JP4628661B2 - DIE PICKUP DEVICE AND DIE PICKUP METHOD - Google Patents

Description

  The present invention relates to a die pickup apparatus and a die pickup method for recognizing the position of a die on a wafer table before picking up by a suction nozzle based on an image of a die to be picked up picked up by a component recognition camera.

In this type of conventional die pickup apparatus, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-111289, the die on the wafer table is imaged by a component recognition camera, and the die position is recognized before picking up. A technique for recognizing with an apparatus is known. In this recognition control, in the one-cycle sequence, the index of the rotating table starts, the movement of the wafer table starts, and after the movement of the wafer table stops, the preceding recognition process of the die is performed. It was a series of sequences that started the pip-up after checking the stop of the index.
Japanese Patent Laid-Open No. 2002-111289

  However, since the wafer table is moved during the index operation and the preceding recognition process is performed, the throughput is greatly affected.

  Accordingly, an object of the present invention is to improve the throughput by operating the wafer table using the previous result of the preceding recognition process to capture the image of the chip part before starting the wafer table movement.

Therefore, according to the first aspect of the present invention, the recognition processing device recognizes the position of the die on the wafer table before picking up by the suction nozzle based on the image of the die to be picked up picked up by the component recognition camera, and the recognition processing result. In the die pick-up apparatus that repeats the cycle time of moving the wafer table and picking up the die based on
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device First control means for executing recognition processing and controlling the wafer table to move in parallel with the recognition processing;
The wafer table is moved by one pitch so that the movement of the wafer table performed in parallel with the recognition process by the first control means is positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. Second control means that is executed by moving the wafer table by a correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time,
After that, there is provided third control means for controlling the suction nozzle to pick up and take out a die to be taken out at the current cycle time after stopping the intermittent rotation of the turntable and stopping the movement of the wafer table. .

According to a second aspect of the present invention, the recognition processing device recognizes the position of the die on the wafer table before picking up by the suction nozzle based on the die image to be picked up picked up by the component recognition camera, and based on the recognition processing result. In the die pick-up apparatus that repeats the cycle time of moving the wafer table and picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device A recognition process is executed and the wafer table is controlled to move in parallel with the recognition process, and the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table is First control means for controlling the suction nozzle to suck and take out ;
The wafer table is moved in parallel with the recognition process by the first control means so that the wafer table is positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. Second control means that is executed by moving the wafer table by a correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time, and moving by one pitch.
When the suction of the die cannot be performed by the suction nozzle from the wafer table, the counter counts the number of times the die cannot be suctioned and determines whether the count value has reached the set value. A determination means;
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. And a third control means for adsorbing and taking out.

According to a third aspect of the present invention, the recognition processing device recognizes the position of the die on the wafer table before picking up by the suction nozzle based on the die image to be picked up picked up by the component recognition camera, and based on the recognition processing result. In the die pick-up apparatus that repeats the cycle time of moving the wafer table and picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device A recognition process is executed and the wafer table is controlled to move in parallel with the recognition process, and the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table is First control means for controlling the suction nozzle to suck and take out ;
The wafer table is moved in parallel with the recognition process by the first control means so that the wafer table is positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. Second control means that is executed by moving the wafer table by a correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time, and moving by one pitch.
First determination means for determining whether or not the recognition result is within a reference range;
A second determination unit that counts the determined number of times by a counter when it is determined that the value is not within the reference range, and determines whether the count value has reached a set value;
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. And a third control means for adsorbing and taking out.

According to a fourth aspect of the present invention, the recognition processing device recognizes the position of the die on the wafer table before picking up by the suction nozzle based on the image of the die to be picked up picked up by the component recognition camera, and based on the recognition processing result. In the die pick-up method of repeating the cycle time of moving the wafer table and picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device Performing a recognition process, moving the wafer table in parallel with the recognition process ,
The movement of the wafer table performed in parallel with the recognition process moves the wafer table by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. And is performed by moving the wafer table by the correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time,
Thereafter, after the intermittent rotation stop of the rotating table and the movement of the wafer table are stopped, the suction nozzle sucks and takes out the die to be taken out in the current cycle time.

According to a fifth aspect of the present invention, the recognition processing device recognizes the position of the die on the wafer table before picking up by the suction nozzle based on the image of the die to be picked up picked up by the component recognition camera, and based on the recognition processing result. In the die pick-up method of repeating the cycle time of moving the wafer table and picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device While performing recognition processing, the wafer table is moved in parallel with the recognition processing, and the suction nozzle sucks the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table. Take out
The movement of the wafer table performed in parallel with the recognition process moves the wafer table by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. And the wafer table is moved by the correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time ,
If the suction nozzle cannot remove the die from the wafer table, the counter counts the number of times that the die cannot be sucked and determines whether the count value has reached the set value. ,
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. It is characterized by adsorbing and taking out.

According to a sixth aspect of the present invention, the recognition processing device recognizes the position of the die on the wafer table before picking up by the suction nozzle based on the die image to be picked up picked up by the component recognition camera, and based on the recognition processing result. In the die pick-up method of repeating the cycle time of moving the wafer table and picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device While performing recognition processing, the wafer table is moved in parallel with the recognition processing, and the suction nozzle sucks the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table. Take out
The wafer table is moved in parallel with the recognition process by moving the wafer table by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. It is executed by moving the wafer table by the correction amount based on the recognition processing result for the die taken out at the previous cycle time at the cycle time of
Determining whether the recognition result is within a reference range;
When it is determined that it is not within the reference range, the determined number of times is counted by a counter, and it is determined whether the count value has reached a set value,
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. And the suction nozzle picks up and takes out.

The invention, together with operating a wafer table by using the prior recognition processing result in the previous cycle time, performs image capture of the chip component before the start of the wafer table moves, the wafer table recognition process of the chip component By performing this in parallel with the movement , the throughput can be improved.

  Hereinafter, an embodiment of a taping device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG. Reference numeral 1 denotes a taping device main body. A carrier tape supply reel 3 is rotatably locked to a pin 2 erected on a side wall portion of the main body 1, and a tape main body (also referred to as a carrier tape) wound around the tape supply reel 3. The take-up and storage reel 9 is provided via a transport rail 8 having a transport path such as a pulley 5, feed pulleys 6 and 7, and a tape body 4A for applying a proper tension to the tape body 4A. It is fixed to.

  Then, the tape body 4A is stored while the tape body 4A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up storage reel 9 by a rotation driving system (not shown). After the chip part A is inserted into a groove (not shown) and further conveyed to a predetermined position, the opening on the upper surface of the storage groove is covered with the cover tape 4C supplied from the cover tape supply reel 10, and then the winding is performed. The tape is wound around the storage reel 9. As described above, the tape is stored by the tape main body 4A provided with a storage groove at a predetermined interval and the cover tape (top tape) 4C that is pressure-bonded to the upper surface. The tape 4 is formed, and the tape body 4A is formed of a bottom tape and a spacer.

  The feed pulleys 6 and 7, the transport rail 8, the cover tape supply reel 10 and the like are provided on the mounting plate 11. A Y table 15 that is driven by a Y-axis drive motor 13 and is guided by a guide 14 to move in the Y direction is provided on a fixed plate 12 that is fixed to the taping device main body 1. An X table 18 that is driven by an X-axis drive motor 16 and is guided by a guide 17 to move in the X direction is provided, and the mounting plate 11 is fixed to the X table 18. Therefore, when the X table 18 and the Y table 15 are moved by driving the X axis drive motor 16 and the Y axis drive motor 13, the transport rail 8 and the tape that moves along the transport rail 8 via the mounting plate 11 are moved. The main body 4A and the like can move in the XY directions.

  A Y table 21 that can be moved in the Y direction by a Y axis drive motor 20 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 22 on the Y table 21. A chip component supply table 24 is provided via the X moving body 23. A wafer affixed to the sheet is diced on the supply table 24 and is divided into individual dies (hereinafter referred to as “chip parts A”), and fixed with the surface having terminals as the upper surface. The chip component A is picked up and taken out by a suction pick-up nozzle 26 described later while being pushed up by a push-up pin (not shown) from the back surface.

  On the upper mounting plate 25 fixed to the main body 1 of the taping device, for example, eight suction takeout nozzles 26 for taking out the chip components A from the chip component supply table 24 are arranged at a peripheral portion with a predetermined interval. The indexing cam unit includes, for example, eight first rotating disks 27 intermittently rotated by the cam unit 30 and eight suction loading nozzles 28 for loading the chip components A into the housing grooves at predetermined intervals. A second turntable 29 that rotates intermittently by 31 is provided.

  In addition, as shown in FIG. 4, a synchronous intermittent rotation device for synchronously rotating the first and second rotary disks 27 and 29 is provided. That is, the second rotating disk 29 is intermittently rotated by the indexing cam unit 31 via the coupling 32 and the drive shaft 19A by driving the drive motor 19, and the pulley 33A provided at the end of the drive shaft 19A and the like. Since the timing belt 33C is stretched between the pulley 33B and the pulley 33B, the drive of the drive shaft 19A is transmitted to the driven shaft 34 via the timing belt 33C and is driven by the indexing cam unit 30 via the driven shaft 34. The first rotating disk 27 is rotated intermittently synchronously. That is, since the first and second rotary disks 27 and 29 having the same number of indexes can be synchronously and intermittently rotated by driving the drive motor 19, the rotation does not shift. Therefore, since the nozzles 26 and 28 of the two rotary disks 27 and 29 can be made to correspond reliably, the chip component A can be reliably delivered. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same. Further, the drive motor 19 can be used for intermittent rotation of both the first and second rotating disks 27 and 29, and the mechanism or rotation control of the synchronous intermittent rotation device can be simplified.

  Next, the component take-out mechanism 35 will be described in detail based on FIG. For example, eight suction / extraction nozzles 26 are arranged on the peripheral portion of the first rotating disk 27 at a predetermined interval, and each suction / extraction nozzle 26 is provided by each reversing device 36 so as to be vertically inverted. . That is, when the drive shaft 39 is rotated via the coupling 38 by the driving of the reverse drive motor 37, the attachment body 40 fixed to the drive shaft 39 is also rotated, and the take-out nozzle 26 is inverted upside down. Further, since the guide 42 can move up and down along the guide 41 provided on the mounting body 40, the take-out nozzle 26 attached to the nozzle mounting body 43 fixed to the guide 42 can move up and down. The upper body 40A of the mounting body 40 and the lower side 43A of the nozzle mounting body 43 are always urged upward by a spring 44, but the stopper 45 is locked to the upper side 40A of the mounting body 40. This limits the upper limit.

  Further, the suction take-out nozzle 26 can be lowered when the operating portion 48A of the operating body 48 that can be moved up and down by the guide 47 by driving the Z-axis drive motor 46 presses the head of the nozzle mounting body 43, For example, the chip part A on the chip part supply table 24 can be taken out.

  Next, the component loading mechanism 50 will be described in detail with reference to FIG. For example, eight suction loading nozzles 28 are arranged on the peripheral edge of the second rotating disk 29 at a predetermined interval, and the suction loading nozzles 28 are rotated about the axial direction by each rotating device 51. Provided possible. That is, a transmission belt 55 is stretched between a pulley 53 provided on the drive shaft of the θ-axis drive motor 52 and a pulley 54 provided around the suction loading nozzle 28, and the suction loading nozzle 28 and a hollow cylinder described later. The body 62 is rotatably provided on the second rotating disk 29 via a bearing 56. The suction loading nozzle 28 is guided by the guide 61 when the operating portion 59A of the operating body 59 that can be moved up and down by the guide 58 by the drive of the Z-axis drive motor 57 presses the projection 60A of the nozzle mounting body 60. The chip component A that is sucked and held can be loaded into the storage groove of the tape body 4A on the transport rail 8. That is, the suction loading nozzle 28 can move up and down in the hollow cylindrical body 62 around it, and can rotate θ together with the hollow cylindrical body 62.

  Here, a control block diagram of the taping device will be described with reference to FIG. 10. Reference numeral 91 denotes a CPU of a microcomputer as a control means and a judgment means for comprehensively controlling the operation related to the loading of the chip part A of the taping apparatus. RAM (Random Access Memory) and 93 are ROM (Read Only Memory) for storing thickness data for each type of chip part A, height level data for each suction take-out nozzle 26, and the like. . Then, the CPU 91 performs overall control of operations related to loading of the chip part A of the taping device according to the program stored in the ROM 93 based on the data stored in the RAM 92. That is, the CPU 91 controls the driving of each driving motor via the driving circuit 94 and the interface 95.

  A recognition processing device 96 is connected to the CPU 91 via the interface 95. The recognition processing device 96 performs recognition processing of an image captured by each recognition camera. Is sent out. That is, the CPU 91 outputs an instruction to the recognition processing device 96 so as to perform recognition processing (calculation of the amount of displacement) of the images captured by each recognition camera, and receives the recognition processing result from the recognition processing device 96. is there.

  Next, in FIG. 7 and FIG. 8, the station located at 12:00 of the first rotating disk 27 is a suction extraction station where the suction extraction nozzle 26 sucks and extracts the chip component A from the chip component supply table 24. The part recognition camera 63 takes an image of the next chip part A to be taken out on the chip part supply table 24 during the turning movement of the one rotary disk 27 and the position of the chip part A to be taken out next is detected by the recognition processing device 96. Recognition process.

  Then, by driving the drive motor 19, the second rotating disk 29 is intermittently rotated clockwise by the indexing cam unit 31 and the first rotating disk 27 is synchronously intermittently rotated counterclockwise by the indexing cam unit 30. The station that stops by intermittently rotating once is a reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36. Next, the position of the reversed chip part A is recognized as a part. This is a recognition station that captures an image with the camera 65 and performs recognition processing with the recognition processing device 96.

  Next, a printing station which is reversed by the reversing device 36 and prints by the printing device 66 on the chip part A having the printing surface as the upper surface and the surface having the terminals as the lower surface will be described below with reference to FIG. An X table 70 that is movable in the X direction via a guide 69 is provided by an X axis drive motor 68 fixed to the mounting plate 67. Further, a Y axis drive motor 71 passes a guide 72 over the X table 70. A Y table 73 that is movable in the Y direction is provided. An ink jet printing unit 78 is provided on a Z moving body 77 that moves in the Z direction by a Z-axis drive motor 74 via a guide 76 provided on a fixed plate 75 on the lower surface of the Y table 73.

  That is, the printing unit 78 is movable in the XY direction and the Z direction, and the CPU 91 performs the X-axis drive motor 68 and the Y-axis drive motor 71 based on the position recognition result of the chip component A by the recognition processing device 96 in the recognition station. In the state in which the XY direction is corrected during the turning movement of the first rotary disk 27 from the recognition station, the chip component is moved by the printing unit 78 lowered by the Z-axis drive motor 74 at the next printing station. A serial number etc. is printed on A. Accordingly, since the printing is performed on the chip component A in the position-corrected state, the printing accuracy can be improved, and the thickness data for each type of chip component stored in the RAM 92 and each suction take-out nozzle 26 can be improved. If the movement level of the printing unit by the Z-axis drive motor 74 is controlled by the CPU 91 in accordance with the data using the height level data, the distance between the picked-up chip component and the printing unit 78 at the time of printing is constant. It is adjusted and printing accuracy can be improved. The stroke control may be performed based on the thickness data or height level data, or based on both data.

  As described above, after the chip part A is sucked and taken out from the chip part supply table 24 by the suction pick-up nozzle 26, it is turned upside down by the reversing device 36 and printed by the printing unit 78 with the chip surface facing upward. Since it is a thing, reduction of the man-hour etc. of sheet replacement can be aimed at.

  The next curing station 79 is a station that dries the ink printed by the printing unit 78 with warm air from a warm air device (not shown).

  The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the chip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is replaced with the suction loading nozzle of the second rotary disk 29. Pass to 28. In other words, the second turntable 29 is handed over at the transfer station of the second turntable 29, and the second turntable 29 rotates in the clockwise direction so that the mounting station and the recovery loading station (the transfer station is the first and the sixth and seventh positions). The rotary disks 27 and 29 are disposed so that the suction loading nozzle 28 is positioned above the tape body 4A of the tape 4.

  That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the tape 4, the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second rotating disk 29 in the station, the line connected to the suction loading nozzle 28 and the traveling line of the tape 4 is 67.5, and the delivery station of the first rotating disk 27 and the second rotating disk Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the 29 transfer stations.

  The next station after the inheriting station of the second turntable 29 is a first inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, It is checked whether the current value is within a predetermined range stored in the RAM 92. Here, if it is not within the predetermined range, the CPU 91 controls not to load the tape body 4A but to store it in a dedicated tray (not shown) described later.

  The next station after the first inspection station is a second inspection station that inspects the characteristics of the chip component by the characteristic inspection device 82, and is a station that conducts a continuity inspection to check whether a current flows through the chip component, for example. Here, if it is inspected by the characteristic inspection device 82 that no current flows, the CPU 91 performs control so that it is not loaded in the tape body 4A but is stored in the dedicated tray.

  At the next recognition station, a loaded component recognition camera 83 is disposed. The chip component A sucked and held by the suction loading nozzle 28 is imaged by the loaded component recognition camera 83, and the nozzle of the chip component A is picked up by the recognition processing device 96. And the appearance inspection (whether there are a predetermined number of bumps, etc.). If a defective chip component is determined by this appearance inspection, the CPU 91 controls the tape body 4A to be stored in the dedicated tray without being loaded.

  The next loading station is provided with a loading position recognition camera 84 for recognizing the position of the storage groove of the tape body 4A on the transport rail 8, and the storage to be loaded while the second turntable 29 is swung. The groove is imaged and the position is recognized by the recognition processing device 96.

  Therefore, after the chip part A is imaged by the loading part recognition camera 83 and the storage groove is imaged by the loading position recognition camera 84, the recognition processing device 96 recognizes the position of the chip part A sucked and held by the suction loading nozzle 28. Then, based on the result, the CPU 91 corrects and controls the Y-axis drive motor 13 and the X-axis drive motor 16 in the XY direction, and the angle in the θ direction, that is, the plane direction. Is corrected and controlled for the θ-axis drive motor 52. For this reason, the chip component A can be loaded into the appropriate position in the storage groove by the suction loading nozzle 28 that is lowered by the drive of the Z-axis drive motor 57. Therefore, since the correction operation in the XY directions is performed on the tape body 4A side and the θ correction operation is performed on the suction loading nozzle 28 side, the movable part can be reduced in weight and high speed compared to the structure in which all is performed on the suction loading nozzle 28 side. It can cope with the increase in functionality and multifunction.

  Further, a print inspection camera 85 is provided at the next recovery loading station, and the chip part A in the storage groove located in this station is imaged during the turning movement of the second rotating disk 29 and recognized by the recognition processing device 96. The presence or absence of printing of the chip part A processed and loaded on the tape 4 and the direction of printing are inspected.

  If the CPU 91 determines that the result is the recognition result by the recognition processing device 96, the suction loading nozzle 28 that has finished loading at the loading station takes out the chip part A from the storage groove located at the recovery loading station and At this time, the suction loading nozzle 28 which was intended to be loaded at the loading station is controlled to stand by without being loaded. In this state, the CPU 91 intermittently rotates the second rotating disk 29 without moving the tape body 4A, and the next suction loading nozzle 28 is held in the storage groove that has been taken out and emptied as described above. The control is performed to load the chip part A that has been stored, and the defective chip part is stored in an XY movable dedicated tray (not shown) at the next station.

  Then, after the chip component A is inserted into the storage groove of the tape body 4A by the component loading mechanism 50, the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86 and wound on the take-up reel 9 Will be.

  With the above configuration, the operation will be described below with reference to FIGS. First, in FIG. 11 showing the A method, the drive motor 19 is driven to start intermittent rotation, the second rotating disk 29 is intermittently rotated clockwise by the indexing cam unit 31, and the first is driven by the indexing cam unit 30. The rotary disk 27 is synchronously intermittently rotated counterclockwise.

During the turning movement of the first turntable 27, the chip part to be first taken out for sucking and taking out the chip part A to be taken out next on the chip part supply table 24 (die to be taken out at this cycle time) A In order to use the preceding recognition result, the chip part A to be taken out first is imaged by the part recognition camera 63, and when the imaging is finished, the chip part A to be taken out first at time T1 in FIG. The Y-axis drive motor 20 and the X-axis are arranged so that the CPU 91 is positioned immediately below the suction / extraction nozzle 26 from which the CPU 91 moves the chip component A to be first extracted. The drive motor 22 is driven to start the movement of the chip component supply table 24.

  In this case, the CPU 91 drives the Y-axis drive motor 20 and the X-axis drive motor 22 so as to be positioned immediately below the suction / extraction nozzle 26 that moves the chip component A to be extracted first. After the table 24 is moved by one pitch and moved by the correction amount based on the preceding recognition processing result for the chip part A preceding the chip part A to be taken out at the previous time, the first turntable 27 is moved. If the intermittent rotation of the second rotating disk 29 is stopped, the suction extraction nozzle 26 is lowered by driving the Z-axis drive motor 46 for the chip component A to be first extracted on the chip component supply table 24 at this suction extraction station. Then adsorb and take out. That is, the movement of the chip component supply table 24 is started simultaneously with the recognition processing of the chip component A to be picked up, and the preceding recognition processing result of the previous chip component A is obtained for picking up the chip component A to be picked up. By using it, the cycle time for adsorption removal can be shortened. Note that the result of the preceding recognition processing of the chip part A to be first taken out during the current cycle time is used for correction of the chip part A to be taken out next.

  Next, when the drive motor 19 is driven, the second rotating disk 29 is intermittently rotated clockwise by the indexing cam unit 31 and the first rotating disk 27 is synchronously intermittently rotated counterclockwise by the indexing cam unit 30. The station of the first rotating disk 27 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36, and the next This is a recognition station in which the position of the inverted chip component A is imaged by the component recognition camera 65 and recognized by the recognition processing device 96.

  Next, a printing station which is reversed by the reversing device 36 and prints by the printing device 66 on the chip part A having the printing surface as the upper surface and the surface having the terminals as the lower surface will be described below with reference to FIG. An X table 70 that is movable in the X direction via a guide 69 is provided by an X axis drive motor 68 fixed to the mounting plate 67. Further, a Y axis drive motor 71 passes a guide 72 over the X table 70. A Y table 73 that is movable in the Y direction is provided. An ink jet printing unit 78 is provided on a Z moving body 77 that moves in the Z direction by a Z-axis drive motor 74 via a guide 76 provided on a fixed plate 75 on the lower surface of the Y table 73.

  That is, the printing unit 78 is movable in the XY direction and the Z direction, and the CPU 91 performs the X-axis drive motor 68 and the Y-axis drive motor 71 based on the position recognition result of the chip component A by the recognition processing device 96 in the recognition station. In the state in which the XY direction is corrected during the turning movement of the first rotary disk 27 from the recognition station, the chip component is moved by the printing unit 78 lowered by the Z-axis drive motor 74 at the next printing station. A serial number etc. is printed on A. Accordingly, since the printing is performed on the chip component A in the position-corrected state, the printing accuracy can be improved, and the thickness data for each type of chip component stored in the RAM 92 and each suction take-out nozzle 26 can be improved. If the movement level of the printing unit by the Z-axis drive motor 74 is controlled by the CPU 91 in accordance with the data using the height level data, the distance between the picked-up chip component and the printing unit 78 at the time of printing is constant. It is adjusted and printing accuracy can be improved. The stroke control may be performed based on the thickness data or height level data, or based on both data.

  As described above, after the chip part A is sucked and taken out from the chip part supply table 24 by the suction pick-up nozzle 26, it is turned upside down by the reversing device 36 and printed by the printing unit 78 with the chip surface facing upward. Since it is a thing, reduction of the man-hour etc. of sheet replacement can be aimed at.

  The next curing station 79 is a station that dries the ink printed by the printing unit 78 with warm air from a warm air device (not shown).

  The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the chip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is replaced with the suction loading nozzle of the second rotary disk 29. Pass to 28. In other words, the second turntable 29 is handed over at the transfer station of the second turntable 29, and the second turntable 29 rotates in the clockwise direction so that the mounting station and the recovery loading station (the transfer station is the first and the sixth and seventh positions). The rotary disks 27 and 29 are disposed so that the suction loading nozzle 28 is positioned above the tape body 4A of the tape 4.

  That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the tape 4, the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second rotating disk 29 in the station, the line connected to the suction loading nozzle 28 and the traveling line of the tape 4 is 67.5, and the delivery station of the first rotating disk 27 and the second rotating disk Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the 29 transfer stations.

  The next station after the inheriting station of the second turntable 29 is a first inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, Whether or not the current value is within a predetermined range stored in the RAM 92 is checked. Here, if it is not within the predetermined range, the CPU 91 controls not to load the tape body 4A but to store it in a dedicated tray (not shown) described later.

  The next station after the first inspection station is a second inspection station that inspects the characteristics of the chip component by the characteristic inspection device 82, and is a station that conducts a continuity inspection to check whether a current flows through the chip component, for example. Here, if it is inspected by the characteristic inspection device 82 that no current flows, the CPU 91 performs control so that it is not loaded in the tape body 4A but is stored in the dedicated tray.

  At the next recognition station, a loaded component recognition camera 83 is disposed. The chip component A sucked and held by the suction loading nozzle 28 is imaged by the loaded component recognition camera 83, and the nozzle of the chip component A is picked up by the recognition processing device 96. And the appearance inspection (whether there are a predetermined number of bumps, etc.). If a defective chip component is determined by this appearance inspection, the CPU 91 controls the tape body 4A to be stored in the dedicated tray without being loaded.

  The next loading station is provided with a loading position recognition camera 84 for recognizing the position of the storage groove of the tape body 4A on the transport rail 8, and the storage to be loaded while the second turntable 29 is swung. The groove is imaged and the position is recognized by the recognition processing device 96.

  Accordingly, after the chip part A is imaged by the loading part recognition camera 83 and the storage groove is imaged by the loading position recognition camera 84, the recognition processing unit 96 recognizes the position of the chip part A sucked and held by the suction loading nozzle 28. Then, based on the result, the CPU 91 corrects and controls the Y-axis drive motor 13 and the X-axis drive motor 16 in the XY direction, and the angle in the θ direction, that is, the plane direction. Is corrected and controlled for the θ-axis drive motor 52. For this reason, the chip component A can be loaded at an appropriate position in the storage groove by the suction loading nozzle 28 that is lowered by the drive of the Z-axis drive motor 57. Accordingly, since the correction operation in the X and Y directions is performed on the tape body 4A side and the θ correction operation is performed on the suction loading nozzle 28 side, the movable portion can be reduced in weight and high speed compared to the structure in which all is performed on the suction loading nozzle 28 side. It can cope with the increase in functionality and multifunction.

  Further, a print inspection camera 85 is provided at the next recovery loading station, and the chip part A in the storage groove located in this station is imaged during the turning movement of the second rotating disk 29 and recognized by the recognition processing device 96. The presence or absence of printing of the chip part A processed and loaded on the tape 4 and the direction of printing are inspected.

  If the CPU 91 determines that the result is the recognition result by the recognition processing device 96, the suction loading nozzle 28 that has finished loading at the loading station takes out the chip part A from the storage groove located at the recovery loading station and At this time, the suction loading nozzle 28 which was intended to be loaded at the loading station is controlled to stand by without being loaded. In this state, the CPU 91 intermittently rotates the second rotating disk 29 without moving the tape body 4A, and the next suction loading nozzle 28 is held in the storage groove that has been taken out and emptied as described above. The control is performed to load the chip part A that has been stored, and the defective chip part is stored in an XY movable dedicated tray (not shown) at the next station.

  As described above, since the two suction loading nozzles 28 can be positioned above the tape body 4A when the second rotating disk 29 is intermittently rotated and stopped, one is used as a loading station and the other as a loading station. A recovery loading station can be provided, and recovery loading can be performed automatically without bothering the operator and without returning the storage groove of the tape body 4A to the loading position.

  Then, after the chip component A is inserted into the storage groove of the tape body 4A by the component loading mechanism 50, the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86 and wound on the take-up reel 9 Will be.

  As described above, a series of chip component A removal and loading operations are sequentially performed. As shown in the determination flowchart of FIG. 13, the chip component A is removed from the chip component supply table 24 by the suction extraction nozzle 26. When the suction / unloading cannot be performed, the CPU 91 increments a first counter (not shown) by 1 and determines whether or not the count value has reached the set value N1.

  When the set value N1 is reached, the CPU 91 performs control by switching to the B method as described later. Further, when the suction can be taken out or the suction cannot be taken out but does not reach the set value N1, the CPU 91 determines whether or not there is a variation in the preceding recognition result. If the position of the chip part A is within the reference range data stored in the RAM 92 by the prior recognition, the A method is maintained as it is, and if it is out of the reference range, that is, there is a variation, the second counter (not shown) is incremented by 1, It is determined whether or not the count value has reached the set value N2, and if not reached, the A method is maintained as it is, and if reached, the CPU 91 switches to the B method and performs control.

  Next, the above-described B method will be described with reference to FIGS. First, in order to start intermittent rotation, the drive motor 19 is driven, the second rotating disk 29 is intermittently rotated clockwise by the indexing cam unit 31, and the first rotating disk 27 is rotated counterclockwise by the indexing cam unit 30. With respect to the chip component A to be taken out first at the previous cycle time, the component supply table 24 is moved by one pitch by driving the Y-axis drive motor 20 and the X-axis drive motor 22 in synchronization with intermittent rotation. Based on the result of recognition processing, it is moved by the correction amount and stopped.

  Then, after the component supply table 24 stops, at the time T2 in FIG. 12, the preceding recognition of the next chip component A to be taken out on the chip component supply table 24 is started while the first rotary disk 27 is turning. To do. That is, the chip part A to be taken out next is imaged by the part recognition camera 63, and when the imaging is completed, the position of the chip part A is subjected to the preceding recognition process by the recognition processing device 96, and the first turntable 27 If the intermittent rotation of the second rotating disk 29 is stopped, the suction extraction nozzle 26 is lowered by driving the Z-axis drive motor 46 for the chip component A to be first extracted on the chip component supply table 24 at this suction extraction station. Then adsorb and take out.

  That is, based on the result of recognition processing for the chip part A to be taken out first at the previous cycle time, the chip part supply table 24 including the correction amount is moved, and the chip part to be taken out first. Although A is adsorbed and taken out, the preceding recognition process in this cycle is for the chip part A to be taken out next.

  Since the operation after the adsorption and removal is the same as that of the A method, the description is omitted here.

  As described above, according to the present embodiment, according to the B method, based on the recognition processing result of the chip part A to be taken out first at the previous cycle time, the chip part supply including the correction amount is also provided. The table 24 is moved to suck and take out the chip part A to be taken out first, and in this suction take-out cycle, the preceding recognition process for the chip part A to be taken out next is executed, and the chip part A to be taken out next is recognized. Although the processing result is used for the suction / extraction operation of the chip part A to be extracted next, positioning for extraction can be performed accurately, but the cycle time becomes long.

  However, in the A system, during the turning movement of the first turntable 27, the chip part A to be picked up and picked up first is picked up and precedent recognition processing is performed, and the part supply table 24 is moved by one pitch. The chip part to be picked up first after being moved by the correction amount based on the recognition processing result of the chip part A preceding the chip part A to be taken out at the previous cycle time and stopped. Since A is adsorbed and taken out, and the preceding recognition process is performed while the component supply table 24 is moving, the cycle time is shortened and the production efficiency is improved as compared with the B method.

  In the A method, the component supply table 24 is moved for taking out the current chip component A based on the previous recognition result of the chip component A, but there is no problem because it does not affect the picking out. When the recognition result varies or when the suction extraction rate decreases, the control is switched to the B method, and there is no problem from this point.

  Therefore, processing is normally performed in the A method, and when the recognition results vary or the suction extraction rate decreases, the control is switched to the B method, so that throughput can be improved and suction is reliably performed. It can be taken out.

  Further, the count value of the first counter and the count value of the second counter are added to determine whether or not the added value has reached the set value N3, and before the count value of each counter reaches N1 and N2. In addition, when the added value reaches N3, the CPU 91 may be controlled by switching from the A method to the B method. By controlling in this way, the switching from the A method to the B method is accelerated, It is possible to stabilize the adsorption and removal. That is, when N1 is 4, for example, and N2 is 8, for example, N3 is set to 5, for example, slightly larger than N1. Further, when N1 and N2 are not set, and the addition value reaches N3 (in this case, it is preferable to set the number to be smaller than “8” when at least N2 is set). Switching control from the A method to the B method may be performed.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of a taping device. It is a front view of a taping device. It is a right view of a taping device. It is a top view for demonstrating the synchronous rotation of the 1st and 2nd turntable. It is a figure for demonstrating a components extraction mechanism. It is a figure for demonstrating a component loading mechanism. It is a top view of the stop state of the 1st and 2nd turntable. It is a top view during the turning movement of the 1st and 2nd turntable. It is a side view of a printing mechanism. It is a control block diagram. It is a figure which shows the prior recognition flowchart of A system. It is a figure which shows the prior | preceding recognition timing table | surface of A system and B system. It is a figure which shows the determination flowchart of A system or B system. It is a figure which shows the flowchart of a B system.

Explanation of symbols

1 Taping device body 24 Parts supply table (wafer table)
26 Suction take-out nozzle 27 First turntable 63 Parts recognition camera 91
92 RAM
96 Recognition processing device

Claims (6)

Based on the image of the die to be picked up picked up by the component recognition camera, the die processing unit recognizes the position of the die on the wafer table before picking up by the suction nozzle, and moves the wafer table based on the recognition processing result. In the die pick-up device that repeats the cycle time for picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device First control means for executing recognition processing and controlling the wafer table to move in parallel with the recognition processing;
The wafer table is moved by one pitch so that the movement of the wafer table performed in parallel with the recognition process by the first control means is positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. Second control means that is executed by moving the wafer table by a correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time,
After that, there is provided third control means for controlling the suction nozzle to pick up and take out a die to be taken out at the current cycle time after stopping the intermittent rotation of the turntable and stopping the movement of the wafer table. Die pickup device. Based on the image of the die to be picked up picked up by the component recognition camera, the die processing unit recognizes the position of the die on the wafer table before picking up by the suction nozzle, and moves the wafer table based on the recognition processing result. In the die pick-up device that repeats the cycle time for picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device A recognition process is executed and the wafer table is controlled to move in parallel with the recognition process, and the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table is First control means for controlling the suction nozzle to suck and take out ;
The wafer table is moved in parallel with the recognition process by the first control means so that the wafer table is positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. Second control means that is executed by moving the wafer table by a correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time, and moving by one pitch.
When the suction of the die cannot be performed by the suction nozzle from the wafer table, the counter counts the number of times the die cannot be suctioned and determines whether the count value has reached the set value. A determination means;
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. And a third control means for adsorbing and taking out the die pick-up apparatus. Based on the image of the die to be picked up picked up by the component recognition camera, the die processing unit recognizes the position of the die on the wafer table before picking up by the suction nozzle, and moves the wafer table based on the recognition processing result. In the die pick-up device that repeats the cycle time for picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device A recognition process is executed and the wafer table is controlled to move in parallel with the recognition process, and the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table is First control means for controlling the suction nozzle to suck and take out ;
The wafer table is moved in parallel with the recognition process by the first control means so that the wafer table is positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. Second control means that is executed by moving the wafer table by a correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time, and moving by one pitch.
First determination means for determining whether or not the recognition result is within a reference range;
A second determination unit that counts the determined number of times by a counter when it is determined that the value is not within the reference range, and determines whether the count value has reached a set value;
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. And a third control means for adsorbing and taking out the die pick-up apparatus. Based on the image of the die to be picked up picked up by the component recognition camera, the die processing unit recognizes the position of the die on the wafer table before picking up by the suction nozzle, and moves the wafer table based on the recognition processing result. In the die pick-up method for repeating the cycle time for picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device Performing a recognition process, moving the wafer table in parallel with the recognition process ,
The movement of the wafer table performed in parallel with the recognition process moves the wafer table by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. And is performed by moving the wafer table by the correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time,
Thereafter, after the intermittent rotation of the rotating disk and the movement of the wafer table are stopped, the die to be taken out at the current cycle time is picked up by the suction nozzle and taken out. Based on the image of the die to be picked up picked up by the component recognition camera, the die processing unit recognizes the position of the die on the wafer table before picking up by the suction nozzle, and moves the wafer table based on the recognition processing result. In the die pick-up method for repeating the cycle time for picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device While performing recognition processing, the wafer table is moved in parallel with the recognition processing, and the suction nozzle sucks the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table. Take out
The movement of the wafer table performed in parallel with the recognition process moves the wafer table by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. And is performed by moving the wafer table by the correction amount based on the recognition processing result for the die taken out at the previous cycle time at the previous cycle time ,
If the suction nozzle cannot remove the die from the wafer table, the counter counts the number of times that the die cannot be sucked and determines whether the count value has reached the set value. ,
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. The die pick-up method characterized by adsorbing and taking out. Based on the image of the die to be picked up picked up by the component recognition camera, the die processing unit recognizes the position of the die on the wafer table before picking up by the suction nozzle, and moves the wafer table based on the recognition processing result. In the die pick-up method for repeating the cycle time for picking up the die,
During the intermittent rotation of a rotating disk having a plurality of suction nozzles at a predetermined interval on the periphery, a die to be taken out at the current cycle time on the wafer table is imaged by the component recognition camera, and the recognition processing device While performing recognition processing, the wafer table is moved in parallel with the recognition processing, and the suction nozzle sucks the die to be taken out at the current cycle time after the intermittent rotation stop of the rotary table and the movement stop of the wafer table. Take out
The wafer table is moved in parallel with the recognition process by moving the wafer table by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out in this cycle time. It is executed by moving the wafer table by the correction amount based on the recognition processing result for the die taken out at the previous cycle time at the cycle time of
Determining whether the recognition result is within a reference range;
When it is determined that it is not within the reference range, the determined number of times is counted by a counter, and it is determined whether the count value has reached a set value,
When it is determined that the set value has been reached, the wafer table is moved by one pitch so as to be positioned immediately below the suction nozzle that moves the die to be taken out at the current cycle time on the wafer table. In addition, after the movement of the wafer table at the previous cycle time, the die to be taken out at the current cycle time is imaged and moved by the correction amount based on the result of recognition processing, and then the die to be taken out first is moved to the suction nozzle. The die pick-up method is characterized in that the adsorbing nozzle adsorbs and takes out the adsorbing nozzle.

Images