JP3757193B2 - Semiconductor chip bonding method and apparatus - Google Patents

Semiconductor chip bonding method and apparatus Download PDF

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JP3757193B2
JP3757193B2 JP2002179012A JP2002179012A JP3757193B2 JP 3757193 B2 JP3757193 B2 JP 3757193B2 JP 2002179012 A JP2002179012 A JP 2002179012A JP 2002179012 A JP2002179012 A JP 2002179012A JP 3757193 B2 JP3757193 B2 JP 3757193B2
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semiconductor chip
adherend
fixture
suction
adhesive
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JP2004022995A (en
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仁 木下
守次 森田
邦夫 西原
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Mitsui Chemicals Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

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  • Computer Hardware Design (AREA)
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  • Die Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To suppress generation of voids without involving airbubbles into the adhesive between a semiconductor chip 5 and an object 18 being bonded. <P>SOLUTION: One surface 23 of the semiconductor chip 5 is supported on the suction plane 9 of a resilient suction member 6 of a fixing tool 2 by vacuum suction using a negative pressure supplied through the vents 11, thus bringing the semiconductor chip 5 bent upward. The semiconductor chip 5 is then applied, to the other surface 24 thereof, with adhesive 26 and pressed against an object 18 being bonded, e.g. a lead frame or a wiring board, being displaced in proximity to each other. The adhesive 26 may be film-like or paste-like and a flexible object 35 being bonded, e.g. a film-like wiring board, may be bent upward on a resilient supporting member 33. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、薄片状の半導体チップを、被着体であるリードフレーム、パッケージまたは配線基板などに取付けてボンディングするための方法および装置に関する。
【０００２】
【従来の技術】
従来から、半導体チップをリードフレーム、パッケージおよび配線基板などの被着体に、ダイアタッチ剤などと呼ばれる接着剤を用いて接着するにあたり、半導体チップをコレットで真空吸着し、接着剤を介して被着体に熱圧着する手法が採られている。この熱圧着時、半導体チップの被着体に対向する表面は、平面に維持された状態に保たれる。この先行技術では、半導体チップと被着体との間に介在された接着剤にボイドが入りやすく、したがって実装時のはんだ付け熱処理などのリフロー工程で、接着剤が吸湿した水分がリフローはんだ付けの実装時、加熱によって水蒸気化し、接着剤の破壊が生じ、亀裂が発生する。
【０００３】
この問題を解決する先行技術は、たとえば特開２００１−１７６８９５に開示される。この先行技術では、フィルム状接着剤である有機ダイボンディング材を用い、これによってボイド発生を防ごうとしている。この先行技術でもまた、半導体チップの平坦な表面と被着体の平坦な取付面とを接着する構成を有し、したがってフィルム状有機ダイボンディング材中に空気を巻き込み、気泡が残りやすいという問題がある。
【０００４】
【発明が解決しようとする課題】
本発明の目的は、半導体チップと被着体との間に介在される接着剤にボイドが発生することを防ぐようにした半導体チップのボンディング方法および装置を提供することである。
【０００５】
【課題を解決するための手段】
本発明は、半導体チップの一方の表面を支持し、被着体の取付面に向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して加熱押圧し、その後、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法である。
【０００６】
また本発明は、半導体チップの彎曲変形時のばね定数よりも大きいばね定数を有する弾力性のある吸着部材の外方の凸の吸着面に、半導体チップの前記一方の表面を、真空吸着して、半導体チップを、前記凸に彎曲変形させることを特徴とする。
【０００７】
また本発明は、取付具を準備し、
この取付具は、
自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
吸着部材の厚み方向に吸着面とは反対側の基端部が固定される通路が形成された取付具本体とを含み、
通気孔を負圧源によって負圧とし、
吸着面に、半導体チップの一方の表面を真空吸着して、半導体チップを外方に凸の形状に彎曲し、
半導体チップの他方の表面と被着体の取付面との間に、接着剤を介在し、
取付具本体と被着体とを、相互に近接変位して加熱押圧し、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法である。
【０００８】
また本発明は、（ａ）取付具であって、
（ａ１）自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
（ａ２）吸着部材の厚み方向に吸着面とは反対側の基端部が固定される取付具本体とを有する取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）取付具と被着体とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置である。
【０００９】
また本発明は、吸着部材のばね定数は、半導体チップの彎曲変形時のばね定数よりも大きく選ばれることを特徴とする。
【００１０】
本発明に従えば、図１〜図４に関連して後述されるように、半導体チップの一方の表面を、たとえば取付具の吸着部材の吸着面に負圧によって真空吸着して保持し、これによって半導体チップを被着体に向って凸に、半導体チップの弾発力によって湾曲変形させ、この状態で、被着体の取付面に、接着剤を介在して加熱押圧し、その後、半導体チップを平坦な状態にする。こうして接着剤に、空気の気泡が巻き込まれることが確実に防がれ、ボイドの発生を防ぐことができる。接着剤は、粘性のある液体、すなわちペースト状であってもよく、またはフィルム状であってもよい。
【００１１】
半導体チップの湾曲変形された凸の頂部を先に、接着剤を介して被着体の取付面に相互に近接変位して押圧するようにしてもよいが、他の実施の形態では、ロールラミネートの要領で半導体チップの一端部から頂部を経て他端部に順次的に押圧して接着するようにしてもよい。接着剤は、半導体チップの前記他方の表面に付着されてもよいが、被着体の取付面上に付着されてもよく、あるいはまた半導体チップの前記他方の表面と被着体の前記取付面との両者に付着されていてもよい。
【００１２】
半導体チップを凸に湾曲変形させるには、上述のように弾力性を有する吸着部材の吸着面に負圧によって真空吸着するようにしてもよいが、他の実施の形態では、半導体チップの前記一方の表面を取付具に、粘着剤、両面テープなどを介して、剥離可能に保持してもよい。
【００１３】
吸着部材が弾力性を有する材料から成る構成では、そのばね定数を、半導体チップのばね定数よりも大きく選び、すなわち吸着部材を、半導体チップに比べて弾性変形しにくい材料製とし、これによって半導体チップの前記一方の表面を、吸着部材の外方に凸である吸着面に沿って真空吸着することが確実になる。
【００１４】
半導体チップは、近年の薄削り技術の発達によって、湾曲してたわませても破損しない強度を有し、これによって本発明の実施が可能である。半導体チップの裏面研磨後の加工変質層をエッチングなどで取除いて平滑にすることが好ましく、これによって半導体チップの強度が改善され、半導体チップを湾曲変形させたとき、破損することを抑制することができる。
【００１５】
また本発明は、半導体チップの一方の表面を支持し、
可撓性被着体を、その取付面が半導体チップに向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して押圧し、その後、被着体の取付面を平坦な状態にすることを特徴とする半導体チップのボンディング方法である。
【００１６】
また本発明は、半導体チップの前記一方の表面を真空吸着して保持することを特徴とする。
【００１７】
また本発明は、（ａ）半導体チップの吸着面を有し、この吸着面に開口する通気孔が形成されて構成される取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）支持部材であって、
取付具の吸着面に対向する被着体の支持面を有し、
支持面は、吸着面に向って凸に形成され、
弾力性を有する材料から成る支持部材と、
（ｄ）取付具と支持部材とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置である。
【００１８】
また本発明は、支持部材のばね定数は、支持面上に置かれる被着体のばね定数よりも大きく選ばれることを特徴とする。
【００１９】
本発明に従えば、図５および図６に関連して後述されるように、柔軟性のある可撓性を有するフィルム状などの被着体を、たとえば弾力性を有する支持部材の支持面に配置して、その取付面は、自然状態では、半導体チップに向って凸に湾曲しており、この状態で取付具のたとえば吸着面に、真空吸着によって半導体チップの一方の表面を支持し、接着剤を介在して半導体チップと被着体とを相互に近接変位して押圧する。こうして接着剤に空気の気泡を巻き込まず、ボイドの発生を抑制して、半導体チップの他方の表面と被着体の取付面との接着を行うことが可能になる。
【００２０】
半導体チップは、たとえば平坦であって、湾曲変形した被着体の取付面の頂部に半導体チップの前記一方の表面を接着剤を介して接触して押圧するようにしてもよいが、他の実施の形態では、いわゆるロールラミネート要領で半導体チップの前記他方の表面の一端部から中央部を経て他端部に順に接触させて、接着剤を介して被着体の取付面に押圧するようにしてもよい。
【００２１】
また本発明は、接着剤は、フィルム状であることを特徴とする。
本発明に従えば、接着剤をフィルム状とし、たとえばフィルム状有機ダイボンディング材などを用いてもよい。これによって（１）厚み精度の向上を図り、（２）ペースト状接着剤を使用したときに生じる半導体チップの外側方へのペースト状接着剤のはみ出し量に比べて、フィルム状接着剤のはみ出し量の抑制を図ることができるとともに、（３）ボイドの発生をさらに一層抑制することができる。
【００２２】
【発明の実施の形態】
図１は、本発明の実施の一形態の全体の構成を示す縦断面図である。このボンディング装置１は基本的に、取付具２と、負圧源３と、この取付具２を図１の上下に変位して駆動する変位駆動手段４とを含む。取付具２は、半導体チップ５を真空吸着する吸着部材６と、この吸着部材６の基端部７が固定される取付具本体８とを含む。
【００２３】
吸着部材６は、弾力性を有し、耐熱性のある材料、たとえば軟質合成樹脂材料、たとえばシリコーンゴム、フッ素系ゴムなどの材料から成る。この吸着部材６は、図１に示される自然状態で外方に凸である吸着面９を有する。すなわち吸着面９は、自然状態で図１の下方である外方に凸である。吸着面９は、図１の紙面に垂直な軸線を有する円筒面の周方向にわたる一部分であってもよい。吸着部材６には、吸着面９に開口する厚み方向（図１の上下方向）に延びる通気孔１１が複数個、点在して形成される。本発明の実施の他の形態では、吸着部材６は、ポーラス状の多孔質材料製とし、吸着面９以外の部分をシール剤などで封止した構造によって実現されてもよい。
【００２４】
取付具本体８は、負圧室１２を有する。取付具本体８は、たとえば金属製であり、剛性である。この負圧室１２は、通路１３を介して、通気孔１１に連なる。吸着部材６の基端部７は、吸着部材６の厚み方向に吸着面９と反対側（図１の上方）にあり、前述のように通路１３が通気孔１１と連通するように配置されて、取付具本体８の下部に固定される。負圧室１２は、可撓管１４を介して負圧源３に連結される。取付具本体８の吸着部材６が取付けられる取付部４１には、電気ヒータなどの加熱手段４２が設けられる。加熱手段４２は、吸着部材６を介して半導体チップ５を、接着に適した温度に加熱する。
【００２５】
装置本体１６の基台１７には、被着体である配線基板１８が配置される。装置本体１６の立上り部１９には、変位駆動手段４が設けられ、取付具２を、図１に示される上限位置から、矢符２１に示すように、下降し、取付具２と基板１８とを、相互に近接変位して押圧する。基台１７には、負圧室４３と、この負圧室４３に電通して基板１８を真空吸着するための通路４４が形成される。負圧室４３は、可撓管１４を介して負圧源３に接続される。基台１７にはまた、通路４４による負圧によって真空吸着された基板１８を、接着に適した温度に加熱するための電気ヒータなどの加熱手段４５が設けられる。
【００２６】
薄削りされた薄片である自然状態で偏平な半導体チップ５を基板１８にボンディングするにあたっては、先ず図１に示されるように、その半導体チップ５の図１の上方である一方の表面２３を、吸着部材６の吸着面９に真空吸着して、半導体チップ５を図１の下方である外方に凸の形状に弾発的に湾曲変形させる。この半導体チップ５の図１の下方である他方の表面２４には、フィルム状接着剤２６が接着される。
【００２７】
フィルム状接着剤２６は、たとえばワニスをキャリアフィルムに塗工し、溶剤を揮発させ、キャリアフィルムから剥離した有機ダイボンディング材などであってもよいが、ペースト状であってもよい。このような接着剤２６は、たとえばポリイミド樹脂、エポキシ樹脂などから成ってもよい。接着剤２６は、熱可塑性合成樹脂などであってもよく、ホットメルト接着剤であってもよい。
【００２８】
図２は、半導体チップ５が接着剤２６を介して基板１８に接触した状態を示す一部の断面図である。図１の状態で、変位駆動手段４は、取付具２を矢符２１で示されるように下降する。これによって半導体チップ５の凸に湾曲した表面２４の図２における最下部である頂部２８は、接着剤２６を介して、先ず押圧される。
【００２９】
図３は、図１および図２に示されるボンディング装置１における変位駆動手段４によって取付具２が図２の状態からさらに下降された状態を示す。取付具２が変位駆動手段４によって下降されると、吸着部材６が弾性変形して圧縮され、こうして取付具本体８と基板１８とが押圧されて、吸着部材６が圧縮される。こうして半導体チップ５は、頂部２８から、次に、図３の左右の端部２９，３０に、左右対称に接触面が拡ってゆき、接着剤２６を介して基板１８の取付面３１に面接触される。こうして接着剤２６と基板１８の取付面３１とが、前述の頂部２８に対応する位置から左右に接触して拡ってゆく。取付具３は、図３の下限位置に達する。したがって接着剤２６内に空気の気泡が巻き込まれることはなく、ボイドの発生が防がれる。
【００３０】
また接着温度での接着剤２６の溶融粘度、吸着部材６の凸を平面に変形するのに要する圧力、凸変形弾性などを適切な値にそれぞれ選ぶ必要があり、さもなければ半導体チップ５が下に凸に変形したままで基板１８の取付面３１に接着されてしまう恐れがある。したがって、接着剤２６の物性に適合するように、吸着部材６などの物性を調整して選択する必要がある。
【００３１】
図４は、図１〜図３に示される実施の形態において、半導体チップ５を、接着剤２６を介して基板１８に接着して固定した状態を示す断面図である。前述の図３において、変位駆動手段４によって取付具２を下降変位し、接着剤２６の図３における下面の全面が、基板１８の平坦な取付面３１に面接触し、さらに接着に必要な圧力が加えられて押圧された状態が、予め定める時間、維持される。その後、負圧源３による吸着部材６の吸着面９における半導体チップ５の真空吸引が解除される。さらにその後、変位駆動手段４によって取付具２が上昇され、図１の上限１に戻る。こうして半導体チップ５の表面２４は、接着剤２６を介して基板１８の取付面３１に接着して固定される。
【００３２】
図５は、本発明の実施の他の形態のボンディング装置１ａの全体の構成を簡略化して示す断面図である。この実施の形態は、前述の図１〜図４に関連して前述した実施の形態に類似し、対応する部分の参照符には同一の数字を用い、また添え字ａを付して示す。注目すべきはこの実施の形態では、取付具本体８の下部は、吸着部材６ａを構成し、この吸着部材６ａには、複数の通気孔１１が点在して形成される。この吸着部材６の図５における下面である吸着面９ａは、扁平であり、矢符２１に垂直である。自然状態で扁平な半導体チップ５の一方の表面２３は、吸着面９に、真空吸着される。半導体チップ５の他方の表面２４には、前述の実施の形態と同様に接着剤２６が付着される。
【００３３】
基台１７上には、支持部材３３が設けられる。この支持部材３３は、弾力性を有する材料から成り、たとえば前述の実施の形態における吸着剤６と同様な材料から成ってもよい。支持部材３３は、取付具２ａにおける吸着部材６の吸着面９に対向する図５の上方に臨む支持面３４を有する。この支持面３４は、吸着面９ａに向って凸に形成される。支持面３４は、図５の紙面に垂直な軸線を有する円筒面の周方向に延びる一部分であってもよい。支持面３４上には、可撓性を有する被着体である、たとえばフレキシブル回路基板３５が載置され、これによって基板３５は、支持面３４上で図５の上方である外方に凸の形状で支持されて配置される。
【００３４】
半導体チップ５の一方の表面２３は、前述のように吸着部材６ａの吸着面９ａに真空吸着され、他方の表面２４には、接着剤２６が付着される。また前述のように支持部材３３の支持面３４上に可撓性基板３５が配置される。基台１７に形成された負圧室４３は、通路４４を介して、支持部材３３に形成された通気孔４６を介して基板３５の支持面３４を真空吸着する。この状態で、変位駆動手段４は、図５の矢符２１で示されるように、取付具２ａを図５の上限位置から下降して取付具２ａと基板３５を支持した支持部材３３とを相互に近接変位して押圧する。
【００３５】
図６は、図５に示される実施の形態における半導体チップ５が取付具２ａによって基板３５に押圧された状態を示す一部の断面図である。取付具２ａが矢符２１に示されるように下降されることによって先ず、支持面３４の頂部３６に対応する基板３５の部分に接触する。その後、さらに取付具２ａが変位駆動手段４によって下降変位されることによって、基板３５の半導体チップ５が取付られる取付面３７の接着剤２６と接触する位置が、図５および図６の左右方向に順次的に拡ってゆく。支持部材３３は、変位駆動手段４による取付具２ａの下降によって、圧縮変形される。こうして図６の状態では、半導体チップ５の表面２４は、接着剤２６を介して基板３５の取付面３７に面接触して接着される。こうして変位駆動手段４によって取付具２ａが図６の下限位置に到達し、接着剤２６による接着に必要な圧力および時間が保たれる。その後、負圧室１２における負圧源３ａによる負圧が解除される。したがって吸着部材６ａによる半導体チップ５の真空吸引が行われなくなる。その後、変位駆動手段４によって取付具２ａが上昇変位され、図５の状態に戻る。
【００３６】
本件発明者の実験結果を述べる。図１〜図４の実施の形態におけるボンディング装置１を用い、２５μｍ厚のフィルム状接着剤２６を、半導体チップ５の表面２４に貼り付けた。この半導体チップ５は、平面形状が縦１０×横１０ｍｍであり、５０μｍ厚を有する。半導体チップ５は、Ｓｉから成る。この半導体チップ５の表面２３は、両面粘着テープで、凸状の弾性吸着部材６に貼り付け、加熱されたガラス基板１８に熱圧着した。比較例では、上述の実施例と同一形状の半導体チップ５を、平面を有する剛体に両面粘着テープで貼り付け、加熱されたガラス基板１８に、熱圧着した。
【００３７】
本件発明者のこのような実験によれば、ガラス基板１８側から取付面３１のボイドを観察した結果、比較例に比べて本発明に従う実施例の方が、空気を巻き込んだ面積が少なく、本発明が優れていることが、確認された。
【００３８】
【発明の効果】
本発明によれば、半導体チップを被着体に対して凸に湾曲変形し、または柔軟性のある可撓性被着体を、凸に湾曲変形した状態で、接着剤を介在して接触し押圧するようにしたので、接着剤中に気泡を巻き込みにくくなり、ボイドの無い接着を達成することができる。特にフィルム状有機ボンディング材などのフィルム状接着剤を用いて、ボイドの発生をさらに一層抑制することができるようになる。
【図面の簡単な説明】
【図１】本発明の実施の一形態の全体の構成を示す縦断面図である。
【図２】半導体チップ５が接着剤２６を介して基板１８に接触した状態を示す一部の断面図である。
【図３】図１および図２に示されるボンディング装置１における変位駆動手段４によって取付具２が図２の状態からさらに下降された状態を示す。
【図４】図１〜図３に示される実施の形態において、半導体チップ５を、接着剤２６を介して基板１８に接着して固定した状態を示す断面図である。
【図５】本発明の実施の他の形態のボンディング装置１ａの全体の構成を簡略化して示す断面図である。
【図６】図５に示される実施の形態における半導体チップ５が取付具２ａによって基板３５に押圧された状態を示す一部の断面図である。
【符号の説明】
１，１ａ ボンディング装置
２，２ａ 取付具
３ 負圧源
４ 変位駆動手段
５ 半導体チップ
６，６ａ 吸着部材
７ 基端部
８ 取付具本体
９，９ａ 吸着面
１１ 通気孔
１２ 負圧室
１８，３５ 基板
２３ 一方の表面
２４ 他方の表面
２６ フィルム状接着剤
３１ 取付面
３３ 支持部材
３４ 支持面
３７ 取付面[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and an apparatus for attaching and bonding a flaky semiconductor chip to a lead frame, a package, a wiring board or the like as an adherend.
[0002]
[Prior art]
Conventionally, when adhering a semiconductor chip to an adherend such as a lead frame, a package, and a wiring board using an adhesive called a die attach agent, the semiconductor chip is vacuum-adsorbed with a collet, and the semiconductor chip is attached via the adhesive. A technique of thermocompression bonding to the adherend is employed. During this thermocompression bonding, the surface of the semiconductor chip facing the adherend is kept in a flat state. In this prior art, voids easily enter the adhesive interposed between the semiconductor chip and the adherend, and therefore the moisture absorbed by the adhesive is reflow soldered in the reflow process such as soldering heat treatment during mounting. At the time of mounting, it is vaporized by heating, the adhesive is destroyed, and a crack is generated.
[0003]
Prior art that solves this problem is disclosed in, for example, Japanese Patent Laid-Open No. 2001-176895. In this prior art, an organic die bonding material, which is a film adhesive, is used to prevent the generation of voids. This prior art also has a configuration in which the flat surface of the semiconductor chip and the flat mounting surface of the adherend are bonded, so that air is easily trapped in the film-like organic die bonding material, and bubbles are likely to remain. is there.
[0004]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor chip bonding method and apparatus that prevent the generation of voids in an adhesive interposed between a semiconductor chip and an adherend.
[0005]
[Means for Solving the Problems]
The present invention supports one surface of a semiconductor chip, and is bent into a convex shape toward the attachment surface of the adherend,
With the adhesive interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
The semiconductor chip bonding method is characterized in that the semiconductor chip and the adherend are displaced close to each other and heated and pressed, and then the semiconductor chip is brought into a flat state.
[0006]
Further, the present invention provides a method in which the one surface of the semiconductor chip is vacuum-sucked to the outer convex suction surface of the elastic suction member having a spring constant larger than that at the time of bending deformation of the semiconductor chip. The semiconductor chip is bent and deformed into the convex shape.
[0007]
The present invention also provides a fixture,
This fixture is
A suction member made of an elastic material having a suction surface that protrudes outward in a natural state, a vent hole extending in the thickness direction opening in the suction surface is formed;
A fixture body formed with a passage in which a base end opposite to the suction surface is fixed in the thickness direction of the suction member;
Make the air vent negative with a negative pressure source,
One surface of the semiconductor chip is vacuum-sucked on the suction surface, and the semiconductor chip is bent into a convex shape outward,
An adhesive is interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
A bonding method of a semiconductor chip, wherein the fixture main body and the adherend are displaced closely to each other and heated and pressed to bring the semiconductor chip into a flat state.
[0008]
The present invention also provides (a) a fixture,
(A1) an adsorbing member made of an elastic material having an adsorbing surface that is convex outward in a natural state and having a vent hole extending in the thickness direction that opens in the adsorbing surface;
(A2) a fixture having a fixture body to which a base end opposite to the suction surface is fixed in the thickness direction of the suction member;
(B) a negative pressure source having a negative pressure at the vent;
(C) A bonding apparatus for a semiconductor chip, comprising: a displacement driving means that presses the fixture and the adherend in close proximity to each other.
[0009]
Further, the present invention is characterized in that the spring constant of the adsorption member is selected to be larger than the spring constant at the time of bending deformation of the semiconductor chip.
[0010]
According to the present invention, as will be described later with reference to FIGS. 1 to 4, one surface of the semiconductor chip is held by vacuum suction, for example, by a negative pressure on the suction surface of the suction member of the fixture. The semiconductor chip is convexly convex toward the adherend by the elastic force of the semiconductor chip, and in this state, the attachment surface of the adherend is heated and pressed through an adhesive, and then the semiconductor chip. To a flat state. In this way, air bubbles are reliably prevented from being caught in the adhesive, and voids can be prevented from being generated. The adhesive may be a viscous liquid, i.e. a paste, or a film.
[0011]
The convex top portion of the semiconductor chip that has been deformed by bending may be first displaced and pressed against the attachment surface of the adherend via an adhesive, but in other embodiments, the roll laminate In this manner, the semiconductor chip may be sequentially pressed and bonded to the other end portion from the one end portion through the top portion. The adhesive may be attached to the other surface of the semiconductor chip, but may be attached to the attachment surface of the adherend, or alternatively, the other surface of the semiconductor chip and the attachment surface of the adherend. And may be attached to both.
[0012]
In order to bend and deform the convex shape of the semiconductor chip, the suction surface of the elastic suction member may be vacuum-sucked by negative pressure as described above. The surface may be releasably held on the fixture via an adhesive, double-sided tape, or the like.
[0013]
In the structure in which the suction member is made of a material having elasticity, the spring constant is selected to be larger than the spring constant of the semiconductor chip, that is, the suction member is made of a material that is less likely to be elastically deformed than the semiconductor chip. It is ensured that the one surface is vacuum-sucked along a suction surface that is convex outward of the suction member.
[0014]
The semiconductor chip has a strength that does not break even if it is bent and bent due to the recent development of thinning technology, and thus the present invention can be implemented. It is preferable to remove the work-affected layer after polishing of the back surface of the semiconductor chip by etching or the like to make it smooth, thereby improving the strength of the semiconductor chip and suppressing damage when the semiconductor chip is bent and deformed. Can do.
[0015]
The present invention also supports one surface of the semiconductor chip,
The flexible adherend is bent and deformed so that its mounting surface faces the semiconductor chip,
With the adhesive interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
The semiconductor chip bonding method is characterized in that the semiconductor chip and the adherend are displaced and pressed close to each other, and then the attachment surface of the adherend is made flat.
[0016]
Further, the present invention is characterized in that the one surface of the semiconductor chip is held by vacuum suction.
[0017]
The present invention also includes (a) a fixture having a suction surface of a semiconductor chip, and a ventilation hole formed in the suction surface.
(B) a negative pressure source having a negative pressure at the vent;
(C) a support member,
Having a support surface of the adherend facing the suction surface of the fixture;
The support surface is formed convex toward the adsorption surface,
A support member made of an elastic material;
(D) A semiconductor chip bonding apparatus characterized by including a displacement driving means for displacing and pressing the fixture and the support member close to each other.
[0018]
Further, the present invention is characterized in that the spring constant of the support member is selected to be larger than the spring constant of the adherend placed on the support surface.
[0019]
According to the present invention, as will be described later with reference to FIGS. 5 and 6, an adherend such as a flexible film is applied to the support surface of a support member having elasticity, for example. The mounting surface is curved in a convex manner toward the semiconductor chip in a natural state, and in this state, one surface of the semiconductor chip is supported and bonded to the suction surface of the fixture by vacuum suction, for example. The semiconductor chip and the adherend are displaced and pressed close to each other via an agent. Thus, it is possible to bond the other surface of the semiconductor chip and the mounting surface of the adherend without suppressing the generation of voids without involving air bubbles in the adhesive.
[0020]
For example, the semiconductor chip may be flat and may be configured to contact and press the one surface of the semiconductor chip with an adhesive on the top of the mounting surface of the adherend that has been bent and deformed. In this form, in the so-called roll laminating procedure, one end of the other surface of the semiconductor chip is contacted in sequence to the other end through the center, and pressed against the attachment surface of the adherend via an adhesive. Also good.
[0021]
The present invention is characterized in that the adhesive is in the form of a film.
According to the present invention, the adhesive may be formed into a film, and for example, a film-shaped organic die bonding material may be used. As a result, (1) the thickness accuracy is improved, and (2) the amount of protrusion of the film-like adhesive compared to the amount of protrusion of the paste-like adhesive to the outside of the semiconductor chip that occurs when the paste-like adhesive is used. (3) Generation of voids can be further suppressed.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a longitudinal sectional view showing the overall configuration of an embodiment of the present invention. The bonding apparatus 1 basically includes a fixture 2, a negative pressure source 3, and a displacement driving means 4 that drives the fixture 2 by displacing it up and down in FIG. The fixture 2 includes a suction member 6 that vacuum-sucks the semiconductor chip 5 and a fixture body 8 to which a base end portion 7 of the suction member 6 is fixed.
[0023]
The adsorbing member 6 is made of a material having elasticity and heat resistance, for example, a soft synthetic resin material such as silicone rubber or fluorine rubber. The suction member 6 has a suction surface 9 that is convex outward in the natural state shown in FIG. That is, the suction surface 9 is convex outward in the natural state, which is the lower side of FIG. The suction surface 9 may be a part of the cylindrical surface extending in the circumferential direction having an axis perpendicular to the paper surface of FIG. A plurality of air holes 11 extending in the thickness direction (vertical direction in FIG. 1) that open to the suction surface 9 are formed in the suction member 6 in a dotted manner. In another embodiment of the present invention, the adsorbing member 6 may be made of a porous porous material and may be realized by a structure in which a portion other than the adsorbing surface 9 is sealed with a sealant or the like.
[0024]
The fixture body 8 has a negative pressure chamber 12. The fixture body 8 is made of metal, for example, and is rigid. The negative pressure chamber 12 is connected to the vent hole 11 via the passage 13. The proximal end portion 7 of the adsorption member 6 is on the opposite side of the adsorption surface 9 in the thickness direction of the adsorption member 6 (upward in FIG. 1), and is arranged so that the passage 13 communicates with the vent hole 11 as described above. , Fixed to the lower part of the fixture body 8. The negative pressure chamber 12 is connected to the negative pressure source 3 through the flexible tube 14. The attachment portion 41 to which the adsorption member 6 of the attachment body 8 is attached is provided with heating means 42 such as an electric heater. The heating means 42 heats the semiconductor chip 5 through the adsorption member 6 to a temperature suitable for bonding.
[0025]
A wiring board 18 as an adherend is disposed on the base 17 of the apparatus main body 16. Displacement driving means 4 is provided at the rising portion 19 of the apparatus main body 16, and the fixture 2 is lowered from the upper limit position shown in FIG. 1 as indicated by an arrow 21. Are pressed close to each other. The base 17 is formed with a negative pressure chamber 43 and a passage 44 that is electrically connected to the negative pressure chamber 43 to vacuum-suck the substrate 18. The negative pressure chamber 43 is connected to the negative pressure source 3 through the flexible tube 14. The base 17 is also provided with a heating means 45 such as an electric heater for heating the substrate 18 vacuum-sucked by the negative pressure by the passage 44 to a temperature suitable for bonding.
[0026]
When bonding the flat semiconductor chip 5 in a natural state, which is a thinly cut piece, to the substrate 18, first, as shown in FIG. 1, the one surface 23 on the upper side of FIG. Vacuum suction is performed on the suction surface 9 of the suction member 6, and the semiconductor chip 5 is elastically bent and deformed into an outwardly convex shape, which is the lower side of FIG. 1. A film adhesive 26 is adhered to the other surface 24 of the semiconductor chip 5 which is the lower side in FIG.
[0027]
The film adhesive 26 may be, for example, an organic die bonding material or the like obtained by applying varnish to a carrier film, volatilizing a solvent, and peeling off the carrier film, but may also be a paste. Such an adhesive 26 may be made of, for example, a polyimide resin or an epoxy resin. The adhesive 26 may be a thermoplastic synthetic resin or the like, or may be a hot melt adhesive.
[0028]
FIG. 2 is a partial cross-sectional view showing a state in which the semiconductor chip 5 is in contact with the substrate 18 through the adhesive 26. In the state of FIG. 1, the displacement driving means 4 moves down the fixture 2 as indicated by an arrow 21. As a result, the top portion 28, which is the lowest portion in FIG. 2, of the convexly curved surface 24 of the semiconductor chip 5 is first pressed through the adhesive 26.
[0029]
FIG. 3 shows a state where the fixture 2 is further lowered from the state of FIG. 2 by the displacement driving means 4 in the bonding apparatus 1 shown in FIGS. When the fixture 2 is lowered by the displacement driving means 4, the suction member 6 is elastically deformed and compressed, and thus the fixture body 8 and the substrate 18 are pressed, and the suction member 6 is compressed. Thus, the contact surface of the semiconductor chip 5 extends symmetrically from the top portion 28 to the left and right end portions 29 and 30 in FIG. 3, and faces the mounting surface 31 of the substrate 18 via the adhesive 26. Touched. In this way, the adhesive 26 and the mounting surface 31 of the substrate 18 expand in contact with the left and right from the position corresponding to the top 28 described above. The fixture 3 reaches the lower limit position of FIG. Therefore, air bubbles are not caught in the adhesive 26, and the generation of voids is prevented.
[0030]
Also, it is necessary to select appropriate values for the melt viscosity of the adhesive 26 at the bonding temperature, the pressure required to deform the convexity of the adsorption member 6 into a flat surface, and the convex deformation elasticity. There is a possibility that it will be adhered to the mounting surface 31 of the substrate 18 while it is deformed convexly. Therefore, it is necessary to adjust and select the physical properties of the adsorption member 6 and the like so as to match the physical properties of the adhesive 26.
[0031]
4 is a cross-sectional view showing a state in which the semiconductor chip 5 is bonded and fixed to the substrate 18 via the adhesive 26 in the embodiment shown in FIGS. In FIG. 3 described above, the fixture 2 is displaced downward by the displacement driving means 4, and the entire lower surface of the adhesive 26 in FIG. 3 comes into surface contact with the flat mounting surface 31 of the substrate 18, and further the pressure required for adhesion. The state where the pressure is applied and pressed is maintained for a predetermined time. Thereafter, the vacuum suction of the semiconductor chip 5 on the suction surface 9 of the suction member 6 by the negative pressure source 3 is released. Thereafter, the fixture 2 is raised by the displacement driving means 4 and returns to the upper limit 1 in FIG. Thus, the surface 24 of the semiconductor chip 5 is bonded and fixed to the mounting surface 31 of the substrate 18 via the adhesive 26.
[0032]
FIG. 5 is a cross-sectional view showing a simplified overall configuration of a bonding apparatus 1a according to another embodiment of the present invention. This embodiment is similar to the embodiment described above with reference to FIGS. 1 to 4 described above, and the same reference numerals are used for the corresponding parts, and the suffix a is attached. It should be noted that in this embodiment, the lower part of the fixture main body 8 constitutes the suction member 6a, and the suction member 6a is formed with a plurality of air holes 11 interspersed. The suction surface 9 a that is the lower surface of the suction member 6 in FIG. 5 is flat and perpendicular to the arrow 21. One surface 23 of the semiconductor chip 5 that is flat in the natural state is vacuum-sucked by the suction surface 9. An adhesive 26 is attached to the other surface 24 of the semiconductor chip 5 in the same manner as in the previous embodiment.
[0033]
A support member 33 is provided on the base 17. The support member 33 is made of a material having elasticity, and for example, may be made of a material similar to the adsorbent 6 in the above-described embodiment. The support member 33 has a support surface 34 that faces the suction surface 9 of the suction member 6 in the fixture 2a and faces upward in FIG. The support surface 34 is formed to be convex toward the suction surface 9a. The support surface 34 may be a portion extending in the circumferential direction of a cylindrical surface having an axis perpendicular to the paper surface of FIG. On the support surface 34, for example, a flexible circuit board 35, which is a flexible adherend, is placed, so that the substrate 35 protrudes outward on the support surface 34, which is the upper side of FIG. 5. The shape is supported and arranged.
[0034]
As described above, one surface 23 of the semiconductor chip 5 is vacuum-sucked to the suction surface 9a of the suction member 6a, and an adhesive 26 is attached to the other surface 24. As described above, the flexible substrate 35 is disposed on the support surface 34 of the support member 33. The negative pressure chamber 43 formed in the base 17 vacuum-sucks the support surface 34 of the substrate 35 through the passage 44 and through the vent hole 46 formed in the support member 33. In this state, as shown by the arrow 21 in FIG. 5, the displacement driving means 4 lowers the fixture 2 a from the upper limit position in FIG. 5, and causes the fixture 2 a and the support member 33 that supports the substrate 35 to interact with each other. To close to and press.
[0035]
FIG. 6 is a partial cross-sectional view showing a state in which the semiconductor chip 5 in the embodiment shown in FIG. 5 is pressed against the substrate 35 by the fixture 2a. When the fixture 2 a is lowered as indicated by the arrow 21, first, it contacts a portion of the substrate 35 corresponding to the top 36 of the support surface 34. Thereafter, the mounting tool 2a is further displaced downward by the displacement driving means 4, so that the position of the mounting surface 37 on which the semiconductor chip 5 of the substrate 35 contacts the adhesive 26 is in the left-right direction in FIGS. It expands sequentially. The support member 33 is compressed and deformed by the lowering of the fixture 2 a by the displacement driving means 4. In this way, in the state of FIG. 6, the surface 24 of the semiconductor chip 5 is bonded in surface contact with the mounting surface 37 of the substrate 35 via the adhesive 26. In this way, the fixture 2a reaches the lower limit position of FIG. 6 by the displacement driving means 4, and the pressure and time required for bonding with the adhesive 26 are maintained. Thereafter, the negative pressure by the negative pressure source 3a in the negative pressure chamber 12 is released. Therefore, vacuum suction of the semiconductor chip 5 by the suction member 6a is not performed. Thereafter, the fixture 2a is displaced upward by the displacement driving means 4 and returns to the state shown in FIG.
[0036]
The experimental results of the inventor will be described. A film adhesive 26 having a thickness of 25 μm was attached to the surface 24 of the semiconductor chip 5 using the bonding apparatus 1 in the embodiment of FIGS. This semiconductor chip 5 has a planar shape of 10 × 10 mm and a thickness of 50 μm. The semiconductor chip 5 is made of Si. The surface 23 of the semiconductor chip 5 was affixed to the convex elastic adsorption member 6 with a double-sided adhesive tape, and was thermocompression bonded to the heated glass substrate 18. In the comparative example, the semiconductor chip 5 having the same shape as that of the above-described example was attached to a rigid body having a flat surface with a double-sided adhesive tape, and thermocompression bonded to the heated glass substrate 18.
[0037]
According to such an experiment by the present inventor, as a result of observing the void of the mounting surface 31 from the glass substrate 18 side, the embodiment according to the present invention has a smaller area in which air is entrained than the comparative example. It was confirmed that the invention is superior.
[0038]
【The invention's effect】
According to the present invention, a semiconductor chip is curvedly deformed to be convex with respect to the adherend, or a flexible flexible adherend is curvedly deformed to be convex and contacted with an adhesive. Since the pressing is performed, it is difficult for air bubbles to be involved in the adhesive, and adhesion without voids can be achieved. In particular, generation of voids can be further suppressed by using a film adhesive such as a film organic bonding material.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing the overall configuration of an embodiment of the present invention.
2 is a partial cross-sectional view showing a state in which a semiconductor chip 5 is in contact with a substrate 18 via an adhesive 26. FIG.
3 shows a state where the fixture 2 is further lowered from the state of FIG. 2 by the displacement driving means 4 in the bonding apparatus 1 shown in FIGS. 1 and 2. FIG.
4 is a cross-sectional view showing a state in which the semiconductor chip 5 is bonded and fixed to a substrate 18 with an adhesive 26 in the embodiment shown in FIGS. 1 to 3; FIG.
FIG. 5 is a cross-sectional view showing a simplified overall configuration of a bonding apparatus 1a according to another embodiment of the present invention.
6 is a partial cross-sectional view showing a state in which the semiconductor chip 5 in the embodiment shown in FIG. 5 is pressed against the substrate 35 by the fixture 2a.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,1a Bonding apparatus 2,2a Attachment 3 Negative pressure source 4 Displacement drive means 5 Semiconductor chip 6, 6a Adsorption member 7 Base end part 8 Attachment body 9, 9a Adsorption surface 11 Vent 12 Negative pressure chamber 18, 35 Substrate 23 One surface 24 The other surface 26 Film adhesive 31 Attachment surface 33 Support member 34 Support surface 37 Attachment surface

Claims (11)

半導体チップの一方の表面を支持し、被着体の取付面に向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して加熱押圧し、その後、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法。Supporting one surface of the semiconductor chip, bending and projecting convexly toward the attachment surface of the adherend,
With the adhesive interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
A semiconductor chip bonding method, wherein a semiconductor chip and an adherend are displaced in proximity to each other and heated and pressed, and then the semiconductor chip is made flat. 半導体チップの彎曲変形時のばね定数よりも大きいばね定数を有する弾力性のある吸着部材の外方の凸の吸着面に、半導体チップの前記一方の表面を、真空吸着して、半導体チップを、前記凸に彎曲変形させることを特徴とする請求項１記載の半導体チップのボンディング方法。The one surface of the semiconductor chip is vacuum-sucked to the outer convex suction surface of the elastic suction member having a spring constant larger than the spring constant at the time of bending deformation of the semiconductor chip, 2. The semiconductor chip bonding method according to claim 1, wherein said convex is bent and deformed. 取付具を準備し、
この取付具は、
自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
吸着部材の厚み方向に吸着面とは反対側の基端部が固定される通路が形成された取付具本体とを含み、
通気孔を負圧源によって負圧とし、
吸着面に、半導体チップの一方の表面を真空吸着して、半導体チップを外方に凸の形状に彎曲し、
半導体チップの他方の表面と被着体の取付面との間に、接着剤を介在し、
取付具本体と被着体とを、相互に近接変位して加熱押圧し、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法。Prepare the fixture,
This fixture is
A suction member made of an elastic material having a suction surface that protrudes outward in a natural state, a vent hole extending in the thickness direction opening in the suction surface is formed;
A fixture body formed with a passage in which a base end opposite to the suction surface is fixed in the thickness direction of the suction member;
Make the air vent negative with a negative pressure source,
One surface of the semiconductor chip is vacuum-sucked on the suction surface, and the semiconductor chip is bent into a convex shape outward,
An adhesive is interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
A bonding method of a semiconductor chip, wherein the fixture main body and the adherend are displaced closely to each other and heated and pressed to bring the semiconductor chip into a flat state. 半導体チップの一方の表面を支持し、
可撓性被着体を、その取付面が半導体チップに向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して押圧し、その後、被着体の取付面を平坦な状態にすることを特徴とする半導体チップのボンディング方法。Support one surface of the semiconductor chip,
The flexible adherend is bent and deformed so that its mounting surface faces the semiconductor chip,
With the adhesive interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
A method of bonding a semiconductor chip, wherein the semiconductor chip and the adherend are displaced and pressed close to each other, and thereafter the mounting surface of the adherend is made flat. 半導体チップの前記一方の表面を真空吸着して保持することを特徴とする請求項４記載の半導体チップのボンディング方法。5. The semiconductor chip bonding method according to claim 4, wherein said one surface of the semiconductor chip is held by vacuum suction. 取付具を準備し、
この取付具は、吸着面を有し、この吸着面に開口する通気孔が形成されて構成され、
通気孔を、負圧源によって負圧とし、
支持部材を準備し、
この支持部材は、取付具の吸着面に対向する支持面を有し、
支持面は、吸着面に向って凸に形成され、弾力性を有し、
吸着面に半導体チップの一方表面を真空吸着し、
可撓性被着体を、支持面上で外方に凸の形状で支持して配置し、
半導体チップの他方の表面と、被着体の取付面との間に、接着剤を介在し、
取付具と被着体を支持した支持部材とを、相互に近接変位して押圧し、
被着体の取付面が半導体チップの前記他方の表面に沿う形状になった状態にすることを特徴とする半導体チップのボンディング方法。Prepare the fixture,
This fixture has a suction surface, and is formed by forming a vent hole that opens to the suction surface.
Make the air vent negative by a negative pressure source,
Prepare a support member,
The support member has a support surface facing the suction surface of the fixture,
The support surface is formed convex toward the adsorption surface, has elasticity,
Vacuum adsorption of one surface of the semiconductor chip to the adsorption surface,
The flexible adherend is supported and arranged in an outwardly convex shape on the support surface,
An adhesive is interposed between the other surface of the semiconductor chip and the attachment surface of the adherend,
The fixture and the support member that supports the adherend are displaced close to each other and pressed,
A bonding method of a semiconductor chip, characterized in that the attachment surface of the adherend is in a state along the other surface of the semiconductor chip. 接着剤は、フィルム状であることを特徴とする請求項１〜６のうちの１つに記載の半導体チップのボンディング方法。The bonding method of a semiconductor chip according to claim 1, wherein the adhesive is in the form of a film. （ａ）取付具であって、
（ａ１）自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
（ａ２）吸着部材の厚み方向に吸着面とは反対側の基端部が固定される取付具本体とを有する取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）取付具と被着体とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置。(A) a fixture,
(A1) an adsorbing member made of an elastic material having an adsorbing surface that is convex outward in a natural state and having a vent hole extending in the thickness direction that opens in the adsorbing surface;
(A2) a fixture having a fixture body to which a base end opposite to the suction surface is fixed in the thickness direction of the suction member;
(B) a negative pressure source having a negative pressure at the vent;
(C) A bonding apparatus for a semiconductor chip, comprising: a displacement driving means that presses the fixture and the adherend in close proximity to each other. 吸着部材のばね定数は、半導体チップの彎曲変形時のばね定数よりも大きく選ばれることを特徴とする請求項８記載の半導体チップのボンディング装置。9. The semiconductor chip bonding apparatus according to claim 8, wherein a spring constant of the attracting member is selected to be larger than a spring constant at the time of bending deformation of the semiconductor chip. （ａ）半導体チップの吸着面を有し、この吸着面に開口する通気孔が形成されて構成される取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）支持部材であって、
取付具の吸着面に対向する被着体の支持面を有し、
支持面は、吸着面に向って凸に形成され、
弾力性を有する材料から成る支持部材と、
（ｄ）取付具と支持部材とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置。(A) a fixture having a suction surface of a semiconductor chip and having a ventilation hole formed in the suction surface;
(B) a negative pressure source having a negative pressure at the vent;
(C) a support member,
Having a support surface of the adherend facing the suction surface of the fixture;
The support surface is formed convex toward the adsorption surface,
A support member made of an elastic material;
(D) A semiconductor chip bonding apparatus comprising displacement driving means for pressing the attachment tool and the support member in close proximity to each other. 支持部材のばね定数は、支持面上に置かれる被着体のばね定数よりも大きく選ばれることを特徴とする請求項１０記載の半導体チップのボンディング装置。11. The semiconductor chip bonding apparatus according to claim 10, wherein the spring constant of the support member is selected to be larger than the spring constant of the adherend placed on the support surface.
JP2002179012A 2002-06-19 2002-06-19 Semiconductor chip bonding method and apparatus Expired - Fee Related JP3757193B2 (en)

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