CN113808987A - Transfer apparatus and method of transferring work - Google Patents

Transfer apparatus and method of transferring work Download PDF

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Publication number
CN113808987A
CN113808987A CN202010809282.5A CN202010809282A CN113808987A CN 113808987 A CN113808987 A CN 113808987A CN 202010809282 A CN202010809282 A CN 202010809282A CN 113808987 A CN113808987 A CN 113808987A
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China
Prior art keywords
workpiece
carrier
workpieces
grooves
top surface
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Pending
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CN202010809282.5A
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Chinese (zh)
Inventor
萧育竹
吴权峰
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Xiansheng Technology Co ltd
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Xiansheng Technology Co ltd
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Publication of CN113808987A publication Critical patent/CN113808987A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A transfer apparatus and a method of transferring workpieces are adapted to perform transfer of a plurality of workpieces. The transfer equipment comprises a bearing device, a pressing device, a stripping device and a control device. The bearing device comprises an adhesion membrane, wherein the adhesion membrane is provided with an adhesion surface for adhering the workpiece and a top surface. The pressure device is positioned above the adhesive film and used for pressing the top surface downwards. The stripping device comprises a carrier positioned below the adhesion membrane, the carrier is provided with a plurality of grooves, each groove is used for accommodating a corresponding workpiece aligned in position, and the carrier can move to apply force to the corresponding workpiece accommodated in the groove and strip the adhesion surface under the state that the pressing device presses the top surface and each groove accommodates the corresponding workpiece. The control device is used for controlling the relative position and displacement among the adhesive film, the carrier and the pressure device. Therefore, the transfer working hours can be reduced and the transfer efficiency can be improved.

Description

Transfer apparatus and method of transferring work
Technical Field
The present invention relates to a transfer apparatus and a method of transferring a workpiece, and more particularly, to a transfer apparatus and a method of transferring a workpiece for peeling off a workpiece and transferring the workpiece to a carrier.
Background
In a semiconductor process, a plurality of chips adhered to a film after dicing need to be transferred to a substrate, so as to facilitate a subsequent chip packaging process.
The currently common transfer method is performed by a pick-and-place device, the pick-and-place device sucks a corresponding chip on the film by a suction nozzle, then the chip is ejected by a thimble on the base, and the suction nozzle drives the chip to move so as to peel the chip off the film, and finally the suction nozzle drives the chip to move and place the chip on the substrate, thereby completing the pick-and-place operation of a single chip. The suction nozzles of the pick-and-place device can only sequentially pick and place the chips one by one, and the action steps required to be executed when the suction nozzles pick and place each chip are multiple and the consumed working hours are long, so that the long working hours are required to be consumed when all the chips on the diaphragm are transferred to the substrate, and the time required for transferring the chips to the subsequent processing procedure is influenced. Therefore, the conventional transfer method has the problems of slow transfer speed and poor efficiency.
Disclosure of Invention
It is therefore an object of the present invention to provide a transfer apparatus that overcomes at least one of the disadvantages of the background art.
The object of the present invention and the problem of the background art are achieved by the following technical solutions, according to the transfer apparatus proposed by the present invention, it is suitable for transferring a plurality of workpieces.
The transfer equipment comprises a bearing device, a pressure applying device, a peeling device and a control device, wherein the bearing device comprises an adhesive film, the adhesive film has an adhesive surface for adhering the workpiece, and a top surface opposite to the adhesive surface, the pressure device is positioned above the adhesive film and used for pressing the top surface downwards, the stripping device comprises a carrier positioned below the adhesive film, the carrier is provided with a plurality of grooves, each groove is used for accommodating the corresponding workpiece with aligned position, under the state that the pressing device presses the top surface downwards and each groove accommodates the corresponding workpiece, the carrier can move to apply force on the corresponding workpiece accommodated in the groove and peel the workpiece from the adhesion surface, the control device is used for controlling the relative position and displacement among the adhesive film, the carrier and the pressure device.
In the transfer apparatus of the present invention, the peeling device further includes a moving mechanism connected to the carrier, and the moving mechanism is configured to drive the carrier to move at least along a first horizontal direction.
In the transfer apparatus of the present invention, the moving mechanism is further configured to drive the carrier to move along a second horizontal direction perpendicular to the first horizontal direction.
In the transfer apparatus of the present invention, the carrying device further includes a transferring mechanism connected to the adhesive film, the transferring mechanism is configured to drive the adhesive film to move at least vertically, and the moving mechanism is further configured to drive the carrier to move vertically.
In the transfer apparatus of the present invention, the pressing device includes a plurality of pressing members respectively corresponding to the positions of the workpieces, and each of the pressing members is configured to press down a portion of the top surface aligned with the corresponding workpiece.
According to the transfer equipment, the workpieces are arranged at intervals in the transverse direction, the pressing device comprises a pressing piece used for pressing the top surface downwards and a moving mechanism connected with the pressing piece, and the moving mechanism is used for driving the pressing piece to move on the top surface at least in the transverse direction so as to press the workpieces in sequence and press the workpieces into the grooves.
According to the transfer device, the pressing piece is a rotating piece capable of rotating around an axis perpendicular to the transverse direction, and the moving mechanism is further used for driving the pressing piece to rotate around the axis on the top surface during moving along the transverse direction.
In the transfer apparatus of the present invention, the carrier further has a plurality of adsorption holes respectively communicating with the grooves, and each of the adsorption holes is used for adsorbing the corresponding workpiece.
In the transfer apparatus of the present invention, the carrier has a plurality of guiding inclined planes respectively located at one side of the groove, each guiding inclined plane is used for contacting with the corresponding workpiece, and each guiding inclined plane allows the corresponding workpiece to slide thereon.
According to the transfer equipment, a first space is formed between two adjacent workpieces in the workpieces, the arrangement mode of the grooves is the same as that of the workpieces, a second space is formed between two adjacent grooves in the grooves, the second space is the same as the first space, and the grooves are respectively aligned with the positions of the workpieces and are respectively accommodated by the workpieces.
According to the transfer equipment, a first space is formed between two adjacent workpieces in the workpieces, the arrangement modes of the grooves and the workpieces are different, a second space is formed between two adjacent grooves in the grooves, the second space is different from the first space, and each groove can be selectively aligned with the corresponding workpiece and is used for accommodating the workpiece.
In the transfer apparatus of the present invention, the second pitch is larger than the first pitch, and the second pitch is an integral multiple of the first pitch.
In the transfer apparatus of the present invention, the workpiece region is divided into at least two different adhesion regions arranged on the adhesion film, the first pitch values in the adhesion regions are different, the groove region is divided into at least two different arrangement regions arranged on the carrier, the second pitch values in the arrangement regions are different, and the second pitch in each arrangement region is an integral multiple of the first pitch in the corresponding adhesion region.
It is an object of the present invention to provide a method of transferring workpieces that overcomes at least one of the disadvantages of the background art.
The object of the present invention and the problem of the background art are achieved by the following technical solutions, and the method for transferring workpieces according to the present invention is suitable for transferring a plurality of workpieces.
The method comprises the following steps:
providing an adhesion membrane, wherein the adhesion membrane adheres the workpiece by an adhesion surface positioned at the bottom end;
aligning, namely aligning the adhesive film, a carrier with a plurality of grooves and a pressure applying device to align the grooves with the corresponding workpiece positions, wherein the pressure applying device corresponds to the top surface of the adhesive film opposite to the adhesive surface;
a relative movement step of performing relative movement among the adhesive film, the carrier and the pressure applying device to align the accommodating positions of the grooves of the carrier with the corresponding workpieces, and pressing the top surface by the pressure applying device; and
and a stripping step, namely moving the carrier to apply force to the corresponding workpiece accommodated in the groove and stripping the workpiece from the adhesion surface.
In the method for transferring the workpiece, in the peeling step, the carrier is driven by the moving mechanism to move along the first transverse direction.
In the method for transferring a workpiece of the present invention, in the peeling step, the carrier is further driven by the moving mechanism to move along a second transverse direction perpendicular to the first transverse direction.
In the method for transferring a workpiece of the present invention, in the relative movement step, the pressing device presses the top surface by a plurality of pressing members, and each of the pressing members presses down a portion of the top surface aligned with the corresponding workpiece.
In the relative movement step, the pressing device presses the top surface through the pressing piece, the pressing device further drives the pressing piece to move on the top surface at least along the transverse direction through the movement mechanism so as to sequentially press the workpieces and extrude the workpieces into the grooves, and when the pressing piece is positioned at a position where the corresponding workpiece is extruded into the corresponding groove, suction force is generated through the suction hole communicated with the corresponding groove to suck the corresponding workpiece.
In the method for transferring the workpiece, in the relative movement step, the movement mechanism further drives the pressing member to simultaneously rotate on the top surface around an axis perpendicular to the transverse direction during the movement of the pressing member along the transverse direction.
In the method for transferring a workpiece of the present invention, in the relative movement step, suction force is generated through suction holes communicating with the corresponding grooves to suck the corresponding workpieces.
According to the method for transferring the workpiece, the grooves are arranged in the same way as the workpiece, and the grooves are respectively aligned with the workpiece and are respectively used for accommodating the workpiece.
According to the method for transferring the workpieces, the arrangement mode of the grooves is different from that of the workpieces, and each groove can be selectively aligned with and accommodated in the corresponding workpiece.
The invention has the beneficial effects that: the multiple workpieces can be quickly transferred into the grooves of the carrier at one time, so that the transfer working hours can be reduced, and the transfer efficiency can be greatly improved. In addition, the carrier is a target carrier for bearing the workpiece to drive the workpiece to carry out subsequent processing, so that when the carrier peels the workpiece off the adhesive film, the workpiece is discharged. Therefore, after the carrier is detached from the mobile platform, the carrier can drive the workpiece to carry out subsequent processing, and the time for transferring the workpiece to the subsequent processing can be greatly shortened.
Drawings
FIG. 1 is a schematic partial cross-sectional view of a first embodiment of a transfer apparatus of the present invention, illustrating the arrangement of a plurality of workpieces, a carrier, a pressing device, and a peeling device;
FIG. 2 is a schematic view, partly in section, of the first embodiment;
FIG. 3 is a block diagram of the first embodiment;
FIG. 4 is a flow chart of the steps of a method of transferring a workpiece by the first embodiment;
FIG. 5 is a schematic view, partly in section, of the first embodiment;
FIG. 6 is a schematic view, partially in section, of the first embodiment illustrating a carrier receiving the workpiece and a plurality of press elements pressed down against an adhesive film;
fig. 7 is a schematic partial cross-sectional view of the first embodiment illustrating the carrier moving and applying a lateral thrust to the workpiece;
fig. 8 is a schematic partial cross-sectional view of the first embodiment illustrating the carrier moving and applying a lateral thrust to the workpiece;
FIG. 9 is a schematic partial cross-sectional view of the first embodiment illustrating the carrier moving the stripped workpiece downward;
FIG. 10 is a schematic view, partly in section, of a second embodiment of the transfer device of the present invention;
FIG. 11 is a schematic view, partly in section, of a third embodiment of the transfer device of the present invention;
FIG. 12 is a schematic view, partly in section, of a fourth embodiment of the transfer device of the present invention;
FIG. 13 is a schematic view, partly in section, of the fourth embodiment;
FIG. 14 is a schematic view, partly in section, of the fourth embodiment;
FIG. 15 is a schematic view, partly in section, of a fifth embodiment of the transfer device of the present invention;
FIG. 16 is a schematic view, partly in section, of the fifth embodiment;
FIG. 17 is a schematic view, partly in section, of the fifth embodiment;
FIG. 18 is a schematic view, partly in section, of the fifth embodiment;
FIG. 19 is a schematic view, partly in section, of a sixth embodiment of the transfer device of the present invention;
FIG. 20 is a schematic partial cross-sectional view of the sixth embodiment;
FIG. 21 is a schematic view in partial section of the sixth embodiment;
FIG. 22 is a bottom view of the adhesive film sheet of the seventh embodiment of the transfer device of the present invention; and
fig. 23 is a top view of the carrier of the seventh embodiment.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Before the present invention is described in detail, it should be noted that in the following description, like elements are represented by like reference numerals.
Referring to fig. 1 and 2, a first embodiment of a transfer apparatus 200 according to the present invention is shown, wherein the transfer apparatus 200 is suitable for transferring a plurality of workpieces 1 in a process. In the first embodiment, the process is, for example, a semiconductor process, and each workpiece 1 is, for example, a semiconductor device, specifically, a chip. The length dimension of each of the work pieces 1 taken along a first transverse direction X and the width dimension taken along a second transverse direction Y perpendicular to the first transverse direction X are between 50um and 10mm, and the thickness dimension of each of the work pieces 1 taken along a longitudinal direction Z perpendicular to the first transverse direction X and the second transverse direction Y is, for example, between 10um and 1 mm. The first lateral direction X is, for example, a front-rear direction, the second lateral direction Y is, for example, a left-right direction, and the longitudinal direction Z is, for example, a vertical direction. Of course, each of the workpieces 1 may be any other kind of workpiece that needs to be transferred from a working area to a carrier in other processes and then transferred to a subsequent process through the carrier, and is not limited to a chip.
Referring to fig. 1, the transfer apparatus 200 includes a carrying device 2, a pressing device 3, a peeling device 4, and a control device 5 (shown in fig. 3). The carrying device 2 includes an adhesive film 21 and a transferring mechanism 22 connected to the adhesive film 21. The adhesive film 21 is a blue film, for example, and the thickness thereof is between 100um and 2 mm. The adhesive film 21 has an adhesive surface 211 facing downward for adhering the work 1, and a top surface 212 opposite to the adhesive surface 211. The adhesion membrane 21 may also be a UV gel-releasing membrane, a thermal gel-releasing membrane, a silica gel membrane, or a PVA membrane, and is not limited to a blue membrane.
The transfer mechanism 22 is a three-axis moving mechanism and includes a base 221, two transfer jigs 222, and a driving mechanism (not shown). The transfer jig 222 is movably connected to the base 221, and the transfer jig 222 is movable on the base 221 in the first lateral direction X, the second lateral direction Y, or the longitudinal direction Z by being driven by the driving mechanism. The transfer jigs 222 are respectively connected to two opposite ends of the adhesive film 21, and the transfer jigs 222 can apply a reverse pulling force to the adhesive film 21, so that the adhesive film 21 is in a flat and tight state as shown in fig. 1. The transfer mechanism 22 can drive the adhesive film 21 to move along the first transverse direction X, the second transverse direction Y and the longitudinal direction Z by the transfer fixture 222. The transfer jig 222 of the first embodiment is an example of a method of clamping the adhesive film 21, but the adhesive film 21 may be fixed by frame fixing or vacuum suction.
The pressing device 3 includes a plurality of pressing members 31, and a moving mechanism 32 connected to the pressing members 31. The pressing member 31 is located above the adhesive film 21 to press down the top surface 212 of the adhesive film 21. In the present first embodiment, the number of the pressing members 31 is the same as the number of the workpieces 1, and the pressing members 31 can be respectively aligned with the workpiece 1 positions. Each of the pressing members 31 is, for example, in the form of a long strip and has a rounded corner 311 at a bottom end, and a width dimension of the rounded corner 311 taken along the first transverse direction X is, for example, 10% to 60% of a length or width dimension of the workpiece 1. The rounded corner 311 of each pressing member 31 is used for pressing down the portion of the top surface 212 aligned with the corresponding workpiece 1, so that pressure can be applied between the adhesive surface 211 and the top surface of the corresponding workpiece 1 through the adhesive film 21 to reduce the adhesion between the adhesive surface 211 and the top surface of the corresponding workpiece 1. The pressing member 31 may have other shapes such as a needle shape, a long trapezoidal shape, or a long triangular shape.
The motion mechanism 32 is a three-axis moving mechanism and includes a motion platform 321 and a driving mechanism (not shown). The pressing member 31 is fixedly disposed at the bottom end of the moving platform 321. The driving structure is configured to drive the moving platform 321 to move along the first transverse direction X, the second transverse direction Y, or the longitudinal direction Z, so that the moving platform 321 can drive the pressing member 31 to move along the first transverse direction X, the second transverse direction Y, and the longitudinal direction Z.
Referring to fig. 1 and 2, the peeling apparatus 4 includes a carrier 41 and a moving mechanism 42 connected to the carrier 41. The carrier 41 is located below the adhesive film 21 for peeling and carrying the workpiece 1, the carrier 41 has a top surface 410, the top surface 410 of the carrier 41 is recessed downward to form a plurality of grooves 411 spaced from each other, and each groove 411 is used for accommodating the corresponding workpiece 1 in an aligned position. In the first embodiment, the carrier 41 is, for example, a tray, which is a target carrier for driving the workpiece 1 to perform a subsequent process. Of course, the carrier 41 may be a target carrier of other carrying type such as a wiring substrate, a lead frame or a glass substrate. The number of the grooves 411 is the same as the number of the workpieces 1, and the grooves 411 can be aligned with the workpieces 1 respectively. The openings of the recesses 411 face upward, and each of the recesses 411 is defined by a supporting surface 412 of the carrier 41, two first side surfaces 413 respectively connected to two opposite sides of the supporting surface 412, and two second side surfaces 414 respectively connected to the other two opposite sides of the supporting surface 412. The first side surfaces 413 are spaced apart along the first transverse direction X, and the second side surfaces 414 are spaced apart along the second transverse direction Y. Each of the first side surfaces 413 and each of the second side surfaces 414 are, for example, vertical surfaces.
The depth of each groove 411 along the longitudinal direction Z is, for example, 50% to 70% of the thickness of each workpiece 1 along the longitudinal direction Z, so that each workpiece 1 can partially protrude out of the top surface 410 of the carrier 41 by a proper distance after being accommodated in the corresponding groove 411. The length dimension of each of the concave grooves 411 taken along the first transverse direction X and the width dimension taken along the second transverse direction Y are, for example, 110% to 130% of the length of each of the workpieces 1, so that the space of each of the concave grooves 411 is large enough for the corresponding workpiece 1 to penetrate through.
For convenience of description, the work 1, the concave 411 and the pressing member 31 of the first embodiment are arranged in the same manner, and are arranged at intervals, for example, along the first transverse direction X. A first pitch P1 is formed between every two adjacent workpieces 1 along the first transverse direction X, a second pitch P2 is formed between every two adjacent grooves 411 along the first transverse direction X, a third pitch P3 is formed between the rounded corners 311 of every two adjacent pressing elements 31 along the first transverse direction X, and the first pitch P1, the second pitch P2 and the third pitch P3 are all the same in size. Of course, the arrangement of the work 1, the concave slot 411 and the pressing member 31 in the first embodiment may be arranged at intervals in the first transverse direction X and the second transverse direction Y, respectively, and is not limited to the arrangement.
The moving mechanism 42 is a three-axis moving mechanism and includes a moving platform 421 and a driving mechanism (not shown). The carrier 41 is detachably assembled and fixed on the top surface of the moving platform 421. The carrier 41 and the movable platform 421 can be assembled and fixed together by a screw locking method or a snap-fit method in which a hook is matched with a slot. The driving structure is configured to drive the moving platform 421 to move along the first horizontal direction X, the second horizontal direction Y, or the longitudinal direction Z, so that the moving platform 421 can drive the carrier 41 to move along the first horizontal direction X, the second horizontal direction Y, and the longitudinal direction Z.
Referring to fig. 3, the control device 5 includes a controller 51, an image sensor 52, and a plurality of pressure sensors 53. The controller 51 is electrically connected to the driving structure of the transfer mechanism 22, the driving structure of the movement mechanism 32, and the driving structure of the movement mechanism 42. The image sensor 52 is electrically connected to the controller 51 for capturing images. The pressure sensors 53 are electrically connected to the controller 51 and respectively disposed on the pressing member 31 (as shown in fig. 1), and each of the pressure sensors 53 is configured to sense a pressure applied by the corresponding pressing member 31 to the adhesive film 21.
The following is a detailed description of a method of transferring a workpiece using the transfer apparatus 200 of the first embodiment:
FIG. 4 is a flowchart of the steps of the method of transferring a workpiece, including the steps of providing S1, aligning S2, relatively moving S3, and peeling S4.
Referring to fig. 1 and 4, in the providing step S1, the adhesive film 21 is provided to adhere a wafer (not shown) on the adhesive surface 211, and the wafer on the adhesive film 21 is cut by a conventional cutting (dicing) method to form a plurality of separated chips, i.e., the chips 1 adhered on the adhesive surface 211. Thereafter, the transfer jig 222 applies a reverse pulling force to the adhesive film 21 in the first transverse direction X, so that the adhesive film 21 is in a flat and tight state as shown in fig. 1.
Referring to fig. 3, 4 and 5, in the alignment step S2, the carrier 41, the adhesive film 21 and the pressing device 3 are aligned. In the first embodiment, for example, the rounded corner 311 of the pressing member 31 is preset as a reference origin to be used as a basis for subsequent alignment of the carrier 41 and the adhesive film 21.
First, the transfer fixture 222 drives the adhesive film 21 to move to a position below the pressing member 31, so that the top surface 212 of the adhesive film 21 and the rounded corner 311 are spaced apart from each other by a certain distance along the longitudinal direction Z. Then, the moving platform 421 drives the carrier 41 to move to the position below the adhesive film 21 and the workpiece 1 shown in fig. 5, so that the top surface 410 of the carrier 41 and the bottom surface of the workpiece 1 are spaced apart from each other by a certain distance along the longitudinal direction Z, where the distance is, for example, 10um to 1 mm. Subsequently, an image is captured from above the adhesive film 21 by, for example, the image sensor 52 disposed at the bottom end of the motion platform 321, and after the controller 51 receives the image, an image recognition module (not shown) of the controller 51 recognizes the image to determine whether the alignment between the carrier 41 and the adhesive film 21 is completed. In the image, whether the alignment of the carrier 41 and the adhesive film 21 is completed is determined, for example, by whether the groove 411 and the workpiece 1 are aligned along the longitudinal direction Z, or by whether the alignment mark on the carrier 41 and the alignment mark on the adhesive film 21 are aligned along the longitudinal direction Z. Meanwhile, the image recognition module compares the image with a reference image which is stored in advance by the controller 51 and has reference origin position information of the fillet 311, so as to determine whether the positions of the groove 411 and the workpiece 1 are aligned with the position of the fillet 311.
When the position of the workpiece 1 or the recess 411 deviates, the controller 51 controls the driving mechanism of the transferring mechanism 22 to operate to finely adjust the position of the workpiece 1, or controls the driving mechanism of the moving mechanism 42 to operate to finely adjust the position of the recess 411. Thereby, each of the recesses 411 is aligned with the corresponding workpiece 1 position, and the rounded corner 311 of each of the pressing members 31 is aligned with the corresponding workpiece 1 position.
It should be noted that, in the first embodiment, the groove 411 may be preset as a reference origin to be used as a basis for subsequent alignment of the adhesive film 21 and the pressing member 31. At this time, the image sensor 5 may be disposed on the top of the mobile platform 421 for capturing an image from the lower side of the adhesive film 21, and the image recognition module compares the image with a pre-stored reference image having the reference origin position information of the groove 411.
Referring to fig. 3, 4 and 6, in the relative movement step S3, the relative movement among the adhesive film 21, the carrier 41 and the pressing device 3 is performed. In the positioning step S2, the pressing member 31 is kept in a fixed state because the rounded corner 311 of the pressing member 31 is preset as a reference origin.
First, the transfer fixture 222 drives the adhesive film 21 to move in the longitudinal direction Z, and the moving platform 421 drives the carrier 41 to move in the longitudinal direction Z. During the upward movement of the adhesive film 21, when the top surface 212 is contacted and blocked by the rounded corner 311 of the pressing member 31, the adhesive film 21 cannot move upward further. The transfer fixture 222 moves upward a suitable distance and pulls the opposite ends of the adhesive film 21 upward, so that the opposite ends of the adhesive film 21 are slightly warped upward, and thus, each rounded corner 311 can be pressed down on the top surface 212 aligned with the corresponding workpiece 1. At this time, the transfer jig 222 can be stopped at the position shown in fig. 6.
By slightly warping and deforming the opposite ends of the adhesive film 21 upward, the adhesive surface 211 can be expanded to reduce the adhesive force. By applying a downward force to the top surface 212 in a stress concentration manner through each rounded corner 311 and transmitting the downward force to the corresponding workpiece 1 through the adhesive film 21, the airtightness between the adhesive surface 211 and the top surface of the corresponding workpiece 1 can be broken, so as to further reduce the adhesive force between the adhesive surface 211 and the top surface of the corresponding workpiece 1.
During the process of moving the carrier 41 upward, the workpieces 1 will first penetrate into the grooves 411, and then each of the carrying surfaces 412 will contact and push the bottom surface of the corresponding workpiece 1 upward, and the pushing force thereof will be transmitted to the corresponding pressing member 31 through the corresponding workpiece 1 and the adhesive film 21. In the first embodiment, the pressure sensors 53 sense the pushing force applied to the corresponding workpiece 1 by the corresponding bearing surface 412, and the sensed pushing force can be used as information for determining whether each workpiece 1 is actually accommodated in the corresponding recess 411. After receiving the signal of the pushing force, the controller 51 compares the value of the pushing force with a preset value. When the value of the pushing force is smaller than the preset value, the controller 51 controls the driving structure of the moving mechanism 42 to continue driving the moving platform 421 to move upward. When the controller 51 determines that the value of the pushing force is the same as the preset value, the controller 51 controls the driving structure of the moving mechanism 42 to stop driving the moving platform 421 to move upward, so that the carrier 41 is positioned at a carrying position shown in fig. 6. Therefore, the corresponding workpieces 1 with aligned accommodating positions of the grooves 411 can be ensured.
It should be noted that the relative movement among the adhesive film 21, the carrier 41 and the pressing device 3 in the first embodiment may be in another two manners:
in one embodiment, the carrier 41 is kept stationary, and the transfer fixture 222 drives the adhesive film 21 to move downward along the longitudinal direction Z, so that the workpieces 1 are respectively accommodated in the grooves 411. The pressing member 31 is driven by the moving platform 321 to move downward along the longitudinal direction Z, so that the rounded corner 311 presses the top surface 212 of the adhesive film 21.
Alternatively, the adhesive film 21 is kept in a fixed state, the moving platform 321 drives the pressing member 31 to move downward along the longitudinal direction Z, so that the rounded corner 311 presses the top surface 212 of the adhesive film 21, and then the moving platform 421 drives the carrier 41 to move upward along the longitudinal direction Z, so that the workpieces 1 are respectively accommodated in the grooves 411.
Referring to fig. 4, 7 and 8, in the peeling step S4, for example, the carrier 41 is driven by the moving platform 421 to move a small distance along the first transverse direction X, so that one of the first side surfaces 413 applies a transverse pushing force to a side of the corresponding workpiece 1 received in the corresponding recess 411. Then, the moving platform 421 drives the carrier 41 to move a small distance along the second transverse direction Y, so that one of the second side surfaces 414 applies a transverse pushing force to the other side of the corresponding workpiece 1 accommodated in the corresponding groove 411.
The lateral thrust exerted by the first side surface 413 on one side of the corresponding workpiece 1 and the lateral thrust exerted by the second side surface 414 on the other side of the corresponding workpiece 1 correspond to a shear force parallel to the adhesive surface 211, and by continuously exerting the lateral thrust on the workpiece 1, the adhesion force between the top surface of the workpiece 1 and the adhesive surface 211 can be gradually reduced, so that the carrier 41 can easily and rapidly peel the workpiece 1 off the adhesive surface 211.
Note that, the peeling step S4 of the first embodiment may also be implemented as follows:
the carrier 41 is driven by the moving platform 421 to move along the first transverse direction X, and only one of the first side surfaces 413 applies a transverse thrust to the workpiece 1;
the moving platform 421 drives the carrier 41 to move along the second transverse direction Y, and only one of the second side surfaces 414 applies a transverse thrust to the workpiece 1;
the moving platform 421 drives the carrier 41 to reciprocate along the first transverse direction X, and then reciprocates along the second transverse direction Y, so that the first side 413 and the second side 414 can both apply a transverse thrust to the corresponding workpiece 1;
only the carrier 41 is driven by the moving platform 421 to reciprocate along the first transverse direction X, so that the first side surfaces 413 can apply a transverse thrust to the corresponding workpieces 1;
the moving platform 421 only drives the carrier 41 to move back and forth along the second transverse direction Y, so that the second side surfaces 414 can apply a transverse thrust to the corresponding workpieces 1.
Referring to fig. 9, when the workpiece 1 is separated from the adhesion surface 211 without being adhered thereto, the moving platform 421 can drive the carrier 41 to move downward along the longitudinal direction Z. Then, the carrier 41 is detached from the moving platform 421, and the carrier 41 can drive the workpiece 1 to perform a subsequent packaging process.
Referring to fig. 10, a second embodiment of a transfer apparatus 200 of the present invention is substantially the same in overall structure and method of transferring workpieces as the first embodiment, except for the structure of the carrier 41.
In the second embodiment, the carrier 41 further has a plurality of suction holes 415 respectively communicating with the bottom ends of the recesses 411, and each of the suction holes 415 is formed on the corresponding carrying surface 412. Negative pressure is generated in each of the suction holes 415 by an external force, so that each of the suction holes 415 can suck the bottom surface of the corresponding workpiece 1 in a vacuum suction manner.
In the relative movement step S3, after each of the workpieces 1 is received in the corresponding recess 411, each of the suction holes 415 sucks the bottom surface of the corresponding workpiece 1 in a vacuum suction manner, so that each of the workpieces 1 can be stably positioned in the corresponding recess 411. In the peeling step S4, each of the suction holes 415 maintains a state in which the corresponding work 1 is vacuum-sucked. In the process that the moving platform 421 drives the carrier 41 to move along the first transverse direction X or the second transverse direction Y, the carrier 41 drives the workpiece 1 to move transversely through the suction force generated by the suction holes 415, so as to gradually reduce the adhesive force between the top surface of the workpiece 1 and the adhesive surface 211, and the carrier 41 can easily and rapidly peel off the workpiece 1 from the adhesive surface 211.
Referring to fig. 11, a third embodiment of a transfer apparatus 200 of the present invention is substantially the same in overall structure and method of transferring workpieces as the second embodiment, except for the structure of the carrier 41.
In the third embodiment, for example, the first side 413' of one side of each of the concave cavities 411 is a guiding inclined surface obliquely connected to the carrying surface 412, the guiding inclined surface is used for being contacted by the corresponding workpiece 1, and the guiding inclined surface allows the corresponding workpiece 1 to slide thereon.
In the relative movement step S3, if the moving platform 421 drives the carrier 41 to move upward along the longitudinal direction Z while slightly deviating along the first transverse direction X, so that the first side surfaces 413 'of the respective recesses 411 contact the bottom end of the corresponding workpiece 1, the lateral component force applied to the corresponding workpiece 1 by the first side surfaces 413' will cause the corresponding workpiece 1 to move along the first transverse direction X, and at the same time, the workpiece 1 will slide downward along the first side surfaces 413 ', so that the workpiece 1 is guided by the first side surfaces 413' and can contact the carrying surface 412. Thereby, it is ensured that each workpiece 1 can reliably extend into the corresponding recess 411 and contact the corresponding bearing surface 412 under the condition that the carrier 41 has a positional deviation in the first transverse direction X.
It should be noted that, in the third embodiment, the guide slope may also be designed in different ways as follows: for example, the second side 414 of one side of each of the recesses 411 is a guiding slant; or the first side 413 of the other side of each groove 411 is also a guide slope; or the second side surfaces 414 on the other two sides of each recess 411 are guiding inclined surfaces; or the first side surfaces 413, 413' of two sides and the second side surfaces 414 of the other two sides of each groove 411 are guiding inclined surfaces.
Referring to fig. 12, a fourth embodiment of the transfer apparatus 200 of the present invention is substantially the same in overall structure and method of transferring workpieces as the first embodiment, except that the workpieces 1, the pockets 411, and the pressing members 31 are arranged in a different manner.
In the fourth embodiment, the arrangement of the grooves 411 and the arrangement of the workpieces 1 are different, and the second pitch P2 and the first pitch P1 are different. Specifically, the second pitch P2 is greater than the first pitch P1, for example, the second pitch P2 is an integer N times the first pitch P1, and the integer N has a value of, for example, 2. Of course, the numerical value of the integer N may be a positive integer of 2 or more. The pressing elements 31 are arranged in a manner different from that of the workpiece 1 but the same as that of the grooves 411, and the third pitch P3 is the same as the second pitch P2.
In the alignment step S2, first, the adhesive film 21 is moved to a position below the pressing member 31 by the transfer jig 222, and the carrier 41 is moved to a position below the adhesive film 21 and the workpiece 1 by the moving platform 421. Subsequently, the image sensor 52 cooperates with the image recognition module to determine whether the recess 411 and the fillet 311 are aligned with the selected position of the workpiece 1. Thereby, each of the recesses 411 can be selectively aligned with the corresponding workpiece 1 position, and the rounded corners 311 of each of the pressing members 31 can be selectively aligned with the corresponding workpiece 1 position. Wherein another portion of the workpiece 1 is not aligned with the recess 411 and the pressing member 31.
Referring to fig. 13, in the relative movement step S3, first, the transfer fixture 222 drives the adhesive film 21 to move in the longitudinal direction Z, and the moving platform 421 drives the carrier 41 to move in the longitudinal direction Z. When the transfer jig 222 is stopped at the position shown in fig. 13, the opposite ends of the adhesive film 21 are slightly warped upward, and each of the rounded corners 311 is pressed down against the top surface 212 and aligned with the selected corresponding position of the workpiece 1. When the carrier 41 is stopped and positioned at the carrying position shown in fig. 13, each of the recesses 411 is configured to receive a corresponding selected workpiece 1. Wherein another portion of the workpiece 1 not aligned with the recess 411 is supported upward by the top surface 410 of the carrier 41, so that another portion of the workpiece 1 supports the adhesive film 21 upward to deform it.
Referring to fig. 14, in the peeling step S4, the carrier 41 continuously applies a lateral pushing force on the workpiece 1, so that the carrier 41 can easily and rapidly peel the corresponding workpiece 1 accommodated in the recess 411 from the adhesive surface 211. After a part of the work 1 on the adhesive film 21 is peeled off, the above-described steps are repeated to peel off another part of the work 1, so that all the works 1 on the adhesive film 21 can be peeled off.
Referring to fig. 15, a fifth embodiment of the transfer apparatus 200 of the present invention, the overall structure and method of transferring workpieces are substantially the same as the second embodiment, except for the number of pressing members 31.
In the present fifth embodiment, the number of the pressing members 31 is one. The carrier 41 forms the adsorption hole 415 as in the second embodiment. In the alignment step S2, first, the adhesive film 21 is moved to a position below the pressing member 31 by the transfer jig 222, and the carrier 41 is moved to a position below the adhesive film 21 and the workpiece 1 by the moving platform 421. Subsequently, the image sensor 52 (shown in fig. 5) and the image recognition module cooperate to determine whether the alignment of the carrier 41 and the adhesive film 21 is completed, and whether the rounded corners 311 of the pressing member 31 are aligned with one of the grooves 411 and one of the workpieces 1. Specifically, the rounded corner 311 of the pressing member 31 is aligned with the position of one of the work pieces 1 arranged along the first lateral direction X, which is the most adjacent to the side edge of the work piece 1.
Referring to fig. 16 and 17, in the relative movement step S3, first, the transfer fixture 222 drives the adhesive film 21 to move in the longitudinal direction Z, and the moving platform 421 drives the carrier 41 to move in the longitudinal direction Z. When the transfer jig 222 is stopped at the position shown in fig. 16, the rounded corners 311 of the pressing member 31 are pressed down against the top surface 212 and aligned with the corresponding positions of the workpieces 1. When the carriers 41 are stopped and positioned at the loading position shown in fig. 16, the workpieces 1 are respectively received in the slots 411.
Subsequently, the moving platform 321 of the moving mechanism 32 drives the pressing member 31 to move on the top surface 212 of the adhesive film 21 along the first transverse direction X, and the rounded corners 311 sequentially apply pressure on the workpiece 1 through the adhesive film 21 during the movement of the pressing member 31, so that the air tightness between the adhesive surface 211 and the top surface of the workpiece 1 can be sequentially broken, the adhesive force between the adhesive surface 211 and the top surface of the workpiece 1 is reduced, and meanwhile, the workpieces 1 can be sequentially pressed into the grooves 411 respectively. When the pressing member 31 is located at a position for pressing the corresponding workpiece 1 into the corresponding groove 411 during the moving process, the corresponding suction hole 415 generates suction force to suck the corresponding workpiece 1, thereby ensuring that the corresponding workpiece 1 can be sucked and still located in the corresponding groove 411 when the pressing member 31 is moved away from the position. When the pressing member 31 is moved to be aligned with the other of the work pieces 1 closest to the side edge, the moving platform 321 stops moving the pressing member 31.
Referring to fig. 18, in the peeling step S4, the carrier 41 continuously applies a lateral pushing force on the workpiece 1, so that the carrier 41 can easily and rapidly peel the corresponding workpiece 1 accommodated in the recess 411 from the adhesive surface 211. The above-mentioned relative movement step S3 and the peeling step S4 are repeated until all the workpieces 1 to be transferred are transferred to the carrier 41.
Referring to fig. 19, a sixth embodiment of a transfer apparatus 200 of the present invention is generally the same in overall structure and method of transferring a workpiece as the fifth embodiment, except for the structure of the pressing member 31.
In the sixth embodiment, the pressing member 31 is a rotating member pivotally connected to a rotating shaft 322, and the pressing member 31 can rotate around an axis a defined by the rotating shaft 322 and perpendicular to the first transverse direction X. The moving platform 321 is connected to one end of the rotating shaft 322. Specifically, the pressing member 31 is exemplified by a gear having a plurality of gear teeth 312 for pressing the top surface 212 of the adhesive film 21.
Referring to fig. 19 and 20, in the relative movement step S3, the moving platform 321 of the moving mechanism 32 drives the pressing member 31 to move on the top surface 212 of the adhesive film 21 along the first transverse direction X through the rotating shaft 322, and simultaneously drives the pressing member 31 to rotate on the top surface 212 along a rotation direction R around the axis a through the rotating shaft 322, so that the pressing member 31 can press on the top surface 212 of the adhesive film 21 through the gear teeth 312. During the movement and rotation of the pressing member 31, the gear teeth 312 press the adhesive film 21 and sequentially transmit the pressure to the workpiece 1, so that the air tightness between the adhesive surface 211 and the top surface of the workpiece 1 can be sequentially broken, the adhesive force between the adhesive surface 211 and the top surface of the workpiece 1 can be reduced, and simultaneously, the workpieces 1 can be sequentially pressed into the grooves 411. When the pressing member 31 is located at a position for pressing the corresponding workpiece 1 into the corresponding groove 411 during the moving process, the corresponding suction hole 415 generates suction force to suck the corresponding workpiece 1, thereby ensuring that the corresponding workpiece 1 can be sucked and still located in the corresponding groove 411 when the pressing member 31 is moved away from the position. When the pressing member 31 is moved to be aligned with the position of the other one of the work pieces 1 which is most adjacent to the side edge, the moving platform 321 stops driving the pressing member 31 to move.
Referring to fig. 21, in the peeling step S4, the carrier 41 continuously applies a lateral pushing force on the workpiece 1, so that the carrier 41 can easily and rapidly peel the corresponding workpiece 1 accommodated in the recess 411 from the adhesive surface 211.
Referring to fig. 22 and 23, a seventh embodiment of the transfer apparatus 200 of the present invention is substantially the same as the fourth embodiment in terms of the overall structure and the method of transferring the work pieces 1, except that the work pieces 1 are disposed on different areas of the adhesive film 21, and the grooves 411 are disposed on different areas of the carrier 41.
The work 1 area is divided into at least two distinct adhesion areas a1, a2 arranged on the adhesive film 21, wherein the adhesion area a1 is adjacent to the periphery of the adhesive film 21 and the adhesion area a2 is adjacent to the center of the adhesive film 21. A first pitch P1 formed between every two adjacent workpieces 1 in the adhesion region a1 along the first transverse direction X is different from a first pitch P1 'formed between every two adjacent workpieces 1 in the adhesion region a2 along the first transverse direction X, and the first pitch P1' is exemplified by a smaller value than the first pitch P1.
The recess 411 is divided into at least two different layout areas L1, L2, which are arranged on the carrier 41, wherein the layout area L1 is adjacent to the periphery of the carrier 41 and the layout area L2 is adjacent to the center of the carrier 41. A second pitch P2 formed in the first transverse direction X between every two adjacent recesses 411 in the layout region L1 is different in value from a second pitch P2 'formed in the first transverse direction X between every two adjacent recesses 411 in the layout region L2, and the value of the second pitch P2' is exemplified as being smaller than that of the second pitch P2. The second pitch P2 in the layout region L1 is an integer N times the first pitch P1 in the corresponding adhesive region A1, and the second pitch P2 'in the layout region L2 is an integer N times the first pitch P1' in the corresponding adhesive region A2. Thereby, the adhesive film 21 and the carrier 41 can have different values of the first pitch P1, P1 'and the second pitch P2, P2' according to regions, respectively.
By designing the arrangement of the pressing member 31 (shown in fig. 12) in the same manner as the arrangement of the recess 411 shown in fig. 23, the transfer of the workpiece 1 can be performed as disclosed in the fourth embodiment. After the overall transfer is completed, the carrier 41 will perform the related back-end process in cooperation with the subsequent processes.
In summary, in the method for transferring the workpieces 1 by the transferring apparatus 200 of each embodiment, a plurality of workpieces 1 can be quickly transferred into the recess 411 of the carrier 41 by performing only a few steps, so that the transferring time can be reduced and the transferring efficiency can be greatly improved. In addition, since the carrier 41 is a target carrier for carrying the workpiece 1 to drive the workpiece 1 to perform a subsequent process, when the carrier 41 peels the workpiece 1 off the adhesive film 21, the discharging of the workpiece 1 is completed at the same time. Therefore, after the carrier 41 is detached from the moving platform 421, the carrier 41 can drive the workpiece 1 to perform a subsequent process, so that the time required for transferring the workpiece 1 to the subsequent process can be greatly shortened, and the purpose of the invention can be achieved.

Claims (22)

1. A transfer apparatus adapted to perform transfer of a plurality of workpieces; the method is characterized in that:
the transfer equipment comprises a bearing device, a pressure applying device, a peeling device and a control device, wherein the bearing device comprises an adhesive film, the adhesive film has an adhesive surface for adhering the workpiece, and a top surface opposite to the adhesive surface, the pressure device is positioned above the adhesive film and used for pressing the top surface downwards, the stripping device comprises a carrier positioned below the adhesive film, the carrier is provided with a plurality of grooves, each groove is used for accommodating the corresponding workpiece with aligned position, under the state that the pressing device presses the top surface downwards and each groove accommodates the corresponding workpiece, the carrier can move to apply force on the corresponding workpiece accommodated in the groove and peel the workpiece from the adhesion surface, the control device is used for controlling the relative position and displacement among the adhesive film, the carrier and the pressure device.
2. The transfer apparatus according to claim 1, characterized in that: the peeling device further comprises a moving mechanism connected with the carrier, and the moving mechanism is used for driving the carrier to move at least along a first transverse direction.
3. The transfer apparatus according to claim 2, characterized in that: the moving mechanism is further used for driving the carrier to move along a second transverse direction perpendicular to the first transverse direction.
4. The transfer apparatus according to claim 2 or 3, characterized in that: the bearing device further comprises a transfer mechanism connected with the adhesion membrane, the transfer mechanism is used for driving the adhesion membrane to move at least vertically, and the moving mechanism is also used for driving the carrier to move vertically.
5. The transfer apparatus according to claim 1, characterized in that: the pressing device comprises a plurality of pressing pieces which correspond to the positions of the workpieces respectively, and each pressing piece is used for pressing down the position, aligned to the corresponding workpiece, of the top surface.
6. The transfer apparatus according to claim 1, characterized in that: the workpieces are arranged at intervals along the transverse direction, the pressure applying device comprises a pressure applying piece used for pressing the top surface downwards and a moving mechanism connected with the pressure applying piece, and the moving mechanism is used for driving the pressure applying piece to move on the top surface at least along the transverse direction so as to sequentially apply pressure to the workpieces and extrude the workpieces into the grooves.
7. The transfer apparatus according to claim 6, characterized in that: the pressing piece is a rotating piece capable of rotating around an axis perpendicular to the transverse direction, and the moving mechanism is further used for driving the pressing piece to rotate around the axis on the top surface in the process of moving along the transverse direction.
8. The transfer apparatus according to claim 1, claim 6 or claim 7, characterized in that: the carrier is further provided with a plurality of adsorption holes respectively communicated with the grooves, and each adsorption hole is used for adsorbing the corresponding workpiece.
9. The transfer apparatus according to claim 1, characterized in that: the carrier is provided with a plurality of guide inclined planes respectively positioned at one side of the groove, each guide inclined plane is used for being contacted by the corresponding workpiece, and each guide inclined plane allows the corresponding workpiece to slide on the guide inclined plane.
10. The transfer apparatus according to claim 1, characterized in that: a first interval is formed between two adjacent workpieces in the workpieces, the arrangement mode of the grooves and the workpieces is the same, a second interval is formed between two adjacent grooves in the grooves, the second interval is the same as the first interval, and the grooves are respectively aligned with the positions of the workpieces and are respectively used for accommodating the workpieces.
11. The transfer apparatus according to claim 1, characterized in that: a first interval is formed between two adjacent workpieces in the workpieces, the arrangement modes of the grooves and the workpieces are different, a second interval is formed between two adjacent grooves in the grooves, the second interval is different from the first interval, and each groove can be selectively aligned with the corresponding workpiece and is accommodated by the corresponding workpiece.
12. The transfer apparatus according to claim 11, characterized in that: the second pitch is greater than the first pitch, and the second pitch is an integer multiple of the first pitch.
13. The transfer apparatus according to claim 11, characterized in that: the workpiece area is divided into at least two different adhesion areas arranged on the adhesion film, the first spacing values in the adhesion areas are different, the groove area is divided into at least two different arrangement areas arranged on the carrier, the second spacing values in the arrangement areas are different, and the second spacing values in the arrangement areas are integral multiples of the first spacing values in the corresponding adhesion areas.
14. A method of transferring workpieces, adapted to perform the transfer of a plurality of workpieces; the method is characterized in that:
the method comprises the following steps:
providing an adhesion membrane, wherein the adhesion membrane adheres the workpiece by an adhesion surface positioned at the bottom end;
aligning, namely aligning the adhesive film, a carrier with a plurality of grooves and a pressure applying device to align the grooves with the corresponding workpiece positions, wherein the pressure applying device corresponds to the top surface of the adhesive film opposite to the adhesive surface;
a relative movement step of performing relative movement among the adhesive film, the carrier and the pressure applying device to align the accommodating positions of the grooves of the carrier with the corresponding workpieces, and pressing the top surface by the pressure applying device; and
and a stripping step, namely moving the carrier to apply force to the corresponding workpiece accommodated in the groove and stripping the workpiece from the adhesion surface.
15. The method of transferring a workpiece according to claim 14, wherein: in the stripping step, the carrier is driven to move along a first transverse direction through a moving mechanism.
16. The method of transferring a workpiece according to claim 15, wherein: in the peeling step, the carrier is driven by the moving mechanism to move along a second transverse direction perpendicular to the first transverse direction.
17. The method of transferring a workpiece according to claim 14, wherein: in the relative movement step, the pressing device presses the top surface through a plurality of pressing pieces, and each pressing piece presses down a part of the top surface, which is aligned with the corresponding workpiece.
18. The method of transferring a workpiece according to claim 14, wherein: in the relative movement step, the pressing device presses the top surface through a pressing piece, the pressing device further drives the pressing piece to move on the top surface at least along the transverse direction through a movement mechanism so as to sequentially press the workpieces and press the workpieces into the grooves, and when the pressing piece is located at a position where the corresponding workpiece is pressed into the corresponding groove, suction force is generated through a suction hole communicated with the corresponding groove to suck the corresponding workpiece.
19. The method of transferring a workpiece according to claim 18, wherein: in the relative movement step, the movement mechanism further drives the pressing piece to simultaneously rotate on the top surface around an axis perpendicular to the transverse direction during the movement of the pressing piece along the transverse direction.
20. The method of transferring a workpiece according to claim 14, wherein: in the relative movement step, suction force is generated through suction holes communicated with the corresponding grooves to suck the corresponding workpieces.
21. The method of transferring a workpiece according to claim 14, wherein: the arrangement mode of the grooves is the same as that of the workpieces, and the grooves are respectively aligned with the positions of the workpieces and are respectively used for accommodating the workpieces.
22. The method of transferring a workpiece according to claim 14, wherein: the arrangement modes of the grooves and the workpieces are different, and each groove can be selectively aligned with and accommodated by the corresponding workpiece.
CN202010809282.5A 2020-06-15 2020-08-12 Transfer apparatus and method of transferring work Pending CN113808987A (en)

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TW109120065 2020-06-15

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CN116884906A (en) * 2023-08-08 2023-10-13 广东工业大学 Film scribing thorn crystal type Mini-LED huge transfer device and use method thereof

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