JP4902838B2 - Electronic component pickup device and taping device - Google Patents

Description

  The present invention relates to an electronic component pickup that picks up an electronic component separated by dicing from an electronic component group that is affixed to a dicing sheet set on an electronic component supply table and arranged in a plurality of vertical and horizontal directions by a suction nozzle. Relates to the device. Specifically, an electronic component separated by dicing is picked up from an electronic component group that is affixed to a dicing sheet set on an electronic component supply table and arranged in a plurality of vertical and horizontal directions, and is fed by a feeding device. The present invention relates to a taping device that sequentially loads into each storage recess of a component storage tape to be fed and closes an opening of the storage recess with a cover tape.

A die pick-up apparatus that picks up a die obtained by dicing a wafer affixed to a sheet on a wafer supply table with a suction nozzle is widely known in Japanese Patent Application Laid-Open No. 2002-240802 (Patent Document 1). As one of the die pick-up devices, a taping device, that is, a die on which a wafer affixed to a sheet on a wafer supply table is picked up is picked up and sequentially loaded into each storage recess of a component storage tape sent by a feeding device. In addition, a taping device that closes the opening of the housing recess with a cover tape is also known.
Japanese Patent Laid-Open No. 2002-240802

  However, when the number of chip parts is large, there is a problem that the entire wafer map data composed of position information, pass / fail information, and other information attached to the wafer supply table cannot be displayed at a time on the monitor.

  Therefore, according to the present invention, when the entire wafer map data cannot be displayed on the monitor, the wafer in a state of being divided into a plurality of parts including the die to be picked up next is displayed on the monitor as a graphic for the convenience of management of the operator. It aims to plan.

For this reason, the first invention picks up an electronic component separated by dicing from an electronic component group that is affixed to a dicing sheet set on an electronic component supply table and arranged in a plurality of vertical and horizontal directions by a suction nozzle. In the electronic component pickup device, the electronic component group is divided into a plurality of regions, and the electronic component to be picked up next is determined based on map data having position information and pass / fail information of each electronic component among the plurality of regions. The electronic component group in the included region is graphically displayed on a monitor.

A second invention picks up an electronic component separated by dicing from an electronic component group which is affixed to a dicing sheet set on an electronic component supply table, and a plurality of electronic components are arranged vertically and horizontally, and feeds it. In the taping device, which is sequentially loaded into the respective housing recesses of the component storage tape fed by the above , and closes the opening of the storage recess with the cover tape, the electronic component group is divided into a plurality of regions, and the plurality of regions Among them , the electronic component group in the area including the electronic component to be picked up next is displayed on the monitor in graphic form based on the map data having the position information and pass / fail information of each electronic component.

According to a third aspect of the present invention, there is provided an electronic component pick-up apparatus for picking up an electronic component obtained by dicing a wafer affixed to a sheet on a wafer supply table by a suction nozzle, and dividing the wafer into a plurality of regions. characterized in that the graphic displayed on the monitor wafers of the wafer supply position information of each electronic component affixed to the table, including the electronic component to be next pickup based on the wafer map data having quality information area of the And

According to a fourth aspect of the present invention, an electronic component obtained by dicing a wafer affixed to a sheet on a wafer supply table is picked up and sequentially loaded into each storage recess of a component storage tape sent by a feeding device. In a taping device that closes the opening of the storage recess, the wafer is divided into a plurality of regions, and wafer map data having position information and pass / fail information of each electronic component on the wafer supply table out of the plurality of regions. Based on this, the wafer in the area containing the electronic component to be picked up next is displayed on the monitor in graphic form.

In the case where the entire (wafer) map data cannot be displayed on the monitor, the present invention works by displaying the electronic component group (wafer) in the area including the electronic component (die) to be picked up next on the monitor. Management convenience can be achieved.

  Hereinafter, an embodiment of a taping device as a transfer device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG. Reference numeral 1 denotes a taping device main body. A carrier tape supply reel 3 is rotatably locked to a pin 2 erected on a side wall portion of the main body 1, and a tape main body (also referred to as a carrier tape) wound around the tape supply reel 3. The take-up and storage reel 9 is provided via a transport rail 8 having a transport path such as a pulley 5, feed pulleys 6 and 7, and a tape body 4A for applying a proper tension to the tape body 4A. It is fixed to.

  Then, the tape body 4A is stored while the tape body 4A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up storage reel 9 by a rotation driving system (not shown). After the chip part A is inserted (loaded) into the groove (storage recess) 4B and further conveyed to a predetermined position, the opening on the upper surface of the storage groove 4B is covered with the cover tape 4C supplied from the cover tape supply reel 10, It is wound up on the winding storage reel 9. As described above, the storage tape 4 is formed by the tape body 4A provided with the storage grooves 4B at a predetermined interval and the cover tape (top tape) 4C that is pressure-bonded to the upper surface thereof. The tape body 4A is a so-called embossed tape.

  The feed pulleys 6 and 7, the transport rail 8, the cover tape supply reel 10 and the like are provided on the mounting plate 11. A Y table 15 that is driven by a Y-axis drive motor 13 and is guided by a guide 14 to move in the Y direction is provided on a fixed plate 12 that is fixed to the taping device main body 1. An X table 18 that is driven by an X-axis drive motor 16 and is guided by a guide 17 to move in the X direction is provided, and the mounting plate 11 is fixed to the X table 18.

  Therefore, when the X table 18 and the Y table 15 are moved by driving the X axis drive motor 16 and the Y axis drive motor 13, the transport rail 8 and the tape that moves along the transport rail 8 via the mounting plate 11 are moved. The main body 4A and the like can move in the XY directions.

  A Y table 21 that can be moved in the Y direction by a Y axis drive motor 20 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 22 on the Y table 21. A wafer supply table 24 is provided via the X moving body 23. A wafer (electronic component group) affixed on a dicing sheet set on the supply table 24 is diced and divided into dies as individual electronic components (hereinafter referred to as “chip components A”), and The chip component A is fixed with the surface having the terminals on the top surface, and is picked up and picked up by a suction pick-up nozzle 26 described later while being pushed up from the back surface by a push-up pin (not shown). .

  The upper mounting plate 25 fixed to the taping device main body 1 is provided with, for example, eight suction take-out nozzles 26 for taking out chip components A from the wafer supply table 24 at a predetermined interval on the peripheral portion, and a drive motor 19A. The first rotating disk 27 that rotates intermittently through the first indexing cam unit 30 is provided, and the upper mounting plate 25 is moved in the XY directions by the X-axis driving motor 88 and the Y-axis driving motor 89. For example, eight suction loading nozzles 28 for loading the chip component A into the storage groove 4B via an XY table (not shown) are provided at a peripheral portion at a predetermined interval and driven by the drive motor 19B. A second rotating disk 29 that rotates intermittently via two indexing cam units 31 is provided.

  The first rotating disk 27 and the second rotating disk 29 rotate intermittently synchronously, and the nozzles 26 and 28 of the two rotating disks 27 and 29 can be made to correspond to each other. It can be delivered from the suction extraction nozzle 26 to the suction loading nozzle 28. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same.

  Next, the component take-out mechanism 35 will be described in detail with reference to FIG. For example, eight suction / extraction nozzles 26 are arranged on the peripheral portion of the first rotating disk 27 at a predetermined interval, and each suction / extraction nozzle 26 is provided by each reversing device 36 so as to be vertically inverted. . That is, when the drive shaft 39 is rotated via the coupling 38 by the driving of the reverse drive motor 37, the attachment body 40 fixed to the drive shaft 39 is also rotated, and the take-out nozzle 26 is inverted upside down.

  Further, since the guide 42 can move up and down along the guide 41 provided on the mounting body 40, the take-out nozzle 26 attached to the nozzle mounting body 43 fixed to the guide 42 can move up and down. The upper body 40A of the mounting body 40 and the lower side 43A of the nozzle mounting body 43 are always urged upward by a spring 44, but the stopper 45 is locked to the upper side 40A of the mounting body 40. This limits the upper limit.

  Further, the suction take-out nozzle 26 can be lowered when the operating portion 48A of the operating body 48 that can be moved up and down by the guide 47 by driving the Z-axis drive motor 46 presses the head of the nozzle mounting body 43, For example, the chip part A on the wafer supply table 24 can be taken out.

  Next, the component loading mechanism 50 will be described in detail with reference to FIG. For example, eight suction loading nozzles 28 are provided at a peripheral portion of the second rotating disk 29 at a predetermined interval, and the nozzles provided at positions where the suction loading nozzles 28 are eccentric by the rotating devices 51. The shaft body 28A is provided to be rotatable about the axial direction. That is, the transmission belt 55 is stretched between a pulley 53 provided on the drive shaft of the θ-axis drive motor 52 and a pulley 54 fixed around the cylindrical body 62, and the cylindrical body 62 is interposed via the bearing 56. The second turntable 29 is rotatably provided.

  The suction loading nozzle 28 is guided by the guide 61 when the operating portion 59A of the operating body 59 that can be moved up and down by the guide 58 by the drive of the Z-axis drive motor 57 presses the projection 60A of the nozzle mounting body 60. The chip component A that is sucked and held can be loaded into the storage groove 4B of the tape body 4A on the transport rail 8. That is, since the nozzle shaft body 28A can move up and down in the cylindrical body 62 and can rotate θ with the cylindrical body 62, the suction loading nozzle 28 provided at an eccentric position below the nozzle shaft body 28A also moves up and down. And can be rotated by θ.

  Here, based on FIG. 9, a control block diagram of the taping device will be described. 91 is a CPU as a control device that controls the operation related to loading of the chip component A of the taping device, and 92 is for each type of chip component A. The RAM (Random Access Memory) and 93 are ROM (Read Only Memory) for storing the thickness data of each, the height level data for each suction take-out nozzle 26, and the like. Then, the CPU 91 performs overall control of operations related to loading of the chip part A of the taping device according to the program stored in the ROM 93 based on the data stored in the RAM 92. That is, the CPU 91 controls the driving of each driving motor via the driving circuit 94 and the interface 95.

  A recognition processing device 96 is connected to the CPU 91 via the interface 95. The recognition processing device 96 performs recognition processing of an image captured by each recognition camera. Is sent out. That is, the CPU 91 outputs an instruction to the recognition processing device 96 so as to perform recognition processing (calculation of the amount of displacement) of the images captured by each recognition camera, and receives the recognition processing result from the recognition processing device 96. is there.

  An image captured by the component recognition camera 63 or the like is displayed on a monitor 97 as a display device.

  If the entire wafer map data consisting of the positional information, pass / failure information and other information of each chip part A stuck on the wafer supply table 24 cannot be displayed on the monitor 97 due to the large number of chip parts, it is adsorbed. According to the present embodiment, one of the four divided parts is displayed based on the position of the chip part A to be taken out. In this case, the individual divided screens are displayed slightly larger than those divided into four equal parts so as to be partially overlapped (overlapped).

  The number of divisions is determined from the relationship between the display area size of the monitor 97 and the size of the wafer W (the number of chip parts A in the wafer). That is, assuming that the maximum displayable area (number of chip parts) on the monitor 97 is vertical A and horizontal B, the vertical number of chip parts based on wafer map data is C, and the horizontal number is D. The number of divisions is C / A (provided that the decimal point is rounded up), and the horizontal direction is D / B (provided that the decimal point is rounded up). Accordingly, assuming that the maximum displayable area on the monitor 97 is 100 in both the vertical and horizontal directions, and the number of chip parts in the vertical and horizontal directions based on the wafer map data is 150 in terms of the number of chip parts, both vertical and horizontal are 150. / 100 becomes 2 and is divided into 4 (see FIG. 11).

  The operation of the taping apparatus will be described below. First, wafer map data is stored in the RAM 92, and a method for graphically displaying the wafer map data on the monitor 97 will be described with reference to FIGS. 10, 11, and 12. explain.

  First, it is taken out from the chip part A at the upper left end of the first wafer. Next, it proceeds to the right sequentially such that it is adjacent to the right, and when the chip part A at the right end disappears, it is lowered and left sequentially from the right end of the next stage. The following description will be made assuming that the paper is taken out while being turned in the direction.

  When the operation of the taping apparatus is started, the CPU 91 reads the wafer map data stored in the RAM 92, and monitors the map graphic of the area E1 (the upper left part when the wafer is divided into four parts) where the top non-defective chip part A is present. 97. The black square in this map graphic indicates that the pickup has been picked up, the hatched square is the defective chip part A, the gray square is the good chip part A, and the white square is that there is no chip part A. (See FIG. 12). Then, the wafer supply table is sequentially driven by driving the Y-axis drive motor 20 and the X-axis drive motor 22 so that the alignment marks attached to the wafer attached on the wafer supply table 24 are positioned below the component recognition camera 63. 24, the four alignment marks are imaged by the component recognition camera 63, and the position of each alignment mark is recognized by the recognition processing device 96, and the CPU 91 grasps the position of the wafer from each of the four alignment mark positions. To do.

  Therefore, the CPU 91 controls the movement of the wafer supply table 24 based on the grasped wafer position.

  Then, the Y-axis drive motor 20 and the X-axis drive motor 22 are driven so that the leading non-defective chip part A to be taken out in the wafer map data is located immediately below the suction take-out nozzle 26 of the first rotating disk 27. The wafer supply table 24 is sequentially moved. After this movement, the component recognition camera 63 images the first chip component A, the recognition processing device 96 performs recognition processing, and the CPU 91 grasps the position of the first chip component A based on the recognition processing result.

  Next, the CPU 91 controls the Y-axis drive motor 20 and the X-axis drive motor 22 on the basis of the recognition processing result, corrects and moves the wafer supply table 24, and then picks up and picks up the first chip component A with the pick-up and pick-up nozzle 26. . After this take-out, the CPU 91 moves the wafer supply table 24 by one pitch in the X direction to increment the X-direction map counter 98X by “1” and take out the next good chip part A based on the map data. In this case, if the next to the first chip part A is defective, the CPU 91 controls the wafer supply table 24 to take out the next good chip part A based on the map data.

  Next, when the next good chip part A based on the map data is imaged by the part recognition camera 63, the recognition processing device 96 performs recognition processing, and the CPU 91 determines that there is no chip part A, the wafer is supplied to the wafer supply table. Remove from 24.

  If it is determined that there is a next non-defective chip part A, the CPU 91 reads the contents of the current X direction map counter 98X and Y direction map counter 98Y, and the contents of both are 75 (150/2) or less (map data). The upper left corner of the wafer is set to 1 in the X and Y directions), and since both are 75 or less, the wafer area E1 (upper left corner when the wafer is divided into four) is displayed on the monitor 97 (FIG. 12). reference). Then, as described above, similarly, the wafer recognition table 63 moves the wafer supply table 24 to capture the next good chip part A based on the map data, and the recognition processing device 96 performs the recognition process. Then, the CPU 91 determines the presence or absence of the chip part A.

  When it is determined that the chip part A is present, the contents of the current X-direction map counter 98X and Y-direction map counter 98Y are read to determine whether the contents of both are 75 or less. Area E1 is displayed on the monitor 97. If the X direction is greater than 75 and the Y direction is 75 or less, the area E2 (upper right portion when the wafer is divided into four) is displayed on the monitor 97.

  In the same manner, the chip parts A on the wafer supply table 24 are successively sucked and picked up by the picking and picking nozzle 26. When the chip parts A are picked up next time, the current X direction map counter 98X and the Y direction map are picked up. When the contents of the counter 98Y are read and the X direction map counter 98X is not more than 75 and the Y direction map counter 98Y is not less than 75, that is, the X direction map counter 98X is less than 75 and the Y direction map counter 98Y is 75. If it is over, an area E3 (lower left when the wafer is divided into four) is displayed on the monitor 97. Further, when the X direction map counter 98X is 75 or less and the Y direction map counter 98Y is not more than 75, that is, if the contents in both the X direction and the Y direction exceed 75, the area E4 (wafer 4 on the wafer) is displayed. Display the bottom right).

  As described above, the suction take-out nozzle 26 of the first rotating disk 27 that rotates intermittently picks up the chip parts A sequentially from the wafer supply table 24, and as shown in FIGS. 6 and 7, the first rotation is performed. A station located at 12 o'clock on the board 27 is a suction extraction station for picking up and extracting the chip part A from the wafer supply table 24. As described above, in this suction take-out station, the non-defective chip part A to be taken out next on the wafer supply table 24 moved during the turning movement of the first turntable 27 is imaged by the part recognition camera 63, The recognition processing unit 96 recognizes the position of the chip component A, and the CPU 91 drives the Y-axis drive motor 20 and the X-axis so that the CPU 91 is positioned immediately below the suction / extraction nozzle 26 that moves the chip component A to be extracted. The motor 22 is driven and the wafer supply table 24 is corrected and moved, and the chip component A on the wafer supply table 24 is lowered by the Z-axis drive motor 46 at this suction / extraction station to be suctioned and taken out. .

  Next, the second rotating disk 29 intermittently rotates clockwise through the second indexing cam unit 31 by driving the drive motor 19B, and at the same time through the first indexing cam unit 30 by driving the drive motor 19A. 1 rotary disk 27 is synchronously intermittently rotated counterclockwise. The station of the first rotating disk 27 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36. The station is a recognition station in which the position of the inverted chip component A is imaged by the component recognition camera 65 and recognized by the recognition processing device 96.

  Next, a printing station which is reversed by the reversing device 36 and prints by the printing device 66 on the chip part A having the printing surface as the upper surface and the surface having the terminal as the lower surface will be described below with reference to FIG. An X table 70 that is movable in the X direction via a guide 69 is provided by an X axis drive motor 68 fixed to the mounting plate 67. Further, a Y axis drive motor 71 passes a guide 72 over the X table 70. A Y table 73 that is movable in the Y direction is provided. An ink jet printing unit 78 is provided on a Z moving body 77 that moves in the Z direction by a Z-axis drive motor 74 via a guide 76 provided on a fixed plate 75 on the lower surface of the Y table 73.

  That is, the printing unit 78 is movable in the XY direction and the Z direction, and the position of the chip part A that has been imaged by the part recognition camera 65 and recognized by the recognition processing device 96 is captured by the part recognition camera 65. On the basis of the recognition result, the CPU 91 controls the X-axis drive motor 68 and the Y-axis drive motor 71 to correct in the XY directions during the turning movement of the first rotating disk 27 from the recognition station. A serial number or the like is printed on the chip part A by the printing unit 78 lowered by the Z-axis drive motor 74 at the printing station.

  Accordingly, since the printing is performed on the chip component A in the position-corrected state, the printing accuracy can be improved, and the thickness data for each type of chip component stored in the RAM 92 and each suction take-out nozzle 26 can be improved. If the movement level of the printing unit by the Z-axis drive motor 74 is controlled by the CPU 91 in accordance with the data using the height level data, the distance between the picked-up chip component and the printing unit 78 at the time of printing is constant. It is adjusted and printing accuracy can be improved.

  The next curing station 79 is a station that dries the ink printed by the printing unit 78 with warm air from a warm air device (not shown).

  The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the chip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is replaced with the suction loading nozzle of the second rotary disk 29. Pass to 28. At the delivery station of the first turntable 27, in other words, at the transfer station of the second turntable 29, the component recognition camera 65 takes an image of the chip part A sucked and held by the suction take-out nozzle 26 and performs recognition processing. The deviation in the X direction and the Y direction as a result of the recognition processing by the device 96 is eliminated by correcting the rotation angle of the second rotating disk 29 and correcting the position of the suction loading nozzle 28 which is eccentric due to the rotation of the nozzle shaft 28A.

  That is, based on the recognition processing result of the recognition processing device 96 based on the image picked up by the component recognition camera 65, the CPU 91 drives the drive motor 19B for rotating the second rotating disk 29 and the θ-axis drive for rotating the nozzle shaft body 28A. By controlling the motor 52, the deviation in the X direction and the Y direction can be corrected. Therefore, the position of the chip component A sucked and held by the delivered suction / extraction nozzle 26 and the position of the suction loading nozzle 28 is made as close as possible to be sucked and held by the suction / outtake nozzle 26 provided on the first rotating disk 27. The chip component A can be reliably delivered from the suction take-out nozzle 26 to the suction loading nozzle 28 provided on the second rotating disk 29.

  Then, the transfer is performed at the transfer station of the second turntable 29, and the second turntable 29 rotates in the clockwise direction so that the mounting station and the recovery loading station (the transfer station is the first and the sixth and seventh). The rotary disks 27 and 29 are disposed so that the suction loading nozzle 28 is positioned above the tape body 4A of the tape 4.

  That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the tape 4, the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second rotating disk 29 in the station, the line connected to the suction loading nozzle 28 and the traveling line of the tape 4 is 67.5, and the delivery station of the first rotating disk 27 and the second rotating disk Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the 29 transfer stations.

  The next station after the inheriting station of the second turntable 29 is an inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, and the current value Is in the predetermined range stored in the RAM 92. Here, if it is not within the predetermined range, the CPU 91 controls not to load the tape body 4A but to store it in a dedicated tray (not shown) described later.

  A loading part recognition camera 83 is arranged at the recognition station next to the inspection station. The chip part A sucked and held by the suction loading nozzle 28 is imaged by the loading part recognition camera 83, and the chip is picked up by the recognition processing device 96. The position of the component A with respect to the nozzle is recognized, and an appearance inspection (whether there are a predetermined number of bumps, etc.) is performed. If a defective chip component is determined by this appearance inspection, the CPU 91 controls the tape body 4A to be stored in the dedicated tray without being loaded.

  The next next station is a loading station for loading the chip component held by the suction loading nozzle 28 into the storage groove 4B of the storage tape 4, and the chip component A held by the suction loading nozzle 28 by the loading component recognition camera 83. Is loaded and chip components are loaded in a state where the deviation in the θ direction (angle in the plane direction) and the deviation in the plane direction (XY direction) are corrected based on the result of the recognition processing performed by the recognition processing device 96.

  That is, the CPU 91 corrects and controls the θ-axis drive motor 52 for the deviation in the θ direction and rotates the suction loading nozzle 28 provided at a position eccentric to the shaft body 28A via the cylindrical body 62 and the nozzle shaft body 28A. The X-axis drive motor 16 and the Y-axis drive motor 13 are corrected and controlled to correct and move the X table 18 and the Y table 15 with respect to the displacement in the plane direction. The tape body 4A moving along the rail 8 is corrected and moved in the X direction.

  In this case, when the suction loading nozzle 28 moved to the loading station is in the recognition station, the chip component A held by the suction extraction nozzle 26 in the printing station of the first rotary disk 27 is moved to the next next. In consideration of the rotation correction amount of the second rotating disk 29 corrected at the delivery station (in addition to the recognition processing result at the recognition station of the electronic component), the CPU 91 performs θ in the loading station of the second rotating disk 29. The axis drive motor 52, the X axis drive motor 16, and the Y axis drive motor 13 are corrected and controlled.

  For this reason, the chip component A can be loaded into the appropriate position in the storage groove 4B by the suction loading nozzle 28 that is lowered by the drive of the Z-axis drive motor 57. Accordingly, since the correction operation in the plane direction is performed on the tape body 4A side and the correction operation in the angular direction (θ) is performed on the suction loading nozzle 28 side, the movable portion is compared with the structure in which all is performed on the suction loading nozzle 28 side. It can be reduced in weight, and can cope with higher speed and more functions.

  The loading operation of the chip part A at this loading station will be described. As described above, the suction loading nozzle 28 is lowered by driving the Z-axis drive motor 57, and the chip component A is loaded into the storage groove 4B of the tape body 4A. At this loading, a vacuum path is connected to a vacuum source (not shown). The suction loading nozzle 28 communicated via the vacuum valve releases the vacuum by the switching operation of the solenoid valve and conversely drops the chip part A onto the bottom surface of the storage groove 4B by blowing air from the suction hole formed in the nozzle 28. And loaded into the storage groove 4B.

  Further, a print inspection camera 85 is provided at the next recovery loading station, and the chip component A loaded in the storage groove 4B located in this station is imaged during the turning movement of the second rotating disk 29, and recognition processing is performed. The device 96 recognizes and checks the presence / absence of printing and the direction of printing of the chip part A loaded in the tape body 4A.

  Then, during the turning movement of the second turntable 29 at the recovery loading station, the print inspection camera 85 images the chip component A loaded in the storage groove 4B located at this station. Based on the captured image, the recognition processing device 96 performs recognition processing to inspect the presence / absence of printing of the chip component A loaded in the storage groove 4B of the tape body 4A and the printing direction.

  If the CPU 91 determines that the CPU 91 is defective based on the recognition result of the recognition processing device 96, the suction loading nozzle 28 that has finished loading at the loading station takes out the chip part A from the storage groove 4B located at the recovery loading station. At this time, the suction loading nozzle 28 to be loaded at the loading station is controlled to stand by without being loaded. In this state, the CPU 91 intermittently rotates the second rotating disk 29 without moving the tape body 4A, and the next suction loading nozzle 28 is held in the storage groove 4B which has been taken out and emptied as described above. Control is performed so that the chip part A that has been used is loaded.

  Then, as described above, after the chip component A is inserted into the storage groove 4B of the tape body 4A by the component loading mechanism 50, the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86 and wound up. It is wound up on the storage reel 9.

  As described in detail, the present embodiment is an embodiment in which the chip component A is loaded on the storage tape 4 by the suction loading nozzle 29. However, the present invention is not limited to this, and a tray in which a plurality of rows of storage recesses are formed vertically and horizontally ( The present invention can also be applied to a form in which it is transferred and stored in (not shown). In this case, the tray is configured to be movable in the XY directions by driving the X-axis drive motor and the Y-axis drive motor.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view which shows a taping apparatus. It is a front view of a taping device. It is a right view of a taping device. It is a figure for demonstrating a components extraction mechanism. It is a figure for demonstrating a component loading mechanism. It is a top view of the stop state of the 1st and 2nd turntable. It is a top view during the turning movement of the 1st and 2nd turntable. It is a side view of a printing mechanism. It is a control block diagram of this taping apparatus. It is a figure which shows a flowchart. It is a figure for demonstrating the screen at the time of displaying the wafer map data on a monitor graphically. It is a figure which shows the screen which divided | segmented wafer map data and displayed it graphically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 4 Storage tape 4A Tape main body 4B Storage groove 4C Cover tape 4D Opening 8 Conveying rail 24 Wafer supply table 26 Adsorption taking-out nozzle 28 Adsorption loading nozzle 91 CPU
96 Recognition processor 97 Monitor

Claims (4)

In the electronic component pick-up device on which an electronic component is attached to the dicing sheet set on an electronic component feeding table is picked up by the suction nozzle electronic components singulated by dicing a plurality ordered group of electronic components in a matrix, the dividing the group of electronic components into a plurality of areas, the position information of each electronic component of the plurality of regions, a group of electronic components of the region including the next electronic component to be picked up based on the map data having quality information An electronic component pick-up device characterized by displaying a graphic on a monitor. A component storage tape that picks up an electronic component separated by dicing from an electronic component group that is affixed to a dicing sheet set on an electronic component supply table and arranged in a plurality of vertical and horizontal electronic components, and is sent by a feeder. In the taping device that is sequentially loaded into each of the storage recesses and closes the opening of the storage recess with a cover tape, the electronic component group is divided into a plurality of regions, and the position of each electronic component in the plurality of regions is A taping device that graphically displays an electronic component group in a region including an electronic component to be picked up next on a monitor based on map data having information and pass / fail information. In an electronic component pick-up apparatus that picks up an electronic component obtained by dicing a wafer affixed to a sheet on a wafer supply table by a suction nozzle, the wafer is divided into a plurality of regions, and the wafer supply table is divided among the plurality of regions. An electronic component pick-up apparatus that graphically displays on a monitor a wafer in an area including an electronic component to be picked up next based on wafer map data having position information and pass / fail information of each electronic component affixed thereon . An electronic component on which a wafer affixed to a sheet on the wafer supply table is diced is picked up and sequentially loaded into each storage recess of a component storage tape sent by a feeding device, and the opening of the storage recess is covered with a cover tape. In the taping device to be closed, the wafer is divided into a plurality of areas, and the next pickup is performed based on the wafer map data having position information and pass / fail information of each electronic component on the wafer supply table in the plurality of areas . A taping apparatus characterized in that a wafer in an area including electronic parts to be displayed is displayed on a monitor in graphic form.

Images