JP2004022995A - Method and system for bonding semiconductor chip - Google Patents

Method and system for bonding semiconductor chip Download PDF

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Publication number
JP2004022995A
JP2004022995A JP2002179012A JP2002179012A JP2004022995A JP 2004022995 A JP2004022995 A JP 2004022995A JP 2002179012 A JP2002179012 A JP 2002179012A JP 2002179012 A JP2002179012 A JP 2002179012A JP 2004022995 A JP2004022995 A JP 2004022995A
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semiconductor chip
suction
adherend
adhesive
fixture
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JP3757193B2 (en
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Hitoshi Kinoshita
木下　仁
Moriji Morita
森田　守次
Kunio Nishihara
西原　邦夫
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Abstract

<P>PROBLEM TO BE SOLVED: To suppress generation of voids without involving airbubbles into the adhesive between a semiconductor chip 5 and an object 18 being bonded. <P>SOLUTION: One surface 23 of the semiconductor chip 5 is supported on the suction plane 9 of a resilient suction member 6 of a fixing tool 2 by vacuum suction using a negative pressure supplied through the vents 11, thus bringing the semiconductor chip 5 bent upward. The semiconductor chip 5 is then applied, to the other surface 24 thereof, with adhesive 26 and pressed against an object 18 being bonded, e.g. a lead frame or a wiring board, being displaced in proximity to each other. The adhesive 26 may be film-like or paste-like and a flexible object 35 being bonded, e.g. a film-like wiring board, may be bent upward on a resilient supporting member 33. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、薄片状の半導体チップを、被着体であるリードフレーム、パッケージまたは配線基板などに取付けてボンディングするための方法および装置に関する。
【０００２】
【従来の技術】
従来から、半導体チップをリードフレーム、パッケージおよび配線基板などの被着体に、ダイアタッチ剤などと呼ばれる接着剤を用いて接着するにあたり、半導体チップをコレットで真空吸着し、接着剤を介して被着体に熱圧着する手法が採られている。この熱圧着時、半導体チップの被着体に対向する表面は、平面に維持された状態に保たれる。この先行技術では、半導体チップと被着体との間に介在された接着剤にボイドが入りやすく、したがって実装時のはんだ付け熱処理などのリフロー工程で、接着剤が吸湿した水分がリフローはんだ付けの実装時、加熱によって水蒸気化し、接着剤の破壊が生じ、亀裂が発生する。
【０００３】
この問題を解決する先行技術は、たとえば特開２００１−１７６８９５に開示される。この先行技術では、フィルム状接着剤である有機ダイボンディング材を用い、これによってボイド発生を防ごうとしている。この先行技術でもまた、半導体チップの平坦な表面と被着体の平坦な取付面とを接着する構成を有し、したがってフィルム状有機ダイボンディング材中に空気を巻き込み、気泡が残りやすいという問題がある。
【０００４】
【発明が解決しようとする課題】
本発明の目的は、半導体チップと被着体との間に介在される接着剤にボイドが発生することを防ぐようにした半導体チップのボンディング方法および装置を提供することである。
【０００５】
【課題を解決するための手段】
本発明は、半導体チップの一方の表面を支持し、被着体の取付面に向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して加熱押圧し、その後、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法である。
【０００６】
また本発明は、半導体チップの彎曲変形時のばね定数よりも大きいばね定数を有する弾力性のある吸着部材の外方の凸の吸着面に、半導体チップの前記一方の表面を、真空吸着して、半導体チップを、前記凸に彎曲変形させることを特徴とする。
【０００７】
また本発明は、取付具を準備し、
この取付具は、
自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
吸着部材の厚み方向に吸着面とは反対側の基端部が固定される通路が形成された取付具本体とを含み、
通気孔を負圧源によって負圧とし、
吸着面に、半導体チップの一方の表面を真空吸着して、半導体チップを外方に凸の形状に彎曲し、
半導体チップの他方の表面と被着体の取付面との間に、接着剤を介在し、
取付具本体と被着体とを、相互に近接変位して加熱押圧し、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法である。
【０００８】
また本発明は、（ａ）取付具であって、
（ａ１）自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
（ａ２）吸着部材の厚み方向に吸着面とは反対側の基端部が固定される取付具本体とを有する取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）取付具と被着体とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置である。
【０００９】
また本発明は、吸着部材のばね定数は、半導体チップの彎曲変形時のばね定数よりも大きく選ばれることを特徴とする。
【００１０】
本発明に従えば、図１〜図４に関連して後述されるように、半導体チップの一方の表面を、たとえば取付具の吸着部材の吸着面に負圧によって真空吸着して保持し、これによって半導体チップを被着体に向って凸に、半導体チップの弾発力によって湾曲変形させ、この状態で、被着体の取付面に、接着剤を介在して加熱押圧し、その後、半導体チップを平坦な状態にする。こうして接着剤に、空気の気泡が巻き込まれることが確実に防がれ、ボイドの発生を防ぐことができる。接着剤は、粘性のある液体、すなわちペースト状であってもよく、またはフィルム状であってもよい。
【００１１】
半導体チップの湾曲変形された凸の頂部を先に、接着剤を介して被着体の取付面に相互に近接変位して押圧するようにしてもよいが、他の実施の形態では、ロールラミネートの要領で半導体チップの一端部から頂部を経て他端部に順次的に押圧して接着するようにしてもよい。接着剤は、半導体チップの前記他方の表面に付着されてもよいが、被着体の取付面上に付着されてもよく、あるいはまた半導体チップの前記他方の表面と被着体の前記取付面との両者に付着されていてもよい。
【００１２】
半導体チップを凸に湾曲変形させるには、上述のように弾力性を有する吸着部材の吸着面に負圧によって真空吸着するようにしてもよいが、他の実施の形態では、半導体チップの前記一方の表面を取付具に、粘着剤、両面テープなどを介して、剥離可能に保持してもよい。
【００１３】
吸着部材が弾力性を有する材料から成る構成では、そのばね定数を、半導体チップのばね定数よりも大きく選び、すなわち吸着部材を、半導体チップに比べて弾性変形しにくい材料製とし、これによって半導体チップの前記一方の表面を、吸着部材の外方に凸である吸着面に沿って真空吸着することが確実になる。
【００１４】
半導体チップは、近年の薄削り技術の発達によって、湾曲してたわませても破損しない強度を有し、これによって本発明の実施が可能である。半導体チップの裏面研磨後の加工変質層をエッチングなどで取除いて平滑にすることが好ましく、これによって半導体チップの強度が改善され、半導体チップを湾曲変形させたとき、破損することを抑制することができる。
【００１５】
また本発明は、半導体チップの一方の表面を支持し、
可撓性被着体を、その取付面が半導体チップに向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して押圧し、その後、被着体の取付面を平坦な状態にすることを特徴とする半導体チップのボンディング方法である。
【００１６】
また本発明は、半導体チップの前記一方の表面を真空吸着して保持することを特徴とする。
【００１７】
また本発明は、（ａ）半導体チップの吸着面を有し、この吸着面に開口する通気孔が形成されて構成される取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）支持部材であって、
取付具の吸着面に対向する被着体の支持面を有し、
支持面は、吸着面に向って凸に形成され、
弾力性を有する材料から成る支持部材と、
（ｄ）取付具と支持部材とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置である。
【００１８】
また本発明は、支持部材のばね定数は、支持面上に置かれる被着体のばね定数よりも大きく選ばれることを特徴とする。
【００１９】
本発明に従えば、図５および図６に関連して後述されるように、柔軟性のある可撓性を有するフィルム状などの被着体を、たとえば弾力性を有する支持部材の支持面に配置して、その取付面は、自然状態では、半導体チップに向って凸に湾曲しており、この状態で取付具のたとえば吸着面に、真空吸着によって半導体チップの一方の表面を支持し、接着剤を介在して半導体チップと被着体とを相互に近接変位して押圧する。こうして接着剤に空気の気泡を巻き込まず、ボイドの発生を抑制して、半導体チップの他方の表面と被着体の取付面との接着を行うことが可能になる。
【００２０】
半導体チップは、たとえば平坦であって、湾曲変形した被着体の取付面の頂部に半導体チップの前記一方の表面を接着剤を介して接触して押圧するようにしてもよいが、他の実施の形態では、いわゆるロールラミネート要領で半導体チップの前記他方の表面の一端部から中央部を経て他端部に順に接触させて、接着剤を介して被着体の取付面に押圧するようにしてもよい。
【００２１】
また本発明は、接着剤は、フィルム状であることを特徴とする。
本発明に従えば、接着剤をフィルム状とし、たとえばフィルム状有機ダイボンディング材などを用いてもよい。これによって（１）厚み精度の向上を図り、（２）ペースト状接着剤を使用したときに生じる半導体チップの外側方へのペースト状接着剤のはみ出し量に比べて、フィルム状接着剤のはみ出し量の抑制を図ることができるとともに、（３）ボイドの発生をさらに一層抑制することができる。
【００２２】
【発明の実施の形態】
図１は、本発明の実施の一形態の全体の構成を示す縦断面図である。このボンディング装置１は基本的に、取付具２と、負圧源３と、この取付具２を図１の上下に変位して駆動する変位駆動手段４とを含む。取付具２は、半導体チップ５を真空吸着する吸着部材６と、この吸着部材６の基端部７が固定される取付具本体８とを含む。
【００２３】
吸着部材６は、弾力性を有し、耐熱性のある材料、たとえば軟質合成樹脂材料、たとえばシリコーンゴム、フッ素系ゴムなどの材料から成る。この吸着部材６は、図１に示される自然状態で外方に凸である吸着面９を有する。すなわち吸着面９は、自然状態で図１の下方である外方に凸である。吸着面９は、図１の紙面に垂直な軸線を有する円筒面の周方向にわたる一部分であってもよい。吸着部材６には、吸着面９に開口する厚み方向（図１の上下方向）に延びる通気孔１１が複数個、点在して形成される。本発明の実施の他の形態では、吸着部材６は、ポーラス状の多孔質材料製とし、吸着面９以外の部分をシール剤などで封止した構造によって実現されてもよい。
【００２４】
取付具本体８は、負圧室１２を有する。取付具本体８は、たとえば金属製であり、剛性である。この負圧室１２は、通路１３を介して、通気孔１１に連なる。吸着部材６の基端部７は、吸着部材６の厚み方向に吸着面９と反対側（図１の上方）にあり、前述のように通路１３が通気孔１１と連通するように配置されて、取付具本体８の下部に固定される。負圧室１２は、可撓管１４を介して負圧源３に連結される。取付具本体８の吸着部材６が取付けられる取付部４１には、電気ヒータなどの加熱手段４２が設けられる。加熱手段４２は、吸着部材６を介して半導体チップ５を、接着に適した温度に加熱する。
【００２５】
装置本体１６の基台１７には、被着体である配線基板１８が配置される。装置本体１６の立上り部１９には、変位駆動手段４が設けられ、取付具２を、図１に示される上限位置から、矢符２１に示すように、下降し、取付具２と基板１８とを、相互に近接変位して押圧する。基台１７には、負圧室４３と、この負圧室４３に電通して基板１８を真空吸着するための通路４４が形成される。負圧室４３は、可撓管１４を介して負圧源３に接続される。基台１７にはまた、通路４４による負圧によって真空吸着された基板１８を、接着に適した温度に加熱するための電気ヒータなどの加熱手段４５が設けられる。
【００２６】
薄削りされた薄片である自然状態で偏平な半導体チップ５を基板１８にボンディングするにあたっては、先ず図１に示されるように、その半導体チップ５の図１の上方である一方の表面２３を、吸着部材６の吸着面９に真空吸着して、半導体チップ５を図１の下方である外方に凸の形状に弾発的に湾曲変形させる。この半導体チップ５の図１の下方である他方の表面２４には、フィルム状接着剤２６が接着される。
【００２７】
フィルム状接着剤２６は、たとえばワニスをキャリアフィルムに塗工し、溶剤を揮発させ、キャリアフィルムから剥離した有機ダイボンディング材などであってもよいが、ペースト状であってもよい。このような接着剤２６は、たとえばポリイミド樹脂、エポキシ樹脂などから成ってもよい。接着剤２６は、熱可塑性合成樹脂などであってもよく、ホットメルト接着剤であってもよい。
【００２８】
図２は、半導体チップ５が接着剤２６を介して基板１８に接触した状態を示す一部の断面図である。図１の状態で、変位駆動手段４は、取付具２を矢符２１で示されるように下降する。これによって半導体チップ５の凸に湾曲した表面２４の図２における最下部である頂部２８は、接着剤２６を介して、先ず押圧される。
【００２９】
図３は、図１および図２に示されるボンディング装置１における変位駆動手段４によって取付具２が図２の状態からさらに下降された状態を示す。取付具２が変位駆動手段４によって下降されると、吸着部材６が弾性変形して圧縮され、こうして取付具本体８と基板１８とが押圧されて、吸着部材６が圧縮される。こうして半導体チップ５は、頂部２８から、次に、図３の左右の端部２９，３０に、左右対称に接触面が拡ってゆき、接着剤２６を介して基板１８の取付面３１に面接触される。こうして接着剤２６と基板１８の取付面３１とが、前述の頂部２８に対応する位置から左右に接触して拡ってゆく。取付具３は、図３の下限位置に達する。したがって接着剤２６内に空気の気泡が巻き込まれることはなく、ボイドの発生が防がれる。
【００３０】
また接着温度での接着剤２６の溶融粘度、吸着部材６の凸を平面に変形するのに要する圧力、凸変形弾性などを適切な値にそれぞれ選ぶ必要があり、さもなければ半導体チップ５が下に凸に変形したままで基板１８の取付面３１に接着されてしまう恐れがある。したがって、接着剤２６の物性に適合するように、吸着部材６などの物性を調整して選択する必要がある。
【００３１】
図４は、図１〜図３に示される実施の形態において、半導体チップ５を、接着剤２６を介して基板１８に接着して固定した状態を示す断面図である。前述の図３において、変位駆動手段４によって取付具２を下降変位し、接着剤２６の図３における下面の全面が、基板１８の平坦な取付面３１に面接触し、さらに接着に必要な圧力が加えられて押圧された状態が、予め定める時間、維持される。その後、負圧源３による吸着部材６の吸着面９における半導体チップ５の真空吸引が解除される。さらにその後、変位駆動手段４によって取付具２が上昇され、図１の上限１に戻る。こうして半導体チップ５の表面２４は、接着剤２６を介して基板１８の取付面３１に接着して固定される。
【００３２】
図５は、本発明の実施の他の形態のボンディング装置１ａの全体の構成を簡略化して示す断面図である。この実施の形態は、前述の図１〜図４に関連して前述した実施の形態に類似し、対応する部分の参照符には同一の数字を用い、また添え字ａを付して示す。注目すべきはこの実施の形態では、取付具本体８の下部は、吸着部材６ａを構成し、この吸着部材６ａには、複数の通気孔１１が点在して形成される。この吸着部材６の図５における下面である吸着面９ａは、扁平であり、矢符２１に垂直である。自然状態で扁平な半導体チップ５の一方の表面２３は、吸着面９に、真空吸着される。半導体チップ５の他方の表面２４には、前述の実施の形態と同様に接着剤２６が付着される。
【００３３】
基台１７上には、支持部材３３が設けられる。この支持部材３３は、弾力性を有する材料から成り、たとえば前述の実施の形態における吸着剤６と同様な材料から成ってもよい。支持部材３３は、取付具２ａにおける吸着部材６の吸着面９に対向する図５の上方に臨む支持面３４を有する。この支持面３４は、吸着面９ａに向って凸に形成される。支持面３４は、図５の紙面に垂直な軸線を有する円筒面の周方向に延びる一部分であってもよい。支持面３４上には、可撓性を有する被着体である、たとえばフレキシブル回路基板３５が載置され、これによって基板３５は、支持面３４上で図５の上方である外方に凸の形状で支持されて配置される。
【００３４】
半導体チップ５の一方の表面２３は、前述のように吸着部材６ａの吸着面９ａに真空吸着され、他方の表面２４には、接着剤２６が付着される。また前述のように支持部材３３の支持面３４上に可撓性基板３５が配置される。基台１７に形成された負圧室４３は、通路４４を介して、支持部材３３に形成された通気孔４６を介して基板３５の支持面３４を真空吸着する。この状態で、変位駆動手段４は、図５の矢符２１で示されるように、取付具２ａを図５の上限位置から下降して取付具２ａと基板３５を支持した支持部材３３とを相互に近接変位して押圧する。
【００３５】
図６は、図５に示される実施の形態における半導体チップ５が取付具２ａによって基板３５に押圧された状態を示す一部の断面図である。取付具２ａが矢符２１に示されるように下降されることによって先ず、支持面３４の頂部３６に対応する基板３５の部分に接触する。その後、さらに取付具２ａが変位駆動手段４によって下降変位されることによって、基板３５の半導体チップ５が取付られる取付面３７の接着剤２６と接触する位置が、図５および図６の左右方向に順次的に拡ってゆく。支持部材３３は、変位駆動手段４による取付具２ａの下降によって、圧縮変形される。こうして図６の状態では、半導体チップ５の表面２４は、接着剤２６を介して基板３５の取付面３７に面接触して接着される。こうして変位駆動手段４によって取付具２ａが図６の下限位置に到達し、接着剤２６による接着に必要な圧力および時間が保たれる。その後、負圧室１２における負圧源３ａによる負圧が解除される。したがって吸着部材６ａによる半導体チップ５の真空吸引が行われなくなる。その後、変位駆動手段４によって取付具２ａが上昇変位され、図５の状態に戻る。
【００３６】
本件発明者の実験結果を述べる。図１〜図４の実施の形態におけるボンディング装置１を用い、２５μｍ厚のフィルム状接着剤２６を、半導体チップ５の表面２４に貼り付けた。この半導体チップ５は、平面形状が縦１０×横１０ｍｍであり、５０μｍ厚を有する。半導体チップ５は、Ｓｉから成る。この半導体チップ５の表面２３は、両面粘着テープで、凸状の弾性吸着部材６に貼り付け、加熱されたガラス基板１８に熱圧着した。比較例では、上述の実施例と同一形状の半導体チップ５を、平面を有する剛体に両面粘着テープで貼り付け、加熱されたガラス基板１８に、熱圧着した。
【００３７】
本件発明者のこのような実験によれば、ガラス基板１８側から取付面３１のボイドを観察した結果、比較例に比べて本発明に従う実施例の方が、空気を巻き込んだ面積が少なく、本発明が優れていることが、確認された。
【００３８】
【発明の効果】
本発明によれば、半導体チップを被着体に対して凸に湾曲変形し、または柔軟性のある可撓性被着体を、凸に湾曲変形した状態で、接着剤を介在して接触し押圧するようにしたので、接着剤中に気泡を巻き込みにくくなり、ボイドの無い接着を達成することができる。特にフィルム状有機ボンディング材などのフィルム状接着剤を用いて、ボイドの発生をさらに一層抑制することができるようになる。
【図面の簡単な説明】
【図１】本発明の実施の一形態の全体の構成を示す縦断面図である。
【図２】半導体チップ５が接着剤２６を介して基板１８に接触した状態を示す一部の断面図である。
【図３】図１および図２に示されるボンディング装置１における変位駆動手段４によって取付具２が図２の状態からさらに下降された状態を示す。
【図４】図１〜図３に示される実施の形態において、半導体チップ５を、接着剤２６を介して基板１８に接着して固定した状態を示す断面図である。
【図５】本発明の実施の他の形態のボンディング装置１ａの全体の構成を簡略化して示す断面図である。
【図６】図５に示される実施の形態における半導体チップ５が取付具２ａによって基板３５に押圧された状態を示す一部の断面図である。
【符号の説明】
１，１ａ　ボンディング装置
２，２ａ　取付具
３　負圧源
４　変位駆動手段
５　半導体チップ
６，６ａ　吸着部材
７　基端部
８　取付具本体
９，９ａ　吸着面
１１　通気孔
１２　負圧室
１８，３５　基板
２３　一方の表面
２４　他方の表面
２６　フィルム状接着剤
３１　取付面
３３　支持部材
３４　支持面
３７　取付面[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for attaching a thin semiconductor chip to a lead frame, a package, a wiring board, or the like, which is an adherend, for bonding.
[0002]
[Prior art]
Conventionally, when a semiconductor chip is adhered to an adherend such as a lead frame, a package, and a wiring board using an adhesive called a die attach agent, the semiconductor chip is vacuum-adsorbed with a collet, and the semiconductor chip is adhered through the adhesive. A technique of thermocompression bonding to a body is adopted. During this thermocompression bonding, the surface of the semiconductor chip facing the adherend is kept flat. In this prior art, voids tend to be formed in the adhesive interposed between the semiconductor chip and the adherend, and therefore, in a reflow process such as a soldering heat treatment at the time of mounting, moisture absorbed by the adhesive absorbs moisture in the reflow soldering. At the time of mounting, steam is generated by heating, and the adhesive is broken, thereby causing cracks.
[0003]
Prior art that solves this problem is disclosed in, for example, JP-A-2001-176895. In this prior art, an organic die bonding material, which is a film-like adhesive, is used to prevent the occurrence of voids. This prior art also has a configuration in which the flat surface of the semiconductor chip and the flat mounting surface of the adherend are bonded to each other, so that air is entrapped in the film-like organic die bonding material and bubbles are likely to remain. is there.
[0004]
[Problems to be solved by the invention]
An object of the present invention is to provide a method and an apparatus for bonding a semiconductor chip, which prevent a void from being generated in an adhesive interposed between a semiconductor chip and an adherend.
[0005]
[Means for Solving the Problems]
The present invention supports one surface of a semiconductor chip and deforms it convexly toward a mounting surface of an adherend,
In the state where an adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
A semiconductor chip bonding method characterized in that a semiconductor chip and an adherend are closely displaced to each other and heated and pressed, and thereafter the semiconductor chip is made flat.
[0006]
Further, the present invention provides a method in which the one surface of the semiconductor chip is vacuum-sucked to an outer convex suction surface of an elastic suction member having a spring constant larger than a spring constant at the time of bending deformation of the semiconductor chip. The semiconductor chip may be curved and deformed into the convex shape.
[0007]
The present invention also provides a fixture,
This fixture is
A suction member having a suction surface that is outwardly convex in a natural state, a ventilation hole extending in a thickness direction that is open to the suction surface is formed, and a suction member made of an elastic material;
A fixture body in which a passage to which a base end opposite to the suction surface in the thickness direction of the suction member is fixed is formed,
The vent hole is made negative pressure by a negative pressure source,
One surface of the semiconductor chip is vacuum-sucked on the suction surface, and the semiconductor chip is bent outwardly in a convex shape.
An adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
A method of bonding semiconductor chips, wherein a semiconductor body is flattened by displacing a mounting body and an adherend close to each other and heating and pressing the same.
[0008]
The present invention also provides (a) a mounting tool,
(A1) a suction member having a suction surface that is outwardly convex in a natural state, a ventilation hole extending in a thickness direction that opens in the suction surface, and formed of an elastic material;
(A2) a fixture having a fixture body to which a base end opposite to the suction surface in the thickness direction of the suction member is fixed;
(B) a negative pressure source having a negative pressure in the vent hole;
(C) A semiconductor chip bonding apparatus characterized by including a displacement driving means for pressing the attachment and the adherend in close proximity to each other.
[0009]
Further, the present invention is characterized in that the spring constant of the suction member is selected to be larger than the spring constant when the semiconductor chip is bent.
[0010]
According to the present invention, as will be described later with reference to FIGS. 1 to 4, one surface of the semiconductor chip is vacuum-adsorbed and held by, for example, a negative pressure on a suction surface of a suction member of a fixture. The semiconductor chip is bent toward the adherend by the elastic force of the semiconductor chip, and in this state, the mounting surface of the adherend is heated and pressed with an adhesive, and then the semiconductor chip is pressed. To a flat state. In this way, air bubbles are reliably prevented from being caught in the adhesive, and the generation of voids can be prevented. The adhesive may be a viscous liquid, ie, a paste, or a film.
[0011]
Although the curved top of the semiconductor chip may be first displaced close to the mounting surface of the adherend via an adhesive and pressed by an adhesive, in another embodiment, a roll lamination may be used. In this manner, the semiconductor chip may be sequentially pressed from one end to the other end via the top and adhered. The adhesive may be attached to the other surface of the semiconductor chip, or may be attached to a mounting surface of the adherend, or alternatively, the other surface of the semiconductor chip and the mounting surface of the adherend. May be attached to both.
[0012]
In order to deform the semiconductor chip into a convex curve, as described above, the semiconductor chip may be vacuum-adsorbed to the suction surface of the elastic suction member by a negative pressure. May be releasably held to the fixture via an adhesive, a double-sided tape, or the like.
[0013]
In a configuration in which the suction member is made of a material having elasticity, the spring constant is selected to be larger than the spring constant of the semiconductor chip, that is, the suction member is made of a material that is less likely to be elastically deformed than the semiconductor chip. It is ensured that the one surface is vacuum-sucked along the suction surface that is outwardly convex of the suction member.
[0014]
A semiconductor chip has a strength that does not break even if it is bent and bent due to the recent development of thinning technology, whereby the present invention can be implemented. It is preferable to remove the damaged layer after polishing the back surface of the semiconductor chip by etching or the like to smooth the surface, thereby improving the strength of the semiconductor chip and suppressing breakage when the semiconductor chip is bent and deformed. Can be.
[0015]
The present invention also supports one surface of the semiconductor chip,
The flexible adherend has its mounting surface deformed convexly toward the semiconductor chip,
In the state where an adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
A semiconductor chip bonding method characterized in that a semiconductor chip and an adherend are mutually displaced close to each other and pressed, and then the mounting surface of the adherend is made flat.
[0016]
Further, the invention is characterized in that the one surface of the semiconductor chip is held by vacuum suction.
[0017]
The present invention also provides: (a) a mounting tool having a suction surface for a semiconductor chip and having a ventilation hole opened in the suction surface;
(B) a negative pressure source having a negative pressure in the vent hole;
(C) a support member,
Having a support surface of the adherend opposed to the suction surface of the fixture,
The support surface is formed convex toward the suction surface,
A support member made of an elastic material;
(D) A semiconductor chip bonding apparatus characterized by including a displacement driving means for pressing the mounting tool and the support member in close proximity to each other.
[0018]
Further, the present invention is characterized in that the spring constant of the support member is selected to be larger than the spring constant of the adherend placed on the support surface.
[0019]
According to the present invention, as described later with reference to FIGS. 5 and 6, an adherend such as a film having flexibility is attached to a support surface of an elastic support member, for example. In the natural state, the mounting surface is convexly curved toward the semiconductor chip. In this state, one surface of the semiconductor chip is supported by, for example, a suction surface of the mounting device by vacuum suction and adhered. The semiconductor chip and the adherend are displaced close to each other and pressed by the agent. In this way, air bubbles are not entrained in the adhesive, the generation of voids is suppressed, and the other surface of the semiconductor chip can be bonded to the mounting surface of the adherend.
[0020]
The semiconductor chip is, for example, flat, and the one surface of the semiconductor chip may be pressed against the top of the mounting surface of the adherend that has been curved and deformed by contact with an adhesive. In the form of, in a so-called roll lamination manner, one end of the other surface of the semiconductor chip is brought into contact with the other end through the central portion in order, and pressed against the mounting surface of the adherend via an adhesive. Is also good.
[0021]
Further, the present invention is characterized in that the adhesive is in the form of a film.
According to the present invention, the adhesive may be in the form of a film, and for example, a film-like organic die bonding material may be used. As a result, (1) the thickness accuracy is improved, and (2) the amount of protrusion of the film-like adhesive to the outside of the semiconductor chip generated when the paste-like adhesive is used is larger than that of the film-like adhesive. And (3) generation of voids can be further suppressed.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a longitudinal sectional view showing the overall configuration of one embodiment of the present invention. The bonding apparatus 1 basically includes a fixture 2, a negative pressure source 3, and a displacement driving means 4 for displacing the fixture 2 up and down in FIG. The fixture 2 includes a suction member 6 for vacuum-sucking the semiconductor chip 5 and a fixture main body 8 to which a base end 7 of the suction member 6 is fixed.
[0023]
The attraction member 6 is made of a material having elasticity and heat resistance, for example, a soft synthetic resin material, for example, a material such as silicone rubber or fluorine-based rubber. The suction member 6 has a suction surface 9 which is outwardly convex in the natural state shown in FIG. That is, the suction surface 9 is convex outward in the lower part of FIG. 1 in a natural state. The suction surface 9 may be a part extending in the circumferential direction of a cylindrical surface having an axis perpendicular to the paper surface of FIG. A plurality of ventilation holes 11 extending in the thickness direction (vertical direction in FIG. 1) that are open to the suction surface 9 are formed in the suction member 6 in a dotted manner. In another embodiment of the present invention, the suction member 6 may be realized by a structure in which a portion other than the suction surface 9 is sealed with a sealant or the like, made of a porous porous material.
[0024]
The attachment body 8 has a negative pressure chamber 12. The attachment body 8 is made of, for example, metal and is rigid. The negative pressure chamber 12 is connected to the ventilation hole 11 via the passage 13. The base end 7 of the suction member 6 is located on the opposite side of the suction surface 9 in the thickness direction of the suction member 6 (upper side in FIG. 1), and is arranged such that the passage 13 communicates with the vent hole 11 as described above. , Is fixed to the lower part of the fixture body 8. The negative pressure chamber 12 is connected to the negative pressure source 3 via a flexible tube 14. A heating means 42 such as an electric heater is provided in the mounting portion 41 of the mounting body 8 to which the suction member 6 is mounted. The heating means 42 heats the semiconductor chip 5 via the suction member 6 to a temperature suitable for bonding.
[0025]
On a base 17 of the apparatus main body 16, a wiring board 18 as an adherend is arranged. Displacement drive means 4 is provided at the rising portion 19 of the apparatus main body 16, and the fixture 2 is lowered from the upper limit position shown in FIG. Are pressed close to each other. The base 17 is provided with a negative pressure chamber 43 and a passage 44 through which the substrate 18 is vacuum-adsorbed through the negative pressure chamber 43. The negative pressure chamber 43 is connected to the negative pressure source 3 via the flexible tube 14. The base 17 is also provided with a heating means 45 such as an electric heater for heating the substrate 18 vacuum-adsorbed by the negative pressure of the passage 44 to a temperature suitable for bonding.
[0026]
In bonding a semiconductor chip 5 which is a thin and thin piece and is flat in a natural state to a substrate 18, first, as shown in FIG. 1, one surface 23 of the semiconductor chip 5 above the semiconductor chip 5 in FIG. Vacuum suction is applied to the suction surface 9 of the suction member 6 to resiliently deform the semiconductor chip 5 into a downwardly convex shape which is the lower part of FIG. A film-like adhesive 26 is adhered to the other surface 24 of the semiconductor chip 5 which is below FIG.
[0027]
The film adhesive 26 may be, for example, an organic die bonding material obtained by applying a varnish to a carrier film, evaporating a solvent, and peeling off the carrier film, or may be a paste. Such an adhesive 26 may be made of, for example, a polyimide resin, an epoxy resin, or the like. The adhesive 26 may be a thermoplastic synthetic resin or the like, or may be a hot melt adhesive.
[0028]
FIG. 2 is a partial cross-sectional view showing a state where the semiconductor chip 5 is in contact with the substrate 18 via the adhesive 26. In the state shown in FIG. 1, the displacement drive unit 4 moves down the fixture 2 as indicated by an arrow 21. As a result, the top 28, which is the lowermost part in FIG. 2, of the convexly curved surface 24 of the semiconductor chip 5 is first pressed via the adhesive 26.
[0029]
FIG. 3 shows a state in which the attachment 2 is further lowered from the state shown in FIG. 2 by the displacement driving means 4 in the bonding apparatus 1 shown in FIGS. When the attachment 2 is lowered by the displacement driving means 4, the suction member 6 is elastically deformed and compressed, and thus the attachment main body 8 and the substrate 18 are pressed, and the suction member 6 is compressed. In this way, the contact surface of the semiconductor chip 5 spreads symmetrically from the top portion 28 to the left and right end portions 29 and 30 in FIG. Contacted. In this way, the adhesive 26 and the mounting surface 31 of the substrate 18 spread right and left from the position corresponding to the top portion 28 described above. The attachment 3 reaches the lower limit position in FIG. Therefore, no air bubbles are trapped in the adhesive 26, and the generation of voids is prevented.
[0030]
In addition, it is necessary to select appropriate values for the melt viscosity of the adhesive 26 at the bonding temperature, the pressure required to deform the protrusion of the adsorption member 6 into a flat surface, the protrusion deformation elasticity, and the like. There is a danger that it will adhere to the mounting surface 31 of the substrate 18 while being deformed convexly. Therefore, it is necessary to adjust and select the physical properties of the suction member 6 and the like so as to match the physical properties of the adhesive 26.
[0031]
FIG. 4 is a cross-sectional view showing a state where the semiconductor chip 5 is adhered and fixed to the substrate 18 via the adhesive 26 in the embodiment shown in FIGS. 3, the fixture 2 is displaced downward by the displacement driving means 4, so that the entire lower surface of the adhesive 26 in FIG. 3 comes into surface contact with the flat mounting surface 31 of the substrate 18, and the pressure required for bonding is further increased. Is kept pressed for a predetermined period of time. Thereafter, the vacuum suction of the semiconductor chip 5 on the suction surface 9 of the suction member 6 by the negative pressure source 3 is released. Thereafter, the attachment 2 is raised by the displacement driving means 4 and returns to the upper limit 1 in FIG. Thus, the surface 24 of the semiconductor chip 5 is adhered and fixed to the mounting surface 31 of the substrate 18 via the adhesive 26.
[0032]
FIG. 5 is a simplified cross-sectional view showing the overall configuration of a bonding apparatus 1a according to another embodiment of the present invention. This embodiment is similar to the embodiment described above with reference to FIGS. 1 to 4, and the same reference numerals are used for the corresponding parts, and a suffix a is added. It should be noted that, in this embodiment, the lower part of the fixture body 8 constitutes a suction member 6a, and a plurality of ventilation holes 11 are formed in the suction member 6a. The suction surface 9 a of the suction member 6, which is the lower surface in FIG. 5, is flat and perpendicular to the arrow 21. One surface 23 of the semiconductor chip 5 which is flat in a natural state is vacuum-sucked to the suction surface 9. An adhesive 26 is attached to the other surface 24 of the semiconductor chip 5 as in the above-described embodiment.
[0033]
A support member 33 is provided on the base 17. The support member 33 is made of a material having elasticity, for example, may be made of the same material as the adsorbent 6 in the above-described embodiment. The support member 33 has a support surface 34 facing upward in FIG. 5 that faces the suction surface 9 of the suction member 6 in the fixture 2a. The support surface 34 is formed to be convex toward the suction surface 9a. The support surface 34 may be a part extending in the circumferential direction of a cylindrical surface having an axis perpendicular to the paper surface of FIG. On the support surface 34, a flexible circuit board 35, which is a flexible adherend, is placed, so that the substrate 35 has an outwardly convex upper surface of FIG. It is supported and arranged in a shape.
[0034]
One surface 23 of the semiconductor chip 5 is vacuum-sucked to the suction surface 9a of the suction member 6a as described above, and an adhesive 26 is adhered to the other surface 24. Further, the flexible substrate 35 is disposed on the support surface 34 of the support member 33 as described above. The negative pressure chamber 43 formed in the base 17 vacuum-adsorbs the support surface 34 of the substrate 35 through the passage 44 and the air hole 46 formed in the support member 33. In this state, the displacement driving means 4 lowers the fixture 2a from the upper limit position in FIG. 5 and moves the fixture 2a and the support member 33 supporting the substrate 35, as indicated by the arrow 21 in FIG. To be displaced close to and pressed.
[0035]
FIG. 6 is a partial cross-sectional view showing a state where the semiconductor chip 5 in the embodiment shown in FIG. 5 is pressed against the substrate 35 by the fixture 2a. When the fixture 2a is lowered as shown by the arrow 21, it first comes into contact with a portion of the substrate 35 corresponding to the top 36 of the support surface 34. Thereafter, when the mounting fixture 2a is further displaced downward by the displacement driving means 4, the position of the mounting surface 37 of the substrate 35 where the semiconductor chip 5 is mounted comes into contact with the adhesive 26 in the left-right direction in FIGS. It spreads sequentially. The support member 33 is compressed and deformed by the lowering of the fixture 2a by the displacement driving means 4. In this manner, in the state shown in FIG. 6, the surface 24 of the semiconductor chip 5 is brought into surface contact with the mounting surface 37 of the substrate 35 via the adhesive 26 and bonded. In this way, the attachment 2 a reaches the lower limit position in FIG. 6 by the displacement driving means 4, and the pressure and time required for the adhesion by the adhesive 26 are maintained. Thereafter, the negative pressure in the negative pressure chamber 12 by the negative pressure source 3a is released. Therefore, vacuum suction of the semiconductor chip 5 by the suction member 6a is not performed. Thereafter, the attachment 2a is displaced upward by the displacement driving means 4, and returns to the state of FIG.
[0036]
The experimental results of the present inventor will be described. Using the bonding apparatus 1 in the embodiment shown in FIGS. 1 to 4, a film adhesive 26 having a thickness of 25 μm was attached to the surface 24 of the semiconductor chip 5. The semiconductor chip 5 has a plane shape of 10 × 10 mm and a thickness of 50 μm. The semiconductor chip 5 is made of Si. The surface 23 of the semiconductor chip 5 was attached to the convex elastic suction member 6 with a double-sided adhesive tape, and was thermocompression-bonded to the heated glass substrate 18. In the comparative example, the semiconductor chip 5 having the same shape as that of the above-described example was attached to a rigid body having a flat surface with a double-sided adhesive tape, and was thermocompression-bonded to the heated glass substrate 18.
[0037]
According to the experiment of the present inventor, as a result of observing the voids in the mounting surface 31 from the glass substrate 18 side, the example according to the present invention has a smaller area in which air It was confirmed that the invention was excellent.
[0038]
【The invention's effect】
According to the present invention, the semiconductor chip is deformed to be convexly curved with respect to the adherend, or the flexible and flexible adherend is deformed to be convex and contacted with an adhesive. Since the pressing is performed, air bubbles are hardly entangled in the adhesive, and bonding without voids can be achieved. In particular, the use of a film-like adhesive such as a film-like organic bonding material can further suppress the generation of voids.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing the entire configuration of an embodiment of the present invention.
FIG. 2 is a partial cross-sectional view showing a state where the semiconductor chip 5 is in contact with a substrate 18 via an adhesive 26.
3 shows a state in which the attachment 2 is further lowered from the state shown in FIG. 2 by the displacement driving means 4 in the bonding apparatus 1 shown in FIGS. 1 and 2. FIG.
FIG. 4 is a cross-sectional view showing a state where the semiconductor chip 5 is adhered and fixed to a substrate 18 via an adhesive 26 in the embodiment shown in FIGS.
FIG. 5 is a simplified cross-sectional view showing the overall configuration of a bonding apparatus 1a according to another embodiment of the present invention.
FIG. 6 is a partial cross-sectional view showing a state where the semiconductor chip 5 in the embodiment shown in FIG. 5 is pressed against the substrate 35 by the fixture 2a.
[Explanation of symbols]
1, 1a Bonding device 2, 2a Attachment 3 Negative pressure source 4 Displacement drive means 5 Semiconductor chip 6, 6a Attachment member 7 Base end 8 Attachment body 9, 9a Attachment surface 11 Vent hole 12 Negative pressure chamber 18, 35 Substrate 23 One surface 24 The other surface 26 Film adhesive 31 Mounting surface 33 Support member 34 Support surface 37 Mounting surface

Claims (11)

半導体チップの一方の表面を支持し、被着体の取付面に向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して加熱押圧し、その後、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法。Supporting one surface of the semiconductor chip and deforming it convexly toward the mounting surface of the adherend,
In the state where an adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
A method for bonding a semiconductor chip, wherein the semiconductor chip and the adherend are displaced close to each other and heated and pressed, and thereafter the semiconductor chip is made flat. 半導体チップの彎曲変形時のばね定数よりも大きいばね定数を有する弾力性のある吸着部材の外方の凸の吸着面に、半導体チップの前記一方の表面を、真空吸着して、半導体チップを、前記凸に彎曲変形させることを特徴とする請求項１記載の半導体チップのボンディング方法。The one surface of the semiconductor chip is vacuum-sucked to the outer convex suction surface of an elastic suction member having a spring constant larger than the spring constant at the time of bending deformation of the semiconductor chip, and the semiconductor chip is vacuum-sucked. 2. The method according to claim 1, wherein the convex deformation is performed. 取付具を準備し、
この取付具は、
自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
吸着部材の厚み方向に吸着面とは反対側の基端部が固定される通路が形成された取付具本体とを含み、
通気孔を負圧源によって負圧とし、
吸着面に、半導体チップの一方の表面を真空吸着して、半導体チップを外方に凸の形状に彎曲し、
半導体チップの他方の表面と被着体の取付面との間に、接着剤を介在し、
取付具本体と被着体とを、相互に近接変位して加熱押圧し、半導体チップを平坦な状態にすることを特徴とする半導体チップのボンディング方法。Prepare the fixture,
This fixture is
A suction member having a suction surface that is outwardly convex in a natural state, a ventilation hole extending in a thickness direction that is open to the suction surface is formed, and a suction member made of an elastic material;
A fixture body in which a passage to which a base end opposite to the suction surface in the thickness direction of the suction member is fixed is formed,
The vent hole is made negative pressure by a negative pressure source,
One surface of the semiconductor chip is vacuum-sucked on the suction surface, and the semiconductor chip is bent outwardly in a convex shape.
An adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
A method for bonding a semiconductor chip, wherein a semiconductor chip is flattened by displacing a mounting body and an adherend close to each other and heating and pressing the same. 半導体チップの一方の表面を支持し、
可撓性被着体を、その取付面が半導体チップに向って凸に彎曲変形させ、
半導体チップの他方の表面と被着体の取付面との間に、接着剤が介在された状態で、
半導体チップと被着体とを相互に近接変位して押圧し、その後、被着体の取付面を平坦な状態にすることを特徴とする半導体チップのボンディング方法。Support one surface of the semiconductor chip,
The flexible adherend has its mounting surface deformed convexly toward the semiconductor chip,
In the state where an adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
A method of bonding a semiconductor chip, wherein a semiconductor chip and an adherend are displaced close to each other and pressed, and then the mounting surface of the adherend is made flat. 半導体チップの前記一方の表面を真空吸着して保持することを特徴とする請求項４記載の半導体チップのボンディング方法。5. The semiconductor chip bonding method according to claim 4, wherein said one surface of the semiconductor chip is held by vacuum suction. 取付具を準備し、
この取付具は、吸着面を有し、この吸着面に開口する通気孔が形成されて構成され、
通気孔を、負圧源によって負圧とし、
支持部材を準備し、
この支持部材は、取付具の吸着面に対向する支持面を有し、
支持面は、吸着面に向って凸に形成され、弾力性を有し、
吸着面に半導体チップの一方表面を真空吸着し、
可撓性被着体を、支持面上で外方に凸の形状で支持して配置し、
半導体チップの他方の表面と、被着体の取付面との間に、接着剤を介在し、
取付具と被着体を支持した支持部材とを、相互に近接変位して押圧し、
被着体の取付面が半導体チップの前記他方の表面に沿う形状になった状態にすることを特徴とする半導体チップのボンディング方法。Prepare the fixture,
The attachment has a suction surface, and is formed by forming a ventilation hole that opens in the suction surface,
The vent is made negative pressure by a negative pressure source,
Prepare the support member,
This support member has a support surface facing the suction surface of the fixture,
The support surface is formed convex toward the suction surface, has elasticity,
Vacuum suction of one surface of the semiconductor chip to the suction surface,
The flexible adherend is placed and supported on the support surface in an outwardly convex shape,
An adhesive is interposed between the other surface of the semiconductor chip and the mounting surface of the adherend,
The mounting member and the supporting member supporting the adherend are displaced close to each other and pressed,
A method of bonding a semiconductor chip, wherein a mounting surface of an adherend is in a shape along the other surface of the semiconductor chip. 接着剤は、フィルム状であることを特徴とする請求項１〜６のうちの１つに記載の半導体チップのボンディング方法。The method for bonding a semiconductor chip according to claim 1, wherein the adhesive is in the form of a film. （ａ）取付具であって、
（ａ１）自然状態で外方に凸である吸着面を有し、この吸着面に開口する厚み方向に延びる通気孔が形成され、弾力性を有する材料から成る吸着部材と、
（ａ２）吸着部材の厚み方向に吸着面とは反対側の基端部が固定される取付具本体とを有する取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）取付具と被着体とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置。(A) a fixture,
(A1) a suction member having a suction surface that is outwardly convex in a natural state, a ventilation hole extending in a thickness direction that opens in the suction surface, and formed of an elastic material;
(A2) a fixture having a fixture body to which a base end opposite to the suction surface in the thickness direction of the suction member is fixed;
(B) a negative pressure source having a negative pressure in the vent hole;
(C) a semiconductor chip bonding apparatus, comprising: displacement driving means for pressing the attachment and the adherend in close proximity to each other. 吸着部材のばね定数は、半導体チップの彎曲変形時のばね定数よりも大きく選ばれることを特徴とする請求項８記載の半導体チップのボンディング装置。9. The semiconductor chip bonding apparatus according to claim 8, wherein a spring constant of the attraction member is selected to be larger than a spring constant at the time of bending deformation of the semiconductor chip. （ａ）半導体チップの吸着面を有し、この吸着面に開口する通気孔が形成されて構成される取付具と、
（ｂ）通気孔を負圧とする負圧源と、
（ｃ）支持部材であって、
取付具の吸着面に対向する被着体の支持面を有し、
支持面は、吸着面に向って凸に形成され、
弾力性を有する材料から成る支持部材と、
（ｄ）取付具と支持部材とを、相互に近接変位して押圧する変位駆動手段とを含むことを特徴とする半導体チップのボンディング装置。(A) a mounting tool having a suction surface of a semiconductor chip and having a ventilation hole formed in the suction surface;
(B) a negative pressure source having a negative pressure in the vent hole;
(C) a support member,
Having a support surface of the adherend opposed to the suction surface of the fixture,
The support surface is formed convex toward the suction surface,
A support member made of a resilient material;
(D) a semiconductor chip bonding apparatus, comprising: a displacement driving unit that presses the mounting member and the support member by displacing them close to each other. 支持部材のばね定数は、支持面上に置かれる被着体のばね定数よりも大きく選ばれることを特徴とする請求項１０記載の半導体チップのボンディング装置。11. The semiconductor chip bonding apparatus according to claim 10, wherein a spring constant of the support member is selected to be larger than a spring constant of the adherend placed on the support surface.
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