JP6739323B2 - Adsorption start die teaching system - Google Patents

Description

The present specification describes a die (hereinafter, referred to as “suction start die”) that a worker first sucks from a plurality of dies of a wafer image displayed on the screen of the display device before the die supply device starts the die suction operation. ) Is designated to teach the actual position of the suction start die to the die supply device.

As described in Patent Document 1 (International Publication WO2013/145202) and Patent Document 2 (JP2013-110182A), a die supply device for supplying a die (chip component) to a component mounting machine is A wafer pallet in which a stretchable dicing sheet having a circular wafer diced so as to be divided into a plurality of dies is attached to a dicing frame, and a push-up pin arranged below the dicing sheet, When the suction nozzle is lowered to suck and pick up the die on the dicing sheet, the sticking portion of the die to be sucked out of the dicing sheet is pushed up by the push-up pin to remove the sticking portion of the die. While partially peeling from the dicing sheet, the die is sucked by the suction nozzle and picked up from the dicing sheet.

In this case, since the dicing sheet is expanded (expanded) in the outer side direction of the circular wafer so that the dies can be easily picked up, and a gap is provided between the dies, the position of each die on the dicing sheet is The dicing sheet may be misaligned due to uneven expansion, which may distort the array of dies, or the position and angle of the circular wafer may be misaligned. For this reason, the die supply device is equipped with a camera for recognizing the position of each die on the wafer. However, even if each die of the wafer image captured by the camera can be recognized, The position of the die on the circular wafer cannot be accurately determined.

Therefore, as described in Patent Document 3 (Japanese Unexamined Patent Publication No. 2002-26041) and Patent Document 4 (Japanese Unexamined Patent Publication No. 2012-222054), a reference that can be distinguished from other dies by image recognition on a wafer. A die is provided, and the position of each die on the wafer is recognized by using the position of the reference die as a reference position.

However, as the distance from the reference die increases, the effect of the distortion of the die array due to the non-uniform expansion of the dicing sheet becomes larger, and the relative positional relationship between the reference die and the die becomes larger. -Because of the deviation of the angle, it is difficult to accurately recognize the position of the die (adsorption start die) that first adsorbs from a large number of die on the wafer only by image processing. Therefore, before the die supply device starts the die suction operation, the wafer image captured by the camera is displayed on the screen of the display device so that the operator can select from among many dies of the wafer image on the screen of the display device. After the suction start die is designated and the actual position of the suction start die is taught to the die supply device, the suction operation of the suction start die is started.

International publication WO2013/145202 JP, 2013-110182, A JP, 2002-26041, A JP 2012-222054A

When the operator designates the suction start die on the screen of the display device, the number of dies existing between the reference die and the suction start die is counted and the suction start die is designated. However, not only is it laborious for the worker to count the number of dies existing between the reference die and the suction start die, but there is also the possibility of counting the wrong number of dies, and the wrong die is designated as the suction start die. There is a possibility that human error will occur.

Furthermore, in many cases, the image of the entire wafer is not displayed on the screen of the display device, and only a part of the wafer is enlarged and displayed. In such a case, if the reference die and the suction start die are separated from each other. , Only one of the reference die and the suction start die is displayed on the screen of the display device. In such a case, it is difficult for an operator to count the number of dies existing between the reference die and the suction start die on the screen of the display device, and a human error occurs in which the suction start die is incorrectly specified. Cheap.

In order to solve the above problems, a display device that displays a wafer image obtained by capturing at least a part of a wafer diced to be divided into a plurality of dies with a camera is provided, and before the die supply device starts a die suction operation. The operator specifies the die to be first sucked (hereinafter referred to as “suction start die”) from the plurality of dies of the wafer image displayed on the screen of the display device and supplies the actual position of the suction start die to the die supply. In a suction start die teaching system for teaching a device, a reference die setting unit that sets a die specified from among dies having a different appearance from other dies of the wafer as a reference die serving as a reference position. , The relative position information indicating how many dies each of the dies of the wafer image displayed on the screen of the display device are distant from the reference die in the vertical direction and the horizontal direction, and the relative position information is displayed on the screen of the display device. And a control unit for displaying.

In this configuration, relative position information indicating how many dies each of the dies of the wafer image displayed on the screen of the display device are separated from the reference die in the vertical and horizontal directions is displayed on the screen of the display device together with the wafer image. Even if only one of the reference die and the suction start die is displayed on the screen of the display device, the operator only needs to look at the relative position information displayed on the screen of the display device. It is possible to easily know how many dies each image die is apart from the reference die in the vertical and horizontal directions. This eliminates the need for the operator to count the number of dies existing between the reference die and the suction start die, simplifies the work of designating the suction start die on the screen of the display device, and makes an error in counting the number of dies. It is possible to prevent human error such as erroneous designation of the suction start die due to.

In this case, as a display mode of the relative position information, for example, the relative position information may be superimposed and displayed on each die arranged in at least one vertical column and one horizontal column of the wafer image displayed on the screen of the display device. .. By doing so, the relative position information can be displayed in an easy-to-understand manner on each die arranged in at least one vertical row and one horizontal row of the wafer image without narrowing the display space of the wafer image displayed on the screen of the display device.

Further, when only a part of the wafer is captured within the field of view of the camera and imaged, only one of the reference die and the suction start die may be displayed in the wafer image displayed on the screen of the display device. In such a case, when moving either the camera or the wafer from the imaging area including the reference die to the imaging area including the suction start die, the wafer image captured by the camera is processed to divide each die. The vertical and horizontal dicing grooves may be recognized, relative position information of each die from the reference die may be measured along the vertical row and the horizontal row of each die, and the information may be displayed on the screen of the display device. By doing so, even when the reference die is not included in the wafer image displayed on the screen of the display device, the die array is distorted due to the expansion of the dicing sheet and the width of the gap (dicing groove) between the dies is varied. Without being affected by, the control unit can accurately measure the relative position information of each die from the reference die and display the accurate relative position information on the screen of the display device.

It should be noted that instead of recognizing the dicing groove, the relative position information of each die from the reference die may be acquired by recognizing one die in order in the vertical direction and the horizontal direction from the reference die. good.

Further, since the relative position information of each die from the reference die is displayed on the screen of the display device, when the operator manually moves either the camera or the wafer to the imaging area including the suction start die. However, the operator can easily move to the imaging area that includes the suction start die by moving either the camera or the wafer while checking the relative position information of each die displayed on the screen of the display device. Can be made.

Further, either the camera or the wafer may be configured to automatically move from the imaging area including the reference die to the imaging area including the suction start die. When the relative position information of the suction start die is acquired and either the camera or the wafer is moved to the imaging area including the suction start die, the control unit measures the relative position information of each die from the reference die. Either the camera or the wafer may be moved to the imaging area including the suction start die while checking the result. By doing this, even if the position of the suction start die is large due to the distortion of the die arrangement due to the expansion of the dicing sheet and the variation in the width of the gap (dicing groove) between the dies, either the camera or the wafer can be moved. The automatic control can surely move to the imaging area including the arrival start die.

The reference die may be designated by wafer mapping data indicating the information of each die of the wafer or by a production job.

Alternatively, the worker may designate the reference die from among the plurality of dies of the wafer image displayed on the screen of the display device. By doing so, even if the reference die position is not specified in advance in the wafer mapping data or the production job data, the operator can easily specify the reference die on the screen of the display device before the start of production. ..

FIG. 1 is an external perspective view of a die supply device showing an embodiment. FIG. 2 is an external perspective view of the push-up unit and its peripheral portion. FIG. 3 is an external perspective view of the wafer pallet. FIG. 4 is a partially cutaway enlarged view showing a state where the push-up pot is raised to the suction position during the push-up operation. FIG. 5 is a partially cutaway enlarged view showing a state in which the push-up pin is projected from the push-up pot during the push-up operation. FIG. 6 is a block diagram showing the configuration of the control system of the die supply device. FIG. 7 is a diagram showing the relationship between the position of the reference die of the wafer, the position of the suction start die, and the visual field of the camera. FIG. 8 is a diagram showing a display example in which relative position information from the reference die is displayed for each die located at the edge of the wafer image displayed on the screen of the display device by the number of dies.

An example will be described below.
First, the configuration of the die supply device 11 will be schematically described with reference to FIG.

The die supply device 11 includes a magazine holding portion 22 (tray tower), a pallet pull-out table 23, an XY moving mechanism 25, a pallet pull-out mechanism 26, a push-up unit 28 (see FIG. 2), and the pallet pull-out table 23 is mounted on a component mounting machine. It is set in a state of being inserted into (not shown).

Wafer pallets 32 having wafers 30 set therein are stacked in multiple stages on a magazine (not shown) housed in the magazine holding unit 22 of the die supply device 11 so as to be vertically movable. Are pulled out onto the pallet pull-out table 23 by the pallet pull-out mechanism 26, and the wafer pallet 32 on the pallet pull-out table 23 is returned to the magazine. As shown in FIG. 3, the wafer 30 is attached to an expandable/contractible dicing sheet 34, and dicing grooves 36 are formed in a grid pattern so as to be divided into a large number of dies 31. The dicing sheet 34 is mounted in an expanded state on a dicing frame 33 having a circular opening, and the dicing frame 33 is attached to the pallet body 35 by screwing or the like.

The push-up unit 28 (see FIG. 2) is configured to be movable in a space area below the dicing sheet 34 of the wafer pallet 32 in XY directions (horizontal, front-rear, left-right directions). Then, the sticking portion of the die 31 to be picked up (adsorbed) in the dicing sheet 34 is locally pushed up from below with the push-up pin 39 (see FIGS. 4 and 5) of the push-up pot 37, thereby The part of the die 31 attached is partially peeled off from the dicing sheet 34 so that the die 31 can be easily picked up.

The push-up unit 28 is configured so that the push-up unit 28 as a whole moves up and down by using a servo motor 38 (see FIG. 6) as a drive source. During the die pick-up operation, when the push-up unit 28 moves up to a predetermined sheet suction position where the upper surface of the push-up pot 37 almost contacts the dicing sheet 34 of the wafer pallet 32, the stopper mechanism (not shown) causes the push-up unit 28 to move. When the ascending operation is stopped and the ascending operation is continued, the push-up pin 39 (see FIGS. 4 and 5) projects upward from the upper surface of the push-up pot 37, and the portion of the dicing sheet 34 to which the die 31 to be picked up is attached. It is designed to push up. In this case, by adjusting the rotation amount of the servo motor 38 serving as a drive source, the push-up height position (push amount) of the push-up pin 39 can be adjusted.

As shown in FIG. 1, the suction head 41 and the camera 42 are assembled to the XY moving mechanism 25, and the XY moving mechanism 25 is configured to integrally move the suction head 41 and the camera 42 in the XY directions. ing. The suction head 41 is provided with a suction nozzle 43 (see FIG. 4 and FIG. 5) that vertically suctions the die 31 on the dicing sheet 34. The camera 42 is capable of recognizing the position of the die 31 to be sucked by the suction nozzle 43 by picking up the die 31 on the dicing sheet 34 from above and performing image processing on the picked-up image.

The control unit 45 (see FIG. 6) of the die supply device 11 is mainly composed of a computer and also has an image processing function, and picks up the die 31 to be sucked among the dies 31 on the dicing sheet 34 with the camera 42. The image obtained is processed to recognize the position of the die 31, the push-up position and the suction position of the die 31 are determined, and as shown in FIG. 5, pick up (suck) the dicing sheet 34. By locally pushing up the attached portion of the die 31 from below with the push-up pin 39 of the pot 37, the attached portion of the die 31 is partially peeled from the dicing sheet 34 and the die 31 is picked up. The die 31 is sucked and picked up by the suction nozzle 43 while floating in an easy state. Then, the position of the die 31 to be sucked next is estimated based on the recognition position of the die 31 that has performed the suction operation this time, and the estimated next position of the suction die 31 is set as the target imaging die position. By repeating the process of picking up the image with the camera 42, recognizing the position of the next suction die 31, and executing the push-up operation and the suction operation described above, the die 31 on the dicing sheet 34 is sucked in a predetermined order. ..

The dicing sheet 34 is expanded outward from the circular wafer 30 so that the dies 31 can be easily picked up, and a gap (dicing groove 36) is formed between the dies 31. The position of 41 is displaced due to the non-uniform expansion of the dicing sheet 34 to distort the arrangement of the dies 31, and the set position/angle of the circular wafer 30 is also displaced.

In view of this, in the present embodiment, one or a plurality of locations on the wafer 30 are dies that have a different shape, pattern, or other appearance from the other dies 31 (dies that can be distinguished from other dies 31 by image processing). The reference die 47 is provided as a reference die, and the position of each die 31 of the wafer 30 is determined by using the position of the reference die 47 as a reference position.

However, as the distance from the reference die 47 increases, the influence of the distortion of the arrangement of the dies 31 due to the non-uniform expansion of the dicing sheet 34 increases, and the deviation of the relative positional relationship between the reference die 47 and the die 31 increases, or the circular shape increases. Since there is also a deviation in the set position/angle of the wafer 30, it is difficult to accurately recognize the position of the suction start die 48, which is the first die to pick up from the many dies 31 of the wafer 30, only by image processing. is there.

Therefore, in this embodiment, before the die supply device 11 starts the die suction operation, the wafer image captured by the camera 42 is displayed on the screen of the display device 51, and the operator inputs a keyboard, a mouse, a touch panel, or the like. The apparatus 52 is operated to designate the suction start die 48 from the many dies 31 of the wafer image to teach the actual position of the suction start die 48 to the die supply device 11, and then the suction start die 48 The suction operation is started.

In this case, since the position of the suction start die 48 is determined in advance by the wafer mapping data indicating the information on the non-defective product or defective product of each die 31 of the wafer 30, the production job (production program), etc. When the suction start die 48 is specified from among many dies 31 of the wafer image displayed on the screen of the display device 51, the relative position relationship between the reference die 47 and the suction start die 48 is a predetermined relative position. It is necessary to specify the suction start die 48 so as to have a relationship.

Therefore, in this embodiment, the control unit 45 of the die supply device 11 is displayed on the screen of the display device 51 so that the operator can easily determine the relative position of each die 31 from the reference die 47. The relative position information indicating how many dies each of the dies 31 in the wafer image are separated from the reference die 47 in the vertical direction and the horizontal direction is measured and displayed on the screen of the display device 51 (FIG. 8). Further, in the present embodiment, as the display mode of the relative position information, the relative position information is overlapped and displayed on each die 31 arranged in at least one vertical row and one horizontal row of the wafer image displayed on the screen of the display device 51. ing.

In the display example of FIG. 8, the numbers such as “1”, “2”, and “3” of the relative position information displayed on each die 31 arranged in a row in the horizontal direction of the wafer image indicate that the column including the reference die 47 is 1. The numbers such as “6”, “7”, and “8” of the relative position information displayed on each die 31 arranged in one vertical column of the wafer image are used as a reference. The row in which the die 47 is included is the first row, and the row in which the die 47 is located is shown. Note that the display mode of the relative position information is not limited to the display example of FIG. 8, and the point is that each die 31 of the wafer image displayed on the screen of the display device 51 is vertically and horizontally from the reference die 47. The number of dies separated should be displayed in an easy-to-understand manner.

As shown in FIG. 8, if the relative position information is superimposed and displayed on each of the dies 31 arranged in a vertical line and a horizontal line of the wafer image displayed on the screen of the display device 51, the screen of the display device 51 is displayed. Relative position information can be displayed in an easy-to-understand manner on each die 31 arranged in a row and a row of the wafer image without narrowing the display space of the wafer image to be displayed. However, when the screen size of the display device 51 is large, the display space of the wafer image displayed on the screen of the display device 51 is narrowed by the display space of the relative position information, and the relative position information is displayed so as not to overlap the wafer image. It may be done.

As shown in FIG. 7, when only a part of the wafer 30 is captured within the field of view of the camera 42 for imaging, one of the reference die 47 and the suction start die 48 is added to the wafer image displayed on the screen of the display device 51. Sometimes only displayed. In such a case, the control unit 45 of the die supply device 11 changes the wafer image captured by the camera 42 when the camera 42 is moved from the imaging area including the reference die 47 to the imaging area including the suction start die 48. By recognizing the vertical and horizontal dicing grooves 36 that divide each die 31 by processing, the relative position information of each die 31 from the reference die 47 is measured along the vertical row and the horizontal row of each die 31. It is displayed on the screen of the display device 51. By doing so, even when the reference die 47 is not included in the wafer image displayed on the screen of the display device 51, the array distortion of the dies 31 due to the expansion of the dicing sheet 34 and the gap between the dies 31 (dicing The control unit 45 of the die supply device 11 accurately measures the relative position information of each die 31 from the reference die 47 without being influenced by the variation in the width of the groove 36), and the accurate information is displayed on the screen of the display device 51. Relative position information can be displayed.

It should be noted that the relative position information of each die 31 from the reference die 47 is acquired by recognizing the die 31 one by one in the vertical direction and the horizontal direction from the reference die 47 instead of recognizing the dicing groove 36. It may be done.

Further, since the relative position information of each die 31 from the reference die 47 is displayed on the screen of the display device 51, when the operator manually moves the camera 42 to the imaging area including the suction start die 48. However, the operator moves the camera 42 while checking the relative position information of each die 31 displayed on the screen of the display device 41 to easily move the camera 42 to the imaging area including the suction start die 48. be able to.

Further, the control unit 45 of the die supply device 11 may automatically move the camera 42 from the imaging area including the reference die 47 to the imaging area including the suction start die 48. Specifically, the controller 45 of the die supply device 11 acquires relative position information of the suction start die 48 from the reference die 47 from the wafer mapping data, the production job, etc., and the camera 42 includes the suction start die 48. When moving to the imaging area, the control unit 45 of the die supply device 11 moves the camera 42 to the imaging area including the suction start die 48 while confirming the measurement result of the relative position information of each die 31 from the reference die 47. It should be done. By doing so, even if the displacement of the suction start die 48 is large due to the distortion of the arrangement of the dies 31 due to the expansion of the dicing sheet 34 and the variation in the width of the gaps (dicing grooves 36) between the dies 31, the camera 42 is not. Can be reliably moved to the imaging area including the arrival start die 48 by automatic control.

In the present embodiment, the position of the wafer 30 (wafer pallet 32) is fixed and the camera 42 is moved to the imaging area including the suction start die 48. On the contrary, the position of the camera 42 is changed. The wafer 30 (wafer pallet 32) may be fixed and moved to an imaging area where the suction start die 48 is included in the field of view of the camera 42, or the camera 42 may be moved only in the X direction (or Y direction). By moving the wafer 30 (wafer pallet 32) only in the Y direction (or the X direction) to the imaging area in which the suction start die 48 is included in the field of view of the camera 42. ..

Further, instead of the reference die 47, a test die may be set as a reference die, and the point is that out of the many dies 31 of the wafer 30, the appearance such as the shape and the pattern is different from the other dies 31. It is only necessary to set a designated die from among the dies (dies that can be distinguished from other dies 31 by image processing) as the reference die.

The reference die such as the reference die 47 may be designated by the wafer mapping data or the production job.

Alternatively, the worker may specify the reference die from among the dies 31 having a different appearance from the other dies 31 of the wafer image displayed on the screen of the display device 51. By doing so, even if the position of the reference die is not specified in the wafer mapping data or the data of the production job in advance, the worker can specify the reference die on the screen of the display device 51 before starting the production. You can

When the wafer 30 is provided with a plurality of reference dies 47, the reference die 47 closest to the suction start die 48 is selected by the camera 42 from the plurality of reference dies 47 before the suction start die 48 is designated. An image is picked up and displayed on the screen of the display device 51, and the operator specifies the reference die 47 displayed on the screen of the display device 51 by operating the mouse of the input device 52 or the like, and sets this as the reference die. Good. The function of the control unit 45 to set the reference die according to the wafer mapping data, the production job, or the designation of the operator corresponds to the reference die setting unit in the claims.

According to the present embodiment described above, how many dies each of the dies 31 of the wafer image displayed on the screen of the display device 51 are separated from the reference die such as the reference die 47 in the vertical direction and the horizontal direction respectively. Since the relative position information shown is displayed on the screen of the display device 51 together with the wafer image, even when only one of the reference die such as the reference die 47 and the suction start die 48 is displayed on the screen of the display device 51, The operator merely sees the relative position information displayed on the screen of the display device 51, and separates each die 31 of the wafer image from the reference die such as the reference die 47 by the number of dies vertically and horizontally. You can easily know what is happening. This eliminates the need for the operator to count the number of dies existing from the reference die such as the reference die 47 to the suction start die 48, and simplifies the work of designating the suction start die 48 on the screen of the display device 51. At the same time, it is possible to prevent a human error such as an incorrect designation of the suction start die 48 due to an incorrect counting of the number of the dies 31.

Although the die supply device 11 of the present embodiment is configured such that the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY moving mechanism 25, the suction head 41 and the camera 42 are moved only in the X direction. In addition, the wafer pallet 32 is moved in the Y direction by the pallet drawing mechanism 26, so that the suction head 41 and the camera 42 are moved in the XY directions relative to the wafer 30, or The suction head 41 and the camera 42 may be fixed in position, and the wafer pallet 32 may be moved in the XY directions.

In addition, it goes without saying that the present invention can be implemented with various modifications within the scope not departing from the spirit of the present invention, such as the structure of the die supply device 11 and the structure of the wafer pallet 32 may be appropriately changed.

11... Die feeder, 23... Pallet pull-out table, 25... XY moving mechanism, 26... Pallet pull-out mechanism, 28... Push-up unit, 30... Wafer, 31... Die, 32... Wafer pallet, 34... Dicing sheet, 36... Dicing Groove, 37... Push-up pot, 39... Push-up pin, 41... Suction head, 42... Camera, 43... Suction nozzle, 45... Control unit (reference die setting unit), 47... Reference die (reference die), 48... Suction start Die, 51... Display device, 52... Input device

Claims (7)

A display device for displaying a wafer image in which at least a part of a wafer diced so as to be divided into a plurality of dies is captured by a camera, and an operator displays a screen of the display device before the die supply device starts a die suction operation Teach the suction start die to teach the actual position of the suction start die to the die supply device by designating the die to be sucked first (hereinafter referred to as “suction start die”) from the plurality of dies of the wafer image displayed on In the system,
A reference die setting unit that sets a die specified from among dies having a different appearance from other dies of the plurality of dies of the wafer as a reference die serving as a reference position,
The relative position information indicating how many dies each of the dies of the wafer image displayed on the screen of the display device are apart from the reference die in the vertical and horizontal directions is measured and displayed on the screen of the display device. A suction start die teaching system, comprising: 2. The suction start die teaching system according to claim 1, wherein the control unit superimposes and displays the relative position information on each of the dies arranged in at least one vertical column and one horizontal column of the wafer image displayed on the screen of the display device. .. The camera picks up and captures only a portion of the wafer within its field of view,
The positional relationship between the reference die and the suction start die is set such that one of them is within the visual field of the camera and the other is outside the visual field of the camera.
The controller, when moving either the camera or the wafer from the imaging area including the reference die to the imaging area including the suction start die, processes the wafer image captured by the camera to The vertical and horizontal dicing grooves that divide the die are recognized, and relative position information of each die from the reference die is measured along the vertical row and the horizontal row of each die and displayed on the screen of the display device. The suction start die teaching system according to claim 1 or 2. The camera picks up and captures only a portion of the wafer within its field of view,
The positional relationship between the reference die and the suction start die is set such that one of them is within the visual field of the camera and the other is outside the visual field of the camera.
The controller, when moving either the camera or the wafer from the imaging area including the reference die to the imaging area including the suction start die, processes the wafer image captured by the camera to One die is recognized in the vertical direction and one in the horizontal direction, and the relative position information of each die from the reference die is measured along the vertical row and the horizontal row of each die to display on the screen of the display device. 3. The suction start die teaching system according to claim 1, which is displayed. The control unit acquires relative position information of the suction start die from the reference die, and moves the camera or the wafer to an imaging area including the suction start die, when the reference die is used. 5. The suction start die teaching system according to claim 3, wherein one of the camera and the wafer is moved to an imaging area including the suction start die while confirming a measurement result of relative position information of each die from FIG. .. 6. The suction start die teaching system according to claim 1, wherein the reference die is designated by wafer mapping data indicating information on each die of the wafer or a production job. The suction start die teaching system according to claim 1, wherein the reference die is specified by an operator from a plurality of dies of a wafer image displayed on the screen of the display device.

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