CN115132614A

CN115132614A - Mounting tool and mounting device

Info

Publication number: CN115132614A
Application number: CN202210290569.0A
Authority: CN
Inventors: 洼田俊也; 羽根洋祐
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 2021-03-29
Filing date: 2022-03-23
Publication date: 2022-09-30
Also published as: KR20220135189A; TWI817416B; JP2022152575A; TW202238750A

Abstract

The invention provides a mounting tool and a mounting device capable of reducing air bubble residue and substrate damage when mounting electronic components on a substrate. The embodiment is a mounting tool (31) for mounting an electronic component (2) on a substrate (W), comprising: a holding surface (311) that is raised so as to bend and contact the electronic component (2); a plurality of openings (312) provided in the holding surface (311); and a plurality of vent holes (313) that are provided so as to communicate with the plurality of openings (312), respectively, wherein the plurality of vent holes (313) hold the electronic component (2) on the holding surface (311) by setting the internal pressure to a negative pressure, and the electronic component (2) is detached from the holding surface (311) by setting the adjacent vent holes (313) to positive pressures in order from the vent hole (313) near the peak portion of the holding surface (311) that is the most raised.

Description

Mounting tool and mounting device

Technical Field

The invention relates to an installation tool and an installation device.

Background

When electronic components, which are semiconductor elements such as logic, memory, and image sensor, are mounted on a substrate, a wafer on which the semiconductor elements are formed is cut to produce individual chips. Then, the chips are picked up one by one and transferred to a substrate for mounting.

In the mounting of such electronic components, air bubbles may remain between the electronic components and the substrate. If air bubbles are present between the electronic component and the substrate, the connection is poor, the strength is insufficient, and the mounting is poor. To cope with this, when mounting an electronic component, the electronic component is bent and held by a mounting tool which is pressed against a substrate, and the electronic component is mounted so that a part of the electronic component is in contact with the substrate and then pressed by an elastic body, thereby pushing out gas between the electronic component and the substrate.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent No. 3757193 publication

[ patent document 2] Japanese patent laid-open No. 2003-203964

[ patent document 3] Japanese patent laid-open No. 2005-150311

Disclosure of Invention

[ problems to be solved by the invention ]

However, in a tool in which an elastic body is deformed and crushed while being pressed, depending on the size of an electronic component, a pressed region may not be uniformly spread, or a sufficient force may not be applied to an outer edge portion, and air bubbles may not be pushed out. In addition, an excessive pressing force may be applied to the central portion, and the electronic component may be damaged.

The present invention has been made to solve the above-described problems, and an object thereof is to provide a mounting tool and a mounting apparatus that can reduce the remaining of air bubbles and the damage of a substrate when an electronic component is mounted on the substrate.

[ means for solving problems ]

The present invention is a mounting tool for mounting an electronic component on a substrate, comprising: a holding surface that rises to bend and contact the electronic component; a plurality of openings provided in the holding surface; and a vent hole communicating with the opening, the electronic component being held on the holding surface by setting an internal pressure to a negative pressure, and the electronic component being detached from the holding surface by setting adjacent vent holes to positive pressures in order from the vent hole near a most raised peak portion of the holding surface.

The mounting device of the present invention includes the mounting tool, and includes: a tool moving mechanism for reciprocating and lifting the mounting tool between a delivery position and a mounting position; a detection unit that detects contact with the mounting tool; and a switching unit that switches between negative pressure and positive pressure with respect to the vent hole of the mounting tool when the contact is detected by the detection unit.

[ Effect of the invention ]

According to the mounting tool and the mounting apparatus of the present invention, it is possible to reduce the remaining of air bubbles and the breakage of the substrate when the electronic component is mounted on the substrate.

Drawings

Fig. 1 is a front view showing a mounting device of an embodiment.

Fig. 2 is a plan view showing the mounting device of the embodiment.

Fig. 3 (a) to 3 (C) are a side view (a), a sectional view (B), and a bottom view (C) showing the attachment tool of the embodiment.

Fig. 4 is a functional block diagram of the control device of the embodiment.

Fig. 5 is a flowchart showing a procedure of mounting the electronic components of the embodiment.

Fig. 6 (a) to 6 (E) are explanatory views showing an embodiment of mounting electronic components according to the embodiment.

Fig. 7 is a cross-sectional view showing a modification of the mounting tool.

Fig. 8 (a) to 8 (D) are explanatory views showing an embodiment of receiving an electronic component by a mounting tool.

[ description of symbols ]

1: mounting device

2: electronic component

10: supply device

11: sheet material

12: supply stage

13: platform deck moving mechanism

20: pick-up device

21: pick-up nozzle

21 b: nozzle hole

22: nozzle moving mechanism

23: direction changing part

24: push up pin

30: mounting device

31: mounting tool

32: tool moving mechanism

50: control device

51: supply device control unit

52: push up pin control part

53: pickup nozzle control section

54: mounting tool control unit

56: substrate stage control unit

57: storage unit

60: substrate carrying platform

61: platform deck moving mechanism

221. 321: sliding mechanism

221a, 321 a: support frame

221b, 321 b: guide rail

221c, 321 c: sliding device

222. 322: lifting mechanism

241: support body

311: retaining surface

312: opening of the container

313: vent hole

322 a: detection part

P1: supply position

P2: handover location

P3: mounting location

S01, S02, S03, S04, S05, S06, S07, S08: step (ii) of

W: substrate

Detailed Description

The mounting device of the embodiment is explained with reference to the drawings. The drawings are schematic views, and the dimensions, ratios, and the like of each portion are exaggerated for easy understanding. As shown in fig. 1 and 2, the mounting device 1 includes a supply device 10, a pickup device 20, a mounting device 30, and a control device 50, and is a device that delivers the electronic component 2 to the mounting device 30 via the pickup device 20 and mounts the electronic component on the substrate W of the substrate stage 60 via the mounting device 30. The electronic component 2 is, for example, a chip-like component. In the present embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces.

The supply device 10 is a device that supplies the electronic parts 2 to the pickup device 20. The supply device 10 moves the electronic part 2 as a pickup object to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 to be picked up. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12. As the stage moving mechanism 13, for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor is used.

Here, the sheet 11 to which the electronic component 2 is attached is an adhesive wafer sheet attached to a wafer ring not shown. On the sheet 11, the electronic components 2 are arranged in a matrix (matrix). In the present embodiment, the electronic component 2 is disposed in an upward state in which the functional surface is exposed upward.

The supply stage 12 is a stage that horizontally supports a wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic component 2 is attached is supported via a wafer ring. The supply stage 12 is provided to be movable in the horizontal direction by a stage moving mechanism 13. The sheet 11 is horizontally supported together with the feeding stage 12, and therefore the sheet 11 and the electronic component 2 placed on the sheet 11 are also provided to be movable in the horizontal direction.

As shown in fig. 1 and 2, the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is referred to as the X-axis direction, and the direction perpendicular to the X-axis is referred to as the Y-axis direction. The direction perpendicular to the plane of the sheet 11 is referred to as the Z-axis direction or the vertical direction. The upward direction is a direction on the side where the electronic component 2 is mounted and is defined by the plane of the sheet 11, and the downward direction is a direction on the side where the electronic component 2 is not mounted and is defined by the plane of the sheet 11.

[ pickup device ]

The pickup device 20 is a relay device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. The pickup device 20 includes a pickup nozzle 21, a nozzle moving mechanism 22, a direction switching section 23, and an upper push pin 24.

The pickup nozzle 21 is a cylindrical suction nozzle that holds the electronic component 2 and releases the held state to release the electronic component 2. The pickup nozzle 21 has a nozzle hole opened at an adsorption surface at a leading end thereof. The nozzle hole communicates with a negative pressure generating circuit (not shown) such as a vacuum pump, and the electronic component 2 is sucked and held by the nozzle hole by generating a negative pressure through the circuit. In addition, the electronic part 2 is released from the pickup nozzle 21 by releasing the negative pressure.

The nozzle moving mechanism 22 is a mechanism that reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2, and moves up and down between the supply position P1 and the delivery position P2. Specifically, the nozzle moving mechanism 22 includes a slide mechanism 221 and an elevating mechanism 222. The delivery position P2 is a position at which the pickup device 20 delivers the electronic component 2 picked up at the supply position P1 to the mounting tool 31 functioning as a receiving unit described later.

The supply position P1 and the delivery position P2 mainly refer to positions in the XY direction, and do not necessarily refer to positions in the Z axis direction. In addition, even when the position (height) in the Z-axis direction is referred to, the height has a predetermined width. The predetermined width includes a thickness of the electronic component 2 at the time of transfer of the electronic component 2, a distance by which the electronic component 2 is pushed up, a distance by which the electronic component 2 can be sucked, and the like.

The slide mechanism 221 reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2. Here, the slide mechanism 221 includes: a guide rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c traveling on the guide rail 221 b. Although not shown, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The elevating mechanism 222 moves the pickup nozzle 21 in the vertical direction. Specifically, the elevating mechanism 222 may use a linear guide that moves the slider on the guide rail by a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 is raised and lowered in the Z-axis direction by driving of the servo motor.

The direction switching portion 23 is provided between the pickup nozzle 21 and the nozzle moving mechanism 22. Here, the direction changing section 23 is an actuator including a drive source such as a motor for changing the direction of the pickup nozzle 21, and a rotation guide such as a ball bearing. The orientation is changed by rotating the film by 0 to 180 degrees in the vertical direction. For example, the electronic component 2 is sucked and held at the supply position P1 with the suction surface facing the pickup nozzle 21 of the supply stage 12. Thereafter, the direction switching section 23 changes the orientation of the pickup nozzle 21 so that the suction surface faces upward. At this time, the rotation angle is 180 °.

The upper push pins 24 are disposed below the sheet 11 of the feeding device 10. The upper push pin 24 is a needle-like member whose front end is sharp. The upper push pin 24 is provided inside the support 241 so that the longitudinal direction is parallel to the Z-axis direction.

The support 241 has a driving mechanism for moving the upper push pin 24 in and out of the interior thereof. The advancing or retreating is performed in the vertical direction. The drive mechanism includes, for example, a slider that moves guided by a guide rail in the vertical direction, and an air cylinder or a cam mechanism that drives the slider.

[ mounting device ]

The mounting device 30 is a device that conveys the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts the electronic component on the substrate W. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a mounting tool 31 and a tool moving mechanism 32.

The mounting tool 31 is a member that has a function as a receiving portion for receiving the electronic component 2 from the pickup nozzle 21 at the delivery position P2 and mounts the electronic component 2 on the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the held state to release the electronic component 2 after mounting.

Specifically, as shown in fig. 3 (a) and 3 (B), the mounting tool 31 is a block having a substantially rectangular parallelepiped cross section, and includes a holding surface 311, an opening 312, and a vent hole 313. The holding surface 311 is a bottom surface of the mounting tool 31, and is a surface that rises so that the electronic component 2 is bent and contacted. The term "bent" refers to an embodiment in which the sheet is bent so as not to form an angle, and includes a so-called bent embodiment in which the sheet is bent so as to form a curved surface between flat surfaces as shown in fig. 3 (B). The holding surface 311 of the present embodiment has a chevron shape. The chevron shape here means a shape in which two flat surfaces having different angles are smoothly continuous at a peak portion including the highest apex at the center. That is, the planar shape of the holding surface 311 is a rectangle, the center of both side surfaces in the longitudinal direction becomes a peak portion, and a ridge line connecting the peak portions of both side surfaces becomes the short side direction. The holding surface 311 is preferably formed of a hard material for preventing elastic deformation of the mounting tool 31 under pressure during mounting of the electronic component 2. The holding surface 311 may have a rectangular or square planar shape depending on the electronic component 2 to be mounted. As described above, fig. 3 (a) to 3 (C) and other drawings are schematic views, and the degree of protrusion of the holding surface 311, the ratio to other parts, and the like are exaggerated for easy understanding.

As shown in fig. 3 (C), a plurality of openings 312 are provided in the holding surface 311. The plurality of openings 312 are arranged in a plurality of columns. Here, when the holding surface 311 is rectangular, the direction of each row is parallel to the short side thereof. However, the direction is not limited to the above. In this embodiment, the openings 312 are arranged in two rows, i.e., two rows [1] arranged at the peak portion, and two rows, i.e., two rows [2] and two rows [3], are arranged on both short sides of the holding surface 311.

A plurality of vent holes 313 are provided, and one end of each vent hole 313 communicates with each opening 312. The plurality of vent holes 313 hold the electronic component 2 on the holding surface 311 by setting the pressure in the holes to a negative pressure, and the electronic component 2 is detached from the holding surface 311 by setting the adjacent vent holes 313 to a positive pressure in order from the vent hole 313 near the most elevated peak portion of the holding surface 311. In the present embodiment, positive pressure is applied in order from the vent hole 313 at the center of the electronic component 2 to the adjacent vent hole 313. The other end of each vent hole 313 communicates with a pneumatic circuit (not shown) that is generated by switching between negative pressure and positive pressure. In the present embodiment, the vent holes 313 of each row are connected to a pipe and a valve, respectively, so that the negative pressure and the positive pressure can be switched for each row. Such a valve functions as a switching unit for switching between negative pressure and positive pressure to the vent hole 313.

The tool moving mechanism 32 reciprocates the mounting tool 31 between the delivery position P2 and the mounting position P3, and moves up and down between the delivery position P2 and the mounting position P3. The tool moving mechanism 32 includes a slide mechanism 321 and an elevating mechanism 322.

The slide mechanism 321 reciprocates the mounting tool 31 between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 has: two guide rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c traveling on the guide rails 321 b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. Although not shown, the slide mechanism 321 includes a slide mechanism for sliding the mounting tool 31 in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider that travels on the guide rail. The slider is driven by a ball screw, a linear motor, or the like driven by a rotary motor.

The lifting mechanism 322 moves the mounting tool 31 in the vertical direction by driving an arm to which the mounting tool 31 is detachably attached. Specifically, the elevating mechanism 322 may use a linear guide that moves the slider on the guide rail by a ball screw mechanism driven by a servo motor. That is, the mounting tool 31 is moved up and down in the Z-axis direction by the driving of the servo motor. Further, the elevating mechanism 322 is provided with a detection portion 322a for detecting contact with the mounting tool 31. As the detection unit 322a, a load sensor such as a strain gauge or a piezoelectric element can be used.

The substrate stage 60 is a table that supports a substrate W on which the electronic component 2 is mounted. The substrate stage 60 is provided on a stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that moves the substrate stage 60 to slide on the XY plane and positions the mounting position of the electronic component 2 on the substrate W at the mounting position P3. The stage moving mechanism 61 may be a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor, for example.

The control device 50 controls the start, stop, speed, operation timing, and the like of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. That is, the control device 50 is a control device of the mounting device 1. The control device 50 can be realized by, for example, a dedicated electronic circuit, a computer operating with a predetermined program, or the like. An input device for inputting instructions or information required for control by an operator and an output device for confirming the state of the device are connected to the control device 50. The input device may use a switch, a touch screen, a keyboard, a mouse, or the like. The output device may use a display portion such as a liquid crystal display (lcd) or an organic Electroluminescence (EL).

Fig. 4 is a functional block diagram of the control device 50. The control device 50 includes: a supply device control unit 51 that controls the supply device 10, an upper push pin control unit 52 and a pickup nozzle control unit 53 that control the pickup device 20, a mounting tool control unit 54 that controls the mounting device 30, a substrate stage control unit 56 that controls the substrate stage 60, and a storage unit 57.

The supply device control unit 51 controls the movement of the supply stage 12. That is, the movement of the electronic part 2 as a pickup object placed on the sheet 11 is controlled. The upper push pin control section 52 controls the movement of the upper push pin 24.

The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21, that is, the operations of the nozzle moving mechanism 22 and the direction switching unit 23. The pickup nozzle control section 53 controls a negative pressure generation circuit communicating with the nozzle hole 21b, and controls holding and releasing of the electronic component 2.

The mounting tool control unit 54 controls the movement of the mounting tool 31, that is, the operation of the tool moving mechanism 32. The mounting tool control unit 54 controls the air pressure circuit communicating with the vent hole 313 of the mounting tool 31, and controls the holding and releasing of the electronic component 2 by switching the negative pressure and the positive pressure of the openings 312 of each row. The attachment tool control unit 54 controls switching between the negative pressure and the positive pressure in the vent hole 313 based on the contact detection by the detection unit 322 a. The substrate stage control unit 56 controls the movement of the substrate stage 60, that is, the operation of the stage moving mechanism 61.

The storage unit 57 is a storage device including various memories (a Hard Disk Drive (HDD), a Solid State Drive (SSD), or the like) as a recording medium, and an interface between the recording medium and the outside. The storage unit 57 stores data and programs necessary for the operation of the mounting apparatus 1, and also stores data necessary for the operation of the mounting apparatus 1. The required data include, for example, position coordinates of the supply position P1, the delivery position P2, the mounting position P3, and position coordinates of each moving mechanism. The respective moving mechanisms perform movement control of the respective structures based on the coordinates. In the storage portion 57, a timing of switching from the negative pressure to the positive pressure in which one of the rows of the vent holes 313 of the attachment tool 31 is arranged is stored.

[ actions ]

The operation of the mounting device 1 as described above will be described. First, the pickup device 20 picks up the electronic component 2 from the supply device 10, and delivers the electronic component 2 to the mounting device 30. That is, the pickup nozzle 21 is moved to the supply position P1 where the upper push pin 24 is located by the pickup device 20, and the nozzle hole 21b of the pickup nozzle 21 is opposed to the upper push pin 24.

On the other hand, the supply apparatus 10 moves the supply stage 12 so that the electronic component 2 to be picked up is positioned at the supply position P1. Thereafter, the pickup nozzle 21 is lowered to bring the suction surface into contact with the electronic component 2 at the supply position P1, thereby sucking the electronic component 2. Then, the pickup nozzle 21 is raised while holding the electronic part 2, and the electronic part 2 is pushed up by the push-up pin 24, thereby picking up the electronic part 2 while peeling off the electronic part 2 from the sheet 11.

The pickup device 20 reverses the pickup nozzle 21 by the direction switching section 23. That is, the orientation of the pickup nozzle 21 is rotated by 180 ° in the vertical direction, and the suction surface of the pickup nozzle 21 is directed upward. The reverse operation may be performed at any point from the supply position P1 to the delivery position P2.

The pickup device 20 moves the picked-up electronic part 2 to the joint position P2 by the nozzle moving mechanism 22. The mounting tool 31 of the mounting device 30 is moved to the delivery position P2 by the tool moving mechanism 32 and stands by, and the holding surface 311 of the mounting tool 31 faces the nozzle hole 21b of the pickup nozzle 21 via the electronic component 2.

Then, after the mounting tool 31 is lowered toward the pickup nozzle 21 positioned at the delivery position P2 and negative pressure is applied to the vent hole 313 of the mounting tool 31 to hold the electronic component 2, the pickup nozzle 21 releases the negative pressure, thereby delivering the electronic component 2 from the pickup nozzle 21 to the mounting tool 31. Thereby, the electronic component 2 is bent to follow the protrusion of the holding surface 311 and is sucked and held.

Thereafter, the mounting tool 31 moves to the mounting position P3, and the electronic component 2 is mounted on the substrate W. The mounting operation will be described with reference to the flowchart of fig. 5 and the operation explanatory diagram of fig. 6. First, the mounting tool 31 is moved to the mounting position P3, and as shown in fig. 6 a, the electronic component 2 held by the mounting tool 31 is opposed to the substrate W (step S01). Then, the mounting tool 31 is lowered to bring the electronic component 2 close to the substrate W (step S02).

When the detection portion 322a of the mounting tool 31 detects contact of the electronic component 2 with the substrate W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, the negative pressure is sequentially stopped from a part of the vent hole 313 and the negative pressure is set to the positive pressure, whereby the electronic component 2 is detached and mounted on the substrate W. That is, the positive pressure is switched in the order of the row [1], the row [2], and the row [3] shown in fig. 3 a to 3C, and air is blown from the opening 312 (step S05 to step S07).

At this time, as shown in fig. 6B, 6C, and 6D, the electronic component 2 corresponding to the most elevated peak portion of the holding surface 311 in the plurality of rows of the vent holes 313 first comes into contact with the substrate W, and the negative pressure (white arrows in the figure) is sequentially switched to the positive pressure (black arrows in the figure) from the row of the peak portion to the adjacent row. Thus, the electronic component 2 that has been bent gradually separates from the peak portion to the outside in a manner to follow the flat surface of the substrate W, and therefore, the air bubbles are removed to the outside and mounted on the substrate W. After mounting, as shown in fig. 6 (E), the mounting tool 31 is raised to leave the electronic component 2 and is retracted from the substrate W (step S08).

[ Effect ]

(1) The mounting tool 31 of the present embodiment is a mounting tool for mounting an electronic component 2 on a substrate W, and includes: a holding surface 311 that rises so that the electronic component 2 is bent and contacts; a plurality of openings 312 provided in the holding surface 311; and a plurality of vent holes 313 that are provided so as to communicate with the plurality of openings 312, respectively, wherein the plurality of vent holes 313 hold the electronic component 2 on the holding surface 311 by setting the internal pressure to a negative pressure, and the electronic component 2 is detached from the holding surface 311 by setting the adjacent vent holes 313 to a positive pressure in order from the vent hole 313 near the most raised peak portion of the holding surface 311.

The mounting device 1 of the present embodiment includes a mounting tool 31, and includes: a tool moving mechanism 32 for moving the mounting tool 31 back and forth between the delivery position and the mounting position and moving up and down between the delivery position and the mounting position; a detection unit 322a that detects a contact pressure with the mounting tool 31; and a switching unit that switches between negative pressure and positive pressure to the vent hole 313 of the mounting tool 31 when the contact is detected by the detection unit 322 a.

Therefore, by sequentially setting the positive pressure to the vent holes in a state where the electronic component 2 is bent from the holding surface 311 by the negative pressure, the electronic component 2 is mounted while discharging bubbles in a process of being flat to follow the substrate W. This can suppress air bubbles from remaining between the electronic component 2 and the substrate W, thereby reducing mounting defects. Since the electronic component 2 is mounted by the bending recovery of itself, the pressing force is not biased but acts uniformly, bubbles can be squeezed out uniformly, and the breakage of the electronic component 2 can be reduced.

(2) The plurality of openings 312 are formed in a plurality of rows. Therefore, by sequentially switching the negative pressure to the positive pressure for each row, the electronic component 2 can be mounted while the bent portion is returned to be flat while preventing an excessive force from being applied to a part of the electronic component.

(3) The adjacent vent holes 313 are set to positive pressure in order from the vent hole 313 near the most raised peak portion of the holding surface 311 among the plurality of vent holes 313. Therefore, bubbles can be discharged from the portion of the electronic component 2 first in contact with the substrate W, gradually toward the outer edge in contact with the substrate W. Further, by making each row parallel to the short side direction, the electronic component 2 having a rectangular shape can be bent in the long side direction in which it is easily deformed.

(4) The holding surface 311 has a mountain shape. Therefore, by gradually flattening the outer edge substrate W on both sides with the peak portion at the center therebetween, the bending is restored from the center of the electronic component 2 to be flat and the distance to contact the substrate W can be shortened, so that there is less concern about air bubbles being involved. Further, since the ridge shape is formed on the long side of the holding surface 311 and the ridge line connecting the peak portions is set to the short side direction, the electronic component 2 is bent in the long side direction, and thus the electronic component 2 easily follows the holding surface 311. Further, the ridge connecting the peak portions may be provided on either side of the holding surface 311. For example, when a ridge is provided on the short side of one end, the electronic component 2 is brought into contact with the substrate W from one end to the other end by applying positive pressure in order from one end to the other end. Even in this case, an effect is obtained that breakage of the electronic component 2 can be reduced while removing the air bubbles. The electronic component 2 is not bent, and accordingly, the possibility of breakage is further reduced. For example, in the case of a row provided with openings 312 as shown in fig. 3 (C), the negative pressure is switched to the positive pressure from the row [2], the row [1], and the row [2], the row [3] on the other end side in this order from the row [3] on the one end side.

[ modified examples ]

The following modifications can also be applied to this embodiment.

(1) The holding surface 311 may be a curved surface. For example, as shown in fig. 7, the holding surface 311 may have a raised shape like a part of a side surface of a cylinder. The term "part of the side surface of the cylinder" as used herein includes a part of a cylindrical body having a circular, oval, rectangular or racetrack cross-section. This smoothes the bending of the electronic component 2, and the influence on the electronic component 2 can be suppressed. In the above embodiment, the opening 312 is provided in the ridge portion connecting the peak portions. However, the opening 312 is not necessarily provided on the ridge line, and may be provided in the vicinity thereof. The same effect as described above can be obtained by setting the negative pressure to the positive pressure in order from the position near the ridge line in the vent hole 313 of each opening 312. In addition, even in the case of such a curved surface, the ridge portion may be provided on either side of the holding surface 311.

(2) When the mounting tool 31 receives the electronic component 2 from the pickup nozzle 21, the adjacent vent holes 313 may be set to a negative pressure in order from a part of the vent holes 313 of the holding surface 311. That is, when the mounting tool 31 receives the electronic component 2, even if the electronic component 2 is bent to follow the holding surface 311, if a part of the electronic component is floated or biased, a problem occurs in that the position recognition of the electronic component 2 is not possible. If the electronic component 2 is mounted in a state where it floats or is biased, the electronic component may be displaced along the outer edge and may be caught in air bubbles.

For example, the adjacent vent holes 313 may be set to negative pressure in order from the vent hole 313 near the most raised peak portion of the holding surface 311 among the plurality of vent holes 313. More specifically, as shown in fig. 8 a, when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection portion 322a detects contact, as shown in fig. 8B to 8D, the rows 2 and 3 (see fig. 3B) are set to negative pressure in order from the row 1 of the opening 312. Accordingly, since the mounting tool 31 receives the electronic component 2 from the pickup nozzle 21 while gradually bending the electronic component 2 in conformity with the holding surface 311, floating or leaning is suppressed, and position recognition is prevented from being disabled. Since the floating or leaning is reduced, the timing of the detachment is less likely to be shifted when the electronic component 2 is mounted, and the possibility of involving air bubbles can be reduced.

[ other embodiments ]

The present invention is not limited to the above embodiment, and includes other embodiments described below. The present invention also includes an embodiment in which all or any combination of the above-described embodiment and the other embodiments described below is included. Furthermore, various omissions, substitutions, and changes may be made to the embodiments without departing from the scope of the invention, and modifications thereof are also encompassed by the invention.

Claims

1. A mounting tool for mounting an electronic component on a substrate, comprising:

a holding surface that rises to bend and contact the electronic component;

a plurality of openings provided in the holding surface; and

a plurality of vent holes provided in communication with the plurality of openings, respectively,

the plurality of vent holes hold the electronic component on the holding surface by setting an internal pressure to a negative pressure, and the electronic component is detached from the holding surface by setting the adjacent vent holes to a positive pressure in order from the vent hole near the most elevated peak portion of the holding surface.

2. The installation tool of claim 1,

the plurality of openings are formed in a plurality of rows.

3. The installation tool according to claim 1 or 2,

the holding surface is mountain-shaped.

4. The installation tool according to claim 1 or 2,

the holding surface is a curved surface.

5. An installation device, characterized by having an installation tool according to any one of claims 1 to 4, and by having:

a tool moving mechanism for reciprocating the mounting tool between a delivery position and a mounting position and lifting and lowering the mounting tool at the delivery position and the mounting position;

a detection unit that detects contact with the mounting tool; and

and a switching unit that switches between negative pressure and positive pressure to the vent hole of the attachment tool when the contact is detected by the detection unit.

6. The mounting device of claim 5,

and setting the adjacent vent holes to be negative pressure in order from the vent hole close to the most raised peak part of the holding surface.