JP6185492B2 - Individual component backward traceability and semiconductor device forward traceability - Google Patents

Description

  The present technology relates to the manufacture of semiconductor devices.

  The large growth in demand for portable consumer electronic devices is driving the demand for mass storage devices. Non-volatile semiconductor memory devices such as flash memory cards are widely used to meet the increasing demand for storage and exchange of digital information. Their portability, versatility, and rugged design, along with high reliability and large capacity, make such memory devices a wide variety of electronic devices including, for example, digital cameras, digital music players, video game consoles, PDAs, mobile phones. Ideal for the application of the device.

  FIG. 1 and FIG. 2 of the prior art respectively show a flowchart and a schematic diagram of steps in manufacturing a semiconductor device memory card. Given the number of parts assembled in a memory card and the size of the memory card manufactured in a semiconductor manufacturing plant, it is important to provide a methodology for tracking semiconductor devices during the memory card manufacturing process It is. 2. Description of the Related Art A manufacturing execution system (MES) that receives information in real time from a process tool to be managed and a person in charge of manufacturing and tracks manufacturing of a memory card to some extent is known. A manufacturing process database that is used to track the cause of a problem when a defect is found in one or more assembled semiconductor devices, where manufacturing personnel track semiconductor devices during the manufacturing process MES maintains a database of manufacturing processes that it enables. An example of a known MES platform is that of Camstar, Charlotte, North Carolina, USA. Camstar provides a MES platform named Camstar Manufacturing and a quality management system named Camstar Quality. Other known platforms for managing the flow in the semiconductor memory card factory include Tango production monitoring suite by CyberDaemons, Hsinchu, Taiwan, and Kinesis Software, PSG production line, PSG production line by PSG assembly line production) manager.

  Referring to prior art FIGS. 1 and 2, a memory die wafer lot 70 and a controller die lot 72 are received from a wafer member manufacturer within a memory card manufacturing plant. The wafer arrives with an integrated circuit fabricated thereon by a wafer member manufacturer. Thus, each memory die wafer member includes a plurality of memory dies, and each controller die wafer member includes a plurality of controller dies. In the embodiment shown in FIG. 2, a semiconductor device including a pair of memory dies is manufactured. Thus, two memory die wafer lots 70a and 70b are shown. It is also known to form a semiconductor device having one or more memory dies. The wafer lot 70a used for the lowermost memory die may be called a wafer mother lot. Also, the wafer lot used for the memory die above the bottom die may be referred to as a wafer sublot. The substrate lot 74 is also received from the substrate manufacturer within the memory card manufacturing plant. The substrate in the substrate lot 74 may be, for example, a printed circuit board (PCB), a lead frame, or a tape automated bonding (TAB) tape.

  In order to prepare wafer members in wafer lots 70 and 72 to be attached to substrates in substrate lot 74, each wafer member may have a protective tape affixed to its active surface (the surface containing the integrated circuit). Well, then in step 20, it is attached to a chuck (not shown) with the active side down. Thereafter, a back grinding step 22 may be performed on each wafer member to reduce the wafer to a desired thickness. After the back grinding step 22, the wafer member is transferred to another tool. Here, the wafer member is diced, for example with a saw or laser, in step 24 so that it may be picked up and placed on the substrate.

  In parallel with the die preparation process, passive components may be mounted on the substrate in the surface mounting process. In step 30, a solder paste may be applied. In step 32, passive components, also referred to herein as passives, may be attached and in step 34 the solder may be reflowed / cleaned. Passive may include, for example, a resistor and a capacitor.

  In step 42, the memory die and controller die may be attached to the substrate by die attach tool 76. Tool 76 utilizes a known good die (KGD) map 78 that defines good and bad dies for each wafer member. In particular, each die on each wafer member in wafer lots 70 and 72 is operational tested and rated as 0, 0 (complete product), A, A (good product), or 1, 1 (defective product). May be. The KGD map 78 is utilized by the die attach tool so that defective dies on the wafer member are ignored. In step 42, a memory die and typically a controller die are mounted on the substrate to form a semiconductor device. As used herein, the term “device” means an assembly consisting of a substrate, one or more semiconductor dies on the substrate, and possibly passive components on the substrate. Each die, substrate, and / or passive in the device may be referred to herein as an “individual component” of the semiconductor device.

  Following die and passive attachment on the substrate, the attached device may be wire bonded in step 48. The wire bonding process 48 is a time-consuming process. Therefore, the device assembly lot may be divided into a plurality of device assembly sub-lots so that wire bonding is performed simultaneously by the plurality of wire bonding tools 80. (The number of wire bonding tools in FIG. 2 is only an example). In the wire bonding step 48, each die bond pad of the die attached to the substrate may be electrically connected to a conductor pad on the substrate.

  Following the wire bond step 48, the devices in each device assembly sublot are encapsulated in the molding material with one or more tools 82 (step 50) and the identifier is laser marked with one or more tools 84 ( Step 54) may then be singulated with one or more tools 86 (Step 56). FIG. 2 shows the device assembly sub-lot that remains separated through these steps. However, one or more device assembly sub-lots may be reassembled into device assembly lots by any of steps 48-56.

  The laser marking process 54 may be considered important in that it allows information related to equipment assembly lots or sublots to be uploaded and tracked by the MES platform that manages the flow within the card manufacturing plant. Prior art FIG. 3 shows an example of a conventional laser mark placed on a device in a device assembly lot or sub-lot. The laser mark may include a logo and alphanumeric characters, for example. Alphanumeric characters are the factory code that identifies where the semiconductor device was manufactured, the date code that indicates when the semiconductor device was made, the MES lot or sublot number assigned to each device assembly lot or sublot, and the device And a device ID code for identifying the type of the semiconductor package. Information from the laser mark of the device assembly lot or sub-lot is assigned and stored by the MES and used for device tracking and traceability.

  Conventional MES platforms that use this methodology have several limitations. First, the MES platform does not uniquely identify a particular device. At best, the MES assembly sublot number is to some extent unique to the entire equipment assembly sublot through a specific set of tools. Each specific device in such a MES assembly sublot will have the same identification code on its surface and will be identified by the same identification code stored in the MES platform. Second, because of the generic marking of the entire assembly sublot, there is no specific individual part information directly associated with a specific device. That is, there is no direct link between the device identification code and the semiconductor die, substrate and / or passive component used in the device.

  As a result, conventional systems have a limited ability to find the cause of a problem if a problem associated with the device is detected during or after manufacture. When a problem associated with the device occurs, the prior art system can identify the MES assembly sublot from which the problem device originates. From the information of the MES assembly sub-lot, it is possible to determine which process the problem apparatus has passed. From this, further investigation may reveal the specific wafer lot and reveal where the problem occurred. However, such surveys are time consuming. Also, no specific identifiers or information regarding the individual parts on which the semiconductor device is formed is provided.

  Referring again to the flowchart of FIG. 1 and the schematic diagram of FIG. 2, after singulation, the semiconductor device 90 may be inspected (step 60), and then one or more tests may be performed in step 62. These tests may include, for example, burn-in and memory read / write tests at high and low temperatures. Usually, a plurality of semiconductor devices 90 obtained from a large number of device assembly lots are combined in a test process. It is known to perform tests on 30,000 to 50,000 devices 90 obtained from a plurality of device assembly lots. Device assembly lots are integrated into a single device test lot at N: 1. Here, N may be, for example, 25 device assembly lots.

  The devices from each assembly lot are re-mixed into different bins depending on how the devices operated in the test operation. In one example, the device is divided into seven bins (1-7). And the apparatus classified into the bins 1-4 is sent to the card | curd test described below noting that test operation is fully passed. Devices classified as bins 5-7 fail the test operation for some reason and are subjected to a regeneration step 64 that is retested. The regeneration operation will vary depending on whether the device is classified into bin 5, bin 6 or bin 7. A plurality of regeneration steps may be performed in one apparatus. If after one or more regeneration steps it is found that the device is fully operational, it may be reclassified into one of bins 1-4 and sent to the card test.

  The card test in step 66 may be similar to the memory test in step 62, but the contents may be written to each device and tested for its capabilities. Although not shown in FIG. 2, the card test may have a similar binning operation, and the devices classified into several bins are retested in the regeneration operation at step 68. A device 90 that passes the card test is subjected to several final inspection and processing steps (not shown) and then shipped.

  In some semiconductor memory card manufacturing factories, the assembly process from attaching the die to the substrate until the device is singulated is called the “54-81” process. The memory test is referred to as the “54-62” process. The card test is called the “54-99” process. Considering the integration and mixing of equipment 90 from a wide variety of assembly lots in "54-62" to test lots in "54-81" and remixing of equipment in card lots in "54-99" It is difficult and time consuming, if possible, to track devices identified as problematic in the memory or card testing phase. This is partly due to the fact that the memory device is not marked with a unique ID, so there is no record of how a particular semiconductor device operated in the test operation.

  In summary, one embodiment of the present technology relates to a system for tracking semiconductor packages. The system includes a semiconductor device having a substrate and one or more semiconductor dies mounted on the substrate. The system further includes an identifier associated with the semiconductor device that uniquely distinguishes the semiconductor device from all other semiconductor devices.

It is a flowchart of a prior art which shows the manufacturing process of a semiconductor device memory card. It is the schematic of the prior art of the assembly process of a semiconductor device memory card. It is an illustration of the prior art of a semiconductor device including MES marking. 2 is a flowchart of an embodiment of the present technology for processing a substrate strip. 2 is a flowchart of an embodiment of the present technology for processing a semiconductor wafer member. 2 is a flowchart of an embodiment of the present technology for forming a semiconductor device. 6 is an illustration of a substrate including markings according to embodiments of the present technology. FIG. 4 is an illustration of a KGD map used in some embodiments of the present technology. 4 is an illustration of a semiconductor device including a unique identifier. It is a table | surface containing the information regarding the semiconductor device by the embodiment of this art and its individual parts. 2 is a flowchart of an embodiment of the present technology for testing a semiconductor device. 5 is a table including information on a semiconductor device and its process according to an embodiment of the present technology. FIG. 2 is a block diagram of a sample server for implementing aspects of the present technology.

  The embodiment will be described with reference to FIGS. FIGS. 4-13 enable backward tracking from a semiconductor device manufacturing process to a single semiconductor die or other individual part, and forward tracking of individual devices and parts through memory and card testing. FIG. 2 is a diagram of a system that enables. It should be understood that the technology may be implemented in a variety of forms and that the technology should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the invention to those skilled in the art. Indeed, the system is intended to cover alternatives, modifications, and equivalents of these embodiments that fall within the scope and spirit of the system as defined by the appended claims.

  Typically, the technology uniquely identifies each semiconductor device and provides an association between the uniquely identified semiconductor device and the individual components (die, substrate, and / or passive) used in the device. A methodology that provides forward and backward traceability. The unique identifier and marking of the semiconductor device allows the semiconductor device and the individual components within the device to be tracked from the device through each step and test in memory card manufacturing.

  Information about the semiconductor device, including the unique ID of the semiconductor device and a specific component identifier, is stored in a database referred to herein as a MES database. In the following description, the MES database stores forward and backward traceability data in addition to other MES data. However, it should be understood that the storage of data relating to card manufacturing may be allocated across two or more databases in a wide variety of ways. In such an example shown in the block diagram of FIG. 13, there are two databases. A traceability database 306a for storing forward and backward traceability data, generated as described below. An individual MES database 306b for storing other MES related data. In the following description, in most cases, reference will be made to a single MES database that stores forward and backward traceability data as well as other MES data.

  Next, an embodiment of the present technology will be described with reference to the flowcharts of FIGS. In some embodiments, information regarding individual components (substrate, semiconductor die, and / or passive components) may be stored in a MES database prior to assembly into a semiconductor device. As described below, when an individual part is assembled into a semiconductor device, this information for the individual part may be associated with the device in the MES database. However, prior to this association, information regarding individual components may be identified and stored.

  The manufacturing process may begin by defining a work order for manufacturing a given number and type of memory card. This may be done days or weeks before actual production begins. Each memory card is made of a specific type of substrate, memory die, controller die, and other individual components. When a work order is defined, the individual parts that will be used for the work order are also identified and stored in the MES database. When individual parts such as a substrate lot and a wafer lot are received in the manufacturing factory, these individual parts are marked by information such as a part manufacturer, a manufacturing date and place, a lot number assigned to the part lot, and the like. When an individual part is received (or at some point before being used in the work order), this information is scanned and uploaded to the MES database. Therefore, when a work order is defined, a specific lot number of an individual part to be used for the work order is also specified.

  When a work order begins, the substrate lot is scanned in step 100 to verify that the substrate lot is an appropriate substrate lot for the work order. Next, individual substrate strips from the substrate lot may be processed. It should be understood that various substrates (eg, PCBs, lead frames, and / or TAB tapes) can be used with the present technology. The example of FIG. 7 shows a strip 200 of a lead frame substrate 204 (one of which is marked in FIG. 7). Although any of a variety of substrates may be used, the strip 200 shown in FIG. 7 is, for example, a micro SD memory card having 80 substrates 204 in a 4 × 20 array. The illustrated strip 200 is an example, and the strip 200 may be provided in other shapes, sizes, and configurations. Although substrate strips are described below, it should be understood that individual substrates may be other substrates, and individual substrates may be formed of a panel, roll, or other grouping of substrates.

  In step 102, each strip 200 (or other group of substrates 204) may be laser marked with its substrate lot number and a specific ID that is unique to the strip 200. In some embodiments, the MES system includes a control program that receives data and feedback from various tools and parts in the card manufacturing plant and stores the information in the MES database. Two elements that provide data and feedback to the MES control program are the laser mark station 318 (FIG. 13) and the scanner 320.

  In step 102, a laser mark station 318 associated with substrate processing may generate a unique ID and assign it to each substrate strip 200. As an example, the laser mark station may assign a continuous strip identifier when a continuous continuous substrate strip 200 is being processed. Next, the laser mark station 318 laser marks each substrate with a known substrate lot number and the generated substrate strip ID. It should be understood that the unique strip identifier for each substrate strip 200 may be generated by another component in the MES system. The component may then convey the unique substrate strip ID to a laser mark station that marks each substrate strip 200 with a substrate lot and a substrate strip identifier.

  Each instance of the substrate strip 200 includes a laser mark 202 that includes a substrate lot number (generic for all strips in the substrate lot) and a unique substrate strip identifier for the particular strip. You may go out. FIG. 7 shows the substrate lot number and the unique strip identifier as a pair of two-digit alphanumeric characters. It is understood that the substrate lot number and / or the unique strip identifier may be represented in more embodiments with more digits than shown in FIG. 7 or in a different manner. I want to be.

  In a non-limiting example, each digit of the two-digit alphanumeric identifier (of the substrate lot number and / or unique strip identifier) may have 33 possible values. The 33 possible values are 10 numerical values (0-9) and 23 alphabetic characters (excluding characters B, O, I, which may be confused with 8, 0, 1 and AZ) Derived from. Thus, each digit may be any of the 33 possible characters. Thus, a two-digit number may represent 33 × 33 = 1089 possible unique identifiers for a substrate sublot and 1089 possible unique strip identifiers for each substrate sublot. It should be understood that in another embodiment, each digit of a two-digit number may have more than 33 possible values and may have fewer than 33 possible values.

  The laser mark 202 may further include a machine readable code having a substrate lot number and unique strip identifier information in a form readable by a computer scanner. The machine readable code shown in FIG. 7 is a two-dimensional matrix code. However, the computer readable code may be a one-dimensional barcode or any other marking that allows the substrate lot number and the unique strip identifier to be encoded in a manner that is understandable by the computer device. Please understand that it is good. In some embodiments, the computer may be able to read alphanumeric text. In such an embodiment, matrix codes or other codes added to the text may be omitted.

  The marking in step 102 may be performed by a laser or may be performed by other known printing processes. Instead of marking, an adhesive label including the above information may be attached to each substrate strip 200. In FIG. 7, a laser mark 202 is shown in the left corner of the substrate strip 200. It should be appreciated that in other embodiments, the laser mark 202 may be provided elsewhere on the substrate strip 200.

  In step 104, the laser mark station 318 that generated the unique strip ID may upload the unique ID assigned to each substrate strip to the MES database. With the known substrate lot number and the received unique strip ID, a separate record may be generated in the MES database for each substrate strip 200. Each record may include a substrate lot, substrate lot history, unique strip ID, and unique substrate ID for each substrate on the strip 200. As described above, when a board lot enters the card manufacturing factory for the first time, not only the history of the lot but also the ID of the lot may be scanned and uploaded to the MES database. The substrate lot history may include information such as who manufactured the substrate lot and when and where the substrate lot was manufactured. In another embodiment, the history information may include other information. The substrate lot ID and history may be uploaded to the MES database, for example, when a substrate lot is selected for use, except when it is received within the card manufacturing plant.

  As already mentioned, in addition to storing the strip ID of each substrate strip 200, step 104 further includes storing a unique ID for each instance of the substrate 204 on the strip 200. Since the type of substrate used in the work order is known, the control program of the MES system or other aspects of the MES system can identify several substrates that identify individual substrates based on the location of the substrate on the substrate strip 200. By using a predefined notation, a unique ID for each substrate 204 on the strip 200 may be generated.

  For example, regarding the 80 substrates 204 shown on the strip 200 of FIG. 7, the MES control program assigns letters A to D starting from the bottom row to rows and 1 to 20 starting from the left side to columns. You may adopt the notation of being assigned to. Thus, the substrate in row 2 column 4 may be identified as B-4. As an alternative, for example, the first row from the bottom row is a number 1-20, and the second row from the bottom row is 21-40, etc. . It should be understood that in other embodiments, each substrate may be assigned a unique identifier according to other notations. Further, as described above, in other examples, different substrate strips may have different shapes and numbers of substrates.

  In step 106, the substrate strip 200 may be processed (including, for example, soldering, cleaning, inspection) prior to connection of passive components. In step 108, the MES control program may store any such processing steps associated with the substrate strip 200 and / or a particular substrate 204 in a MES database. Additional information regarding these processes (e.g., when and where these processes were performed, the specific tools used, maintenance records for the tools and / or manufacturing personnel associated with the processes) may also be strip 200 and / or specific. It may be stored in association with the substrate 204.

  At the same time or at different times, similar identification, storage, and processing of wafer members used in the manufacture of semiconductor devices may be performed. As described in the Background section, a separate wafer lot may be used for each die in the die stack that is attached to the semiconductor device. In step 110, each wafer member in each wafer lot may be identified. In some embodiments, the unique ID may be marked on each wafer member by a wafer manufacturer or in a card manufacturing plant. For example, a marking process may be used as described above with respect to the substrate strip. In another embodiment, instead of marking each wafer member, the wafer member is uniquely identified by its vertical position relative to other wafer members in the wafer sublot (eg, the ninth wafer member from the top of the sublot). May be identified.

  In step 112, a record including the wafer sublot, wafer lot history, wafer member ID of each wafer member in the sublot, and die ID of each die on the wafer member is generated in the MES database for each die on the wafer. May be. This occurs for each wafer sublot used in the device manufacturing process including one or more memory die wafer sublots or mother lots and controller die wafer lots. In some embodiments, as described above, when a wafer lot first enters the card manufacturing plant, not only its history but also the lot's MES wafer lot ID may be scanned and uploaded to the MES database. . The wafer lot history may include information such as who manufactured the wafer lot and when and where it was manufactured. In another embodiment, the history information may include other information. The MES wafer lot ID and history may be uploaded to the MES database, for example, when a wafer sublot is selected for use, except when received within a card manufacturing plant.

Step 112 further includes storing a wafer member ID and a die ID. As described in step 110, the MES control program identifies each wafer member, either by a unique ID or by the position of the wafer member within the identified wafer sublot. The MES control program may also store the wafer member identifier when the wafer member identifier is generated. With respect to identification of specific dies on the wafer member, the MES control program stores these by using a predefined notation that describes the position of all dies on the wafer member in (x, y) coordinate notation. May be. Polar coordinates (r, θ ) may alternatively be used to define the position of the die on the wafer member. Other methods of identifying a particular die on the wafer member are also conceivable, including a method by position on the wafer member and a method by a unique ID assigned to each die on the wafer member.

  In step 114, the wafer member may be processed (including backside grinding, dicing, inspection, cleaning, etc.). In step 116, any such processing steps may be stored in the MES database associated with the wafer member and / or dies on the wafer member by the MES control program. Additional information about these processes (for example, information including when and where the process was performed, one or more specific tools used, tool maintenance records, and / or manufacturing personnel associated with the process) May be stored in association with the wafer member and / or dies on the wafer member.

  The embodiments described above with respect to FIGS. 4 and 5 make it possible to obtain the highest resolution with respect to the back traceability of the individual components used in the semiconductor device, as will be described below. In other embodiments where the highest resolution is not required, one or more of the individual part identification and storage steps described above may be omitted. In addition, at least some of the steps described above with respect to FIGS. 4 and 5 may occur within the manufacturing process, such as when individual components are assembled together in a semiconductor device, as described below with respect to the flowchart of FIG. It may be done in the second half.

  In step 120, the next substrate 204 to accommodate the passive and die is selected on the strip 200. If not already done, the MES control program stores the substrate lot number, strip ID, and position of this substrate 204 in the MES database. At step 122, a unique identifier for each passive component that is mounted on the selected substrate 204 may be associated with the selected substrate 204 and stored in the MES database. Passives (eg, resistors and / or capacitors, etc.) may have their own unique identifier. The unique identifier that the passive has is scanned or entered by the manufacturer to be associated with the substrate 204 to which the passive is attached and captured in the MES database. The passive components may then be surface mounted and reflowed on the selected substrate 204 at step 124.

  In step 126, a die for mounting on the substrate 204 is selected based on the KGD map. A diagram representing a KGD map for one wafer member in the MES wafer sublot is shown in FIG. As already mentioned, the semiconductor device may include a different number of semiconductor dies, and there may be a separate wafer sublot used for each die mounted in a die stack on the substrate 204. Thus, if there are, for example, 2, 4, or 8 memory dies mounted on the substrate 204, there may be 2, 4, or 8 MES wafer sublots that feed the die to the substrate, respectively. There may be a KGD map for each wafer member within each MES wafer sublot. This KGD map is provided by the wafer member manufacturer based on tests performed by the wafer member manufacturer.

  FIG. 8 shows an example of a wafer member 206 having a plurality of semiconductor dies 208 (one of which is numbered in FIG. 8). Die excellence may be displayed in the KGD map by an alphanumeric code associated with each die 208 on the wafer member 206. In this example, 0,0 may represent a die with no detected defects; A, A may be non-defective dies with minimal defects; 1,1 is for mounting on any substrate 204 It may represent a defective die that must not be selected. It should be understood that any of a variety of other schemes may be used in the KGD map to represent the excellence of the dies on a particular wafer member 204.

  In step 126, dies selected from wafer members in different MES wafer lots may be selected based on a plurality of different criteria. In one embodiment, a complete die (0,0) may be initially selected from a plurality of wafer members in each MES wafer sublot and mounted together on the substrate 204. A substrate with only perfect dies is likely to be the highest quality semiconductor device. As described below, one aspect of the present technology allows identification and isolation of a semiconductor device having the highest quality semiconductor die. These devices may be shipped to OEM manufacturers or other manufacturers at a premium price. By selecting only perfect dies for mounting in a single semiconductor device, the likelihood of the device being of the highest quality can be optimized. If the perfect die from one or more wafer members in each sublot is used up, the next best die (A, A) may be used. It will be appreciated that the die selected for mounting in a given semiconductor device may be selected based on a wide variety of other criteria in other embodiments.

  In step 128, the MES wafer sublot, wafer member ID, and die position selected on the wafer member may be stored in association with the substrate 204 to which the selected die is attached. This may be done for each of the dies from different sublots that are mounted on the substrate. After all the dies to be mounted on a given substrate are identified at step 128 and stored in association with the substrate, the dies may be mounted on the substrate at step 130. The order of steps 128 and 130 may be reversed in another embodiment. The die may be attached to the substrate, for example, via a known die attach adhesive or via a eutectic die bonding process.

  When the die and / or passive is mounted on the substrate, the assembly member may be considered a semiconductor device (although another processing step is performed before becoming a complete package, as described below). At this point, a unique device ID can be assigned to each semiconductor device. However, as will be described below, as another method, the unique device ID may be assigned after the process, for example, in connection with the laser mark process 142.

  In step 136, a wire bonding step may be performed on the semiconductor device formed on the substrate. In the wire bonding step, the die bonding pads on each device semiconductor die 208 are wire bonded to the contact pads formed on the substrate 204. As already mentioned in the background section, this process is relatively time consuming. For this reason, the MES assembly lot may be subdivided into MES assembly sublots. Information for each device may be updated in the MES database to reflect the specific assembly sublot and the process tool to which each device is transferred.

  Following the wire bonding step 136, the devices in each assembly sub-lot are encapsulated in the molding material at step 138, assigned a unique device ID at step 140, and laser marked with an identifier at step 142 (step 140 and 142 will be described in more detail below), and may be singulated into individual semiconductor devices at step 144 and inspected at step 148. As discussed in the background section, each sub-lot may remain separated in steps 138, 140, 142, 144 and / or 148. Alternatively, in one of these steps, one or several of the assembly sublots may be recombined, or all assembly sublots may be recombined to the original assembly lot.

  Both the step 140 of assigning a unique device ID to each device and the step 142 of laser marking the unique device ID on the device may be performed by a laser mark station 318 associated with the device marking. FIG. 9 shows a top view of the semiconductor device 210 after encapsulation, singulation, and laser marking. The laser mark may include a logo 212 and an alphanumeric display 214 of a unique ID associated with the device. The logo 212 may be omitted in some embodiments. The unique ID display 214 of the device may have a format of “YWDMMLXXX”. Here, Y represents the last digit of the year. WW represents the week number (#) within the year. D represents the day of the week (1-7). M represents a card manufacturing factory. LL represents an alphanumeric two-digit ID for designating each MES assembly sub-lot. XXX represents a three-digit alphanumeric unique ID for distinguishing each device made with the same date, location, and MES assembly sub-lot information.

  The first seven digits in the unique ID display 214 are known by the MES system for each device. The last three digits may be generated and assigned by the laser mark station, for example, as the laser mark station marks each device. As an example, the laser mark station may be assigned a continuous device identifier as the device 210 is processed continuously. Next, the unique 10-digit ID may be stored in the MES database by the MES control program as a means of uniquely identifying the particular device 210 in the database. It should be understood that instead of the last three digits generated by the laser mark station, a unique device identifier for each device 210 may be generated by another element in the MES system. The element may then send a unique device ID to a laser mark station that marks each device 210 with a 10 digit device identifier.

  There are more than three digits at the end of the unique ID display 214 depending on how many digits are needed to uniquely identify the date, location, and MES assembly sub-lot for each device. Or there may be fewer digits. In a non-limiting example, any digit (eg, sublot number LL and assigned digit XXX) may have 33 possible values as described above (10 numeric values and 23 alphabetic characters). (A to Z except English letters B, O, and I)). Thus, for example, sub-lot number LL can uniquely identify any of 1089 sub-lots, and the assigned 3-digit code can be any of approximately 36,000 devices in a given sub-lot. Can be uniquely identified. It will be appreciated that in another embodiment, each given digit may represent more or less values. It is further noted that additional or alternative information may be included in the unique ID display 214 in another embodiment, provided that the display uniquely identifies the semiconductor device 210 having the representation. It will be understood. For example, it will be appreciated that date information may be represented in different ways in display 214.

  The marking further includes a code 218 having the same information as the alphanumeric display 214 in a machine readable form. The machine readable code 218 may be a two-dimensional matrix code. However, it should be understood that the computer readable code may be a one-dimensional barcode or any other marking in which the unique device ID is encoded in a manner understandable to the computer device. In some embodiments where the computer can read alphanumeric text, a separate matrix code or other code added to the text may be omitted.

Logo 212, display 214, and / or code 218 may be formed by a laser or other known printing process. Instead of marking, an adhesive label including the above information may be attached to each semiconductor device 210. The locations of the logo 212, the display 214, and the code 218 shown in FIG. 9 are examples, and each location may be moved to a different location. One or more of logo 212, display 214, and code 218 may be located on the back side of semiconductor device 210 in another embodiment.

  While it is useful to provide both an alphanumeric display 214 and code 218 on the surface of the device 210, it will be appreciated that in other embodiments either of these may be omitted. As noted above, code 218 may be omitted if the computing device can read and understand the alphanumeric display. Although more time consuming, the code 218 may alternatively be omitted and the manufacturer may enter an alphanumeric display via a keyboard or other input device associated with the MES control program. it can. Similarly, it may be helpful to allow a person to read the alphanumeric display 214, but the alphanumeric display 214 may be omitted if the person can identify the unique ID when the code 218 is scanned.

  After the 3-digit code XXX has been assigned to the device by the laser mark station, the laser mark station can then upload the 3-digit code so that the MES system can have a unique 10-digit identifier for each device. Good. A unique 10 digit identifier may then be stored in the MES database so that a unique identifier for each particular device can be assigned in the process.

Referring to FIG. 10, the MES database may have a table 220 that has all of the data needed for backtrackability of all relevant information about all processed devices. This information may include, for example, specific individual components included in each device (as opposed to wafer lots, substrate lots or passive component lots). As shown in FIG. 10, the MES database may store the device's unique ID along with the following information associated with the unique device ID.
-MES assembly sub-lot to which the device belongs,
The substrate lot number, strip ID, position on the identified strip,
The MES wafer sub-lot number, wafer member ID, die position on the wafer member for the first die,
The MES wafer sublot number, wafer member ID, die position on the wafer member,. . .
The MES wafer sublot number, wafer member ID, and die position on the wafer member for the nth die n (in the n-die stack).
In the embodiment of FIG. 10, specific information regarding passive components is not shown in table 220, but this information may be included in other embodiments.

Because of the association between a particular individual component (die, substrate, and / or passive) and a particular unique device ID, all of the above stored information about the individual component is associated with a particular semiconductor device by that unique device ID. May be. As described above, a lot of information regarding individual parts is generated and stored prior to the time when the individual parts are assembled into the semiconductor device. Once the unique device ID of the semiconductor device is generated, all of the stored information of the individual components in the device may be associated with the unique device ID in the MES database. Thus, for example, by using the device's unique ID, the following information can be quickly and easily accessed from the MES database.
-Regarding semiconductor dies (memory and controller) used in equipment:
○ Manufacturer;
○ When and where it was manufactured;
○ When it was received at the equipment manufacturing factory;
O When and where and who performed back grinding, dicing, and other processing steps (during or after being part of the wafer component);
○ Where was the die located on the wafer (as described above).
-Regarding the substrates used in the equipment:
○ Manufacturer;
○ When and where it was manufactured;
○ When it was received at the equipment manufacturing factory;
O When and where and who performed surface mounting and other processing steps (during or after it was still part of the strip);
○ Where was the substrate located on the strip (as above).
• For passives used in equipment:
○ Manufacturer;
○ When and where it was manufactured;
○ When it was received at the equipment manufacturing factory;
○ When and who performed the surface mounting and other processing steps.

  The above information about the individual parts may be stored with the information shown in FIG. 10 or may be cross-referenced in the MES database having the information shown in FIG. With this information, the MES database can provide full back traceability for all of the individual components within a given semiconductor device. This information may be accessed by knowing the unique ID of the device, correctly printed on the device (in both human readable and machine readable formats), as described above. The information shown in FIG. 10 and described above is not intended as a comprehensive list of information that may be stored in the MES database regarding the semiconductor device and its individual components. In another embodiment, additional and / or alternative information may also be stored in association with the unique device ID.

  In addition to backward traceability, uniquely identifying each device 210 also allows forward traceability. Each process tool (or an operator associated with each such process tool) may have a scanner 320 that communicates with the MES control program. The scanner in a given tool scans the matrix code 218 of the device 210 and the MES control program updates the MES database to indicate that the device 210 is undergoing processing or testing in that tool. The scanner may scan one device 210 at a time, or it may scan multiple devices 210 codes 218 at a time.

  When a device is scanned in a given process tool (manufacturing or testing), the MES control program may record not only information about the processing step but also the processing step in association with the unique ID number of the device. The record information may include various other information such as the date and time when the apparatus has undergone processing, the worker associated with the tool performing the process, and the maintenance record of the process tool. Thus, a unique device ID, coupled with scanning that ID for every process that the device undergoes, provides full forward traceability of the device 210 as the device 210 passes through the manufacturing and testing process. To do.

  Referring to FIG. 11, after device 210 singulation and marking, device 210 may undergo a memory test and a card test. For memory testing, some assembly sub-lots can be recombined into a larger test lot with N: 1 integration for efficient testing and instrument utilization. As an example, 25 assembled sub-lots may be combined into a single test lot. (In another example, there can be more assembly sublots or fewer assembly sublots). In step 150, the integrated test lot may undergo a memory test. The memory test may include multiple read / write operations (possibly at high and low temperatures) for each device 210 in the test lot. The memory test at step 150 may include other or alternative tests, such as burn-in, for example.

  As described in the background section, the memory test 150 bins the semiconductor devices in the test lot and physically separates the semiconductor devices into different bins. In one example, there may be seven bins, devices in bins 1-4 may pass the test operation sufficiently, and devices in bins 5-7 may be considered not to pass. The seven-bin embodiment with passed bins 1-4 and bins 5-7 that require retesting is only an example. Various other binning and classification may be used so that devices that perform satisfactorily in memory tests are distinguished from devices that do not perform satisfactorily.

  When any device arrives at bins 5-7 in step 156, the device ID is scanned in step 158 and the device's record in the MES database is still in a different logical partition (although it is still in the MES database, a different one Moved into a set of stored records). Accordingly, the devices are broadly classified into two by the steps 156, 158, 160 of identifying the defective device and moving the defective device record to a new location. The database record of the device that passed the memory test remains unchanged in the database. These devices are referred to herein as prime test sublots and are carried to card testing as described below.

  On the other hand, the device records arriving at bins 5, 6, and 7 are scanned to record those bins and the device records are moved to locations in the new database. Other information including, for example, date and time, test personnel, etc. is also stored in the new location with the record. An individual device record may be identified by its unique ID number, as described above. Separation into locations in different databases can easily reveal which devices worked well and which devices did not work well in the memory testing process.

  In step 162, the devices that finally arrived in bins 5-7 may be regenerated, and these are retested in step 150. As indicated in the background section, the type of retest may depend on which bin the device has been classified into. After retesting, the device is binned again and defective devices are scanned. The database records for those devices that failed to bin twice may be moved again to a new database location. With this system, the MES database will have a clear record of how a given device operated in the test process 150. If a device fails multiple times, each instance and the resulting binning will be stored in association with that device. In this system, the MES control program can provide a wide variety of real-time data. In one aspect, the MES control program may indicate when a device has failed the test process 150 a predetermined number of times and at what event the device has been removed from further testing.

  In the system of steps 150-162, only the devices that failed the test are scanned. This provides an advantage in that it is not necessary to scan a passed device (usually considered to be a very large number of devices). However, in another embodiment, all devices may be scanned after testing and information regarding their binning may also be added to the database. In some embodiments, instead of excluding defective device records, all records may be left in their original locations in the database, but the records are updated to reflect the test results. Here again, only the defective device may be scanned and its record updated, or all devices may be scanned and its record updated.

  With respect to devices 210 (bins 1-4) that have passed test step 150, these devices may be coupled to a card test lot for card testing in step 166. The card test process may be similar to the memory test process, but additional or different tests may be performed, such as examining how the device 210 processes the downloaded content. In step 166, devices 210 undergo a card test, and then in step 168, these devices are binned depending on how they operated. This binning may be the same as the memory test process or by a different procedure. The defective device may be scanned at step 170, and then at step 174, the record is moved to a new database location along with the binning information. These devices may be regenerated at step 178 and the process is repeated. Each time the device 210 undergoes playback, the recording along with the playback information may be moved to a new location if it fails.

  Devices 210 that pass the card test may be final labeled or processed at step 176. At this point, the device 210 is a completed semiconductor package ready for shipment. One aspect of the present technology allows identification of the best device. That is, given the traceability of each device and storage of information about the device, the MES control program can, for example, have a device with only a perfect semiconductor die (0,0 on the KGD map) and / or any playback. It is possible to identify a device that has passed the memory test and the card test. These devices may be separated at step 180 for sale to customers who require higher performance. The remaining high quality equipment may be sold elsewhere. Similarly, devices that pass the memory test and / or card test after several plays may be separated and sold, for example, at a lower price. Separation process 180 may be omitted in other embodiments.

  FIG. 12 shows a table 220 that further includes a record of all process tools passed by the semiconductor device and all test procedures passed by the semiconductor device. (Table 220 may also include all of the individual part information shown in table 220 of FIG. 9, omitted from FIG. 12 for clarity). Table 220 may further include a record of each playback process that the semiconductor device has passed during the test operation. As mentioned above, the table 220 of FIG. 12 is shown by way of example, and in other embodiments may include additional or different information.

  The system provides full forward and backward traceability of the semiconductor device and its individual components as the semiconductor device passes through multiple manufacturing steps. The system also provides this traceability in real time. Such a system provides better resolution than what was possible with traditional tracking and traceability systems. As discussed in the Background section, conventional traceability systems do not have a unique ID associated with each device, and the specific individual components (die, substrate, and / or passive) used in the device. ) And did not have the ability to track. As a result, if a problem with the device is detected after manufacture, the conventional system has limited ability to find the problem. Since the prior art system made it possible to identify the MES assembly lot, it could be determined from this MES assembly lot which process was applied to a given device. From this, further investigations revealed the wafer lot, and in some cases, where the problem occurred. However, such investigations were time consuming and did not provide any specific identification and information regarding the individual components that make up the semiconductor device.

  These problems are solved in the present system. If a problem with the device is detected, a query against the MES database will not only identify, process, and information about the particular die, substrate and / or passive used, but all steps performed on the device. It can be revealed instantly. This not only makes it easier to identify the cause of the problem, but can also quickly identify the trend of the problem. By analyzing a small number of problematic devices, their common factors can be quickly and easily identified, regardless of device level or individual component level. For example, sampling of problematic devices reveals that each problematic device was made using a semiconductor die from a specific wafer sub-lot or lot delivered from a specific wafer manufacturer. obtain. Even when it occurs at the individual component level, it has made significant progress over conventional MES platforms because it has the ability to pinpoint the cause of the problem.

  Furthermore, tracking is possible in real time, so that as soon as a problem is discovered, the cause of the problem can be identified and improved without wasting additional resources. For example, if a problem in sampling a semiconductor device during memory or card testing is identified as a problem with a particular wafer lot or multiple lots, it will stop production during operation and additional dies from the offending wafer One or more problematic lots can be removed from the process before being incorporated into the process.

  Although the system has been described in the context of a non-volatile memory package such as a memory card, the methodology described herein can be used for full forward and backward traceability in other semiconductor package technologies. Please understand that.

  The MES control program and the MES database may be part of the MES server 300, and an example thereof will be described with reference to FIG. The components of the MES server 300 include, but are not limited to, a system that connects the processor 302, system memory 304, traceability database 306a, MES database 306b, various system interfaces, and various system components. A bus 308 may be included. As described above, the traceability database 306a and the MES database 306b may be combined into a single database or distributed across multiple databases. The system bus 308 is any of several types of bus structures including a memory bus or memory controller, a peripheral bus, and a local bus using any of a variety of bus architectures. It's okay.

  The system memory 304 includes computer storage media in the form of volatile and / or nonvolatile memory such as ROM 310 and RAM 312. The RAM 312 may include an operating system 313 of the MES server 300 and a plurality of program modules of the MES software platform 314. One of these program modules may be the MES control program described above. The MES control program may be that part of the MES platform that causes the various components of the MES server 300 to read data regarding the semiconductor device 210 and the individual components of the semiconductor device 210. The MES control program may further be involved in generating the identifier as described above. The MES control program may have other responsibilities.

  Each of the traceability database 306a and the MES database 306b is a relational database that includes a computer readable medium that stores together all MES data including, for example, data relating to the semiconductor device 210 and individual components of the semiconductor device 210 described above. It may be. Databases 306a and / or 306b may store other types of data and information. Traceability database 306a and / or MES database 306b are shown as part of MES server 300, but may be remote from server 300 or remote from the card manufacturing plant where the MES server may be located. Good. In some embodiments, there may be redundant and backup versions of one or both of the traceability database 306a and the MES database 306b. Although not shown, the MES server 300 may also include a wide variety of other computer readable media including removable / non-removable, volatile / nonvolatile computer storage media.

  The MES server 300 may include various interfaces for inputting and outputting data and information. The input interface 316 receives data from a plurality of scanners 320 and from input devices such as a keyboard 322 and a mouse 324. The scanner 320 may be provided in a process tool and a test tool for reading the above-described machine-readable code (such as the matrix code 218 on the semiconductor device 210). The scanner 320 may also read machine readable codes on individual parts. The number of scanners shown in FIG. 13 is merely an example.

  A video interface 330 for interfacing with the monitor 332 may be provided. The monitor 332 can, for example, provide a graphical user interface for manufacturing personnel and can be used to display data from various process and test tools as well as other factory departments. For example, a peripheral interface 336 for supporting peripheral devices including the printer 338 may be provided.

  The MES server 300 may operate in a network environment via the network interface 340 by using logical connections to one or more remote computers 344, 346. The logical connection to computer 344 may be a local area connection (LAN) 348 and the logical connection to computer 346 may be over the Internet 350. Other types of network connections are possible. Thus, in addition to interfacing with databases 306a and / or 306b to obtain traceability information within the card manufacturing plant, the system can also retrieve these information from any remote location that has a network connection to the MES server. It is possible to connect to the MES server 300 to obtain

  It should be understood that the above description of MES server 300 is only an example and may include various other components in addition to or in place of the above.

  In other embodiments, the technology relates to a system for tracking semiconductor packages. The system includes a substrate and one or more semiconductor dies mounted on the substrate. The system further includes an identifier associated with the semiconductor device that associates the semiconductor device with a particular semiconductor die used in the semiconductor device.

  In a further embodiment, the technology relates to a system for tracking semiconductor packages. The system includes a semiconductor device comprising a substrate and one or more semiconductor dies mounted on the substrate. The system further includes an identifier associated with the semiconductor device. The identifier also indicates to the semiconductor device i) the manufacturing process performed on the semiconductor device, ii) the test operation performed on the semiconductor device, and iii) how the semiconductor device operated in the test operation. Associate.

  In other embodiments, the technology relates to a system for tracking semiconductor packages. The system includes a semiconductor device having a substrate, one or more semiconductor dies mounted on the substrate, and passive components. The system further includes a computer readable medium that includes stored information that identifies at least one of the following: i) a substrate used in a semiconductor device, ii) one or more semiconductor dies used in the semiconductor device, iii) passive components used in the semiconductor device, iv) a tool in which the semiconductor device is processed, v) a semiconductor The tool on which the device was tested, vi) the binning of the semiconductor device after the test of the semiconductor device, vii) whether and how many times the semiconductor device was subjected to a regeneration operation after the test operation.

The foregoing detailed description of the invention has been presented for purposes of illustration and description. The subject matter claimed herein is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many variations and modifications are possible in light of the above teaching. The described embodiments best describe the invention and its practical application, so that those skilled in the art will be able to use the various embodiments and various modifications to suit the particular use intended. It was chosen to make the best use of the present invention. It is intended that the scope of the invention be defined by the claims appended hereto.
The main features of the embodiment described above are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Absent.
[Feature 1]
A system for tracking semiconductor packages,
A semiconductor device comprising a substrate and one or more semiconductor dies mounted on the substrate;
An identifier associated with the semiconductor device,
The identifier uniquely distinguishes the semiconductor device from all other semiconductor devices.
[Feature 2]
The system of claim 1, wherein the unique identifier is provided on a surface of the semiconductor device.
[Feature 3]
The system according to claim 2, wherein the unique identifier is an alphanumeric code provided on a surface of the semiconductor device.
[Feature 4]
The system of claim 2, wherein the unique identifier is a machine readable code provided on a surface of the semiconductor device.
[Feature 5]
The system of claim 1, wherein the unique identifier is stored in a memory of a computing device for monitoring a manufacturing process of the semiconductor package.
[Feature 6]
The system of claim 1, wherein the unique identifier identifies the one or more semiconductor dies used in the semiconductor device.
[Feature 7]
The unique identifier is the manufacturer of the semiconductor die used in the semiconductor device, when and where the semiconductor die was made, and the processing performed on the semiconductor die before being incorporated into the semiconductor device; The system of feature 1, wherein at least one of the two is identified.
[Feature 8]
The system of claim 1, wherein the unique identifier identifies the substrate used in the semiconductor device.
[Feature 9]
The unique identifier includes the manufacturer of the substrate used in the semiconductor device, when and where the substrate was made, and the processing performed on the substrate before it was incorporated into the semiconductor package. The system of feature 1, wherein at least one is identified.
[Feature 10]
The unique identifier is
Time and place where the semiconductor device was made; and
A device assembly sub-lot in which the semiconductor device is generated;
An ID for distinguishing each device made by the same time and place information and the same device assembly sub-lot information;
The system of claim 1, comprising:
[Feature 11]
The unique identifier has a format of YWWDLLLLXXX,
Y represents the last digit of the year,
WW represents the week number within the year,
D represents a day within the week;
M represents a semiconductor package manufacturing factory,
LL represents an alphanumeric two-digit ID for distinguishing each device assembly sub-lot,
XXX represents a unique ID of 3 alphanumeric characters for distinguishing each device created by the same date, place, and device assembly sub-lot information.
The system according to Feature 1.
[Feature 12]
The system of claim 1, wherein the semiconductor package is a non-volatile memory package.
[Feature 13]
A system for tracking semiconductor packages,
A semiconductor device comprising a substrate and one or more semiconductor dies mounted on the substrate;
An identifier associated with the semiconductor device, the identifier associating the specific semiconductor die used in the semiconductor device with the semiconductor device;
Including system.
[Feature 14]
14. The system according to claim 13, wherein the identifier further associates the specific substrate used in the semiconductor device with the semiconductor device.
[Feature 15]
The semiconductor device further includes a passive component,
The system according to claim 13, wherein the identifier further associates the specific passive component used in the semiconductor device with the semiconductor device.
[Feature 16]
The identifier includes the manufacturer of the semiconductor die used in the semiconductor device, the time and location when the semiconductor die was made, and the processing performed on the semiconductor die before being incorporated into the semiconductor device. 14. The system according to feature 13, further associating at least one with the semiconductor device.
[Feature 17]
The identifier is at least one of a manufacturer of the substrate used in the semiconductor device, a time and location when the substrate was made, and a process performed on the substrate before being incorporated into the semiconductor device. The system according to claim 13, wherein the system is further associated with the semiconductor device.
[Feature 18]
The one or more semiconductor dies include a memory die;
The identifier associates the semiconductor device with the particular memory die being used, and the manufacturer of the memory die, when the one or more memory dies were made, and where the one or more memory dies were 14. The system of feature 13, wherein at least one of those created is associated with the semiconductor device.
[Feature 19]
The one or more semiconductor dies are:
A controller die,
The identifier associated with the semiconductor device in which the particular controller die was used;
At least one of the controller die manufacturer, when the controller die was made, and where the controller die was made;
The system of feature 13, comprising:
[Feature 20]
14. The system of feature 13, wherein the identifier is unique for the semiconductor device.
[Feature 21]
The system of claim 13, wherein the identifier is displayed on a surface of the semiconductor device and stored in a computer memory associated with the system.
[Feature 22]
A system for tracking semiconductor packages,
A semiconductor device comprising a substrate and one or more semiconductor dies mounted on the substrate;
An identifier associated with the semiconductor device,
The identifier includes i) a manufacturing process performed on the semiconductor device, ii) a test operation performed on the semiconductor device, and iii) how the semiconductor device operated in the test operation. Associating the semiconductor device with the semiconductor device.
[Feature 23]
The system of claim 22, wherein the identifier associates a bin into which the semiconductor device is classified and the semiconductor device.
[Feature 24]
23. The system of feature 22, wherein the identifier associates with the semiconductor device whether the semiconductor device has undergone some reclaiming work, and if so, the number of reclaiming work and what was the reclaiming work.
[Feature 25]
The identifier associates the semiconductor device with at least one of an identifier of a tool used to process or test the semiconductor device, a maintenance history of the tool, and a manufacturing person associated with the tool. The system according to claim 22.
[Feature 26]
The identifier enables classification of the semiconductor device;
23. The system of feature 22, wherein the classification is used to identify and isolate a first group of semiconductor devices that perform better than a second group of semiconductor devices.
[Feature 27]
24. The system of feature 22, wherein the identifier is provided in machine readable code on a surface of the semiconductor device.
[Feature 28]
The system of feature 22, wherein the identifier is unique to the semiconductor device.
[Feature 29]
A system for tracking semiconductor packages,
A semiconductor device;
A computer readable medium;
With
The semiconductor device includes:
A substrate,
One or more semiconductor dies mounted on the substrate;
Passive components,
Including
The computer-readable medium is
i) the substrate used in the semiconductor device;
ii) the one or more semiconductor dies used in the semiconductor device;
iii) the passive component used in the semiconductor device;
iv) a tool in which the semiconductor device is processed;
v) a tool with which the semiconductor device was tested;
vi) binning the semiconductor device after testing the semiconductor device;
vii) whether or not the semiconductor device has undergone a regeneration operation after the test operation, and how many times it has been received;
A system comprising stored information identifying at least one of
[Feature 30]
30. The system of feature 29, wherein the computer readable medium is used in a production execution system database.
[Feature 31]
32. The system of feature 30, further comprising a network connection that allows access to the database within a manufacturing plant where the semiconductor package is manufactured.
[Feature 32]
32. The system of claim 30, further comprising a network connection that allows access to the database outside a manufacturing plant where the semiconductor package is manufactured.
[Feature 33]
30. The system of claim 29, wherein the information stored on the computer readable medium enables identification and isolation of a first group of semiconductor devices that perform better than a second group of semiconductor devices.
[Feature 34]
A plurality of scanners associated with the tool on which the semiconductor device is processed, wherein the scanner scans a unique code on the semiconductor device that allows information associated with the tool to be stored in association with the semiconductor device; 30. The system of feature 29, further comprising a scanner.

Claims (11)

A system comprising a semiconductor device having an outer surface,
The semiconductor device further includes
A substrate,
One or more semiconductor dies mounted on the substrate;
An identifier provided visibly on the outer surface,
The system
A database storing first information in association with the identifier, wherein the first information includes identification information of the semiconductor die and the substrate used in the semiconductor device including the identifier. When,
One or more process tools for processing the semiconductor die and the substrate;
One or more scanners for reading second information, wherein the one or more scanners are included in the one or more process tools, the second information processing the semiconductor die and the substrate The scanner includes the identification information of the one or more process tools, and the second information is stored in the database in association with the identifier;
A system comprising: The system of claim 1, wherein the identifier uniquely identifies the semiconductor device. The system according to claim 1, wherein the identifier can identify at least one of (i) a process tool that has processed the semiconductor device, and (ii) a test tool that has tested the semiconductor device. The system of any one of claims 1 to 3, wherein the identifier is printed on the outer surface of a molding material that covers the one or more semiconductor dies. The system according to claim 1, wherein the identifier is an alphanumeric code. The system according to claim 1, wherein the identifier is a machine-readable code. The identifier includes the manufacturer of the semiconductor die used in the semiconductor device, the time and location when the semiconductor die was made, and the processing performed on the semiconductor die before being incorporated into the semiconductor device. The system according to claim 1, wherein at least one is identified. The identifier is
Time and place where the semiconductor device was made; and
A device assembly sub-lot in which the semiconductor device is generated;
An ID for distinguishing each device made by the same time and place information and the same device assembly sub-lot information;
Including A system according to any one of claims 1 to 7. The identifier has a format of YWWDLLLLXXX,
Y represents the last digit of the year,
WW represents the week number within the year,
D represents a day within the week;
M represents a semiconductor package manufacturing factory,
LL represents an alphanumeric two-digit ID for distinguishing each device assembly sub-lot,
XXX represents a unique ID of 3 alphanumeric characters for distinguishing each device created by the same date, place, and device assembly sub-lot information.
The system according to any one of claims 1 to 8 . The semiconductor device Ru Oh nonvolatile memory package according to any one of claims 1 to 9 system. Before SL nonvolatile memory package, digital cameras, digital music players, video game consoles, PDA, provided in one of the electronic device of the mobile phone system of claim 10.

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