CN212222414U - Substrate stripping device - Google Patents

Abstract

The embodiment of the utility model discloses base plate stripping off device is disclosed. The substrate peeling apparatus includes: the device comprises a movable platform, a fixed platform, a movable roller, a lifting roller and a roller controller; the movable platform is used for fixing the substrate to be stripped; the fixing platform is used for fixing the product substrate; the roller controller is used for applying a force with a set magnitude to the moving roller and the lifting roller, controlling the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction vertical to the surface of the product substrate, enabling the lifting roller to be located on one side, close to the product substrate, of the substrate to be peeled when the substrate to be peeled is peeled, enabling the moving roller to be located on one side, far away from the product substrate, of the substrate to be peeled, enabling the lifting roller and the moving roller to move along the direction parallel to the surface of the product substrate with a preset height difference, and enabling the substrate to be peeled from the product substrate along the moving track of the moving roller. The embodiment of the utility model provides a realized that accurate control peels off the position of fulcrum, peels off dynamics and peel off the angle.

Description

Substrate stripping device

Technical Field

The embodiment of the utility model provides a relate to the semiconductor technology, especially relate to a base plate stripping off device.

Background

In order to meet the demand that the electronic industry such as semiconductors and MEMS (micro electro mechanical systems) has made a great effort to improve performance and reduce product volume, methods such as reducing the thickness of a substrate or forming a circuit on the reverse side of the substrate are currently widely used, and it is necessary to attach a support substrate to a product substrate in order to protect the product and the process, and to rapidly, economically, and cleanly peel off the support substrate after the necessary process.

The support substrate and product attachment are broadly divided into two methods: the first method is a method of applying an adhesive to both sides or all sides of one substrate, and the second method is a method of attaching substrates using an adhesive tape. After the subsequent process is completed, the adhesion of the adhesive or tape is usually reduced or the two substrates are separated from each other after partial peeling by a mechanical force greater than the adhesive force. The substrate is typically separated after reducing or removing the tack of the adhesive using a light source (Laser or UV) or the separation is performed using mechanical force after partial separation using a mechanical tool (blade or saw). In the prior art, the position, the peeling strength, the peeling angle and the like of a peeling fulcrum cannot be controlled in the separation operation, so that the product substrate is easily damaged in the peeling process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a base plate stripping off device to realize that accurate control peels off the position of fulcrum, peel off dynamics and peel off the angle.

In a first aspect, an embodiment of the present invention provides a substrate stripping apparatus, including:

the device comprises a movable platform, a fixed platform, a movable roller, a lifting roller and a roller controller;

the movable platform is used for fixing a substrate to be stripped;

the fixing platform is used for fixing the product substrate;

the roller controller is used for applying a force with a set size to the moving roller and the lifting roller, controlling the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction perpendicular to the surface of the product substrate, enabling the lifting roller to be located on one side, close to the product substrate, of the substrate to be stripped when the substrate to be stripped is stripped, enabling the moving roller to be located on one side, far away from the product substrate, of the substrate to be stripped, enabling the lifting roller and the moving roller to move along the direction parallel to the surface of the product substrate with a preset height difference, and enabling the substrate to be stripped on the product substrate along the moving track of the moving roller.

Optionally, the roller controller comprises a roller support structure and a roller driver;

the roller supporting structure is used for supporting the lifting roller and the moving roller;

the roller driver is used for applying a force with a set magnitude to the moving roller and the lifting roller and controlling the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction vertical to the surface of the product substrate.

Optionally, the apparatus further comprises:

a position sensor and a pressure sensor;

the position sensor is used for detecting the positions of the lifting roller and the moving roller;

the pressure sensor is used for detecting the force applied to the substrate to be stripped by the lifting roller and the movable roller and adjusting the positions of the movable roller and the lifting roller.

Optionally, the roller driver is further configured to adjust a force applied to the moving roller and the lifting roller according to data measured by the position sensor and the pressure sensor.

Optionally, the lifting roller includes at least two sub-rollers, and the at least two sub-rollers are sequentially arranged along the length direction of the moving roller.

Optionally, the mobile platform includes a base, a support table and a movable fixing plate;

the supporting platform is fixed on the base;

the movable fixed plate is connected to the support platform, the support platform comprises a slide rail, and the movable fixed plate can move along the slide rail;

the movable fixing plate is used for fixing the substrate to be stripped.

Optionally, the fixing platform comprises a vacuum chuck for fixing the product substrate.

Optionally, the apparatus further comprises:

and the pressure detector is used for detecting the vacuum pressure between the vacuum chuck and the product substrate and the vacuum pressure between the movable fixing plate and the substrate to be stripped.

In a second aspect, an embodiment of the present invention further provides a substrate peeling method, where the substrate peeling apparatus includes a moving platform, a fixed platform, a moving roller, a lifting roller, and a roller controller;

the method comprises the following steps:

fixing the substrate to be peeled through the moving platform;

fixing the product substrate through the fixing platform;

the roller controller controls the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction vertical to the surface of the product substrate, so that the lifting roller is positioned on one side of the substrate to be stripped, which is close to the product substrate, and the moving roller is positioned on one side of the substrate to be stripped, which is far away from the product substrate;

the roller controller applies a force with a set magnitude to the moving roller and the lifting roller, and controls the lifting roller and the moving roller to move along a direction parallel to the surface of the product substrate by a preset height difference, so that the substrate to be peeled is peeled from the product substrate along the moving track of the moving roller.

Optionally, the substrate peeling apparatus further includes: a position sensor and a pressure sensor;

the method further comprises the following steps:

and the roller driver adjusts the force applied to the movable roller and the lifting roller according to the positions of the lifting roller and the movable roller detected by the position sensor and the force applied to the substrate to be stripped by the lifting roller and the movable roller detected by the pressure sensor.

The utility model discloses the scheme is peeled off the below that the fulcrum is located the removal roller bearing among the stripping process, the position of peeling off the fulcrum can be adjusted through the position of adjusting the removal roller bearing, the removal rate is adjusted through the removal rate of control removal roller bearing and lifting roller bearing, can adjust the relative position of lifting roller bearing and removal roller bearing according to the peeling off condition, thereby adjust the angle of peeling off of treating to peel off the base plate, and exert the power of lifting roller bearing through the regulation, adjust the dynamics of peeling off, the scheme of this embodiment can peel off the position of fulcrum according to the accurate quick regulation of the bonding condition of the product of difference, peel off the angle and peel off the dynamics, can carry out accurate peeling off control, can use optimally according to the change of property and environment, multiple product is peeled off to minimum dynamics, the efficiency of peeling off. In addition, according to the scheme of the embodiment, the strength and the position of the movable roller and the lifting roller can be adjusted in real time according to the size of the adhesive force between the substrates in the substrate peeling process, so that the damage of the product substrate is prevented.

Drawings

FIG. 1 is a schematic view of a substrate peeling apparatus according to this embodiment

FIG. 2 is a schematic diagram of a substrate stripping process provided in this embodiment;

FIG. 3 is a schematic diagram of another substrate lift-off provided by the present implementation;

FIG. 4 is a schematic diagram illustrating the substrate provided in this embodiment after the substrate is peeled;

FIG. 5 is a schematic of the peel force being equal to the adhesive force;

FIG. 6 is a schematic of a peel with a peel force less than the adhesion force;

FIG. 7 is a schematic of a peel with a peel force greater than an adhesion force;

FIG. 8 is a schematic view of a lift roller and a shift roller provided in this embodiment;

fig. 9 is a schematic view of still another substrate peeling apparatus provided in this embodiment;

fig. 10 is a schematic diagram of a substrate peeling method provided in this embodiment.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

This embodiment provides a substrate peeling apparatus, and fig. 1 is a schematic view of a substrate peeling apparatus provided in this embodiment, and referring to fig. 1, the apparatus includes:

a moving platform 100, a fixed platform 200, a moving roller 111, a lifting roller 112, and a roller controller 300;

the movable platform 100 is used for fixing a substrate 101 to be stripped;

the fixing platform 200 is used for fixing the product substrate 103;

the roller controller 300 is configured to apply a force of a set magnitude to the moving roller 111 and the lifting roller 112, and control the moving roller 111 and the lifting roller 112 to move in a direction parallel to the surface of the product substrate 103 and in a direction perpendicular to the surface of the product substrate 103, so that the lifting roller 112 is located on a side of the substrate 101 to be peeled adjacent to the product substrate 103 when peeling of the substrate 101 to be peeled is performed, the moving roller 111 is located on a side of the substrate 101 to be peeled away from the product substrate 103, and the lifting roller 112 and the moving roller 111 are moved in a direction parallel to the surface 103 of the product substrate by a preset height difference, so that the substrate 101 to be peeled is peeled off from the product substrate 103 along a moving track of the moving roller 111.

The movable platform 100 may include a movable fixed plate 105, the movable fixed plate 105 may move along with the substrate 101 to be peeled when the substrate 101 to be peeled is peeled, and the substrate 101 to be peeled may be moved along with the movable fixed plate 105 when the substrate 101 to be peeled is completely peeled off from the product substrate 103. The preset height difference can be adjusted according to the stripping condition.

Fig. 2 is a schematic diagram of a substrate peeling process provided in this embodiment, fig. 3 is a schematic diagram of another substrate peeling provided in this embodiment, and fig. 4 is a schematic diagram of the substrate provided in this embodiment after the substrate peeling is completed, referring to fig. 1 to fig. 3, before the peeling, the product substrate 103 and the substrate 101 to be peeled are bonded together by the adhesive layer 102, the product substrate 103 is fixed on the fixing platform 200, the movable fixing plate 105 moves downward to contact and fix the substrate 101 to be peeled, and the preparation work before the peeling is completed.

Referring to fig. 2, after the preparation for the peeling operation, the roller controller 300 controls the lifting roller 112 and the moving roller 111 to move to the vicinity of the peeling fulcrum, the moving roller 111 moves downward, and the movable fixing plate 105 is pressed with a certain force. The pressing force at this time is set or selected in advance according to engineering and product conditions, and an exemplary pressing force may be 400 and 600N. The roller controller 300 controls the lifting roller 112 to ascend, and applies a load force to the movable fixing plate 105, wherein the load force may be set in advance or a required value may be dynamically selected according to the engineering environment and material conditions.

Referring to fig. 3, after the lifting roller 112 is lifted to a predetermined position, the moving roller 111 and the lifting roller 112 move in a direction parallel to the surface of the product substrate 103, and the substrate 101 to be peeled starts to be peeled. When there is no abnormality in the peeling, the moving roller 111 and the lifting roller 112 move in a stable position state, and the substrate 101 to be peeled and the product substrate 103 are separated with a uniform force.

Referring to fig. 4, after the peeling process is completed, the force applied to the movable roller 111 and the lifting roller 112 is released and returns to the original position, and the substrate 101 to be peeled after the peeling process is absorbed on the movable fixing plate 105 and returns to the original position, thereby completing the peeling process.

Specifically, in the peeling process, the peeling fulcrum is located below the moving roller 111, the position of the peeling fulcrum can be adjusted by adjusting the position of the moving roller 111, the peeling speed is adjusted by controlling the moving speed of the moving roller 111 and the lifting roller 112, and the relative position of the lifting roller 112 and the moving roller 111 is adjusted according to the peeling condition, so that the peeling angle of the substrate to be peeled is adjusted, the peeling force is adjusted by adjusting the force applied to the lifting roller 112, the scheme of the embodiment can accurately and rapidly adjust the position, the peeling angle and the peeling force of the peeling fulcrum according to the bonding condition of different products, precise peeling control can be performed, various products can be peeled by using the optimal and minimum force according to the change of materials and environment, and the peeling efficiency is improved. In addition, according to the scheme of the embodiment, the strength and the position of the moving roller and the lifting roller can be adjusted in real time according to the size of the adhesive force between the substrates in the substrate peeling process, so that the damage of the product substrate 103 is prevented.

Alternatively, referring to fig. 1-4, the roller controller 300 includes a roller support structure 113 and a roller drive 114;

a roller support structure 113 for supporting the lift roller 112 and the moving roller 111;

the roller driver 114 is configured to apply a force of a set magnitude to the moving roller 111 and the lifting roller 112, and control the moving roller 111 and the lifting roller 112 to move in a direction parallel to the surface of the product substrate 103 and in a direction perpendicular to the surface of the product substrate 103.

Specifically, the roller support structure 113 may also be driven by the roller driver 114 to move in a direction parallel to the surface of the product substrate 103 and perpendicular to the surface of the product substrate 103, and when the moving roller 111 and the lifting roller 112 need to move synchronously, the support structure 113 may be directly driven to move to drive the moving roller 111 and the lifting roller 112 to move synchronously. The roller driver 114 may also drive the moving roller 111 and the lift roller 112 to move independently.

The position of the roller driver 114 is shown by way of example only and is not a limitation of the present invention.

Alternatively, referring to fig. 1, the mobile platform 100 includes a base 125, a support stage 115, and a movable fixing plate 105;

the support table 115 is fixed to the base 125;

the movable fixing plate 105 is connected to the supporting stage 115, the supporting stage 115 includes a slide rail along which the movable fixing plate 105 can move;

the movable fixing plate 105 is used to fix the substrate 101 to be peeled.

Specifically, the movable fixing plate 105 may fix the substrate 101 to be peeled by vacuum pressure, and when the substrate 101 to be peeled is peeled, the movable fixing plate 105 moves with the peeled substrate 101 to be peeled and the substrate 101 to be peeled is completely peeled directly. Illustratively, referring to fig. 3 and 4, the portion of the substrate 101 to be peeled is elevated from the movable fixing plate 105.

Optionally, the holding platform 200 includes a vacuum chuck 104, the vacuum chuck 104 being used to hold the product substrate 103.

Specifically, the vacuum chuck 104 fixes the product substrate 103 by vacuum pressure, so that the product substrate 103 can be better prevented from being damaged.

Alternatively, referring to fig. 4, the substrate peeling apparatus further includes:

position sensor 400 and pressure sensor 500;

the position sensor 400 is used to detect the positions of the lift roller 112 and the moving roller 111;

the pressure sensor 500 is used to detect the force applied by the lift roller 112 and the moving roller 111 to the substrate 101 to be peeled.

Specifically, the position sensor 400 may be an optical position sensor such as a laser position sensor or an ultrasonic position sensor, or may be another type of position sensor, for example, a camera, and determines the positions of the lifting roller 112 and the moving roller 111 by taking an image, which is not limited in this embodiment. The pressure sensor 500 may determine the force applied to the substrate 101 to be peeled by the lifting roller 112 and the moving roller 111 by detecting the force applied to the lifting roller 112 and the moving roller 111 by the roller driver 114, and at this time, the pressure sensor 500 may be disposed between the lifting roller 112 and the moving roller 111 and the roller driver 114. The pressure sensor 500 may also directly detect the force applied by the lifting roller 112 and the moving roller 111 to the substrate 101 to be peeled, and in this case, the pressure sensor 500 may be directly disposed on the surfaces of the lifting roller 112 and the moving roller 111.

It should be noted that the present embodiment only illustrates the positions of the position sensor 400 and the pressure sensor 500, and the present invention is not limited thereto, and the specific positions of the position sensor 400 and the pressure sensor 500 may be set as required.

Optionally, the roller driver 114 is further configured to adjust the force applied to the moving roller 111 and the lifting roller 112 and the positions of the moving roller 111 and the lifting roller 112 according to the data measured by the position sensor 400 and the pressure sensor 500.

Specifically, the roller driver 114 may determine the current substrate peeling state based on the data measured by the position sensor 400. Fig. 5 is a schematic of peeling with a peel force equal to the adhesive force, fig. 6 is a schematic of peeling with a peel force less than the adhesive force, and fig. 7 is a schematic of peeling with a peel force greater than the adhesive force. As shown in fig. 5, when the peeling force is equal to the adhesive force, the peeling fulcrum is below the moving roller 111, and the moving roller 111 and the lifting roller 112 move in a stable relative position. As shown in fig. 6, when the adhesive force and the peeling force are different, such as a change in the angle and the position of the roller and a failure in the adjustment of the force, and the adhesive force is higher than the peeling force, the lift roller 112 cannot reach the set position, and the peeling fulcrum is located between the lift rollers 112 of the movable roller 111. In contrast, as shown in fig. 7, when the peeling force is larger than the residual adhesive force, the adhesive force is larger than the degree of pressing down of the moving roller 111, and the peeling position is on the side of the moving roller 111 away from the lift roller 112.

For example, when the peeling force is equal to the adhesive force, it is not necessary to adjust the force applied to the moving roller 111 and the lifting roller 112, and when the peeling force is greater than the adhesive force, the force applied to the lifting roller 112 may be reduced, and the relative positions of the lifting roller 112 and the moving roller 111 may be adjusted to reduce the peeling angle. When the peeling force is smaller than the adhesive force, it is possible to increase the force applied to the lifting roller 112 and adjust the relative positions of the lifting roller 112 and the moving roller 111 to increase the peeling angle.

Fig. 8 is a schematic view of the lifting roller and the moving roller provided in the present embodiment. Alternatively, referring to fig. 8, the lifting roller includes at least two sub-rollers 1121, and the at least two sub-rollers 1121 are sequentially arranged along the length direction of the moving roller 111.

Specifically, each of the sub-rollers 1121 corresponds to a partial region of the substrate 101 to be peeled for peeling the partial substrate 101 to be peeled, and at least two of the sub-rollers 1121 can be independently controlled, so that the peeling strength can be more accurately controlled. And for products with different bonding strengths in different areas of the product substrate 103 and the substrate 101 to be peeled, the substrate 101 to be peeled can be peeled by adjusting the position and strength of each sub-roller 1121, so that insufficient peeling strength or overlarge peeling strength is avoided.

Fig. 9 is a schematic view of another substrate peeling apparatus provided in this embodiment, and optionally, referring to fig. 9, the substrate peeling apparatus further includes:

a pressure detector 600 for detecting a vacuum pressure between the vacuum chuck 104 and the product substrate 103, and a vacuum pressure between the movable fixing plate 105 and the substrate 101 to be peeled.

Specifically, the fixing stability of the vacuum chuck 104 to the product substrate 103 and the fixing stability of the movable fixing plate 105 to the substrate 101 to be peeled can be determined by detecting the vacuum pressure between the vacuum chuck 104 and the product substrate 103 and the vacuum pressure between the movable fixing plate 105 and the substrate 101 to be peeled, and the peeling process is started when there is no abnormality in fixing, so that the product substrate 103 or the substrate 101 to be peeled is prevented from falling off due to the fixing of a problem in the peeling process.

The present embodiment further provides a substrate peeling method, and fig. 10 is a schematic diagram of the substrate peeling method provided in the present embodiment, referring to fig. 1 and fig. 10;

the substrate peeling apparatus includes a moving platform 100, a fixed platform 200, a moving roller 111, a lifting roller 112 and a roller controller 300;

the method comprises the following steps:

and step 10, fixing the substrate to be stripped through the movable platform.

And 20, fixing the product substrate through the fixing platform.

And step 30, controlling the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction vertical to the surface of the product substrate by the roller controller, so that the lifting roller is positioned on one side of the substrate to be stripped, which is close to the product substrate, and the moving roller is positioned on one side of the substrate to be stripped, which is far away from the product substrate.

And step 40, applying a force with a set magnitude to the movable roller and the lifting roller by the roller controller, so that the lifting roller and the movable roller move along the direction parallel to the surface of the product substrate by a preset height difference, and the substrate to be peeled is peeled from the product substrate along the moving track of the movable roller.

According to the scheme of the embodiment, the stripping fulcrum is located below the movable roller in the stripping process, the position of the stripping fulcrum can be adjusted by adjusting the position of the movable roller, the stripping speed is adjusted by controlling the moving speed of the movable roller and the lifting roller, and the relative position of the lifting roller and the movable roller can be adjusted according to the stripping condition, so that the stripping angle of the substrate to be stripped is adjusted, the stripping force is adjusted by adjusting the force applied to the lifting roller, namely the scheme of the embodiment can accurately and quickly adjust the position, the stripping angle and the stripping force of the stripping fulcrum according to the bonding condition of different products, precise stripping control can be performed, various products can be stripped by using optimal and minimum force according to the change of materials and environment, and the stripping efficiency is improved. In addition, according to the scheme of the embodiment, the strength and the position of the movable roller and the lifting roller can be adjusted in real time according to the size of the adhesive force between the substrates in the substrate peeling process, so that the damage of the product substrate is prevented.

Optionally, the substrate peeling apparatus further includes: a position sensor and a pressure sensor;

the method further comprises the following steps:

the roller driver adjusts the force applied to the movable roller and the lifting roller according to the positions of the lifting roller and the movable roller detected by the position sensor and the force applied to the substrate to be peeled by the lifting roller and the movable roller detected by the pressure sensor.

The base plate stripping off method that this embodiment provided with the utility model discloses the base plate stripping off device that arbitrary embodiment provided belongs to the same utility model and conceives, has the same beneficial effect, does not see in this embodiment detailed technical details the utility model discloses the base plate stripping off device that arbitrary embodiment provided.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (8)

1. A substrate peeling apparatus, comprising:

the device comprises a movable platform, a fixed platform, a movable roller, a lifting roller and a roller controller;

the movable platform is used for fixing a substrate to be stripped;

the fixing platform is used for fixing the product substrate;

the roller controller is used for applying a force with a set size to the moving roller and the lifting roller, controlling the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction perpendicular to the surface of the product substrate, enabling the lifting roller to be located on one side, close to the product substrate, of the substrate to be stripped when the substrate to be stripped is stripped, enabling the moving roller to be located on one side, far away from the product substrate, of the substrate to be stripped, enabling the lifting roller and the moving roller to move along the direction parallel to the surface of the product substrate with a preset height difference, and enabling the substrate to be stripped on the product substrate along the moving track of the moving roller.

2. The apparatus of claim 1, wherein:

the roller controller comprises a roller support structure and a roller driver;

the roller supporting structure is used for supporting the lifting roller and the moving roller;

the roller driver is used for applying a force with a set magnitude to the moving roller and the lifting roller and controlling the moving roller and the lifting roller to move along the direction parallel to the surface of the product substrate and the direction vertical to the surface of the product substrate.

3. The apparatus of claim 2, further comprising:

a position sensor and a pressure sensor;

the position sensor is used for detecting the positions of the lifting roller and the moving roller;

the pressure sensor is used for detecting the force applied to the substrate to be peeled by the lifting roller and the moving roller.

4. The apparatus of claim 3, wherein:

the roller driver is also used for adjusting the force applied to the moving roller and the lifting roller and adjusting the positions of the moving roller and the lifting roller according to the data measured by the position sensor and the pressure sensor.

5. The apparatus of claim 1, wherein:

the lifting roller comprises at least two sub-rollers which are sequentially arranged along the length direction of the movable roller.

6. The apparatus of claim 1, wherein:

the movable platform comprises a base, a supporting platform and a movable fixing plate;

the supporting platform is fixed on the base;

the movable fixed plate is connected to the support platform, the support platform comprises a slide rail, and the movable fixed plate can move along the slide rail;

the movable fixing plate is used for fixing the substrate to be stripped.

7. The apparatus of claim 6, wherein:

the fixed platform includes a vacuum chuck for fixing the product substrate.

8. The apparatus of claim 7, further comprising:

and the pressure detector is used for detecting the vacuum pressure between the vacuum chuck and the product substrate and the vacuum pressure between the movable fixing plate and the substrate to be stripped.

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