JP4681258B2 - Taping device - Google Patents

Description

  In the present invention, the chip component is taken out from the chip component supply unit by the suction take-out nozzle, the chip components are sequentially loaded into the respective storage recesses in the storage tape, and the opening on the upper surface of the storage recess is closed with the cover tape. The present invention relates to a taping device.

  This type of taping device is widely known in Patent Document 1 and the like. According to the technique disclosed in this Patent Document 1, after the chip component is loaded into the storage recess in the storage tape, the suction loading nozzle is loaded, and then the second rotary disk is swung by the print inspection camera as the print inspection apparatus. The chip part in the storage recess is imaged, and recognition processing is performed by a recognition processing device, and the presence / absence of printing and the direction of printing of the chip part loaded on the storage tape are inspected.

Then, when it is determined as defective based on the recognition result by the recognition processing device, the suction loading nozzle that has been loaded takes out the chip component from the storage recess and collects it in the discharge box or defective component tray.
JP 2004-10150 A

  However, since the suction loading nozzle is arranged (passes) directly under the print inspection camera of the print inspection station for imaging the chip component loaded in the storage recess of the tape body, the chip component However, depending on the type of chip parts, there is a problem in that an image on the printing surface that is favorable for printing inspection cannot be obtained. In addition, since the printing inspection is performed in a state where the tape is loaded in the storage recess of the storage tape, the posture of the chip component in the storage recess may be stabilized depending on the type of the chip component or the structure of the storage recess of the storage tape. In some cases, there was an inspection defect due to the inclination of the chip parts.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a taping device that can perform a print inspection with a stable posture of a chip component and can obtain a good print surface image for the print inspection of a chip component.

In the first invention, the chip components are taken out from the chip component supply section by the suction take-out nozzle, the chip components are sequentially loaded into the respective storage recesses in the storage tape, and the opening on the upper surface of the storage recess is closed with the cover tape. In the taping device, the chip component sucked and held by the suction take-out nozzle by the print inspection camera in the middle of the transfer from taking out the chip component from the chip component supply unit and loading it into the storage recess in the storage tape An image is picked up, and the presence / absence of printing, printing error, printing quality, and printing direction are inspected, and chip components determined to be defective by the inspection are not loaded on the storage tape .

According to a second aspect of the present invention, a plurality of suction / take-out nozzles for taking out chip components from the chip-part supply unit are arranged at a peripheral portion with a predetermined interval, and the suction take-out nozzles are turned upside down after taking out the chip components. A suction loading nozzle that inherits the chip components from the first take-out disk equipped with the device and the suction take-out nozzles reversed by the reversing device and sequentially loads the chip components into the respective storage recesses in the storage tape. And a plurality of second rotating disks arranged at a predetermined interval in the taping device, the suction extraction nozzle of the first rotating disk takes out the chip components from the chip component supply unit, In the middle of passing the chip component from the suction take-out nozzle reversed by the reversing device to the suction loading nozzle of the second rotating disk, Ri imaging the chip component held by suction on the suction removal nozzle, presence or absence of printing, an error of printing, inspects the quality and the print direction of print, the chip component it is determined that printing failure by the inspection the The storage tape is not loaded .

Furthermore, in the third aspect of the present invention, the chip components are taken out from the chip component supply section by the suction take-out nozzle, the chip components are sequentially loaded into the respective storage recesses in the storage tape, and the opening on the upper surface of the storage recess is closed with the cover tape In the taping apparatus constructed as described above, the chip component was sucked and held by the suction take-out nozzle by the first print inspection camera in the middle of the transfer from taking out the chip component from the chip component supply unit and loading it into the storage recess in the storage tape. A first print inspection is performed by imaging the chip component to inspect the presence / absence of printing, printing error, printing quality and printing direction, and the chip component loaded in the housing recess in the housing tape is a second. captured by the print inspection camera, the presence or absence of printing, an error of printing, at least one of the second print-inspection for inspecting the orientation of the quality and printing of the printable selection And, wherein the first chip component it is determined that the defective printing by the print inspection is not loaded on the storage tape, the second chip component it is determined that the defective printing by the print inspection, characterized in that retrieving from said storage recess And

In the present invention, since the chip part is imaged by the print inspection camera while the suction take-out nozzle holds the chip part, the presence / absence of printing, the printing error, the printing quality, and the printing of the chip part with a stable posture of the chip part are performed. It is possible to provide a taping device capable of inspecting the orientation and obtaining an image of a good print surface for the print inspection of the chip component.

  Hereinafter, an embodiment of a taping device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG. Reference numeral 1 denotes a taping device main body. A carrier tape supply reel 3 is rotatably locked to a pin 2 erected on a side wall portion of the main body 1, and a tape main body (“carrier tape” wound around the tape supply reel 3. 4A is wound and accommodated via a transport rail 8 having a transport path such as a pulley 5, feed pulleys 6 and 7 and a tape body 4A for applying an appropriate tension to the tape body 4A. It is fixed to the reel 9.

  Then, the tape body 4A is stored while the tape body 4A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up storage reel 9 by a rotation driving system (not shown). After the chip component A is inserted (loaded) into the recess and further conveyed to a predetermined position, the opening on the upper surface of the storage recess is covered with the cover tape 4C supplied from the cover tape supply reel 10, and then the take-up storage reel 9 It will be rolled up. As described above, the storage tape 4 is formed by the tape main body 4A provided with storage recesses at a predetermined interval and the cover tape (top tape) 4C that is pressure-bonded to the upper surface thereof. The main body 4A is formed of a bottom tape and a spacer.

  The feed pulleys 6 and 7, the transport rail 8, the cover tape supply reel 10 and the like are provided on the mounting plate 11. A Y table 15 that is driven by a Y-axis drive motor 13 and is guided by a guide 14 to move in the Y direction is provided on a fixed plate 12 that is fixed to the taping device main body 1. An X table 18 that is driven by an X-axis drive motor 16 and is guided by a guide 17 to move in the X direction is provided, and the mounting plate 11 is fixed to the X table 18.

  Therefore, when the X table 18 and the Y table 15 are moved by driving the X axis drive motor 16 and the Y axis drive motor 13, the transport rail 8 and the tape that moves along the transport rail 8 via the mounting plate 11 are moved. The main body 4A and the like can move in the XY directions.

  A Y table 21 that can be moved in the Y direction by a Y axis drive motor 20 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 22 on the Y table 21. A chip component supply table 24 is provided via the X moving body 23. On the supply table 24, a wafer affixed to a sheet is diced and divided into individual dies (hereinafter referred to as “chip parts A”). The chip component A is picked up and taken out by a suction take-off nozzle 26 described later while being pushed up by a push-up pin (not shown) from the back side.

  The upper mounting plate 25 fixed to the taping device main body 1 is provided with, for example, eight suction take-out nozzles 26 for taking out the chip components A from the chip component supply table 24 at a predetermined interval on the peripheral portion. A first rotating disk 27 that rotates intermittently through the indexing cam unit 30 by driving 19A is provided, and a suction loading nozzle 28 for loading the chip component A into the housing recess is provided at a predetermined interval on the upper mounting plate 25. In the peripheral portion, for example, there are provided, for example, eight second rotating disks 29 that are intermittently rotated via the indexing cam unit 31 by driving the driving motor 19B.

  The first rotating disk 27 and the second rotating disk 29 rotate intermittently synchronously, and the nozzles 26 and 28 of the two rotating disks 27 and 29 can be made to correspond to each other. It can be delivered from the suction extraction nozzle 26 to the suction loading nozzle 28. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same.

  Next, the component take-out mechanism 35 will be described in detail with reference to FIG. For example, eight suction / extraction nozzles 26 are arranged on the peripheral portion of the first rotating disk 27 at a predetermined interval, and each suction / extraction nozzle 26 is provided by each reversing device 36 so as to be vertically inverted. . That is, when the drive shaft 39 is rotated via the coupling 38 by the driving of the reverse drive motor 37, the attachment body 40 fixed to the drive shaft 39 is also rotated, and the take-out nozzle 26 is inverted upside down.

  Further, since the guide 42 can move up and down along the guide 41 provided on the mounting body 40, the take-out nozzle 26 attached to the nozzle mounting body 43 fixed to the guide 42 can move up and down. The upper body 40A of the mounting body 40 and the lower side 43A of the nozzle mounting body 43 are always urged upward by a spring 44, but the stopper 45 is locked to the upper side 40A of the mounting body 40. This limits the upper limit.

  Further, the suction take-out nozzle 26 can be lowered when the operating portion 48A of the operating body 48 that can be moved up and down by the guide 47 by driving the Z-axis drive motor 46 presses the head of the nozzle mounting body 43, For example, the chip part A on the chip part supply table 24 can be taken out.

  Next, the component loading mechanism 50 will be described in detail with reference to FIG. For example, eight suction loading nozzles 28 are provided at a peripheral portion of the second rotating disk 29 at a predetermined interval, and the nozzles provided at positions where the suction loading nozzles 28 are eccentric by the rotating devices 51. The shaft body 28A is provided to be rotatable about the axial direction. That is, the transmission belt 55 is stretched between a pulley 53 provided on the drive shaft of the θ-axis drive motor 52 and a pulley 54 fixed around the cylindrical body 62, and the cylindrical body 62 is interposed via the bearing 56. The second turntable 29 is rotatably provided.

  The suction loading nozzle 28 is guided by the guide 61 when the operating portion 59A of the operating body 59 that can be moved up and down by the guide 58 by the drive of the Z-axis drive motor 57 presses the projection 60A of the nozzle mounting body 60. The chip component A that is sucked and held can be loaded into the storage recess of the tape body 4A on the transport rail 8. That is, since the nozzle shaft body 28A can move up and down in the cylindrical body 62 and can rotate θ with the cylindrical body 62, the suction loading nozzle 28 provided at an eccentric position below the nozzle shaft body 28A also moves up and down. And can be rotated by θ.

  Here, based on FIG. 8, the control block diagram of the taping device will be described. 91 is a CPU as a control device that controls the operation related to loading of the chip component A of the taping device, and 92 is for each type of chip component A. The RAM (Random Access Memory) and 93 are ROM (Read Only Memory) for storing the thickness data of each, the height level data for each suction take-out nozzle 26, and the like. Based on the data stored in the RAM 92, the CPU 21 controls the operation related to the loading of the chip part A of the taping device in accordance with the program stored in the ROM 93. That is, the CPU 91 controls the driving of each driving motor via the driving circuit 94 and the interface 95.

  A recognition processing device 96 is connected to the CPU 91 via the interface 95. The recognition processing device 96 performs recognition processing of an image captured by each recognition camera. Is sent out. That is, the CPU 91 outputs an instruction to the recognition processing device 96 so as to perform recognition processing (calculation of the amount of displacement) of the images captured by each recognition camera, and receives the recognition processing result from the recognition processing device 96. is there.

  Next, as shown in FIGS. 6 and 7, the station located at 12:00 of the first rotating disk 27 is a suction extraction station where the suction extraction nozzle 26 sucks and extracts the chip component A from the chip component supply table 24. is there. In this suction take-out station, the chip part A to be taken out next on the chip part supply table 24 is picked up by the part recognition camera 63 while the first turntable 27 is swung, and the position of the chip part A is recognized. A recognition process is performed at 96, and the CPU 91 drives the Y-axis drive motor 20 and the X-axis drive motor 22 so as to be positioned immediately below the suction extraction nozzle 26 from which the chip component A to be extracted is moved to supply the chip components. The table 24 is moved, and at this suction / extraction station, the chip part A on the chip part supply table 24 is driven by the Z-axis drive motor 46 so that the suction / extraction nozzle 26 is lowered and sucked out.

  Next, the second rotating disk 29 is intermittently rotated clockwise through the indexing cam unit 31 by driving the driving motor 19B, and the first rotating disk 27 is moved through the indexing cam unit 30 by driving the driving motor 19A. Synchronously rotate counterclockwise. The station of the first rotating disk 27 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36. The station is a print inspection station in which the print surface of the chip component A that is turned upside down is imaged from above by a print inspection camera 65 as a print inspection device and recognized by the recognition processing device 96. Based on the captured image, the recognition processing device 96 recognizes and inspects the presence / absence of printing, printing errors, printing quality, printing orientation, chip component orientation or dirt based on this printing orientation, and the like. Here, the orientation of the chip component may be inspected based on the outer shape of the recognized chip component based on the captured image. When processed by the recognition processing device 96 as a printing defect (including a difference in the orientation of chip parts), the CPU 91 does not load the tape main body 4A but sucks it into a dedicated tray (not shown) described later. The loading nozzle 28 and the like are controlled.

  The printing inspection camera 65 is fixed with an illuminating device for illuminating the printing surface of the chip part sucked and held by the suction take-out nozzle 26, and is omitted in the drawing.

  The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the tip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is sucked by the second rotary disk 29. Delivered to the loading nozzle 28. At the transfer station of the first turntable 27, in other words, at the transfer station of the second turntable 29, the print inspection camera 65, which is also a component recognition camera, picks up the image of the chip part A sucked and held by the suction take-out nozzle 26. Thus, the X-direction and Y-direction shifts as a result of the recognition processing by the recognition processing device 96 are eliminated by correcting the rotation angle of the second rotating disk 29 and correcting the position of the eccentric suction loading nozzle 28 by the rotation of the nozzle shaft body 28A. Is done.

  That is, based on the recognition processing result of the recognition processing device 96 based on the image picked up by the print inspection camera 65, the CPU 91 drives the drive motor 19B for rotating the second rotating disk 29 and the θ-axis drive for rotating the nozzle shaft body 28A. By controlling the motor 52, the deviation in the X direction and the Y direction can be corrected. Therefore, the position of the chip component A sucked and held by the delivered suction / extraction nozzle 26 and the position of the suction loading nozzle 28 is made as close as possible to be sucked and held by the suction / outtake nozzle 26 provided on the first rotating disk 27. The chip component A can be reliably delivered from the suction take-out nozzle 26 to the suction loading nozzle 28 provided on the second rotating disk 29. Further, if the recognition processing result based on the image picked up by the print inspection camera 65 indicates that the printing state is poor and cannot be read and is regarded as a defective chip part, the CPU 91 determines that the defective chip part is a tape body 4A at a loading station described later. Without being loaded into the tray, it is stored in a dedicated tray (not shown) described later.

  Then, the second rotating disk 29 is rotated in the clockwise direction by the transfer at the transfer station of the second rotating disk 29, and is adsorbed at the loading station and the recovery loading station (the 6th and the seventh as the first transfer station). Both rotary disks 27 and 29 are arranged so that the loading nozzle 28 is positioned above the tape body 4A of the storage tape 4.

  That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the storage tape 4, both the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second turntable 29 in the loading station, the line connected to the suction loading nozzle 28 and the travel line of the tape 4 is 67.5, and the delivery station and the second rotation of the first turntable 27 Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the transfer station of the disk 29.

  The next station after the transfer station of the second turntable 29 is an inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, and the current value is Whether it is within a predetermined range stored in the RAM 92 is checked. Here, if it is not within the predetermined range, the CPU 91 controls the suction loading nozzle 28 and the like so as to be stored in a dedicated tray (not shown) to be described later without being loaded into the tape body 4A.

  At the recognition station next to the inspection station, a loaded component recognition camera 83 is arranged, and the chip component A sucked and held by the suction loading nozzle 28 is imaged by the loaded component recognition camera 83 and the recognition processing device 96 performs the corresponding processing. The position of the chip component A with respect to the nozzle is recognized and an appearance inspection (whether there are a predetermined number of bumps, etc.) is performed. If a defective chip component is determined by this appearance inspection, the CPU 91 controls the suction loading nozzle 28 and the like so as to be housed in the dedicated tray without being loaded into the tape body 4A.

  The next next station is a loading station in which the chip component held by the suction loading nozzle 28 is loaded into the storage recess of the storage tape 4. The chip component A held by the suction loading nozzle 28 by the loading component recognition camera 83 is loaded. Based on the result of the image pickup and the recognition processing by the recognition processing device 96, the chip component is loaded in a state where the deviation in the θ direction (angle in the plane direction) and the deviation in the plane direction (XY direction) are corrected.

  That is, the CPU 91 corrects and controls the θ-axis drive motor 52 for the deviation in the θ direction and rotates the suction loading nozzle 28 provided at a position eccentric to the shaft body 28A via the cylindrical body 62 and the nozzle shaft body 28A. The X-axis drive motor 16 and the Y-axis drive motor 13 are corrected and controlled to correct and move the X table 18 and the Y table 15 with respect to the displacement in the plane direction. The tape body 4A moving along the rail 8 is corrected and moved in the X direction.

  In this case, when the suction loading nozzle 28 moved to the loading station is in the recognition station, the suction extraction nozzle 26 in the fourth station is set as the suction extraction station of the first rotating disk 27 as the first station. Taking into account the rotation correction amount of the second turntable 29 for correcting the held chip component A at the next next delivery station (in addition to the recognition processing result at the recognition station of the electronic component), the second The CPU 91 corrects and controls the θ-axis drive motor 52, the X-axis drive motor 16, and the Y-axis drive motor 13 at the loading station of the rotary disk 29.

  For this reason, the chip component A can be loaded into the appropriate position in the storage recess by the suction loading nozzle 28 that is lowered by the drive of the Z-axis drive motor 57. Accordingly, since the correction operation in the plane direction is performed on the tape body 4A side and the correction operation in the angular direction (θ) is performed on the suction loading nozzle 28 side, the movable portion is compared with the structure in which all is performed on the suction loading nozzle 28 side. It can be reduced in weight, and can cope with higher speed and more functions.

  Further, a print inspection camera (second print inspection camera) 85 is also provided at the next recovery loading station, and the chip part A in the housing recess located in this station is imaged while the second turntable 29 is swung. Then, the presence / absence of printing of the chip part A that has been recognized by the recognition processing device 96 and loaded on the tape 4, the printing error, the printing quality, the printing direction, the direction or dirt of the chip part based on this printing direction, etc. Recognize and check again.

  When the CPU 91 determines that the chip is defective based on the recognition result of the recognition processing device 96, that is, the result of the recognition processing device 96 performing recognition processing based on the image captured by the print inspection camera 85 on the printed surface of the chip component. When it is determined that the component is defective (for example, the difference in the storing direction of the chip component), the suction loading nozzle 28 that has finished loading at the loading station is inserted into the chip component A from the storage recess positioned at the recovery loading station. At this time, the suction loading nozzle 28 to be loaded at the loading station is controlled to stand by without being loaded. In this state, the CPU 91 intermittently rotates the second rotating disk 29 without moving the tape body 4A, and the next suction loading nozzle is placed in the storage recess that has been taken out and emptied as described above at the recovery loading station. The chip part A held by the control unit 28 is controlled to be loaded, and the defective chip part held by the preceding suction loading nozzle 28 is stored in a dedicated tray disposed at the next station of the recovery loading station. Thus, the suction loading nozzle 28 and the like are controlled.

  The taping device includes a touch panel switch 98 provided on a monitor 97 which is a display means such as a CRT. The touch panel switch 98 includes a first switch for selecting whether or not to perform a print inspection based on the image of the print inspection camera 65, and whether or not to perform a print inspection based on the image of the print inspection camera 85. A second switch to be selected, for example, when it is correctly stored due to a slight inclination of the bottom surface of the storage recess, but is determined to be defective according to the print inspection based on the image of the print inspection camera 85 In this case, the print inspection is not performed by operating the second switch, and the determination of the defect can be avoided.

  As described above, after the chip component A is inserted into the storage recess of the tape body 4A by the component loading mechanism 50, the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86, and wound and stored. The reel 9 is wound up.

  As described in detail, the present embodiment is an embodiment in which the chip component A is loaded on the storage tape 4 by the suction loading nozzle 29. However, the present invention is not limited to this. The present invention can also be applied to a form in which it is transferred and stored in (not shown). In this case, the tray is configured to be movable in the XY directions by driving the X-axis drive motor and the Y-axis drive motor.

  According to the embodiment as described above, since the chip part is imaged by the print inspection camera 65 in a state where the suction / extraction nozzle 26 sucks and holds the chip part, the print inspection can be performed with a stable posture of the chip part. Further, conventionally, the suction loading nozzle 28 is arranged (passed) directly under the print inspection camera of the print inspection station for imaging the chip component loaded in the storage recess of the tape body. However, the lighting device cannot be arranged near the chip component, and depending on the type of the chip component, there is a problem that an image of a good print surface cannot be obtained for the print inspection. Since the illumination device can be disposed in the vicinity of the chip component being held, an image on the printing surface that is favorable for chip component print inspection can be obtained.

  In addition, when it is determined as a defective chip part based on the imaging result by the print inspection camera 65, the chip part is not loaded into the storage tape, and therefore, it is not necessary to perform a re-adsorption operation for discharging the chip part. Tact down associated with the discharging operation can be suppressed. Furthermore, it is not necessary to provide a special inspection table for printing inspection.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view which shows a taping apparatus. It is a front view of a taping device. It is a right view of a taping device. It is a figure for demonstrating a components extraction mechanism. It is a figure for demonstrating a component loading mechanism. It is a top view of the stop state of the 1st and 2nd turntable. It is a top view during the turning movement of the 1st and 2nd turntable. It is a control block diagram of this taping apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 24 Chip component supply table 26 Adsorption take-out nozzle 27 1st rotation board 28 Adsorption loading nozzle 29 2nd rotation board 36 Inversion apparatus 65 Printing inspection camera 91 CPU
96 Recognition processing device

Claims (3)

In a taping device in which a chip component is taken out from a chip component supply section by a suction take-out nozzle, chip components are sequentially loaded into each storage recess in the storage tape, and the opening on the upper surface of the storage recess is closed with a cover tape. The chip component picked up by the suction pickup nozzle is imaged by a print inspection camera in the middle of transfer from taking out the chip component from the chip component supply unit and loading it into the storage recess in the storage tape, and whether or not printing is performed A taping apparatus that performs inspection of printing error, printing quality, and printing direction, and does not load a chip part that is determined to be printing defective by the inspection onto the storage tape . A plurality of suction take-out nozzles for taking out chip components from the chip component supply unit are arranged at a peripheral portion with a predetermined interval, and a first reversing device is provided that reverses the suction take-out nozzles up and down after taking out the chip components. A suction loading nozzle that inherits the chip components from the rotary disk and the suction take-out nozzle that has been reversed by the reversing device and sequentially loads the chip components into the respective storage recesses in the storage tape has a predetermined interval at the periphery. In a taping apparatus including a plurality of second rotating disks arranged, a state in which the suction extraction nozzle of the first rotating disk extracts a chip component from the chip component supply unit and is reversed by the reversing device. In the middle of transferring the chip component from the suction take-out nozzle to the suction loading nozzle of the second rotating disk, the suction take-out nozzle is used by a print inspection camera. Imaging the chip component attracted to and held in Le, the presence or absence of printing, an error of printing, inspects the quality and the print direction of print, the chip component it is determined that printing failure by testing loaded in the storage tape Taping device characterized by not . In a taping device in which a chip component is taken out from a chip component supply section by a suction take-out nozzle, chip components are sequentially loaded into each storage recess in the storage tape, and the opening on the upper surface of the storage recess is closed with a cover tape. Imaging the chip component sucked and held by the suction take-out nozzle by the first print inspection camera in the middle of transfer from taking out the chip component from the chip component supply unit and loading it into the storage recess in the storage tape, A first print inspection for inspecting the presence / absence of printing, printing error, printing quality and printing orientation, and chip components loaded in the storage recesses in the storage tape are imaged by a second print inspection camera; It is possible to select at least one of the second printing inspection for checking the presence / absence of printing, the printing error, the printing quality and the printing direction, and the first mark Chip component it is determined that printing failure by the inspection is not loaded on the storage tape, the second chip component it is determined that the defective printing by the print inspection taping apparatus characterized by retrieving from said storage recess.

Images