JP7466134B2 - Production information management system and production information management method - Google Patents

Description

This disclosure relates to a production information management system and a production information management method that manages production information based on the results of components being removed from a carrier and mounted on a board by a component mounter.

Conventionally, mounted boards are industrially produced by mounting electronic components and other parts onto a board using a component mounter. When a malfunction occurs in part of a mounted board mass-produced in this way during an industrial production process, there is a demand for tracing the cause of the malfunction. Therefore, in the manufacturing information management method described in Patent Document 1, manufacturing information is managed by writing the manufacturing information to an IC tag attached to the board.

JP 2010-272692 A

However, with the technology described in Patent Document 1, although it is possible to track defects in component mounters during the manufacturing process of mounted boards by acquiring manufacturing information, it is not possible to track defects outside of the mounting process, such as defects caused by the components themselves.

Therefore, the present disclosure provides a production information management system and a production information management method that generate production information that can trace defects caused by the components being installed.

A production information management system according to one aspect of the present disclosure is a production information management system that manages production information related to mounted boards produced by a component mounter that mounts components removed from a carrier holding a plurality of components onto a board, and includes a board information acquisition unit that acquires board information identifying the board on which the components are to be mounted, a carrier information acquisition unit that acquires carrier information identifying the carrier, a holding position information acquisition unit that acquires holding position information identifying the holding position in the carrier of the components to be mounted, a mounting position acquisition unit that acquires mounting position information identifying the mounting position on the board of the components removed from the carrier, and a storage unit that stores production information of the mounted board that associates the carrier information, the holding position information, and the mounting position information with the acquired board information.

A production information management method according to one aspect of the present disclosure is a production information management method for managing production information related to a mounted board produced by a component mounter that mounts components removed from a carrier holding a plurality of components onto a board, and includes a board information acquisition step for acquiring board information that identifies the board on which the components are to be mounted, a carrier information acquisition step for acquiring carrier information that identifies the carrier, a holding position information acquisition step for acquiring holding position information that identifies the holding position of the components to be mounted in the carrier, a mounting position acquisition step for acquiring mounting position information that identifies the mounting position of the components removed from the carrier on the board, and a first storage step for storing production information of the mounted board that associates the carrier information, the holding position information, and the mounting position information with the acquired board information.

These comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or may be realized by any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

The production information management system and production information management method disclosed herein are capable of tracing a defective mounting board back to the component, and inferring the possibility of a malfunction occurring in a mounting board on which a component related to the causative component is mounted and which has not yet experienced a malfunction.

FIG. 1 is an external view of a mounting system according to an embodiment. FIG. 2 is an external view of the component mounter according to the embodiment. FIG. 3 is a plan view showing the main configuration of the component mounter according to the embodiment. FIG. 4 is a perspective view showing a holding relationship of components on a carrier plate according to the embodiment. FIG. 5 is a perspective view showing the storage relationship of carrier plates in a magazine according to the embodiment. FIG. 6 is a perspective view showing the holding relationship of components on a carrier tape according to an embodiment. FIG. 7 is a block diagram showing a functional configuration of the integrated station according to the embodiment. FIG. 8 is a plan view showing the positional relationship of components on a wafer in the embodiment. FIG. 9 is a diagram illustrating an example of production information according to the embodiment. FIG. 10 is a flow chart showing a flow up to the third storage step in the embodiment. FIG. 11 is a flowchart showing a flow up to the second storage step in the embodiment. FIG. 12 is a flowchart showing a flow up to the first storage step in the embodiment.

In order to solve the above problem, a production information management system according to one aspect of the present disclosure is a production information management system that manages production information related to mounted boards produced by a component mounter that mounts components removed from a carrier holding a plurality of components onto a board, and includes a carrier information acquisition unit that acquires carrier information that identifies the carrier, a board information acquisition unit that acquires board information that identifies the board on which the components are to be mounted, a holding position information acquisition unit that acquires holding position information that identifies the holding position in the carrier of the components to be mounted, a mounting position acquisition unit that acquires mounting position information that identifies the mounting position on the board of the components removed from the carrier, and a storage unit that stores production information of the mounted board that associates the carrier information, the holding position information, and the mounting position information with the acquired board information.

The production information management method is a production information management method for managing production information related to a mounted board produced by a component mounter that mounts components taken from a carrier holding a plurality of components onto a board, and includes a carrier information acquisition step for acquiring carrier information that identifies the carrier, a board information acquisition step for acquiring board information that identifies the board on which the components are to be mounted, a holding position information acquisition step for acquiring holding position information that identifies the holding position in the carrier of the components to be mounted, a mounting position acquisition step for acquiring mounting position information that identifies the mounting position on the board of the components taken from the carrier, and a first storage step for storing production information of the mounted board that associates the carrier information, the holding position information, and the mounting position information with the acquired board information.

As a result, if a malfunction occurs in a manufactured mounted board, it is possible to trace the cause back to the position of the carrier holding the component. Therefore, for example, it is possible to infer that there is a high probability of a malfunction occurring in a mounted board on which a component that was held near the component that caused the malfunction was mounted, on the same carrier.

The production information management system further includes a magazine information acquisition unit that is attached to a magazine that stores a plurality of the carriers and acquires magazine information that identifies the magazine, and a storage position information acquisition unit that acquires storage position information that identifies the storage position of the carrier in the magazine, and the storage unit may further store the acquired board information in association with the magazine information and the storage position information.

The production information management method may also include a magazine information acquisition step of acquiring magazine information that is attached to a magazine that stores a plurality of the carriers and identifies the magazine, a storage position information acquisition step of acquiring storage position information that identifies the storage position of the carrier in the magazine, and a second storage step of storing the acquired board information in association with the magazine information and the storage position information.

This makes it possible to infer that there is a high probability of a malfunction occurring on a board on which a component that was held in a carrier located near the component that caused the malfunction is mounted in the same magazine.

The parts may be parts cut out from a wafer, and the production information management system may further include a wafer information acquisition unit that acquires wafer information identifying the wafer, and a wafer position information acquisition unit that acquires wafer position information identifying the position of the parts on the wafer, and the storage unit may store the wafer information and the wafer position information in association with the carrier information and the holding position information.

The production information management method may further include a wafer information acquisition step of acquiring wafer information that identifies the wafer, a wafer position information acquisition step of acquiring wafer position information that identifies the position of the part on the wafer, and a third storage step of storing the wafer information and the wafer position information in association with the carrier information and the holding position information.

Based on these findings, it is possible to infer that there is a high probability of malfunction occurring on a mounting board on which a component that was located near the component that caused the malfunction is mounted on the same wafer.

(Embodiment)
Hereinafter, the embodiment will be specifically described with reference to the drawings.

The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection forms, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Furthermore, among the components in the following embodiments, components that are not described in an independent claim that indicates a superordinate concept are described as optional components.

The figures are schematic diagrams and are not necessarily precise illustrations. In each figure, the same components are given the same reference numerals.

Figure 1 shows the external appearance of a production information management system in an embodiment.

The mounting system 1000 in this embodiment includes multiple component mounters 100 (three component mounters 100 in the example shown in FIG. 1) and an integrated station 200 capable of executing a production information management method.

The multiple component mounters 100 are configured as a production line that sends boards 20 from upstream to downstream while mounting components such as electronic components. That is, each component mounter 100 receives boards 20 from the upstream side, mounts components on the boards 20, and sends the boards 20 with the mounted components downstream. Hereinafter, a board 20 on which components have been mounted by such a production line made up of multiple component mounters 100 will be referred to as a mounted board.

Figure 2 is an external view of the component mounter 100. Figure 3 is a plan view showing the main configuration of the component mounter 100.

The type of component mounter 100 is not particularly limited, but an example is a component mounter 100 equipped with two sub-equipment (front sub-equipment 110 and rear sub-equipment 120) that simultaneously and independently mounts components. Each of the sub-equipment 110, 120 is an orthogonal robot type mounting stage, and is equipped with a second component supply unit 115, a head 112, an XY robot 113, a component recognition camera 116, etc. The rear sub-equipment 120 is equipped with a first component supply unit 117. The second component supply unit 115 is composed of an array of multiple carrier tapes 114 that each store a carrier tape.

The head 112 can be equipped with, for example, multiple nozzles for picking up components, and can hold multiple components from a carrier tape 114, a carrier plate 170 (described later) also called a FOL carrier, etc., and mount them on the board 20. The XY robot 113 moves the head 112. The component recognition camera 116 is used to two-dimensionally or three-dimensionally inspect the pick-up state of the components picked up by the head 112.

The carrier supplied by the first component supply unit 117 is a plate-shaped carrier plate 170 as shown in FIG. 4. The carrier plate 170 is a plate-shaped member that holds components 171 arranged in a matrix in a mounted state. The carrier plate 170 is provided with information holding means 172 that holds carrier information that can identify the carrier. The information holding means 172 is not particularly limited, and the carrier information may be held by an IC tag, a two-dimensional code, or the like. In the present embodiment, the information holding means 172 is a barcode.

As shown in FIG. 6, the carrier plates 170 are supplied in a state where a plurality of plates are inserted and stored in the magazine 180. The magazine 180 is provided with an information holding means 172 that holds magazine information that identifies the magazine 180. The information holding means 172 attached to the magazine 180 does not need to be the same as the carrier plate 170, but in this embodiment, a barcode similar to that of the carrier plate 170 is attached using the information holding means 172.

The carrier supplied by the second component supply unit 115 is a tape-like carrier tape 114 as shown in FIG. 5. The components 171 are stored in a number of storage recesses formed in succession at regular intervals on the carrier tape 114, and are packaged by attaching a cover tape 425 to the upper surface. The carrier tape 114 with the cover tape 425 attached in this manner is then supplied in a form wound up by a predetermined number onto a component reel 426.

The parts reel 426 on which the carrier tape 114 is wound is provided with an information storage means 172 that stores carrier information that can identify the carrier. The carrier information includes information about the manufacturing vendor that produced the parts reel 426.

The component recognition camera 116 is positioned near the center of the arrangement direction of the carrier tape 114 in the second component supply section 115. After picking up a component from the second component supply section 115, the head 112 passes the component recognition camera 116 and then moves to the mounting point on the board 20, repeating the operation of mounting all the picked-up components in sequence. The mounting point is the position on the board where the component is to be mounted.

The mounter 100 moves the head 112 to the first component supply unit 117 or the second component supply unit 115 and has the head 112 pick up components. The mounter 100 then moves the head 112 over the component recognition camera 116 at a constant speed, and has the component recognition camera 116 capture images of all components picked up by the head 112, allowing the pick-up positions of the components to be accurately detected. The mounter 100 then moves the head 112 to the board 20 and sequentially mounts all of the picked-up components on the mounting points. The mounter 100 mounts all of the predetermined components on the board 20 by repeatedly performing the pick-up, movement, and mounting operations using the head 112.

Figure 7 is a block diagram showing the functional configuration realized by the integrated station in this embodiment.

The integrated station 200 is a device that manages the mounting process in the component mounters 100 and manages information on the mounted components 171. The integrated station 200 is a computer that can realize multiple functions by executing software, and realizes a production information management system 210 as one of its functions. In this embodiment, the integrated station 200 also functions as a data generation system. The data generation system generates mounting data for mounting components in a production line consisting of multiple component mounters 100, and instructs each component mounter 100 to mount the components on the board 20 according to the mounting data.

The integrated station 200 includes an input unit 201, a display unit 202, a storage unit 204, and a communication unit. It also includes a generation unit 203 as a data generation system.

The input unit 201 is composed of information acquisition devices such as a keyboard and a mouse, and receives operations from an operator and notifies the generation unit 203 and other units of the results of the operations.

The display unit 202 is composed of, for example, an LCD display, and displays the operating status of the generation unit 203 and other units, as well as the data stored in the storage unit 204.

The generation unit 203 generates mounting data and stores the generated mounting data in the storage unit 204. The generation unit 203 also displays the mounting data on the display unit 202 and transmits it to each mounter 100 via the communication unit 205.

The storage unit 204 is a recording medium for storing implementation data and the like. This recording medium may be volatile or non-volatile. Specifically, the storage unit 204 may be, for example, a hard disk or a semiconductor element memory.

The communication unit 205 communicates with each mounter 100, a higher-level computer, etc. For example, the communication unit 205 transmits mounting data stored in the storage unit 204 to the mounter 100, causing the mounter 100 to mount components according to the mounting data. The communication unit 205 also acquires wafer information, wafer position information (described in detail below), etc. from the higher-level computer, etc.

The production information management system 210 manages production information related to mounted boards produced by a component mounter 100 that mounts the components 171 taken from a carrier plate 170 that holds a plurality of components 171, a carrier tape 114, etc., onto a board 20. The production information management system 210 includes a carrier information acquisition unit 211, a board information acquisition unit 212, a holding position information acquisition unit 213, a mounting position acquisition unit 214, and a memory unit 215 as processing units that are realized by executing software. In addition, in the case of this embodiment, the production information management system 210 includes a magazine information acquisition unit 216, a storage position information acquisition unit 217, a wafer information acquisition unit 218, and a wafer position information acquisition unit 219.

The board information acquisition unit 212 is a processing unit that acquires board information that identifies the board 20 on which the component 171 is mounted. The method by which the board information acquisition unit 212 acquires the board information is not particularly limited, and for example, the component mounter 100 may read the board information attached to the board 20 using an information storage means such as a two-dimensional code, a three-dimensional code, or an RFID, and acquire the read board information by communication. Alternatively, the board information may be acquired from the mounting data.

The carrier information acquisition unit 211 is a processing unit that acquires carrier information that identifies carriers such as the carrier tape 114 and the carrier plate 170. The method by which the carrier information acquisition unit 211 acquires the carrier information is not particularly limited, as is the case with the substrate information.

The magazine information acquisition unit 216 acquires magazine information that is attached to a magazine 180 that stores multiple carrier plates 170 by the information holding means 172 and identifies the magazine 180. The method by which the magazine information acquisition unit 216 acquires the magazine information is not particularly limited, as is the case with the board information.

The storage position information acquisition unit 217 acquires storage position information that specifies the storage position of the carrier plate 170 in the magazine 180. As with the board information, the method by which the storage position information acquisition unit 217 acquires the storage position information is not particularly limited. For example, the worker who removes the carrier plate 170 from the magazine 180 may input the information using the input unit 201.

In this embodiment, the parts 171 held by the carrier plate 170 are parts that are formed in multiples on a single wafer 179 during the semiconductor device manufacturing process and cut out individually from the wafer 179, as shown in FIG. 8, and the wafer information acquisition unit 218 acquires wafer information that identifies the wafer that became the substrate during the semiconductor device manufacturing process.

The wafer position information acquisition unit 219 acquires wafer position information that specifies the position of the component 171 on the wafer. Specifically, for example, the wafer position information is determined by the relative positional relationship between the notch 178 provided in the wafer 179 and each component 171.

The method of acquiring the magazine information, storage position information, wafer information, and wafer position information is not particularly limited. In this embodiment, the carrier information is stored in the storage unit 204 in a state in which the magazine information and storage position information are associated with each other. In the case of the carrier plate 170, the positions at which the components 171 are held are associated with wafer information and wafer position information, and these pieces of information are also stored in the storage unit 204. Thus, the magazine information acquisition unit 216, storage position information acquisition unit 217, wafer information acquisition unit 218, and wafer position information acquisition unit 219 acquire each piece of information associated with the carrier information acquired by the carrier information acquisition unit 211 from the storage unit 204.

The holding position information acquisition unit 213 acquires holding position information that specifies the holding position in the carrier of the component 171 to be mounted. For example, the component mounter 100 knows the position in the carrier plate 170 where the head 112 adsorbs and holds the component 171 from the carrier plate 170 supplied to the first component supply unit 117, and the holding position information acquisition unit 213 acquires this position from the component mounter 100 as holding position information.

The mounting position acquisition unit 214 acquires mounting position information that identifies the mounting position on the board 20 of the component removed from the carrier. The method of acquiring the mounting position information is not particularly limited, but in the present embodiment, the mounting position information is defined in the mounting data generated by the generation unit 203, and the mounting position acquisition unit 214 acquires the mounting position information from the mounting data stored in the storage unit 204.

The memory unit 215 stores in the storage unit 204 production information (see FIG. 9) that associates the acquired board information with carrier information, holding position information, and mounting position information. In the case of this embodiment, the memory unit 215 further stores magazine information, storage position information, wafer information, and wafer position information in association with the carrier information and holding position information for the board information.

Specifically, each time a component 171 is mounted at a predetermined mounting position on the board 20, the mounting position information is associated with magazine information, storage position information, carrier information, holding position information, wafer information, and wafer position information, and stored as production information in the storage unit 204. In the mounting system 1000 of this embodiment, components are continuously mounted on the board 20 inline by multiple component mounters 100, so the integrated station 200 acquires the board information, mounting position information, holding position information, and carrier information from each component mounter 100, and the production information management system 210 compiles the information acquired for each board 20 to generate a single piece of production information.

Next, the flow of information processing will be explained. Figure 10 is a flowchart showing an example of a process for associating carrier information, holding position information, wafer information, and wafer position information.

For example, a parts manufacturer cuts out a plurality of parts 171 such as semiconductor elements from a wafer on which the parts 171 are manufactured, and mounts each part 171 on a carrier plate 170. At this time, wafer information of the wafer from which the parts 171 are cut is obtained (S101), and carrier information on which the cut parts are mounted is obtained (S102). Next, a specific part 171 is picked up from a wafer that has been diced in advance (S103), and wafer position information indicating the position of the picked-up part 171 on the wafer is obtained (S104). The picked-up part 171 is mounted on a specific position on the carrier plate 170 (S105), and holding position information indicating the position of the mounted part 171 on the carrier plate 170 is obtained (S106). The processes of S103 to S106 are repeated until all parts 171 are mounted on the carrier plate 170 (S107). As a result, data is created in which each holding position information is associated with carrier information, wafer information, and wafer position information (third storage process).

Figure 11 is a flowchart showing an example of a process for associating carrier information, magazine information, and storage location information.

For example, when a parts manufacturer stores a carrier plate 170 on which a part 171 is mounted in a magazine 180, the manufacturer obtains magazine information (S201) and obtains carrier information to be stored in the magazine 180 (S202). Next, the carrier plate 170 is inserted into the magazine 180 and stored (S203), and storage position information indicating the position of the stored carrier plate 170 in the magazine 180 is obtained (S204). The processes of S202 to S204 are repeated until all carrier plates 170 are stored in the magazine 180 (S205). As a result, data is created in which the magazine information and storage position information are associated with each carrier information (second storage process).

Figure 12 is a flowchart showing an example of a process for associating board information, carrier information, holding position information, and mounting position information.

The board information acquisition unit 212 of the production information management system 210 in the integrated station 200 acquires board information from the component mounter 100 (S301). In addition, the carrier information acquisition unit 211 acquires carrier information from the first component supply unit 117 of the component mounter 100, etc. (S302). For example, at this stage, the production information management system 210 may associate the acquired carrier information with data related to the carrier information, wafer information, and wafer position information associated in the third storage process. In addition, the production information management system 210 may associate the acquired carrier information with data related to the carrier information, magazine information, and storage position information associated in the second storage process.

Next, when the head 112 picks up and holds the component 171 from the carrier plate 170 or the like arranged in the first component supply unit 117 of the component mounter 100, the holding position information acquisition unit 213 acquires holding position information (S303). Note that the component mounter 100 may fail to pick up the component 171. In this case, when the component recognition camera 116 detects the failure to pick up the component 171, it picks up the component 171 from a different holding position again from the carrier plate 170. In this case, the holding position information is updated to the new one.

The components 171 held by the head 112 are mounted on the board 20 in accordance with the mounting data (S304), and mounting position information associated with the holding position information is acquired by the mounting position acquisition unit 214 (S305). The processes of S303 to S305 are repeated until all of the specified components 171 are mounted on the board 20 (S306). As a result, production information such as that shown in FIG. 9 is generated, and the memory unit 215 stores the production information in the storage unit (first storage process).

As described above, the production information management system and production information management method of this embodiment can generate production information that correlates the mounting position on the board 20 with the position of the component on the wafer. Therefore, if a malfunction occurs on a produced mounting board and the component 171 that is causing it is found, it is possible to identify the carrier that held the component 171, the magazine 180 in which the carrier was stored, the wafer that is the manufacturing substrate for the component 171, and even the position of the wafer based on the production information from the mounting position of the component 171.

As a result, for example, when a malfunction occurs commonly among a plurality of mounting boards on which components 171 cut out from the same wafer are mounted, the mounting board on which the components 171 cut out from the wafer are mounted can be the target of a recall based on the wafer information. Also, when a malfunction occurs commonly among a plurality of mounting boards on which components 171 included in a certain area of the wafer are mounted, the mounting board on which the components 171 cut out from the area are mounted can be the target of a recall based on the wafer position information. Also, when a malfunction occurs commonly among a plurality of mounting boards on which components 171 sucked and held from a carrier contained in the same magazine 180 are mounted, the mounting board on which the components 171 held in the carrier removed from the magazine 180 are mounted can be the target of a recall based on the magazine information. Also, when a malfunction occurs commonly among a plurality of mounting boards on which components 171 held in a carrier contained in a certain area of the magazine 180 are mounted, the mounting board on which the components 171 removed from the magazine area are mounted can be the target of a recall based on the storage position information.

As described above, if a malfunction occurs in the mounting board, it is possible to trace the storage, transportation, and manufacturing processes of the component based on the mounting position of the component 171 that caused the malfunction.

The above describes the production information management system and the production information management method according to one or more aspects based on the embodiment, but the present disclosure is not limited to this embodiment. As long as it does not deviate from the spirit of this disclosure, various modifications that a person skilled in the art can make to this embodiment may also be included within the scope of this disclosure.

In the above embodiment, each component included in the integrated station 200 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory.

In addition, although an embodiment has been described in which all processing is performed by the integration station 200, some of the processing may be performed by the component mounter 100 or other equipment. For example, the component mounter 100 may associate and store the holding position information and the mounting position information each time a component 171 is mounted, and the production information management system 210 may acquire the information all at once when a certain amount of data has been accumulated.

In addition, while the holding position information of the carrier plate 170 is described, the holding position information of the component 171 held on the carrier tape 114 may also be processed in the same manner.

Furthermore, although an embodiment has been described in which the generation unit 203 generates implementation data according to predetermined rules, the implementation data may be obtained from outside the integration station 200.

In addition, the production information management system 210 does not need to hold production information as shown in FIG. 9, but only holds carrier information, holding position information, and mounting position information as production information, and other information may be held by a separate system and associated with wafer information, magazine information, etc. in the event of a malfunction of the mounting board.

This disclosure can be applied to mounting boards produced by component mounting machines.

20 Substrate 100 Component mounter 110 Sub-facility 112 Head 113 Robot 114 Carrier tape 115 Second component supply unit 116 Component recognition camera 117 First component supply unit 120 Rear sub-facility 170 Carrier plate 171 Component 172 Information holding means 179 Wafer 180 Magazine 200 Integration station 201 Input unit 202 Display unit 203 Generation unit 204 Storage unit 205 Communication unit 210 Production information management system 211 Carrier information acquisition unit 212 Substrate information acquisition unit 213 Holding position information acquisition unit 214 Mounting position acquisition unit 215 Memory unit 216 Magazine information acquisition unit 217 Storage position information acquisition unit 218 Wafer information acquisition unit 219 Wafer position information acquisition unit 425 Cover tape 426 Parts Reel 1000 Mounting System

Claims (4)

A production information management system that manages production information related to mounted boards produced by a component mounter that mounts components picked up from a carrier plate holding a plurality of components onto a board, comprising:
a board information acquisition unit that acquires board information that identifies the board on which the component is to be mounted;
A carrier information acquisition unit that acquires carrier information that identifies the carrier plate;
a holding position information acquisition unit that acquires holding position information that identifies a holding position on the carrier plate of the component to be mounted;
a mounting position acquisition unit that acquires mounting position information that identifies a mounting position on the board of the component removed from the carrier plate;
a storage unit that stores production information of a mounting board in which the carrier information, the holding position information, and the mounting position information are associated with the acquired board information;
a wafer information acquiring unit that acquires wafer information for identifying a wafer ;
a wafer position information acquiring unit that acquires wafer position information that identifies a position of the component on the wafer,
The storage unit is
a production information management system that stores the wafer information and the wafer position information in association with the carrier information and the holding position information; a magazine information acquiring unit that is attached to a magazine that stores a plurality of the carrier plates and that acquires magazine information that identifies the magazine;
a storage position information acquisition unit that acquires storage position information that identifies a storage position of the carrier plate in the magazine,
The storage unit is
2. The production information management system according to claim 1, wherein the acquired board information is stored in association with the magazine information and the storage position information. 1. A production information management method for managing production information related to a mounted board produced by a component mounter that mounts components picked up from a carrier plate holding a plurality of components onto a board, comprising:
a carrier information acquisition step of acquiring carrier information that identifies the carrier plate;
a board information acquisition step of acquiring board information that identifies the board on which the component is to be mounted;
a holding position information acquisition step of acquiring holding position information that identifies a holding position of the component to be mounted on the carrier plate;
a mounting position acquisition step of acquiring mounting position information that identifies a mounting position on the board of the component removed from the carrier plate;
a first storage step of storing production information of a mounting board in which the carrier information, the holding position information, and the mounting position information are associated with the acquired board information;
a wafer information acquiring step of acquiring wafer information for identifying the wafer ;
a wafer position information acquiring step of acquiring wafer position information that identifies a position of the component on the wafer;
The production information management method includes a third storage step of storing the wafer information and the wafer position information in association with the carrier information and the holding position information. a magazine information acquiring step of acquiring magazine information that is attached to a magazine storing a plurality of the carrier plates and that identifies the magazine;
a storage position information acquiring step of acquiring storage position information that identifies a storage position of the carrier plate in the magazine;
4. The production information management method according to claim 3, further comprising a second storage step of storing the acquired board information in association with the magazine information and the storage position information.

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