TWI593617B - Detaching apparatus - Google Patents

Description

Stripping device

The present invention relates to a peeling device for peeling off two sheet-like bodies that are in close contact with each other.

As a technique for forming a specific pattern or film on a plate-like body such as a glass substrate or a semiconductor substrate, a pattern or a film (hereinafter referred to as a "pattern" or the like) carried on another plate-like body is transferred to the substrate. . In this technique, it is necessary to peel two sheets of the plate-like body and to transfer the pattern or the like from one to the other, and then peel off the two plate-shaped bodies without damaging the pattern or the like.

For example, Japanese Laid-Open Patent Publication No. 2008-287949 discloses an apparatus for peeling a substrate for forming an element and a substrate for transfer which are in close contact with each other. In this technique, the two substrates to be bonded are held in a horizontal posture, and the upper and lower substrates are moved in the direction of vacuum suction. The upper and lower substrates are respectively adsorbed and held by a plurality of adsorption pads arranged in a dispersed manner.

Such a transfer technique can be applied to various device manufacturing processes, but it is required to be more compactly managed in the peeling process in accordance with the diversification of materials such as patterns, the miniaturization of the pattern, and the enlargement of the substrate. That is, in order to prevent damage of a pattern or the like due to local stress concentration, it is necessary to appropriately manage the progress of peeling. However, in order to respond to such a request, the following problems which should be improved remain in the above prior art.

First, in the above-described prior art, the upper and lower substrates are locally adsorbed by the adsorption pad. Therefore, there is a case where peeling between the substrates occurs locally at the adsorption site, and peeling cannot be performed under appropriate management. In particular, when the adsorption pad is brought into contact with the substrate in a region where a pattern or the like is formed, a strong peeling force acts on the region in a concentrated manner to damage the pattern or the like.

Secondly, in such a peeling device, the two-piece plate-like body in which the two plate-like bodies are closely adhered is carried into the apparatus, and the two plate-shaped bodies are peeled off from each other. At this time, as described above, the local stress concentration to the pattern or the like causes damage to the pattern or the like. Therefore, it is required to construct the device for receiving the adhesion body from the outside without generating such stress. However, the prior art described above does not consider this aspect.

The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide an adhesive body in which a sheet-like body is adhered to a peeling device in which two sheet-like members that are in close contact with each other are peeled off, and the sheet-like body is adhered well. The technology of moving in.

An aspect of the present invention is a peeling apparatus which peels off a first plate-like body and a second plate which has a planar size smaller than that of the first plate-shaped body and which is in close contact with the first plate-shaped body by a film or pattern. In order to achieve the above object, the object includes: a holding platform having an upper surface which is larger than a plane size of the effective area of the first plate-like body in which the film or the pattern is formed, and a horizontal holding surface, so that the first plate-shaped body The other surface of the surface that is in contact with one surface opposite to the surface of the second plate-shaped body abuts on the holding surface to hold the first plate-shaped body, and the peeling device holds the second plate-shaped body so that the second plate-shaped body faces the second plate-shaped body. The first plate-shaped body held by the holding platform is relatively moved away from the first plate-shaped body; the support member has an upper end projecting above the holding surface, and the upper end partially abutting against the first plate shape. The other side of the body supports the first plate-shaped body to be separated from the holding surface; and the lifting device protrudes above the upper surface of the holding surface from the upper end of the supporting member, and the upper end is located below the height of the holding surface Change support member between the lower positions The relative position of the height direction of the surface; and a support member system contact The other surface of the first plate-shaped body is located in a region corresponding to a region in which the second plate-like body is in close contact with one side, and is more outward than the effective region.

In the invention, the first plate-shaped body is separated from the second plate-like body in a state in which the first plate-shaped body is in contact with the holding surface of the holding platform. Therefore, the first plate-shaped body can be peeled off while being held in a planar posture. Therefore, it is possible to prevent a pattern or a film (hereinafter referred to as a "pattern or the like") formed between the first plate-shaped body and the second plate-shaped body from locally causing stress concentration to prevent a pattern due to stress concentration or the like. damage.

Further, when the dense body of the first plate-shaped body and the second plate-shaped body is carried in, the supporting member plays a major role in this case. In other words, the support member can be supported by the self-retaining surface at the upper upper portion, and the first plate-shaped body can be supported in a state of being separated from the holding surface. Therefore, the support member can be received from the outside. Moreover, the support member retreats to a position lower than the lower surface of the holding surface, whereby the adhesion body is delivered from the support member to the holding platform. As described above, the support member has a function of receiving the adhering body that has been carried in from the outside and placing it on the holding platform.

At this time, when the supporting member abuts against the first plate-like body in a region corresponding to the effective region, a large pressing force is applied to the pattern or the like at the abutting portion. Further, when the first plate-shaped body is in contact with the first plate-shaped body and the first plate-shaped body is in contact with the first plate-shaped body, the first plate-shaped body needs to support the entire weight of the close-contact body. 1 When the rigidity of the plate-shaped body is low, there is a case of bending. In the present invention, the support member is supported on the outer side of the effective region in which the first plate-shaped body and the second plate-like body are in close contact with each other and an effective pattern or the like is formed, and the first plate-shaped body is supported. Therefore, such a problem does not occur.

As described above, according to the present invention, it is possible to favorably peel off the two plate-like bodies that are in close contact with each other, and it is possible to satisfactorily perform the reception of the densely-attached body by externally without impairing the pattern or the like.

In the present invention, the holding surface may have a larger planar surface size than the second plate-shaped body, and corresponds to an effective area of the first plate-shaped body placed on the holding surface in the holding surface. The area is located on the outer side of the area corresponding to the second plate-shaped body. The opening protrudes above the holding surface through the opening when the supporting member is in the upper position.

In such a configuration, the entire area of the first plate-shaped body in which the second plate-shaped body is in close contact with the holding surface can be held by the one of the first plate-shaped bodies, and the second plate-shaped body can be more effectively prevented from being peeled off. The first plate-shaped body exerts a local stress. Further, the receiving member that is lifted and lowered by the opening can surely support the receiving contact body on the outer side of the effective region, and the adhering body can be surely placed on the holding surface.

In this case, for example, a plurality of support members and openings may be provided, and the plurality of support members may integrally move up and down with respect to the holding surface. In this manner, for example, the adherend can be lifted and lowered while maintaining the state parallel to the holding surface. Therefore, the receiving body can be stably received from the outside and placed on the holding surface.

Further, for example, it may be configured to include an auxiliary support member that is provided in a region corresponding to the effective region in the holding surface, and is provided with a second opening different from the opening provided in the support member, and from the second The opening protrudes above the holding surface to support the first plate-shaped body. In the effective region, the first plate-like system before the peeling of the member from the second plate-like body is caused to be damaged by a pattern or the like as described above, which is not preferable. However, depending on the type of pattern or the like, there is also a high resistance to such stress. In such a case, it is effective to support the effective region in the effective retention of the adherend.

Further, since the first plate-like system of the monomer after peeling off from the second plate-shaped body is less rigid than the dense body, the deflection of the holding system outside the effective region alone due to its own weight becomes large. In such a case, it is effective to support the first plate-like body in the effective region, and since it is peeled off, there is no adverse effect on the pattern or the like.

Further, for example, a configuration may be further included in which the gap forming member is formed such that the peripheral edge portion of the first plate-shaped body held by the holding platform is displaced upward and is generated between the first plate-shaped body and the holding surface. Void. When the first plate-shaped body is carried out from the holding platform, The support member can be used when the first plate-shaped body is lifted from the holding surface. However, since the first plate-like system is in a state of being pressed against the holding surface by the atmospheric pressure, there is a case where the first plate-shaped body cannot be lifted by simply pressing against the support member. The peripheral member of the first plate-shaped body is displaced upward by the gap forming member, and the outside air is introduced between the first plate-shaped body and the holding surface, whereby the first plate-shaped body can be easily released by releasing the pressure of the atmospheric pressure. Leave away from the holding surface. That is, it is used to realize the configuration in which the first plate-shaped body after peeling is easily carried out.

Further, for example, the holding platform may have a horizontal platform portion having a holding surface on the upper surface, and a tilting platform having an upper surface connected to the holding surface and having an inclined surface having a downward gradient in a direction away from the holding surface. And a pressing member that holds the first plate-shaped body while the peripheral edge portion of the first plate-shaped body that is more outward than the effective region protrudes above the inclined surface, and further includes The peripheral edge portion of the first plate-shaped body that protrudes above the inclined surface is pressed and bent downward, whereby peeling starts between the first plate-shaped body and the second plate-shaped body, and the horizontal platform portion and the inclined platform portion are Leaving in the horizontal direction, at least one of the supporting members is relatively raised and lowered with respect to the holding surface from the gap between the horizontal platform portion and the inclined platform portion due to the separation.

Such an inclined surface is provided in one of the holding platforms, and the first plate-shaped body protruding from the inclined surface is bent along the inclined surface, whereby peeling can be started under appropriate management. Thereby, peeling can be performed favorably. In this case, when an opening for inserting the support member is provided in the vicinity of the boundary between the holding surface and the inclined surface, the uncoated region in which the first plate-shaped body is in close contact with the second plate-shaped body and the peeled-off region are peeled off. The boundary line, that is, the shape of the peeling boundary line is scattered, so that peeling cannot be performed at a fixed speed. When the horizontal plate portion and the inclined platform portion are separated from each other, and the first plate-shaped body (or the adhesion body) is supported by the support member, the two platform portions are separated to cause the support member to protrude from the gap, thereby supporting the separation. When the member is retracted and the horizontal platform portion is in close contact with the inclined platform portion, the problem can be avoided and the peeling can be performed satisfactorily.

In the present invention, the first plate-shaped body is in close contact with the second plate-shaped body, and the first plate-shaped body is in close contact with each other. Further, the supporting member supports the first plate-like body on the outer side of the effective region in which the effective pattern or the like is formed, and the first plate-shaped body is brought into contact with the holding surface of the holding platform. Therefore, the two plate-like bodies that are in close contact with each other can be favorably peeled off, and the receiving of the bonded body that has been carried in from the outside can be favorably performed without impairing the pattern or the like.

1‧‧‧ peeling device

3‧‧‧ platform block

5‧‧‧Upper adsorption block

11‧‧‧Main frame

30‧‧‧ Platform (maintaining platform)

31‧‧‧Horizontal Platform Division (maintaining platform)

32‧‧‧ tilting platform (maintaining platform)

33‧‧‧Initial stripping unit

34‧‧‧roll unit

36‧‧‧Main lift

37‧‧‧Sub-lift

38‧‧‧Edge lifts

50‧‧‧Support framework

70‧‧‧Control unit

51~54‧‧‧Adsorption unit (peeling device)

310‧‧‧ (horizontal platform part 31) upper surface (holding surface)

311‧‧‧Adsorption tank

312‧‧‧Adsorption tank

313‧‧‧1st opening

314‧‧‧2nd opening

315‧‧‧3rd opening

316‧‧‧cut section

320‧‧‧ upper surface

321‧‧‧rail

322‧‧‧ Slider

323‧‧‧Mobile agencies

331‧‧‧ Pressing members

332‧‧‧Support arm

333‧‧‧rail

334‧‧‧column components

335‧‧‧ Lifting mechanism

336‧‧‧ base

337‧‧‧Location adjustment agency

340‧‧‧ peeling roller

341‧‧‧ Slider

342‧‧‧ Slider

343‧‧‧lower corner

344‧‧‧ Lifting mechanism

345‧‧‧ upper corner

346‧‧‧Support roll

351‧‧‧rail

352‧‧‧rail

353‧‧‧Motor

354‧‧‧Rolling screw mechanism

361‧‧‧ Lifting pin (supporting member)

361a‧‧‧ upper surface

362‧‧‧Adsorption pad

363‧‧‧Negative pressure supply path

365‧‧‧ Lifting mechanism (lifting device)

371‧‧‧ Lifting pin (auxiliary support member)

375‧‧‧ Lifting mechanism

381‧‧‧Oscillation arm (void forming member)

381a‧‧‧ upper end of each oscillating arm 381

382‧‧‧Support framework

383‧‧‧ drive rod

384‧‧‧Mobile agencies

517‧‧‧Adsorption pad

521‧‧‧beam components

522‧‧‧column components

523‧‧‧column components

524‧‧‧Board components

525‧‧‧ Lifting mechanism

526‧‧‧pad support members

527‧‧‧Adsorption pad

527a‧‧‧Adsorption Department

527b‧‧‧ Bellows Department

537‧‧‧Adsorption pad

547‧‧‧Adsorption pad

701‧‧‧CPU

702‧‧‧Motor Control Department

703‧‧‧Valve Control Department

704‧‧‧Negative Pressure Supply Department

705‧‧‧User Interface (UI) Department

A-A'‧‧‧ cut face

AR‧‧‧Active area

B-B'‧‧‧ cut face

C-C'‧‧‧ cut face

BH‧‧ ‧ coating with hand

BL‧‧‧Cladding (1st plate)

E‧‧‧ ridge line

R1‧‧‧ adsorbing the area of the coating layer BL by the adsorption tank 311

R2‧‧‧ adsorbing the area of the cladding layer BL by the adsorption tank 312

R3‧‧‧Adsorption of the substrate SB by the first adsorption unit 51

R4‧‧‧ peeling roller 340 abuts the area of the substrate SB

R5‧‧‧Abutment area

R6‧‧‧ The lower surface area of the cladding layer BL that the upper surface 361a of the lift pin 361 abuts

The lower surface area of the cladding layer BL abutting the upper end of the oscillating arm 381 of the R7‧‧‧ edge lifter 38

R8‧‧‧ Lifting pin 371 abuts the surface area under the coating layer BL

S101~S115‧‧‧Steps

SB‧‧‧ substrate (2nd plate)

TR‧‧‧able area

V3‧‧‧ valve group

V5‧‧‧ valve group

WH‧‧‧ workpiece with hand

WK‧‧‧ workpiece

-X‧‧‧ directions

+X‧‧‧ directions

-Y‧‧ Direction

+Y‧‧ Direction

-Z‧‧‧ directions

+Z‧‧‧ directions

θ‧‧‧An angle formed by the lower surface of the cladding layer BL and the upper surface 320 of the inclined platform portion 32

α‧‧‧The angle between the peeled portion of the substrate SB and the cladding layer BL

The angle between the substrate SB and the cladding layer BL near the β ‧ ‧ strip boundary

Fig. 1 is a perspective view showing an embodiment of a peeling device of the present invention.

Fig. 2 is a perspective view showing the main configuration of the peeling device.

Fig. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective parts.

4(a) and 4(b) are perspective views showing a more detailed configuration of the platform.

Fig. 5 is a plan view showing the direction of the cross section of the cross-sectional view of the platform of Figs. 6(a) to 8(b).

6(a) and 6(b) are cross-sectional views showing the arrangement of a main lifter.

7(a) to (c) are cross-sectional views of the platform showing the arrangement of the sub-lifts.

8(a) and 8(b) are cross-sectional views showing the arrangement of the edge lifter.

Figure 9 is a diagram showing the positional relationship between the platform and the workpiece placed on the platform.

Fig. 10 is a block diagram showing the electrical configuration of the peeling device.

Fig. 11 is a flow chart showing the peeling process.

12(a) to 12(d) are first diagrams showing the positional relationship of each unit in each stage of the process.

13(a) to (d) are second diagrams showing the positional relationship of each unit in each stage of the process.

14(a) to 14(d) are diagrams 3 showing the positional relationship of each unit in each stage of the process.

15(a) to 15(d) are diagrams 4 showing the positional relationship of each unit in each stage of the process.

16(a) and 16(b) are views for explaining the advantages of the peeling process of the embodiment.

Fig. 1 is a perspective view showing an embodiment of a peeling device of the present invention. In order to uniformly represent the directions of the following figures, the XYZ orthogonal coordinate axes are set as shown in the lower right of FIG. Here, the XY plane represents a horizontal plane, and the Z axis represents a vertical axis. In more detail, the (+Z) direction table Shows the direction of the vertical direction.

This peeling device 1 is a device for peeling off two sheet-like bodies carried in a state in which the main surfaces are in close contact with each other. For example, it is used for forming a part of a pattern forming process of a specific pattern on the surface of a substrate such as a glass substrate or a semiconductor substrate. More specifically, the pattern forming process is uniformly applied to the surface of the cladding layer as a carrier for temporarily carrying the pattern to be transferred (coating step), and the surface is processed according to the shape of the pattern. The plate is pressed against the coating layer on the coating layer, thereby patterning the coating layer (patterning step). Next, the coating layer in which the pattern is formed in this manner is adhered to the substrate to be transferred (the transfer step), whereby the pattern is finally transferred from the cladding layer to the substrate.

In this case, the apparatus can be preferably applied for the purpose of separating between the substrate and the cladding layer which are in contact with each other in the patterning step, or between the substrate and the cladding layer which are in close contact with each other in the transfer step. Of course, it can be used for both of them, and can also be used for other purposes. For example, it can also be applied to a peeling process when a film carried on a carrier is transferred to a substrate.

The peeling device 1 has a structure in which a platform block 3 and an upper adsorption block 5 are fixed to a main frame 11 attached to a casing. In Fig. 1, in order to show the internal structure of the device, the illustration of the housing is omitted. Also, in addition to the blocks, the stripping device 1 includes a control unit 70 (Fig. 10) which will be described later.

The platform block 3 has a platform 30 for placing a plate or a close-contact body (hereinafter referred to as a "workpiece") in which the substrate and the cladding layer are in close contact with each other. The platform 30 includes a horizontal platform portion 31 having a substantially horizontal plane on its upper surface, and an inclined platform portion 32 having an upper surface having an inclination of several degrees (e.g., about 2 degrees) with respect to a horizontal plane. An initial peeling unit 33 is provided on the side of the inclined platform portion 32 of the stage 30, that is, in the vicinity of the end portion on the (-Y) side. Further, the roller unit 34 is provided so as to straddle the horizontal platform portion 31.

On the other hand, the upper adsorption block 5 includes a support frame 50 whose main frame 11 is erected and disposed to cover the upper portion of the platform block 3; the first adsorption unit 51, the second adsorption unit 52, and the third adsorption unit 53 And a fourth adsorption unit 54, which is mounted on the support frame 50. The adsorption units 51 to 54 are sequentially arranged in the (+Y) direction.

Fig. 2 is a perspective view showing the main configuration of the peeling device. More specifically, FIG. 2 shows the structure of the stage 30, the roller unit 34, and the second adsorption unit 52 in each configuration of the peeling device 1. The platform 30 includes a horizontal platform portion 31 having an upper surface 310 that is substantially horizontal; and an inclined platform portion 32 having an upper surface 320 that is inclined. The upper surface 310 of the horizontal platform portion 31 has a planar size that is slightly larger than the planar size of the workpiece being placed.

The inclined platform portion 32 is closely attached to the (-Y) side end portion of the horizontal platform portion 31. The portion of the upper surface 320 that is in contact with the horizontal platform portion 31 is located at the same height (Z-direction position) as the upper surface 310 of the horizontal platform portion 31, and on the other hand, along the (-Y) direction from the horizontal platform portion 31. Move away and go backwards, ie (-Z). Therefore, the platform 30 as a whole is continuous with the inclined surface of the upper surface 310 of the horizontal platform portion 31 and the inclined surface of the upper surface 320 of the inclined platform portion 32, and the ridge portion E connected thereto is linearly extending in the X direction.

Further, a lattice-shaped groove is formed in the upper surface 310 of the horizontal platform portion 31. More specifically, a lattice-shaped groove 311 is provided in the central portion of the upper surface 310 of the horizontal platform portion 31. The groove 312 corresponding to the shape of the three sides of one side of the inclined land portion 32 side in the rectangular shape is provided on the peripheral edge portion of the upper surface 310 of the horizontal land portion 31 so as to surround the region in which the groove 311 is formed. The grooves 311 and 312 are connected to a negative pressure supply unit 704 (FIG. 10) to be described later via a control valve, and have adsorption tanks for adsorbing and holding the workpiece placed on the stage 30 by supplying a negative pressure. Features. The two types of grooves 311 and 312 are not connected to the platform, and are connected to the negative pressure supply unit 704 via independent control valves. Therefore, in addition to the adsorption using the two grooves, the adsorption using only one groove can be realized. .

The roller unit 34 is disposed in such a manner as to span the platform 30 thus constructed. Specifically, the pair of guide rails 351 and 352 are extended in the Y direction along both end portions of the horizontal platform portion 31 in the X direction, and the guide rails 351 and 352 are fixed to the main frame 11 . Further, the roller unit 34 is attached slidably with respect to the guide rails 351 and 352.

The roller unit 34 includes a slider 341 that is slidably engaged with the guide rails 351 and 352, respectively. 342 is provided with an upper portion 343 extending in the X direction across the upper portion of the platform 30 so as to connect the sliders 341 and 342. The upper corner 345 is detachably attached to the lower corner 343 via an appropriate lifting mechanism 344. Further, a cylindrical peeling roller 340 extending in the X direction is rotatably attached to the upper corner 345.

When the upper corner 345 is lowered downward by the elevating mechanism 344, that is, in the (-Z) direction, the lower surface of the peeling roller 340 abuts against the upper surface of the workpiece placed on the stage 30. On the other hand, in a state in which the upper corner 345 is positioned at the upper position, that is, the position in the (+Z) direction by the elevating mechanism 344, the peeling roller 340 is separated from the upper surface of the workpiece. At the upper corner 345, a support roller 346 for suppressing the deflection of the peeling roller 340 is rotatably mounted, and a rib for preventing the deflection of the upper corner 345 itself is appropriately provided. The peeling roller 340 and the backup roller 346 do not have a driving source, and these are free to rotate.

The roller unit 34 is movable in the Y direction by the motor 353 attached to the main frame 11. More specifically, the lower corner 343 is coupled to, for example, the ball screw mechanism 354 as a conversion mechanism that converts the rotational motion of the motor 353 into a linear motion. When the motor 353 rotates, the lower corner 343 moves in the Y direction along the guide rails 351 and 352, whereby the roller unit 34 moves in the Y direction. The movable range of the peeling roller 340 accompanying the movement of the roller unit 34 is set to the vicinity of the (-Y) side end of the horizontal platform portion 31 in the (-Y) direction, and is set to the horizontal platform in the (+Y) direction. The (+Y) side end portion of the portion 31 is further outward, that is, further toward the (+Y) side.

Next, the configuration of the second adsorption unit 52 will be described. Further, the first to fourth adsorption units 51 to 54 have the same structure. Here, the structure of the second adsorption unit 52 will be representatively described. The second adsorption unit 52 has a beam member 521 extending in the X direction and fixed to the support frame 50, and the pair of column members 522 and 523 extending vertically downward, that is, in the (-Z) direction are positioned in the X direction. It is attached to the beam member 521 differently. The plate members 522 and 523 are attached to the plate members 522 and 523 so as to be lifted and lowered by the guide rails hidden in the drawing. The plate member 524 is driven up and down by a lifting mechanism 525 including a motor and a switching mechanism (for example, a ball screw mechanism).

A rod-shaped pad supporting member 526 extending in the X direction is attached to a lower portion of the plate member 524, and a plurality of adsorption pads 527 are arranged at equal intervals in the X direction on the lower surface of the pad supporting member 526. 2 shows a state in which the second adsorption unit 52 is moved to a position higher than the actual position. However, when the plate member 524 is moved downward by the elevating mechanism 525, the adsorption pad 527 can be lowered to an extremely close to the horizontal platform. The position of the upper surface 310 of the portion 31 is up. In the state in which the workpiece is placed on the platform 30, the upper surface of the workpiece is abutted. Each of the adsorption pads 527 is given a negative pressure from a negative pressure supply portion 704 which will be described later to adsorb and hold the upper surface of the workpiece.

Fig. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective parts. First, the structure of the initial peeling unit 33 will be described with reference to Figs. 1 and 3 . The initial peeling unit 33 has a rod-shaped pressing member 331 extending in the X direction above the inclined platform portion 32, and the pressing member 331 is supported by the support arm 332. The support arm 332 is attached to the column member 334 so as to be movable up and down via a guide rail 333 extending in the vertical direction, and the support arm 332 is moved up and down with respect to the column member 334 by the action of the elevating mechanism 335. The column member 334 is supported by a base portion 336 attached to the main frame 11. However, the position of the column member 334 on the base portion 336 in the Y direction can be adjusted within a specific range by the position adjustment mechanism 337.

The workpiece WK as the object to be peeled off is placed on the stage 30 composed of the horizontal platform portion 31 and the inclined platform portion 32. In the above-mentioned patterning step, the workpiece-based plate and the coating layer are in close contact with each other by the film of the pattern forming material. On the other hand, in the transfer step, the workpiece-based substrate and the cladding layer are in close contact with each other via the patterned pattern. In the following, the peeling operation of the peeling device 1 when the bonded body of the substrate SB and the coating layer BL in the transfer step is the workpiece WK will be described. However, in the case where the adherend of the plate and the coating layer is used as a workpiece, peeling can be performed by the same method.

In the case of the workpiece WK, it is assumed that the cladding layer BL has a larger planar size than the substrate SB. The substrate SB is in close contact with a substantially central portion of the cladding layer BL. Workpiece WK system will cover The BL is set to the lower side, and the substrate SB is placed above and placed on the stage 30. At this time, as shown in FIG. 3, the workpiece WK is placed on the stage 30 in such a manner that the (-Y)-side end portion of the substrate SB in the workpiece WK becomes the ridge portion at the boundary between the horizontal platform portion 31 and the inclined platform portion 32. The upper side of E is, in more detail, the position where the ridge portion E is slightly shifted toward the (-Y) side. Therefore, the cladding layer BL outside the substrate SB in the (-Y) direction is disposed to protrude above the inclined land portion 32, and the lower surface of the cladding layer BL and the upper surface of the inclined land portion 32 are provided. A gap is created between 320. The angle θ between the lower surface of the cladding layer BL and the upper surface 320 of the inclined land portion 32 is about the same as the inclination angle of the inclined land portion 32 (2 degrees in this embodiment).

The horizontal platform portion 31 is provided with adsorption grooves 311 and 312 for adsorbing and holding the lower surface of the cladding layer BL. The adsorption groove 311 adsorbs the lower surface of the cladding layer BL that is in contact with the lower portion of the substrate SB. On the other hand, the adsorption groove 312 adsorbs the lower surface of the cladding layer BL outside the substrate SB. The adsorption grooves 311, 312 can be opened independently of each other. The adsorption is closed, so that the two types of adsorption grooves 311, 312 can be used together to strongly adsorb the coating layer BL. On the other hand, by using only the outer adsorption groove 312 for adsorption, the central portion of the coating layer BL in which the pattern is effectively formed is not adsorbed, and the deflection of the coating layer BL due to adsorption can be prevented. Damage caused by the pattern. As described above, by independently controlling the supply of the negative pressure to the adsorption grooves 311 at the center portion and the adsorption grooves 312 at the peripheral portion, the adsorption and holding of the coating layer BL can be switched depending on the purpose.

The first to fourth adsorption units 51 to 54 and the separation roller 340 of the roller unit 34 are disposed above the workpiece WK held by the stage 30 in this manner. As described above, a plurality of adsorption pads 527 are arranged in parallel in the X direction in the lower portion of the second adsorption unit 52. More specifically, the adsorption pad 527 has an adsorption portion 527a integrally formed of a material having flexibility and elasticity such as rubber or silicone resin, and the lower surface abuts on the upper surface of the workpiece WK (more specifically, The workpiece WK is adsorbed on the upper surface of the substrate SB; and the bellows portion 527b has a stretchability in the up-down direction (Z direction). Provided in other adsorption units 51, 53 and The adsorption pads of 54 are also of the same construction, but the following are distinguished by designating symbols 517, 537 and 547 for the adsorption pads provided in the adsorption units 51, 53 and 54 respectively.

The first adsorption unit 51 is provided above the (-Y) side end portion of the horizontal platform portion 31, and adsorbs the upper surface of the (-Y) side end portion of the substrate SB when descending. On the other hand, the fourth adsorption unit 54 is disposed above the (+Y) side end portion of the substrate SB placed on the stage 30, and adsorbs the upper surface of the (+Y) side end portion of the substrate SB when descending. The second adsorption unit 52 and the third adsorption unit 53 are appropriately dispersed and disposed therebetween. For example, the adsorption pads 517 to 547 may be substantially equally spaced in the Y direction. The movement in the up and down direction and the opening and closing of the adsorption can be performed independently of each other between the adsorption units 51 to 54.

The peeling roller 340 moves in the up-down direction to move away from the substrate SB, and moves horizontally along the substrate SB by moving in the Y direction. In a state in which the peeling roller 340 is lowered, it is horizontally moved while abutting against the upper surface of the substrate SB and rotating. The position of the peeling roller 340 when moving to the most (-Y) side is the position of the first adsorption unit 51 closest to the (+Y) side of the adsorption pad 517. In order to realize the arrangement to such an approach position, the first adsorption unit 51 is the same as the second adsorption unit 52 shown in FIG. 2, but as shown in FIG. 1 and other second to fourth The adsorption units 52 to 54 are attached to the support frame 50 in opposite directions.

The initial peeling unit 33 adjusts its Y-direction position such that the pressing member 331 is positioned above the cladding layer BL that protrudes above the inclined platform portion 32. Further, by the support arm 332 descending, the pressing member 331 is lowered and the lower end thereof is pressed against the upper surface of the covering layer BL. At this time, the front end of the pressing member 331 is formed by the elastic member without causing the pressing member 331 to scratch the coating layer BL.

Next, a more detailed configuration of the platform 30 will be described. In the platform 30 of the embodiment, in addition to the above-described respective components required for the peeling process of the workpiece WK, two plate-shaped bodies (plates or plates) for smoothly carrying in and peeling off the workpiece WK to the peeling device 1 are provided. The structure in which the substrate and the cladding layer are carried out. Hereinafter, the configurations will be described.

Figure 4 is a perspective view showing a more detailed configuration of the platform. As shown in Fig. 4(a), the horizontal platform portion 31 and the inclined platform portion 32 of the platform 30 are separately formed and separable. The inclined platform portion 32 can be moved away from the horizontal platform portion 31 in the horizontal direction by the horizontal movement mechanism to be described later, and the inclined platform portion 32 is in close contact with the side surface of the horizontal platform portion 31, whereby the horizontal platform portion 31 and the inclined portion The platform unit 32 functions integrally as the platform 30.

On the upper surface 310 of the horizontal platform portion 31, in addition to the adsorption grooves 311 and 312, three types of openings 313, 314, and 315 having different shapes from each other are provided at a plurality of portions. More specifically, a plurality of first openings 313 having an elliptical shape are dispersedly disposed at a plurality of portions of the flat portion between the adsorption groove 311 and the adsorption groove 312 in the upper surface 310 of the horizontal land portion 31. Further, a substantially circular second opening 314 is provided at four locations where the central portion of the upper surface 310 of the horizontal platform portion 31 is isolated from each other. The first opening 313 and the second opening 314 are not connected to the adsorption grooves 311 and 312 on the upper surface 310 of the horizontal platform portion 31. Therefore, the adsorption groove 311 is divided around the second opening 314. Further, a plurality of third openings 315 having an elliptical shape are dispersedly disposed at a plurality of portions between the outer adsorption groove 312 and the outer edge of the platform.

Further, in the end portion of the horizontal platform portion 31 opposite to the inclined platform portion 32, that is, at the (+Y) side, a plurality of opening sizes having the same degree as the third opening 315 are provided on the upper surface 310 of the platform. The cutout portion 316. The outer suction groove 312 is provided to avoid the notch portion 316, and the suction groove 312 is not connected to the cutout portion 316 on the upper surface 310 of the horizontal platform portion 31.

On the other hand, on the side of the horizontal platform portion 31 on the side of the inclined platform portion 32, that is, on the (-Y) side, four sets of main lifters 36 are arranged side by side in the X direction. The construction of the main lifts 36 is identical to each other. Each of the main lifts 36 includes a lift pin 361 that is finished in a thin plate shape along the side of the horizontal platform portion 31, and a lift mechanism 365 that supports the lift pin 361 from below and is based on the control unit The drive signal of 70 (Fig. 10) causes the lift pin 361 to move up and down in the vertical direction (Z direction). The lifting mechanism 365 is fixed to the bottom surface of the horizontal platform portion 31.

Fig. 4(b) shows a schematic structure of the lift pin 361. As shown in the figure, the upper surface 361a of the lift pin 361 is finished to be substantially flat. An adsorption pad 362 is provided at a central portion thereof, and the adsorption pad 362 is in communication with a negative pressure supply path 363 provided through the inside of the lift pin 361. The negative pressure supply path 363 is connected to a negative pressure supply portion 704 (FIG. 10) which will be described later via a control valve. As will be described below, the main elevator 36 having the same structure is further provided corresponding to each of the first openings 313.

Figure 5 is a top plan view of the platform showing the direction of the cross-section of the platform of Figures 6-8. 6 is a cross-sectional view of the platform showing the arrangement of the main elevator. More specifically, Fig. 6 shows the cut surface of AA' of Fig. 5. In addition, in FIG. 5, in order to make an easy view, the indication points in the area in which these adsorption tanks 311 and 312 are arrange|positioned are shown, and the adsorption tanks 311 and 312 are mentioned.

As shown in FIG. 6(a), the inclined platform portion 32 is supported by a horizontal moving mechanism including: a guide rail 321 extending from the side of the horizontal platform portion 31 in the (-Y) direction; and a slider 322, It is slidably engaged in the Y direction with respect to the guide rail 321, and the moving mechanism 323 moves the slider 322 in the Y direction. More specifically, the inclined platform portion 32 is attached to the slider 322, and is moved horizontally in the Y direction, that is, the horizontal platform portion 31 in the approaching and leaving direction by the movement of the moving mechanism 323.

The side of the (+Y) side of the inclined platform portion 32 that is in contact with the horizontal platform portion 31 is cut in correspondence with the lift pin 361 of the main lift 36, thereby avoiding the lift pin when the inclined platform portion 32 is combined with the horizontal platform portion 31. 361 interference.

The main lift 36 is provided in one set for each of the plurality of first openings 313 that are formed on the upper surface 310 of the horizontal platform portion 31. In other words, the elevating mechanism 365 is attached to the lower end of the through hole from the first opening 313 to the bottom surface of the horizontal platform portion 31, and the lift pin 361 is inserted into each of the openings 313. The main elevator 36 is also provided in the same group with respect to the other first openings 313 which are not shown in Fig. 6(a).

Each of the main elevators 36 performs the same operation based on the drive signal from the control unit 70. That is, each of the lift pins 361 can be respectively positioned at a lower position and an upper position, the lower portion The position is as shown in FIG. 6(a), and the upper end thereof is retracted below the upper surface 310 of the horizontal platform portion 31, and the upper position protrudes above the horizontal platform portion 31 as shown in FIG. 6(b). Surface 310 is further above. According to the drive signal from the control unit 70, each of the lift pins 361 is raised and lowered together between the upper position and the lower position. Further, as shown in FIG. 6(b), the positioning of the upper portion of the lift pin 361 is performed in a state where the inclined platform portion 32 is separated from the horizontal platform portion 31, and is mounted on the horizontal platform portion 31 (-Y). The lift pin 361 of the main lift 36 on the side of the side is lifted and lowered by the gap between the horizontal platform portion 31 and the inclined platform portion 32.

Fig. 7 is a cross-sectional view showing the platform of the cut surface of Fig. 5B', and showing the arrangement of the sub-lift. In addition, illustration of the inclined platform portion 32 and the horizontal movement mechanism is omitted. The sub-lift 37 is attached to each of the second openings 314 provided at four locations in the central portion of the upper surface 310 of the horizontal platform portion 31. More specifically, the sub-lift 37 includes a lift pin 371 that is inserted through a through hole that penetrates from the second opening 314 to the bottom surface of the horizontal platform portion 31, and a lift mechanism 375 that is attached to the bottom surface of the platform to lift the pin 371 is raised and lowered in the up and down direction, that is, in the Z direction. The lift pin 371 has a substantially disk-shaped upper end and is lifted between a lower position and an upper position according to a drive signal from the control unit 70. The lower position is retracted to a horizontal platform as shown in Fig. 7(a). The upper surface 310 of the portion 31 is further below, and the upper portion protrudes above the upper surface 310 of the horizontal platform portion 31 as shown in Fig. 7(c).

The plurality of main lifts 36 perform the same operation together based on the drive signals from the control unit 70. On the other hand, the plurality of sub-lifts 37 also perform the same operation in accordance with the drive signals from the control unit 70. However, the main lift 36 and the sub-lift 37 operate independently of each other. Therefore, in this embodiment, the following three states can be switched: as shown in FIG. 7(a), the lift pin 361 of the main lift 36 and the lift pin 371 of the sub-lift 37 are in the lower position; as shown in FIG. 7(b) As shown, only the lift pin 361 of the main lift 36 is in the upper position; and as shown in Fig. 7(c), the lift pin 361 of the main lift 36 and the lift pin 371 of the sub-lift 37 are in the upper position.

Fig. 8 is a cross-sectional view showing the platform of the C-C' cut surface of Fig. 5, and showing the arrangement of the edge lift. In addition, illustration of the inclined platform portion 32 and the horizontal movement mechanism is omitted. The edge lifter 38 includes a plurality of oscillating arms 381 that are respectively inserted through the through holes from the third opening 315 to the bottom surface of the horizontal platform portion 31 and one end extends to the upper surface 310 of the platform; the support frame 382 supports The central portion of the oscillating arm 381 is oscillated freely; a drive lever 383 coupled to the other end of each of the oscillating arms 381; and a moving mechanism 384 for reciprocating the drive lever 383 in the Y direction.

The driving rod 383 is moved in the Y direction by the movement of the moving mechanism 384, whereby the oscillation arms 381 are oscillated together to switch the following state: as shown in FIG. 8(a), the upper end 381a of each of the oscillation arms 381 is from the upper surface of the platform. 310 is slightly retracted downward; as shown in FIG. 8(b), the upper end 381a of each of the oscillation arms 381 protrudes slightly upward from the upper surface 310 of the platform. An edge lifter including the same mechanism is also provided in the cutout portion 316 provided at the (+Y) side end portion of the horizontal platform portion 31. However, in this case, the oscillation arms 381 are arranged in the X direction.

As described above, the upper surface 310 of the horizontal platform portion 31 is provided with recesses 313 to 315 for lifting and lowering the adsorption grooves 311 and 312 or various mechanisms, and recesses recessed downward from the upper surface 310 of the platform. However, in terms of the function of abutting the workpiece WK to maintain the planar posture, it is desirable that the upper surface 310 of the platform be as flat as possible. That is, it is preferable that each of the rectangular regions surrounded by the lattice-shaped adsorption grooves 311, 312 in the upper surface 310 of the platform, the planar portion around the openings 313 to 315, and the flat portion outside the adsorption groove 312 Each has a higher degree of flatness and these are all on a single plane. Further, it is preferable that the size of the opening of the adsorption tank and each opening is as small as possible. Therefore, this embodiment uses a lift pin 361 which is finished into a thin shape as shown in Fig. 4 (b).

In terms of ensuring a high degree of flatness, it is preferable for the horizontal stage portion 31 to be composed of a material having no ductility. For example, it can be preferably applied to a surface such as a slate or a quartz plate in which an opening such as an adsorption groove is formed to perform planar polishing (or the reverse order). For example, a metal material such as stainless steel cannot completely remove the opening even if it is ground-polished. The fine concavities around it, and such irregularities can be a cause of damage to the peeling.

Figure 9 is a diagram showing the positional relationship between the platform and the workpiece placed on the platform. In the workpiece WK in which the substrate SB and the cladding layer BL are in close contact with each other, the cladding layer BL has a planar size larger than that of the substrate SB. Therefore, the entire surface of the substrate SB is opposed to the cladding layer BL, whereas the central portion of the cladding layer BL faces the substrate SB, but the peripheral portion is a blank portion that does not face the substrate SB. In the central portion of the surface region of the substrate SB excluding the peripheral portion, an effective region AR that functions as a device is effectively set by transferring the pattern. Therefore, the purpose of the peeling apparatus 1 is to peel off the substrate SB and the cladding layer BL without damaging the pattern transferred from the cladding layer BL to the effective region AR of the substrate SB.

The workpiece WK is placed on the stage 30 such that the entire effective area AR of the substrate SB is located on the upper surface 310 of the horizontal platform portion 31. On the other hand, on the outer side of the more effective area AR, the (-Y) side end portion of the substrate SB is positioned to protrude slightly toward the (-Y) side of the ridge line portion E at the boundary between the horizontal platform portion 31 and the inclined platform portion 32. The location.

In the figure, a region R1 indicating a dot indicates a region where the coating layer BL is adsorbed by the adsorption groove 311. The region R1 adsorbed by the adsorption groove 311 covers the entirety of the effective region AR. Further, the region R2 indicates a region where the coating layer BL is adsorbed by the adsorption groove 312. The adsorption tank 312 is attached to the outer side of the more effective area AR to adsorb the coating layer BL. Therefore, for example, the state in which the coating layer BL is adsorbed only by the adsorption tank 312 prevents the pattern in the effective area AR from being affected by the adsorption. The other regions R3 to R8 shown in FIG. 9 will be described later in the description of the operation.

Fig. 10 is a block diagram showing the electrical configuration of the peeling device. The various parts of the device are controlled by the control unit 70. The control unit 70 includes a CPU (Central Processing Unit) 701 that manages the operation of the entire device, a motor control unit 702 that controls the motors provided in the respective units, and a valve control unit 703 that controls the valves provided in the respective units. a negative pressure supply unit 704 that generates a negative pressure supplied to each unit; and a user interface (UI) unit 705 for accepting an operation input from a user or reporting the status of the device to use By. Further, the control unit 70 may not include the negative pressure supply portion when the negative pressure supplied from the outside such as the factory power transmission line can be utilized.

The motor control unit 702 drives and controls the motor 353 provided in the platform block 3, and the lifting mechanism 525 provided in each of the lifting units 335, 344, 365, and 375 and the moving mechanisms 323 and 384 and the adsorption units 51 to 54 of the upper adsorption block 5, respectively. Wait for the motor group. In addition, although the motor is typically described as a driving source of each movable portion, the motor is not limited thereto, and various actuators such as a cylinder, a solenoid, and a piezoelectric element may be used depending on the application. As a driving source.

The valve control unit 703 controls the valve group V3 provided in the stage block 3, the valve group V5 provided in the upper adsorption block 5, and the like. The valve group V3 includes valves that are connected to the suction grooves 311 and 312 provided in the horizontal platform unit 31 and the adsorption paths 362 provided on the lift pins 361 from the negative pressure supply unit 704 for use in the same. The adsorption tank and the adsorption pad are individually supplied with a specific negative pressure. The valve group V5 includes various valves that are provided on the piping path that is connected to the adsorption pads 517 to 547 from the negative pressure supply unit 704, and supplies a specific negative pressure to each of the adsorption pads 517 to 547.

Next, a peeling operation of the peeling device 1 configured as described above will be described with reference to Figs. 11 to 15 . Fig. 11 is a flow chart showing the peeling process. 12 to 15 are diagrams showing the positional relationship of each unit in each stage of the process, and schematically showing the progress of the process. This stripping process is performed by executing the processing program previously stored by the CPU 701 to control the completion of each unit.

First, the workpiece WK is loaded to the above position on the stage 30 by an operator or an external transfer robot or the like (step S101). FIG. 12 schematically shows a state in which the workpiece WK loaded from the outside is placed on the stage 30. Fig. 12 (a) shows the state of the stage 30 before the workpiece WK is carried in. At this time, the lift pin 361 of the main lift 36, the lift pin 371 of the sub-lift 37, and the upper end of the oscillating arm 381 are both retracted to a position lower than the upper surface 310 of the platform.

In this state, as shown in FIG. 12(b), the workpiece WK is carried by the operator or by using the workpiece WH provided on the transfer robot to support the lower surface. Then, the lift pin 361 of the main lift 36 rises and the upper end thereof moves to a position higher than the upper surface 310 of the platform to abut the upper surface of the workpiece WK, and more specifically, abuts against the cladding layer BL. lower surface. At this time, as shown in FIG. 6(b), the inclined platform portion 32 is separated from the horizontal platform portion 31, and the lift pins 361 protrude from the gaps thereof. Further, the lift pin 361 may be raised before the workpiece WK is carried in or in parallel with the carry-in.

On the upper surface side in the lower surface area of the cladding layer BL, the substrate SB and the cladding layer BL are overlapped, and in the abutable region TR which is outside the effective region AR in which an effective pattern or the like is formed, the workpiece is manually The WH and the lift pins 361 abut against the lower surface of the cladding layer BL. That is, the support of the workpiece WK is performed by abutting the support member (the lift pin 361 and the workpiece hand WH) against the lower surface of the cover layer BL in the abuttable region TR. The support member is not brought into contact with the region of the effective region AR or the outer side of the abuttable region TR that does not overlap the substrate SB. The reason set as described above is as follows.

In the process of loading the flat workpiece WK from the outside and placing it on the flat platform 30, it is necessary to temporarily support the state of the workpiece WK in a partial manner. At this time, a local pressing force is applied to the pattern or the like between the substrate SB and the cladding layer BL at the support portion. Since there is a stress concentration due to such a non-uniform pressing force to damage the pattern or the like, it is preferable to avoid the contact of the supporting member with respect to the effective region AR in which an effective pattern or the like is formed.

On the other hand, the support outside the more abuttable region TR is such that the substrate SB is not present on the upper portion of the support portion, so the weight of the entire workpiece WK must be supported by the rigidity of the cover layer BL. In particular, when the mass of the workpiece WK increases as the substrate SB is enlarged, the coating layer BL cannot be damaged by such a load. Further, even if it is not damaged, there is a case where the coating layer BL is deflected by the load, whereby sporadic peeling occurs between the substrate SB and the substrate SB.

In this embodiment, a region in which the substrate SB and the cladding layer BL are in close contact with each other on the outer side of the effective area AR is referred to as a contactable region TR. The support member (the workpiece hand WH and the lift pin 361) is brought into contact with the lower surface of the coating layer BL in the abuttable region TR, whereby the problem as described above can be prevented. By supporting the region TR, the weight of the workpiece WK can be supported by the rigidity of the substrate SB and the rigidity of the cladding layer BL, and damage to the pattern or the like in the effective region AR can also be prevented.

The region R6 shown in Fig. 9 indicates the lower surface area of the cladding layer BL where the upper surface 361a of the lift pin 361 abuts. As shown in the figure, the workpiece WK is supported by the plurality of portions dispersed so as to surround the periphery of the effective area AR, and the workpiece WK is supported by the coating layer BL. Further, each of the lift pin upper surfaces 361a is finished flatly, whereby the pressure applied to the coating layer BL can be dispersed at the contact portion. Further, the reason why the region R6 is interrupted in the region around the effective region AR against the lift pin 361 is that the workpiece can be moved by the hand WH through the lift pin 361.

Returning to Fig. 12(b), after the lift pin 361 abuts against the lower surface of the cover layer BL in this manner, the workpiece is manually retracted toward the outside of the apparatus by the WH. As a result, as shown in FIG. 12(c), the workpiece WK is delivered to the lift pin 361 and is supported by the abutment of the lift pin 361 from the lower surface. At this time, a negative pressure is applied to the adsorption pad 362 provided on the upper surface of the lift pin 361 to adsorb and hold the lower surface of the cladding layer BL, whereby the position of the workpiece WK can be prevented from shifting or falling. In this case, damage to the pattern or the like is also avoided by adsorbing the outer side of the more effective area AR.

The lift pin 361 is lowered from this state to move to the lower position, and the suction of the suction pad 362 is released, whereby, as shown in Fig. 12(d), the lift pin 361 is separated from the lower surface of the cover layer BL and the workpiece WK is delivered. To the upper surface 310 of the platform 30. Next, the inclined platform portion 32 moves toward the horizontal platform portion 31 side, and is integrated with the horizontal platform portion 31 as shown in Fig. 6(a).

Returning to Fig. 11, if the workpiece WK is placed on the stage 30 in this manner, the respective parts of the apparatus are set to a specific initial state (step S102). The initial state is the workpiece WK by the adsorption tank One or both of 311, 312 are adsorbed and held, and the pressing member 331 of the initial peeling unit 33, the peeling roller 340 of the roller unit 34, and the adsorption pads 517 to 547 of the first to fourth adsorption units 51 to 54 are all from the workpiece WK. go away. Further, the peeling roller 340 is in the movable range and is located closest to the (-Y) side.

The first adsorption unit 51 and the peeling roller 340 are lowered from the state and abut against the upper surface of the workpiece WK (step S103). At this time, as shown in Fig. 13 (a), the adsorption pad 517 of the first adsorption unit 51 adsorbs the upper surface of the (-Y) side end portion of the substrate SB, and the peeling roller 340 is attached to the (+Y) side adjacent position. Connected to the upper surface of the substrate SB. In Fig. 13(a), the downward arrow indicated in the vicinity of the pressing member 331 means that the pressing member 331 moves in the direction of the arrow from the state shown in the drawing in the continuation step. The same is true in the figures below.

The region R3 shown in FIG. 9 indicates a region where the substrate SB is adsorbed by the first adsorption unit 51 at this time, and the region R4 indicates a region where the peeling roller 340 abuts on the substrate SB. As shown in FIG. 9, the first adsorption unit 51 adsorbs the (-Y) side end portion of the holding substrate SB, and the peeling roller 340 is attached to the (+Y) side of the adsorption region R3 adjacent to the first adsorption unit 51. The region R4 is in contact with the substrate SB. The abutting region R4 where the peeling roller 340 abuts is set to be outside the effective area AR, that is, a position closer to the (-Y) side from the effective area AR. Therefore, the inside of the effective area AR is not affected by the adsorption by the first adsorption unit 51 or the pressing of the peeling roller 340.

Returning to Fig. 11, the initial peeling unit 33 is actuated, and the pressing member 331 is lowered to press the end of the coating layer BL (step S104). The end of the cladding layer BL protrudes above the inclined platform portion 32, and there is a gap between the lower surface of the cladding layer BL and the upper surface 320 of the inclined platform 32. Therefore, as shown in FIG. 13(b), the pressing member 331 presses the end portion of the covering layer BL downward, whereby the end portion of the covering layer BL is bent downward along the inclined surface of the inclined land portion 32. As a result, the end portion of the substrate SB adsorbed and held by the first adsorption unit 51 is separated from the coating layer BL to start peeling. The pressing member 331 is formed in a rod shape extending in the X direction, and its length in the X direction is set longer than the coating layer BL. Therefore, as shown in FIG. 9 , the pressing member 331 abuts against the abutment region R5 of the cladding layer BL from the cladding layer BL (-X). The side end portion to the (+X) side end portion extends in a straight line shape. In this manner, the coating layer BL can be bent into a cylindrical shape, and the boundary between the peeled region where the substrate SB and the coating layer BL have been peeled off and the unpeeled region where the coating layer BL has not been peeled off (hereinafter referred to as "peeling" can be performed. The boundary line") is set to be linear.

From this state, the first adsorption unit 51 is raised, and in synchronization with this, the peeling roller 340 is moved in the (+Y) direction (step S105). Specifically, the movement of the peeling roller 340 is started when the peeling boundary line that moves in the (+Y) direction by the rise of the first adsorption unit 51 reaches the immediately below the peeling roller 340. Thereby, the contact region R4 shown in FIG. 9 is moved in the (+Y) direction. Thereafter, the first adsorption unit 51 moves upward at a fixed speed, that is, in the (+Z) direction, and the peeling roller 340 moves in the (+Y) direction at a fixed speed.

As shown in FIG. 13(c), the first adsorption unit 51 holding the end portion of the substrate SB is raised, whereby the substrate SB is pulled up and the peeling direction of the cladding layer BL is performed in the (+Y) direction. At this time, since the peeling roller 340 is abutted, there is no case where the contact region R4 ( FIG. 9 ) of the peeling roller 340 is not peeled off. When the peeling roller 340 is brought into contact with the substrate SB and moved in the (+Y) direction at a constant speed, the peeling speed can be fixedly maintained. In other words, the peeling boundary line is a straight line along the direction in which the roller extends, that is, the X direction, and is performed at a fixed speed in the (+Y) direction. Thereby, it is possible to surely prevent the damage of the pattern due to the stress concentration caused by the change in the speed of the peeling.

Then, the value of the internal control parameter N used for the following processing is set to 2 (step S106). Next, the peeling roller 340 is waited for the Nth adsorption position to pass (step S107). The Nth adsorption position is a position immediately below the Nth adsorption unit (N=1 to 4) in the upper surface of the substrate SB, and is a position at which the adsorption of the Nth adsorption unit is received.

Here, since N=2, the peeling roller 340 is waited for the second adsorption position, that is, the position directly below the second adsorption unit 52. When the peeling roller 340 passes the second adsorption position (YES in step S107), the lowering of the second adsorption unit 52 is started, and the substrate SB is captured by the adsorption pad 527 of the second adsorption unit 52 (step S108).

As shown in FIG. 13(d), since the peeling roller 340 has passed, the substrate SB is peeled off from the coating layer BL and floated upward at a position directly below the second adsorption unit 52. When the negative pressure is applied to the adsorption pad 527 composed of the elastic member having elasticity, the substrate SB is approached, whereby the adsorption substrate SB can be captured at a time point when the lower surface of the adsorption pad 527 abuts the upper surface of the substrate SB. . It is also possible to make the lifted substrate SB stand by after the adsorption pad 527 is lowered to a specific position. In either case, the failure of adsorption can be prevented by making the adsorption pad soft.

After the adsorption of the substrate SB is started, the movement of the second adsorption unit 52 is changed to increase (step S109). Thereby, as shown in FIG. 14(a), the peeling progress speed is still controlled by the peeling roller 340, and the main system for pulling up the peeled substrate SB is taken from the first adsorption unit 51 to the second adsorption unit. 52. Moreover, the substrate SB after peeling is switched from being held by the first adsorption unit 51 to being held by the first adsorption unit 51 and the second adsorption unit 52, and the holding portion is increased. In addition, when each of the adsorption units 51 to 54 is raised, the relative position in the Z direction between the adsorption units 51 to 54 is maintained so that the posture of the substrate SB after peeling is substantially flat.

Then, by adding 1 to the value of the control parameter N (step S111), the processing returns to the loop processing of step S107 until the parameter N becomes 4. Therefore, in the next cycle, when the peeling roller 340 passes through the third adsorption position immediately below the third adsorption unit 53, the third adsorption unit 53 is lowered, and is used as shown in FIG. 14(b). The main body of the lifted substrate SB is moved from the second adsorption unit 52 to the third adsorption unit 53. Further, in the next cycle, after the peeling roller 340 passes through the fourth adsorption position, the fourth adsorption unit 54 is lowered to pull the substrate SB. By changing the upper limit of N in step S110, it is also possible to correspond to the case where the number of adsorption units is different from the above.

In this manner, the substrate SB is pulled by the fourth adsorption unit 54, whereby the entire substrate SB is pulled from the cladding layer BL as shown in FIG. 14(c). Therefore, after the fourth adsorption unit 54 is raised (YES in step S110), the peeling roller 340 is moved to the (+Y) side of the platform 30. The movement is stopped (step S112). Next, as shown in FIG. 14(d), the adsorption units 51 to 54 are all raised to the same height and then stopped (step S113). Further, the pressing member 331 of the initial peeling unit 33 is moved away from the cladding layer BL to move above the upper surface of the cladding layer BL and further (-Y) than the (-Y) side end portion of the cladding layer BL. The side retracted position (step S114). Thereafter, the adsorption holding of the coating layer BL by the adsorption tank is released, and the separated substrate SB and the coating layer BL are carried out outside the apparatus (step S115), whereby the peeling process is completed.

The reason why the heights of the respective adsorption units 51 to 54 are the same is that the substrate SB and the cladding layer BL after the separation are held in parallel, so that the insertion by the external robot or the operator is carried out by hand. It is easy to take and take the coating layer BL and the substrate SB to the delivery hand.

Fig. 15 schematically shows a process from the peeling of the substrate SB and the coating layer BL to the removal. Immediately after the peeling, the substrate SB is held in a horizontal posture by the adsorption unit 51 to 54 adsorbing the upper surface thereof as shown in Fig. 15 (a), and the coating layer BL is placed on the stage 30.

The substrate SB can be carried out by the workpiece by hand WH. In other words, as shown in FIG. 15(b), the workpiece is again moved between the substrate SB and the cladding layer BL by the hand WH and abuts against the lower end portion of the substrate SB, thereby releasing the adsorption by the adsorption unit 51 or the like. The substrate SB is delivered from the adsorption unit 51 or the like to the workpiece hand WH. At this time, since the workpiece WH is also on the outer side of the effective area AR and abuts against the substrate SB, damage to the transferred pattern or the like does not occur.

Next, the carrying out of the coating layer BL will be described. The cladding layer BL is in a state in which most of the lower surface abuts against the stage 30. The edge lifter 38 is actuated from this state, and as shown in Fig. 15(c), the end portion of the coating layer BL is slightly displaced upward by the oscillation arm 381. The area R7 shown in Fig. 9 indicates the lower surface area of the cladding layer BL where the upper end of the oscillation arm 381 of the edge lifter 38 abuts. In this manner, the oscillating arm 381 is in contact with the lower surface of the cladding layer BL in a region close to the peripheral edge portion of the cladding layer BL on the stage 30.

Therefore, the peripheral portion of the cladding layer BL is displaced in such a manner as to warp upward, so that a slight gap is formed between the lower surface of the cladding layer BL and the upper surface 310 of the stage. The deflection of the coating layer BL and the central portion of the coating layer BL are pressed by the atmospheric pressure, so that the entire coating layer BL is not lifted. The purpose of this operation is to introduce a gap between the lower surface of the cladding layer BL and the upper surface 310 of the platform to introduce external air, thereby reducing the adhesion between the two and making the next lifting operation smooth.

Then, the main lift 36 and the sub-lift 37 are actuated to raise the lift pins 361 and 371. As shown in FIG. 15(d), the cladding layer BL is thereby lifted away from the upper surface 310 of the platform. At this time, if the coating layer BL is in close contact with the upper surface 310 of the platform, a large force is required to make the coating layer BL separate from the upper surface 310 of the platform in order to compete with the atmospheric pressure. Therefore, there is a case where the deflection of the coating layer BL is locally increased at the abutting portion with the lift pin. By making a gap between the cladding layer BL and the upper surface 310 of the stage in advance, the entire cladding layer BL can be lifted with less force, and the deflection of the cladding layer BL can also be alleviated.

The upper ends of the lift pins 361, 371 are positioned at substantially the same height, whereby the cover layer BL can be maintained in a horizontal position away from the platform upper surface 310. At this time, the cover layer BL is supported by the lift pin 371 of the sub-lift 37 together with the lift pin 361 of the main lift 36 for the following reasons.

Since the adhesion between the coating layer BL and the substrate SB after the peeling is released, the center portion is more likely to be bent than the state in which the workpiece WK is in close contact with the substrate SB. Therefore, there is a case where it is impossible to lift from the platform 30 only by the deflection of the central portion of the support-system cover layer BL of the lift pin 361 to the abuttable region TR. In order to allow the coating layer BL to be surely removed from the platform 30, it is possible to maintain the horizontal posture and facilitate the carrying out, and it is effective to support the center portion of the coating layer BL by the lift pins 371 of the sub-lift 37. The region R8 in Fig. 9 indicates the lower surface area of the cladding layer BL at which the lift pin 371 abuts. The region R8 is in the effective region AR, but at this point of time, the pattern or the like in the effective region AR has been transferred to the substrate SB, thereby abutting against the lower surface of the effective region AR to support the cladding layer BL without any question. question.

Further, the patterning step of patterning from the plate to the cladding layer BL is performed by placing a pattern to be transferred onto the substrate, such as a pattern to be peeled off from the substrate. In this case, since the interposer pattern or the like is removed and adhered to the plate of the clad layer BL, there is no case where the pressing force of the lift pin 371 is applied to the lower surface of the clad layer BL to apply a pressing force to the pattern or the like. On the other hand, in the case where the deflection of the cladding layer BL is made small, it is effective in suppressing damage to the pattern or the like. Therefore, it is preferable to support the cladding layer BL at as many places as possible.

In a state in which the cladding layer BL is lifted in this manner, the cladding layer enters the gap between the lower surface of the cladding layer BL and the upper surface 310 of the substrate by the hand BH, and the cladding layer BL is taken out from the lift pins 361 and 371 to be carried out. . The cover layer BH can also be used with the workpiece by hand WH, but for the same reason as the support of the sub-lift 371, it is preferable to support the coating layer BL more than when the workpiece is loaded. And the structure of moving out.

As described above, in this embodiment, the peeling roller 340 extending in the X direction orthogonal to the direction in which the peeling is performed (here, the Y direction) is brought into contact with the substrate SB, and the peeling roller 340 is peeled off at a constant speed. When the substrate SB is pulled in the direction of the movement, the speed of the peeling can be kept constant, and the gap between the substrate SB and the cladding layer BL can be favorably peeled off. At this time, the peeling treatment of the present embodiment has the following advantages.

Fig. 16 is a view for explaining the advantages of the peeling process of the embodiment. In the present embodiment, the main body of the pulling substrate SB is sequentially moved toward the adsorption unit on the downstream side in the peeling progress direction. Therefore, the curvature of the substrate SB directly under the peeling roller 340 is shifted within a certain fixed range from the initial stage to the final stage of the peeling. Therefore, as shown in Fig. 16 (a), the angle ? formed by the peeled portion of the substrate SB and the cladding layer BL is also controlled within a fixed range. Therefore, the force (peeling force) of pulling off the substrate SB and the coating layer BL is also substantially constant at the boundary between the peeled portion and the unpeeled portion, that is, the peeling boundary line directly under the peeling roller 340. Therefore, peeling can be performed favorably without damaging the pattern.

On the other hand, if it is considered to hold only one end of the substrate SB, the comparison is carried out. For example, as shown in FIG. 16( b ), the amount of deflection of the substrate SB due to its own weight increases due to the rigidity or mass of the substrate SB, and the pulling of the substrate SB is absorbed by the deflection. Thereby the peeling is slow. In other words, the angle β between the substrate SB in the vicinity of the peeling boundary line and the coating layer BL gradually decreases, and the peeling force between the two becomes small, and the progress of peeling becomes slow.

In a more extreme case, there is a problem that the adsorption force of the adsorption unit cannot support the mass of the substrate SB and the substrate SB is dropped; or the substrate SB cannot be bent or broken due to bending. Moreover, in order to increase the pulling amount of the substrate SB required to pull the entire substrate SB from the cladding layer BL, the size of the device for realizing this situation is increased. In particular, when the size of the substrate SB is advanced, the quality of the substrate SB is increased, and these problems are further apparent.

On the other hand, in this embodiment, the holding of the substrate SB can be sequentially increased by the peeling, the holding of the substrate SB can be ensured, and the posture of the substrate SB after peeling can be easily maintained. Further, since peeling can be performed while imparting a stable peeling force as described above, damage of the pattern is also prevented. Further, by arranging the adsorption unit in accordance with the size of the substrate SB, it is also possible to flexibly correspond to the enlargement of the substrate SB.

Further, in this embodiment, as shown in Fig. 9, the region R3 in which the substrate SB is adsorbed by the first adsorption unit 51 which is pulled by the substrate SB at the initial stage of the peeling is more outward than the effective region AR in which the effective pattern is formed. . By partially adsorbing the substrate SB, the substrate SB is partially peeled off from the cladding layer BL at this portion, whereby there is a possibility of occurrence of pattern deformation, damage, or the like, but such a problem is avoided by adsorbing the effective region. Further, the peeling speed becomes unstable until the peeling boundary line reaches the position immediately below the peeling roller 340. However, the peeling speed is also prevented by setting the abutting region R4 of the peeling roller 340 in the initial stage as the effective region. Damage to the pattern caused by the change.

On the other hand, in the progress of the peeling, the second to fourth adsorption units 52 to 54 of the new adsorption substrate SB are in contact with the substrate SB in the region separated from the cladding layer BL, so there is no such The pattern transferred to the substrate SB is damaged by the adsorption in this case.

Further, when the coating layer BL is held by the flat platform 30 and peeled off, the coating layer BL in the effective region AR does not exist as compared with the prior art in which the adsorption mechanism is partially abutted and peeled off. The deformation of the locality also prevents damage to the pattern or the like caused by such deformation.

Further, in this embodiment, the lift pin 361 of the main lift 36 receives the workpiece WK loaded from the outside and is placed on the stage 30. At this time, the lift pin 361 abuts against the lower surface of the workpiece WK in the contact region TR in the lower surface of the workpiece WK in which the substrate SB (or plate) is in contact with the cladding layer BL or the like. The contactable region TR is a region in which the substrate SB overlaps with the cladding layer BL and is formed outside the effective region AR in which an effective pattern or the like is formed. In this manner, the region where the rigidity of the substrate SB and the cladding layer BL overlap is high, whereby the workpiece WK can be surely supported, and damage due to the pattern or the like in the pressing effective region AR can be prevented.

In particular, in the abuttable region TR, the plurality of portions are dispersed and abutted against the lift pins 361, whereby the pressure applied to the cover layer BL can be dispersed and supported. In addition to this, it is easy to advance and retreat between the lift pins 361 by hand. Therefore, the loading of the workpiece WK and the placement on the stage 30 can be smoothly performed.

Further, the sub-lifter 37 is disposed at the center of the stage 30, and the main lifter 36 supports the peeled coating layer BL. Thereby, the deflection of the coating layer BL after peeling is suppressed and the horizontal posture is maintained, and the removal to the outside can be facilitated. Further, before the coating layer BL is separated from the stage 30, the edge lifter 38 causes the end portion of the coating layer BL to be displaced upward to form a gap with the upper surface 310 of the stage. In this way, the lifting of the cladding layer BL by the lift pins 361, 371 can be smoothly performed.

Further, in the configuration in which one of the stages 30 is inclined to control the start of peeling, the opening for inserting the lift pins cannot be provided in the vicinity of the ridge line portion E corresponding to the boundary between the horizontal plane of the platform 30 and the inclined surface. . The reason is that if this way, then open The sporadic peeling occurs around the edge of the mouth, so that the peeling start line cannot be controlled. Therefore, in this embodiment, the horizontal platform portion 31 and the inclined platform portion 32 are configured to be separable, and the lift pins are protruded from the gap when the two are separated. At the same time, after the workpiece WK is placed, the horizontal platform portion 31 is brought into contact with the inclined platform portion 32 to constitute the stage 30. Thereby, the abuttable region TR on the inclined surface side can also be supported by the lift pins.

As described above, in the embodiment, the coating layer BL in the workpiece WK as the object to be peeled off corresponds to the "first plate-shaped body" of the present invention, and the substrate SB corresponds to the present invention. "The second plate-shaped body". Further, among the two main faces of the cladding layer BL, the upper surface in close contact with the substrate SB corresponds to "one surface", and the lower surface corresponds to "the other surface".

Further, in the above embodiment, the platform 30 functions as the "holding platform" of the present invention, and the upper surface 310 of the horizontal platform portion 31 corresponds to the "holding surface" of the present invention. Further, the adsorption units 51 to 54 function as the "peeling device" of the present invention. Further, the lift pin 361 functions as a "support member" of the present invention, and the lift mechanism 365 functions as a "lifting device" of the present invention. Moreover, in the above-described embodiment, the lift pin 371 functions as the "auxiliary support member" of the present invention, and the oscillation arm 381 functions as the "void forming member" of the present invention.

It is to be noted that the present invention is not limited to the above-described embodiments, and various modifications may be made in addition to the above without departing from the spirit and scope of the invention. For example, in the above embodiment, the grid 30 is provided with the lattice-shaped adsorption grooves 311 and 312, and the coating layer BL is adsorbed and held. However, the shape of the adsorption groove is not limited thereto. For example, an annular adsorption tank may be provided, and the adsorption hole for supplying a negative pressure may be appropriately disposed to adsorb the coating layer.

Further, the apparatus 1 of the above-described embodiment has a lift pin 371 that can abut against the sub-lift 37 of the lower surface of the workpiece WK in the effective area AR of the workpiece WK, and does not abut the lift of the sub-lift 37 when the workpiece is loaded. The pin 371 thereby suppresses damage to the pattern or the like in the effective area AR. However, depending on the pattern material or its configuration, there is also no lift pin The influence of the 371's abutment. In this case, the sub-lift 37 can also be used together when moving into the workpiece.

Further, in the above-described embodiment, the pressure of the respective adsorption units 51 to 54 is controlled to reduce the stress applied to the substrate SB so that the posture of the substrate SB after peeling is maintained close to the plane, but the substrate SB is raised. The aspect of pulling is not limited to this. For example, the adsorption unit may be stopped at a fixed height such that the substrate after peeling is substantially horizontal, or the substrate may be held in a posture that is bent as having a specific curvature. These lines can be freely set by controlling the ascending state of each adsorption unit.

Further, in the above embodiment, four adsorption units are disposed on the upper portion of the substrate SB to sequentially adsorb the substrate SB. However, the number of adsorption units is arbitrary, and is not limited thereto. If the substrate is large, the number of adsorption units may be increased, and if it is small, the adsorption unit may be reduced.

Further, in the above embodiment, the substrate and the cladding layer are held by vacuum suction, but the aspect of the substrate is not limited thereto. For example, it is also possible to perform adsorption holding by electrostatic or magnetic adsorption. In particular, the first adsorption unit 51 that holds the outside of the effective area of the substrate can be held by mechanically holding the peripheral portion of the substrate without being held by adsorption.

In the peeling apparatus 1 of the above-described embodiment, the peeling roller 340 is brought into contact with the substrate SB to manage the peeling boundary line, and the substrate SB is pulled, thereby peeling off from the coating layer BL, but peeling off The method of processing is not limited to this. In other words, even if it is a device that is peeled off by another peeling method, a dense body including a plate-like body such as a plate or a substrate and a coating layer is carried, and the plate-like body for carrying out the peeling is separately carried out. The invention can be applied.

Further, in the above embodiment, the coating layer BL is held by the inclined land portion 32 and held, and the coating layer BL is bent by the pressing member 331 to form a notched slit. However, the above-described situation is not a necessary condition, and for example, peeling may be started only by pulling by the first adsorption unit. In this case, it is not necessary to set the platform to be tilted.

The present invention can be applied to a peeling process in which two sheet-like bodies are closely adhered to a pattern forming process such as a transfer pattern, and the like, in addition to the various purposes of peeling off two plate-like bodies that are in close contact with each other, Good application, not limited to those who accompany such a pattern transfer.

31‧‧‧Horizontal Platform Division

310‧‧‧Top surface of the horizontal platform

361‧‧‧lifting pin

371‧‧‧lifting pin

381‧‧‧Oscillation arm

AR‧‧‧Active area

BL‧‧‧ coating

SB‧‧‧ substrate

TR‧‧‧able area

WH‧‧‧ workpiece with hand

WK‧‧‧ workpiece

+X‧‧‧ directions

+Y‧‧ Direction

+Z‧‧‧ directions

Claims (6)

A peeling device which peels off a first plate-shaped body and a second plate-shaped body having a planar size smaller than that of the first plate-shaped body and which is in close contact with the first plate-shaped body by a film or pattern; and The peeling device includes: a holding platform having an upper surface which is larger than a plane size of the first plate-shaped body in which the effective area of the film or the pattern is formed, and a horizontal holding surface, and the surface of the first plate-shaped body is closely adhered The other surface on the opposite side of the second plate-shaped body is in contact with the holding surface to hold the first plate-shaped body, and the peeling device holds the second plate-shaped body to make the second plate-shaped body The first plate-shaped body held by the holding platform is relatively moved away from the first plate-shaped body; the support member has an upper end projecting above the holding surface, and the upper end partially abuts The other surface of the first plate-shaped body supports the first plate-shaped body so as to be separated from the holding surface; and the lifting device changes the support member to the holding surface between the upper position and the lower position Phase a position in the height direction, wherein the upper end of the support member protrudes above the holding surface, the lower position is lower than a height of the holding surface; and the support member is abutted against the first The first plate-shaped body that is carried in from the outside and the second plate-shaped body that is in close contact with the first plate-shaped body are temporarily supported by the plate-like body, and are placed on the holding platform. The position of the other surface of the first plate-shaped body is a position outside the region corresponding to the region in which the second plate-like body is in close contact with the one surface side, and is located outside the effective region. The peeling device of claim 1, wherein the holding surface has a shape larger than the second plate shape The planar dimension of the body is disposed outside the region corresponding to the effective region of the first plate-shaped body placed on the holding surface and on the inner side of the region corresponding to the second plate-shaped body. The opening is such that the upper end protrudes above the holding surface through the opening when the support member is at the upper position. The peeling device of claim 2, wherein a plurality of the support members and the opening are respectively provided, and the plurality of support members are integrally raised and lowered relative to the holding surface. The peeling device according to any one of claims 1 to 3, wherein a second opening different from the opening provided in the support member is provided in a region of the holding surface corresponding to the effective region, and includes the second opening The opening of the second plate protrudes above the holding surface to support the auxiliary support member of the first plate-shaped body. The peeling device according to any one of claims 1 to 3, comprising a gap forming member that displaces a peripheral edge portion of the first plate-shaped body held by the holding platform upward in the first plate A gap is formed between the body and the above-mentioned holding surface. A peeling device which peels off a first plate-shaped body and a second plate-shaped body having a planar size smaller than that of the first plate-shaped body and which is in close contact with the first plate-shaped body by a film or pattern; and The peeling device includes: a holding platform having an upper surface which is larger than a plane size of the first plate-shaped body in which the effective area of the film or the pattern is formed, and a horizontal holding surface, and the surface of the first plate-shaped body is closely adhered The other surface on the opposite side of the second plate-shaped body is in contact with the holding surface to hold the first plate-shaped body, and the peeling device holds the second plate-shaped body to make the second plate-shaped body The first plate-shaped body held by the holding platform is relatively moved away from the first plate-shaped body; and the support member has an upper end projecting above the holding surface, the upper end And partially contacting the other surface of the first plate-shaped body to support the first plate-shaped body from being separated from the holding surface; and the lifting device changing between the upper position and the lower position a position of the support member in a relative height direction of the holding surface, wherein the upper end is such that the upper end of the support member protrudes above the holding surface, and the lower position is that the upper end is located below a height of the holding surface; and the holding platform comprises a horizontal platform portion having the above-mentioned holding surface on the upper surface; and an inclined platform portion having an upper surface connected to the holding surface and having an inclined surface having a downward gradient toward a direction away from the holding surface; The peripheral portion of the first plate-shaped body that protrudes above the inclined surface in a state in which the outer peripheral portion of the first plate-shaped body protrudes upward from the inclined surface holds the first plate-shaped body, and further includes a pressing member that presses and protrudes The peripheral portion of the first plate-shaped body above the inclined surface is bent downward, thereby the first plate-shaped body and the upper plate The second plate-shaped body is peeled off, and the support member is in contact with the first plate-shaped body at a position where the second plate is in close contact with the one surface of the first plate-shaped body. The horizontal platform portion and the inclined platform portion are separated from each other in a region corresponding to the region of the shape and outside the effective region, and are separated from the horizontal platform portion and the inclined platform portion by the leaving A gap is generated therebetween, and at least one of the support members is relatively raised and lowered with respect to the holding surface from the gap.