JP2013105773A - Die pushing-up operation management system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically measure pushing-up height positions of a pushing-up pot and a pushing-up pin, and a position of the pushing-up pin in the XY direction of a die supply device.SOLUTION: In detection of pushing-up height, a pushing-up operation is performed without setting a wafer pallet at the upper part of a pushing-up unit 18, a camera of a die supply device is moved at the upper part of a prism 35 in the X direction to pick up the side faces of the pushing-up pot 27 and the pushing-up pin in the X direction with the camera via the prism 35 at a state that the pushing-up pot 27 is raised to project the pushing-up pin from the upper face of the pushing-up pot, the camera is moved to the upper part of a prism 36 in the Y direction to pick up the side faces of the pushing-up pot 27 and the pushing-up pin in the Y direction with the camera via the prism 36, and image processing is performed on the picked up side face images of the pushing-up pot 27 and the pushing-up pin 29 to detect a height position of the upper face of the pushing-up pot 27 and a height position of the upper end of the pushing-up pin 29 in the pushing-up operation.

Description

  The present invention relates to a die push-up operation management system for managing a die push-up operation in a die supply apparatus provided with a wafer pallet provided with a stretchable dicing sheet to which a diced wafer is attached.

  In recent years, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2010-129949), a die supply device that supplies a die is set in a component mounter, and the die is mounted on a circuit board by the component mounter. There is something that was made. The die supply apparatus includes a wafer pallet having a stretchable dicing sheet on which a wafer diced so as to be divided into a plurality of dies is attached, and a push-up pot disposed below the dicing sheet. When picking up the die on the dicing sheet by lowering the nozzle, the push-up pot is raised to a predetermined suction position that contacts the lower surface of the dicing sheet, and the dicing sheet is sucked on the upper surface of the push-up pot In this state, by pushing the push-up pin in the push-up pot upward from the upper surface of the push-up pot, the sticking portion of the die to be adsorbed in the dicing sheet is pushed up by the push-up pin, and the die is attached. Adsorb the die to the adsorption nozzle while partially peeling the attachment part from the dicing sheet It is to be picked up from the dicing sheet Te.

JP 2010-129949 A

  By the way, when lowering the suction nozzle and sucking the die on the dicing sheet, if the push-up height position of the push-up pot (push-up pin) becomes too high, the lower end of the suction nozzle hits the die on the dicing sheet too much. The die may be damaged or cracked. On the contrary, if the push-up height position of the push-up pot (push-up pin) becomes too low, the die cannot be stably sucked to the suction nozzle. Therefore, in order to stably adsorb the die without damaging the die, it is necessary to strictly manage the push-up height position of the push-up pot (push-up pin). Further, when a minute die is pushed up by a push-up pin, it is necessary to strictly manage the position of the push-up pin in the horizontal direction (XY direction).

  However, the push-up height position of the push-up pot (push-up pin) and the position of the push-up pin in the X and Y directions are affected by the assembly accuracy of each component of the push-up unit and the mounting condition of the push-up pin, thereby ensuring the required position accuracy. It is difficult. Therefore, before starting production, if the thrust height position of the push-up pot (push-up pin) and the position of the push-up pin in the XY direction are measured and it is found that the amount of positional deviation exceeds the allowable range, In this case, the operator must manually measure the push-up height position of the push-up pot (push-up pin) and the position of the push-up pin in the XY direction. As a result, a lot of time was spent.

  Therefore, the problem to be solved by the present invention is to provide a die push-up operation management system having a function of automatically measuring the push-up height position of the push-up pot (push-up pin) and the position of the push-up pin in the XY direction. It is.

  In order to solve the above-mentioned problem, the invention according to claim 1 is directed to a wafer pallet having a stretchable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is attached, and below the dicing sheet And a push-up mechanism that moves the push-up pot up and down, and when the die on the dicing sheet is sucked and picked up by lowering the suction nozzle, the push-up pot is lifted and placed on the upper surface of the push-up pot. With the dicing sheet adsorbed, the push-up pin in the push-up pot protrudes upward from the upper surface of the push-up pot, so that the sticking portion of the die to be adsorbed in the dicing sheet is The suction nozzle while pushing up and partially peeling the sticking part of the die from the dicing sheet An image that is applied to a die supply apparatus that picks up the die and picks up the image from the dicing sheet, images the object to be imaged from above, a camera moving mechanism that moves the camera, and an image that processes an image captured by the camera A push-up pot for picking up an image of a side surface of the push-up pot while the push-up pot is raised by performing a push-up operation without setting the wafer pallet above the push-up pot when the push-up height is detected; Optical axis direction changing means (prisms, mirrors, etc.) disposed on the side of the optical axis, and when the push-up height is detected, the camera is moved above the optical axis direction changing means by the camera moving mechanism. The side surface of the pot is imaged by the camera via the optical axis direction changing means, and the side image of the picked-up pot imaged in front is captured. It is obtained to detect the height position of the upper surface of the push-up pot during the boosting operation by the image processing by the image processing means.

  According to this configuration, the side surface of the push-up pot during the push-up operation is imaged by the camera via the optical axis direction changing means, and the side image of the picked-up push pot is subjected to image processing to detect the push-up height position of the push-up pot. Since it has a function, the push-up height position of the push-up pot can be automatically measured. Moreover, the camera used for the detection of the push-up height can also be used for a camera other than the detection of the push-up height, such as a camera that images the die on the dicing sheet, so there is no need to add a dedicated camera. The demand for cost reduction can also be satisfied.

  In the present invention, the optical axis direction changing means may be fixedly provided at a position that does not interfere with the setting (in / out) of the wafer pallet. However, the structure of the die supply apparatus does not interfere with the setting of the wafer pallet. It may be difficult in terms of space to fix and provide the optical axis direction changing means.

  Therefore, as in claim 2, a vertical movement mechanism for moving the optical axis direction changing means up and down is provided, and when the push-up height is detected, the optical axis direction changing means is raised to a position where the side surface of the pot is imaged. The optical axis direction changing means may be lowered to a position that does not interfere with the setting of the wafer pallet before the wafer pallet is set above the push-up pot after the detection of the push-up height. In this way, the present invention is carried out even with a die supply apparatus having a structure in which it is difficult to adopt a configuration in which the optical axis direction changing means is fixed at a position that does not interfere with the setting of the wafer pallet. be able to.

  Further, the side surface of the push-up pin that protrudes from the upper surface of the push-up pot when the push-up height is detected is imaged by the camera together with the side surface of the push-up pot, and the side image of the pick-up pot and the push-up are captured. The side surface image of the pin may be processed by an image processing means to detect the height position of the upper surface of the push-up pot and the height position of the upper end of the push-up pin during the push-up operation. In this way, the height position of the upper end of the push-up pin can be detected using the side image of the push-up pin when the push-up height is detected, and the push-up amount of the push-up pin (the height position of the upper end of the push-up pin is pushed up. The difference value from the height position of the upper surface of the pot can also be measured.

  In the present invention, if only the push-up pot or the push-up height of the push-up pot is detected, only one optical axis direction changing means is provided, but a function of detecting the position of the push-up pin in the XY direction is added. In such a case, the configuration may be such that two optical axis direction changing means are provided.

  Specifically, as in claim 4, optical axis direction changing means are arranged at positions in the X direction and the Y direction with respect to the push-up pin, respectively, and the camera moving mechanism is used to detect the light in the X direction when the push-up height is detected. The X direction side surface of the push-up pin is imaged by moving it above the axial direction changing means, and the Y side surface of the push pin is imaged by moving the camera above the Y direction optical axis direction changing means. The X-direction side image and the Y-direction side image of the picked-up pin may be subjected to image processing by an image processing means to detect the position of the push-up pin in the XY direction. In this way, the position of the push-up pin in the XY direction can be automatically measured using the two side images in the X direction and the Y direction.

  Further, as in claim 5, the presence or absence of at least one of breakage and bending of the push-up pin may be determined based on the image processing result of the side image of the push-up pin. In this way, it is possible to automatically detect breakage or bending of the push-up pin using the side image of the push-up pin.

FIG. 1 is an external perspective view of a component supply apparatus showing a state in which a wafer pallet is set in Embodiment 1 of the present invention. FIG. 2 is an external perspective view of the component supply apparatus showing a state before the wafer pallet is set. FIG. 3 is an external perspective view showing the positional relationship between the push-up pot and the prism of the first embodiment. FIG. 4 is an external perspective view of the wafer pallet. FIG. 5 is a partially broken enlarged view showing a state in which the push-up pot is raised to the suction position during the push-up operation. FIG. 6 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation. FIG. 7 is a perspective view showing a state in which the prism in the second embodiment is pushed up to a position where the side surface of the pot is imaged. FIG. 8 is a perspective view illustrating a state where the prism is lowered to a position that does not interfere with the setting of the wafer pallet in the second embodiment.

  Hereinafter, two Examples 1 and 2 which embody the form for implementing this invention are demonstrated.

A first embodiment of the present invention will be described below with reference to FIGS.
First, the configuration of the component supply device 11 (die supply device) will be schematically described.
As shown in FIG. 1, the component supply apparatus 11 includes a magazine holding unit 12 (tray tower), a pallet drawer table 13, an XY moving mechanism 15 (camera moving mechanism), a push-up unit 18 (see FIG. 3), and the like. The pallet drawer table 13 is inserted into the mounting machine (not shown).

  In a magazine (not shown) housed in a magazine holding section 12 of the component supply device 11 so as to be movable up and down, a wafer pallet 22 on which a die 21 (wafer component) is placed and a tray pallet on which a tray component is placed (see FIG. (Not shown) can be mounted in multiple stages, and one of the wafer pallet 22 and the tray pallet is selected from the magazine and pulled out onto the pallet drawer table 13 during operation of the component mounter. ing. As shown in FIG. 4, the wafer pallet 22 is obtained by expanding a stretchable dicing sheet 24 on which a die 21 formed by dicing a wafer into a grid pattern is attached to a wafer mounting plate 23 having a circular opening. The wafer mounting plate 23 is attached to the pallet body 25 by screwing or the like.

  The push-up unit 18 (see FIG. 3) is configured to be movable in the X and Y directions in the space area below the dicing sheet 24 of the wafer pallet 22. And the sticking part of the die 21 to be picked up (adsorbed) in the dicing sheet 24 is pushed up from the lower side by a push-up pin 29 (see FIGS. 5 and 6) of the pot 27 so that the die 21 is partially peeled from the dicing sheet 24 so that the die 21 can be easily picked up.

  The push-up unit 18 is configured such that the push-up unit 18 as a whole moves up and down using a servo motor (not shown) as a drive source. During the die pick-up operation, when the push-up unit 18 is raised and the upper surface of the push-up pot 27 is raised to a predetermined sheet suction position where it substantially contacts the dicing sheet 24 of the wafer pallet 22, the stopper unit (not shown) When the ascent is stopped and the ascending operation is continued, the push-up pin 29 (see FIGS. 5 and 6) protrudes upward from the upper surface of the push-up pot 27, and the sticking portion of the die 21 to be picked up in the dicing sheet 24 To come up. In this case, the push-up height position (push-up amount) of the push-up pin 29 can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.

  As shown in FIG. 1, the suction head 31 and the camera 32 are assembled to the XY movement mechanism 15, and the suction head 31 and the camera 32 are integrally moved in the XY directions by the XY movement mechanism 15. ing. The suction head 31 is provided with a suction nozzle 33 (see FIGS. 5 and 6) that sucks the die 21 on the dicing sheet 24 so as to move up and down. The camera 32 can confirm the position of the die 21 sucked by the suction nozzle 33 by picking up an image of the die 21 on the dicing sheet 24 from above and processing the picked-up image.

  By the way, when the suction nozzle 33 sucks the die 21 on the dicing sheet 24 of the wafer pallet 22 and the push-up height position of the push-up pot 27 (push-up pin 29) becomes too high, the lower end of the suction nozzle 33 becomes the dicing sheet. There is a possibility that the die 21 will be hit too hard and the die 21 will be damaged or cracked, and the internal circuit of the die 21 may be damaged. On the contrary, the push-up height of the push-up pot 27 (push-up pin 29) If the position becomes too low, the die 21 cannot be stably sucked by the suction nozzle 33. Accordingly, in order to stably suck the die 21 without damaging the suction nozzle 33, it is necessary to strictly manage the push-up height position of the push-up pot 27 (push-up pin 29). When the minute die 21 is pushed up by the push-up pin 29, it is necessary to strictly manage the position of the push-up pin 29 in the horizontal direction (XY direction).

  Therefore, in the first embodiment, the prisms 35 and 36 as the optical axis direction changing means are disposed at the positions in the X direction and the Y direction with respect to the push-up unit 18, respectively, and the push-up pin 29 protruding from the upper surface of the push-up pot 27. A side image in the X direction and a side image in the Y direction can be captured by the camera 32 via the prisms 35 and 36. The prisms 35 and 36 are fixed at positions that do not interfere with the setting (in / out) of the wafer pallet 22. When the push-up height is detected, the camera 32 is moved above the X-direction prism 35 by the XY moving mechanism 15, and the X-direction side surface of the push-up pin 29 is imaged by the camera 32 via the prism 35. 32 is moved above the Y-direction prism 36 and the Y-direction side surface of the push-up pin 29 is imaged by the camera 32 via the prism 36, and the X-side side image and Y-direction of the imaged push-up pin 29 are captured. The side image of the push-up pin 29 is image-processed to detect the position of the push-up pin 29 in the XY direction, and whether the push-up pin 29 is damaged or bent is determined based on the image processing result of the side face image of the push-up pin 29. I have to.

  Further, the X-direction or Y-direction side images of the push-up pot 27 and the push-up pin 29 imaged by the camera 32 are subjected to image processing, and the height position of the upper surface of the push-up pot 27 and the height of the upper end of the push-up pin 29 during the push-up operation. The position is detected, and the push-up amount of the push-up pin 29 (the difference value between the height position of the upper end of the push-up pin 29 and the height position of the upper face of the push-up pot 27) is calculated.

  The control device (not shown) of the component supply device 11 functions as an image processing means in the claims, and does not set the wafer pallet 22 above the push-up unit 18 when the push-up height is detected before production is started. In the state where the push-up pot 27 is raised and the push-up pin 29 is protruded from the upper surface of the push-up pot 27, the camera 32 is moved above the X direction prism 35 by the XY moving mechanism 15. The side surface in the X direction of the push-up pot 27 and the push-up pin 29 is imaged by the camera 32 through the prism 35, and the camera 32 is moved above the prism 36 in the Y-direction to move the push-up pot 27 and the push-up pin 29. The side surface in the Y direction is imaged by the camera 32 via the prism 36, and the push-up pot 2 output from the camera 32 Then, the side image of the push-up pin 29 is image-processed to detect the height position (push-up height position) of the upper face of the push-up pot 27 and the height position of the push-up pin 29 (push-up height position) during the push-up operation. .

  At this time, an index indicating the reference height position is stored in the field of view of each camera 32 together with the object to be imaged, and the height position of the upper surface of the push-up pot 27 or the like is determined based on the reference height position. The height position of the upper end of the push-up pin 29 may be detected, or the height position of the upper surface of the push-up pot 27 and the upper end of the push-up pin 29 may be detected based on the height position of the visual field of the camera 32. The height position may be detected. When the height position is detected, the final height position may be obtained by averaging the height positions obtained from the side image in the X direction and the side image in the Y direction. You may make it obtain | require a height position only from the side image of any one direction of a Y direction.

  The control device of the component supply device 11 allows the amount of positional deviation based on the detection result of the height position of the upper surface of the push-up pot 27 and the height position (push-up amount) of the upper end of the push-up pin 29 during the push-up operation. It is determined whether or not the range is exceeded, and if it is determined that the amount of positional deviation exceeds the allowable range, a warning is displayed on a display device (not shown) or a warning sound is generated. The worker is warned.

  Further, the control device of the component supply device 11 performs image processing on the side image in the X direction and the side image in the Y direction of the push-up pin 29 to detect the position of the push-up pin 29 in the XY direction, and the side image of the push-up pin 29. Based on the image processing result, whether or not the push pin 29 is broken or bent is determined. If breakage or bend of the push pin 29 is detected, a warning is displayed on the display device or a warning sound is generated. To warn workers.

  According to the first embodiment described above, the side surface of the push-up pot 27 at the time of the push-up operation is imaged by the camera 32 via the prism 35 or 36, and the side image of the picked-up push pot 27 is subjected to image processing and the push-up pot 27 Therefore, the push-up height position of the push-up pot 27 can be automatically measured. In addition, the camera 32 used for detecting the push-up height can also be used as a camera used for purposes other than the push-up height detection, such as the camera 32 for imaging the die 21 on the dicing sheet 24, and therefore a dedicated camera is added. There is no need, and the demand for cost reduction can be satisfied.

  Furthermore, in the first embodiment, it is possible to automatically measure the push-up height position of the push-up pin 29 during the push-up operation using the side image of the push-up pin 29 protruding from the upper surface of the push-up pot 27 during the push-up operation. . Accordingly, it is possible to automatically determine whether or not the amount of displacement of the push-up height position of the push-up pot 27 or push-up pin 29 exceeds the allowable range, and the push-up height of the push-up pot 27 or the push-up pin 29 is determined. The operation of correcting the positional deviation can be easily performed.

  Moreover, in the first embodiment, the X-direction side image and the Y-direction side image of the push-up pin 29 are subjected to image processing to detect the position of the push-up pin 29 in the XY direction. Can be automatically measured. As a result, it is possible to automatically determine whether or not the amount of positional deviation of the push-up pin 29 in the XY direction exceeds the allowable range, and the work of correcting the positional deviation of the push-up pin 29 in the XY direction is easily performed. be able to.

  Further, in the first embodiment, since the presence or absence of breakage or bending of the push-up pin 29 is determined based on the image processing result of the side image of the push-up pin 29, damage or bending of the push-up pin 29 is automatically performed. Can be detected.

  In the first embodiment, the push-up pot 27 is configured to detect the push-up height position of the push-up pot 27, the push-up height position of the push-up pin 29, and the breakage / bending of the push-up pin 29. One or two may be detected.

  In the first embodiment, the two prisms 35 and 36 are fixedly provided at positions that do not interfere with the setting (in / out) of the wafer pallet 22. However, due to the structure of the component supply device 11, the setting of the wafer pallet 22 is performed. It may be difficult in terms of space to fix the prisms 35 and 36 at positions that do not interfere with each other.

  Therefore, in the second embodiment of the present invention, as shown in FIGS. 7 and 8, a vertical movement mechanism 37 that integrally moves the two prisms 35 and 36 up and down is provided, and the vertical movement mechanism 37 detects the push-up height. Positions where the prisms 35 and 36 are raised to the position where the side surface of the push-up pot 27 is imaged and the wafer pallet 22 is set above the push-up pot 27 after the push-up height is detected before the wafer pallet 22 is set. The prisms 35 and 36 are lowered and retracted. The vertical movement mechanism 37 is configured to vertically move a slide elevating member 38 to which the prisms 35 and 36 are fixed by an actuator such as a motor (not shown). Other configurations are the same as those of the first embodiment.

  With the above configuration, even if the component supply device 11 has a structure in which it is difficult to adopt a configuration in which the prisms 35 and 36 are fixed at positions that do not interfere with the setting of the wafer pallet 22, the present invention. Can be implemented.

  Note that the present invention is not limited to the configuration in which the side images of the push-up pot 27 and the push-up pin 29 are captured using the camera 32 provided in the component supply device 11, and the push-up is performed using the camera provided in the component mounter. A side image of the pot 27 and the push-up pin 29 may be taken. Even in this case, it is not necessary to add a dedicated camera, and the demand for cost reduction and space saving can be satisfied.

Further, the image processing is not limited to the configuration in which the side images of the push-up pot 27 and the push-up pin 29 are processed by the control device of the component supply device 11, and this image processing may be performed by the control device of the component mounting machine.
Further, the optical axis direction changing means arranged on the side of the push-up pot 27 is not limited to the prisms 35 and 36, and other optical axis direction changing means such as a mirror may be used.

  In addition, the present invention is not limited to the configuration in which the component supply device 11 in which the wafer pallet 22 and the tray pallet are mixedly mounted is set in the component mounter, and the die supply device in which only the wafer pallet 22 is loaded is set in the component mounter. Various modifications can be made without departing from the gist, such as a configuration.

  DESCRIPTION OF SYMBOLS 11 ... Component supply apparatus (die supply apparatus), 12 ... Magazine holding part, 13 ... Pallet drawer table, 15 ... XY movement mechanism (camera movement mechanism), 18 ... Push-up unit, 21 ... Die, 22 ... Wafer pallet, 23 ... Wafer mounting plate, 24 ... dicing sheet, 25 ... pallet body, 27 ... push-up pot, 29 ... push-up pin, 31 ... suction head, 32 ... camera, 33 ... suction nozzle, 35, 36 ... prism (optical axis direction changing means) 37 ... Vertical movement mechanism, 38 ... Slide lifting member

Claims (5)

A wafer pallet provided with a stretchable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is attached, and a push-up mechanism that moves a push-up pot disposed below the dicing sheet up and down, When the suction nozzle is lowered and the die on the dicing sheet is picked up and picked up, the push-up pot is lifted and the dicing sheet is sucked onto the upper surface of the push-up pot. Projecting upward from the upper surface of the push-up pot, the sticking portion of the die to be adsorbed in the dicing sheet is pushed up by the push-up pin, and the sticking portion of the die is partially removed from the dicing sheet. While peeling, pick up the die from the dicing sheet by sucking the die onto the suction nozzle. It applies to are backing up die supply device,
A camera for imaging an imaging object from above;
A camera moving mechanism for moving the camera;
Image processing means for processing an image captured by the camera;
In order to take an image of the side surface of the push-up pot in a state where the push-up pot is lifted by performing a push-up operation without setting the wafer pallet above the push-up pot when the push-up height is detected, An optical axis direction changing means arranged,
When the push-up height is detected, the camera is moved by the camera moving mechanism above the optical axis direction changing means, and the side surface of the push pot is imaged by the camera via the optical axis direction changing means, and the image is taken. A die push-up operation management system, wherein a side surface image of a push-up pot is subjected to image processing by the image processing means to detect a height position of an upper surface of the push-up pot during the push-up operation.   A vertical movement mechanism for moving the optical axis direction changing means up and down; and when the push-up height is detected, the vertical movement mechanism raises the optical axis direction changing means to a position where the side surface of the push-up pot is imaged; 2. The die push-up operation management system according to claim 1, wherein the optical axis direction changing means is lowered to a position that does not interfere with the setting of the wafer pallet before the wafer pallet is set above.   The side surface of the push-up pin that protrudes from the upper surface of the push-up pot when the push-up height is detected is imaged by the camera together with the side surface of the push-up pot, and the side image of the pick-up pot and the side image of the push-up pin are captured. The die push-up according to claim 1 or 2, wherein the image processing means performs image processing to detect the height position of the upper surface of the push-up pot and the height position of the upper end of the push-up pin during the push-up operation. Operation management system. Optical axis direction changing means are respectively arranged at positions in the X direction and the Y direction with respect to the push-up pin,
When the push-up height is detected, the camera moving mechanism moves the camera above the X-direction optical axis direction changing means to image the X-direction side surface of the push-up pin, and the camera is moved in the Y-direction optical axis direction. An image of the side surface in the Y direction of the push-up pin is picked up by moving it above the conversion means, and the image processing means performs image processing on the side image in the X direction and the side image in the Y direction of the pick-up pin. The die push-up operation management system according to claim 3, wherein the position in the XY direction is detected.   5. The apparatus according to claim 3, further comprising: a unit that determines whether or not the push pin is broken or bent based on an image processing result of the side image of the push pin by the image processing unit. Die push-up operation management system.

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