JP7359863B2 - Parts management device and parts management method - Google Patents

Description

This specification discloses a technology related to a parts management device and a parts management method.

The information management device described in Patent Document 1 includes a collection source information acquisition means, a mounting destination information acquisition means, and a storage means. The sampling source information acquisition means acquires sampling source information including identification information for identifying the wafer and sampling position information regarding the sampling position of the component on the wafer. The mounting destination information acquisition means acquires mounting destination information including identification information for identifying the base material and mounting position information regarding the mounting position of the component on the base material. The storage means stores mounting performance information in which collection source information of the mounted component and mounting destination information of the mounted component are associated with each other when the component is mounted on the base material.

The electronic component transport device described in Patent Document 2 includes a transport table that forms a transport path, a container holding device that holds an electronic component container, an observation device that observes electronic components in the transport path, and a transport table. and a plurality of carrier tape running devices arranged around the carrier tape. Note that the container holding means is a wafer ring holding section that holds a wafer ring in which electronic components are arranged in an array, or a tray holding section that holds a tray in which electronic components are arranged in an array by partitioning a plane into a lattice shape. It is.

Further, the electronic component transfer device described in Patent Document 2 classifies each electronic component of a wafer ring into non-defective products or non-defective products. A carrier tape running device for non-defective products stores electronic components in pockets of the carrier tape and seals them with seal tape while running the carrier tape in the transport direction of the reel. The reel winds up carrier tape sealed with seal tape. When the packaging of non-defective electronic components onto the carrier tape is completed, the electronic components classified as non-defective are re-inspected. During the re-inspection, workers check the data obtained by the observation equipment, and re-judge electronic components that were classified as non-defective to either non-defective or non-defective.

JP2018-056306A Japanese Patent Application Publication No. 2016-100394

Component supply methods include wafer supply, which supplies components from a wafer, as in the invention described in Patent Document 1, and reel supply, which supplies components from a reel. Furthermore, as in the invention described in Patent Document 2, it is also known to transfer components arranged on a wafer to a reel and perform reel supply. Conventionally, in reel supply, parts supplied on a reel basis have been managed, which has not been sufficient as traceability information. Specifically, it is necessary to trace all the parts supplied from the reel containing the parts to be traced, making the tracing work complicated.

In view of such circumstances, this specification discloses a parts management device and a parts management method that can improve traceability of reel-supplied parts in which parts are sequentially supplied from a carrier tape.

This specification discloses a parts management device including an acquisition unit and a storage unit. The acquisition unit acquires position information of the cavity in which the component is accommodated when the component is sequentially supplied from a carrier tape having a plurality of cavities in which the component is accommodated to be mounted on the board. The storage unit associates the positional information of the cavity acquired by the acquisition unit with identification information for identifying a reel around which the carrier tape is wound, and stores the information in a storage device.

Further, this specification discloses a parts management method including an acquisition step and a storage step. In the acquisition step, when the components are sequentially supplied from a carrier tape having a plurality of cavities accommodating the components to be mounted on the board, position information of the cavities in which the components are accommodated is acquired. In the storage step, the position information of the cavity acquired in the acquisition step and identification information for identifying a reel around which the carrier tape is wound are associated with each other and stored in a storage device.

According to the above-mentioned parts management device, the acquisition section and the storage section are provided. Thereby, the parts management device can associate the positional information of the cavity in which the supplied parts were accommodated with the identification information for identifying the reel and store them in the storage device. Therefore, the user of the parts management device can easily narrow down the parts to be traced based on the cavity position information from among the parts supplied from the carrier tape of the reel, and traceability is improved. What has been described above regarding the parts management device also applies to the parts management method.

FIG. 2 is a plan view showing a configuration example of a component mounting machine. It is a block diagram showing an example of a control block of a parts management device. 3 is a flowchart illustrating an example of a control procedure of the parts management device. FIG. 2 is a plan view showing an example of a carrier tape. FIG. 3 is a schematic diagram showing an example of information stored in a storage device. FIG. 2 is a plan view showing an example of a wafer. FIG. 3 is a schematic diagram showing an example of wafer-related information. FIG. 7 is a schematic diagram showing another example of information stored in a storage device. FIG. 2 is a plan view of a carrier tape showing an example of a cavity, a specific cavity, and an empty cavity.

1. Embodiment 1-1. Configuration Example of Component Mounting Machine 10 As shown in FIG. There is. The substrate conveyance device 11 is constituted by a belt conveyor or the like, and conveys the substrate 90 in the conveyance direction (X-axis direction). Substrate 90 is a circuit board and forms at least one of an electronic circuit and an electric circuit. The board transport device 11 carries the board 90 into the component mounting machine 10 and positions the board 90 at a predetermined position inside the machine. The board transport device 11 carries the board 90 out of the component mounting machine 10 after the mounting process of the component 91 by the component mounting machine 10 is completed.

The component supply device 12 sequentially supplies components 91 to be mounted on the board 90. Specifically, the component supply device 12 includes a plurality of feeders 121 provided along the conveyance direction (X-axis direction) of the substrate 90. Each of the plurality of feeders 121 includes a reel RL0, and a carrier tape 80 is wound around the reel RL0. The feeder 121 pitch-feeds the carrier tape 80 containing a plurality of parts 91, and supplies the parts 91 so that they can be collected at a collection position PP1 provided on the tip side of the feeder 121.

The component transfer device 13 includes a head drive device 131 and a moving table 132. The head drive device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction using a linear motion mechanism. The mounting head 20 is removably (replaceably) provided on the moving table 132 using a clamp member. The mounting head 20 uses at least one holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and mounts the component 91 onto the substrate 90 positioned by the substrate transfer device 11. For example, a suction nozzle, a chuck, etc. can be used as the holding member 30.

As the component camera 14 and the board camera 15, known imaging devices can be used. The component camera 14 is fixed to the base of the component mounting machine 10 so that its optical axis is directed upward in the Z-axis direction (vertically upward direction). The component camera 14 can image the component 91 held by the holding member 30 from below. The board camera 15 is provided on the movable table 132 of the component transfer device 13 so that its optical axis points downward in the Z-axis direction (vertically downward direction). The board camera 15 can image the board 90 from above.

Further, the board camera 15 can also image the component 91 from above at the component 91 sampling position PP1. The component camera 14 and the board camera 15 perform imaging based on control signals sent from the control device 16. Image data captured by the component camera 14 and the board camera 15 is transmitted to the control device 16.

The control device 16 includes a known arithmetic unit and a storage device DS0, and constitutes a control circuit. Information, image data, etc. output from various sensors provided in the component mounting machine 10 are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions set in advance.

For example, the control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transport device 11. The control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board 90. Further, the control device 16 causes the holding member 30 to collect and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to take an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the suitability of the component 91 and the holding posture of the component 91.

The control device 16 moves the holding member 30 upward from a scheduled mounting position that is preset by a control program or the like. Further, the control device 16 corrects the scheduled mounting position based on the positioning state of the board 90, the holding posture of the component 91, etc., and sets the mounting position where the component 91 is actually mounted. The planned mounting position and the mounting position include the rotation angle in addition to the position (X coordinate and Y coordinate).

The control device 16 corrects the target position (X coordinate and Y coordinate) and rotation angle of the holding member 30 according to the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position, and mounts the component 91 on the board 90. The control device 16 executes a mounting process for mounting a plurality of components 91 on the board 90 by repeating the above pick-and-place cycle.

1-2. Configuration Example of Parts Management Device 40 As shown in FIG. 2, the parts management device 40 of this embodiment is provided in the control device 16 of the component mounting machine 10. The component management device 40 can be formed, for example, on a line management device that manages a board production line including a plurality of component mounting machines 10, a host computer that manages a plurality of board production lines, or on a cloud.

Furthermore, when considered as a control block, the parts management device 40 includes an acquisition section 41 and a storage section 42. The parts management device 40 can also further include a determining section 43. As shown in FIG. 2, the parts management device 40 of this embodiment includes an acquisition section 41, a storage section 42, and a determination section 43. Further, the parts management device 40 executes the control program according to the flowchart shown in FIG. The acquisition unit 41 performs the process shown in step S11. The storage unit 42 performs the processing shown in step S12 and step S13. The determining unit 43 performs the determination and processing shown in steps S14 to S16.

1-2-1. Acquisition unit 41
When the components 91 are sequentially supplied from the carrier tape 80 that includes a plurality of cavities 81 that accommodate the components 91 to be mounted on the board 90, the acquisition unit 41 acquires position information of the cavities 81 in which the components 91 are accommodated. (Step S11 shown in FIG. 3).

As shown in FIG. 4, the carrier tape 80 includes a plurality of cavities 81, a plurality of feed holes 82, and a cover tape 83. Each of the plurality of cavities 81 accommodates a component 91. The plurality of feed holes 82 are formed at predetermined intervals in the transport direction of the carrier tape 80 (the longitudinal direction of the carrier tape 80). A cover tape 83 is adhered to the upper surface of the carrier tape 80, and the openings of each of the plurality of cavities 81 are closed.

The cover tape 83 of the carrier tape 80 transported to the collection position PP1 shown in FIGS. 1 and 4 is peeled off so that the holding member 30 can collect the parts 91. Specifically, the feeder 121 peels off the cover tape 83 while conveying the carrier tape 80, and sequentially positions the plurality of cavities 81 at the sampling position PP1. As a result, the component 91 housed in the cavity 81 positioned at the collection position PP1 can be collected by the holding member 30, and the component 91 can be supplied.

The plurality of cavities 81 are formed at predetermined intervals in the transport direction of the carrier tape 80. The interval T1 between the cavities 81 is appropriately set according to the dimensions of the parts 91 to be accommodated. As shown in FIG. 4, in this embodiment, the interval T1 between the cavities 81 is set to an integral multiple (twice in the figure) of the interval T2 between the feed holes 82. Each time the feeder 121 feeds the carrier tape 80 by a predetermined amount (in the case of the figure, twice the pitch T2 of the feed holes 82), the cavity 81 is positioned at the sampling position PP1 and one part 91 is fed. The number of remaining components 91 remaining on the carrier tape 80 decreases by one.

Therefore, the acquisition unit 41 can acquire the position information of the cavity 81 on the carrier tape 80 based on the number of parts 91 supplied from the carrier tape 80 . The number of parts 91 to be supplied can be obtained from the amount by which the feeder 121 pitches the carrier tape 80. For example, when the leading (first) cavity 81 of the carrier tape 80 is positioned at the sampling position PP1 and one component 91 is supplied, the acquisition unit 41 detects the position of the leading (first) cavity 81 of the carrier tape 80. Obtain location information indicating.

When the feeder 121 feeds the carrier tape 80 by the predetermined amount, the second cavity 81 from the top of the carrier tape 80 is positioned at the sampling position PP1, and one component 91 is fed. Thereby, the acquisition unit 41 acquires position information indicating the position of the second cavity 81 from the top of the carrier tape 80. The same can be said of the position information indicating the position of the third cavity 81 from the beginning of the carrier tape 80.

Furthermore, when attaching the reel RL0 around which the carrier tape 80 is wound to the feeder 121, the operator uses a reading device to read the identification code attached to the reel RL0. Further, when installing the feeder 121 in the slot of the component supply device 12, the operator reads the identification code attached to the feeder 121 using a reading device.

When the feeder 121 is installed in the slot, power is supplied from the component mounting machine 10 via the connector, and the feeder 121 becomes communicable with the component mounting machine 10. As a result, the slot of the component supply device 12, the identification information of the feeder 121 installed in the slot, and the identification information of the reel RL0 attached to the feeder 121 are associated, and the storage device DS0 of the control device 16 is associated with the identification information of the feeder 121 installed in the slot. is memorized. In addition, the initial number of components 91 accommodated on the carrier tape 80 and the remaining number of components 91 remaining on the carrier tape 80 are recorded in the storage device DS0.

Therefore, the acquisition unit 41 acquires the position information of the cavity 81 in the carrier tape 80 based on the initial number of components 91 accommodated in the carrier tape 80 and the remaining number of components 91 remaining in the carrier tape 80. You can also do it. For example, if the initial number of parts 91 accommodated is 5000 and the remaining number of parts 91 is 5000, then the 1st (=5000-5000+1) part 91 is supplied. In this case, the acquisition unit 41 acquires position information indicating the position of the leading (first) cavity 81 of the carrier tape 80.

If the initial number of parts 91 accommodated is 5000 and the remaining number of parts 91 is 4999, then the 2nd (=5000-4999+1) part 91 is supplied. In this case, the acquisition unit 41 acquires position information indicating the position of the second cavity 81 from the top of the carrier tape 80. In this way, when the initial number of parts 91 accommodated is NI0 points and the remaining number of parts 91 is NR0 points, the (NI0-NR0+1)th part 91 is supplied. In this case, the acquisition unit 41 acquires position information indicating the position of the (NI0−NR0+1)th cavity 81 from the beginning of the carrier tape 80.

1-2-2. Storage section 42
The storage unit 42 associates the position information of the cavity 81 acquired by the acquisition unit 41 with the identification information identifying the reel RL0 around which the carrier tape 80 is wound, and stores the information in the storage device DS0 (shown in FIG. 3). Step S12).

As described above, the slot of the component supply device 12, the identification information of the feeder 121 installed in the slot, and the identification information of the reel RL0 attached to the feeder 121 are associated, and the control device 16 It is stored in the storage device DS0. Therefore, the storage unit 42 can associate the position information of the cavity 81 acquired by the acquisition unit 41 with identification information for identifying the reel RL0 around which the carrier tape 80 is wound, and store the information in the storage device DS0. .

Furthermore, the storage unit 42 can store at least one of the board information, device information, holding information, and mounting information in the storage device DS0 in association with the position information of the cavity 81 and the identification information of the reel RL0 ( Step S13 shown in FIG. 3). Board information refers to information regarding the board 90 on which the component 91 is mounted. For example, the board information includes identification information for identifying the board 90, the type of the board 90, information for specifying the mounting position where the component 91 is mounted (for example, a circuit symbol), and the like. Types of the board 90 include, for example, a multi-sided board in which a plurality of boards 90 are formed so as to be divisible, a single-sided board in which a component 91 is mounted only on one of the front and back sides of the board 90, and a board. A double-sided mounting board on which components 91 are mounted on both sides (front and back surfaces) of 90 is included.

The device information refers to information regarding the device DD0 used for mounting the component 91. For example, the equipment DD0 includes equipment such as the mounting head 20, the holding member 30, and the feeder 121 that are detachably installed in the component mounting machine 10. Further, in a board production line including a plurality of component mounting machines 10, it is necessary to identify the component mounting machines 10. In this case, the device DD0 includes, for example, the component mounting machine 10. Further, the device information includes identification information for identifying the device DD0, usage conditions of the device DD0, and the like.

The holding information refers to information regarding the holding state of the part 91 when the part 91 is picked up and held by the holding member 30. For example, the holding information includes the amount of deviation of the part 91 taken and held by the holding member 30 from the normal holding position, the rotation angle with respect to the normal holding posture, the judgment result of the holding state, the location of image data, etc. . The determination result of the holding state is determined based on whether the above-mentioned shift amount and the above-mentioned rotation angle of the component 91 picked up and held by the holding member 30 are within the permissible range. The retained information can be obtained, for example, by processing an image captured by the component camera 14.

The mounting information refers to information regarding the mounting state of the component 91 when the component 91 is mounted on the board 90 by the holding member 30. For example, the mounting information includes the amount of deviation of the component 91 mounted on the board 90 from the normal mounting position, the rotation angle relative to the normal mounting state, the mounting state determination result, the location of image data, and the like. The determination result of the mounting state is determined based on whether the above-mentioned shift amount and the above-mentioned rotation angle of the component 91 mounted on the board 90 are within the permissible range. The mounting information can be acquired, for example, by a visual inspection machine that inspects the component 91 mounted on the board 90.

FIG. 5 schematically shows an example of information stored in the storage device DS0. For example, the positional information of the cavity 81 of the carrier tape 80 wound on the reel RL0 of the identification information DID1 is indicated by "1", "2", and "3" from the beginning of the carrier tape 80. The component 91 housed in the leading (first) cavity 81 of the carrier tape 80 is mounted at the mounting position indicated by the circuit symbol R1 of the board 90 of the identification information BID1. Further, the component 91 is picked up (adsorbed) and held by the holding member 30 (suction nozzle) identified by the nozzle number NZ1, and mounted on the substrate 90. Further, the determination results of the holding state and the mounting state of the component 91 are both good (OK).

The above can also be applied to the components 91 accommodated in the second and subsequent cavities 81 from the top of the carrier tape 80 . Moreover, the above-mentioned can be similarly applied to the component 91 accommodated in the carrier tape 80 wound around the reel RL0 of the identification information DID2. For example, for the component 91 mounted at the mounting position indicated by the circuit symbol R10 of the board 90 with the identification information BID1, both the held state and the mounted state are determined to be defective (NG).

The parts 91 supplied in units of reel RL0 are managed, and if it is thought that the cause of the defect is in the part 91 itself, the operator traces all parts 91 accommodated in reel RL0 with identification information DID1. trace work is complicated. On the other hand, the user of the parts management device 40 determines, based on the information shown in FIG. It is possible to know that it was accommodated in the second cavity 81 from the top.

Therefore, the user of the parts management device 40 can easily narrow down the parts 91 to be traced based on the position information of the cavity 81 from among the parts 91 supplied from the reel RL0 of the identification information DID1, and traceability is improved. do. Further, for example, assume that it has been found that the component 91 with a defective determination result is often accommodated in the cavity 81 on the rear side of the carrier tape 80. The more the component 91 is housed in the cavity 81 on the rear side of the carrier tape 80, the longer the elapsed time after the carrier tape 80 is started to be used.

Therefore, it can be assumed that the cause of the defect in the component 91 is, for example, a defect in the storage condition of the carrier tape 80. Furthermore, the parts 91 housed in the cavities 81 on the rear side of the carrier tape 80 are more susceptible to the influence of the pressure exerted by the carrier tape 80 when the carrier tape 80 is wound. Therefore, it can be estimated that the cause of the defect in the component 91 is, for example, a defect in the winding state of the carrier tape 80.

The method of supplying the component 91 includes wafer supply in which the component 91 is supplied from the wafer WF0, and reel supply in which the component 91 is supplied from the reel RL0. The wafer WF0 has some defective parts due to the manufacturing process, and the parts that do not meet a predetermined quality are managed as bad dies on a map. A defective die is detected in advance by optical inspection or the like, but a die that is not determined to be a defective die may later be found to be a defective die. For example, when a manufacturer obtains the distribution of coordinate positions on wafer WF0 from traceability information regarding a plurality of dies that have failed to be detected, the dies may be concentrated in a specific area of wafer WF0. In this case, the manufacturer modifies the criteria for determining whether the die is good or bad so that the die can be detected, thereby reducing the possibility of failing to detect a defective die.

However, the component supply device that supports wafer supply is generally more expensive than the component supply device 12 that supports reel supply, the types and number of components 91 that can be supplied are smaller, and the replenishment work of components 91 is also complicated. easy to become Therefore, it is known to move the components 91 arranged on the wafer WF0 to the reel RL0 and perform reel supply.

The carrier tape 80 of this embodiment accommodates the wafer parts 91W, which are the parts 91 arranged on the wafer WF0. The XW axis and YW axis shown in FIG. 6 represent an example of orthogonal coordinate axes in wafer WF0. For example, a predetermined number of wafer components 91W are arranged in the XW axis direction from a predetermined area on the origin side of the orthogonal coordinate axes (the arrangement order is 1). Next, a predetermined number of wafer components 91W are arranged in the XW-axis direction from a region whose YW-axis coordinate is one more than the predetermined region. On wafer WF0, the above-described arrangement is repeated, and the parts 91 (wafer parts 91W) arranged on wafer WF0 can be specified by the above-mentioned arrangement order.

The wafer related information shown in FIG. 7 includes identification information of wafer WF0, arrangement information (arrangement order) of wafer parts 91W, arrangement information (coordinate information) of wafer parts 91W, and wafer parts information. For example, the coordinates of the wafer components 91W arranged in the predetermined area (the arrangement order is 1) in the XW axis direction are indicated by the coordinate XW1, and the coordinates in the YW axis direction are indicated by the coordinate YW1. The wafer component 91W is, for example, a wafer component 91W whose quality is not specified.

For the wafer parts 91W arranged in the area adjacent to the area with the arrangement order 1 in the XW axis direction (the arrangement order 2), the coordinate in the XW axis direction is indicated by the coordinate XW2, and the coordinate in the YW axis direction is indicated by the coordinate YW1. is shown. The wafer component 91W is, for example, a reference member RM0 that indicates the reference position of the wafer WF0. The reference member RM0 is provided at a predetermined position on the wafer WF0, and indicates a reference position when collecting the wafer component 91W from the wafer WF0. The reference member RM0 is normally not accommodated in the carrier tape 80 in order to prevent incorrect attachment.

The wafer parts 91W arranged in the area adjacent to the area with the arrangement order 2 in the XW axis direction (the arrangement order is 3) have the coordinates in the XW axis direction indicated by the coordinate XW3, and the coordinates in the YW axis direction the coordinates YW1. It is shown in The wafer component 91W is, for example, a defective wafer component 91W (defective component BM0). The defective component BM0 is one discovered during the manufacturing process of the wafer component 91W, and is normally not accommodated in the carrier tape 80 to prevent incorrect mounting.

Similarly, for the wafer parts 91W arranged in the area with the arrangement order AJ1, the coordinate in the XW axis direction is indicated by the coordinate XWA1, and the coordinate in the YW axis direction is indicated by the coordinate YWA1. The wafer component 91W is, for example, a wafer component 91WA whose quality is rank A. Furthermore, the coordinates of the wafer parts 91W arranged in the area with the arrangement order AJ2 are indicated by the coordinates XWA2 in the XW axis direction, and the coordinates in the YW axis direction are indicated by the coordinates YWA2. The wafer component 91W is, for example, a wafer component 91WB whose quality is B rank.

Further, for the wafer parts 91W arranged in the area with the arrangement order AJ3, the coordinate in the XW axis direction is indicated by the coordinate XWA3, and the coordinate in the YW axis direction is indicated by the coordinate YWA3. The wafer component 91W is, for example, a wafer component 91WC whose quality is C rank. In this specification, it is assumed that the quality of the wafer parts 91W deteriorates in the order of, for example, the A-rank wafer parts 91WA, the B-rank wafer parts 91WB, and the C-rank wafer parts 91WC. Furthermore, the method for setting the quality of the wafer component 91W is not limited.

In this way, wafer WF0 includes various wafer parts 91W. Therefore, when supplying the component 91 using the carrier tape 80 that accommodates the wafer component 91W, there is a demand to obtain the arrangement information of the wafer component 91W on the wafer WF0. In this case, the storage unit 42 associates and stores in advance the arrangement information of the wafer components 91W on the wafer WF0 and the position information of the cavity 81 in which the wafer components 91W are accommodated in the carrier tape 80, before supplying the components 91. It is better to store it in the device DS0.

For example, the storage unit 42 stores the arrangement information of the wafer components 91W arranged in the area with the arrangement order AJ1, the position information of the cavity 81 in which the wafer component 91W is accommodated, and the location information of the cavity 81 in which the wafer component 91W is accommodated. It is stored in the storage device DS0 in association with the identification information of the reel RL0 of the carrier tape 80. As a result, the user of the parts management device 40 recognizes that the supplied part 91 is a wafer part 91W, and that the wafer part 91W is located in the area of the coordinate XWA1 in the XW axis direction and the coordinate YWA1 in the YW axis direction on the wafer WF0. You can know that it was arranged. Further, the user of the parts management device 40 can know that the wafer part 91W is arranged in the order AJ1 and that the wafer part 91WA has an A-rank quality.

The above can also be said to the other wafer components 91W. In this way, the storage unit 42 stores, in the wafer-related information shown in FIG. 7, the position information of the cavity 81 in which the wafer component 91W is accommodated, and the identification of the reel RL0 of the carrier tape 80 in which the wafer component 91W is accommodated. The information can be further associated and stored in the storage device DS0.

Note that the wafer components 91W are arranged in a predetermined order on the wafer WF0, and housed in the carrier tape 80 in the arrangement order on the wafer WF0. Therefore, it is sufficient for the storage unit 42 to store the predetermined wafer component 91W contained in the carrier tape 80 in the storage device DS0. Further, the wafer components 91W may be accommodated in the arrangement order of the wafer WF0 on a plurality of carrier tapes 80.

Therefore, the storage unit 42 stores identification information for identifying the wafer WF0, identification information for identifying the plurality of reels RL0 around which the carrier tape 80 is wound, and predetermined arrangement information before supplying the component 91. They can be associated and stored in the storage device DS0 in advance. The predetermined arrangement information is arrangement information including the arrangement order of the predetermined wafer components 91W accommodated in each carrier tape 80 on the wafer WF0.

As shown in FIG. 8, the wafer components 91W arranged on the wafer WF0 of the identification information WID1 are accommodated in, for example, the carrier tapes 80 of a plurality of (five) reels RL0. Therefore, the identification information WID1 of the wafer WF0 and the identification information DID1 to DID5 of the plurality of (five) reels RL0 are stored in association with each other in the storage device DS0. Further, for example, in the reel RL0 of the identification information DID1, the arrangement order of the wafer components 91W accommodated in the leading (first) cavity 81 of the carrier tape 80 is 1, and the wafer components 91W are arranged in the XW axis direction. The coordinates are shown as coordinates XW1, and the coordinates in the YW axis direction are shown as coordinates YW1.

In the reel RL0 of the identification information DID2, the arrangement order of the wafer parts 91W accommodated in the leading (first) cavity 81 of the carrier tape 80 is the order BJ1, and the coordinates of the wafer parts 91W in the XW axis direction are the coordinates. It is indicated by XWB1, and the coordinate in the YW axis direction is indicated by coordinate YWB1. From the above arrangement order of the wafer parts 91W, it can be seen that (BJ1-1) wafer parts 91W are accommodated in the carrier tape 80 of the reel RL0 of the identification information DID1.

In the reel RL0 of the identification information DID3, the arrangement order of the wafer parts 91W accommodated in the leading (first) cavity 81 of the carrier tape 80 is the order CJ1, and the coordinates of the wafer parts 91W in the XW axis direction are the coordinates. It is indicated by XWC1, and the coordinate in the YW axis direction is indicated by coordinate YWC1. Similarly, from the arrangement order of the wafer parts 91W, it can be seen that (CJ1-BJ1) wafer parts 91W are accommodated in the carrier tape 80 of the reel RL0 of the identification information DID2. The above can also be said to the reel RL0 of identification information DID3 to identification information DID5.

Note that in the storage method shown in the figure, the number of wafer components 91W accommodated in the reel RL0 of the identification information DID5 is unknown. Therefore, it is preferable that the storage unit 42 separately stores the number of wafer components 91W accommodated in the reel RL0 in the storage device DS0. Further, the storage unit 42 can store arrangement information of the wafer components 91W accommodated in any cavity 81 of each carrier tape 80. Furthermore, the storage unit 42 can also store arrangement information including the cumulative arrangement order of the wafer parts 91W up to the immediately preceding carrier tape 80. In this case, the reel RL0 of the identification information DID1, which is the first reel RL0, has a cumulative arrangement order of wafer parts 91W of zero and does not include arrangement information.

Here, at least one of the defective wafer component 91W (defective component BM0) included in wafer WF0, the wafer component 91W whose quality is below a predetermined rank, and the reference member RM0 indicating the reference position of wafer WF0 is identified as a member. Let it be SM0. As described above, the reference member RM0 indicating the reference position of the defective wafer component 91W (defective component BM0) and the wafer WF0 is usually not accommodated in the carrier tape 80 in order to prevent incorrect mounting. Furthermore, for example, when it is requested to supply a wafer component 91W of a predetermined quality, such as a wafer component 91W of rank B or higher, the wafer component 91W whose quality is below the predetermined rank (in this case, the wafer component 91WC of rank C) may be incorrectly installed. In order to prevent this, there are cases where the carrier tape 80 does not accommodate the carrier tape 80.

Therefore, the carrier tape 80 has a carrier tape 80 in which the wafer component 91W, which is arranged after the specific member SM0 in the wafer WF0, is moved up and accommodated in the specific cavity 81S, which is the cavity 81 scheduled to accommodate the specific member SM0. included. For example, assume that the third cavity 81 shown in FIG. 9 is the specific cavity 81S. In this case, the wafer component 91W scheduled to be accommodated in the fourth cavity 81 is accommodated in the third specific cavity 81S. Furthermore, the fourth cavity 81 accommodates a wafer component 91W that is scheduled to be accommodated in the fifth cavity 81. The same applies hereafter, and the wafer component 91W that is subsequent to the specific member SM0 in the arrangement order on the wafer WF0 is moved up and accommodated in the cavity 81.

In this case, it is preferable that the storage unit 42 stores specific cavity information including the position and number of the specific cavities 81S in the storage device DS0 before supplying the component 91. Thereby, the component management device 40 can match the arrangement information of the wafer components 91W on the wafer WF0 with the position information of the cavity 81 in which the wafer components 91W are accommodated in the carrier tape 80. In the above example, the position of the specific cavity 81S is the third cavity 81, and the number of specific cavities 81S is one.

Further, the carrier tape 80 includes a carrier tape 80 in which a specific cavity 81S scheduled to accommodate the specific member SM0 is set to an empty cavity 81E. For example, assume that the third cavity 81 shown in FIG. 9 is the specific cavity 81S. In this case, the third specific cavity 81S is set to the empty cavity 81E. The empty cavity 81E is a cavity 81 that does not accommodate the wafer component 91W and the specific member SM0. In this case, for example, the No. 4 cavity 81 accommodates the wafer component 91W that is scheduled to be accommodated in the No. 4 cavity 81. The same applies hereafter, and the above-mentioned wafer component 91W is not moved up and accommodated.

In this case, it is preferable that the storage unit 42 stores empty cavity information including the position and number of the empty cavities 81E in the storage device DS0 before supplying the component 91. Thereby, the component supply device 12 can pitch the carrier tape 80 to the cavity 81 in which the wafer component 91W is accommodated, and can supply the wafer component 91W. In the above example, the position of the empty cavity 81E is the third cavity 81, and the number of empty cavities 81E is one.

Note that even if the carrier tape 80 is pitch-feeded, the carrier tape 80 may not be conveyed due to a defective attachment of the reel RL0. Further, when a mistake is made in picking up the component 91, there is a possibility that the operator may rewind the carrier tape 80. In these cases, the arrangement information of the wafer components 91W on the wafer WF0 and the position information of the cavities 81 in which the wafer components 91W are accommodated in the carrier tape 80 no longer match.

Therefore, the carrier tape 80 includes a carrier tape 80 in which a predetermined cavity 81 scheduled to accommodate the wafer component 91W is set as an empty cavity 81E. In this case, the empty cavity 81E is preferably set at a predetermined period (for example, every time a predetermined number of parts 91 are supplied). The storage unit 42 preferably stores empty cavity information including the position and number of the empty cavities 81E in the storage device DS0 before supplying the component 91.

Thereby, the parts management device 40 can periodically check whether the arrangement information of the wafer parts 91W matches the position information of the cavity 81 in which the wafer parts 91W are accommodated in the carrier tape 80. can. In this case as well, the component supply device 12 can pitch the carrier tape 80 to the cavity 81 in which the wafer component 91W is accommodated, and can supply the wafer component 91W.

1-2-3. Discrimination section 43
The determining unit 43 uses empty cavity information detected when the component supply device 12 feeds the components 91 by pitch-feeding the carrier tape 80 and supplies the components 91 in order, and the empty cavity information stored in the storage device DS0. It is determined whether or not the cavity information matches. For example, when the component supply device 12 is supplying the component 91, the determining unit 43 causes the board camera 15 to take an image of the cavity 81, and determines whether the cavity 81 is an empty cavity or not based on the image taken by the board camera 15. 81E or not can be determined. Specifically, when the component 91 is not captured in the image, the determining unit 43 determines that the cavity 81 that is scheduled to accommodate the component 91 is an empty cavity 81E.

The determining unit 43 causes the component supply device 12 to continue supplying the component 91 when the empty cavity information matches, and causes the component supply device 12 to stop supplying the component 91 when the empty cavity information does not match. Specifically, the determining unit 43 determines whether the empty cavity information matches (step S14 shown in FIG. 3). If the empty cavity information matches (Yes in step S14), the determination unit 43 causes the component supply device 12 to continue supplying the component 91 (step S15).

If the empty cavity information does not match (No in step S14), the determination unit 43 stops the component supply device 12 from supplying the component 91 (step S16). In this case, the parts management device 40 warns the operator that the arrangement information of the wafer parts 91W and the positional information of the cavities 81 in which the wafer parts 91W are accommodated on the carrier tape 80 do not match. Thereby, the operator can confirm the positional deviation of the carrier tape 80 and correct the positional deviation of the carrier tape 80.

Further, when the determining unit 43 determines that the empty cavity information does not match, the component supply device 12 can also transport the carrier tape 80 so that the nearest empty cavity 81E reaches the sampling position PP1. As a result, the arrangement information of the wafer components 91W and the position information of the cavities 81 in which the wafer components 91W are accommodated in the carrier tape 80 are matched, and the positional deviation of the carrier tape 80 is corrected.

Note that while the component supply device 12 is supplying the component 91, the determination unit 43 causes the component camera 14 to take an image of the holding member 30, and determines whether the cavity 81 is empty based on the image taken by the component camera 14. It is also possible to determine whether it is the cavity 81E. Specifically, when the component 91 is not captured in the image (the holding member 30 is not holding the component 91), the determining unit 43 determines whether the cavity 81 scheduled to accommodate the component 91 is an empty cavity 81E. It can be determined that there is.

2. Others In order to prevent incorrect attachment, the specific member SM0 is not accommodated in the carrier tape 80 of the embodiment. The component supply device 12 can also supply the wafer component 91W from the carrier tape 80 containing the specific member SM0. In this case, when the cavity 81 in which the specific member SM0 is accommodated is detected, the component supply device 12 pitch-feeds the carrier tape 80 to the cavity 81 in which the wafer component 91W is accommodated. can be supplied.

Furthermore, what has been described above regarding the wafer component 91W can also be applied to the component 91 produced in the same manufacturing lot. Specifically, a case is assumed in which parts 91 produced in the same manufacturing lot are accommodated in a plurality of carrier tapes 80 in production order. In this case, the storage unit 42 stores identification information for identifying the production lot, identification information for identifying the plurality of reels RL0 around which the carrier tape 80 is wound, and predetermined production information before supplying the component 91. It is preferable to associate the information with the information in advance and store it in the storage device DS0. The predetermined production information includes the production order of the predetermined parts 91 accommodated in each carrier tape 80. The predetermined component 91 can be, for example, the component 91 accommodated in the first (first) cavity 81 of each carrier tape 80 .

Further, in the carrier tape 80, the predetermined cavity 81 in which the component 91 is to be accommodated may be set as an empty cavity 81E. In this case, the storage unit 42 can previously store empty cavity information including the position and number of the empty cavities 81E in the storage device DS0 before supplying the component 91. Then, the determining unit 43 determines whether the empty cavity information detected when the component supply device 12 is supplying the component 91 matches the empty cavity information stored in the storage device DS0. You can also do that. Further, the determining unit 43 causes the component supply device 12 to continue supplying the component 91 when the empty cavity information matches, and causes the component supply device 12 to stop supplying the component 91 when the empty cavity information does not match. You can also do that.

3. Parts Management Method What has already been said about the parts management device 40 also applies to the parts management method. Specifically, the parts management method includes an acquisition step and a storage step. The acquisition process corresponds to control performed by the acquisition unit 41. The storage process corresponds to the control performed by the storage unit 42. Moreover, the parts management method can further include a determination step. The determination process corresponds to the control performed by the determination unit 43.

4. Example of Effects of Embodiment The parts management device 40 includes an acquisition section 41 and a storage section 42 . Thereby, the parts management device 40 can associate the positional information of the cavity 81 in which the supplied part 91 was accommodated with the identification information for identifying the reel RL0 and store them in the storage device DS0. Therefore, the user of the parts management device 40 can easily narrow down the parts 91 to be traced based on the position information of the cavity 81 from among the parts 91 supplied from the carrier tape 80 of the reel RL0, and traceability is improved. do. What has been described above regarding the parts management device 40 also applies to the parts management method.

12: parts supply device, 30: holding member, 40: parts management device,
41: Acquisition unit, 42: Storage unit, 43: Discrimination unit, 80: Carrier tape,
81: Cavity, 81S: Specific cavity, 81E: Empty cavity,
90: Substrate, 91: Parts, 91W: Wafer parts, DD0: Equipment,
DS0: Storage device, RL0: Reel, WF0: Wafer,
RM0: Reference member, SM0: Specific member.

Claims (11)

an acquisition unit that acquires positional information of the cavity in which the component is accommodated when the component is sequentially supplied from a carrier tape having a plurality of cavities that accommodate the component to be mounted on the board;
a storage unit that stores in a storage device the positional information of the cavity acquired by the acquisition unit and identification information for identifying a reel around which the carrier tape is wound in association with each other;
Equipped with
The storage unit stores device information regarding a mounting head or a holding member that is a device used for mounting the component, holding information regarding a holding state of the component when the component is picked up and held by the holding member, and , at least one of mounting information regarding the mounting state of the component when the component is mounted on the board by the holding member, is stored in the storage device in association with position information of the cavity and identification information of the reel. A parts management device that stores information . 2. The acquisition unit acquires position information of the cavity in the carrier tape based on the initial number of the components accommodated in the carrier tape and the remaining number of the components remaining in the carrier tape. The parts management device described in . The parts management device according to claim 1, wherein the acquisition unit acquires position information of the cavity in the carrier tape based on the number of parts supplied from the carrier tape. an acquisition unit that acquires positional information of the cavity in which the component is accommodated when the component is sequentially supplied from a carrier tape having a plurality of cavities that accommodate the component to be mounted on the board;
a storage unit that stores in a storage device the positional information of the cavity acquired by the acquisition unit and identification information for identifying a reel around which the carrier tape is wound in association with each other;
Equipped with
The carrier tape accommodates the wafer components, which are the components arranged on the wafer,
The storage unit associates the arrangement information of the wafer components on the wafer with the position information of the cavity in the carrier tape in which the wafer components are accommodated before supplying the components, and stores the information in the storage device. A parts management device that stores information. The wafer components are housed in the plurality of carrier tapes in an arrangement order on the wafer,
The storage unit stores identification information for identifying the wafer, identification information for identifying the plurality of reels around which the carrier tape is wound, and information for identifying the wafer components contained in each of the carrier tapes. 5. The parts management device according to claim 4 , wherein the arrangement information including the arrangement order on a wafer is stored in the storage device in advance in association with the arrangement information before supplying the parts. The carrier tape is scheduled to accommodate a specific member that is at least one of the defective wafer parts included in the wafer, the wafer parts whose quality is below a predetermined rank, and a reference member indicating a reference position of the wafer. The wafer components that are arranged later than the specific member on the wafer are moved up and accommodated in the specific cavity, which is the cavity of
6. The parts management device according to claim 4 , wherein the storage unit stores specific cavity information including the position and number of the specific cavities in the storage device in advance before supplying the parts. The carrier tape is scheduled to accommodate a specific member that is at least one of the defective wafer parts included in the wafer, the wafer parts whose quality is below a predetermined rank, and a reference member indicating a reference position of the wafer. The specific cavity that is the cavity of is set to be an empty cavity,
6. The parts management device according to claim 4 , wherein the storage unit stores empty cavity information including the position and number of the empty cavities in the storage device in advance before supplying the parts. In the carrier tape, the predetermined cavity scheduled to accommodate the wafer component is set as an empty cavity,
6. The parts management device according to claim 4 , wherein the storage unit stores empty cavity information including the position and number of the empty cavities in the storage device in advance before supplying the parts. The empty cavity information detected when the component supply device that pitch-feeds the carrier tape and sequentially supplies the components supplies the components, and the empty cavity information stored in the storage device. The parts management device according to claim 7 or 8 , further comprising a determining unit that determines whether or not they match. The determining unit causes the component supply device to continue supplying the component when the empty cavity information matches, and causes the component supply device to stop supplying the component when the empty cavity information does not match. The parts management device according to claim 9 . an acquisition step of acquiring positional information of the cavity in which the component is housed when the component is sequentially supplied from a carrier tape having a plurality of cavities housing the component to be mounted on the board;
a storing step of storing in a storage device the positional information of the cavity acquired in the acquiring step and identification information identifying a reel around which the carrier tape is wound in association with each other;
Equipped with
The storage step includes device information regarding a mounting head or a holding member that is a device used for mounting the component, holding information regarding a holding state of the component when the component is picked up and held by the holding member, and , storing at least one of mounting information regarding the mounting state of the component when the component is mounted on the board by the holding member in association with position information of the cavity and identification information of the reel; Parts management method to memorize .

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