TW201508957A - Phosphor film pick-up apparatus for LED chip - Google Patents
Phosphor film pick-up apparatus for LED chip Download PDFInfo
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Abstract
Description
本發明是有關於一種LED晶片用螢光膜拾取裝置,更明確地說,是將附着於膠帶上的多個螢光膜分離後將其配置於封裝或基板上供給的LED晶片用螢光膜拾取裝置。 The present invention relates to a fluorescent film pick-up device for an LED chip, and more particularly to a fluorescent film for an LED chip which is provided by separating a plurality of fluorescent films attached to a tape and then arranging the same on a package or a substrate. Pick up device.
在螢光膜附着在具有黏着力的膠帶的狀態下,切削(sawing)各個螢光膜然後與膠帶傳遞到下一個製程。 In the state where the fluorescent film is attached to the adhesive tape, the respective fluorescent films are sawed and then transferred to the next process with the tape.
如圖1所示,附着於膠帶(T)狀態的多個螢光膜(P)逐一順序地從膠帶(T)分離然後附着於LED晶片。因此,將螢光膜(F)附着於LED晶片從而可以製造發出白色光的LED元件。將螢光膜(F)附着於LED晶片的方法比將螢光物質粉末混合的液體合成樹脂外敷於LED晶片然後製造LED元件的方法,有著可以更精確地調整螢光體厚度的優點。 As shown in FIG. 1, a plurality of fluorescent films (P) attached to the tape (T) state are sequentially separated from the tape (T) and then attached to the LED wafer. Therefore, the fluorescent film (F) is attached to the LED wafer so that an LED element that emits white light can be manufactured. The method of attaching the fluorescent film (F) to the LED wafer to the LED chip and then manufacturing the LED element than the liquid synthetic resin in which the fluorescent substance powder is mixed has an advantage that the thickness of the phosphor can be more precisely adjusted.
近年來,LED晶片趨於小型化,從而附着於LED晶片的螢光膜(P)的大小也變得很小,而螢光膜的材質也有柔軟度變強的情形。 In recent years, LED chips have been miniaturized, so that the size of the fluorescent film (P) attached to the LED chips is also small, and the material of the fluorescent film is also soft.
因此,為了將一個小且柔軟度較強的螢光膜(F)附着於LED晶片,因此需要有可以從膠帶(T)有效地分離螢光膜的裝置。 Therefore, in order to attach a small and soft fluorescent film (F) to the LED wafer, there is a need for a device that can effectively separate the fluorescent film from the tape (T).
本發明是如上所述為了解決其必要性而產出的發明,本發明的目的是,提供即使在螢光膜附着於柔軟度較強的膠帶或附着在膠帶的較小螢光膜的情況下,也能從膠帶可以很容易地分離螢光膜的結構的LED晶片用螢光膜拾取裝置。 The present invention is an invention which is produced as described above in order to solve the necessity thereof, and an object of the present invention is to provide a case where a fluorescent film is attached to a soft film or a small fluorescent film attached to a tape. A fluorescent film pickup device for LED wafers in which the structure of the fluorescent film can be easily separated from the tape.
為了解決上述目的,本發明的LED晶片用螢光膜拾取裝置為,將附着在膠帶上的螢光膜,從膠帶上分離(detaching)的LED晶片用螢光膜拾取裝置,其特徵在於:具備為了吸着所述螢光膜附着的膠帶下面,由吸着孔形成的支撐體;以及具備與吸着於上述支撐體的膠帶的下面接觸的接觸針,上述接觸針刮削上述螢光膜附着的膠帶的下面,從而可將上述螢光膜從上述膠帶分離;並包含刮削構件、作動構件以及拾取頭,刮削構件在水平方向上可滑動地配置於支撐體;作動構件將上述刮削構件針對上述支撐體往水平方向移動;拾取頭配置於上述支撐體的上側,藉由上述刮削構件的接觸針,將從上述膠帶分離的螢光膜吸著之後上升,使上述螢光膜分離(detaching)。 In order to achieve the above object, a fluorescent film pick-up device for an LED chip according to the present invention is a fluorescent film pick-up device for LED wafers which is detached from a tape by a fluorescent film attached to a tape, and is characterized in that: a support body formed by the suction hole for absorbing the adhesive film attached to the fluorescent film; and a contact pin having contact with the lower surface of the adhesive tape affixed to the support body, the contact pin scraping the underside of the adhesive tape attached to the fluorescent film Therefore, the fluorescent film may be separated from the tape; and include a scraping member, an actuating member, and a pick-up head, the scraping member being slidably disposed in the horizontal direction on the support body; and the actuating member leveling the scraping member against the support body The direction is moved; the pickup head is disposed on the upper side of the support body, and the fluorescent film separated from the tape is sucked by the contact pin of the scraping member, and then raised, and the fluorescent film is detached.
如上所述,為了達成上述目標,本發明LED晶片用螢光膜拾取裝置,具有在不損壞大小較小的螢光膜的情況下,將其從膠帶分離的分離(detaching)效果。 As described above, in order to achieve the above object, the fluorescent film pick-up device for an LED chip of the present invention has a detaching effect of separating it from the tape without damaging the fluorescent film having a small size.
此外,本發明LED晶片用螢光膜拾取裝置,具有如下效果:附著在柔軟度強、厚度薄的膠帶的螢光膜,也可以有效地將其從膠帶上分離。 Further, the fluorescent film pick-up device for an LED chip of the present invention has an effect that the fluorescent film adhered to the tape having a high softness and a small thickness can be effectively separated from the tape.
10‧‧‧支撐體 10‧‧‧Support
11‧‧‧吸着孔 11‧‧‧Sucking holes
12‧‧‧外徑部 12‧‧‧ OD
13‧‧‧凹部 13‧‧‧ recess
15‧‧‧真空路徑 15‧‧‧vacuum path
20‧‧‧刮削構件 20‧‧‧Scraping members
21‧‧‧接觸針 21‧‧‧Contact needle
22‧‧‧第2傾斜面 22‧‧‧2nd inclined surface
30‧‧‧作動構件 30‧‧‧actuating components
31‧‧‧推構件 31‧‧‧ Push components
311‧‧‧第1傾斜面 311‧‧‧1st inclined surface
32‧‧‧彈性構件 32‧‧‧Flexible components
40‧‧‧拾取頭 40‧‧‧ pick up head
41‧‧‧吸着套 41‧‧‧Sucking sleeve
42‧‧‧吸着路徑 42‧‧‧Sucking path
43‧‧‧筒夾 43‧‧‧ Collet
T‧‧‧膠帶 T‧‧‧ Tape
P‧‧‧螢光膜 P‧‧‧Flame film
圖1為繪示螢光膜附着於膠帶狀態的剖面圖。 Fig. 1 is a cross-sectional view showing a state in which a fluorescent film is attached to a tape.
圖2至圖5為說明根據本發明中第1實施例的LED晶片用螢光膜拾取裝置的剖面圖。 2 to 5 are cross-sectional views illustrating a fluorescent film pickup device for an LED wafer according to a first embodiment of the present invention.
以下,以參照圖式而詳細說明根據本發明的LED晶片用螢光膜拾取裝置。 Hereinafter, a fluorescent film pickup device for an LED wafer according to the present invention will be described in detail with reference to the drawings.
圖2至圖5為說明根據本發明中第1實施例的LED晶片用螢光膜拾取裝置的剖面圖。 2 to 5 are cross-sectional views illustrating a fluorescent film pickup device for an LED wafer according to a first embodiment of the present invention.
如圖2所示,本實施例的LED晶片用螢光膜拾取裝置具備支撐體(10),刮削構件(20),作動構件(30)以及拾取頭(40)。 As shown in FIG. 2, the fluorescent film pick-up device for an LED wafer of the present embodiment includes a support body (10), a scraping member (20), an actuating member (30), and a pick-up head (40).
附着著螢光膜(P)的膠帶(T)配置並支撐於支撐體(10)的上面。在支撐體(10)的上面上形成吸着孔(11),在支撐體(10) 的中心部形成與吸着孔(11)連結的真空通路(15)。藉由通過吸着孔(11)傳遞的真空,膠帶(T)固定於支撐體(10)的上面。 The tape (T) to which the fluorescent film (P) is attached is disposed and supported on the upper surface of the support (10). A suction hole (11) is formed on the upper surface of the support body (10), and the support body (10) The central portion forms a vacuum passage (15) that is coupled to the suction hole (11). The tape (T) is fixed to the upper surface of the support body (10) by a vacuum transmitted through the suction hole (11).
在支撐體(10)的上面外周形成外徑部(12)。以外徑部(12)包圍的支撐體(10)上面部分為凹部(13)。凹部(13)形成得比外徑部(12)低。外徑部(12)支撐螢光膜(P)附着於膠帶(T)上的螢光膜(P)的周圍,凹部(13)吸著並支撐附着螢光膜(P)的部分的膠帶(T)。 An outer diameter portion (12) is formed on the outer periphery of the upper surface of the support body (10). The upper portion of the support body (10) surrounded by the outer diameter portion (12) is a recessed portion (13). The recess (13) is formed lower than the outer diameter portion (12). The outer diameter portion (12) supports the fluorescent film (P) attached to the periphery of the fluorescent film (P) on the tape (T), and the concave portion (13) sucks and supports the portion of the tape attached to the fluorescent film (P) ( T).
刮削構件(20)具備接觸針(21),支撐體(10)沿著水平方向可滑動地被配置。接觸針(21)配置為相對支撐體(10)的上面凹部(13)突出,從而接觸於膠帶(T)的下面。刮削構件(20)針對支撐體(10)水平移動時,以接觸針(21)刮削膠帶(T)的下面而從膠帶(T)分離螢光膜(P)。 The scraping member (20) is provided with a contact pin (21), and the support body (10) is slidably disposed in the horizontal direction. The contact pin (21) is configured to protrude from the upper concave portion (13) of the support body (10) so as to be in contact with the underside of the tape (T). When the scraping member (20) is horizontally moved by the support body (10), the fluorescent film (P) is separated from the tape (T) by scraping the underside of the tape (T) with the contact pin (21).
作動構件(30)配置於支撐體(10),將刮削構件(20)相對支撐體(10)沿著水平方向移動。在本實施例作動構件(30)具備推構件(31)以及彈性構件(32)。推構件(31)將刮削構件(20)相對支撐體(10)沿著水平方向推動並移動。彈性構件(32)藉由推構件(31)將往一側方向移動的刮削構件(20)推向相反側方向而恢復到原位置。 The actuating member (30) is disposed on the support body (10), and moves the scraping member (20) in the horizontal direction with respect to the support body (10). In the present embodiment, the actuating member (30) is provided with a push member (31) and an elastic member (32). The pushing member (31) pushes and moves the scraping member (20) in the horizontal direction with respect to the support body (10). The elastic member (32) pushes the scraping member (20) moving in one direction by the pushing member (31) to the opposite side direction to return to the original position.
在推構件(31)形成著相對垂直方向傾斜所形成的第1傾斜面(311),在刮削構件(20)形成著與第1傾斜面(311)相面對、並與第1傾斜面(311)以相同角度傾斜所形成的第2傾斜面(22)。推構件(31)升降時,相對於第1傾斜面(311)刮削 構件(20)的第2傾斜面(22)因滑動而使刮削構件(20)相對支撐體(10)水平移動。 The push member (31) is formed with a first inclined surface (311) which is formed to be inclined with respect to the vertical direction, and the scraping member (20) is formed to face the first inclined surface (311) and to be inclined with the first inclined surface ( 311) The second inclined surface (22) formed is inclined at the same angle. When the push member (31) moves up and down, it is scraped relative to the first inclined surface (311) The second inclined surface (22) of the member (20) horizontally moves the scraping member (20) relative to the support (10) by sliding.
彈性構件(32)配置在推構件(31)跟支撐體(10)之間。若推構件(31)上升時,因刮削構件(20)的移動會使彈性構件(32)彈性壓縮。若推構件(31)下降時,彈性構件(32)彈性復原,使得刮削構件(20)往原位置水平移動。 The elastic member (32) is disposed between the push member (31) and the support (10). When the push member (31) is raised, the elastic member (32) is elastically compressed by the movement of the scraping member (20). When the push member (31) is lowered, the elastic member (32) is elastically restored, so that the scraping member (20) is horizontally moved to the original position.
拾取頭(40)配置在支撐體(10)上側並可升降。拾取頭(40)下降後,藉由刮削構件(20)的接觸針(21)而將自膠帶(T)分離的螢光膜(P)吸着。拾取頭(40)在吸着着螢光膜(P)狀態下上升,把螢光膜(P)從膠帶(T)分離(detaching)。拾取頭(40)將分離的螢光膜(P)附着在配置於基板、封裝(package)、引脚架(lead frame)等的LED晶片上之後,再回來對下一個螢光膜(P)從膠帶(T)分離(detaching)。 The pickup head (40) is disposed on the upper side of the support body (10) and is movable up and down. After the pickup head (40) is lowered, the fluorescent film (P) separated from the tape (T) is sucked by the contact pin (21) of the scraping member (20). The pickup head (40) rises while sucking the fluorescent film (P), and detaches the fluorescent film (P) from the tape (T). The pickup head (40) attaches the separated fluorescent film (P) to the LED wafer disposed on the substrate, the package, the lead frame, and the like, and then returns to the next fluorescent film (P). Detach from the tape (T).
拾取頭(40)具備筒夾(collet)(43)及吸着套(cap)(41)。筒夾(43)形成為圓筒型,通過其內部的吸着路徑(42)傳遞真空。在筒夾(43)的末端上配置吸着套(41),以多孔性材質形成的吸着套(41)從吸着路徑(42)傳遞真空後,吸着螢光膜(P)。 The pickup head (40) is provided with a collet (43) and a cap (41). The collet (43) is formed in a cylindrical shape, and a vacuum is transmitted through a suction path (42) inside thereof. A suction sleeve (41) is placed at the end of the collet (43), and a vacuum (P) is sucked from the suction path (42) by a suction sleeve (41) made of a porous material.
如上述,接下來針對LED晶片螢光膜拾取裝置的運作進行說明。 As described above, the operation of the LED wafer fluorescent film pickup device will be described next.
如圖2所示,附着螢光膜(P)的膠帶(T)被吸着在支撐體(10)上側。這時,考慮到即將分離(detaching)的螢光膜(P)的位置,在螢光膜(P)配置於凹部(13)的中央的狀態下,通過 吸着孔(11)傳達真空而吸着膠帶(T)。 As shown in Fig. 2, the tape (T) to which the fluorescent film (P) is attached is sucked on the upper side of the support (10). At this time, in consideration of the position of the fluorescent film (P) to be detached, the fluorescent film (P) is placed in the center of the concave portion (13), and passed. The suction hole (11) conveys the vacuum and sucks the tape (T).
如同,在膠帶(T)吸着的狀態上,如圖3所示,使得拾取頭(40)下降而配置在離螢光膜(P)接近的上側,或配置在可接觸螢光膜(P)的一端。 As in the state in which the tape (T) is sucked, as shown in FIG. 3, the pickup head (40) is lowered to be disposed on the upper side close to the fluorescent film (P), or is disposed in the contactable fluorescent film (P). One end.
如圖3所示,刮削構件(20)的接觸針(21)相對凹部(13)形成突出,可將螢光膜(P)的一側抬起,從而與膠帶(T)接觸。 As shown in Fig. 3, the contact pin (21) of the scraping member (20) is protruded from the concave portion (13), and one side of the fluorescent film (P) can be lifted to come into contact with the tape (T).
在相同狀態下,如圖4所示,使推構件(31)上升,並藉由第1傾斜面(311)和第2傾斜面(22)的相互作用,刮削構件(20)會往右側移動,這時,彈性構件(32)會彈性壓縮。 In the same state, as shown in FIG. 4, the push member (31) is raised, and the scraping member (20) moves to the right side by the interaction of the first inclined surface (311) and the second inclined surface (22). At this time, the elastic member (32) is elastically compressed.
刮削構件(20)往右側移動時,接觸針將螢光膜(P)下側的膠帶刮削後移動。由於接觸針(21)的作用,螢光膜(P)和膠帶(T)的接觸面分離,藉由作用於拾取頭(40)的吸着套(41)的真空,螢光膜(P)被吸着在拾取頭(40)。相反地,與螢光膜(P)分離的膠帶(T)藉由支撐體(10)的吸着孔(11)傳達的真空,吸着在凹部(13)的上面。 When the scraping member (20) moves to the right side, the contact pin scrapes the tape on the lower side of the fluorescent film (P) and moves. Due to the action of the contact pin (21), the contact faces of the fluorescent film (P) and the tape (T) are separated, and the fluorescent film (P) is acted upon by the vacuum applied to the absorbing sleeve (41) of the pickup head (40). Suck on the pickup head (40). Conversely, the tape (T) separated from the fluorescent film (P) is sucked on the upper surface of the concave portion (13) by the vacuum transmitted by the suction hole (11) of the support (10).
如圖5所示,拾取頭(40)以吸着螢光膜(P)的狀態上升,為了該螢光膜(P)的結合(bonding)而將螢光膜(P)傳送至下一個步驟。推構件(31)下降,彈性構件(32)會彈性復原,將刮削構件(20)往左側推之後,朝向為了分離下一個螢光膜(P)的位置而移動。 As shown in Fig. 5, the pickup head (40) rises in a state in which the phosphor film (P) is sucked, and the phosphor film (P) is transferred to the next step for bonding of the phosphor film (P). When the push member (31) is lowered, the elastic member (32) is elastically restored, and after the scraping member (20) is pushed to the left side, it is moved toward the position for separating the next fluorescent film (P).
依不同狀況,推構件(31)下降前,先解除支撐體(10)的真空後,使得膠帶(T)往分離(detaching)下一個螢光膜(P)的 位置移動,在吸着膠帶(T)的狀態下,可使得推構件(31)下降。這種狀況下,藉由彈性構件(32)的作用,刮削構件(20)往左側移動,刮落螢光膜(P)附着的位置上的膠帶(T)。自然而然螢光膜(P)從膠帶(T)分離,從而使拾取頭(40)接收螢光膜(P)。 Depending on the situation, before the push member (31) is lowered, the vacuum of the support (10) is released, and the tape (T) is detached to the next fluorescent film (P). The position is moved, and in the state in which the tape (T) is sucked, the push member (31) can be lowered. In this case, the scraping member (20) moves to the left side by the action of the elastic member (32), and the tape (T) at the position where the fluorescent film (P) is attached is scraped off. Naturally, the fluorescent film (P) is separated from the tape (T) so that the pickup head (40) receives the fluorescent film (P).
如上,對於本發明舉出適合例子做說明,本發明的範圍不能夠限制在如前說明及所示的內容。 As described above, the present invention is described as a suitable example, and the scope of the present invention is not limited to the contents as described and illustrated.
例如,前面所舉的作動構件(30)是以包括推構件(31)和彈性構件(32)的情況作為例子而進行說明,也可使用具備不同構造的作動構件(30)。即,只要是刮削構件對於支撐體往水平方向進行往復運動的構成,任何構成都可作為作動構件而被使用。例如,與刮削構件連接的氣壓促動器(actuator)也可作為作動構件使用。 For example, the above-described actuating member (30) is described as an example including the push member (31) and the elastic member (32), and an actuating member (30) having a different structure may be used. That is, any configuration can be used as the actuating member as long as the scraping member reciprocates the support body in the horizontal direction. For example, an air pressure actuator connected to the scraping member can also be used as an actuating member.
而且,前面已說明支撐體(10)的上面是以外徑部(12)和凹部(13)構成,不管其高度差距,也可以平面構造的支撐體所構成。 Further, it has been explained above that the upper surface of the support body (10) is constituted by the outer diameter portion (12) and the concave portion (13), and may be constituted by a support body having a planar structure regardless of the height difference.
而且,前面已說明拾取頭(40)具備多孔性材質的吸着套(41),也可使用無具備吸着套的拾取頭。即,拾取頭亦可以吸着路徑向下面露出,且在拾取頭下面吸着螢光膜的方式而構成。 Further, the pick-up head (40) has been described as being provided with a absorbing sleeve (41) of a porous material, and a pick-up head having no absorbing sleeve may be used. That is, the pickup head may be configured such that the suction path is exposed to the lower surface and the fluorescent film is sucked under the pickup head.
10‧‧‧支撐體 10‧‧‧Support
11‧‧‧吸着孔 11‧‧‧Sucking holes
12‧‧‧外徑部 12‧‧‧ OD
13‧‧‧凹部 13‧‧‧ recess
15‧‧‧真空路徑 15‧‧‧vacuum path
20‧‧‧刮削構件 20‧‧‧Scraping members
21‧‧‧接觸針 21‧‧‧Contact needle
22‧‧‧第2傾斜面 22‧‧‧2nd inclined surface
30‧‧‧作動構件 30‧‧‧actuating components
31‧‧‧推構件 31‧‧‧ Push components
311‧‧‧第1傾斜面 311‧‧‧1st inclined surface
32‧‧‧彈性構件 32‧‧‧Flexible components
40‧‧‧拾取頭 40‧‧‧ pick up head
41‧‧‧吸着套 41‧‧‧Sucking sleeve
42‧‧‧吸着路徑 42‧‧‧Sucking path
43‧‧‧筒夾 43‧‧‧ Collet
T‧‧‧膠帶 T‧‧‧ Tape
P‧‧‧螢光膜 P‧‧‧Flame film
Claims (9)
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KR1020130098223A KR101503018B1 (en) | 2013-08-20 | 2013-08-20 | Phosphor Film Pick-up Apparatus for LED Chip |
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TW201508957A true TW201508957A (en) | 2015-03-01 |
TWI513059B TWI513059B (en) | 2015-12-11 |
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TW102133078A TWI513059B (en) | 2013-08-20 | 2013-09-13 | Phosphor film pick-up apparatus for led chip |
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JP (1) | JP5775956B2 (en) |
KR (1) | KR101503018B1 (en) |
CN (1) | CN104425333B (en) |
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JP6405200B2 (en) * | 2014-11-14 | 2018-10-17 | アスリートFa株式会社 | Semiconductor chip peeling device |
CN106449513B (en) * | 2016-11-11 | 2023-04-21 | 华南理工大学 | Overheat-preventing CSP fluorescent membrane molding device and method |
KR102654600B1 (en) * | 2018-11-02 | 2024-04-03 | 세메스 주식회사 | Die ejector and die bonding apparatus having the same |
KR102330661B1 (en) * | 2019-12-04 | 2021-11-23 | 세메스 주식회사 | Die pickup module and die bonding apparatus including the same |
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TWI283906B (en) * | 2001-12-21 | 2007-07-11 | Esec Trading Sa | Pick-up tool for mounting semiconductor chips |
JP2005150214A (en) * | 2003-11-12 | 2005-06-09 | Renesas Technology Corp | Method for manufacturing semiconductor device, and semiconductor manufacturing equipment used therefor |
US7240422B2 (en) * | 2004-05-11 | 2007-07-10 | Asm Assembly Automation Ltd. | Apparatus for semiconductor chip detachment |
JP2008210922A (en) * | 2007-02-26 | 2008-09-11 | Matsushita Electric Ind Co Ltd | Method of picking up electronic component and pickup device used therefor |
JP2009064938A (en) * | 2007-09-06 | 2009-03-26 | Shinkawa Ltd | Pickup device of semiconductor die and pickup method |
KR101207935B1 (en) * | 2010-05-31 | 2012-12-04 | 주식회사 프로텍 | Method of manufacturing led device |
KR101173284B1 (en) * | 2010-07-07 | 2012-08-10 | 주식회사 에버다임 | locking device |
KR101253586B1 (en) * | 2010-08-25 | 2013-04-11 | 삼성전자주식회사 | Phosphor film, method of manufacturing the same, method of coating phosphor layer on an LED chip, method of manufacturing LED package and LED package manufactured thereof |
KR101165360B1 (en) * | 2010-11-26 | 2012-07-12 | 주식회사 프로텍 | Adhesive stamping apparatus for die bonder |
CN103153611B (en) * | 2011-06-07 | 2015-01-07 | 东丽株式会社 | Resin sheet laminated body, method for producing same, and method for producing led chip with phosphor-containing resin sheet using same |
KR101191869B1 (en) * | 2011-06-08 | 2012-10-16 | 주식회사 프로텍 | Method of manufacturing led device |
JP2013065757A (en) * | 2011-09-20 | 2013-04-11 | Toshiba Corp | Pickup method of semiconductor chip and pickup device of semiconductor chip |
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JP5775956B2 (en) | 2015-09-09 |
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