JP7518206B2 - Component placement machine - Google Patents

Description

This specification discloses technology relating to component mounting machines.

In the working device described in Patent Document 1, a lead wire cutting device equipped with a fixed blade and a movable blade that clamps and cuts multiple lead wires between the fixed blade and the lead wire cutting device is placed on a device table. The lead wire cutting device is equipped with a lead wire cutting device sensor. When the lead wire cutting device is placed on the device table, the lead wire cutting device sensor detects whether the rear wall of the housing is placed in a position sufficiently close to the erection surface.

The lead wire cutting unit described in Patent Document 2 is equipped with a tag as a unit information recording section. The tag records a unit ID, which is identification information individually assigned to each of the multiple lead wire cutting units, movable blade history information, which is information indicating the number of times the movable blade has been used, and the like. The tag is positioned opposite a tag information control section provided on the unit holding member, and the information recorded on the tag is read and rewritten by the tag information control section.

JP 2018-043298 A International Publication No. 2019/220499

When a lead wire cutting device that cuts the lead wires of lead components is mounted on a pallet member with multiple slots, the cycle time varies depending on the slot position of the slot in which the lead wire cutting device is mounted, and depending on the slot position, production efficiency may decrease. The same can be said about the lead wire cutting devices used in the mounting process when multiple lead wire cutting devices are mounted on a pallet member.

In light of these circumstances, this specification discloses a component mounting machine that can improve the production efficiency of circuit board products.

This specification discloses a component mounting machine including a component supply unit, a pallet member, a mounting head, and a calculation unit. The component supply unit supplies lead components having lead wires. The pallet member includes a plurality of slots in which a lead wire cutting device for cutting the lead wires is mounted. The mounting head picks up the lead components supplied from the component supply unit, transfers them to the lead wire cutting device mounted in the predetermined slot of the pallet member, and performs a mounting process in which the lead components whose lead wires have been cut by the lead wire cutting device are mounted in a predetermined mounting position on a board. The calculation unit calculates recommended information, which is information on the slot position of the slot in which the lead wire cutting device should be mounted or the lead wire cutting device to be used in the mounting process among the plurality of lead wire cutting devices mounted on the pallet member, so that the movement distance of the lead components is shortest in a movement path of the lead components that includes at least the pick-up position of the lead components, the slot position of the slot in which the lead wire cutting device is mounted, and the mounting position of the lead components.

The above-mentioned component mounting machine can improve the production efficiency of circuit board products.

FIG. 2 is a plan view showing a configuration example of a component mounting machine. 1 is a perspective view showing an example of a lead wire cutting device mounted on a pallet member; FIG. 3 is an enlarged view of the vicinity of a fixed blade of the lead wire cutting device of FIG. 2 . 3 is an enlarged view showing an example of a state in which a lead component has been transferred to the lead wire cutting device of FIG. 2 . FIG. FIG. 11 is a schematic diagram showing an example of a calculation method of recommendation information. FIG. 11 is a schematic diagram showing an example of another calculation method of recommendation information. FIG. 11 is a schematic diagram showing an example of another calculation method of recommendation information. FIG. 11 is a schematic diagram showing an example of another calculation method of recommendation information.

1. Embodiment 1-1. Configuration example of component mounting machine 10 The component mounting machine 10 mounts components 80 on a board 90. The components 80 include lead components 81. As shown in FIG 1, the component mounting machine 10 of this embodiment includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, a control device 16, and a display device 17.

The board transport device 11 is, for example, configured with a belt conveyor, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transport device 11 transports the board 90 into the component mounting machine 10, positions the board 90 at a predetermined position within the machine, and clamps it. After the component mounting machine 10 has finished mounting the components 80, the board transport device 11 unclamps the board 90 and transports the board 90 out of the component mounting machine 10.

The component supply device 12 supplies components 80 to be mounted on the board 90. The component supply device 12 can be equipped with a feeder that is provided along the transport direction (X-axis direction) of the board 90. The feeder pitch-feeds a carrier tape that stores a plurality of components 80, and supplies the components 80 so that they can be picked up at a supply position located at the tip side of the feeder.

The component supply device 12 may also include a component supply section 30. The component supply section 30 supplies lead components 81 each having a lead wire 81a. The lead components 81 are relatively large electronic components compared to the chip components and the like supplied by the feeder, and are supplied in an array on a tray 31. The tray 31 is moved, for example, by a drive device 30a in the Y-axis direction perpendicular to the X-axis direction in a horizontal plane.

The drive unit 30a pulls out a tray 31 to be used in the production of a board product from among the multiple trays 31 housed in the component supply unit 30, and moves the tray 31 in the Y-axis direction to load it onto the component supply device 12. The drive unit 30a can also move a used tray 31 that has been used in the production of a board product in the Y-axis direction to retrieve it from the component supply device 12 to the component supply unit 30. The feeder and tray 31 are detachably (replaceably) provided in the slot 12b of the pallet member 12a of the component supply device 12.

The pallet member 12a has a plurality of slots 12b in the conveying direction (X-axis direction) of the substrate 90. Each of the plurality of slots 12b is formed to extend along the Y-axis direction. A feeder can be mounted in the slot 12b of the pallet member 12a, and a tray 31 can also be mounted therein. A lead wire cutting device 40 can also be mounted in the slot 12b of the pallet member 12a. The lead wire cutting device 40 cuts the lead wire 81a of the lead component 81. The lead wire cutting device 40 can take various forms as long as it is capable of cutting the lead wire 81a.

2 to 4, the lead wire cutting device 40 of this embodiment includes a main body 41, a fixed blade section 42, a movable blade section 43, a fixed blade identification section 44, an identification section 45, a control board 46, and a memory device 47. The main body 41 is formed in the same shape (flat box shape) as the main body of the feeder, and can be mounted in and removed from the slot 12b in the same way as the feeder.

The fixed blade portion 42 has an opening 42a formed according to the arrangement of the lead wire 81a. The lead component 81 is held by the fixed blade portion 42 with the lead wire 81a inserted into the opening 42a. The movable blade portion 43 is provided inside the main body portion 41 and below the fixed blade portion 42. With the lead wire cutting device 40 mounted in the slot 12b, the movable blade portion 43 can rotate around an axis extending along a vertical direction (Z-axis direction) perpendicular to the X-axis direction and the Y-axis direction. The movable blade portion 43 cuts the lead wire 81a with the lead wire 81a sandwiched between the movable blade portion 43 and the fixed blade portion 42.

The fixed blade portion 42 can be replaced. Therefore, the lead wire cutting device 40 is provided with a fixed blade identification unit 44 that identifies the fixed blade portion 42. The fixed blade identification unit 44 can be, for example, a one-dimensional code, a two-dimensional code, etc. In this embodiment, a two-dimensional code is used for the fixed blade identification unit 44. In addition, the pallet member 12a can be provided with multiple lead wire cutting devices 40. Therefore, the lead wire cutting device 40 is provided with an identification unit 45 that identifies the lead wire cutting device 40.

The identification unit 45 includes identification information for identifying the lead wire cutting device 40. The identification information includes information for identifying the lead wire cutting device 40 from other devices such as a feeder. The identification unit 45 may use, for example, a one-dimensional code, a two-dimensional code, or a wireless tag. For example, it is necessary to store the number of times the lead wire cutting device 40 has been used for maintenance of the fixed blade unit 42, the movable blade unit 43, etc. In this case, it is preferable that the identification unit 45 is capable of rewriting information such as a wireless tag. In this embodiment, a wireless tag is used as the identification unit 45, and in addition to the identification information, the number of times the lead wire cutting device 40 has been used is stored.

The control board 46 drives and controls the actuator that rotates the movable blade portion 43. The control board 46 can also communicate with the control device 16 of the component mounting machine 10. The control board 46 is further provided with a memory device 47. A known memory device can be used as the memory device 47, and various information can be stored therein. For example, the memory device 47 can store a program that drives and controls the actuator, identification information that identifies the lead wire cutting device 40, the number of times the lead wire cutting device 40 has been used, and the like.

The component transfer device 13 includes a head drive device 13a and a movable table 13b. The head drive device 13a is configured to be able to move the movable table 13b in the X-axis direction and the Y-axis direction by a linear motion mechanism. A mounting head 20 is detachably (replaceably) attached to the movable table 13b by a clamp member. The mounting head 20 uses at least one holding member 21 to pick up and hold the component 80 supplied by the component supply device 12, and mounts the component 80 on the board 90 positioned by the board transport device 11. The holding member 21 can be, for example, a suction nozzle, a chuck, or the like.

The mounting head 20 can also pick up lead components 81 supplied from the component supply unit 30, transfer them to the lead wire cutting device 40 mounted in a predetermined slot 12b of the pallet member 12a, and mount the lead components 81, whose lead wires 81a have been cut by the lead wire cutting device 40, at predetermined mounting positions 73 on the board 90. In this specification, the above process by the mounting head 20 is referred to as the mounting process.

The component camera 14 and the board camera 15 may be publicly known imaging devices. The component camera 14 is fixed to the base of the component mounting machine 10 so that its optical axis faces upward in the vertical direction (Z-axis direction). The component camera 14 can image the component 80 held by the holding member 21 from below. The board camera 15 is provided on the moving stage 13b of the component transfer device 13 so that its optical axis faces downward in the vertical direction (Z-axis direction). The board camera 15 can image the board 90 from above.

The component camera 14 and the board camera 15 capture images based on control signals sent from the control device 16. Image data of the images captured by the component camera 14 and the board camera 15 is sent to the control device 16. The control device 16 is equipped with a known arithmetic device and storage device, and a control circuit is configured. Information and image data output from various sensors provided in the component mounting machine 10 are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions that have been set in advance.

For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the holding member 21 to pick up and hold the component 80 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 80 held by the holding member 21. The control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 80.

The control device 16 moves the holding member 21 above the intended mounting position, which is set in advance by a control program or the like. The control device 16 also corrects the intended mounting position based on the positioning state of the board 90, the holding posture of the component 80, and the like, and sets the mounting position where the component 80 will actually be mounted. The intended mounting position and mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 21 to match the mounting position. The control device 16 lowers the holding member 21 at the corrected rotation angle in the corrected target position to mount the component 80 on the board 90. The control device 16 can mount multiple components 80 on the board 90 by repeating the above pick-and-place cycle.

The display device 17 may be a known display device, and displays various data so that the worker can visually confirm them. For example, the display device 17 may display various settings of the component mounting machine 10, the operating status, the production status of the board product, and the like. In addition, the display device 17 of this embodiment is configured as a touch panel, and the display device 17 also functions as an input device that accepts various operations by the worker.

1-2. Example of control of lead wire cutting device 40 The pallet member 12a of this embodiment has multiple slots 12b, and the lead wire cutting device 40 can be mounted in any of the slots 12b. Therefore, the cycle time varies depending on the slot position of the slot 12b in which the lead wire cutting device 40 is mounted, and depending on the slot position, production efficiency may decrease. The above also applies to the lead wire cutting device 40 used in the mounting process when multiple lead wire cutting devices 40 are mounted on the pallet member 12a.

Therefore, the component mounting machine 10 is equipped with a calculation unit 61. The component mounting machine 10 can also be equipped with a correction unit 62. The component mounting machine 10 can also be equipped with a guidance unit 63. The component mounting machine 10 can also be equipped with a judgment unit 64. As shown in FIG. 1, the component mounting machine 10 of this embodiment is equipped with a calculation unit 61, a correction unit 62, a guidance unit 63 and a judgment unit 64.

The calculation unit 61, the correction unit 62, the guidance unit 63, and the judgment unit 64 can be provided in various calculation devices, control devices, and management devices. The calculation unit 61, the correction unit 62, the guidance unit 63, and the judgment unit 64 can also be formed on the cloud. As shown in FIG. 1, in this embodiment, the calculation unit 61, the correction unit 62, the guidance unit 63, and the judgment unit 64 are provided in the control device 16.

1-2-1. Calculation unit 61 and correction unit 62
The calculation unit 61 calculates the recommended information so as to minimize the moving distance of the lead components 81 on a moving path 70 of the lead components 81 that includes at least a picking position 71 of the lead components 81, a slot position 72 of the slot 12b in which the lead wire cutting device 40 is mounted, and an attachment position 73 of the lead components 81. The recommended information is information on the slot position 72 of the slot 12b in which the lead wire cutting device 40 should be mounted, or on the lead wire cutting device 40 to be used in the attachment process among the multiple lead wire cutting devices 40 mounted on the pallet member 12a.

As shown in FIG. 5, for example, assume that a tray 31 is mounted in the central slot 12b of a pallet member 12a. Also assume that a lead wire cutting device 40 (for ease of explanation, referred to as lead wire cutting device 40a) is mounted in the slot 12b on the left side of the tray 31 in the plane of the drawing. Also assume that a lead wire cutting device 40 (for ease of explanation, referred to as lead wire cutting device 40b) is mounted in the slot 12b on the right side of the tray 31 in the plane of the drawing. Also assume that a lead component 81 whose lead wire 81a can be cut by the lead wire cutting device 40a and lead wire cutting device 40b is mounted at mounting position 73 on the left side of the plane of the drawing of the board 90.

Arrow AR1 shows an example of a movement path 70 of the lead component 81 for the lead wire cutting device 40a. Arrow AR2 shows an example of a movement path 70 of the lead component 81 for the lead wire cutting device 40b. Arrow AR1 is shorter than arrow AR2, and of the two movement paths 70, the movement path 70 indicated by arrow AR1 has the shortest movement distance of the lead component 81. In this case, the calculation unit 61 calculates the slot position 72 of the slot 12b in which the lead wire cutting device 40a is mounted as the slot position 72 of the slot 12b in which the lead wire cutting device 40 is to be mounted.

The calculation unit 61 can also calculate the lead wire cutting device 40a, out of the multiple (two) lead wire cutting devices 40a, 40b mounted on the pallet member 12a, as the lead wire cutting device 40 to be used in the mounting process. In either case, the cycle time is reduced and production efficiency is improved compared to the lead wire cutting device 40b. The cycle time refers to the time required for the mounting process by the mounting head 20. In other words, the cycle time is the time from when the mounting head 20 starts picking up the lead components 81 supplied from the component supply unit 30 to when the lead components 81 with their lead wires 81a cut by the lead wire cutting device 40 are mounted on the board 90.

The component mounting machine 10 can be equipped with an imaging device 50 that captures an image of the lead components 81 held by the holding member 21 of the mounting head 20. As described above, in this embodiment, the imaging device 50 is the component camera 14 shown in Figure 1. The component camera 14 can capture an image of the components 80 (including the lead components 81) held by the holding member 21 from below.

The correction unit 62 corrects the position of the mounting head 20 based on the holding posture of the lead component 81 recognized from the image captured by the imaging device 50 (component camera 14). Specifically, the correction unit 62 corrects the position of the mounting head 20 to correct the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 21. The correction unit 62 lowers the holding member 21 at the corrected rotation angle in the corrected target position to mount the lead component 81 on the board 90.

In this embodiment, the movement path 70 of the lead component 81 includes an imaging position 74 where the lead component 81 is imaged by the imaging device 50 (component camera 14). For example, as shown in Figure 6, assume that the lead wire cutting device 40 (for convenience of explanation, referred to as lead wire cutting device 40c) is mounted in slot 12b, which is closer to the tray 31 than the lead wire cutting device 40b shown in Figure 5. The arrangement of the tray 31, lead wire cutting device 40a, and lead component 81 is the same as that shown in Figure 5. Also, arrow AR3 shows an example of the movement path 70 of the lead component 81 for the lead wire cutting device 40c.

Arrow AR3 is shorter than arrow AR1, and of the two movement paths 70, the movement path 70 indicated by arrow AR3 is the shortest in the movement distance of the lead component 81. In this case, the calculation unit 61 calculates the slot position 72 of the slot 12b in which the lead wire cutting device 40c is mounted as the slot position 72 of the slot 12b in which the lead wire cutting device 40 should be mounted. The calculation unit 61 can also calculate the lead wire cutting device 40c, out of the multiple (two) lead wire cutting devices 40a, 40c mounted on the pallet member 12a, as the lead wire cutting device 40 to be used in the mounting process.

As shown in Figure 7, lead component 81 may interfere with component 80 already mounted on board 90 during the mounting process. Specifically, component 80 is already mounted on board 90 along movement path 70 of lead component 81 indicated by arrow AR1 in Figure 7. For example, assume that the height of component 80 is greater than the height of lead component 81, and that there is a possibility that lead component 81 may come into contact with component 80 when lead component 81 is moved. Also assume that lead wire cutting device 40 (for ease of explanation, referred to as lead wire cutting device 40d) is mounted in slot 12b on the right side of the paper surface relative to tray 31.

The arrangement of the tray 31, lead wire cutting device 40a, and lead components 81 is the same as that shown in Figure 5. The dashed arrow AR11 indicates an example of a movement path 70 of the lead components 81 for the lead wire cutting device 40a that is set so as not to interfere with the above-mentioned components 80. The arrow AR4 indicates an example of a movement path 70 of the lead components 81 for the lead wire cutting device 40d.

In this embodiment, the calculation unit 61 calculates the recommended information for the movement path 70 of the lead component 81, which is set so that the lead component 81 does not interfere with the component 80 already mounted on the board 90 during the mounting process. The arrow AR4 is shorter than the arrow AR11, and the movement path 70 indicated by the arrow AR4 among the two movement paths 70 has the shortest movement distance of the lead component 81. Therefore, the calculation unit 61 calculates the slot position 72 of the slot 12b in which the lead wire cutting device 40d is mounted as the slot position 72 of the slot 12b in which the lead wire cutting device 40 should be mounted. The calculation unit 61 can also calculate the lead wire cutting device 40d of the multiple (two) lead wire cutting devices 40a, 40d mounted on the pallet member 12a as the lead wire cutting device 40 to be used in the mounting process.

8, for example, for the convenience of changing the setup when switching to the production of the next board product, multiple lead wire cutting devices 40 of the same type (two in the figure) may be mounted on the pallet member 12a. Specifically, it is assumed that the already-mentioned lead wire cutting device 40a and a lead wire cutting device 40 (for convenience of explanation, referred to as lead wire cutting device 40e) mounted in the slot 12b on the right side of the paper surface with respect to the tray 31 are mounted. The lead wire cutting device 40a and the lead wire cutting device 40e have the same shape of the opening 42a of the fixed blade portion 42, and can transfer the same type of lead component 81 and cut the lead wire 81a.

The arrangement of the tray 31, lead wire cutting device 40a, and lead components 81 is the same as that shown in Figure 5. Also, arrow AR5 shows an example of a movement path 70 of the lead components 81 for the lead wire cutting device 40e. In this form, the calculation unit 61 calculates recommendation information for multiple (two in this figure) lead wire cutting devices 40 of the same type mounted on the pallet member 12a.

Arrow AR1 is shorter than arrow AR5, and of the two movement paths 70, the movement path 70 indicated by arrow AR1 is the shortest in the movement distance of the lead component 81. Therefore, the calculation unit 61 can calculate that the lead wire cutting device 40a out of the multiple (two) lead wire cutting devices 40a, 40e mounted on the pallet member 12a is the lead wire cutting device 40 to be used in the mounting process.

In addition, for example, some of the multiple (two) lead wire cutting devices 40 of the same type mounted on the pallet member 12a may become unusable in the installation process due to maintenance or the like. In this case, the calculation unit 61 calculates recommendation information for the lead wire cutting devices 40 that can be used in the installation process when some of the multiple (two) lead wire cutting devices 40 of the same type mounted on the pallet member 12a become unusable in the installation process.

For example, in the above example, assume that the lead wire cutting device 40a is no longer available for use in the installation process. In this case, the calculation unit 61 can calculate that the lead wire cutting device 40e out of the multiple (two) lead wire cutting devices 40a and 40e mounted on the pallet member 12a is the lead wire cutting device 40 that should be used in the installation process.

1-2-2. Guide section 63
The recommendation information calculated by the calculation unit 61 is expected to be utilized in various ways. The component mounting machine 10 of the present embodiment includes a guide unit 63. The guide unit 63 uses the recommendation information calculated by the calculation unit 61. For example, the guidance unit 63 can provide the operator with the recommended information calculated by the calculation unit 61. In this case, the guidance unit 63 provides the operator with the recommended information calculated by the calculation unit 61. The image can be displayed on a known display device.

1, the component mounting machine 10 of this embodiment is equipped with a display device 17. For example, the guidance unit 63 can cause the display device 17 to display the recommended information calculated by the calculation unit 61. For example, the guidance unit 63 can cause the display device 17 to display a slot number indicating the slot position 72 of the slot 12b in which the lead wire cutting device 40 should be mounted, and the like.

This allows the worker to visually confirm the slot position 72 of the slot 12b where the lead wire cutting device 40 should be installed. In this case, the worker installs the lead wire cutting device 40 in the slot 12b of the guided slot position 72. The worker can also install the lead wire cutting device 40 in the slot 12b of the guided slot position 72 using a known transport device, an unmanned transport vehicle, or the like.

The guide unit 63 can also display on the display device 17 an apparatus number or the like indicating which of the multiple lead wire cutting devices 40 mounted on the pallet member 12a should be used in the installation process. This allows the worker to visually identify which of the multiple lead wire cutting devices 40 mounted on the pallet member 12a should be used in the installation process. In this case, the worker can change the control program or the like so that the guided lead wire cutting device 40 is used in the installation process.

The guidance unit 63 can also guide the recommended information calculated by the calculation unit 61 to various management devices, etc. In this case, the management device can mount the lead wire cutting device 40 in the slot 12b of the guided slot position 72 on a known conveying device, an unmanned guided vehicle, etc. The management device can also change the control program, etc. so that the guided lead wire cutting device 40 is used in the mounting process among the multiple lead wire cutting devices 40 mounted on the pallet member 12a.

The recommended information calculated by the calculation unit 61 can also be used, for example, to calculate the operating rate of the component mounting machine 10. The worker or the calculation device can calculate the operating rate of the component mounting machine 10 from the cycle time when the lead wire cutting device 40 is mounted in the slot 12b of the slot position 72 calculated by the calculation unit 61 and a board product is produced. The recommended information calculated by the calculation unit 61 can also be used, for example, to create a production plan for the board product. The worker or the calculation device can calculate the time required to produce the board product from the calculated cycle time and create a production plan for the board product.

1-2-3. Judgment section 64
If the production of a board product is started in a state where the lead wire cutting device 40 that should be mounted on the pallet member 12a is not mounted, the component mounting machine 10 stops the production of the board product. The longer the stop time, the lower the production efficiency becomes. Therefore, the component mounting machine 10 of the present embodiment is provided with the determination unit 64.

The determination unit 64 determines whether the lead wire cutting device 40 that should be mounted on the pallet member 12a is mounted on the pallet member 12a. The determination unit 64 may take various forms as long as it can determine whether the lead wire cutting device 40 is mounted.

For example, as shown in Figures 2 and 3, the lead wire cutting device 40 of this embodiment is provided with an identification unit 45 that identifies the lead wire cutting device 40. In this embodiment, the judgment unit 64 can judge whether the lead wire cutting device 40 is installed based on the identification unit 45 provided in the lead wire cutting device 40. For example, the identification unit 45 of this embodiment is a wireless tag that stores at least identification information that identifies the lead wire cutting device 40. In this case, the judgment unit 64 acquires the identification information by wirelessly communicating with the identification unit 45 when the lead wire cutting device 40 is installed on the pallet member 12a. The judgment unit 64 judges whether the lead wire cutting device 40 is installed based on whether the acquired identification information matches the identification information of the lead wire cutting device 40 to be installed on the pallet member 12a.

Specifically, when the acquired identification information matches the identification information of the lead wire cutting device 40 to be mounted on the pallet member 12a, the determination unit 64 determines that the lead wire cutting device 40 to be mounted on the pallet member 12a is mounted on the pallet member 12a. Conversely, when the acquired identification information does not match the identification information of the lead wire cutting device 40 to be mounted on the pallet member 12a, the determination unit 64 determines that the lead wire cutting device 40 to be mounted on the pallet member 12a is not mounted on the pallet member 12a.

The lead wire cutting device 40 can also store identification information for identifying the lead wire cutting device 40 in the memory device 47 of the control board 46 shown in Figure 2. In this embodiment, the judgment unit 64 reads the identification information from the memory device 47 when the lead wire cutting device 40 is mounted on the pallet member 12a. The judgment unit 64 judges whether the lead wire cutting device 40 is mounted or not based on whether the read identification information matches the identification information of the lead wire cutting device 40 to be mounted on the pallet member 12a.

Specifically, when the read-out identification information matches the identification information of the lead wire cutting device 40 to be mounted on the pallet member 12a, the judgment unit 64 judges that the lead wire cutting device 40 to be mounted on the pallet member 12a is mounted on the pallet member 12a. Conversely, when the read-out identification information does not match the identification information of the lead wire cutting device 40 to be mounted on the pallet member 12a, the judgment unit 64 judges that the lead wire cutting device 40 to be mounted on the pallet member 12a is not mounted on the pallet member 12a.

1-2-4. Others The component supply unit 30 only needs to be able to supply the lead components 81 so that the mounting head 20 can pick them up, and the tray 31 can be placed outside the pallet member 12a to supply the lead components 81. In this specification, for the sake of clarity, a method for calculating the recommended information for one mounting process is described. The calculation unit 61 can compare the total movement distance of the lead components 81 in the mounting process to be executed, for example, by using the empty slot 12b as a candidate for the mounting position of the lead wire cutting device 40 (the slot position 72 of the slot 12b where the lead wire cutting device 40 should be mounted). In this case, the calculation unit 61 can calculate the slot position 72 where the total movement distance of the lead components 81 is shortest as the slot position 72 of the slot 12b where the lead wire cutting device 40 should be mounted. Similarly, the calculation unit 61 can compare the total movement distance of the lead components 81 in the mounting process to be executed for the multiple lead wire cutting devices 40 mounted on the pallet member 12a. In this case, the calculation unit 61 can calculate the lead cutting device 40 that has the shortest total moving distance of the lead components 81 as the lead cutting device 40 to be used in the mounting process.

2. Example of Effects of the Embodiment According to the component mounting machine 10, the production efficiency of board products can be improved.

10: component mounting machine, 12a: pallet member, 12b: slot,
20: mounting head, 21: holding member, 30: component supply unit,
40: lead wire cutting device, 45: identification unit, 46: control board,
47: storage device, 50: imaging device, 61: calculation unit, 62: correction unit,
63: Guidance unit, 64: Determination unit, 70: Movement path, 71: Collection position,
72: slot position, 73: mounting position, 74: imaging position, 80: component,
81: lead component, 81a: lead wire, 90: substrate.

Claims (9)

a component supply unit that supplies lead components having lead wires;
a pallet member having a plurality of slots in which a lead wire cutting device for cutting the lead wire is mounted;
a mounting head that performs a mounting process of picking up the lead components supplied from the component supply unit, transferring them to the lead wire cutting device mounted in the predetermined slot of the pallet member, and mounting the lead components, the lead wires of which have been cut by the lead wire cutting device, at predetermined mounting positions on a substrate;
a calculation unit that calculates recommendation information, which is information on the slot position of the slot in which the lead wire cutting device should be mounted or the lead wire cutting device to be used in the mounting process among a plurality of the lead wire cutting devices mounted on the pallet member, so that the movement distance of the lead component is shortest in a movement path of the lead component that includes at least the picking position of the lead component, the slot position of the slot in which the lead wire cutting device is mounted, and the mounting position of the lead component;
Equipped with
the component supply unit supplies the lead components from a tray in which the lead components are arranged in a matrix;
A plurality of the lead wire cutting devices of the same type are mounted on the pallet member,
The calculation unit of the component mounting machine calculates the recommended information for multiple lead wire cutting devices of the same type mounted on the pallet member so that the movement distance of the lead parts from the collection position of the lead parts arranged on the tray to the installation position of the lead parts is shortest . an imaging device that images the lead components held by the holding member of the mounting head;
a correction unit that corrects a position of the mounting head based on a holding posture of the lead component recognized from an image captured by the imaging device;
Equipped with
2. The component mounting machine according to claim 1, wherein the movement path of the lead component includes an imaging position where the image of the lead component is captured by the imaging device. The component mounting machine according to claim 1 or 2, wherein the calculation unit calculates the recommended information for the movement path of the lead component that is set so that the lead component does not interfere with components already mounted on the board during the mounting process. The component mounting machine according to any one of claims 1 to 3, wherein the calculation unit calculates the recommended information for the lead wire cutting devices that can be used in the mounting process when some of the multiple lead wire cutting devices of the same type mounted on the pallet member become unusable in the mounting process. 5. The component mounting machine according to claim 1, further comprising a guide unit that provides the recommendation information calculated by the calculation unit. A component mounting machine as described in any one of claims 1 to 5 , further comprising a judgment unit for judging whether or not the lead wire cutting device that should be mounted on the pallet member is mounted on the pallet member. The lead wire cutting device includes an identification unit for identifying the lead wire cutting device,
7. The component mounting machine according to claim 6 , wherein the determining section determines whether the lead wire cutting device is mounted or not based on the identifying section provided in the lead wire cutting device. the identification unit is a wireless tag that stores at least identification information for identifying the lead wire cutting device,
The component mounting machine of claim 7, wherein the judgment unit wirelessly communicates with the identification unit to acquire the identification information when the lead wire cutting device is mounted on the pallet member, and determines whether the lead wire cutting device is mounted based on whether the acquired identification information matches the identification information of the lead wire cutting device to be mounted on the pallet member. The lead wire cutting device has identification information for identifying the lead wire cutting device stored in a memory device of a control board,
7. The component mounting machine of claim 6, wherein the determination unit reads out the identification information from the memory device when the lead wire cutting device is mounted on the pallet member, and determines whether or not the lead wire cutting device is mounted based on whether the read-out identification information matches the identification information of the lead wire cutting device to be mounted on the pallet member.

Images