WO2015083221A1

WO2015083221A1 - Die supply device adjustment system and adjustment jig

Info

Publication number: WO2015083221A1
Application number: PCT/JP2013/082385
Authority: WO
Inventors: 早川　昌志; 友則岩瀬
Original assignee: 富士機械製造株式会社
Priority date: 2013-12-02
Filing date: 2013-12-02
Publication date: 2015-06-11
Also published as: JP6112688B2; JPWO2015083221A1

Abstract

The stamp portion (63) of an adjustment jig (61) is formed so that as the amount of pressing against a die (31) increases, the size of a stamp mark (66) stamped on the surface of the die (31) becomes larger. The suction head (41) of a die supply device (11) holds the adjustment jig (61) in place of a suction nozzle (43) and is operated to descend in the same manner as a die suction operation to allow the adjustment jig (61) to descend and the stamp portion (63) of the adjustment jig (61) to press against the surface of a die (31), thereby stamping a stamp mark (66) on the surface of the a die (31), said stamp mark (66) having a size depending on the amount of pressing the stamp portion (63). As the descending position of the suction head (41) lowers, the amount of pressing the stamp portion (63) becomes larger and the size of the stamp mark (66) becomes larger. Therefore, based on the size of the stamp mark (66), the height of a stop position in the descending operation of the suction head (41) is measured.

Description

Die supply apparatus adjustment system and adjustment jig

The present invention relates to a die supply device adjustment used for adjusting a die supply device for adsorbing and supplying a die by a suction nozzle from a wafer stretched body stretched with a dicing sheet that can be stretched and bonded with a diced wafer. The invention relates to a system and an adjustment jig.

In recent years, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2010-129949), a die supply device for supplying a die is set in a component mounter, and the die is mounted on a circuit board by the component mounter. There is something that was made. This die supply apparatus includes a wafer pallet (wafer stretched body) in which an expandable dicing sheet with a wafer diced so as to be divided into a plurality of dies is stretched on a dicing frame, and a lower portion of the dicing sheet When the pickup nozzle is lowered to suck and pick up the die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is picked up by the push-up pin. The die is adsorbed by the adsorption nozzle and picked up from the dicing sheet while being pushed up and partially separating the sticking portion of the die from the dicing sheet.

JP 2010-129949 A

By the way, when the suction nozzle is lowered to suck the die on the dicing sheet, if the height of the stop position of the lowering operation of the suction nozzle (the lower limit position of the lowering stroke) becomes too low, the lower end of the suction nozzle becomes the dicing sheet. There is a possibility that the die will be damaged or cracked by hitting the upper die too much.On the other hand, if the height of the stop position of the lowering operation of the suction nozzle becomes too high, the die will be stably attached to the suction nozzle. Cannot be adsorbed. Therefore, in order to stably suck the suction nozzle without damaging the die, it is necessary to precisely adjust the height of the stop position of the lowering operation of the suction nozzle.

Also, if the push-up height of the push-up pin (the height of the upper end) becomes too high, the lower end of the suction nozzle may hit the die on the dicing sheet too much and the die may be damaged or cracked. Furthermore, if the push-up height of the push-up pin becomes too low, the die cannot be stably sucked to the suction nozzle. Therefore, in order to stably suck the die without damaging the die, it is necessary to precisely adjust the push-up height of the push-up pin.

Also, in recent years, there is a tendency for the die to become increasingly finer, and if the horizontal displacement (XY direction) between the suction nozzle and the push-up pin becomes large, the push-up position of the push-up pin shifts with respect to the suction position of the suction nozzle and sucks. The die cannot be stably adsorbed to the nozzle. Therefore, in order to stably attract the die to the suction nozzle, it is necessary to adjust the horizontal position of the suction nozzle and the push-up pin so that the horizontal displacement between the suction nozzle and the push-up pin falls within an allowable range. There is.

As described above, in the die supply apparatus, it is necessary to adjust the height of the stop position of the lowering operation of the suction nozzle, the push-up height of the push-up pin, and the horizontal position of both. Before the start, the height of the stop position of the suction nozzle lowering operation, the push-up height of the push-up pin, and the horizontal position of both are measured manually, and their misalignments exceed the allowable range. If it becomes clear, the laborious work of performing manual measurement again, such as reassembling the component parts of the apparatus, was performed. For this reason, a lot of time may be spent on the adjustment work, which is one factor that reduces productivity.

Also, when the wafer pallet (wafer extension body) in the magazine of the die supply apparatus is pulled out on the pallet pulling table, the orientation of the wafer pallet may be slightly inclined in the horizontal direction. In this case, there is a possibility that the relationship between the suction position of the suction nozzle and the position of each die on the dicing sheet is shifted, and the die cannot be stably suctioned to the suction nozzle. Therefore, in order to stably attract the die to the suction nozzle, it is desirable to adjust the suction position of each die on the dicing sheet according to the tilt of the wafer pallet. Therefore, when the inclination of the wafer pallet becomes large, there is a possibility that the die cannot be stably sucked to the suction nozzle.

Therefore, an object of the present invention is to enable at least one of the above-described problems to be solved.

The present invention sets a wafer stretched body in which a stretchable dicing sheet with a wafer diced so as to be divided into a plurality of dies is stretched, and includes a suction nozzle that is detachably held on a suction head. When the die on the dicing sheet is lowered and picked up and picked up, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by a push-up pin disposed below the die, and the suction nozzle The adjustment jig is applied to a die supply device that adsorbs the die to the pick-up sheet and picks up the dicing sheet from the dicing sheet. The stamp portion has a stamp portion that is stamped on the surface of the die, and the stamp portion has a stamp mark stamped on the surface of the die as the amount pressed against the die increases. The adjustment jig, which is formed of a material that can be elastically deformed so as to increase its size and is held by the suction head, is positioned above the die, and the suction head is lowered as in the die suction operation. By lowering the adjustment jig and pressing the stamp portion on the surface of the die, a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the die, and the size of the stamp mark is set. Based on this, the height of the stop position of the lowering operation of the suction head (lower limit position of the lowering stroke) can be known.

In this configuration, the suction head is caused to hold an adjustment jig instead of the suction nozzle, and the suction head is moved down in the same manner as the die suction operation so that the adjustment jig is lowered to the surface of the die. By pressing the stamp portion of the adjustment jig, a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the die. In this case, the stamp part of the adjustment jig is formed so that the size of the stamp mark stamped on the surface of the die increases as the pressing amount to the die (the amount by which the stamp part descends) increases. As the size of the stamp mark stamped on the surface of the die increases, the pressing amount (lowering amount) of the stamp portion against the die increases, that is, the height of the stop position of the lowering operation of the suction head decreases. I understand. Accordingly, the height of the stop position of the lowering operation of the suction head (suction nozzle) can be easily and accurately measured from the size of the stamp mark imprinted on the die surface.

By the way, depending on the type of die, there may be a die that cannot be stamped or a die that has stamp stamped may not be mounted.

In such a case, a sheet stretched body in which a sheet to which a wafer is not attached is stretched is prepared, the sheet stretched body is set instead of the wafer stretched body, and is held by the suction head The adjustment jig is positioned above the sheet of the sheet extending body, and the suction head is moved down in the same manner as the die suction operation to lower the adjustment jig to place the stamp portion on the surface of the sheet. By pressing, a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the sheet so that the height of the stop position of the lowering operation of the suction head can be known based on the size of the stamp mark. You may make it comprise. In this way, if a sheet stretch body is set instead of the wafer stretch body and the stamp mark is imprinted on the surface of the sheet of the sheet stretch body, the stamp mark is not imprinted on the surface of the die. Has the advantage of

Here, the stamp part may have any shape such as a columnar shape as long as it can be elastically deformed. For example, the stamp part has a shape that becomes thinner toward the lower side by a porous material that can be elastically deformed. It is preferable that the adjustment jig is provided with an ink tank portion for supplying ink to the stamp portion. If the stamp part is formed into a shape (for example, a taper shape, a spherical shape, etc.) that becomes thinner toward the lower side by a porous material that can be elastically deformed, the size of the stamp mark with respect to the pressing amount (down amount) of the stamp part to the die The rate of change is increased, and the measurement accuracy of the height of the stop position of the lowering operation of the suction head (suction nozzle) can be improved. In addition, if the adjustment jig is provided with an ink tank section that supplies ink to the stamp section, the work (operation) for attaching ink to the stamp section before the stamping operation can be omitted, and the measurement work can be omitted. Can be performed efficiently.

In the present invention, the operator may measure the size of the stamp mark visually or with a measuring instrument such as a ruler, but this operation may be automated. Specifically, a camera that captures the stamp mark stamped on the surface of the die or sheet, an image processing unit that recognizes the stamp mark by processing an image captured by the camera, and the image processing unit It is good also as a structure provided with the calculating means which calculates the height of the stop position of the downward movement operation | movement of the said suction head based on the size of the said stamp mark. In this way, the work of measuring the height of the stop position of the lowering operation of the suction head can be completely automated, and productivity can be improved.

When measuring the horizontal positional relationship between the suction head and the push-up pin, a sheet stretched body in which a sheet to which a wafer is not stuck is stretched, and a stamp for imprinting on the surface of the sheet of the sheet stretched body An adjustment jig having a portion, the sheet tension body is set in place of the wafer tension body, and the adjustment jig held by the suction head is attached to a sheet of the sheet tension body. The suction head is moved downward and moved downward in the same manner as the die suction operation, the adjustment jig is lowered, and the stamp portion is pressed against the surface of the sheet, so that the stamp mark is stamped on the surface of the sheet. The push pin is pushed up and the sheet is pushed up by the push pin to make a push mark on the sheet, and the stamp mark and the push mark are moved in the horizontal direction. Based on the location relationship it may be configured such horizontal positional relationship between the adsorption head and the push-up pins can be seen. In this way, the horizontal positional relationship between the suction head and the push-up pin can be easily and accurately measured based on the horizontal positional relationship between the stamp mark stamped on the surface of the sheet and the push-up trace.

Also in this case, the shape of the stamp portion may be any shape. For example, the stamp portion is formed so that a stamp mark to be impressed by an elastically deformable porous material is a circle or a ring. The adjustment jig is preferably provided with an ink tank portion for supplying ink to the stamp portion. When the shape of the stamp mark is a ring, there is an advantage that even if the stamp mark is large, the push-up trace does not overlap with the stamp mark and the push-up trace can be easily recognized.

The operator may measure the horizontal positional relationship between the stamp mark and the push-up mark with an instrument such as a visual or ruler, but this operation may be automated by image processing using a camera. In this case, on the basis of the position of the stamp mark recognized by the image processing means and the position of the push-up mark, the horizontal position of the suction head and the horizontal position of the push-up pin and / or the horizontal displacement amount of both are calculated. The calculation may be performed by

Furthermore, a configuration may be provided with reference position correction means for correcting the horizontal reference position of the moving mechanism for moving the suction head and the push-up pin in the horizontal direction based on the calculation result of the calculation means. In this way, the horizontal displacement between the suction head and the push-up pin can be automatically corrected.

Alternatively, display means for displaying the calculation result of the calculation means, and input means for an operator to input a correction amount for the horizontal reference position of the moving mechanism for moving the suction head and the push-up pin in the horizontal direction, respectively. It is good also as a composition. Thus, if the calculation result of the calculation means is displayed on the display means, the operator can easily determine an appropriate correction amount for the reference position in the horizontal direction from the display.

Further, when measuring the push-up height of the push-up pin, the stamp part of the adjustment jig is used to measure the stamp mark stamped on the surface of the die on the dicing sheet as the push-up height of the dicing sheet by the push-up pin increases. The adjustment jig is formed of a material that can be elastically deformed so as to increase in size, and the adjustment jig held by the adsorption head is positioned above the die to move the adsorption head downward. With the part in contact with or close to the surface of the die, the push-up pin located directly below the adjustment jig is pushed up to push up the dicing sheet with the push-up pin and on the push-up part of the dicing sheet A die is pressed against the stamp portion to stamp a stamp mark on the surface of the die, and the bump is determined based on the size of the stamp mark. The push-up height of up pin may be configured as can be seen. In this case, the stamp portion of the adjustment jig is formed so that the size of the stamp mark imprinted on the surface of the die on the dicing sheet increases as the push-up height of the dicing sheet by the push-up pin increases. It can be seen that the push-up height of the push-up pin increases as the size of the stamp mark imprinted on the surface of the die increases. Thereby, the push-up height of the push-up pin can be measured easily and accurately.

In this case, a sheet stretching body in which a sheet to which a wafer is not bonded is stretched is used, the sheet stretching body is set in place of the wafer stretching body, and an adjustment jig held on the suction head is provided. The suction head is moved down by being positioned above the sheet of the sheet stretching body, and the stamp part of the adjustment jig is in contact with or close to the surface of the sheet, and is directly below the adjustment jig. The push-up pin located on the sheet is pushed up, the sheet is pushed up by the push-up pin, the push-up portion of the sheet is pressed against the stamp portion, and the stamp mark is stamped on the push-up portion of the sheet, and the size of the stamp mark is increased. Based on this, the push-up height of the push-up pin may be determined. As described above, if the stamp mark is stamped on the surface of the sheet of the sheet stretched body instead of the wafer stretched body, there is an advantage that the surface of the die does not need to be stained with the stamp mark.

In addition, the stamp part of the adjustment jig is formed in a shape in which the direction of the stamp mark to be stamped on the surface of the die is specified, and the adjustment jig held by the suction head is positioned above the die to The suction head is moved downward in the same manner as the die suction operation, the adjustment jig is lowered, and the stamp portion is pressed against the surface of the die, so that a stamp mark is stamped on the surface of the die. You may comprise so that the inclination angle of the horizontal direction of each die | dye on a dicing sheet can be known based on direction. In this way, the horizontal inclination angle of each die on the dicing sheet can be easily and accurately measured.

In this case, the operator may measure the direction of the stamp mark visually or with a meter such as a protractor, but this operation may be automated by image processing using a captured image of the camera.

FIG. 1 is an external perspective view of a die supply apparatus according to Embodiment 1 of the present invention. FIG. 2 is an external perspective view of the push-up unit and its peripheral part. FIG. 3 is an external perspective view of the wafer pallet. FIG. 4 is a partially broken enlarged view showing a state in which the push-up pot is raised to the suction position during the push-up operation. FIG. 5 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation. FIG. 6 is a block diagram showing the configuration of the control system of the die supply apparatus. 7A and 7B are a longitudinal front view and a bottom view of the adjustment jig. FIGS. 8A and 8B are views for explaining the relationship between the amount of stamp portion pressed against the die and the size of the stamp mark. FIG. 9 is an external perspective view of a sheet pallet used in Embodiment 2 of the present invention. FIG. 10 is a diagram illustrating an example of a captured image of the camera according to the third embodiment of the present invention. FIG. 11 is a diagram illustrating an example of a captured image of the camera according to the fourth embodiment of the present invention. FIGS. 12A and 12B are diagrams for explaining the relationship between the push-up height of the push-up pin (the pressing amount of the stamp portion) and the size of the stamp mark in the fifth embodiment of the present invention. FIGS. 13A and 13B are diagrams illustrating the relationship between the push-up height of the push-up pin (the pressing amount of the stamp portion) and the size of the stamp mark according to the sixth embodiment of the present invention. FIGS. 14A and 14B are a front view and a bottom view of an adjustment jig used in Example 7 of the present invention. FIGS. 15A and 15B are plan views showing examples of stamp mark imprinting with and without a wafer pallet tilt.

Hereinafter, seven examples 1 to 7 embodying a mode for carrying out the present invention will be described.

A first embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the die supply apparatus 11 will be schematically described with reference to FIG.

The die supply device 11 includes a magazine holding unit 22 (tray tower), a pallet drawer table 23, an XY moving mechanism 25, a push-up unit 28 (see FIG. 2), and the like, and the pallet drawer table 23 is a component mounting machine (not shown). Is set to the state where it is plugged in.

In a magazine (not shown) housed in a magazine holding unit 22 of the die supply apparatus 11 so as to be movable up and down, wafer pallets 32 equipped with wafer extending bodies 30 are stacked in multiple stages. The pallet 32 is drawn onto the pallet drawer table 23 by a pallet drawer mechanism 56 (see FIG. 6). As shown in FIG. 3, the wafer extending body 30 is obtained by expanding a dicing sheet 34 that can be stretched and bonded with a die 31 formed by dicing the wafer into a grid pattern on a dicing frame 33 having a circular opening. The dicing frame 33 is attached to the pallet main body 35 by screwing or the like.

The push-up unit 28 (see FIG. 2) is configured to be movable in the XY direction (horizontal direction) in the space area below the dicing sheet 34 of the wafer pallet 32. And the sticking part of the die 31 to be picked up (sucked) in the dicing sheet 34 is pushed up from below and pushed up locally by a push-up pin 39 (see FIGS. 4 and 5) of the pot 37, so that the die The sticking part of 31 is partly peeled off from the dicing sheet 34 so that the die 31 can be easily lifted.

The push-up unit 28 is configured such that the push-up unit 28 as a whole moves up and down using a servo motor 55 (see FIG. 6) as a drive source. When the die pick-up operation is performed, the push-up unit 28 rises and the upper surface of the push-up pot 37 rises to a predetermined sheet adsorbing position where it contacts or approaches the dicing sheet 34 of the wafer pallet 32, and the push-up unit 28 is moved by a stopper mechanism (not shown). When the upward movement stops and the upward movement is continued, the push-up pin 39 (see FIGS. 4 and 5) protrudes upward from the upper surface of the push-up pot 37, and the die 31 to be picked up from the dicing sheet 34 is attached. The part is pushed up. In this case, the push-up height position (push-up amount) of the push-up pin 39 can be adjusted by adjusting the rotation amount of the servo motor 55 serving as a drive source.

As shown in FIG. 1, the suction head 41 and the camera 42 are assembled to the XY movement mechanism 25, and the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY movement mechanism 25. ing. The suction head 41 is provided with a suction nozzle 43 (see FIGS. 4 and 5) that sucks the die 31 on the dicing sheet 34 so as to move up and down. The camera 42 picks up the die 31 on the dicing sheet 34 from above and performs image processing on the picked-up image with the control device 51 (see FIG. 6) of the die supply device 11, so that the die to be sucked by the suction nozzle 43. The position of 31 can be recognized.

As shown in FIG. 6, the control device 51 (calculation means) of the die supply apparatus 11 includes a storage device 52 that stores various control programs and data, and an input device 53 (input means) such as a mouse, a keyboard, and a touch panel. Are connected to a display device 54 (display means) for displaying various types of information. The control device 51 functions as a control unit that controls the suction operation of the suction head 41 and the push-up operation of the push-up pin 39 and also functions as an image processing unit. An image obtained by imaging the die 31 to be picked up by the camera 42 is processed to recognize the position of the die 31 to determine the push-up position and the suction position of the die 31. As shown in FIG. 34, the sticking part of the die 31 to be picked up (adsorbed) is pushed up from below and locally pushed up by the push-up pin 39 of the pot 37, so that the sticking part of the die 31 is partially removed from the dicing sheet 34. The die 31 is picked up by being sucked by the suction nozzle 43 while being lifted up so that the die 31 is easily picked up. We are backing up. Then, the position of the next die 31 (hereinafter referred to as “next suction die”) 31 is estimated based on the recognition position of the die 31 that has performed the suction operation this time, and the estimated position of the next suction die 31 is determined as the target imaging die. As the position, the next suction die 31 is imaged by the camera 42, the position of the next suction die 31 is recognized, and the above-described push-up operation and suction operation are repeated, so that the die 31 on the dicing sheet 34 is moved. Adsorption is performed in a predetermined order.

By the way, when the suction nozzle 43 is lowered to suck the die 31 on the dicing sheet 34, if the height of the stop position of the lowering operation of the suction nozzle 43 (the lower limit position of the lowering stroke) becomes too low, the suction nozzle 43 If the lower end of the suction nozzle 43 hits the die 31 on the dicing sheet 34 too much, the die 31 may be damaged or cracked. On the contrary, if the height of the stop position of the lowering operation of the suction nozzle 43 is too high. The die 31 cannot be stably adsorbed to the adsorption nozzle 43. Therefore, in order to stably attract the suction nozzle 43 without damaging the die 31, it is necessary to precisely adjust the height of the stop position of the lowering operation of the suction nozzle 43 (suction head 41). Further, when sucking the minute die 31, it is necessary to precisely adjust the position of the suction nozzle 43 (suction head 41) in the horizontal direction (XY direction).

Therefore, in the first embodiment, before starting production, the height and the horizontal position of the stop position of the lowering operation of the suction head 41 are measured using the adjustment jig 61 shown in FIG. Hereinafter, this measurement method will be described.

At the upper end of the adjustment jig 61, a holding portion 62 for positioning and holding the adjustment jig 61 on the suction head 41 is provided. The holding portion 62 of the adjustment jig 61 has the same structure as the holding portion (not shown) at the upper end of the suction nozzle 43, and the adjustment jig 61 can be replaced with the suction nozzle 43 with respect to the suction head 41. It is detachably held by suction or engagement means.

The adjustment jig 61 is formed in a nozzle shape having the same height as the suction nozzle 43, and a stamp part 63 for imprinting on the surface of the die 31 is provided in the lower part thereof. The stamp portion 63 is formed in a shape (for example, a taper shape, a spherical shape, etc.) that becomes narrower toward the lower side due to an elastically deformable porous material such as porous rubber or foamed elastic resin material, and the pressing amount to the die 31 is small. The larger the size, the larger the size of the stamp mark 66 (see FIG. 8) stamped on the surface of the die 31, and the XY coordinate of the center of the stamp mark 66 is designed to coincide with the XY coordinate of the center of the suction head 41. ing. In the first embodiment, the stamp mark 66 has a circular shape, and the amount of pressing of the stamp portion 63 against the die 31 (the height of the stop position of the lowering operation of the suction head 41) and the size (for example, diameter) of the stamp mark 66 in advance. Table data or mathematical formulas that define the relationship between and are created by experimental data or the like and stored in the storage device 52.

The stamp part 63 is attached to a lower end part of a cylindrical ink tank part 64 protruding downward from the lower surface of the holding part 62, and the ink 65 filled in the ink tank part 64 soaks into the stamp part 63 little by little. Thus, the ink 65 is automatically supplied to the stamp unit 63. The holding unit 62 that closes the upper end opening of the ink tank unit 64 is configured to be detachable so that the user can replenish the ink 65 into the ink tank unit 64 by removing the holding unit 62 from the ink tank unit 64. Of course, a disposable configuration in which the user cannot replenish the ink 65 in the ink tank unit 64 may be adopted.

The operation of measuring the stop position height and the horizontal position of the lowering operation of the suction head 41 using the adjustment jig 61 configured as described above is controlled by the control device 51 of the die supply device 11 as follows. Is done. First, the adjustment jig 61 is held on the suction head 41 of the die supply apparatus 11. The holding operation of the adjustment jig 61 may be performed manually by the operator, or a nozzle place for storing the replacement suction nozzle 43 and the adjustment jig 61 in the die supply device 11 (see FIG. (Not shown), the suction head 41 may be moved to the nozzle place by the XY moving mechanism 25 so that the adjustment jig 61 is automatically held by the suction head 41.

Then, the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the die 31 on the wafer pallet 32 to lower the suction head 41 in the same manner as the die suction operation. As shown in FIG. 8, the adjustment jig 61 is lowered, and the stamp portion 63 of the adjustment jig 61 is pressed against the surface of the die 31, and the pressing amount of the stamp portion 63 is pressed against the surface of the die 31. A stamp mark 66 having a size corresponding to the above is stamped.

At this time, the push-up operation of the push-up pin 39 may not be performed, or the stamp portion 63 is pressed against the surface of the die 31 while performing the push-up operation of the push-up pin 39 in the same manner as the die suction operation. May be stamped. In the latter case, the pressing amount of the stamp portion 63 (the height of the stop position of the lowering operation of the suction head 41) may be measured in consideration of the pushing height of the die 31 by the pushing operation of the pushing pin 39.

After the stamp mark 66 is stamped, the adjustment jig 61 is raised to its original height, and then the camera 42 is moved above the stamp mark 66 by the XY moving mechanism 25 and the stamp mark 66 is imaged by the camera 42. The image signal is transmitted to the control device 51. The control device 51 recognizes the stamp mark 66 by processing the received image signal, measures the size (for example, diameter) of the stamp mark 66, and uses the table data or the mathematical formula stored in the storage device 52. Using the size of the stamp mark 66, the pressing amount of the stamp part 63 and the height of the stop position of the lowering operation of the suction head 41 are calculated and displayed on the display device 54.

Further, the control device 51 measures the XY coordinate of the center of the recognized stamp mark 66 and displays the XY coordinate on the display device 54 as the XY coordinate of the center of the suction head 41 (the horizontal position of the suction head 41). .

In the first embodiment described above, the stamp portion 63 of the adjustment jig 61 has the stamp mark 66 that is stamped on the surface of the die 31 as the pressing amount against the die 31 (the descending amount of the stamp portion 63) increases. Since the size is increased, the adjustment head 61 is held by the suction head 41 instead of the suction nozzle 43, and the suction head 41 is moved down in the same manner as the die suction operation. If the jig 61 is lowered and the stamp portion 63 of the adjustment jig 61 is pressed against the surface of the die 31, the stamp mark 66 having a size corresponding to the pressing amount of the stamp portion 63 is pressed against the surface of the die 31. Can be stamped. As the size of the stamp mark 66 stamped on the surface of the die 31 increases, the amount of pressing of the stamp portion 63 against the die 31 increases, that is, the height of the stop position of the lowering operation of the suction head 41 decreases. Therefore, the height of the stop position of the lowering operation of the suction head 41 (suction nozzle 43) can be easily and accurately measured from the size of the stamp mark 66 stamped on the surface of the die 31. In the present invention, the size of the stamp mark 66 stamped on the surface of the die 31 by the operator may be measured visually or with a measuring instrument such as a ruler.

Further, in the first embodiment, the stamp portion 63 is formed in a shape (for example, a taper shape, a spherical shape, etc.) that becomes thinner toward the lower side by a porous material that can be elastically deformed. The rate of change of the size of the stamp mark 66 with respect to the amount (descent amount) is increased, and the measurement accuracy of the height of the stop position of the lowering operation of the suction head 41 (suction nozzle 43) can be improved. However, the shape of the stamp part 63 is not limited to the tapered shape, and may be any shape such as a columnar shape as long as it can be elastically deformed. In short, the larger the pressing amount to the die 31, the more What is necessary is just to form it so that the size of the stamp mark 66 stamped on the surface of the die | dye 31 may become large. The shape of the stamp mark 66 is not limited to a circle, and may be any shape as long as the center position of the stamp mark 66 is uniquely specified, such as a square or a regular polygon.

In the first embodiment, the adjustment jig 61 is provided with the ink tank portion 64 that supplies the ink 65 to the stamp portion 63, so that the operation (operation) for attaching the ink to the stamp portion 63 can be omitted. Can be performed efficiently. However, in the present invention, the adjustment jig 61 may not be provided with the ink tank portion 64. In this case, the operation of attaching the ink to the stamp portion 63 before the stamping operation is performed automatically or manually. Just do it.

Incidentally, depending on the type of the die 31, there may be a die 31 that cannot be stamped with the stamp mark 66, or the die 31 that has stamped the stamp mark 66 may not be mounted.

Therefore, in the second embodiment of the present invention, the height of the stop position of the lowering operation of the suction head 41 (suction nozzle 43) is measured using the sheet pallet 68 shown in FIG. 9 instead of the wafer pallet 32. ing. In the following description, substantially the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. Mainly, the parts different from the first embodiment are denoted by different reference numerals.

The sheet pallet 68 used in the second embodiment is obtained by attaching a sheet stretching body 69 to the pallet main body 35 common to the wafer pallet 32 by screwing or the like. The sheet stretching body 69 is the wafer stretching body 30. The sheet 70 to which the die 31 is not attached is attached to the common dicing frame 33. Here, the sheet 70 may be a dicing sheet 34 or a commercially available sheet (film, paper, or the like). In short, the stamp mark 66 is easily stamped clearly and is stamped by image processing. A sheet that easily recognizes 66 may be used.

When the height of the stop position of the lowering operation of the suction head 41 (suction nozzle 43) is measured using the sheet pallet 68, the operator sets the sheet pallet 68 in the magazine of the die supply device 11, and the magazine Then, the sheet pallet 68 is pulled out onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the sheet 70 of the sheet tension body 69 of the sheet pallet 68 to move the suction head 41 in the same manner as the die suction operation. The adjustment jig 61 is lowered to press the stamp portion 63 of the adjustment jig 61 against the surface of the sheet 70, and according to the pressing amount of the stamp portion 63 against the surface of the sheet 70. A stamp mark 66 of a certain size is impressed. At this time, the push-up pin 39 is not pushed up, and the push-up pin 39 prevents the sheet 70 from being pushed up. Further, when the stamp portion 63 is pressed against the surface of the sheet 70, the lower surface side of the sheet 70 is reinforced by a plate (not shown) or the like so that the sheet 70 is not recessed downward.

After the stamp mark 66 is stamped, the adjustment jig 61 is raised to the original height position, the camera 42 is moved above the stamp mark 66 by the XY movement mechanism 25, and the stamp mark 66 is imaged by the camera 42. The image is processed by the control device 51 to recognize the stamp mark 66, the size (for example, diameter) of the stamp mark 66 is measured, and the table data or mathematical formula stored in the storage device 52 is used. Based on the size of the stamp mark 66, the pressing amount of the stamp portion 63 and the height of the stop position of the lowering operation of the suction head 41 are calculated and displayed on the display device 54.

In the second embodiment described above, since the stamp mark 66 is stamped on the surface of the sheet 70 of the sheet pallet 68, there is an advantage that it is not necessary to stamp the stamp mark 66 on the surface of the die 31. In addition, the same effects as those of the first embodiment can be obtained.

In the second embodiment, the component parts of the wafer pallet 32 and the sheet pallet 68 are made common. However, the sheet pallet is configured such that, for example, the sheet is placed on a plate-like pallet body that can be pulled out by the pallet pulling mechanism 56. It is good also as a structure fixed so that replacement | exchange was possible.

Next, Embodiment 3 of the present invention will be described with reference to FIG. However, substantially the same parts as those in the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.

In the third embodiment, using the sheet pallet 68 used in the second embodiment, the horizontal position information (XY direction) of the suction head 41 and the push-up pin 39 is measured as follows. However, the lower surface side of the sheet 70 of the sheet pallet 68 is not reinforced by a plate or the like, and the push-up pin 39 pushes up the sheet 70 so that a push-up mark 71 can be made on the sheet 70.

First, the operator sets the sheet pallet 68 in the magazine of the die supply device 11, and pulls out the sheet pallet 68 from the magazine onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the sheet 70 of the sheet pallet 68 and the suction head 41 is moved down in the same manner as the die suction operation to perform the adjustment. The jig 61 is lowered, the stamp portion 63 of the adjustment jig 61 is pressed against the surface of the sheet 70, the stamp mark 66 is pressed onto the surface of the sheet 70, and the push-up pin 39 is pushed up. By pushing up the sheet 70 with the push-up pin 39, a push-up mark 71 is formed on the sheet 70.

Thereafter, the adjustment jig 61 is raised to the original height position, and the camera 42 is moved to a position where both the stamp mark 66 and the push-up mark 71 can be accommodated by the XY moving mechanism 25, and the stamp mark is moved by the camera 42. 66 and the pick-up trace 71 are imaged, and the image is processed by the control device 51 to recognize the stamp mark 66 and the push-up mark 71, so that the horizontal position of the suction head 41 and the horizontal position of the push-up pin 39 are determined. In addition to the measurement, the horizontal displacement amount of the suction head 41 and the horizontal displacement amount of the push pin 39 from the center of the image (the horizontal position of the suction head 41 and the push pin 39 when there is no displacement). Is calculated.

Further, the control device 51 (reference position correcting means) determines whether or not the horizontal displacement amount of the suction head 41 and the push-up pin 39 is within an allowable range, and the horizontal displacement amount of the suction head 41. Is determined to exceed the permissible range, the horizontal reference position of the XY moving mechanism 25 that moves the suction head 41 in the horizontal direction is corrected based on the amount of positional deviation, and the corrected reference position is determined. The position of the suction head 41 in the horizontal direction is controlled with reference. When it is determined that the horizontal displacement amount of the push-up pin 39 exceeds the allowable range, a moving mechanism (not shown) for moving the push-up unit 28 in the horizontal direction based on the displacement amount. The horizontal reference position is corrected, and the horizontal position of the push-up unit 28 is controlled based on the corrected reference position. In this way, the horizontal displacement between the suction head 41 and the push-up pin 39 can be automatically corrected.

In addition, information on the measured positional deviation between the suction head 41 and the push-up pin 39 is displayed on the display device 54. In the third embodiment, an automatic correction mode for automatically correcting a horizontal position shift (reference position shift) between the suction head 41 and the push-up pin 39, and correction of the position shift by the operator operating the input device 53. The manual correction mode for manually setting the amount can be switched, and when the operator selects the manual correction mode, the operator looks at the information on the positional deviation displayed on the display device 54, and the positional deviation is detected. Determine the amount of correction and set manually.

In the third embodiment described above, the horizontal positional relationship between the suction head 41 and the push-up pin 39 is simplified based on the horizontal positional relationship between the stamp mark 66 stamped on the surface of the sheet 70 and the push-up trace 71. Can be measured accurately.

The shape of the stamp mark 66 is not limited to a circle, and may be any shape as long as the center position of the stamp mark 66 is uniquely specified, such as a square or a regular polygon. .

Also, the operator may measure the horizontal positional relationship between the stamp mark 66 stamped on the surface of the sheet 70 and the push-up trace 71 with an instrument such as a visual check or a ruler.

In the fourth embodiment of the present invention shown in FIG. 11, the stamp portion 63 of the adjustment jig 61 is formed to be an annular stamp mark 72, and this adjustment jig 61 is used to perform the third embodiment. The position information in the horizontal direction (XY direction) of the suction head 41 and the push-up pin 39 is measured by the same method.

When the shape of the stamp mark 72 is an annular shape as in the fourth embodiment, even if the stamp mark 72 is large, the push-up trace 71 does not overlap the stamp mark 72 and the push-up trace 71 can be easily recognized. There is.

The adjustment jig 61 used in the fourth embodiment may be used in the first and second embodiments. When the die 31 is very small, an annular stamp mark 72 may be stamped across a plurality of dies 31.

Next, Embodiment 5 of the present invention will be described with reference to FIG. However, substantially the same parts as in the first to third embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.

In the fifth embodiment, the push-up height of the push-up pin 39 is measured as follows. As in the first embodiment, the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pulling table 23 by the pallet pulling mechanism 56 and is also adjusted by the adjustment jig 61 held on the suction head 41 by the XY moving mechanism 25. Is moved above the die 31 on the wafer pallet 32 and the suction head 41 is moved downward so that the stamp 63 of the adjustment jig 61 is in contact with or close to the surface of the die 31. The push-up pin 39 positioned immediately below the jig 61 is pushed up, the dicing sheet 34 is pushed up by the push-up pin 39, and the die 31 on the push-up portion of the dicing sheet 34 is pressed against the stamp portion 63. A stamp mark 66 is imprinted on the surface of.

At this time, as the push-up height of the dicing sheet 34 by the push-up pin 39 increases, the size of the stamp mark 66 stamped on the surface of the die 31 on the dicing sheet 34 increases. Table data or mathematical formulas that prescribe the relationship between the pressing amount of the stamp portion 63 (the push-up height of the push-up pin 39) on the die 31 and the size (for example, diameter) of the stamp mark 66 are created and stored based on experimental data or the like. It is stored in the device 52.

After the stamp mark 66 is stamped, the camera 42 captures an image of the stamp mark 66, and the captured image is processed by the control device 51 to measure the size (for example, diameter) of the stamp mark 66 and stored in the storage device 52. Using the table data or the mathematical formula, the pressing amount of the stamp portion 63 and the push-up height of the push-up pin 39 are calculated from the size of the stamp mark 66 and displayed on the display device 54.

The operation for measuring the push-up height of the push-up pin 39 is repeated a plurality of times by changing the push-up height of the push-up pin 39 by a predetermined amount so that the size of the stamp mark 66 becomes a predetermined size. An automatic push-up height adjustment mode for automatically adjusting the push-up height of the pin 39 to a target height is set. In addition, when a manual push-up height adjustment mode in which the operator operates the input device 53 to adjust the push-up height of the push-up pin 39 is set, and the operator selects the manual push-up height adjustment mode, the operator By looking at the measurement value displayed on the display device 54, the push-up height of the push-up pin 39 can be arbitrarily adjusted by operating the input device 53.

In the fifth embodiment described above, the push-up height of the push-up pin 39 can be easily and accurately measured.

In the present invention, the operator may measure the push-up height of the push-up pin 39 by measuring the size of the stamp mark 66 imprinted on the surface of the die 31 with an instrument such as a visual or ruler.

Next, Embodiment 6 of the present invention will be described with reference to FIG. However, substantially the same parts as those in the first to fifth embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.

As described above, depending on the type of the die 31, there may be a die 31 that cannot be stamped with the stamp mark 66, or the die 31 that has stamped the stamp mark 66 may not be mounted. In the case of the die 31 that is easily broken, if the die 31 is pushed up by the push-up pin 39 and pressed too strongly against the stamp part 63, the die 31 may be broken.

Therefore, in the sixth embodiment, using the sheet pallet 68 used in the third embodiment, the push-up height of the push-up pin 39 is measured as follows. In the example of FIG. 13, the shape of the stamp portion 63 of the adjustment jig 61 is a cylindrical shape, but it may be a tapered shape or a spherical shape similar to that of the first embodiment.

As in the third embodiment, the operator sets the sheet pallet 68 in the magazine of the die supply apparatus 11 and pulls out the sheet pallet 68 from the magazine onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the sheet 70 of the sheet pallet 68 to move the suction head 41 downward, and the stamp of the adjustment jig 61 is moved. In a state where the portion 63 is in contact with or close to the surface of the sheet 70, the push-up pin 39 located immediately below the adjustment jig 61 is pushed up to push up the sheet 70 with the push-up pin 39 and The stamped portion is pressed against the stamp portion 63 to stamp the stamp mark 66 on the surface of the sheet 70.

Thereafter, the stamp mark 66 is imaged by the camera 42, the captured image is processed by the control device 51, the size (for example, diameter) of the stamp mark 66 is measured, and the table data or formula stored in the storage device 52. Is used to calculate the pressing amount of the stamp portion 63 and the pushing height of the push-up pin 39 from the size of the stamp mark 66 and display it on the display device 54.

In the sixth embodiment described above, since the stamp mark 66 is stamped on the surface of the sheet 70 of the sheet pallet 68, there is an advantage that it is not necessary to stamp the stamp mark 66 on the surface of the die 31. In addition, the same effects as those of the fifth embodiment can be obtained.

Next, Example 7 of the present invention will be described with reference to FIGS. However, substantially the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

In the seventh embodiment, the stamp portion 82 of the adjustment jig 61 is formed in a shape in which the direction of the stamp mark 83 to be stamped on the surface of the die 31 is specified. Specifically, two stamp portions 82 are provided at predetermined intervals in the X direction or Y direction below the ink tank portion 64 of the adjustment jig 61, and the ink in the ink tank portion 64 is provided to each stamp portion 82. It is configured to supply. The two stamp portions 82 are formed in the same shape by an elastically deformable porous material, and have the same downward projecting dimensions. The shape of each stamp portion 82 may be any shape such as a columnar shape, a tapered shape, a spherical shape, or the like. In short, stamps to be imprinted on the surface of the die 31 by the two stamp portions 82 are used. Any shape that can identify the orientation of the mark 83 may be used. Accordingly, the present invention is not limited to the configuration in which the two stamp portions 82 are provided, and even if the adjustment jig 61 has only one stamp portion, the stamp mark to be stamped on the surface of the die 31 is not limited. What is necessary is just to form in the shape (for example, elongate rectangle) which can specify direction.

When the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pulling table 23 by the pallet pulling mechanism 56, the orientation of the wafer pallet 32 may be slightly inclined in the horizontal direction. In this case, there is a possibility that the relationship between the suction position of the suction nozzle 43 and the position of each die 31 on the dicing sheet 34 is shifted, and the die 31 cannot be stably suctioned to the suction nozzle 43.

Therefore, in the seventh embodiment, the horizontal tilt angle of each die 31 on the wafer pallet 32 is measured using the adjustment jig 61 shown in FIG. 14 as follows.

As in the first embodiment, the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pull-out table 23 by the pallet pull-out mechanism 56, and the adjustment jig 61 held by the suction head 41 is moved onto the wafer pallet 32. The suction head 41 is moved downward in the same manner as the die suction operation by lowering the adjustment jig 61 and pressing the two stamp portions 82 against the surface of the die 31. Then, two stamp marks 83 are imprinted on the surface of the die 82.

Thereafter, the two dies 31 on which the two stamp marks 83 are impressed are captured by the camera 42, and the captured image is processed by the control device 51 to recognize the two stamp marks 83 and the two dies 31. Then, the horizontal inclination angle of the line connecting the centers of the two dies 31 is calculated with reference to the line connecting the centers of the two stamp marks 83.

Then, the control device 51 (calculation means and suction position correction means) determines whether or not the horizontal inclination angle is within the allowable range, and determines that the horizontal inclination angle exceeds the allowable range. Calculates the amount of horizontal displacement of each die 31 on the dicing sheet 34 based on the horizontal inclination angle, and corrects the displacement of the suction position of each die 31 on the dicing sheet 34 based on the calculation result. To do. In this way, it is possible to automatically correct the deviation of the suction position of each die 31 on the dicing sheet 34 due to the inclination of the wafer pallet 32.

Also, the measured horizontal tilt angle and information on the positional deviation are displayed on the display device 54. In the seventh embodiment, an automatic correction mode for automatically correcting the shift of the suction position of each die 31 on the dicing sheet 34 due to the tilt of the wafer pallet 32, and the operator operates the input device 53 to correct the suction position. The manual correction mode for manually setting the amount can be switched, and when the operator selects the manual correction mode, the operator looks at the information displayed on the display device 54 and determines the correction amount of the suction position. It can be set manually.

In the seventh embodiment described above, by stamping the surface of the die 31 with the stamp portion 82 having a shape in which the direction of the stamp mark 83 is specified, the direction of the stamp 31 is changed from the direction of the stamp mark 83 (horizontal inclination angle). The tilt angle in the horizontal direction can be measured easily and accurately.

Note that the operator may measure the direction (inclination angle in the horizontal direction) of the stamp mark 83 visually or with a meter such as a protractor.

The die supply apparatus 11 used in each of the first to seventh embodiments is configured such that the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY moving mechanism 25. However, the suction head 41 and the camera 42 are Even if the wafer pallet 32 is moved only in the X direction and the wafer pallet 32 is moved in the Y direction on the pallet drawing table 23, the position of the die 31 to be imaged / sucked may be moved in the XY direction. good.

In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as the structure of the die supply apparatus 11 and the structure of the wafer pallet 32 may be appropriately changed.

DESCRIPTION OF SYMBOLS 11 ... Die supply apparatus, 22 ... Magazine holding part, 23 ... Pallet drawer table, 25 ... XY movement mechanism, 28 ... Push-up unit, 30 ... Wafer extension body, 31 ... Die, 32 ... Wafer pallet, 33 ... Dicing frame, 34 ... Dicing sheet, 37 ... Push-up pot, 39 ... Push-up pin, 41 ... Suction head, 42 ... Camera, 43 ... Suction nozzle, 51 ... Control device (calculation means, image processing means, reference position correction means, suction position correction means) , 52 ... Storage device, 53 ... Input device (input means), 54 ... Display device (display means), 55 ... Servo motor, 56 ... Pallet drawer mechanism, 61 ... Adjustment jig, 62 ... Holding section, 63 ... Stamp part, 64 ... Ink tank part, 65 ... Ink, 66 ... Stamp mark, 68 ... Sheet pallet, 69 ... Sheet stretched body, 7 ... seat, 71 ... push-up marks, 72 ... stamp mark, 82 ... stamp unit, 83 ... stamp mark

Claims

A wafer stretched body stretched with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is stretched is set, and the suction nozzle detachably held by the suction head is lowered to When picking up and picking up a die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by a push-up pin arranged below the die, and the die is put into the suction nozzle. Applied to a die feeding device that picks up and picks up from the dicing sheet,
The suction head is provided with an adjustment jig that is exchangeably held with the suction nozzle,
The adjustment jig has a stamp portion for imprinting on the surface of the die, and the stamp portion is configured such that the size of the stamp mark imprinted on the surface of the die increases as the pressing amount against the die increases. Formed of an elastically deformable material,
The adjustment jig held by the adsorption head is positioned above the die, and the adsorption head is moved downward in the same manner as the die adsorption operation to lower the adjustment jig and bring the adjustment jig onto the surface of the die. By pressing the stamp portion, a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the die, and the height of the stop position of the lowering operation of the suction head is determined based on the size of the stamp mark. A die feeding apparatus adjustment system characterized by being configured to be understood.
A sheet extending body in which a sheet to which the wafer is not bonded is stretched;
Instead of the wafer stretch body, set the sheet stretch body,
The adjustment jig held by the suction head is positioned above the sheet of the sheet stretching body, and the suction head is lowered as in the die suction operation to lower the adjustment jig. By pressing the stamp portion on the surface of the sheet, a stamp mark having a size corresponding to the pressing amount of the stamp portion is pressed on the surface of the sheet, and the lowering operation of the suction head is stopped based on the size of the stamp mark. The die feeding apparatus adjustment system according to claim 1, wherein the height of the position is known.
The stamp part is formed in a shape that becomes narrower toward the lower side by an elastically deformable porous material,
The die supply apparatus adjustment system according to claim 1, wherein the adjustment jig is provided with an ink tank portion that supplies ink to the stamp portion.
A camera for imaging the stamp mark;
Image processing means for recognizing the stamp mark by processing an image captured by the camera;
4. A calculating unit that calculates the height of the stop position of the lowering operation of the suction head based on the size of the stamp mark recognized by the image processing unit. 5. The die supply apparatus adjustment system as described in.
A wafer stretched body stretched with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is stretched is set, and the suction nozzle detachably held by the suction head is lowered to When picking up and picking up a die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by a push-up pin arranged below the die, and the die is put into the suction nozzle. Applied to a die feeding device that picks up and picks up from the dicing sheet,
A sheet stretching body in which a sheet to which the wafer is not bonded is stretched;
An adjustment jig having a stamp portion for imprinting on the surface of the sheet of the sheet tension body,
Instead of the wafer stretch body, set the sheet stretch body,
The adjustment jig held by the suction head is positioned above the sheet of the sheet stretching body, and the suction head is lowered as in the die suction operation to lower the adjustment jig. By pressing the stamp portion on the surface of the sheet, a stamp mark is impressed on the surface of the sheet, and the push-up pin is pushed up to push up the sheet with the push-up pin, thereby making a push-up mark on the sheet. A die feeding device adjustment system, wherein the horizontal positional relationship between the suction head and the push-up pin is understood based on the horizontal positional relationship between the stamp mark and the push-up trace.
The stamp part is formed so that a stamp mark to be stamped by a porous material that can be elastically deformed is a circle or a ring,
6. The die supply apparatus adjustment system according to claim 5, wherein the adjustment jig is provided with an ink tank part for supplying ink to the stamp part.
A camera that images the stamp mark stamped on the surface of the sheet and the push-up trace;
Image processing means for recognizing the stamp mark and the raised mark by processing an image captured by the camera;
Based on the position of the stamp mark recognized by the image processing means and the position of the push-up mark, the horizontal position of the suction head and the horizontal position of the push-up pin and / or the amount of horizontal displacement between the two are determined. The die supply apparatus adjustment system according to claim 5, further comprising: a calculation unit that performs calculation.
8. A reference position correction unit that corrects a horizontal reference position of a moving mechanism that moves the suction head and the push-up pin in the horizontal direction based on a calculation result of the calculation unit. The die supply apparatus adjustment system as described in.
Display means for displaying a calculation result of the calculation means;
The input means for an operator to input a correction amount of a horizontal reference position of a moving mechanism that moves the suction head and the push-up pin in the horizontal direction, respectively. Die feeding device adjustment system.
A wafer stretched body stretched with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is stretched is set, and the suction nozzle detachably held by the suction head is lowered to When picking up and picking up a die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by a push-up pin arranged below the die, and the die is put into the suction nozzle. Applied to a die feeding device that picks up and picks up from the dicing sheet,
The suction head is provided with an adjustment jig that is exchangeably held with the suction nozzle,
The adjustment jig has a stamp portion for imprinting on the surface of the die, and the stamp portion is imprinted on the surface of the die on the dicing sheet as the push-up height of the dicing sheet by the push-up pin increases. It is made of elastically deformable material so that the size of the stamp mark
The adjustment jig held by the suction head is positioned above the die and the suction head is lowered to bring the stamp portion of the adjustment jig into contact with or close to the surface of the die Then, the push-up pin positioned immediately below the adjustment jig is pushed up, the dicing sheet is pushed up by the push-up pin, and the die on the push-up portion of the dicing sheet is pressed against the stamp portion. A die feeding device adjustment system, wherein a stamp mark is stamped on the stamp pin, and the push-up height of the push-up pin is known based on the size of the stamp mark.
A sheet extending body in which a sheet to which the wafer is not bonded is stretched;
Instead of the wafer stretch body, set the sheet stretch body,
The adjustment jig held by the suction head is positioned above the sheet of the sheet stretching body, and the suction head is moved downward to bring the stamp portion of the adjustment jig into contact with the surface of the sheet Alternatively, in a state of being approached, the push-up pin positioned immediately below the adjustment jig is pushed up, the sheet is pushed up by the push-up pin, and the push-up portion of the sheet is pressed against the stamp portion to push up the sheet 11. The die feeding apparatus adjusting system according to claim 10, wherein a stamp mark is impressed on the portion, and the push-up height of the push-up pin is known based on the size of the stamp mark.
The stamp portion is formed of an elastically deformable porous material,
The die supply apparatus adjustment system according to claim 10 or 11, wherein the adjustment jig is provided with an ink tank portion for supplying ink to the stamp portion.
A wafer stretched body stretched with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is stretched is set, and the suction nozzle detachably held by the suction head is lowered to When picking up and picking up a die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by a push-up pin arranged below the die, and the die is put into the suction nozzle. Applied to a die feeding device that picks up and picks up from the dicing sheet,
The suction head is provided with an adjustment jig that is exchangeably held with the suction nozzle,
The adjustment jig has a stamp portion for imprinting on the surface of the die, and the stamp portion is formed in a shape that specifies the direction of the stamp mark imprinted on the surface of the die,
The adjustment jig held by the adsorption head is positioned above the die, and the adsorption head is moved downward in the same manner as the die adsorption operation to lower the adjustment jig and bring the adjustment jig onto the surface of the die. A stamp mark is pressed on the surface of the die by pressing the stamp portion, and the horizontal inclination angle of each die on the dicing sheet is determined based on the direction of the stamp mark. Die feeder adjustment system.
A camera for imaging a stamp mark stamped on the surface of the die;
Image processing means for recognizing the stamp mark by processing an image captured by the camera;
The calculation unit according to claim 13, further comprising: calculation means for calculating a horizontal displacement amount of each die on the dicing sheet based on a direction of the stamp mark recognized by the image processing means. Die feeder adjustment system.
15. The die feeding apparatus adjustment system according to claim 14, further comprising: a suction position correction unit that corrects the suction position of each die on the dicing sheet based on a calculation result of the calculation unit.
Display means for displaying a calculation result of the calculation means;
The die feeding apparatus adjustment system according to claim 14, further comprising: an input unit that allows an operator to input a correction amount of a suction position of each die on the dicing sheet.
A wafer stretched body stretched with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is stretched is set, and the suction nozzle detachably held by the suction head is lowered to When picking up and picking up a die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by a push-up pin arranged below the die, and the die is put into the suction nozzle. An adjustment jig used for adjustment of a die supply device that adsorbs and picks up from the dicing sheet,
The adjustment jig has a stamp portion that is held in the suction head so as to be replaceable with the suction nozzle, and that stamps the surface of the die by lowering the suction head in the same manner as the die suction operation. Adjustment jig.
The adjustment jig according to claim 17, wherein the stamp portion is formed of an elastically deformable porous material, and has an ink tank portion for supplying ink to the stamp portion.