CN111868901B - Tool height adjusting device and chip component transfer device having the same - Google Patents
Tool height adjusting device and chip component transfer device having the same Download PDFInfo
- Publication number
- CN111868901B CN111868901B CN201980019450.6A CN201980019450A CN111868901B CN 111868901 B CN111868901 B CN 111868901B CN 201980019450 A CN201980019450 A CN 201980019450A CN 111868901 B CN111868901 B CN 111868901B
- Authority
- CN
- China
- Prior art keywords
- tool
- transparent plate
- chip
- holding portion
- chip holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012546 transfer Methods 0.000 title claims description 53
- 238000003384 imaging method Methods 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims description 32
- 238000010586 diagram Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 102220496565 MAGUK p55 subfamily member 3_I21A_mutation Human genes 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Abstract
The invention provides a tool height adjusting device, which can accurately adjust the height position of a chip holding part in a pick-up tool using a soft component with small pressure change along with contacting the chip holding part. Specifically, provided is a tool height adjustment device provided with: a transparent plate; an imaging unit that acquires an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and a control unit having a function of controlling up-and-down driving of the pickup tool, a function of controlling an operation of the photographing unit, and a function of analyzing an image obtained by the photographing unit, wherein the control unit analyzes the image obtained by the photographing unit while approaching the chip holding portion to the transparent plate direction, thereby detecting a height position of the upper surface of the transparent plate effectively held by the chip holding portion.
Description
Technical Field
The present invention relates to a tool height adjustment device for a pickup tool used for picking up a chip component on a transfer source substrate in a chip component transfer device used for transferring the chip component on the transfer source substrate to a transfer target substrate.
Background
Miniaturization of semiconductor chips and miniaturization of LED chips by improvement of light emitting efficiency of LEDs are advancing due to progress of micromachining technology. Therefore, a plurality of chip components such as semiconductor chips and LED chips can be densely formed on one wafer substrate.
If a plurality of small chip components are densely formed in this way, it is extremely inefficient to transfer the chip components one by one when transferring them to other substrates. Therefore, in order to improve efficiency, various methods have been studied, and as one of them, there is a method of picking up a plurality of chip components simultaneously (for example, patent document 1).
Fig. 7 shows an example in which a plurality of chip components C densely arranged on a transfer source substrate B0 are picked up at the same time and transferred to a transfer target substrate B1 with an interval therebetween, and shows a case in which transfer is performed using a pickup tool 2 having a plurality of chip holding portions 21 that hold the chip components C.
Fig. 7 (a) shows a state in which the chip holding portion 21 and the chip component C are aligned, and then the pick-up tool 2 is lowered, and as shown in fig. 7 (B), the chip holding portion 21 is brought into contact with the chip component C, and if the pick-up tool 2 is raised in a state in which the chip holding portion 21 holds the chip component C, as shown in fig. 7 (C), a plurality of chip components C can be picked up simultaneously from the transfer source substrate B0. Then, as shown in fig. 7 (d), in a state where the transfer target substrate B1 is disposed below the pickup tool 2, the pickup tool 2 is lowered to bring the chip component C into close contact with the transfer target substrate B1 as shown in fig. 7 (e), and then the chip holding portion 21 is released from holding the chip component C, and as shown in fig. 7 (f), the pickup tool 2 is raised, so that the transfer of the chip component C to the transfer target substrate B1 is enabled.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2015-529400
Patent document 2: japanese patent laid-open No. 2008-201883
Disclosure of Invention
Problems to be solved by the invention
When the chip holding portion 21 shown in fig. 7 holds the chip component C, a vacuum suction method has been conventionally used. That is, in the chip holding portion 21 shown in the cross-sectional view in fig. 8 (a), the chip holding portion 21 adsorbs the chip component C by depressurizing the inside of the adsorption hole 2V in a state where the adsorption hole 2V of the chip holding portion 21 is in contact, and if the chip holding portion 21 is lifted in this state, the chip component C can be peeled off from the transfer source substrate B0 and picked up. Here, as the pick-up tool 2 and the chip holding portion 21, metals are generally used from the viewpoints of mechanical strength and workability.
In addition, as shown in fig. 7, the chip component C that picks up a plurality of chips simultaneously is several tens μm square, and is very small. Therefore, there is also a chip component C in which cracks occur due to the pressure at the time of contact of the chip holding portion 21 made of metal, as shown in fig. 8 (b). As shown in fig. 8 (C), such a chip component C may be broken during the pickup process and may not be sucked and held, and even if transferred onto the transfer target substrate B1 in a state where a crack is generated, a problem may occur.
Therefore, as a countermeasure against breakage of the chip component C at the time of such pickup, it is considered to use the flexible member 21S at a portion of the chip holding portion 21 that contacts the chip component C. Fig. 9 (a) to 9 (C) show the case where the chip component C is picked up by the chip holding portion 21 having the soft member 21S, and the soft member 21S is deformed so as not to apply a pressure to the chip component C abruptly.
Further, since extremely fine processing is required to form the suction holes 2V for sucking the minute chip parts C, the cost is high, and therefore, it is also conceivable to hold the chip parts C by a method other than vacuum suction. One of them is a method using intermolecular force (van der waals force), which corresponds to the use of a so-called gecko tape (patent document 2) or the like (fig. 10). In this case as well, the portion of the chip holding portion 21 that contacts the chip member C is a soft member, unlike a metal or the like. Therefore, the gecko tape shown in fig. 10 is also labeled as a soft member 21S. Fig. 10 (a) to 10 (C) show a case where the chip component C is picked up by the chip holding portion 21, and the chip holding portion 21 has a soft member 21S capable of holding the chip component C by intermolecular forces, and the soft member 21S deforms so as not to apply a sudden pressure to the chip component C as in fig. 9 (a) to 9 (C).
However, although breakage of the chip component C can be prevented by using a soft member for the chip holding portion 21, on the other hand, a problem also arises in adjusting the height position of the chip holding portion 21. That is, in the chip holding portion 21 using the flexible member 21S, it is still necessary to grasp the relative distance to the chip member C in order to reliably hold the chip member C, but the height position adjustment of the chip holding portion 21 as a premise is difficult in the conventional method. This is because, in the conventional method, the height position of the chip holding portion 21 is grasped by detecting a pressure change when the chip holding portion 21 is in contact with a known surface, but it is difficult to detect a pressure change when the chip holding portion 21 is in contact with the surface by using the flexible member 21S.
The present invention has been made in view of the above-described problems, and provides a tool height adjustment device capable of accurately adjusting the height position of a chip holding portion in a pick-up tool using a flexible member having a small pressure change associated with contact with the chip holding portion. In addition, a chip component transfer device with the tool height adjusting device is also provided.
Means for solving the problems
In order to solve the above-described problems, the invention described in claim 1 is a tool height adjustment device for adjusting a height position of a chip holding portion of a pick-up tool for picking up a chip component by moving the chip holding portion up and down, the tool height adjustment device comprising: a transparent plate; an imaging unit that acquires an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and a control unit having a function of controlling up-and-down driving of the pickup tool, a function of controlling an operation of the photographing unit, and a function of analyzing an image obtained by the photographing unit, wherein the control unit analyzes the image obtained by the photographing unit while approaching the chip holding portion to the transparent plate direction, thereby detecting a height position of the upper surface of the transparent plate effectively held by the chip holding portion.
The invention described in claim 2 is a tool height adjustment device for adjusting a height position of a chip holding portion of a pick-up tool for picking up a chip component by moving the chip holding portion up and down, the tool height adjustment device comprising: a transparent plate; an imaging unit that acquires an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and a control unit having a function of controlling up-and-down driving of the pickup tool, a function of controlling an operation of the photographing unit, and a function of analyzing an image acquired by the photographing unit, wherein the control unit temporarily attaches the chip holding portion to the transparent plate, and detects a height position of the upper surface of the transparent plate by analyzing the image acquired by the photographing unit while driving the pickup tool in a direction in which the chip holding portion is separated from the transparent plate.
The invention described in claim 3 is the tool height adjusting device according to claim 1 or 2, wherein the tool height adjusting device adjusts the height position of the chip holding portion of the pick-up tool provided with the plurality of chip holding portions.
The invention according to claim 4 is the tool height adjusting device according to claim 3, wherein the control unit has the following functions: the parallelism of the region formed by the plurality of chip holding parts with respect to the upper surface of the transparent plate is evaluated by analyzing the image acquired by the imaging unit.
The invention described in claim 5 is the tool height adjustment device according to any one of claims 1 to 4, wherein the tool height adjustment device adjusts a height position of a chip holding portion of a pick-up tool using a flexible member in the chip holding portion.
The invention described in claim 6 is a chip component transfer device that picks up a chip component from a transfer source substrate and mounts the chip component on a transfer target substrate, wherein the chip component transfer device has a tool height adjustment device according to any one of claims 1 to 5 for adjusting a height position of a chip holding portion of a pick-up tool that picks up the chip component from the transfer source substrate.
Effects of the invention
In a pick-up tool using a flexible member having a small pressure change caused by contact with a chip holding portion, the height position of the chip holding portion can be accurately adjusted, and the chip member to be picked up is not damaged by pressurization.
Drawings
Fig. 1 is a cross-sectional view showing the structure of a tool height adjusting device according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view showing an operation state of the tool height adjusting device according to the embodiment of the present invention.
Fig. 3 is an example of an image obtained by the imaging unit of the tool height adjustment device according to the embodiment of the present invention, in which (a) of fig. 3 is a diagram showing a state in which the chip holding portion is away from the focus of the imaging unit, (b) of fig. 3 is a diagram showing a state in which the chip holding portion is close to the focus of the imaging unit, (c) of fig. 3 is a diagram showing a state in which the chip holding portion is in contact with a surface provided at the focus of the imaging unit, and (d) of fig. 3 is a diagram showing a state in which the chip holding portion is in close contact with a surface provided at the focus of the imaging unit.
Fig. 4 shows an example of the relationship between the tool height adjustment device according to the embodiment of the present invention and the transfer source stage, the transfer source substrate, the chip component, and the transfer target substrate.
Fig. 5 (a) is a diagram showing a state in which focusing of the imaging unit is performed in the tool height adjustment device according to the embodiment of the present invention, and fig. 5 (b) is a diagram showing a focusing jig for focusing of the imaging unit.
Fig. 6 is a view showing an image obtained by the imaging unit of the tool height adjusting device according to the embodiment of the present invention, and is an example in which the pickup tool is tilted.
Fig. 7 is an example in which a plurality of minute chip components are simultaneously picked up and transferred, where (a) of fig. 7 is a diagram showing an alignment state of a pick-up tool and a chip component, (b) of fig. 7 is a diagram showing a chip component holding state based on the pick-up tool, (c) of fig. 7 is a diagram showing a chip component pick-up state based on the pick-up tool, (d) of fig. 7 is a diagram showing an alignment state of the pick-up tool and a transfer target substrate, fig. 7 (e) is a diagram showing a chip component being arranged on the transfer target substrate with the pick-up tool, and (f) of fig. 7 is a diagram showing a transfer completion state of the chip component based on the pick-up tool.
Fig. 8 is a diagram for explaining a problem in picking up a minute chip component by a conventional vacuum suction method, in which fig. 8 (a) is a diagram showing a state in which a chip holding portion is disposed at an upper portion of the chip component, fig. 8 (b) is a diagram showing a state in which the chip holding portion is brought into close contact with the chip component, and fig. 8 (c) is a diagram showing a state in which the chip holding portion adsorbs the chip component to pick up the chip component.
Fig. 9 is a diagram illustrating an example in which a minute chip component is sucked and held by a chip holding portion using a flexible member and picked up, in which fig. 9 (a) is a diagram showing a state in which the flexible member is in contact with the chip component, fig. 9 (b) is a diagram showing a state in which the flexible member is brought into close contact with the chip component and held, and fig. 9 (c) is a diagram showing a state in which the chip holding portion is raised and the chip component is picked up.
Fig. 10 is a diagram illustrating an example in which a chip component is held and picked up by a holding force of a flexible member, wherein fig. 10 (a) is a diagram illustrating a state in which the flexible member is in contact with the chip component, fig. 10 (b) is a diagram illustrating a state in which the flexible member is held in close contact with the chip component, and fig. 10 (c) is a diagram illustrating a state in which the chip holding portion is raised and the chip component is picked up.
Detailed Description
Embodiments of the present invention will be described. Fig. 1 is a cross-sectional view showing the structure of a tool height adjusting device 1 according to an embodiment of the present invention. The tool height adjusting device 1 adjusts the height position of a chip holding portion 21 of a pick-up tool 2, and includes a transparent plate 4, an imaging unit 5, and a control unit 10.
Here, the pick-up tool 2 picks up the chip parts C from the transfer source substrate B0 held by the transfer source stage 3, and the pick-up tool 2 has a plurality of chip holding parts 21 so as to pick up a plurality of chip parts C at the same time. The region formed by the plurality of chip holding portions 21 is formed to be planar in order to hold the plurality of chip components C existing on the same plane at the same time. A soft member 21S shown in fig. 9 and 10 is used in a portion of the chip holding portion 21 that contacts the chip member C. The material and application of the chip member C are not particularly limited as long as it is a microchip smaller than 500 μm square, and the chip member C is intended for use in an LED chip, a wireless chip, a MEMS chip, or the like.
The transparent plate 4 in the pick-up tool 2 is a transparent plate provided on the transfer source stage 3, and is provided so that the transparent plate upper surface 41 is parallel to the transfer source stage upper surface 31. The transparent plate 4 is preferably made of a material which is transparent without clouding, is not easily deformed, and is not easily damaged, and is preferably made of glass or quartz. The height of the transparent plate upper surface 41 with respect to the transfer source stage upper surface 31 can be arbitrarily set as long as it can be accurately grasped, but it is preferable that the height is in the range of from 0 μm (the transparent plate upper surface 41 and the transfer source stage upper surface 31 form the same plane) up to 1000 μm.
As shown in fig. 1, the imaging unit 5 is disposed below the transparent plate 4 so that the chip holding portion 21 of the pickup tool 2 is brought into view through the transparent plate 4. In fig. 1, the imaging unit 5 is configured to bend the optical axis by the prism 51 and acquire an image by the imaging device 50, but if a sufficient space can be provided directly below the transparent plate 4, a configuration may be adopted in which the imaging device 50 has a field of view directly above without using the prism 51.
The control unit 10 has the following functions: a function of controlling up-down driving of the pick-up tool 2 via a driving unit not shown; a function of controlling the operation of the photographing unit 5; and a function of analyzing the image acquired by the imaging unit 5. Here, in the up-and-down driving of the pickup tool 2, the up-and-down driving can be controlled while calculating the up-and-down movement distance using an encoder or the like. In the operation of the imaging unit 5, the timing of acquiring an image can be controlled, and an image can be acquired in conjunction with the up-and-down driving position of the pickup tool 2. The image analysis function obtained by the imaging unit 5 may be a general-purpose image analysis software.
Hereinafter, a process of adjusting the height of the chip holding portion 21 of the pick-up tool 2 using the tool height adjusting device 1 will be described.
First, regarding (the imaging device 50 of) the imaging unit 5, the transparent plate upper surface 41 is brought into focus in advance. At this stage, as shown in fig. 1, the pick-up tool 2 is arranged in such a manner that the chip holding portion 21 is away from the transparent plate upper surface 41.
From this state, the control unit 10 gradually lowers the pickup tool 2, and stops at a stage where the chip holding portion 21 is brought into close contact with the transparent plate upper surface 41 as shown in fig. 2. Even if the flexible member 21S is used for the chip holding portion 21, since a large pressure is applied to the pick-up tool 2 when the flexible member 21S is sufficiently pressurized, the adhesion of the chip holding portion 21 to the transparent plate upper surface 41 can be detected by the pressure detection.
During the period when the pickup tool 2 reaches the state of fig. 2 from the state of fig. 1, the control unit 10 acquires an image in association with the moving distance of the pickup tool 2 through the photographing unit 5. That is, in a state where the chip holding portion 21 is close to the transparent plate upper surface 41, an image is acquired in association with the distance, and an example of the acquired image is shown in fig. 3. In fig. 3, (a) of fig. 3 is a state in which the chip holding portion 21 is away from the transparent plate upper surface 41, and since the focus of the photographing unit 5 is aligned with the transparent plate upper surface 41, the image I21 of the chip holding portion 21 is blurred. Then, as the pickup tool 2 descends, the contrast of the image I21 increases ((b) of fig. 3). After that, as shown in fig. 3 (c), the contrast of the image I21 is improved after the chip holding portion 21 is in contact with the transparent plate upper surface 41, and until the chip holding portion 21 is pressed against the transparent plate upper surface 41 as shown in fig. 3 (d). This is considered to be because the surface of the chip holding portion 21 is not smooth and has minute irregularities, so that light is diffusely reflected between the chip holding portion 21 and the transparent plate 4 to deteriorate the contrast, and the diffuse reflection is suppressed by bringing the chip holding portion 21 into close contact with the transparent plate 4 to thereby improve the contrast, and a clear image can be obtained.
When the chip holding portion 21 picks up the chip component C, it is difficult to hold the chip component C in a state where only the tip of the flexible member 21S reaches the chip component C. On the other hand, if the chip holding portion 21 and the chip member C are brought into close contact with each other in the state of excessively compressing the flexible member 21S, the chip member C may be broken. Therefore, it is understood that the soft member 21S should be compressed moderately and brought into close contact with the transparent plate upper surface 41 in order to effectively hold the chip member C.
Therefore, in the tool height adjustment according to the present invention, the height position determined that the chip holding portion 21 has substantially reached the transparent plate upper surface 41 (the transparent plate upper surface 41 is effectively held) is detected during the period from the state where the chip holding portion 21 is in contact with the transparent plate upper surface 41 until a pressure equal to or higher than a predetermined level is applied to the transparent plate 4. That is, the control unit 10 analyzes the image acquired by the imaging unit 5, and determines that the chip holding portion 21 has substantially reached the transparent plate upper surface 41 in the period from fig. 3 (c) to fig. 3 (d) with respect to the image I21. Specifically, the control unit 10 analyzes an evaluation item such as the contrast of an image acquired in association with the distance by which the pickup tool 2 is lowered, and determines that the chip holding portion 21 has substantially reached the transparent plate upper surface 41 at a stage at which the evaluation item reaches a certain reference.
Through the above steps, the reference position of the height in the moving distance of the pick-up tool 2 can be set. For example, as shown in fig. 4, if the height h0 of the transparent plate upper surface 41 with respect to the transfer source stage upper surface 31 is measured by the laser length measuring device 7 or the like, the height position where the chip holding portion 21 substantially reaches the transfer source stage upper surface 31 can be set. Further, if the height h1 of the transfer source substrate B0 with respect to the upper surface of the transfer source stage and the height h2 of the chip component C on the transfer source substrate B0 are measured, the height position where the chip holding portion 21 effectively holds the chip component C can be set.
In addition, if the height of the transfer target substrate B1 with respect to the transparent plate upper surface 41 is also measured in the same manner, the chip holding portion 21 at the time of transferring the chip component C to the transfer target substrate B1 can be set to an appropriate height by taking the height h2 of the chip component into consideration.
In the above description, the embodiment in which the chip holding portion 21 is detected to substantially reach the height position of the transparent plate upper surface 41 while the chip holding portion 21 is brought close to the transparent plate upper surface 41 has been described, but the height position in which the chip holding portion 21 is substantially separated from the transparent plate upper surface 41 (the holding of the transparent plate upper surface 41 is released) can also be detected in the direction in which the chip holding portion 21 is separated from the transparent plate upper surface 41. That is, after the chip holding portion 21 is brought into a state of close contact with the transparent plate 41 until the pressure applied to the transparent plate 41 reaches a predetermined value, the pickup tool 2 may be driven so that the chip holding portion 21 is separated from the transparent plate upper surface 41, and an image may be acquired by the imaging unit 5 in association with the movement distance. By this method, it is known that the chip holding portion 21 is substantially spaced from the transparent plate upper surface 41 at a height position, and if the chip holding portion 21 and the transparent plate upper surface 41 approach from the height position, effective holding can be performed.
In addition, when the focus of the photographing unit 5 is brought into focus on the transparent plate upper surface 41, as shown in fig. 5 (a), a focusing jig 6 with a mark 6M for focusing may be used. Here, as shown in fig. 5 (b), a plurality of marks 6M are arranged on the focusing jig 6, and if alignment is performed in a state where the plurality of marks 6M are in the field of view of the imaging unit 5, optical axis alignment can be performed perpendicularly to the transparent plate upper surface 41.
By aligning the optical axis of the photographing unit 5 perpendicularly to the transparent plate upper surface 41, it is also possible to evaluate the parallelism of the region formed by the plurality of chip holding parts 21 and the transparent plate upper surface 41. That is, when the region formed by the plurality of chip holding portions 21 is inclined with respect to the transparent plate upper surface 41, a difference occurs in contrast of the image I21 of the plurality of chip holding portions 21 in the field of view. Fig. 6 shows this, and it is known that the chip holding portion 21A corresponding to the image I21A and the chip holding portion 21B corresponding to the image I21B differ in the distance from the transparent plate upper surface 41. Further, since the distance between the chip holding portion 21B and the transparent plate upper surface 41 is larger than that of the chip holding portion 21A, adjustment of the inclination or the like of the pickup tool 2 can be performed with reference to the image.
Although the present embodiment has been described above on the premise that the flexible member 21S is used for the chip holding portion 21, the present invention is not limited to this, and the present invention can be applied to the chip holding portion 21 without using the flexible member 21S. That is, if the surface holding the chip member C is flat without using the flexible member 21S, the evaluation item (such as contrast) of the image acquired by the imaging unit 5 immediately after the chip holding portion 21 is brought into contact with the transparent plate upper surface 41 reaches the criterion, and therefore, the device can be used for tool height adjustment.
As described above, by using the tool height adjustment device of the present invention in the chip component transfer device that picks up a chip component from the transfer source substrate held by the transfer source stage 3 shown in fig. 4 and transfers the chip component onto the transfer target substrate, even if the chip component is minute, the chip component can be accurately held and transferred without breakage.
Description of the reference numerals
1: A tool height adjusting device; 2: picking up a tool; 3: a transfer source stage; 4: a transparent plate; 5: a photographing unit; 6: a focusing jig; 7: a laser length measuring device; 10: a control unit; 21: a chip holding section; 21S: a soft member; 31: the upper surface of the transfer printing source carrier; 41: the upper surface of the transparent plate; 50: a photographing device; 51: a prism; 61: the lower surface of the focusing jig; b0: transferring the source substrate; b1: transferring the target substrate; c: a chip component; i21: chip holding part image.
Claims (6)
1. A tool height adjusting device adjusts a height position of a chip holding portion of a pick-up tool for picking up a chip component by moving the chip holding portion up and down,
The tool height adjusting device comprises:
a transparent plate;
an imaging unit that acquires an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and
A control unit having a function of controlling up-and-down driving of the pickup tool, a function of controlling an operation of the photographing unit, and a function of analyzing a contrast of an image acquired by the photographing unit,
The control unit analyzes the contrast of the image obtained by the photographing unit while approaching the chip holding portion to the transparent plate direction, thereby detecting the height position of the upper surface of the transparent plate effectively held by the chip holding portion,
The control unit has the following functions: the parallelism of the region formed by the plurality of chip holding portions with respect to the upper surface of the transparent plate is evaluated by analyzing the contrast of the image acquired by the imaging unit.
2. A tool height adjusting device adjusts a height position of a chip holding portion of a pick-up tool for picking up a chip component by moving the chip holding portion up and down,
The tool height adjusting device comprises:
a transparent plate;
an imaging unit that acquires an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and
A control unit having a function of controlling up-and-down driving of the pickup tool, a function of controlling an operation of the photographing unit, and a function of analyzing a contrast of an image acquired by the photographing unit,
The control means temporarily adheres the chip holding portion to the transparent plate, and detects the height position of the upper surface of the transparent plate by analyzing the contrast of the image acquired by the imaging means while driving a pickup tool in a direction to separate the chip holding portion from the transparent plate.
3. The tool height adjustment device according to claim 2, wherein,
The tool height adjusting device adjusts the height position of a chip holding portion of a pick-up tool provided with a plurality of chip holding portions.
4. The tool height adjusting apparatus according to claim 3, wherein,
The control unit has the following functions: the parallelism of the region formed by the plurality of chip holding portions with respect to the upper surface of the transparent plate is evaluated by analyzing the contrast of the image acquired by the imaging unit.
5. The tool height adjusting apparatus according to any one of claims 1 to 4, wherein,
The tool height adjusting device adjusts the height position of a chip holding part of a pick-up tool using a flexible member in the chip holding part.
6. A chip component transfer apparatus which picks up a chip component from a transfer source substrate and mounts the chip component on a transfer target substrate, wherein,
The chip component transfer apparatus has the tool height adjustment apparatus according to any one of claims 1 to 5 for adjusting the height position of the chip holding portion of the pick-up tool that picks up the chip component from the transfer source substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-061143 | 2018-03-28 | ||
| JP2018061143A JP6752250B2 (en) | 2018-03-28 | 2018-03-28 | Tool height adjustment device and chip component transfer device equipped with this |
| PCT/JP2019/011063 WO2019188470A1 (en) | 2018-03-28 | 2019-03-18 | Tool height adjustment device and chip component transfer device equipped with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111868901A CN111868901A (en) | 2020-10-30 |
| CN111868901B true CN111868901B (en) | 2024-06-21 |
Family
ID=
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH707308A1 (en) * | 2012-12-05 | 2014-06-13 | Esec Ag | Method for determining height of adhesive dispensing nozzle over reference surface, involves checking image of plate until image dark area meets preset criterion, and setting detected corresponding height of nozzle as reference height |
| WO2015083221A1 (en) * | 2013-12-02 | 2015-06-11 | 富士機械製造株式会社 | Die supply device adjustment system and adjustment jig |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH707308A1 (en) * | 2012-12-05 | 2014-06-13 | Esec Ag | Method for determining height of adhesive dispensing nozzle over reference surface, involves checking image of plate until image dark area meets preset criterion, and setting detected corresponding height of nozzle as reference height |
| WO2015083221A1 (en) * | 2013-12-02 | 2015-06-11 | 富士機械製造株式会社 | Die supply device adjustment system and adjustment jig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI740966B (en) | Apparatus and method for automatically setting, calibrating and monitoring or measuring pickup head position and force during component pickup operations | |
| EP3425661B1 (en) | Chip bonding apparatus and method | |
| CN106920762B (en) | Semiconductor manufacturing apparatus, semiconductor device manufacturing method, and chip mounter | |
| CN107079619B (en) | Mounting device and measuring method | |
| CN108364880B (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| CN109824253B (en) | Substrate cutting device | |
| TW202201592A (en) | Equipment and method for transferring workpieces including a carrying apparatus, a pressing apparatus, a peeling apparatus and a controlling apparatus | |
| TWI754482B (en) | Component Mounting Device | |
| CN111868901B (en) | Tool height adjusting device and chip component transfer device having the same | |
| KR100478556B1 (en) | Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel | |
| JP2002118153A (en) | Method of manufacturing and apparatus for mounting electronic component | |
| US20200365430A1 (en) | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | |
| JP7218405B2 (en) | Chip parts transfer device | |
| KR102633517B1 (en) | Tool height adjustment device and chip component transfer device equipped with the same | |
| JP6938738B2 (en) | Chip parts transfer device | |
| TW201508957A (en) | Phosphor film pick-up apparatus for LED chip | |
| JPH05208390A (en) | Suction nozzle | |
| JP2003118859A (en) | Device and method for extracting flexible tabular body | |
| CN112771653B (en) | Compliant die attach tool, die attach system, and method of using the same | |
| JP2001127421A (en) | Ball mounter and mounting method | |
| JPWO2019008674A1 (en) | Component mounting equipment | |
| TW202339020A (en) | Contact position setting device, mounting device, and contact position setting method capable of setting a contact reference height position for a holding portion to contact a contact object while suppressing deviation | |
| KR102543043B1 (en) | Support body separation device and support body separation method | |
| CN116895559A (en) | Contact position setting device, mounting device, and contact position setting method | |
| JP6647014B2 (en) | Support separating apparatus and support separating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |