JP7129590B2 - COMPONENT MOUNTING APPARATUS AND COMPONENT SUPPLY METHOD IN COMPONENT MOUNTING APPARATUS - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus that picks up a component with a mounting head and mounts it on a board, and a component supply method in the component mounting apparatus.

A component mounting apparatus supplies components to a predetermined component suction position on a base by a parts feeder, and a mounting head picks up the components supplied to the component suction position and mounts them on a substrate. A tray feeder, which is known as one type of parts feeder provided in such a component mounting apparatus, draws out a tray containing a plurality of components to supply components.

A tray of a tray feeder has a plurality of concave portions arranged in a matrix, and components are accommodated in each of the concave portions (for example, Patent Document 1 below). The space in each recess is separated from the space in other adjacent recesses by a wall, and the position of each part in the tray is fixed. Therefore, if the central position of each concave portion of the tray pulled out from the tray feeder is aligned with the component pickup position, the component can be picked up accurately by the mounting head.

JP 2015-56414 A

However, as described above, the tray having the concave portion partitioned by the wall is a dedicated item according to the size of the parts to be stored, and when supplying a plurality of types of parts with different sizes, the size of each part It was necessary to prepare multiple dedicated trays according to the requirements. In particular, there was a problem that a new tray had to be produced for a prototype part having a size or shape that did not exist in the past, resulting in an increase in cost.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting apparatus and a component supply method for the component mounting apparatus that can inexpensively construct a configuration for supplying a plurality of types of components having different sizes and mounting them on a board.

A component mounting apparatus according to the present invention comprises a base, component supply means for supplying a component to a component suction position determined on the base, and suction of the component supplied to the component suction position to the base. and a mounting head mounted on the board positioned against the base, the component supply means having a component mounting surface on which the component is mounted, the component mounting surface being positioned at a predetermined position with respect to the base. By being positioned, the component placed on the component placement surface is supplied to the component pickup position, and a mark is provided on the component placement surface as a guide for placing the component. a plurality of the marks are provided on the component placement surface, and a lattice pattern consisting of a plurality of vertical lines and a plurality of horizontal lines is provided on the component placement surface, and the marks are the vertical lines of the lattice pattern and the The component placement surface is the intersection of the horizontal lines, and the component placement surface is the surface of the conveyor that runs relative to the base. A component is placed on the unused mark in the component supply means.
Further, the component mounting apparatus of the present invention comprises a base, component supply means for supplying a component to a component suction position determined with respect to the base, and suction of the component supplied to the component suction position. a mounting head mounted on a substrate positioned with respect to a base; the component supply means has a component mounting surface on which the component is mounted; By being positioned at a position, the component placed on the component placement surface is supplied to the component pickup position, and a mark serving as a guide for placing the component on the component placement surface. is provided, a plurality of the marks are provided on the component placement surface, the component placement surface is a surface of a conveyor that travels with respect to the base, and the component placement surface is provided with a running direction of the conveyor and a plurality of horizontal lines perpendicular to the vertical lines, and the landmarks are the intersections of the vertical lines and the horizontal lines of the grid.

A component supply method for a component mounting apparatus according to the present invention includes a base, component supply means for supplying a component to a component suction position determined on the base, and suction of the component supplied to the component suction position. a mounting head for mounting on a substrate positioned with respect to the base, the component supply means having a component mounting surface on which the component is mounted, the component mounting surface being the base; The component mounted on the component mounting surface is supplied to the component pickup position by being positioned at a predetermined position relative to the component mounting surface, and the component mounting surface serves as a guideline for mounting the component on the component mounting surface. a plurality of marks are provided on the component mounting surface; a checkered pattern consisting of a plurality of vertical lines and a plurality of horizontal lines is provided on the component mounting surface; A component supply method in a component mounting apparatus, wherein the component placement surface is the surface of a conveyor that runs on the base, and the component placement surface is the surface of the conveyor that runs on the base. a component placing step of placing the component on a surface; a component supplying step of positioning the component placing surface on which the component is placed at the predetermined position and supplying the component to the component pick-up position; a component pickup step of picking up the component supplied in the component supply step with the pickup head, and in the component pickup step, if the component cannot be mounted on the substrate, the pickup head picks up the picked up component as the component. It is placed on the mark that is not used in the supply means.
A component supply method for a component mounting apparatus according to the present invention comprises a base, component supply means for supplying a component to a component pick-up position determined on the base, and a component supplied to the component pick-up position. a mounting head for mounting on the substrate positioned on the base by suction, the component supply means having a component mounting surface on which the component is mounted, the component mounting surface being the component mounting surface; The component mounted on the component mounting surface is supplied to the component suction position by being positioned at a predetermined position with respect to the base, and the component is mounted on the component mounting surface. A mark serving as a guide is provided, a plurality of the marks are provided on the component placement surface, the component placement surface is a surface of a conveyor that runs relative to the base, and the component placement surface is provided with the above -mentioned marks. A part provided with a check pattern consisting of a plurality of vertical lines extending along the running direction of the conveyor and a plurality of horizontal lines orthogonal to the vertical lines, and the marks being the intersections of the vertical lines and the horizontal lines of the check pattern. A component supply method for a mounting apparatus, comprising: a component placement step of placing the component on the component placement surface using the mark as a guide; and moving the component placement surface on which the component is placed to the predetermined position. and a component supply step of positioning and supplying the component to the component pickup position.

ADVANTAGE OF THE INVENTION According to this invention, the structure which supplies and mounts|wears a board|substrate with several types of components which differ in size can be constructed|assembled at low cost.

1 is a perspective view of a main part of a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a perspective view of a tray of a tray feeder provided in a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a plan view showing a component supply tray provided in a component mounting apparatus according to an embodiment of the present invention together with components placed thereon; FIG. 1 is a perspective view showing a component supply tray provided in a component mounting apparatus according to an embodiment of the present invention together with components placed thereon; FIG. 1 is a block diagram showing a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a flow chart showing the flow of component mounting work executed by a component mounting apparatus according to an embodiment of the present invention; 1 is a perspective view showing an example of a state in which a component is picked up by a mounting head included in a component mounting apparatus according to an embodiment of the present invention; FIG. (a) and (b) are perspective views of a conveyor device provided in the component mounting apparatus according to the embodiment of the present invention in place of the component supply tray.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a component mounting apparatus 1 according to one embodiment of the present invention. A component mounting apparatus 1 is an apparatus for mounting a component PT on a board KB sent from the upstream process side and sending the board KB to the downstream process side. A moving mechanism 15 , a mounting head 16 , a board camera 17 , a component camera 18 and a collection box 19 are provided. Here, for convenience of explanation, the left-right direction of the component mounting apparatus 1 viewed from the operator OP is defined as the X-axis direction, and the front-rear direction is defined as the Y-axis direction. Also, the vertical direction is defined as the Z-axis direction.

In FIG. 1, the substrate transfer section 12 has a pair of conveyor mechanisms 12a arranged on the front and rear sides of the base 11. As shown in FIG. The board transfer unit 12 transfers the board KB in the X-axis direction by means of a conveyor mechanism 12a, and positions the board KB at a predetermined working position. The tray feeder 13 is attached to a region on the near side (on the operator OP side) of the substrate transfer section 12 .

In FIG. 2, the tray feeder 13 has a tray 13T in which parts PT are accommodated in each of a plurality of concave portions 13B arranged in a matrix. As shown in FIG. 1, the tray feeder 13 has a plurality of pallets 13P arranged vertically, and each pallet 13P holds a tray 13T. When one pallet 13P is pulled out to a predetermined height position (part supply position) by a drawer mechanism (not shown) as viewed from the operator OP, the parts PT in the tray 13T held by the pallet 13P are pulled out. It becomes a state (supply state) in which it is supplied to the mounting head 16 (FIG. 2).

The concave portion 13B of each tray 13T provided in the tray feeder 13 has the same size. Therefore, the parts PT stored in each tray 13T are the same, and the types (sizes) of the parts PT are divided for each tray 13T. Each time the tray feeder 13 changes the component PT to be supplied, the tray 13T positioned at the component supply position is replaced.

In FIG. 1, a tray-shaped component supply tray 14 is detachably installed in a tray installation portion 11T provided in the front region of the base 11. As shown in FIG. The component supply tray 14 has a flat component placement surface 21 . One or a plurality of components PT are mounted on the component mounting surface 21 (FIG. 3). The component placement surface 21 may be covered with a thick cushioning material or the like for facilitating placement of the component PT.

3 and 4, a check pattern 22 composed of a plurality of vertical lines 22a and a plurality of horizontal lines 22b is formed on the component placement surface 21 of the component supply tray 14. As shown in FIG. The intersection of the vertical line 22a and the horizontal line 22b is a mark 23 used as a reference when the operator OP places the component PT on the component placement surface 21 manually.

The component PT placed on the component placement surface 21 of the component supply tray 14 is manually placed on the component placement surface 21 by the operator OP using the mark 23 provided on the component placement surface 21 as a guide. placed. Specifically, the component PT is mounted on the component mounting surface 21 so that the target suction position MC by the mounting head 16 (specifically, the nozzle 16a) of the component PT matches the mark 23 in plan view (FIGS. 3 and 4). 4).

The component supply tray 14 does not have the concave portion 13B formed in the tray 13T of the tray feeder 13, and has a planar shape as a whole. Therefore, the size and number of components PT that can be placed on the component placement surface 21 are not limited as long as they are within a range corresponding to the size of the component placement surface 21 and the number of the marks 23 . Therefore, a plurality of parts PT of arbitrary size can be placed on the part placement surface 21 without interfering with each other. Each component PT placed on the component placement surface 21 enters a supply state when the component supply tray 14 is attached to a predetermined position (here, the tray installation portion 11T) on the base 11 .

In FIG. 1, the head moving mechanism 15 has a fixed table 31, a moving table 32, and a moving plate 33. As shown in FIG. A fixed table 31 is fixed to the base 11 and extends in the Y-axis direction. The moving table 32 extends in the X-axis direction, and one end thereof is movable along the fixed table 31 . The moving plate 33 is provided movably along the moving table 32 .

In FIG. 1, the mounting head 16 is attached to a moving plate 33 of the head moving mechanism 15. As shown in FIG. The head moving mechanism 15 moves the mounting head 16 within the XY plane by moving the moving table 32 with respect to the fixed table 31 in the Y-axis direction and moving the moving plate 33 with respect to the moving table 32 .

In FIG. 1, the mounting head 16 has a plurality of nozzles 16a. Each nozzle 16a extends downward, and a component suction opening is formed at the lower end. Each nozzle 16a moves up and down in the Z-axis direction and rotates around the Z-axis by the operation of the nozzle driving mechanism 16A.

In FIG. 1, the mounting head 16 is equipped with a control valve 16B. The control valve 16B is connected to a vacuum source (not shown) to generate a suction force at the component suction opening of each nozzle 16a. Each nozzle 16a sucks the component PT supplied by the tray feeder 13 or the component PT supplied by the component supply tray 14 by the suction force generated at the component suction opening.

Here, the mounting head 16 can pick up the component PT at each of a plurality of component pickup positions determined with respect to the base 11 as spatial positions for picking up the component PT. In the present embodiment, the component suction positions are positions corresponding to the respective centers of the plurality of recessed portions 13B of the tray 13T of the tray feeder 13 (the tray 13T positioned at the component supply position), and a position corresponding to the center of each of the plurality of recessed portions 13B. The positions corresponding to each of the plurality of marks 23 of the component supply tray 14 are set.

As described above, in the present embodiment, the component supply tray 14 as component supply means has the component placement surface 21 on which the component PT is placed, and the component placement surface 21 is positioned at a predetermined position (tray The component PT placed on the component placement surface 21 is supplied to the component pickup position by being positioned on the installation portion 11T). It has a configuration in which a mark 23 is provided.

In FIG. 1, the substrate camera 17 is attached to the mounting head 16 with the imaging optical axis directed downward. The component camera 18 is provided in a region on the front side of the board transfer section 12 on the base 11 with the imaging optical axis directed upward. The recovery box 19 is formed of a box-shaped member that is open upward, and is provided adjacent to the component camera 18 in the region on the front side of the board transfer section 12 .

In FIG. 5 , the control device 40 provided in the component mounting apparatus 1 controls the operation of transporting and positioning the board KB by the board transporting section 12 . The control device 40 also controls the feeding operation of the parts PT by the tray feeder 13 . The control device 40 also controls movement of the mounting head 16 by the head moving mechanism 15 . The control device 40 also controls the lifting and rotating operations of the nozzle 16a by the nozzle drive mechanism 16A. Further, the control device 40 controls the suction operation of the component PT of the nozzle 16a by the control valve 16B. Further, the control device 40 controls the imaging of each of the board camera 17 and the component camera 18 . The image data obtained by imaging with the substrate camera 17 and the image data obtained by imaging with the component camera 18 are sent to the control device 40 and image recognition is performed.

In FIG. 5, the control device 40 is connected to the touch panel 41 (FIG. 1) provided in the component mounting apparatus 1. As shown in FIG. The touch panel 41 functions as an input device for the operator OP to make necessary inputs to the control device 40, and also allows the control device 40 to display the state of the component mounting apparatus 1 to the operator OP and to give work instructions to the operator OP. function as an output device.

Next, based on the flowchart shown in FIG. 6, the procedure of component mounting work by the component mounting apparatus 1 will be described. In the component mounting work, first, the operator OP places the component PT on the component supply tray 14 that has been removed from the tray installation section 11T (component placement step of step ST1). In this component placement step, the operator OP places one or more components PT on the component placement surface 21 of the component supply tray 14 using the marks 23 provided on the component placement surface 21 as a guide.

The component mounting apparatus 1 stores mark information, which is coordinate information of the position where the mark 23 is provided. By inputting the placement position (mark information) of the placed component PT from the touch panel 41 , the placement position (mark information) of the component PT becomes the pickup position of the component PT by the mounting head 16 . A number associated with the mark information may be assigned near the mark 23, or the placement position of the component PT may be determined by using the mark 23 as a number. Horizontal lines 22b may be numbered. Also, the number of the position where the component PT is to be placed is set in advance in the mounting data, and the operator OP may place the component PT on the component supply tray 14 based on the number. The mark 23 input to the component mounting apparatus 1 by the operator OP is stored in the storage unit as a status of being used on the mark information.

After placing the component PT on the component supply tray 14, the operator OP moves the component PT placed on the component supply tray 14 to the component pickup position by attaching the component supply tray 14 to the tray setting portion 11T of the base 11. supply (component supply process of step ST2). The procedure for supplying the component PT to the component mounting apparatus 1, which consists of the component placement process of step ST1, the component supply process of step ST2, and the component supply process, constitutes the component supply method in the component mounting apparatus 1 according to the present embodiment.

After putting the parts PT placed on the parts supply tray 14 into the supply state by the above-described procedure, the operator OP performs an operation start operation from the touch panel 41 . When a work start operation is performed from the touch panel 41, the board transfer section 12 is operated under the control of the control device 40 to load the board KB received from the outside and position it at the work position (board loading step of step ST3). .

After the board transfer section 12 has positioned the board KB at the working position, the mounting head 16 moves above the board KB to allow the board camera 17 to recognize the board KB (a board recognition process in step ST4). In recognizing the board KB, the board camera 17 recognizes the board mark MK (FIG. 1) provided at the corner of the board KB. Based on the position of the board mark MK recognized by the board camera 17, the control device 40 grasps the positional deviation of the board KB from the working position.

When the substrate camera 17 recognizes the substrate KB, the mounting head 16 moves above the tray 13T positioned at the component supply position by the tray feeder 13 or the component supply tray 14 installed in the tray installation section 11T. Then, the mounting head 16 sucks the component PT supplied from the tray 13T or the component supply tray 14 using the nozzle 16a (component suction step of step ST5).

Here, if the operator OP places a component PT at an arbitrary position on the component placement surface 21 in a state where there is no mark on the component placement surface 21 of the component supply tray 14, the mounting head 16 In , the part PT is picked up after the part PT is found by the board camera 17, and the working efficiency is extremely deteriorated. In the component mounting apparatus 1 according to the present embodiment, the component mounting surface 21 is positioned at a predetermined position (the tray setting portion 11T) with respect to the base 11, and the component PT is positioned at the component pickup position. A mark 23 is provided as a guide for the placement position of the PT, and the operator OP places the part PT using the mark 23 as a guide. Therefore, the component PT placed on the component placement surface 21 is always positioned at the component pickup position, and the component mounting work can be performed efficiently.

After picking up the component PT, the mounting head 16 moves above the component camera 18 . When the component PT is positioned above the component camera 18, the component camera 18 recognizes the component PT picked up by the mounting head 16 from below (component recognition step of step ST6). Then, the control device 40 determines whether or not the component PT picked up by the mounting head 16 can be mounted on the board KB based on the recognition result of the component camera 18 (determining step ST7).

Specifically, in the above determination, when the component PT recognized by the component camera 18 has a predetermined attitude and positional relationship with respect to the nozzle 16a, it is determined that the component PT can be mounted on the board KB. . On the other hand, if the recognized component PT does not have the predetermined posture and positional relationship with respect to the nozzle 16a, it is determined that the component PT cannot be mounted on the board KB. Note that the component PT recognized by the component camera 18 has a predetermined posture with respect to the nozzle 16a, but is not in a predetermined positional relationship, and the size of the component PT differs from the size of the component PT on the mounting data. In this case, it is determined that a component PT different from the target component PT is being sucked, and it is determined that the component PT cannot be mounted on the board KB, and the operator OP is notified that the sucked component PT is a different component PT. do.

Therefore, even if there is no abnormality in the component PT itself, it may be determined that the component PT cannot be mounted on the board KB because the position where the nozzle 16a has picked up the component PT has deviated from the original target pickup position. FIG. 7 shows an example in which the position (actual pickup position JC) where the mounting head 16 picks up the component PT with the nozzle 16a is deviated from the position (target pickup position MC) where it should originally be picked up.

When it is determined in the determination process of step ST7 that the component PT can be mounted on the board KB, the mounting head 16 moves above the board KB. Then, the mounting head 16 mounts the picked component PT at a predetermined position (target mounting position) on the substrate KB (component mounting process of step ST8).

On the other hand, when it is determined in the determination process of step ST7 that the component PT cannot be mounted on the board KB, the mounting head 16 puts the sucked component PT into the collection box 19 and collects the component PT (step part collection step in ST9). A component PT, such as an IC chip, which is placed in a planar shape and does not easily lose its posture, may be placed on the component supply tray 14 instead of being recovered in the recovery box 19 . When placing the component PT on the component supply tray 14 , the component PT is placed on the mark 23 that is not in use (not in use) in the status of the mark information of the component supply tray 14 stored in the storage unit of the component mounting apparatus 1 . place

When the parts PT are mounted on the board KB in step ST8 or collected in step ST9, the controller 40 determines whether or not all the parts PT to be mounted on the board KB have been mounted on the board KB. (completion determination step of step ST10). If all the parts PT to be mounted on the board KB have not been completely mounted on the board KB, the process returns to step ST5, and an example of the processes from picking up the parts PT to mounting the parts PT on the board KB is performed. Repeat the steps of On the other hand, when all the components PT have been mounted on the board KB in step ST10, the board transfer section 12 unloads the board KB to the downstream process side (board unloading step of step ST11). This completes the component mounting work for each board KB.

As described above, in the component mounting apparatus 1 according to the present embodiment, the component PT is placed on the component placement surface 21 using the mark 23 provided on the component placement surface 21 provided on the component supply tray 14 as a component supply means as a guide. , the component PT can be positioned at the component suction position while the component mounting surface 21 is positioned at a predetermined position (tray setting portion 11T) with respect to the base 11 . Since the component mounting surface 21 does not have a concave portion 13B like the tray 13T provided in the tray feeder 13, any size and number of marks 23 can be used within a range corresponding to the size of the component mounting surface 21 and the number of marks 23. A number of components PT can be placed on the component placement surface 21 . Therefore, according to the component mounting apparatus 1 and the component supply method in the component mounting apparatus 1 of the present embodiment, it is possible to inexpensively construct a configuration in which a plurality of types of components PT with different sizes are supplied and mounted on the board KB. .

Since the component supply tray 14 according to the present embodiment can place a plurality of components PT of any size as described above, it is effective even when it is necessary to mount a plurality of prototype components of different sizes on the board KB. be. Furthermore, it is extremely effective when the component PT collected in the collection box 19 in step ST9 is re-adsorbed to the mounting head 16 and mounted on the substrate KB.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above. For example, the component supply means for supplying the component PT to the component pickup position determined on the base 11 is not limited to the tray-like member (the component supply tray 14) shown in the above embodiment. For example, as shown in FIGS. 8A and 8B, the component supply means may be a conveyor device 50 attached to the base 11 instead of the component supply tray 14. FIG. This conveyor device 50 has a conveyor 52 that is driven in the front-rear direction by a motor 51, and a surface 52a of the conveyor 52 serves as a component mounting surface. A surface 52a (component placement surface) of the conveyor 52 is provided with a guide 53 made of a check pattern consisting of a plurality of vertical lines extending along the traveling direction of the conveyor 52 and a plurality of horizontal lines perpendicular to the vertical lines.

The intersection 53a of the vertical line and the horizontal line of the guide 53 has a function corresponding to the mark 23 of the component supply tray 14, and the operator OP places the component PT on the surface 52a (component placement surface) of the conveyor 52. It serves as a guideline for the position of the part PT at the time. After the operator OP places the part PT on the surface 52a of the conveyor 52, the motor 51 is activated to run the conveyor 52 (FIG. 8(a)→FIG. 8(b)). Then, when the portion where the part PT is placed is positioned at a predetermined position (the part stop position 54 shown in FIGS. 8A and 8B) with respect to the base 11, the conveyor 52 is stopped, and the part PT is stopped. It is positioned at the part pick-up position.

This conveyor device 50 also has a component placement surface on which the components PT are placed, similar to the component supply tray 14 described above. The parts PT placed on the surface are supplied to the parts pick-up position, and the parts placement surface is provided with a mark that serves as a guideline for placing the parts PT. Therefore, effects similar to those of the above-described embodiment can be obtained.

In the above-described embodiment, the component supply tray 14 is installed in the tray installation section 11T provided separately from the tray feeder 13. It may be. Further, in the above embodiment, the parts PT are supplied by the tray feeder 13, but the parts PT are supplied by a parts feeder other than the tray feeder 13, such as a tape feeder or a stick feeder. may be

To provide a component mounting apparatus and a component supply method in the component mounting apparatus, capable of inexpensively constructing a configuration for supplying a plurality of types of components having different sizes and mounting them on a substrate.

1 component mounting device 11 base 14 component supply tray (component supply means)
16 Mounting head 21 Component mounting surface 22 Plaid 22a Vertical line 22b Horizontal line 23 Mark 52 Conveyor KB Board PT Component

Claims (4)

a base;
component supply means for supplying a component to a component pickup position determined with respect to the base;
a mounting head for picking up the component supplied to the component pick-up position and mounting it on the substrate positioned with respect to the base;
The component supply means has a component mounting surface on which the component is mounted, and the component mounting surface is positioned at a predetermined position with respect to the base, thereby placing the component on the component mounting surface. A component is supplied to the component suction position, and a mark is provided on the component placement surface as a guideline for placing the component,
A plurality of the marks are provided on the component mounting surface,
A check pattern consisting of a plurality of vertical lines and a plurality of horizontal lines is provided on the component mounting surface, and the mark is an intersection of the vertical line and the horizontal line of the check pattern,
The component placement surface is a surface of a conveyor that runs on the base,
A component mounting apparatus according to claim 1, wherein when the component sucked by the suction head cannot be mounted on the substrate, the suction head places the sucked component on the unused mark in the component supply means. a base;
component supply means for supplying a component to a component pickup position determined with respect to the base;
a mounting head for picking up the component supplied to the component pick-up position and mounting it on the substrate positioned with respect to the base;
The component supply means has a component mounting surface on which the component is mounted, and the component mounting surface is positioned at a predetermined position with respect to the base, thereby placing the component on the component mounting surface. A component is supplied to the component suction position, and a mark is provided on the component placement surface as a guideline for placing the component,
A plurality of the marks are provided on the component mounting surface,
The component placement surface is a surface of a conveyor that runs on the base,
A check pattern consisting of a plurality of vertical lines extending along the running direction of the conveyor and a plurality of horizontal lines perpendicular to the vertical lines is provided on the component placement surface, and the marks are the vertical lines of the check pattern. A component mounting apparatus, which is the intersection of the horizontal lines. a base, a component supply means for supplying a component to a component suction position determined on the base, and a substrate positioned on the base by sucking the component supplied to the component suction position; The component supply means has a component mounting surface on which the component is mounted, and the component mounting surface is positioned at a predetermined position with respect to the base, whereby the component is mounted. The component placed on the placement surface is supplied to the component suction position, and the component placement surface is provided with a mark as a guideline for placing the component, and A plurality of the marks are provided, and a lattice pattern consisting of a plurality of vertical lines and a plurality of horizontal lines is provided on the component placement surface, the mark is an intersection of the vertical lines and the horizontal lines of the lattice pattern, and the component A component supply method in a component mounting apparatus, wherein the mounting surface is the surface of a conveyor that runs on the base,
a component placement step of placing the component on the component placement surface using the mark as a guide;
a component supply step of positioning the component placement surface on which the component is placed at the predetermined position and supplying the component to the component pickup position;
a component pick-up step of picking up the component supplied in the component supply step with the pick-up head;
A component supply method in a component mounting apparatus, wherein, in the component suction step, when the component cannot be mounted on the board, the suction head places the sucked component on the unused mark of the component supply means. a base, a component supply means for supplying a component to a component suction position determined on the base, and a substrate positioned on the base by sucking the component supplied to the component suction position; The component supply means has a component mounting surface on which the component is mounted, and the component mounting surface is positioned at a predetermined position with respect to the base, whereby the component is mounted. The component placed on the placement surface is supplied to the component suction position, and the component placement surface is provided with a mark as a guideline for placing the component, and A plurality of the marks are provided, the component placement surface is a surface of a conveyor that travels with respect to the base, and the component placement surface includes a plurality of vertical lines extending along the running direction of the conveyor. , a component supply method in a component mounting apparatus, wherein a check pattern consisting of a plurality of horizontal lines orthogonal to the vertical lines is provided, and the mark is an intersection point of the vertical line and the horizontal line of the check pattern,
a component placement step of placing the component on the component placement surface using the mark as a guide;
a component supply step of positioning the component placement surface on which the component is placed at the predetermined position and supplying the component to the component pickup position.

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