TW202238750A - Installation tool and installation device characterized by reducing air bubble residues and substrate damage while installing electronic components on a substrate - Google Patents

Abstract

The present invention provides an installation tool and an installation device, and both of them can reduce air bubble residues and substrate damage while installing electronic components on a substrate. The embodiment is the installation tool (31) used to install the electronic component (2) on the substrate (W), having: a holding surface (311) bending the electronic component (2) and raising with a jointed manner; a plurality of openings (312) provided on the holding surface (311); and a plurality of air vents (313) respectively communicated with the openings (312). The air vents (313) hold the electronic component (2) on the holding surface (311) by setting the internal pressure to be negative pressure and allow the electronic component (2) to be separated from the holding surface (311) by sequentially setting the adjacent air vents (313) to be positive pressure from the air vent (313) near the most raised peak part of the holding surface (311).

Description

Installation tools and installation devices

The invention relates to an installation tool and an installation device.

When mounting electronic components such as logic, memory, and image sensors on a substrate, the wafer on which the semiconductor elements are formed is cut to form individual wafers. Then, the wafers are picked up one by one and transferred to a substrate for mounting.

During mounting of such electronic components, air bubbles may remain between the electronic component and the substrate. If there are air bubbles between the electronic parts and the substrate, the connection will be poor and the strength will be insufficient, resulting in poor mounting. In order to cope with this, when mounting electronic components, the electronic components are bent and held in a mounting tool that is pressed against the substrate, and a part of the electronic component is brought into contact with the substrate and pressed with an elastic body, thereby extruding The air between the electronic parts and the substrate is mounted. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent No. 3757193 [Patent Document 2] Japanese Patent Laid-Open No. 2003-203964 [Patent Document 3] Japanese Patent Laid-Open No. 2005-150311

[Problem to be Solved by the Invention]

However, in a tool that deforms and crushes an elastic body while pressing, depending on the size of the electronic component, the pressed area may not spread evenly, or a sufficient force may not be applied to the outer edge, and air bubbles may not be squeezed out. . In addition, an excessive pressing force may be applied to the central portion and electronic components may be damaged.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a mounting tool and a mounting device capable of reducing residual air bubbles and damage to the substrate when mounting electronic components on the substrate. [Means to solve the problem]

The present invention is a mounting tool for mounting an electronic component on a substrate, comprising: a holding surface raised so as to bend and connect the electronic component; a plurality of openings provided on the holding surface; The opening communicates with each other, and the electronic component is held on the holding surface by setting the internal pressure to a negative pressure. The adjacent air holes are set to a positive pressure to detach the electronic component from the holding surface.

The installation device of the present invention has the installation tool, and has: a tool moving mechanism, which makes the installation tool reciprocate between the transfer position and the installation position and lifts up and down between the transfer position and the installation position; contact of a tool; and a switching unit that switches between negative pressure and positive pressure for a vent hole of the mounting tool when the contact is detected by the detection unit. [Effect of the invention]

According to the mounting tool and the mounting device of the present invention, it is possible to reduce residual air bubbles and damage to the substrate when electronic components are mounted on the substrate.

A mounting device according to an embodiment will be described with reference to the drawings. In addition, the drawings are schematic diagrams, and the dimensions, ratios, etc. of each part include exaggerated parts for easy understanding. As shown in Figures 1 and 2, the mounting device 1 includes a supply device 10, a pick-up device 20, a mounting device 30, and a control device 50. The pick-up device 20 transfers the electronic component 2 to the mounting device 30, and the mounting device 30 A device mounted on the substrate W of the substrate stage 60 . Electronic component 2 is, for example, a wafer-shaped component. In this embodiment, the electronic component 2 is a semiconductor wafer obtained by dividing a wafer into individual pieces.

The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20 . The supply apparatus 10 moves the electronic component 2 which is a pick-up object to supply position P1. The supply position P1 is a position where the pick-up device 20 picks up the electronic component 2 as a pick-up object. The supply device 10 includes a supply stage 12 that supports the sheet 11 on which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12 . As the stage moving mechanism 13, for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.

Here, the sheet 11 to which the electronic component 2 is attached is an adhesive wafer sheet attached to a wafer ring not shown. Electronic components 2 are arranged in a matrix on the sheet 11 . In this embodiment, the electronic component 2 is arrange|positioned in the upward state which exposed the functional surface upward.

The supply stage 12 is a stage for horizontally supporting the wafer ring to which the sheet 11 is attached. That is, the sheet 11 on which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by an overload stage moving mechanism 13 . Since the sheet 11 is supported horizontally together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

In addition, as shown in FIGS. 1 and 2 , the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. In addition, the direction orthogonal to the plane of the sheet|seat 11 is called Z-axis direction or an up-down direction. The so-called upward direction is the direction of the side on which the electronic component 2 is placed, which is bounded by the plane of the sheet 11, and the direction of the side where the electronic component 2 is not placed is defined by the plane of the sheet 11 direction.

[pickup device] The pick-up device 20 is a relay device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30 . The pick-up device 20 includes a pick-up nozzle 21 , a nozzle moving mechanism 22 , a direction changing part 23 , and a push-up pin 24 .

The pick-up nozzle 21 is a cylindrical adsorption nozzle that holds the electronic component 2 and releases the holding state to release the electronic component 2 . The pick-up nozzle 21 has a nozzle hole opened on the suction surface at the front end thereof. The nozzle hole communicates with a negative pressure generating circuit (not shown) such as a vacuum pump, and the negative pressure is generated by the circuit, and the electronic component 2 is adsorbed and held by the nozzle hole. In addition, the electronic component 2 is released from the pick-up nozzle 21 by releasing the negative pressure.

The nozzle moving mechanism 22 is a mechanism that reciprocates the pick-up nozzle 21 between the supply position P1 and the delivery position P2, and moves up and down between the supply position P1 and the delivery position P2. Specifically, the nozzle moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222 . In addition, delivery position P2 is a position where the pick-up device 20 delivers the electronic component 2 picked up at the supply position P1 to the mounting tool 31 which functions as the reception part mentioned later.

The supply position P1 and the delivery position P2 mainly refer to positions in the XY direction, and do not necessarily refer to positions in the Z-axis direction. In addition, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2 at the time of delivery of the electronic component 2 , the distance for pushing the electronic component 2 up, the distance for the electronic component 2 to be sucked, and the like.

The slide mechanism 221 reciprocates the pick-up nozzle 21 between the supply position P1 and the delivery position P2. Here, the slide mechanism 221 has the guide rail 221b extended parallel to the X-axis direction, and fixed to the support frame 221a, and the slider 221c which runs on the guide rail 221b. Although not shown, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lift mechanism 222 moves the pickup nozzle 21 in the vertical direction. Specifically, the lift mechanism 222 may use a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 moves up and down along the Z-axis direction by the drive of the servo motor.

The direction changing part 23 is provided between the pick-up nozzle 21 and the nozzle moving mechanism 22 . Here, the direction changing unit 23 is an actuator including a drive source such as a motor for changing the orientation of the pick-up nozzle 21 and a rotating guide such as a ball bearing. The so-called change of direction means to rotate 0° to 180° in the vertical direction. For example, the electronic component 2 is sucked and held at the supply position P1 by the pick-up nozzle 21 whose suction surface faces the supply stage 12 . Thereafter, the direction changing unit 23 changes the direction of the pick-up nozzle 21 so that the suction surface faces upward. At this time, the rotation angle is 180°.

The push-up pin 24 is provided below the sheet 11 of the supply device 10 . The push-up pin 24 is a needle-like member with a sharp tip. The push-up pin 24 is disposed inside the support body 241 such that its length direction is parallel to the Z-axis direction.

The support body 241 has a drive mechanism for moving the push-up pin 24 in and out from the inside or withdrawing therein. The entry and exit or retraction is performed in the up and down direction. The drive mechanism includes, for example, a slider that moves while being guided by vertical guide rails, and an air cylinder or a cam mechanism that drives the slider.

[installation device] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate W. As shown in FIG. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 has a mounting tool 31 and a tool moving mechanism 32 .

The mounting tool 31 is a member that functions as a receiving unit that receives the electronic component 2 from the pick-up nozzle 21 at the transfer position P2, and mounts the electronic component 2 on the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the holding state to release the electronic component 2 after mounting.

Specifically, as shown in FIG. 3(A) and FIG. 3(B) , the mounting tool 31 is a block with a substantially rectangular parallelepiped in cross section, and has a holding surface 311 , an opening 312 , and a vent hole 313 . The holding surface 311 is the bottom surface of the mounting tool 31 and is a surface raised so that the electronic component 2 is bent and connected. The term "curved" refers to bending without forming a corner, and also includes an embodiment called buckling in which a curved surface is formed between flat surfaces as shown in FIG. 3(B) . The holding surface 311 of this embodiment has a mountain shape. The mountain shape referred to here refers to a shape in which two flat surfaces with different angles are gently continuous at a peak portion including the highest peak in the center. That is, the planar shape of the holding surface 311 is rectangular, the center of both sides in the long-side direction is a peak, and the ridge connecting the peaks on both sides is a short-side direction. Furthermore, the holding surface 311 is preferably formed of a hard material so that the mounting tool 31 is prevented from being elastically deformed under pressure during mounting of the electronic component 2 . The holding surface 311 may be rectangular or square in planar shape depending on the electronic component 2 to be mounted. 3(A) to 3(C) and other drawings are schematic diagrams as described above, and the degree of protrusion of the holding surface 311 and the ratio to other parts are exaggerated for easy understanding.

As shown in FIG. 3(C) , a plurality of openings 312 are provided on the holding surface 311 . A plurality of openings 312 are arranged in a plurality of columns. Here, when the holding surface 311 has a rectangular shape, the direction of each column is a direction parallel to the short side thereof. However, it is not limited to the above directions. The openings 312 in this embodiment are provided with two rows of row [ 2 ] and row [ 3 ] on both short side sides of the holding surface 311 across the row [ 1 ] which is a row provided in the peak portion.

There are multiple air holes 313 , and one end of each air hole 313 communicates with each opening 312 . The plurality of vent holes 313 hold the electronic component 2 on the holding surface 311 by setting the pressure in the holes to negative pressure, and successively close the adjacent vent holes 313 to the most raised peak portion of the holding surface 311. The air hole 313 is set to positive pressure, and the electronic component 2 is detached from the holding surface 311 . In the present embodiment, the positive pressure is set sequentially from the air hole 313 on the central side of the electronic component 2 to the adjacent air holes 313 . The other end of each vent hole 313 communicates with an air pressure circuit (not shown) generated by switching negative pressure and positive pressure. In this embodiment, the vent holes 313 of each row are connected to pipes and valves so that negative pressure and positive pressure can be switched for each row. Such a valve functions as a switching unit that switches between negative pressure and positive pressure for the vent hole 313 .

The tool moving mechanism 32 reciprocates the installation tool 31 between the delivery position P2 and the installation position P3, and moves up and down between the delivery position P2 and the installation position P3. The tool moving mechanism 32 has a slide mechanism 321 and an elevating mechanism 322 .

The slide mechanism 321 reciprocates the installation tool 31 between the transfer position P2 and the installation position P3. Here, the slide mechanism 321 has two guide rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c running on the guide rails 321b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. In addition, although not shown in figure, the slide mechanism 321 has a slide mechanism which slides and moves the attachment tool 31 in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider traveling on the guide rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

The elevating mechanism 322 moves the installation tool 31 in the vertical direction by driving the arm on which the installation tool 31 is detachably provided. Specifically, the lift mechanism 322 may use a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor. That is, the mounting tool 31 is raised and lowered in the Z-axis direction by the drive of the servo motor. Furthermore, the detection part 322a which detects the contact with the attachment tool 31 is provided in the lifting mechanism 322. As shown in FIG. As the detection unit 322a, a load sensor such as a strain gauge or a piezoelectric element can be used.

The substrate stage 60 is a stage that supports the substrate W on which the electronic component 2 is mounted. The substrate stage 60 is provided on a stage moving mechanism 61 . The stage moving mechanism 61 is a movement mechanism that slides the substrate stage 60 on the XY plane and positions the mounting position of the electronic component 2 on the substrate W at the mounting position P3. As the stage moving mechanism 61 , for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.

The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10 , the pickup device 20 , the mounting device 30 , and the substrate stage 60 . That is, the control device 50 is a control device of the mounting device 1 . The control device 50 can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. An input device for an operator to input instructions or information necessary for control, and an output device for checking the state of the device are connected to the control device 50 . The input device may use a switch, a touch screen, a keyboard, a mouse, and the like. As the output device, a display unit such as liquid crystal or organic electroluminescence (EL) can be used.

FIG. 4 is a functional block diagram of the control device 50 . The control device 50 has a supply device control unit 51 for controlling the supply device 10, a push pin control unit 52 and a pick-up nozzle control unit 53 for controlling the pickup device 20, a mounting tool control unit 54 for controlling the mounting device 30, and a control unit for controlling the substrate stage 60. A substrate stage control unit 56 and a memory unit 57 .

The supply device control unit 51 controls the movement of the supply stage 12 . That is, the movement of the electronic component 2 as a pick-up object placed on the sheet 11 is controlled. The push-up pin control unit 52 controls the movement of the push-up pin 24 .

The pick-up nozzle control unit 53 controls the movement of the pick-up nozzle 21 , that is, the operation of the nozzle moving mechanism 22 and the direction changing unit 23 . Moreover, the pick-up nozzle control part 53 controls the negative pressure generating circuit which communicates with the nozzle hole 21b, and controls holding and releasing of the electronic component 2.

The installation tool control unit 54 controls the movement of the installation tool 31 , that is, the operation of the tool moving mechanism 32 . In addition, the mounting tool control unit 54 controls the air pressure circuit communicated with the vent holes 313 of the mounting tool 31 to switch the negative pressure and positive pressure of the openings 312 of each row to control holding and releasing of the electronic component 2 . In addition, the attachment tool control unit 54 controls switching between the negative pressure and the positive pressure of the vent hole 313 based on the contact detection by the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60 , that is, the operation of the stage moving mechanism 61 .

The memory unit 57 is a memory device including various memories (hard disk drives (HDD) or solid state drives (SSD)) as recording media, recording media, and external interfaces. Data and programs necessary for the operation of the mounting device 1 are stored in advance in the storage unit 57 , and data necessary for the operation of the mounting device 1 is stored therein. The so-called required data are, for example, the position coordinates of the supply position P1, the delivery position P2, and the installation position P3, and the position coordinates of each moving mechanism. Each of the movement mechanisms performs movement control of each structure based on these coordinates. In addition, the timing at which one of the rows of the air holes 313 of the mounting tool 31 is switched from negative pressure to positive pressure is stored in the memory unit 57 .

[action] The operation of the mounting device 1 as described above will be described. First, the pickup device 20 picks up the electronic component 2 from the supply device 10 and delivers the electronic component 2 to the mounting device 30 . That is, the pick-up nozzle 21 is moved to the supply position P1 where the push-up pin 24 is located by the pick-up device 20 , and the nozzle hole 21 b of the pick-up nozzle 21 faces the push-up pin 24 .

On the other hand, the supply apparatus 10 moves the supply stage 12 so that the electronic component 2 which is a pick-up object is located in supply position P1. After that, the pickup nozzle 21 is lowered to bring the suction surface into contact with the electronic component 2 at the supply position P1 to suction the electronic component 2 . Then, the electronic component 2 is picked up while the electronic component 2 is peeled off from the sheet 11 by raising the pick-up nozzle 21 while holding the electronic component 2 while pushing up the electronic component 2 with the push-up pin 24 .

The pick-up device 20 reverses the pick-up nozzle 21 by the direction changing part 23 . That is, the orientation of the pick-up nozzle 21 is rotated 180° in the vertical direction, and the suction surface of the pick-up nozzle 21 is directed upward. Furthermore, the reverse operation may be performed at any point between the supply position P1 and the transfer position P2.

The pick-up device 20 moves the picked-up electronic components 2 to the delivery position P2 through the nozzle moving mechanism 22 . The mounting tool 31 of the mounting device 30 is moved to the transfer position P2 by the tool moving mechanism 32 and waits, and the holding surface 311 of the mounting tool 31 faces the nozzle hole 21b of the pick-up nozzle 21 via the electronic component 2 .

Then, after the mounting tool 31 is lowered toward the pick-up nozzle 21 located at the delivery position P2, and the negative pressure is applied to the vent hole 313 of the mounting tool 31 to hold the electronic component 2, the pick-up nozzle 21 releases the negative pressure, thereby removing the negative pressure from the pick-up nozzle 21. The electronic component 2 is handed over to the mounting tool 31 . As a result, the electronic component 2 is curved so as to follow the bulge of the holding surface 311 and is sucked and held.

Thereafter, the mounting tool 31 moves to the mounting position P3, and the electronic component 2 is mounted on the substrate W. As shown in FIG. The mounting operation will be described with reference to the flowchart in FIG. 5 and the operation explanatory diagram in FIG. 6 . First, the mounting tool 31 moves to the mounting position P3, and as shown in FIG. 6(A) , the electronic component 2 held by the mounting tool 31 faces the substrate W (step S01 ). Then, the mounting tool 31 descends to bring the electronic component 2 close to the substrate W (step S02 ).

When the detection part 322a of the mounting tool 31 detects contact of the electronic component 2 and the board|substrate W (YES of step S03), the mounting tool 31 stops descending (step S04). Then, the electronic component 2 is detached and mounted on the substrate W by sequentially stopping the negative pressure from a part of the vent hole 313 and setting it to a positive pressure. That is, switch to positive pressure in the order of column [1], column [2] and column [3] shown in (A) to (C) of FIG. 3, and blow air from the opening 312 (step S05 to S07).

At this time, as shown in FIG. 6(B), FIG. 6(C), and FIG. 6(D), the electronic components 2 corresponding to the most raised peak portion of the holding surface 311 among the rows of vent holes 313 The part of the peak part is initially in contact with the substrate W, and the negative pressure (the white arrow in the figure) is switched to the positive pressure (the black arrow in the figure) sequentially from the column of the peak part to the adjacent column. As a result, the curved electronic component 2 is gradually detached from the peak portion outward to follow the flat surface of the substrate W, and thus air bubbles are removed to the outside while being mounted on the substrate W. After mounting, as shown in (E) of FIG. 6 , the mounting tool 31 is raised, and the electronic component 2 is left to retreat from the substrate W (step S08 ).

[Effect] (1) This embodiment is a mounting tool 31 for mounting the electronic component 2 on the substrate W, and has: a holding surface 311 raised in such a way that the electronic component 2 is bent and connected; a plurality of openings 312 are provided on the holding surface 311; And a plurality of ventilation holes 313 are provided in communication with the plurality of openings 312 respectively. The plurality of ventilation holes 313 hold the electronic component 2 on the holding surface 311 by setting the internal pressure as a negative pressure, and by self-approaching the holding surface 311 Starting from the air hole 313 at the most raised peak portion, the adjacent air holes 313 are sequentially set to positive pressure to detach the electronic component 2 from the holding surface 311 .

In addition, the mounting device 1 of the present embodiment has a mounting tool 31, and has: a tool moving mechanism 32, which reciprocates the mounting tool 31 between the transfer position and the mounting position, and lifts the mounting tool 31 between the transfer position and the mounting position; The contact pressure to the mounting tool 31 ; and the switching unit switches the negative pressure and the positive pressure to the vent hole 313 of the mounting tool 31 when the contact is detected by the detection unit 322 a.

Therefore, since the electronic component 2 is bent by the negative pressure and held on the holding surface 311, the vent holes are sequentially set to a positive pressure, thereby making the electronic component 2 flat in a manner similar to the substrate W. Bubbles while installing. Thereby, air bubbles can be suppressed from remaining between the electronic component 2 and the substrate W, and mounting defects can be reduced. Since the electronic component 2 itself is mounted by bending and restoring, the pressing force acts uniformly without being biased, air bubbles can be evenly squeezed out, and damage to the electronic component 2 can also be reduced.

(2) A plurality of openings 312 are formed by being arranged in a plurality of rows. Therefore, by sequentially switching the negative pressure to the positive pressure for each row, it is possible to mount the curved portion flatly while preventing excessive force from being applied to a part of the electronic component 2 .

(3) From among the plurality of vent holes 313 , the adjacent vent holes 313 are set to positive pressure sequentially from the vent hole 313 near the most raised peak portion of the holding surface 311 . Therefore, from the portion where the electronic component 2 first comes into contact with the substrate W, air bubbles can be discharged gradually toward the outer edge in contact with the substrate W. Furthermore, by making each row parallel to the short-side direction, it is possible to generate bending in the long-side direction in which the rectangular electronic component 2 is easily deformed.

(4) The holding surface 311 has a mountain shape. Therefore, by gradually flattening the outer edge substrate W toward both sides across the central peak portion, it is only necessary to shorten the distance in contact with the substrate W while returning the curvature from the center of the electronic component 2 to flattening. There is less worry about entering air bubbles, too. Furthermore, by forming a mountain shape on the long side of the holding surface 311 and setting the ridge lines connecting the peaks in the short side direction, bending occurs in the long side direction of the electronic component 2 , so that the electronic component 2 can easily follow the holding surface 311 . Furthermore, the ridge lines connecting the peak portions may be provided on either side of the holding surface 311 . For example, when a ridge line is provided on the short side of one end, the electronic component 2 is in contact with the substrate W from one end to the other end by sequentially applying positive pressure from one end to the other end. Even in this case, the effect that damage to the electronic component 2 can be reduced while removing air bubbles can be obtained. The electronic component 2 does not bend, which further reduces the risk of damage. For example, in the case of a column having openings 312 as shown in FIG. , column [3] switches from negative pressure to positive pressure.

[modified example] This embodiment can also apply the following modified examples. (1) The holding surface 311 may also be a curved surface. For example, as shown in FIG. 7 , the holding surface 311 may have a raised shape like a part of the side surface of a cylinder. In addition, a part of the side surface of the cylinder mentioned here also includes a part of a circular, elliptical, rounded rectangular, or racetrack-shaped cylindrical body in cross section. Thereby, the bending of the electronic component 2 becomes gentle, and the influence on the electronic component 2 can be suppressed. Furthermore, in the above-mentioned embodiment, the opening 312 is provided at the ridge line part connecting the peak part. However, the opening 312 does not necessarily need to be provided on the ridge line, and may be provided near it. The same effect as described above can be obtained by sequentially changing from the negative pressure to the positive pressure in the air hole 313 of each opening 312 from the position close to the ridge line. In addition, even in the case of such a curved surface, the ridge line portion may be provided on either side of the holding surface 311 .

(2) When the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21 , negative pressure may be applied to the adjacent ventilation holes 313 sequentially from a part of the ventilation holes 313 on the holding surface 311 . That is, when the mounting tool 31 receives the electronic component 2 , even if the electronic component 2 is bent to follow the holding surface 311 , if a part floats or deviates, problems such as the inability to recognize the position of the electronic component 2 arise. Also, if the electronic component 2 is to be mounted in a state where the electronic component 2 is lifted or leaned, there is a possibility that air bubbles may be trapped due to a timing shift when the electronic component 2 is separated from the ridgeline along the outer edge.

For example, the adjacent vent holes 313 may be set to negative pressure sequentially from the vent hole 313 near the most raised peak portion of the holding surface 311 among the plurality of vent holes 313 . More specifically, as shown in (A) of FIG. 8 , when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection part 322 a detects the contact, the contact between (B) to (D) of FIG. 8 As shown, from the row [1] of the opening 312, the row [2] and the row [3] (see (B) of FIG. 3 ) are set to negative pressure in order. Thereby, the electronic component 2 can be gradually bent in the manner of the holding surface 311, and the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21, so that lifting or deviation is suppressed, and position recognition failure can be prevented. In addition, since the floating and leaning are reduced, when the electronic component 2 is mounted, it is difficult to deviate in the timing of detachment, and the possibility of trapping air bubbles can be reduced.

[Other Embodiments] The present invention is not limited to the above-described embodiments, and includes other embodiments described below. In addition, the present invention also includes all or arbitrary combinations of the aforementioned embodiments and other embodiments described below. Furthermore, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and the modifications are also included in the present invention.

1: Install the device 2: Electronic parts 10: Supply device 11: sheet 12: Supply carrier 13: Stage moving mechanism 20: Pickup device 21: Pick up the nozzle 21b: Nozzle hole 22: Nozzle moving mechanism 23: Direction conversion department 24: Upsell 30: Mounting device 31: Installation tool 32: Tool moving mechanism 50: Control device 51: Supply device control unit 52: Upsell control department 53: Pick up nozzle control unit 54: Install Tool Control 56: Substrate carrier control unit 57: memory department 60: Substrate carrier 61: Stage moving mechanism 221, 321: sliding mechanism 221a, 321a: Support frame 221b, 321b: guide rail 221c, 321c: slider 222, 322: lifting mechanism 241: support body 311: keep surface 312: opening 313: ventilation hole 322a: Detection Department P1: supply position P2: handover position P3: Installation position S01, S02, S03, S04, S05, S06, S07, S08: steps W: Substrate [1], [2], [3]: columns

Fig. 1 is a front view showing a mounting device according to an embodiment. Fig. 2 is a plan view showing the mounting device of the embodiment. 3(A) to 3(C) are a side view (A), a cross-sectional view (B), and a bottom view (C) showing the mounting tool according to the embodiment. Fig. 4 is a functional block diagram of the control device according to the embodiment. Fig. 5 is a flow chart showing the procedure for mounting the electronic components of the embodiment. 6(A) to 6(E) are explanatory diagrams showing an embodiment of mounting electronic components according to the embodiment. Fig. 7 is a cross-sectional view showing a modified example of the mounting tool. 8(A) to 8(D) are explanatory diagrams showing an embodiment of receiving electronic components using a mounting tool.

2: Electronic parts

31: Installation tool

311: keep surface

312: opening

313: ventilation hole

[1], [2], [3]: columns

Claims (6)

A mounting tool, which is a mounting tool for mounting electronic parts on a substrate, has: the retaining surface is raised in such a way as to bend and meet the electronic parts; a plurality of openings disposed on the retaining surface; and a plurality of ventilation holes are respectively provided in communication with the plurality of openings, A plurality of the air holes hold the electronic part on the holding surface by setting the internal pressure to negative pressure, by starting from the air holes near the most raised peak portion of the holding surface, The adjacent air holes are sequentially set to positive pressure to detach the electronic component from the holding surface. The installation tool as described in claim item 1, wherein The plurality of openings are formed by being arranged in a plurality of rows. The installation tool as described in claim 1 or claim 2, wherein The retaining surface is mountain-shaped. The installation tool as described in claim 1 or claim 2, wherein The retaining surface is a curved surface. An installation device, wherein, has the installation tool according to any one of claims 1 to 4, and has: a tool moving mechanism, which reciprocates the installation tool between the handover position and the installation position and lifts between the handover position and the installation position; a detection section that detects contact with the installation tool; and The switching unit switches between a negative pressure and a positive pressure for a vent hole of the attachment tool when the contact is detected by the detection unit. The installation device as described in claim 5, wherein From among the plurality of ventilation holes, the ventilation holes adjacent to the most elevated peak portion of the holding surface are sequentially set to a negative pressure.

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