CN116895559A - Contact position setting device, mounting device, and contact position setting method - Google Patents

Contact position setting device, mounting device, and contact position setting method Download PDF

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Publication number
CN116895559A
CN116895559A CN202310311081.6A CN202310311081A CN116895559A CN 116895559 A CN116895559 A CN 116895559A CN 202310311081 A CN202310311081 A CN 202310311081A CN 116895559 A CN116895559 A CN 116895559A
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CN
China
Prior art keywords
contact
height position
push
unit
holding portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310311081.6A
Other languages
Chinese (zh)
Inventor
佐藤修平
山田泰弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2023027398A external-priority patent/JP2023152743A/en
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN116895559A publication Critical patent/CN116895559A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention provides a contact position setting device, a mounting device and a contact position setting method, which can set a contact reference height position for a holding part to be contacted with a contact object in a manner of restraining offset. The contact position setting device comprises: a driving mechanism for moving a holding portion for sucking and holding the electronic component in a direction of contact and separation with a contact object; a contact detection unit that detects contact between the holding unit and a contact object; a stop control unit for stopping movement of the holding unit when the contact detection unit detects contact; a detachment detection unit that moves the holding unit that detects the contact and stopped by the stop control unit in a direction of detachment from the contact object, and detects detachment of the holding unit from the contact object based on a change in suction pressure detected by the pressure detection unit at this time; and a reference position setting unit that sets a contact reference height position of the holding unit with respect to the contact object based on the height position of the holding unit detected by the position detecting unit when the detachment is detected by the detachment detecting unit.

Description

Contact position setting device, mounting device, and contact position setting method
Technical Field
The present invention relates to a contact position setting device, a mounting device, and a contact position setting method.
Background
In a mounting apparatus for mounting electronic components such as semiconductor chips on a substrate, electronic components supplied while being supported by a wafer sheet are picked up from the wafer sheet and transferred onto the substrate, and are mounted while being pressed against the substrate. In such a mounting device, the electronic component is held by the holding portion. The holding portion moves in a contact-separation manner with respect to the electronic component to approach and contact the electronic component supported by the wafer sheet for picking up the electronic component, and moves in a manner to hold the electronic component and separate from the wafer sheet. In addition, in order to press the electronic component against the substrate, the electronic component is moved so as to be held in contact with and separated from the substrate, so as to be brought close to the substrate, the electronic component is brought into contact with the substrate, and the holding of the electronic component is released, so that the electronic component is moved away from the substrate. In order to perform such movement of the holding portion, it is necessary to recognize the movement amount to the contact object such as the electronic component or the substrate.
Such a holding portion is driven in a direction of contact separation with respect to a contact object by a driving mechanism, and is provided so as to be relatively movable with respect to the driving mechanism in many cases. Thus, the holding portion moves toward the contact object, and when the holding portion contacts the contact object, the holding portion moves relative to the driving mechanism. Moreover, the relative movement is detected by a sensor. That is, since the relative position between the driving mechanism and the holding portion changes, the change in the relative position is detected by the sensor, and the holding portion is recognized as being in contact with the contact object based on a predetermined amount of change. In this way, the position (height position) of the contact object is identified, thereby identifying the amount of movement to the contact object.
Therefore, the height position of the contact object detected in this way is, for example, a movement destination for bringing the holding portion into contact with the electronic component at the time of pickup, and a height position of the contact object for bringing the electronic component held by the holding portion into contact with the substrate at the time of mounting. That is, the contact object includes both an object that the holding portion directly contacts and an object that is indirectly contacted via an object that the holding portion directly contacts. The movement destination for contact with such a contact object becomes the contact reference height position.
[ Prior Art literature ]
[ patent literature ]
Patent document 1 japanese patent laid-open publication No. 2010-206103
Disclosure of Invention
[ problem to be solved by the invention ]
However, in recognition of contact between the holding portion and the contact object based on a change in the relative position between the driving mechanism and the holding portion, there is a time from contact with the contact object until a predetermined amount of change in the relative position is reached, and therefore, a shift occurs between the time of contact with the contact object and the time of recognition (detection) of contact, and the contact reference height position cannot be accurately detected due to the shift. In addition, in the case of small electronic parts or electronic parts subjected to micromachining, soft rubber is often used at the tip of the holding portion so as not to apply stress to the electronic parts. Then, at the time of contact between the holding portion and the contact object, the relative position of the driving mechanism and the holding portion does not change, and after the soft rubber is deformed by pressing against the contact object, the relative position changes, and further, a detection delay of contact occurs, and the contact reference height position cannot be accurately detected.
An object of an embodiment of the present invention is to provide a contact position setting device, a mounting device, and a contact position setting method, in which a contact reference height position for a holding portion to contact a contact object can be set while suppressing a deviation from an actual contact height position.
[ means of solving the problems ]
In order to achieve the above object, a contact position setting device according to an embodiment includes: a holding part for sucking and holding the electronic component; a driving mechanism for moving the holding portion in a direction of contact and separation with a contact object; a contact detection unit that detects contact between the holding unit and the contact object; a pressure detection unit that detects a suction pressure of the holding unit; a position detection unit that detects a height position of the holding unit; a stop control unit that moves the holding unit to which the suction force is applied in a direction to contact the contact object, and stops movement of the holding unit when contact is detected by the contact detection unit; a detachment detection unit that moves the holding unit that detects contact and is stopped by the stop control unit in a direction of detachment from the contact object, and detects detachment of the holding unit from the contact object based on a change in suction pressure detected by the pressure detection unit at this time; and a reference position setting unit that sets a contact reference height position of the holding unit with respect to the contact object based on the height position of the holding unit detected by the position detecting unit when the detachment is detected by the detachment detecting unit.
The mounting device of the embodiment includes: the contact position setting device; a supply device for supplying the electronic component; a pick-up device that picks up the electronic parts from the supply device; a substrate stage for supporting a substrate; and a mounting device for mounting the picked-up electronic component on the substrate.
In the contact position setting method according to the embodiment, the holding portion to which the suction force is applied is moved in the direction in which the driving mechanism contacts the contact object; the driving mechanism stops the holding portion when the contact detecting portion detects the contact of the holding portion with the contact object; the driving mechanism moves the stopped holding portion in a direction away from the contact object; a pressure detection unit that detects detachment of the holding unit from the contact object based on a change in suction pressure of the holding unit; a position detecting unit that detects a height position of the holding unit when the pressure detecting unit detects the detachment; a reference position setting unit sets a contact reference height position of the holding unit with respect to the contact object based on the height position of the holding unit detected by the position detecting unit.
[ Effect of the invention ]
The embodiment of the invention can set the contact reference height position for the contact of the holding part and the contact object in a manner of restraining the deviation from the actual contact height position, and can mount electronic parts based on the setting.
Drawings
Fig. 1 is a front view showing an installation device according to an embodiment, and a block diagram showing a contact position setting device.
Fig. 2 is a plan view showing the mounting device of the embodiment.
Fig. 3 (a) and 3 (B) are side views showing a pickup unit constituting the contact position setting device of the embodiment.
Fig. 4 (a) to 4 (G) are explanatory views showing the operation of the pickup unit in setting the contact reference height position.
Fig. 5 is a flowchart showing a procedure for setting the contact reference height position.
Fig. 6 (a) to 6 (C) are explanatory views showing the operation of the holding portion in setting the push-up reference height position.
Fig. 7 is a flowchart showing a procedure for setting the push-up reference height position.
[ description of symbols ]
1: mounting device
2: electronic component
M: substrate board
10: feeding device
11: sheet material (sheet)
12: supply carrier
13: carrier moving mechanism
20: pick up device
22: moving mechanism
22a: sliding mechanism
22b: supporting frame
22c: rail track
22d: slider (slider)
23: turnover mechanism
24: push-up mechanism
24a: push-up pin
24b: support body
30: mounting device
31: joint head
31a: nozzle
32: head moving mechanism
40: transfer device
41: transfer table
50: substrate carrying table
51: carrier moving mechanism
60: control device
61: mechanism control part
62: stop control unit
63: separation detecting part
64: reference position setting unit
65: push-up reference position setting unit
66: storage unit
70: input device
80: display device
200: pick-up unit
210: pick-up tool
211: holding part
211a: suction hole
211b: mounting member
211c: piping arrangement
212: lifting rod
213: locking body
214: probe body
214a: support member
220: driving mechanism
221: stand for stand
221a: vertical plane
222: linear guide rail
223: driving body
223a: support part
224: screw shaft
225: driving source
226: bracket
226a: moving blocks
226b: arm portion
227: support frame
228: force application member
230: contact detection unit
240: pressure detecting section
250: position detecting unit
260: push-up position detecting unit
321: sliding mechanism
321a: supporting frame
321b: rail track
321c: sliding piece
322: lifting mechanism
B: push up datum height position
d: back-off amount
E: error of
g: gap of
Lo: detecting a position
Le: back-off position
Lr: contact reference height position
S: contact position setting device
S101 to S109, S201 to S207: step (a)
t1, t2: thickness of (L)
P1: supply position
P2: delivery location
P3: mounting position
X, Y, Z: axial direction
Detailed Description
An embodiment of the present invention (hereinafter, referred to as the present embodiment) will be specifically described with reference to the accompanying drawings. In addition, the drawings are schematic, and the sizes, ratios, and the like of the respective parts are exaggerated for easy understanding.
As shown in fig. 1 and 2, the contact position setting device S of the present embodiment is used for a mounting device 1 for electronic components 2. The mounting device 1 includes: the electronic component 2 is supplied to the apparatus 10, the pickup device 20, the mounting device 30, the transfer device 40, the substrate stage 50, and the control device 60. The mounting apparatus 1 turns over the electronic component 2 picked up by the pickup device 20 from the supply device 10, delivers it to the mounting apparatus 30, and mounts it onto the substrate M supported by the substrate stage 50. Alternatively, the electronic component 2 picked up by the pickup device 20 from the supply device 10 is transferred to the mounting device 30 via the transfer device 40, and mounted on the substrate M supported by the substrate stage 50. At this time, the contact position setting device S sets a height position as a reference by pickup, mounting, or transfer of the electronic component 2 via the transfer device 40, or the like.
[ electronic parts ]
The electronic component 2 is, for example, a rectangular thin-piece component. In the present embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. The semiconductor chip has a functional surface functioning as a semiconductor element on one of the front and back surfaces.
[ supply device ]
The supply device 10 is a device that supplies the electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 that is the pickup object. The supply device 10 includes: a supply stage 12 for supporting the sheet 11 to which the plurality of electronic components 2 are attached, and a stage moving mechanism 13 for moving the supply stage 12. As the stage moving mechanism 13, for example, a linear guide (linear guide) is used, which moves a slider (slider) on a rail (rail) by a ball screw (ball screw) mechanism driven by a servo motor (servo). The supply device 10 moves the electronic component 2, which is a pickup object, out of the plurality of electronic components 2 supported by the supply stage 12 by the intermediate spacer material 11 to the supply position P1 by the stage moving mechanism 13.
Here, the sheet 11 to which the electronic component 2 is attached is a wafer sheet having adhesiveness to which a wafer ring, not shown, is attached. A plurality of electronic components 2 obtained by singulating a wafer are arranged in a matrix (matrix) on the sheet 11. In the present embodiment, the electronic component 2 is arranged in a face up (face up) state in which the functional surface is exposed upward.
The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 to which the electronic parts 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage moving mechanism 13. The sheet 11 is horizontally supported by the stage moving mechanism 13 together with the supply stage 12, and therefore the sheet 11 and the electronic parts 2 mounted on the sheet 11 are also provided so as to be movable in the horizontal direction.
As shown in fig. 1, the direction in which the supply device 10 and the mounting device 30 are arranged is referred to as an X-axis direction, and the direction orthogonal to the X-axis is referred to as a Y-axis direction. The direction perpendicular to the plane of the sheet 11 is referred to as the Z-axis direction or the up-down direction. The upward direction refers to a direction on the side where the electronic component 2 is mounted with the plane of the sheet 11 as a boundary, and the downward direction refers to a direction on the side where the electronic component 2 is not mounted with the plane of the sheet 11 as a boundary.
In the present embodiment, a distance from a height position (origin height position) of an origin (reference point) which is a reference of a predetermined Z direction is referred to as "height". The height position of the distance is set as the height position. In the present embodiment, the Z direction is a vertical direction or a vertical direction. The "origin" in this case may be used in common for each device such as the pickup device 20 and the mounting device 30, or may be unique for each device. The "distance" at this time is, for example, a movement amount of the respective driving mechanism 220, the lifting mechanism 322, and the like in the respective devices such as the pickup device 20 and the mounting device 30 in the Z direction. Further, for ease of understanding, it is referred to as "height position", but "height position" is a distance from the origin. The "height position" is a distance in the direction in which the contact object moves, and is not necessarily limited to a distance in the vertical direction or the vertical direction.
[ pickup device ]
The pickup device 20 picks up the electronic component 2 from the supply device 10, and transfers the picked-up electronic component 2 to the mounting device 30. The pickup device 20 includes a pickup unit 200, a moving mechanism 22, a flipping mechanism 23, and a pushing-up mechanism 24.
[ pickup Unit ]
The pickup unit 200 is a mechanism that suctions and holds the electronic component 2, and releases the suction and hold to release the electronic component 2. The pickup unit 200 constitutes a mechanism portion of the contact position setting device S. The contact position setting device S is a device that sets the contact reference height position of the pickup unit 200 and the contact object. The contact position setting device S of the present embodiment includes the pickup unit 200 as a mechanism portion, and includes a stop control portion 62, a separation detection portion 63, a reference position setting portion 64, and a push-up reference position setting portion 65 of the control device 60, which will be described later, as control portions.
As described above, the semiconductor chip as the electronic component 2 is adhesively supported on the adhesive sheet 11 (wafer sheet). The semiconductor chip is pushed up from the opposite surface of the sheet 11 supported by a push-up mechanism 24 such as a push-up pin or a push-up body via the sheet 11, and the self-adhesive surface is released. At this time, the pick-up unit 200 holds the semiconductor chip and peels the semiconductor chip from the sheet 11 with the push-up operation. Thus, the semiconductor chips are picked up from the sheet 11.
The pickup unit 200 as a mechanism portion of the contact position setting device S will be described below. Fig. 3 (a) shows a schematic structure of the pickup unit 200. The pickup unit 200 includes a pickup tool 210, a driving mechanism 220, a contact detection unit 230, a pressure detection unit 240, and a position detection unit 250 (see fig. 1).
(picking tool)
The pick-up tool 210 includes a holding portion 211, a lifting lever 212, a locking body 213, and a probe 214. The holding portion 211 suctions and holds the electronic component 2. The holding portion 211 has a truncated cone shape with a diameter of a tip end thereof decreasing downward, and a suction hole 211a is provided in a tip end surface. As shown in fig. 3 (B), the upper portion of the holding portion 211 is detachably provided to the mounting member 211B. The mounting member 211b is a block-shaped member provided at the lower end of the lifting lever 212 described later. The suction hole 211a of the holding portion 211 communicates with a pipe 211c attached to a side surface of the attaching member 211b via a suction path in the attaching member 211b. The pipe 211c is connected to a negative pressure generating circuit (not shown) including a vacuum pump or the like through a pressure detecting unit 240 described later. Therefore, a suction force is generated in the suction hole 211a, and the electronic component 2 can be sucked and held on the front end surface of the holding portion 211. In order to reduce damage when the electronic component 2 is in contact with the electronic component, the holding portion 211 is formed of a material capable of elastic deformation. For example, the holding portion 211 is formed of rubber.
The lifting rod 212 is a rod-shaped member having a vertical axis, and the mounting member 211b is provided at the lower end thereof as described above. The locking body 213 is a plate-like body provided at the upper end of the lifting rod 212 so as to expand in diameter. The detector 214 is a horizontal plate-like body provided on the upper portion of the locking body 213, and protrudes in one direction away from the axis of the lifting lever 212.
(drive mechanism)
The driving mechanism 220 is a mechanism for moving the holding portion 211 in a direction of contact and separation with the contact object. The driving mechanism 220 includes a mount 221, a linear guide 222, a driving body 223, a screw shaft 224, a driving source 225, a bracket 226, a holder 227, and a biasing member 228.
The stand 221 is a plate-like body in the vertical direction. The linear guide 222 is provided on a vertical surface 221a of the stand 221 in the up-down direction. The driving body 223 movably engages the support portion 223a with the linear guide 222 and is supported. The screw shaft 224 is provided with an axis line perpendicular thereto, and is screwed to the driving body 223. The driving source 225 is provided on the mount 221, and is a motor for rotationally driving the screw shaft 224. The screw shaft 224 is rotated by the driving source 225, so that the driving body 223 is driven in the up-down direction along the linear guide rail 222.
One end of the bracket 226 is fixed to the driving body 223. The other end of the bracket 226 is attached to a bracket 227 of the tubular body. Details regarding the bracket 226 will be described later. The holder 227 is provided with a pickup tool 210 so as to be movable in the up-down direction. That is, the lifting rod 212 is supported in the holder 227 so as to be capable of being lifted and lowered, and the locking body 213 abuts against the upper end of the holder 227, thereby defining the downward movement end. The urging member 228 is provided between the lower end of the holder 227 and the upper end of the holding portion 211, and applies a load urging the pickup tool 210 in the downward direction.
(contact detection section)
The contact detection unit 230 detects contact between the holding unit 211 and the contact object. The "detection of contact" in the present embodiment means, for example, detection of the moment when the holding portion 211 changes from a state of not being in contact with the contact object to a state of being in contact with the contact object. It is not continuously detected whether the contacted state is maintained. In the following description, the expression "contacted" or "contacted" is the same.
The contact detection unit 230 detects contact between the holding unit 211 and the contact object based on the displacement amount of the relative height position between the holding unit 211 and the holder 227 of the drive mechanism 220. The contact detection unit 230 of the present embodiment is a displacement sensor that detects a distance from the probe 214 in a noncontact manner. In the present embodiment, an eddy current type displacement sensor is used. The contact detecting unit 230 is mounted on a side surface of the holder 227 via the support 214a so as to face the probe 214. When the holder 227 of the driving mechanism 220 is driven to descend, the pickup tool 210 descends, and the holding portion 211 comes into contact with the contact object. Then, the lowering of the pick-up tool 210 is stopped. As the carriage 227 continues to descend, the stopped picking tool 210 moves relative to the carriage 227. Thereby, the contact detecting unit 230 descends together with the holder 227 with respect to the probe 214 of the pick-up tool 210, and the gap g expands. Thus, when the gap g between the contact detection unit 230 and the probe 214 is larger than the predetermined threshold amount, the contact detection unit 230 detects this.
(pressure detection section)
The pressure detecting unit 240 (see fig. 1, 3 (a) and 3 (B)) detects the detachment of the holding unit 211 from the contact object based on the change in the suction pressure of the holding unit 211. The pressure detecting unit 240 is connected to the pipe 211c, and is a suction pressure sensor in which a diaphragm deforms according to pressure fluctuation in the pipe 211c, and changes in resistance of a detecting element provided thereon are converted into an electrical signal and output.
(position detection part)
The position detecting unit 250 (see fig. 1) detects the height position of the holding unit 211. The position detecting unit 250 is provided in the driving mechanism 220, and is an encoder for counting the rotation amount of the screw shaft 224 based on the driving source 225. Accordingly, the amount of movement of the driving body 223 that moves by the rotation of the screw shaft 224 is counted. That is, the movement amount of the pick-up tool 210 locked to the holder 227 is counted via the holder 226 and the holder 227 that move integrally with the drive body 223. Thereby, the position detecting unit 250 detects the height position of the holding unit 211 of the pick-up tool 210 based on the amount of movement from the origin serving as a predetermined reference.
However, the pickup tool 210 is biased by the biasing member 228 to be locked so as to be movable relative to the holder 227. When the holding portion 211 of the pick-up tool 210 moves and comes into contact with the contact object to stop the movement of the pick-up tool 210, only the holder 227 moves relatively to the pick-up tool 210. Therefore, although the holding portion 211 is stopped, the height position of the carriage 227 that continues to move is detected by the position detecting portion 250. The height position of the holder 227 is detected by the position detection unit 250 until the contact of the holding unit 211 with the contact object is recognized by the contact detection unit 230. As described above, the height position of the holding portion 211 detected by the position detecting portion 250 also includes the height position detected after the holding portion 211 comes into contact with the contact object until the stand 227 stops.
(push-up position detecting section)
The push-up position detecting unit 260 (see fig. 1) detects a push-up height position to which the electronic component 2 is moved by pushing up the electronic component 2 by a push-up mechanism 24 described later. The push-up position detecting unit 260 is an encoder provided in the driving mechanism of the push-up mechanism 24 and configured to count the amount of movement of the push-up pin 24a by the driving mechanism. The push-up position detecting unit 260 detects the height position of the push-up pin 24a based on the amount of movement from the origin serving as a predetermined reference.
[ moving mechanism ]
As shown in fig. 1 and 2, the moving mechanism 22 is a mechanism that reciprocates the pickup unit 200 having the holding portion 211 between the supply position P1 and the delivery position P2, and moves up and down between the supply position P1 and the delivery position P2. The delivery position P2 is a position where the pickup device 20 delivers the electronic component 2 picked up at the supply position P1 to a bonding head 31 functioning as a receiving section described later. The supply position P1 and the delivery position P2 mainly refer to positions in the XY direction, and not necessarily refer to positions in the Z axis direction.
The moving mechanism 22 includes a driving mechanism 220 of the pickup unit 200, and moves the holding portion 211 provided in the pickup unit 200 in the left-right direction by moving the driving mechanism 220. The driving mechanism 220 functions as a lifting mechanism that moves the holding portion 211 in the up-down direction. That is, as shown in fig. 1, the bracket 226 of the driving mechanism 220 has a moving block 226a and an arm 226b. The moving block 226a is fixed to the driving body 223. One end of the arm portion 226b is attached to the moving block 226a, and the other end of the arm portion 226b is attached to the holder 227 of the tubular body. Accordingly, the driving body 223 is driven in the up-down direction along the linear guide rail 222 by the driving source 225, and the holder 227 moves up and down, so that the holding portion 211 moves up and down.
In addition, the moving mechanism 22 includes a slide mechanism 22a. The slide mechanism 22a moves the driving mechanism 220 to reciprocate the holding portion 211 between the supply position P1 and the delivery position P2. Here, the slide mechanism 22a includes: a rail 22c extending parallel to the X-axis direction and fixed to the support frame 22b, and a slider (slider) 22d moving on the rail 22 c. Although not shown, the slider 22d is driven by a ball screw driven by a rotary motor, a linear motor, or the like. A drive mechanism 220 is provided on the slider 22d.
[ turnover mechanism ]
The turning mechanism 23 is connected to the arm 226b, and changes the orientation of the holding portion 211. The turning mechanism 23 is an actuator including a driving source such as a motor and a rotation guide such as a ball bearing. The holding portion 211 is oriented toward the suction hole 211a from the locking body 213 side of the pickup unit 200. The direction change means rotation of 0 ° to 180 ° in the up-down direction. For example, the electronic component 2 is sucked and held at the supply position P1 with the suction hole 211a facing the holding portion 211 of the supply stage 12. Then, the flipping mechanism 23 changes the orientation of the holding portion 211 so that the suction surface faces upward. At this time, the rotation angle is 180 °.
[ push-up mechanism ]
The push-up mechanism 24 is provided below the sheet 11 of the feeding device 10. The push-up mechanism 24 includes: a push-up pin 24a, a support (back up) 24b, and a driving mechanism for the push-up pin 24a, not shown. The push-up pin 24a is a needle-like member with a pointed tip (see fig. 6 a to 6C). The support body 24b is provided such that the longitudinal direction of the push-up pin 24a is parallel to the Z-axis direction. The driving mechanism is provided in the support body 24b, and causes the push-up pin 24a to enter from the inside thereof or retract into the inside thereof. The entry or the retreat is performed in the up-down direction. The driving mechanism includes, for example: a slider guided by the rails in the up-down direction and moved, and a cylinder or cam mechanism for driving the slider.
[ mounting device ]
The mounting device 30 is a device that conveys the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate M. The mounting position P3 is a position where the electronic component 2 is mounted to the substrate M. The mounting device 30 includes a joint head 31 and a head moving mechanism 32.
The bonding head 31 has a function of receiving the electronic component 2 from the holding portion 211 at the delivery position P2 as a receiving portion, and is a device for mounting the electronic component 2 to the substrate M at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the electronic component 2 after mounting by releasing the held state. The bonding head 31 also constitutes a mechanism portion of the contact position setting device S, like the pickup unit 200. The contact position setting means S sets a contact reference height position of the bonding head 31 and the contact object.
Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the electronic component 2 by releasing the holding state. The nozzle 31a includes a nozzle hole. The nozzle hole opens at the suction surface at the tip of the nozzle 31a. The nozzle hole communicates with a negative pressure generating circuit (not shown) including a vacuum pump or the like, and the electronic component 2 is sucked and held on the suction surface of the nozzle 31a by the negative pressure generated by the circuit. Then, by releasing the negative pressure, the holding state of the electronic component 2 is released from the suction surface.
Further, as described above, the bonding head 31 of the present embodiment has the same structure as the pick-up tool 210 of the pick-up unit 200. That is, the nozzle 31a corresponds to the holding portion 211 of the pickup tool 210, and has the same lifting lever, locking body, and detecting body as the lifting lever 212, locking body 213, and detecting body 214, although not shown. As a structure corresponding to the driving mechanism 220, a lifting mechanism 322 of the head moving mechanism 32 described later is provided. The position detecting unit 250 detects the height position of the nozzle 31a, as in the case of the holding unit 211.
The head moving mechanism 32 reciprocates the joint head 31 between the delivery position P2 and the attachment position P3, and moves up and down between the delivery position P2 and the attachment position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lifter 322.
The slide mechanism 321 reciprocates the joint head 31 between the delivery position P2 and the attachment position P3. Here, the slide mechanism 321 includes: two rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c moving on the rails 321 b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.
Further, although not shown, the slide mechanism 321 includes a slide mechanism that slides the joint head 31 in the Y-axis direction. The slide mechanism may be constituted by a rail in the Y-axis direction and a slider that moves on the rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like.
The lifting mechanism 322 is a mechanism for moving the nozzle 31a in a direction (up-down direction) of contact and separation with the contact object. Although not shown, the lifting mechanism 322 has the same configuration as the driving mechanism 220 of the pickup unit 200. That is, the elevating mechanism 322 includes a mount 221, a linear guide 222, a driving body 223, a screw shaft 224, a driving source 225, a bracket 226, a holder 227, and a biasing member 228, which are similar to those of the driving mechanism 220. Thereby, the nozzle 31a can be lifted and lowered by the screw shaft rotated by the driving source. The lifting mechanism 322 is not provided with an arm or a tilting mechanism for tilting the nozzle 31a, and the nozzle 31a is attached to the screw shaft via a bracket or a bracket. The mounting device 30 includes a contact detection unit, a pressure detection unit, and a position detection unit similar to the contact detection unit 230, the pressure detection unit 240, and the position detection unit 250. With the above-described configuration of the mounting device 30, as shown in a modification example described later, the mounting device 30 can be caused to function as the contact position setting device S.
The mounting device 30 further includes an imaging device, an image processing device, and a position recognition device, which are not shown. The electronic component 2 held by the bonding head 31 and the substrate M supported by the substrate stage 50 are photographed by the photographing device, and the positional relationship between the two is recognized by the position recognition device based on the image processed by the image processing device. Based on the positional relationship, the mounting device 30 mounts the electronic component 2 to the substrate M. The imaging device may be an up-down dual-field camera which is interposed between the electronic component 2 and the substrate M and can simultaneously image both, or may be a camera which separately images both.
[ transfer device ]
The transfer device 40 is a device for placing the electronic component 2 in a period before the electronic component 2 is transferred from the pickup device 20 to the mounting device 30. The mounting device 1 of the present embodiment can selectively perform the following functions: a function of inverting the picked-up electronic component 2 and conveying (mounting) it to the substrate M using the inverting mechanism 23 in the middle of transfer; the transfer device 40 is used to convey (mount) the picked-up electronic component 2 to the substrate M in its original posture. That is, the mounting device 1 can use both of face-up bonding and face-down bonding.
The transfer device 40 includes a transfer table 41, and the transfer table 41 is used for placing the electronic component 2 on the holding portion 211 and for receiving the electronic component 2 by the bonding head 31. That is, the transfer table 41 is a stage having a function as a receiving section for receiving the electronic component 2 from the holding section 211 at the delivery position P2. The transfer table 41 includes nozzle holes (not shown) for holding the electronic components 2 and releasing the electronic components 2 while releasing the holding state. The nozzle hole opens on the mounting surface of the transfer table 41. The nozzle hole communicates with a negative pressure generating circuit (not shown) including a vacuum pump or the like, and the electronic component 2 is sucked and held by the negative pressure generated by the circuit. Further, by releasing the negative pressure, the self-transfer stage 41 releases the holding state of the electronic component 2. The transfer table 41 includes a moving stage, and is retracted from the delivery position P2 without interference when the electronic component 2 picked up by the pickup device 20 is turned over and delivered to the bonding head 31. However, in the case where interference does not occur even when the electronic component 2 is turned over, the transfer table 41 may be fixed without providing a moving stage.
[ substrate stage ]
The substrate stage 50 is a stage for supporting a substrate M for mounting the electronic component 2. The substrate stage 50 is provided in the stage moving mechanism 51. The stage moving mechanism 51 is a moving mechanism that moves the substrate stage 50 in a sliding manner on the XY plane and positions the mounting position P3 of the electronic component 2 on the substrate M. The stage moving mechanism 51 may use, for example, a linear guide that moves a slider on a rail by a ball screw mechanism driven by a servo motor.
[ control device ]
The control device 60 controls the start, stop, speed, operation timing, and the like of the supply device 10, the pickup device 20, the mounting device 30, the transfer device 40, and the substrate stage 50. In order to realize various functions of the mounting apparatus 1, the control apparatus 60 includes a processor that executes a program, a memory that stores various information such as a program and operation conditions, a driving circuit that drives each component, and the like. As shown in fig. 1, the control device 60 is connected with an input device 70 for an operator to input instructions or information necessary for control, and a display device 80 for confirming the state of the device. The input device 70 may use a switch, a touch screen, a keyboard, a mouse, etc. The display device 80 may use liquid crystal, organic Electroluminescence (EL), or the like.
The control device 60 of the present embodiment includes a mechanism control unit 61, a stop control unit 62, a separation detection unit 63, a reference position setting unit 64, a push-up reference position setting unit 65, and a storage unit 66. The mechanism control unit 61 controls the mechanisms of the respective units of the supply apparatus 10, the pickup apparatus 20, the mounting apparatus 30, the transfer apparatus 40, and the substrate stage 50. For example, in the present embodiment, when setting a contact reference height position described later, the stop control unit 62 and the separation detection unit 63 control the operation of the drive mechanism 220 of the pickup unit 200 via the mechanism control unit 61. When the push-up reference height position described later is set, the stop control unit 62 controls the operation of the push-up mechanism 24 via the mechanism control unit 61. In addition, when the push-up reference height position is set, the stop control unit 62 and the disengagement detection unit 63 also control the operation of the driving mechanism 220 via the mechanism control unit 61, so that a detection error described later is obtained by the same operation as when the contact reference height position is set.
In the stop control unit 62, when the mechanism control unit 61 moves the holding unit 211 in a state where the suction force is applied in a direction to contact the contact object and the contact detection unit 230 detects contact between the holding unit 211 and the contact object, the movement of the holding unit 211 is stopped. In the stop control unit 62, when the mechanism control unit 61 moves the push-up pin 24a of the push-up mechanism 24 in the push-up direction and the contact detection unit 230 detects contact between the holding unit 211 and the contact object, the movement of the push-up pin 24a is stopped. The detachment detection unit 63 moves the holding unit 211 stopped by the stop control unit 62 in a direction of detachment from the contact object, and detects detachment of the holding unit 211 from the contact object based on a change in suction pressure detected by the pressure detection unit 240 at this time. That is, the detachment is detected from a change in suction pressure when the holding portion 211 is detached from the contact object.
The reference position setting unit 64 sets the contact reference height position of the holding unit 211 with respect to the contact object based on the height position of the holding unit 211 detected by the position detecting unit 250 when the detachment detecting unit 63 detects detachment. That is, the contact reference height position is set by taking the height position at which the holding portion 211 is separated from the contact object as the height position at which the holding portion 211 contacts the contact object.
The push-up reference position setting unit 65 sets a push-up reference height position. The push-up reference height position is an initial position (standby position) of the push-up pin 24a when the electronic part 2 is picked up from the sheet 11. The push-up reference height position is a height position of the lower surface of the sheet 11, and is a height position of the upper surface of the support body 24 b. In order to set the push-up reference height position, the push-up reference position setting unit 65 calculates an error between the contact reference height position and the height position (detection position) at which the contact detection unit 230 detects contact, and calculates the height position of the retracted position of the holding unit 211 based on the contact reference height position and the error. The retreat position is a position higher than the surface of the electronic component 2 by a predetermined retreat amount. The details of the process of setting the push-up reference height position will be described later.
The storage unit 66 is a storage device including various memories (Hard Disk Drive (HDD) or solid state Drive (Solid State Drive, SSD)) as a recording medium, and an interface between the recording medium and the outside. The storage unit 66 stores data and programs necessary for the operation of the mounting device 1. The required data includes, for example, various thresholds, contact reference height positions, push-up reference height positions, and the like. The data output from each device is also stored in the storage unit 66 as appropriate. In the following description, the data to be output from each device is also acquired and stored in the storage unit 66.
Action
The following describes operations of picking up the electronic component 2 from the supply device 10 by the pick-up device 20 and transferring the electronic component 2 to the mounting device 30 in the mounting device 1 described above with reference to fig. 1 to 3 (a) and 3 (B) and fig. 4 (a) to 4 (G) to 7. In the following description, the state in which the contact detection unit 230 detects contact with the electronic component 2 is set to ON (connection), and the state in which contact is not detected is set to OFF (disconnection). The detection of the contact is determined based on the displacement amount of the relative height position of the holding portion 211 and the holder 227 of the driving mechanism 220. That is, the determination is made by whether or not the gap g detected by the displacement sensor exceeds a predetermined threshold. For example, as will be described later, after the holding portion 211 contacts the electronic component 2, the gap g is enlarged. The determination is made by whether or not the gap g is increased by a predetermined distance (predetermined threshold) from the distance (initial distance) between the contact detecting unit 230 and the probe 214 when the locking body 213 contacts the holder 227. That is, the contact detection unit 230 outputs OFF when the predetermined distance is not exceeded, and the contact detection unit 230 outputs ON when the predetermined distance is exceeded after the predetermined distance is exceeded.
The state in which the pressure detected by the pressure detecting unit 240 is within the predetermined threshold due to the contact between the holding unit 211 and the electronic component 2 is set to ON, and the state in which the pressure is separated from the electronic component 2 and exceeds the predetermined threshold is set to OFF. For example, although negative pressure is applied to the inside of the pipe 211c by suction, the pressure in the pipe 211c is not so low by suction from the suction hole 211a before the holding portion 211 contacts the electronic component 2. After the holding portion 211 contacts the electronic component 2, the suction from the suction hole 211a is blocked, and thus the pressure in the pipe 211c becomes low. The pressure detection unit 240 outputs ON when the pressure is within a predetermined pressure range (predetermined threshold), that is, when the pressure is lower than the predetermined pressure, and the pressure detection unit 240 outputs OFF when the pressure is outside the predetermined pressure range, that is, when the pressure is higher than the predetermined pressure.
[ setting of contact height position ]
(setting of contact reference height position)
First, the setting of the contact reference height position, which is the destination toward which the holding portion 211 moves for contact with the electronic component 2 to be contacted, will be described with reference to the explanatory diagrams of fig. 4 (a) to 4 (G) and the flowchart of fig. 5. That is, as shown in fig. 4 a, suction of the holding portion 211 is started, and the driving mechanism 220 lowers the pick-up tool 210, so that the holding portion 211 is moved in a direction to come into contact with the electronic component 2 (step S101). At this time, the holding portion 211 is biased by the biasing member 228 against the holder 227, and the locking body 213 contacts the upper end of the holder 227. Thus, the gap g between the probe 214 and the contact detection unit 230 becomes an initial interval.
As shown in fig. 4B, the holding portion 211 is in contact with the surface of the electronic component 2 (step S102). At this time, the contact detection unit 230 cannot detect contact yet. That is, since the gap g does not change, the contact detection portion 230 remains OFF. The tip of the holding portion 211 is in contact with the electronic component 2, but the suction hole 211a is not sufficiently blocked, and air leaks from the gap. Accordingly, the pressure in the pipe 211c detected by the pressure detecting unit 240 starts to gradually decrease, but the pressure detecting unit 240 remains OFF.
As shown in fig. 4C, the holding portion 211 in contact with the electronic component 2 is further lowered, and the distal end starts to collapse (step S103). Then, the leakage of air from the tip of the holding portion 211 that is in contact gradually disappears, and the pressure in the pipe 211c detected by the pressure detecting portion 240 decreases. When the pressure in the pipe 211c is within the threshold value, the pressure detecting unit 240 turns ON. On the other hand, as the holding portion 211 collapses, the urging member 228 is compressed, and the gap g expands. However, since the holding portion 211 is crushed and the amount of displacement detected by the contact detecting portion 230 is small and does not exceed the threshold value, the contact detecting portion 230 is kept OFF.
As shown in fig. 4D, the holding portion 211 is further lowered, the tip of the holding portion 211 is completely crushed, and the urging member 228 is further compressed (step S104). As a result, the gap g further expands, and therefore the displacement amount detected by the contact detection unit 230 exceeds the threshold value, and the contact detection unit 230 turns ON. At this time, the contact detection section 230 recognizes (detects) that the holding section 211 is in contact with the electronic component 2. By such detection of the contact by the contact detecting unit 230, the stop control unit 62 stops the holding unit 211 by the driving mechanism 220 (step S105).
In addition, which of the contact detecting portion 230 and the pressure detecting portion 240 is turned ON first differs depending ON the state of the tip of the holding portion 211, the elastic coefficient, the suction pressure, the falling speed, the elastic coefficient of the urging member 228, the respective threshold values, and the like. In the present embodiment, the pressure detecting unit 240 is set to be ON first. Further, since there is a fluctuation or noise of the signals of the contact detection unit 230 and the pressure detection unit 240, if the threshold value is set strictly, there is a possibility of erroneous detection, and therefore, it is preferable to set the threshold value with a certain margin.
Next, as shown in fig. 4E, the detachment detection section 63 moves the holding section 211 in a direction of detachment from the electronic component 2 by the driving mechanism 220 (step S106). Then, the contraction of the urging member 228 is prolonged, and the contact detection unit 230 is turned OFF when the gap g is within the threshold value. However, in this case, since the holding portion 211 remains crushed, the suction hole 211a at the tip of the holding portion 211 is blocked, and the pressure in the pipe 211c detected by the pressure detecting portion 240 is within the threshold value, and the pressure detecting portion 240 remains ON.
As shown in fig. 4 (F), the holding portion 211 further rises, and the holding portion 211 is completely flattened (step S107). At this time, since the suction hole 211a at the tip of the holding portion 211 is still blocked, the pressure in the pipe 211c detected by the pressure detecting portion 240 is within the threshold value, and the pressure detecting portion 240 is kept ON.
As shown in fig. 4G, the holding portion 211 is further raised, and the holding portion 211 is separated from the electronic component 2 (step S108). Accordingly, the suction hole 211a at the tip of the instant holding portion 211 is opened, and the pressure in the pipe 211c detected by the pressure detecting portion 240 at this time rapidly rises to exceed the threshold value, so that the pressure detecting portion 240 turns OFF. In fig. 4 (G), for easy understanding, a gap is generated between the tip of the holding portion 211 and the electronic component 2, but in reality, the pressure detecting portion 240 is turned OFF at the moment when the tip of the holding portion 211 is separated from the electronic component 2, and therefore, the height position is substantially the same as the moment when the tip of the holding portion 211 is in contact with the electronic component 2.
The reference position setting unit 64 sets the height position of the holding unit 211 detected by the position detecting unit 250 at the time when the pressure detecting unit 240 turns OFF as the contact reference height position (step S109).
(setting of push-up reference height position)
Next, the setting of the push-up reference height position will be described with reference to the explanatory diagrams of fig. 6 (a) to 6 (C) and the flowchart of fig. 7. In fig. 6 (a) to 6 (C), B is the push-up reference height position. The B is the upper surface of the support 24B. Lr is the contact reference height position of the holding portion 211 set by the reference position setting portion 64 as described above. Lo is a detection position detected as the elevation of the push-up pin 24 a. Le is the retracted position of the holding portion 211 separated from the contact reference height position Lr by a predetermined distance, that is, by the retracted amount d. That is, the retracted position Le is a height position of the holding portion 211 determined by a predetermined retraction amount d with respect to the contact reference height position Lr.
As described later, when picking up the electronic component 2, the electronic component 2 is held by the holding portion 211 and the push-up pins 24a, and the holding portion 211 and the push-up pins 24a move synchronously to peel the electronic component 2 from the sheet 11. Therefore, the tip of the push-up pin 24a needs to be set to a predetermined reference height position. The standby height position is the push-up reference height position B, and is the upper surface of the support body 24B as described above.
The push-up pin 24a is pressed against the holding portion 211 via the electronic component 2 with respect to the height position of the push-up pin 24a, the contact due to the pressing is detected by the contact detecting portion 230, and the height position at the time of detecting the contact is obtained by the push-up position detecting portion 260.
Accordingly, the push-up reference height position B is set based on the height position of the push-up pin 24a at the time of detecting the contact by pushing up the electronic component 2 via the push-up pin 24a of the push-up mechanism 24 controlled by the mechanism control unit 61 so as to be in contact with the holding unit 211 located at the preset height position at the supply position P1. That is, the push-up reference position setting unit 65 sets the push-up reference height position B at which the push-up mechanism 24 is to push up, based on the push-up height position detected by the push-up position detecting unit 260 when the contact detecting unit 230 detects that the electronic component 2 moved by the push-up mechanism 24 is in contact with the holding unit 211.
In addition, in the detection of the contact detection unit 230 having made contact with the holding unit 211, the self-holding unit 211 starts to actually contact with the contact object, and a delay occurs until the contact detection unit 230 detects the contact. As will be described later, the delay is a time from actual contact to the holding portion 211 being crushed or exceeding a threshold value for detection, during which the holder 227 moves. The movement amount thereof becomes a detection error with respect to the height position where the holding portion 211 is in contact with the contact object. Therefore, the height position of the push-up pin 24a obtained based on the detection by the contact detection unit 230 also includes the detection error.
Therefore, in order to set the push-up reference height position more accurately, it is preferable to set the push-up reference height position in consideration of a detection error with respect to the height position of the push-up pin 24a obtained based on the detection by the contact detection unit 230. That is, the push-up reference position setting unit 65 sets the push-up reference height position based on the difference between the push-up height position detected by the push-up position detecting unit 260, the height position of the holding portion 211 in contact with the electronic component 2 detected by the contact detecting unit 230, and the height position of the holding portion 211 when the detachment detecting unit 63 detects detachment of the holding portion 211 from the electronic component 2.
First, by the same operation as the operation for obtaining the contact reference height position (see fig. 4 a to 4G), an error E between the height position (contact reference height position) at which the holding portion 211 is in contact with the electronic component 2 and the height position (detection position) at which the contact reference height position is detected by the contact detection portion 230 is obtained (step S201). That is, the holding portion 211 is lowered toward the electronic component 2 located at the supply position P1, the contact detecting portion 230 is turned ON, and the height position of the holding portion 211 at which the lowering is stopped is obtained. At this time, the amount of lowering of the holder 227 until the holding portion 211 is pressed by the detection error E or the height exceeds the threshold value is included until the contact detection portion 230 is turned ON by the contact of the holding portion 211 with the electronic component 2.
Next, the detachment detecting unit 63 lifts the holding unit 211 to obtain the height position of the holding unit 211 when the holding unit is detached from the electronic component 2. The height position at which the holding portion 211 is separated is the height position at the moment when the holding portion 211 is separated from the electronic component 2 as the contact object, and therefore is also the height position at the moment when the holding portion 211 is in contact with the contact object. That is, the height position at which the holding portion 211 is disengaged is the height position at which the holding portion 211 is in contact with the electronic component 2. The reference position setting unit 64 sets the height position at which the holding unit 211 is disengaged as the contact reference height position Lr.
Then, the push-up reference position setting unit 65 subtracts the height position at the time of contact detection from the height position at the time of disengagement of the holding unit 211, and calculates an error E (contact error) of contact detection.
However, in the setting operation of the contact reference height position, the difference between the height position of the holding portion 211 when the contact detection portion 230 is turned ON in step S105 and the height position of the holding portion 211 when the pressure detection portion 240 is turned OFF in step S109 also becomes the error E of the contact detection. Therefore, the error E may be used as the error E used for setting the push-up reference height position B. In this case, if the height position of the holding portion 211 at the time of stopping the descent is obtained in step S105 in advance, it is not necessary to perform the operation of step S201 for calculating the error again. In another aspect, in the process of obtaining the error E used in setting the push-up reference height position B, the height position at which the holding portion 211 is disengaged is obtained. If the height position at which the holding portion 211 thus obtained is disengaged is set as the contact reference height position, the operation of step S109 for setting the contact reference height position need not be performed separately.
In this way, the contact reference height position Lr and the error E are obtained. Then, the push-up reference position setting unit 65 calculates the height position of the retreat position Le, which is a position higher than the surface of the electronic component 2 by the predetermined retreat amount d.
Next, as shown in fig. 6 a, the holding unit 211 is moved to the retracted position Le (step S202). In setting the push-up reference height position B, the holding portion 211 is moved to the retreat position Le spaced from the contact reference height position Lr, instead of being moved to the contact reference height position Lr, for the following reasons. That is, when the holding portion 211 is moved to the contact reference height position Lr, the contact detecting portion 230 as a displacement sensor may be turned ON by contact with the electronic component 2. However, when the holding unit 211 is retracted to the height position spaced apart from the electronic component 2, the contact detecting unit 230 can be made to stand by in the OFF state, and when the electronic component 2 is pushed up, the contact detecting unit 230 is switched from OFF to ON, so that the timing can be reliably detected.
Then, the push-up pin 24a of the push-up mechanism 24 is started to move upward from the origin position (step S203). Then, as shown in fig. 6B, the electronic component 2 pushed up by the push-up pin 24a via the sheet 11 is lifted up and brought into contact with the holding portion 211 (step S204). At the time of such contact, as described above, the gap g has not changed yet, and thus the contact detecting section 230 remains OFF.
Further, as shown in fig. 6 (C), when the push-up pin 24a is lifted, the holding portion 211 is flattened, and the urging member 228 is compressed, whereby the gap g is enlarged, and when the amount of displacement detected by the contact detection portion 230 exceeds the threshold value, the contact detection portion 230 becomes ON (step S205). When the contact detecting unit 230 is turned ON, that is, after the contact detecting unit 230 detects the contact of the chip, the stop control unit 62 stops the raising of the push-up pin 24a by the push-up mechanism 24 (step S206). The push-up position detecting unit 260 obtains the height position of the thus stopped push-up pin 24a from the origin position as the push-up height position by the driving mechanism of the push-up mechanism 24. The height position of the push-up pin 24a at this time is the detection position Lo. That is, the detection position Lo is obtained by the driving mechanism of the push-up mechanism 24. The height position at which the push-up pin 24a stops is a distance from the origin position at which the push-up pin 24a starts to rise, and is also a moving amount.
The push-up reference position setting unit 65 calculates and sets the push-up reference height position B in consideration of the difference (error E) between the detection position Lo and the retreat position Le (the position actually in contact) (step S207). The holding portion 211 is located at a retreat position Le higher than the contact reference height position Lr, which is the height of the electronic component 2, by a retreat amount d. Therefore, the contact height position in step S204 is the height at which the electronic component 2 pushed up from the contact reference height position Lr by the push-up pin 24a is in contact with the holding portion 211 of the retreat position Le. That is, the retracted position Le is a height position where it is actually in contact. The error E is a difference between the height position of the push-up pin 24a when the contact detection unit 230 detects contact and the height position of the electronic component 2 pushed up by the push-up pin 24a and the holding unit 211, and thus becomes a difference between the detection position Lo and the retracted position Le. This is equal to the distance (Lo-Le) between Lo and Le shown in FIGS. 6 (A) to 6 (C). I.e. error e=distance (Lo-Le).
Therefore, the height position obtained by subtracting the error E from the detection position Lo becomes the retracted position Le. The height position obtained by subtracting the retreat amount d from the retreat position Le becomes the contact reference height position Lr, that is, the height position of the surface of the electronic component 2. The height position obtained by subtracting the thickness t1 of the electronic component 2 and the thickness t2 of the sheet 11 from the contact reference height position Lr becomes the height position of the upper surface of the support 24B, and becomes the push-up reference height position B.
In other words, the height obtained by subtracting the error E and the retreat amount d from the detection position Lo is the contact reference height position Lr (the surface height of the electronic component 2). The height position at which the thickness t1 of the electronic component 2 and the thickness t2 of the sheet 11 are lowered from the height of the contact reference height position Lr is referred to as a push-up reference height position B. That is, the push-up reference height position B can be obtained by the following equation.
Push-up reference height position b=lo-E-d-t 1-t2
Further, the amount of the push-up pin 24a sinking into the sheet 11, and the like may also be included in the error E. The push-up reference position setting unit 65 sets the push-up reference height position B thus obtained as an initial position (standby position) of the push-up pin 24a when the electronic component 2 is picked up from the sheet 11.
[ mounting action of electronic parts ]
Next, a description will be given of a procedure of mounting the electronic component 2 on the substrate M in the mounting apparatus 1 in which the contact reference height position Lr and the push-up reference height position B are set as described above. Here, a description will be given of a procedure of mounting the electronic component 2 to the substrate M in a face-down state.
First, the holding portion 211 is moved by the pickup device 20 to the supply position P1 where the push-up pin 24a is located, and the tip of the holding portion 211 is opposed to the push-up pin 24 a. On the other hand, the supply device 10 moves the supply stage 12 to position the electronic component 2 to be picked up at the supply position P1. Then, the holding portion 211 is lowered together with the holder 227 of the driving mechanism 220 to approach the electronic component 2. At this time, the push-up pin 24a is lifted from the origin position and stands by at the push-up reference height position B.
The holding portion 211 is lowered to the contact reference height position Lr and stopped. At this time, the holding portion 211 is in contact with the electronic component 2. In a state where the holding portion 211 is stopped, suction from the suction hole 211a is started. By the suction, the electronic component 2 is held by the holding portion 211. In this state, the holding portion 211 is raised in synchronization with the raising of the push-up pin 24a, and is stopped when the raising is performed by a predetermined amount. Then, the electronic component 2 sucked by the further raised holding portion 211 is peeled off from the sheet 11 and picked up.
The pickup device 20 turns the holding portion 211 by the turning mechanism 23. The pick-up device 20 moves the picked-up electronic parts 2 to the joint position P2 by the moving mechanism 22. In the transfer position P2, the bonding head 31 of the mounting device 30 stands by to face the electronic component 2 held by the inverted holding portion 211.
The bonding head 31 is lowered toward the holding portion 211 located at the transfer position P2, and after the electronic component 2 is held by the bonding head 31, the holding portion 211 releases the negative pressure, thereby transferring the electronic component 2 to the bonding head 31. Then, the bonding head 31 is lifted up to be away from the holding portion 211 and moved to the mounting position P3, thereby mounting the electronic component 2 to the substrate M.
[ Effect ]
(1) The contact position setting device S of the present embodiment includes: a holding portion 211 for suction-holding the electronic component 2; a driving mechanism 220 for moving the holding portion 211 in a direction of contact and separation with a contact object; a contact detection unit 230 that detects contact between the holding unit 211 to which a suction force is applied and a contact object; a pressure detection unit 240 that detects the suction pressure of the holding unit 211; a position detecting unit 250 for detecting the height position of the holding unit 211; the stop control unit 62 stops the movement of the holding unit 211 when the holding unit 211 to which the suction force is applied is moved in the direction of contact with the contact object and the contact detection unit 230 detects contact; a detachment detection unit 63 that moves the holding unit 211, which detects contact and is stopped by the stop control unit 62, in a direction of detachment from the contact object, and detects detachment of the holding unit 211 from the contact object based on a change in suction pressure detected by the pressure detection unit 240 at this time; and a reference position setting unit 64 for setting a reference height position of the holding unit 211 with respect to the contact object, based on the height position of the holding unit 211 detected by the position detecting unit 250 when the detachment is detected by the detachment detecting unit 63.
In the contact position setting method of the present embodiment, the driving mechanism 220 moves the holding portion 211 to which the suction force is applied in the direction of contact with the contact object, and when the contact detection portion 230 detects contact between the holding portion 211 and the electronic component 2, the driving mechanism 220 stops the holding portion 211. The driving mechanism 220 moves the stopped holding portion 211 in a direction of separating from the contact object, and the pressure detecting portion 240 detects separation of the holding portion 211 from the contact object based on a change in suction pressure of the holding portion 211. The position detecting unit 250 detects the height position of the holding unit 211 at the time of detachment detected by the pressure detecting unit 240, and the reference position setting unit 64 sets the contact reference height position of the holding unit 211 with respect to the contact object based on the height position of the holding unit 211 detected by the position detecting unit 250.
If the amount of lowering (movement amount) for bringing the holding portion 211 into contact with the electronic component 2 is insufficient, the holding portion 211 cannot be brought into contact with the electronic component 2, and thus the electronic component 2 cannot be held, and a pickup error may occur. If the amount of lowering (movement) is too large, the holding portion is excessively pressed against the electronic component 2, which may cause damage to the electronic component 2 and generate cracks or defects. The pickup error includes not only the inability to hold the electronic component 2 but also the case where the held electronic component 2 is inclined in posture or greatly deviated from the holding center. Such a defective posture in holding is likely to occur also in small electronic parts 2 of about several mm square.
The lowering amount is a movement amount of the holding portion 211 from a height position (origin height position) as a reference of the lowering thereof to the contact with the electronic component 2, and the insufficient lowering amount means that the height position of the holding portion 211 when lowered for contact and holding with the electronic component 2 is high and the holding portion is not in contact with the electronic component 2. The excessively large lowering amount means that the height position of the holding portion 211 when lowered to contact and hold the electronic component 2 is low, and the holding portion is in a state of being excessively pressed against the electronic component 2. Therefore, if the height position of the holding portion 211 in contact with the electronic component 2 is shifted, a pick-up error, damage to the electronic component 2, or the like may be caused. Therefore, the movement position determining the movement amount of the holding portion 211 needs to be accurately set to an optimal value.
The actual height position is detected by a sensor as a reference position (height position) for determining the movement position of the holding portion 211. The detection is performed by the detection value exceeding a predetermined prescribed threshold. Therefore, the actual height position is shifted from the detected height position according to the time period from when the detected value exceeds the threshold value.
According to the contact position setting device S and the contact position setting method of the present embodiment, the moving position of the holding portion 211 can be accurately set to an optimal value. That is, since the height position of the surface of the substrate M can be accurately recognized by the "detachment" of the holding portion 211 from the contact object, the contact reference height position for the holding portion 211 to be in contact with the contact object can be set while suppressing the deviation from the actual contact height position, and the pickup error, damage, or poor posture of the contact object can be reduced.
In the present embodiment, the holding portion 211 is provided so as to be movable relative to the driving mechanism 220. Thereby, the holding portion 211 can be displaced to absorb the impact when the holding portion 211 is in contact with the contact object.
The contact detection unit 230 detects contact between the holding unit 211 and the contact object based on the displacement amount of the relative height position of the holding unit 211 and the holder 227 of the driving mechanism 220, which are provided so as to be able to move relative to each other. Specifically, after the holding portion 211 is actually brought into contact with the contact object, when a displacement amount (threshold value) of a predetermined relative height position is reached, the contact detecting portion 230 detects the contact. Therefore, a time period from when the displacement amount exceeds the threshold value is generated. The time is a delay from when the holding portion 211 is actually in contact with the contact object until the contact detection portion 230 detects the contact. Due to the delay, an actual height position is offset (error) from the detected height position.
As a result, even when an error occurs between the actual contact height position and the contact detected height position, the contact reference height position having a small error from the actual contact height position can be set based on the height position obtained by the pressure change when the holding portion 211 is separated from the contact object. That is, the difference between the height position when the holding unit 211 is separated from the contact object and the height position when the contact detection unit 230 detects contact is an error, and the height amount of the error can be reflected to a necessary height position. Thus, the contact reference height position having a small error from the actual contact height position can be set. Further, in the case where the delay until the contact detection unit 230 detects contact further includes a delay due to elastic deformation of the holding unit 211, the error further increases, but even in such a case, the present embodiment can set the contact reference height position at a position (height position) where the holding unit 211 contacts the contact object accurately.
Therefore, the reference position (the destination position to be reached, in this case, the height position at which the holding portion 211 contacts the contact object) at which the holding portion 211 moves for contact with the contact object can be set so as to reduce the deviation from the actual contact height position, and the holding portion 211 can be brought into contact without damaging the contact object.
However, in order to eliminate the delay in contact detection, particularly, delay due to detection of relative displacement, the holding portion 211 to which suction pressure (negative pressure) is applied is brought into contact with the contact object, and the suction hole 211a is blocked by contact of the holding portion 211 with the contact object irrespective of a change in displacement of the displacement sensor or the like, whereby suction pressure changes. The contact is considered to be detected by the change. However, even in this case, it takes time to suck the gas remaining in the suction path, and since the change in suction pressure or flow rate is slow, it is difficult to catch the change, and the response delay becomes large. In particular, in the case where there is leakage of suction at the contact portion of the holding portion 211 and the contact object, it is more difficult to catch the change. Even when the holding portion 211 is made of rubber, the rubber surface has irregularities, and leakage occurs at the initial stage of contact. The inventors focused on the following: when the suction pressure is released from the contact object, a rapid pressure change or flow rate change occurs, instead of the usual method of detecting contact between the holding portion 211 and the contact object when the suction pressure is released from the contact object. That is, since the change is remarkable, the detection is easy, and since the change time with respect to the threshold value is short, the detection delay is also small. As described above, in the present embodiment, the contact is detected based on the change in suction pressure (the pressure increase or the increase in suction flow rate) when the holding portion 211 is separated from the contact object, instead of using the change in suction pressure when the holding portion 211 is in contact with the contact object. That is, by using the pressure change at the time of detachment instead of the pressure change at the time of contact of the holding portion 211 with the contact object, the detection delay can be reduced.
(2) The contact position setting device S of the present embodiment includes: a push-up mechanism 24 for moving the electronic component 2 toward the holding portion 211; a push-up position detecting unit 260 for detecting a push-up height position reached by the electronic component 2 moved by the electronic component 2 pushed up by the push-up mechanism 24; and a push-up reference position setting unit 65 that sets a push-up reference height position to be pushed up by the push-up mechanism 24 based on the push-up height position detected by the push-up position detecting unit 260 when the contact detecting unit 230 detects that the electronic component 2 moved by the push-up mechanism 24 is in contact with the holding unit 211.
The push-up reference position setting unit 65 sets a push-up reference height position at which the push-up mechanism 24 is to push up, based on a difference between the push-up height position detected by the push-up position detecting unit 260, the height position of the holding unit 211 in contact with the electronic component 2 detected by the contact detecting unit 230, and the height position of the holding unit 211 when the separation detecting unit 63 detects that the holding unit 211 is separated from the contact object.
Therefore, the electronic parts 2 pushed up by the push-up mechanism 24 can be picked up without causing damage. In addition, the occurrence of holding errors, dropping, defective mounting positions, and the like of the electronic component 2 can be suppressed. If the height position of the holding portion 211 for picking up the electronic component 2 is not correct from the push-up reference height position, the position of the holding portion 211 for stopping and the contact height position with respect to the electronic component 2 may be greatly deviated, and the electronic component 2 may be damaged. For example, when the push-up height of the push-up pin 24a is excessively large, cracks due to the posture change of the electronic component 2 or the shape change of the sheet 11 interfere with each other to generate chips in the surrounding electronic components 2. Further, a holding error, a drop, and a positional shift at the time of mounting, which are caused by a defective posture of the electronic component 2 at the time of pickup, are caused.
The contact position setting device S and the contact position setting method according to the present embodiment can accurately set the movement position of the holding portion 211 to an optimal value. The contact reference height position for the contact between the holding portion 211 and the contact object can be set so as to suppress the deviation from the actual contact height position. Therefore, the push-up reference height position can also be set with suppressed errors.
Here, a conventional procedure for setting the height to be the reference height position for pushing up will be described.
[1] The pick-up jig (holding portion) is positioned above the electronic component by a predetermined retreat amount.
[2] The push-up pins are raised from the original positions of the push-up pins located lower than the upper surface of the support body (the lower surface of the wafer sheet).
[3] The push-up pins raise the electronic parts via the wafer sheet.
[4] The electronic part is contacted with a pick-up jig located above the electronic part.
[5] Further, when the displacement sensor is turned ON (contact is detected) by the electronic component, the ascent of the ascent pin is stopped, and the height position (movement amount) of the ascent pin from the origin at this time is measured.
[6] The position obtained by subtracting the retreat amount from the height position measured in [5] is set as the upper surface of the support body, and is set as the push-up reference height position.
As described above, conventionally, the push-up reference height position is set by detecting contact of the pickup jig by the displacement sensor. However, the detected value includes, as an error, the amount of movement of the push-up pin from the time when the pick-up jig contacts the electronic component until the displacement sensor becomes ON. In the case where the pick-up jig is rubber, the amount of flattening of the jig is also included, and thus a larger error is caused.
In this state, the electronic component pushed up by the push-up pin is recognized as being in contact with the pick-up jig at a higher height position than is actually. Therefore, at the time of pickup, the height position at which the push-up pin stands by so that the tip end thereof is positioned on the upper surface of the support body is actually brought into a state in which the push-up pin protrudes from the upper surface of the support body. Thus, the wafer sheet is caught on the push pins, and the electronic parts cannot be moved to the pickup position. In addition, there are cases where the push-up pin is broken. Further, the wafer sheet may be wrinkled or torn and not picked up.
In addition, during pickup, the push-up pins are lifted up while holding the electronic component with the pickup jig until the electronic component is sufficiently peeled from the wafer sheet. At this time, the push-up pin is raised in synchronization with the pickup jig, and the synchronization shift is absorbed by the displacement of the spring. The amount of rise of the push-up pins from the standby position, that is, the amount of push-up height, results in a raised-bottom state in which the push-up pins are higher than the upper surface of the support body. On the other hand, on the pick-up side, the front end of the actual pick-up jig is located below due to the response error of the displacement sensor. Therefore, the interval for holding the electronic component is narrower than the envisaged interval, and excessive force is applied to the electronic component, which increases the possibility of damage. If the standby position is not provided, the upward movement time becomes longer, and the pickup operation takes time, which reduces productivity.
In the present embodiment, the height position (error amount) corresponding to the delay of the contact detection in the contact detection unit 230 is grasped in advance, and the error amount is subtracted to set the push-up reference height position in the calculation of the push-up reference height position in [6], so that the above-described problem is avoided.
(3) The holding portion 211 is formed of an elastically deformable material. Therefore, a detection delay of the contact detection portion 230 caused by the elastic deformation of the holding portion 211 occurs. However, even if such elastic deformation exists, the contact reference height position can be accurately set.
Modification example
The present invention is not limited to the embodiments described above. The basic configuration is the same as that of the above embodiment, and the following modifications can be applied.
(1) In the above embodiment, the contact position setting device S is configured as the pickup device 20, and the contact reference height position is a height position of the surface of the electronic component 2 supported by the sheet 11 and positioned at the supply position P1. However, as will be described below, the contact position setting device S may set the contact height position in any or all of the pickup device 20, the mounting device 30, and the transfer device 40. In these cases, the contact reference height position is the height position of the surface of the substrate M supported by the substrate stage 50 and positioned at the mounting position P3, the height position of the surface of the transfer stage 41 at the delivery position P2, and the height position of the surface of the electronic component 2 supported by the transfer stage 41. In this manner, the storage unit 66 stores the respective contact reference height positions, and can switch which of the contact reference height positions is used as the contact reference height position depending on the contact object of the holding unit.
For example, by providing the mounting device 30 with the same structure as the pickup unit 200, the contact position setting device S may be configured with the nozzle 31a of the bonding head 31 as a holding portion. In this case, the contact object is the substrate M, and the lower surface (the opposite surface to the holding surface) of the electronic component 2 held by the nozzle 31a as the holding portion is in contact with the surface of the substrate M. Thus, the height position of the electronic component 2 held by the nozzle 31a is the height position of the surface of the substrate M. The reference height position of contact in the contact position setting device S is based on the height position of the nozzle 31a detected by the position detecting section 250 when the detachment detecting section 63 detects detachment of the nozzle 31a from the surface of the substrate M. Accordingly, the contact position setting means S sets the identified height position of the surface of the substrate M as the contact reference height position. That is, the contact reference height position is set to a height position (mounting height position) when the electronic component 2 held by the bonding head 31 is mounted on the substrate M.
However, actually in contact with the substrate M is the electronic component 2. Accordingly, the nozzle 31a is set to a height position where the held electronic component 2 is stopped when mounted on the substrate M, and the height is increased by adding the thickness of the electronic component 2 to the contact reference height position set by the contact position setting device S. Therefore, the movement destination of the mounting device 30 to which the nozzle 31a of the bonding head 31 moves when the electronic component 2 is mounted on the substrate M is a position where the thickness of the electronic component 2 is added to the contact reference height position set by the contact position setting device S. Therefore, the height position obtained by adding the thickness of the electronic component 2 to the reference height position set by the contact position setting means S may be set as the mounting height position.
In this way, the mounting height position can be accurately determined, and therefore damage to the electronic component 2 and positional displacement when the electronic component 2 is mounted on the surface of the substrate M can be reduced.
When the electronic component 2 is mounted on the substrate M, if the amount of lowering (movement amount) for bringing the electronic component 2 held by the nozzle 31a into contact with the substrate M is insufficient, mounting failure may occur, and if the amount of lowering (movement amount) is excessive, the electronic component 2 may be damaged, and a crack or defect may occur. The mounting failure includes a positional deviation of mounting, inclination in a horizontal plane, inclination in a vertical plane, and the like.
The amount of lowering is the amount of movement of the nozzle 31a from the reference height position (origin height position) at which the nozzle is lowered to the point where the held electronic component 2 is in contact with the substrate M, and the insufficient amount of lowering is the amount of height position at which the nozzle is lowered to bring the electronic component 2 into contact with the substrate M, and the electronic component 2 is not in contact with the substrate M. In this case, since the suction and holding of the electronic component 2 are released in a state where the electronic component 2 is suspended, the posture is changed, and the accuracy of the mounting position is deteriorated. In addition, sufficient pressing force cannot be applied, and bonding (poor bonding) cannot be performed. On the other hand, an excessively large amount of lowering means that the height position of the nozzle 31a is low when it is lowered, and the electronic component 2 is excessively pressed against the substrate M. In this case, excessive pressing may cause damage such as cracks or chipping to the electronic component 2, and the posture of the electronic component 2 may also be deviated. In this way, if the height position of the electronic component 2 held by the nozzle 31a is shifted from the height position of the electronic component in contact with the substrate M, mounting failure, damage to the electronic component 2, and the like may occur. Therefore, the movement position determining the movement amount of the nozzle 31a needs to be accurately set to an optimal value.
In this embodiment, the movement position of the nozzle 31a can be accurately set to an optimum value. The contact reference height position for bringing the nozzle 31a into contact with the contact object can be set so as to suppress the deviation from the actual contact position. That is, since the height position of the surface of the substrate M can be accurately recognized by the "detachment" of the nozzle 31a from the contact object, the contact reference height position for the nozzle 31a to be in contact with the contact object can be set while suppressing the deviation from the actual contact height position, and the mounting defect, damage, or posture defect of the contact object can be reduced.
(2) The contact position setting device S configured as the supply device 10 and the mounting device 30 may function as the contact position setting device S configured to set the contact reference height position when the pick-up tool 210 mounts the electronic component 2 on the transfer table 41 and the contact reference height position when the bonding head 31 picks up the electronic component 2 from the transfer table 41, respectively. That is, the contact position setting device S can set the height position of the surface of the transfer table 41 or the height position of the surface of the electronic component 2 mounted on the transfer table 41 as the contact reference height position. Therefore, the transfer table 41 or the electronic component 2 mounted on the transfer table 41 is a contact object for the contact position setting device S. The transfer table 41 is provided with suction holes for holding the electronic components 2 mounted on the transfer table 41. When the contact reference height position is set, the contact reference height position can be set at a height position on the transfer table 41 avoiding the suction hole so that the detachment can be reliably detected. In addition, when the height position of the upper surface of the electronic component 2 mounted on the transfer table 41 is set to the contact reference height position, the electronic component 2 suctioned and held on the transfer table 41 must be suctioned and held on the transfer table 41 so that the detachment of the holding portion 211 can be reliably detected. Therefore, the transfer table 41 can hold the electronic component 2 by suction force larger than the suction force of the holding portion 211. The contact position setting device S of the mounting device 30 may set the height position of the surface of the electronic component 2 mounted on the transfer table 41 as the contact reference height position as described above, or may set the height position of the surface of the transfer table 41 as the contact reference height position, and receive the electronic component 2 by adding the thickness of the electronic component 2 to the set contact reference height position when the electronic component 2 is received from the transfer table 41.
(3) The sensor used for the contact detection unit 230 may be any sensor as long as it can recognize a predetermined relative displacement between the relatively movable members. Among them, a sensor capable of recognizing displacement in a noncontact manner is preferable in view of the life of the sensor or particles generated by contact. In the present embodiment, an eddy current type displacement sensor (for example, a camshaft angle sensor (registered trademark)) is used, but the displacement sensor may be, for example, a displacement sensor of not only an eddy current type (high-frequency oscillation type) but also a magnetic type, a capacitance type, an ultrasonic type, a laser type, or the like. Any of the sensors can recognize the contact of the holding portion 211 by comparing the detected value with a predetermined threshold value.
(4) The sensor used for the contact detecting unit 230 is not limited to the above-described non-contact sensor, and may be a sensor capable of recognizing stress generated when the holding unit 211 is in contact with the sensor. For example, even with a piezoelectric element or a strain gauge (load cell) capable of detecting stress, contact of the holding portion 211 can be recognized by comparing the detected stress value with a predetermined threshold value. In this case, a strain gauge is provided in the mounting member 211b, and strain generated in the mounting member 211b due to contact of the holding portion 211 with the contact object is measured. Alternatively, the load cell is provided so as to be close to the probe 214, and after the holding portion 211 is brought into contact with the contact object, the pressurizing force generated by the contact of the probe 214 with the load cell is measured. Various structures are possible. Further, the force applied to the holding portion 211 may be measured by a load cell without moving the holding portion 211 and the holder 227 relative to each other. Similarly, the deformation of the holding portion 211 may be measured by a strain gauge without moving the holding portion 211 and the holder 227 relative to each other.
Even these sensors have an error in the delay of the time until the detection value reaches the threshold value. In particular, since there is a fluctuation or noise in the signal of the sensor, if the threshold value is set strictly, there is a possibility that the detection is erroneously performed, and if the threshold value is set to have a margin of a certain degree, the delay that becomes an error increases. In addition, a delay caused by deformation of the holding portion 211 is also generated. In the present invention, as described above, since the detection holding portion 211 is separated from the contact object, the signal of the sensor changes drastically and rapidly, and even if the threshold has a margin, the delay that becomes an error can be shortened. In addition, delay caused by deformation of the holding portion can be eliminated. Therefore, the contact reference height position of the holding portion 211 can be accurately set. Of course, the same applies to the nozzle 31a of the joint head 31.
(5) In addition, a sensor for contacting the detecting portion 230 may also detect the suction pressure of the holding portion 211. In this embodiment, the height position at the time of detachment of the holding portion 211 is detected. Thereby, an error caused by the detection delay of the contact detection section 230 is eliminated. In the case where the sensor detects the suction pressure of the holding portion 211, after the holding portion 211 is in contact with the contact object, the holding portion 211 moves until the pressure detected by the pressure detecting portion 240 exceeds the threshold value. The error in contact recognition of the pressure detecting portion 240 generated at this time is eliminated as described above, and thus does not become a problem. That is, the pressure detecting portion 240 can be used as the contact detecting portion 230, and the structure can be simplified.
(6) As described above, in the case of the elastic holding portion 211, errors due to the elastic force and the crush are similarly included in any of the sensors. Even in this case, the height position obtained when the holding portion 211 is separated from the contact object is corrected. The present invention is not limited to this, and the same contact position setting device S may be configured even with a hard material such as a metal, which hardly undergoes elastic deformation. In this case, although an error due to the deformation of the elastic holding portion 211 does not occur, an error due to the time until the contact detection portion 230 detects the contact by exceeding the threshold value is generated as described above. Even if there is such an error, the height position obtained when the holding portion 211 is separated from the contact object can be corrected, and therefore the contact reference height position can be accurately set. In addition, in the case of the hard holding portion 211, in order to prevent damage to the electronic component 2, it is necessary to appropriately set the pressure at the time of contact. In the case where the holding portion 211 is movable relative to the holder 227, the impact force when the holding portion 211 contacts the electronic component 2 can be reduced. The same applies when the nozzles 31a of the bonding head 31 press the electronic component 2 against the substrate M. In addition, excessive contact pressure due to relative movement can be easily avoided. Further, the pressure at which the holding portion 211 or the nozzle 31a is in contact with the contact object can be easily set. In the pickup unit 200 of the present embodiment, the holding portion is biased by the biasing member 228. Accordingly, the holding portion 211 is biased by the displacement of the biasing member 228 by the relative displacement between the holding portion 211 and the holder 227. The force is applied to the electronic part 2. In the present embodiment, the height position of the holding portion 211 in contact with the electronic component 2 can be accurately grasped. Further, the displacement amount of the holding portion 211 after contact with the electronic component 2 can be easily controlled. This makes it possible to accurately control the compression amount of the biasing member, and to accurately set the pressure applied to the electronic component 2 to a desired pressure. The same applies when the nozzle 31a of the bonding head 31 is pressed against the electronic part 2. Further, if a voice coil motor or the like is used, for example, such pressure can be easily controlled regardless of the displacement amount, but accurate pressure control can be performed even with an inexpensive, simple, and lightweight urging member.
(7) In the above embodiment, the electronic component 2 is arranged in the supply device 10 in a face-up state in which the functional surface is exposed upward, but may be arranged in a face-down state in which the functional surface is on the lower sheet 11 side. As described above, the electronic component 2 includes a case of being mounted face down with respect to the substrate M, and also includes a case of being mounted face up. That is, the electronic component 2 disposed face-up can be face-down bonded by flipping, and face-up bonding can be performed by passing through the transfer device 40. The electronic components 2 arranged face-down can be bonded face-up by flipping, and can be bonded face-down by passing through the transfer device 40.
As an example, a case will be described in which the electronic component 2 arranged in the sheet 11 in a face-up state is mounted on the substrate M in a face-up state. That is, as described above, after the electronic component 2 is picked up by the holding portion 211, the picked-up electronic component 2 is moved to the bonding position P2 by the moving mechanism 22 without turning the holding portion 211 by the turning mechanism 23. The electronic component 2 held by the holding portion 211 faces the transfer table 41 of the transfer device 40. After the holding unit 211 is lowered and the transfer table 41 suctions and holds the electronic component 2, the holding unit 211 releases the negative pressure, and the electronic component 2 is transferred to the transfer table 41.
After the pickup unit 200 is retracted from the transfer position P2, the nozzle 31a of the bonding head 31 of the mounting device 30 is moved to the transfer position P2 so as to face the electronic component 2 held on the transfer table 41. After the bonding head 31 is lowered toward the transfer table 41 and the electronic component 2 is held by the nozzle 31a, the transfer table 41 releases the negative pressure, and the electronic component 2 is transferred to the nozzle 31a of the bonding head 31. Then, the electronic component 2 is mounted to the substrate M as described above.
In this way, when the holding unit 211 mounts the electronic component 2 on the transfer table 41, the contact reference height position for contact with the contact object can be accurately set even when the nozzle 31a of the bonding head 31 picks up the electronic component 2 from the transfer table 41, as described above. Therefore, in each case of picking up the electronic component 2 from the sheet 11, placing it on the transfer table 41, picking up it from the transfer table 41, and placing it on the substrate M, the contact reference height position for contact with the contact object can be accurately set to an appropriate height position while suppressing the deviation from the actual contact height position, and therefore, the electronic component can be reliably held without damage or deviation. This prevents damage even during the joining via the transfer table 41, and allows the mounting to be effectively carried out in a correct posture and at a correct height. In addition, even when the transfer table 41 is not mounted in a face-up state, the transfer table may be used.
The mounting device 1 may be configured so that the contact height position with respect to the contact object can be obtained by detecting the disengaged state. Therefore, the head of the electronic component 2 may be picked up and mounted as one (one head) device. That is, the mounting device 1 may be used as both the pickup device 20 and the mounting device 30. In this case, the head which uses both the holding portion 211 and the bonding head 31 picks up the electronic component 2, transfers the electronic component 2 to the substrate M, and mounts it to the substrate M. The contact reference height position is the height of the electronic component 2 on the sheet 11, the surface height of the substrate M. Thus, the same effects as those of the embodiment can be obtained. In this case, the electronic parts 2 arranged in the face-up state are mounted in the face-up manner, and therefore, the flip-flop mechanism is not required. However, it is preferable to have a horizontal rotation mechanism for θ correction.
(8) In the embodiment described above, in step S103 and step S104, the pressure detection unit 240 is turned ON regardless of the operation. However, the following modes are also possible. When the holding portion 211 is initially brought into contact with the contact object and the pressure detecting portion 240 is turned ON, or when the operation in the Z-axis direction is stopped after the pressure detecting portion 240 is turned ON, suction of the holding portion 211 is stopped. The pressure in the pressure detecting unit 240 at the time of stopping the operation in the Z-axis direction is obtained. Then, the amount of change in the acquired pressure is set to a predetermined threshold value.
When the suction is thus stopped, the pressure in the path gradually rises due to leakage. Further, the suction force against the contact object is reduced as compared with when the holding portion 211 continues suction. Therefore, the force required for disengaging the holding portion 211 is reduced, and thus the disengagement becomes easy. Even in this case, since the suction hole 211a is released at once, the case where a sudden pressure change is caused when the holding portion 211 is disengaged does not change, and therefore the disengagement can be accurately detected according to the threshold value. Further, the pressure may be slightly increased by supplying air into the pipe 211c instead of the natural leakage. The pressure in the pipe 211c may be set so that when the holding portion 211 is disengaged, a change in the detectable disengagement occurs within an allowable detection error.
Here, if the suction force is strongly applied to the holding portion 211, the detachment is not easily performed. In particular, in the case of the rubber holding portion 211, there is a possibility that elongation may occur immediately before detachment. When the holding portion 211 expands, the holding portion 211 rises accordingly, and therefore, the height position at the time of contact and the height position at the time of disengagement deviate, which becomes an error. In this embodiment, since the holding portion 211 can be easily separated from the contact object, an error generated at the time of separation can be suppressed to the minimum.
In addition, even if the pressure is not changed after the contact is recognized in this way, the suction force at the time of contact can be reduced (low negative pressure) from the beginning. That is, if the detection at the time of detachment is possible and the holding portion 211 made of rubber or the like is made to have a pressure that is less likely to be elongated, the same operation and effects as described above can be obtained as if the pressure was changed after the contact was recognized.
(9) The supply stage 12 may be configured to support a tray on which a plurality of electronic components 2 are mounted, instead of the sheet 11. Such electronic parts 2 mounted on the tray are also pickup objects. The tray may be directly supported on the supply stage 12 or may be indirectly supported via a support plate or the like. The supply stage 12 can position the electronic component 2 placed on the tray at the supply position P1. The tray or a member supporting the tray is a contact object of the holding portion 211. This is the same as the substrate M in the above-described manner.
For example, a description will be given of a manner in which the supply stage 12 supports a tray on which a plurality of electronic components 2 are mounted via a support plate instead of the sheet 11. After the holding portion 211 is brought into contact with the support plate of the substitute sheet 11, when the detachment detecting portion 63 detects detachment of the holding portion 211, the position detecting portion 250 detects the height position of the upper surface of the support plate. Then, the reference position setting unit 64 sets the detected height position as the contact reference height position. The height position of the picked-up electronic component 2 may be a height position obtained by adding the height of the surface of the tray on which the electronic component 2 is placed and the thickness of the electronic component 2 to the set contact reference position.
In the case where the tray is held by adhesion, clamping by a leaf spring, or the like, the height position of the surface of the tray on which the electronic component 2 is placed may be detected by detachment of the holding portion 211, and set to the contact reference height position. In this case, the height position obtained by adding the thickness of the electronic component 2 to the set contact reference height position can be used as the height position for picking up the electronic component 2.
Other embodiments
The present invention is not limited to the above-described embodiments, and includes a mode in which all or any of the above-described embodiments are combined. Further, various omissions, substitutions, and changes in the embodiments may be made without departing from the scope of the invention, and modifications thereof are also included in the invention.

Claims (16)

1. A contact position setting device, characterized by comprising:
a holding part for sucking and holding the electronic component;
a driving mechanism for moving the holding portion in a direction of contact and separation with a contact object;
a contact detection unit that detects contact between the holding unit and the contact object;
a pressure detection unit that detects a suction pressure of the holding unit;
a position detection unit that detects a height position of the holding unit;
A stop control unit that stops movement of the holding unit when the holding unit to which the suction force is applied is moved in a direction to contact the contact object and contact is detected by the contact detection unit;
a detachment detection unit that moves the holding unit that detects contact and is stopped by the stop control unit in a direction of detachment from the contact object, and detects detachment of the holding unit from the contact object based on a change in suction pressure detected by the pressure detection unit at this time; and
and a reference position setting unit that sets a contact reference height position of the holding unit with respect to the contact object based on the height position of the holding unit detected by the position detecting unit when the detachment is detected by the detachment detecting unit.
2. The contact position setting device according to claim 1, wherein the contact detection portion detects contact of the holding portion with the contact object based on a displacement amount of a relative height position of the holding portion and the driving mechanism.
3. The contact position setting device according to claim 1, comprising:
a push-up mechanism that moves the contact object toward the holding portion;
A push-up position detection unit that detects a push-up height position to which the contact object is moved by pushing up the contact object by the push-up mechanism; and
and a push-up reference position setting unit that sets a push-up reference height position realized by the push-up mechanism, based on the push-up height position detected by the push-up position detection unit when the contact detection unit detects that the contact object moved by the push-up mechanism is in contact with the holding unit.
4. The contact position setting device according to claim 3, wherein,
the push-up reference position setting unit is configured to:
the push-up height position detected by the push-up position detecting unit, and
a difference between a height position of the holding portion which is detected by the contact detecting portion and which is in contact with the contact object, and a height position of the holding portion which is detected by the separation detecting portion and which is when the holding portion is separated from the contact object,
to set the push-up reference height position achieved by the push-up mechanism.
5. The contact position setting device according to claim 2, comprising:
a push-up mechanism that moves the contact object toward the holding portion;
A push-up position detection unit that detects a push-up height position to which the contact object is moved by pushing up the contact object by the push-up mechanism; and
and a push-up reference position setting unit that sets a push-up reference height position realized by the push-up mechanism, based on the push-up height position detected by the push-up position detection unit when the contact detection unit detects that the contact object moved by the push-up mechanism is in contact with the holding unit.
6. The contact position setting device according to claim 5, wherein,
the push-up reference position setting unit is configured to:
the push-up height position detected by the push-up position detecting unit, and
a difference between a height position of the holding portion which is detected by the contact detecting portion and which is in contact with the contact object, and a height position of the holding portion which is detected by the separation detecting portion and which is when the holding portion is separated from the contact object,
to set the push-up reference height position achieved by the push-up mechanism.
7. The contact position setting device according to claim 1, wherein the holding portion is formed of an elastically deformable material.
8. A mounting device, comprising:
the contact position setting device according to any one of claims 1 to 7;
a supply device for supplying electronic components;
a pick-up device that picks up the electronic parts from the supply device;
a substrate stage for supporting a substrate; and
a mounting device for mounting the picked-up electronic component on the substrate,
the holding portion of the contact position setting device and the driving mechanism are provided as part of the pickup device and the mounting device, respectively,
the reference position setting unit sets a contact reference height position of the holding unit in the pickup device with respect to the contact object, and sets a contact reference height position of the holding unit in the mounting device with respect to the contact object.
9. The mounting device of claim 8, wherein the mounting device comprises a mounting device,
the pick-up device has a flipping mechanism for flipping the electronic parts picked up,
the mounting device receives the electronic component flipped by the flipping mechanism and mounts it on the substrate.
10. The mounting device of claim 8, wherein the mounting device comprises a mounting device,
Comprises a transfer table for placing the electronic parts picked up by the pick-up device,
the mounting device receives the electronic component mounted on the transfer table by the pickup device and mounts the electronic component on the substrate.
11. The mounting apparatus according to claim 8, wherein the contact reference height position is a height position of a surface of the electronic part that is supported by a sheet and positioned at a supply position where the pickup apparatus picks up.
12. The mounting apparatus according to claim 8, wherein the contact reference height position is a height position of a surface of the substrate that is supported on the substrate stage and positioned at a mounting position at which the electronic component is mounted on the substrate.
13. The mounting device of claim 10, wherein the contact reference height position is a height position of a surface of the transfer table.
14. The mounting apparatus according to claim 10, wherein the contact reference height position is a height position of a surface of the electronic component supported on the transfer stage.
15. The mounting device of claim 10, wherein,
Has a storage section that stores the contact reference height position,
and switching and applying the contact reference height position according to the contact object of the holding part.
16. A contact position setting method is characterized in that,
the driving mechanism moves the holding part to which the suction force is applied in a direction of contacting with the contact object;
the driving mechanism stops the holding portion when the contact detecting portion detects the contact of the holding portion with the contact object;
the driving mechanism moves the stopped holding portion in a direction away from the contact object;
a pressure detection unit that detects detachment of the holding unit from the contact object based on a change in suction pressure of the holding unit;
a position detecting unit that detects a height position of the holding unit when the pressure detecting unit detects the detachment;
a reference position setting unit sets a contact reference height position of the holding unit with respect to the contact object based on the height position of the holding unit detected by the position detecting unit.
CN202310311081.6A 2022-03-30 2023-03-28 Contact position setting device, mounting device, and contact position setting method Pending CN116895559A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-056425 2022-03-30
JP2023027398A JP2023152743A (en) 2022-03-30 2023-02-24 Contact position setting device, mounting device and contact position setting method
JP2023-027398 2023-02-24

Publications (1)

Publication Number Publication Date
CN116895559A true CN116895559A (en) 2023-10-17

Family

ID=88309876

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310311081.6A Pending CN116895559A (en) 2022-03-30 2023-03-28 Contact position setting device, mounting device, and contact position setting method

Country Status (1)

Country Link
CN (1) CN116895559A (en)

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