JP2012222054A - Die position determination system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die position determination system for determining a position of a die to be suctioned by a suction nozzle, achieving both of production efficiency improvement and die yield improvement.SOLUTION: A die position determination system comprises: reference position marks 41 provided at two positions on an upper surface of a wafer palette 22; storage means for previously storing die arrangement positional information created in a coordinate system of the wafer palette 22 using the positions of the reference position marks 41 as a reference; a camera for imaging the two reference position marks 41 on the wafer palette 22 set at a predetermined position of a die pickup device; means for recognizing the positions of the reference position marks 41 in a machine coordinate system of the die pickup device by processing the captured image; and means for calculating a positional shift amount in the coordinate system of the wafer palette 22 with respect to the machine coordinate system of the die pickup device. The system acquires arrangement positions of respective dies 21 in the machine coordinate system of the die pickup device by correcting the die arrangement positional information by using the positional shift amount.

Description

  The present invention relates to a die position determination system that determines the position of a die to be sucked by a suction nozzle.

  For example, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2006-332417), a wafer pallet with an expandable dicing sheet on which a wafer diced in a grid pattern is attached is used as a die pickup device. When the die separated from the wafer on the dicing sheet is picked up and picked up by the suction nozzle, the sticking part of the die to be picked up in the dicing sheet is pushed up from directly below and pushed up with a pot (die ejector) In this way, the die is adsorbed by a suction nozzle and picked up from the dicing sheet while the sticking portion of the die is partially peeled from the dicing sheet.

  In this die pick-up device, since it is necessary to align the suction nozzle with the die for each die suction operation, map data of the array position of the die on the wafer pallet is stored in the storage device before the start of production. Stores the position data of the first die to be picked up after the start of production (hereinafter referred to as “production start die”), reads the production start die and map data from the storage device at the start of production, picks up from the production start die, The adjacent dies are picked up in order.

  In this case, there is a possibility that the coordinate system of the wafer pallet set in the die pickup device is shifted from the coordinate system of the die pickup device. Therefore, in Patent Document 1, a plurality of dies at predetermined positions are set as a plurality of reference dies (reference chips) from among a large number of dies on the dicing sheet, and the entire wafer on the dicing sheet (a large number of dies). Die) is imaged by the camera and displayed on the display panel. On the display screen, the operator manually teaches one reference die adjacent to the notch formed on the edge of the wafer to determine the position of the reference die. As well as inputting, the image of the position of another reference die is automatically recognized with reference to the reference die, and the mechanical coordinate system of the die pickup device and the coordinate system of the wafer pallet are based on the positions of the plurality of reference dies. The map data is corrected by measuring the amount of positional deviation between them (X, Y, θ coordinate deviation).

  On the other hand, in Patent Document 2 (Japanese Patent Laid-Open No. 2002-26041), in order to automatically recognize a plurality of reference dies, a plurality of dedicated reference dies different from dies used as products are formed on a wafer. I am trying.

JP 2006-332417 A JP 2002-26041 A

  However, as described in Patent Document 1, in the method in which the die adjacent to the notch formed on the edge of the wafer is used as the reference die among the many dies on the dicing sheet, the operator manually teaches the reference die. There was a drawback that the production efficiency was reduced. Furthermore, there is a possibility that the reference die is erroneously specified due to an operation mistake and erroneous data correction is performed.

  On the other hand, in Patent Document 2, since a plurality of dedicated reference dies different from dies used as products are formed on a wafer, there is a disadvantage that the yield of dies per wafer is reduced and the cost is increased accordingly. there were.

  Therefore, the problem to be solved by the present invention is to provide a die position determination system capable of achieving both improvement in production efficiency and improvement in die yield, and avoiding erroneous designation of a reference die due to an operation error.

  In order to solve the above-described problem, the invention according to claim 1 is directed to a suction nozzle of a die pickup device having a wafer pallet on which a dicing sheet to which a die formed by dicing a wafer is attached is attached, or the die pickup device. In the die position determination system for determining the position of the die in the suction nozzle of the component mounting machine to which the die on the dicing sheet is set, provided at a position outside the wafer on the upper surface of the wafer pallet. Storage position information stored in the wafer pallet coordinate system based on the reference position mark and the reference position mark of the wafer pallet set at a predetermined position. A camera that picks up images of the die pick-up device or the front Image processing means for recognizing the position of the reference position mark in the machine coordinate system of the component mounting machine, the position of the reference position mark recognized by the image processing means, and the arrangement position information of the die stored in the storage means And a die position calculating means for calculating the position of the die in the machine coordinate system of the die pick-up device or the component mounting machine.

  In this configuration, a reference position mark is provided on the upper surface of the wafer pallet, and die arrangement position information created in the coordinate system of the wafer pallet based on the position of the reference position mark is stored in the storage means. Once the position of the reference position mark on the wafer pallet set in the die pickup device is known, the die pickup device or the component mounter can be used based on the reference position mark position and the die arrangement position information stored in the storage means. The die position in the machine coordinate system can be calculated. In this case, since the reference position mark is provided not on the wafer but on the wafer pallet, it is not necessary to make a plurality of dedicated reference dies different from the die used as a product on the wafer. It is not necessary to reduce the yield. In addition, since the position of the reference position mark on the wafer pallet can be automatically recognized, there is no need for the operator to manually teach the reference die. Thereby, the problem of the production efficiency fall in the said patent document 1 can also be solved, and while improving both production efficiency and the yield of a die, the misdesignation of the reference die by a work mistake can also be avoided.

  In this case, even if the number of reference position marks provided on the wafer pallet is one, if the shape of the reference position marks is directional, the machine coordinate system of the die pickup device and the coordinate system of the wafer pallet It is possible to measure the amount of misalignment (the amount of misalignment of the X, Y, and θ coordinates), but as in claim 2, a plurality of reference position marks are provided on the upper surface of the wafer pallet, and image processing means is provided. Based on the positions of the plurality of reference position marks recognized in the image, the positional deviation amount of the coordinate system of the wafer pallet with respect to the mechanical coordinate system of the die pick-up device or the component mounting machine is calculated, and the array position information of the die is obtained by the positional deviation amount. By correcting, the position of the die in the machine coordinate system of the die pick-up device or the component mounter may be obtained. As described above, if a plurality of reference position marks are used, the positional deviation amount of the coordinate system of the wafer pallet with respect to the mechanical coordinate system of the die pickup device or the component mounting machine can be calculated with high accuracy. The position of the die in the machine coordinate system can be calculated with high accuracy.

  According to a third aspect of the present invention, the image processing means and the die position calculating means are provided in any of a control device for a pickup device, a control device for a component mounter, and a control device for a component mounting line including the component mounter. It may be. This is because the control devices are connected via a network and can transmit and receive signals to and from each other.

  Further, as described in claim 4, the storage means for storing the arrangement position information of the die may be provided on the wafer pallet, the storage device of the control device of the die pickup device may be used, or the component mounting The storage device of the control device of the machine may be used, or the storage device of the control device of the component mounting line may be used.

  When the storage device of the control device of the die pickup device or the storage device of the control device of the component mounting line is used as a storage device for storing die arrangement position information, In addition to storing the arrangement position information of the die of the wafer pallet, the wafer pallet is provided with an identification information recording unit for recording or storing the identification information of the wafer pallet, and the identification information recording unit is provided with the identification information recording unit in the die pickup device. An identification information reading means for reading information is provided, and a wafer pallet die arrangement corresponding to the identification information read by the identification information reading means from among a plurality of wafer pallet die arrangement position information stored in the storage means The position information may be read to calculate the die position of the wafer pallet. In this way, there is an advantage that the arrangement position information of a plurality of wafer pallet dies can be collectively managed by one storage means.

  In this case, the identification information recording unit may record a code such as a bar code or a two-dimensional code, or may use an electronic tag for electronic storage, a magnetic tape for magnetic recording, or the like. The identification information reading means for reading the identification information from the identification information recording unit may be provided with a dedicated reader according to the recording method of the identification information recording unit, but the cost increases accordingly. Therefore, in consideration of the fact that the die pick-up device for setting the wafer pallet is equipped with a camera for imaging the die on the wafer pallet as a standard, a code representing the identification information is recorded on the upper surface as the identification information recording unit. The identification information reading means may pick up an image of the code with the camera and recognize the image of the code. In this way, the camera that images the die on the wafer pallet can also be used as identification information reading means for reading the identification information from the identification information recording unit, and the cost reduction requirement can be satisfied.

  The die that is first sucked by the suction nozzle after the start of production (hereinafter referred to as “production start die”) may be designated by the operator by teaching or the like, or stored as in claim 6. The position information of the production start die may be stored in the means. In this way, the work of specifying the production start die by teaching or the like by the operator can be omitted, the production efficiency can be further improved, and erroneous specification of the production start die due to a work mistake can be avoided.

  In this case, as described in claim 7, it is preferable that the storage means update and store the position information of the die that is first sucked at the next production when the production is finished as the position information of the production start die. In this way, even when the die remaining on the wafer pallet at the end of production is reused in the next production, the position of the production start die that is first picked up in the next production can be automatically acquired, The operator can omit the operation of specifying the production start die by teaching or the like, and can also avoid erroneous specification of the production start die due to an operation error.

FIG. 1 is an external perspective view of a component supply apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view of the push-up unit portion. FIG. 3 is an external perspective view of a component mounter on which a component supply device is set. FIG. 4 is an external perspective view of the wafer pallet. FIG. 5 is a flowchart showing the flow of processing of the die position calculation program.

An embodiment embodying a mode for carrying out the present invention will be described with reference to the drawings.
As shown in FIG. 1, the die pick-up device 11 of the present embodiment includes a magazine holder 12 (tray tower), a pallet drawer table 13, a pallet drawer mechanism 14, a sub robot 15, a shuttle mechanism 16, a reversing unit 17, and a push-up unit. 18 (see FIG. 2), an NG conveyor 19, a nozzle changer 20, and the like. As shown in FIG. 3, the die pickup device 11 is set in a state in which the pallet drawer table 13 is inserted into the feeder setting slot of the component mounter 25.

  In a magazine (not shown) housed in a magazine holding portion 12 of the die pickup device 11 so as to be movable up and down, a wafer pallet 22 on which a die 21 (wafer part) is placed and a tray part (electronic part) are placed. A tray pallet (not shown) can be mixed and mounted in multiple stages. As shown in FIGS. 4 and 5, the wafer pallet 22 includes an expandable dicing sheet 36 on which a wafer (a large number of dies 21) diced in a grid pattern is attached, and a wafer mounting plate having a circular opening. The wafer mounting plate 23 is mounted in an expanded state, and the wafer mounting plate 23 is attached to the pallet body 28 by screwing or the like. The dicing sheet 36 may be expanded by any method. For example, the dicing sheet 36 may be mounted on the wafer mounting plate 23 with the circular ring pushed up from below.

  The pallet pulling mechanism 14 pulls out one of the wafer pallet 22 and the tray pallet from the magazine in the magazine holding unit 12 onto the pallet pulling table 13 according to a production program (production job). And a position where the die 21 is picked up by a suction nozzle (not shown) of the component mounting machine 25 (see FIG. 3) (hereinafter referred to as “component mounting machine drawing position”) and a drawing position close to the magazine (hereinafter referred to as “sub robot use”). The pallet 22 can be pulled out at any position of “drawing position”. The component mounting machine drawer position is the position of the front end of the pallet drawer table 13 (the position farthest from the magazine), and the sub robot drawer position is the suction nozzle (not shown) of the sub robot 15 on the wafer pallet 22. This is a position where the die 21 on the dicing sheet 36 can be adsorbed.

  The sub-robot 15 is provided above the pallet pull-out table 13 in the back surface of the magazine holder 12 (the surface on the sub-robot pull-out position side), and is in the XZ direction (the width direction and the vertical direction of the pallet pull-out table 13). Direction). The movement direction of the sub robot 15 is only the X direction, and the relative position of the sub robot 15 in the Y direction (pallet pulling direction) with respect to the wafer pallet 22 is gradually pulled out in the Y direction by the pallet pulling mechanism 14. It is controlled by that. The sub robot 15 is provided with one or a plurality of suction nozzles (not shown) facing downward, so that the suction nozzles can be replaced by the nozzle changer 20 according to the size of the die 21 to be picked up. . The sub robot 15 is provided with a camera 24, and based on a captured image of the camera 24, the position of the die 21 to be picked up or the suction posture of the die 21 can be confirmed.

  The shuttle mechanism 16 receives the component picked up by the suction nozzle of the sub robot 15 by the shuttle nozzle 26 and transfers it to a position where it can be picked up by the suction nozzle of the component mounting machine 25.

  The reversing unit 17 flips the die 21 received from the sub robot 15 upside down as necessary. This is because, depending on the type of the die 21, there is a die (for example, a flip chip) that is attached to the dicing sheet 36 of the wafer pallet 22 upside down.

  The push-up unit 18 (see FIG. 2) is provided on the pallet drawer table 13 and is configured to be movable in the XY direction (the width direction of the pallet drawer table 13 and the direction perpendicular thereto) in the space area below the dicing sheet of the wafer pallet 22. Has been. Even when the wafer pallet 22 is pulled out to any position of the component mounter pulling position and the sub robot pulling position, the sticking portion of the die 21 to be picked up in the dicing sheet 36 is pushed up from below. By pushing up locally at 27, the sticking part of the die 21 is partly peeled off the dicing sheet 36, and the die 21 is lifted up so that it can be easily picked up. In order for the push-up unit 18 to select the push-up pot 27 according to the size of the die 21 or the like, a plurality of types (for example, four types) of push-up pots 27 have a predetermined angular pitch (90 ° pitch in the example of FIG. 2). The push-up pot 27 that is provided radially and is pushed up is rotated to a position where it is directed upward.

  The push-up unit 18 is configured such that the push-up unit 18 as a whole moves up and down using a servo motor (not shown) as a drive source. During the die pick-up operation, when the push-up unit 18 rises and the upper end of the push-up pot 27 comes into contact with the dicing sheet 36 of the wafer pallet 22, the push-up unit 18 stops being raised by a stopper mechanism (not shown) and continues to move up. Then, the push-up pin protrudes upward from the push-up pot 27 so as to push up the sticking portion (the suction point of the suction nozzle) of the die 21 to be sucked out of the dicing sheet 36. In this case, the push-up height of the push-up pin can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.

  The NG conveyor 19 is a conveyor that discharges defective parts and dies 21 with poor suction. As shown in FIG. 3, the magazine holding unit 12 is provided with a window 31 for confirming from the operator side the state in which the die 21 on the dicing sheet 36 of the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15. When the operator confirms the state in which the die 21 on the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15, the operation in the confirmation mode in which the pallet in the magazine holding unit 12 is retracted below the window 31. It can be selected. Further, in the confirmation mode, the sub robot 15 can be stopped with the suction nozzle of the sub robot 15 picking up the die 21 on the wafer pallet 22.

  The control device 32 of the die pickup device 11 configured as described above is configured by a computer including an input device 33 such as a keyboard and a mouse, and peripheral devices such as a display device 34 such as a liquid crystal display, and component mounting according to a production program. The pallet pull-out position and the part pick-up method are selected according to the type of parts to be supplied to the machine 25, and the pallet pull-out mechanism 14, sub robot 15 and shuttle mechanism 16, reversing unit 17, push-up unit are selected according to the selection result. The operation of 18 etc. is controlled as follows.

(1) In the case of the small die 21 In the case of the small die 21, it is difficult to hold the die 21 to the suction nozzle of the sub robot 15 → shuttle nozzle 26 → component mounting machine 25. 22 is pulled out to the component mounting machine drawing position, and the die 21 on the dicing sheet 36 of the wafer pallet 22 is directly picked up by the suction nozzle of the component mounting machine 25.

(2) In the case of the die 21 having a size other than the above In the case of the die 21 having a size that allows the die 21 to be held, the wafer pallet 22 is removed from the magazine in the magazine holding unit 12 for the purpose of shortening the mounting time. The die 21 is pulled out to the sub robot pulling position, and the die 21 on the dicing sheet 36 of the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15, and the die 21 is received by the shuttle nozzle 26 of the shuttle mechanism 16 to be received at a predetermined pickup position. The die 21 is picked up by the suction nozzle of the component mounting machine 25 from the shuttle nozzle 26 of the shuttle mechanism 16 at this pickup position.

(3) In the case of a tray component In the case of a tray component, the tray pallet is pulled out from the magazine in the magazine holding unit 12 to the component mounting machine drawer position, and the component on the tray pallet is directly picked up by the suction nozzle of the component mounting machine 25. Pick up.

  By the way, when the die 21 on the dicing sheet 36 of the wafer pallet 22 is picked up and picked up by the suction nozzle, the push-up pot 27 is located in the circular opening of the wafer pallet 22 with the dicing sheet 36 stretched, and the dicing sheet It is necessary to avoid the push-up pot 27 from interfering with the edge of the circular opening of the wafer pallet 22 because it moves in the XY direction along the lower surface of the dicing sheet 36 in a sucked state. .

  Further, there are various sizes of wafers on the dicing sheet 36 of the wafer pallet 22 such as 8 inches, 6 inches, and 4 inches, and even if they are the same size, there is no grip ring inside. Depending on the presence or absence of the grip ring, the diameter of the effective area (circular opening) of the wafer varies. Therefore, it is necessary to set the movable range of the push-up pot 27 in the XY direction according to the size of the wafer on the dicing sheet 36 of the wafer pallet 22 and the presence or absence of the grip ring.

  In this embodiment, therefore, an identification information recording unit 35 that records or stores the identification information is provided on the wafer pallet 22. In addition to the identification information of the wafer pallet 22, the identification information recording unit 35 is provided on the dicing sheet 36. The wafer information relating to the size of the wafer and / or the pickup operation range is recorded or stored. The identification information recording unit 35 may be one that records a code such as a bar code or a two-dimensional code, or may be an electronic tag that is stored electronically, a magnetic tape that is magnetically recorded, or the like. The identification information reading means for reading the identification information and the wafer information from the identification information recording unit 35 may be provided with a dedicated reader according to the recording method of the identification information recording unit 35, but the cost increases accordingly.

  Therefore, in consideration of the fact that the die pick-up device 11 is equipped with a die imaging camera 24 as a standard, in this embodiment, as the identification information recording unit 35, a code (bar code) representing identification information and wafer information on the upper surface. 2D code or the like) is used, and as the identification information reading means, the die imaging camera 24 equipped in the die pickup device 11 is used, and the camera 24 uses the code of the identification information recording unit 35. The code of the identification information recording unit 35 is read by performing image processing with the control device 32 of the die pickup device 11. In this way, the identification information reading means for reading the identification information and the wafer information from the identification information recording unit 35 can be used as the die imaging camera 24, and an increase in cost can be avoided.

  The control device 32 of the die pick-up device 11 reads the identification information and the wafer information from the code of the wafer information recording unit 35 using the die imaging camera 24 before starting the die pick-up operation. Automatically set the movable range of the direction. As a result, it is not necessary to perform an operation of inputting information on the movable range in the X and Y directions in which the push-up pot 27 does not interfere with the circular opening edge of the wafer pallet 22, and productivity can be improved.

  By the way, when the wafer pallet 22 is pulled out from the magazine in the magazine holding unit 12 onto the pallet pull-out table 13 and the die 21 on the wafer pallet 22 is sucked by the suction nozzle, the suction nozzle is set to the die 21 for each die suction operation. Therefore, the position of the die 21 on the wafer pallet 22 is calculated by the following method.

  Reference position marks 41 are provided, for example, at two positions on the upper surface of the wafer pallet 22 outside the wafer (wafer mounting plate 23). The positions of the two reference position marks 41 may be set, for example, on the outer side in the diameter direction of the circular wafer or in the vicinity thereof. In short, the coordinate system of the wafer pallet 22 using the two reference position marks 41 as a reference. So that the interval between the two reference position marks 41 is increased. The shape of the two reference position marks 41 may be any shape as long as the shape can accurately recognize the center position.

  Before the start of production, die arrangement position information (map data) indicating the arrangement of the dies 21 on the wafer pallet 22 is created in the coordinate system of the wafer pallet 22 based on the position of the reference position mark 41 and stored in the storage means. Keep it. This storage means may be provided on the wafer pallet 22, the storage device of the control device 32 of the die pick-up device 11 may be used, or the storage device of the control device of the component mounter 25 may be used. Alternatively, a storage device of a control device (production management computer) of a component mounting line on which the die pickup device 11 is installed may be used. When the storage means is provided on the wafer pallet 22, identification information and wafer information may be stored in the storage means.

  In the present embodiment, the die arrangement position information of the plurality of wafer pallets 22 is stored in the storage device of the control device 32 of the die pickup device 11, the storage device of the control device of the component mounting machine 25, or the storage device of the control device of the component mounting line. In addition, the die arrangement position information of the wafer pallet 22 corresponding to the identification information read by the identification information reading means is read out from the die arrangement position information of the plurality of wafer pallets 22 stored in the storage device. The position of the die 21 of the wafer pallet 22 is calculated. In this way, there is an advantage that the die array position information of the plurality of wafer pallets 22 can be collectively managed by one storage device.

  Here, the die arrangement position information (map data) may be created by using an inspection apparatus or the like, as described in, for example, Patent Document 1 (Japanese Patent Laid-Open No. 2006-332417), or May be created using a dedicated device with an improved digitizer or the like. In addition to the die arrangement position information, the position information of the defective die may be stored so that the defective die is not sucked by the suction nozzle.

  Further, the die 21 (hereinafter referred to as “production start die”) that is first sucked by the suction nozzle after the production is started may be designated by the operator by teaching or the like. The die position information is stored. In this way, the operator can omit the work of designating the production start die by teaching or the like, and the production efficiency can be further improved.

  In this case, it is preferable to update and store the position information of the die 21 that is first sucked in the next production at the end of production as the position information of the production start die. In this way, even when the die 21 remaining on the wafer pallet 22 at the end of production is reused in the next production, the position of the production start die can be automatically acquired, and the operator can perform teaching or the like. The work of specifying the production start die can be omitted.

  In this embodiment, the control unit 32 of the die pick-up device 11, the control unit of the component mounter 25 or the control unit of the component mounting line executes the die position calculation program of FIG. The position of the die 21 in the machine coordinate system of the die pickup device 11 is calculated based on the position of the die and the die arrangement position information stored in the storage device. Here, the mechanical coordinate system of the die pickup device 11 is a coordinate system used for controlling the sub robot 15 that moves the suction nozzle that sucks the die 21.

  The die position calculation program in FIG. 5 is repeatedly executed at a predetermined cycle during operation of the die pickup device 11, and serves as an image processing means and a die position calculation means in the claims. When this program is started, first, in step 101, it is determined whether or not the wafer pallet 22 has been pulled out from the magazine in the magazine holding unit 12 to a predetermined position on the pallet pulling table 13, and if not, it is pulled out. Wait until Thereafter, when the wafer pallet 22 is pulled out onto the pallet pull-out table 13, the process proceeds to step 102, where identification information is read from the identification information recording unit 35 of the wafer pallet 22 using identification information reading means such as a camera 24.

  Thereafter, the process proceeds to step 103, where the wafer pallet 22 corresponding to the identification information read by the identification information reading means from the die arrangement position information of the plurality of wafer pallets 22 and the position information of the production start die stored in the storage device. Die arrangement position information and production start die position information are read.

  Thereafter, the process proceeds to step 104, where the camera 24 images two reference position marks 41 on the wafer pallet 22, and in the next step 105, the captured image of the camera 24 is processed, and the machine coordinate system of the die pickup device 11 is processed. The position of the reference position mark 41 is recognized.

  Thereafter, the process proceeds to step 106, and the positional deviation amount (X-axis direction deviation) of the coordinate system of the wafer pallet 22 with respect to the mechanical coordinate system of the die pickup device 11 based on the position of the reference position mark 41 in the mechanical coordinate system of the die pickup device 11. Amount ΔX, Y axis direction deviation amount ΔY, rotational direction deviation amount Δθ). Then, in the next step 107, the die arrangement position information read in step 103 and the position information of the production start die are corrected by the positional deviation amount (ΔX, ΔY, Δθ) of the coordinate system of the wafer pallet 22. The position of each die 21 and the position of the production start die in the machine coordinate system of the die pickup device 11 are obtained.

  According to the present embodiment described above, the reference position mark 41 is provided on the upper surface of the wafer pallet 22 and die array position information created in the coordinate system of the wafer pallet 22 with the position of the reference position mark 41 as a reference is stored. Therefore, if the position of the reference position mark 41 on the wafer pallet 22 set in the die pickup apparatus 11 is found, the position of the reference position mark 41 and the die arrangement position information stored in the storage means are stored. Based on the above, the position of the die 21 in the machine coordinate system of the die pickup device 11 can be calculated. In this case, since the reference position mark 41 is provided not on the wafer but on the wafer pallet 22, it is not necessary to make a plurality of dedicated reference dies different from the die 21 used as a product on the wafer. The yield of the winning die 21 is not reduced. In addition, since the position of the reference position mark 41 on the wafer pallet 22 can be automatically recognized, it is not necessary for the operator to manually teach the reference position mark 41. Thereby, the problem of the production efficiency fall in the said patent document 1 (Unexamined-Japanese-Patent No. 2006-332417) can also be solved, and it can be made to make a production efficiency improvement and the yield improvement of the die | dye 21 compatible, and also by an operation mistake Incorrect specification of the reference die can also be avoided.

  In the present embodiment, the number of reference position marks 41 provided on the wafer pallet 22 is two (plural). However, the present invention may have only one reference position mark. If the shape is a directional shape (for example, an L shape having a straight line portion extending in the X direction and a straight line portion extending in the Y direction), it is between the machine coordinate system of the die pickup device 11 and the coordinate system of the wafer pallet 22. The amount of misalignment (ΔX, ΔY, Δθ) can be measured.

  In the present embodiment, the reference position mark 41 of the wafer pallet 22 is imaged by the camera 24 of the die pickup apparatus 11 and the die position in the machine coordinate system of the die pickup apparatus 11 is calculated. The reference position mark 41 of the wafer pallet 22 is imaged by a substrate mark imaging camera provided on the mounting head of the machine 25, the die position in the machine coordinate system of the component mounter 25 is calculated, and the component mounting is performed. The die on the wafer pallet 22 may be directly sucked by the suction nozzle of the mounting head of the machine 25.

  In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as appropriately changing the configuration of the component supply device 11.

  DESCRIPTION OF SYMBOLS 11 ... Die pick-up apparatus, 12 ... Magazine holding part, 13 ... Pallet drawer table, 14 ... Pallet drawer mechanism, 15 ... Sub robot, 16 ... Shuttle mechanism, 17 ... Reversing unit, 18 ... Push-up unit, 19 ... NG conveyor, 20 DESCRIPTION OF SYMBOLS Nozzle changer, 21 ... Die (wafer part), 22 ... Wafer pallet, 23 ... Wafer mounting plate, 24 ... Camera (identification information reading means), 25 ... Component mounting machine, 26 ... Shuttle nozzle, 27 ... Push-up pot, 28 ... Pallet body, 32 ... Control device (image processing means, die position calculation means), 33 ... Input device, 34 ... Display device, 35 ... Identification information recording section, 36 ... Dicing sheet, 41 ... Reference position mark

Claims (7)

On the dicing sheet, a suction nozzle of a die pickup device mounted with a wafer pallet on which a dicing sheet formed by dicing a wafer is attached, or a suction nozzle of a component mounting machine on which the die pickup device is set. In the die position determination system for determining the position of the die in the one that sucks the die,
A reference position mark provided at a position outside the wafer on the upper surface of the wafer pallet;
Storage means for storing the array position information of the die created in the coordinate system of the wafer pallet based on the position of the reference position mark;
A camera for imaging a reference position mark of the wafer pallet set at a predetermined position;
Image processing means for processing a captured image of the camera and recognizing the position of the reference position mark in a machine coordinate system of the die pickup device or the component mounter;
Based on the position of the reference position mark recognized by the image processing means and the arrangement position information of the die stored in the storage means, the position of the die in the machine coordinate system of the die pick-up device or the component mounter is calculated. And a die position calculation means. A plurality of reference position marks are provided on the upper surface of the wafer pallet,
The die position calculating means is a positional deviation amount of the coordinate system of the wafer pallet with respect to a mechanical coordinate system of the die pick-up device or the component mounter based on the positions of the plurality of reference position marks recognized by the image processing means. The position of the die in the machine coordinate system of the die pick-up device or the component mounting machine is obtained by calculating the above and correcting the arrangement position information of the die with the amount of displacement. The die position determination system described.   The image processing means and the die position calculation means are provided in any of a control device for the pickup device, a control device for the component mounter, and a control device for a component mounting line including the component mounter. The die position determination system according to claim 1 or 2.   The storage means is provided in any one of the wafer pallet, a control device for the pickup device, a control device for the component mounter, and a control device for a component mounting line including the component mounter. Item 4. The die position determination system according to any one of Items 1 to 3. The storage means stores the array position information of a plurality of wafer pallet dies,
The wafer pallet is provided with an identification information recording unit that records or stores identification information of the wafer pallet,
The die pickup device is provided with identification information reading means for reading the identification information from the identification information recording unit,
The die position calculation means is arranged in the wafer pallet die arrangement position corresponding to the identification information read by the identification information reading means from among the plurality of wafer pallet die arrangement position information stored in the storage means. 5. The die position determination system according to claim 1, wherein information is read to calculate a die position of the wafer pallet.   The position information of a die (hereinafter referred to as “production start die”) that is first sucked by the suction nozzle after the start of production is stored in the storage unit. Die position determination system.   7. The die position determination system according to claim 6, wherein the storage means updates and stores the position information of the die that is first picked up at the next production at the end of production as the position information of the production start die.

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