TW201508957A - Phosphor film pick-up apparatus for LED chip - Google Patents

Abstract

The disclosed phosphor film pick-up apparatus for an LED chip detaches the phosphor film attached on the tape from the tape, characterized in: having a supporting body formed by sucking holes for sucking a lower surface of the tape attached with the phosphor film, and having a contact pin contacting with the lower surface of the tape that is sucked on the supporting body. The contact pin scratches the lower surface of the tape attached with the phosphor film so as to detach the phosphor film from the tape. The phosphor film pick-up apparatus for an LED chip further includes a scratching member, a moving member and a pick-up head. The scratching member is horizontally-slidably disposed on the supporting body. The moving member moves the scratching member relative to the supporting body along the horizontal direction. The pick-up head is supported on the upper side of the supporting body. By the contacting pin of the scratching member, the pick-up head rises after the phosphor film detached from the tape is sucked, so as to detach the phosphor film.

Description

Fluorescent film pickup device for LED wafer

The present invention relates to a fluorescent film pick-up device for an LED chip, and more particularly to a fluorescent film for an LED chip which is provided by separating a plurality of fluorescent films attached to a tape and then arranging the same on a package or a substrate. Pick up device.

In the state where the fluorescent film is attached to the adhesive tape, the respective fluorescent films are sawed and then transferred to the next process with the tape.

As shown in FIG. 1, a plurality of fluorescent films (P) attached to the tape (T) state are sequentially separated from the tape (T) and then attached to the LED wafer. Therefore, the fluorescent film (F) is attached to the LED wafer so that an LED element that emits white light can be manufactured. The method of attaching the fluorescent film (F) to the LED wafer to the LED chip and then manufacturing the LED element than the liquid synthetic resin in which the fluorescent substance powder is mixed has an advantage that the thickness of the phosphor can be more precisely adjusted.

In recent years, LED chips have been miniaturized, so that the size of the fluorescent film (P) attached to the LED chips is also small, and the material of the fluorescent film is also soft.

Therefore, in order to attach a small and soft fluorescent film (F) to the LED wafer, there is a need for a device that can effectively separate the fluorescent film from the tape (T).

The present invention is an invention which is produced as described above in order to solve the necessity thereof, and an object of the present invention is to provide a case where a fluorescent film is attached to a soft film or a small fluorescent film attached to a tape. A fluorescent film pickup device for LED wafers in which the structure of the fluorescent film can be easily separated from the tape.

In order to achieve the above object, a fluorescent film pick-up device for an LED chip according to the present invention is a fluorescent film pick-up device for LED wafers which is detached from a tape by a fluorescent film attached to a tape, and is characterized in that: a support body formed by the suction hole for absorbing the adhesive film attached to the fluorescent film; and a contact pin having contact with the lower surface of the adhesive tape affixed to the support body, the contact pin scraping the underside of the adhesive tape attached to the fluorescent film Therefore, the fluorescent film may be separated from the tape; and include a scraping member, an actuating member, and a pick-up head, the scraping member being slidably disposed in the horizontal direction on the support body; and the actuating member leveling the scraping member against the support body The direction is moved; the pickup head is disposed on the upper side of the support body, and the fluorescent film separated from the tape is sucked by the contact pin of the scraping member, and then raised, and the fluorescent film is detached.

As described above, in order to achieve the above object, the fluorescent film pick-up device for an LED chip of the present invention has a detaching effect of separating it from the tape without damaging the fluorescent film having a small size.

Further, the fluorescent film pick-up device for an LED chip of the present invention has an effect that the fluorescent film adhered to the tape having a high softness and a small thickness can be effectively separated from the tape.

10‧‧‧Support

11‧‧‧Sucking holes

12‧‧‧ OD

13‧‧‧ recess

15‧‧‧vacuum path

20‧‧‧Scraping members

21‧‧‧Contact needle

22‧‧‧2nd inclined surface

30‧‧‧actuating components

31‧‧‧ Push components

311‧‧‧1st inclined surface

32‧‧‧Flexible components

40‧‧‧ pick up head

41‧‧‧Sucking sleeve

42‧‧‧Sucking path

43‧‧‧ Collet

T‧‧‧ Tape

P‧‧‧Flame film

Fig. 1 is a cross-sectional view showing a state in which a fluorescent film is attached to a tape.

2 to 5 are cross-sectional views illustrating a fluorescent film pickup device for an LED wafer according to a first embodiment of the present invention.

Hereinafter, a fluorescent film pickup device for an LED wafer according to the present invention will be described in detail with reference to the drawings.

2 to 5 are cross-sectional views illustrating a fluorescent film pickup device for an LED wafer according to a first embodiment of the present invention.

As shown in FIG. 2, the fluorescent film pick-up device for an LED wafer of the present embodiment includes a support body (10), a scraping member (20), an actuating member (30), and a pick-up head (40).

The tape (T) to which the fluorescent film (P) is attached is disposed and supported on the upper surface of the support (10). A suction hole (11) is formed on the upper surface of the support body (10), and the support body (10) The central portion forms a vacuum passage (15) that is coupled to the suction hole (11). The tape (T) is fixed to the upper surface of the support body (10) by a vacuum transmitted through the suction hole (11).

An outer diameter portion (12) is formed on the outer periphery of the upper surface of the support body (10). The upper portion of the support body (10) surrounded by the outer diameter portion (12) is a recessed portion (13). The recess (13) is formed lower than the outer diameter portion (12). The outer diameter portion (12) supports the fluorescent film (P) attached to the periphery of the fluorescent film (P) on the tape (T), and the concave portion (13) sucks and supports the portion of the tape attached to the fluorescent film (P) ( T).

The scraping member (20) is provided with a contact pin (21), and the support body (10) is slidably disposed in the horizontal direction. The contact pin (21) is configured to protrude from the upper concave portion (13) of the support body (10) so as to be in contact with the underside of the tape (T). When the scraping member (20) is horizontally moved by the support body (10), the fluorescent film (P) is separated from the tape (T) by scraping the underside of the tape (T) with the contact pin (21).

The actuating member (30) is disposed on the support body (10), and moves the scraping member (20) in the horizontal direction with respect to the support body (10). In the present embodiment, the actuating member (30) is provided with a push member (31) and an elastic member (32). The pushing member (31) pushes and moves the scraping member (20) in the horizontal direction with respect to the support body (10). The elastic member (32) pushes the scraping member (20) moving in one direction by the pushing member (31) to the opposite side direction to return to the original position.

The push member (31) is formed with a first inclined surface (311) which is formed to be inclined with respect to the vertical direction, and the scraping member (20) is formed to face the first inclined surface (311) and to be inclined with the first inclined surface ( 311) The second inclined surface (22) formed is inclined at the same angle. When the push member (31) moves up and down, it is scraped relative to the first inclined surface (311) The second inclined surface (22) of the member (20) horizontally moves the scraping member (20) relative to the support (10) by sliding.

The elastic member (32) is disposed between the push member (31) and the support (10). When the push member (31) is raised, the elastic member (32) is elastically compressed by the movement of the scraping member (20). When the push member (31) is lowered, the elastic member (32) is elastically restored, so that the scraping member (20) is horizontally moved to the original position.

The pickup head (40) is disposed on the upper side of the support body (10) and is movable up and down. After the pickup head (40) is lowered, the fluorescent film (P) separated from the tape (T) is sucked by the contact pin (21) of the scraping member (20). The pickup head (40) rises while sucking the fluorescent film (P), and detaches the fluorescent film (P) from the tape (T). The pickup head (40) attaches the separated fluorescent film (P) to the LED wafer disposed on the substrate, the package, the lead frame, and the like, and then returns to the next fluorescent film (P). Detach from the tape (T).

The pickup head (40) is provided with a collet (43) and a cap (41). The collet (43) is formed in a cylindrical shape, and a vacuum is transmitted through a suction path (42) inside thereof. A suction sleeve (41) is placed at the end of the collet (43), and a vacuum (P) is sucked from the suction path (42) by a suction sleeve (41) made of a porous material.

As described above, the operation of the LED wafer fluorescent film pickup device will be described next.

As shown in Fig. 2, the tape (T) to which the fluorescent film (P) is attached is sucked on the upper side of the support (10). At this time, in consideration of the position of the fluorescent film (P) to be detached, the fluorescent film (P) is placed in the center of the concave portion (13), and passed. The suction hole (11) conveys the vacuum and sucks the tape (T).

As in the state in which the tape (T) is sucked, as shown in FIG. 3, the pickup head (40) is lowered to be disposed on the upper side close to the fluorescent film (P), or is disposed in the contactable fluorescent film (P). One end.

As shown in Fig. 3, the contact pin (21) of the scraping member (20) is protruded from the concave portion (13), and one side of the fluorescent film (P) can be lifted to come into contact with the tape (T).

In the same state, as shown in FIG. 4, the push member (31) is raised, and the scraping member (20) moves to the right side by the interaction of the first inclined surface (311) and the second inclined surface (22). At this time, the elastic member (32) is elastically compressed.

When the scraping member (20) moves to the right side, the contact pin scrapes the tape on the lower side of the fluorescent film (P) and moves. Due to the action of the contact pin (21), the contact faces of the fluorescent film (P) and the tape (T) are separated, and the fluorescent film (P) is acted upon by the vacuum applied to the absorbing sleeve (41) of the pickup head (40). Suck on the pickup head (40). Conversely, the tape (T) separated from the fluorescent film (P) is sucked on the upper surface of the concave portion (13) by the vacuum transmitted by the suction hole (11) of the support (10).

As shown in Fig. 5, the pickup head (40) rises in a state in which the phosphor film (P) is sucked, and the phosphor film (P) is transferred to the next step for bonding of the phosphor film (P). When the push member (31) is lowered, the elastic member (32) is elastically restored, and after the scraping member (20) is pushed to the left side, it is moved toward the position for separating the next fluorescent film (P).

Depending on the situation, before the push member (31) is lowered, the vacuum of the support (10) is released, and the tape (T) is detached to the next fluorescent film (P). The position is moved, and in the state in which the tape (T) is sucked, the push member (31) can be lowered. In this case, the scraping member (20) moves to the left side by the action of the elastic member (32), and the tape (T) at the position where the fluorescent film (P) is attached is scraped off. Naturally, the fluorescent film (P) is separated from the tape (T) so that the pickup head (40) receives the fluorescent film (P).

As described above, the present invention is described as a suitable example, and the scope of the present invention is not limited to the contents as described and illustrated.

For example, the above-described actuating member (30) is described as an example including the push member (31) and the elastic member (32), and an actuating member (30) having a different structure may be used. That is, any configuration can be used as the actuating member as long as the scraping member reciprocates the support body in the horizontal direction. For example, an air pressure actuator connected to the scraping member can also be used as an actuating member.

Further, it has been explained above that the upper surface of the support body (10) is constituted by the outer diameter portion (12) and the concave portion (13), and may be constituted by a support body having a planar structure regardless of the height difference.

Further, the pick-up head (40) has been described as being provided with a absorbing sleeve (41) of a porous material, and a pick-up head having no absorbing sleeve may be used. That is, the pickup head may be configured such that the suction path is exposed to the lower surface and the fluorescent film is sucked under the pickup head.

10‧‧‧Support

11‧‧‧Sucking holes

12‧‧‧ OD

13‧‧‧ recess

15‧‧‧vacuum path

20‧‧‧Scraping members

21‧‧‧Contact needle

22‧‧‧2nd inclined surface

30‧‧‧actuating components

31‧‧‧ Push components

311‧‧‧1st inclined surface

32‧‧‧Flexible components

40‧‧‧ pick up head

41‧‧‧Sucking sleeve

42‧‧‧Sucking path

43‧‧‧ Collet

T‧‧‧ Tape

P‧‧‧Flame film

Claims (9)

A fluorescent film pick-up device for LED wafers for separating a fluorescent film from a tape for attaching to a fluorescent film, the fluorescent film pick-up device for LED chips comprising: a support body forming a suction hole a lower surface of the adhesive tape to which the fluorescent film is attached; a contact pin contacting the lower surface of the adhesive tape sucked to the support; and a scraping member slidably disposed in the horizontal direction to the support body so as to adhere thereto The underside of the tape of the fluorescent film is separated from the tape after being cut by the contact pin; and the actuating member moves the scraping member in a horizontal direction with respect to the support; And a pick-up head disposed on an upper side of the support, and the fluorescent film separated from the adhesive tape is sucked and raised by a contact pin of the scraping member to separate the fluorescent film. The fluorescent film pick-up device for an LED wafer according to claim 1, wherein the actuating member comprises a pushing member and an elastic member, the pushing member directing the scraping member with respect to the support body along a horizontal side When the pusher moves, the elastic member restores the scraping member that is moved in one direction by the push member in the opposite direction. The fluorescent film pick-up device for an LED chip according to claim 2, wherein the pushing member of the actuating member is movable up and down, and includes a first inclined surface formed to be inclined in a vertical direction. The scraping member is disposed on the support body, and is in contact with the first inclined surface of the push member, and is slidably moved relative to the first inclined surface. The fluorescent film pick-up device for LED wafer according to claim 3, wherein the scraping member includes a second inclined surface, and the second inclined surface is formed to be in contact with the first inclined surface of the push member. And sliding relative to the first inclined surface. The fluorescent film pick-up device for an LED chip according to any one of claims 2 to 4, wherein the elastic member is disposed between the push member and the support body, and the push member is elastically compressed when it is raised. When the push member is lowered, the elasticity is restored to move the scraping member horizontally. The fluorescent film pick-up device for an LED wafer according to any one of claims 1 to 4, wherein an upper end of the contact pin of the scraping member protrudes higher than an upper surface of the support body adjacent to the periphery. The fluorescent film pick-up device for an LED wafer according to claim 6, wherein the upper surface of the support body includes an outer diameter portion and a concave portion, and the outer diameter portion supports the tape to which the fluorescent film is attached. Around the fluorescent film, the concave portion is formed lower than the outer diameter portion, and sucks a tape to which a portion of the fluorescent film is attached, and a contact pin of the scraping member is formed to be opposed to the support body The recess is prominent. The fluorescent film pick-up device for an LED wafer according to any one of claims 1 to 4, wherein the pick-up head is in a state of being lowered to a position close to a fluorescent film attached to the tape, The contact pin of the scraping member is horizontally moved relative to the underside of the tape at the attachment position of the fluorescent film, and the fluorescent film is separated from the tape and transmitted to the pickup head. The fluorescent film pick-up device for an LED wafer according to claim 1, wherein the pick-up head comprises a collet and a absorbing sleeve, the collet forming a absorbing path for conveying a vacuum, the absorbing sleeve being The porous material is formed and disposed at a terminal portion of the collet, and a vacuum is received from the absorbing path to be able to suck the fluorescent film.