TWI817416B - Installation tools and installation devices - Google Patents

Abstract

The present invention provides a mounting tool and a mounting device that can reduce the residual air bubbles and damage to the substrate when mounting electronic components on a substrate. The embodiment is a mounting tool (31) for mounting electronic components (2) on a substrate (W). It has a holding surface (311) that is raised to bend and connect the electronic components (2); and a plurality of openings ( 312), provided on the holding surface (311); and a plurality of ventilation holes (313), respectively provided in communication with the plurality of openings (312), the plurality of ventilation holes (313) by setting the internal pressure to negative pressure. Hold the electronic component (2) on the holding surface (311), and sequentially set the adjacent vent holes (313) to positive pressure starting from the vent hole (313) close to the most raised peak part of the holding surface (311). , so that the electronic component (2) is separated from the holding surface (311).

Description

Installation tools and installation devices

The invention relates to an installation tool and an installation device.

When electronic components such as semiconductor elements such as logic, memory, and image sensors are mounted on a substrate, the wafer on which the semiconductor elements are formed is cut to form individual wafers. Then, the wafers are picked up one by one and transferred to the substrate for mounting.

In such mounting of electronic components, air bubbles may remain between the electronic components and the substrate. If there are air bubbles between the electronic components and the substrate, the connection will be poor and the strength will be insufficient, resulting in poor installation. In order to cope with this problem, when mounting electronic components, the electronic components are bent and held in a mounting tool that is pressed against the substrate, and a part of the electronic component is brought into contact with the substrate and pressed with an elastic body, thereby extruding The electronic components are mounted in such a way that there is air between them and the substrate. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent No. 3757193 [Patent Document 2] Japanese Patent Application Laid-Open No. 2003-203964 [Patent Document 3] Japanese Patent Application Laid-Open No. 2005-150311

[Problem to be solved by the invention]

However, in a tool in which the elastic body is deformed and crushed while being pressed, depending on the size of the electronic component, the pressed area may not expand evenly, or sufficient force may not be applied to the outer edge part, making it impossible to squeeze out the air bubbles. . In addition, excessive pressing force may be applied to the central part and electronic components may be damaged.

The present invention was made in order to solve the above-described problems, and an object thereof is to provide a mounting tool and a mounting device that can reduce the remaining air bubbles and damage to the substrate when mounting electronic components on a substrate. [Means to solve the problem]

The present invention is a mounting tool for mounting electronic components on a substrate. It has: a holding surface raised to bend and connect the electronic components; a plurality of openings provided on the holding surface; and a ventilation hole connected to the holding surface. The opening is connected, and the internal pressure is set to a negative pressure to hold the electronic component on the holding surface. The adjacent vent holes are set to a positive pressure to separate the electronic components from the holding surface.

The installation device of the present invention has the installation tool, and has: a tool moving mechanism to make the installation tool reciprocate between the transfer position and the installation position and to rise and fall between the transfer position and the installation position; and a detection part to detect whether the installation contact of the tool; and a switching unit that switches the negative pressure and the positive pressure on the ventilation hole of the mounting tool when the contact is detected by the detection unit. [Effects of the invention]

According to the mounting tool and mounting device of the present invention, bubbles remaining and damage to the substrate can be reduced when mounting electronic components on a substrate.

The mounting device of the embodiment will be described with reference to the drawings. In addition, the drawings are schematic diagrams, and the dimensions, ratios, etc. of each part include exaggerated parts for easy understanding. As shown in FIGS. 1 and 2 , the mounting device 1 includes a supply device 10 , a pickup device 20 , a mounting device 30 , and a control device 50 . The pickup device 20 transfers the electronic components 2 to the mounting device 30 , and the mounting device 30 A device mounted on the substrate W on the substrate stage 60 . The electronic component 2 is, for example, a wafer-shaped component. In this embodiment, the electronic component 2 is a semiconductor wafer obtained by dividing the wafer into individual pieces.

The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20 . The supply device 10 moves the electronic component 2 as a picked-up object to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 as a pickup object. The supply device 10 includes a supply stage 12 that supports the sheet 11 on which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12 . As the stage moving mechanism 13, for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.

Here, the sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). On the sheet 11, the electronic components 2 are arranged in a matrix. In this embodiment, the electronic component 2 is arranged in an upward state with the functional surface exposed upward.

The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by an overload stage moving mechanism 13 . Since the sheet 11 is supported horizontally together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

In addition, as shown in FIGS. 1 and 2 , the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. In addition, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction refers to the side with the plane of the sheet 11 as a boundary and on which the electronic components 2 are placed. The downward direction refers to the side with the plane of the sheet 11 as a boundary and with which the electronic components 2 are not placed. direction.

[pickup device] The pickup device 20 is a relay device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30 . The pick-up device 20 includes a pick-up nozzle 21 , a nozzle moving mechanism 22 , a direction conversion part 23 , and a push-up push button 24 .

The pickup nozzle 21 is a cylindrical adsorption nozzle that holds the electronic component 2 and releases the holding state to release the electronic component 2 . The pickup nozzle 21 has a nozzle hole opened on the suction surface at the front end. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and the circuit generates negative pressure, and the electronic component 2 is adsorbed and held by the nozzle hole. In addition, the electronic component 2 is released from the pickup nozzle 21 by releasing the negative pressure.

The nozzle moving mechanism 22 is a mechanism that reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2, and moves the pick-up nozzle 21 up and down in the supply position P1 and the delivery position P2. Specifically, the nozzle moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222 . In addition, the delivery position P2 is a position where the pick-up device 20 delivers the electronic component 2 picked up at the supply position P1 to the mounting tool 31 that functions as a receiving portion to be described later.

The supply position P1 and the delivery position P2 mainly refer to the positions in the XY direction, and do not necessarily refer to the positions in the Z-axis direction. In addition, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2 when the electronic component 2 is handed over, the distance to push the electronic component 2 up, the distance to which the electronic component 2 can be attracted, and the like.

The sliding mechanism 221 reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2. Here, the sliding mechanism 221 has a guide rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c traveling on the guide rail 221b. Although not shown in the figure, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lifting mechanism 222 moves the pickup nozzle 21 in the up and down direction. Specifically, the lifting mechanism 222 may use a linear guide that moves a slider on a guide rail through a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 moves up and down along the Z-axis direction by driving the servo motor.

The direction conversion part 23 is provided between the pickup nozzle 21 and the nozzle moving mechanism 22 . Here, the direction changing unit 23 is an actuator including a driving source such as a motor for changing the direction of the pickup nozzle 21 and a rotation guide such as a ball bearing. The so-called change of orientation means rotating 0° to 180° in the up and down direction. For example, the electronic component 2 is sucked and held at the supply position P1 by the pick-up nozzle 21 with the suction surface facing the supply stage 12 . Thereafter, the direction changing unit 23 changes the direction of the pickup nozzle 21 so that the suction surface faces upward. At this time, the rotation angle is 180°.

The upper push button 24 is provided below the sheet 11 of the supply device 10 . The upper push pin 24 is a needle-shaped member with a sharp front end. The upper push pin 24 is provided inside the support body 241 so that its length direction is parallel to the Z-axis direction.

The support body 241 has a driving mechanism for moving the upper push pin 24 in and out of the support body 241 or retracting the support body 241 to the inside thereof. The entry and exit or retraction is performed in the up and down direction. The drive mechanism includes, for example, a slider that is guided to move by an up-and-down guide rail, and a cylinder or a cam mechanism that drives the slider.

[Mounted device] The mounting device 30 is a device that carries the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate W. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a mounting tool 31 and a tool moving mechanism 32 .

The mounting tool 31 has a function as a receiving portion for receiving the electronic component 2 from the pickup nozzle 21 at the delivery position P2, and is a member that mounts the electronic component 2 on the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2 .

Specifically, as shown in FIGS. 3(A) and 3(B) , the mounting tool 31 is a block with a substantially rectangular parallelepiped shape in cross section, and has a holding surface 311 , an opening 312 , and a ventilation hole 313 . The holding surface 311 is the bottom surface of the mounting tool 31 and is a raised surface such that the electronic components 2 are bent and connected. Bending refers to bending without creating an angle, and also includes an embodiment called buckling in which a curved surface is generated between flat surfaces and bent as shown in FIG. 3(B) . The holding surface 311 of this embodiment has a mountain shape. The mountain shape referred to here refers to a shape in which two flat surfaces with different angles are gently continued at a peak portion including the central highest apex. That is, the planar shape of the holding surface 311 is a rectangle, the center of both side surfaces in the longitudinal direction is a peak portion, and the ridge line connecting the peak portions of both side surfaces is a short-side direction. Furthermore, the holding surface 311 is preferably made of a hard material for the mounting tool 31 to prevent elastic deformation under pressure during mounting of the electronic component 2 . The holding surface 311 may have a rectangular planar shape or a square shape depending on the electronic component 2 to be mounted. In addition, as mentioned above, FIGS. 3(A) to 3(C) and other drawings are schematic diagrams, and the degree of bulge of the holding surface 311 or the ratio to other parts, etc. are exaggerated for easy understanding.

As shown in FIG. 3(C) , a plurality of openings 312 are provided on the holding surface 311 . The plurality of openings 312 are arranged in a plurality of columns. Here, when the holding surface 311 is rectangular, the direction of each column is a direction parallel to its short side. However, it is not limited to the above-mentioned direction. The openings 312 in this embodiment are arranged in one row at the peak portion, that is, row [1], and two rows, row [2] and row [3], are provided on both short sides of the holding surface 311.

A plurality of ventilation holes 313 are provided, and one end of each ventilation hole 313 is connected to each opening 312 . The plurality of vent holes 313 hold the electronic component 2 on the holding surface 311 by setting the pressure in the hole to a negative pressure. The ventilation hole 313 is set to a positive pressure, and the electronic component 2 is separated from the holding surface 311 . In this embodiment, the positive pressure is set sequentially from the vent hole 313 on the central side of the electronic component 2 to the adjacent vent hole 313 . The other end of each vent hole 313 is connected to an air pressure circuit (not shown) generated by switching negative pressure and positive pressure. In this embodiment, the ventilation holes 313 of each row are respectively connected to pipes and valves so that negative pressure and positive pressure can be switched for each row. This type of valve functions as a switching unit for switching between negative pressure and positive pressure with respect to the vent hole 313 .

The tool moving mechanism 32 reciprocates the installation tool 31 between the transfer position P2 and the installation position P3, and moves the installation tool 31 up and down between the transfer position P2 and the installation position P3. The tool moving mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322 .

The sliding mechanism 321 reciprocates the installation tool 31 between the transfer position P2 and the installation position P3. Here, the sliding mechanism 321 includes two guide rails 321b that extend parallel to the X-axis direction and are fixed to the support frame 321a, and a slider 321c that runs on the guide rails 321b. Although not shown in the figure, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. Furthermore, although not shown in the figure, the sliding mechanism 321 has a sliding mechanism for sliding the mounting tool 31 in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider traveling on the guide rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

The lifting mechanism 322 drives the arm on which the installation tool 31 is detachably provided to move the installation tool 31 in the up and down direction. Specifically, the lifting mechanism 322 may use a linear guide that moves a slider on a guide rail through a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the mounting tool 31 moves up and down along the Z-axis direction. Furthermore, the lifting mechanism 322 is provided with a detection portion 322 a that detects contact with the mounting tool 31 . As the detection part 322a, a load sensor such as a strain gauge or a piezoelectric element can be used.

The substrate stage 60 is a stage that supports the substrate W for mounting the electronic component 2 . The substrate stage 60 is provided in the stage moving mechanism 61 . The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and positions the mounting position of the electronic component 2 on the substrate W at the mounting position P3. The stage moving mechanism 61 may use, for example, a linear guide that moves a slider on a guide rail using a ball screw mechanism driven by a servo motor.

The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10 , the pickup device 20 , the loading device 30 , and the substrate stage 60 . That is, the control device 50 is a control device of the mounting device 1 . The control device 50 can be implemented by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. The control device 50 is connected to an input device for the operator to input instructions or information required for control and an output device for confirming the status of the device. Input devices may use switches, touch screens, keyboards, mice, etc. The output device may use a display unit such as liquid crystal or organic electroluminescence (EL).

FIG. 4 is a functional block diagram of the control device 50. The control device 50 includes a supply device control unit 51 that controls the supply device 10 , a push-up control unit 52 and a pick-up nozzle control unit 53 that control the pickup device 20 , a mounting tool control unit 54 that controls the mounting device 30 , and a substrate stage 60 that controls the substrate stage 60 . The substrate stage control unit 56 and the memory unit 57 are provided.

The supply device control unit 51 controls the movement of the supply stage 12 . That is, the movement of the electronic component 2 as a pickup object placed on the sheet 11 is controlled. The upper pusher control unit 52 controls the movement of the upper pusher 24 .

The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21 , that is, the operations of the nozzle moving mechanism 22 and the direction conversion unit 23 . In addition, the pick-up nozzle control unit 53 controls the negative pressure generating circuit connected to the nozzle hole 21 b and controls the holding and releasing of the electronic component 2 .

The mounting tool control unit 54 controls the movement of the mounting tool 31 , that is, the operation of the tool moving mechanism 32 . In addition, the mounting tool control unit 54 controls the air pressure circuit connected to the ventilation hole 313 of the mounting tool 31 to switch the negative pressure and the positive pressure of the opening 312 of each row to control the holding and releasing of the electronic component 2 . In addition, the mounting tool control unit 54 controls switching between negative pressure and positive pressure in the vent hole 313 based on the contact detection by the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60 , that is, the operation of the stage moving mechanism 61 .

The storage unit 57 is a storage device including various memories as recording media (hard disk drive (HDD), solid state drive (SSD), etc.) and an interface between the recording medium and the outside. The memory unit 57 stores data and programs necessary for the operation of the mounting device 1 in advance, and stores data necessary for the operation of the mounting device 1 . The required data include, for example, the position coordinates of the supply position P1, the transfer position P2, the installation position P3, and the position coordinates of each moving mechanism. Each of the moving mechanisms controls the movement of each structure based on these coordinates. In addition, the memory unit 57 stores the timing of switching which column of the vent holes 313 of the mounting tool 31 from negative pressure to positive pressure.

[action] The operation of the mounting device 1 as described above will be described. First, the pickup device 20 picks up the electronic components 2 from the supply device 10 and delivers the electronic components 2 to the mounting device 30 . That is, the pickup nozzle 21 is moved to the supply position P1 where the upper push pin 24 is located by the pickup device 20 , so that the nozzle hole 21 b of the pickup nozzle 21 faces the upper push pin 24 .

On the other hand, the supply device 10 moves the supply stage 12 so that the electronic component 2 as a picked-up object is located at the supply position P1. Thereafter, the pickup nozzle 21 is lowered to bring the suction surface into contact with the electronic component 2 at the supply position P1, and the electronic component 2 is suctioned. Next, while holding the electronic components 2 , the pick-up nozzle 21 is raised and the electronic components 2 are pushed up by the push pin 24 , thereby peeling off the electronic components 2 from the sheet 11 and simultaneously picking up the electronic components 2 .

The pickup device 20 reverses the pickup nozzle 21 through the direction converting unit 23 . That is, the direction of the pickup nozzle 21 is rotated 180° in the up-down direction so that the suction surface of the pickup nozzle 21 faces upward. Furthermore, the reversal operation may be performed at any point between the supply position P1 and the delivery position P2.

The pick-up device 20 moves the picked-up electronic component 2 to the transfer position P2 through the nozzle moving mechanism 22 . The mounting tool 31 of the mounting device 30 is moved to the transfer position P2 by the tool moving mechanism 32 and waits. The holding surface 311 of the mounting tool 31 faces the nozzle hole 21 b of the pickup nozzle 21 via the electronic component 2 .

Then, the mounting tool 31 is lowered toward the pickup nozzle 21 located at the transfer position P2, and negative pressure is applied to the ventilation hole 313 of the mounting tool 31 to hold the electronic component 2. Then, the pickup nozzle 21 releases the negative pressure, thereby removing the negative pressure from the pickup nozzle 21. The electronic component 2 is delivered to the mounting tool 31 . Thereby, the electronic component 2 is bent in a manner imitating the bulge of the holding surface 311 and is adsorbed and held.

Thereafter, the mounting tool 31 moves to the mounting position P3 to mount the electronic component 2 on the substrate W. The installation operation will be described with reference to the flowchart of FIG. 5 and the operation explanation diagram of FIG. 6 . First, the mounting tool 31 moves to the mounting position P3, and as shown in FIG. 6(A) , the electronic component 2 held by the mounting tool 31 faces the substrate W (step S01). Then, the mounting tool 31 is lowered to bring the electronic component 2 close to the substrate W (step S02 ).

When the detection part 322a of the mounting tool 31 detects the contact between the electronic component 2 and the board W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, the negative pressure is stopped sequentially from a part of the vent hole 313 and is set to a positive pressure, whereby the electronic component 2 is detached and mounted on the substrate W. That is, the positive pressure is switched to the positive pressure in the order of row [1], row [2], and row [3] shown in FIGS. S07).

At this time, as shown in FIGS. 6(B) , 6(C) , and 6(D) , the electronic component 2 corresponding to the most raised peak portion of the holding surface 311 among the plurality of rows of the vent holes 313 The portion is initially in contact with the substrate W, and the negative pressure (white arrow in the figure) is switched to the positive pressure (black arrow in the figure) from the column of the peak portion to the adjacent column. Thereby, the curved electronic component 2 gradually detaches from the peak portion toward the outside to imitate the flat surface of the substrate W. Therefore, the air bubbles are removed to the outside and are mounted on the substrate W. After mounting, as shown in (E) of FIG. 6 , the mounting tool 31 rises, leaving the electronic component 2 and retracting from the substrate W (step S08 ).

[Effect] (1) This embodiment is a mounting tool 31 for mounting electronic components 2 on a substrate W. It has: a holding surface 311 that is raised in a manner that the electronic components 2 are bent and connected; a plurality of openings 312 are provided in the holding surface 311; And a plurality of ventilation holes 313 are provided in communication with the plurality of openings 312 respectively. The plurality of ventilation holes 313 maintain the electronic component 2 on the holding surface 311 by setting the internal pressure as a negative pressure, and by approaching the holding surface 311 from Starting from the vent hole 313 at the most raised peak portion, the adjacent vent holes 313 are sequentially set to positive pressure, and the electronic component 2 is detached from the holding surface 311 .

In addition, the mounting device 1 of this embodiment has the mounting tool 31, and has: the tool moving mechanism 32, which reciprocates the mounting tool 31 between the delivery position and the mounting position, and raises and lowers the delivery position and the mounting position; and the detection part 322a, which detects the contact pressure to the mounting tool 31; and a switching unit that switches the negative pressure and the positive pressure to the vent hole 313 of the mounting tool 31 when the detection unit 322a detects contact.

Therefore, since the electronic component 2 is bent by the negative pressure and held on the holding surface 311, the ventilation holes are sequentially set to positive pressure, and the electronic component 2 becomes flat in the manner of imitating the substrate W. Install the air bubbles at the same time. This can suppress bubbles from remaining between the electronic component 2 and the substrate W, thereby reducing mounting defects. Since the electronic component 2 is installed by utilizing its own bending recovery, the pressing force acts evenly without being biased, and can evenly squeeze out air bubbles and reduce damage to the electronic component 2 .

(2) The plurality of openings 312 are arranged in a plurality of columns. Therefore, by sequentially switching the negative pressure to the positive pressure for each row, it is possible to prevent excessive force from being applied to a part of the electronic component 2 and to restore the curved portion to a flat surface for mounting.

(3) Starting from the vent hole 313 close to the most raised peak portion of the holding surface 311 among the plurality of vent holes 313, the adjacent vent holes 313 are sequentially set to positive pressure. Therefore, from the part where the electronic component 2 first comes into contact with the substrate W, the air bubbles can be discharged gradually toward the outer edge and come into contact with the substrate W. Furthermore, by arranging each row parallel to the short side direction, the rectangular electronic component 2 can be bent in the long side direction where it is easily deformed.

(4) The holding surface 311 is in the shape of a mountain. Therefore, the outer edges of the substrate W on both sides sandwiching the peak portion in the center gradually become flat, and the bending returns to flat from the center of the electronic component 2 and the distance between the electronic component 2 and the substrate W is shortened. Therefore, the winding There is also less worry about getting into air bubbles. Furthermore, by forming a mountain shape on the long side of the holding surface 311 and setting the ridge line connecting the peak portions in the short side direction, the electronic component 2 is curved in the long side direction, so the electronic component 2 can easily imitate the holding surface 311 . Furthermore, a ridge line connecting the peak portions may be provided on either side of the holding surface 311 . For example, when a ridge is provided on the short side of one end, the electronic component 2 is in contact with the substrate W from one end to the other end by setting the positive pressure sequentially from one end to the other end. Even in this case, it is possible to obtain an effect of eliminating air bubbles and reducing damage to the electronic component 2 . The electronic component 2 does not bend, thereby further reducing the risk of damage. For example, in the case where rows are provided with openings 312 as shown in FIG. 3(C) , starting from row [3] on one end side, row [2], row [1], and row [2] on the other end side are followed. , the sequence of column [3] switches from negative pressure to positive pressure.

[Modification] The following modifications can also be applied to this embodiment. (1) The holding surface 311 may also be a curved surface. For example, as shown in FIG. 7 , the holding surface 311 may have a convex shape like a part of the side surface of the cylinder. In addition, the part of the side surface of the cylinder here also includes a part of a cylindrical body whose cross section is circular, elliptical, rounded rectangular, or track-shaped. Thereby, the bending of the electronic component 2 becomes gentle, and the influence on the electronic component 2 can be suppressed. Furthermore, in the embodiment, the opening 312 is provided in the ridge portion connecting the peak portions. However, the opening 312 does not necessarily need to be provided on the ridge line, and may be provided near it. The same effect as described above can be obtained by sequentially changing the negative pressure to the positive pressure from the position close to the ridge line in the ventilation hole 313 of each opening 312 . In addition, even in the case of such a curved surface, the ridge portion may be provided on either side of the holding surface 311 .

(2) When the mounting tool 31 receives the electronic component 2 from the pickup nozzle 21 , starting from a portion of the vent holes 313 of the holding surface 311 , the adjacent vent holes 313 may be set to negative pressure in sequence. That is, when the electronic component 2 is received by the mounting tool 31 , even if the electronic component 2 is bent to follow the holding surface 311 , if a part of the electronic component 2 floats or is deflected, the position of the electronic component 2 cannot be recognized, etc. Problems arise. In addition, if the electronic component 2 is to be mounted in a state where it floats or is deflected, there is a possibility that air bubbles may be trapped due to timing deviation when the electronic component 2 leaves the ridge along the outer edge.

For example, the adjacent vent holes 313 may be set to negative pressure in sequence starting from the vent hole 313 close to the most raised peak portion of the holding surface 311 among the plurality of vent holes 313 . More specifically, as shown in FIG. 8(A) , when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection part 322 a detects contact, as shown in FIG. 8(B) to FIG. 8(D) As shown in the figure, starting from the row [1] of the openings 312, the rows [2] and [3] (see (B) of FIG. 3 ) are set to negative pressure in sequence. Accordingly, the electronic component 2 can be gradually bent in the manner of the holding surface 311 while the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21, thereby suppressing floating or deflection and preventing position recognition from being impossible. In addition, since floating or deflection is reduced, when the electronic component 2 is mounted, the timing of detachment is less likely to shift, and the possibility of air bubbles being trapped can be reduced.

[Other embodiments] The present invention is not limited to the above-described embodiment, but also includes other embodiments shown below. In addition, the present invention also includes an embodiment in which all or any combination of the above-described embodiments and other embodiments described below are included. Furthermore, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and the modifications are also included in the present invention.

1: Install the device 2: Electronic parts 10: Supply device 11:Sheet 12: Supply carrier 13: Carrier moving mechanism 20: Pickup device 21: Pick up the nozzle 21b:Nozzle hole 22:Nozzle moving mechanism 23: Direction conversion part 24: Promotion on the Internet 30: Mounted device 31:Installation tools 32: Tool moving mechanism 50:Control device 51: Supply device control department 52: Go to the sales control department 53: Pick up nozzle control part 54: Installation tool control department 56:Substrate stage control section 57:Memory Department 60: Substrate carrier 61: Carrier moving mechanism 221, 321: Sliding mechanism 221a, 321a: Support framework 221b, 321b: guide rail 221c, 321c: slider 222, 322: Lifting mechanism 241:Support 311:Keep the surface 312:Open your mouth 313:Vent hole 322a: Inspection Department P1: supply position P2: handover position P3: Installation location S01, S02, S03, S04, S05, S06, S07, S08: steps W: substrate [1], [2], [3]: columns

Fig. 1 is a front view showing the mounting device according to the embodiment. Fig. 2 is a plan view showing the mounting device according to the embodiment. 3(A) to 3(C) are a side view (A), a cross-sectional view (B), and a bottom view (C) showing the mounting tool according to the embodiment. Fig. 4 is a functional block diagram of the control device according to the embodiment. FIG. 5 is a flowchart showing a procedure for mounting electronic components according to the embodiment. 6(A) to 6(E) are explanatory diagrams illustrating a mounting embodiment of electronic components according to the embodiment. FIG. 7 is a cross-sectional view showing a modified example of the mounting tool. 8(A) to 8(D) are explanatory diagrams showing an embodiment of receiving electronic components using a mounting tool.

2: Electronic parts

31:Installation tools

311:Keep the surface

312:Open your mouth

313:Vent hole

[1], [2], [3]: columns

Claims (6)

A mounting tool for mounting electronic components on a substrate, having: a holding surface raised in a manner to bend and connect the electronic components; a plurality of openings provided on the holding surface; and a plurality of through-holes The air holes are respectively provided in communication with the plurality of openings. The plurality of air holes hold the electronic components on the holding surface by setting the internal pressure to negative pressure, and move closer to the holding surface by Starting from the vent hole at the most raised peak portion, the adjacent vent holes are sequentially set to positive pressure to detach the electronic component from the holding surface. The installation tool according to claim 1, wherein the plurality of openings are arranged in a plurality of columns. The installation tool according to claim 1 or claim 2, wherein the retaining surface is in the shape of a mountain. The installation tool according to claim 1 or claim 2, wherein the retaining surface is a curved surface. An installation device, which has the installation tool according to any one of claims 1 to 4, and has: a tool moving mechanism that causes the installation tool to reciprocate between a handover position and an installation position and to move between the handover position and the installation position. position and the installation position rise and fall; a detection part detects contact with the installation tool; and a switching part switches the detection part to the installation tool when the contact is detected by the detection part. Negative pressure and positive pressure of the ventilation hole of the installation tool. The installation device according to claim 5, wherein the adjacent vent holes are set to negative pressure in sequence starting from the vent hole close to the most raised peak portion of the holding surface among the plurality of vent holes.