of the embodiment. The exposure apparatus 1 includes an exposure apparatus main body 3 that exposes a liquid crystal display element pattern to a substrate, a transport robot hand (transport unit) 4, a carry-in/out unit (port-out unit) 5, and a substrate transport apparatus 7 having a vibrating unit (not shown). These are housed in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature. The oscillating portion of the substrate transfer device 7 will be described in detail later using the drawings. In the present embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more. Fig. 2 is an external perspective view of the exposure apparatus main body 3 and the transport robot 4 that transports the substrate p to the exposure apparatus main body 3. The exposure apparatus main body 3 is provided with an illumination system (not shown) that illuminates the mask 以 by the exposure light IL, and a mask holder (not shown) that holds the mask for forming the liquid crystal display element pattern, and is disposed on the reticle. The projection optical system pL under the stage is provided as a substrate holder 9 that can be moved two-dimensionally on the susceptor 8 disposed under the projection optical system PL, and a moving mechanism that holds the substrate holder 9 and moves the substrate holder 9 33. That is, the exposure apparatus main body 3 is provided with a stage device including the substrate holder 9 and the moving mechanism 33. Further, in the following description, the two-dimensional movement of the substrate holder 9 with respect to the susceptor 8 is performed in a horizontal plane, and the X-axis and the Y-axis are set in the direction orthogonal to each other in the horizontal plane. The holding surface of the substrate holder 9 on the substrate p is placed parallel to the horizontal surface in the state of the base 201132570 (for example, the state in which the substrate p is transferred). X, the z-axis projection is set in the direction orthogonal to the x-axis and the γ-axis. First, the optical axis of the PL is set to be parallel to the Z-axis. Further, each of the directions around the X-axis, the γ-axis, and the 2-axis is referred to as a ΘΧ direction, a ΘΥ direction, and a direction, respectively. The moving mechanism 33 has a moving mechanism main body 35, and a table 34 disposed on the moving mechanism ΓΛΓ1 and holding the substrate holder 9. The moving mechanism body μ is supported by the gas bearing in a non-contact manner on the guiding surface 8a (base 8 = face)' to move in the χγ direction on the guiding surface 8& The exposure apparatus can be moved in a predetermined area of the guide surface 8a on the light emission side (the image surface side of the projection optical system) while holding the substrate Ρ. The moving mechanism body 35 is movable on the guide surface 8a within the lamp :: by, for example, an action including a line coarse motion system (moving mechanism). The stage 34 is moved relative to the moving mechanism body 35 at the Z-axis, port... by a micro-motion system including an actuator such as a voice coil motor. The stage 34 is actuated by a substrate-loaded σ driving system including a coarse (four) system and a micro-motion system, and can be in the X-axis, the axis, the Ζ-axis, the "..., and Move in six directions. The transport robot 4 is used to transport the substrate to the exposure apparatus main body 3 and the carry-in/out unit 5. The transport robot 4 holds the substrate ρ after the mounting, and the disk (substrate support member, substrate support device) Τ moves the substrate ρ together with the tray T to transport the substrate portion 5 to the substrate P. For the exposure, put the heart and move in and out of the exposure device! In a rectangular substrate? In the state of being placed on the above substrate, the stepwise scanning method is performed, and the pattern of the shape W is sequentially transferred to a plurality of, for example, four exposure regions (pattern transfer regions) on the substrate P. That is, the exposure apparatus performs the following scanning exposure, that is, by illuminating the slit-shaped bright area of the mask by the exposure light IL from the illumination system, 'by the controller not shown In the driving system shown in the figure, when the mask holder holding the mask M and the substrate holder 9 holding the substrate p are moved in a predetermined scanning direction (here, the γ-axis direction is set), the pattern of the mask is rotated. The (10) exposure area printed on the substrate p, that is, the broom exposure. Further, the exposure apparatus i of the present embodiment constitutes a so-called multi-lens type scanning exposure apparatus in which the projection optical system PL has a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to a plurality of projection optical modules. After the scanning exposure of the 1_thinning region is completed, a stepping operation is performed in which the substrate holding member 9 is moved to the scanning start position of the next exposure region in the x direction. Next, in the exposure apparatus main body 3, by repeating such scanning exposure and stepping operation, the pattern of the mask M is sequentially transferred to the four exposure areas. As shown in Fig. 2, the transport robot 4 has, for example, a horizontal joint type structure, an arm portion 10 composed of a plurality of portions connected through a vertical joint shaft, a transport hand 12 coupled to the front end of the arm portion 1A, and Drive unit. The arm portion can be driven by the driving device 13 by, for example, moving the driving device 13 in the vertical direction (the x-axis direction) by a control device (not shown). The hand 12 is known to have an open shape, and the two sides 18 and 18 of the long side of the tray (the long side of the substrate) are supported in parallel with the long side of the tray. Direction, by which the substrate p can be held through the tray Ding 7 201132570. Further, the transporting hand 12 is provided with a power supply port (not shown) for supplying electric power to a vibration actuator (vibration generating unit) (not shown) provided in the carrier. The vibration (four) device and the power supply unit will be described in detail later. FIG. 3 is a perspective view for explaining the operation of transporting the robot hand 4. As shown in FIG. 2 and FIG. 3, the transport robot 4 can transfer the hand 12 to the substrate holder 9 of the exposure apparatus main body 3 in the longitudinal direction of the transport hand 12 (the longitudinal direction of the substrate )). direction. Thereby, the transport robot 4 transfers the substrate 至 to the substrate holder 9 » In addition, the transfer robot 4 is not shown in FIGS. 2 and 3 for convenience, but is provided below the transfer hand 12, It has the same mechanism as the transfer handcart and can be driven independently by the hand. X. Transporting The robot hand 4 is not limited to a robot hand having a horizontal joint type structure, and can be realized by appropriately using a known robot hand (generally, a transport mechanism) or a combination. FIG. 4 is a side view showing a schematic configuration of the carry-in/out portion 5. The loading/unloading unit 5 is transferred to a coating and developing machine (not shown) disposed adjacent to the exposure unit 4i, and the substrate Ρβ loading/unloading unit 5 is provided with a substrate supporting unit 51 and a supporting tray τ. The tray support portion 52. The substrate supporting portion 51 includes a flat second supporting portion 5U and a plurality of substrate supporting pins (support pins) 51b which are vertically provided on the first supporting portion 51a and support different portions of the lower surface of the substrate ρ. In the present embodiment, for example, 30 pieces of the substrate supporting pins 5 1 b are provided. Each of the substrate supporting pins 5 1 b is fixed such that the lower end portion is fixed to the first supporting portion 51a and the upper end portion (upper end surface) supports the substrate ρ. An adsorption hole connected to a vacuum pump (not shown) is provided on the upper end surface of the substrate supporting pin 5ib, and the substrate p can be adsorbed. Further, at the upper end portion of the substrate supporting pin 5丨b, a substrate detecting portion (not shown) on which the detecting substrate p is placed on the substrate supporting pin 51b is provided. The substrate supporting portion 51 is connected to the driving portion 54 via the connecting member 53. The driving unit 514 is movable in the χγ plane and the ΘΖ direction on the base portion 55 by the driving system including the coarse motion system and the micro motion system, and the loading and unloading portion 5 can be supported by the substrate supporting pin 5ib. The position of the substrate ρ in the x direction and the Y direction is corrected, or the substrate p is rotated by 9 degrees in the 02 direction. The tray support portion 52 includes a frame-shaped second support portion 52a and a plurality of tray support pins (second support pins) that are provided on the second support portion 52a and support different portions of the tray τ. Further, the tray support portion 52 is provided with a vibration actuator (vibration generating portion) (not shown) provided for the tray τ. The vibration actuator and the power supply unit will be described in detail later using the drawings. The holding 52b is set such that the lower end portion is fixed to the second support portion a, and the upper end portion can support the tray T〇if·±±4* μ board support portion 51 H support, and the 卩5 kb Wei is placed at the upper end of the base. Support ° 卩 5U outside. Further, the tray support pin 52b has a tray detecting portion for detecting whether or not the tray τ is placed on the tray. The heart tray support portion 52 is configured such that the guide portion % moves on the side of the pivot axis I / ... the movable portion can be along the drive portion 54 and 1 = the guide portion 56. The guide portion 56 is supported by the i-support of the substrate support The other part 51 and the other side of the Ρ55. The second support of the substrate support unit 5! is Qiu Lian, and the member 53 and the drive unit 54 are disposed in the L-team support unit 5 of the frame-shaped heart music 2 and the holding unit 52a. First, the tray support portion 52 can move in the z-axis direction while the substrate is held by the substrate 卩5 1 a, and the connection member 53 and the drive unit 54 are not interfered with the 201132570. Further, the tray support portion 52 is raised in the positive direction of the Z-axis. The tray T supported by the tray support pin 52b can be raised in the positive direction of the Z-axis, and the substrate p supported on the substrate supporting pin 5 of the substrate supporting portion 51 can be placed on the tray τ. Further, the tray supporting portion 52 will be borrowed. The tray T on which the substrate P is supported by the tray support pin 52b is transferred to the transport hand 12 of the transport robot 4. Next, the structure of the tray τ will be described in detail. Fig. 5 is a plan view showing the planar structure of the tray τ. As shown, the tray τ is formed by a plurality of linear members 丨 9 interlaced at a predetermined interval in the longitudinal and lateral directions. The sub-mounting portion 20, that is, the portion of the mounting portion 20 where the linear member 19 is not disposed is a rectangular opening portion 21. The tray T is at a predetermined position between the side portions 18, 18 of the placing portion 20. The substrate P is placed on the substrate, and the shape of the tray τ is not limited to the shape shown in FIG. 5. For example, a single frame in which only one peripheral portion of the support substrate 开口 is formed in a single opening portion 21 may be formed. The substrate 配置 arrangement growth edge is parallel to both side portions of the mounting portion 20! 8 and 丨 8. The tray T is in a state where the mounting portion 20 is placed on the substrate p, and the both side portions i 8 and 18 are transported to the robot hand 4 The transporting hand 12 is supported from below (see FIGS. 2 and 3). In other words, the transport robot 4 of the present embodiment supports the substrate P through the tray T and transports the substrate p to a predetermined position by holding the tray τ and moving. The tray T and the lower surface of the placing portion 20 are supported by a plurality of tray support pins 52b of the tray supporting portion 52 of the loading and unloading portion 5 shown in Fig. 4. Further, the tray T' is supported by the tray as shown in Fig. 4. The pin 52b supports a plurality of substrates of the substrate supporting portion 5 in a state where the mounting portion 2 is supported under the mounting portion 2 The support pin 5 lb 10 201132570 is inserted into the plurality of openings 2 shown in Fig. 5. Further, as the material for forming the tray T, it is preferable to use the substrate τ to support the substrate Ρ to suppress the weight of the substrate Ρ itself. As the material to be bent, for example, various synthetic resins or metals can be used, and specific examples thereof include nylon, polypropylene, AS (acrylonitrile-styrene copolymer) resin, and ABS (acrylonitrile-butadiene-styrene copolymer). Resin, polycarbonate, fiber reinforced plastic, stainless steel, etc. "As fiber reinforced plastics, GFRp (Guss Fiber Reinforced Plastic) or cFRp (Carbon Fiber Reinforced piastic) plastic). Further, the linear member 19 which is interlaced in a lattice shape may be formed by using a member having excellent flexibility such as a lead. Here, as shown in Fig. 2, a groove portion 3 that holds the tray T is formed on the upper surface of the substrate holder 9. The groove portion 3 is formed in a lattice shape corresponding to the frame structure of the tray τ. Further, by forming the groove portion 3 on the upper surface of the substrate holder 9, the holding portion (holder portion) 31 of the plurality of substrates P is provided in an island shape. The holding portion 31 has a size corresponding to the opening portion 21 of the tray T. The upper surface of the holding portion 31 is processed so that the substrate holder 9 has a good flatness with respect to the solid holding surface of the substrate p. Further, a plurality of suction holes κ (see Fig. j) for causing the substrate P to follow the surface are provided on the upper surface of the holding portion 31. Each of the suction holes K is connected to a vacuum pump (not shown). Fig. 6 is a partial side sectional view showing a state in which the tray T is housed in the groove portion of the substrate holder 9. As shown in Fig. 6, the thickness of the tray is smaller than the depth of the groove portion 3〇. By this, the tray T is inserted into the groove portion 3, and the core portion 31 protrudes from the opening portion 21, and only the substrate p 201132570 placed on the tray τ is transferred to the holding portion 31. A conical concave portion 41 is formed at four corners on the lower surface side of the mounting portion 20 of the tray T, and a spherical convex portion 42 that is engaged with the concave portion 41 is provided at a position corresponding to each concave portion 41 in the groove portion 3'. When the placing portion 20 is inserted into the groove portion 3, the convex portion 42 of the substrate holder 9 is engaged with the concave portion 41 of the placing portion 2, and the position of the tray 收容 received in the groove portion 30 can be prevented from shifting. . Hereinafter, the oscillating portion, the vibration generating portion, and the power feeding portion of the substrate transfer device 7 of the present embodiment will be described in detail with reference to FIGS. 7 and 8. Fig. 7 is a view showing a schematic configuration of a transport hand 12 and a tray τ according to the present embodiment, and (a) is a schematic cross-sectional view corresponding to a cross section taken along line Α-Α' of Fig. 2 (b) (a) An enlarged picture of the alpha part. Fig. 8 is a view showing a schematic configuration of a tray supporting portion 52 and a tray 本 of the present embodiment, and is a schematic sectional view corresponding to a cross section taken along line BB' of Fig. 4, and (b) is a cold portion of (a) Expanded map. As shown in Figs. 7(a) and 7(b), the substrate transfer device 7 of the present embodiment includes a vibrating portion V that vibrates the tray T. The vibration portion v has a vibration actuator (vibration generating portion) va provided on the tray T, a tray-side power supply unit (power supply portion) ET provided on the tray τ, and a hand-side power supply unit provided on the transport hand 12 ( Power supply department) EH. Further, as shown in Figs. 8(a) and 8(b), the oscillating portion v has a support portion side power supply portion (power supply portion) EP provided in the tray support portion 52 of the carry-in/out portion 5. The vibration actuator VA is placed in the interior of the mounting portion 20 by embedding the linear member constituting the mounting portion 2, and is fixed to the mounting portion 2A. As the vibration actuator VA, for example, a vibration motor generated by rotating an eccentric copper to generate a vibration motor or a supersonic motor having a piezoelectric element corresponding to the applied voltage deformation can be used. In the present embodiment, the configuration in which the plurality of vibration actuators VA are provided will be described. However, depending on the conditions, the vibration actuators VA may be one. Further, the vibration actuator VA is not limited to the above-described vibration motor or ultrasonic motor as long as it can be fixed to the mounting portion 2 and the mounting portion 20 is vibrated at a desired vibration frequency. Further, the vibration actuator VA does not have to be buried inside the placing portion 20, and may be fixed to the lower surface or the side surface of the linear member 19. Further, the vibration actuator VA is disposed more effectively in the vicinity of the position where the mounting portion 2 is to be vibrated. The vibration actuator VA is driven by applying a predetermined voltage to the terminal portion VAT, and causes the placing portion 20 of the tray T to vibrate at a predetermined vibration frequency. Here, the frequency of the vibration of the vibration actuator VA corresponds to the frequency setting of the vibration of the mounting portion 2A. The frequency of the vibration of the mounting portion 20 is set to a high frequency which is placed on the lower surface of the substrate P of the mounting portion 20 and on the upper surface of the mounting portion 2 (substrate support surface) 2〇a due to the action of vibration. The hand side power supply unit EH is composed of a power supply unit (not shown) provided in the transport robot 4, a hand side wiring 14, and a hand side terminal unit 15. The hand side wiring 14 is electrically connected to the power supply unit by the hand side terminal portion 5 connected to the hand side terminal portion 15 at one end side and the power source portion (not shown) connected to the transport robot hand 4 at the other end side. The hand-side terminal portion 15 is formed on the upper surface of the transporting hand 12 in correspondence with the tray-side terminal portion 22 disposed on the lower surface of the tray τ. Hand side terminal part. When the transporting hand 12 is positioned to hold the tray τ and the tray τ is held, it is in contact with the tray-side terminal portion 22 formed under the tray 来 to be electrically connected to the tray-side terminal portion 13 201132570. In addition, the 'hand side terminal portion' 5 is elastically deformable, and when the transport hand j 2 holds the tray T, 'there is contact with the tray side terminal portion 22 provided on the tray τ and the hand 1 2 is elastic. The deformation is made to bias the tray side terminal portion 22. As a result, the hand-side terminal portion 15 comes into contact with the tray-side terminal portion 22 in the pressed state, and electrical connection with the tray-side terminal portion 22 is ensured. The tray side power supply unit ET is composed of a tray side wiring 23 and a tray side terminal unit 22 provided on the tray τ. The tray side wiring 23 is connected to the terminal portion VAT of the vibration actuator VA at one end side, and is connected to the tray side terminal portion 22 at the $-end side to expose the tray side terminal portion 22 which is exposed below the tray τ. The terminal portion VAT of the vibration actuator VA disposed inside the mounting portion 2 is electrically connected. The tray-side terminal portion 22 is formed to be exposed on the lower surface of the mounting portion 2 () corresponding to the hand-side terminal portion disposed on the upper surface of the transporting hand 12. The tray-side terminal portion 22 is electrically connected to the hand-side terminal portion 15 when the transport hand 12 is positioned to hold the tray τ and is held in contact with the hand-side terminal portion 15 formed on the upper surface of the transport hand 12 when the tray is held. Further, the 'tray-side terminal portion 22 is elastically deformable, and when the transporting hand 12 holds the tray τ', it is in contact with the hand-side terminal portion η provided on the transporting hand 12 and elastically deformed toward the side of the tray τ. The side terminal portion 15 is biased. Thereby, the tray-side terminal portion 22 is in contact with the counterpart-side terminal portion 15 in the pressed state, and electrical connection with the hand-side terminal portion 15 is ensured. When the hand side power supply unit Μ and the tray side power supply unit ET are electrically connected to the tow (four) material portion 22 in the hand side terminal portion 15 , the connection of the 201132570 to the other end of the hand side wiring 14 can be omitted. The electric power supplied from the power supply unit is supplied to the vibration actuator VA as the vibration generating unit through the hand side wiring 14 and the tray side wiring 23. Further, a plurality of abutting portions 16 that support the lower surface of the loading portion 20 of the tray τ are provided on the upper surface of the transporting hand 12. The abutting portion 16 is disposed at a position that does not overlap with the vibration actuator VA provided on the tray T in a plan view. In other words, the vibration actuator VA is disposed between the two abutting portions 16 and the abutting portion 16 in the direction of the tray T while the tray τ is positioned and held by the transporting hand 12. Here, the vibration actuator VA is preferably disposed at a position where the vibration of the linear member 丨9 is at the position of the vibration of the linear member 丨9 when the placing portion 20 of the tray τ supported by the abutting portion 16 vibrates. As shown in Figs. 8(a) and 8(b), the support unit side power supply unit Ep is composed of a power supply unit (not shown) provided in the carry-in/out unit 5, a support unit side wiring 57, and a support unit side terminal unit 58. The support portion side wiring 57 is connected to the support portion side terminal portion 58 at one end side and the power supply portion (not shown) connected to the carry-in/out portion 5 at the other end side to electrically connect the support portion side terminal portion 58 and the power supply portion to the support portion side. The terminal portion 58 is formed to be exposed at an upper end portion of the tray support pin 52b in correspondence with the tray side terminal portion 22 disposed on the lower surface of the tray τ. The support-side terminal portion 58 is electrically connected to the tray-side terminal portion 22 in contact with the tray-side terminal portion 22 formed on the lower surface of the tray τ when the tray T is positioned and held by the tray T. Further, the support portion side terminal portion 58 is elastically deformable, and is in contact with the tray side terminal portion 22 provided on the tray τ and to the tray support portion 52 when the pin 52b supports the tray τ. The side is elastically deformed and is pressed against the side end 15 of the tray 32 201132570. Thereby, the support-side terminal portion 58 comes into contact with the tray-side terminal portion 22 in the pressed state, and electrical connection with the tray-side terminal portion 22 is ensured. When the support unit side power supply unit Ep is electrically connected to the tray side terminal unit 22 in the above configuration, the other power source (not shown) connected to the support unit side wiring 57 can be connected. The electric power supplied from the unit is supplied to the vibration actuator VA as the vibration generating unit through the support unit side wiring 57 and the tray side wiring 23. Further, a plurality of abutting portions 52c supporting the lower surface of the loading portion 20 of the tray τ are provided on the upper surface of the tray support pin 52b. (4) Supporting the distribution of the milk system = the vibration of the stomach VA is set to overlap with the vibration set in the drag T. That is, vibration

派動之腹點之位置較理想。The position of the abdomen of the dispatch is ideal.

饮带沿署短邊之部分及與短邊平行之 !叹句问下方彎曲之狀 ，最向下方彎曲之狀態， 之中央部分成為向下方 16 201132570 彎曲之狀態。 接著，說明曝光裝置1之動作。且牌 具體而言，針對藉由 搬送機器手4將基板p椒人； 丁肝丞板P搬入及搬出之方法進行說明。此處， 針對將基板P載置至托盤T’將載置於此托盤τ之基板p 搬入、搬出曝光裝置本體3之步驟進行說明。 塗布有感光劑之基板p係從塗布顯影機搬送至圖i所 示之搬出入部5,定位載置於圖4所示之基板支持部51之 基板支持銷51b上之既定位置，吸附保持於基板支持銷5ib 之上面。如上述，藉由複數個基板支持銷51b支持之基板p， 如圖9所示，成為未由基板支持銷51b支持之部分向下方 彎曲之狀態。 在基板P吸附保持於基板支持銷51b之上面後基板 支持部5 1，在將基板p吸附保持於基板支持銷5 lb之上面 之狀態下，使驅動部54作動，使基板p對準於托盤τ。基 板p與托盤τ之對準結束後，搬出入部5使托盤支持部52 沿著導引部56上昇’以使托盤支持銷52b上之托盤τ上昇。 藉此，基板P在定位之狀態下載置於托盤T之載置部2〇上。 此時，在習知曝光裝置，將彎曲狀態之基板載置於托 盤時，具有以下之問題。圖10(a)〜圖l〇(e)係說明從 習知曝光裝置之搬出入部500至習知托盤T0之基板p〇之 交接步驟的不意圖。 如圖10 ( a )所示，藉由複數個基板支持銷5 1 〇b支持 之基板P0 ’成為未由基板支持銷5 10b支持之部分向下方彎 曲之狀態。在此狀態下，使托盤支持部520上昇，以使由 17 201132570 托盤支持銷520b支持之托盤τ〇上昇。 於疋，如圖1〇(b)所示，基板Ρ0係載置於托盤Τ0 上將基板P0從搬出入部500之基板支持銷5i〇b交接至 & M TO L基板PG從向下方彎曲之部分與托盤下〇接 觸因該部分與托盤το之摩擦，基板P在托盤τ〇上無法 擴展’維持波浪般彎曲之狀態。接著，使配置於托盤別下 方之搬送機器手400之搬送手1200上昇。 於疋，如圖10 ( C )所示，牦盤τ〇之兩側部係藉由搬 送手200保持’托盤τ〇在載置基板之狀態下往托盤支 持銷52Gb之上方被舉起。托盤Τ()兩側部被支持，因基板 P〇與托盤TG之本身重量’藉由搬送手1 支持之兩侧部 :中間部成為向下方彎曲之狀態。因此，基板p〇成為中央 成為下凸之彎曲狀態’朝向中央部壓縮之應力作用且從 上方觀察之基板p0之平面積變小。 之後，使搬送手12〇〇移動，將載置基板p〇之托盤τ〇 朝向圖11所示之基板保持具9〇〇之上方搬送。 圖11係說明從習知托盤T0將基板p〇交接至習知曝光 裝置之基板保持具9〇〇之步驟的示意圖。 如圖11 ( a)所示’藉由搬送手12〇〇將基板p〇往基板 保持具900之上方搬送後’使搬送+ i 下降。於是，如 圖U( b)所不，托盤T0收容於基板保持具900之槽部300, 基板Ρ0載置於基板保持具_上。此時，基板Ρ0從最往 下方彎曲之部分與基板保持具9〇〇接觸。 如圖11 (C)所示，進一步使搬送手12〇〇下降後，基 201132570 板P0載置於基板保持具900,基板P〇從托盤τ〇交接至基 板保持具900。又，托盤Τ0與基板保持具9〇〇之槽部3㈧ 之底部抵接，托盤το從搬送手1200交接至基板保持^ 9〇〇 之槽部300。此時，由於基板保持具9〇〇與基板p〇之摩擦， 基板P0之彎曲狀態之形狀無法完全回復，基板p〇之平面 積較完全平坦之情形縮小》如上述，在習知曝光裝置基 板P0在基板保持具900上成為彎曲狀態，會有產生無法在 基板上之適當位置進行既定曝光等曝光不良問題之情形。 另一方面，本實施形態之曝光裝置卜為了解決上述習 知曝光裝置之問題，使用上述基板搬送裝置7。以下，說明 曝光裝置1之動作與本實施形態之基板搬送裝置7之作用 圖12 ( a) 、（ b )、及（c )係說明從本實施形態之曝 光裝置1之搬出入部5至托盤τ之基板p之交接步驟的示 意圖。 如圖12(a)所示，藉由複數個基板支持銷51b支持之 基板P’成為未由基板支持銷51b支持之部分向下方彎曲之 狀態。 此外拖盤τ係以托盤支持銷5 2b支持，如圖8 ( a) 及8(b)所示’設於拖盤τ之下面之拖盤侧端子部22與設 於托盤支持銷52b之前端部之支持部側端子部W接觸而電 氣連接。亦即’支持部側供電部砂係藉由不圖示之電源部 供電力，成為可對設於拖盤τ之振動致動器VA之端子部 供電之狀態。在此狀態下，使托盤支持部5 2上昇，以 使由托盤支持銷52b支持之托盤τ上昇。 201132570 於是，如圖12(b)所示，基板P係載置於托盤丁上， 將基板P從搬出入部5之基板支持銷5 lb交接至托盤τ。此 時，搬出入部5係以支持部側供電部EP之不圓示之電源部 對振動致動器VA之端子部VAT供給電力，使振動致動器 VA以既定之頻率振動。振動致動器VA以既定之頻率振動 後，固定有振動致動器VA之拖盤τ之載置部2〇以既定之 頻率振動。 在此，振動致動器VA之振動之頻率係對應於載置部 20之振動之頻率設定。載置部2〇之振動之頻率係設定為載 置於載置部20之基板Ρ之下面與載置部2〇之上面（基板 支持面）2Ga因振動之作用而產生滑動之高頻。因此載置 部20以既定之頻率振動後，載置部2〇之上面加與基板ρ 之下面成為重複部分且瞬間分離與接觸之狀態，成為載置 部20之上面20a與基板ρ之下面之間之摩擦力降低之狀態。 藉此’如圖12( a)所示f曲為於面方向壓縮而在平面 積變小之狀態下載置於載置部2〇之基板p之應力開放，如 圖12(b)所示’基板ρ之外緣部以從基板ρ之中央部往外 側擴張之方式移動。藉此，基板p以平坦之狀態載置於拖 盤T。 此時’如圖8所示，托盤支持銷52b係配置於不血設 於拖盤T之振動致動器VA俯視地重疊之位置。因此，可使 耗盤支持銷52b間之線狀構件19更容易振動，可使載置部 :〇效率良好地振動。另外’於將振動致動器VA配置於線 構件19之振動之腹點之部分場合可使線狀構件19之振 20 201132570 動增幅y吏載置部20效率更好且有效地振動。 其人在將基板p調整為實施曝光處理之溫度後，使 配置於㈣τ下方之搬送機器手4之搬送手12上昇。 於疋’如圖12(c)所示，托盤τ之兩側部18、18 (參 、圖2及圖5)係藉由搬送手12保持，在托盤τ載置基板 之狀L下往托盤支持銷52b之上方被舉起。托盤τ兩側部 ^、18被支持’因基板p與托盤τ之本身重量，藉由搬送 手12支持之兩側部18 ' 18之間成為向下方彎曲之狀態。 此時如圖7(a)及7(b)所示，設於搬送手12之上 面之手側端子部1 5與設於拖盤τ之下面之拖盤側端子部22 接觸而電氣連接。亦即’手側供電部ΕΗ係藉由不圖示之電 源邛供給電力，成為可對設於拖盤τ之振動致動器之端 子部VAT供電之狀態。 在此，搬送機器手4係在以搬送手12支持托盤τ兩側 邛1 8、1 8往上方舉起時，藉由手側供電部ΕΗ之不圖示之 電源部對振動致動器VA之端子部VAT供給電力，使振動 致動器VA以既定之頻率振動。振動致動器va以既定之頻 率振動後，固定有振動致動器VA之拖盤丁之載置部2〇以 既定之頻率振動。 在此’振動致動器VA之振動之頻率係對應於載置部 2〇之振動之頻率設定。此外，載置部2〇之振動之頻率係設 疋為載置於載置部20之基板P之下面與載置部2〇之上面 (基板支持面）20a因振動之作用而產生滑動之高頻。因 此’載置部20以既定之頻率振動後，載置部2〇之上面2〇a 21 201132570 與基板p之下面成為重複部分且瞬間分離與接觸之狀態， 成為載置部20之上面20a與基板P之下面之間之摩擦力降 低之狀態。 藉此’如圖12(c)所示’基板P之下面與拖盤τ之載 置部20之上面20a以開放基板p之應力之方式滑動，可防 止基板P彎曲成為波浪般之狀態。又，可緩和使基板p朝 向中央部壓縮之應力。 接著，如圖3所示，搬送機器手4改變搬送手12之方 向以使搬送手12之長邊方向（基板p之長邊方向）朝向曝 光裝置本體3之基板保持具9側。之後，使搬送手12移動， 將載置有基板P之托盤T朝向圖13所示之基板保持具9上 方搬送。此時，可繼續手側供電部ΕΗ對振動致動器VA之 電力供給’使托盤Τ之載置部20之振動繼續，或暫時中斷 對振動致動器VA之電力供給，使托盤τ之載置部之振 動中斷亦可。 & 此夕卜，搬送手丨2以基板Ρ表面與基板保持具9之伯 部31成為大致平行之方式搬送基板ρ。此處，大致平布 意指排除因本身重量導致之基板ρ之彎曲時平行或接这 行之狀態。具體而言’搬送手12以搬送手12保持基相 之被保持部分與保持部31之基板載置面成為大致平行之 式搬送基板Ρ。藉此，即使為於拖盤了之搬送時使載置 2〇之振動繼續之場合，亦可防止基板ρ或拖盤τ之位置 移。The drink belt is along the short side of the department and parallel to the short side. The sigh is asked to bend underneath, and the bottom part is bent downward. The central part becomes the state of bending downwards 201132. Next, the operation of the exposure apparatus 1 will be described. Specifically, the method of loading and unloading the substrate p pepper person and the D-hepatic plate P by the transfer robot 4 will be described. Here, the step of loading the substrate P placed on the tray τ into and out of the exposure apparatus main body 3 by placing the substrate P on the tray T' will be described. The substrate p to which the sensitizer is applied is transported from the coating and developing machine to the carry-in/out portion 5 shown in Fig. i, and is placed at a predetermined position on the substrate supporting pin 51b of the substrate supporting portion 51 shown in Fig. 4, and is adsorbed and held on the substrate. Support the top of the pin 5ib. As described above, the substrate p supported by the plurality of substrate supporting pins 51b is in a state in which the portion not supported by the substrate supporting pins 51b is bent downward as shown in Fig. 9 . After the substrate P is adsorbed and held on the upper surface of the substrate supporting pin 51b, the substrate supporting portion 51 is moved by the substrate supporting pin 5 lb, and the driving portion 54 is actuated to align the substrate p with the substrate. τ. After the alignment of the substrate p and the tray τ is completed, the loading/unloading portion 5 causes the tray supporting portion 52 to ascend along the guiding portion 56 to raise the tray τ on the tray supporting pin 52b. Thereby, the substrate P is downloaded and placed on the placing portion 2 of the tray T in the state of being positioned. At this time, in the conventional exposure apparatus, when the substrate in a bent state is placed on the tray, the following problems occur. Fig. 10 (a) to Fig. 10 (e) show the intention of the transfer step from the carry-in/out portion 500 of the conventional exposure apparatus to the substrate p of the conventional tray T0. As shown in Fig. 10 (a), the substrate P0' supported by the plurality of substrate supporting pins 5 1 〇b is in a state in which the portion not supported by the substrate supporting pins 5 10b is bent downward. In this state, the tray support portion 520 is raised to raise the tray τ 支持 supported by the 17 201132570 tray support pin 520b. As shown in FIG. 1(b), the substrate Ρ0 is placed on the tray Τ0, and the substrate P0 is transferred from the substrate supporting pin 5i〇b of the loading and unloading unit 500 to the & M TO L substrate PG which is bent downward. Part of the contact with the lower jaw of the tray is due to the friction of the portion with the tray το, and the substrate P cannot be expanded on the tray τ〇 to maintain a wave-like state. Next, the transfer hand 1200 of the transfer robot 400 placed under the tray is raised. As shown in Fig. 10(C), the both sides of the disk τ are held by the transporting hand 200, and the tray τ is lifted above the tray supporting pin 52Gb while the substrate is placed. Both sides of the tray Τ () are supported, and the substrate P 〇 and the weight of the tray TG ' are both sides supported by the transport hand 1 : the intermediate portion is bent downward. Therefore, the substrate p 〇 has a centrally bent state in which it is bent downward. The stress applied to the central portion is reduced, and the flat area of the substrate p0 as viewed from above becomes smaller. Thereafter, the transporting hand 12 is moved, and the tray τ〇 on which the substrate p is placed is transported upward toward the substrate holder 9A shown in Fig. 11 . Fig. 11 is a view showing the step of transferring the substrate p〇 from the conventional tray T0 to the substrate holder 9 of the conventional exposure apparatus. As shown in Fig. 11 (a), after the substrate p is transported over the substrate holder 900 by the transporting hand 12, the transport + i is lowered. Therefore, as shown in Fig. U(b), the tray T0 is housed in the groove portion 300 of the substrate holder 900, and the substrate Ρ0 is placed on the substrate holder_. At this time, the portion of the substrate Ρ0 bent from the lowermost side is in contact with the substrate holder 9〇〇. As shown in Fig. 11(C), after the transfer hand 12 is further lowered, the base 201132570 board P0 is placed on the substrate holder 900, and the substrate P is transferred from the tray τ to the substrate holder 900. Further, the tray Τ0 is in contact with the bottom of the groove portion 3 (8) of the substrate holder 9A, and the tray τ is transferred from the transfer hand 1200 to the groove portion 300 of the substrate holding portion. At this time, due to the friction between the substrate holder 9〇〇 and the substrate p〇, the shape of the curved state of the substrate P0 cannot be completely recovered, and the flat area of the substrate p〇 is relatively flat. As described above, in the conventional exposure device substrate P0 is in a curved state on the substrate holder 900, and there is a possibility that an exposure failure such as a predetermined exposure cannot be performed at an appropriate position on the substrate. On the other hand, in the exposure apparatus of the present embodiment, the substrate transfer apparatus 7 is used in order to solve the above problem of the conventional exposure apparatus. Hereinafter, the operation of the exposure apparatus 1 and the operation of the substrate transfer apparatus 7 of the present embodiment will be described. Figs. 12(a), (b), and (c) illustrate the loading and unloading portion 5 to the tray τ from the exposure apparatus 1 of the present embodiment. A schematic diagram of the step of transferring the substrate p. As shown in Fig. 12 (a), the substrate P' supported by the plurality of substrate supporting pins 51b is in a state of being bent downward by a portion not supported by the substrate supporting pins 51b. Further, the tray τ is supported by the tray support pin 52b, as shown in Figs. 8(a) and 8(b), the tray side terminal portion 22 disposed under the tray τ and the front end of the tray support pin 52b. The support portion side terminal portion W of the portion is in contact with each other and electrically connected. In other words, the support unit side power supply unit sand system supplies power to a power supply unit (not shown), and supplies power to the terminal unit of the vibration actuator VA provided on the tray τ. In this state, the tray support portion 52 is raised to raise the tray τ supported by the tray support pin 52b. 201132570 Then, as shown in FIG. 12(b), the substrate P is placed on the tray, and the substrate P is transferred from the substrate support pin 5 lb of the carry-in/out portion 5 to the tray τ. At this time, the carry-in/out portion 5 supplies electric power to the terminal portion VAT of the vibration actuator VA by the power supply unit not shown in the support portion side power supply portion EP, and vibrates the vibration actuator VA at a predetermined frequency. After the vibration actuator VA vibrates at a predetermined frequency, the placing portion 2 of the tray τ to which the vibration actuator VA is fixed is vibrated at a predetermined frequency. Here, the frequency of the vibration of the vibration actuator VA is set corresponding to the frequency of the vibration of the placing portion 20. The frequency of the vibration of the mounting portion 2 is set to a high frequency which is placed on the lower surface of the substrate 载 of the mounting portion 20 and the upper surface of the mounting portion 2 (the substrate supporting surface) 2Ga is slid by the action of vibration. Therefore, after the mounting portion 20 vibrates at a predetermined frequency, the upper surface of the mounting portion 2 is placed on the lower surface of the substrate ρ as a repeating portion and is instantaneously separated and contacted, and becomes the upper surface 20a of the mounting portion 20 and the lower surface of the substrate ρ. The state of friction between the two is reduced. Thus, as shown in Fig. 12(a), the f-curve is compressed in the plane direction, and the stress placed on the substrate p placed on the mounting portion 2 is opened in a state where the flat area is reduced, as shown in Fig. 12(b). The outer edge portion of the substrate ρ moves outward from the central portion of the substrate ρ. Thereby, the substrate p is placed on the tray T in a flat state. At this time, as shown in Fig. 8, the tray support pin 52b is disposed at a position where the vibration actuator VA which is not provided on the tray T overlaps in a plan view. Therefore, the linear member 19 between the consumable support pins 52b can be more easily vibrated, and the mounting portion can be vibrated efficiently. Further, in the case where the vibration actuator VA is disposed at the abdomen point of the vibration of the wire member 19, the vibration of the linear member 19 can be made to increase the efficiency of the mounting portion 20 more effectively and effectively. After the substrate p is adjusted to the temperature at which the exposure process is performed, the transfer hand 12 of the transfer robot 4 disposed under the (4) τ is raised. As shown in Fig. 12(c), the two side portions 18, 18 (see, Figs. 2 and 5) of the tray τ are held by the transporting hand 12, and are placed on the tray 255 in the form of the substrate. The support pin 52b is lifted above it. The two sides of the tray τ are supported by the weights of the substrate p and the tray τ, and the sides 18' 18 supported by the conveyance hand 12 are bent downward. At this time, as shown in Figs. 7(a) and 7(b), the hand-side terminal portion 15 provided on the upper surface of the transporting hand 12 is in electrical contact with the tray-side terminal portion 22 provided on the lower surface of the tray τ. In other words, the hand-side power supply unit supplies power to the terminal unit VAT of the vibration actuator provided on the tray τ by supplying electric power from a power source (not shown). Here, when the transport robot 4 is lifted upward by the both sides 188, 18 of the support hand 12 of the transport hand 12, the power supply unit to the vibration actuator VA (not shown) by the hand power supply unit ΕΗ The terminal portion VAT supplies electric power, and the vibration actuator VA vibrates at a predetermined frequency. After the vibration actuator va vibrates at a predetermined frequency, the loading portion 2 of the tray to which the vibration actuator VA is fixed is vibrated at a predetermined frequency. Here, the frequency of the vibration of the vibration actuator VA is set corresponding to the frequency of the vibration of the placing portion 2A. Further, the frequency of the vibration of the mounting portion 2 is such that the lower surface of the substrate P placed on the mounting portion 20 and the upper surface of the mounting portion 2 (the substrate supporting surface) 20a are slid by the action of vibration. frequency. Therefore, when the mounting portion 20 vibrates at a predetermined frequency, the upper surface 2〇a 21 201132570 of the mounting portion 2 is overlapped with the lower surface of the substrate p and is instantaneously separated and contacted, and becomes the upper surface 20a of the mounting portion 20 and A state in which the frictional force between the lower surfaces of the substrates P is lowered. As a result, the lower surface of the substrate P and the upper surface 20a of the mounting portion 20 of the tray τ are slid by the stress of the open substrate p as shown in Fig. 12(c), thereby preventing the substrate P from being bent into a wave-like state. Further, the stress which causes the substrate p to be compressed toward the central portion can be alleviated. Then, as shown in Fig. 3, the transport robot 4 changes the direction of the transport hand 12 so that the longitudinal direction of the transport hand 12 (longitudinal direction of the substrate p) faces the substrate holder 9 side of the exposure apparatus main body 3. Thereafter, the transporting hand 12 is moved, and the tray T on which the substrate P is placed is transported toward the upper side of the substrate holder 9 shown in Fig. 13 . At this time, it is possible to continue the power supply to the vibration actuator VA by the hand-side power supply unit ' to continue the vibration of the loading unit 20 of the tray , or to temporarily interrupt the power supply to the vibration actuator VA so that the tray τ is loaded. The vibration of the part can also be interrupted. & Further, the transport cassette 2 transports the substrate ρ such that the surface of the substrate is substantially parallel to the portion 31 of the substrate holder 9. Here, the substantially flat state means a state in which the bending of the substrate ρ due to its own weight is parallel or connected. Specifically, the transporting hand 12 transports the substrate 以 in such a manner that the transporting hand 12 holds the held portion of the base phase and the substrate mounting surface of the holding portion 31 substantially in parallel. Thereby, even when the vibration of the load is continued during the conveyance of the tray, the position of the substrate ρ or the tray τ can be prevented from shifting.

13係說明從牦盤τ將基板 Ρ交接至曝光裝置1之基 22 201132570 板保持具9之步驟的示意圖。 搬送機器手4，如圖丨3( _ 板P向基板保持具9上方 :’藉由搬送手12將基 康德，佶II 2麻- 、進行托盤T與槽部30之對 準後使圖2所不之_& 於是，如圖Π⑴所示 ：：以使搬送手12下降。 Λ(5 30 . P « * ^ 收谷於基板保持具9之槽 ^ 30暴板p载置於基板伴拄且〇 ^ 往下方f曲之部分與基板二持具9上。此時，基板p從最 接觸。 、保持具9之保持部31 (參照圖3) 在此，搬送機器手4係w主w 係以手側供電部EH對振動致動器 V A供，.，口電力使振動致動器v Δ 去 、 勃器VA振動，使拖盤T之載置部20 以既定之振動頻率振動。於， 、疋成為載置部20之上面20a 與基板P之下面之間之磨換上The 13 series shows a schematic diagram of the step of transferring the substrate 牦 from the τ τ to the base of the exposure apparatus 1 22 201132570 board holder 9. The robot hand 4 is transported, as shown in Fig. 3 ( _ plate P is placed above the substrate holder 9: 'Kekid, 佶II 2 hemp- by the hand 12, and the tray T and the groove portion 30 are aligned to make Fig. 2 If not, then, as shown in Fig. (1):: to lower the transporting hand 12. Λ (5 30 . P « * ^ sag in the groove of the substrate holder 9 ^ 30 slab p placed on the substrate 〇 〇 往 f f f f f f f f f 与 f 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 w is supplied to the vibration actuator VA by the hand side power supply unit EH, and the port electric power vibrates the vibration actuator v Δ and the VA device VA to cause the loading unit 20 of the tray T to vibrate at a predetermined vibration frequency. Then, 疋 becomes the grinding between the upper surface 20a of the mounting portion 20 and the lower surface of the substrate P.

,v n之摩擦力降低之狀態。之後，於基板P 與基板保持具9之保持部3丨, the state of friction of v n is reduced. Thereafter, the holding portion 3 of the substrate P and the substrate holder 9

1之接觸面積逐漸增加時，基板 P之下面與拖盤T之載詈邱L & & 戰置。卩20之上面20a滑動使基板p之 應力開放，防止基板p之贊曲。 如圖13(0所示，進一步使搬送手12下降後，基板p 載置於基板保持具9之保持部31，基板p從托盤T交接至 基板保持具9。又’托盤τ與基板保持具9之槽部3〇之底 部抵接，托盤T從搬送”2交接至基板保持具9之槽部3〇。 如上述，在本實施形態之曝光裝置i，於基板p之交接時防 止基板P之f曲’基板p在基板保持具9上成為平坦狀態。 因此’可在基板P上之適#位置良好地進行既定曝光。 對基板保持具9之基板P之交接完成後，搬送機器手4 使搬送手12從基板保持具9上退避。 23 201132570 在基板P載置至基板保持具9後’藉由照明系統以曝 光用光IL照明圖2所示之光罩M。以曝光用光il照明之光 罩Μ之圖案，係透過投影光學系統PL投影曝光於載置於基 板保持具9之基板Ρ。 在曝光裝置1，如上述可將基板Ρ良好地載置於基板保 持具9上’因此可在基板ρ上之適當位置高精度進行既定 曝光’可實現信賴性高之曝光處理。又，在曝光裝置丨，如 上述可順利進行對托盤Τ及基板保持具9之基板ρ之交接， 因此可無延遲地進行對基板Ρ之曝光處理。 接著’針對曝光處理結束後之從基板保持具9之基板ρ 之搬出動作進行說明。此外，以下之說明中雖說明搬送手 12進行基板ρ之搬出，但雙手構造中之另一個搬送手進行 搬出亦可。 曝光處理結束後，搬送機器手4驅動搬送手12，在載 置於基板保持具9上之托盤τ之下方將搬送手12從—γ方 向側插入至基板保持具9之X軸方向兩側。與此同時，藉 由未圖示之控制裝置解除真空泵之吸引，解除基板保持具9 進行之基板ρ之吸附。 接著’搬送手12被驅動裝置13往上方驅動既定量後， 搬送手12分別抵接於托盤τ之載置部2〇之兩側部i8、u 之下面。搬送手12進一步被往上方驅動後，載置於基板保 持具9之保持部31之基板Ρ交接至托盤τ。此時，根據本 實施形態，如上述可防止基板Ρ之彎曲，因此在使托盤τ 彺上方移動時’可在較以往平坦之狀態下將基板Ρ載置於 24 201132570 步被往上方驅動後， 之上方被舉起，載置 托盤T之載置部20上。搬送手12進一 支持基板Ρ之托盤Τ往基板保持具9 部2 0從基板保持具9離開。 在托盤Τ被舉起至此載置部2()與基板保持具9離開之 位置之時點，保持基板ρ之托盤T係藉由搬送手Η而從基 板保持” 9上退避。以此方式，完成對曝光裝置本體3之 基板P之搬出動作。 其次，針對本發明之第2實施形態，援用圖1〜圖13， 使用圖14及圖1 5說明。本實施形態之基板搬送裝置&係 振動產生部不設於拖盤（基板支持構件）丁丨而設於搬送機 器手4a及搬出入部（出入口部）5a之方面與上述之第1實 施形態之基板搬送裝置7不同。其他方面與第i實施形態 之基板搬送裝置7相同，故對相同之部分賦予相同之符號 而說明省略。 圖14係顯示本實施形態之拖盤T1及搬送手12之概略 構成之示意剖面圖。 如圖14所示，在不設有於圖7(a)及7(b)顯示之振 動致動器VA及拖盤側供電部ET方面與已於第1實施形態 說明之拖盤T相異，其他方面則設為與拖盤τ相同。 搬送機器手（搬送部）4a具備：保持拖盤τΐ之搬送手 12、使搬送手12移動之手致動器（致動器、振動產生部） 61、 控制手致動器61之手控制部（控制部、振動產生部） 62。 手致動器61具有致動器本體61a、升降驅動部63、直 動驅動部64。 25 201132570 升降驅動部63具備藉由繞軸旋轉來使搬送手12升降 之進給螺桿63a、固定於致動器本體61a並使進給螺桿63a 繞軸旋轉之升降馬達63b、固定於搬送手12之手支持部 63c。於致動器本體61a沿使搬送手12升降之方向形成有滑 槽61b。手支持部63c具有設為可與設於致動器本體之 滑槽61b卡合並沿滑槽61b之延在方向滑動之卡合部63d。 升降驅動部63係藉由以升降馬達63b使進給螺桿63a 繞軸旋轉並使搬送手12與手支持部63c 一起沿滑槽6ib移 動來使搬送手12於與拖盤T1之載置部2〇之上面2〇a交又 之方向’例如鉛直方向（Z方向）移動。 直動驅動部64具有使致動器本體61a沿拖盤丁丨之栽 置部20之上面2〇3移動之線性馬達64a、使致動器本體 可滑動地卡合之直動導引部64b。線性馬達64a及直動導亏丨 部64b係沿沿載置部20之上面2〇a之搬送手12之移動方向 設置。 直動驅動部64係藉由使線性馬達 〜、μ工^7 :¾ .¾動並使致動器 本體6U沿直動導引部64b移動來使透過手支持部63c與致 動器本體6U連結之搬送手12於沿載置部2〇之上面2〇& 之方向，例如水平方向（χγ平面方向）移動。 手控制部62係設為可對手致動器61之升降馬達咖 及線性馬達64a分別傳達既定之控制信號，設為可分別振動 性控制升降馬達63b及線性馬達64ae在此，所謂振動性控 制係指使各馬達產生既定之頻率之振動，使搬送手12於各 移動方向以既定之頻率振動。 26 201132570 升降馬達63b及線性馬達64a之振動之頻率係基於搬送 手12之振動之頻率設定。此外，搬送手12之振動之頻率 係基於搬送手12之振動傳達至保持於搬送手12之拖盤T1 而拖盤τ!振動時之載置部2〇之振動之頻率設定。載置部 20之振動之頻率係設定為與於第u施形態以振動致動器 VA振動之拖盤T之載置部2〇之振動之頻率相同。 於搬送手12之上面設有支持拖盤T1之載置部2〇之下 面之複數抵接部17。本實施形態之抵接部17係設為可將於 搬送手12產生之振動效率良好地傳達至拖盤T1。亦即，本 實施形態之抵接部丨7亦做為傳達振動之振動傳達構件發揮 機能。 圖15係顯示本實施形態之拖盤T1及搬出入部&之概 略構成之示意剖面圖。 如圖1 5所示，本實施形態之搬出入部5a之拖盤支持部 52具有使拖盤支持部52升降之支持部致動器（致動器振 動產生部）7 1、控制支持部致動器7丨之支持部控制部（控 制部、振動產生部）72。 支持部致動器71係如於上述第1實施形態已說明，設 為可使拖盤支持部52沿於圖4顯示之導引部56於z軸方 向移動。支持部控制部72係設為可對支持部致動器71傳 達既定之控制信號，設為可振動性控制支持部致動器7 1。 在此，所謂振動性控制係指使各致動器產生既定之頻率之 振動’使拖盤支持部5 2沿Z方向以既定之頻率振動。 在本實施形態係上述之手致動器61及手控制部62、支 27 201132570 持部致動器71及支持部控制部72分別構成使搬送手12及 拖盤支持部52產生振動之振動產生部。此外，此等振動產 生部構成基於供給電力使保持拖盤T1之搬送手12及托盤 支持銷52b分別產生振動之加振部v 1。 此外，於托盤支持銷52b之上面設有支持拖盤T1之載 置部20之下面之複數抵接部52e。本實施形態之抵接部52e 係設為可將於拖盤支持部52產生之振動效率良好地傳達至 拖盤τι。亦即，本實施形態之抵接部52e亦做為傳達振動 之振動傳達構件發揮機能。 在如圖12 (a)〜圖12 (b)所示使由基板支持銷51b 支持之基板P載置於拖盤τι之載置部20時，首先如圖15 所示使支持部致動器71作動。接著，如圖12 (a)所示， 藉由使拖盤支持部52上升，使以拖盤支持部52保持之拖 盤T1上升。 其次，在如圖12 ( b )所示使由基板支持銷5 lb支持之 基板P載置於拖盤T1之載置部20時，以於圖15顯示之支 持部控制部72使支持部致動器71以既定之頻率振動。於 是，如圖15所示，支持部致動器71之振動傳達至拖盤支 持部52，托盤支持銷52b以既定之頻率振動。 托盤支持銷52b以既定之頻率振動後，該振動透過抵 接部52e傳達至拖盤T1，與第！實施形態同樣地，拖盤T1 之載置部20以既定之頻率振動。藉此，與於圖12(b)顯 示之第1實施形態同樣地，除去基板p之彎曲，基板p變 平垣。 28 201132570When the contact area of 1 is gradually increased, the bottom of the substrate P and the tray T are loaded with Qiu L && The upper surface 20a of the crucible 20 slides to open the stress of the substrate p, preventing the substrate p from being praised. As shown in Fig. 13 (0), after the transfer hand 12 is further lowered, the substrate p is placed on the holding portion 31 of the substrate holder 9, and the substrate p is transferred from the tray T to the substrate holder 9. Further, the tray τ and the substrate holder The bottom of the groove portion 3 of the 9 is abutted, and the tray T is transferred from the conveyance "2" to the groove portion 3 of the substrate holder 9. As described above, the exposure apparatus i of the present embodiment prevents the substrate P from being transferred at the substrate p. The substrate p is flat on the substrate holder 9. Therefore, the predetermined exposure can be performed satisfactorily on the substrate P. After the substrate P of the substrate holder 9 is transferred, the robot 4 is transported. The transporting hand 12 is retracted from the substrate holder 9. 23 201132570 After the substrate P is placed on the substrate holder 9, the reticle M shown in Fig. 2 is illuminated by the illumination system IL by the illumination system. The pattern of the illuminating mask is projected onto the substrate 载 placed on the substrate holder 9 by the projection optical system PL. In the exposure device 1, the substrate can be placed on the substrate holder 9 as described above. Therefore, the predetermined position on the substrate ρ can be accurately determined. In the exposure apparatus, the substrate ρ of the tray Τ and the substrate holder 9 can be smoothly transferred as described above, so that the exposure processing of the substrate 可 can be performed without delay. Next, the carrying operation of the substrate ρ from the substrate holder 9 after the completion of the exposure processing will be described. In the following description, the transfer hand 12 is described as carrying out the substrate ρ, but the other hand in the two-hand structure is carried out. After the exposure process is completed, the transport robot 4 drives the transport hand 12, and the transport hand 12 is inserted from the -γ direction side to the X axis of the substrate holder 9 below the tray τ placed on the substrate holder 9. At the same time, the suction of the vacuum pump is released by the control device (not shown), and the suction of the substrate ρ by the substrate holder 9 is released. Then, the transporting hand 12 is driven by the driving device 13 to the above, and then transported. The hand 12 abuts on the lower sides i8 and u of the mounting portion 2 of the tray τ. The transporting hand 12 is further driven upward and placed on the holding portion 31 of the substrate holder 9. The plate is transferred to the tray τ. At this time, according to the present embodiment, since the bending of the substrate 可 can be prevented as described above, when the tray τ 移动 is moved, the substrate can be placed in a state of being flat in the past 24 201132570. After the step is driven upward, the upper portion is lifted up and placed on the placing portion 20 of the tray T. The transporting hand 12 is fed into the tray of the supporting substrate, and the substrate holder 9 is detached from the substrate holder 9. When the tray 举 is lifted up to a position where the placing unit 2 () and the substrate holder 9 are separated from each other, the tray T holding the substrate ρ is retracted from the substrate holding by the transfer of the handcuffs. In this manner, the pair is completed. The second embodiment of the present invention will be described with reference to Figs. 14 and 15 in the second embodiment of the present invention. The substrate transfer device and the vibration generating unit according to the present embodiment are provided in the transfer robot 4a and the carry-in/out portion (port-out portion) 5a, not in the tray (substrate support member), and in the first embodiment described above. The substrate transfer device 7 is different. The other points are the same as those of the substrate transfer device 7 of the i-th embodiment, and the same reference numerals are given to the same portions, and the description thereof will be omitted. Fig. 14 is a schematic cross-sectional view showing a schematic configuration of the tray T1 and the transporting hand 12 of the embodiment. As shown in Fig. 14, the vibration actuator VA and the tray side power supply unit ET which are not provided in Figs. 7(a) and 7(b) are different from the tray T which has been described in the first embodiment. Other aspects are set to be the same as the tray τ. The transport robot (transport unit) 4a includes a transport hand 12 that holds the tray τ, a hand actuator that moves the transport hand 12 (actuator, vibration generating unit) 61, and a hand control unit that controls the hand actuator 61. (Control unit, vibration generating unit) 62. The hand actuator 61 has an actuator body 61a, a lift drive portion 63, and a linear drive portion 64. 25 201132570 The elevation drive unit 63 includes a feed screw 63a that lifts and lowers the conveyance hand 12 by pivoting, an elevation motor 63b that is fixed to the actuator main body 61a and rotates the feed screw 63a, and is fixed to the conveyance hand 12 Hand support portion 63c. A slide groove 61b is formed in the actuator body 61a in a direction in which the transfer hand 12 is moved up and down. The hand support portion 63c has an engaging portion 63d which is slidable in the direction in which the sliding groove 61b is engaged with the chute 61b provided in the actuator main body. The elevation drive unit 63 rotates the feed screw 63a by the elevation motor 63b, and moves the conveyance hand 12 together with the hand support portion 63c along the chute 6ib to move the hand 12 to the loading portion 2 of the tray T1. The direction above the 2〇a intersection is moved, for example, in the vertical direction (Z direction). The linear motion drive unit 64 has a linear motor 64a that moves the actuator body 61a along the upper surface 2〇3 of the tray unit 20, and a linear motion guide 64b that slidably engages the actuator body. . The linear motor 64a and the linear motion guide portion 64b are provided along the moving direction of the transport hand 12 along the upper surface 2〇a of the mounting portion 20. The linear motion driving unit 64 transmits the hand support portion 63c and the actuator body 6U by moving the linear motor 〜7,3⁄4.3⁄4 and moving the actuator body 6U along the linear motion guiding portion 64b. The connected transport hand 12 moves in the horizontal direction (χγ plane direction) in the direction of the top surface of the mounting unit 2〇. The hand control unit 62 is configured to transmit a predetermined control signal to each of the lift motor and the linear motor 64a of the opponent actuator 61, and to separately control the lift motor 63b and the linear motor 64ae, and the vibration control system. The motors are caused to generate vibrations of a predetermined frequency, and the transporting hand 12 is vibrated at a predetermined frequency in each moving direction. 26 201132570 The frequency of the vibration of the lift motor 63b and the linear motor 64a is set based on the frequency of the vibration of the transport hand 12. Further, the frequency of the vibration of the transporting hand 12 is set based on the frequency of the vibration of the placing unit 2〇 when the vibration of the transporting hand 12 is transmitted to the tray T1 held by the transporting hand 12 and the drag τ! The frequency of the vibration of the placing portion 20 is set to be the same as the frequency of the vibration of the placing portion 2 of the tray T which is vibrated by the vibration actuator VA in the first embodiment. A plurality of abutting portions 17 supporting the lower surface of the loading portion 2 of the tray T1 are provided on the upper surface of the transporting hand 12. The abutting portion 17 of the present embodiment is configured to efficiently transmit the vibration generated by the transporting hand 12 to the tray T1. That is, the abutting portion 7 of the present embodiment also functions as a vibration transmitting member that transmits vibration. Fig. 15 is a schematic cross-sectional view showing a schematic configuration of a tray T1 and a loading/unloading portion & As shown in Fig. 15, the tray support portion 52 of the carry-in/out portion 5a of the present embodiment has a support portion actuator (actuator vibration generating portion) 71 for raising and lowering the tray support portion 52, and the control support portion is actuated. The support unit control unit (control unit, vibration generation unit) 72 of the unit 7丨. The support portion actuator 71 has been described as described in the first embodiment, and the tray support portion 52 is moved in the z-axis direction along the guide portion 56 shown in Fig. 4 . The support unit control unit 72 is configured to transmit a predetermined control signal to the support unit actuator 71, and is provided as a vibratory control support unit actuator 71. Here, the vibration control means that each actuator generates a vibration of a predetermined frequency, and the tray support portion 52 is vibrated at a predetermined frequency in the Z direction. In the present embodiment, the hand actuator 61 and the hand control unit 62, the support 27 201132570 holding unit 71, and the support unit control unit 72 respectively constitute a vibration for generating vibration of the transport hand 12 and the tray support portion 52. unit. Further, these vibration generating units constitute a oscillating portion v 1 for generating vibration by the transport hand 12 and the tray support pin 52b that hold the tray T1 based on the supplied electric power. Further, a plurality of abutting portions 52e for supporting the lower surface of the loading portion 20 of the tray T1 are provided on the upper surface of the tray support pin 52b. The abutting portion 52e of the present embodiment is configured to efficiently transmit the vibration generated by the tray support portion 52 to the tray τι. That is, the abutting portion 52e of the present embodiment also functions as a vibration transmitting member that transmits vibration. When the substrate P supported by the substrate supporting pin 51b is placed on the placing portion 20 of the tray τ1 as shown in Figs. 12(a) to 12(b), first, the supporting portion actuator is made as shown in Fig. 15. 71 action. Next, as shown in Fig. 12 (a), the tray support portion 52 is raised, and the tray T1 held by the tray support portion 52 is raised. Next, when the substrate P supported by the substrate supporting pins 5 lb is placed on the placing portion 20 of the tray T1 as shown in Fig. 12 (b), the support portion control portion 72 shown in Fig. 15 causes the support portion to The actuator 71 vibrates at a predetermined frequency. Then, as shown in Fig. 15, the vibration of the support portion actuator 71 is transmitted to the tray support portion 52, and the tray support pin 52b vibrates at a predetermined frequency. After the tray support pin 52b vibrates at a predetermined frequency, the vibration is transmitted to the tray T1 through the abutting portion 52e, and the first! In the embodiment, the placing portion 20 of the tray T1 vibrates at a predetermined frequency. As a result, in the same manner as in the first embodiment shown in Fig. 12(b), the bending of the substrate p is removed, and the substrate p is flattened. 28 201132570

i2保持拖盤τΐ 並舉起時，以於圖14顯示之手控制部62使手致動器6ι之When i2 holds the tray τΐ and lifts up, the hand control portion 62 shown in Fig. 14 causes the hand actuator 6i

於是’升降馬達63b及線性馬達64a之振動傳達至搬送 手12，搬送手12以既定之振動頻率於與拖盤τι之載置部 20a之方向振動。搬送 之振動透過抵接部 1 20以既定之振動頻率 20之上面20a交又之方向及沿上面： 手12以既定之頻率振動後，搬送手 17傳達至拖盤T1，拖盤T1之載置部 於各方向振動。 1實施形態同樣地，基 於是，與於圖12(c)顯示之第 板P之下面與拖盤T1之載置部20之上面20a滑動，基板p 之應力開放’防止基板P之彎曲。另外，如圖13(a)〜圖 13 (c)所示，於將載置於拖盤T1之基板p交接至基板保 持具9時亦可與第1實施形態同樣地防止基板p之彎曲。 如以上說明，利用本實施形態，不僅可獲得與第1實 施形態同樣之效果，且無於拖盤T1設振動致動器VA或拖 盤側供電部ET之必要，故可使基板搬送裝置7之構成簡潔。 其次’針對本發明之第3實施形態，援用圖1〜圖1 3， 使用圖16及圖17說明。本實施形態之基板搬送裝置几係 振動產生部不設於拖盤（基板支持構件）T2而設於搬送機 器手4b及搬出入部（出入口部）5b之方面與上述之第1實 施形態之基板搬送裝置7不同。其他方面與第1實施形態 29 201132570 之基板搬送裝置7相同，故對相同之部分賦予相同之符號 而說明省略。 圖16係顯示本實施形態之搬送手12及拖盤T2之概略 構成之圖，（a )係對應於沿圖2之A-A，線之剖面之示意剖 面圖，（b)係（a)之αι部之擴大圖。圖17係說明本實 施形態之托盤支持部52及拖盤Τ2之概略構成之圖，（a ) 係對應於沿圖4之B-B ’線之剖面之示意剖面圖，（b )係（a ) 之冷1部之擴大圖。 如圖16(a)及圖16(b)所示，本實施形態之拖盤η 在不設有於圖7(a)及7 (b)顯示之振動致動器VA及拖 盤側供電部ET方面與已於第1實施形態說明之拖盤τ相 異，其他方面則設為與拖盤T相同。 如圖16(a)及圖16(b)所示，本實施形態之基板搬 送裝置7b具備使搬送手12振動而使拖盤T2振動之加振部 V2。加振部V2具有設於搬送手12之複數振動致動器（振 動產生部）V A1、設於搬送手12之手側供電部（供電部） EH2。此外，加振部V2係如圖n(a)及n(b)所示，具 有設於搬出入部5b之拖盤支持部52之振動致動器（振動 產生部）VA2、支持部側供電部（供電部）Ep2。 如圖16(a)及圖16(b)所示，振動致動器VA1係使 用與第1 f施形態之振動致動g VA 者，土里入搬送手 12之内部而固定於搬送手12。振動致動器vai係分別設於 支持拖盤T2之載置部20之兩侧部丄8、i 8之一對爪狀之部 分之雙方。 30 201132570 手側供電部EH2係由設於搬送機器手4b之電源部（圖 示略）、手側配線14b構成。手側配線14係藉由一端側連 接於搬送機器手4b之不圖示之電源部來將振動致動器vai 與端子部VAT1電氣連接。 此外’於搬送手12之上面設有與上述之第2實施形態 同樣之複數抵接部1 7。在本實施形態，抵接部1 7係設於振 動致動器VA1之附近，配置為與振動致動器vai平面地重 疊。換言之’於本實施形態中，振動致動器VA1係設於抵 接部1 7之附近’配置於與抵接部1 7平面地重疊之位置。 如圖17(a)及圖17(b)所示，振動致動器VA2係使 用與第1實施形態之振動致動器VA同樣者，埋入托盤支持 銷52b而固疋於托盤支持銷52b。支持部側供電部ep2係由 設於搬出入部5b之電源部（圖示略）、支持部側配線57b 構成。支持部側配線57b係藉由一端側連接於振動致動器 V A 2而另一端側連接於搬出入部5 b之不圖示之電源部來將 振動致動器VA2與電源部電氣連接。 此外’於托盤支持銷52b之上面設有與上述之第2實 施形態同樣之抵接部52e。在本實施形態，抵接部52e係設 於振動致動器VA2之附近，配置為與振動致動器VA2平面 地重疊。換言之，於本實施形態中，振動致動器VA2係設 於抵接部52e之附近，配置於與抵接部52e平面地重疊之位 置。 在本實施形態’在如圖12(a)〜圖12(b)所示使由 基板支持銷51b支持之基板p載置於拖盤T2之載置部 31 201132570 時，如圖17(a)及圖17(b)所示，從支持部側供電部Ep2 對振動致動器VA2供給電力，使振動致動器VA2以既定之 頻率振動。於是，如圖17 (b)所示，振動致動器VA2使 托盤支持銷52b以既定之頻率振動。 托盤支持銷52b以既定之頻率振動後，該振動透過抵 接部52e傳達至拖盤T2，與第i實施形態及第2實施形態 同樣地’拖盤T2之載置部20以既定之振動頻率振動。藉 此，與於圖12 ( b )顯示之第i實施形態同樣地，除去基板 P之彎曲’基板P變平坦。 在此’在本實施形態’振動致動器VA2係設於抵接部 52e之附近，配置於與抵接部52e平面地重疊之位置。因此， 防止振動之減衰，可將於振動致動器VA2產生之振動能量 效率良好地傳達至拖盤T2與基板p。 此外’如圖12 ( c )所示’於以搬送手12保持拖盤T2 並舉起時，以於圖16(a)及圖l6(b)顯示之手側供電部 EH2對振動致動器VA2供給電力，使振動致動器VA1以既 定之頻率振動。振動致動器VA1以既定之頻率振動後，搬 送手12以既定之頻率振動。搬送手12以既定之頻率振動 後’搬送手12之振動透過抵接部1 7傳達至拖盤T2，拖盤 T2之載置部20以既定之振動頻率振動。 於是’與於圖12 ( c )顯示之第1實施形態同樣地，基 板P之下面與拖盤T2之載置部20之上面20a滑動，基板P 之應力開放，防止基板P之彎曲。另外，如圖13(a)〜圖 13 (c)所示，於將載置於拖盤T2之基板p交接至基板保 32 201132570 持具9時亦可與第1實施形態同樣地防止基板p之臀曲。 在此’在本實施形態’如圖16(a)及圖16(b)所示， 振動致動器VA1係設於抵接部17之附近，配置於與抵接部 17平面地重疊之位置。因此，防止振動之減衰，可將於振 動致動器VA1產生之振動能量效率良好地傳達至拖盤T2 與基板Ρ。 如以上說明，利用本實施形態，不僅可獲得與第1實 施形態同樣之效果，且無於拖盤Τ2設振動致動器VA或拖 盤側供電部ΕΤ之必要，故可使基板搬送裝置7之構成簡 潔。此外，與第2實施形態比較，搬送手12及拖盤支持部 52之移動中亦可對拖盤Τ2繼續給予一樣之振動。 另外’在本實施形態雖已說明分別具備複數振動致動 器VA1、VΑ2之構成，但此等只要於搬送手i 2及拖盤支持 部52各設置少1個即可。 又，作為上述實施形態之基板P，不僅適用顯示器元件 用之玻璃基板，亦適用於半導體元件製造用之半導體晶 圓、薄膜磁頭用之陶瓷晶圓、或曝光裝置所使用之光罩或 標線片之原版（合成石英、矽晶圓）等。 又，作為曝光裝置，除了適用使光罩M與基板p同步 移動以㈣光罩M之圖案之曝光用光IL使基板ρ掃描曝光 之步進掃也方式之掃描型曝光裝置（掃描步進器）外，亦 可適用於在光罩M與基板P靜止之狀態下使光罩Μ之圖案 —次曝光、使基板Ρ依序步進移動之步進重複方式之投影 曝光裝置（步進器）。 33 201132570 又，本發明亦可適用於美國專利第6341007號說明書、 美國專利第6208407號說明書、美國專利第6262796號說 明書等所揭示之具備複數個基板載台之雙載台型曝光裝 置。 又，本發明亦可適用於美國專利第6897963號說明書、 歐洲專利申請公開第1713113號說明書等所揭示之具備保 持基板之基板載台及不保持基板、載置形成有基準標記之 基準構件及/或各種光電感測器之測量載台之曝光裝置。 又，可採用具備複數個基板載台及測量載台之曝光裝置。 此外，上述實施形態中，雖使用在光透射性基板上形 成既定遮光圖案（或相位圖案、減光圖案）之光透射型光 罩’但替代此光罩，使用例如美國專利第6778257號說明 書所揭示之根據待曝光圖案之電子資料形成透射圖案或反 射圖案、或發光圖案之可變成形光罩（亦稱為電子光罩' 主動光罩、或影像產生器）亦可。又，替代具備非發光型 影像顯示元件之可變成形光罩’具備包含自發光型影像顯 示元件之圖案形成裝置亦可。 上述實施形態之曝光裝置，係以保持既定機械精度、 電氣精度、光學精度之方式組裝包含本案申請專利範圍記 載之各構成要素之各種子系統來製造。為了確保該等各種 精度，在該組裝前後對各種光學系統進行用以達成光學精 度之調整，對各種機械系統進行用以達成機械精度之調 整，對各種電氣系統進行用以達成電氣精度之調整。 從各種子系統至曝光裝置之組裝步驟，包含各種子系 34 201132570 統相互之機械連接、電路之配線連接、氣壓迴路之配管連 接等在從各種子系，统至曝光裝置之組裝步驟之前，當然 有各子系統個別之組裂步驟。在各種子系統至曝光裝置之 >·且裝步驟結束後’進行綜合調整以確保曝光裝置整體之各 種精度。此外，曝光装置之製造以在溫度及真空度等受到 管理之無塵室進行為佳。 半導體元件等之微;^件’如圖18所示，係經由下述步 驟製造，即進行微元件之功能/性能設計之步驟2〇1、根據 該設計步驛製作光罩（標線片）之步驟202、製造元件之基 材即基板之步驟203、包含基板處理（曝光處理）（包含根 據上述實施形態使用光罩之圖案以曝光用光使基板曝光之 動作、及使曝光後基板（感光劑）顯影之動作）之基板處Then, the vibration of the elevating motor 63b and the linear motor 64a is transmitted to the transporting hand 12, and the transporting hand 12 vibrates in the direction of the placing portion 20a of the tray τ1 at a predetermined vibration frequency. The transmitted vibration passes through the abutting portion 120 at a predetermined vibration frequency 20 on the upper surface 20a and in the direction and along the upper surface: the hand 12 vibrates at a predetermined frequency, and the transport hand 17 transmits to the tray T1, and the tray T1 is placed. The part vibrates in all directions. In the same manner as in the first embodiment, the lower surface of the first plate P shown in Fig. 12(c) slides on the upper surface 20a of the mounting portion 20 of the tray T1, and the stress of the substrate p is opened to prevent the substrate P from being bent. Further, as shown in Fig. 13 (a) to Fig. 13 (c), when the substrate p placed on the tray T1 is transferred to the substrate holder 9, the bending of the substrate p can be prevented in the same manner as in the first embodiment. As described above, according to the present embodiment, not only the same effects as those of the first embodiment but also the vibration actuator VA or the tray-side power supply unit ET are provided in the tray T1, so that the substrate transfer device 7 can be provided. The composition is simple. Next, the third embodiment of the present invention will be described with reference to Figs. 16 and 17 using Figs. 1 to 13 . In the substrate transfer apparatus of the present embodiment, the plurality of vibration generating units are not provided in the tray (substrate supporting member) T2, and are provided in the transporting robot 4b and the loading/unloading portion (porting and exiting portion) 5b, and the substrate transporting in the first embodiment described above. The device 7 is different. The other points are the same as those of the substrate transfer device 7 of the first embodiment 29 201132570. Therefore, the same reference numerals will be given to the same parts, and description thereof will be omitted. Fig. 16 is a view showing a schematic configuration of the transport hand 12 and the tray T2 of the present embodiment, wherein (a) corresponds to a schematic cross-sectional view taken along line AA of Fig. 2, and (b) is a (a) An enlarged picture of the Ministry. Fig. 17 is a view showing a schematic configuration of the tray supporting portion 52 and the tray 2 in the embodiment, wherein (a) is a schematic sectional view corresponding to a cross section taken along line BB' of Fig. 4, and (b) is a type (a) An enlarged picture of the cold one. As shown in Fig. 16 (a) and Fig. 16 (b), the tray η of the present embodiment is not provided with the vibration actuator VA and the tray side power supply unit shown in Figs. 7(a) and 7(b). The ET is different from the tray τ which has been described in the first embodiment, and is otherwise the same as the tray T. As shown in Fig. 16 (a) and Fig. 16 (b), the substrate transfer device 7b of the present embodiment includes a vibrating portion V2 that vibrates the transporting hand 12 to vibrate the tray T2. The oscillating portion V2 includes a plurality of vibration actuators (vibration generating portions) V A1 provided in the transporting hand 12 and a hand side power feeding portion (power feeding portion) EH2 provided in the transporting hand 12. In addition, as shown in FIGS. n(a) and n(b), the oscillating portion V2 includes a vibration actuator (vibration generating portion) VA2 and a support portion side power supply portion provided in the tray support portion 52 of the carry-in/out portion 5b. (Power supply unit) Ep2. As shown in Fig. 16 (a) and Fig. 16 (b), the vibration actuator VA1 is activated by the vibration of the first f-type embodiment, and is fixed to the transfer hand 12 by the inside of the soil transfer hand 12 . The vibration actuators vai are respectively provided on both of the claw-like portions of the both side portions 、8, i8 of the mounting portion 20 supporting the tray T2. 30 201132570 The hand side power supply unit EH2 is composed of a power supply unit (not shown) provided on the transport robot 4b and a hand side wiring 14b. The hand side wiring 14 is electrically connected to the terminal portion VAT1 by a one end side connected to a power supply unit (not shown) of the transport robot 4b. Further, a plurality of abutting portions 17 similar to those of the second embodiment described above are provided on the upper surface of the transporting hand 12. In the present embodiment, the abutting portion 17 is disposed in the vicinity of the vibrating actuator VA1, and is disposed to overlap the vibration actuator vai in a plane. In other words, in the present embodiment, the vibration actuator VA1 is disposed in the vicinity of the abutting portion 17 and is disposed at a position overlapping the abutting portion 17 in a plane. As shown in Fig. 17 (a) and Fig. 17 (b), the vibration actuator VA2 is similar to the vibration actuator VA of the first embodiment, and is embedded in the tray support pin 52b to be fixed to the tray support pin 52b. . The support unit side power supply unit ep2 is composed of a power supply unit (not shown) provided in the carry-in/out unit 5b and a support unit side wiring 57b. The support unit side wiring 57b electrically connects the vibration actuator VA2 and the power supply unit by a power supply unit (not shown) whose one end side is connected to the vibration actuator V A 2 and whose other end side is connected to the carry-in/out part 5 b. Further, the abutting portion 52e similar to the above-described second embodiment is provided on the upper surface of the tray support pin 52b. In the present embodiment, the contact portion 52e is provided in the vicinity of the vibration actuator VA2, and is disposed to overlap the vibration actuator VA2 in a plane. In other words, in the present embodiment, the vibration actuator VA2 is disposed in the vicinity of the contact portion 52e, and is disposed at a position that is planarly overlapped with the contact portion 52e. In the present embodiment, when the substrate p supported by the substrate supporting pin 51b is placed on the mounting portion 31 201132570 of the tray T2 as shown in Figs. 12(a) to 12(b), as shown in Fig. 17(a). As shown in Fig. 17 (b), electric power is supplied from the support portion side power supply portion Ep2 to the vibration actuator VA2, and the vibration actuator VA2 is vibrated at a predetermined frequency. Then, as shown in Fig. 17 (b), the vibration actuator VA2 causes the tray support pin 52b to vibrate at a predetermined frequency. After the tray support pin 52b vibrates at a predetermined frequency, the vibration is transmitted to the tray T2 through the abutting portion 52e, and the mounting portion 20 of the tray T2 has a predetermined vibration frequency as in the first embodiment and the second embodiment. vibration. As a result, in the same manner as in the i-th embodiment shown in Fig. 12 (b), the substrate P is removed from the bending of the substrate P. In the present embodiment, the vibration actuator VA2 is disposed in the vicinity of the contact portion 52e, and is disposed at a position that is planarly overlapped with the contact portion 52e. Therefore, the vibration energy generated by the vibration actuator VA2 can be efficiently transmitted to the tray T2 and the substrate p without preventing the vibration from being degraded. Further, as shown in FIG. 12(c), when the transporting hand 12 holds the tray T2 and lifts up, the hand-side power supply unit EH2 shown in FIGS. 16(a) and 16(b) is attached to the vibration actuator VA2. Electric power is supplied to cause the vibration actuator VA1 to vibrate at a predetermined frequency. After the vibration actuator VA1 vibrates at a predetermined frequency, the conveyance hand 12 vibrates at a predetermined frequency. When the conveyance hand 12 vibrates at a predetermined frequency, the vibration of the conveyance hand 12 is transmitted to the tray T2 through the abutment portion 17 and the placement portion 20 of the tray T2 vibrates at a predetermined vibration frequency. Then, similarly to the first embodiment shown in Fig. 12 (c), the lower surface of the substrate P slides on the upper surface 20a of the mounting portion 20 of the tray T2, and the stress of the substrate P is opened to prevent the substrate P from being bent. Further, as shown in FIG. 13(a) to FIG. 13(c), when the substrate p placed on the tray T2 is transferred to the substrate holder 32 201132570 holder 9, the substrate p can be prevented in the same manner as in the first embodiment. The hips. Here, in the present embodiment, as shown in FIGS. 16(a) and 16(b), the vibration actuator VA1 is disposed in the vicinity of the abutting portion 17, and is disposed at a position overlapping the abutting portion 17 in a plane. . Therefore, the vibration energy generated by the vibration actuator VA1 can be efficiently transmitted to the tray T2 and the substrate 防止 by preventing the vibration from being reduced. As described above, according to the present embodiment, not only the same effects as those of the first embodiment but also the vibration actuator VA or the tray-side power supply unit 设 are provided in the tray 2, so that the substrate transfer device 7 can be provided. The composition is simple. Further, in comparison with the second embodiment, the movement of the transport hand 12 and the tray support portion 52 can continue to give the same vibration to the tray Τ2. In the present embodiment, the configuration in which the plurality of vibration actuators VA1 and V2 are provided is described. However, it is only necessary to provide one of the transporter i 2 and the tray support unit 52. Further, the substrate P of the above-described embodiment is applicable not only to a glass substrate for a display element but also to a semiconductor wafer for semiconductor element manufacturing, a ceramic wafer for a thin film magnetic head, or a photomask or a marking for use in an exposure apparatus. The original version of the film (synthetic quartz, silicon wafer) and so on. Further, as the exposure device, a scanning type exposure device (scanning stepper) in which a stepping scan of the substrate p is performed by exposing the exposure light IL of the pattern of the mask M to the exposure mask IL in synchronization with the substrate p is applied. In addition, it can also be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the mask Μ is patterned in a state where the reticle M and the substrate P are stationary, and the substrate Ρ is sequentially stepped and moved. . Further, the present invention is also applicable to a dual stage type exposure apparatus having a plurality of substrate stages as disclosed in the specification of US Pat. No. 6,431,007, the specification of US Pat. No. 6,208,407, and the specification of US Pat. No. 6,262,796. Further, the present invention is also applicable to a substrate stage having a holding substrate and a substrate holding the substrate, and a reference member on which a reference mark is formed, and/or disclosed in the specification of the Japanese Patent No. 6897963, and the like. Or an exposure device for the measurement stage of various photo-inductors. Further, an exposure apparatus including a plurality of substrate stages and a measurement stage can be employed. Further, in the above-described embodiment, a light-transmitting type reticle that forms a predetermined light-shielding pattern (or a phase pattern or a light-reducing pattern) on a light-transmitting substrate is used. Instead of the reticle, for example, the specification of US Pat. No. 6,778,257 is used. A variable shaped reticle (also referred to as an electronic reticle 'active reticle, or image generator) that forms a transmissive pattern or a reflective pattern or a luminescent pattern according to the electronic material of the pattern to be exposed may also be disclosed. Further, instead of the variable shaping mask 211 having a non-light-emitting image display element, a pattern forming device including a self-luminous type image display element may be provided. The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements of the patent application scope in a manner that maintains predetermined mechanical precision, electrical precision, and optical precision. In order to ensure these various precisions, various optical systems are used to adjust the optical precision before and after the assembly, and various mechanical systems are used to adjust the mechanical precision, and various electrical systems are used to achieve electrical precision adjustment. The assembly steps from the various subsystems to the exposure device include, of course, the mechanical connection of the various subsystems 34 201132570, the wiring connection of the circuit, the piping connection of the pneumatic circuit, etc., before the assembly steps from the various subsystems to the exposure device. There are individual splitting steps for each subsystem. After various sub-systems to the exposure apparatus >· and after the loading step is finished, comprehensive adjustment is made to ensure various precisions of the entire exposure apparatus. Further, the production of the exposure apparatus is preferably carried out in a clean room in which temperature and vacuum are managed. As shown in FIG. 18, the semiconductor device or the like is manufactured by the following steps: step 2 of performing the function/performance design of the micro component, and manufacturing a photomask (reticle) according to the design step. Step 202, a step 203 of manufacturing a substrate as a substrate, and a substrate processing (exposure treatment) (including an operation of exposing the substrate by exposure light using a pattern of a photomask according to the above embodiment, and a substrate after exposure (photosensitive) Substrate)

理步驟204、元件*且裝+1¾ γ A 千、，且裝步驟（包含切割步驟、接合步驟、封 裝步驟等之加工程序）2〇5、以及檢查步驟鳩等。此外， :步驟204 ’包含藉由使感光劑顯影，形成與光罩之圖案對 :之曝光圖案層（顯影後感光劑之層），透過該曝光圖案 層對基板加工之動作。 〃 此外，上述實施形態之要件可適當加以組合。又亦 :使用-部分之構成要素之情形…在法令容許之範 、内，援引在上述實施形態引用之關於曝光裝置等之所有 么開公報及美國專狀㈣作為本說明f記載卜部分。 【圖式簡單說明】 圖1係顯示曝光裝置之整體概略的剖面俯視圖。 35 201132570 圖2係搬送機器手的外觀立體圖。 圖3係用以說明搬送機器手之動作的立體圖。 圖4係顯示搬出入部之概略構成的側視圖。 圖5係顯示托盤之平面構造的俯視圖。 圖6係顯示托盤收容於基板保持具之槽部之狀態的部 分側剖面圖。 圖7係顯示第丨實施形態之拖盤及搬送手之概略構成 之剖面圖。 圖8係顯示第1實施形態之拖盤及搬出入部之概略構 成之剖面圖。 圖9係以顏色之濃淡顯示基板之彎曲的俯視圖。 圖10(a)〜（c)係說明習知曝光裝置之基板交接步 驟的示意圖。 圖11(a)〜（c)係說明習知曝光裝置之基板交接步 驟的示意圖。 圖12 ( a )〜（c )係說明本實施形態之曝光裝置之基 板交接步驟的示意圖。 圖13 ( a )〜（c )係說明本實施形態之曝光裝置之基 板交接步驟的示意圖。 圖14係顯示第2實施形態之拖盤及搬送手之概略構成 之剖面圖。 圖1 5係顯示第2實施形態之拖盤及搬出入部之概略構 成之剖面圖。 圖16係顯示第3實施形態之拖盤及搬送手之概略構成 36 201132570 之剖面圖。 圖17係賴不第3實施形態之拖盤及搬出入部之概略構 成之剖面圖。 圖w係說明本發明實施形態之元件製造方法的流程 【主要元件符號說明】 34、 4a、4b5、 5a、5b 7 ' 7a > 7b 9 12 16、17 18 20 曝光裝置 曝光裝置本體 搬送機器手（搬送部） 搬出入部（出入口部） 基板搬送裝置 基板保持具 搬送手 抵接部 側部 載置部 20a 30 上面（基板支持面） 槽部 31 52b 保持部（保持具部） 拖盤支持銷（支持部） 52c ' 52e 61 抵接部 手致動器（致冑器、振動產生部) 手控制部（控制部、振動產生部） 37 62 201132570 71 支持部致動器（致動器'振動產生部） 72 支持部控制部（控制部、振動產生部） EH、EH2 手側供電部（供電部） EP、EP2 支持部側供電部（供電部） ET 拖盤側供電部（供電部） IL 曝光用光 P 基板 T 、 ΤΙ 、 T2 拖盤（基板支持構件、基板支持裝置） V、VI、V2 加振部 VA、VA1、VA2 振動致動器（振動產生部） 38Step 204, component * and +13⁄4 γ A thousand, and a loading step (including a processing procedure of a cutting step, a bonding step, a sealing step, etc.) 2〇5, an inspection step, and the like. Further, the step 204' includes an operation of forming the substrate with the pattern of the mask by the development of the photosensitive layer (the layer of the photosensitive agent after development), and processing the substrate through the exposure pattern layer. 〃 Further, the requirements of the above embodiments can be combined as appropriate. In addition, in the case of the use of the component of the - part, the publication of the above-mentioned embodiment regarding the exposure apparatus and the U.S. specification (4) are cited as the description of the description f. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional plan view showing an overall schematic view of an exposure apparatus. 35 201132570 Figure 2 is a perspective view of the appearance of the transport robot. Fig. 3 is a perspective view for explaining the operation of transporting the robot hand. Fig. 4 is a side view showing a schematic configuration of a carry-in/out portion. Figure 5 is a plan view showing the planar configuration of the tray. Fig. 6 is a partial side sectional view showing a state in which the tray is housed in the groove portion of the substrate holder. Fig. 7 is a cross-sectional view showing a schematic configuration of a tray and a transporting hand according to a third embodiment. Fig. 8 is a cross-sectional view showing a schematic configuration of a tray and a loading/unloading unit according to the first embodiment. Fig. 9 is a plan view showing the curvature of the substrate in shades of color. Fig. 10 (a) to (c) are views showing a substrate transfer step of a conventional exposure apparatus. Fig. 11 (a) to (c) are views showing a substrate transfer step of a conventional exposure apparatus. Fig. 12 (a) to (c) are views showing the step of transferring the substrate of the exposure apparatus of the embodiment. Fig. 13 (a) to (c) are views showing the step of transferring the substrate of the exposure apparatus of the embodiment. Fig. 14 is a cross-sectional view showing a schematic configuration of a tray and a transporting hand in the second embodiment. Fig. 15 is a cross-sectional view showing a schematic configuration of a tray and a loading/unloading portion according to a second embodiment. Fig. 16 is a cross-sectional view showing the schematic configuration of the tray and the transporting hand of the third embodiment 36 201132570. Fig. 17 is a cross-sectional view showing a schematic configuration of a tray and a loading/unloading portion according to a third embodiment. Figure w is a flow chart for explaining a component manufacturing method according to an embodiment of the present invention. [Main component symbol description] 34, 4a, 4b5, 5a, 5b 7 ' 7a > 7b 9 12 16 , 17 18 20 Exposure device Exposure device body transport robot (Transporting unit) The loading and unloading unit (the entrance and exit unit) The substrate transporting device substrate holder transporting the hand abutting portion side mounting portion 20a 30 The upper surface (substrate supporting surface) The groove portion 31 52b The holding portion (the holder portion) The tray support pin ( Supporting part) 52c ' 52e 61 Abutting hand actuator (actuator, vibration generating unit) Hand control unit (control unit, vibration generating unit) 37 62 201132570 71 Support unit actuator (actuator 'vibration generation Part 72 Control unit control unit (control unit, vibration generation unit) EH, EH2 Hand side power supply unit (power supply unit) EP, EP2 Support unit side power supply unit (power supply unit) ET Tray side power supply unit (power supply unit) IL exposure Light P substrate T, 、, T2 tray (substrate support member, substrate support device) V, VI, V2 vibration absorbing unit VA, VA1, VA2 vibration actuator (vibration generating unit) 38

Claims (1)

201132570 七、申請專利範圍： 1·一種基板搬送裝係將載置於基板支持構件之基板 與該基板支持構件一起搬送，其特徵在於具備： 使載置有前述基板之前述基板支持構件振動之加振 保持前述加振部使振動 搬送部。 之前述基板支持構件並移動 之 2.如申請專利範圍第1項 公，队观疋衣直，具中，前述 加振部包含設於前述基板支持構件並基於供給電力使前述 基板支持構件產生振動之至少1個振動產生部。 3·如申請專利範圍第2項之基板搬送裝置，其中，前述 加振部包含對前述振動產生部進行電力供給之供電部，該 供電口P之至少一部分係設於前述搬送部。 4.如申請專利範圍第2項之基板搬送裝置，苴中，具 備：支持載置有前述基板之前述基板支持構件之出入口部、； 前述加振部包含對前述振動產生部進行電力供給之供 。」亥供電部之至少一部分係設於前述出入口部； 刖述搬送部係保持支持於前诚屮a 持構件並移動。《持於_出人口部之前述基板支 5.如申請專利範圍 出入口部具有分別支持 數支持部； 第4項之基板搬送裝置，其中，前述 月'J述基板支持構件之不同位置之複 前述複數支持部係 述基板支持構件上之前 配置於不與該複數支持部支持之前 述振動產生部在俯視重疊之位置。 39 201132570 6. 如申請專利範圍第i項之基板搬送裝置，丨中，前述 加振部包含基於供給電力使前述搬送部之中保持前述基板 支持構件之部分產生振動之至少1個振動產生部。 7. 如申請專利範圍第6項之基板搬送裝置，其中，前述 搬送部具備保持前述基板支持構件之搬送手、使前述搬送 手移動之致動器； 前述振動產生部具有控制前述致動器使前述搬送手振 動之控制部* "" 8.如申請專利範圍第6項之基板搬送裝置，其中，前述 搬送部具備保持前述基板支持構件之搬送手； 前述振動產生部具有設於前述搬送手且使前述搬送手 振動之至少1個振動致動器。 ” 9·如申請專利範圍第8項之基板搬送裝置，其中，前述 搬送:進—步具備支持前述基板支持構件之複數抵接部； 前述振動致動器係配置於前述抵接部之附近。 以如申請專利範圍第7至9項中任—項之基板搬送裝 ，其中，前述致動器係設為可將前述搬送手於沿前述美 板支持構件之基板支持面之方向及與前述基板切面= 之方向之至少一方移動。 u·如申請專利範圍第1項之基板搬送裝置，其中，具 備：^持載置有前述基板之前述基板支持構件之出入口部： 二則述加振部包含設於前述出入口部並基於供給電力使 刖述出入口部產生振動之至少1個振動產生部。 12·如申請專利範圍第n項之基板搬送裝置，其中，前 201132570 之 述出入口部具有分別支持前述基板支 複數支持部； 了僻什I不冋位置 迚振動產生部具有設於前述支持 振動之至少1個振動致動器。 使…持部 中：屮申請專利範圍第11或12項之基板搬送裝置，- 位置之複數：二部具備分別支持前述基板支持構件之不同 _ 支持部、使前述支持部移動之致動器； 前述振動產生部具有控制前 ’ 動之控制部。 〖蚁動器使則迷支持部振 置，利範圍第1至13項中任-項之基板搬送裝 f其中，别述搬送部使前述基板支持構件往保持前j 之基板保持具移動，將該基 义“土 交接至前述基板保持具。 冑件支持之則述基板 丨5.如申請專利範圍第14項之基板搬送裝置， 义 述搬=將前述基板支持構件交接至前述基板保持且： 16.如申請專利範圍第15項之 ” 述搬送部係對前述基板保持具之中載置前送述裝基置，其令，前 部交接前述基板，對前述基板保持具之中與前述 不同之部分交接前述基板支持構件。 〃部 17·如申請專利範圍第16項之基板 述搬送部係對前述基板保持具之 、置，其中，前 狀之槽部交接前述基板支持構件。4保持具部設為槽 18.如申請專利範圍第2至17 置”搬送部係保持前述基板支持二裝 201132570 種曝光裝置，對基板保持具保持之基板照射曝光 用光而使前述基板曝光，其特徵在於： 具備對前述基板保持具搬送前述基板之申請專利範圍 第1至18項申任一項之基板搬送裝置。 20.種基板支持裝置，支持基板，其特徵在於具有： 載置前述基板之載置部； 設於前述載置部且使前述載置部振動之振動產生部。 21·一種元件製造方法，包含： 使用申請專利範圍第19項之曝光裝置使該基板曝光之 動作；以及 基於曝光結果處理曝光後之前述基板之動作。 八、圖式： (如次頁） 42201132570 VII. Patent application scope: 1. A substrate transfer apparatus transports a substrate placed on a substrate supporting member together with the substrate supporting member, and is characterized in that: the vibration of the substrate supporting member on which the substrate is placed is added The vibrating portion is vibrated to hold the vibrating portion. The substrate supporting member is moved and moved as described in the first aspect of the patent application. The vibration absorbing portion includes the substrate supporting member and generates vibration of the substrate supporting member based on the supplied electric power. At least one vibration generating unit. 3. The substrate transfer apparatus according to the second aspect of the invention, wherein the vibrating unit includes a power supply unit that supplies electric power to the vibration generating unit, and at least a part of the power supply port P is connected to the transport unit. 4. The substrate transfer apparatus according to the second aspect of the invention, further comprising: an inlet/outlet portion that supports the substrate supporting member on which the substrate is placed; and the vibration portion includes a power supply to the vibration generating unit . At least a part of the Hai power supply unit is provided at the entrance/exit portion; the transport unit is held and supported by the front member. "The above-mentioned substrate support held by the _ population section 5. If the patent application area entrance and exit portion has a support number support portion respectively; the substrate transfer device of the fourth item, wherein the above-mentioned different positions of the substrate support member are the aforementioned The plurality of support portions are disposed at positions where the vibration generating portions that are not supported by the plurality of support portions are overlapped in a plan view before being arranged on the substrate supporting member. In the case of the substrate transfer apparatus of the above-mentioned item, the oscillating unit includes at least one vibration generating unit that vibrates a portion of the transport unit that holds the substrate supporting member based on the supplied electric power. 7. The substrate transfer device according to claim 6, wherein the transfer unit includes a transfer hand that holds the substrate supporting member and an actuator that moves the transfer hand; and the vibration generating unit controls the actuator The substrate conveying device of the sixth aspect of the invention, wherein the conveying unit includes a conveying hand that holds the substrate supporting member, and the vibration generating unit is provided in the conveying unit. At least one vibration actuator that vibrates the transfer hand by hand. The substrate transfer apparatus of claim 8, wherein the transporting step further includes a plurality of abutting portions for supporting the substrate supporting member; and the vibration actuator is disposed in the vicinity of the abutting portion. The substrate transfer device according to any one of claims 7 to 9, wherein the actuator is configured to move the hand in a direction along a substrate supporting surface of the sheet supporting member and the substrate The substrate transfer device of the first aspect of the invention, wherein the substrate transfer device of the first aspect of the invention includes: an inlet/outlet portion of the substrate supporting member on which the substrate is placed: At least one vibration generating unit that is provided in the inlet/outlet portion and that causes the inlet portion to vibrate based on the supply of electric power. The substrate transfer device according to the nth aspect of the patent application, wherein the front entrance portion of the front 201132570 has the aforementioned support The substrate support number support portion; the remote vibration position generating portion has at least one vibration actuator provided to support the vibration. In the holding unit: 基板 the substrate transfer device of claim 11 or 12, - the plurality of positions: the two portions each having a different support for the substrate supporting member, a support portion, and an actuator for moving the support portion; The generating unit has a control unit that controls the front side. The ant-moving unit is configured to vibrate the support unit, and the substrate transfer unit f of any one of items 1 to 13 is provided. The substrate holder is moved to maintain the front j, and the basic "soil" is transferred to the substrate holder. The substrate is supported by the substrate. 5. The substrate transfer device according to claim 14 of the patent application, the transfer of the substrate support member to the substrate is maintained and: 16. As described in claim 15 The transport unit attaches the substrate to the substrate before the substrate holder is placed, and the substrate is transferred to the front portion, and the substrate supporting member is transferred to the substrate holder from the substrate holder. The substrate transfer unit according to the sixteenth aspect of the patent application is attached to the substrate holder, wherein the front groove portion is transferred to the substrate supporting member. The holder portion is a groove 18. As disclosed in the second patent application. In the case where the substrate is supported by the substrate holding device, the substrate is exposed to the exposure light and the substrate is exposed, and the substrate is provided with the substrate holder. A substrate transfer apparatus according to any one of claims 1 to 18. A substrate supporting device, comprising: a mounting portion on which the substrate is placed; and a vibration generating portion that is provided on the mounting portion and vibrates the mounting portion. A method of manufacturing a device comprising: exposing the substrate using an exposure apparatus of claim 19; and processing the exposure of the substrate based on an exposure result. Eight, the pattern: (such as the next page) 42
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