JPH11111756A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same by which adhesiveness is improved between a base film and a heat radiating plate, without degrading the quality and short-circuits (bridges) between solder bumps due to peeling are prevented. SOLUTION: A semiconductor device 30 includes a semiconductor chip 4 connected to a device hole 31 and TAB tape 23, on which electrodes of the semiconductor chip 4 are connected to lands 32 on which bumps 11 are formed via inner leads 20. The TAB tape 23 can be jointed by its structure to a mount board 33. In this case, a reinforcing material 14 is connected to the TAB tape 23 via an adhesive material 15 having a function of temporary adhesion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a TAB tape (T
More particularly, the present invention relates to a semiconductor device connected to a mounting substrate using a bump, to which a reinforcing material is attached, using a bump.

[0002]

2. Description of the Related Art Conventionally, as this kind of semiconductor device, one described in the specification of Japanese Patent Application Laid-Open No. 8-318691 is known. An example of the configuration of the known semiconductor device will be described with reference to FIG. That is, as shown in FIGS. 9A and 9B, the conventional TAB tape is manufactured by fixing the semiconductor chip 4 to an insulating base film 9 such as polyimide.

More specifically, a sprocket hole 1 for transporting and positioning the corresponding film is provided on both sides in the width direction of the base film 9, and the sprocket hole 1 is used to make use of the sprocket hole 1. Can be transported in its longitudinal direction. An opening for positioning the semiconductor chip 4, that is, a device hole 22 is provided inside the base film 9, and a cut hole 2 is formed outside the device hole 22.

A pad 3 is formed in a predetermined area on the base film 9 between the device hole 22 and the cut hole 2, and the pad 3 is formed on an inner lead 6 electrically connected to the semiconductor chip 4. Is connected to
On the pad 3, a bump 11 on the formed ball is formed by solder or the like as an external connection electrode member. Further, as shown by a broken line in the drawing, a peripheral area defined other than the bumps 11 is covered with a cover resist 7.
This prevents contamination of metal wiring and the like on the base film 9.

[0005] The semiconductor chip 4 is sealed with a resin 10 together with the inner leads 6 around the semiconductor chip 4. Finally, by cutting the base film 9 from the cut hole 2, a semiconductor device constituted by the semiconductor chip 4 and the base film 9 member (TAB tape) can be obtained.

In the semiconductor device having the above structure, the bumps 11 on the pads 3 can be directly mounted on the printed circuit board 20, so that the base film 9 can be used substantially as a package. Therefore, the above-described semiconductor device has an advantage that it is less expensive than a semiconductor device having a ceramic package or the like. Further, since the wiring region of the inner lead 6 can be limited only to the inside of the cut hole 2, the illustrated semiconductor device is advantageous in terms of miniaturization.

In order to improve heat dissipation, Japanese Patent Application Laid-Open No.
As shown in FIG. 2 of 1869, a heat radiation bump is formed on a suspension lead suspended in the device hole by wiring on the same surface as the inner lead, and heat is radiated to the printed circuit board side. The heat dissipation has been improved by attaching. At this time, JP-A-8-3
As described in 1869 [0034], when the heat radiating plate (including a reinforcing plate in some cases) is attached to a base film in order to prevent warpage of the tape, an adhesive for fixing was required.

Further, even when there is no heat radiating plate, a reinforcing plate is stuck with an adhesive to reinforce the base film.

[0009]

As the adhesive used when bonding the reinforcing plate of the semiconductor device and the TAB tape, for example, a liquid thermosetting adhesive is used. For this reason, there have been problems such as an unstable bonding area, unevenness, and misalignment if not kept parallel after bonding.

In addition, when an epoxy-based adhesive is used, there is a problem that the package warps due to heat shrinkage after being cured by heat. Therefore, when a sheet-like, for example, thermoplastic adhesive is attached to the entire surface of the TAB tape, it is necessary to attach the sheet at a high temperature of, for example, 200 ° C. or more in order to complete the adhesion, which adversely affects the quality of the TAB tape itself. Had the problem of giving

That is, for example, deformation of the TAB tape itself, peeling of the cover resist, transfer of dirt from the bonding jig, oxidation of the wiring, and the like. Also, if the attachment is incomplete, TAB will be required when the package is mounted on the mounting board.
If the tape base film and adhesive absorb moisture,
There has been a problem that peeling occurs between the TAB tape and the reinforcing plate, the molten solder bump is deformed, and a so-called bump bridge occurs in which adjacent solders are short-circuited.

In particular, when a polyimide resin is used as the base material of the TAB tape, the polyimide resin generally has a high hygroscopic property, and if left at normal temperature, the moisture absorption rate increases. When the polyimide resin is heated in the bonding step, the moisture moves to the bonding material, which is a major cause of generating bubbles in the bonding material. Similarly, adhesives also generally have a hygroscopic property, so their handling requires extreme care.

[0013] For this reason, the material, adhesiveness, and bonding structure of the adhesive are very important, and a method of bonding the TAB tape and the reinforcing material is also a major problem. An object of the present invention is to improve the above-mentioned drawbacks of the prior art, improve the adhesion between the base film and the heat sink without deteriorating the quality, and prevent a short (bridge) defect between solder bumps caused by peeling. An object of the present invention is to provide a semiconductor device having an effect and a manufacturing method thereof.

[0014]

In order to achieve the above-mentioned object, the present invention employs the following basic technical structure. That is, as a first aspect according to the present invention, a semiconductor chip is connected to a device hole,
The semiconductor device includes a TAB tape in which electrodes of the semiconductor chip are connected to lands on which bumps are formed through inner leads, and the TAB tape has a structure that can be bonded to a mounting substrate. A semiconductor device in which a reinforcing material is connected to the TAB tape via an adhesive having a temporary bonding function, and as a second aspect according to the present invention, a semiconductor chip is connected to a device hole, And a TA in which electrodes of the semiconductor chip are connected to lands on which bump portions are formed via inner leads.
B in a semiconductor device having a structure that can be bonded to a mounting substrate.
When manufacturing a semiconductor device in which a reinforcing material is connected to a tape via an adhesive having a temporary bonding function, the reinforcing material and the TAB tape are bonded to each other using an adhesive having a temporary bonding function. 5 is a method for manufacturing a semiconductor device having the above structure.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor device and the method of manufacturing the semiconductor device according to the present invention employ the above-described technical configuration.
While the TAB tape did not absorb the moisture again, the TAB tape was bonded to the reinforcing material via an adhesive having a temporary bonding function, and a bubble removing operation was performed using a pressing member and a jig having a predetermined configuration. Thereafter, a heat treatment is performed under predetermined conditions to complete the bonding operation.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a semiconductor device according to the present invention; That is, FIG. 1A is a cross-sectional view showing a configuration of one specific example of a semiconductor device 30 according to the present invention, in which a semiconductor chip 4 is connected to a device hole 31 and The lands 32 on which the electrodes of the semiconductor chip 4 have the bump portions 11 formed via the inner leads 20
Including the TAB tape 23 connected to the
In the semiconductor device 30 having a structure in which the tape 23 can be bonded to the mounting substrate 33, the semiconductor device 30 in which the reinforcing member 14 is connected to the TAB tape 23 via the adhesive 15 having a temporary bonding function. It is shown.

That is, as shown in FIG. 1B, the base material 9 of the TAB tape 23 according to the present invention is desirably made of, for example, a polyimide resin. In addition, a metal wiring portion 20 constituting an inner lead formed by an appropriate printed wiring technique is arranged. The reinforcing member 14 functions as a heat dissipating means having a heat dissipating effect, and at the same time, functions as a support member provided for solving the problem of workability in a mounting process due to the flexibility of the TAB tape. Have.

As shown in FIG. 1A, in this specific example, in addition to the reinforcing member 14, another heat sink 25 is provided via an appropriate adhesive, a heat radiation paste 24, or the like. May be. In a preferred embodiment of the present invention, for example, the base film 9 having a device hole 31 provided for connecting the semiconductor chip 4 is provided with an inner lead 20 for bonding to an electrode of the semiconductor chip 4 and an external electrode. A TAB tape having a pattern in which lands 32 provided for bonding are wired with metal foil is formed, the pad electrodes of the semiconductor chip 4 are connected to the inner leads 20, and bumps 11 are formed on the lands. In the tape BGA type semiconductor device 30, the reinforcing plate 14 used for preventing warpage of the TAB tape 23 and the TAB tape 23 are attached to the tape BGA type semiconductor device 30. An adhesive having a temporary bonding function is used as the adhesive to be attached, and the adhesive is heated by heating during the bonding or after the bonding is completed. In which was set to be. Further, as another specific example, the reinforcing plate 14 and the T
The adhesive 15 is selectively formed at the portion where the AB tape 23 is attached.

The adhesive having the temporary bonding function used in the present invention may be composed of a material having tackiness at room temperature, and does not exhibit tackiness at room temperature, but at a predetermined temperature. When heated for a short time, for example, a material made of a material having an adhesive property by a heat treatment at 150 ° C. for about 3 seconds can be used. In the present invention, it is preferable that the inside of the material constituting the TAB tape is substantially free of moisture. For this purpose, the TAB tape is bonded to the reinforcing material. In this case, the TAB tape is pre-heated and the TAB tape is heated.
The water existing inside the B tape material is released, and the T
It is desirable that the AB tape be configured to be substantially free of moisture and then bonded to the reinforcing material.

For this purpose, in the case of a TAB tape made of the polyimide resin, the heat treatment is performed, for example, in the case of a polyimide resin having a thickness of 125 μm.
30 minutes to 1 hour at 125-150 ° C is sufficient.
Further, since the TAB tape 23 absorbs moisture again if left as it is, the heat treatment is carried out, and the polyimide resin tape having zero or less water contained therein can be combined with the reinforcing material 14 within as short a time as possible. It is desirable to supply it to the bonding operation process.

For example, it is desirable to perform the above-mentioned bonding operation within 8 hours after the above-mentioned heat treatment operation of the polyimide resin tape. Next, a specific example of the bonding operation between the TAB tape 23 and the reinforcing member 14 in the present invention will be described. That is, as shown in FIG. 2, the base film 9 of the TAB tape 23 and the reinforcing plate 14 are adhered by the adhesive 15. For example, the adhesive 15 is pasted on the reinforcing plate 14 in advance, and the positioning is easily performed by positioning the reinforcing plate 14 and the TAB tape 23.

The adhesive 15 is a TAB tape 23
The same effect can be obtained even if the element is arranged on one main surface. Here, as a method of attaching the adhesive 15, a roller method can be used as shown in FIG. 2, and in this method, the base film 9 and the reinforcing plate 1 are
It is effective that the air (voids) remaining during 4 is pressed while being pushed in the lateral direction while being pressed.

This is because when the voids 16 are generated as shown in FIG. 8A, moisture easily accumulates in the spaces, and by performing a heat treatment in a later step, the voids are formed as shown in FIG. This is because blisters are generated at the time of mounting as shown in FIG. However, the roller method has a long bonding time,
When the bonding is performed in a short time, a device for pressing the reinforcing member 14 may be, for example, a rubber or other elastic member that applies a pressing force to the TAB tape 23 and the reinforcing member 14 from above and below as shown in FIG. It is preferable to use a stamp method using a pressing portion 35 formed of a member having the stamp.

In this case, when the pressing force is simply applied in the vertical direction, the voids 16 are easily generated as shown in FIG. The blisters of the base film 9 including these voids 16 at the time of mounting are
This occurs when the peeling force generated by enlarging the voids 16 and the like exceeds the adhesive force of the reinforcing plate 14 and the reinforcing plate 14.

For this reason, the solder bump bridge 17 at the time of mounting
In order to solve the problem, it is necessary to suppress the peeling force to be equal to or less than the adhesive force. Therefore, it is important to suppress the generation of the voids 16, stabilize the adhesive force, suppress the moisture absorption, and the like. . Here, as shown in FIG. 4B, a jig or a stamp mold 2 having a pressing portion 35 having a curvature at the tip end.
Attachment at 7 reduces the generation of voids 16.

When a material having elasticity on rubber is used as the material of the attaching surface of the stamp mold 27, the adhesion is improved and the attaching property is stabilized. Further, a sheet on rubber may be provided between the stamp die 27 and the base film 9. In other words, in the present invention, the adhesive having the temporary adhesive function is a large-sized air bubble that is likely to expand in the future to cause peeling or to generate a bump bridge, excluding substantially fine voids. It is desirable to be in a state not containing.

One of the features of the semiconductor device according to the present invention is that it does not have a bump bridge. The semiconductor device 30 of the present invention includes the base film 9
And the reinforcing plate 14 are joined by interposing an adhesive 15 having a temporary bonding function therebetween, and the adhesive having the temporary bonding function may be a coating type adhesive.
It may be a sheet-like adhesive.

In the present invention, the bonding is performed by heating during or after the bonding. In the present invention, as the adhesive having a temporary adhesive function, for example, having an adhesive at room temperature, an adhesive capable of holding and bonding, for example, using an adhesive resin using release paper,
The bonding may be performed by heating during or after bonding, and is made of a material that does not exhibit adhesiveness at room temperature but exhibits an adhesive function when heated at a predetermined temperature for a short time. May be available.

As such an adhesive material, for example, even when heated during bonding, the quality of the base film 9 member including the metal wiring and the like is not deteriorated.
C. or below, or an adhesive that can be temporarily bonded in a short time, for example, 3 seconds even at 100.degree. C. or higher. In other words, for example, even if the bonding is completed with a thermoplastic adhesive at a temperature of 300 ° C. or more for 30 seconds, a temporary bonding process is performed at 100 ° C., and then a heating process is performed at 150 ° C. for 2 hours. Materials that can be applied to complete the bonding can also be used.

Heating is further performed after this bonding, and the principle that the bonding strength is improved is that the bonding strength between the molecules inside the bonding material 15 is reduced and the bonding material such as the bonding material 15 and the base film 9 is expanded. As shown in FIG. 5A, the adhesive layer 1 having a large number of large voids 16 therein
By performing the above-described pressing process and heating process on 5,
As shown in FIG. 5B, the voids 16 of the adhesive layer 15 are compressed to disperse the voids into the microvoids 18, and at the same time, the anchor effect of the adhesive 15 is promoted to improve the adhesion. It is.

As a result, the adhesiveness could be improved without deteriorating the quality of the base film 9 member, and the initial adhesive strength was increased to about 2 to 5 times as shown in the table of FIG. Next, a second specific example of the present invention will be described with reference to FIGS. In the specific example described above, the adhesive 1
The method of preventing the solder bump bridge 17 by improving the adhesive strength of No. 5 has been described.

The cause of the solder bump bridge 17 is that when the package is reflowed on the printed circuit board 13,
Due to the moisture absorption of the base film 9 and the adhesive material 15 itself, the peeling force is higher than the adhesive force due to the vapor pressure of water and the thermal expansion of the base film 9.
It is considered that the base film 9 peels off and reaches the solder bump bridge 17.

For this reason, it can be easily prevented by reducing the width of the tacky adhesive of the present invention, that is, reducing the adhesive area or volume of the adhesive. This principle is to prevent the expansion of the void 16 by completely dehydrating the moisture absorbed by the base film 9, the adhesive 15 and the like in the preheating area during reflow.

For example, in order to dehydrate the moisture absorbed in the base film 9 and the adhesive 15 in the region of 150 ° C. for 60 to 90 seconds of the general reflow profile as shown in FIG. Instead of being formed on the entire surface of the base film 9 and the reinforcing plate 14 as shown in FIG.
The structure is such that the adhesive material 15 is partially formed as in to 5 and the like, and dehydration is promoted in the preheating region.

That is, for example, in the case of a solder bump, 183
Since the melting starts at a temperature of ° C., the solder bump bridge 17 does not occur if the dewatering is performed to such an extent that the expansion of the void 16 cannot proceed before the melting. At this time, it is necessary to determine the area and volume of the adhesive 15 so that the adhesive 15 can be dewatered, instead of determining the area of the adhesive based on the size of the package.

That is, taking into account the water-absorbing and dehydrating characteristics of the base film 9 and the moisture-absorbing and dehydrating characteristics of the adhesive material 15, for example, at 150 ° C.
The volume to be completely dehydrated in 60 seconds is determined.
However, as shown in FIG. 6A, when the type and thickness of the adhesive 15 are the same, the amount of dehydration from the reinforcing plate side 19 and the metal wiring side 28 is almost negligible or small. Most dehydrate.

This is almost dependent on the width of the adhesive material 15. If the width of the adhesive material is controlled, the amount of moisture absorption is reduced and dehydration can be easily performed. As a result of the experiment, after storing at 30 ° C. for 192 hours with the room temperature adhesive type adhesive A shown in Table 1, a mounting test was performed in a connection arrangement pattern as shown in FIG. When was 50
Forty-five solder bridges occurred in the package, but a similar test was performed with the width of the adhesive as shown in FIG.
When the thickness was set to 5 mm or less, the number of solder bridges did not reach 0 in 50 packages.

As described above, even if the same adhesive 15 is used, the dewatering property differs depending on the width of the adhesive. Therefore, FIG.
Thus, the arrangement pattern of the adhesive as shown in FIG. 7C is effective. In other words, forming the adhesive material 15 only in the portion where the bumps 11 are located, forming the adhesive material 15 radially, and the like have naturally shown the same effect in the sense that the volume of the adhesive material 15 is reduced.

That is, in the present invention, the adhesive having the temporary bonding function is selectively disposed at a predetermined portion between the TAB tape and the reinforcing material. In this embodiment, the bonding between the base film surface and the reinforcing plate has been described as an example.However, if the adhesive is an insulating material or has an insulating cover resist, as a method of attaching the metal wiring surface and the reinforcing plate. Is also effective.

As described above, as a method of manufacturing a semiconductor device according to the present invention, for example, a semiconductor chip is connected to a device hole, and an electrode of the semiconductor chip forms a bump portion via an inner lead. In a semiconductor device having a structure that can be bonded to a mounting substrate, a reinforcing material is connected to the TAB tape via an adhesive having a temporary bonding function. When the semiconductor device is manufactured, the reinforcing material and the TAB tape are configured to be bonded to each other using an adhesive having a temporary bonding function, and in particular, having the temporary bonding function. As the adhesive, a tacky adhesive can be used, or a material that can exhibit an adhesive function when heated at a predetermined temperature for a short time can be used. Come.

Further, in the method of manufacturing a semiconductor device according to the present invention, when the reinforcing material is bonded to the TAB tape, the TAB tape is preliminarily subjected to a heat treatment,
It is desirable that the AB tape material is configured to be substantially free of moisture and then bonded to the reinforcing material. Further, in the method of manufacturing a semiconductor device according to the present invention, when the TAB tape and the reinforcing material are bonded to each other, the TAB tape and the reinforcing material are joined together, and then the both are pressed. It is preferable to perform an operation of pushing out voids contained in the adhesive having a temporary bonding function to the outside.

In the present invention, the pressing member used in the pressing process is preferably made of a material having elasticity. Further, the pressing member used in the pressing process has a curved pressing surface. It is preferable that they are projected in a shape. As described above, in the method of manufacturing a semiconductor device according to the present invention, the adhesive having the temporary bonding function has a specific pattern at a predetermined portion between the TAB tape and the reinforcing material. Alternatively, they may be selectively arranged.

The procedure of the operation of the method of manufacturing a semiconductor device according to the present invention includes, for example, a first step of heat-treating a device film material constituting a TAB tape, a step of heating a film of the TAB tape or a corresponding member of a reinforcing material. A second step of applying an adhesive having a temporary adhesive function to the joining surface along a predetermined pattern, and after the first step, temporarily suspend the TAB tape and the reinforcing material within a predetermined period. A third step of bonding via an adhesive having an adhesive function, a fourth step of performing a short-time heat treatment on the bonded TAB tape and the reinforcing member or performing a pressing operation without performing the heat treatment. Preferably, the method comprises the steps of:

[0044]

As described above, in the semiconductor device of the present invention, the adhesiveness between the base film and the heat sink can be improved without deteriorating the quality, and the short-circuit (bridge) defect between the solder bumps caused by peeling can be prevented. Have.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view illustrating a configuration of a specific example of a semiconductor device according to the present invention, and FIG.
FIG. 2 is an enlarged view showing a configuration example of an AB tape.

FIG. 2 is a cross-sectional view showing a configuration of a specific example of a bonding apparatus used in a method of manufacturing a semiconductor device according to the present invention.

FIG. 3 is a sectional view showing the configuration of another specific example of the bonding apparatus used in the method of manufacturing a semiconductor device according to the present invention.

FIG. 4A is a cross-sectional view showing one configuration example of a pressing member of a bonding apparatus used in the method of manufacturing a semiconductor device according to the present invention, and FIG. It is sectional drawing which shows the other structural example of the press member of the bonding apparatus used by the manufacturing method of the semiconductor device in this invention.

5 (A) and 5 (B) are views showing a process in which voids in an adhesive layer are miniaturized according to the present invention.

FIG. 6A is a cross-sectional view of a semiconductor device according to the present invention, and FIGS. 6A and 6B are diagrams illustrating an example of an arrangement pattern of the adhesive.

FIGS. 7A to 7C are diagrams showing another example of the arrangement pattern of the adhesive in the semiconductor device according to the present invention.

8A and 8B are cross-sectional views illustrating an example of a configuration of a semiconductor device using a conventional TAB tape.

FIGS. 9A to 9D are diagrams illustrating an example of a configuration of a semiconductor device using a conventional TAB tape.

FIG. 10 is a diagram showing the effect of the peeling strength in the semiconductor device according to the present invention.

FIG. 11 is a graph showing an example of an infrared reflow temperature profile.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Sprocket hole 2 ... Cut hole 3 ... Pad 4 ... Semiconductor chip 5 ... Cover resist coating line 6 ... Inner lead 7 ... Cover resist 8 ... TAB tape adhesive 9 ... Base film 10 ... Resin 11 ... Bump 12 ... OLB pad 13 ... Printed circuit board 14 ... Reinforcement plate 15 ... Adhesive material 16 ... Void 17 ... Bridge 18 ... Micro void 19 ... Reinforcement plate side 20 ... Metal wiring surface 21 ... Adhesive material edge 22, 31 ... Device hole 25 ... Heat radiation plate 26 ... Paste Roller 27: Stamp type 28: Metal wiring side 30: Semiconductor device 32: Land 33: Substrate 35: Pressing member

Claims (17)

[Claims] 1. A semiconductor chip is connected to a device hole, and an electrode of the semiconductor chip includes a TAB tape connected to a land on which a bump portion is formed via an inner lead. In a semiconductor device having a structure that can be joined to
A semiconductor device, wherein a reinforcing material is connected to an AB tape via an adhesive having a temporary bonding function. 2. The semiconductor device according to claim 1, wherein the adhesive having the temporary bonding function is made of an adhesive. 3. The semiconductor device according to claim 1, wherein the adhesive having the temporary bonding function is made of a material that exhibits an adhesive function when heated at a predetermined temperature for a short time. 4. The adhesive having the temporary bonding function is selectively disposed at a predetermined portion between the TAB tape and the reinforcing material.
13. The semiconductor device according to claim 1. 5. The semiconductor device according to claim 1, wherein the material constituting the TAB tape is substantially free of moisture. 6. The semiconductor according to claim 1, wherein the adhesive having the temporary bonding function is in a state where it contains no bubbles except for substantially fine voids. apparatus. 7. The semiconductor device according to claim 1, wherein the semiconductor device does not have a bump bridge. 8. A TAB tape in which a semiconductor chip is connected to a device hole, and an electrode of the semiconductor chip is connected via an inner lead to a land on which a bump is formed, wherein the TAB tape is a mounting board. In a semiconductor device having a structure that can be joined to
When manufacturing a semiconductor device in which a reinforcing material is connected to an AB tape via an adhesive having a temporary bonding function, the reinforcing material and the TAB tape are bonded to each other using an adhesive having a temporary bonding function. A method for manufacturing a semiconductor device, comprising: 9. The adhesive having the temporary adhesive function,
9. The method for manufacturing a semiconductor device according to claim 8, wherein an adhesive having tackiness is used. 10. The method for manufacturing a semiconductor device according to claim 8, wherein said adhesive having a temporary bonding function is a material which exhibits an adhesive function when heated at a predetermined temperature for a short time. 11. When the reinforcing material is bonded to the TAB tape, the TAB tape is subjected to a heat treatment so that the inside of the TAB tape material contains substantially no moisture, and then the reinforcing material is applied. The method of manufacturing a semiconductor device according to claim 8, wherein the semiconductor device is configured to be bonded to a material. 12. When bonding the TAB tape and the reinforcing material together, after joining the TAB tape and the reinforcing material, the both are pressed to be included in the adhesive having the temporary bonding function. 12. The method of manufacturing a semiconductor device according to claim 8, wherein an operation of pushing out a void to be performed is performed. 13. The method of manufacturing a semiconductor device according to claim 12, wherein the pressing member used for the pressing process is made of a material having elasticity. 14. The method according to claim 13, wherein the pressing member used in the pressing process has a pressing surface protruding in a curved shape. 15. The adhesive according to claim 8, wherein the adhesive having the temporary bonding function is selectively disposed at a predetermined portion between the TAB tape and the reinforcing material. A method for manufacturing a semiconductor device. 16. A method for manufacturing a semiconductor device, wherein the reinforcing plate and the TAB tape are bonded by heating in a vacuum atmosphere during bonding, during bonding, or after completion of bonding. 17. A first step of heat-treating an equipment film material constituting a TAB tape, wherein an adhesive having a temporary adhesive function is formed in a predetermined pattern on a joining surface of the TAB tape or the reinforcing member with a corresponding member. A second step of applying the TAB tape and the reinforcing material via an adhesive having a temporary bonding function within a predetermined period after the first step of applying the first step, A fourth step of subjecting the bonded TAB tape and the reinforcing member to a short-time heat treatment or performing a pressing operation without performing the heat treatment. .