TW202201592A - Equipment and method for transferring workpieces including a carrying apparatus, a pressing apparatus, a peeling apparatus and a controlling apparatus - Google Patents

Equipment and method for transferring workpieces including a carrying apparatus, a pressing apparatus, a peeling apparatus and a controlling apparatus Download PDF

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TW202201592A
TW202201592A TW109120065A TW109120065A TW202201592A TW 202201592 A TW202201592 A TW 202201592A TW 109120065 A TW109120065 A TW 109120065A TW 109120065 A TW109120065 A TW 109120065A TW 202201592 A TW202201592 A TW 202201592A
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Taiwan
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workpieces
carrier
grooves
pressing
adhesive film
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TW109120065A
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Chinese (zh)
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蕭育竹
吳權峰
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賢昇科技股份有限公司
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Priority to TW109120065A priority Critical patent/TW202201592A/en
Priority to CN202010809282.5A priority patent/CN113808987A/en
Publication of TW202201592A publication Critical patent/TW202201592A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling

Abstract

An equipment for transferring workpieces is suitable for transferring a plurality of workpieces and includes a carrying apparatus, a pressing apparatus, a peeling apparatus and a controlling apparatus. The carrying apparatus includes an adhesive film. The adhesive film has an adhesive surface for adhering the workpieces, and a top surface. The pressing apparatus is located above the adhesive film to press the top surface down. The peeling apparatus includes a carrier located under the adhesive film. The carrier is formed with a plurality of recesses, and each recess is configured to accommodate the corresponding workpieces aligned in position. Under the states in which the pressing apparatus presses the top surface down and the recesses accommodate the corresponding workpieces, the carrier may move to exert a force on the corresponding workpieces accommodated within the grooves and peel them off the adhesive surface. The controlling apparatus is configured to control relative positions and displacements among the adhesive film, the carrier and the pressing apparatus. Accordingly, the transfer man-hour may be reduced and the transfer efficiency may be improved.

Description

轉移設備及轉移工件的方法Transfer equipment and method for transferring workpieces

本發明是有關於一種轉移設備及轉移工件的方法,特別是指一種用以剝離工件並將其轉移至載具的轉移設備及轉移工件的方法。The present invention relates to a transfer device and a method for transferring a workpiece, and more particularly to a transfer device and a method for transferring the workpiece for peeling off the workpiece and transferring it to a carrier.

在半導體製程中,需要將切割後黏著在一膜片的多個晶片轉移到一基板上,以便於進行後續該等晶片的封裝製程。In the semiconductor manufacturing process, it is necessary to transfer a plurality of chips adhered to a film after dicing to a substrate, so as to facilitate the subsequent packaging process of the chips.

目前常用的轉移方式是透過一取放裝置來進行,該取放裝置藉由一吸嘴吸取該膜片上的對應的一個晶片,隨後,晶片會受底座上頂針頂出,且該吸嘴帶動該晶片移動以將其剝離該膜片,最後,該吸嘴帶動該晶片移動並將其放置在該基板上,即完成單一個該晶片的取放作業。該取放裝置的該吸嘴只能一個接著一個地依序進行該等晶片的取放作業,由於該吸嘴進行每一個該晶片的取放時所需執行的動作步驟繁多且耗費的工時長,因此,要將該膜片上的所有該等晶片全部轉移到該基板時,需要耗費很長的工時,從而影響該等晶片轉移到後續製程所需的時間。所以,現有轉移方式存在有轉移速度緩慢及效率很差的問題。The commonly used transfer method is to use a pick-and-place device. The pick-and-place device uses a suction nozzle to suck a corresponding wafer on the diaphragm. Then, the wafer is ejected by the ejector pin on the base, and the suction nozzle drives The wafer moves to peel off the film, and finally, the suction nozzle drives the wafer to move and place it on the substrate, thus completing the pick-and-place operation of a single wafer. The suction nozzle of the pick-and-place device can only carry out the pick-and-place operations of the wafers one by one in sequence, because the suction nozzle needs to perform many steps and time-consuming when picking and placing each of the wafers. Therefore, it takes a long time to transfer all the wafers on the membrane to the substrate, which affects the time required for transferring the wafers to the subsequent process. Therefore, the existing transfer methods have the problems of slow transfer speed and poor efficiency.

因此,本發明之其中一目的,即在提供一種能夠克服先前技術的至少一個缺點的轉移設備。Accordingly, one of the objects of the present invention is to provide a transfer apparatus that overcomes at least one of the disadvantages of the prior art.

於是,本發明轉移設備在一些實施態樣中,適於進行多個工件的轉移,該轉移設備包含一承載裝置、一施壓裝置、一剝離裝置,及一控制裝置。Therefore, in some embodiments, the transfer apparatus of the present invention is suitable for transferring a plurality of workpieces, and the transfer apparatus includes a carrying device, a pressing device, a peeling device, and a control device.

該承載裝置包括一黏著膜片,該黏著膜片具有一用以黏著該等工件的黏著面,及一相反於該黏著面的頂面。該施壓裝置位於該黏著膜片上方,用以下壓該頂面。該剝離裝置包括一位於該黏著膜片下方的載具,該載具形成有多個凹槽,各該凹槽用以供位置對齊的對應的該工件容置,在該施壓裝置下壓該頂面且各該凹槽容置對應的該工件的狀態下,該載具能夠移動以施力在容置於該等凹槽內的對應該等工件並將其剝離該黏著面。該控制裝置用以控制該黏著膜片、該載具以及該施壓裝置之間的相對位置與位移。The carrier device includes an adhesive film, the adhesive film has an adhesive surface for adhering the workpieces, and a top surface opposite to the adhesive surface. The pressing device is located above the adhesive film and presses the top surface with the following. The peeling device includes a carrier under the adhesive film, the carrier is formed with a plurality of grooves, each of the grooves is used for accommodating the corresponding workpieces aligned in position, and the pressing device presses the With the top surface and each of the grooves accommodating the corresponding workpieces, the carrier can move to exert force on the corresponding workpieces accommodated in the grooves and peel them off the adhesive surface. The control device is used for controlling the relative position and displacement among the adhesive film, the carrier and the pressing device.

在一些實施態樣中,該剝離裝置還包括一連接該載具的移動機構,該移動機構用以帶動該載具至少沿一第一橫方向移動。In some embodiments, the peeling device further includes a moving mechanism connected to the carrier, and the moving mechanism is used to drive the carrier to move along at least a first lateral direction.

在一些實施態樣中,該移動機構還用以帶動該載具沿一垂直於該第一橫方向的第二橫方向移動。In some embodiments, the moving mechanism is further used to drive the carrier to move along a second lateral direction perpendicular to the first lateral direction.

在一些實施態樣中,該承載裝置還包括一連接該黏著膜片的移載機構,該移載機構用以帶動該黏著膜片至少沿一縱向上下移動,該移動機構還用以帶動該載具沿該縱向上下移動。In some embodiments, the carrier device further includes a transfer mechanism connected to the adhesive film, the transfer mechanism is used to drive the adhesive film to move up and down at least along a longitudinal direction, and the moving mechanism is also used to drive the carrier The tool moves up and down along the longitudinal direction.

在一些實施態樣中,該施壓裝置包括多個分別與該等工件位置相對應的施壓件,各該施壓件用以下壓在該頂面對齊於對應該工件的部位。In some embodiments, the pressing device includes a plurality of pressing members corresponding to the positions of the workpieces, and each of the pressing members is aligned with the position corresponding to the workpiece on the top surface by pressing below.

在一些實施態樣中,該等工件沿一橫方向相間隔排列,該施壓裝置包括一用以下壓該頂面的施壓件,及一連接該施壓件的運動機構,該運動機構用以帶動該施壓件至少沿一橫方向於該頂面上移動以依序施壓於該等工件並將該等工件擠壓入該等凹槽內。In some embodiments, the workpieces are arranged at intervals along a transverse direction, the pressing device includes a pressing member for pressing the top surface below, and a movement mechanism connected to the pressing member, the movement mechanism uses In order to drive the pressing member to move on the top surface at least along a lateral direction to press the workpieces in sequence and squeeze the workpieces into the grooves.

在一些實施態樣中,該施壓件為一能夠繞一垂直於該横方向的軸線轉動的旋轉件,該運動機構還用以帶動該施壓件沿該橫方向移動過程中同時於該頂面上繞該軸線轉動。In some embodiments, the pressing member is a rotating member that can rotate around an axis perpendicular to the lateral direction, and the motion mechanism is further used to drive the pressing member to move along the lateral direction while simultaneously rotating on the top. Rotate around this axis.

在一些實施態樣中,該載具還形成有多個分別連通該等凹槽的吸附孔,各該吸附孔用以吸附對應的該工件。In some embodiments, the carrier is further formed with a plurality of adsorption holes respectively communicating with the grooves, and each of the adsorption holes is used for adsorbing the corresponding workpiece.

在一些實施態樣中,該載具具有多個分別位於該等凹槽一側的導引斜面,各該導引斜面用以供對應的該工件接觸,各該導引斜面允許對應的該工件於其上滑動。In some embodiments, the carrier has a plurality of guide slopes respectively located on one side of the grooves, each guide slope is used for contacting the corresponding workpiece, and each guide slope allows the corresponding workpiece swipe on it.

在一些實施態樣中,該等工件中的兩個相鄰工件之間形成有一第一間距,該等凹槽與該等工件的佈設方式相同,該等凹槽中的兩個相鄰凹槽之間形成有一第二間距,該第二間距與該第一間距相同,該等凹槽分別與該等工件位置對齊且分別供該等工件容置。In some embodiments, a first distance is formed between two adjacent workpieces among the workpieces, the grooves are arranged in the same manner as the workpieces, and two adjacent grooves among the grooves A second distance is formed therebetween, the second distance is the same as the first distance, and the grooves are respectively aligned with the workpieces and are respectively accommodated by the workpieces.

在一些實施態樣中,該等工件中的兩個相鄰工件之間形成有一第一間距,該等凹槽與該等工件的佈設方式不同,該等凹槽中的兩個相鄰凹槽之間形成有一第二間距,該第二間距與該第一間距不同,各該凹槽能選擇性地與對應的該工件對位並供其容置。In some embodiments, a first distance is formed between two adjacent workpieces among the workpieces, the grooves are arranged differently from the workpieces, and two adjacent grooves among the grooves A second distance is formed therebetween, the second distance is different from the first distance, and each of the grooves can be selectively aligned with the corresponding workpiece and accommodated therein.

在一些實施態樣中,該第二間距大於該第一間距,該第二間距是該第一間距的整數倍。In some embodiments, the second distance is greater than the first distance, and the second distance is an integer multiple of the first distance.

在一些實施態樣中,該等工件區分成佈設在該黏著膜片上的至少兩個不同的黏著區域,該等黏著區域內的該第一間距數值不同,該等凹槽區分成佈設在該載具上的至少兩個不同的佈設區域,該等佈設區域內的該第二間距數值不同,各該佈設區域內的該第二間距是對應的該黏著區域內的該第一間距的整數倍。In some embodiments, the workpieces are divided into at least two different adhesive areas arranged on the adhesive film, the first distance values in the adhesive areas are different, and the grooves are divided into at least two different adhesive areas arranged on the adhesive film. At least two different layout areas on the carrier, the second spacing values in the layout areas are different, and the second spacing in each layout area is an integer multiple of the first spacing in the corresponding adhesive area .

本發明之其中一目的,即在提供一種能夠克服先前技術的至少一個缺點的轉移工件的方法。One object of the present invention is to provide a method of transferring workpieces that overcomes at least one of the disadvantages of the prior art.

於是,本發明轉移工件的方法在一些實施態樣中,適於進行多個工件的轉移,該方法包含下述步驟:Therefore, in some embodiments, the method for transferring workpieces of the present invention is suitable for transferring a plurality of workpieces, and the method includes the following steps:

提供步驟,提供一黏著膜片,該黏著膜片以一位於底端的黏著面黏著該等工件;providing a step of providing an adhesive film for adhering the workpieces with an adhesive surface at the bottom end;

對位步驟,進行該黏著膜片、一具有多個凹槽的載具,及一施壓裝置之間的對位,使各該凹槽與對應的該工件位置對齊,以及該施壓裝置對應於該黏著膜片的一相反於該黏著面的頂面;The alignment step is to perform alignment between the adhesive film, a carrier with a plurality of grooves, and a pressing device, so that each of the grooves is aligned with the corresponding position of the workpiece, and the pressing device corresponds to on a top surface of the adhesive film opposite to the adhesive surface;

相對運動步驟,進行該黏著膜片、該載具,及該施壓裝置之間的相對運動,使該載具的各該凹槽容置位置對齊的對應的該工件,以及該施壓裝置下壓該頂面;及The relative movement step is to carry out the relative movement between the adhesive film, the carrier, and the pressing device, so that the corresponding workpieces of the grooves of the carrier are aligned with each other, and the lower part of the pressing device pressing the top surface; and

剝離步驟,移動該載具使其施力在容置於該等凹槽內的對應該等工件並將其剝離該黏著面。In the peeling step, the carrier is moved to exert force on the corresponding workpieces accommodated in the grooves and peeled off the adhesive surface.

在一些實施態樣中,在該剝離步驟中,透過一移動機構帶動該載具沿一第一橫方向移動。In some embodiments, in the peeling step, the carrier is driven to move along a first lateral direction by a moving mechanism.

在一些實施態樣中,在該剝離步驟中,還透過該移動機構帶動該載具沿一垂直於該第一橫方向的第二橫方向移動。In some embodiments, in the peeling step, the moving mechanism is also used to drive the carrier to move along a second lateral direction perpendicular to the first lateral direction.

在一些實施態樣中,在該相對運動步驟中,該施壓裝置透過多個施壓件施壓於該頂面,且各該施壓件下壓在該頂面對齊於對應該工件的部位。In some embodiments, in the relative movement step, the pressing device presses the top surface through a plurality of pressing pieces, and each of the pressing pieces is pressed down on the top surface to align with the corresponding position of the workpiece. part.

在一些實施態樣中,在該相對運動步驟中,該施壓裝置透過一施壓件施壓於該頂面,且該施壓裝置還透過一運動機構帶動該施壓件至少沿一橫方向於該頂面上移動以依序施壓於該等工件並將該等工件擠壓入該等凹槽內,當該施壓件位在將對應的該工件擠壓入對應的該凹槽內的位置時,透過一與對應的該凹槽連通的吸附孔產生吸力吸附對應的該工件。In some embodiments, in the relative movement step, the pressing device presses the top surface through a pressing member, and the pressing device also drives the pressing member along at least one lateral direction through a moving mechanism Move on the top surface to press the workpieces in sequence and squeeze the workpieces into the grooves, when the pressing member is positioned to squeeze the corresponding workpieces into the corresponding grooves When the position is in the position, the corresponding workpiece is adsorbed by suction through an adsorption hole communicated with the corresponding groove.

在一些實施態樣中,在該相對運動步驟中,該運動機構還帶動該施壓件沿該橫方向移動過程中同時繞一垂直於該横方向的軸線於該頂面上轉動。In some embodiments, in the relative movement step, the movement mechanism also drives the pressing member to rotate on the top surface around an axis perpendicular to the lateral direction during the movement in the lateral direction.

在一些實施態樣中,在該相對運動步驟中,透過一與對應的該凹槽連通的吸附孔產生吸力吸附對應的該工件。In some embodiments, in the relative movement step, suction is generated to adsorb the corresponding workpiece through an adsorption hole communicating with the corresponding groove.

在一些實施態樣中,該等凹槽與該等工件的佈設方式相同,該等凹槽分別與該等工件位置對齊且分別供該等工件容置。In some embodiments, the grooves are arranged in the same manner as the workpieces, and the grooves are respectively aligned with the workpieces and are respectively accommodated by the workpieces.

在一些實施態樣中,該等凹槽與該等工件的佈設方式不同,各該凹槽能選擇性地與對應的該工件對位並供其容置。In some embodiments, the grooves and the workpieces are arranged in different ways, and each of the grooves can selectively align with and accommodate the corresponding workpiece.

本發明至少具有以下功效:能一次將多個工件快速地轉移至該載具的該等凹槽內,藉此能降低轉移工時並能大幅提升轉移效率。此外,由於該載具為承載該等工件以帶動其進行後續製程的目標載具,因此,在該載具將該等工件剝離該黏著膜片時,即同時完成該等工件的放料動作。藉此,將該載具拆離該移動平台後,該載具便能帶動該等工件進行後續製程,能大幅縮短將該等工件轉移到後續製程所需的時間。The present invention has at least the following effects: a plurality of workpieces can be quickly transferred into the grooves of the carrier at one time, thereby reducing the transfer man-hour and greatly improving the transfer efficiency. In addition, since the carrier is the target carrier for carrying the workpieces to drive them to the subsequent process, when the carrier peels off the workpieces from the adhesive film, the unloading of the workpieces is simultaneously completed. In this way, after the carrier is detached from the moving platform, the carrier can drive the workpieces to carry out the subsequent process, which can greatly shorten the time required for transferring the workpieces to the subsequent process.

在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are designated by the same reference numerals.

參閱圖1及圖2,是本發明轉移設備200的第一實施例,該轉移設備200適於應用在一製程中進行多個工件1的轉移。在本第一實施例中,該製程是例如為半導體製程,各該工件1是以半導體元件為例,具體而言為一晶片。各該工件1沿一第一橫方向X所取的長度尺寸以及沿一垂直於該第一橫方向X的第二橫方向Y所取的寬度尺寸介於50um~10mm,各該工件1沿一垂直於該第一、第二橫方向X、Y的縱向Z所取的厚度尺寸是例如介於10um~1mm。該第一橫方向X是例如為前後方向,該第二橫方向Y是例如為左右方向,該縱向Z是例如為上下方向。當然,各該工件1也可以是在其他製程中需要由一工作區轉移至一載具並透過該載具移載至後續製程的任何其他種類的工件,不以晶片為限。Referring to FIG. 1 and FIG. 2 , it is a first embodiment of the transfer apparatus 200 of the present invention. The transfer apparatus 200 is suitable for transferring a plurality of workpieces 1 in a process. In the first embodiment, the process is, for example, a semiconductor process, and each of the workpieces 1 is an example of a semiconductor element, specifically, a wafer. The length dimension of each workpiece 1 taken along a first transverse direction X and the width dimension taken along a second transverse direction Y perpendicular to the first transverse direction X are between 50um and 10mm. The thickness dimension taken in the longitudinal direction Z perpendicular to the first and second lateral directions X, Y is, for example, between 10 um and 1 mm. The first lateral direction X is, for example, the front-rear direction, the second lateral direction Y is, for example, the left-right direction, and the vertical direction Z is, for example, the up-down direction. Of course, each of the workpieces 1 can also be any other types of workpieces that need to be transferred from a work area to a carrier in other processes and transferred to subsequent processes through the carrier, not limited to wafers.

參閱圖1,該轉移設備200包含一承載裝置2、一施壓裝置3、一剝離裝置4,及一控制裝置5(如圖3所示)。該承載裝置2包括一黏著膜片21,及一連接該膜黏著膜片21的移載機構22。該黏著膜片21是以藍膜為例,其厚度尺寸是例如介於100um~2mm。該黏著膜片21具有一朝向下方用以黏著該等工件1的黏著面211,及一相反於該黏著面211的頂面212。該黏著膜片21也可為UV解膠膜片、熱解膠膜片、矽膠膜片或PVA膜片等膜片,不以藍膜為限。Referring to FIG. 1 , the transfer apparatus 200 includes a carrying device 2 , a pressing device 3 , a peeling device 4 , and a control device 5 (as shown in FIG. 3 ). The carrier device 2 includes an adhesive film 21 and a transfer mechanism 22 connected to the film adhesive film 21 . The adhesive film 21 is a blue film as an example, and its thickness is, for example, between 100um and 2mm. The adhesive film 21 has an adhesive surface 211 facing downward for adhering the workpieces 1 , and a top surface 212 opposite to the adhesive surface 211 . The adhesive film 21 can also be a film such as a UV release film, a pyrolysis film, a silicone film, or a PVA film, and is not limited to a blue film.

該移載機構22為三軸移動機構並包括一基座221、兩個移載夾具222,及一驅動結構(圖未示)。該等移載夾具222能移動地連接於該基座221,該等移載夾具222能夠被該驅動結構驅動而沿該第一橫方向X、該第二橫方向Y,或該縱向Z於該基座221上移動。該等移載夾具222分別連接於該黏著膜片21的兩相反端,該等移載夾具222能對該黏著膜片21施加反向拉力,以使該黏著膜片21呈圖1所示的平坦緊繃狀態。該移載機構22能透過該等移載夾具222帶動該黏著膜片21沿著該第一、第二橫方向X、Y及該縱向Z移動。本第一實施例的該等移載夾具222連接該黏著膜片21的方式是以夾持方式為例,但也可透過框件固定或真空吸附等方式連接固定該黏著膜片21。The transfer mechanism 22 is a three-axis moving mechanism and includes a base 221, two transfer fixtures 222, and a driving structure (not shown). The transfer fixtures 222 are movably connected to the base 221, and the transfer fixtures 222 can be driven by the driving structure along the first transverse direction X, the second transverse direction Y, or the longitudinal direction Z in the direction of the move on the base 221 . The transfer fixtures 222 are respectively connected to two opposite ends of the adhesive film 21 , and the transfer fixtures 222 can apply reverse pulling force to the adhesive film 21 , so that the adhesive film 21 has the shape shown in FIG. 1 . Flat and tight. The transfer mechanism 22 can drive the adhesive film 21 to move along the first and second lateral directions X, Y and the longitudinal direction Z through the transfer fixtures 222 . In the first embodiment, the method of connecting the transfer jigs 222 to the adhesive film 21 is a clamping method, but the adhesive film 21 can also be connected and fixed by means of frame fixing or vacuum adsorption.

該施壓裝置3包括多個施壓件31,及一連接該等施壓件31的運動機構32。該等施壓件31位於該黏著膜片21上方用以下壓該黏著膜片21的該頂面212。在本第一實施例中,該等施壓件31的數量與該等工件1的數量相同,且該等施壓件31能分別與該等工件1位置相對齊。各該施壓件31例如呈長條片狀並具有一位於底端的倒圓角311,該倒圓角311沿該第一橫方向X所取的寬度尺寸是例如該工件1的長度或寬度尺寸的10%~60%。各該施壓件31的該倒圓角311用以下壓在該頂面212對齊於對應該工件1的部位,藉此,能通過該黏著膜片21施加壓力至該黏著面211與對應該工件1的頂面之間,以降低該黏著面211與對應該工件1的頂面之間的黏著性。需說明的是,各該施壓件31的形狀也可為針狀、長條梯形狀或長條三角形狀等其他形狀。The pressing device 3 includes a plurality of pressing members 31 and a movement mechanism 32 connected to the pressing members 31 . The pressing members 31 are located above the adhesive film 21 to press down the top surface 212 of the adhesive film 21 . In the first embodiment, the number of the pressing members 31 is the same as the number of the workpieces 1 , and the pressing members 31 can be aligned with the workpieces 1 respectively. Each of the pressing members 31 is, for example, in the shape of a long strip and has a rounded corner 311 at the bottom end. The width of the rounded corner 311 along the first lateral direction X is, for example, the length or width of the workpiece 1 . 10%~60%. The rounded corners 311 of each of the pressing members 31 are pressed on the top surface 212 to align with the part corresponding to the workpiece 1 , whereby pressure can be applied to the adhesive surface 211 and the corresponding workpiece 1 through the adhesive film 21 . 1 to reduce the adhesion between the adhesive surface 211 and the top surface corresponding to the workpiece 1 . It should be noted that the shape of each of the pressing members 31 may also be other shapes such as needle shape, elongated trapezoid shape, or elongated triangle shape.

該運動機構32為三軸移動機構並包括一運動平台321,及一驅動結構(圖未示)。該等施壓件31固定地設置於該運動平台321底端。該驅動結構用以驅動該運動平台321沿該第一橫方向X、或該第二橫方向Y,或該縱向Z移動,使得該運動平台321能帶動該等施壓件31沿著該第一、第二橫方向X、Y及該縱向Z移動。The moving mechanism 32 is a three-axis moving mechanism and includes a moving platform 321 and a driving structure (not shown). The pressing members 31 are fixedly disposed at the bottom end of the moving platform 321 . The driving structure is used to drive the moving platform 321 to move along the first lateral direction X, the second lateral direction Y, or the longitudinal direction Z, so that the moving platform 321 can drive the pressing members 31 along the first lateral direction , the second horizontal direction X, Y and the vertical Z movement.

參閱圖1及圖2,該剝離裝置4包括一載具41,及一連接該載具41的移動機構42。該載具41位於該黏著膜片21下方用以剝離並承載該等工件1,該載具41具有一頂面410,該載具41的該頂面410向下凹陷形成有多個彼此相間隔的凹槽411,各該凹槽411用以供位置對齊的對應的該工件1容置。在本第一實施例中,該載具41例如為一承載盤,其為用以帶動該等工件1進行後續製程的目標載具。當然,該載具41也可為配線基板、導線架或玻璃基板等其他承載型式的目標載具。該等凹槽411的數量與該等工件1的數量相同,且該等凹槽411能分別與該等工件1位置相對齊。各該凹槽411的開口朝向上方,各該凹槽411是由該載具41的一承載面412、兩個分別連接於該承載面412的兩相反側的第一側面413,及兩個分別連接於該承載面412的另兩相反側的第二側面414所共同界定而出。該等第一側面413沿該第一橫方向X相間隔,而該等第二側面414沿該第二橫方向Y相間隔。各該第一側面413及各該第二側面414例如為直立面。Referring to FIG. 1 and FIG. 2 , the peeling device 4 includes a carrier 41 and a moving mechanism 42 connected to the carrier 41 . The carrier 41 is located under the adhesive film 21 for peeling off and carrying the workpieces 1 , the carrier 41 has a top surface 410 , and the top surface 410 of the carrier 41 is recessed downward to form a plurality of spaced apart Each of the grooves 411 is used for accommodating the corresponding workpiece 1 that is aligned in position. In the first embodiment, the carrier 41 is, for example, a carrier plate, which is a target carrier for driving the workpieces 1 to perform subsequent processes. Of course, the carrier 41 can also be a target carrier of other bearing types such as a wiring substrate, a lead frame, or a glass substrate. The number of the grooves 411 is the same as the number of the workpieces 1 , and the grooves 411 can be aligned with the workpieces 1 respectively. The opening of each of the grooves 411 faces upward, and each of the grooves 411 is formed by a bearing surface 412 of the carrier 41 , two first side surfaces 413 respectively connected to two opposite sides of the bearing surface 412 , and two respectively The second side surfaces 414 connected to the other two opposite sides of the bearing surface 412 are jointly defined. The first side surfaces 413 are spaced apart along the first transverse direction X, and the second side surfaces 414 are spaced apart along the second transverse direction Y. Each of the first side surfaces 413 and each of the second side surfaces 414 are, for example, upright surfaces.

各該凹槽411沿該縱向Z所取的深度例如為各該工件1沿該縱向Z所取的厚度的50%~70%,藉此,使得各該工件1容置於對應的該凹槽411後能夠部分凸伸出該載具41的該頂面410一段適當距離。各該凹槽411沿該第一橫方向X所取的長度尺寸以及沿該第二橫方向Y所取的寬度尺寸例如為各該工件1的長度的110%~130%,藉此,使得各該凹槽411的空間大小足夠供對應的該工件1穿伸於內。The depth of each of the grooves 411 along the longitudinal direction Z is, for example, 50% to 70% of the thickness of each of the workpieces 1 along the longitudinal direction Z, whereby the workpieces 1 are accommodated in the corresponding grooves After 411 , it can partially protrude out of the top surface 410 of the carrier 41 by an appropriate distance. The length dimension of each groove 411 taken along the first lateral direction X and the width dimension taken along the second lateral direction Y are, for example, 110% to 130% of the length of each workpiece 1, thereby making each The size of the space of the groove 411 is sufficient for the corresponding workpiece 1 to penetrate therethrough.

為了便於說明,本第一實施例的該等工件1、該等凹槽411以及該等施壓件31的佈設方式相同,且各自是以例如沿該第一橫方向X相間隔排列為例。每兩個相鄰的該等工件1之間沿該第一橫方向X形成有一第一間距P1,每兩個相鄰的該等凹槽411之間沿該第一橫方向X形成有一第二間距P2,每兩個相鄰的該等施壓件31的該等倒圓角311之間沿該第一橫方向X形成有一第三間距P3,該第一間距P1、該第二間距P2及該第三間距P3的大小皆相同。當然,本第一實施例的該等工件1、該等凹槽411以及該等施壓件31的佈設方式也可各自是同時沿該第一橫方向X及該第二橫方向Y相間隔排列,不以前述佈設方式為限。For convenience of description, the workpieces 1 , the grooves 411 , and the pressing members 31 in the first embodiment are arranged in the same manner, and each of them is, for example, arranged at intervals along the first lateral direction X as an example. A first distance P1 is formed between every two adjacent workpieces 1 along the first lateral direction X, and a second spacing P1 is formed along the first lateral direction X between every two adjacent grooves 411 A distance P2, a third distance P3 is formed between the rounded corners 311 of every two adjacent pressing members 31 along the first lateral direction X, the first distance P1, the second distance P2 and the The sizes of the third pitches P3 are all the same. Of course, the layout of the workpieces 1 , the grooves 411 , and the pressing members 31 in the first embodiment can also be arranged at intervals along the first lateral direction X and the second lateral direction Y at the same time. , not limited to the aforementioned arrangement.

該移動機構42為三軸移動機構並包括一移動平台421,及一驅動結構(圖未示)。該載具41可拆卸地組裝固定於該移動平台421頂面。該載具41與該移動平台421例如能透過螺絲鎖固方式,或是卡鉤與卡槽相配合的卡扣方式組裝固定在一起。該驅動結構用以驅動該移動平台421沿該第一橫方向X、或該第二橫方向Y,或該縱向Z移動,使得該移動平台421能帶動該載具41沿著該第一、第二橫方向X、Y及該縱向Z移動。The moving mechanism 42 is a three-axis moving mechanism and includes a moving platform 421 and a driving structure (not shown). The carrier 41 is detachably assembled and fixed on the top surface of the moving platform 421 . The carrier 41 and the moving platform 421 can be assembled and fixed together, for example, by means of screw locking, or by means of a buckle in which a hook is matched with a slot. The driving structure is used to drive the moving platform 421 to move along the first lateral direction X, the second lateral direction Y, or the longitudinal direction Z, so that the moving platform 421 can drive the carrier 41 along the first and second lateral directions. The two horizontal directions X, Y and the vertical Z move.

參閱圖3,該控制裝置5包括一控制器51、一影像感測器52,及多個壓力感測器53。該控制器51電性連接於該移載機構22的該驅動結構、該運動機構32的該驅動結構,及該移動機構42的該驅動結構。該影像感測器52與該控制器51電性連接,用以擷取影像。該等壓力感測器53與該控制器51電性連接且分別設置於該等施壓件31(如圖1所示)上,各該壓力感測器53用以感測對應的該施壓件31施壓於該黏著膜片21上的壓力。Referring to FIG. 3 , the control device 5 includes a controller 51 , an image sensor 52 , and a plurality of pressure sensors 53 . The controller 51 is electrically connected to the driving structure of the transfer mechanism 22 , the driving structure of the moving mechanism 32 , and the driving structure of the moving mechanism 42 . The image sensor 52 is electrically connected to the controller 51 for capturing images. The pressure sensors 53 are electrically connected to the controller 51 and are respectively disposed on the pressure-applying members 31 (as shown in FIG. 1 ). Each pressure sensor 53 is used to sense the corresponding pressure The pressure on the adhesive film 21 is exerted by the member 31 .

以下針對利用本第一實施例的該轉移設備200進行轉移工件的方法作詳細說明:The following is a detailed description of the method for transferring workpieces using the transfer device 200 of the first embodiment:

圖4是轉移工件的方法的一步驟流程圖,包含下述步驟:提供步驟S1、對位步驟S2、相對運動步驟S3,及剝離步驟S4。4 is a one-step flow chart of a method for transferring a workpiece, comprising the following steps: providing step S1, alignment step S2, relative movement step S3, and peeling step S4.

參閱圖1及圖4,在該提供步驟S1中,提供該黏著膜片21以該黏著面211黏著一晶圓(圖未示),透過現有常用的切割(dicing)方式切割該黏著膜片21上的該晶圓以形成多個分離的晶片,該等晶片即為黏著在該黏著面211上的該等工件1。之後,透過該等移載夾具222對該黏著膜片21沿該第一橫方向X施加反向拉力,使該黏著膜片21呈圖1所示的平坦緊繃狀態。Referring to FIGS. 1 and 4 , in the providing step S1 , the adhesive film 21 is provided to adhere a wafer (not shown) with the adhesive surface 211 , and the adhesive film 21 is cut by a conventional dicing method. to form a plurality of separate chips, the chips are the workpieces 1 adhered to the adhesion surface 211 . Afterwards, a reverse pulling force is applied to the adhesive film 21 along the first lateral direction X through the transfer fixtures 222 , so that the adhesive film 21 is in a flat and tight state as shown in FIG. 1 .

參閱圖3、圖4及圖5,在該對位步驟S2中,進行該載具41、該黏著膜片21以及該施壓裝置3之間的對位。在本第一實施例中,是例如將該等施壓件31的該等倒圓角311預設為基準原點,以作為該載具41及該黏著膜片21後續對位時的依據。Referring to FIG. 3 , FIG. 4 and FIG. 5 , in the alignment step S2 , alignment among the carrier 41 , the adhesive film 21 and the pressing device 3 is performed. In the first embodiment, for example, the rounded corners 311 of the pressing members 31 are preset as reference origins, which are used as the basis for subsequent alignment of the carrier 41 and the adhesive film 21 .

首先,透過該等移載夾具222帶動該黏著膜片21移動至該等施壓件31下方的位置,使該黏著膜片21的該頂面212與該等倒圓角311沿該縱向Z相間隔一段適當距離。接著,透過該移動平台421帶動該載具41移動至圖4所示位於該黏著膜片21及該等工件1下方的位置,使該載具41的該頂面410與該等工件1底面沿該縱向Z相間隔一段適當距離,該距離例如為10um~1mm。隨後,透過例如設置於該運動平台321底端的該影像感測器52由該黏著膜片21上方擷取影像,該控制器51接收該影像後,藉由該控制器51的一影像辨識模組(圖未示)辨識該影像以判斷該載具41與該黏著膜片21是否對位完成。在該影像中要判斷該載具41與該黏著膜片21是否對位完成的方式,本第一實施例是例如透過該等凹槽411與該等工件1沿該縱向Z上的位置是否對齊來判斷,當然,也可以透過該載具41上的對位標記與該黏著膜片21上的對位標記沿該縱向Z上的位置是否對齊來判斷。同時,該影像辨識模組還會將該影像與該控制器51所預先儲存的一具有該等倒圓角311基準原點位置資訊的基準影像進行比對,以判斷該等凹槽411及該等工件1的位置是否與該等倒圓角311位置對齊。First, the adhesive film 21 is moved to a position below the pressing members 31 through the transfer fixtures 222 , so that the top surface 212 of the adhesive film 21 and the rounded corners 311 are aligned along the longitudinal direction Z. at an appropriate distance. Next, drive the carrier 41 to move to the position below the adhesive film 21 and the workpieces 1 as shown in FIG. The longitudinal direction Z is separated by a suitable distance, for example, the distance is 10um~1mm. Subsequently, an image is captured from above the adhesive film 21 through the image sensor 52 disposed at the bottom of the motion platform 321 . After the controller 51 receives the image, an image recognition module of the controller 51 is used to capture the image. (Not shown) The image is identified to determine whether the alignment of the carrier 41 and the adhesive film 21 is completed. In the image, it is necessary to judge whether the alignment of the carrier 41 and the adhesive film 21 is completed. In the first embodiment, for example, whether the positions of the workpieces 1 and the workpieces 1 are aligned along the longitudinal direction Z through the grooves 411 Of course, it can also be judged by whether the alignment marks on the carrier 41 and the alignment marks on the adhesive film 21 are aligned along the longitudinal direction Z. At the same time, the image recognition module will also compare the image with a reference image pre-stored by the controller 51 with the reference origin position information of the rounded corners 311 to determine the grooves 411 and the Whether the position of the workpiece 1 is aligned with the position of the rounded corners 311 .

當該等工件1或該等凹槽411的位置有偏差時,該控制器51控制該移載機構22的該驅動結構作動以微調該等工件1的位置,或者是控制該移動機構42的該驅動結構作動以微調該等凹槽411的位置。藉此,使得各該凹槽411與對應的該工件1位置對齊,以及各該施壓件31的該倒圓角311與對應的該工件1位置對齊。When the positions of the workpieces 1 or the grooves 411 are deviated, the controller 51 controls the driving structure of the transfer mechanism 22 to act to fine-tune the positions of the workpieces 1 , or controls the position of the moving mechanism 42 . The drive structure is actuated to fine-tune the positions of the grooves 411 . Thereby, each of the grooves 411 is aligned with the corresponding workpiece 1 , and the rounded corners 311 of each of the pressing members 31 are aligned with the corresponding workpiece 1 .

需說明的是,本第一實施例也可以將該等凹槽411預設為基準原點,以作為該黏著膜片21及該等施壓件31後續對位時的依據。此時,該影像感測器5例如可設置於該移動平台421頂端由該黏著膜片21下方擷取影像,該影像辨識模組會將該影像與預先儲存的一具有該等凹槽411基準原點位置資訊的基準影像進行比對。It should be noted that, in the first embodiment, the grooves 411 can also be preset as the reference origin, which is used as the basis for the subsequent alignment of the adhesive film 21 and the pressing members 31 . At this time, the image sensor 5 can be disposed at the top of the mobile platform 421 to capture an image from under the adhesive film 21 , and the image recognition module will compare the image with a pre-stored reference with the grooves 411 . The reference image of the origin position information is compared.

參閱圖3、圖4及圖6,在該相對運動步驟S3中,進行該黏著膜片21、該載具41及該施壓裝置3之間的相對運動。由於該對位步驟S2中是以該等施壓件31的該等倒圓角311預設為基準原點,因此,該等施壓件31是保持固定不動的狀態。Referring to FIG. 3 , FIG. 4 and FIG. 6 , in the relative movement step S3 , the relative movement between the adhesive film 21 , the carrier 41 and the pressing device 3 is performed. Since the rounded corners 311 of the pressing members 31 are preset as reference origins in the alignment step S2, the pressing members 31 are kept in a fixed state.

首先,透過該等移載夾具222帶動該黏著膜片21帶動沿該縱向Z向上移動,同時,透過該移動平台421帶動該載具41沿該縱向Z向上移動。該黏著膜片21上移過程中,當該頂面212被該等施壓件31的該等倒圓角311接觸且阻擋時,該黏著膜片21便無法繼續上移。透過該等移載夾具222再向上移動一段適當距離並且向上拉動該黏著膜片21的兩相反端,使該黏著膜片21的兩相反端略往上翹曲變形,藉此,使得各該倒圓角311能緊迫下壓在該頂面212對齊於對應該工件1的部位。此時,該等移載夾具222便能停止在圖6所示的位置。First, the adhesive film 21 is driven to move upward along the longitudinal direction Z through the transfer fixtures 222 , and at the same time, the carrier 41 is driven to move upward along the longitudinal direction Z through the moving platform 421 . During the upward movement of the adhesive film 21 , when the top surface 212 is contacted and blocked by the rounded corners 311 of the pressing members 31 , the adhesive film 21 cannot continue to move upward. The transfer clamps 222 are moved upward for an appropriate distance and the two opposite ends of the adhesive film 21 are pulled upward, so that the two opposite ends of the adhesive film 21 are slightly warped and deformed upward, thereby making the inverted The rounded corners 311 can be pressed down tightly on the top surface 212 aligned with the position corresponding to the workpiece 1 . At this time, the transfer jigs 222 can be stopped at the positions shown in FIG. 6 .

藉由該黏著膜片21的兩相反端略往上翹曲變形,能將該黏著面211擴張開來以降低其黏著力。藉由各該倒圓角311以應力集中的方式施加下壓力至該頂面212並通過該黏著膜片21傳遞至對應的該工件1,能破除該黏著面211與對應的該工件1頂面之間的氣密性,以進一步地降低該黏著面211與對應的該工件1頂面之間的黏著力。By the two opposite ends of the adhesive film 21 being slightly warped and deformed upward, the adhesive surface 211 can be expanded to reduce its adhesive force. By applying down pressure to the top surface 212 in a stress concentration manner by each of the rounded corners 311 and transmitting it to the corresponding workpiece 1 through the adhesive film 21 , the adhesive surface 211 and the corresponding top surface of the workpiece 1 can be broken. air tightness between the two, so as to further reduce the adhesive force between the adhesive surface 211 and the corresponding top surface of the workpiece 1 .

該載具41上移過程中,該等工件1會分別先穿伸至該等凹槽411內,隨後,各該承載面412會接觸對應的該工件1底面並將其往上頂推,其頂推力會經由對應的該工件1及該黏著膜片21傳遞至對應的該施壓件31。在本第一實施例中,透過各該壓力感測器53感測對應的該承載面412施加於對應的該工件1上的頂推力,能作為判斷各該工件1是否確實容置於對應的該凹槽411內的資訊。該控制器51接受到該頂推力的訊號後,會將該頂推力的數值與預設的一預設值進行比對。當該頂推力的數值小於該預設值時,該控制器51控制該移動機構42的該驅動結構繼續驅動該移動平台421上移。當該控制器51判斷該頂推力的數值與該預設值相同時,該控制器51控制該移動機構42的該驅動結構停止驅動該移動平台421上移,使該載具41定位在圖6所示的一承載位置。藉此,能確保各該凹槽411容置位置對齊的對應的該工件1。During the upward movement of the carrier 41 , the workpieces 1 will first penetrate into the grooves 411 , and then, each of the bearing surfaces 412 will contact the bottom surface of the corresponding workpiece 1 and push it upwards. The pushing force is transmitted to the corresponding pressing member 31 via the corresponding workpiece 1 and the adhesive film 21 . In the first embodiment, each of the pressure sensors 53 senses the thrust force exerted by the corresponding bearing surface 412 on the corresponding workpiece 1 , which can be used to determine whether each workpiece 1 is indeed accommodated in the corresponding workpiece 1 . information in the groove 411 . After receiving the signal of the thrust force, the controller 51 compares the value of the thrust force with a preset value. When the value of the thrust force is smaller than the preset value, the controller 51 controls the driving structure of the moving mechanism 42 to continue to drive the moving platform 421 to move upward. When the controller 51 determines that the value of the thrust force is the same as the preset value, the controller 51 controls the driving structure of the moving mechanism 42 to stop driving the moving platform 421 to move upward, so that the carrier 41 is positioned at the position shown in FIG. 6 . A load-bearing position is shown. Thereby, it can be ensured that the corresponding workpieces 1 in which the accommodating positions of the grooves 411 are aligned are ensured.

需說明的是,本第一實施例的該黏著膜片21、該載具41及該施壓裝置3之間的相對運動也可以是下述另外兩種方式:It should be noted that the relative movement between the adhesive film 21, the carrier 41 and the pressing device 3 in the first embodiment can also be in the following two other ways:

其中一種方式是該載具41保持固定不動的狀態,透過該等移載夾具222帶動該黏著膜片21帶動沿該縱向Z向下移動,使該等工件1分別容置於該等凹槽411內。透過該運動平台321帶動該等施壓件31沿該縱向Z向下移動,使該等倒圓角311緊迫施壓在該黏著膜片21的該頂面212。One way is to keep the carrier 41 in a fixed state, and drive the adhesive film 21 to move downward along the longitudinal direction Z through the transfer fixtures 222 , so that the workpieces 1 are respectively accommodated in the grooves 411 Inside. The pressing members 31 are driven to move downward along the longitudinal direction Z through the moving platform 321 , so that the rounded corners 311 are pressed against the top surface 212 of the adhesive film 21 .

另外一種方式是該黏著膜片21保持固定不動的狀態,先透過該運動平台321帶動該等施壓件31沿該縱向Z向下移動,使該等倒圓角311緊迫施壓在該黏著膜片21的該頂面212,接著再透過該移動平台421帶動該載具41沿該縱向Z向上移動,使該等工件1分別容置於該等凹槽411內。Another way is to keep the adhesive film 21 in a fixed state, first drive the pressing members 31 to move downward along the longitudinal direction Z through the moving platform 321, so that the rounded corners 311 are pressed tightly on the adhesive film The top surface 212 of the sheet 21 then drives the carrier 41 to move upward along the longitudinal direction Z through the moving platform 421 , so that the workpieces 1 are respectively accommodated in the grooves 411 .

參閱圖4、圖7及圖8,在該剝離步驟S4中,例如透過該移動平台421帶動該載具41先沿該第一橫方向X移動一小段距離,使其中一個該第一側面413施加橫向推力在容置於對應的該凹槽411內的對應的該工件1側邊。隨後再透過該移動平台421帶動該載具41沿該第二橫方向Y移動一小段距離,使其中一個該第二側面414施加橫向推力在容置於對應的該凹槽411內的對應的該工件1另一側邊。Referring to FIGS. 4 , 7 and 8 , in the peeling step S4 , for example, the moving platform 421 drives the carrier 41 to move a short distance along the first lateral direction X, so that one of the first side surfaces 413 is applied The lateral thrust is on the corresponding side of the workpiece 1 accommodated in the corresponding groove 411 . Then, through the moving platform 421, the carrier 41 is driven to move a short distance along the second lateral direction Y, so that one of the second side surfaces 414 exerts a lateral thrust on the corresponding groove 411 accommodated in the corresponding groove 411. The other side of workpiece 1.

該第一側面413施加在對應的該工件1側邊的橫向推力以及該第二側面414施加在對應的該工件1另一側邊的橫向推力相當於是平行於該黏著面211的剪力,藉由在該工件1上持續地施加橫向推力,能逐漸地降低該工件1頂面與該黏著面211之間的黏著力,使得該載具41能輕易且迅速地將該等工件1剝離該黏著面211。The lateral thrust exerted by the first side 413 on the corresponding side of the workpiece 1 and the lateral thrust exerted by the second side 414 on the other side of the workpiece 1 are equivalent to shear forces parallel to the adhesive surface 211 . By continuously applying lateral thrust on the workpiece 1, the adhesive force between the top surface of the workpiece 1 and the adhesive surface 211 can be gradually reduced, so that the carrier 41 can easily and quickly peel off the adhesive force from the workpieces 1 face 211.

需說明的是,本第一實施例的該剝離步驟S4也可透過下述方式實施:It should be noted that the peeling step S4 in the first embodiment can also be implemented in the following manner:

透過該移動平台421帶動該載具41沿該第一橫方向X移動,只透過其中一個該第一側面413對該工件1施加橫向推力;Drive the carrier 41 to move along the first lateral direction X through the moving platform 421, and apply lateral thrust to the workpiece 1 only through one of the first side surfaces 413;

透過該移動平台421帶動該載具41沿該第二橫方向Y移動,只透過其中一個該第二側面414對該工件1施加橫向推力;Drive the carrier 41 to move along the second lateral direction Y through the moving platform 421, and apply lateral thrust to the workpiece 1 only through one of the second side surfaces 414;

透過該移動平台421先帶動該載具41沿該第一橫方向X往復移動,接著再沿該第二橫方向Y往復移動,使得該等第一側面413及該等第二側面414皆能對對應的該工件1施加橫向推力;The moving platform 421 first drives the carrier 41 to move back and forth along the first lateral direction X, and then moves back and forth along the second lateral direction Y, so that both the first side surfaces 413 and the second side surfaces 414 can face each other. The corresponding workpiece 1 applies lateral thrust;

透過該移動平台421只帶動該載具41沿該第一橫方向X往復移動,使得該等第一側面413皆能對對應的該工件1施加橫向推力;The moving platform 421 only drives the carrier 41 to reciprocate along the first lateral direction X, so that the first side surfaces 413 can apply lateral thrust to the corresponding workpiece 1;

透過該移動平台421只帶動該載具41沿該第二橫方向Y往復移動,使得該等第二側面414皆能對對應的該工件1施加橫向推力。The moving platform 421 only drives the carrier 41 to reciprocate along the second lateral direction Y, so that the second side surfaces 414 can apply lateral thrust to the corresponding workpiece 1 .

參閱圖9,當該等工件1與該黏著面211分離而不被其黏著後,該移動平台421便能帶動該載具41沿該縱向Z向下移動。之後,將該載具41拆離該移動平台421,該載具41便能帶動所承載的該等工件1進行後續的封裝製程。Referring to FIG. 9 , when the workpieces 1 are separated from the adhesive surface 211 without being adhered thereto, the moving platform 421 can drive the carrier 41 to move downward along the longitudinal direction Z. As shown in FIG. After that, the carrier 41 is detached from the moving platform 421 , and the carrier 41 can drive the workpieces 1 carried by the carrier 41 to carry out subsequent packaging processes.

參閱圖10,是本發明轉移設備200的第二實施例,其整體結構及轉移工件的方法大致與第一實施例相同,不同處在於該載具41的結構。Referring to FIG. 10 , it is a second embodiment of the transfer apparatus 200 of the present invention. The overall structure and the method for transferring workpieces are substantially the same as those of the first embodiment, and the difference lies in the structure of the carrier 41 .

在本第二實施例中,該載具41還形成有多個分別連通該等凹槽411底端的吸附孔415,各該吸附孔415形成於對應的該承載面412。透過外力作用使各該吸附孔415內產生負壓,使得各該吸附孔415能以真空吸附的方式吸附對應的該工件1底面。In the second embodiment, the carrier 41 is further formed with a plurality of adsorption holes 415 respectively communicating with the bottom ends of the grooves 411 , and each of the adsorption holes 415 is formed on the corresponding bearing surface 412 . Through the action of external force, negative pressure is generated in each of the adsorption holes 415 , so that each of the adsorption holes 415 can adsorb the corresponding bottom surface of the workpiece 1 in a vacuum adsorption manner.

在該相對運動步驟S3中,當各該工件1容置於對應的該凹槽411後,各該吸附孔415以真空吸附的方式吸附對應的該工件1底面,藉此,使得各該工件1能穩固地定位在對應的該凹槽411內。在該剝離步驟S4中,各該吸附孔415保持真空吸附對應的該工件1的狀態。該移動平台421帶動該載具41沿該第一橫方向X或該第二橫方向Y移動的過程中,該載具41透過該等吸附孔415所產生的吸力分別帶動該等工件1橫向移動,藉此,能逐漸地降低該工件1頂面與該黏著面211之間的黏著力,使得該載具41能輕易且迅速地將該等工件1剝離該黏著面211。In the relative movement step S3, after each of the workpieces 1 is accommodated in the corresponding groove 411, each of the suction holes 415 suctions the bottom surface of the corresponding workpiece 1 in a vacuum suction manner, thereby making each of the workpieces 1 It can be stably positioned in the corresponding groove 411 . In the peeling step S4 , each of the suction holes 415 maintains the state of vacuum suction of the corresponding workpiece 1 . When the moving platform 421 drives the carrier 41 to move along the first lateral direction X or the second lateral direction Y, the suction force generated by the carrier 41 through the suction holes 415 drives the workpieces 1 to move laterally, respectively , whereby the adhesive force between the top surface of the workpiece 1 and the adhesive surface 211 can be gradually reduced, so that the carrier 41 can easily and quickly peel off the adhesive surface 211 from the workpieces 1 .

參閱圖11,是本發明轉移設備200的第三實施例,其整體結構及轉移工件的方法大致與第二實施例相同,不同處在於該載具41的結構。Referring to FIG. 11 , it is a third embodiment of the transfer apparatus 200 of the present invention. The overall structure and the method for transferring workpieces are substantially the same as those of the second embodiment, and the difference lies in the structure of the carrier 41 .

在本第三實施例中,例如各該凹槽411其中一側的該第一側面413’為一傾斜地連接於該承載面412的導引斜面,該導引斜面用以供對應的該工件1接觸,且該導引斜面允許對應的該工件1於其上滑動。In the third embodiment, for example, the first side surface 413 ′ of one side of each of the grooves 411 is a guide slope connected to the bearing surface 412 obliquely, and the guide slope is used for the corresponding workpiece 1 contact, and the guide slope allows the corresponding workpiece 1 to slide thereon.

在該相對運動步驟S3中,若該移動平台421帶動該載具41沿該縱向Z向上移動的過程中沿該第一橫方向X略產生偏移,使得各該凹槽411的該第一側面413’與對應的該工件1底端接觸時,該第一側面413’施加於對應的該工件1的側向分力會促使其沿該第一橫方向X移動,同時該工件1會沿著該第一側面413’向下滑動,使得該工件1被該第一側面413’導引而能夠與該承載面412接觸。藉此,能確保該載具41在該第一橫方向X上有位置偏差的狀況下,各該工件1能夠確實地穿伸至對應的該凹槽411內並且接觸對應的該承載面412。In the relative movement step S3, if the moving platform 421 drives the carrier 41 to move upward along the longitudinal direction Z slightly offset along the first lateral direction X, so that the first side surface of each groove 411 is slightly offset. When 413' is in contact with the bottom end of the corresponding workpiece 1, the lateral component force applied by the first side surface 413' to the corresponding workpiece 1 will cause it to move along the first lateral direction X, and at the same time, the workpiece 1 will move along the The first side surface 413 ′ slides downward, so that the workpiece 1 can be guided by the first side surface 413 ′ to be in contact with the bearing surface 412 . Thereby, it can be ensured that each workpiece 1 can surely penetrate into the corresponding groove 411 and contact the corresponding bearing surface 412 under the condition that the carrier 41 has a positional deviation in the first lateral direction X.

需說明的是,在本第三實施例中,導引斜面也可以是下述不同的設計方式:例如各該凹槽411其中一側的該第二側面414為導引斜面;或者各該凹槽411兩側的該等第一側面413皆為導引斜面;或者各該凹槽411另兩側的該等第二側面414皆為導引斜面;或者各該凹槽411兩側的該等第一側面413以及另兩側的該等第二側面414皆為導引斜面。It should be noted that, in the third embodiment, the guiding inclined surface can also be designed in the following different ways: for example, the second side surface 414 on one side of each of the grooves 411 is a guiding inclined surface; The first sides 413 on both sides of the groove 411 are guide slopes; or the second sides 414 on the other sides of each groove 411 are guide slopes; or the two sides of each groove 411 Both the first side surface 413 and the second side surfaces 414 on the other two sides are guiding inclined surfaces.

參閱圖12,是本發明轉移設備200的第四實施例,其整體結構及轉移工件的方法大致與第一實施例相同,不同處在於該等工件1、該等凹槽411以及該等施壓件31的佈設方式不同。Referring to FIG. 12, it is the fourth embodiment of the transfer apparatus 200 of the present invention, the overall structure and the method of transferring workpieces are basically the same as those of the first embodiment, the difference lies in the workpieces 1, the grooves 411 and the pressing The arrangement of the pieces 31 is different.

在本第四實施例中,該等凹槽411與該等工件1的佈設方式不同,該第二間距P2與該第一間距P1不同。具體而言,該第二間距P2是以大於該第一間距P1為例,該第二間距P2是該第一間距P1的整數N倍,該整數N的數值是例如為2。當然,該整數N的數值也可為2以上的正整數。該等施壓件31與該等工件1的佈設方式不同,但與該等凹槽411的佈設方式相同,該第三間距P3的大小與該第二間距P2相同。In the fourth embodiment, the grooves 411 are arranged differently from the workpieces 1 , and the second distance P2 is different from the first distance P1 . Specifically, the second pitch P2 is larger than the first pitch P1, for example, the second pitch P2 is an integer N times the first pitch P1, and the value of the integer N is, for example, 2. Of course, the value of the integer N may be a positive integer of 2 or more. The arrangement of the pressing members 31 and the workpieces 1 is different, but is the same as the arrangement of the grooves 411 , and the size of the third distance P3 is the same as the second distance P2 .

在該對位步驟S2中,首先,透過該等移載夾具222帶動該黏著膜片21移動至該等施壓件31下方的位置,以及透過該移動平台421帶動該載具41移動至位於該黏著膜片21及該等工件1下方的位置。隨後,透過該影像感測器52與該影像辨識模組相配合以判斷該等凹槽411以及該等該等倒圓角311是否與選擇的該等工件1位置對齊。藉此,使得各該凹槽411能選擇性地與對應的該工件1位置對齊,以及各該施壓件31的該倒圓角311能選擇性地與對應的該工件1位置對齊。其中,該等工件1的另一部分則不會與該等凹槽411及該等施壓件31對齊。In the aligning step S2, firstly, the adhesive film 21 is driven to move to a position below the pressing members 31 through the transfer fixtures 222, and the carrier 41 is driven to move to the position below the pressure-applying members 31 through the moving platform 421 Adhesive film 21 and the position below the workpieces 1 . Then, the image sensor 52 cooperates with the image recognition module to determine whether the grooves 411 and the rounded corners 311 are aligned with the selected workpieces 1 . Thereby, each of the grooves 411 can be selectively aligned with the corresponding position of the workpiece 1 , and the rounded corners 311 of each of the pressing members 31 can be selectively aligned with the corresponding position of the workpiece 1 . The other parts of the workpieces 1 are not aligned with the grooves 411 and the pressing members 31 .

參閱圖13,在該相對運動步驟S3中,首先,透過該等移載夾具222帶動該黏著膜片21帶動沿該縱向Z向上移動,同時,透過該移動平台421帶動該載具41沿該縱向Z向上移動。當該等移載夾具222停止在圖13所示的位置時,該黏著膜片21的兩相反端略往上翹曲變形,各該倒圓角311緊迫下壓在該頂面212且與選擇的對應的該工件1位置對齊。當該載具41停止並定位在圖13所示的承載位置時,各該凹槽411供選擇的對應的該工件1容置。其中,未與該等凹槽411對齊的該等工件1的另一部分則會被該載具41的該頂面410往上頂撐,使得該等工件1的另一部分將該黏著膜片21往上頂撐使其變形。Referring to FIG. 13, in the relative movement step S3, firstly, the adhesive film 21 is driven to move upward along the longitudinal direction Z through the transfer fixtures 222, and at the same time, the carrier 41 is driven along the longitudinal direction through the moving platform 421 Z moves up. When the transfer fixtures 222 stop at the position shown in FIG. 13 , the two opposite ends of the adhesive film 21 are slightly warped and deformed upward, and each of the rounded corners 311 is pressed down on the top surface 212 tightly and is aligned with the selected The corresponding position of the workpiece 1 is aligned. When the carrier 41 is stopped and positioned at the bearing position shown in FIG. 13 , each of the grooves 411 is for accommodating the corresponding workpiece 1 . Wherein, the other parts of the workpieces 1 that are not aligned with the grooves 411 will be supported by the top surface 410 of the carrier 41 , so that the other parts of the workpieces 1 will move the adhesive film 21 to the top. The top brace makes it deformed.

參閱圖14,在該剝離步驟S4中,藉由該載具41持續地在該等工件1上施加橫向推力,使得該載具41能輕易且迅速地將容置於該等凹槽411內的對應該等工件1剝離該黏著面211。將該黏著膜片21上的該等工件1的一部分剝離後,重複進行上述步驟對該等工件1的另一部分進行剝離,便能將該黏著膜片21上的所有該等工件1剝離。Referring to FIG. 14 , in the peeling step S4 , the carrier 41 continuously exerts a lateral thrust on the workpieces 1 , so that the carrier 41 can easily and quickly remove the workpieces accommodated in the grooves 411 . The adhesive surface 211 is peeled off correspondingly to the workpiece 1 . After peeling off a part of the workpieces 1 on the adhesive film 21 , and repeating the above steps to peel off another part of the workpieces 1 , all the workpieces 1 on the adhesive film 21 can be peeled off.

參閱圖15,是本發明轉移設備200的第五實施例,其整體結構及轉移工件的方法大致與第一、二實施例相同,不同處在於該施壓件31的數量。Referring to FIG. 15 , it is a fifth embodiment of the transfer apparatus 200 of the present invention. The overall structure and the method for transferring workpieces are substantially the same as those of the first and second embodiments, except for the number of the pressing members 31 .

在本第五實施例中,該施壓件31的數量為一個。該載具41和第二實施例一樣形成該等吸附孔415。在該對位步驟S2中,首先,透過該等移載夾具222帶動該黏著膜片21移動至該施壓件31下方的位置,以及透過該移動平台421帶動該載具41移動至位於該黏著膜片21及該等工件1下方的位置。隨後,透過該影像感測器52(如圖5所示)及該影像辨識模組相配合以判斷該載具41與該黏著膜片21是否對位完成,以及判斷該施壓件31的該倒圓角311是否與其中一個該凹槽411及其中一個該工件1的位置對齊。具體而言,該施壓件31的該倒圓角311是與沿著該第一橫方向X排列的該等工件1中的一個最鄰近於側邊的該工件1位置對齊。In the fifth embodiment, the number of the pressing member 31 is one. The carrier 41 forms the adsorption holes 415 as in the second embodiment. In the alignment step S2, firstly, the adhesive film 21 is driven to move to a position below the pressing member 31 through the transfer fixtures 222, and the carrier 41 is driven to move to the position located in the adhesive film through the moving platform 421 The position below the diaphragm 21 and the workpieces 1 . Then, through the cooperation of the image sensor 52 (as shown in FIG. 5 ) and the image recognition module, it is judged whether the alignment of the carrier 41 and the adhesive film 21 is completed, and the position of the pressing member 31 is judged. Whether the rounded corner 311 is aligned with the position of one of the grooves 411 and one of the workpieces 1 . Specifically, the rounded corner 311 of the pressing member 31 is aligned with the workpiece 1 that is closest to the side of one of the workpieces 1 arranged along the first lateral direction X.

參閱圖16及圖17,在該相對運動步驟S3中,首先,透過該等移載夾具222帶動該黏著膜片21沿該縱向Z向上移動,同時,透過該移動平台421帶動該載具41沿該縱向Z向上移動。當該等移載夾具222停止在圖16所示的位置時,該施壓件31的該倒圓角311緊迫下壓在該頂面212且與對應的該工件1位置對齊。當該載具41停止並定位在圖16所示的承載位置時,該等工件1分別容置於該等凹槽411內。Referring to FIGS. 16 and 17 , in the relative movement step S3 , first, the adhesive film 21 is driven to move upward along the longitudinal direction Z through the transfer fixtures 222 , and at the same time, the carrier 41 is driven to move along the longitudinal direction Z through the moving platform 421 . The longitudinal direction Z moves upwards. When the transfer fixtures 222 stop at the positions shown in FIG. 16 , the rounded corners 311 of the pressing member 31 are pressed down on the top surface 212 and aligned with the corresponding position of the workpiece 1 . When the carrier 41 is stopped and positioned at the bearing position shown in FIG. 16 , the workpieces 1 are respectively accommodated in the grooves 411 .

隨後,該運動機構32的該運動平台321帶動該施壓件31沿該第一橫方向X於該黏著膜片21的該頂面212上移動,該施壓件31移對的過程中該倒圓角311透過該黏著膜片21依序施加壓力於該等工件1上,從而能依序破除該黏著面211與該等工件1頂面之間的氣密性,以降低該黏著面211與該等工件1頂面之間的黏著力,同時,還能依序地將該等工件1分別擠壓入該等凹槽411內。該施壓件31在前述移動過程中,當該施壓件31位在將對應的該工件1擠壓入對應的該凹槽411內的位置時,對應的該吸附孔415產生吸力吸附對應的該工件1,藉此,能確保該施壓件31移離前述位置時,前述對應的該工件1能夠被吸附而仍位在對應的該凹槽411內。當該施壓件31移動到與該等工件1中的另一個最鄰近於側邊的該工件1位置對齊時,該運動平台321即停止帶動該施壓件31移動。Subsequently, the moving platform 321 of the moving mechanism 32 drives the pressing member 31 to move along the first lateral direction X on the top surface 212 of the adhesive film 21 . The rounded corners 311 sequentially apply pressure on the workpieces 1 through the adhesive film 21, so as to break the air tightness between the adhesive surface 211 and the top surfaces of the workpieces 1 in sequence, so as to reduce the adhesion between the adhesive surface 211 and the workpieces 1. At the same time, the adhesion between the top surfaces of the workpieces 1 can also sequentially squeeze the workpieces 1 into the grooves 411 respectively. During the aforementioned movement of the pressing member 31 , when the pressing member 31 is at a position where the corresponding workpiece 1 is squeezed into the corresponding groove 411 , the corresponding suction hole 415 generates suction to attract the corresponding The workpiece 1, thereby, can ensure that when the pressing member 31 moves away from the aforementioned position, the aforementioned corresponding workpiece 1 can be adsorbed and still located in the corresponding groove 411 . When the pressing member 31 moves to align with the other workpiece 1 of the workpieces 1 that is closest to the side, the moving platform 321 stops driving the pressing member 31 to move.

參閱圖18,在該剝離步驟S4中,藉由該載具41持續地在該工件1上施加橫向推力,使得該載具41能輕易且迅速地將容置於該等凹槽411內的對應該等工件1剝離該黏著面211。重覆上述該相對運動步驟S3及該剝離步驟S4的動作直到需轉移的該等工件1皆轉至該載具41上。Referring to FIG. 18 , in the peeling step S4 , the carrier 41 continuously exerts a lateral thrust on the workpiece 1 , so that the carrier 41 can easily and quickly remove the pair of objects accommodated in the grooves 411 . The adhesive surface 211 should be peeled off from the workpiece 1 . The above-mentioned relative movement step S3 and the peeling step S4 are repeated until the workpieces 1 to be transferred are all transferred to the carrier 41 .

參閱圖19,是本發明轉移設備200的第六實施例,其整體結構及轉移工件的方法大致與第五實施例相同,不同處在於該施壓件31的結構。Referring to FIG. 19 , it is the sixth embodiment of the transfer apparatus 200 of the present invention. The overall structure and the method of transferring the workpiece are basically the same as those of the fifth embodiment, and the difference lies in the structure of the pressing member 31 .

在本第六實施例中,該施壓件31為一能轉動地樞接於一轉軸322的旋轉件,該施壓件31能夠繞該轉軸322所界定的一垂直於該第一横方向X的軸線A轉動。該運動平台321連接於該轉軸322一端。具體而言,該施壓件31是以一齒輪為例,其具有多個用以施壓於該黏著膜片21的該頂面212的齒輪齒312。In the sixth embodiment, the pressing member 31 is a rotating member rotatably pivoted to a rotating shaft 322 , and the pressing member 31 can be defined around the rotating shaft 322 and perpendicular to the first lateral direction X The axis A rotates. The moving platform 321 is connected to one end of the rotating shaft 322 . Specifically, the pressing member 31 is an example of a gear having a plurality of gear teeth 312 for pressing the top surface 212 of the adhesive film 21 .

參閱圖19及圖20,在該相對運動步驟S3中,該運動機構32的該運動平台321透過該轉軸322帶動該施壓件31沿該第一橫方向X於該黏著膜片21的該頂面212上移動,同時透過該轉軸322帶動該施壓件31於該頂面212沿一轉動方向R繞該軸線A轉動,使得該施壓件31能夠透過該等齒輪齒312施壓在該黏著膜片21的該頂面212。該施壓件31移對及轉動的過程中透過該等齒輪齒312施壓在該黏著膜片21並且依序將壓力傳遞於該等工件1上,從而能依序破除該黏著面211與該等工件1頂面之間的氣密性,以降低該黏著面211與該等工件1頂面之間的黏著力,同時,還能依序地將該等工件1分別擠壓入該等凹槽411內。該施壓件31在前述移動過程中,當該施壓件31位在將對應的該工件1擠壓入對應的該凹槽411內的位置時,對應的該吸附孔415產生吸力吸附對應的該工件1,藉此,能確保該施壓件31移離前述位置時,前述對應的該工件1能夠被吸附而仍位在對應的該凹槽411內。當該施壓件31移動到與該等工件1中的另一個最鄰近於側邊的該工件1位置對齊時,該運動平台321即停止帶動該施壓件31移動。19 and FIG. 20, in the relative movement step S3, the moving platform 321 of the moving mechanism 32 drives the pressing member 31 along the first lateral direction X on the top of the adhesive film 21 through the rotating shaft 322 At the same time, the pressing member 31 is driven on the top surface 212 to rotate along a rotation direction R around the axis A through the rotating shaft 322, so that the pressing member 31 can press the adhesive on the adhesive through the gear teeth 312. The top surface 212 of the diaphragm 21 . During the moving and rotating process of the pressing member 31, the adhesive film 21 is pressed through the gear teeth 312 and the pressure is transmitted to the workpieces 1 in sequence, so that the adhesive surface 211 and the Equal air tightness between the top surfaces of the workpieces 1 to reduce the adhesive force between the adhesive surface 211 and the top surfaces of the workpieces 1, and at the same time, the workpieces 1 can be sequentially squeezed into the recesses. in the groove 411. During the aforementioned movement of the pressing member 31 , when the pressing member 31 is at a position where the corresponding workpiece 1 is squeezed into the corresponding groove 411 , the corresponding suction hole 415 generates suction to attract the corresponding The workpiece 1, thereby, can ensure that when the pressing member 31 moves away from the aforementioned position, the aforementioned corresponding workpiece 1 can be adsorbed and still located in the corresponding groove 411 . When the pressing member 31 moves to align with the other workpiece 1 of the workpieces 1 that is closest to the side, the moving platform 321 stops driving the pressing member 31 to move.

參閱圖21,在該剝離步驟S4中,藉由該載具41持續地在該工件1上施加橫向推力,使得該載具41能輕易且迅速地將容置於該等凹槽411內的對應該等工件1剝離該黏著面211。Referring to FIG. 21 , in the peeling step S4 , the carrier 41 continuously exerts a lateral thrust on the workpiece 1 , so that the carrier 41 can easily and quickly remove the pair of objects accommodated in the grooves 411 . The adhesive surface 211 should be peeled off from the workpiece 1 .

參閱圖22及圖23,是本發明轉移設備200的第七實施例,其整體結構及轉移工件的方法大致與第四實施例相同,不同處在於該等工件1佈設在該黏著膜片21上的不同區域,以及該等凹槽411佈設在該載具41上的不同區域。Referring to FIGS. 22 and 23 , it is a seventh embodiment of the transfer apparatus 200 of the present invention. The overall structure and the method of transferring workpieces are substantially the same as those of the fourth embodiment, except that the workpieces 1 are arranged on the adhesive film 21 , and the grooves 411 are arranged in different areas on the carrier 41 .

該等工件1區分成佈設在該黏著膜片21上的至少兩個不同的黏著區域A1、A2,其中該黏著區域A1是鄰近於該黏著膜片21外圍,而該黏著區域A2是鄰近於該黏著膜片21中心。該黏著區域A1內的該第一間距P1與該黏著區域A2內的該第一間距P1’ 數值不同,該第一間距P1’ 數值是以小於該第一間距P1數值為例。The workpieces 1 are divided into at least two different adhesive areas A1 and A2 arranged on the adhesive film 21, wherein the adhesive area A1 is adjacent to the periphery of the adhesive film 21, and the adhesive area A2 is adjacent to the adhesive film 21. Adhere the center of the diaphragm 21. The value of the first distance P1 in the adhesion area A1 is different from the value of the first distance P1' in the adhesion area A2, and the value of the first distance P1' is smaller than the value of the first distance P1 as an example.

該等凹槽411區分成佈設在該載具41上的至少兩個不同的佈設區域L1、L2,其中該佈設區域L1是鄰近於該載具41外圍,而該佈設區域L2是鄰近於該載具41中心。該佈設區域L1內的該第二間距P2與該佈設區域L2內的該第二間距P2’數值不同,該第二間距P2’數值是以小於該第二間距P2數值為例。該佈設區域L1內的該第二間距P2是對應的該黏著區域A1內的該第一間距P1的整數N倍,而該佈設區域L2內的該第二間距P2’是對應的該黏著區域A2內的該第一間距P1’的整數N倍。藉此,該黏著膜片21及該載具41可依據區域分別有不同的該第一間距P1、P1’與該第二間距P2、P2’數值。The grooves 411 are divided into at least two different layout areas L1 and L2 disposed on the carrier 41 , wherein the layout area L1 is adjacent to the periphery of the carrier 41 , and the layout area L2 is adjacent to the carrier 41 . With 41 centers. The value of the second distance P2 in the layout area L1 is different from the value of the second distance P2' in the layout area L2, and the value of the second distance P2' is smaller than the value of the second distance P2 as an example. The second pitch P2 in the arrangement area L1 is an integer N times the first pitch P1 in the corresponding adhesive area A1, and the second pitch P2' in the arrangement area L2 is the corresponding adhesive area A2 Integer N times of the first pitch P1' within. Thereby, the adhesive film 21 and the carrier 41 can respectively have different values of the first pitch P1, P1' and the second pitch P2, P2' according to the region.

藉由將該等施壓件31(如圖12所示)的佈設方式設計成與圖23所示的該等凹槽411佈設方式相同,便能和第四實施例所揭露的內容一樣進行該等工件1的轉移。完成整體轉移後,該載具41將配合後續製程,進行相關後段製程。By designing the layout of the pressing members 31 (as shown in FIG. 12 ) to be the same as the layout of the grooves 411 shown in FIG. 23 , the process can be performed as disclosed in the fourth embodiment. Wait for the transfer of workpiece 1. After the overall transfer is completed, the carrier 41 will cooperate with the subsequent process to perform the related post-process.

綜上所述,藉由各實施例的轉移設備200進行轉移工件1的方法,只要執行少數幾個步驟便能一次將多個工件1快速地轉移至該載具41的該等凹槽411內,藉此能降低轉移工時並能大幅提升轉移效率。此外,由於該載具41為承載該等工件1以帶動其進行後續製程的目標載具,因此,在該載具41將該等工件1剝離該黏著膜片21時,即同時完成該等工件1的放料動作。藉此,將該載具41拆離該移動平台421後,該載具41便能帶動該等工件1進行後續製程,能大幅縮短將該等工件1轉移到後續製程所需的時間,故確實能達成本發明之目的。To sum up, the method for transferring workpieces 1 using the transfer apparatus 200 of each embodiment can quickly transfer a plurality of workpieces 1 into the grooves 411 of the carrier 41 at a time by only performing a few steps. , thereby reducing the transfer man-hours and greatly improving the transfer efficiency. In addition, since the carrier 41 is a target carrier for carrying the workpieces 1 to drive the workpieces 1 to carry out subsequent processes, the workpieces 1 are simultaneously completed when the carrier 41 peels off the workpieces 1 from the adhesive film 21 . 1 unloading action. In this way, after the carrier 41 is detached from the moving platform 421, the carrier 41 can drive the workpieces 1 to carry out the subsequent process, which can greatly shorten the time required for transferring the workpieces 1 to the subsequent process. The purpose of the present invention can be achieved.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention, and should not limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the application for patent of the present invention and the content of the patent specification are still within the scope of the present invention. within the scope of the invention patent.

1:工件 200:轉移設備 2:承載裝置 21:黏著膜片 211:黏著面 212:頂面 22:移載機構 221:基座 222:移載夾具 3:施壓裝置 31:施壓件 311:倒圓角 312:齒輪齒 32:運動機構 321:運動平台 322:轉軸 4:剝離裝置 41:載具 410:頂面 411:凹槽 412:承載面 413:第一側面 413’:第一側面 414:第二側面 415:吸附孔 42:移動機構 421:移動平台 5:控制裝置 51:控制器 52:影像感測器 53:壓力感測器 A:軸線 A1:黏著區域 A2:黏著區域 P1:第一間距 P1’:第一間距 P2:第二間距 P2’:第二間距 P3:第三間距 L1:佈設區域 L2:佈設區域 S1:提供步驟 S2:對位步驟 S3:相對運動步驟 S4:剝離步驟 R:旋轉方向 X:第一橫方向 Y:第二橫方向 Z:縱向1: Workpiece 200: Transfer equipment 2: carrying device 21: Adhesive film 211: Adhesive Noodles 212: top surface 22: Transfer mechanism 221: Pedestal 222: Transfer fixture 3: Pressure device 31: Pressure parts 311: rounded corners 312: Gear teeth 32: Movement mechanism 321: Motion Platform 322: Spindle 4: Stripping device 41: Vehicle 410: Top surface 411: Groove 412: Bearing surface 413: First side 413’: first side 414: Second side 415: adsorption hole 42: Moving Mechanisms 421: Mobile Platforms 5: Control device 51: Controller 52: Image sensor 53: Pressure sensor A: axis A1: Adhesion area A2: Adhesion area P1: first pitch P1': first pitch P2: Second pitch P2': second pitch P3: The third pitch L1: Layout area L2: Layout area S1: Provide steps S2: Alignment step S3: Relative movement step S4: Stripping step R: direction of rotation X: the first horizontal direction Y: the second horizontal direction Z: portrait

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是本發明轉移設備的第一實施例的一局部剖視示意圖,說明多個工件、一承載裝置、一施壓裝置,及一剝離裝置之間的配置關係; 圖2是該第一實施例的一局部剖視示意圖; 圖3是該第一實施例的一方塊圖; 圖4是透過該第一實施例進行轉移工件的方法的一步驟流程圖; 圖5是該第一實施例的一局部剖視示意圖; 圖6是該第一實施例的一局部剖視示意圖,說明一載具容置該等工件,以及多個施壓件緊迫下壓在一黏著膜片上; 圖7是該第一實施例的一局部剖視示意圖,說明該載具移動並施加橫向推力於該等工件; 圖8是該第一實施例的一局部剖視示意圖,說明該載具移動並施加橫向推力於該等工件; 圖9是該第一實施例的一局部剖視示意圖,說明該載具帶動剝離的該等工件下移; 圖10是本發明轉移設備的第二實施例的一局部剖視示意圖; 圖11是本發明轉移設備的第三實施例的一局部剖視示意圖; 圖12是本發明轉移設備的第四實施例的一局部剖視示意圖; 圖13是該第四實施例的一局部剖視示意圖; 圖14是該第四實施例的一局部剖視示意圖; 圖15是本發明轉移設備的第五實施例的一局部剖視示意圖; 圖16是該第五實施例的一局部剖視示意圖; 圖17是該第五實施例的一局部剖視示意圖; 圖18是該第五實施例的一局部剖視示意圖; 圖19是本發明轉移設備的第六實施例的一局部剖視示意圖; 圖20是該第六實施例的一局部剖視示意圖; 圖21是該第六實施例的一局部剖視示意圖; 圖22是本發明轉移設備的第七實施例的該黏著膜片的一仰視圖;及 圖23是該第七實施例的該載具的一俯視圖。Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: 1 is a partial cross-sectional schematic view of the first embodiment of the transfer apparatus of the present invention, illustrating the configuration relationship among a plurality of workpieces, a carrying device, a pressing device, and a peeling device; Fig. 2 is a partial cross-sectional schematic view of the first embodiment; 3 is a block diagram of the first embodiment; FIG. 4 is a one-step flow chart of the method for transferring workpieces by the first embodiment; Figure 5 is a partial cross-sectional schematic view of the first embodiment; 6 is a partial cross-sectional schematic view of the first embodiment, illustrating a carrier for accommodating the workpieces, and a plurality of pressing members pressing down on an adhesive film; 7 is a schematic partial cross-sectional view of the first embodiment, illustrating the movement of the carrier and applying lateral thrust to the workpieces; 8 is a schematic partial cross-sectional view of the first embodiment, illustrating the movement of the carrier and applying lateral thrust to the workpieces; 9 is a partial cross-sectional schematic view of the first embodiment, illustrating that the carrier drives the peeled workpieces to move down; Fig. 10 is a partial cross-sectional schematic view of the second embodiment of the transfer apparatus of the present invention; Fig. 11 is a partial cross-sectional schematic view of the third embodiment of the transfer apparatus of the present invention; Fig. 12 is a partial cross-sectional schematic view of the fourth embodiment of the transfer apparatus of the present invention; Figure 13 is a partial cross-sectional schematic view of the fourth embodiment; Figure 14 is a partial cross-sectional schematic view of the fourth embodiment; Fig. 15 is a partial cross-sectional schematic view of the fifth embodiment of the transfer apparatus of the present invention; Figure 16 is a partial cross-sectional schematic view of the fifth embodiment; Figure 17 is a partial cross-sectional schematic view of the fifth embodiment; Figure 18 is a partial cross-sectional schematic view of the fifth embodiment; Fig. 19 is a partial cross-sectional schematic view of the sixth embodiment of the transfer apparatus of the present invention; Figure 20 is a partial cross-sectional schematic view of the sixth embodiment; Figure 21 is a partial cross-sectional schematic view of the sixth embodiment; Figure 22 is a bottom view of the adhesive film of the seventh embodiment of the transfer apparatus of the present invention; and 23 is a top view of the carrier of the seventh embodiment.

1:工件1: Workpiece

200:轉移設備200: Transfer equipment

2:承載裝置2: carrying device

21:黏著膜片21: Adhesive film

211:黏著面211: Adhesive Noodles

212:頂面212: top surface

22:移載機構22: Transfer mechanism

221:基座221: Pedestal

222:移載夾具222: Transfer fixture

3:施壓裝置3: Pressure device

31:施壓件31: Pressure parts

311:倒圓角311: rounded corners

32:運動機構32: Movement mechanism

321:運動平台321: Motion Platform

4:剝離裝置4: Stripping device

41:載具41: Vehicle

410:頂面410: Top surface

411:凹槽411: Groove

412:承載面412: Bearing surface

413:第一側面413: First side

42:移動機構42: Moving Mechanisms

421:移動平台421: Mobile Platforms

53:壓力感測器53: Pressure sensor

P1:第一間距P1: first pitch

P2:第二間距P2: Second pitch

P3:第三間距P3: The third pitch

X:第一橫方向X: the first horizontal direction

Y:第二橫方向Y: the second horizontal direction

Z:縱向Z: portrait

Claims (22)

一種轉移設備,適於進行多個工件的轉移,該轉移設備包含: 一承載裝置,包括一黏著膜片,該黏著膜片具有一用以黏著該等工件的黏著面,及一相反於該黏著面的頂面; 一施壓裝置,位於該黏著膜片上方,用以下壓該頂面; 一剝離裝置,包括一位於該黏著膜片下方的載具,該載具形成有多個凹槽,各該凹槽用以供位置對齊的對應的該工件容置,在該施壓裝置下壓該頂面且各該凹槽容置對應的該工件的狀態下,該載具能夠移動以施力在容置於該等凹槽內的對應該等工件並將其剝離該黏著面;及 一控制裝置,用以控制該黏著膜片、該載具以及該施壓裝置之間的相對位置與位移。A transfer device suitable for transferring a plurality of workpieces, the transfer device comprising: a carrier device, comprising an adhesive film, the adhesive film has an adhesive surface for adhering the workpieces, and a top surface opposite to the adhesive surface; A pressing device, located above the adhesive film, presses the top surface with the following; A peeling device includes a carrier located under the adhesive film, the carrier is formed with a plurality of grooves, each of the grooves is used for accommodating the corresponding workpieces aligned in position, and the pressing device is pressed down In a state in which the top surface and each of the grooves accommodate the corresponding workpiece, the carrier can move to apply force to the corresponding workpiece accommodated in the grooves and peel it off the adhesive surface; and A control device is used to control the relative position and displacement among the adhesive film, the carrier and the pressing device. 如請求項1所述的轉移設備,其中,該剝離裝置還包括一連接該載具的移動機構,該移動機構用以帶動該載具至少沿一第一橫方向移動。The transfer device according to claim 1, wherein the peeling device further comprises a moving mechanism connected to the carrier, and the moving mechanism is used to drive the carrier to move at least along a first lateral direction. 如請求項2所述的轉移設備,其中,該移動機構還用以帶動該載具沿一垂直於該第一橫方向的第二橫方向移動。The transfer device according to claim 2, wherein the moving mechanism is further used to drive the carrier to move along a second lateral direction perpendicular to the first lateral direction. 如請求項2或3所述的轉移設備,其中,該承載裝置還包括一連接該黏著膜片的移載機構,該移載機構用以帶動該黏著膜片至少沿一縱向上下移動,該移動機構還用以帶動該載具沿該縱向上下移動。The transfer device according to claim 2 or 3, wherein the carrying device further comprises a transfer mechanism connected to the adhesive film, the transfer mechanism is used to drive the adhesive film to move up and down at least along a longitudinal direction, the moving The mechanism is also used to drive the carrier to move up and down along the longitudinal direction. 如請求項1所述的轉移設備,其中,該施壓裝置包括多個分別與該等工件位置相對應的施壓件,各該施壓件用以下壓在該頂面對齊於對應該工件的部位。The transfer device according to claim 1, wherein the pressing device comprises a plurality of pressing pieces corresponding to the positions of the workpieces, and each of the pressing pieces is aligned with the corresponding workpiece on the top surface with the following pressing force. part. 如請求項1所述的轉移設備,其中,該等工件沿一橫方向相間隔排列,該施壓裝置包括一用以下壓該頂面的施壓件,及一連接該施壓件的運動機構,該運動機構用以帶動該施壓件至少沿該橫方向於該頂面上移動以依序施壓於該等工件並將該等工件擠壓入該等凹槽內。The transfer equipment according to claim 1, wherein the workpieces are arranged at intervals along a lateral direction, the pressing device includes a pressing member for pressing the top surface below, and a movement mechanism connected to the pressing member , the motion mechanism is used to drive the pressing member to move on the top surface at least along the transverse direction to press the workpieces in sequence and squeeze the workpieces into the grooves. 如請求項6所述的轉移設備,其中,該施壓件為一能夠繞一垂直於該横方向的軸線轉動的旋轉件,該運動機構還用以帶動該施壓件沿該橫方向移動過程中同時於該頂面上繞該軸線轉動。The transfer device according to claim 6, wherein the pressing member is a rotating member that can rotate around an axis perpendicular to the lateral direction, and the motion mechanism is further used to drive the pressing member to move along the lateral direction while rotating around the axis on the top surface. 6或7所述的轉移設備,其中,該載具還形成有多個分別連通該等凹槽的吸附孔,各該吸附孔用以吸附對應的該工件。The transfer device according to 6 or 7, wherein the carrier is further formed with a plurality of adsorption holes respectively communicating with the grooves, and each of the adsorption holes is used for adsorbing the corresponding workpiece. 如請求項1所述的轉移設備,其中,該載具具有多個分別位於該等凹槽一側的導引斜面,各該導引斜面用以供對應的該工件接觸,各該導引斜面允許對應的該工件於其上滑動。The transfer device according to claim 1, wherein the carrier has a plurality of guide slopes respectively located on one side of the grooves, each guide slope is used for contacting the corresponding workpiece, and each guide slope The corresponding workpiece is allowed to slide thereon. 如請求項1所述的轉移設備,其中,該等工件中的兩個相鄰工件之間形成有一第一間距,該等凹槽與該等工件的佈設方式相同,該等凹槽中的兩個相鄰凹槽之間形成有一第二間距,該第二間距與該第一間距相同,該等凹槽分別與該等工件位置對齊且分別供該等工件容置。The transfer device according to claim 1, wherein a first distance is formed between two adjacent workpieces among the workpieces, the grooves are arranged in the same manner as the workpieces, and two of the grooves are arranged in the same manner as the workpieces. A second distance is formed between the adjacent grooves, the second distance is the same as the first distance, and the grooves are respectively aligned with the workpieces and are respectively accommodated by the workpieces. 如請求項1所述的轉移設備,其中,該等工件中的兩個相鄰工件之間形成有一第一間距,該等凹槽與該等工件的佈設方式不同,該等凹槽中的兩個相鄰凹槽之間形成有一第二間距,該第二間距與該第一間距不同,各該凹槽能選擇性地與對應的該工件對位並供其容置。The transfer device according to claim 1, wherein a first distance is formed between two adjacent workpieces among the workpieces, the grooves are arranged differently from the workpieces, and two of the grooves are arranged in a different manner. A second spacing is formed between the adjacent grooves, the second spacing is different from the first spacing, and each of the grooves can be selectively aligned with the corresponding workpiece and accommodated therein. 如請求項11所述的轉移設備,其中,該第二間距大於該第一間距,該第二間距是該第一間距的整數倍。The transfer device of claim 11, wherein the second distance is greater than the first distance, and the second distance is an integer multiple of the first distance. 如請求項11所述的轉移設備,其中,該等工件區分成佈設在該黏著膜片上的至少兩個不同的黏著區域,該等黏著區域內的該第一間距數值不同,該等凹槽區分成佈設在該載具上的至少兩個不同的佈設區域,該等佈設區域內的該第二間距數值不同,各該佈設區域內的該第二間距是對應的該黏著區域內的該第一間距的整數倍。The transfer device according to claim 11, wherein the workpieces are divided into at least two different adhesive areas arranged on the adhesive film, the first spacing values in the adhesive areas are different, and the grooves It is divided into at least two different layout areas arranged on the carrier, the value of the second spacing in the layout areas is different, and the second spacing in each layout area corresponds to the first spacing in the adhesive area. integer multiples of a spacing. 一種轉移工件的方法,適於進行多個工件的轉移,該方法包含下述步驟: 提供步驟,提供一黏著膜片,該黏著膜片以一位於底端的黏著面黏著該等工件; 對位步驟,進行該黏著膜片、一具有多個凹槽的載具,及一施壓裝置之間的對位,使各該凹槽與對應的該工件位置對齊,以及該施壓裝置對應於該黏著膜片的一相反於該黏著面的頂面; 相對運動步驟,進行該黏著膜片、該載具,及該施壓裝置之間的相對運動,使該載具的各該凹槽容置位置對齊的對應的該工件,以及該施壓裝置下壓該頂面;及 剝離步驟,移動該載具使其施力在容置於該等凹槽內的對應該等工件並將其剝離該黏著面。A method for transferring workpieces, suitable for transferring a plurality of workpieces, the method comprising the steps of: providing a step of providing an adhesive film for adhering the workpieces with an adhesive surface at the bottom end; The alignment step is to perform alignment between the adhesive film, a carrier with a plurality of grooves, and a pressing device, so that each of the grooves is aligned with the corresponding position of the workpiece, and the pressing device corresponds to on a top surface of the adhesive film opposite to the adhesive surface; The relative movement step is to carry out the relative movement between the adhesive film, the carrier, and the pressing device, so that the corresponding workpieces of the grooves of the carrier are aligned with each other, and the lower part of the pressing device pressing the top surface; and In the peeling step, the carrier is moved to exert force on the corresponding workpieces accommodated in the grooves and peeled off the adhesive surface. 如請求項14所述的轉移工件的方法,其中,在該剝離步驟中,透過一移動機構帶動該載具沿一第一橫方向移動。The method for transferring workpieces as claimed in claim 14, wherein, in the peeling step, the carrier is driven to move along a first lateral direction by a moving mechanism. 如請求項15所述的轉移工件的方法,其中,在該剝離步驟中,還透過該移動機構帶動該載具沿一垂直於該第一橫方向的第二橫方向移動。The method for transferring workpieces according to claim 15, wherein, in the peeling step, the moving mechanism is also used to drive the carrier to move along a second lateral direction perpendicular to the first lateral direction. 如請求項14所述的轉移工件的方法,其中,在該相對運動步驟中,該施壓裝置透過多個施壓件施壓於該頂面,且各該施壓件下壓在該頂面對齊於對應該工件的部位。The method for transferring workpieces as claimed in claim 14, wherein, in the relative movement step, the pressing device presses the top surface through a plurality of pressing members, and each of the pressing members presses down on the top surface Align with the part corresponding to the workpiece. 如請求項14所述的轉移工件的方法,其中,在該相對運動步驟中,該施壓裝置透過一施壓件施壓於該頂面,且該施壓裝置還透過一運動機構帶動該施壓件至少沿一橫方向於該頂面上移動以依序施壓於該等工件並將該等工件擠壓入該等凹槽內,當該施壓件位在將對應的該工件擠壓入對應的該凹槽內的位置時,透過一與對應的該凹槽連通的吸附孔產生吸力吸附對應的該工件。The method for transferring workpieces as claimed in claim 14, wherein, in the relative movement step, the pressing device presses the top surface through a pressing member, and the pressing device also drives the pressing device through a motion mechanism The pressing piece moves on the top surface at least along a lateral direction to press the workpieces in sequence and squeeze the workpieces into the grooves. When the pressing piece is positioned to press the corresponding workpieces When entering the corresponding position in the groove, suction is generated through an adsorption hole communicated with the corresponding groove to attract the corresponding workpiece. 如請求項18所述的轉移工件的方法,其中,在該相對運動步驟中,該運動機構還帶動該施壓件沿該橫方向移動過程中同時繞一垂直於該横方向的軸線於該頂面上轉動。The method for transferring workpieces as claimed in claim 18, wherein, in the relative movement step, the movement mechanism also drives the pressing member to move along the lateral direction while moving at the top around an axis perpendicular to the lateral direction. face turning. 如請求項14所述的轉移工件的方法,其中,在該相對運動步驟中,透過一與對應的該凹槽連通的吸附孔產生吸力吸附對應的該工件。The method for transferring a workpiece according to claim 14, wherein, in the relative movement step, a suction force is generated to adsorb the corresponding workpiece through an adsorption hole communicating with the corresponding groove. 如請求項14所述的轉移工件的方法,其中,該等凹槽與該等工件的佈設方式相同,該等凹槽分別與該等工件位置對齊且分別供該等工件容置。The method for transferring workpieces as claimed in claim 14, wherein the grooves are arranged in the same manner as the workpieces, and the grooves are respectively aligned with the workpieces and are respectively accommodated by the workpieces. 如請求項14所述的轉移工件的方法,其中,該等凹槽與該等工件的佈設方式不同,各該凹槽能選擇性地與對應的該工件對位並供其容置。The method for transferring workpieces as claimed in claim 14, wherein the grooves and the workpieces are arranged in different ways, and each of the grooves can selectively align with and accommodate the corresponding workpiece.
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