JP2012046218A - Taping device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the quality of a housing tape by detecting whether any unexpected accident occurs after the respective housing recessed parts of a tape body are sequentially loaded with chip components to close the openings of the housing recessed parts with a cover tape.SOLUTION: If adhesives 92A and 92B are not sufficiently applied, when air in air flow paths 90A and 90B is sucked by an air suction source, parts, to which the adhesives 92A and 92B are not sufficiently applied, are peeled off. Thus, a cover tape 4C rises to close the lower openings of the air flow paths 90A and 90B formed in a pressure-bonding detector 88, to suddenly increase the pressure detection value of each pressure sensor. Thereby detecting that pressure bonding is not sufficient.

Description

  The present invention relates to a taping device in which chip parts are sequentially loaded by suction nozzles into respective storage recesses of a tape main body fed by a feeding device, and thereafter an opening of the storage recess is closed with a cover tape.

  A taping device in which chip parts are sequentially loaded by suction nozzles into respective storage recesses of a tape body (carrier tape) fed by a feeding device and then the opening of the storage recess is closed with a cover tape is widely known in Patent Document 1 or the like. It has been. In general, after the chip parts are sequentially loaded into the storage recesses of the tape body, the opening of the storage recess is closed with a cover tape. The presence / absence and loading direction of the chip parts before the closing is inspected. It was.

Japanese Patent Laid-Open No. 2002-240802

  However, for some reason, the chip component may pop out of the storage recess after loading, or the direction of the loading direction may change, and the opening of the storage recess is blocked with a cover tape via adhesive. It is possible that a serious situation will occur.

  Therefore, the present invention detects whether or not an unexpected situation has occurred after the chip parts are sequentially loaded into the storage recesses of the tape body and the opening of the storage recess is closed with the cover tape. The purpose is to improve the quality of the storage tape.

  For this reason, the first invention is the taping device in which the chip parts are sequentially loaded by the suction nozzles in the respective housing recesses of the tape body fed by the feeding device, and then the opening of the housing recess is closed with the cover tape. An adhesive detection device is provided for detecting whether or not the cover tape is bonded to the tape body after the closing operation of closing the opening of the recess with the cover tape, and the adhesion detection device communicates with an air suction source. And an inspection part in which an air flow path is formed so that the opening end faces an adhesive part between the tape body and the cover tape, and the cover tape that is not adhered to the tape body by the air suction source includes the air flow. It is characterized by comprising a pressure detection sensor whose detected pressure value increases when the opening end of the path is closed.

  According to a second aspect of the present invention, there is provided a taping device in which the chip parts are sequentially loaded by suction nozzles into the respective housing recesses of the tape body fed by the feeding device, and then the opening of the housing recess is closed with a cover tape. After performing the closing operation of closing the opening with the cover tape, and after performing the closing operation, the cover tape is used to inspect the presence / absence and loading direction of the chip component loaded in the storage recess. An adhesive detection device is provided for detecting whether or not there is an unbonded portion on the tape body.

  According to a third aspect of the present invention, there is provided a taping device in which the chip parts are sequentially loaded by suction nozzles into the respective housing recesses of the tape main body fed by the feeding device, and then the opening of the housing recess is closed with a cover tape. After performing the closing operation of closing the opening with the cover tape, the tape main body is imaged separately from the imaging in order to inspect the presence / absence and the loading direction of the chip component loaded in the storage recess. An image pickup device for picking up an image of an adhesive portion between the cover tape and the cover tape is provided.

  The present invention detects whether or not an unexpected situation has occurred after the chip parts are sequentially loaded into the storage recesses of the tape body and the opening of the storage recess is closed with the cover tape. The quality of the storage tape can be improved.

It is a top view which shows a taping apparatus. It is a front view of a taping device. It is a right view of a taping device. It is a figure for demonstrating a components extraction mechanism. It is a figure for demonstrating a component loading mechanism. It is a top view of the stop state of the 1st and 2nd turntable. It is a top view during the turning movement of the 1st and 2nd turntable. It is a front view of the taping apparatus which concerns on the loading operation | movement of the chip | tip part loading to the storage recessed part of a tape main body, and a cover tape. It is a right view of a crimping detection device. It is a fragmentary longitudinal cross-sectional view of the crimping | compression-bonding detection apparatus which shows a state with normal adhesion | attachment with a tape main body and a cover tape. It is a fragmentary longitudinal cross-sectional view of the crimping | compression-bonding detection apparatus which shows the state in which adhesion | attachment with a tape main body and a cover tape is abnormal. It is a figure which shows the image which shows a state with the normal adhesion | attachment with a tape main body and a cover tape. It is a figure which shows the image which shows the state in which adhesion | attachment with a tape main body and a cover tape is abnormal.

  Hereinafter, an embodiment of a taping device as a transfer device of the present invention will be described with reference to the drawings. First, the taping device will be described based on the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG.

  Reference numeral 1 denotes a taping device main body. A carrier tape supply reel 3 is rotatably locked to a pin 2 erected on a side wall portion of the main body 1, and a tape main body (also referred to as a carrier tape) wound around the tape supply reel 3. The take-up and storage reel 9 is provided via a transport rail 8 having a transport path such as a pulley 5, feed pulleys 6 and 7, and a tape body 4A for applying a proper tension to the tape body 4A. It is fixed to.

  Then, while the tape main body 4A is sequentially conveyed by a predetermined amount in accordance with the rotation of the take-up storage reel 9 by a rotation drive system (not shown), the storage recess of the tape main body 4A is taken. After the chip part A is inserted (loaded) into 4B and further conveyed to a predetermined position, the opening on the upper surface of the storage recess 4B is covered with the cover tape 4C supplied from the cover tape supply reel 10, and then the take-up storage reel It will be rolled up by nine. As described above, the storage tape 4 is formed by the tape body 4A provided with the storage recesses 4B at a predetermined interval and the cover tape (top tape) 4C that is pressure-bonded to the upper surface thereof. The tape body 4A is a so-called embossed tape.

  The feed pulleys 6 and 7, the transport rail 8, the cover tape supply reel 10 and the like are provided on the mounting plate 11. A Y table 15 that is driven by a Y-axis drive motor 13 and is guided by a guide 14 to move in the Y direction is provided on a fixed plate 12 that is fixed to the taping device main body 1. An X table 18 that is driven by an X-axis drive motor 16 and is guided by a guide 17 to move in the X direction is provided, and the mounting plate 11 is fixed to the X table 18.

  Therefore, when the X table 18 and the Y table 15 are moved by driving the X axis drive motor 16 and the Y axis drive motor 13, the transport rail 8 and the tape that moves along the transport rail 8 via the mounting plate 11 are moved. The main body 4A and the like can move in the XY directions.

  A Y table 21 that can be moved in the Y direction by a Y axis drive motor 20 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 22 on the Y table 21. A chip component supply table 24 is provided via the X moving body 23. A wafer affixed to the sheet is diced on the supply table 24 and is divided into individual dies (hereinafter referred to as “chip parts A”), and fixed with the surface having terminals as the upper surface. The chip component A is picked up and taken out by a suction pick-up nozzle 26 described later while being pushed up by a push-up pin (not shown) from the back surface.

  The upper mounting plate 25 fixed to the taping device main body 1 is provided with, for example, eight suction take-out nozzles 26 for taking out the chip components A from the chip component supply table 24 at a predetermined interval on the periphery. A first rotating disk 27 that is intermittently rotated via the first indexing cam unit 30 by driving of the driving motor is provided, and the upper mounting plate 25 is moved in the XY directions by the X-axis driving motor and the Y-axis driving motor. For example, eight suction loading nozzles 28 for loading the chip component A into the storage recess 4B via an XY table (not shown) are arranged at a predetermined interval on the peripheral edge, and driven by the second drive motor. A second rotating disk 29 that rotates intermittently via a second indexing cam unit 31 is provided.

  The first rotating disk 27 and the second rotating disk 29 rotate intermittently synchronously, and the nozzles 26 and 28 of the two rotating disks 27 and 29 can be made to correspond to each other. It can be delivered from the suction extraction nozzle 26 to the suction loading nozzle 28. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same.

  Next, the component take-out mechanism 35 will be described in detail with reference to FIG. For example, eight suction / extraction nozzles 26 are arranged on the peripheral portion of the first rotating disk 27 at a predetermined interval, and each suction / extraction nozzle 26 is provided by each reversing device 36 so as to be vertically inverted. . That is, when the drive shaft 39 is rotated via the coupling 38 by the driving of the reverse drive motor 37, the attachment body 40 fixed to the drive shaft 39 is also rotated, and the take-out nozzle 26 is inverted upside down.

  The guide 42 can move up and down along the guide 41 provided on the mounting body 40, and the suction take-out nozzle 26 attached to the nozzle mounting body 43 fixed to the guide 42 can move up and down. The upper end 40A of the mounting body 40 and the lower side 43A of the nozzle mounting body 43 are always urged upward by a spring 44, but the stopper 45 is locked to the upper side 40A of the mounting body 40. This limits the upper limit.

  Further, the suction take-out nozzle 26 can be lowered when the operating portion 48A of the operating body 48 that can be moved up and down by the guide 47 by driving the Z-axis drive motor 46 presses the head of the nozzle mounting body 43, For example, the chip part A on the chip part supply table 24 can be taken out.

  Next, the component loading mechanism 50 will be described in detail with reference to FIG. For example, eight suction loading nozzles 28 are provided at a peripheral portion of the second rotating disk 29 at a predetermined interval, and the nozzles provided at positions where the suction loading nozzles 28 are eccentric by the rotating devices 51. The shaft body 28A is provided to be rotatable about the axial direction. That is, the transmission belt 55 is stretched between a pulley 53 provided on the drive shaft of the θ-axis drive motor 52 and a pulley 54 fixed around the cylindrical body 62, and the cylindrical body 62 is interposed via the bearing 56. The second turntable 29 is rotatably provided.

  The suction loading nozzle 28 is guided by the guide 61 when the operating portion 59A of the operating body 59 that can be moved up and down by the guide 58 by the drive of the Z-axis drive motor 57 presses the projection 60A of the nozzle mounting body 60. The chip component A that is sucked and held can be loaded into the storage recess 4B of the tape body 4A on the transport rail 8. That is, since the nozzle shaft body 28A can move up and down in the cylindrical body 62 and can rotate θ with the cylindrical body 62, the suction loading nozzle 28 provided at an eccentric position below the nozzle shaft body 28A also moves up and down. And can be rotated by θ.

  Next, as shown in FIGS. 6 and 7, the station located at 12:00 of the first rotating disk 27 is a suction extraction station where the suction extraction nozzle 26 sucks and extracts the chip component A from the chip component supply table 24. is there. In this suction take-out station, while the first turntable 27 is turning, the chip part A to be taken out next on the chip part supply table 24 is imaged by the part recognition camera 63 and the position of the chip part A is recognized. The Y-axis drive motor 20 and the X-axis drive motor 22 are positioned so as to be positioned immediately below the suction take-out nozzle 26 from which the controller (not shown) recognizes and the control device moves the chip component A to be taken out. The chip component supply table 24 is moved by being driven, and the chip component A on the chip component supply table 24 is driven by the Z-axis drive motor 46 at this suction extraction station so that the suction extraction nozzle 26 descends and is suctioned and extracted.

  Next, the second rotating disk 29 intermittently rotates clockwise through the second indexing cam unit 31 by driving the second drive motor, and at the same time through the first indexing cam unit 30 by driving the first driving motor. Then, the first rotating disk 27 is rotated intermittently in the counterclockwise direction. The station of the first rotating disk 27 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36. The station is a recognition station in which the position of the inverted chip component A is imaged by the component recognition camera 65 and recognized by the recognition processing device.

  The next is a printing station which is reversed by the reversing device 36 and prints on the chip part A with the printing surface as the upper surface and the surface having the terminals as the lower surface by the printing device.

  The next curing station 79 is a station that dries the ink printed by the printing device with warm air from a warm air device (not shown).

  The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the chip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is replaced with the suction loading nozzle of the second rotary disk 29. Pass to 28. At the delivery station of the first turntable 27, in other words, at the transfer station of the second turntable 29, the component recognition camera 65 images the chip component A sucked and held by the suction take-out nozzle 26 and recognizes it. The deviation in the X direction and the Y direction due to the result of the recognition processing by the processing device is eliminated by correcting the rotation angle of the second rotating disk 29 and correcting the position of the suction loading nozzle 28 which is eccentric due to the rotation of the nozzle shaft 28A.

  That is, based on the recognition processing result of the recognition processing device based on the imaging of the component recognition camera 65, the control device rotates the second drive motor that rotates the second rotating plate 29 and the nozzle shaft body 28A. By controlling the shaft drive motor 52, the deviation in the X direction and the Y direction can be corrected. Therefore, the position of the chip component A sucked and held by the delivered suction / extraction nozzle 26 and the position of the suction loading nozzle 28 is made as close as possible to be sucked and held by the suction / outtake nozzle 26 provided on the first rotating disk 27. The chip component A can be reliably delivered from the suction take-out nozzle 26 to the suction loading nozzle 28 provided on the second rotating disk 29.

  Then, the second rotating disk 29 is inherited by the inheriting station of the second rotating disk 29, and the second rotating disk 29 is rotated in the clockwise direction, and the suction loading nozzle 28 is set in the mounting station (the first inheriting station is the sixth). Both rotary disks 27 and 29 are arranged so as to be positioned above the tape body 4A of the tape 4.

  That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the tape 4, the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second rotating disk 29 in the station, the line connected to the suction loading nozzle 28 and the traveling line of the tape 4 is 67.5, and the delivery station of the first rotating disk 27 and the second rotating disk Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the 29 transfer stations.

  The next station after the inheriting station of the second turntable 29 is an inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, and the current value Is in the predetermined range stored in the storage device. Here, if it is not within the predetermined range, the control device does not load the tape body 4A but controls it to be stored in a dedicated tray (not shown).

  At the recognition station next to the inspection station, a loaded component recognition camera 83 is disposed. The chip component A sucked and held by the suction loading nozzle 28 is imaged by the loaded component recognition camera 83, and the chip is processed by the recognition processing device. The position of the component A with respect to the nozzle is recognized, and an appearance inspection (whether there are a predetermined number of bumps, etc.) is performed. If a defective chip component is determined by the appearance inspection, the control device controls the tape body 4A so that it is housed in the dedicated tray without being loaded.

  The next next station is a loading station for loading the chip component held by the suction loading nozzle 28 into the storage recess 4B of the storage tape 4, and the chip component A held by the suction loading nozzle 28 by the loading component recognition camera 83. The chip component is loaded in a state in which the deviation in the θ direction (the angle in the plane direction) and the deviation in the plane direction (the XY direction) is corrected based on the result of the image picked up and recognized by the recognition processing device.

  That is, for the deviation in the θ direction, the control device corrects and controls the θ-axis drive motor 52 to rotate the suction loading nozzle 28 provided at a position eccentric to the shaft body 28A via the cylindrical body 62 and the nozzle shaft body 28A. The X-axis drive motor 16 and the Y-axis drive motor 13 are corrected and controlled to correct and move the X table 18 and the Y table 15 with respect to the deviation in the plane direction. The tape body 4A moving along the transport rail 8 is corrected and moved in the X direction.

  In this case, when the suction loading nozzle 28 moved to the loading station is in the recognition station, the chip component A held by the suction extraction nozzle 26 in the printing station of the first rotary disk 27 is moved to the next next. In consideration of the rotation correction amount of the second turntable 29 corrected at the delivery station (in addition to the recognition processing result at the recognition station of the electronic component), the control device is installed at the loading station of the second turntable 29. The θ-axis drive motor 52, the X-axis drive motor 16, and the Y-axis drive motor 13 are corrected and controlled.

  In this loading station, as described above, the suction loading nozzle 28 is lowered by the drive of the Z-axis drive motor 57, and the chip component A is loaded into the storage recess 4B of the tape body 4A. The suction loading nozzle 28 communicated with the source via the vacuum path releases the vacuum by switching operation of the solenoid valve and conversely blows air out of the suction hole formed in the nozzle 28 so as to be placed on the bottom surface of the storage recess 4B. The chip component A is dropped and loaded into the storage recess 4B.

  As shown in FIGS. 6, 7 and 8, the loading station has an imaging device for imaging the position of the storage recess 4 </ b> B in which the chip component A is loaded at an upper position that does not interfere with the turning of the second rotating disk 29. 85, and a state in which the image captured by the imaging device 85 is corrected by the recognition processing device and corrected for the deviation in the θ direction (angle in the plane direction) and the plane direction (XY direction). Then, the chip part A is loaded into the storage recess 4B. The imaging device 85 includes a storage recess recognition camera 85A, a lens barrel 85B, and an illumination device 85C.

  The next loading station is provided with an imaging device 87 for inspecting the presence / absence of the chip component A loaded in the tape main body 4A and the loading direction at an upper position that does not interfere with the turning of the second rotating disk 29. The chip part A loaded in the storage recess 4B located in this station during the turning movement of the rotary disk 29 is imaged, and the presence / absence of the chip part A loaded in the tape body 4A after being recognized by the recognition processing device and The direction of the chip part A is inspected. The loading direction of the chip component A can be determined by, for example, the direction of printing printed on the chip component A by the printing device at the printing station described above, the position of the mark attached to the chip component A, and the like.

  The imaging device 87 includes a presence / absence / direction inspection camera 87A, a lens barrel 87B, and an illumination device 87C.

  If the result of the inspection is defective, the control is performed as follows. That is, if the control device determines that the controller is defective based on the recognition result of the recognition processing device, the suction loading nozzle 28 that has finished loading at the loading station takes out the chip component A from the storage recess 4B located at the recovery loading station. At this time, the suction loading nozzle 28 to be loaded at the loading station is controlled to stand by without being loaded. In this state, the control device intermittently rotates the second rotating disk 29 without moving the tape main body 4A, and the next suction loading nozzle 28 is placed in the storage recess 4B that has been taken out and emptied as described above. Control is performed so that the held chip component A is loaded (recovered).

  As described above, after the chip component A is inserted into the housing recess 4B of the tape body 4A by the component loading mechanism 50, the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86, and the housing tape As shown in FIG.

  Crimp detection device for determining whether or not the thermocompression bonding (adhesion) between the tape body 4A and the cover tape 4C is sufficiently performed at the downstream position after the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86. An (adhesion detection device) 88 is provided. As shown in FIG. 9, the front and rear ends of the storage tape (tape body 4A) formed by pressure bonding slide in the direction perpendicular to the transport direction and move on the transport surface of the transport rail 8, but above it. Each of the pressure sensors (not shown) for detecting whether or not the air flowing through the air flow paths 90A and 90B formed in each of the inspection units 88A and 88B has stopped flowing due to the pair of inspection units 88A and 88B. ).

  The crimp detection device 88 will be described in detail. As shown in FIG. 10, the inspection portions 88A and 88B located above the front and rear end portions in the direction orthogonal to the transport direction of the storage tape straddling the storage recess 4B of the tape body 4A. Are formed with inclined surfaces 91A and 91B that gradually rise away from the tape body 4A as they go from the inside toward the outside toward the storage recesses 4B.

  Then, air flow paths 90A and 90B including vertical passages 90A1 and 90B1 that open the lower surfaces of the inclined surfaces 91A and 91B that are the bottom surfaces of the inspection portions 88A and 88B and horizontal passages 90A2 and 90B2 that communicate with the vertical passages are formed. The air flow paths 90A and 90B communicate with an air suction source that always sucks air through the nipples 93A and 93B and a suction hose communicating with the nipples 93A and 93B. The lower surface openings of the air flow paths 90A and 90B face the bonding portion between the tape body 4A and the cover tape 4C.

  Since adhesives (black portions) 92A and 92B for bonding when the tape body 4A and the cover tape 4C are thermocompression bonded are applied to the tape body 4A in a strip shape along the transport direction of the tape body 4A. When the adhesives 92A and 92B are applied and the thermocompression bonding is sufficient even if the air in the air flow paths 90A and 90B is always sucked by the air suction source, as shown in FIG. The portions where 92A and 92B are applied do not rise. In this case, even if a part of the cover tape 4C to which the adhesives 92A and 92B are not applied is sucked and raised, the part does not reach the inclined surfaces 91A and 91B on the bottom surfaces of the inspection portions 88A and 88B. Since the lower openings of the air flow paths 90A and 90B are not blocked by the cover tape 4C by the part of the cover tape 4C to which 92A and 92B are not applied, the pressure detection value of each pressure sensor does not increase. Misdetection that it is not bonded is prevented.

  Further, as shown in FIG. 11, when the adhesives 92A and 92B are not sufficiently applied, when the air in the air flow paths 90A and 90B is sucked by the air suction source, the adhesives 92A and 92B are Since the uncoated part is peeled off, the cover tape 4C rises and the cover tape 4C closes the lower openings of the air flow paths 90A and 90B. It suddenly increases. Therefore, in this case, when any detection output value of the pressure detection sensor becomes a certain value or more, the control device controls to stop the operation of the taping device based on this detection output. And after this stop, it can repair by an operator apply | coating an adhesive agent to the location where crimping | compression-bonding is insufficient, and thermocompression-bonding again. Therefore, the quality of the storage tape can be improved.

  Next, as shown in FIG. 8, the presence / absence of the chip component A and the loading direction after the tape body 4A and the cover tape 4C are pressure-bonded by the tape pressure-bonding mechanism 86 are inspected downstream of the pressure-bonding detection device 88. An imaging device 95 is provided. The imaging device 95 includes a presence / absence / direction inspection camera 95A arranged in a horizontal direction, a lens barrel 95B, a prism 95C, and an illumination device 95D.

  The imaging device 95 is for inspecting the presence and the loading direction of the chip component A after the tape body 4A and the cover tape 4C are pressure-bonded. This can be determined by the direction of printing printed on the chip part A by the printing device at the station, the position of the mark attached to the chip part A, and the like.

  If the picked-up image is recognized by the recognition processing device and the chip component A is not loaded in the storage recess 4B, or if it is loaded, the control device determines that the loading direction is not normal. Control to stop the operation. And the quality improvement of a storage tape can be aimed at by eliminating such a defective part.

  As described above, after the upper surface opening of the housing recess 4B after the chip component A is loaded in the housing recess 4B is covered with the cover tape 4C, the thermocompression bonding between the tape body 4A and the cover tape 4C is sufficiently performed. The crimping detection device 88 detects whether or not the image is received, and after the covering, the image pickup device 95 images the storage tape to inspect the presence or absence of the chip component A and the loading direction. In order to detect whether or not the thermocompression bonding between the tape body 4A and the cover tape 4C is sufficiently performed and to check the presence / absence / loading direction of the chip component A, the imaging device 95 may perform the detection.

  In other words, the presence / orientation inspection camera 95A images the adhesive portion of the tape body 4A and the cover tape 4C for the first time in order to detect whether or not the thermocompression bonding between the tape body 4A and the cover tape 4C is sufficiently performed. Further, in order to inspect the presence / absence / loading direction of the chip part A, the storage recess 4B is imaged a second time. In this case, imaging is performed by changing the imaging location and imaging magnification. In addition, after imaging the adhesion part of 4 A of tape main bodies and the cover tape 4C, it was made to image the storage recessed part 4B, but you may image in the reverse order.

  The captured image is an image as shown in FIG. 12, and the adhesives 92 </ b> A and 92 </ b> B are applied and the thermocompression bonding is sufficient, and the thermocompression bonding between the tape body 4 </ b> A and the cover tape 4 </ b> C is insufficient. If the image does not have a location, the control device (determination device) determines that the image is normal by performing pattern matching with a basic image to be compared with the captured image (an image without a location where thermocompression bonding is insufficient).

  Further, when the captured image is an image as shown in FIG. 13 and there is a portion S where the adhesives 92A and 92B are not sufficiently applied and the thermocompression bonding is not sufficient, a basic image to be compared with the captured image. The control device (determination device) determines that there is an abnormality by performing pattern matching with (an image where there is no portion where thermocompression bonding is insufficient). And if it is judged that it is abnormal, the quality of a storage tape can be improved by eliminating such a defective part.

  As described above, in the present invention, an unexpected situation occurs after the chip parts A are sequentially loaded into the respective housing recesses 4B of the tape body 4A and the upper surface opening of the housing recess 4B is closed with the cover tape 4C. That is, after performing the closing operation of closing the upper surface opening of the storage recess 4B after the chip component A is loaded in the storage recess 4B with the cover tape 4C, the thermocompression bonding of the tape body 4A and the cover tape 4C ( It is possible to improve the quality of the storage tape by detecting whether or not the bonding is sufficiently performed and checking the presence / absence and loading direction of the chip component A.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 4A Tape main body 4B Storage recessed part 4C Cover tape 86 Tape crimping mechanism 88 Crimp detection apparatus 88A, 88B Inspection part 92A, 92B Adhesive 95 Imaging device

Claims (3)

  In a taping device in which the chip parts are sequentially loaded by suction nozzles into the respective housing recesses of the tape body fed by the feeding device, and the opening of the housing recess is closed with a cover tape, the opening of the housing recess is covered with the cover tape. An adhesion detection device is provided for detecting whether or not the cover tape is adhered to the tape body after the closing operation is performed. The adhesion detection device communicates with an air suction source, and the tape body and the cover tape. And an inspection portion in which an air flow path facing the opening end faces the bonding portion, and the cover tape not bonded to the tape body by the air suction source closes the open end portion of the air flow path. Then, a taping device comprising a pressure detection sensor for increasing the detected pressure value.   In a taping device in which the chip parts are sequentially loaded by suction nozzles into the respective housing recesses of the tape body fed by the feeding device, and the opening of the housing recess is closed with a cover tape, the opening of the housing recess is covered with the cover tape. After the closing operation, the cover tape is bonded to the tape main body after the closing operation and the imaging device for inspecting the presence / absence and loading direction of the chip parts loaded in the storage recess. A taping device, comprising: an adhesive detection device that detects whether or not there is a portion that is not present.   In a taping device in which the chip parts are sequentially loaded by suction nozzles into the respective housing recesses of the tape body fed by the feeding device, and the opening of the housing recess is closed with a cover tape, the opening of the housing recess is covered with the cover tape. After the closing operation is performed, an image of the storage recess is taken in order to inspect the presence / absence and loading direction of the chip component loaded in the storage recess, and the tape body and the cover tape are bonded separately from the imaging A taping device comprising an image pickup device for picking up an image of a part.

Images